HLMP-Cx08 Series, HLMP-Cx25 Series HLMP-Cx27 Series, HLMP-C610 T-13/4 (5 mm) AlInGaP Lamps Data Sheet Description Features The HLMP-Cx08, HLMP-Cx25, HLMP-Cx27, and HLMP-C610 series are 5 mm lamps specially designed for applications requir-ing very high on-axis intensity that is not achievable with a standard lamp. These devices are capable of producing light output over a wide range of drive currents. High intensity Built using AlInGaP technology, they are well suited for typical 5 mm TS-AlGaAs lamp applica-tions, and have significantly SUPERIOR RELIABILITY than most TS-AlGaAs lamps in wet/hot environments. These lamps come with clear non-diffused lens and are optically designed to yield superior light output. 8 or 25 viewing angles General purpose leads Popular 5 mm diameter Available in bulk, tape and reel, or ammopack Choice of colors: Amber or Red Applications Indoor/outdoor applications Small store-front signs Message panels Road construction barrier lights Center high mount stop lights Spoiler, car decorative lighting Motorcycle/bicycle warning lights Device Selection Part Number Standoff Typical Viewing Angle[1](degrees), 21/2 HLMP-C008-U00xx No Luminous Intensity, Iv (mcd) @ 20 mA Min. Typ. Color Dominant Wavelength[2] 8 2900 6000 Red 626 HLMP-C208-S00xx 8 2600 3000 Amber 590 HLMP-C608-R00xx 8 1000 2000 Red 635 HLMP-C610-R00xx Yes 8 1000 2000 Red 635 HLMP-C025-P00xx No 25 500 1000 Red 626 HLMP-C225-O00xx 25 450 800 Amber 590 HLMP-C625-P00xx 25 500 700 Red 635 25 500 1000 Red 626 25 500 700 Red 635 25 500 Orange 605 HLMP-C027-P00xx Yes HLMP-C627-P00xx HLMP-C325-P00xx No Notes: 1. 1/2 is the off-axis angle at which the luminous intensity is half of the axial luminous intensity. 2. The dominant wavelength, d, is derived from the CIE chromaticity diagram and represents the single wavelength which defines the color of the device. Package Dimensions HLMP-Cx27 1.07 (0.042) 0.56 (0.022) 6.10 (0.240) 5.46 (0.215) 1.00 (0.040) MAX. EPOXY MENISCUS 1.32 (0.052) 1.02 (0.040) 0.45 SQ. NOM. (0.018) 5.21 (0.205) 4.70 (0.105) 2.54 NOM. (0.100) CATHODE LEAD 9.14 (0.360) 8.36 (0.330) 1.27 NOM. (0.050) 13.50 (0.53) 13.30 (0.52) 25.40 MIN. (1.000) HLMP-Cx25 6.10 (0.240) 5.46 (0.215) 1.07 (0.042) 0.56 (0.022) 1.00 (0.040) MAX. EPOXY MENISCUS 0.45 SQ. NOM. (0.018) 1.02 (0.004) MAX. TYP. 5.21 (0.205) 4.70 (0.105) 2.54 NOM. (0.100) CATHODE LEAD 9.14 (0.360) 8.36 (0.330) 1.27 NOM. (0.050) 25.40 MIN. (1.000) HLMP-C610 0.89 (0.035) 0.64 (0.023) 6.10 (0.240) 5.46 (0.215) 1.00 (0.040) MAX. EPOXY MENISCUS 0.45 SQ. NOM. (0.018) 1.32 (0.052) 1.02 (0.040) 5.08 (0.200) 4.57 (0.100) 2.54 NOM. (0.100) CATHODE LEAD 9.19 (0.362) 8.43 (0.332) 1.27 NOM. (0.050) 13.55 (0.533) 13.35 (0.525) 25.40 MIN. (1.00) HLMP-Cx08 0.89 (0.035) 0.64 (0.023) 6.10 (0.240) 5.46 (0.215) 1.00 (0.040) MAX. EPOXY MENISCUS 0.45 SQ. NOM. (0.018) 1.02 (0.004) MAX. TYP. 5.08 (0.200) 4.57 (0.100) 2.54 NOM. (0.100) 9.19 (0.362) 8.43 (0.332) CATHODE LEAD 1.27 NOM. (0.050) 25.40 MIN. (1.00) 2 Part Numbering System HLMP - C x xx - x x x xx Mechanical Option 00:Bulk 02: Tape & Reel, Straight Leads DD: Ammo Pack Color Bin Options 0: Full Color Bin Distribution Maximum Iv Bin Options 0: Open (no max. limit) Minimum Iv Bin Options Please refer to the Iv Bin Table Viewing Angle & Standoff Option 08: 8 degrees, without standoff 10: 8 degrees, with standoff 25: 25 degrees, without standoff 27: 25 degrees, with standoff Color Options 0: AlInGaP Red 626 nm 2: AlInGaP Amber 590 nm 3: AlInGaP Orange 605 nm 6: AlInGaP Red 635 nm Absolute Maximum Ratings at TA = 25C Parameter Absolute Maximum Units Peak Forward Current 70 mA Average Forward Current[1] 30 mA DC Current[2] 50 mA Reverse Voltage (IR = 100 A) 5 V LED Junction Temperature 110 C Operating Temperature Range -40 to +100 C Storage Temperature Range -40 to +100 C Notes: 1. See Figure 2 to establish pulsed operating conditions. 