May 2011 Doc ID 16749 Rev 3 1/7
7
STPS30170DJF
Power Schottky rectifier
Features
■Very small conduction losses
■Negligible switching losses
■Extremely fast switching
■Low thermal resistance
■Avalanche capability specified
■ECOPACK®2 compliant component
Description
This Schottky rectifier is designed for switch mode
power supply and high frequency DC to DC
converters.
Packaged in PowerFLAT™, this device is
intended for use in low voltage, high frequency
inverters, free-wheeling and polarity protection
applications.
Its low profile was especially designed to be used
in applications with space-saving constraints.
TM: PowerFLAT is a trademark of STMicroelectronics
Table 1. Device summary
Symbol Value
IF(AV) 30 A
VRRM 170 V
Tj (max) 150 °C
VF(typ) 0.65 V
K
A
A
A
K
K
A
PowerFLAT 5x6
STPS30170DJF
www.st.com
Characteristics STPS30170DJF
2/7 Doc ID 16749 Rev 3
1 Characteristics
To evaluate the conduction losses use the following equation:
P = 0.65 x IF(AV) + 0.0046 IF2(RMS)
Table 2. Absolute ratings (limiting values, anode terminals short circuited)
Symbol Parameter Value Unit
VRRM Repetitive peak reverse voltage 170 V
IF(RMS) Forward rms current 45 A
IF(AV) Average forward current Tc = 80 °C, δ = 0.5 30 A
IFSM Surge non repetitive forward current tp = 10 ms sinusoidal
Tc = 25 °C 200 A
PARM Repetitive peak avalanche power tp = 1 µs, Tj = 25 °C 12500 W
Tstg Storage temperature range -65 to + 175 °C
TjMaximum operating junction temperature (1)
1. condition to avoid thermal runaway for a diode on its own heatsink
150 °C
Table 3. Thermal resistance
Symbol Parameter Value Unit
Rth(j-c) Junction to case 2.5 °C/W
Table 4. Static electrical characteristics (anode terminals short circuited)
Symbol Parameter Test conditions Min. Typ. Max. Unit
IR(1)
1. Pulse test: tp = 5 ms, δ < 2%
Reverse leakage current Tj = 25 °C VR = VRRM
--15µA
Tj = 125 °C - 4 12 mA
VF(2)
2. Pulse test: tp = 380 µs, δ < 2%
Forward voltage drop
Tj = 25 °C IF = 15 A --0.88
V
Tj = 125 °C - 0.65 0.70
Tj = 25 °C IF = 30 A --0.95
Tj = 125 °C - 0.71 0.79
dPtot
dTj <1
Rth(j-a)
STPS30170DJF Characteristics
Doc ID 16749 Rev 3 3/7
Figure 1. Average forward power dissipation
versus average forward current
Figure 2. Average forward current versus
ambient temperature (δ = 0.5)
0
4
8
12
16
20
24
28
32
0 5 10 15 20 25 30 35 40
P (W)
F(AV)
δ= 0.05
δ= 0.1
δ= 0.2
δ= 0.5
δ= 1
T
δ= t / T
ptp
I (A)
F(AV)
0
5
10
15
20
25
30
35
0 25 50 75 100 125 150
I (A)
F(AV)
R= R
th(j-a) th(j-c)
T (°C)
amb
T
δ= t / T
ptp
Figure 3. Normalized avalanche power
derating versus pulse duration
Figure 4. Normalized avalanche power
derating versus junction
temperature
0.001
0.01
0.10.01 1
0.1
10 100 1000
1
t (µs)
p
P(t
p)
P (1 µs)
ARM
ARM
0
0.2
0.4
0.6
0.8
1
1.2
25 50 75 100 125 150
T (°C)
j
P(T
j)
P (25 °C)
ARM
ARM
Figure 5. Non repetitive surge peak forward
current versus overload duration
(maximum values)
Figure 6. Relative variation of thermal
