High Stability Thin Film Flat Chip Resistors
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TNPW e3
Vishay
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
TNPW e3 precision thin film flat chip resistors are the perfect
choice for most fields of modern electronics where highest
reliability and stability is of major concern. Typical
applications include test an d measuring equipment, medical
equipment, industrial, and automotive.
FEATURES
Low temperature coefficient and tight
tolerances (± 0.1 %; ± 10 ppm/K)
Superior moisture resistivity 0.25 % (85 °C;
56 days; 85 % RH)
Excellent overall stability at different
environmental conditions 0.05 % (1000 h
rated power at 70 °C)
AEC-Q200 qualified (sizes 0402 to 1206)
Waste gas resistant
Material categorization: For definition s of compli ance
please see www.vishay.com/doc?99912
APPLICATIONS
Test and me asu r i n g eq uipment
Medical equipment
Industrial equipment
Automotive
Notes
TNPW 0402 without marking.
(1) Size not specified in EN 140401-801.
(2) Rated voltage . The power dissipation on the resistor generates a temperature rise against the local ambient, depending on the heat
flow support of the printed-circuit board (thermal resistance). Using advanced temperature level may require spe cial consid erations towards
the choice of circuit board and solder material. The rated dissipation applies only if the permitted film temperature is not exceeded.
(3) Measuring conditions in accordance with EN 140401-801.
STANDARD ELECTRICAL SPECIFICATIONS
DESCRIPTION TNPW0402 e3 TNPW0603 e3 TNPW0805 e3 TNPW1206 e3 TNPW1210 e3
(1)
TNPW20 10 e3 TNPW25 12 e3
(1)
Metric size RR 1005M RR 1608M RR 2012M RR 3216M RR 3225M RR 5025M RR 6332M
Resistance range 10
to 100 k
10
to 332 k
10
to 1 M
10
to 2 M
10
to 3.01 M
10
to 4.99 M
10
to 8.87 M
Resistance tolerance ± 1 %; ± 0.5 %; ± 0.1 %
Temperature
coefficent ± 50 ppm/K; ± 25 ppm/K; ± 15 ppm/K; ± 10 ppm/K ± 50 ppm/K; ± 25 ppm/K
Rated dissipation,
P
70 (2)
0.063 W 0.1 W 0.125 W 0.25 W 0.33 W 0.4 W 0.5 W
Operating voltage,
U
max.
AC/DC 50 V 75 V 150 V 200 V 200 V 300 V 300 V
Permissible film
temperat ure,
F
max. 155 °C
Operating
temperature range
- 55 °C to 125 °C (15 5 °C)
Thermal resistance
(3)
870 K/W 550 K/W 440 K/W 220 K/W 170 K/W 140 K/W 110 K/W
Max. resistance
change at
P
70
;
R
/
R
:10
to 100 k
10
to 332 k
10
to 1 M
10
to 2 M
10
to 3.01 M
10
to 4.99 M
10
to 8.87 M
1000 h

0.05 %

0.05 %

0.05 %

0.05 %

0.05 %

0.05 %

0.05 %
8000 h

0.10 %

0.10 %

0.10 %

0.10 %

0.10 %

0.10 %

0.10 %
225 000 h

0.30 %

0.30 %

0.30 %

0.30 %

0.30 %

0.30 %

0.30 %
Insulation voltage:
U
ins
1 min 75 V 100 V 200 V 300 V 300 V 300 V 300 V
Continuous 75 V 75 V 75 V 75 V 75 V 75 V 75 V
Failure rate:
FITobserved

