HLMP-Cx08 Series, HLMP-Cx25 Series
HLMP-Cx27 Series, HLMP-C610
T-13/4 (5 mm) AlInGaP Lamps
Data Sheet
Features
High intensity
General purpose leads
Popular 5 mm diameter
Available in bulk, tape and reel, or ammopack
8° or 25° viewing angles
Choice of colors: Amber or Red
Applications
Indoor/outdoor applications
Small store-front signs
Message panels
Road construction barrier lights
Center high mount stop lights
Spoiler, car decorative lighting
Motorcycle/bicycle warning lights
Description
The HLMP-Cx08, HLMP-Cx25, HLMP-Cx27, and HLMP-C610
series are 5 mm lamps specially designed for applications
requir-ing very high on-axis intensity that is not achiev-
able with a standard lamp. These devices are capable of
producing light output over a wide range of drive currents.
Built using AlInGaP technology, they are well suited for
typical 5 mm TS-AlGaAs lamp applica-tions, and have
signi cantly SUPERIOR RELIABILITY than most TS-AlGaAs
lamps in wet/hot environments. These lamps come with
clear non-di used lens and are optically designed to yield
superior light output.
Device Selection
Part Number Stando
Typical Viewing
Angle[1](degrees),
21/2
Luminous Intensity,
Iv (mcd) @ 20 mA
Color
Dominant
Wavelength[2]
Min. Typ.
HLMP-C008-U00xx No 8 2900 6000 Red 626
HLMP-C208-S00xx 8 2600 3000 Amber 590
HLMP-C608-R00xx 8 1000 2000 Red 635
HLMP-C610-R00xx Yes 8 1000 2000 Red 635
HLMP-C025-P00xx No 25 500 1000 Red 626
HLMP-C225-O00xx 25 450 800 Amber 590
HLMP-C625-P00xx 25 500 700 Red 635
HLMP-C027-P00xx Yes 25 500 1000 Red 626
HLMP-C627-P00xx 25 500 700 Red 635
HLMP-C325-P00xx No 25 500 Orange 605
Notes:
1. 1/2 is the o -axis angle at which the luminous intensity is half of the axial luminous intensity.
2. The dominant wavelength, d, is derived from the CIE chromaticity diagram and represents the single wavelength which de nes the color of the
device.
2
Package Dimensions
HLMP-Cx27
6.10 (0.240)
5.46 (0.215)
1.27
(0.050)NOM.
2.54
(0.100)
0.45
(0.018)SQ. NOM.
CATHODE
LEAD
25.40
(1.00) MIN.
NOM.
5.08 (0.200)
4.57 (0.100)
13.55 (0.533)
13.35 (0.525)
0.89 (0.035)
0.64 (0.023)
9.19 (0.362)
8.43 (0.332)
1.32 (0.052)
1.02 (0.040)
6.10 (0.240)
5.46 (0.215)
1.27
(0.050)NOM.
2.54
(0.100)
0.45
(0.018)SQ. NOM.
CATHODE
LEAD
25.40
(1.00) MIN.
NOM.
5.08 (0.200)
4.57 (0.100)
0.89 (0.035)
0.64 (0.023)
9.19 (0.362)
8.43 (0.332)
1.02 (0.004)
MAX. TYP.
1.00 (0.040) MAX. EPOXY MENISCUS
1.00 (0.040) MAX. EPOXY MENISCUS
HLMP-Cx25
HLMP-C610
HLMP-Cx08
6.10 (0.240)
5.46 (0.215)
1.27
(0.050)NOM.
2.54
(0.100)
0.45
(0.018)SQ. NOM.
CATHODE
LEAD
25.40
(1.000)MIN.
NOM.
5.21 (0.205)
4.70 (0.105)
13.50 (0.53)
13.30 (0.52)
1.07 (0.042)
0.56 (0.022)
9.14 (0.360)
8.36 (0.330)
1.32 (0.052)
1.02 (0.040)
6.10 (0.240)
5.46 (0.215)
1.27
(0.050)NOM.
2.54
(0.100)
0.45
(0.018)SQ. NOM.
CATHODE
LEAD
25.40
(1.000)MIN.
NOM.
5.21 (0.205)
4.70 (0.105)
1.07 (0.042)
0.56 (0.022)
9.14 (0.360)
8.36 (0.330)
1.02 (0.004)
MAX. TYP.
