Is Now Part of To learn more about ON Semiconductor, please visit our website at www.onsemi.com Please note: As part of the Fairchild Semiconductor integration, some of the Fairchild orderable part numbers will need to change in order to meet ON Semiconductor's system requirements. Since the ON Semiconductor product management systems do not have the ability to manage part nomenclature that utilizes an underscore (_), the underscore (_) in the Fairchild part numbers will be changed to a dash (-). This document may contain device numbers with an underscore (_). Please check the ON Semiconductor website to verify the updated device numbers. The most current and up-to-date ordering information can be found at www.onsemi.com. Please email any questions regarding the system integration to Fairchild_questions@onsemi.com. ON Semiconductor and the ON Semiconductor logo are trademarks of Semiconductor Components Industries, LLC dba ON Semiconductor or its subsidiaries in the United States and/or other countries. ON Semiconductor owns the rights to a number of patents, trademarks, copyrights, trade secrets, and other intellectual property. A listing of ON Semiconductor's product/patent coverage may be accessed at www.onsemi.com/site/pdf/Patent-Marking.pdf. ON Semiconductor reserves the right to make changes without further notice to any products herein. ON Semiconductor makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does ON Semiconductor assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. Buyer is responsible for its products and applications using ON Semiconductor products, including compliance with all laws, regulations and safety requirements or standards, regardless of any support or applications information provided by ON Semiconductor. "Typical" parameters which may be provided in ON Semiconductor data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including "Typicals" must be validated for each customer application by customer's technical experts. ON Semiconductor does not convey any license under its patent rights nor the rights of others. ON Semiconductor products are not designed, intended, or authorized for use as a critical component in life support systems or any FDA Class 3 medical devices or medical devices with a same or similar classification in a foreign jurisdiction or any devices intended for implantation in the human body. Should Buyer purchase or use ON Semiconductor products for any such unintended or unauthorized application, Buyer shall indemnify and hold ON Semiconductor and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that ON Semiconductor was negligent regarding the design or manufacture of the part. ON Semiconductor is an Equal Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner. HGTG30N60C3D Data Sheet January 2009 File Number 4041.2 63A, 600V, UFS Series N-Channel IGBT with Anti-Parallel Hyperfast Diodes Features The HGTG30N60C3D is a MOS gated high voltage switching device combining the best features of MOSFETs and bipolar transistors. The device has the high input impedance of a MOSFET and the low on-state conduction loss of a bipolar transistor. The much lower on-state voltage drop varies only moderately between 25oC and 150oC. The IGBT used is the development type TA49051. The diode used in anti-parallel with the IGBT is the development type TA49053. * Typical Fall Time . . . . . . . . . . . . . . . 