Genesis Microchip Publication PRELIMINARY DATA SHEET gm2121 SXGA LCD Monitor Controller with Integrated Analog Interface and Dual LVDS Transmitter Publication Number: C2121-DAT-01F Publication Date: December 2002 Genesis Microchip Inc. 165 Commerce Valley Dr. West * Thornhill * ON * Canada * L3T 7V8 * Tel: (905) 889-5400 * Fax: (905) 889-5422 2150 Gold Street * PO Box 2150 * Alviso * CA * USA * 95002 * Tel: (408) 262-6599 * Fax: (408) 262-6365 4F, No. 24, Ln 123, Sec 6, Min-Chung E. Rd. * Taipei * Taiwan * Tel: (2) 2791-0118 * Fax: (2) 2791-0196 143-37 Hyundai Tower * Unit 902 * Samsung-dong * Kangnam-gu * Seoul * Korea * 135-090 * Tel: (82-2) 553-5693 * Fax: (82-2) 552-4942 www.genesis-microchip.com / info@genesis-microchip.com.com The following are trademarks or registered trademarks of Genesis Microchip, Inc.: TM TM TM TM TM TM TM TM Genesis , Genesis Display Perfection , ESM , RealColor , Ultra-Reliable DVI , Real Recovery , Sage , JagASM , TM TM TM TM SureSync , Adaptive Backlight ControlTM, Faroudja , DCDi , TrueLife , IntelliComb TM Other brand or product names are trademarks of their respective holders. (c) Copyright 2002 Genesis Microchip Inc. All Rights Reserved. Genesis Microchip Inc. reserves the right to change or modify the information contained herein without notice. It is the customer's responsibility to obtain the most recent revision of the document. Genesis Microchip Inc. makes no warranty for the use of its products and bears no responsibility for any errors or omissions that may appear in this document. gm2121 Preliminary Data Sheet Table Of Contents 1 Overview ........................................................................................................................................8 1.1 gm2121 System Design Example..........................................................................................8 1.2 gm2121 Features ...................................................................................................................9 2 GM2121 Pinout ............................................................................................................................10 3 GM2121Pin List ...........................................................................................................................11 4 Functional Description .................................................................................................................16 4.1 Clock Generation.................................................................................................................16 4.1.1 Using the Internal Oscillator with External Crystal ........................................................17 4.1.2 Using an External Clock Oscillator.................................................................................19 4.1.3 Clock Synthesis ...............................................................................................................20 4.2 Chip Initialization................................................................................................................21 4.2.1 Hardware Reset ...............................................................................................................21 4.2.2 Correct Power Sequencing ..............................................................................................22 4.3 Analog to Digital Converter ................................................................................................22 4.3.1 ADC Pin Connection.......................................................................................................23 4.3.2 ADC Characteristics........................................................................................................23 4.3.3 Clock Recovery Circuit...................................................................................................24 4.3.4 Sampling Phase Adjustment............................................................................................25 4.3.5 ADC Capture Window ....................................................................................................25 4.4 Test Pattern Generator (TPG)..............................................................................................26 4.5 Input Format Measurement .................................................................................................26 4.5.1 HSYNC / VSYNC Delay ................................................................................................27 4.5.2 Horizontal and Vertical Measurement ............................................................................28 4.5.3 Format Change Detection................................................................................................28 4.5.4 Watchdog ........................................................................................................................28 4.5.5 Internal Odd/Even Field Detection (For Interlaced Inputs to ADC Only) ......................28 4.5.6 Input Pixel Measurement ................................................................................................29 4.5.7 Image Phase Measurement..............................................................................................29 4.5.8 Image Boundary Detection..............................................................................................29 4.5.9 Image Auto Balance ........................................................................................................29 4.6 RealColorTM Digital Color Controls....................................................................................29 4.6.1 RealColorTM Flesh tone Adjustment ...............................................................................30 4.6.2 Color Standardization and sRGB Support.......................................................................30 4.7 4.7.1 High-Quality Scaling...........................................................................................................30 Variable Zoom Scaling....................................................................................................30 C2121-DAT-01F 3 http://www.genesis-microchip.com December 2002 gm2121 Preliminary Data Sheet 4.7.2 4.8 Bypass Options....................................................................................................................30 4.9 Gamma LUT........................................................................................................................31 4.10 Display Output Interface .....................................................................................................31 4.10.1 Display Synchronization.............................................................................................31 4.10.2 Programming the Display Timing ..............................................................................31 4.10.3 Panel Power Sequencing (PPWR, PBIAS) .................................................................33 4.10.4 Output Dithering .........................................................................................................33 4.11 Dual Four Channel LVDS Transmitter ...............................................................................34 4.12 Energy Spectrum Management (ESM)................................................................................34 4.13 OSD .....................................................................................................................................34 4.13.1 On-Chip OSD SRAM .................................................................................................35 4.13.2 Color Look-up Table (LUT) .......................................................................................36 4.14 On-Chip Microcontroller (OCM) ........................................................................................36 4.14.1 Standalone Configuration ...........................................................................................37 4.14.2 Full-Custom Configuration.........................................................................................38 4.14.3 In-System-Programming (ISP) of FLASH ROM Devices .........................................39 4.14.4 UART Interface ..........................................................................................................39 4.14.5 DDC2Bi Interface .......................................................................................................40 4.14.6 General Purpose Inputs and Outputs (GPIO's)...........................................................40 4.15 Bootstrap Configuration Pins ..............................................................................................41 4.16 Host Interface ......................................................................................................................42 4.16.1 Host Interface Command Format................................................................................42 4.16.2 2-wire Serial Protocol .................................................................................................43 4.17 5 Horizontal and Vertical Shrink........................................................................................30 Miscellaneous Functions .....................................................................................................44 4.17.1 Low Power State.........................................................................................................44 4.17.2 Pulse Width Modulation (PWM) Back Light Control ................................................45 Electrical Specifications ...............................................................................................................46 5.1 Preliminary DC Characteristics ...........................................................................................46 5.2 Preliminary AC Characteristics ...........................................................................................48 5.3 External ROM Interface Timing Requirements ..................................................................49 6 Ordering Information ...................................................................................................................50 7 Mechanical Specifications............................................................................................................51 C2121-DAT-01F 4 http://www.genesis-microchip.com December 2002 gm2121 Preliminary Data Sheet List Of Tables Table 1. Analog Input Port ................................................................................................................11 Table 2. RCLK PLL Pins ..................................................................................................................11 Table 3. System Interface and GPIO Signals ....................................................................................12 Table 4. Display Output Port.............................................................................................................13 Table 5. Parallel ROM Interface Port................................................................................................13 Table 6. Reserved Pins ...................................................................................................................14 Table 7. Power and Ground Pins for ADC Sampling Clock DDS ....................................................14 Table 8. Power and Ground Pins for Display Clock DDS ................................................................14 Table 9. I/O Power and Ground Pins.................................................................................................15 Table 10. Power and Ground Pins for LVDS Transmitter ..............................................................15 Table 11. TCLK Specification ........................................................................................................19 Table 12. Pin Connection for RGB Input with HSYNC/VSYNC...................................................23 Table 13. ADC Characteristics........................................................................................................24 Table 14. Supported LVDS 24-bit Panel Data Mapping.................................................................34 Table 15. Supported LVDS 18-bit Panel Data Mapping.................................................................34 Table 16. gm2121 GPIOs and Alternative Functions .....................................................................41 Table 17. Bootstrap Signals.............................................................................................................41 Table 18. Instruction Byte Map.......................................................................................................43 Table 19. Absolute Maximum Ratings............................................................................................46 Table 20. DC Characteristics...........................................................................................................47 Table 21. Maximum Speed of Operation ........................................................................................48 Table 22. Display Timing and DCLK Adjustments........................................................................48 Table 23. 