2. Derate linearly from 50C at 0.5 mA/C. 3. The transient peak current is the maximum non-recurring peak current that can be applied to the device without damaging the LED die and wirebond. It is not recommended that this device be operated at peak currents above the Absolute Maximum Peak Forward Current. 3 Optical/Electrical Characteristics at TA=25C Min. Typ.[3] Parameter Device 21/2 Included Angle Between Half Luminous Intensity Points[1] HLMP-C008 HLMP-C208 HLMP-C608 HLMP-C025 HLMP-C225 HLMP-C325 HLMP-C625 HLMP-C610 HLMP-C027 HLMP-C627 8 8 8 25 25 25 25 8 25 25 Deg. IF = 20 mA See Note 1 d Dominant Wavelength[2] HLMP-C008 HLMP-C208 HLMP-C608 HLMP-C025 HLMP-C225 HLMP-C325 HLMP-C625 HLMP-C610 HLMP-C027 HLMP-C627 626 590 635 626 590 605 635 635 626 635 nm See Note 2 PEAK Peak Wavelength HLMP-C008 HLMP-C208 HLMP-C608 HLMP-C025 HLMP-C225 HLMP-C325 HLMP-C625 HLMP-C610 HLMP-C027 HLMP-C627 635 594 650 635 594 611 650 650 635 650 nm Measurement at Peak 1/2 Spectral Line Halfwidth 17 nm s Speed of Response 20 ns C Capacitance 40 pF VF = 0; f = 1 MHz RJ-PIN Thermal Resistance 260 C/W Junction to Cathode Lead VF Forward Voltage V IF = 20 mA VR Reverse Breakdown Voltage V IR = 100 A HLMP-C008 HLMP-C208 HLMP-C608 HLMP-C025 HLMP-C225 HLMP-C625 HLMP-C610 HLMP-C027 HLMP-C627 1.9 1.9 1.9 1.9 1.9 1.9 1.9 1.9 1.9 5.0 Max. 2.4 2.6 2.2 2.4 2.6 2.2 2.2 2.4 2.2 Units Test Conditions Symbol Notes: 1. 1/2 is the off-axis angle at which the luminous intensity is half of the axial luminous intensity. 2. The dominant wavelength, d, is derived from the CIE chromaticity diagram and represents the single wavelength which defines the color of the device. 3. Typical specification for reference only. Do not exceed absolute maximum ratings. 4 1.0 C008 C025 C027 RELATIVE INTENSITY C208 C225 C325 C608 C625 C627 C610 0.5 0 550 600 650 700 WAVELENGTH - nm 60 5 50 CURRENT - mA 4 3 100 300 Hz z Hz z 1 KH 3 KH Hz Hz 10 K KHz 2 30 K IPEAK - MAX. IDC - MAX. 6 100 RATIO OF MAXIMUM TOLERABLE PEAK CURRENT TO MAXIMUM TOLERABLE DC CURRENT Figure 1. Relative intensity vs. wavelength. 1 1.0 10 100 1000 AMBER 20 0 1.0 10,000 2.5 3.0 Figure 3. Forward current vs. forward voltage. FORWARD CURRENT (mA) 60 2.5 2.0 1.5 1.0 0.5 0 2.0 1.5 VF - FORWARD VOLTAGE - V tp - PULSE DURATION - s 3.0 RELATIVE LUMINOUS INTENSITY (NORMALIZED AT 20 mA) RED 30 10 Figure 2. Maximum tolerable peak current vs. pulse duration. 0 20 40 60 IF - DC FORWARD CURRENT - mA Figure 4. Relative luminous intensity vs. forward current. 5 40 40 RJ-A = 780C/W 20 0 0 20 40 60 80 100 120 AMBIENT TEMPERATURE (C) Figure 5. Maximum forward DC current vs. ambient temperature. Soldering/Cleaning Cleaning agents from the ketone family (acetone, methyl ethyl ketone, etc.) and from the chlorinated hydrocarbon family (methylene chloride, trichloro-ethylene, carbon tetrachloride, etc.) are not recommended for cleaning LED parts. All of these various solvents attack or dissolve the encapsulating epoxies used to form the package of plastic LED parts. For information on soldering LEDs, please refer to Application Note 1027. 1.0 RELATIVE INTENSITY 0.9 0.8 0.7 0.6 0.5 0.4 0.3 0.2 0.1 0 -25 -20 -15 -10 -5 0 5 10 15 20 25 ANGULAR DISPLACEMENT - DEGREES Figure 6. Relative luminous intensity vs. angular displacement for HLMP-Cx08 and HLMP-Cx10. 