DATA SH EET
Product specification
Supersedes data of 1998 Jul 29 2003 May 14
INTEGRATED CIRCUITS
74LVC541A
Octal buffer/line driver with 5 V
tolerant inputs/outputs (3-state)
2003 May 14 2
Philips Semiconductors Product specification
Octal buffer/line driver with 5 V
tolerant inputs/outputs (3-state) 74LVC541A
FEATURES
•5 V tolerant inputs/outputs; for interfacing with 5 V logic
•Wide supply voltage range from 2.7 to 3.6 V
•CMOS low-power consumption
•Direct interface with TTL levels
•Complies with JEDEC standard no. 8-1A
•ESD protection:
HBM EIA/JESD22-A114-A exceeds 2000 V
MM EIA/JESD22-A115-A exceeds 200 V.
DESCRIPTION
The 74LVC541A is a high performance, low-power,
low-voltage, Si-gate CMOS device and superior to most
advanced CMOS compatible TTL families.
Inputs can be driven from either 3.3 or 5 V devices. In
3-state operation, outputs can handle 5 V. This feature
allows the use of these devices as translators in a mixed
3.3 and 5 V environment.
The 74LVC541A is an octal non-inverting buffer/line driver
with 5 V tolerant inputs/outputs. The 3-state outputs are
controlled by the output enable inputs OE1and OE2.
QUICK REFERENCE DATA
GND = 0 V; Tamb =25°C; tr=t
f≤2.5 ns.
Notes
1. CPD is used to determine the dynamic power dissipation (PDin µW).
PD=C
PD ×VCC2×fi×N+Σ(CL×VCC2×fo) where:
fi= input frequency in MHz;
fo= output frequency in MHz;
CL= output load capacitance in pF;
VCC = supply voltage in Volts;
N = total load switching outputs;
Σ(CL×VCC2×fo) = sum of the outputs.
2. The condition is VI= GND to VCC.
SYMBOL PARAMETER CONDITIONS TYPICAL UNIT
tPHL/tPLH propagation delay; An to Yn CL= 50 pF; VCC = 3.3 V 3.3 ns
CIinput capacitance 5.0 pF
CPD power dissipation capacitance per buffer notes 1 and 2 20 pF
2003 May 14 3
Philips Semiconductors Product specification
Octal buffer/line driver with 5 V
tolerant inputs/outputs (3-state) 74LVC541A
FUNCTION TABLE
See note 1.
Note
1. H = HIGH voltage level;
L = LOW voltage level;
X = don’t care;
Z = high-impedance OFF-state.
ORDERING INFORMATION
INPUT OUTPUT
OE1 OE2 An Yn
LLLL
LLHH
XHXZ
HXXZ
TYPE NUMBER TEMPERATURE RANGE PACKAGE
PINS PACKAGE MATERIAL CODE
74LVC541AD −40 to +85 °C 20 SO20 plastic SOT163-1
74LVC541ADB −40 to +85 °C 20 SSOP20 plastic SOT339-1
74LVC541APW −40 to +85 °C 20 TSSOP20 plastic SOT360-1
74LVC541ABQ −40 to +85 °C 20 DHVQFN20 plastic SOT764-1
PINNING
PIN SYMBOL DESCRIPTION
1OE1 output enable input
(active LOW)
2 A0 data input
3 A1 data input
4 A2 data input
5 A3 data input
6 A4 data input
7 A5 data input
8 A6 data input
9 A7 data input
10 GND ground (0 V)
11 Y7 bus output
12 Y6 bus output
13 Y5 bus output
14 Y4 bus output
15 Y3 bus output
16 Y2 bus output
17 Y1 bus output
18 Y0 bus output
19 OE2 output enable input
(active LOW)
20 VCC supply voltage
PIN SYMBOL DESCRIPTION
2003 May 14 4
Philips Semiconductors Product specification
Octal buffer/line driver with 5 V
tolerant inputs/outputs (3-state) 74LVC541A
handbook, halfpage
OE1
A0
A1
A2
A3
A4
541
A5
A6
A7
GND
VCC
OE2
Y0
Y1
Y3
Y4
Y2
Y5
Y6
Y7
1
2
3
4
5
6
7
8
9
10 11
12
20
19
18
17
16
15
14
13
MNA897
Fig.1 Pin configuration SO20 and (T)SSOP20.
