Semiconductor Components Industries, LLC, 2004
September, 2004 − Rev. 5 1Publication Order Number:
MMBT2222LT1/D
MMBT2222LT1,
MMBT2222ALT1
MMBT2222ALT1 is a Preferred Device
General Purpose
Transistors
NPN Silicon
Features
Pb−Free Package May be Available. The G−Suffix Denotes a
Pb−Free Lead Finish
MAXIMUM RATINGS
Rating Symbol Value Unit
CollectorEmitter Voltage
MMBT2222LT1
MMBT2222ALT1
VCEO 30
40
Vdc
CollectorBase Voltage
MMBT2222LT1
MMBT2222ALT1
VCBO 60
75
Vdc
EmitterBase Voltage
MMBT2222LT1
MMBT2222ALT1
VEBO 5.0
6.0
Vdc
Collector Current − Continuous IC600 mAdc
THERMAL CHARACTERISTICS
Characteristic Symbol Max Unit
Total Device Dissipation
FR−5 Board (Note 1)
TA = 25°C
Derate above 25°C
PD225
1.8
mW
mW/°C
Thermal Resistance
Junction−to−Ambient RJA 556 °C/W
Total Device Dissipation
Alumina Substrate (Note 2)
TA = 25°C
Derate above 25°C
PD300
2.4
mW
mW/°C
Thermal Resistance
Junction−to−Ambient RJA 417 °C/W
Junction and Storage
Temperature Range TJ, Tstg 55 to
+150 °C
Maximum ratings are those values beyond which device damage can occur.
Maximum ratings applied to the device are individual stress limit values (not
normal operating conditions) and are not valid simultaneously. If these limits are
exceeded, device functional operation is not implied, damage may occur and
reliability may be affected.
1. FR−5 = 1.0 0.75 0.062 in.
2. Alumina = 0.4 0.3 0.024 in. 99.5% alumina.
Device Package Shipping
ORDERING INFORMATION
MMBT2222LT1 SOT−23
SOT−23
CASE 318
Style 6
3000/Tape & Reel
Preferred devices are recommended choices for future use
and best overall value.
MARKING
DIAGRAM
xxx M
xxx = Specific Device Code
= (M1B = MMBT2222LT1,
= 1P = MMBT2222ALT1)
M = Date Code
COLLECTOR
3
1
BASE
2
EMITTER
MMBT2222ALT1 SOT−23 3000/Tape & Reel
12
3
MMBT2222LT3 SOT−23 10,000/Tape & Reel
MMBT2222ALT3 SOT−23 10,000/Tape & Reel
For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specifications
Brochure, BRD8011/D.
MMBT2222ALT3G SOT−23
(Pb−Free) 10,000/Tape & Reel
MMBT2222ALT1G SOT−23
(Pb−Free) 3000/Tape & Reel
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MMBT2222LT1G SOT−23
(Pb−Free) 3000/Tape & Reel
MMBT2222LT1, MMBT2222ALT1
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2
ELECTRICAL CHARACTERISTICS (TA = 25°C unless otherwise noted)
Characteristic Symbol Min Max Unit
OFF CHARACTERISTICS
CollectorEmitter Breakdown Voltage (IC = 10 mAdc, IB = 0) MMBT2222
MMBT2222A V(BR)CEO 30
40
Vdc
CollectorBase Breakdown Voltage (IC = 10 Adc, IE = 0) MMBT2222
MMBT2222A V(BR)CBO 60
75
Vdc
EmitterBase Breakdown Voltage (IE = 10 Adc, IC = 0) MMBT2222
MMBT2222A V(BR)EBO 5.0
6.0
Vdc
Collector Cutoff Current (VCE = 60 Vdc, VEB(off) = 3.0 Vdc) MMBT2222A ICEX 10 nAdc
Collector Cutoff Current (VCB = 50 Vdc, IE = 0) MMBT2222
(VCB = 60 Vdc, IE = 0) MMBT2222A
(VCB = 50 Vdc, IE = 0, TA = 125°C) MMBT2222
(VCB = 60 Vdc, IE = 0, TA = 125°C) MMBT2222A
ICBO
0.01
