Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) Commercial "L" Series, SnPb Termination, X7R Dielectric 6.3V - 250 VDC (Commercial Grade) Overview KEMET's Commercial "L" Series with Tin/Lead Termination surface mount capacitors in X7R dielectric are designed to meet the needs of critical applications where tin/lead end metallization is required. KEMET's tin/lead electroplating process is designed to meet a 5% minimum lead content and address concerns for a more robust and reliable lead containing termination system. As the bulk of the electronics industry moves towards RoHS compliance, KEMET continues to provide tin/lead terminated products for military, aerospace and industrial applications and will ensure customers have a stable and long-term source of supply. KEMET's X7R dielectric features a 125C maximum operating temperature and is considered "temperature stable." The Electronics Components, Assemblies & Materials Association (EIA) characterizes X7R dielectric as a Class II material. Components of this classification are fixed, ceramic dielectric capacitors suited for bypass and decoupling applications or for frequency discriminating circuits where Q and stability of capacitance characteristics are not critical. X7R exhibits a predictable change in capacitance with respect to time and voltage and boasts a minimal change in capacitance with reference to ambient temperature. Capacitance change is limited to 15% from -55C to +125C. Benefits * * * * -55C to +125C operating temperature range Temperature stable dielectric Reliable and robust termination system EIA 0402, 0603, 0805, 1206, 1210, 1808, 1812, 1825, 2220, and 2225 case sizes * DC voltage ratings of 6.3 V, 10 V, 16 V, 25 V, 50 V, 100 V, 200 V, and 250 V * Capacitance offerings ranging from 150 pF to 22 F * Available capacitance tolerances of 5%, 10%, and 20% * * * * Non-polar device, minimizing installation concerns SnPb plated termination finish (5% min) Flexible termination option available upon request Available for other surface mount products, additional dielectrics and higher voltage ratings upon request Ordering Information 1 2 C 1206 C 226 K 8 R Ceramic Case Size (L" x W") Specification/ Series Capacitance Code (pF) Capacitance Tolerance Voltage Dielectric 0402 0603 0805 1206 1210 1808 1812 1825 2220 2225 C = Standard 2 Significant Digits + Number of Zeros 9 = 6.3 V 8 = 10 V 4 = 16 V 3 = 25 V 6 = 35 V 5 = 50 V 1 = 100 V 2 = 200 V A = 250 V R = X7R J = 5% K = 10% M = 20% A C Failure Rate/ Termination Finish1 Design A = N/A L = SnPb (5% min) TU Packaging/Grade (C-Spec)2 Blank = Bulk TU = 7" Reel Unmarked TM = 7" Reel Marked Additional termination finish options may be available. Contact KEMET for details Additional reeling or packaging options may be available. Contact KEMET for details. One WORLD One Brand One Strategy One Focus One Team (c) KEMET Electronics Corporation * P.O. Box 5928 * Greenville, SC 29606 (864) 963-6300 * www.kemet.com One KEMET C1018_X7R_SnPb_SMD * 6/11/2012 1 Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) Commercial "L" Series, SnPb Termination, X7R Dielectric, 6.3 - 250 VDC (Commercial Grade) Dimensions - Millimeters (Inches) W 100% Tin or SnPb Plate L B T Nickel Plate S EIA Size Code Metric Size Code L Length 0402 0603 0805 1206 1210 1808 1812 1825 2220 2225 1005 1608 2012 3216 3225 4520 4532 4564 5650 5664 1.00 (.040) 0.05 (.002) 1.60 (.063) 0.15 (.006) 2.00 (.079) 0.20 (.008) 3.20 (.126) 0.20 (.008) 3.20 (.126) 0.20 (.008) 4.70 (.185) 0.50 (.020) 4.50 (.177) 0.30 (.012) 4.50 (.177) 0.30 (.012) 5.70 (.224) 0.40 (.016) 5.60 (.220) 0.40 (.016) W Width T Thickness 0.50 (.020) 0.05 (.002) 0.80 (.032) 0.15 (.006) 1.25 (.049) 0.20 (.008) 1.60 (.063) 0.20 (.008) 2.50 (.098) 0.20 (.008) See Table 2 for Thickness 2.00 (.079) 0.20 (.008) 3.20 (.126) 0.30 (.012) 6.40 (.252) 0.40 (.016) 5.00 (.197) 0.40 (.016) 6.40 (.248) 0.40 (.016) Conductive Metalization Electrodes B Bandwidth 0.30 (.012) 0.10 (.004) 0.35 (.014) 