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FEATURES
1
2
3
4
5
6
7
8
9
10
20
19
18
17
16
15
14
13
12
11
OE1
A1
A2
A3
A4
A5
A6
A7
A8
GND
VCC
OE2
Y1
Y2
Y3
Y4
Y5
Y6
Y7
Y8
SN54LVC541A . . . J OR W PACKAGE
SN74LVC541A . . . DB, DGV, DW , NS,
OR PW PACKAGE
(TOP VIEW)
3 2 1 20 19
9 10 11 12 13
4
5
6
7
8
18
17
16
15
14
Y1
Y2
Y3
Y4
Y5
A3
A4
A5
A6
A7
SN54LVC541A . . . FK PACKAGE
(TOP VIEW)
A2
A1
OE1
Y7
Y6 OE2
A8
GND
Y8 VCC
SN74LVC541A . . . RGY PACKAGE
(TOP VIEW)
1 20
10 11
2
3
4
5
6
7
8
9
19
18
17
16
15
14
13
12
OE2
Y1
Y2
Y3
Y4
Y5
Y6
Y7
A1
A2
A3
A4
A5
A6
A7
A8
OE1
Y8 V
GND
CC
DESCRIPTION/ORDERING INFORMATION
SN54LVC541A, SN74LVC541AOCTAL BUFFERS/DRIVERS
WITH 3-STATE OUTPUTS
SCAS298M – JANUARY 1993 – REVISED MAY 2005
•I
off
Supports Partial-Power-Down ModeOperation•Operate From 1.65 V to 3.6 V
•Latch-Up Performance Exceeds 250 mA Per•Inputs Accept Voltages to 5.5 V
JESD 17•Max t
pd
of 5.1 ns at 3.3 V
•ESD Protection Exceeds JESD 22•Typical V
OLP
(Output Ground Bounce) < 0.8 V
– 2000-V Human-Body Model (A114-A)at V
CC
= 3.3 V, T
A
= 25°C
– 200-V Machine Model (A115-A)•Typical V
OHV
(Output V
OH
Undershoot) > 2 V atV
CC
= 3.3 V, T
A
= 25°C – 1000-V Charged-Device Model (C101)ABC•Support Mixed-Mode Signal Operation on AllPorts (5-V Input/Output Voltage With3.3-V V
CC
)
The SN54LVC541A octal buffer/driver is designed for 2.7-V to 3.6-V V
CC
operation, and the SN74LVC541A octalbuffer/driver is designed for 1.65-V to 3.6-V V
CC
operation.
ORDERING INFORMATION
T
A
PACKAGE
(1)
ORDERABLE PART NUMBER TOP-SIDE MARKING
QFN – RGY Reel of 1000 SN74LVC541ARGYR LC541ATube of 25 SN74LVC541ADWSOIC – DW LVC541AReel of 2000 SN74LVC541ADWRSOP – NS Reel of 2000 SN74LVC541ANSR LVC541A–40°C to 85°C SSOP – DB Reel of 2000 SN74LVC541ADBR LC541ATube of 70 SN74LVC541APWTSSOP – PW Reel of 2000 SN74LVC541APWR LC541AReel of 250 SN74LVC541APWTTVSOP – DGV Reel of 2000 SN74LVC541ADGVR LC541ACDIP – J Tube of 20 SNJ54LVC541AJ SNJ54LVC541AJ–55°C to 125°C CFP – W Tube of 85 SNJ54LVC541AW SNJ54LVC541AWLCCC – FK Tube of 55 SNJ54LVC541AFK SNJ54LVC541AFK
(1) Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are available atwww.ti.com/sc/package.
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of TexasInstruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
PRODUCTION DATA information is current as of publication date.
Copyright © 1993–2005, Texas Instruments IncorporatedProducts conform to specifications per the terms of the Texas
On products compliant to MIL-PRF-38535, all parameters areInstruments standard warranty. Production processing does not
tested unless otherwise noted. On all other products, productionnecessarily include testing of all parameters.
processing does not necessarily include testing of all parameters.