1.0 RELATIVE INTENSITY 0.9 0.8 0.7 0.6 0.5 0.4 0.3 0.2 0.1 0 -90 -80 -70 -60 -50 -40 -30 -20 -10 0 10 20 30 40 50 60 70 80 90 ANGULAR DISPLACEMENT - DEGREES Figure 7. Relative luminous intensity vs. angular displacement for HLMP-Cx25 and HLMP-Cx27. 6 Intensity Bin Limits Color Res/Orange Yellow Bin Color Categories Intensity Range (mcd) Min. Max. Color Category# Min. Max. Orange 2 599 602.5 3 601.5 605 4 603.8 608.2 5 606.8 611.2 P 540.0 850.0 Q 850.0 1200.0 R 1200.0 1700.0 S 1700.0 2400.0 T 2400.0 3400.0 U 3400.0 4900.0 V 4900.0 7100.0 W 7100.0 10200.0 X 10200.0 14800.0 Y 14800.0 21400.0 Z 21400.0 30900.0 O 510.0 800.0 P 800.0 1250.0 Q 1250.0 1800.0 R 1800.0 2900.0 S 2900.0 4700.0 T 4700.0 7200.0 U 7200.0 11700.0 V 11700.0 18000.0 W 18000.0 27000.0 Lambda (nm) Tolerance for each bin limit is 0.5 nm. Maximum tolerance for each bin limit is 18%. Mechanical Option Matrix Mechanical Option Code Definition 00 Bulk Packaging, minimum increment 500 pcs/bag 02 Tape & Reel, straight leads, minimum increment 1300 pcs/bag DD Ammo Pack, straight leads with minimum increment 2K/pack Note: All categories are established for classification of products. Products may not be available in all categories. Please contact your local Avago representative for further clarification/information. 7 Precautions: Lead Forming: The leads of an LED lamp may be preformed or cut to length prior to insertion and soldering on PC board. For better control, it is recommended to use proper tool to precisely form and cut the leads to applicable length rather than doing it manually. If manual lead cutting is necessary, cut the leads after the soldering process. The solder connection forms a mechanical ground which prevents mechanical stress due to lead cutting from traveling into LED package. This is highly recommended for hand solder operation, as the excess lead length also acts as small heat sink. Soldering and Handling: Care must be taken during PCB assembly and soldering process to prevent damage to the LED component. LED component may be effectively hand soldered to PCB. However, it is only recommended under unavoidable circumstances such as rework. The closest manual soldering distance of the soldering heat source (soldering iron's tip) to the body is 1.59mm. Soldering the LED using soldering iron tip closer than 1.59mm might damage the LED. 1.59 mm ESD precaution must be properly applied on the soldering station and personnel to prevent ESD damage to the LED component that is ESD sensitive. Do refer to Avago application note AN 1142 for details. The soldering iron used should have grounded tip to ensure electrostatic charge is properly grounded. Note: 1. PCB with different size and design (component density) will have different heat mass (heat capacity). This might cause a change in temperature experienced by the board if same wave soldering setting is used. So, it is recommended to re-calibrate the soldering profile again before loading a new type of PCB. 2. Customer is advised to take extra precaution during wave soldering to ensure that the maximum wave temperature does not exceed 250C and the solder contact time does not exceeding 3sec. Over-stressing the LED during soldering process might cause premature failure to the LED due to delamination. Any alignment fixture that is being applied during wave soldering should be loosely fitted and should not apply weight or force on LED. Non metal