SN54HC138, SN74HC138 3-LINE TO 8-LINE DECODERS/DEMULTIPLEXERS SCLS107E - DECEMBER 1982 - REVISED SEPTEMBER 2003 D Targeted Specifically for High-Speed D D D D D D D Memory Decoders and Data-Transmission Systems Wide Operating Voltage Range of 2 V to 6 V Outputs Can Drive Up To 10 LSTTL Loads Low Power Consumption, 80-A Max ICC Typical tpd = 15 ns 4-mA Output Drive at 5 V Low Input Current of 1 A Max Incorporate Three Enable Inputs to Simplify Cascading and/or Data Reception SN54HC138 . . . J OR W PACKAGE SN74HC138 . . . D, DB, N, NS, OR PW PACKAGE (TOP VIEW) A B C G2A G2B G1 Y7 GND 1 16 2 15 3 14 4 13 5 12 6 11 7 10 8 9 VCC Y0 Y1 Y2 Y3 Y4 Y5 Y6 SN54HC138 . . . FK PACKAGE (TOP VIEW) C G2A NC G2B G1 4 3 2 1 20 19 18 5 17 6 16 7 15 8 14 9 10 11 12 13 Y1 Y2 NC Y3 Y4 Y7 GND NC Y6 Y5 The 'HC138 devices are designed to be used in high-performance memory-decoding or datarouting applications requiring very short propagation delay times. In high-performance memory systems, these decoders can be used to minimize the effects of system decoding. When employed with high-speed memories utilizing a fast enable circuit, the delay times of these decoders and the enable time of the memory are usually less than the typical access time of the memory. This means that the effective system delay introduced by the decoders is negligible. B A NC VCC Y0 description/ordering information NC - No internal connection ORDERING INFORMATION PACKAGE TA PDIP - N SN74HC138N Tube of 40 SN74HC138D Reel of 2500 SN74HC138DR Reel of 250 SN74HC138DT SOP - NS Reel of 2000 SN74HC138NSR HC138 SSOP - DB Reel of 2000 SN74HC138DBR HC138 Tube of 90 SN74HC138PW Reel of 2000 SN74HC138PWR Reel of 250 SN74HC138PWT CDIP - J Tube of 25 SNJ54HC138J SNJ54HC138J CFP - W Tube of 150 SNJ54HC138W SNJ54HC138W LCCC - FK Tube of 55 SNJ54HC138FK SNJ54HC138FK TSSOP - PW -55C 55 C to 125 125C C TOP-SIDE MARKING Tube of 25 SOIC - D -40C 40 C to 85C 85 C ORDERABLE PART NUMBER SN74HC138N HC138 HC138 Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are available at www.ti.com/sc/package. Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. Copyright (c) 2003, Texas Instruments Incorporated PRODUCTION DATA information is current as of publication date. Products conform to specifications per the terms of Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters. On products compliant to MIL-PRF-38535, all parameters are tested unless otherwise noted. On all other products, production processing does not necessarily include testing of all parameters. POST OFFICE BOX 655303 * DALLAS, TEXAS 75265 1 SN54HC138, SN74HC138 3-LINE TO 8-LINE DECODERS/DEMULTIPLEXERS SCLS107E - DECEMBER 1982 - REVISED SEPTEMBER 2003 description/ordering information (continued) The conditions at the binary-select inputs at the three enable inputs select one of eight output lines. Two active-low and one active-high enable inputs reduce the need for external gates or inverters when expanding. A 24-line decoder can be implemented without external inverters, and a 32-line decoder requires only one inverter. An enable input can be used as a data input for demultiplexing applications. FUNCTION TABLE INPUTS ENABLE 2 OUTPUTS SELECT G1 G2A G2B C B A Y0 Y1 Y2 Y3 Y4 Y5 Y6 Y7 X H X X X X H H H H H H H H X X H X X X H H H H H H H H L X X X X X H H H H H H H H H L L L L L L H H H H H H H H L L L L H H L H H H H H H H L L L H L H H L H H H H H H L L L H H H H H L H H H H H L L H L L H H H H L H H H H L L H L H H H H H H L H H H L L H H L H H H H H H L H H L L H H H H H H H H H H L POST OFFICE BOX 655303 * DALLAS, TEXAS 75265 SN54HC138, SN74HC138 3-LINE TO 8-LINE DECODERS/DEMULTIPLEXERS SCLS107E - DECEMBER 1982 - REVISED SEPTEMBER 2003 logic diagram (positive logic) 15 A B C 1 14 Y1 2 13 3 12 11 10 G1 Y0 6 Y2 Y3 Y4 Y5 9 Y6 G2A 4 7 G2B Y7 5 Pin numbers shown are for the D, DB, J, N, NS, PW, and W packages. absolute maximum ratings over operating free-air temperature range (unless otherwise noted) Supply voltage range, VCC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -0.5 V to 7 V Input clamp current, IIK (VI < 0 or VI > VCC) (see Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20 mA Output clamp current, IOK (VO < 0 or VO > VCC) (see Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20 mA Continuous output current, IO (VO = 0 to VCC) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25 mA Continuous current through VCC or GND . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 50 mA Package thermal impedance, JA (see Note 2): D package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 73C/W DB package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 82C/W N package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 67C/W NS package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 64C/W PW package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 108C/W Storage temperature range, Tstg . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -65C to 150C Stresses beyond those listed under "absolute maximum ratings" may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under "recommended operating conditions" is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. NOTES: 1. The input and output voltage ratings may be exceeded if the input and output current ratings are observed. 2. The package thermal impedance is calculated in accordance with JESD 51-7. POST OFFICE BOX 655303 * DALLAS, TEXAS 75265 3 SN54HC138, SN74HC138 3-LINE TO 8-LINE DECODERS/DEMULTIPLEXERS SCLS107E - DECEMBER 1982 - REVISED SEPTEMBER 2003 recommended operating conditions (see Note 3) SN54HC138 VCC Supply voltage VCC = 2 V VIH VCC = 4.5 V High-level High level input voltage VCC = 6 V MIN NOM MAX 2 5 6 Input voltage VO Output voltage TA 5 6 3.15 4.2 0 0 Input transition rise/fall time 2 4.2 VCC = 2 V t/v MAX 3.15 VCC = 6 V VI NOM 1.5 VCC = 4.5 V Low-level Low level input voltage MIN 1.5 VCC = 2 V VIL SN74HC138 0.5 1.35 1.35 1.8 1.8 0 VCC 0 V VCC V 1000 VCC = 4.5 V 500 500 VCC = 6 V 400 400 -55 125 -40 V VCC 1000 Operating free-air temperature V V 0.5 VCC UNIT 85 ns C NOTE 3: All unused inputs of the device must be held at VCC or GND to ensure proper device operation. Refer to the TI application report, Implications of Slow or Floating CMOS Inputs, literature number SCBA004. electrical characteristics over recommended operating free-air temperature range (unless otherwise noted) PARAMETER VOH TEST CONDITIONS 4 MIN 1.998 1.9 1.9 4.499 4.4 4.4 6V 5.9 5.999 5.9 5.9 IOH = -4 mA 4.5 V 3.98 4.3 3.7 3.84 6V 5.48 5.8 5.2 5.34 IOL = 5.2 mA Ci MAX 4.4 IOL = 4 mA VI = VCC or 0, MIN 1.9 VI = VIH or VIL VI = VCC or 0 MAX 2V IOL = 20 A ICC TYP SN74HC138 4.5 V VI = VIH or VIL II MIN SN54HC138 IOH = -20 20 A IOH = -5.2 mA VOL TA = 25C VCC IO = 0 MAX UNIT V 2V 0.002 0.1 0.1 0.1 4.5 V 0.001 0.1 0.1 0.1 6V 0.001 0.1 0.1 0.1 4.5 V 0.17 0.26 0.4 0.33 6V 0.15 0.26 0.4 0.33 6V 0.1 100 1000 1000 nA 8 160 80 A 10 10 10 pF 6V 2 V to 6 V POST OFFICE BOX 655303 3 * DALLAS, TEXAS 75265 V SN54HC138, SN74HC138 3-LINE TO 8-LINE DECODERS/DEMULTIPLEXERS SCLS107E - DECEMBER 1982 - REVISED SEPTEMBER 2003 switching characteristics over recommended operating free-air temperature range, CL = 50 pF (unless otherwise noted) (see Figure 1) PARAMETER FROM (INPUT) TO (OUTPUT) VCC A, B, or C Any Y tpd Enable Any Y tt Any y TA = 25C MIN SN54HC138 MIN SN74HC138 TYP MAX MAX MIN MAX 2V 67 180 270 225 4.5 V 18 36 54 45 6V 15 31 46 38 2V 66 155 235 195 4.5 V 18 31 47 39 6V 15 26 40 33 2V 38 75 110 95 4.5 V 8 15 22 19 6V 6 13 19 16 UNIT ns ns operating characteristics, TA = 25C PARAMETER Cpd TEST CONDITIONS Power dissipation capacitance No load TYP UNIT 85 pF PARAMETER MEASUREMENT INFORMATION From Output Under Test VCC Test Point Input 50% 50% 0V CL = 50 pF (see Note A) tPLH In-Phase Output LOAD CIRCUIT 50% 10% tPHL 90% 90% tr Input 50% 10% 90% 90% tr tPHL VCC 50% 10% 0 V Out-of-Phase