handbook, halfpage
1
2
3
4
5
6
7
8
9
A0
A1
A2
A3
A4
A5
A6
A7
19
18
17
16
15
14
13
12
OE2
Y0
Y1
Y2
Y3
Y4
Y5
Y6
20
OE1 VCC
10 11
GND
Top view Y7
GND(1)
MDB202
Fig.2 Pin configuration DHVQFN20.
(1) The die substrate is attached to this pad using conductive die
attach material. It can not be used as a supply pin or input.
Fig.3 Logic Symbol (IEEE/IEC).
handbook, halfpage
MNA898
911
12
13
14
15
16
2
3
4
5
6
7
8
18
17
19
1&EN
2003 May 14 5
Philips Semiconductors Product specification
Octal buffer/line driver with 5 V
tolerant inputs/outputs (3-state) 74LVC541A
handbook, halfpage
2
3
4
5
6
7
8
9
18
17
16
15
14
13
12
11
1
19
A0
A1
A2
A3
A4
A5
A6
A7
Y0
Y1
Y2
Y3
Y4
Y5
Y6
Y7
OE1
OE2
MNA899
Fig.4 Logic symbol.
handbook, halfpage
2
3
4
5
6
7
8
9
18
17
16
15
14
13
12
11
1
19
A0
A1
A2
A3
A4
A5
A6
A7
Y0
Y1
Y2
Y3
Y4
Y5
Y6
Y7
OE1
OE2
MNA900
Fig.5 Functional diagram.
2003 May 14 6
Philips Semiconductors Product specification
Octal buffer/line driver with 5 V
tolerant inputs/outputs (3-state) 74LVC541A
RECOMMENDED OPERATING CONDITIONS
LIMITING VALUES
In accordance with the Absolute Maximum Rating System (IEC 60134); voltages are referenced to GND (ground = 0 V).
Notes
1. The input and output voltage ratings may be exceeded if the input and output current ratings are observed.
2. For SO20 packages: above 70 °C the value of Ptot derates linearly with 8 mW/K.
For (T)SSOP20 packages: above 60 °C the value of Ptot derates linearly with 5.5 mW/K.
For DHVQFN20 packages: above 60 °C the value of Ptot derates linearly with 4.5 mW/K.
SYMBOL PARAMETER CONDITIONS MIN. MAX. UNIT
VCC supply voltage for maximum speed performance 2.7 3.6 V
for low-voltage applications 1.2 3.6 V
VIinput voltage 0 5.5 V
VOoutput voltage output HIGH or LOW state 0 VCC V
output 3-state 0 5.5 V
Tamb operating ambient temperature in free air −40 +85 °C
tr, tfinput rise and fall times VCC = 1.2 to 2.7 V 0 20 ns/V
VCC = 2.7 to 3.6 V 0 10 ns/V
SYMBOL PARAMETER CONDITIONS MIN. MAX. UNIT
VCC supply voltage −0.5 +6.5 V
IIK input diode current VI<0 −−50 mA
VIinput voltage note 1 −0.5 +5.5 V
IOK output diode current VO>V
CC or VO<0 −±50 mA
VOoutput voltage output HIGH or LOW state; note 1 −0.5 VCC + 0.5 V
output 3-state; note 1 −0.5 +6.5 V
IOoutput diode source or sink current VO=0toV
CC −±50 mA
ICC, IGND VCC or GND current −±100 mA
Tstg storage temperature −60 +150 °C
Ptot power dissipation Tamb =−40 to +125 °C; note 2 −500 mW
2003 May 14 7
Philips Semiconductors Product specification
Octal buffer/line driver with 5 V
tolerant inputs/outputs (3-state) 74LVC541A
DC CHARACTERISTICS
At recommended operating conditions; voltages are referenced to GND (ground=0V).