2-Wire Host Interface Port Timing .................................................................................48 C2121-DAT-01F 5 http://www.genesis-microchip.com December 2002 gm2121 Preliminary Data Sheet List Of Figures Figure 1. gm2121 System Design Example......................................................................................8 Figure 2. gm2121 Pin Out Diagram ...............................................................................................10 Figure 3. gm2121 Functional Block Diagram ................................................................................16 Figure 4. Using the Internal Oscillator with External Crystal ........................................................17 Figure 5. Internal Oscillator Output................................................................................................18 Figure 6. Sources of Parasitic Capacitance.....................................................................................18 Figure 7. Using an External Single-ended Clock Oscillator...........................................................19 Figure 8. Internally Synthesized Clocks .........................................................................................20 Figure 9. On-chip Clock Domains..................................................................................................21 Figure 10. Correct Power Sequencing ..............................................................................................22 Figure 11. Example ADC Signal Terminations................................................................................23 Figure 12. gm2121 Clock Recovery .................................................................................................24 Figure 13. ADC Capture Window ....................................................................................................25 Figure 14. Some of gm2121 built-in test patterns ............................................................................26 Figure 15. Factory Calibration and Test Environment .....................................................................26 Figure 16. HSYNC Delay.................................................................................................................27 Figure 17. Active Data Crosses HSYNC Boundary .........................................................................27 Figure 18. ODD/EVEN Field Detection...........................................................................................28 Figure 19. RealColorTM Digital Color Controls................................................................................29 Figure 20. Display Windows and Timing.........................................................................................32 Figure 21. Single Pixel Width Display Data.....................................................................................32 Figure 22. Double Pixel Wide Display Data ....................................................................................33 Figure 23. Panel Power Sequencing .................................................................................................33 Figure 24. OSD Cell Map.................................................................................................................35 Figure 25. OCM Full-Custom and Standalone Configurations ........................................................37 Figure 26. Programming OCM in Standalone Configuration...........................................................38 Figure 27. Programming the OCM in Full-Custom Configuration ..................................................39 Figure 28. 2-Wire Protocol Data Transfer ........................................................................................43 Figure 29. 2-Wire Write Operations (0x1x and 0x2x)......................................................................44 Figure 30. 2-Wire Read Operation (0x9x and 0xAx) .......................................................................44 Figure 31. External ROM Interface Timing Diagram ......................................................................49 Figure 32. gm2121 160-pin PQFP Mechanical Drawing ................................................................51 C2121-DAT-01F 6 http://www.genesis-microchip.com December 2002 gm2121 Preliminary Data Sheet Revision History Document Description Date C2121-DAT-01A * Initial release May 2002 * Corrected Pin out changes as follows: Jun 2002 o Figure 2, gm2121 Pin out Diagram (Pin #102 to 116) o Table 2, RCLK PLL pins o Table 7, Power & Ground Pins for ADC Sampling Clock DDS o Table 8, Power & Ground Pins for Display Clock DDS o Table10, AVSS_OUT_LV_E pin o Table 6, one RESERVED pin and two RESERVED Pin name change to VCO_LV & VBUFC Corrected Pinout as follows: Aug 2002 * Pins 88 to 97 changed from RESERVED to GPO [0..7] * Pins 38 and 39 changed to STI_TM1 and STI_TM2 Table 3, added GPO [0..7] Table 6, removed RESERVED pins 88 to 97 Table 6, renamed pins 38 and 39 to STI_TM1 and STI_TM2 and added a clause that these pins MUST be tied to GND. Updated 4.14.4. with TCLK_SEL0, TCLK_SEL1 and DDC_PORT_SEL information. These signals are new bootstrap configuration pins in gm2121 Updated 4.14.5 with the newly added GPO's [0..7] Updated 4.15 with the new bootstrap configuration pins Table 20, updated DC Characteristics Updated 4.14.4 and 4.15 with clarifications for the UART baud rates and DDC2Bi pin selection options in standalone configuration Changed Pin names: o RVDD to RVDD_3.3 o CVDD to CVDD_2.5 o AVDD_OUT_LV_E to AVDD_OUT_LV_E_2.5 o AVDD_LV_E_ to AVDD_LV_E_2.5 o AVDD_OUT_LV_O to AVDD_OUT_LV_O_2.5 o AVDD_LV_O to AVDD_LV_O_2.5 o AVDD_RPLL to AVDD_RPLL_3.3 o VDD_DPLL to VDD_DPLL_3.3 o AVDD_DDDS to AVDD_DDDS_3.3 o VDD_DDDS to VDD_DDDS_3.3 o AVDD_SSDS to AVDD_SSDS_3.3 o VDD_SSDS to VDD_SSDS_3.3 o VDD2_ADC to VDD2_ADC_2.5 o VDD1_ADC to VDD1_ADC_2.5 o AVDD_ADC to AVDD_ADC_3.3 o AVDD_BLUE to AVDD_BLUE_3.3 o AVDD_GREEN to AVDD_GREEN_3.3 o AVDD_RED to AVDD_RED_3.3 C2121-DAT-01B C2121-DAT-01C * * * * * * * * * * C2121-DAT-01D * C2121-DAT-01E * C2121-DAT-01F * * * * * C2121-DAT-01F Added Section 4.2.2 - Correct Power Sequencing Sep 2002 Added the following note to Table 3 System Interface/GPIO signals GPIO4/UART_DI Oct 2002 and GPIO5/UART_DO: Add 10K Pull-up to VDD_3.3 Added note to Table 17 bootstrap signal HOST_PORT_EN (ROM_ADDR8) Added note to Table 17 bootstrap signal OCM_ROM_CNFG(1) (ROM_ADDR14) Updated Table 17 bootstrap signal DDC_PORT_SEL (ROM_ADDR12) Documentation Fix: Pin Name Change GPIO16/HFS to GPIO16/HFSn Added section 5.3 External ROM Interface Timing Requirements Dec 2002 7 http://www.genesis-microchip.com December 2002 gm2121 Preliminary Data Sheet 1 Overview The gm2121 is a graphics processing IC for Liquid Crystal Display (LCD) monitors at SXGA resolution. It provides all key IC functions required for the highest quality LCD monitors. On-chip functions include a high-speed triple-ADC and PLL, a high quality zoom and shrink scaling engine, an on-screen display (OSD) controller, digital color controls, an on-chip micro-controller (OCM) and industry standard dual four channel LVDS transmitter for direct connect to LCD panels with LVDS interface. With this level of integration, the gm2121 devices simplify and reduce the cost of LCD monitors while maintaining a highdegree of flexibility and quality. 1.1 gm2121 System Design Example Figure 1 below shows a typical dual interface LCD monitor system based on the gm2121. Designs based on the gm2121 have reduced system cost, simplified hardware and firmware design and increased reliability because only a minimal number of components are required in the system. Analog RGB Direct Connect to LVDS IF Panels gm2121 LCD Module Back-light NVRAM Figure 1. C2121-DAT-01F EEPROM (optional) gm2121 System Design Example 8 http://www.genesis-microchip.com December 2002 gm2121 Preliminary Data Sheet 1.2 gm2121 Features On-chip Microcontroller FEATURES * * * Zoom (from VGA) and shrink (from UXGA) scaling * Integrated 8-bit triple-channel ADC / PLL * Embedded microcontroller with parallel ROM interface * On-chip versatile OSD engine * All system clocks synthesized from a single external crystal * Programmable gamma correction (CLUT) * RealColor controls provide sRGB compliance * PWM back light intensity control * 5-Volt tolerant inputs * Low EMI and power saving features * * * Built in Flexible LVDS Transmitter High-Quality Advanced Scaling * * * Fully programmable zoom ratios High-quality shrink capability from UXGA resolution Real Recovery function provides full color recovery image for refresh rates higher than those supported by the LCD panel Supports up to 162MHz (SXGA 75Hz / UXGA 60Hz) On-chip high-performance PLLs (only a single reference crystal required) Automatic input format detection Robust phase and image positioning RealColor Technology * * * * * * * Dual four channel 6/8-bit LVDS transmitter (with high-quality dithering) Programmable channel swapping Programmable channel polarity Support up to SXGA 75Hz output Stand-alone operation requires no external ROM and no firmware development for Fast Time to Market Auto-Configuration / Auto-Detection * * * Highly Integrated System-on-a-Chip Reduces Component Count for Highly Cost Effective Solution Analog RGB Input Port * * * Requires no external micro-controller External parallel ROM interface allows firmware customization with little additional cost 21 general-purpose inputs/outputs (GPIO's) and 8 general-purpose outputs (GPO's) available for managing system devices (keypad, back-light, NVRAM, etc) Industry-standard firmware embedded onchip, requires no external ROM (configuration settings stored in NVRAM) Low power mode (,0.15W) when no inputs are active Support for DDC2Bi based In-systemProgramming of Flash ROM Digital brightness and contrast controls TV color controls including hue and saturation controls Flesh-tone adjustment Full color matrix allows end-users to experience the same colors as viewed on CRTs and other displays (e.g. sRGB compliance) Firmware compatible Family of Products: - gm2110/20 Analog-Interface XGA/SXGA - gm3110/gm3120 Digital-Interface XGA/SXGA - gm5110/gm5120 Dual-Interface XGA/SXGA On-chip OSD Controller * * * * On-chip RAM for downloadable menus 1, 2 and 4-bit per pixel character cells Horizontal and vertical stretch of OSD menus Blinking, transparency and blending Built in Test Pattern Generator C2121-DAT-01F 9 http://www.genesis-microchip.com December 2002 gm2121 Preliminary Data Sheet 2 GM2121 Pinout 41 42 43 44 45 46 47 48 49 50 51 52 53 54 55 56 57 58 59 60 61 62 63 64 65 66 67 68 69 70 71 72 73 74 75 76 77 78 79 80 120 119 118 117 116 115 114 113 112 111 110 109 108 107 106 105 104 103 102 101 100 99 98 97 96 95 94 93 92 91 90 89 88 87 86 85 84 83 82 81 GND1_ADC VDD1_ADC_2.5 GND2_ADC VDD2_ADC_2.5 VSS_SDDS VDD_SDDS_3.3 AVSS_SDDS AVDD_SDDS_3.3 VBUFC VSS_DDDS VDD_DDDS_3.3 AVSS_DDDS AVDD_DDDS_3.3 VSS_DPLL VDD_DPLL_3.3 AVSS_RPLL AVDD_RPLL_3.3 XTAL TCLK HSYNC VSYNC CRVSS CVDD_2.5 GPO 7 GPO 6 GPO 5 GPO 4 GPO 3 GPO 2 CRVSS RVDD_3.3 GPO 1 GPO 0 RESERVED RESERVED RESERVED RESERVED RESERVED RESERVED RESERVED PBIAS CRVSS CVDD_2.5 CRVSS VCO_LV AVDD_OUT_LV_E_2.5 AVSS_OUT_LV_E CH3P_LV_E CH3N_LV_E CLKP_LV_E CLKN_LV_E CH2P_LV_E CH2N_LV_E CH1P_LV_E CH1N_LV_E CH0P_LV_E CH0N_LV_E AVSS_OUT_LV_E AVDD_OUT_LV_E_2.5 AVSS_LV_E AVDD_LV_E_2.5 AVSS_OUT_LV_O AVDD_OUT_LV_O_2.5 CH3P_LV_O CH3N_LV_O CLKP_LV_O CLKN_LV_O CH2P_LV_O CH2N_LV_O CH1P_LV_O CH1N_LV_O CH0P_LV_O CH0N_LV_O AVDD_OUT_LV_O_2.5 AVSS_OUT_LV_O AVSS_LV_O AVDD_LV_O_2.5 CRVSS CVDD_2.5 RESERVED 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 33 34 35 36 37 38 39 40 gm2121 ROM_DATA5 ROM_DATA4 ROM_DATA3 ROM_DATA2 ROM_DATA1 ROM_DATA0 ROM_OEn GPIO22/HCLK GPIO16/HFSn GPIO20/HDATA3 GPIO19/HDATA2 GPIO18/HDATA1 GPIO17/HDATA0 RVDD_3.3 CRVSS