0.15 (.006) 0.50 (0.02) 0.25 (.010) 0.50 (0.02) 0.25 (.010) 0.50 (0.02) 0.25 (.010) 0.60 (.024) 0.35 (.014) 0.60 (.024) 0.35 (.014) 0.60 (.024) 0.35 (.014) 0.60 (.024) 0.35 (.014) 0.60 (.024) 0.35 (.014) S Separation Minimum 0.30 (.012) 0.70 (.028) 0.75 (.030) N/A Mounting Technique Solder Reflow Only Solder Wave or Solder Reflow Solder Reflow Only Applications Typical applications include military, aerospace and other high reliability applications. Qualification/Certification Commercial Grade products are subject to internal qualification. Details regarding test methods and conditions are referenced in Table 4, Performance & Reliability. Environmental Compliance These devices do not meet RoHS criteria due to the concentration of Pb containment in the termination finish (c) KEMET Electronics Corporation * P.O. Box 5928 * Greenville, SC 29606 (864) 963-6300 * www.kemet.com C1018_X7R_SnPb_SMD * 6/11/2012 2 Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) Commercial "L" Series, SnPb Termination, X7R Dielectric, 6.3 - 250 VDC (Commercial Grade) Electrical Parameters/Characteristics Item Parameters/Characteristics Operating Temperature Range Capacitance Change with Reference to +25C and 0 VDC Applied (TCC) Aging Rate (Maximum % Capacitance Loss/Decade Hour) Dielectric Withstanding Voltage (DWV) Dissipation Factor (DF) Maximum Limit @ 25C Insulation Resistance (IR) Limit @ 25C -55C to +125C 15% 3.0% 250% of rated voltage (5 1 seconds and charge/discharge not exceeding 50 mA) 5%(10 V), 3.5%(16 V and 25 V) and 2.5%(50 V to 250 V) See Insulation Resistance Limit Table (Rated voltage applied for 120 5 seconds @ 25C) Regarding aging rate: Capacitance measurements (including tolerance) are indexed to a referee time of 1000 Hours. To obtain IR limit, divide M-F value by the capacitance and compare to G limit. Select the lower of the two limits. Capacitance and dissipation factor (DF) measured under the following conditions: 1 kHz 50 Hz and 1.0 0.2 Vrms if capacitance 10 F 120 Hz 10 Hz and 0.5 0.1 Vrms if capacitance > 10 F Note: When measuring capacitance it is important to ensure the set voltage level is held constant. The HP4284 and Agilent E4980 have a feature known as Automatic Level Control (ALC). The ALC feature should be switched to "ON." Post Environmental Limits High Temperature Life, Biased Humidity, Moisture Resistance Dielectric Rated DC Voltage Capacitance Value Dissipation Factor (Maximum %) > 25 X7R 16/25 Capacitance Shift Insulation Resistance 20% 10% of Initial Limit 3.0 All < 16 5.0 7.5 Insulation Resistance Limit Table (X7R Dielectric) EIA Case Size 0201 0402 0603 0805 1206 1210 1808 1812 1825 2220 2225 1,000 Megohm Microfarads or 100 G N/A < 0.012 F < 0.047 F < 0.047 F < 0.22 F < 0.39 F ALL < 2.2 F ALL < 10 F ALL 500 Megohm Microfarads or 10 G ALL 0.012 F 0.047 F 0.047 F 0.22 F 0.39 F N/A 2.2 F N/A 10 F N/A (c) KEMET Electronics Corporation * P.O. Box 5928 * Greenville, SC 29606 (864) 963-6300 * www.kemet.com C1018_X7R_SnPb_SMD * 6/11/2012 3 Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) Commercial "L" Series, SnPb Termination, X7R Dielectric, 6.3 - 250 VDC (Commercial Grade) Table 1A - Capacitance Range/Selection Waterfall (0402 - 1206 Case Sizes) 3 5 9 8 4 3 5 1 2 9 8 4 3 6 5 1 2 A 9 8 4 3 6 5 1 2 A 6.3 10 16 25 50 100 200 6.3 10 16 25 35 50 100 200 250 6.3 10 16 25 35 50 100 200 250 10 4 M M M M M M M M M M M M M M M M M M M M M M M M M M M M M M M M M M M M M M M M M M M M M BB BB BB BB BB BB BB BB BB BB BB BB BB BB BB BB BB BB BB BB BB BB BB BB BB BB BB BB BB BB BB BB Voltage DC 16 8 10 9 25 C1206 Voltage DC 6.3 Voltage Code 9 8 4 Series C0402 C0603 EB EB EB EB EB EB EB EB EB EB EC EC EB EB EB EB EC EC EC EC EM EG EG EG EB EB EB EB EB EB EB EB EB EB EB ED ED ED ED EM EG EG 250 5 1 2 A EB EB EB EB EB EB EB EB ED ED ED ED EM EH 1 2 A 9 8 4 3 6 C0805 EB EB EB EB EB EB EB EB EB EB EB EB EB EB EB EB EC EC EC EC EC EC EC EC EC ED ED ED EH EH EH EH 200 EB EB EB EB EB EB EB EB EB EB EB EB