230ns at TJ = 150oC * 63A, 600V at TC = 25oC * Short Circuit Rating * Low Conduction Loss * Hyperfast Anti-Parallel Diode Packaging JEDEC STYLE TO-247 The IGBT is ideal for many high voltage switching applications operating at moderate frequencies where low conduction losses are essential. E C G Formerly Developmental Type TA49014. Ordering Information PART NUMBER HGTG30N60C3D PACKAGE TO-247 BRAND G30N60C3D NOTE: When ordering, use the entire part number. Symbol C G E INTERSIL CORPORATION IGBT PRODUCT IS COVERED BY ONE OR MORE OF THE FOLLOWING U.S. PATENTS 4,364,073 4,417,385 4,430,792 4,443,931 4,466,176 4,516,143 4,532,534 4,587,713 4,598,461 4,605,948 4,620,211 4,631,564 4,639,754 4,639,762 4,641,162 4,644,637 4,682,195 4,684,413 4,694,313 4,717,679 4,743,952 4,783,690 4,794,432 4,801,986 4,803,533 4,809,045 4,809,047 4,810,665 4,823,176 4,837,606 4,860,080 4,883,767 4,888,627 4,890,143 4,901,127 4,904,609 4,933,740 4,963,951 4,969,027 (c)2009 Fairchild Semiconductor Corporation HGTG30N60C3D Rev. B HGTG30N60C3D Absolute Maximum Ratings TC = 25oC, Unless Otherwise Specified HGTG30N60C3D UNITS 600 V At TC = 25oC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . IC25 63 A At TC = 110oC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . IC110 30 A Average Diode Forward Current at 110oC. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . I(AVG) 25 A Collector Current Pulsed (Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ICM 252 A Gate to Emitter Voltage Continuous. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . VGES 20 V Gate to Emitter Voltage Pulsed . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . VGEM 30 V Switching Safe Operating Area at TJ = 150oC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . SSOA 60A at 600V Collector to Emitter Voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .BVCES Collector Current Continuous Power Dissipation Total at TC = 25oC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . PD 208 W Power Dissipation Derating TC > 25oC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1.67 W/oC Operating and Storage Junction Temperature Range . . . . . . . . . . . . . . . . . . . . . . . . TJ, TSTG -40 to 150 oC Maximum Lead Temperature for Soldering . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . TL 260 oC Short Circuit Withstand Time (Note 2) at VGE = 15V. . . . . . . . . . . . . . . . . . . . . . . . . . . . . .tSC 4 s Short Circuit Withstand Time (Note 2) at VGE = 10V. . . . . . . . . . . . . . . . . . . . . . . . . . . . . tSC 15 s CAUTION: Stresses above those listed in "Absolute Maximum Ratings" may cause permanent damage to the device. This is a stress only rating and operation of the device at these or any other conditions above those indicated in the operational sections of this specification is not implied. NOTES: 1. Repetitive Rating: Pulse width limited by maximum junction temperature. 