Notes
1. All typical values are measured at VCC = 3.3 V and Tamb =25°C.
2. The specified overdrive current at the data input forces the data input to the opposite logic input state.
SYMBOL PARAMETER TEST CONDITIONS MIN. TYP.(1) MAX. UNIT
OTHER VCC (V)
Tamb =−40 to +85 °C
VIH HIGH-level input
voltage 1.2 VCC −−V
2.7 to 3.6 2.0 −−V
V
IL LOW-level input voltage 1.2 −−GND V
2.7 to 3.6 −−0.8 V
VOH HIGH-level output
voltage VI=V
IH or VIL
IO=−12 mA 2.7 VCC −0.5 −−V
I
O
=−100 µA 3.0 VCC −0.2 VCC −V
IO=−18 mA 3.0 VCC −0.6 −−V
I
O
=−24 mA 3.0 VCC −0.8 −−V
V
OL LOW-level output
voltage VI=V
IH or VIL
IO=12mA 2.7 −−0.40 V
IO= 100 µA 3.0 −−0.20 V
IO=24mA 3.0 −−0.55 V
ILI input leakage current VI= 5.5 Vor GND;
note 2 3.6 −±0.1 ±5µA
IOZ 3-state output
OFF-state current VI=V
IH or VIL;
VO= 5.5 Vor GND 3.6 −0.1 ±5µA
Ioff power-off leakage
supply current VIor VO= 5.5 V 0.0 −−±10 µA
ICC quiescent supply
current VI=V
CC or GND;
IO=0 3.6 −0.1 10 µA
∆ICC additional quiescent
supply current per input
pin
VI=V
CC −0.6 V;
IO=0 2.7 to 3.6 −5 500 µA
2003 May 14 8
Philips Semiconductors Product specification
Octal buffer/line driver with 5 V
tolerant inputs/outputs (3-state) 74LVC541A
AC CHARACTERISTICS
GND = 0 V; tr=t
f≤2.5 ns; CL=50pF.
Note
1. All typical values are measured at Tamb =25°C; typical values given for VCC = 3.0 to 3.6 V are measured at
VCC = 3.3 V.
AC WAVEFORMS
SYMBOL PARAMETER TEST CONDITIONS MIN. TYP.(1) MAX. UNIT
WAVEFORMS VCC (V)
Tamb =−40 to +85 °C
tPHL/tPLH propagation delay An to Yn see Figs 6 and 8 1.2 −14 −ns
2.7 1.5 3.9 6.6 ns
3.0 to 3.6 1.5 3.3 5.6 ns
tPZH/tPZL 3-state output enable time
OEn to Yn see Figs 7 and 8 1.2 −2.2 −ns
2.7 1.5 5.2 8.4 ns
3.0 to 3.6 1.5 4.4 7.4 ns
tPHZ/tPLZ 3-state output disable time
OEn to Yn see Figs 7 and 8 1.2 −11 −ns
2.7 1.5 4.3 7.0 ns
3.0 to 3.6 1.5 3.8 6.0 ns
handbook, halfpage
MNA901
An input
Yn output
tPHL tPLH
GND
VI
VM
VM
VOH
VOL
Fig.6 Input (An) to output (Yn) propagation delays.
VM= 1.5 V at VCC ≥2.7 V.
VM= 0.5 VCC at VCC < 2.7 V.
VOL and VOH are typical output voltage drop that occur with the output load.
2003 May 14 9
Philips Semiconductors Product specification
Octal buffer/line driver with 5 V
tolerant inputs/outputs (3-state) 74LVC541A
handbook, full pagewidth
MNA902
tPLZ
tPHZ
outputs
disabled outputs
enabled
VY
VX
outputs
enabled
output
LOW-to-OFF
OFF-to-LOW
output
HIGH-to-OFF
OFF-to-HIGH
OEn input
VOL
VOH
VCC
VI
VM
GND
GND
tPZL
tPZH
VM
VM
Fig.7 3-state enable and disable times.
