STPS30170DJF Power Schottky rectifier Features Very small conduction losses Negligible switching losses Extremely fast switching Low thermal resistance Avalanche capability specified ECOPACK(R)2 compliant component A K A K K Description This Schottky rectifier is designed for switch mode power supply and high frequency DC to DC converters. Packaged in PowerFLATTM, this device is intended for use in low voltage, high frequency inverters, free-wheeling and polarity protection applications. A A PowerFLAT 5x6 STPS30170DJF Its low profile was especially designed to be used in applications with space-saving constraints. Table 1. Device summary Symbol Value IF(AV) 30 A VRRM 170 V Tj (max) 150 C VF(typ) 0.65 V TM: PowerFLAT is a trademark of STMicroelectronics May 2011 Doc ID 16749 Rev 3 1/7 www.st.com 7 Characteristics 1 STPS30170DJF Characteristics Table 2. Absolute ratings (limiting values, anode terminals short circuited) Symbol VRRM Repetitive peak reverse voltage IF(RMS) Forward rms current Unit 170 V 45 A Average forward current Tc = 80 C, = 0.5 30 A IFSM Surge non repetitive forward current tp = 10 ms sinusoidal Tc = 25 C 200 A PARM Repetitive peak avalanche power tp = 1 s, Tj = 25 C Tj Storage temperature range 12500 W -65 to + 175 C 150 C Value Unit 2.5 C/W Maximum operating junction temperature (1) 1 dPtot < condition to avoid thermal runaway for a diode on its own heatsink Rth(j-a) dTj Table 3. Thermal resistance Symbol Rth(j-c) Table 4. Parameter Junction to case Static electrical characteristics (anode terminals short circuited) Symbol Parameter Test conditions IR(1) Reverse leakage current Tj = 25 C Tj = 125 C Tj = 25 C VF(2) Forward voltage drop Tj = 125 C Tj = 25 C Tj = 125 C VR = VRRM IF = 15 A Min. Typ. Max. Unit - - 15 A - 4 12 mA - - 0.88 - 0.65 0.70 - - 0.95 - 0.71 0.79 V IF = 30 A 1. Pulse test: tp = 5 ms, < 2% 2. Pulse test: tp = 380 s, < 2% To evaluate the conduction losses use the following equation: P = 0.65 x IF(AV) + 0.0046 IF2(RMS) 2/7 Value IF(AV) Tstg 1. Parameter Doc ID 16749 Rev 3 STPS30170DJF Figure 1. Characteristics Average forward power dissipation Figure 2. versus average forward current PF(AV)(W) 32 35 24 Rth(j-a) = Rth(j-c) 30 = 0.2 20 25 = 0.1 20 = 0.05 16 IF(AV)(A) =1 = 0.5 28 Average forward current versus ambient temperature ( = 0.5) T 15 12 = tp / T tp 10 8 T 5 4 = tp / T IF(AV)(A) 0 tp Tamb(C) 0 0 5 Figure 3. 10 15 20 25 30 35 40 Normalized avalanche power derating versus pulse duration 0 25 Figure 4. PARM(tp) PARM(1 s) 50 75 100 125 150 Normalized avalanche power derating versus junction temperature PARM(Tj) PARM(25 C) 1 1.2 1 0.1 0.8 0.6 0.4 0.01 0.2 0.01 0.1 Figure 5. 200 Tj(C) tp(s) 0.001 1 0 10 100 25 1000 Non repetitive surge peak forward current versus overload duration (maximum values) IM(A) Figure 6. 1.0 180 0.9 160 0.8 140 0.7 120 75 100 125 150 Relative variation of thermal impedance, junction to case, versus pulse duration Zth(j-c)/Rth(j-c) 0.6 100 Tc = 25 C 80 Tc = 75 C 60 40 50 0.5 0.4 0.3 Tc = 125 C IM 20 0 1.E-03 0.2 0.1 t = 0.5 Single pulse t(s) 1.E-02 1.E-01 1.E+00 0.0 1.E-05 Doc ID 16749 Rev 3 tp(s) 1.E-04 1.E-03 1.E-02 1.E-01 1.E+00 3/7 Characteristics Figure 7. 1.E+02 STPS30170DJF Reverse leakage current versus reverse voltage applied (typical values) Figure 8. IR(mA) C(pF) 1000 1.E+01 Tj = 150 C 1.E+00 Tj = 125 C Junction capacitance versus reverse voltage applied (typical values) F = 1 MHz Vosc = 30 mVRMS T = 25 C j Tj = 100 C 100 1.E-01 Tj = 75 C 1.E-02 Tj = 50 C Tj = 25 C 1.E-03 VR(V) 0 20 Figure 9. 60 VR(V) 10 1.E-04 40 60 80 100 120 140 160 1 180 Forward voltage drop versus forward current 10 100 1000 Figure 10. Thermal resistance, junction to ambient, versus copper surface under tab IFM(A) 250 Rth(j-a)(C/W) epoxy printed board Fr4, copper thickness=35 m 55 50 200 45 Tj = 125 C (Maximum values) 40 150 35 30 Tj = 125 C (Typical values) 25 100 20 15 Tj = 25 C (Maximum values) 10 5 VFM(V) 0 0.0 4/7 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1.0 1.1 50 Scu(cm) 0 0 1 Doc ID 16749 Rev 3 2 3 4 5 6 7 8 9 10 STPS30170DJF Package information Epoxy meets UL94,V0 Lead-free package In order to meet environmental requirements, ST offers these devices in different grades of ECOPACK(R) packages, depending on their level of environmental compliance. ECOPACK(R) specifications, grade definitions and product status are available at: www.st.com. ECOPACK(R) is an ST trademark. Table 5. PowerFLAT 5x6 dimensions Dimensions Ref. Min. D2 E2 K e b A2 Inches Max. Min. Typ. Max. A 0.80 1.00 0.031 0.039 A1 0.02 0.05 0.001 0.002 b D Typ. A2 L A A1 Millimeters 0.25 0.30 0.50 D D2 0.010 0.012 5.20 4.11 0.020 0.205 4.31 0.162 0.170 e 1.27 0.050 E 6.15 0.242 E E2 3.50 3.70 0.138 0.146 L 0.50 0.80 0.020 0.031 K 1.275 1.575 0.050 0.062 Figure 11. Footprint (dimensions in mm) 5.35 4.41 3.86 4.33 6.29 2 Package information 0.98 0.95 0.62 1.27 Doc ID 16749 Rev 3 5/7 Ordering information STPS30170DJF Figure 12. Tape and reel specifications Dot identifying Pin A1 location 2.0 O 1.55 1.75 4.0 0.30 0.20 5.30 12.0 5.5 O 1.5 R 0.50 6.30 8.0 1.20 All dimensions are typical values in mm 3 Ordering information Table 6. 4 Ordering information Order code Marking Package STPS30170DJF-TR PS30 170 PowerFLAT 5x6 Weight Base qty Delivery mode 95 mg 3000 Tape and reel Revision history Table 7. 6/7 User direction of unreeling Document revision history Date Revision Changes 06-Nov-2009 1 First issue. 30-Jul-2010 2 Replace Power QFN with PowerFLAT. 20-May-2011 3 Updated package graphics. Updated base quantity and marking in Table 6. Added Figure 12. Doc ID 16749 Rev 3 STPS30170DJF Please Read Carefully: Information in this document is provided solely in connection with ST products. STMicroelectronics NV and its subsidiaries ("ST") reserve the right to make changes, corrections, modifications or improvements, to this document, and the products and services described herein at any time, without notice. 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