SN74LVC126A QUADRUPLE BUS BUFFER GATE WITH 3-STATE OUTPUTS www.ti.com SCAS339Q - MARCH 1994 - REVISED JULY 2005 FEATURES * 14 2 13 3 12 4 11 5 10 6 9 7 8 VCC 4OE 4A 4Y 3OE 3A 3Y RGY PACKAGE (TOP VIEW) 1A 1Y 2OE 2A 2Y DESCRIPTION/ORDERING INFORMATION This quadruple bus buffer gate is designed for 1.65-V to 3.6-V VCC operation. VCC * 1 1 14 2 13 4OE 3 12 4A 4 11 4Y 5 6 10 3OE 9 3A The SN74LVC126A features independent line drivers with 3-state outputs. Each output is disabled when the associated output-enable (OE) input is low. 7 8 3Y * 1OE 1A 1Y 2OE 2A 2Y GND 1OE * * * D, DB, DGV, NS, OR PW PACKAGE (TOP VIEW) Operates From 1.65 V to 3.6 V Specified From -40C to 85C and From -40C to 125C Inputs Accept Voltages to 5.5 V Max tpd of 4.7 ns at 3.3 V Typical VOLP (Output Ground Bounce) < 0.8 V at VCC = 3.3 V, TA = 25C Typical VOHV (Output VOH Undershoot) > 2 V at VCC = 3.3 V, TA = 25C Latch-Up Performance Exceeds 250 mA Per JESD 17 ESD Protection Exceeds JESD 22 - 2000-V Human-Body Model (A114-A) - 200-V Machine Model (A115-A) GND * * To ensure the high-impedance state during power up or power down, OE should be tied to GND through a pulldown resistor; the minimum value of the resistor is determined by the current-sourcing capability of the driver. Inputs can be driven from either 3.3-V or 5-V devices. This feature allows the use of this device as a translator in a mixed 3.3-V/5-V system environment. ORDERING INFORMATION PACKAGE (1) TA -40C to 85C QFN - RGY Tube of 50 SN74LVC126AD Reel of 2500 SN74LVC126ADR Reel of 250 SN74LVC126ADT SOP - NS Reel of 2000 SN74LVC126ANSR LVC126A SSOP - DB Reel of 2000 SN74LVC126ADBR LC126A Tube of 90 SN74LVC126APW Reel of 2000 SN74LVC126APWR Reel of 250 SN74LVC126APWT Reel of 2000 SN74LVC126ADGVR TSSOP - PW TVSOP - DGV (1) TOP-SIDE MARKING SN74LVC126ARGYR SOIC - D -40C to 125C ORDERABLE PART NUMBER Reel of 1000 LC126A LVC126A LC126A LC126A Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are available at www.ti.com/sc/package. Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. PRODUCTION DATA information is current as of publication date. Products conform to specifications per the terms of the Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters. Copyright (c) 1994-2005, Texas Instruments Incorporated SN74LVC126A QUADRUPLE BUS BUFFER GATE WITH 3-STATE OUTPUTS www.ti.com SCAS339Q - MARCH 1994 - REVISED JULY 2005 FUNCTION TABLE (EACH BUFFER) INPUTS OE A OUTPUT Y H H H H L L L X Z LOGIC DIAGRAM (POSITIVE LOGIC) 1OE 1A 2OE 2A 1 3OE 2 3 1Y 3A 4 4OE 5 6 2Y 4A 10 9 8 3Y 13 12 11 4Y Absolute Maximum Ratings (1) over operating free-air temperature range (unless otherwise noted) VCC MIN MAX Supply voltage range -0.5 6.5 UNIT V range (2) -0.5 6.5 V -0.5 VCC + 0.5 VI Input voltage VO Output voltage range (2) (3) IIK Input clamp current VI < 0 -50 mA IOK Output clamp current VO < 0 -50 mA IO Continuous output current 50 mA 100 mA Continuous current through VCC or GND D package (4) 86 DB package (4) JA Package thermal impedance 96 DGV package (4) 127 