VM= 1.5 V at VCC ≥2.7 V.
VM= 0.5 VCC at VCC < 2.7 V.
VX=V
OL + 0.3 V at VCC ≥2.7 V; VX=V
OL + 0.1 VCC at VCC < 2.7 V.
VY=V
OH −0.3 V at VCC ≥2.7 V; VY=V
OH −0.1 VCC at VCC < 2.7 V.
VOL and VOH are typical output voltage drop that occur with the output load.
handbook, full pagewidth
open
GND
50 pF
2 × VCC
VCC
VIVO
MNA903
D.U.T.
CL
RT500 Ω
500 Ω
PULSE
GENERATOR
S1
Fig.8 Load circuitry for switching times.
Definitions for test circuits:
CL= load capacitance including jig and probe capacitance.
RT= termination resistance should be equal to Zo of the pulse generator.
TEST S1
tPLH/tPHL open
tPLZ/tPZL 2×VCC
tPHZ/tPZH GND
VCC VI
<2.7 V VCC
2.7 to 3.6 V 2.7 V
2003 May 14 10
Philips Semiconductors Product specification
Octal buffer/line driver with 5 V
tolerant inputs/outputs (3-state) 74LVC541A
PACKAGE OUTLINES
UNIT A
max. A1A2A3bpcD
(1) E(1) (1)
eH
ELL
pQZ
ywv θ
REFERENCES
OUTLINE
VERSION EUROPEAN
PROJECTION ISSUE DATE
IEC JEDEC JEITA
mm
inches
2.65 0.3
0.1 2.45
2.25 0.49
0.36 0.32
0.23 13.0
12.6 7.6
7.4 1.27 10.65
10.00 1.1
1.0 0.9
0.4 8
0
o
o
0.25 0.1
DIMENSIONS (inch dimensions are derived from the original mm dimensions)
Note
1. Plastic or metal protrusions of 0.15 mm (0.006 inch) maximum per side are not included.
1.1
0.4
SOT163-1
10
20
wM
bp
detail X
Z
e
11
1
D
y
0.25
075E04 MS-013
pin 1 index
0.1 0.012
0.004 0.096
0.089 0.019
0.014 0.013
0.009 0.51
0.49 0.30
0.29 0.05
1.4
0.055
0.419
0.394 0.043
0.039 0.035
0.016
0.01
0.25
0.01 0.004
0.043
0.016
0.01
0 5 10 mm
scale
X
θ
A
A1
A2
HE
Lp
Q
E
c
L
vMA
(A )
3
A
SO20: plastic small outline package; 20 leads; body width 7.5 mm SOT163-1
99-12-27
03-02-19
2003 May 14 11
Philips Semiconductors Product specification
Octal buffer/line driver with 5 V
tolerant inputs/outputs (3-state) 74LVC541A
UNIT A1A2A3bpcD
(1) E(1) eH
ELL
pQ(1)
Zywv θ
REFERENCES
OUTLINE
VERSION EUROPEAN
PROJECTION ISSUE DATE
IEC JEDEC JEITA
mm 0.21
0.05 1.80
1.65 0.38
0.25 0.20
0.09 7.4
7.0 5.4
5.2 0.65 7.9
7.6 0.9
0.7 0.9
0.5 8
0
o
o
0.131.25 0.2 0.1
DIMENSIONS (mm are the original dimensions)
Note
1. Plastic or metal protrusions of 0.2 mm maximum per side are not included.
1.03
0.63
SOT339-1 MO-150 99-12-27
03-02-19
X
wM
θ
A
A1
A2
bp
D
HE
Lp
Q
detail X
E
Z
e
c
L
vMA
(A )
3
A
110
20 11
y
0.25
pin 1 index
0 2.5 5 mm
scale
SSOP20: plastic shrink small outline package; 20 leads; body width 5.3 mm SOT339-1
A
max.