material is recommended as it will absorb less heat during wave soldering process. At elevated temperature, LED is more susceptible to mechanical stress. Therefore, PCB must allowed to cool down to room temperature prior to handling, which includes removal of alignment fixture or pallet. If PCB board contains both through hole (TH) LED and other surface mount components, it is recommended that surface mount components be soldered on the top side of the PCB. If surface mount need to be on the bottom side, these components should be soldered using reflow soldering prior to insertion the TH LED. Recommended PC board plated through holes (PTH) size for LED component leads. LED Component Lead Size Diagonal Plated Through Hole Diameter Manual Solder Dipping 0.45 x 0.45 mm (0.018 x 0.018 inch) 0.636 mm (0.025 inch) 0.98 to 1.08 mm (0.039 to 0.043 inch) Pre-heat Temperature 105C Max. - Pre-heat Time 60 sec Max. - 0.50 x 0.50 mm (0.020 x 0.020 inch) 0.707 mm (0.028 inch) 1.05 to 1.15 mm (0.041 to 0.045 inch) Peak Temperature 250C Max. 260C Max. Dwell Time 3 sec Max. 5 sec Max. Recommended soldering condition: Wave Soldering[1],[2] Note: 1. Above conditions refers to measurement with thermocouple mounted at the bottom of PCB. 2. It is recommended to use only bottom preheaters in order to reduce thermal stress experienced by LED. 8 Wave soldering parameters must be set and maintained according to the recommended temperature and dwell time. Customer is advised to perform daily check on the soldering profile to ensure that it is always conforming to recommended soldering conditions. Over-sizing the PTH can lead to twisted LED after clinching. On the other hand under sizing the PTH can cause difficulty inserting the TH LED. Refer to application note AN5334 for more information about soldering and handling of TH LED lamps. Example of Wave Soldering Temperature Profile for TH LED Recommended solder: Sn63 (Leaded solder alloy) SAC305 (Lead free solder alloy) LAMINAR HOT AIR KNIFE TURBULENT WAVE 250 Flux: Rosin flux Solder bath temperature: 245C 5C (maximum peak temperature = 250C) TEMPERATURE (C) 200 Dwell time: 1.5 sec - 3.0 sec (maximum = 3sec) 150 Note: Allow for board to be sufficiently cooled to room temperature before exerting mechanical force. 100 50 PREHEAT 0 10 20 Ammo Packs Drawing 9 30 40 50 60 TIME (MINUTES) 70 80 90 100 Packaging Box for Ammo Packs Note: The dimension for ammo pack is applicable for the device with standoff and without standoff. Packaging Label: (i) Avago Mother Label: (Available on packaging box of ammo pack and shipping box) (1P) Item: Part Number STANDARD LABEL LS0002 RoHS Compliant e3 max temp 250C (1T) Lot: Lot Number (Q) QTY: Quantity LPN: CAT: Intensity Bin (9D)MFG Date: Manufacturing Date BIN: Color Bin (P) Customer Item: 10 (V) Vendor ID: (9D) Date Code: Date Code DeptID: Made In: Country of Origin (ii) Avago Baby Label (Only available on bulk packaging) Lamps Baby Label (1P) PART #: Part Number RoHS Compliant e3 max temp 250C (1T) LOT #: Lot Number (9D)MFG DATE: Manufacturing Date QUANTITY: Packing Quantity C/O: Country of Origin Customer P/N: CAT: Intensity Bin Supplier Code: BIN: Color Bin DATECODE: Date Code For product information and a complete list of distributors, please go to our web site: www.avagotech.com Avago, Avago Technologies, and the A logo are trademarks of Avago Technologies in the United States and other countries. Data subject to change. Copyright (c) 2005-2012 Avago Technologies. All rights reserved. AV02-0965EN - March 13, 2012