NS package (4) 76 PW package (4) 113 RGY package (5) Tstg Ptot (1) (2) (3) (4) (5) (6) (7) 2 Storage temperature range Power dissipation 125C (6) (7) C/W 47 -65 TA = -40C to V 150 C 500 mW Stresses beyond those listed under "absolute maximum ratings" may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under "recommended operating conditions" is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. The input and output negative-voltage ratings may be exceeded if the input and output current ratings are observed. The value of VCC is provided in the recommended operating conditions table. The package thermal impedance is calculated in accordance with JESD 51-7. The package thermal impedance is calculated in accordance with JESD 51-5. For the D package: above 70C, the value of Ptot derates linearly with 8 mW/K. For the DB, NS, and PW packages: above 60C, the value of Ptot derates linearly with 5.5 mW/K. SN74LVC126A QUADRUPLE BUS BUFFER GATE WITH 3-STATE OUTPUTS www.ti.com SCAS339Q - MARCH 1994 - REVISED JULY 2005 Recommended Operating Conditions (1) TA = 25C VCC Supply voltage VIH High-level input voltage Input voltage VO Output voltage High-level output current IOH MAX MIN MAX MIN MAX 1.65 3.6 1.65 3.6 1.65 3.6 1.5 1.5 1.5 0.65 x VCC 0.65 x VCC 0.65 x VCC VCC = 2.3 V to 2.7 V 1.7 1.7 1.7 VCC = 2.7 V to 3.6 V 2 2 2 0.35 x VCC 0.35 x VCC 0.35 x VCC 0.7 0.7 0.7 VCC = 2.7 V to 3.6 V 0.8 0.8 0.8 0 5.5 0 5.5 V 0 VCC 0 VCC 0 VCC V -4 -4 VCC = 2.3 V -8 -8 -8 VCC = 2.7 V -12 -12 -12 VCC = 3 V -24 -24 -24 4 4 4 VCC = 1.65 V VCC = 2.3 V 8 8 8 VCC = 2.7 V 12 12 12 VCC = 3 V 24 24 24 10 10 10 t/v Input transition rise or fall rate (1) V 5.5 -4 Low-level output current V 0 VCC = 1.65 V IOL UNIT V VCC = 2.3 V to 2.7 V VCC = 1.65 V to 1.95 V VI -40 TO 125C MIN Data retention only VCC = 1.65 V to 1.95 V Low-level input voltage VIL Operating -40 TO 85C mA mA ns/V All unused inputs of the device must be held at VCC or GND to ensure proper device operation. Refer to the TI application report, Implications of Slow or Floating CMOS Inputs, literature number SCBA004. Electrical Characteristics over recommended operating free-air temperature range (unless otherwise noted) PARAMETER TEST CONDITIONS IOH = -100 A VOH 1.65 V to 3.6 V TA = 25C MIN -40 TO 85C TYP MAX MIN -40 TO 125C MAX MIN MAX VCC - 0.2 VCC - 0.2 VCC - 0.3 IOH = -4 mA 1.65 V 1.29 1.2 1.05 IOH = -8 mA 2.3 V 1.9 1.7 1.55 2.7 V 2.2 2.2 2.05 2.25 IOH = -12 mA VOL VCC UNIT V 3V 2.4 2.4 IOH = -24 mA 3V 2.3 2.2 IOL = 100 A 1.65 V to 3.6 V 0.1 0.2 IOL = 4 mA 1.65 V 0.24 0.45 0.6 IOL = 8 mA 2.3 V 0.3 0.7 0.75 IOL = 12 mA 2.7 V 0.4 0.4 0.6 IOL = 24 mA 3V 0.55 0.55 0.8 2 0.3 V II VI = 5.5 V or GND 3.6 V 1 5 20 A IOZ VO = VCC or GND 3.6 V 1 10 20 A ICC VI = VCC or GND, 3.6 V 1 10 40 A 500 500 5000 A ICC IO = 0 One input at VCC - 0.6 V, Other inputs at VCC or GND 2.7 V to 3.6 V Ci VI = VCC or GND 3.3 V 4.5 pF Co VO = VCC or GND 3.3 V 7 pF 3 SN74LVC126A QUADRUPLE BUS BUFFER GATE WITH 3-STATE OUTPUTS www.ti.com SCAS339Q - MARCH 1994 - REVISED