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DESCRIPTION/ORDERING INFORMATION (CONTINUED)
OE1
OE2
To Seven Other Channels
A1 Y1
1
19
2 18
SN54LVC541A, SN74LVC541AOCTAL BUFFERS/DRIVERS
WITH 3-STATE OUTPUTS
SCAS298M – JANUARY 1993 – REVISED MAY 2005
The 'LVC541A devices are ideal for driving bus lines or buffering memory address registers.
These devices feature inputs and outputs on opposite sides of the package to facilitate printed circuit boardlayout.
The 3-state control gate is a 2-input AND gate with active-low inputs so that, if either output enable ( OE1 or OE2)input is high, all eight outputs are in the high-impedance state.
Inputs can be driven from either 3.3-V or 5-V devices. This feature allows the use of these devices as translatorsin a mixed 3.3-V/5-V system environment.
These devices are fully specified for partial-power-down applications using I
off
. The I
off
circuitry disables theoutputs, preventing damaging current backflow through the devices when they are powered down.
To ensure the high-impedance state during power up or power down, OE should be tied to V
CC
through a pullupresistor; the minimum value of the resistor is determined by the current-sinking capability of the driver.
FUNCTION TABLE
INPUTS
OUTPUT
YOE1 OE2 A
L L L LL L H HH X X ZX H X Z
LOGIC DIAGRAM (POSITIVE LOGIC)
2
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Absolute Maximum Ratings
(1)
SN54LVC541A, SN74LVC541AOCTAL BUFFERS/DRIVERS
WITH 3-STATE OUTPUTS
SCAS298M – JANUARY 1993 – REVISED MAY 2005
over operating free-air temperature range (unless otherwise noted)
MIN MAX UNIT
V
CC
Supply voltage range –0.5 6.5 VV
I
Input voltage range
(2)
–0.5 6.5 VV
O
Voltage range applied to any output in the high-impedance or power-off state
(2)
–0.5 6.5 VV
O
Voltage range applied to any output in the high or low state
(2) (3)
–0.5 V
CC
+ 0.5 VI
IK
Input clamp current V
I
< 0 –50 mAI
OK
Output clamp current V
O
< 0 –50 mAI
O
Continuous output current ±50 mAContinuous current through V
CC
or GND ±100 mADB package
(4)
70DGV package
(4)
92DW package
(4)
58θ
JA
Package thermal impedance °C/WNS package
(4)
60PW package
(4)
83RGY package
(5)
37T
stg
Storage temperature range –65 150 °C
(1) Stresses beyond those listed under "absolute maximum ratings" may cause permanent damage to the device. These are stress ratingsonly, and functional operation of the device at these or any other conditions beyond those indicated under "recommended operatingconditions" is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.(2) The input negative-voltage and output voltage ratings may be exceeded if the input and output current ratings are observed.(3) The value of V
CC
is provided in the recommended operating conditions table.(4) The package thermal impedance is calculated in accordance with JESD 51-7.(5) The package thermal impedance is calculated in accordance with JESD 51-5.
3
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Recommended Operating Conditions
(1)
SN54LVC541A, SN74LVC541AOCTAL BUFFERS/DRIVERS
WITH 3-STATE OUTPUTS
SCAS298M – JANUARY 1993 – REVISED MAY 2005
SN54LVC541A SN74LVC541A
UNITMIN MAX MIN MAX
Operating 2 3.6 1.65 3.6V
CC
Supply voltage VData retention only 1.5 1.5V
CC
= 1.65 V to 1.95 V 0.65 × V
CC
V
IH
High-level input voltage V
CC
= 2.3 V to 2.7 V 1.7 VV
CC
= 2.7 V to 3.6 V 2 2V
CC
= 1.65 V to 1.95 V 0.35 × V
CC
V
IL
Low-level input voltage V
CC
= 2.3 V to 2.7 V 0.7 VV
CC
= 2.7 V to 3.6 V 0.8 0.8V
I
Input voltage 0 5.5 0 5.5 VHigh or low state 0 V
CC
0 V
CCV
O
Output voltage V3-state 0 5.5 0 5.5V
CC
= 1.65 V –4V
CC
= 2.3 V –8I
OH
High-level output current mAV
CC
= 2.7 V –12 –12V
CC
= 3 V –24 –24V
CC
= 1.65 V 4V
CC
= 2.3 V 8I
OL
Low-level output current mAV
CC
= 2.7 V 12 12V
CC
= 3 V 24 24T
A
Operating free-air temperature –55 125 –40 85 °C
(1) All unused inputs of the device must be held at V
CC
or GND to ensure proper device operation. Refer to the TI application report,Implications of Slow or Floating CMOS Inputs, literature number SCBA004.