2
2003 May 14 12
Philips Semiconductors Product specification
Octal buffer/line driver with 5 V
tolerant inputs/outputs (3-state) 74LVC541A
UNIT A1A2A3bpcD
(1) E(2) (1)
eH
ELL
pQZywv θ
REFERENCES
OUTLINE
VERSION EUROPEAN
PROJECTION ISSUE DATE
IEC JEDEC JEITA
mm 0.15
0.05 0.95
0.80 0.30
0.19 0.2
0.1 6.6
6.4 4.5
4.3 0.65 6.6
6.2 0.4
0.3 0.5
0.2 8
0
o
o
0.13 0.10.21
DIMENSIONS (mm are the original dimensions)
Notes
1. Plastic or metal protrusions of 0.15 mm maximum per side are not included.
2. Plastic interlead protrusions of 0.25 mm maximum per side are not included.
0.75
0.50
SOT360-1 MO-153 99-12-27
03-02-19
wM
bp
D
Z
e
0.25
110
20 11
pin 1 index
θ
A
A1
A2
Lp
Q
detail X
L
(A )
3
HE
E
c
vMA
X
A
y
0 2.5 5 mm
scale
TSSOP20: plastic thin shrink small outline package; 20 leads; body width 4.4 mm SOT360-1
A
max.
1.1
2003 May 14 13
Philips Semiconductors Product specification
Octal buffer/line driver with 5 V
tolerant inputs/outputs (3-state) 74LVC541A
terminal 1
index area
0.51
A1Eh
b
UNIT ye
0.2
c
REFERENCES
OUTLINE
VERSION EUROPEAN
PROJECTION ISSUE DATE
IEC JEDEC JEITA
mm 4.6
4.4
Dh
3.15
2.85
y1
2.6
2.4 1.15
0.85
e1
3.5
0.30
0.18
0.05
0.00 0.05 0.1
DIMENSIONS (mm are the original dimensions)
SOT764-1 MO-241 - - -- - -
0.5
0.3
L
0.1
v
0.05
w
0 2.5 5 mm
scale
SOT764-1
DHVQFN20: plastic dual in-line compatible thermal enhanced very thin quad flat package; no leads;
20 terminals; body 2.5 x 4.5 x 0.85 mm
A(1)
max.
AA1c
detail X
y
y1C
e
L
Eh
Dh
e
e1
b
29
19 12
11
10
1
20
X
D
E
C
BA
terminal 1
index area
AC
CB
vM
wM
E(1)
Note
1. Plastic or metal protrusions of 0.075 mm maximum per side are not included.
D(1)
02-10-17
03-01-27
2003 May 14 14
Philips Semiconductors Product specification
Octal buffer/line driver with 5 V
tolerant inputs/outputs (3-state) 74LVC541A
SOLDERING
Introduction to soldering surface mount packages
Thistextgivesaverybrief insight to acomplextechnology.
A more in-depth account of soldering ICs can be found in
our
“Data Handbook IC26; Integrated Circuit Packages”
(document order number 9398 652 90011).
There is no soldering method that is ideal for all surface
mount IC packages. Wave soldering can still be used for
certainsurfacemountICs,butitisnotsuitableforfinepitch
SMDs. In these situations reflow soldering is
recommended.
Reflow soldering
Reflow soldering requires solder paste (a suspension of
fine solder particles, flux and binding agent) to be applied
tothe printed-circuit boardbyscreen printing,stencillingor
pressure-syringe dispensing before package placement.
Driven by legislation and environmental forces the
worldwide use of lead-free solder pastes is increasing.
Several methods exist for reflowing; for example,
convection or convection/infrared heating in a conveyor
type oven. Throughput times (preheating, soldering and
cooling) vary between 100 and 200 seconds depending
on heating method.
Typical reflow peak temperatures range from
215 to 270 °C depending on solder paste material. The
top-surface temperature of the packages should
preferably be kept:
•below 220 °C (SnPb process) or below 245 °C (Pb-free
process)
– for all the BGA packages
– for packages with a thickness ≥2.5 mm
– for packages with a thickness < 2.5 mm and a
volume ≥350 mm3 so called thick/large packages.