0.1 x 10
-9
/h

0.1 x 10
-9
/h

0.1 x 10
-9
/h

0.1 x 10
-9
/h

0.1 x 10
-9
/h

0.1 x 10
-9
/h

0.1 x 10
-9
/h
P x R
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DIMENSIONS DIMENSIONS AND MASS
TYPE L
(mm) W
(mm) H
(mm) T1/T2
(mm) MASS
(mg)
TNPW0402 e3 1.0 ± 0.05 0.5 ± 0.05 0.35 ± 0.05 0.2 ± 0.10 0.65
TNPW0603 e3 1.6 ± 0.10 0.85 ± 0.10 0.45 ± 0.10 0.3 ± 0.20 2
TNPW0805 e3 2.0 ± 0.15 1.25 ± 0.15 0.45 ± 0.10 0.4 ± 0.20 5.5
TNPW1206 e3 3.2 ± 0.15 1.6 ± 0.15 0.55 ± 0.10 0.5 ± 0.25 10
TNPW1210 e3 3.2 ± 0.15 2.45 ± 0.15 0.60 ± 0.15 0.5 ± 0.25 16
TNPW2010 e3 5.0 ± 0.15 2.5 ± 0.15 0.60 ± 0.15 0.6 ± 0.25 28
TNPW2512 e3 6.3 ± 0.20 3.1 ± 0.15 0.60 ± 0.15 0.6 ± 0.25 39
SOLDER PAD DIMENSIONS
TYPE REFLO W SOLD ERING WAVE SOLDERING
a
(mm) b
(mm) l
(mm) a
(mm) b
(mm) l
(mm)
TNPW0402 e3 0.4 0.6 0.5 - - -
TNPW0603 e3 0.5 0.9 1.0 0.9 0.9 1.0
TNPW0805 e3 0.7 1.3 1.2 0.9 1.3 1.3
TNPW1206 e3 0.9 1.7 2.0 1.1 1.7 2.3
TNPW1210 e3 0.9 2.5 2.0 1.1 2.5 2.3
TNPW2010 e3 1.0 2.5 3.9 1.2 2.5 3.9
TNPW2512 e3 1.0 3.2 5.2 1.2 3.2 5.2
TEMPERATURE COEFFICIENT AND RESISTANCE RANGE
TYPE TCR TOLERANCE RESISTANCE E-SERIES
TNPW0402 e3
± 50 ppm/K ± 1 % 10R to 100K 24; 96
± 0.5 % 10R to 100K 24; 192
± 0.1 % 47R to 100K
± 25 ppm/K ± 1 % 10R to 100K 24; 96
± 0.5 % 10R to 100K
24; 192
± 0.1 % 47R to 100K± 15 ppm/K ± 0.1 %
± 10 ppm/K ± 0.1 %
TNPW0603 e3
± 50 ppm/K ± 1 % 10R to 332K 24; 96
± 0.5 % 10R to 332K 24; 192
± 0.1 %
± 25 ppm/K ± 1 % 10R to 332K 24; 96
± 0.5 % 10R to 332K 24; 192
± 0.1 %
± 15 ppm/K ± 0.1 % 47R to 332K
± 10 ppm/K ± 0.1 %
TNPW0805 e3
± 50 ppm/K ± 1 % 10R to 1M0 24; 96
± 0.5 % 10R to 1M0 24; 192
± 0.1 %
± 25 ppm/K ± 1 % 10R to 1M0 24; 96
± 0.5 % 10R to 1M0 24; 192
± 0.1 %
± 15 ppm/K ± 0.1 % 47R to 1M0
± 10 ppm/K ± 0.1 %
TNPW1206 e3
± 50 ppm/K ± 1 % 10R to 2M0 24; 96
± 0.5 % 10R to 2M0 24; 192
± 0.1 %
± 25 ppm/K ± 1 % 10R to 2M0 24; 96
± 0.5 % 10R to 2M0 24; 192
± 0.1 %
± 15 ppm/K ± 0.1 % 47R to 2M0
± 10 ppm/K ± 0.1 %
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Note
The product can be ordered using either the PART NUMBER or the PRODUCT DESCRIPTION.
TNPW1210 e3
± 50 ppm/K ± 1 % 10R to 3M01 24; 96
± 0.5 % 10R to 3M01 24; 192
± 0.1 % 47R to 2M13
± 25 ppm/K ± 1 % 10R to 3M01 24; 96
± 0.5 % 10R to 3M01
24; 192
± 0.1 % 47R to 2M13± 15 ppm/K ± 0.1 %
± 10 ppm/K ± 0.1 %
TNPW2010 e3
± 50 ppm/K ± 1 % 10R to 4M99 24; 96
± 0.5 % 10R to 4M99 24; 192
± 0.1 % 47R to 1M0
± 25 ppm/K ± 1 % 10R to 4M99 24; 96
± 0.5 % 10R to 4M99 24; 192
± 0.1 % 47R to 1M0
TNPW2512 e3
± 50 ppm/K ± 1 % 10R to 8M87 24; 96
± 0.5 % 10R to 8M87 24; 192
± 0.1 % 47R to 1M0
± 25 ppm/K ± 1 % 10R to 8M87 24; 96
± 0.5 % 10R to 8M87 24; 192
± 0.1 % 47R to 1M0
TEMPERAT URE COEFFICIENT AND RESISTANCE RANGE
TYPE TCR TOLERANCE RESISTANCE E-SERIES
PART NUMBER AND PRODUCT DESCRIPTION
Part Number: TNPW12061K32DEEA
TYPE/SIZE RESISTANCE TOLERANCE TCR PACKAGING SPECIAL
TNPW0402