2. VCE(PK) = 360V, TJ = 125oC, RG = 25. Electrical Specifications TC = 25oC, Unless Otherwise Specified PARAMETER SYMBOL TEST CONDITIONS MIN TYP MAX UNITS Collector to Emitter Breakdown Voltage BVCES IC = 250A, VGE = 0V 600 - - V Emitter to Collector Breakdown Voltage BVECS IC = 10mA, VGE = 0V 15 25 - V Collector to Emitter Leakage Current Collector to Emitter Saturation Voltage Gate to Emitter Threshold Voltage Gate to Emitter Leakage Current Switching SOA ICES VCE(SAT) VCE = BVCES TC = 25oC - - 250 A VCE = BVCES TC = 150oC - - 3.0 mA IC = IC110, VGE = 15V TC = 25oC - 1.5 1.8 V TC = 150oC - 1.7 2.0 V TC = 25oC 3.0 5.2 6.0 V - - 100 nA VCE(PK) = 480V 200 - - A VCE(PK) = 600V 60 - - A IC = IC110, VCE = 0.5 BVCES - 8.1 - V IC = IC110, VCE = 0.5 BVCES VGE = 15V - 162 180 nC VGE = 20V - 216 250 nC - 40 - ns - 45 - ns - 320 400 ns - 230 275 ns VGE(TH) IC = 250A, VCE = VGE IGES VGE = 20V SSOA TJ = 150oC, VGE = 15V, RG = 3, L = 100H Gate to Emitter Plateau Voltage On-State Gate Charge Current Turn-On Delay Time Current Rise Time Current Turn-Off Delay Time VGEP QG(ON) td(ON)I trI td(OFF)I TJ = 150oC, ICE = IC110, VCE(PK) = 0.8 BVCES, VGE = 15V, RG = 3, L = 100H Current Fall Time tfI Turn-On Energy EON - 1050 - J Turn-Off Energy (Note 3) EOFF - 2500 - J Diode Forward Voltage VEC - 1.75 2.2 V (c)2009 Fairchild Semiconductor Corporation IEC = 30A HGTG30N60C3D Rev. B HGTG30N60C3D Electrical Specifications TC = 25oC, Unless Otherwise Specified PARAMETER SYMBOL Diode Reverse Recovery Time trr Thermal Resistance RJC TEST CONDITIONS MIN TYP MAX UNITS IEC = 30A, dIEC/dt = 100A/s - 52 60 ns IEC = 1.0A, dIEC/dt = 100A/s - 42 50 ns IGBT - - 0.6 oC/W Diode - - 1.3 oC/W NOTE: 3. Turn-Off Energy Loss (EOFF) is defined as the integral of the instantaneous power loss starting at the trailing edge of the input pulse and ending at the point where the collector current equals zero (ICE = 0A). The HGTG30N60C3D was tested per JEDEC standard No. 24-1 Method for Measurement of Power Device Turn-Off Switching Loss. This test method produces the true total Turn-Off Energy Loss. Turn-On losses include diode losses. 150 PULSE DURATION = 250s DUTY CYCLE <0.5%, VCE = 10V 125 100 TC = 150oC 75 TC = 25oC 50 TC = -40oC 25 0 4 6 8 10 VGE, GATE TO EMITTER VOLTAGE (V) 12 ICE, COLLECTOR TO EMITTER CURRENT (A) ICE, COLLECTOR TO EMITTER CURRENT (A) Typical Performance Curves PULSE DURATION = 250s, DUTY CYCLE <0.5%, TC = 25oC 150 VGE = 15.0V 125 9.5V 100 9.0V 75 8.5V 50 7.0V 7.5V 0 0 ICE, COLLECTOR TO EMITTER CURRENT (A) ICE, COLLECTOR TO EMITTER CURRENT (A) 125 100 TC = 25oC 75 TC = 150oC 50 25 0 5 FIGURE 3. COLLECTOR TO EMITTER ON-STATE VOLTAGE (c)2009 Fairchild Semiconductor Corporation 4 6 8 10 FIGURE 2. SATURATION CHARACTERISTICS TC = -40oC 1 2 3 4 VCE, COLLECTOR TO EMITTER VOLTAGE (V) 2 VCE , COLLECTOR TO EMITTER VOLTAGE (V) 150 0 8.0V 25 FIGURE 1. TRANSFER CHARACTERISTICS PULSE DURATION = 250s DUTY CYCLE <0.5%, VGE = 10V 10.0V 12.0V 150 PULSE DURATION = 250s DUTY CYCLE <0.5% VGE = 15V 125 100 TC = 150oC TC = -40oC TC = 25oC 75 50 25 0 0 1 2 3 4 5 VCE, COLLECTOR TO EMITTER VOLTAGE (V) FIGURE 4. COLLECTOR TO EMITTER ON-STATE VOLTAGE HGTG30N60C3D Rev. B HGTG30N60C3D (Continued) tSC , SHORT CIRCUIT WITHSTAND TIME (s) ICE , DC COLLECTOR CURRENT (A) 70 VGE = 15V 60 50 40 30 20 10 0 25 50 75 100 125 TC , CASE TEMPERATURE (oC) 150 25 450 20 250 10 td(OFF)I , TURN-OFF DELAY TIME (ns) td(ON)I , TURN-ON DELAY TIME (ns) VGE = 10V 50 40 VGE = 15V 20 20 30 40 50 200 tSC 150 5 10 100 11 15 14 VGE , GATE TO EMITTER VOLTAGE (V) TJ = 150oC, RG = 3, L = 100H, VCE(PK) = 480V 400 VGE = 10V 200 100 10 60 FIGURE 7. TURN-ON DELAY TIME vs COLLECTOR TO EMITTER CURRENT VGE = 15V 300 ICE , COLLECTOR TO EMITTER CURRENT (A) 500 13 12 500 100 10 10 300 15 FIGURE 6. SHORT CIRCUIT WITHSTAND TIME TJ = 150oC, RG = 3, L = 100H, VCE(PK) = 480V 30 400 ISC 350 FIGURE 5. MAX. DC COLLECTOR CURRENT vs CASE TEMPERATURE 200 500 VCE = 360V, RG = 25, TJ = 125oC ISC, PEAK SHORT CIRCUIT CURRENT (A) Typical Performance Curves 50 20 30 40 ICE , COLLECTOR TO EMITTER CURRENT (A) 60 FIGURE 8. TURN-OFF DELAY TIME vs COLLECTOR TO EMITTER CURRENT 500 TJ = 150oC, RG = 3, L = 100H, VCE(PK) = 480V TJ = 150oC, RG = 3, L = 100H, VCE(PK) = 480V VGE = 10V tfI , FALL TIME (ns) trI , TURN-ON RISE TIME (ns) 400 100 VGE = 15V 10 10 20 30 40 50 ICE , COLLECTOR TO EMITTER CURRENT (A) FIGURE 9. TURN-ON RISE TIME vs COLLECTOR TO EMITTER CURRENT (c)2009 Fairchild Semiconductor Corporation 60 300 VGE = 10V 200 VGE = 15V 100 10 20 30 40 50 60 ICE , COLLECTOR TO EMITTER CURRENT (A) FIGURE 10. TURN-OFF FALL TIME vs COLLECTOR TO EMITTER CURRENT HGTG30N60C3D Rev. B HGTG30N60C3D 6.0 TJ = 150oC, RG = 3, L = 100H, VCE(PK) = 480V EOFF, TURN-OFF ENERGY LOSS (mJ) EON , TURN-ON ENERGY LOSS (mJ) 8.0 (Continued) 7.0 6.0 5.0 VGE = 10V 4.0 3.0 2.0 1.0 VGE = 15V 0 10 20 30 40 50 TJ = 150oC, RG = 3, L = 100H, VCE(PK) = 480V 5.0 4.0 VGE = 10V or 15V 3.0 2.0 1.0 0 10 60 ICE , COLLECTOR TO EMITTER CURRENT (A) fMAX , OPERATING FREQUENCY (kHz) 500 TJ = 150oC, TC = 75oC RG = 3, L = 100H 100 VGE = 15V fMAX1 = 0.05/(tD(OFF)I + tD(ON)I) fMAX2 = (PD - PC)/(EON + EOFF) 10 VGE = 10V PD = ALLOWABLE DISSIPATION PC = CONDUCTION DISSIPATION (DUTY FACTOR = 50%) RJC = 0.6oC/W 1 5 10 20 30 40 ICE, COLLECTOR TO EMITTER CURRENT (A) C, CAPACITANCE (pF) CIES 6000 5000 4000 3000 2000 COES 1000 CRES 0 10 15 20 VCE, COLLECTOR TO EMITTER VOLTAGE (V) FIGURE 15. CAPACITANCE vs COLLECTOR TO EMITTER VOLTAGE (c)2009 Fairchild Semiconductor Corporation 200 150 LIMITED BY CIRCUIT 100 50 0 0 100 200 300 400 500 600 25 FIGURE 14. SWITCHING SAFE OPERATING AREA VCE , COLLECTOR TO EMITTER VOLTAGE (V) FREQUENCY = 400kHz 5 TJ = 150oC, VGE = 15V, L = 100H VCE , COLLECTOR TO EMITTER VOLTAGE (V) 8000 0 250 60 FIGURE 13. OPERATING FREQUENCY vs COLLECTOR TO EMITTER CURRENT 7000 60 FIGURE 12. TURN-OFF ENERGY LOSS vs COLLECTOR TO EMITTER CURRENT ICE, COLLECTOR TO EMITTER CURRENT (A) FIGURE 11. TURN-ON ENERGY LOSS vs COLLECTOR TO EMITTER CURRENT 20 30 40 50 ICE , COLLECTOR TO EMITTER CURRENT (A) IG (REF) = 3.54mA, RL = 20, TC = 25oC 600 15 12 480 VCE = 600V 9 360 VCE = 400V 240 6 VCE = 200V 3 120 0 0 40 80 120 QG, GATE CHARGE (nC) 160 VGE , GATE TO EMITTER VOLTAGE (V) Typical Performance Curves 0 200 FIGURE 16. GATE CHARGE WAVEFORMS HGTG30N60C3D Rev. B HGTG30N60C3D Typical Performance Curves (continued) Collector Current, Ic [A] 500 10s 100s 100 1ms 10ms 10 DC 1 *Notes: 0.1 o 1. TC = 25 C o 2. TJ = 150 C 3. Single Pulse 0.01 1 10 100 1000 Collector-Emitter Voltage, VCE [V] ZJC , NORMALIZED THERMAL RESPONSE Figure 17. SOA Characteristics 100 0.5 0.2 t1 0.1 10-1 PD 0.05 t2 0.02 0.01 DUTY FACTOR, D = t1 / t2 PEAK TJ = (PD X ZJC X RJC) + TC SINGLE PULSE 10-2 10-5 10-4 10-3 10-2 10-1 100 101 t1 , RECTANGULAR PULSE DURATION (s) Figure 18. IGBT NORMALIZED TRANSIENT THERMAL IMPEDANCE, JUNCTION TO CASE (c)2009 Fairchild Semiconductor Corporation HGTG30N60C3D Rev. B HGTG30N60C3D Typical Performance Curves (continued) 200 60 50 tr, RECOVERY TIMES (ns) IEC , FORWARD CURRENT (A) TC = 