EB EB EB EB EC EC EC EC EC EC EC EC EC ED ED ED EH EH EH EH 5 (c) KEMET Electronics Corporation * P.O. Box 5928 * Greenville, SC 29606 (864) 963-6300 * www.kemet.com Roll Over for Order Info. EB EB EB EB EB EB EB EB EB EB EB EB EB EB EB EB EC EC EC EC EB EB EB EC ED EE EF EG EG EG EF EF EH EH EH EH 50 6 EB EB EB EB EB EB EB EB EB EB EB EB EB EB EB EB EC EC EC EC EB EB EB EC ED EE EF EF ED ED ED ED EN ED EF EF EH EH EH EH 25 3 EB EB EB EB EB EB EB EB EB EB EB EB EB EB EB EB EC EC EC EC EB EB EB EC ED EE EF EF ED ED ED ED EN ED EF EF EH EH EH EH 35 4 DC DC DC DC DC DC EB EB EB EB EB EB EB EB EB EB EB EB EB EB EB EB EC EC EC EC EB EB EB EC ED EE EF EF ED ED ED ED EN ED EF EF EH EH EH EH 16 8 DC DC DC DC DC DC DC DC DE DE DE DG DG 10 9 DC DC DC DC DC DC DC DC DD DD DD DE DE DE DE DE DG DG DG DG 6.3 2 DC DC DC DC DC DC DC DC DC DC DC DC DD DD DD DC DD DD DG DG DD DD DE DE DH DH 250 1 DC DC DC DC DC DC DC DC DC DC DC DC DD DD DD DC DD DD DG DG DD DD DE DE DH DH 200 5 DC DC DC DC DC DC DC DC DC DC DC DC DD DD DD DC DC DC DC DC DD DG DG DD DG DG DG DG 50 DC DC DC DC DC DC DC DC DC DC DC DC DD DD DD DC DC DC DC DC DD DG DG DD DD DD DD DD DE DG DG DG 100 DC DC DC DC DC DC DC DC DC DC DC DC DD DD DD DC DC DC DC DC DD DG DG DD DD DD DD DD DE DG DG DG 25 3 DC DC DC DC DC DC DC DC DC DC DC DC DD DD DD DC DC DC DC DC DD DG DG DD DD DD DD DD DE DG DG DG 35 4 CB CB CB CB 16 8 CB CB CB CB CB CB CB CB CB CB CB CB 10 9 CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CD 6.3 5 CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CD 200 3 CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB 50 CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB 100 CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB 16 BB BB BB BB BB BB BB BB 25 BB BB BB BB BB BB BB BB BB BB BB BB 10 BB BB BB BB BB BB BB BB BB BB BB BB BB BB BB BB 100 Product Availability and Chip Thickness Codes - See Table 2 for Chip Thickness Dimensions 6.3 K K K K K K K K K K K K K K K K K K K K K K K K K K K K K K K K K K K K K K K K K K K K K 25 J J J J J J J J J J J J J J J J J J J J J J J J J J J J J J J J J J J J J J J J J J J J J 50 Cap Cap Code C0805 Voltage Code Cap Tolerance 10 - 91 pF 100 - 910 100 - 150 pF 101 - 820 180 - 820 pF 181 1,000 - 10,000 pF 102 - 103 12,000 pF 123 15,000 pF 153 18,000 pF 183 22,000 pF 223 27,000 pF 273 33,000 pF 333 39,000 pF 393 47,000 pF 473 56,000 pF 563 68,000 pF 683 82,000 pF 823 0.1 uF 104 0.12 uF 124 0.15 uF 154 0.18 uF 184 0.22 uF 224 0.27 uF 274 0.33 uF 334 0.39 uF 394 0.47 uF 474 0.56 uF 564 0.68 uF 684 0.82 uF 824 1 uF 105 1.2 uF 125 1.5 uF 155 1.8 uF 185 2.2 uF 225 2.7 uF 275 3.3 uF 335 3.9 uF 395 4.7 uF 475 5.6 uF 565 6.8 uF 685 8.2 uF 825 10 uF 106 12 uF 126 15 uF 156 18 uF 186 22 uF 226 47 uF 476 C0603 50 C0402 16 Series 6.3 Cap Cap Code C1206 C1018_X7R_SnPb_SMD * 6/11/2012 4 Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) Commercial "L" Series, SnPb Termination, X7R Dielectric, 6.3 - 250 VDC (Commercial Grade) Table 1B - Capacitance Range/Selection Waterfall (1210 - 2225 Case Sizes) 1 2 A 5 1 2 A 250 25 5 JE JE JE JE JE JE JE JE JB JB JB JB JB JC JC JC JC JC JC JC JC JC JC JC JC JC JC JC JC JD JF JF JO FM FM JO JO FS FS JO Voltage DC Voltage Code 9 8 4 KE KE KE KE KE KE KE KE KE KE KE KE KE KE KE KE KE KC KC KC KC KC KB KB KB KB KB KB KB KB KB KC KD KD KC KC KC KC KC KC KC KC KC KC KC KC KD KE KC KC KC KC KC KC KC KC KD KD KD KE KE KE KC KC KC KC KC KC KC KC KD KD KD KE KE KE A JE JE JE JE JE JE JE JE JB JB JB JB JB JC JC JC JC JC JC JC JC JC JC JC JD JF JF JC JC JC JC JC JC JC JC JC JC JD JD JF JF JC JC JC JC JC JC JC JC JC JC JD JD JF JF 1 2 A 5 1 2 GK GK A 5 C1808 C1812 (c) KEMET Electronics Corporation * P.O. Box 5928 * Greenville, SC 29606 (864) 963-6300 * www.kemet.com Roll Over for Order Info. 25 2 50 1 250 5 100 3 200 2 50 1 250 5 200 A 50 50 2 100 250 1 25 200 5 100 100 3 200 25 50 GK C1210 KE KE KE KE KE KE KE KE KE KE KE 100 LF LF LF LF LF LF GB GB GB GB LF LF GB GB GB GB LF LF GB GB GB