GPIO21/IRQn RESETn GPIO15/DDC_SCL GPIO14/DDC_SDA CVDD_2.5 CRVSS GPIO8/IRQINn GPIO0/PWM0 GPIO1/PWM1 GPIO2/PWM2 GPIO3/TIMER1 GPIO4/UART_DI GPIO5/UART_DO GPIO6 RVDD_3.3 CRVSS GPIO7 GPIO9 GPIO10 GPIO11/ROM_WEn GPIO12/NVRAM_SDA GPIO13/NVRAM_SCL STI_TM1 STI_TM2 PPWR 160 159 158 157 156 155 154 153 152 151 150 149 148 147 146 145 144 143 142 141 140 139 138 137 136 135 134 133 132 131 130 129 128 127 126 125 124 123 122 121 ROM_DATA6 ROM_DATA7 CRVSS RVDD_3.3 ROM_ADDR0 ROM_ADDR1 ROM_ADDR2 ROM_ADDR3 ROM_ADDR4 ROM_ADDR5 ROM_ADDR6 ROM_ADDR7 ROM_ADDR8 ROM_ADDR9 ROM_ADDR10 ROM_ADDR11 CRVSS RVDD_3.3 ROM_ADDR12 ROM_ADDR13 ROM_ADDR14 ROM_ADDR15 CVDD_2.5 CRVSS AVDD_RED_3.3 RED+ REDAGND_RED AVDD_GREEN_3.3 GREEN+ GREENAGND_GREEN AVDD_BLUE_3.3 BLUE+ BLUEAGND_BLUE AVDD_ADC_3.3 ADC_TEST AGND_ADC SGND_ADC The gm2121 is available in a 160-pin Plastic Quad Flat Pack (PQFP) package. Figure 2 provides the pin locations for all signals. Figure 2. C2121-DAT-01F gm2121 Pin Out Diagram 10 http://www.genesis-microchip.com December 2002 gm2121 Preliminary Data Sheet 3 GM2121Pin List I/O Legend: A = Analog, I = Input, O = Output, P = Power, G= Ground Table 1. Pin Name No. I/O Description Analog power (3.3V) for the red channel. Must be bypassed with decoupling capacitor to AGND_RED pin on system board (as close as possible to the pin). Positive analog input for Red channel. Negative analog input for Red channel. Analog ground for the red channel. Must be directly connected to the system ground plane. Analog power (3.3V) for the green channel. Must be bypassed with decoupling capacitor to AGND_GREEN pin on system board (as close as possible to the pin). Positive analog input for Green channel. Negative analog input for Green channel. Analog ground for the green channel. Must be directly connected to the system ground plane. Analog power (3.3V) for the blue channel. Must be bypassed with decoupling capacitor to AGND_BLUE pin on system board (as close as possible to the pin). Positive analog input for Blue channel. Negative analog input for Blue channel. Analog ground for the blue channel. Must be directly connected to the system ground plane. Analog power (3.3V) for ADC analog blocks that are shared by all three channels. Includes band gap reference, master biasing and full-scale adjust. Must be bypassed with decoupling capacitor to AGND_ADC pin on system board (as close as possible to the pin). Analog test output for ADC Do not connect. Analog ground for ADC analog blocks that are shared by all three channels. Includes band gap reference, master biasing and full-scale adjust. Must be directly connected to system ground plane. Dedicated pad for substrate guard ring that protects the ADC reference system. Must be directly connected to the system ground plane. Digital GND for ADC clocking circuit. Must be directly connected to the system ground plane Digital power (2.5V) for ADC encoding logic. Must be bypassed with decoupling capacitor to GND1_ADC pin on system board (as close as possible to the pin). Digital GND for ADC clocking circuit. Must be directly connected to the system ground plane. Digital power (2.5V) for ADC encoding logic. Must be bypassed with decoupling capacitor to GND2_ADC pin on system board (as close as possible to the pin). ADC input horizontal sync input. [Input, Schmitt trigger (400mV typical hysteresis), 5V-tolerant] ADC input vertical sync input. [Input, Schmitt trigger (400mV typical hysteresis), 5V-tolerant] AVDD_RED_3.3 136 AP RED+ REDAGND_RED 135 134 133 AI AI AG AVDD_GREEN_3.3 132 AP GREEN+ GREENAGND_GREEN 131 130 129 AI AI AG AVDD_BLUE_3.3 128 AP BLUE+ BLUEAGND_BLUE 127 126 125 AI AI AG AVDD_ADC_3.3 124 AP ADC_TEST AGND_ADC 123 122 AO AG SGND_ADC 121 AG GND1_ADC 120 G VDD1_ADC_2.5 119 P GND2_ADC 118 G VDD2_ADC_2.5 117 P HSYNC 101 I VSYNC 100 I Table 2. Pin Name Analog Input Port RCLK PLL Pins No I/O Description AVDD_RPLL_3.3 104 AP AVSS_RPLL 105 AG TCLK 102 AI XTAL VDD_DPLL_3.3 VSS_DPLL 103 106 107 AO P G Analog power for the Reference DDS PLL. Connect to 3.3V supply. Must be bypassed with a 0.1uF capacitor to pin AVSS_RPLL (as close to the pin as possible). Analog ground for the Reference DDS PLL. Must be directly connected to the system ground plane. Reference clock (TCLK) from the 20.0MHz crystal oscillator (see Figure 4), or from singleended CMOS/TTL clock oscillator (see Figure 7). This is a 5V-tolerant input. See Table 12. Crystal oscillator output. Digital power for FCLK and RCLK PLLs. Connect to 3.3V supply. Digital ground for FCLK and RCLK PLLs. C2121-DAT-01F 11 http://www.genesis-microchip.com December 2002 gm2121 Preliminary Data Sheet Table 3. Pin Name No I/O Description Active-low hardware reset signal. The reset signal must be held low for at least 1S. [Input, Schmitt trigger (400mV typical hysteresis), 5V-tolerant] General-purpose input/output signal or PWM0. Open drain option via register setting. [Bi-directional, Schmitt trigger (400mV typical hysteresis), 5V-tolerant] General-purpose input/output signal or PWM1. Open drain option via register setting. [Bi-directional, Schmitt trigger (400mV typical hysteresis), 5V-tolerant] General-purpose input/output signal or PWM2. Open drain option via register setting. [Bi-directional, Schmitt trigger (400mV typical hysteresis), 5V-tolerant] General-purpose input/output signal. Open drain option via register setting. This pin is also connected to Timer 1 clock input of the OCM. [Bi-directional, Schmitt trigger (400mV typical hysteresis), 5V-tolerant] General-purpose input/output signal. Open drain option via register setting. This pin is also connected to the OCM UART data input signal by programming an OCM register. Add 10K Pull-up to VDD_3.3. [Bi-directional, Schmitt trigger (400mV typical hysteresis), 5V-tolerant] General-purpose input/output signal. Open drain option via register setting. This pin is also connected to the OCM UART data output signal by programming an OCM register. Add 10K Pull-up to VDD_3.3. [Bi-directional, Schmitt trigger (400mV typical hysteresis), 5V-tolerant] General-purpose input/output signal. [Bi-directional, Schmitt trigger (400mV typical hysteresis), 5V-tolerant] General-purpose input/output signal. [Bi-directional, Schmitt trigger (400mV typical hysteresis), 5V-tolerant] General-purpose input/output signal. This is also active-low interrupt input to OCM and is directly wired to OCM int_0n. [Bi-directional, Schmitt trigger (400mV typical hysteresis), 5V-tolerant] General-purpose input/output signal. Open drain option via register setting. [Bi-directional, Schmitt trigger (400mV typical hysteresis), 5V-tolerant] General-purpose input/output signal. Open drain option via register setting. [Bi-directional, Schmitt trigger (400mV typical hysteresis), 5V-tolerant] General-purpose input/output signal, or ROM write enable if a programmable FLASH device is used. Open drain option via register setting. [Bi-directional Input, Schmitt trigger (400mV typical hysteresis), 5V-tolerant] General-purpose input/output signals, or 2-wire master serial interface to NVRAM in standalone mode. Open drain option via register setting. [Bi-directional Input, Schmitt trigger (400mV typical hysteresis), 5V-tolerant] General-purpose input/output signals, or 2-wire master serial interface to NVRAM in standalone mode. Open drain option via register setting. [Bi-directional Input, Schmitt trigger (400mV typical hysteresis), 5V-tolerant] General-purpose input/output signal when host port is disabled, or data signal for 2-wire serial host interface. [Bi-directional, Schmitt trigger (400mV typical hysteresis), slew rate limited, 5V tolerant] General-purpose input/output signals. [Bi-directional, Schmitt trigger (400mV typical hysteresis), 5V-tolerant] RESETn 17 I GPIO0/PWM0 23 IO GPIO1/PWM1 24 IO GPIO2/PWM2 25 IO GPIO3/TIMER1 26 IO GPIO4/UART_DI 27 IO GPIO5/UART_DO 28 IO GPIO6 29 IO GPIO7 32 IO GPIO8/IRQINn 22 IO GPIO9 33 IO GPIO10 34 IO GPIO11/ROM_WEn 35 IO GPIO12/NVRAM_SDA GPIO13/NVRAM_SCL 36 37 IO IO GPIO14/DDC_SCL GPIO15/DDC_SDA 18 19 IO GPIO16/HFSn 9 IO GPIO17/HDATA0 GPIO18/HDATA1 GPIO19/HDATA2 GPIO20/HDATA3 GPIO21/IRQn 13 12 11 10 16 IO IO IO IO IO GPIO22/HCLK 8 IO GPO 0 GPO 1 GPO 2 GPO 3 GPO 4 GPO 5 GPO 6 GPO 7 88 89 92 93 94 95 96 97 C2121-DAT-01F System Interface and GPIO Signals O O O O O O O O General-purpose input/output signal when host port is disabled, or active-low and opendrain interrupt output pin. [Bi-directional, 5V-tolerant] General-purpose input/output signal when host port is disabled, or clock for 2-wire serial host interface. [Bi-directional, Schmitt trigger (400mV typical hysteresis), 5V-tolerant] General-purpose output signal. General-purpose output signal General-purpose output signal General-purpose output signal General-purpose output signal General-purpose output signal General-purpose output signal General-purpose output signal 12 http://www.genesis-microchip.com December 2002 gm2121 Preliminary Data Sheet Table 4. Pin Name No I/O PBIAS 41 O PPWR 40 O CH3P_LV_E CH3N_LV_E CLKP_LV_E CLKN_LV_E CH2P_LV_E CH2N_LV_E CH1P_LV_E CH1N_LV_E CH0P_LV_E CH0N_LV_E CH3P_LV_O CH3N_LV_O CLKP_LV_O CLKN_LV_O CH2P_LV_O CH2N_LV_O CH1P_LV_O CH1N_LV_O CH0P_LV_O CH0N_LV_O 48 49 50 51 52 53 54 55 56 57 64 65 66 67 68 69 70 71 72 73 O O O O O O O O O O O O O O O O O O O O Description Panel Bias Control (back light enable) [Tri-state output, Programmable Drive] Panel Power Control [Tri-state output, Programmable Drive] Even LVDS Channel 3 positive Even LVDS Channel 3 negative Even LVDS Clock positive Even LVDS Clock negative Even LVDS Channel 2 positive Even LVDS Channel 2 negative Even LVDS Channel 1 positive Even LVDS Channel 1 negative Even LVDS Channel 0 positive Even LVDS Channel 0 negative Odd LVDS Channel 3 positive Odd LVDS channel 3 negative Odd LVDS Clock positive Odd LVDS Clock negative Odd LVDS Channel 2 positive Odd LVDS channel 2 negative Odd LVDS Channel 1 positive Odd LVDS channel 1 negative Odd LVDS Channel 0 positive Odd LVDS channel 0 negative Table 5. Pin Name No I/O ROM_ADDR15 ROM_ADDR14 ROM_ADDR13 ROM_ADDR12 ROM_ADDR11 ROM_ADDR10 ROM_ADDR9 ROM_ADDR8 ROM_ADDR7 ROM_ADDR6 ROM_ADDR5 ROM_ADDR4 ROM_ADDR3 ROM_ADDR2 ROM_ADDR1 ROM_ADDR0 ROM_DATA7 ROM_DATA6 ROM_DATA5 ROM_DATA4 ROM_DATA3 ROM_DATA2 ROM_DATA1 ROM_DATA0 ROM_OEn 139 140 141 142 145 146 147 148 149 150 151 152 153 154 155 156 159 160 1 2 3 4 5 6 7 IO IO IO IO IO IO IO IO IO IO IO IO IO IO IO IO I I I I I I I I O C2121-DAT-01F Display Output Port Parallel ROM Interface Port Description ROM address output. These pins also serve as 5V-tolerant bootstrap inputs on power up. 5V-tolerant external PROM data input External PROM data Output Enable 13 http://www.genesis-microchip.com December 2002 gm2121 Preliminary Data Sheet Table 6. Pin Name Reserved Reserved Reserved Reserved Reserved Reserved Reserved Reserved VBUFC VCO_LV STI_TM1 STI_TM2 No I/O 80 81 82 83 84 85 86 87 112 45 38 39 O O O O O O O O O O I I Description For test purposes only. Do not connect For test purposes only. Do not connect For test purposes only. Do not connect For test purposes only. Do not connect For test purposes only. Do not connect For test purposes only. Do not connect For test purposes only. Do not connect For test purposes only. Do not connect For test purposes only. Do not connect For test purposes only. Do not connect For test purposes only. MUST be tied to GND For test purposes only. MUST be tied to GND Power and Ground Pins for ADC Sampling Clock DDS Table 7. Pin Name Reserved Pins No I/O Description AVDD_SDDS_3.3 113 AP AVSS_SDDS 114 AG VDD_SDDS_3.3 VSS_SDDS 115 116 P G Analog power for the Source DDS. Connect to 3.3V supply. Must be bypassed with a 0.1uF capacitor to AVSS_SDDS pin (as close to the pin as possible). Analog ground for the Source DDS. Must be directly connected to the system ground. Digital power for the Source DDS. Connect to 3.3V supply. Digital ground for the Source DDS. Table 8. Power and Ground Pins for Display Clock DDS No I/O Description AVDD_DDDS_3.3 108 AP AVSS_DDDS 109 AG VDD_DDDS_3.3 VSS_DDDS 110 111 P G Analog power for Destination DDS. Connect to 3.3V supply. Must be bypassed with a 0.1uF capacitor to AVSS_DDDS pin (as close to the pin as possible). Analog ground for Destination DDS. Must be directly connected to the system ground plane. Digital power for the Destination DDS. Connect to 3.3V supply. Digital ground for the Destination DDS. Pin Name C2121-DAT-01F 14 http://www.genesis-microchip.com December 2002 gm2121 Preliminary Data Sheet Table 9. Pin Name RVDD_3.3 CRVSS CVDD_2.5 No I/O 14 30 90 143 157 15 21 31 42 44 78 91 99 137 144 158 20 43 79 98 138 P P P P P G G G G G G G G G G G P P P P P I/O Power and Ground Pins Description Connect to 3.3V digital supply. Must be bypassed with a 0.1uF capacitor to CRVSS (as close to the pin as possible). Connect to digital ground. Connect to 2.5V digital supply. Must be bypassed with a 0.1uF capacitor to CRVSS (as close to the pin as possible). Note, "AP" indicates a power supply that is analog in nature and does not have large switching currents. These should be isolated from other digital supplies that do have large switching currents. Pin Name AVDD_OUT_LV_E_ 2.5 AVDD_LV_E_2.5 AVSS_OUT_LV_E AVSS_LV_E AVDD_OUT_LV_O_ 2.5 AVDD_LV_O_2.5 AVSS_OUT_LV_O AVSS_LV_O C2121-DAT-01F Table 10. Power and Ground Pins for LVDS Transmitter No I/O Description 46 59 61 47 58 60 AP Analog power for on-chip LVDS output buffer. Connect to 2.5V supply. AP G 63 74 77 AP Analog power for on-chip LVDS transmitter. Connect to 2.5V supply Analog ground for on-chip LVDS output buffer. Must be directly connected to the system ground plane Analog ground for on-chip LVDS transmitter. Must be directly connected to the system ground plane Analog power for on-chip LVDS output buffer. Connect to 2.5V supply. AP Analog power for on-chip LVDS transmitter. Connect to 2.5V supply. 