25oC, dIEC/dt = 100A/s 100oC 10 150oC 1 0 0.5 25oC trr 40 30 ta 20 tb 10 2.0 1.0 1.5 VEC , FORWARD VOLTAGE (V) 2.5 0 3.0 1 Figure 19. DIODE FORWARD CURRENT vs FORWARD VOLTAGE DROP 5 10 IEC , FORWARD CURRENT (A) 30 Figure 20. RECOVERY TIME vs FORWARD CURRENT Test Circuit and Waveforms L = 100H 90% RHRP3060 10% VGE EOFF RG = 3 90% + - VDD = 480V ICE 10% td(OFF)I trI tfI Figure 21. INDUCTIVE SWITCHING TEST CIRCUIT (c)2009 Fairchild Semiconductor Corporation EON VCE td(ON)I Figure 22. SWITCHING TEST WAVEFORMS HGTG30N60C3D Rev. B HGTG30N60C3D Handling Precautions for IGBTs Operating Frequency Information Insulated Gate Bipolar Transistors are susceptible to gateinsulation damage by the electrostatic discharge of energy through the devices. When handling these devices, care should be exercised to assure that the static charge built in the handler's body capacitance is not discharged through the device. With proper handling and application procedures, however, IGBTs are currently being extensively used in production by numerous equipment manufacturers in military, industrial and consumer applications, with virtually no damage problems due to electrostatic discharge. IGBTs can be handled safely if the following basic precautions are taken: Operating frequency information for a typical device (Figure 13) is presented as a guide for estimating device performance for a specific application. Other typical frequency vs collector current (ICE) plots are possible using the information shown for a typical unit in Figures 4, 7, 8, 11 and 12. The operating frequency plot (Figure 13) of a typical device shows fMAX1 or fMAX2 whichever is smaller at each point. The information is based on measurements of a typical device and is bounded by the maximum rated junction temperature. 1. Prior to assembly into a circuit, all leads should be kept shorted together either by the use of metal shorting springs or by the insertion into conductive material such as "ECCOSORBDTM LD26" or equivalent. 2. When devices are removed by hand from their carriers, the hand being used should be grounded by any suitable means - for example, with a metallic wristband. 3. Tips of soldering irons should be grounded. 4. Devices should never be inserted into or removed from circuits with power on. 5. Gate Voltage Rating - Never exceed the gate-voltage rating of VGEM. Exceeding the rated VGE can result in permanent damage to the oxide layer in the gate region. 6. Gate Termination - The gates of these devices are essentially capacitors. Circuits that leave the gate open-circuited or floating should be avoided. These conditions can result in turn-on of the device due to voltage buildup on the input capacitor due to leakage currents or pickup. 7. Gate Protection - These devices do not have an internal monolithic zener diode from gate to emitter. If gate protection is required an external zener is recommended. (c)2009 Fairchild Semiconductor Corporation fMAX1 is defined by fMAX1 = 0.05/(tD(OFF)I + tD(ON)I). Deadtime (the denominator) has been arbitrarily held to 10% of the on-state time for a 50% duty factor. Other definitions are possible. tD(OFF)I and tD(ON)I are defined in Figure 21. Device turn-off delay can establish an additional frequency limiting condition for an application other than TJM. tD(OFF)I is important when controlling output