GB LF LF GB GB GB GB LF LF GB GB GB GB LF GB GB GB GB LF GB GB GB GB HB HB HB LD LD GB GB GB GD HB HB HB LD LD GB GB GB GH HB HB HB LD LD GB GB GB GB GB HB HB HB LD LD GB GB GB GB GB HB HB HB LD LD GB GB GB GB GB HB HB HE LD LD GB GB GB GB GB HB HB HE LD LD GB GB GB GB GB HB HB LD LD GB GB GB GB GB HB HE LD GB GB GB GB GB HB HB HB HB LD GB GB GB GB GB HB HB HB HB LD GB GB GB GB GB HB HB HB HB LD GB GB GB GB GB HB HB HB HB LD GB GB GB GB GB HB HB HB HB LD GB GB GB GB GB HB HB HB HB GB GB GB GB GB HB HB HB HB GB GB GB GB GB HB HB HB HB GB GB GB GB GB HB HB HB HB GB GB GB GB GB HB HB HB HB GB GB GB GE GE HB HB HB HB GB GB GB GG GG HB HB HB HB GB GB GB GG GG HB HB HB HB GB GB GG GG GG HB HB HB HB GB GB GG GG GG HB HB HB HB GB GB GG GG GG HB HB HD HD GB GB GG GJ GJ HB HB HD HD GC GC GG HB HD HD HD GC GC GG HB HD HD HD GE GE GG HB HF HF HF GE GE GG HB HF HF HF HB HC HD GO GO HF 200 FB FB FB FB FB FB FB FB FB FB FB FB FB FB FB FB FC FC FC FF FG LF LF LF LF LF LF LF LF LF LD LD LD LD LD LD LD LD LD LD LD LD LD LD LD LD LD LD LD LD 50 FB FB FB FB FB FE FE FB FB FB FB FB FB FB FB FB FB FB FB FB FB FB FB FC FC FC FF FG 250 FB FB FB FB FB FB FB FB FB FB FB FB FB FB FB FB FB FB FB FB FB FB FB FB FB FB FC FD FD FD FD FD FD FD FD FD FF FG FL FM 200 FB FB FB FB FB FB FB FB FB FB FB FB FB FB FB FB FB FB FB FB FB FB FB FB FB FB FB FB FB FC FC FC FC FD FD FD FD FD FF FH FG FG FG FG FH FM FK FS 100 FB FB FB FB FB FB FB FB FB FB FB FB FB FB FB FB FB FB FB FB FB FB FB FB FB FB FB FB FB FC FC FC FC FD FD FD FD FD FF FH FH FH FH FJ FG FM FG FG FH FM FK FS 16 FB FB FB FB FB FB FB FB FB FB FB FB FB FB FB FB FB FB FB FB FB FB FB FB FB FB FB FB FB FC FC FC FC FD FD FD FD FD FF FH FH FH FH FJ FE FF FG FC FF FG FH FH 250 Product Availability and Chip Thickness Codes - See Table 2 for Chip Thickness Dimensions JE JE JE JE JE JE JE JE JB JB JB JB JB JC JC JC JC JC JC JC JC JC JC JC JC JC JC JC JC JD JF Series C2225 3 100 100 200 A 200 50 2 50 250 1 250 200 5 10 Cap Code M M M M M M M M M M M M M M M M M M M M M M M M M M M M M M M M M M M M M M M M M M M M M M M M M M M M M M M M M A 200 100 FB FB FB FB FB FB FB FB FB FB FB FB FB FB FB FB FB FB FB FB FB FB FB FB FB FB FB FB FB FC FC FC FC FD FD FD FD FD FF FH FH FH FH FJ FE FF FG FC FF FG FH FH K K K K K K K K K K K K K K K K K K K K K K K K K K K K K K K K K K K K K K K K K K K K K K K K K K K K K K K K K 2 100 25 50 FB FB FB FB FB FB FB FB FB FB FB FB FB FB FB FB FB FB FB FB FB FB FB FB FB FB FB FB FB FC FC FC FC FD FD FD FD FD FF FH FH FH FH FJ FE FF FG FC FF FG FH FH J J J J J J J J J J J J J J J J J J J J J J J J J J J J J J J J J J J J J J J J J J J J J J J J J J J J J J J J J C2220 1 25 Voltage DC C1825 5 50 3 250 2 200 1 100 5 50 A 250 2 200 1 50 5 100 3 6.3 Cap C1812 4 Cap Tolerance 10 - 91 pF 100 - 910 100 - 270 pF 101 - 271 330 pF 331 390 pF 391 470 - 1,200 pF 471 - 122 1,500 pF 152 1,800 pF 182 2,200 pF 222 2,700 pF 272 3,300 pF 332 3,900 pF 392 4,700 pF 472 5,600 pF 562 6,800 pF 682 8,200 pF 822 10,000 pF 103 12,000 pF 123 15,000 pF 153 18,000 pF 183 22,000 pF 223 27,000 pF 273 33,000 pF 333 39,000 pF 393 47,000 pF 473 56,000 pF 563 68,000 pF 683 82,000 pF 823 0.10 uF 104 0.12 uF 124 0.15 uF 154 0.18 uF 184 0.22 uF 224 0.27 uF 274 0.33 uF 334 0.39 uF 394 0.47 uF 474 0.56 uF 564 0.68 uF 684 0.82 uF 824 1.0 uF 105 1.2 uF 125 1.5 uF 155 1.8 uF 185 2.2 uF 225 2.7 uF 275 3.3 uF 335 3.9 uF 395 4.7 uF 475 5.6 uF 565 6.8 uF 685 8.2 uF 825 10 uF 106 12 uF 126 15 uF 156 18 uF 186 22 uF 226 47 uF 476 C1808 8 16 C1210 9 10 Series Voltage Code 6.3 Cap Cap Code 1 2 A 3 5 C1825 C2220 C2225 C1018_X7R_SnPb_SMD * 6/11/2012 5 Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) Commercial "L" Series, SnPb Termination, X7R Dielectric, 6.3 - 250 VDC (Commercial Grade) Table 2 - Chip Thickness/Packaging Quantities Paper Quantity Plastic Quantity Thickness Code Case Size Thickness Range (mm) 7" Reel 13" Reel 7" Reel 13" Reel BB CB CD DC DD DE DG DH EB EC EN ED EE EF EM EG EH FB FC FD FE FF FG FL FH