Output 90% tf VOLTAGE WAVEFORM INPUT RISE AND FALL TIMES VOH 50% 10% VOL tf tPLH 50% 10% tf 50% 10% 90% VOH VOL tr VOLTAGE WAVEFORMS PROPAGATION DELAY AND OUTPUT TRANSITION TIMES NOTES: A. CL includes probe and test-fixture capacitance. B. Phase relationships between waveforms were chosen arbitrarily. All input pulses are supplied by generators having the following characteristics: PRR 1 MHz, ZO = 50 , tr = 6 ns, tf = 6 ns. C. The outputs are measured one at a time with one input transition per measurement. D. tPLH and tPHL are the same as tpd. Figure 1. Load Circuit and Voltage Waveforms POST OFFICE BOX 655303 * DALLAS, TEXAS 75265 5 PACKAGE OPTION ADDENDUM www.ti.com 18-Oct-2013 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Pins Package Drawing Qty Eco Plan Lead/Ball Finish MSL Peak Temp (2) (6) (3) Op Temp (C) Device Marking (4/5) 5962-8406201VEA ACTIVE CDIP J 16 1 TBD A42 N / A for Pkg Type -55 to 125 5962-8406201VE A SNV54HC138J 5962-8406201VFA ACTIVE CFP W 16 1 TBD A42 N / A for Pkg Type -55 to 125 5962-8406201VF A SNV54HC138W 84062012A ACTIVE LCCC FK 20 1 TBD POST-PLATE N / A for Pkg Type -55 to 125 84062012A SNJ54HC 138FK 8406201EA ACTIVE CDIP J 16 1 TBD A42 N / A for Pkg Type -55 to 125 8406201EA SNJ54HC138J 8406201FA ACTIVE CFP W 16 1 TBD A42 N / A for Pkg Type -55 to 125 8406201FA SNJ54HC138W JM38510/65802B2A ACTIVE LCCC FK 20 1 TBD POST-PLATE N / A for Pkg Type -55 to 125 JM38510/ 65802B2A JM38510/65802BEA ACTIVE CDIP J 16 1 TBD A42 N / A for Pkg Type -55 to 125 JM38510/ 65802BEA JM38510/65802BFA NRND CFP W 16 1 TBD A42 N / A for Pkg Type -55 to 125 JM38510/ 65802BFA M38510/65802B2A ACTIVE LCCC FK 20 1 TBD POST-PLATE N / A for Pkg Type -55 to 125 JM38510/ 65802B2A M38510/65802BEA ACTIVE CDIP J 16 1 TBD A42 N / A for Pkg Type -55 to 125 JM38510/ 65802BEA M38510/65802BFA NRND CFP W 16 1 TBD A42 N / A for Pkg Type -55 to 125 JM38510/ 65802BFA SN54HC138J ACTIVE CDIP J 16 1 TBD A42 N / A for Pkg Type -55 to 125 SN54HC138J SN74HC138D ACTIVE SOIC D 16 40 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 85 HC138 SN74HC138DBR ACTIVE SSOP DB 16 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 85 HC138 SN74HC138DBRE4 ACTIVE SSOP DB 16 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 85 HC138 SN74HC138DBRG4 ACTIVE SSOP DB 16 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 85 HC138 Addendum-Page 1 Samples PACKAGE OPTION ADDENDUM www.ti.com Orderable Device 18-Oct-2013 Status (1) Package Type Package Pins Package Drawing Qty Eco Plan Lead/Ball Finish MSL Peak Temp (2) (6) (3) Op Temp (C) Device Marking (4/5) SN74HC138DE4 ACTIVE SOIC D 16 40 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 85 HC138 SN74HC138DG4 ACTIVE SOIC D 16 40 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 85 HC138 SN74HC138DR ACTIVE SOIC D 16 2500 Green (RoHS & no Sb/Br) CU NIPDAU | CU SN Level-1-260C-UNLIM -40 to 85 HC138 SN74HC138DRE4 ACTIVE SOIC D 16 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 85 HC138 SN74HC138DRG4 ACTIVE SOIC D 16 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 85 HC138 SN74HC138DT ACTIVE SOIC D 16 250 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 85 HC138 SN74HC138DTE4 ACTIVE SOIC D 16 250 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 85 HC138 SN74HC138DTG4 ACTIVE SOIC D 16 250 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 85 HC138 SN74HC138N ACTIVE PDIP N 16 25 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type -40 to 85 SN74HC138N SN74HC138N3 OBSOLETE PDIP N 16 TBD Call TI Call TI -40 to 85 SN74HC138NE4 ACTIVE PDIP N 16 25 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type -40 to 85 SN74HC138N SN74HC138NSR ACTIVE SO NS 16 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 85 HC138 SN74HC138NSRG4 ACTIVE SO NS 16 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 85 HC138 SN74HC138PW ACTIVE TSSOP PW 16 90 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 85 HC138 