4
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Electrical Characteristics
Switching Characteristics
SN54LVC541A, SN74LVC541AOCTAL BUFFERS/DRIVERS
WITH 3-STATE OUTPUTS
SCAS298M – JANUARY 1993 – REVISED MAY 2005
over recommended operating free-air temperature range (unless otherwise noted)
SN54LVC541A SN74LVC541APARAMETER TEST CONDITIONS V
CC
UNITMIN TYP
(1)
MAX MIN TYP
(1)
MAX
1.65 V to 3.6 V V
CC
– 0.2I
OH
= –100 µA
2.7 V to 3.6 V V
CC
– 0.2I
OH
= –4 mA 1.65 V 1.2V
OH
I
OH
= –8 mA 2.3 V 1.7 V2.7 V 2.2 2.2I
OH
= –12 mA
3 V 2.4 2.4I
OH
= –24 mA 3 V 2.2 2.21.65 V to 3.6 V 0.2I
OL
= 100 µA
2.7 V to 3.6 V 0.2I
OL
= 4 mA 1.65 V 0.45V
OL
VI
OL
= 8 mA 2.3 V 0.7I
OL
= 12 mA 2.7 V 0.4 0.4I
OL
= 24 mA 3 V 0.55 0.55I
I
V
I
= 0 to 5.5 V 3.6 V ±5 ±5 µAI
off
V
I
or V
O
= 5.5 V 0 ±10 µAI
OZ
V
O
= 0 to 5.5 V 3.6 V ±15 ±10 µAV
I
= V
CC
or GND 10 10I
CC
I
O
= 0 3.6 V µA3.6 V ≤V
I
≤5.5 V
(2)
10 10One input at V
CC
– 0.6 V,∆I
CC
2.7 V to 3.6 V 500 500 µAOther inputs at V
CC
or GNDC
i
V
I
= V
CC
or GND 3.3 V 4 4 pFC
o
V
O
= V
CC
or GND 3.3 V 5.5 5.5 pF
(1) All typical values are at V
CC
= 3.3 V, T
A
= 25°C.(2) This applies in the disabled state only.
over recommended operating free-air temperature range (unless otherwise noted) (see Figure 1 )
SN54LVC541A
FROM TO V
CC
= 3.3 VPARAMETER V
CC
= 2.7 V UNIT(INPUT) (OUTPUT) ± 0.3 V
MIN MAX MIN MAX
t
pd
A Y 5.6 1 5.1 nst
en
OE Y 7.5 1 7 nst
dis
OE Y 7.7 1 7 ns
5
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Switching Characteristics
Operating Characteristics
SN54LVC541A, SN74LVC541AOCTAL BUFFERS/DRIVERS
WITH 3-STATE OUTPUTS
SCAS298M – JANUARY 1993 – REVISED MAY 2005
over recommended operating free-air temperature range (unless otherwise noted) (see Figure 1 )
SN74LVC541A
FROM TO V
CC
= 1.8 V V
CC
= 2.5 V V
CC
= 3.3 VPARAMETER V
CC
= 2.7 V UNIT(INPUT) (OUTPUT) ± 0.15 V ± 0.2 V ± 0.3 V
MIN MAX MIN MAX MIN MAX MIN MAX
t
pd
A Y 1 15.7 1 7.8 1 5.6 1.5 5.1 nst
en
OE Y 1 17.5 1 10.5 1 7.5 1.5 7 nst
dis
OE Y 1 16.5 1 9 1 7.7 1.5 7 nst
sk(o)
1 ns
T
A
= 25°C
V
CC
= 1.8 V V
CC
= 2.5 V V
CC
= 3.3 VTESTPARAMETER UNITCONDITIONS
TYP TYP TYP
Outputs enabled 65 58 33Power dissipation capacitanceC
pd
f = 10 MHz pFper buffer/driver
Outputs disabled 2 2 2
6
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PARAMETER MEASUREMENT INFORMATION
VM
th
tsu
From Output
Under Test
CL
(see Note A)
LOAD CIRCUIT
S1 VLOAD
Open
GND
RL
RL
Data Input
Timing Input VI
0 V
VI
0 V
0 V
tw
Input
VOLTAGE WA VEFORMS
SETUP AND HOLD TIMES
VOLTAGE WA VEFORMS
PROPAGATION DELAY TIMES
INVERTING AND NONINVERTING OUTPUTS
VOLTAGE WA VEFORMS
PULSE DURATION
tPLH
tPHL
tPHL
tPLH
VOH
VOH
VOL
VOL
VI
0 V
Input
Output
Waveform 1
S1 at VLOAD
(see Note B)
Output
Waveform 2
S1 at GND
(see Note B)
VOL
VOH
tPZL
tPZH