FM FJ FK FS LD LF GB GC GD GE GH GG GK GJ GO HB HC HD HE HF JB JC JD JE JF JO KB KC KD KE 0402 0603 0603 0805 0805 0805 0805 0805 1206 1206 1206 1206 1206 1206 1206 1206 1206 1210 1210 1210 1210 1210 1210 1210 1210 1210 1210 1210 1210 1808 1808 1812 1812 1812 1812 1812 1812 1812 1812 1812 1825 1825 1825 1825 1825 2220 2220 2220 2220 2220 2220 2225 2225 2225 2225 0.50 0.05 0.80 0.07 0.80 0.15 0.78 0.10 0.90 0.10 1.00 0.10 1.25 0.15 1.25 0.20 0.78 0.10 0.90 0.10 0.95 0.10 1.00 0.10 1.10 0.10 1.20 0.15 1.25 0.15 1.60 0.15 1.60 0.20 0.78 0.10 0.90 0.10 0.95 0.10 1.00 0.10 1.10 0.10 1.25 0.15 1.40 0.15 1.55 0.15 1.70 0.20 1.85 0.20 2.10 0.20 2.50 0.20 0.90 0.10 1.00 0.15 1.00 0.10 1.10 0.10 1.25 0.15 1.30 0.10 1.40 0.15 1.55 0.10 1.60 0.20 1.70 0.15 2.50 0.20 1.10 0.15 1.15 0.15 1.30 0.15 1.40 0.15 1.50 0.15 1.00 0.15 1.10 0.15 1.30 0.15 1.40 0.15 1.50 0.15 2.40 0.15 1.00 0.15 1.10 0.15 1.30 0.15 1.40 0.15 10,000 4,000 4,000 4,000 4,000 0 0 0 4,000 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 50,000 10,000 10,000 10,000 10,000 0 0 0 10,000 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 2,500 2,500 2,500 4,000 4,000 4,000 2,500 2,500 2,500 2,500 2,000 2,000 4,000 4,000 4,000 2,500 2,500 2,500 2,000 2,000 2,000 2,000 2,000 1,000 2,500 2,500 1,000 1,000 1,000 1,000 1,000 1,000 1,000 1,000 500 1,000 1,000 1,000 1,000 1,000 1,000 1,000 1,000 1,000 1,000 500 1,000 1,000 1,000 1,000 0 0 0 0 0 10,000 10,000 10,000 10,000 10,000 10,000 10,000 10,000 10,000 10,000 8,000 8,000 10,000 10,000 10,000 10,000 10,000 10,000 8,000 8,000 8,000 8,000 8,000 4,000 10,000 10,000 4,000 4,000 4,000 4,000 4,000 4,000 4,000 4,000 2,000 4,000 4,000 4,000 4,000 4,000 4,000 4,000 4,000 4,000 4,000 2,000 4,000 4,000 4,000 4,000 Thickness Code Case Size Thickness Range (mm) 7" Reel 13" Reel 7" Reel 13" Reel Paper Quantity Plastic Quantity Package quantity based on finished chip thickness specifications. (c) KEMET Electronics Corporation * P.O. Box 5928 * Greenville, SC 29606 (864) 963-6300 * www.kemet.com C1018_X7R_SnPb_SMD * 6/11/2012 6 Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) Commercial "L" Series, SnPb Termination, X7R Dielectric, 6.3 - 250 VDC (Commercial Grade) Table 3 - Chip Capacitor Land Pattern Design Recommendations per IPC-7351 EIA Size Code Metric Size Code 01005 Density Level A: Maximum (Most) Land Protrusion (mm) Density Level B: Median (Nominal) Land Protrusion (mm) Density Level C: Minimum (Least) Land Protrusion (mm) C Y X V1 V2 C Y X V1 V2 C Y X V1 V2 0402 0.33 0.46 0.43 1.60 0.90 0.28 0.36 0.33 1.30 0.70 0.23 0.26 0.23 1.00 0.50 0201 0603 0.38 0.56 0.52 1.80 1.00 0.33 0.46 0.42 1.50 0.80 0.28 0.36 0.32 1.20 0.60 0402 1005 0.50 0.72 0.72 2.20 1.20 0.45 0.62 0.62 1.90 1.00 0.40 0.52 0.52 1.60 0.80 0603 1608 0.90 1.15 1.10 4.00 2.10 0.80 0.95 1.00 3.10 1.50 0.60 0.75 0.90 2.40 1.20 0805 2012 1.00 1.35 1.55 4.40 2.60 0.90 1.15 1.45 3.50 2.00 0.75 0.95 1.35 2.80 1.70 1206 3216 1.60 1.35 1.90 5.60 2.90 1.50 1.15 1.80 4.70 2.30 1.40 0.95 1.70 4.00 2.00 1210 3225 1.60 1.35 2.80 5.65 3.80 1.50 1.15 2.70 4.70 3.20 1.40 0.95 2.60 4.00 2.90 1808 4520 2.30 1.75 2.30 7.40 3.30 2.20 1.55 2.20 6.50 2.70 2.10 1.35 2.10 5.80 2.40 1812 4532 2.15 1.60 3.60 6.90 4.60 2.05 1.40 3.50 6.00 4.00 1.95 1.20 3.40 5.30 3.70 1825 4564 2.15 1.60 6.90 6.90 7.90 2.05 1.40 6.80 6.00 7.30 1.95 1.20 6.70 5.30 7.00 2220 5650 2.75 1.70 5.50 8.20 6.50 2.65 1.50 5.40 7.30 5.90 2.55 1.30 5.30 6.60 5.60 2225 5664 2.70 1.70 6.90 8.10 7.90 2.60 1.50 6.80 7.20 7.30 2.50 1.30 6.70 6.50 7.00 Density Level A: For low-density product applications. Recommended for wave solder applications and provides a wider process window for reflow solder processes. KEMET only recommends wave soldering of EIA 0603, 0805 and 1206 case sizes. Density Level B: For products with a moderate level of component density. Provides a robust solder attachment condition for reflow solder processes. Density Level C: For high component density product applications. Before