impedance, junction to case,
versus pulse duration
1.E-02 1.E-01 1.E+00
0
20
40
60
80
100
120
140
160
180
200
1.E-03
I (A)
M
t(s)
T = 25 °C
c
T = 75 °C
c
T = 125 °C
c
IM
t
δ= 0.5
0.0
0.1
0.2
0.3
0.4
0.5
0.6
0.7
0.8
0.9
1.0
1.E-05 1.E-04 1.E-03 1.E-02 1.E-01 1.E+00
Z/R
th(j-c) th(j-c)
Single pulse
t (s)
p
Characteristics STPS30170DJF
4/7 Doc ID 16749 Rev 3
Figure 7. Reverse leakage current versus
reverse voltage applied
(typical values)
Figure 8. Junction capacitance versus
reverse voltage applied
(typical values)
1.E-04
1.E-03
1.E-02
1.E-01
1.E+00
1.E+01
1.E+02
0 20 40 60 80 100 120 140 160 180
I (mA)
R
V (V)
R
T = 25 °C
j
T = 50 °C
j
T = 75 °C
j
T = 125 °C
j
T = 150 °C
j
T = 100 °C
j
10
100
1000
1 10 100 1000
C(pF)
F = 1 MHz
V = 30 mV
T = 25 °C
osc RMS
j
V (V)
R
Figure 9. Forward voltage drop versus
forward current
Figure 10. Thermal resistance, junction to
ambient, versus copper surface
under tab
0
5
10
15
20
25
30
35
40
45
50
55
60
0.0 0.1 0.2 0.3 0.4
0
5
10
15
20
25
30
35
40
45
50
55
60
0.0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1.0 1.1
T = 125 °C
(Maximum values)
j
T = 125 °C
(Typical values)
j
T = 25 °C
(Maximum values)
j
I (A)
FM
V (V)
FM 0
50
100
150
200
250
012345678910
R (°C/W)
th(j-a)
epoxy printed board Fr4,
copper thickness=35 µm
S (cm²)
cu
STPS30170DJF Package information
Doc ID 16749 Rev 3 5/7
2 Package information
●Epoxy meets UL94,V0
●Lead-free package
In order to meet environmental requirements, ST offers these devices in different grades of
ECOPACK® packages, depending on their level of environmental compliance. ECOPACK®
specifications, grade definitions and product status are available at: www.st.com.
ECOPACK® is an ST trademark.
Figure 11. Footprint (dimensions in mm)
Table 5. PowerFLAT 5x6 dimensions
Ref.
Dimensions
Millimeters Inches
Min. Typ. Max. Min. Typ. Max.
A 0.80 1.00 0.031 0.039
A1 0.02 0.05 0.001 0.002
A2 0.25 0.010
b 0.30 0.50 0.012 0.020
D 5.20 0.205
D2 4.11 4.31 0.162 0.170
e 1.27 0.050
E 6.15 0.242
E2 3.50 3.70 0.138 0.146
L 0.50 0.80 0.020 0.031
K 1.275 1.575 0.050 0.062
D2
E2
K
L
b
e
D
E
A
A1 A2
1.27
0.62
0.95
0.98
6.29
4.33
3.86
5.35
4.41
Ordering information STPS30170DJF
6/7 Doc ID 16749 Rev 3
Figure 12. Tape and reel specifications
3 Ordering information
4 Revision history
Dot identifying Pin A1 location
User direction of unreeling
All dimensions are typical values in mm
4.0
8.0
6.30
2.0
12.0
5.30
1.75
5.5
Ø 1.55
Ø 1.5
0.20
1.20
0.30
R 0.50
Table 6. Ordering information
Order code Marking Package Weight Base qty Delivery mode
STPS30170DJF-TR PS30 170 PowerFLAT 5x6 95 mg 3000 Tape and reel
Table 7. Document revision history
Date Revision Changes
06-Nov-2009 1 First issue.
30-Jul-2010 2 Replace Power QFN with PowerFLAT.
20-May-2011 3 Updated package graphics. Updated base quantity and marking in
Ta bl e 6 . Added Figure 12.
STPS30170DJF
Doc ID 16749 Rev 3 7/7
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