1.00 (0.040) MAX. EPOXY MENISCUS
1.00 (0.040) MAX. EPOXY MENISCUS
3
Part Numbering System
HLMP - C x xx - x x x xx
Mechanical Option
00:Bulk
02: Tape & Reel, Straight Leads
DD: Ammo Pack
Color Bin Options
0: Full Color Bin Distribution
Maximum Iv Bin Options
0: Open (no max. limit)
Minimum Iv Bin Options
Please refer to the Iv Bin Table
Viewing Angle & Stando Option
08: 8 degrees, without stando
10: 8 degrees, with stando
25: 25 degrees, without stando
27: 25 degrees, with stando
Color Options
0: AlInGaP Red 626 nm
2: AlInGaP Amber 590 nm
3: AlInGaP Orange 605 nm
6: AlInGaP Red 635 nm
Absolute Maximum Ratings at TA = 25°C
Parameter Absolute Maximum Units
Peak Forward Current 70 mA
Average Forward Current[1] 30 mA
DC Current[2] 50 mA
Reverse Voltage (IR = 100 A) 5V
LED Junction Temperature 110 °C
Operating Temperature Range -40 to +100 °C
Storage Temperature Range -40 to +100 °C
Notes:
1. See Figure 2 to establish pulsed operating conditions.
2. Derate linearly from 50°C at 0.5 mA/°C.
3. The transient peak current is the maximum non-recurring peak current that can be applied to the device without damaging the LED die and
wirebond. It is not recommended that this device be operated at peak currents above the Absolute Maximum Peak Forward Current.
4
Optical/Electrical Characteristics at TA=25°C
Test
Symbol Parameter Device Min. Typ.[3] Max. Units Conditions
21/2 Included Angle Between Half HLMP-C008 8 Deg. IF = 20 mA
Luminous Intensity Points[1] HLMP-C208 8 See Note 1
HLMP-C608 8
HLMP-C025 25
HLMP-C225 25
HLMP-C325 25
HLMP-C625 25
HLMP-C610 8
HLMP-C027 25
HLMP-C627 25
d Dominant Wavelength[2] HLMP-C008 626 nm See Note 2
HLMP-C208 590
HLMP-C608 635
HLMP-C025 626
HLMP-C225 590
HLMP-C325 605
HLMP-C625 635
HLMP-C610 635
HLMP-C027 626
HLMP-C627 635
PEAK Peak Wavelength HLMP-C008 635 nm Measurement at Peak
HLMP-C208 594
HLMP-C608 650
HLMP-C025 635
HLMP-C225 594
HLMP-C325 611
HLMP-C625 650
HLMP-C610 650
HLMP-C027 635
HLMP-C627 650
1/2 Spectral Line Halfwidth 17 nm
s Speed of Response 20 ns
C Capacitance 40 pF VF = 0; f = 1 MHz
RJ-PIN Thermal Resistance 260 °C/W Junction to Cathode Lead
VF Forward Voltage HLMP-C008 1.9 2.4 V IF = 20 mA
HLMP-C208 1.9 2.6
HLMP-C608 1.9 2.2
HLMP-C025 1.9 2.4
HLMP-C225 1.9 2.6
HLMP-C625 1.9 2.2
HLMP-C610 1.9 2.2
HLMP-C027 1.9 2.4
HLMP-C627 1.9 2.2
VR Reverse Breakdown Voltage 5.0 V IR = 100 μA
Notes:
1. 1/2 is the o -axis angle at which the luminous intensity is half of the axial luminous intensity.
2. The dominant wavelength, d, is derived from the CIE chromaticity diagram and represents the single wavelength which de nes the color of the
device.
3. Typical speci cation for reference only. Do not exceed absolute maximum ratings.
5
Figure 1. Relative intensity vs. wavelength.
Figure 2. Maximum tolerable peak current vs. pulse duration. Figure 3. Forward current vs. forward voltage.
Figure 4. Relative luminous intensity vs. forward current.
RATIO OF MAXIMUM TOLERABLE
PEAK CURRENT TO MAXIMUM
TOLERABLE DC CURRENT
1.0 10,000
6
1
tp – PULSE DURATION – µs
1000
5
3
10010
4
2
I
PEAK
– MAX.
I
DC
– MAX.
100 KHz
30 KHz
10 KHz
3 KHz
1 KHz
300 Hz
100 Hz
CURRENT – mA
1.0
0
V
F
– FORWARD VOLTAGE – V
50
40
30
10
2.0 3.0
60
1.5 2.5
20
RED AMBER
RELATIVE LUMINOUS INTENSITY
(NORMALIZED AT 20 mA)
0
0
IF – DC FORWARD CURRENT – mA
2.5
2.0
1.5
0.5
60
3.0
20 40
1.0
WAVELENGTH – nm
RELATIVE INTENSITY
550 600 650 700
1.0
0.5
0
C208
C225
C325
C008
C025
C027
C608
C625
C627
C610
Figure 5. Maximum forward DC current vs. ambient temperature.