adapting the minimum land pattern variations the user should perform qualification testing based on the conditions outlined in IPC Standard 7351 (IPC-7351). Soldering Process Recommended Soldering Technique: * Solder wave or solder reflow for EIA case sizes 0603, 0805 and 1206 * All other EIA case sizes are limited to solder reflow only Recommended Soldering Profile: * KEMET recommends following the guidelines outlined in IPC/JEDEC J-STD-020 (c) KEMET Electronics Corporation * P.O. Box 5928 * Greenville, SC 29606 (864) 963-6300 * www.kemet.com C1018_X7R_SnPb_SMD * 6/11/2012 7 Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) Commercial "L" Series, SnPb Termination, X7R Dielectric, 6.3 - 250 VDC (Commercial Grade) Table 4 - Performance & Reliability: Test Methods and Conditions Stress Reference Test or Inspection Method Terminal Strength JIS-C-6429 Appendix 1, Note: Force of 1.8 kg for 60 seconds. Board Flex JIS-C-6429 Appendix 2, Note: 2 mm (min) for all except 3 mm for C0G. Magnification 50 X. Conditions: Solderability J-STD-002 a) Method B, 4 hours @ 155C, dry heat @ 235C b) Method B @ 215C category 3 c) Method D, category 3 @ 260C Temperature Cycling JESD22 Method JA-104 1,000 cycles (-55C to +125C). Measurement at 24 hours +/- 2 hours after test conclusion. Load Humidity: 1,000 hours 85C/85% RH and rated voltage. Add 100 K ohm resistor. Measurement at 24 hours +/- 2 hours after test conclusion. Low Volt Humidity: 1,000 hours 85C/85% RH and 1.5 V. Add 100 K ohm resistor. Measurement at 24 hours +/- 2 hours after test conclusion. t = 24 hours/cycle. Steps 7a and 7b not required. Unpowered. Measurement at 24 hours +/- 2 hours after test conclusion. -55C/+125C. Note: Number of cycles required - 300. Maximum transfer time - 20 seconds. Dwell time - 15 minutes. Air - Air. Biased Humidity MIL-STD-202 Method 103 Moisture Resistance MIL-STD-202 Method 106 Thermal Shock MIL-STD-202 Method 107 High Temperature Life MIL-STD-202 Method 108 /EIA-198 Storage Life MIL-STD-202 Method 108 150C, 0 VDC for 1,000 hours. Mechanical Shock MIL-STD-202 Method 213 Figure 1 of Method 213, Condition F. Resistance to Solvents MIL-STD-202 Method 215 Add aqueous wash chemical, OKEM Clean or equivalent. 1,000 hours at 125C (85C for X5R, Z5U and Y5V) with 2 X rated voltage applied. Storage and Handling Ceramic chip capacitors should be stored in normal working environments. While the chips themselves are quite robust in other environments, solderability will be degraded by exposure to high temperatures, high humidity, corrosive atmospheres, and long term storage. In addition, packaging materials will be degraded by high temperature- reels may soften or warp and tape peel force may increase. KEMET recommends that maximum storage temperature not exceed 40C and maximum storage humidity not exceed 70% relative humidity. Temperature fluctuations should be minimized to avoid condensation on the parts and atmospheres should be free of chlorine and sulfur bearing compounds. For optimized solderability chip stock should be used promptly, preferably within 1.5 years of receipt. Construction Reference A B C D E Item Finish Barrier Layer Base Metal Inner Electrode Termination System Dielectric Material Material SnPb (5% min) Ni Cu Ni BaTiO3 Note: Image is exaggerated in order to clearly identify all components of construction. (c) KEMET Electronics Corporation * P.O. Box 5928 * Greenville, SC 29606 (864) 963-6300 * www.kemet.com C1018_X7R_SnPb_SMD * 6/11/2012 8 Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) Commercial "L" Series, SnPb Termination, X7R Dielectric, 6.3 - 250 VDC (Commercial Grade) Tape & Reel Packaging Information KEMET offers multilayer ceramic chip capacitors packaged in 8, 12 and 16 mm tape on 7" and 13" reels in accordance with EIA Standard 481. This packaging system is compatible with all tape-fed automatic pick and place systems. See Table 2 for details on reeling quantities for commercial chips. Bar Code Label