JULY 2005 Switching Characteristics over recommended operating free-air temperature range (unless otherwise noted) (see Figure 1) PARAMETER tpd ten tdis FROM (INPUT) TO (OUTPUT) A OE OE VCC TA = 25C MIN -40 TO 85C TYP MAX -40 TO 125C MIN MAX MIN MAX 1.8 V 0.15 V 1 4.2 9.3 1 9.8 1 11.3 2.5 V 0.2 V 1 2.7 6.7 1 7.2 1 9.3 2.7 V 1 2.9 5 1 5.2 1 6.5 3.3 V 0.3 V 1 2.5 4.5 1 4.7 1 6 1.8 V 0.15 V 1 4.8 9.5 1 10 1 11.5 2.5 V 0.2 V 1 2.8 7.8 1 8.3 1 10.4 2.7 V 1 3.1 6.1 1 6.3 1 8 Y Y 3.3 V 0.3 V 1 2.5 5.5 1 5.7 1 7.5 1.8 V 0.15 V 1 4.4 12.1 1 12.6 1 14.1 2.5 V 0.2 V 1 2.7 8.2 1 8.7 1 10.8 2.7 V 1 2.7 6.5 1 6.7 1 8.5 1.3 2.3 5.8 1.3 6 1.3 7.5 Y 3.3 V 0.3 V 3.3 V 0.3 V tsk(o) 1 1.5 UNIT ns ns ns ns Operating Characteristics TA = 25C TEST CONDITIONS PARAMETER Outputs enabled Cpd Power dissipation capacitance per gate f = 10 MHz Outputs disabled 4 VCC TYP 1.8 V 20 2.5 V 21 3.3 V 22 1.8 V 2 2.5 V 3 3.3 V 4 UNIT pF SN74LVC126A QUADRUPLE BUS BUFFER GATE WITH 3-STATE OUTPUTS www.ti.com SCAS339Q - MARCH 1994 - REVISED JULY 2005 PARAMETER MEASUREMENT INFORMATION VLOAD S1 RL From Output Under Test CL (see Note A) Open GND RL TEST S1 tPLH/tPHL tPLZ/tPZL tPHZ/tPZH Open VLOAD GND LOAD CIRCUIT INPUTS VCC 1.8 V 0.15 V 2.5 V 0.2 V 2.7 V 3.3 V 0.3 V VI tr/tf VCC VCC 2.7 V 2.7 V 2 ns 2 ns 2.5 ns 2.5 ns VM VLOAD CL RL V VCC/2 VCC/2 1.5 V 1.5 V 2 x VCC 2 x VCC 6V 6V 30 pF 30 pF 50 pF 50 pF 1 k 500 500 500 0.15 V 0.15 V 0.3 V 0.3 V VI Timing Input VM 0V tw tsu VI Input VM VM th VI Data Input VM VM 0V 0V VOLTAGE WAVEFORMS PULSE DURATION VOLTAGE WAVEFORMS SETUP AND HOLD TIMES VI VM Input VM 0V tPLH VOH Output VM VOL tPHL VM VM 0V Output Waveform 1 S1 at VLOAD (see Note B) tPLH tPLZ VLOAD/2 VM tPZH VOH Output VM tPZL tPHL VM VI Output Control VM VOL VOLTAGE WAVEFORMS PROPAGATION DELAY TIMES INVERTING AND NONINVERTING OUTPUTS Output Waveform 2 S1 at GND (see Note B) VOL + V VOL tPHZ VM VOH - V VOH 0 V VOLTAGE WAVEFORMS ENABLE AND DISABLE TIMES LOW- AND HIGH-LEVEL ENABLING NOTES: A. CL includes probe and jig capacitance. B. Waveform 1 is for an output with internal conditions such that the output is low, except when disabled by the output control. Waveform 2 is for an output with internal conditions such that the output is high, except when disabled by the output control. C. All input pulses are supplied by generators having the following characteristics: PRR 10 MHz, ZO = 50 . D. The outputs are measured one at a time, with one transition per measurement. E. tPLZ and tPHZ are the same as tdis. F. tPZL and tPZH are the same as ten. G. tPLH and tPHL are the same as tpd. H. All parameters and waveforms are not applicable to all devices. Figure 1. Load Circuit and Voltage Waveforms 5 PACKAGE OPTION ADDENDUM www.ti.com 21-Dec-2009 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Drawing Pins Package Eco Plan (2) Qty SN74LVC126AD ACTIVE SOIC D 14 SN74LVC126ADBLE OBSOLETE SSOP DB 14 SN74LVC126ADBR ACTIVE SSOP DB 14 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74LVC126ADBRE4 ACTIVE SSOP DB 14 