SN74HC138PWE4 ACTIVE TSSOP PW 16 90 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 85 HC138 SN74HC138PWG4 ACTIVE TSSOP PW 16 90 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 85 HC138 SN74HC138PWLE OBSOLETE TSSOP PW 16 TBD Call TI Call TI -40 to 85 SN74HC138PWR ACTIVE TSSOP PW 16 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 85 HC138 SN74HC138PWRE4 ACTIVE TSSOP PW 16 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 85 HC138 Addendum-Page 2 Samples PACKAGE OPTION ADDENDUM www.ti.com Orderable Device 18-Oct-2013 Status (1) Package Type Package Pins Package Drawing Qty Eco Plan Lead/Ball Finish MSL Peak Temp (2) (6) (3) Op Temp (C) Device Marking (4/5) SN74HC138PWRG4 ACTIVE TSSOP PW 16 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 85 HC138 SN74HC138PWT ACTIVE TSSOP PW 16 250 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 85 HC138 SN74HC138PWTE4 ACTIVE TSSOP PW 16 250 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 85 HC138 SN74HC138PWTG4 ACTIVE TSSOP PW 16 250 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 85 HC138 SNJ54HC138FK ACTIVE LCCC FK 20 1 TBD POST-PLATE N / A for Pkg Type -55 to 125 84062012A SNJ54HC 138FK SNJ54HC138J ACTIVE CDIP J 16 1 TBD A42 N / A for Pkg Type -55 to 125 8406201EA SNJ54HC138J SNJ54HC138W ACTIVE CFP W 16 1 TBD A42 N / A for Pkg Type -55 to 125 8406201FA SNJ54HC138W (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) (3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. (4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device. Addendum-Page 3 Samples PACKAGE OPTION ADDENDUM www.ti.com 18-Oct-2013 (5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation of the previous line and the two combined represent the entire Device Marking for that device. (6) Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish value exceeds the maximum column width. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. 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OTHER QUALIFIED VERSIONS OF SN54HC138, SN54HC138-SP, SN74HC138 : * Catalog: SN74HC138, SN54HC138 * Automotive: SN74HC138-Q1, SN74HC138-Q1 * Military: SN54HC138 * Space: SN54HC138-SP NOTE: Qualified Version Definitions: * Catalog - TI's standard catalog product * Automotive - Q100 devices qualified for high-reliability automotive applications targeting zero defects * Military - QML certified for Military and Defense Applications * Space - Radiation tolerant, ceramic packaging and qualified for use in Space-based application Addendum-Page 4 PACKAGE MATERIALS INFORMATION www.ti.com 5-Oct-2013 TAPE AND REEL INFORMATION *All dimensions are nominal Device Package Package Pins Type Drawing SPQ Reel Reel A0 Diameter Width (mm) (mm) W1 (mm) B0 (mm) K0 (mm) P1 (mm) W Pin1 (mm) Quadrant SN74HC138DBR SSOP DB 16 2000 330.0 16.4 8.2 6.6 2.5 12.0 16.0 Q1 SN74HC138DR SOIC D 16 2500 330.0 16.8 6.5 10.3 2.1 8.0 16.0 Q1 SN74HC138DRG4 SOIC D 16 2500 330.0 16.4 6.5 10.3 2.1 8.0 16.0 Q1 SN74HC138PWR TSSOP PW 16 2000 330.0 12.4 6.9 5.6 1.6 8.0 12.0 Q1 SN74HC138PWT TSSOP PW 16 250 330.0 12.4 6.9 5.6 1.6 8.0 12.0 Q1 Pack Materials-Page 1 PACKAGE MATERIALS INFORMATION www.ti.com 5-Oct-2013 *All dimensions are nominal Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) SN74HC138DBR SSOP DB 16 2000 367.0 367.0 38.0 SN74HC138DR SOIC D 16 2500 364.0 364.0 27.0 SN74HC138DRG4 SOIC D 16 2500 333.2 345.9 28.6 SN74HC138PWR TSSOP PW 16 2000 367.0 367.0 35.0 SN74HC138PWT TSSOP PW 16 250 367.0 367.0 35.0 Pack Materials-Page 2 MECHANICAL DATA MSSO002E - JANUARY 1995 - REVISED DECEMBER 2001 DB (R-PDSO-G**) PLASTIC SMALL-OUTLINE 28 PINS SHOWN 0,38 0,22 0,65 28 0,15 M 15 0,25 0,09 8,20 7,40 5,60 5,00 Gage Plane 1 14 0,25 A 0-8 0,95 0,55 Seating Plane 2,00 MAX 0,10 0,05 MIN PINS ** 14 16 20 24 28 30 38 A MAX 6,50 6,50 7,50 8,50 10,50 10,50 12,90 A MIN 5,90 5,90 6,90 7,90 9,90 9,90 12,30 DIM 4040065 /E 12/01 NOTES: A. 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