•below 235 °C (SnPb process) or below 260 °C (Pb-free
process) for packages with a thickness < 2.5 mm and a
volume < 350 mm3 so called small/thin packages.
Moisture sensitivity precautions, as indicated on packing,
must be respected at all times.
Wave soldering
Conventional single wave soldering is not recommended
forsurfacemountdevices(SMDs)orprinted-circuitboards
with a high component density, as solder bridging and
non-wetting can present major problems.
To overcome these problems the double-wave soldering
method was specifically developed.
If wave soldering is used the following conditions must be
observed for optimal results:
•Use a double-wave soldering method comprising a
turbulent wave with high upward pressure followed by a
smooth laminar wave.
•For packages with leads on two sides and a pitch (e):
– larger than or equal to 1.27 mm, the footprint
longitudinal axis is preferred to be parallel to the
transport direction of the printed-circuit board;
– smaller than 1.27 mm, the footprint longitudinal axis
must be parallel to the transport direction of the
printed-circuit board.
The footprint must incorporate solder thieves at the
downstream end.
•Forpackageswithleadsonfoursides,thefootprintmust
be placed at a 45°angle to the transport direction of the
printed-circuit board. The footprint must incorporate
solder thieves downstream and at the side corners.
During placement and before soldering, the package must
be fixed with a droplet of adhesive. The adhesive can be
applied by screen printing, pin transfer or syringe
dispensing. The package can be soldered after the
adhesive is cured.
Typical dwell time of the leads in the wave ranges from
3 to 4 seconds at 250 °C or 265 °C, depending on solder
material applied, SnPb or Pb-free respectively.
A mildly-activated flux will eliminate the need for removal
of corrosive residues in most applications.
Manual soldering
Fix the component by first soldering two
diagonally-opposite end leads. Use a low voltage (24 V or
less) soldering iron applied to the flat part of the lead.
Contact time must be limited to 10 seconds at up to
300 °C.
When using a dedicated tool, all other leads can be
soldered in one operation within 2 to 5 seconds between
270 and 320 °C.
2003 May 14 15
Philips Semiconductors Product specification
Octal buffer/line driver with 5 V
tolerant inputs/outputs (3-state) 74LVC541A
Suitability of surface mount IC packages for wave and reflow soldering methods
Notes
1. Formoredetailed information onthe BGA packagesreferto the
“(LF)BGAApplication Note
”(AN01026);order a copy
from your Philips Semiconductors sales office.
2. All surface mount (SMD) packages are moisture sensitive. Depending upon the moisture content, the maximum
temperature (with respect to time) and body size of the package, there is a risk that internal or external package
cracks may occur due to vaporization of the moisture in them (the so called popcorn effect). For details, refer to the
Drypack information in the
“Data Handbook IC26; Integrated Circuit Packages; Section: Packing Methods”
.
3. These packages are not suitable for wave soldering. On versions with the heatsink on the bottom side, the solder
cannot penetrate between the printed-circuit board and the heatsink. On versions with the heatsink on the top side,
the solder might be deposited on the heatsink surface.
4. If wave soldering is considered, then the package must be placed at a 45° angle to the solder wave direction.
The package footprint must incorporate solder thieves downstream and at the side corners.
5. Wave soldering is suitable for LQFP, TQFP and QFP packages with a pitch (e) larger than 0.8 mm; it is definitely not
suitable for packages with a pitch (e) equal to or smaller than 0.65 mm.
6. Wave soldering is suitable for SSOP, TSSOP, VSO and VSSOP packages with a pitch (e) equal to or larger than
0.65 mm; it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.5 mm.