62 75 76 G Analog ground for on-chip LVDS output buffer. Must be directly connected to the system ground plane. Analog ground for on-chip LVDS transmitter. Must be directly connected to the system ground plane. G G 15 http://www.genesis-microchip.com December 2002 gm2121 Preliminary Data Sheet 4 Functional Description A functional block diagram is illustrated below. Each of the functional units shown is described in the following sections. NVRAM Serial Host I/F Serial I/F GPIO Host Interface Parallel ROM IF 8051-style Microcontroller Triple ADC Clock Generation External ROM I/F OSD Controller Internal ROM MCU RAM Analog RGB Crystal Reference Brightness / Contrast / Hue / Sat / RealColor / Moire Image Capture / Measurement Figure 3. OSD RAMs Zoom / Shrink / Filter Gamma Control Output Data Path Dual LVDS Transmitter gm2121 Functional Block Diagram 4.1 Clock Generation The gm2121 features two clock inputs. All additional clocks are internal clocks derived from one or more of these: 1. Crystal Input Clock (TCLK and XTAL). This is the input pair to an internal crystal oscillator and corresponding logic. A 20.0 MHz crystal is recommended. Other crystal frequencies may be used, but require custom programming. This is illustrated in Figure 4 below. Alternatively, a single-ended TTL/CMOS clock oscillator can be driven into the TCLK pin (leave XTAL as N/C in this case). This is illustrated in Figure 7 below. This option is selected by connecting a 10K pull-up to ROM_ADDR13 (refer to Table 17). See also Table 12. 2. Host Interface Transfer Clock (HCLK) The gm2121 TCLK oscillator circuitry is a custom designed circuit to support the use of an external oscillator or a crystal resonator to generate a reference frequency source for the gm2121 device. C2121-DAT-01F 16 http://www.genesis-microchip.com December 2002 Panel Data and Control gm2121 Preliminary Data Sheet 4.1.1 Using the Internal Oscillator with External Crystal The first option for providing a clock reference is to use the internal oscillator with an external crystal. The oscillator circuit is designed to provide a very low jitter and very low harmonic clock to the internal circuitry of the gm2121. An Automatic Gain Control (AGC) is used to insure startup and operation over a wide range of conditions. The oscillator circuit also minimizes the overdrive of the crystal, which reduces the aging of the crystal. When the gm2121 is in reset, the state of the ROM_ADDR13 pin is sampled. If the pin is left unconnected (internal pull-down) then internal oscillator is enabled. In this mode a crystal resonator is connected between TCLK and the XTAL with the appropriately sized loading capacitors CL1 and CL2. The size of CL1 and CL2 are determined from the crystal manufacturer's specification and by compensating for the parasitic capacitance of the gm2121 device and the printed circuit board traces. The loading capacitors are terminated to the analog VDD power supply. This connection increases the power supply rejection ratio when compared to terminating the loading capacitors to ground. gm2121 Vdda CL1 102 Vdd TCLK 103 Vdda XTAL CL2 OSC_OUT TCLK Distribution 100 K 180 uA 141 N/C Reset State Logic ROM_ADDR13 Internal Oscillator Enable Internal Pull Down Resistor ~ 60K Figure 4. Using the Internal Oscillator with External Crystal The TCLK oscillator uses a Pierce Oscillator circuit. The output of the oscillator circuit, measured at the TCLK pin, is an approximate sine wave with a bias of about 2 volts above ground (see Figure 5). The peak-to-peak voltage of the output can range from 250 mV to 1000 mV depending on the specific characteristics of the crystal and variation in the oscillator characteristics. The output of the oscillator is connected to a comparator that converts the sine wave to a square wave. The comparator requires a C2121-DAT-01F 17 http://www.genesis-microchip.com December 2002 gm2121 Preliminary Data Sheet minimum signal level of about 50-mV peak to peak to function correctly. The output of the comparator is buffered and then distributed to the gm2121 circuits. 3.3 Volts 250 mV peak to peak to 1000 mV peak to peak ~ 2 Volts time Figure 5. Internal Oscillator Output One of the design parameters that must be given some consideration is the value of the loading capacitors used with the crystal as shown in Figure 6. The loading capacitance (Cload) on the crystal is the combination of CL1 and CL2 and is calculated by Cload = ((CL1 * CL2) / (CL1 + CL2)) + Cshunt. The shunt capacitance Cshunt is the effective capacitance between the XTAL and TCLK pins. For the gm2121 this is approximately 9 pF. CL1 and CL2 are a parallel combination of the external loading capacitors (Cex), the PCB board capacitance (Cpcb), the pin capacitance (Cpin), the pad capacitance (Cpad), and the ESD protection capacitance (Cesd). The capacitances are symmetrical so that CL1 = CL2 = Cex + CPCB + Cpin + Cpad + CESD. The correct value of Cex must be calculated based on the values of the load capacitances. Approximate values are provided in Figure 6. CL1 = Cex1 + Cpcb + Cpin + Cpad + Cesd Vdda Cex1 Cpcb 102 Cpin Cpad Cesd Internal Oscillator TCLK gm2121 Cshunt Vdda 103 XTAL Cex2 Cpcb Cpin Cpad CL2 = Cex1 + Cpcb + Cpin + Cpad + Cesd Figure 6. C2121-DAT-01F Cesd Approximate values: CPCB ~ 2 pF to 10 pF (layout dependent) Cpin ~ 1.1 pF Cpad ~ 1 pF Cesd ~ 5.3 pF Cshunt ~ 9 pF Sources of Parasitic Capacitance 18 http://www.genesis-microchip.com December 2002 gm2121 Preliminary Data Sheet Some attention must be given to the details of the oscillator circuit when used with a crystal resonator. The PCB traces should be as short as possible. The value of Cload that is specified by the manufacturer should not be exceeded because of potential start up problems with the oscillator. Additionally, the crystal should be a parallel resonate-cut and the value of the equivalent series resistance must be less then 90 Ohms. 4.1.2 Using an External Clock Oscillator Another option for providing the reference clock is to use a single-ended external clock oscillator. When the gm2121 is in reset, the state of the ROM_ADDR13 is sampled. If ROM_ADDR13 is pulled high by connecting to VDD through a pull-up resistor (10K recommended, 15K maximum) then external oscillator mode is enabled. In this mode the internal oscillator circuit is disabled and the external oscillator signal that is connected to the TCLK pin is routed to an internal clock buffer. This is illustrated in Figure 7. Vdd 14 to 24 MHz gm2121 102 Vdd OSC_OUT TCLK Distribution TCLK Oscillator GND 103 Vdd Internal Oscillator XTAL Disable 10 K 141 Reset State Logic External Oscillator Enable ROM_ADDR13 Internal Pull Down Resistor ~ 60 K Figure 7. Using an External Single-ended Clock Oscillator Table 11. TCLK Specification Frequency Jitter Tolerance Rise Time (10% to 90%) Maximum Duty Cycle C2121-DAT-01F 14 to 24 MHz 250 ps 5 ns 40-60 19 http://www.genesis-microchip.com December 2002 gm2121 Preliminary Data Sheet 4.1.3 Clock Synthesis The gm2121 synthesizes all additional clocks internally as illustrated in Figure 8 below. The synthesized clocks are as follows: 1. Main Timing Clock (TCLK) is the output of the chip internal crystal oscillator. TCLK is derived from the TCLK/XTAL pad input. 2. Reference Clock (RCLK) synthesized by RCLK PLL (RPLL) using TCLK as the reference. 3. Input Source Clock (SCLK) synthesized by Source DDS (SDDS) PLL using input HSYNC as the reference. The SDDS internal digital logic is driven by RCLK. 4. Display Clock (DCLK) synthesized by Destination DDS (DDDS) PLL using IP_CLK as the reference. The DDDS internal digital logic is driven by RCLK. 5. Half Reference Clock (RCLK/2) is the RCLK (see 2, above) divided by 2. Used as OCM_CLK domain driver. 6. Quarter Reference Clock (RCLK/4) is the RCLK (see 2, above) divided by 4. Used as alternative clock (faster than TCLK) to drive IFM. 7. ADC Output Clock (SENSE_ACLK) is a delay-adjusted ADC sampling clock, ACLK. ACLK is derived from SCLK. HSYNC SCLK SDDS IP_CLK TCLK DCLK DDDS RCLK PLL Figure 8. /2 RCLK/2 /4 RCLK/4 Internally Synthesized Clocks The on-chip clock domains are selected from the synthesized clocks as shown in Figure 9 below. These include: 1. Input Domain Clock (IP_CLK). Max = 165MHz 2. Host Interface and On-Chip Microcontroller Clock (OCM_CLK). Max = 100MHz 3. Filter and Display Pixel Clock (DP_CLK). Max = 135MHz 4. Source Timing Measurement Domain Clock (IFM_CLK). Max = 50MHz C2121-DAT-01F 20 http://www.genesis-microchip.com December 2002 gm2121 Preliminary Data Sheet 5. ADC Domain Clock (ACLK). Max = 165MHz. The clock selection for each domain as shown in the figure below is controlled using the CLOCK_CONFIG registers (index 0x03 and 0x04). DCLK SCLK IP_CLK DP_CLK SENSE_ACLK IP_CLK RCLK/2 SCLK RCLK/4 ACLK OCM_CLK TCLK TCLK Figure 9. IFM_CLK On-chip Clock Domains 4.2 Chip Initialization 4.2.1 Hardware Reset Hardware Reset is performed by holding the RESETn pin low for a minimum of 1s. A TCLK input (see Clock Options above) must be applied during and after the reset. When the reset period is complete and RESETn is de-asserted, the power-up sequence is as follows: 1. Reset all registers of all types to their default state (this is 00h unless otherwise specified in the gm2121 Register Listing). 2. Force each clock domain into reset. Reset will remain asserted for 64 local clock domain cycles following the de-assertion of RESETn. 3. Operate the OCM_CLK domain at the TCLK frequency. 4. Preset the RCLK PLL to output ~200MHz clock (assumes 20.0MHz TCLK crystal frequency). 5. Wait for RCLK PLL to Lock. Then, switch the OCM_CLK domain to operate from the bootstrap selected clock. 6. If a pull-up resistor is installed on ROM_ADDR9 pin (see Table 17), then the OCM becomes active as soon as OCM_CLK is stable. Otherwise, the OCM remains in reset until OCM_CONTROL register (0x22) bit 1 is enabled. C2121-DAT-01F 21 http://www.genesis-microchip.com December 2002 gm2121 Preliminary Data Sheet 4.2.2 Correct Power Sequencing The system designer must ensure that the 2.5V CVDD and 3.3V RVDD power supply rails power up in the correct sequence. That is, at any time during the power-up sequence the actual voltage of the 3.3V RVDD power supply should always be equal to or higher than the actual voltage of the 2.5V CVDD power supply. In mathematical terms, VRVDD >= VCVDD at all times. This is illustrated in Figure 10. In addition, the system designer must ensure that the 2.5V core VDD supply must be active for at least 1ms before the rising edge of the chip RESETn signal during the chip power-up sequence. The rising edge of RESETn signal is used to latch the bootstrap configurations, so its correct timing relationship to the core VDD is critical for correct chip operation. Voltage RVDD (3.3V) CVDD (2.5V) VRVDD-CVDD(t) TCVDD->RESETn Time t Voltage RESETn 0V Time Figure 10. Correct Power Sequencing Parameter Min VRVDD-CVDD(for all t>0) 0V TCVDD->RESETn 1ms Typ Max 4.3 Analog to Digital Converter The gm2121 chip has three ADC's (analog-to-digital converters), one for each color (red, green, and blue). C2121-DAT-01F 22 http://www.genesis-microchip.com December 2002 gm2121 Preliminary Data Sheet 4.3.1 ADC Pin Connection The analog RGB signals are connected to the gm2121 as described below: Table 12. Pin Name Red+ RedGreen+ GreenBlue+ BlueHSYNC VSYNC Pin Connection for RGB Input with HSYNC/VSYNC ADC Signal Name Red Terminate as illustrated in Figure 11 Green Terminate as illustrated in Figure 11 Blue Terminate as illustrated in Figure 11 Horizontal Sync (Terminate as illustrated in Figure 11) Vertical Sync (Terminate as with HSYNC illustrated in Figure 11) gm2121 20 RED RED + 0.01uF 75 DB15 57.6 RED - GND 0.01uF HSYNC HS Figure 11. Example ADC Signal Terminations Please note that it is very important to follow the recommended layout guidelines for the circuit shown in Figure 11. These are described in "gm5115 Layout Guidelines" document number C5115-SLG-01A. 4.3.2 ADC Characteristics The table below summarizes the characteristics of the ADC: C2121-DAT-01F 23 http://www.genesis-microchip.com December 2002 gm2121 Preliminary Data Sheet Table 13. MIN ADC Characteristics TYP MAX Track & Hold Amp Bandwidth NOTE 290 MHz Guaranteed by design. Note that the Track & Hold Amp Bandwidth is programmable. 