ripple under a lightly loaded condition. fMAX2 is defined by fMAX2 = (PD - PC)/(EOFF + EON). The allowable dissipation (PD) is defined by PD = (TJM - TC)/RJC. The sum of device switching and conduction losses must not exceed PD . A 50% duty factor was used (Figure 13) and the conduction losses (PC) are approximated by PC = (VCE x ICE)/2. EON and EOFF are defined in the switching waveforms shown in Figure 21. EON is the integral of the instantaneous power loss (ICE x VCE) during turn-on and EOFF is the integral of the instantaneous power loss during turn-off. All tail losses are included in the calculation for EOFF; i.e. the collector current equals zero (ICE = 0). HGTG30N60C3D Rev. B ON Semiconductor and are trademarks of Semiconductor Components Industries, LLC dba ON Semiconductor or its subsidiaries in the United States and/or other countries. ON Semiconductor owns the rights to a number of patents, trademarks, copyrights, trade secrets, and other intellectual property. A listing of ON Semiconductor's product/patent coverage may be accessed at www.onsemi.com/site/pdf/Patent-Marking.pdf. ON Semiconductor reserves the right to make changes without further notice to any products herein. ON Semiconductor makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does ON Semiconductor assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. Buyer is responsible for its products and applications using ON Semiconductor products, including compliance with all laws, regulations and safety requirements or standards, regardless of any support or applications information provided by ON Semiconductor. "Typical" parameters which may be provided in ON Semiconductor data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including "Typicals" must be validated for each customer application by customer's technical experts. ON Semiconductor does not convey any license under its patent rights nor the rights of others. ON Semiconductor products are not designed, intended, or authorized for use as a critical component in life support systems or any FDA Class 3 medical devices or medical devices with a same or similar classification in a foreign jurisdiction or any devices intended for implantation in the human body. Should Buyer purchase or use ON Semiconductor products for any such unintended or unauthorized application, Buyer shall indemnify and hold ON Semiconductor and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that ON Semiconductor was negligent regarding the design or manufacture of the part. ON Semiconductor is an Equal Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner. PUBLICATION ORDERING INFORMATION LITERATURE FULFILLMENT: Literature Distribution Center for ON Semiconductor 19521 E. 32nd Pkwy, Aurora, Colorado 80011 USA Phone: 303-675-2175 or 800-344-3860 Toll Free USA/Canada Fax: 303-675-2176 or 800-344-3867 Toll Free USA/Canada Email: orderlit@onsemi.com (c) Semiconductor Components Industries, LLC N. American Technical Support: 800-282-9855 Toll Free USA/Canada Europe, Middle East and Africa Technical Support: Phone: 421 33 790 2910 Japan Customer Focus Center Phone: 81-3-5817-1050 www.onsemi.com 1 ON Semiconductor Website: www.onsemi.com Order Literature: http://www.onsemi.com/orderlit For additional information, please contact your local Sales Representative www.onsemi.com