TNPW0603
TNPW0805
TNPW1206
TNPW1210
TNPW2010
TNPW2512
R = Decimal
K = Thousand
M = Million
(4 digits)
B = ± 0.1 %
D = ± 0.5 %
F = ± 1.0 %
H = ± 50 ppm/K
E = ± 25 ppm/K
X = ± 15 ppm/K
Y = ± 10 ppm/K
EA
EC
ED
EG
EN
EY
Up to 2 digits
Blank = Standard
Product Description: TNPW1206 1K32 0.5 % T-9 ET1 e3
TNPW1206 1K32 0.5 % T-9 ET1 e3
TYPE/SIZE RESISTANCE TOLERANCE TCR PACKAGING LEAD (Pb)-FREE
TNPW0402
TNPW0603
TNPW0805
TNPW1206
TNPW1210
TNPW2010
TNPW2512
Examples:
54R1 = 54.1
1K32 = 1320
± 0.1 %
± 0.5 %
± 1.0 %
T-2 = ± 50 ppm/K
T-9 = ± 25 ppm/K
T-10 = ± 15 ppm/K
T-13 = ± 10 ppm/K
ET1
ET6
ET7
E67
E52
E75
e3 = Pure tin
termination finish
TW120PN 61K32DEEA
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Note
(1) 1000 pieces packaging is available only for precision resistors with tolerance ± 0.1 % and temperature coefficient
± 25 ppm/K.
DESCRIPTION
Production is strictly controlled and follows an extensive
set of instructions established for reproducibility. A
homogeneous film of metal alloy is deposited on a high grade
AI2O3 ceramic substrate and conditioned to achieve the
desired temperature coefficient. Specially designed inner
contacts are deposited on both sides. A special laser is used
to achieve the target value by smoothly fine trimming the
resistive layer without damaging the ceramics. A further
conditioning is applied in order to stabilize the trimming
result. The resistor elements are covered by a protective
coating designed for electrical, mechanical and climatic
protection. The terminations receive a final pure tin on nickel
plating. The result of the determined production is verified by
an extensive testing procedure on 100 % of the individual
chip resistors. This includes pulse load screening for the
elimination of products with a potential risk of early life
failures according to EN 140401-801, 2.1.2.2. Only accepted
products are laid directly into the tape in accordance with
EN 60286-3.
ASSEMBLY
The resistors are suitable for processing on automatic SMD
assembly systems. They are suitable for automatic soldering
using wave, reflow or vapour phase as shown in
IEC 61760-1. The encapsulation is resistant to all cleaning
solvents commonly used in the electronics industry,
including alcohols, esters and aqueous solutions. The
suitability of conformal coatings, if appl ied , shall be qualified
by appropriate means to ensure the long-term stability of the
whole system. The resistors are RoHS compliant, the pure
tin plating provides compatibility with lead (Pb)-free and
lead-containing soldering processes. The immunity of the
plating against tin whisker growth has been proven under
extensive testing.
All products comply with the GADSL (2) and the
CEFIC-EECA-EICTA (3) list of legal restrictions on
hazardous substances. This includes full compliance with
the following directives:
2000/53/EC End of Vehicle life Directive (ELV) and
Annex II (ELV II)
2011/65/EU Restriction of the use of Hazardous
Substances Directive (RoHS)
2002/96/EC Waste Electrical and Electronic Equipment
Directive (WEEE)
The resistors are Halogen-free according to JEDEC JS709A
definition.
Solderability is specified for 2 years after production or
re-qualification. The permitted storage time is 20 years.
RELATED PRODUCTS
The TNPW with SnPb termination plating is designed for
those applications, where lead bearing terminations are
mandatory. For ordering TNPW with SnPb terminations
please refer to latest edition of data sheet TNPW, document
number 31006.
TNPS .... ESCC high-reliability thin film chip resistors are the
premium choice for design and manufacture of equipment,
where matured technology and proven reliability are of
utmost importance. They are regularly used in
communication and research satellites and fit equally well
into aircra ft and military electronic systems. Approval of the
TNPS .... ESCC products is granted by the European Space
Components Coordination and registered in the ESCC
Qualified Parts List, REP005, document number 28789.
Notes
(2) Global Automotive Declarable Substance List, see www.gadsl.org.
(3) CEFIC (European Chemical Industry Council), EECA (European Electronic Component Manufacturers Association), EICTA (European trade
organisation representing the information and communications technology and consumer electronics), see www.eicta.org issue
environment policy chemicals chemicals for electronics.
PACKAGING
TYPE CODE QUANTITY CARRIER TAPE WIDTH PITCH REEL DIAMETER
TNPW0402 e3 ET7 = ED 10 000
Paper tape
acc. IEC 60286-3
Type I 8 mm
2 mm 180 mm / 7"
TNPW0603 e3
TNPW0805 e3
TNPW1206 e3
TNPW1210 e3
E52 = EN 1000 (1) 4 mm 180 mm / 7"
ET1 = EA 5000
ET6 = EC 20 000 4 mm 330 mm / 13"
TNPW2010 e3 E75 = EY 1000 Blister tape
acc. IEC 60286-3
Type II 12 mm 4 mm 180 mm / 7"
TNPW2512 e3 E75 = EY 1000
E67 = EG 2000
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FUNCTIONAL PERFORMANCE
Note
(1) Typical figures. HF-characteristic also depends on termination and circuit design.
120
110
100
90
80
70
6010 100 1K 10K 100K
Non-Linearity
Non-Linearity A
3
in dB
Resistance Value in Ω
TNPW0603
e3
TNPW1206
e3
TNPW0402
e3
TNPW0805
e3
3
2
1
100 1K 10K 100K 1M
Current Noise
Current Noise in
µV/V
Resistance Value in Ω
TNPW0402
e3
TNPW0805
e3
0.5
0.3
0.1
0.01
0.03
0.05
TNPW0603
e3
TNPW1206
e3
60
40
20
0
- 40
- 60
-801 5 10 50 100 Frequency f in MHz
HF Performance (1)
Phase Angle in
ϑ°
TNPW0603
e3
10 Ω
100 Ω
1 k Ω
4.75 k Ω
10 k Ω
500 1000
60
40
20
0
- 20
- 40
- 60
-80
TNPW0603 e3
HF Performance
(1)
1510 50 100 500 1000
Frequency f in MHz
[Z]-RO in %
RO
10 Ω
100 Ω
1 k Ω
4.75 k Ω
10 k Ω
60
40
20
0
- 20
- 40
- 60
-80
Phase Angle in ϑ°
1 5 10 50 100 Frequency f in MHz
HF Performance
(1)
TNPW0805
e3
10 Ω
100 Ω
1 k Ω
10 k Ω
500 1000