290 MHz is the maximum setting. Full Scale Adjust Range at RGB Inputs Full Scale Adjust Sensitivity Zero Scale Adjust Sensitivity Sampling Frequency (Fs) Differential Non-Linearity (DNL) No Missing Codes Integral Non-Linearity (INL) Channel to Channel Matching 0.55 V 0.90 V +/- 1 LSB Measured at ADC Output. Independent of full scale RGB input. Measured at ADC Output. +/- 1 LSB 10 MHz +/-0.5 LSB +/- 1.5 LSB +/- 0.5 LSB 162.5 MHz +/-0.9 LSB Fs = 135 MHz Guaranteed by test. Fs =135 MHz Note that input formats with resolutions or refresh rates higher than that supported by the LCD panel are supported as recovery modes only. This is called RealRecoveryTM. For example, it may be necessary to shrink the image. This may introduce image artifacts. However, the image is clear enough to allow the user to change the display properties. The gm2121 ADC has a built in clamp circuit for AC-coupled inputs. By inserting series capacitors (about 10 nF), the DC offset of an external video source can be removed. The clamp pulse position and width are programmable. 4.3.3 Clock Recovery Circuit The SDDS (Source Direct Digital Synthesis) clock recovery circuit generates the clock used to sample analog RGB data (IP_CLK or source clock). This circuit is locked to HSYNC of the incoming video signal. Patented digital clock synthesis technology makes the gm2121 clock circuits resistant to temperature/voltage drift. Using DDS (Direct Digital Synthesis) technology, the clock recovery circuit can generate any IP_CLK clock frequency within the range of 10MHz to 165MHz. Image Phase Measurement R G B ADC 24 Window Capture Phase HSYNC HSYNC (delayed) Figure 12. C2121-DAT-01F SDDS IPCLK gm2121 Clock Recovery 24 http://www.genesis-microchip.com December 2002 gm2121 Preliminary Data Sheet 4.3.4 Sampling Phase Adjustment The programmable ADC sampling phase is adjusted by delaying the HSYNC input to the SDDS. The accuracy of the sampling phase is checked and the result read from a register. This feature enables accurate auto-adjustment of the ADC sampling phase. 4.3.5 ADC Capture Window Figure 13 below illustrates the capture window used for the ADC input. In the horizontal direction the capture window is defined in IP_CLKs (equivalent to a pixel count). In the vertical direction it is defined in lines. All the parameters beginning with "Source" are programmed gm2121 registers values. Note that the input vertical total is solely determined by the input and is not a programmable parameter. Source Horizontal Total (pixels) Reference Point Source Hstart Source Height Input Vertical Total (lines) Source Vstart Source Width Capture Window Figure 13. ADC Capture Window The Reference Point marks the leading edge of the first internal HSYNC following the leading edge of an internal VSYNC. Both the internal HSYNC and the internal VSYNC are derived from external HSYNC and VSYNC inputs. Horizontal parameters are defined in terms of single pixel increments relative to the internal horizontal sync. Vertical parameters are defined in terms of single line increments relative to the internal vertical sync. For ADC interlaced inputs, the gm2121 may be programmed to automatically determine the field type (even or odd) from the VSYNC/HSYNC relative timing. See Input Format Measurement, Section 4.4. C2121-DAT-01F 25 http://www.genesis-microchip.com December 2002 gm2121 Preliminary Data Sheet 4.4 Test Pattern Generator (TPG) The gm2121 contains hundreds of test patterns, some of which are shown in Figure 14. Once programmed, the gm2121 test pattern generator can replace a video source (e.g. a PC) during factory calibration and test. This simplifies the test procedure and eliminates the possibility of image noise being injected into the system from the source. The foreground and background colors are programmable. In addition, the gm2121 OSD controller can be used to produce other patterns. Figure 14. Some of gm2121 built-in test patterns The DDC2Bi port can be used for factory testing. The factory test station connects to the gm2121 through the Direct Data Channel (DDC) of the DSUB15 connector. Then, the PC can make gm2121 display test patterns (see section 4.4). A camera can be used to automate the calibration of the LCD panel. DDC Factory Test Station Device-Under-Test Camera Figure 15. Factory Calibration and Test Environment 4.5 Input Format Measurement The gm2121 has an Input Format Measurement block (the IFM) providing the capability of measuring the horizontal and vertical timing parameters of the input video source. This information may be used to determine the video format and to detect a change in the input format. It is also capable of detecting the field type of interlaced formats. The IFM features a programmable reset, separate from the regular gm2121 soft reset. This reset disables the IFM, reducing power consumption. The IFM is capable of operating while gm2121 is running in power down mode. Horizontal measurements are measured in terms of the selected IFM_CLK (either TCLK or RCLK/4), while vertical measurements are measured in terms of HSYNC pulses. C2121-DAT-01F 26 http://www.genesis-microchip.com December 2002 gm2121 Preliminary Data Sheet For an overview of the internally synthesized clocks, see section 4.1. 4.5.1 HSYNC / VSYNC Delay The active input region captured by the gm2121 is specified with respect to internal HSYNC and VSYNC. By default, internal syncs are equivalent to the HSYNC and VSYNC at the input pins and thus force the captured region to be bounded by external HSYNC and VSYNC timing. However, the gm2121 provides an internal HSYNC and VSYNC delay feature that removes this limitation. This feature is available for use with the ADC input. By delaying the sync internally, the gm2121 can capture data that spans across the sync pulse. It is possible to use HSNYC and VSYNC delay for image positioning. (Alternatively, Source_HSTART and Source_VSTART in Figure 13 are used for image positioning of analog input.) Taken to an extreme, the intentional movement of images across apparent HSYNC and VSYNC boundaries creates a horizontal and/or vertical wrap effect. HSYNC is delayed by a programmed number of selected input clocks. active HS(system) HS(internal) active capture capture programmable delay capture input block actually captures across HSYNC Figure 16. HSYNC Delay Delayed horizontal sync may be used to solve a potential problem with VSYNC jitter with respect to HSYNC. VSYNC and HSYNC are generally driven active coincidentally, but with different paths to the gm2121 (HSYNC is often regenerated from a PLL). As a result, VSYNC may be seen earlier or later. Because VSYNC is used to reset the line counter and HSYNC is used to increment it, any difference in the relative position of HSYNC and VSYNC is seen on-screen as vertical jitter. By delaying the HSYNC a small amount, it can be ensured that VSYNC always resets the line counter prior to it being incremented by the "first" HSYNC. active data crosses HS boundary delayed HS placed safely within blanking Data HS (system) Internal Delayed HS Figure 17. C2121-DAT-01F Active Data Crosses HSYNC Boundary 27 http://www.genesis-microchip.com December 2002 gm2121 Preliminary Data Sheet 4.5.2 Horizontal and Vertical Measurement The IFM is able to measure the horizontal period and active high pulse width of the HSYNC signal, in terms of the selected clock period (either TCLK or RCLK/4.). Horizontal measurements are performed on only a single line per frame (or field). The line used is programmable. It is able to measure the vertical period and VSYNC pulse width in terms of rising edges of HSYNC. Once enabled, measurement begins on the rising VSYNC and is completed on the following rising VSYNC. Measurements are made on every field / frame until disabled. 4.5.3 Format Change Detection The IFM is able to detect changes in the input format relative to the last measurement and then alert both the system and the on-chip microcontroller. The microcontroller sets a measurement difference threshold separately for horizontal and vertical timing. If the current field / frame timing is different from the previously captured measurement by an amount exceeding this threshold, a status bit is set. An interrupt can also be programmed to occur. 4.5.4 Watchdog The watchdog monitors input VSYNC / HSYNC. When any HSYNC period exceeds the programmed timing threshold (in terms of the selected IFM_CLK), a register bit is set. When any VSYNC period exceeds the programmed timing threshold (in terms of HSYNC pulses), a second register bit is set. An interrupt can also be programmed to occur. 4.5.5 Internal Odd/Even Field Detection (For Interlaced Inputs to ADC Only) The IFM has the ability to perform field decoding of interlaced inputs to the ADC. The user specifies start and end values to outline a "window" relative to HSYNC. If the VSYNC leading edge occurs within this window, the IFM signals the start of an ODD field. If the VSYNC leading edge occurs outside this window, an EVEN field is indicated (the interpretation of odd and even can be reversed). The window start and end points are selected from a predefined set of values. HS window Window Start Window End VS - even VS - odd Figure 18. C2121-DAT-01F ODD/EVEN Field Detection 28 http://www.genesis-microchip.com December 2002 gm2121 Preliminary Data Sheet 4.5.6 Input Pixel Measurement The gm2121 provides a number of pixel measurement functions intended to assist in configuring system parameters such as pixel clock, SDDS sample clocks per line and phase setting, centering the image, or adjusting the contrast and brightness. 4.5.7 Image Phase Measurement This function measures the sampling phase quality over a selected active window region. This feature may be used when programming the source DDS to select the proper phase setting. Please refer to the gm2121 Programming Guide for the optimized algorithm. 4.5.8 Image Boundary Detection The gm2121 performs measurements to determine the image boundary. This information is used when programming the Active Window and centering the image. 4.5.9 Image Auto Balance The gm2121 performs measurements on the input data that is used to adjust brightness and contrast. 4.6 RealColorTM Digital Color Controls The gm2121 provides high-quality digital color controls. These consist of a subtractive "black level" stage, followed by a full 3x3 RGB matrix multiplication stage, followed by a signed offset stage as shown in Figure 19. Subtractive Offset (Black Level) Red In - Green In - Blue In - 3x3 Color Conversion Additive Offset (Brightness) X Figure 19. +/- Red Out +/- Green Out +/- Blue Out RealColorTM Digital Color Controls This structure can accommodate all RGB color controls such as black-level (subtractive stage), contrast (multiplicative stage), and brightness (signed additive offset). In addition, it supports all YUV color controls including brightness (additive factor applied to Y), contrast (multiplicative factor applied to Y), hue (rotation of U and V through an angle) and saturation (multiplicative factor applied to both Y and V). To provide the highest color purity all mathematical functions use 10 bits of accuracy. The final result is then dithered to eight or six bits (as required by the LCD panel). C2121-DAT-01F 29 http://www.genesis-microchip.com December 2002 gm2121 Preliminary Data Sheet 4.6.1 RealColorTM Flesh tone Adjustment The human eye is more sensitive to variations of flesh tones than other colors; for example, the user may not care if the color of grass is modified slightly during image capture and/or display. However, if skin tones are modified by even a small amount, it is unacceptable. The gm2121 features flesh tone adjustment capabilities. This feature is not based on lookup tables, but rather a manipulation of YUV-channel parameters. Flesh tone adjustment is available for all inputs. 