0.01
10
10
Adc
Emitter Cutoff Current (VEB = 3.0 Vdc, IC = 0) MMBT2222A IEBO 100 nAdc
Base Cutoff Current (VCE = 60 Vdc, VEB(off) = 3.0 Vdc) MMBT2222A IBL 20 nAdc
ON CHARACTERISTICS
DC Current Gain
(IC = 0.1 mAdc, VCE = 10 Vdc)
(IC = 1.0 mAdc, VCE = 10 Vdc)
(IC = 10 mAdc, VCE = 10 Vdc)
(IC = 10 mAdc, VCE = 10 Vdc, TA = −55°C) MMBT2222A only
(IC = 150 mAdc, VCE = 10 Vdc) (Note 3)
(IC = 150 mAdc, VCE = 1.0 Vdc) (Note 3)
(IC = 500 mAdc, VCE = 10 Vdc) (Note 3) MMBT2222
MMBT2222A
hFE 35
50
75
35
100
50
30
40
300
CollectorEmitter Saturation Voltage (Note 3)
(IC = 150 mAdc, IB = 15 mAdc) MMBT2222
MMBT2222A
(IC = 500 mAdc, IB = 50 mAdc) MMBT2222
MMBT2222A
VCE(sat)
0.4
0.3
1.6
1.0
Vdc
BaseEmitter Saturation Voltage (Note 3)
(IC = 150 mAdc, IB = 15 mAdc) MMBT2222
MMBT2222A
(IC = 500 mAdc, IB = 50 mAdc) MMBT2222
MMBT2222A
VBE(sat)
0.6
1.3
1.2
2.6
2.0
Vdc
SMALL−SIGNAL CHARACTERISTICS
CurrentGain − Bandwidth Product (Note 4)
(IC = 20 mAdc, VCE = 20 Vdc, f = 100 MHz) MMBT2222
MMBT2222A
fT250
300
MHz
Output Capacitance
(VCB = 10 Vdc, IE = 0, f = 1.0 MHz) Cobo 8.0 pF
Input Capacitance
(VEB = 0.5 Vdc, IC = 0, f = 1.0 MHz) MMBT2222
MMBT2222A
Cibo
30
25
pF
Input Impedance
(IC = 1.0 mAdc, VCE = 10 Vdc, f = 1.0 kHz) MMBT2222A
(IC = 10 mAdc, VCE = 10 Vdc, f = 1.0 kHz) MMBT2222A
hie 2.0
0.25 8.0
1.25
k
Voltage Feedback Ratio
(IC = 1.0 mAdc, VCE = 10 Vdc, f = 1.0 kHz) MMBT2222A
(IC = 10 mAdc, VCE = 10 Vdc, f = 1.0 kHz) MMBT2222A
hre
8.0
4.0
X 10−4
SmallSignal Current Gain
(IC = 1.0 mAdc, VCE = 10 Vdc, f = 1.0 kHz) MMBT2222A
(IC = 10 mAdc, VCE = 10 Vdc, f = 1.0 kHz) MMBT2222A
hfe 50
75 300
375
3. Pulse Test: Pulse Width 300 s, Duty Cycle 2.0%.
4. fT is defined as the frequency at which |hfe| extrapolates to unity.
MMBT2222LT1, MMBT2222ALT1
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ELECTRICAL CHARACTERISTICS (TA = 25°C unless otherwise noted)
Characteristic UnitMaxMinSymbol
SMALL−SIGNAL CHARACTERISTICS
Output Admittance
(IC = 1.0 mAdc, VCE = 10 Vdc, f = 1.0 kHz) MMBT2222A
(IC = 10 mAdc, VCE = 10 Vdc, f = 1.0 kHz) MMBT2222A
hoe 5.0
25 35
200
mhos
Collector Base Time Constant
(IE = 20 mAdc, VCB = 20 Vdc, f = 31.8 MHz) MMBT2222A rb, Cc 150 ps
Noise Figure
(IC = 100 Adc, VCE = 10 Vdc, RS = 1.0 k, f = 1.0 kHz) MMBT2222A NF 4.0 dB
SWITCHING CHARACTERISTICS (MMBT2222A only)
Delay Time
(
V
CC
= 30 Vdc, V
BE(off)
= −0.5 Vdc, td 10
ns
Rise Time
(VCC
=
30
Vdc
,
VBE(
o
ff)
=
−0
.
5
Vdc
,
IC = 150 mAdc, IB1 = 15 mAdc) tr 25 ns
Storage Time
(
V
CC
= 30 Vdc, I
C
= 150 mAdc, ts 225
ns
Fall Time
(VCC
=
30
Vdc
,
IC
=
150
mAdc
,
IB1 = IB2 = 15 mAdc) tf 60 ns
3. Pulse Test: Pulse Width 300 s, Duty Cycle 2.0%.
4. fT is defined as the frequency at which |hfe| extrapolates to unity.
Figure 1. Turn−On Time Figure 2. Turn−Off Time
SWITCHING TIME EQUIVALENT TEST CIRCUITS
Scope rise time < 4 ns
*Total shunt capacitance of test jig, connectors, and oscilloscope.