60
40
20
0
- 20
- 40
- 60
-80
[Z]-RO in %
RO
HF Performance (1)
1510 50 100 500 1000
Frequency f in MHz
TNPW0805 e3
10 Ω
100 Ω
1 k Ω
10 k Ω
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90
80
70
60
50
40
30
20
10
0
Temperature Rise
0 0.1 0.2 0.3 0.4 0.5
Power in W
Temperature Rise in K
0.6 0.7
0402 0603 0805 1206 1210 2010 2512
Derating
120
100
80
60
40
20
0
- 55 - 25 0 25 50 75 100 125 150 175
Ambient Temperature in °C
Rated Power in %
70
EN
3K
1K
100
10 10R 100R 1K 10K 100K
Test Voltage in V
TNPW0805 e3
TNPW0603 e3
Single-Pulse High Voltage Overload
Test 1.2/50 µs EN140000 4.27
Resistance Value
in Ω
3K
1K
100
10
10R 100R 1K 10K 100K
Single-Pulse High Voltage Overload
Test 10/700 µs EN140000 4.27
Resistance Value
in Ω
Test Voltage in V
TNPW0805 e3
TNPW0603 e3
100 W
10 W
1W
0.1 W
10 µs Pulse Duration
t
i
Permissible pulse power
P
i, max.
100 µs 1 ms 10 ms 100 ms 1 s 10 s
Maximum pulse load
P
i, max.
for single pulses
TNPW1206 e3
TNPW0805 e3
TNPW0603 e3
Conditions:
P
0, n 1000 and
U
i
U
i, max.
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TEST AND REQUIREMENTS
All tests are carried out in accordance with the following
specifications:
IEC 60115-1, generic specification (includes tests)
EN 140400, sectional specification (includes schedule for
qualification approval)
EN 140401-801, detail specification (includes schedule for
conformance inspection)
The testing also covers most of the requirements specified
by EIA/IS-703 and JIS-C-5202. The tests are carried out
under standard atmospheric conditions in accordance with
IEC 60068-1, 5.3. Climatic category LCT/UCT/56 (rated
temperature range: Lower category temperature, upper
category temperature; damp heat, long term, 56 days) is
valid. Unless otherwise specified the following values apply:
Temperature: 15 °C to 35 °C
Relative humidity: 45 % to 75 %
Air pressure: 86 kPa to 106 kPa (860 mbar to 1060 mbar).
The components are mounted for testing on boards in
accordance with EN 60115-1, 4.31 unless otherwise
specified. The parameters stated in the Test Procedures and
Requirements table are based on the required tests and
permitted limits of EN 140401-801.
10 000 V
1000 V
100 V
10 V
10 µs Pulse Duration
t
i
Permissible pulse voltage
U
i, max.
100 µs 1 ms 10 ms 100 ms 1 s 10 s
TNPW1206 e3
TNPW0805 e3
TNPW0603 e3
Conditions:
P
i
P
i, max.
Maximum pulse voltage
U
i, max.
TEST PROCEDURES AND REQUIREMENTS
EN 60115-1
CLAUSE IEC 60068-2
TEST METHOD TEST PROCEDURE REQUIREMENTS
PERMISSIBLE CHANGE
Stability for product types:
TNPW0402 e3
TNPW0603 e3
TNPW0805 e3
TNPW1206 e3
TNPW1210 e3
TNPW2010 e3
TNPW2512 e3
4.5 - Resistance ± 1 %; ± 0.5 %; ± 0.1 %
4.8.4.2 - Temperature
coefficient At (20/- 55/20) C and
(20/125/20) °C ± 50 ppm/K; ± 25 ppm/K; ± 15 ppm/K; ± 10 ppm/K
4.25.1 - Endurance at
70 C
U= or
U = Umax.;
whichever is the less severe;
1.5 h on; 0.5 h off;