tPLZ
tPHZ
VLOAD/2
0 V
VOL + V∆
VOH − V∆≈0 V
VI
VOLTAGE WA VEFORMS
ENABLE AND DISABLE TIMES
LOW- AND HIGH-LEVEL ENABLING
Output
Output
tPLH/tPHL
tPLZ/tPZL
tPHZ/tPZH
Open
VLOAD
GND
TEST S1
NOTES: A. CL includes probe and jig capacitance.
B. Waveform 1 is for an output with internal conditions such that the output is low, except when disabled by the output control.
Waveform2 is for an output with internal conditions such that the output is high, except when disabled by the output control.
C. All input pulses are supplied by generators having the following characteristics: PRR ≤ 10 MHz, ZO = 50 Ω.
D. The outputs are measured one at a time, with one transition per measurement.
E. tPLZ and tPHZ are the same as tdis.
F. tPZL and tPZH are the same as ten.
G. tPLH and tPHL are the same as tpd.
H. All parameters and waveforms are not applicable to all devices.
Output
Control
VMVM
VMVM
VMVM
VM
VMVM
VM
VM
VM
VI
VM
VM
1.8 V ± 0.15 V
2.5 V ± 0.2 V
2.7 V
3.3 V ± 0.3 V
1 kΩ
500 Ω
500 Ω
500 Ω
VCC RL
2 × VCC
2 × VCC
6 V
6 V
VLOAD CL
30 pF
30 pF
50 pF
50 pF
0.15 V
0.15 V
0.3 V
0.3 V
V∆
VCC
VCC
2.7 V
2.7 V
VI
VCC/2
VCC/2
1.5 V
1.5 V
VM
tr/tf
≤2 ns
≤2 ns
≤2.5 ns
≤2.5 ns
INPUTS
SN54LVC541A, SN74LVC541AOCTAL BUFFERS/DRIVERS
WITH 3-STATE OUTPUTS
SCAS298M – JANUARY 1993 – REVISED MAY 2005
Figure 1. Load Circuit and Voltage Waveforms
7
PACKAGE OPTION ADDENDUM
www.ti.com 5-Sep-2011
Addendum-Page 1
PACKAGING INFORMATION
Orderable Device Status (1) Package Type Package
Drawing Pins Package Qty Eco Plan (2) Lead/
Ball Finish MSL Peak Temp (3) Samples
(Requires Login)
5962-9759501Q2A ACTIVE LCCC FK 20 1 TBD Call TI Call TI
5962-9759501QRA ACTIVE CDIP J 20 1 TBD Call TI Call TI
5962-9759501QSA ACTIVE CFP W 20 1 TBD Call TI Call TI
SN74LVC541ADBLE OBSOLETE SSOP DB 20 TBD Call TI Call TI
SN74LVC541ADBR ACTIVE SSOP DB 20 2000 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74LVC541ADBRG4 ACTIVE SSOP DB 20 2000 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74LVC541ADGVR ACTIVE TVSOP DGV 20 2000 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74LVC541ADGVRE4 ACTIVE TVSOP DGV 20 2000 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74LVC541ADGVRG4 ACTIVE TVSOP DGV 20 2000 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74LVC541ADW ACTIVE SOIC DW 20 25 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74LVC541ADWE4 ACTIVE SOIC DW 20 25 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74LVC541ADWG4 ACTIVE SOIC DW 20 25 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74LVC541ADWR ACTIVE SOIC DW 20 2000 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74LVC541ADWRE4 ACTIVE SOIC DW 20 2000 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74LVC541ADWRG4 ACTIVE SOIC DW 20 2000 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74LVC541ANSR ACTIVE SO NS 20 2000 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74LVC541ANSRE4 ACTIVE SO NS 20 2000 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74LVC541ANSRG4 ACTIVE SO NS 20 2000 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