+16 V
−2 V < 2 ns
0
1.0 to 100 s,
DUTY CYCLE 2.0%
1 k
+30 V
200
CS* < 10 pF
+16 V
−14 V
0
< 20 ns
1.0 to 100 s,
DUTY CYCLE 2.0%
1 k
+30 V
200
CS* < 10 pF
−4 V
1N914
MMBT2222LT1, MMBT2222ALT1
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4
1000
10
20
30
50
70
100
200
300
500
700
1.0 k0.1 0.2 0.3 0.5 0.7 1.0 2.0 3.0 5.0 7.0 10 20 30 50 70 100 200 300 500 700
IC, COLLECTOR CURRENT (mA)
Figure 3. DC Current Gain
hFE, DC CURRENT GAINVCE, COLLECTOR−EMITTER VOLTAGE (VOLTS)
1.0
0.8
0.6
0.4
0.2
0
0.005 0.01 0.02 0.03 0.05 0.1 0.2 0.3 0.5 1.0 2.0 3.0 5.0 10 20 30 50
IB, BASE CURRENT (mA)
Figure 4. Collector Saturation Region
TJ = 125°C
TJ = 25°C
25°C
−55°C
IC = 1.0 mA 10 mA 150 mA 500 mA
VCE = 1.0 V
VCE = 10 V
MMBT2222LT1, MMBT2222ALT1
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Figure 5. TurnOn Time
IC, COLLECTOR CURRENT (mA)
70
100
200
50
t, TIME (ns)
10 20 70
5.0
100
5.0 7.0 30 50 200
10
30
7.0
20
IC/IB = 10
TJ = 25°C
tr @ VCC = 30 V
td @ VEB(off) = 2.0 V
td @ VEB(off) = 0
3.0
2.0
300 500
500
t, TIME (ns)
5.0
7.0
10
20
30
50
70
100
200
300
Figure 6. TurnOff Time
IC, COLLECTOR CURRENT (mA)
10 20 70 1005.0 7.0 30 50 200 300 500
VCC = 30 V
IC/IB = 10
IB1 = IB2
TJ = 25°C
ts = ts − 1/8 tf
tf
Figure 7. Frequency Effects
f, FREQUENCY (kHz)
4.0
6.0
8.0
10
2.0
0.1
Figure 8. Source Resistance Effects
RS, SOURCE RESISTANCE (OHMS)
NF, NOISE FIGURE (dB)
1.0 2.0 5.0 10 20 50
0.2 0.5
0
100
NF, NOISE FIGURE (dB)
0.01 0.02 0.05
RS = OPTIMUM
RS = SOURCE
RS = RESISTANCE
IC = 1.0 mA, RS = 150
500 A, RS = 200
100 A, RS = 2.0 k
50 A, RS = 4.0 k
f = 1.0 kHz
IC = 50 A
100 A
500 A
1.0 mA
4.0
6.0
8.0
10
2.0
0
50 100 200 500 1.0 k 2.0 k 5.0 k 10 k 20 k 50 k 100 k
Figure 9. Capacitances
REVERSE VOLTAGE (VOLTS)
3.0
5.0
7.0
10
2.0
0.1
CAPACITANCE (pF)
1.0 2.0 3.0 5.0 7.0 10 20 30 50
0.2 0.3 0.5 0.7
Ccb
20
30
Ceb
Figure 10. Current−Gain Bandwidth Product
IC, COLLECTOR CURRENT (mA)
70
100
200
300
50
500
fT, CURRENT−GAIN BANDWIDTH PRODUCT (MHz)
1.0 2.0 3.0 5.0 7.0 10 20 30 50 70 100
VCE = 20 V
TJ = 25°C
MMBT2222LT1, MMBT2222ALT1
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Figure 11. “On” Voltages
IC, COLLECTOR CURRENT (mA)
0.4
0.6
0.8
1.0
0.2
V, VOLTAGE (VOLTS)
0
TJ = 25°C
VBE(sat) @ IC/IB = 10
VCE(sat) @ IC/IB = 10
VBE(on) @ VCE = 10 V
Figure 12. Temperature Coefficients
IC, COLLECTOR CURRENT (mA)
−0.5
0
+0.5
COEFFICIENT (mV/ C)
−1.0
−1.5
−2.5
°
RVC for VCE(sat)
RVB for VBE
0.1 1.0 2.0 5.0 10 20 50
0.2 0.5 100 200 500 1.0 k
1.0 V
−2.0
0.1 1.0 2.0 5.0 10 20 500.2 0.5 100 200 500
MMBT2222LT1, MMBT2222ALT1
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PACKAGE DIMENSIONS
SOT−23 (TO−236AB)
CASE 318−08
ISSUE AH
DJ
K
L
A
C
BS
H
GV
3
12
DIM
A
MIN MAX MIN MAX
MILLIMETERS
0.1102 0.1197 2.80 3.04
INCHES
B0.0472 0.0551 1.20 1.40
C0.0350 0.0440 0.89 1.11
D0.0150 0.0200 0.37 0.50
G0.0701 0.0807 1.78 2.04
H0.0005 0.0040 0.013 0.100
J0.0034 0.0070 0.085 0.177
K0.0140 0.0285 0.35 0.69
L0.0350 0.0401 0.89 1.02
S0.0830 0.1039 2.10 2.64
V0.0177 0.0236 0.45 0.60
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. MAXIMUM LEAD THICKNESS INCLUDES LEAD
FINISH THICKNESS. MINIMUM LEAD THICKNESS
IS THE MINIMUM THICKNESS OF BASE
MATERIAL.
4. 318−03 AND −07 OBSOLETE, NEW STANDARD
318−08.
STYLE 6:
PIN 1. BASE
2. EMITTER
3. COLLECTOR
0.8
0.031
0.9
0.035
0.95
0.037
0.95
0.037
2.0
0.079
SOLDERING FOOTPRINT*
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
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to any products herein. SCILLC makes no warranty , representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability
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MMBT2222LT1/D
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