4.6.2 Color Standardization and sRGB Support Internet shoppers may be very picky about what color they experience on the display. gm2121 RealColorTM digital color controls can be used to make the color response of an LCD monitor compliant with standard color definitions, such as sRGB. sRGB is a standard for color exchange proposed by Microsoft and HP (see www.srgb.com). gm2121 RealColor controls can be used to make LCD monitors sRGB compliant, even if the native response of the LCD panel itself is not. 4.7 High-Quality Scaling The gm2121 zoom scaler uses an adaptive scaling technique proprietary to Genesis Microchip Inc., and provides high quality scaling of real time video and graphics images. An input field/frame is scalable in both the vertical and horizontal dimensions. Interlaced fields may be spatially de-interlaced by vertically scaling and repositioning the input fields to align with the output display's pixel map. 4.7.1 Variable Zoom Scaling The gm2121 scaling filter can combine its advanced scaling with a pixel-replication type scaling function. This is useful for improving the sharpness and definition of graphics when scaling at high zoom factors (such as VGA to SXGA). 4.7.2 Horizontal and Vertical Shrink The gm2121 provides an arbitrary horizontal and vertical shrink down to (50% + 1 pixel/line) of the original image size. This allows the gm2121 to capture and display images one VESA standard format larger than the native display resolution. For example, UXGA may be captured and displayed on an SXGA panel. 4.8 Bypass Options The gm2121 has the capability to completely bypass internal processing. In this case, captured input signals and data are passed, with a small register latency, straight through to the display output. The gm2121 is also able to bypass the zoom filter. C2121-DAT-01F 30 http://www.genesis-microchip.com December 2002 gm2121 Preliminary Data Sheet 4.9 Gamma LUT The gm2121 provides an 8 to 10-bit look-up table (LUT) for each input color channel intended for Gamma correction and to compensate for a non-linear response of the LCD panel. A 10-bit output results in an improved color depth control. The 10-bit output is then dithered down to 8 bits (or 6 bits) per channel at the display (see section 4.10.3 below). The LUT is user programmable to provide an arbitrary transfer function. Gamma correction occurs after the zoom / shrink scaling block. The LUT has bypass enable. If bypassed, the LUT does not require programming. 4.10 Display Output Interface The Display Output Port provides data and control signals that permit the gm2121 to connect to a variety of flat panel or CRT devices. The output interface is configurable for 18 or 24-bit RGB pixels, either single or double pixel wide. All display data and timing signals are synchronous with the DCLK output clock. 4.10.1 Display Synchronization Refer to section 4.1 for information regarding internal clock synthesis. The gm2121 supports the following display synchronization modes: Frame Sync Mode: The display frame rate is synchronized to the input frame or field rate. This mode is used for standard operation. Free Run Mode: No synchronization. This mode is used when there is no valid input timing (i.e. to display OSD messages or a splash screen) or for testing purposes. In free-run mode, the display timing is determined only by the values programmed into the display window and timing registers. 4.10.2 Programming the Display Timing Display timing signals provide timing information so the Display Port can be connected to an external display device. Based on values programmed in registers, the Display Output Port produces the horizontal sync (DHS), vertical sync (DVS), and data enable (DEN) control signals, which are then encoded into the LVDS data stream by the on-chip LVDS transmitter. The figure below provides the registers that define the output display timing. Horizontal values are programmed in single pixel increments relative to the leading edge of the horizontal sync signal. Vertical values are programmed in line increments relative to the leading edge of the vertical sync signal. C2121-DAT-01F 31 http://www.genesis-microchip.com December 2002 DH_BKGND_START DVS gm2121 Preliminary Data Sheet DH_BKGND_END DV_VS_END VSYNC Region Vertical Blanking (Back Porch) DV_BKGND_START Horizontal Blanking (Front Porch) Display Active Window DV_ACTIVE_START DV_TOTAL Horizontal Blanking (Back Porch) HSYNC region Display Background Window DV_ACTIVE_LENGTH DV_BKGND_END Vertical Blanking (Front Porch) DH_TOTAL DHS DEN ** DH_HS_END ** DEN is not asserted during vertical blanking DH_ACTIVE_WIDTH DH_ACTIVE_START Figure 20. Display Windows and Timing The double-wide output only supports an even number of horizontal pixels. DCLK (Output) DEN (Output) ER/EG/EB (Output) XXX rgb0 OR/OG/OB (Output) Figure 21. C2121-DAT-01F rgb1 rgb2 rgb3 rgb4 XXX Single Pixel Width Display Data 32 http://www.genesis-microchip.com December 2002 gm2121 Preliminary Data Sheet DCLK (Output) DEN (Output) ER/EG/EB (Output) XXX rgb0 rgb2 rgb4 rgb6 rgb8 OR/OG/OB (Output) XXX rgb1 rgb3 rgb5 rgb7 rgb9 Figure 22. Double Pixel Wide Display Data 4.10.3 Panel Power Sequencing (PPWR, PBIAS) gm2121 has two dedicated outputs PPWR and PBIAS to control LCD power sequencing once data and control signals are stable. The timing of these signals is fully programmable. TMG1 TMG2 <State1> <State2> TMG2 TMG1 PPWR Output Panel Data and Control Signals PBIAS Output <State0> <State3> POWER_SEQ_EN = 1 Figure 23. <State2> <State1> <State0> POWER_SEQ_EN = 0 Panel Power Sequencing 4.10.4 Output Dithering The Gamma LUT outputs a 10-bit value for each color channel. This value is dithered down to either 8bits for 24-bit per pixel panels, or 6-bits for 18-bit per pixel panels. The benefit of dithering is that the eye tends to average neighboring pixels and a smooth image free of contours is perceived. Dithering works by spreading the quantization error over neighboring pixels both spatially and temporally. Two dithering algorithms are available: random or ordered dithering. Ordered dithering is recommended when driving a 6-bit panel. All gray scales are available on the panel output whether using 8-bit panel (dithering from 10 to 8 bits per pixel) or using 6-bit panel (dithering from 10 down to 6 bits per pixel). C2121-DAT-01F 33 http://www.genesis-microchip.com December 2002 gm2121 Preliminary Data Sheet 4.11 Dual Four Channel LVDS Transmitter The gm2121 implements the industry standard flexible four channel dual LVDS transmitter. The LVDS transmitter can support the following: * Single or double pixel mode * 24/48-bit panel mapping to the LVDS channels (see Table 14) * 18/36-bit panel mapping to the LVDS channels (see Table 15) * Programmable even/odd LVDS swapping * Programmable channel swapping (the clocks are fixed) * Programmable channel polarity swapping * Support up to SXGA 75Hz output Table 14. Supported LVDS 24-bit Panel Data Mapping Channel 0 Channel 1 Channel 2 Channel 3 R0, R1, R2, R3, R4, R5, G0 G1, G2, G3, G4, G5, B0, B1 B2, B3, B4, B5, PHS, PVS, PDE R6, R7, G6, G7, B6, B7, RES Channel 0 Channel 1 Channel 2 Channel 3 R2, R3, R4, R5, R6, R7, G2 G3, G4, G5, G6, G7, B2, B3 B4, B5, B6, B7, PHS, PVS, PDE R0, R1, G0, G1, B0, B1, RES Table 15. Channel 0 Channel 1 Channel 2 Channel 3 Supported LVDS 18-bit Panel Data Mapping R0, R1, R2, R3, R4, R5, G0 G1, G2, G3, G4, G5, B0, B1 B2, B3, B4, B5, PHS, PVS, PDE Disabled for this mode 4.12 Energy Spectrum Management (ESM) High spikes in the EMI power spectrum may cause LCD monitor products to violate emissions standards. The gm2121 has many features that can be used to reduce electromagnetic interference (EMI). These include drive strength control, dual-edge clocking and clock spectrum modulation. These features help to eliminate the costs associated with EMI reducing components and shielding. 4.13 OSD The gm2121 has a fully programmable, high-quality OSD controller. The graphics are divided into "cells" 12 by 18 pixels in size. The cells are stored in an on-chip static RAM (4096 words by 24 bits) and can be C2121-DAT-01F 34 http://www.genesis-microchip.com December 2002 gm2121 Preliminary Data Sheet stored as 1-bit per pixel data, 2-bit per pixel data or 4-bit per pixel data. This permits a good compression ratio while allowing more than 16 colors in the image. Some general features of the gm2121 OSD controller include: OSD Position - The OSD menu can be positioned anywhere on the display region. The reference point is Horizontal and Vertical Display Background Start (DH_BKGND_START and DV_BKGND_START in Figure 20). OSD Stretch - The OSD image can be stretched horizontally and/or vertically by a factor of two, three, or four. Pixel and line replication is used to stretch the image. OSD Blending - Sixteen levels of blending are supported for the character-mapped and bitmapped images. One host register controls the blend levels for pixels with LUT values of 128 and greater, while another host register controls the blend levels for pixels with LUT values of 127 and lower. OSD color LUT value 0 is reserved for transparency and is unaffected by the blend attribute. 4.13.1 On-Chip OSD SRAM The on-chip static RAM (4096 words by 24 bits) stores the cell map and the cell definitions. In memory, the cell map is organized as an array of words, each defining the attributes of one visible character on the screen starting from upper left of the visible character array. These attributes specify which character to display, whether it is stored as 1, 2 or 4 bits per pixel, the foreground and background colors, blinking, etc. Registers CELLMAP_XSZ and CELLMAP_YSZ are used to define the visible area of the OSD image. For example, Figure 24 shows a cell map for which CELLMAP_XSZ =25 and CELLMAP_YSZ =10. Address 1: Cell Attributes for upper-left hand cell Address 25: Attributes for upper-right hand cell CELLMAP_XSZ Address26: Cell attributes for st nd 1 cell, 2 row Brightness Contrast CELLMAP_YS Z Figure 24. OSD Cell Map Cell definitions are stored as bit map data. On-chip registers point to the start of 1-bit per pixel definitions, 2-bit per pixel definitions and 4-bit per pixel definitions respectively. 1, 2 and 4-bit per pixel cell definitions require 9, 18 and 36 words of the OSD RAM respectively. C2121-DAT-01F 35 http://www.genesis-microchip.com December 2002 gm2121 Preliminary Data Sheet Note that the cell map and the cell definitions share the same on-chip RAM. Thus, the size of the cell map can be traded off against the number of different cell definitions. In particular, the size of the OSD image and the number of cell definitions must fit in OSD SRAM. That is, the following inequality must be satisfied. (Note, the ROUND operation rounds 3.5 to 4). (CELLMAP_XSZ+1) * CELLMAP_YSZ + 18 * ROUND(Number of 1-bit per pixel fonts / 2) + 18 * (Number of 2-bit per pixel fonts) + 36 * (Number of 4-bit per pixel fonts) <= 4096 For example, an OSD menu 360 pixels wide by 360 pixels high is 30 cells in width and 20 cells in height. Many of these cells would be the same (e.g. empty). In this case, the menu could contain more than 32 1bit per pixel cells, 100 2-bit per pixel cells, and 16 4-bit per pixel cells. Of course, different numbers of each type can also be used. 4.13.2 Color Look-up Table (LUT) Each pixel of a displayed cell is resolved to an 8-bit color code. This selected color code is then transformed to a 24-bit value using a 256 x 24-bit look up table. This LUT is stored in an on-chip RAM that is separate from the OSD RAM. Color index value 0x00 is reserved for transparent OSD pixels. 