PACKAGE(1) SOLDERING METHOD
WAVE REFLOW(2)
BGA, LBGA, LFBGA, SQFP, TFBGA, VFBGA not suitable suitable
DHVQFN, HBCC, HBGA, HLQFP, HSQFP, HSOP, HTQFP,
HTSSOP, HVQFN, HVSON, SMS not suitable(3) suitable
PLCC(4), SO, SOJ suitable suitable
LQFP, QFP, TQFP not recommended(4)(5) suitable
SSOP, TSSOP, VSO, VSSOP not recommended(6) suitable
2003 May 14 16
Philips Semiconductors Product specification
Octal buffer/line driver with 5 V
tolerant inputs/outputs (3-state) 74LVC541A
DATA SHEET STATUS
Notes
1. Please consult the most recently issued data sheet before initiating or completing a design.
2. The product status of the device(s) described in this data sheet may have changed since this data sheet was
published. The latest information is available on the Internet at URL http://www.semiconductors.philips.com.
3. For data sheets describing multiple type numbers, the highest-level product status determines the data sheet status.
LEVEL DATA SHEET
STATUS(1) PRODUCT
STATUS(2)(3) DEFINITION
I Objective data Development This data sheet contains data from the objective specification for product
development. Philips Semiconductors reserves the right to change the
specification in any manner without notice.
II Preliminary data Qualification This data sheet contains data from the preliminary specification.
Supplementary data will be published at a later date. Philips
Semiconductors reserves the right to change the specification without
notice, in order to improve the design and supply the best possible
product.
III Product data Production This data sheet contains data from the product specification. Philips
Semiconductors reserves the right to make changes at any time in order
to improve the design, manufacturing and supply. Relevant changes will
be communicated via a Customer Product/Process Change Notification
(CPCN).
DEFINITIONS
Short-form specification The data in a short-form
specification is extracted from a full data sheet with the
same type number and title. For detailed information see
the relevant data sheet or data handbook.
Limiting values definition Limiting values given are in
accordance with the Absolute Maximum Rating System
(IEC 60134). Stress above one or more of the limiting
values may cause permanent damage to the device.
These are stress ratings only and operation of the device
attheseorat any otherconditionsabovethosegiven in the
Characteristics sections of the specification is not implied.
Exposure to limiting values for extended periods may
affect device reliability.
Application information Applications that are
described herein for any of these products are for
illustrative purposes only. Philips Semiconductors make
norepresentationorwarrantythatsuchapplicationswillbe
suitable for the specified use without further testing or
modification.
DISCLAIMERS
Life support applications These products are not
designed for use in life support appliances, devices, or
systems where malfunction of these products can
reasonably be expected to result in personal injury. Philips
Semiconductorscustomersusingorsellingtheseproducts
for use in such applications do so at their own risk and
agree to fully indemnify Philips Semiconductors for any
damages resulting from such application.
Right to make changes Philips Semiconductors
reserves the right to make changes in the products -
including circuits, standard cells, and/or software -
described or contained herein in order to improve design
and/or performance. When the product is in full production
(status ‘Production’), relevant changes will be
communicated via a Customer Product/Process Change
Notification (CPCN). Philips Semiconductors assumes no
responsibility or liability for the use of any of these
products, conveys no licence or title under any patent,
copyright, or mask work right to these products, and
makes no representations or warranties that these
products are free from patent, copyright, or mask work
right infringement, unless otherwise specified.
2003 May 14 17
Philips Semiconductors Product specification
Octal buffer/line driver with 5 V
tolerant inputs/outputs (3-state) 74LVC541A
NOTES
2003 May 14 18
Philips Semiconductors Product specification
Octal buffer/line driver with 5 V
tolerant inputs/outputs (3-state) 74LVC541A
NOTES
2003 May 14 19
Philips Semiconductors Product specification
Octal buffer/line driver with 5 V
tolerant inputs/outputs (3-state) 74LVC541A
NOTES
© Koninklijke Philips Electronics N.V. 2003 SCA75
All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner.
The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed
without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license
under patent- or other industrial or intellectual property rights.
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Contact information
For additional information please visit http://www.semiconductors.philips.com. Fax: +31 40 27 24825
For sales offices addresses send e-mail to: sales.addresses@www.semiconductors.philips.com.
Printed in The Netherlands 613508/02/pp20 Date of release: 2003 May 14 Document order number: 9397 750 10553