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74LVC126ADBRG4 ACTIVE SSOP DB 14 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74LVC126ADE4 ACTIVE SOIC D 14 50 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74LVC126ADG4 ACTIVE SOIC D 14 50 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74LVC126ADGVR ACTIVE TVSOP DGV 14 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74LVC126ADGVRE4 ACTIVE TVSOP DGV 14 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74LVC126ADGVRG4 ACTIVE TVSOP DGV 14 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74LVC126ADR ACTIVE SOIC D 14 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74LVC126ADRE4 ACTIVE SOIC D 14 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74LVC126ADRG4 ACTIVE SOIC D 14 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74LVC126ADT ACTIVE SOIC D 14 250 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74LVC126ADTE4 ACTIVE SOIC D 14 250 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74LVC126ADTG4 ACTIVE SOIC D 14 250 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74LVC126ANSR ACTIVE SO NS 14 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74LVC126ANSRE4 ACTIVE SO NS 14 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74LVC126ANSRG4 ACTIVE SO NS 14 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74LVC126APW ACTIVE TSSOP PW 14 90 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74LVC126APWE4 ACTIVE TSSOP PW 14 90 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74LVC126APWG4 ACTIVE TSSOP PW 14 90 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74LVC126APWLE OBSOLETE TSSOP PW 14 SN74LVC126APWR ACTIVE TSSOP PW 14 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74LVC126APWRE4 ACTIVE TSSOP PW 14 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74LVC126APWRG4 ACTIVE TSSOP PW 14 2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM 50 Green (RoHS & no Sb/Br) TBD TBD Addendum-Page 1 Lead/Ball Finish CU NIPDAU Call TI Call TI MSL Peak Temp (3) Level-1-260C-UNLIM Call TI Call TI PACKAGE OPTION ADDENDUM www.ti.com 21-Dec-2009 Orderable Device Status (1) Package Type Package Drawing Pins Package Eco Plan (2) Qty SN74LVC126APWT ACTIVE TSSOP PW 14 250 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74LVC126APWTE4 ACTIVE TSSOP PW 14 250 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74LVC126APWTG4 ACTIVE TSSOP PW 14 250 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74LVC126ARGYR ACTIVE VQFN RGY 14 3000 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR SN74LVC126ARGYRG4 ACTIVE VQFN RGY 14 3000 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR Lead/Ball Finish MSL Peak Temp (3) no Sb/Br) (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) (3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis. OTHER QUALIFIED VERSIONS OF SN74LVC126A : * Automotive: SN74LVC126A-Q1 NOTE: Qualified Version Definitions: * Automotive - Q100 devices qualified for high-reliability automotive applications targeting zero defects Addendum-Page 