PACKAGE OPTION ADDENDUM
www.ti.com 5-Sep-2011
Addendum-Page 2
Orderable Device Status (1) Package Type Package
Drawing Pins Package Qty Eco Plan (2) Lead/
Ball Finish MSL Peak Temp (3) Samples
(Requires Login)
SN74LVC541APW ACTIVE TSSOP PW 20 70 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74LVC541APWE4 ACTIVE TSSOP PW 20 70 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74LVC541APWG4 ACTIVE TSSOP PW 20 70 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74LVC541APWLE OBSOLETE TSSOP PW 20 TBD Call TI Call TI
SN74LVC541APWR ACTIVE TSSOP PW 20 2000 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74LVC541APWRE4 ACTIVE TSSOP PW 20 2000 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74LVC541APWRG3 PREVIEW TSSOP PW 20 2000 TBD Call TI Call TI
SN74LVC541APWRG4 ACTIVE TSSOP PW 20 2000 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74LVC541APWT ACTIVE TSSOP PW 20 250 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74LVC541APWTE4 ACTIVE TSSOP PW 20 250 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74LVC541APWTG4 ACTIVE TSSOP PW 20 250 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74LVC541ARGYR ACTIVE VQFN RGY 20 3000 Green (RoHS
& no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR
SN74LVC541ARGYRG4 ACTIVE VQFN RGY 20 3000 Green (RoHS
& no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR
SNJ54LVC541AFK ACTIVE LCCC FK 20 1 TBD POST-PLATE N / A for Pkg Type
SNJ54LVC541AJ ACTIVE CDIP J 20 1 TBD A42 N / A for Pkg Type
SNJ54LVC541AW ACTIVE CFP W 20 1 TBD Call TI N / A for Pkg Type
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
PACKAGE OPTION ADDENDUM
www.ti.com 5-Sep-2011
Addendum-Page 3
(2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
(3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
OTHER QUALIFIED VERSIONS OF SN54LVC541A, SN74LVC541A :
•Catalog: SN74LVC541A
•Automotive: SN74LVC541A-Q1, SN74LVC541A-Q1
•Enhanced Product: SN74LVC541A-EP, SN74LVC541A-EP
•Military: SN54LVC541A
NOTE: Qualified Version Definitions:
•Catalog - TI's standard catalog product
•Automotive - Q100 devices qualified for high-reliability automotive applications targeting zero defects
•Enhanced Product - Supports Defense, Aerospace and Medical Applications
•Military - QML certified for Military and Defense Applications
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device Package
Type Package
Drawing Pins SPQ Reel
Diameter
(mm)
Reel
Width
W1 (mm)