4.14 On-Chip Microcontroller (OCM) The gm2121 on-chip microcontroller (OCM) serves as the system microcontroller. It programs the gm2121 and manages other devices in the system such as the keypad, the back light and non-volatile RAM (NVRAM) using general-purpose input/output (GPIO) pins. The OCM can operate in two configurations, Standalone configuration and Full-Custom configuration, as illustrated in Figure 25. C2121-DAT-01F 36 http://www.genesis-microchip.com December 2002 gm2121 Preliminary Data Sheet Factory Port Factory Port gm2121 Analog RGB Input Output to LCD Panel OCM ROM NVRAM Analog RGB Input On-chip ROM: * Auto mode detection * Auto-configuration * Standard high-quality OSD menus * Factory test / calibration functions Configuration settings in Figure 1.NVRAM: OCM * OSD Colors, Logo and other configuration * Panel Parameters * Additional input modes * Code patches gm2121 OCM NVRAM Output to LCD Panel PROM User Standalone settings in NVRAM: External ROM: Full-Custom and Configurations * Brightness/contrast settings, etc * On mode-by-mode basis * Contains firmware code and data for all firmware functions A - Standalone Configuration B - Full-Custom Configuration (No external ROM) (Program and Data stored in external ROM) Figure 25. OCM Full-Custom and Standalone Configurations 4.14.1 Standalone Configuration Standalone configuration offers the most simple and inexpensive system solution for generic LCD monitors. In this configuration the OCM executes firmware stored internally in gm2121. The baud rate for serial communication (in standalone configuration) is determined by two bootstrap resistors on ROMADDR11 (TCLK_SEL1, pin 145) and ROMADDR10 (TCLK_SEL0, pin 146). The on-chip firmware provides all the standard functions required in a high-quality generic LCD monitor. This includes mode-detection, auto-configuration and a high-quality standard OSD menu system. No external ROM is required (which reduces BOM cost) and no firmware development effort is required (which reduces time-to-market). In Standalone configuration many customization parameters are stored in NVRAM. These include the LCD panel timing parameters, the color scheme and logos used in the OSD menus, the functions provided by the OSD menus, and arbitrary firmware modifications. These customization parameters are described in the Standalone User's Guide (B0108-SUG-01). Based on the customization parameters, G-Wizard (a GUI-based development tool used to program Genesis devices) produces the hex image file for NVRAM. G-Probe is then used to download the NVRAM image file into the NVRAM device. This is illustrated in Figure 26 below. C2121-DAT-01F 37 http://www.genesis-microchip.com December 2002 gm2121 Preliminary Data Sheet Specify Configurable Parameters (See Standalone Users Guide) G-Wizard NVRAM Image File (.nvram_image. hex) G-Probe LCD Controller Board NVRAM gm2121 OCM Figure 26. Programming OCM in Standalone Configuration 4.14.2 Full-Custom Configuration In full-custom configuration the OCM executes a firmware program running from external ROM. A parallel port with separate address and data busses is available for this purpose. This port connects directly to standard, commercially available ROM or programmable Flash ROM devices. Normally 64KB or 128KB of ROM is required. Both instructions and data are fetched from external ROM on a cycle-by-cycle basis. The external ROM access speed on the parallel port is determined by the gm2121 internal OCM_CLK, which is derived from the TCLK. As a result, the external ROM device's access speed requirements are directly related to the TCLK frequency. For the detailed timing requirements see section 5.3 "External ROM Interface Timing Requirements"). To program gm2121 in full-custom configuration the content of the external ROM is generated using Genesis software development tools G-Wizard and OSD-Workbench. This is illustrated in Figure 27. GWizard is a GUI-based tool for capturing system information such as panel timing, support modes, system configuration, etc. OSD-Workbench is a GUI based tool for defining OSD menus and functionality. C2121-DAT-01F 38 http://www.genesis-microchip.com December 2002 gm2121 Preliminary Data Sheet G-Wizard gm2121 Driver OSD Workbench gm2121 Driver Firmware source files (*.c *.h) Keil Compiler External ROM Image File (.hex) ROM Programmer LCD Controller Board ROM gm2121 OCM Figure 27. Programming the OCM in Full-Custom Configuration Genesis recommends using Keil compiler (http://www.keil.com/) to compile the firmware source code into a hex file. This hex file is then downloaded into the external ROM using commercially available ROM programmers. For development purposes it may be useful to use a ROM emulator. For example, a PROMJET ROM emulator can be used (http://www.emutec.com/pjetmain.html). 4.14.3 In-System-Programming (ISP) of FLASH ROM Devices Gm2121 has hardware to program FLASH ROM devices. In particular, the GPIO11/ROM_WEn pin can be connected to the write enable of the FLASH ROM. Firmware is then used to perform the writes using the gm2121host registers. 4.14.4 UART Interface The gm2121 OCM has an integrated Universal Asynchronous Remote Terminal (UART) port that can be used as a factory debug port. In particular, the UART can be used to 1) read / write chip registers, 2) read / write to NVRAM, and 3) read / write to FLASH ROM. C2121-DAT-01F 39 http://www.genesis-microchip.com December 2002 gm2121 Preliminary Data Sheet The UART is connected to pins GPIO4/UART_DI and GPIO5/UART_DO. gm2121 has serial-toparallel conversion hardware which is accessed by firmware. Note: Install 10K pull-ups on UART according to Table 3. 4.14.5 DDC2Bi Interface The gm2121 also features hardware support for DDC2Bi communication over the DDC channel of the analog input ports. The specification for the DDC2Bi standard can be obtained from VESA (www.vesa.org). The DDC2Bi port can be used as a factory debug port or for field programming. In particular, the DDC2Bi port can be used to 1) read / write chip registers (see section 4.15 below), 2) read / write to NVRAM (see section 4.13.1 above), and 3) read / write to FLASH ROM (see section 4.13.3 above). For DDC2Bi communication over the analog VGA connector pins GPIO22/HCLK and GPIO16/HFSn should be connected to the DDC clock and data pins of the analog DSUB15 VGA connector. gm2121 contains serial to parallel conversion hardware, that is then accessed by firmware for interpretation and execution of the DDC2Bi command set. Bootstrap option ROM_ADDR12 (pin 142) is used to select the pin pair to be used for DDC2Bi communication. This signal (named DDC_PORT_SEL) selects between DDC2Bi interface or GPIO functions for pin pairs 8 (GPIO22/HCLK), 9 (GPIO16/HFSn) and 18 (GPIO15/DDC_SCL), 19 (GPIO14/DDC_SDA) for the internal standalone firmware. See the truth table below for further details. DDC2Bi Pin pair Pin number (Port Function) Pin pair HFSn / HCLK (GPIO22/HCLK) DDC_PORT_SEL = '0' ROM_ADDR12 (pin 142) pulled LOW DDC_PORT_SEL = '1' ROM_ADDR12 (pin 142) pulled HIGH GPIO22 HCLK GPIO16 HFSn DDC_SCL GPIO15 DDC_SDA GPIO14 Pin 8 Pin 9 (GPIO16/HFSn) Pin pair DDC_SDA / DDC_SCL Pin 18 (GPIO15/DDC_SCL) Pin 19 (GPIO14/DDC_SDA) 4.14.6 General Purpose Inputs and Outputs (GPIO's) The gm2121 has 23 general-purpose input/output (GPIO) and 8 general-purpose output (GPO) pins. These are used by the OCM to communicate with other devices in the system such as keypad buttons, NVRAM, LEDs, audio DAC, etc. Each GPIO has independent direction control, open drain enable, for reading and writing. The GPO's are shared with gm2121's TEST_BUS. To activate these GPO's set TEST BUS_CONTROL (register 0x1E6) to 0x00 and TEST_BUS_EN (register 0x1E7 bit 2) to `1', pins 88-97 can function as general-purpose outputs GPO0-7. Note that the GPIO pins have alternate functionality as described in Table 16 below. C2121-DAT-01F 40 http://www.genesis-microchip.com December 2002 gm2121 Preliminary Data Sheet Table 16. Pin Name Pin Number GPIO0/PWM0 GPIO1/PWM1 GPIO2/PWM2 GPIO3/TIMER1 GPIO4/UART_DI GPIO5/UARD_D0 GPIO6 GPIO7 GPIO8/IRQINn GPIO9 GPIO10 GPIO11/ROM_WEn GPIO12/NVRAM_SDA GPIO13/NVRAM_SCL GPIO14/DDC_SCL GPIO15/DDC_SDA GPIO16/HFSn GPIO17/HDATA0 GPIO18/HDATA1 GPIO19/HDATA2 GPIO20/HDATA3 GPIO21/IRQn GPIO22/HCLK GPO 0 GPO 1 GPO 2 GPO 3 GPO 4 GPO 5 GPO 6 GPO 7 23 24 25 26 27 28 29 32 22 33 34 35 36 37 18 19 9 13 12 11 10 16 8 88 89 92 93 94 95 96 97 gm2121 GPIOs and Alternative Functions Alternative function PWM0, PWM1 and PWM2 back light intensity controls, as described in section 4.17.2 below. Timer1 input of the OCM. OCM UART data in/out signals respectively. OCM external interrupt source (IRQINn). Write enable for external ROM if programmable FLASH device is used. Data and clock lines for master 2-wire serial interface to NVRAM when gm2121 is used in standalone configuration (section 4.14.1). General-purpose input/output signals. Open drain option via register setting. [Bi-directional Input, Schmitt trigger (400mV typical hysteresis), 5V-tolerant] Serial data line for 2-wire host interface. OCM interrupt output pin. Serial input clock for 2-wire host interface. 4.15 Bootstrap Configuration Pins During hardware reset, the external ROM address pins ROM_ADDR[15:0] are configured as inputs. On the negating edge of RESETn, the value on these pins is latched and stored. This value is readable by the on-chip microcontroller (or an external microcontroller via the host interface). Install a 10K pull-up resistor to indicate a `1', otherwise a `0' is indicated because ROM_ADDR[15:0] have a 60K internal pull-down resistor. Table 17. Bootstrap Signals Signal Name Pin Name Description HOST_ADDR(6:0) HOST_PROTOCOL HOST_PORT_EN ROM_ADDR(6:0) ROM_ADDR7 ROM_ADDR8 OCM_START ROM_ADDR9 DDC_PORT_SEL ROM_ADDR12 If using 2-wire host protocol, these are the serial bus device address. Program this bit to 0 for 2-wire host interface operation. Program this bit to 0 for 2-wire host interface operation. Note: For DDC2Bi operation on HCLK/HFSn (recommended) set to 0 (unconnected). Determines the operating condition of the OCM after HW reset: 0 = OCM remains in reset until enabled by register bit. 1 = OCM becomes active after OCM_CLK is stable. Selects the pin pair to be used for DDC2Bi communication for the standalone firmware (standalone configuration is selected when bootstrap of ROM_ADDR14 = 0) 0 = GPIO14/DDC_SCL and GPIO15/DDC_SDA 1 = GPIO22/HCLK and GPIO16/HFSn C2121-DAT-01F 41 http://www.genesis-microchip.com December 2002 gm2121 Preliminary Data Sheet Signal Name Pin Name Description TCLK_SEL1 TCLK_SEL0 ROM_ADDR11 ROM_ADDR10 OSC_SEL ROM_ADDR13 OCM_ROM_CNFG(1) ROM_ADDR14 PBIAS_POL ROM_ADDR15 Selects the for the standalone firmware UART baud rate depending on the frequency of the TCLK crystal (TCLK_SEL1, TCLK_SEL0) 00 = 115.2 KBaud (for TCLK = 14.3 MHz) 01 = 57.6 KBaud (for TCLK = 20 MHz) 10 = 57.6 KBaud (for TCLK = 24 MHz) 11 = 57.6 KBaud (for TCLK = 14.3 MHz) Selects reference clock source (refer to Figure 7): 0 = XTAL and TCLK pins are connected to a crystal oscillator. 1 = TCLK input is driven with a single-ended TTL/CMOS clock oscillator. Together with OCM_CONTROL register (0x22) bit 4, this bit selects internal/external ROM configuration. 0 = All 48K of ROM is internal. 1 = All 48K of ROM is in external ROM using ROM_ADDR15:0 address outputs if register 0x22 bit 4 is 0. If register 0x22 bit 4 is 1, 0-32K ROM is internal, and 32K~48K ROM is external using ROM_ADDR13:0 address outputs. Note: When booting from internal ROM (standalone configuration) the embedded firmware checks for a signature in external ROM (values 0x89, 0xAB, 0xCD, 0xEF at addresses 0xFFFC, 0xFFFD, 0xFFFE, 0xFFFF) and if present then OCM begins executing from address 0x0000 of external ROM (i.e. full-custom configuration). Sets the polarity of the PBIAS signal after the RESET sequence. This is to prevent flashing during power up, for panels with active LOW panel enable signal. 0 = PBIAS set to LOW after RESET 1 = PBIAS set to HIGH after RESET 4.16 Host Interface gm2121 contains many internal registers that control its operation. These are described in the gm2121 Register Listing (C2121-DSL-01). A serial host interface is provided to allow an external device to peek and poke registers in the gm2121. This is done using a 2-wire serial protocol. Note that 2-wire host interface requires bootstrap settings as described in Table 17. An arbitration mechanism ensures that register accesses from the OCM and the 2-wire host interface port are always serviced (time division multiplexing). 