70 °C; 1000 h ± (0.05 % R+0.01)
70 C; 8000 h ± (0.1 % R+0.02)
4.25.3 - Endurance at
upper category
temperature
125 °C; 1000 h
155 °C; 1000 h ± (0.05 % R+ 0.01 )
± (0.1 % R+ 0.02 )
P70 x R
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4.24 78 (Cab) Damp heat,
steady state (40±2) °C; 56 days;
(93 ± 3) % RH ± (0.1 % R+ 0.01 )
4.23 Climatic
sequence:
±(0.1 % R+0.02 )
4.23.2 2 (Bb) Dry heat UCT; 16 h
4.23.3 30 (Db) Damp 55 °C; 24 h; > 90 % RH;
1 cycle
4.23.4 1 (Ab) Cold LCT; 2 h
4.23.5 13 (M) Low air 8.5 kPa; 2 h; 25 ± 10 °C
4.23.6 30 (Db) Damp heat,
cyclic 55 °C; 5 days;
> 95 to 100 % RH; 5 cycles
4.23.7 - DC load U= Umax.; 1 min
LCT = - 55 °C
UCT = 125 °C
- 1 (Ab) Cold - 55 °C; 2 h ±(0.05 % R+0.01 )
4.19 14 (Na) Rapid change
of temperature
30 min at LCT and
30 min at UCT;
LCT = - 55 °C; UCT = 125 °C;
1000 cycles
±(0.1 % R+0.01 )
4.13 - Short time
overload
U= 2.5 x or
U=2 x Umax.; whichev er is the
less severe; 5 s ±(0.05 % R+0.01 )
4.27 - Single pulse
high voltage
overload
Severity no. 4:
U= 10 x or
U=2 x Umax.;
whichever is the less severe;
10 pulses 10 µs/700 µs
±(0.5 % R+0.05 )
no visible damage
4.37 - Periodic
electric
overload
U= or
U=2 x Umax.;
whichever is the less severe;
0.1 s on; 2.5 s off;
1000 cycles
±(0.5 % R+0.05 )
no visible damage
4.22 6 (Fc) Vibration
Endurance by sweeping;
10 Hz to 2000 Hz;
no resonance;
amplitude 1.5 mm or
200 m/s2; 7.5 h
±(0.05 % R+0.01 )
no visible damage
TEST PROCEDUR ES AND REQUIREMENTS
EN 60115-1
CLAUSE IEC 60068-2
TEST METHOD TEST PROCEDURE REQUIREMENTS
PERMISSIBLE CHANGE
Stability for product types:
TNPW0402 e3
TNPW0603 e3
TNPW0805 e3
TNPW1206 e3
TNPW1210 e3
TNPW2010 e3
TNPW2512 e3
P70 x R
P70 x R
P70 x R
15 x P70 x R
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4.17.2 58 (Td) Solderability
Solder bath method;
SnPb40; non-activated flux
(215 ± 3) °C; (3 ± 0.3) s Good tinning ( 95 % covered);
no visible damage
Solder bath method;
SnAg3Cu0.5 or SnAg3.5;
non-activated flux
(235 ± 3) °C; (2 ± 0.2) s
4.18.2 58 (Td) Resistance to
soldering heat Solder bath method;
(260 ± 5) °C; (10 ± 1) s ±(0.02 % R+0.01)
4.29 45 (XA) Component
solvent
resistance
Isopropyl alcohol + 50 °C;
method 2 No visible damage
4.32 21 (Ue3)Shear
(adhesion)
RR 1005M and RR 1608M;
9 N No visible damage
RR 2012M and RR 3216M:
45 N
4.33 21 (Ue1)Substrate
bending Depth 2 mm, 3 times ±(0.05 % R+0.01)
no visible damage, no open circuit in bent position
4.7 - Voltage proof URMS =Uins; 60 ± 5 s No flashover or breakdown
4.35 - Flammability IEC 60695-11-5,
needle flame test; 10 s No burning after 30 s
- - Damp heat (85 ±5) °C; 56 days
(85 ±5) % RH ± (0.25 R + 0.05 )
TEST PROCEDURES AND REQUIREMENTS
EN 60115-1
CLAUSE IEC 60068-2
TEST METHOD TEST PROCEDURE REQUIREMENTS
PERMISSIBLE CHANGE
Stability for product types:
TNPW0402 e3
TNPW0603 e3
TNPW0805 e3
TNPW1206 e3
TNPW1210 e3
TNPW2010 e3
TNPW2512 e3