A0
(mm) B0
(mm) K0
(mm) P1
(mm) W
(mm) Pin1
Quadrant
SN74LVC541ADBR SSOP DB 20 2000 330.0 16.4 8.2 7.5 2.5 12.0 16.0 Q1
SN74LVC541ADGVR TVSOP DGV 20 2000 330.0 12.4 6.9 5.6 1.6 8.0 12.0 Q1
SN74LVC541ADWR SOIC DW 20 2000 330.0 24.4 10.8 13.0 2.7 12.0 24.0 Q1
SN74LVC541ANSR SO NS 20 2000 330.0 24.4 8.2 13.0 2.5 12.0 24.0 Q1
SN74LVC541APWR TSSOP PW 20 2000 330.0 16.4 6.95 7.1 1.6 8.0 16.0 Q1
SN74LVC541APWR TSSOP PW 20 2000 330.0 16.4 6.95 7.1 1.6 8.0 16.0 Q1
SN74LVC541APWRG4 TSSOP PW 20 2000 330.0 16.4 6.95 7.1 1.6 8.0 16.0 Q1
SN74LVC541APWT TSSOP PW 20 250 330.0 16.4 6.95 7.1 1.6 8.0 16.0 Q1
SN74LVC541ARGYR VQFN RGY 20 3000 330.0 12.4 3.8 4.8 1.6 8.0 12.0 Q1
PACKAGE MATERIALS INFORMATION
www.ti.com 14-Jul-2012
Pack Materials-Page 1
*All dimensions are nominal
Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm)
SN74LVC541ADBR SSOP DB 20 2000 367.0 367.0 38.0
SN74LVC541ADGVR TVSOP DGV 20 2000 367.0 367.0 35.0
SN74LVC541ADWR SOIC DW 20 2000 367.0 367.0 45.0
SN74LVC541ANSR SO NS 20 2000 367.0 367.0 45.0
SN74LVC541APWR TSSOP PW 20 2000 367.0 367.0 38.0
SN74LVC541APWR TSSOP PW 20 2000 364.0 364.0 27.0
SN74LVC541APWRG4 TSSOP PW 20 2000 367.0 367.0 38.0
SN74LVC541APWT TSSOP PW 20 250 367.0 367.0 38.0
SN74LVC541ARGYR VQFN RGY 20 3000 367.0 367.0 35.0
PACKAGE MATERIALS INFORMATION
www.ti.com 14-Jul-2012
Pack Materials-Page 2
MECHANICAL DATA
MPDS006C – FEBRUAR Y 1996 – REVISED AUGUST 2000
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
DGV (R-PDSO-G**) PLASTIC SMALL-OUTLINE
24 PINS SHOWN
14
3,70
3,50 4,90
5,10
20
DIM
PINS **
4073251/E 08/00
1,20 MAX
Seating Plane
0,05
0,15
0,25
0,50
0,75
0,23
0,13
112
24 13
4,30
4,50
0,16 NOM
Gage Plane
A
7,90
7,70
382416
4,90
5,103,70
3,50
A MAX
A MIN
6,60
6,20
11,20
11,40
56
9,60
9,80
48
0,08
M
0,07
0,40
0°–8°
NOTES: A. All linear dimensions are in millimeters.
B. This drawing is subject to change without notice.
C. Body dimensions do not include mold flash or protrusion, not to exceed 0,15 per side.
D. Falls within JEDEC: 24/48 Pins – MO-153
14/16/20/56 Pins – MO-194
MECHANICAL DATA
MSSO002E – JANUARY 1995 – REVISED DECEMBER 2001
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
DB (R-PDSO-G**) PLASTIC SMALL-OUTLINE
4040065 /E 12/01
28 PINS SHOWN
Gage Plane
8,20
7,40
0,55
0,95
0,25
38
12,90
12,30
28
10,50
24
8,50
Seating Plane
9,907,90
30
10,50
9,90
0,38
5,60
5,00
15
0,22
14
A
28
1
2016
6,50
6,50
14
0,05 MIN
5,905,90
DIM
A MAX
A MIN
PINS **
2,00 MAX
6,90
7,50
0,65 M
0,15
0°–ā8°
0,10
0,09
0,25
NOTES: A. All linear dimensions are in millimeters.
B. This drawing is subject to change without notice.
C. Body dimensions do not include mold flash or protrusion not to exceed 0,15.
D. Falls within JEDEC MO-150
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