FORWARD CURRENT (mA)
0
0
AMBIENT TEMPERATURE (°C)
40
120
60
20 40
20
60 80 100
RθJ-A = 780°C/W
6
Soldering/Cleaning
Cleaning agents from the ketone family (acetone, methyl
ethyl ketone, etc.) and from the chlorinated hydrocarbon
family (methylene chloride, trichloro-ethylene, carbon
tetrachloride, etc.) are not recommended for cleaning LED
parts. All of these various solvents attack or dissolve the
encapsulating epoxies used to form the package of plastic
LED parts.
For information on soldering LEDs, please refer to Applica-
tion Note 1027.
Figure 7. Relative luminous intensity vs. angular displacement for HLMP-Cx25 and HLMP-Cx27.
RELATIVE INTENSITY
1.0
0
ANGULAR DISPLACEMENT – DEGREES
0.8
0.6
0.5
0.7
0.2
-70 -60
0.1
0.3
0.4
-40 0 20 30 50 70 90
0.9
-90 -20-80 -50 -30 -10 10 40 60 80
Figure 6. Relative luminous intensity vs. angular displacement for HLMP-Cx08 and HLMP-Cx10.
RELATIVE INTENSITY
1.0
0
ANGULAR DISPLACEMENT – DEGREES
0.8
0.6
0.5
0.7
0.2
-20 -15
0.1
0.3
0.4
-10 0 5 10 15 20 25
0.9
-25 -5
7
Color Categories
Color Category#
Lambda (nm)
Min. Max.
Orange 2 599 602.5
3 601.5 605
4 603.8 608.2
5 606.8 611.2
Tolerance for each bin limit is ±0.5 nm.
Intensity Bin Limits
Color Bin
Intensity Range (mcd)
Min. Max.
Res/Orange P 540.0 850.0
Q 850.0 1200.0
R 1200.0 1700.0
S 1700.0 2400.0
T 2400.0 3400.0
U 3400.0 4900.0
V 4900.0 7100.0
W 7100.0 10200.0
X 10200.0 14800.0
Y 14800.0 21400.0
Z 21400.0 30900.0
Yellow O 510.0 800.0
P 800.0 1250.0
Q 1250.0 1800.0
R 1800.0 2900.0
S 2900.0 4700.0
T 4700.0 7200.0
U 7200.0 11700.0
V 11700.0 18000.0
W 18000.0 27000.0
Maximum tolerance for each bin limit is ±18%.
Mechanical Option Matrix
Mechanical Option Code De nition
00 Bulk Packaging, minimum increment 500 pcs/bag
02 Tape & Reel, straight leads, minimum increment 1300 pcs/bag
DD Ammo Pack, straight leads with minimum increment 2K/pack
Note:
All categories are established for classi cation of products. Products may not be available in all categories. Please contact your local Avago
representative for further clari cation/information.
8
Precautions:
Lead Forming:
The leads of an LED lamp may be preformed or cut to
length prior to insertion and soldering on PC board.
For better control, it is recommended to use proper
tool to precisely form and cut the leads to applicable
length rather than doing it manually.
If manual lead cutting is necessary, cut the leads after
the soldering process. The solder connection forms a
mechanical ground which prevents mechanical stress
due to lead cutting from traveling into LED package.
This is highly recommended for hand solder operation,
as the excess lead length also acts as small heat sink.
Soldering and Handling:
Care must be taken during PCB assembly and soldering
process to prevent damage to the LED component.
LED component may be e ectively hand soldered
to PCB. However, it is only recommended under
unavoidable circumstances such as rework. The closest
manual soldering distance of the soldering heat source
(soldering iron’s tip) to the body is 1.59mm. Soldering
the LED using soldering iron tip closer than 1.59mm
might damage the LED.
ESD precaution must be properly applied on the
soldering station and personnel to prevent ESD
damage to the LED component that is ESD sensitive.
Do refer to Avago application note AN 1142 for details.
The soldering iron used should have grounded tip to
ensure electrostatic charge is properly grounded.
Recommended soldering condition:
Wave Manual Solder
Soldering[1],[2] Dipping
Pre-heat Temperature 105°C Max. –
Pre-heat Time 60 sec Max. –
Peak Temperature 250°C Max. 260°C Max.