Anti-Static Reel (R) Embossed Plastic* or Punched Paper Carrier. ET KEM Chip and KPS Orientation in Pocket (except 1825 Commercial, and 1825 and 2225 Military) Sprocket Holes Embossment or Punched Cavity 8 mm, 12 mm or 16 mm Carrier Tape 178 mm (7.00") or 330 mm (13.00") Anti-Static Cover Tape (.10 mm (.004") Maximum Thickness) *EIA 01005, 0201, 0402 and 0603 case sizes available on punched paper carrier only. Table 5 - Carrier Tape Configuration - Embossed Plastic & Punched Paper (mm) EIA Case Size Tape Size (W)* Lead Space (P1)* 01005 - 0402 8 2 0603 - 1210 8 4 1805 - 1808 12 4 1812 12 8 KPS 1210 12 8 KPS 1812 & 2220 16 12 Array 0508 & 0612 8 4 *Refer to Figures 1 & 2 for W and P1 carrier tape reference locations. *Refer to Tables 6 & 7 for tolerance specifications. (c) KEMET Electronics Corporation * P.O. Box 5928 * Greenville, SC 29606 (864) 963-6300 * www.kemet.com C1018_X7R_SnPb_SMD * 6/11/2012 9 Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) Commercial "L" Series, SnPb Termination, X7R Dielectric, 6.3 - 250 VDC (Commercial Grade) Figure 1 - Embossed (Plastic) Carrier Tape Dimensions P2 T T2 ODo [10 pitches cumulative tolerance on tape 0.2 mm] Po E1 Ao F Ko W B1 E2 Bo S1 P1 T1 Center Lines of Cavity OD 1 Cover Tape B 1 is for tape feeder reference only, including draft concentric about B o. Embossment For cavity size, see Note 1 Table 5 User Direction of Unreeling Table 6 - Embossed (Plastic) Carrier Tape Dimensions Metric will govern Constant Dimensions -- Millimeters (Inches) Tape Size D0 8 mm 12 mm 1.5 +0.10/-0.0 (0.059 +0.004/-0.0) 16 mm D1 Minimum Note 1 1.0 (0.039) 1.5 (0.059) E1 1.75 0.10 (0.069 0.004) R Reference S1 Minimum Note 2 Note 3 25.0 (0.984) 4.0 0.10 2.0 0.05 (0.079 0.600 (0.157 0.004) 0.002) (0.024) 30 (1.181) P0 P2 T Maximum T1 Maximum 0.600 (0.024) 0.100 (0.004) Variable Dimensions -- Millimeters (Inches) Tape Size Pitch 8 mm Single (4 mm) 12 mm Single (4 mm) & Double (8 mm) 16 mm Triple (12 mm) B1 Maximum Note 4 4.35 (0.171) 8.2 (0.323) 12.1 (0.476) E2 Minimum 6.25 (0.246) 10.25 (0.404) 14.25 (0.561) F P1 3.5 0.05 4.0 0.10 (0.138 0.002) (0.157 0.004) 8.0 0.10 (0.315 5.5 0.05 0.004) (0.217 0.002) 5.5 0.05 8.0 0.10 (0.315 (0.217 0.002) 0.004) T2 Maximum 2.5 (0.098) 4.6 (0.181) 4.6 (0.181) W Maximum 8.3 (0.327) 12.3 (0.484) 16.3 (0.642) A0,B0 & K0 Note 5 1. The embossment hole location shall be measured from the sprocket hole controlling the location of the embossment. Dimensions of embossment location and hole location shall be applied independent of each other. 2. The tape with or without components shall pass around R without damage (see Figure 6). 3. If S1 < 1.0 mm, there may not be enough area for cover tape to be properly applied (see EIA Standard 481 paragraph 4.3 section b). 4. B1 dimension is a reference dimension for tape feeder clearance only. 5. The cavity defined by A0, B0 and K0 shall surround the component with sufficient clearance that: (a) the component does not protrude above the top surface of the carrier tape. (b) the component can be removed from the cavity in a vertical direction without mechanical restriction, after the top cover tape has been removed. (c) rotation of the component is limited to 20 maximum for 8 and 12 mm tapes and 10 maximum for 16 mm tapes (see Figure 3). (d) lateral movement of the component is restricted to 0.5 mm maximum for 8 and 12 mm wide tape and to 1.0 mm maximum for 16 mm tape (see Figure 4). (e) for KPS Series product, A0 and B0 are measured on a plane 0.3 mm above the bottom of the pocket. (f) see Addendum in EIA Standard 481 for standards relating to more precise taping requirements. (c) KEMET Electronics Corporation * P.O. Box 5928 * Greenville, SC 29606 (864) 963-6300 * www.kemet.com C1018_X7R_SnPb_SMD * 6/11/2012 10 Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) Commercial "L" Series, SnPb Termination, X7R Dielectric, 6.3 - 250 VDC (Commercial Grade) Figure 2 - Punched (Paper) Carrier Tape Dimensions P2 T Po ODo [10 