4.16.1 Host Interface Command Format Transactions on the 2-wire host protocol occurs in integer multiples of bytes (i.e. 8 bits or two nibbles respectively). These form an instruction byte, a device register address and/or one or more data bytes. This is described in Table 18. The first byte of each transfer indicates the type of operation to be performed by the gm2121. The table below lists the instruction codes and the type of transfer operation. The content of bytes that follow the instruction byte will vary depending on the instruction chosen. By utilizing these modes effectively, registers can be quickly configured. The two LSBs of the instruction code, denoted 'A9' and 'A8' in Table 18 below, are bits 9 and 8 of the internal register address respectively. Thus, they should be set to `00' to select a starting register address of less than 256, `01' to select an address in the range 256 to 511, and '10' to select an address in the range 512 to 767. These bits of the address increment in Address Increment transfers. The unused bits in the instruction byte, denoted by 'x', should be set to `1'. C2121-DAT-01F 42 http://www.genesis-microchip.com December 2002 gm2121 Preliminary Data Sheet Table 18. Bit Instruction Byte Map Operation Mode 765432 1 0 0 0 0 1 x x A9 A8 0 0 1 0 x x A9 A8 Description Allows the user to write a single or multiple bytes to a specified starting address location. A Macro operation will cause the internal address pointer to increment after each byte transmission. Termination of the transfer will cause the address pointer to increment to the next address location. Allows the user to read multiple bytes from a specified starting address location. A Macro operation will cause the internal address pointer to increment after each read byte. Termination of the transfer will cause the address pointer to increment to the next address location. Write Address Increment Write Address No Increment (for table loading) 1 0 0 1 x x A9 A8 1 0 1 0 x x A9 A8 Read Address Increment Read Address No Increment (for table reading) 0 0 1 1 x x A9 A8 0 1 0 0 x x A9 A8 1 0 0 0 x x A9 A8 1 0 1 1 x x A9 A8 1 1 0 0 x x A9 A8 0 0 0 0 x x A9 A8 0 1 0 1 x x A9 A8 0 1 1 0 x x A9 A8 0 1 1 1 x x A9 A8 1 1 0 1 x x A9 A8 1 1 1 0 x x A9 A8 1 1 1 1 x x A9 A8 Reserved Spare No operation will be performed 4.16.2 2-wire Serial Protocol The 2-wire protocol consists of a serial clock HCLK and bi-directional serial data line HFSn. The bus master drives HCLK and either the master or slave can drive the HFSn line (open drain) depending on whether a read or write operation is being performed. The gm2121 operates as a slave on the interface. The 2-wire protocol requires each device be addressable by a 7-bit identification number. The gm2121 is initialized on power-up to 2-wire mode by asserting bootstrap pins HOST_PROTOCOL=0 and the device identification number on HOST_ADDR(6:0) on the rising edge of RESETn (see Table 17). This provides flexibility in system configuration with multiple devices that can have the same address. A 2-wire data transfer consists of a stream of serially transmitted bytes formatted as shown in the figure below. A transfer is initiated (START) by a high-to-low transition on HFSn while HCLK is held high. A transfer is terminated by a STOP (a low-to-high transition on HFSn while HCLK is held high) or by a START (to begin another transfer). The HFSn signal must be stable when HCLK is high, it may only change when HCLK is low (to avoid being misinterpreted as START or STOP). HCLK 1 2 3 4 5 6 7 8 9 1 2 8 9 HFSn A6 A5 A4 A3 A2 A1 A0 R/W ACK D7 D6 D0 ACK START ADDRESS BYTE DATA BYTE STOP Receiver acknowledges by holding SDA low Figure 28. 2-Wire Protocol Data Transfer Each transaction on the HFSn is in integer multiples of 8 bits (i.e. bytes). The number of bytes that can be transmitted per transfer is unrestricted. Each byte is transmitted with the most significant bit (MSB) first. After the eight data bits, the master releases the HFSn line and the receiver asserts the HFSn line low to C2121-DAT-01F 43 http://www.genesis-microchip.com December 2002 gm2121 Preliminary Data Sheet acknowledge receipt of the data. The master device generates the HCLK pulse during the acknowledge cycle. The addressed receiver is obliged to acknowledge each byte that has been received. The Write Address Increment and the Write Address No Increment operations allow one or multiple registers to be programmed with only sending one start address. In Write Address Increment, the address pointer is automatically incremented after each byte has been sent and written. The transmission data stream for this mode is illustrated in Figure 29 below. The highlighted sections of the waveform represent moments when the transmitting device must release the HFSn line and wait for an acknowledgement from the gm2121 (the slave receiver). HCLK HFSn 1 2 3 4 5 DEVICE ADDRESS 6 7 8 9 1 R/W ACK 2 3 4 5 6 OPERATION CODE 7 8 A9 A8 START 9 1 2 3 4 5 6 7 8 REGISTER ADDRESS ACK 9 1 2 9 DATA ACK DATA STOP Two MSBs of register address Figure 29. ACK 2-Wire Write Operations (0x1x and 0x2x) The Read Address Increment (0x90) and Read Address No Increment (0xA0) operations are illustrated in Figure 30. The highlighted sections of the waveform represent moments when the transmitting device must release the HFSn line and waits for an acknowledgement from the master receiver. Note that on the last byte read, no acknowledgement is issued to terminate the transfer. HCLK HFSn DEVICEADDRESS R/W ACK OPERATIONCODE ACK REGISTERADDRESS START ACK DEVICEADDRESS R/W ACK DATA DATA ACK DATA START Figure 30. STOP 2-Wire Read Operation (0x9x and 0xAx) Please note that in all the above operations the operation code includes two address bits, as described in Table 18. 4.17 Miscellaneous Functions 4.17.1 Low Power State The gm2121 provides a low power state in which the clocks to selected parts of the chip may be disabled (see Table 20). C2121-DAT-01F 44 http://www.genesis-microchip.com December 2002 gm2121 Preliminary Data Sheet 4.17.2 Pulse Width Modulation (PWM) Back Light Control Many of today's LCD back light inverters require both a PWM input and variable DC voltage to minimize flickering (due to the interference between panel timing and inverter's AC timing), and adjust brightness. Most LCD monitor manufactures currently use a microcontroller to provide these control signals. To minimize the burden on the external microcontroller, the gm2121 generates these signals directly. There are three pins available for controlling the LCD back light, PWM0 (GPIO0), PWM1 (GPIO1) and PWM2 (GPIO2). The duty cycle of these signals is programmable. They may be connected to an external RC integrator to generate a variable DC voltage for a LCD back light inverter. Panel HSYNC is used as the clock for a counter generating this output signal. C2121-DAT-01F 45 http://www.genesis-microchip.com December 2002 gm2121 Preliminary Data Sheet 5 Electrical Specifications The following targeted specifications have been derived by simulation. 5.1 Preliminary DC Characteristics Table 19. Absolute Maximum Ratings PARAMETER SYMBOL MIN (1,2) MAX UNITS VVDD_3.3 2.5V Supply Voltages (1.2) VVDD_2.5 -0.3 3.6 V -0.3 2.75 V VIN5Vtol -0.3 5.5 V VIN -0.3 3.6 V VESD 2.0 kV Latch-up ILA 100 mA Ambient Operating Temperature TA 0 70 C TSTG -40 125 C Operating Junction Temp. TJ 0 Thermal Resistance (Junction to Air) Natural Convection (3) Thermal Resistance (Junction to Case) Convection (4) 3.3V Supply Voltages Input Voltage (5V tolerant inputs) (1,2) Input Voltage (non 5V tolerant inputs) (1,2) Electrostatic Discharge Storage Temperature TYP 125 C JA 29.4 C/W C/W JC 13.2 Soldering Temperature (30 sec.) TSOL 220 C Vapor Phase Soldering (30 sec.) TVAP 220 C NOTES: (1) All voltages are measured with respect to GND. (2) Absolute maximum voltage ranges are for transient voltage excursions. (3) Package thermal resistance is based on a PCB with one signal plane and two power planes. Package JA is improved on a PCB with four or more layers. (4) Based on the figures for the Operating Junction Temperature, JC and Power Consumption in Table 20, the typical case temperature is calculated as TC = TJ - P x JC. This equals 102 degrees Celsius. C2121-DAT-01F 46 http://www.genesis-microchip.com December 2002 gm2121 Preliminary Data Sheet Table 20. PARAMETER DC Characteristics SYMBOL MIN TYP MAX(1) UNITS 1.57 1.726 W POWER P Power Consumption @ 135 MHz Power Consumption @ Low Power Mode (2) PLP 0.076 W 3.3V Supply Voltages VVDD_3.3 3.0 3.3 3.6 V 2.5V Supply Voltages VVDD_2.5 2.25 2.5 2.75 V Supply Current @ Low Power Mode (2) ILP 28 Total Supply Current @ CLK =135MHz I 597 656 mA * 2.5V digital supply (3) I2.5V_VDD 412 468 mA * 2.5V analog supply (4) I2.5V_AVDD 80 80 mA I3.3V_VDD 8 11 mA I3.3V_AVDD 97 97 mA * 3.3V digital supply (5) * 3.3V analog supply (6) mA INPUTS High Voltage VIH 2.0 VDD V Low Voltage VIL GND 0.8 V Clock High Voltage VIHC 2.4 VDD V Clock Low Voltage VILC GND 0.4 V High Current (VIN = 5.0 V) IIH -25 25 A Low Current (VIN = 0.8 V) IIL -25 25 A Capacitance (VIN = 2.4 V) CIN 8 pF OUTPUTS High Voltage (IOH = 7 mA) VOH 2.4 VDD V Low Voltage (IOL = -7 mA) VOL GND 0.4 V Tri-State Leakage Current IOZ -25 25 A NOTES: (1) Maximum current figures are provided for the purposes of selecting an appropriate power supply circuit. (2) Low power figures result from setting the ADC and clock power down bits so that only the micro-controller is running. (3) Includes 2.5V digital core (CVDD) (4) Includes pins VDD1_ADC_2.5, VDD2_ADC_2.5 and LVDS transmitter power pins (5) Includes pins VDD_DPLL, VDD_SDDS, VDD_DDDS and RVDD. (6) Includes pins AVDD_ADC, AVDD_RED, AVDD_GREEN, AVDD_BLUE, AVDD_RPLL, AVDD_SDDS, and AVDD_DDDS. C2121-DAT-01F 47 http://www.genesis-microchip.com December 2002 gm2121 Preliminary Data Sheet 5.2 Preliminary AC Characteristics The following targeted specifications have been derived by simulation. All timing is measured to a 1.5V logic-switching threshold. The minimum and maximum operating conditions used were: TDIE = 0 to 125 C, Vdd = 2.35 to 2.65V, Process = best to worst, CL = 16pF for all outputs. Maximum Speed of Operation Table 21. Clock Domain Main Input Clock (TCLK) ADC Clock (ACLK) HCLK Host Interface Clock (6-wire protocol) Input Format Measurement Clock (IFM_CLK) Reference Clock (RCLK) On-Chip Microcontroller Clock (OCM_CLK) Display Clock (DCLK) Table 22. Max Speed of Operation 24 MHz ( 20.0MHz recommended) 162.5MHz 5 MHz 50MHz ( 20.0MHz recommended) 200MHz (200MHz recommended) 100 MHz 135 MHz Display Timing and DCLK Adjustments DP_TIMING -> Propagation delay from DCLK to DA*/DB* Propagation delay from DCLK to DHS Propagation delay from DCLK to DVS Propagation delay from DCLK to DEN Tap 0 (default) Min Max (ns) (ns) 1.0 4.5 1.0 4.5 0.5 4.5 1.0 4.5 Tap 1 Min Max (ns) (ns) 0.5 3.5 0.5 3.5 0.0 3.5 0.5 3.5 Tap 2 Min Max (ns) (ns) -0.5 2.5 -0.5 2.5 -1.0 2.5 -0.5 2.5 Tap 3 Min Max (ns) (ns) -1.5 1.5 -1.5 1.5 -2.0 1.5 -1.5 1.5 Note: DCLK Clock Adjustments are the amount of additional delay that can be inserted in the DCLK path, in order to reduce the propagation delay between DCLK and its related signals. Table 23. Parameter SCL HIGH time SCL LOW time SDA to SCL Setup SDA from SCL Hold Propagation delay from SCL to SDA 2-Wire Host Interface Port Timing Symbol MIN TSHI TSLO TSDIS TSDIH TSDO3 1.25 1.25 30 20 10 TYP MAX Units 150 us us ns ns ns Note: The above table assumes OCM_CLK = R_CLK / 2 = 100 MHz (default) (ie 10ns / clock) C2121-DAT-01F 48 http://www.genesis-microchip.com December 2002 gm2121 Preliminary Data Sheet 5.3 External ROM Interface Timing Requirements TRC TACC ROM_DATA[7:0] 74 ROM_ADDR[15:0] A0 00F4 00F5 00F6 TOE ROM_OEn TMICRO_CLK MICRO_CLK (internal) Latched Data 74 (internal) Address Asserted Figure 31. A0 Data Latched External ROM Interface Timing Diagram TMICRO_CLK = 1 / fTCLK = 1 / 24MHz = 41.6 ns (if 24MHz TCLK crystal is used) MICRO_CLK is the internal MCU clock derived from TCLK and has the same frequency as TCLK. At the maximum supported TCLK frequency (24MHz) the MICRO_CLK period is about 41ns. The ROM data is latched on the third MICRO_CLK rising edge after the ADDRESS bus is asserted. Due to this requirement, the external ROM should have a maximum access time of equal to or less than three TCLK periods (for example, less than 123 ns when 24MHz TCLK crystal is used). There are three criteria to be met for the external ROM interface timing (again, using 24MHz TCLK as a worst-case example): 1. TRC = 4 x TMIRCO_CLK = 166.4 ns 2. TACCmax 3 x TMIRCO_CLK = 124.8 ns 3. T OE 2 x TMIRCO_CLK = 83.2 ns C2121-DAT-01F 49 http://www.genesis-microchip.com December 2002 gm2121 Preliminary Data Sheet 6 Ordering Information Order Code Application Package Temperature Range gm2121 SXGA 160-pin PQFP 0-70C C2121-DAT-01F 50 http://www.genesis-microchip.com December 2002 gm2121 Preliminary Data Sheet 7 Mechanical Specifications A B 80 121 Symbol Millimeter C 160 pin 1 40 Depressed dot on package indicates pin 1 (lower left corner) A B C D E G H I J L M Inch Min Nom Max Min Nom Max 30.95 27.90 31.20 28.00 0.65 31.45 28.10 1.218 1.098 1.228 1.102 0.026 1.238 1.106 4.25 3.17 0.73 0.05 0 0.22 0.11 1.60 3.32 0.88 0.25 0.30 0.15 3.47 1.03 0.50 7 0.38 0.23 0.167 0.125 0.025 0.002 0 0.008 0.004 0.063 0.131 0.031 0.010 0.012 0.006 0.137 0.037 0.020 7 0.016 0.008 D E G I J L Figure 32. C2121-DAT-01F M H gm2121 160-pin PQFP Mechanical Drawing 51 http://www.genesis-microchip.com December 2002