Dwell Time 3 sec Max. 5 sec Max.
Note:
1. Above conditions refers to measurement with thermocouple
mounted at the bottom of PCB.
2. It is recommended to use only bottom preheaters in order to
reduce thermal stress experienced by LED.
LED Component Plated Through
Lead Size Diagonal Hole Diameter
0.45 x 0.45 mm 0.636 mm 0.98 to 1.08 mm
(0.018 x 0.018 inch) (0.025 inch) (0.039 to 0.043 inch)
0.50 x 0.50 mm 0.707 mm 1.05 to 1.15 mm
(0.020 x 0.020 inch) (0.028 inch) (0.041 to 0.045 inch)
Wave soldering parameters must be set and maintained
according to the recommended temperature and dwell
time. Customer is advised to perform daily check on the
soldering pro le to ensure that it is always conforming
to recommended soldering conditions.
Note:
1. PCB with di erent size and design (component density) will have
di erent heat mass (heat capacity). This might cause a change in
temperature experienced by the board if same wave soldering
setting is used. So, it is recommended to re-calibrate the soldering
pro le again before loading a new type of PCB.
2. Customer is advised to take extra precaution during wave
soldering to ensure that the maximum wave temperature does
not exceed 250°C and the solder contact time does not exceeding
3sec. Over-stressing the LED during soldering process might
cause premature failure to the LED due to delamination.
Any alignment xture that is being applied during
wave soldering should be loosely tted and should
not apply weight or force on LED. Non metal material
is recommended as it will absorb less heat during wave
soldering process.
At elevated temperature, LED is more susceptible to
mechanical stress. Therefore, PCB must allowed to cool
down to room temperature prior to handling, which
includes removal of alignment xture or pallet.
If PCB board contains both through hole (TH) LED and
other surface mount components, it is recommended
that surface mount components be soldered on the
top side of the PCB. If surface mount need to be on the
bottom side, these components should be soldered
using re ow soldering prior to insertion the TH LED.
Recommended PC board plated through holes (PTH)
size for LED component leads.
Over-sizing the PTH can lead to twisted LED after
clinching. On the other hand under sizing the PTH can
cause di culty inserting the TH LED.
Refer to application note AN5334 for more information
about soldering and handling of TH LED lamps.
1.59 mm
9
Example of Wave Soldering Temperature Pro le for TH LED
0 10 20 30 40 50 60 70 80 90 100
250
200
150
100
50
TIME (MINUTES)
PREHEAT
TURBULENT WAVE LAMINAR
HOT AIR KNIFE
TEMPERATURE (°C)
Recommended solder:
Sn63 (Leaded solder alloy)
SAC305 (Lead free solder alloy)
Flux: Rosin ux
Solder bath temperature:
245°C± 5°C (maximum peak temperature = 250°C)
Dwell time: 1.5 sec – 3.0 sec (maximum = 3sec)
Note: Allow for board to be suciently cooled to
room temperature before exerting mechanical force.
Ammo Packs Drawing
10
Packaging Label:
(i) Avago Mother Label: (Available on packaging box of ammo pack and shipping box)
(1P) Item: Part Number
(1T) Lot: Lot Number
LPN:
(9D)MFG Date: Manufacturing Date
(P) Customer Item:
(V) Vendor ID:
DeptID: Made In: Country of Origin
(Q) QTY: Quantity
CAT: Intensity Bin
BIN: Color Bin
(9D) Date Code: Date Code
STANDARD LABEL LS0002
RoHS Compliant
e3 max temp 250C
Packaging Box for Ammo Packs
Note: The dimension for ammo pack is applicable for the device with stando and without stando .
For product information and a complete list of distributors, please go to our web site: www.avagotech.com
Avago, Avago Technologies, and the A logo are trademarks of Avago Technologies in the United States and other countries.
Data subject to change. Copyright © 2005-2012 Avago Technologies. All rights reserved.
AV02-0965EN - March 13, 2012
(ii) Avago Baby Label (Only available on bulk packaging)
(1P) PART #: Part Number
(1T) LOT #: Lot Number
(9D)MFG DATE: Manufacturing Date
C/O: Country of Origin
Customer P/N:
Supplier Code:
QUANTITY: Packing Quantity
CAT: Intensity Bin
BIN: Color Bin
DATECODE: Date Code
RoHS Compliant
e3 max tem
p
250C
Lam
p
s Bab
y
Label