2 PACKAGE MATERIALS INFORMATION www.ti.com 21-Dec-2009 TAPE AND REEL INFORMATION *All dimensions are nominal Device Package Package Pins Type Drawing SPQ Reel Reel A0 Diameter Width (mm) (mm) W1 (mm) B0 (mm) K0 (mm) P1 (mm) W Pin1 (mm) Quadrant SN74LVC126ADBR SSOP DB 14 2000 330.0 16.4 8.2 6.6 2.5 12.0 16.0 Q1 SN74LVC126ADGVR TVSOP DGV 14 2000 330.0 12.4 6.8 4.0 1.6 8.0 12.0 Q1 SN74LVC126ADR SOIC D 14 2500 330.0 16.4 6.5 9.0 2.1 8.0 16.0 Q1 SN74LVC126ANSR SO NS 14 2000 330.0 16.4 8.2 10.5 2.5 12.0 16.0 Q1 SN74LVC126APWR TSSOP PW 14 2000 330.0 12.4 7.0 5.6 1.6 8.0 12.0 Q1 SN74LVC126ARGYR VQFN RGY 14 3000 180.0 12.4 3.75 3.75 1.15 8.0 12.0 Q1 Pack Materials-Page 1 PACKAGE MATERIALS INFORMATION www.ti.com 21-Dec-2009 *All dimensions are nominal Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) SN74LVC126ADBR SSOP DB 14 2000 346.0 346.0 33.0 SN74LVC126ADGVR TVSOP DGV 14 2000 346.0 346.0 29.0 SN74LVC126ADR SOIC D 14 2500 346.0 346.0 33.0 SN74LVC126ANSR SO NS 14 2000 346.0 346.0 33.0 SN74LVC126APWR TSSOP PW 14 2000 346.0 346.0 29.0 SN74LVC126ARGYR VQFN RGY 14 3000 190.5 212.7 31.8 Pack Materials-Page 2 MECHANICAL DATA MSSO002E - JANUARY 1995 - REVISED DECEMBER 2001 DB (R-PDSO-G**) PLASTIC SMALL-OUTLINE 28 PINS SHOWN 0,38 0,22 0,65 28 0,15 M 15 0,25 0,09 8,20 7,40 5,60 5,00 Gage Plane 1 14 0,25 A 0-8 0,95 0,55 Seating Plane 2,00 MAX 0,10 0,05 MIN PINS ** 14 16 20 24 28 30 38 A MAX 6,50 6,50 7,50 8,50 10,50 10,50 12,90 A MIN 5,90 5,90 6,90 7,90 9,90 9,90 12,30 DIM 4040065 /E 12/01 NOTES: A. B. C. D. All linear dimensions are in millimeters. This drawing is subject to change without notice. Body dimensions do not include mold flash or protrusion not to exceed 0,15. Falls within JEDEC MO-150 POST OFFICE BOX 655303 * DALLAS, TEXAS 75265 MECHANICAL DATA MTSS001C - JANUARY 1995 - REVISED FEBRUARY 1999 PW (R-PDSO-G**) PLASTIC SMALL-OUTLINE PACKAGE 14 PINS SHOWN 0,30 0,19 0,65 14 0,10 M 8 0,15 NOM 4,50 4,30 6,60 6,20 Gage Plane 0,25 1 7 0- 8 A 0,75 0,50 Seating Plane 0,15 0,05 1,20 MAX PINS ** 0,10 8 14 16 20 24 28 A MAX 3,10 5,10 5,10 6,60 7,90 9,80 A MIN 2,90 4,90 4,90 6,40 7,70 9,60 DIM 4040064/F 01/97 NOTES: A. B. C. D. All linear dimensions are in millimeters. This drawing is subject to change without notice. Body dimensions do not include mold flash or protrusion not to exceed 0,15. Falls within JEDEC MO-153 POST OFFICE BOX 655303 * DALLAS, TEXAS 75265 MECHANICAL DATA MPDS006C - FEBRUARY 1996 - REVISED AUGUST 2000 DGV (R-PDSO-G**) PLASTIC SMALL-OUTLINE 24 PINS SHOWN 0,40 0,23 0,13 24 13 0,07 M 0,16 NOM 4,50 4,30 6,60 6,20 Gage Plane 0,25 0-8 1 0,75 0,50 12 A Seating Plane 0,15 0,05 1,20 MAX PINS ** 0,08 14 16 20 24 38 48 56 A MAX 3,70 3,70 5,10 5,10 7,90 9,80 11,40 A MIN 3,50 3,50 4,90 4,90 7,70 9,60 11,20 DIM 4073251/E 08/00 NOTES: A. B. C. D. All linear dimensions are in millimeters. This drawing is subject to change without notice. Body dimensions do not include mold flash or protrusion, not to exceed 0,15 per side. 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