pitches cumulative tolerance on tape 0.2 mm] E1 A0 F P1 T1 T1 Top Cover Tape W E2 B0 Bottom Cover Tape G Cavity Size, See Note 1, Table 7 Center Lines of Cavity Bottom Cover Tape User Direction of Unreeling Table 7 - Punched (Paper) Carrier Tape Dimensions Metric will govern Constant Dimensions -- Millimeters (Inches) Tape Size D0 E1 P0 P2 T1 Maximum G Minimum 8 mm 1.5 +0.10 -0.0 (0.059 +0.004 -0.0) 1.75 0.10 (0.069 0.004) 4.0 0.10 (0.157 0.004) 2.0 0.05 (0.079 0.002) 0.10 (0.004) Maximum 0.75 (0.030) R Reference Note 2 25 (0.984) T Maximum W Maximum A0 B 0 1.1 (0.098) 8.3 (0.327) 8.3 (0.327) Variable Dimensions -- Millimeters (Inches) Tape Size Pitch 8 mm Half (2 mm) 8 mm Single (4 mm) E2 Minimum 6.25 (0.246) F 3.5 0.05 (0.138 0.002) P1 2.0 0.05 (0.079 0.002) 4.0 0.10 (0.157 0.004) Note 1 1. The cavity defined by A0, B0 and T shall surround the component with sufficient clearance that: a) the component does not protrude beyond either surface of the carrier tape. b) the component can be removed from the cavity in a vertical direction without mechanical restriction, after the top cover tape has been removed. c) rotation of the component is limited to 20 maximum (see Figure 3). d) lateral movement of the component is restricted to 0.5 mm maximum (see Figure 4). e) see Addendum in EIA Standard 481 for standards relating to more precise taping requirements. 2. The tape with or without components shall pass around R without damage (see Figure 6). (c) KEMET Electronics Corporation * P.O. Box 5928 * Greenville, SC 29606 (864) 963-6300 * www.kemet.com C1018_X7R_SnPb_SMD * 6/11/2012 11 Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) Commercial "L" Series, SnPb Termination, X7R Dielectric, 6.3 - 250 VDC (Commercial Grade) Packaging Information Performance Notes 1. Cover Tape Break Force: 1.0 Kg minimum. 2. Cover Tape Peel Strength: The total peel strength of the cover tape from the carrier tape shall be: Tape Width Peel Strength 8 mm 0.1 to 1.0 Newton (10 to 100 gf) 12 and 16 mm 0.1 to 1.3 Newton (10 to 130 gf) The direction of the pull shall be opposite the direction of the carrier tape travel. The pull angle of the carrier tape shall be 165 to 180 from the plane of the carrier tape. During peeling, the carrier and/or cover tape shall be pulled at a velocity of 300 10 mm/minute. 3. Labeling: Bar code labeling (standard or custom) shall be on the side of the reel opposite the sprocket holes. Refer to EIA Standards 556 and 624. Figure 3 - Maximum Component Rotation T Maximum Component Rotation Top View Maximum Component Rotation Side View Typical Pocket Centerline Tape Width (mm) 8,12 16 - 200 Bo Maximum Rotation ( 20 10 T) Typical Component Centerline Ao Figure 4 - Maximum Lateral Movement 8 mm & 12 mm Tape 0.5 mm maximum 0.5 mm maximum 16 mm Tape s Tape Maximum Width (mm) Rotation ( 8,12 20 16 - 56 10 72 - 200 5 S) Figure 5 - Bending Radius Embossed Carrier Punched Carrier 1.0 mm maximum 1.0 mm maximum R Bending Radius (c) KEMET Electronics Corporation * P.O. Box 5928 * Greenville, SC 29606 (864) 963-6300 * www.kemet.com R C1018_X7R_SnPb_SMD * 6/11/2012 12 Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) Commercial "L" Series, SnPb Termination, X7R Dielectric, 6.3 - 250 VDC (Commercial Grade) Figure 6 - Reel Dimensions Full Radius, See Note W3 (Includes Access Hole at Slot Location (O 40 mm minimum) flange distortion at outer edge) W2 (Measured at hub) D A N (See Note) C (Arbor hole diameter) B (see Note) W1 (Measured at hub) If present, tape slot in core for tape start: 2.5 mm minimum width x 10.0 mm minimum depth Note: Drive spokes optional; if used, dimensions B and D shall apply. Table 8 - Reel Dimensions Metric will govern Constant Dimensions -- Millimeters (Inches) Tape Size A B Minimum C D Minimum 8 mm 178 0.20 (7.008 0.008) or 330 0.20 (13.000 0.008) 1.5 (0.059) 13.0 +0.5/-0.2 (0.521 +0.02/-0.008) 20.2 (0.795) 12 mm 16 mm Variable Dimensions -- Millimeters (Inches) Tape Size N Minimum W1 W2 Maximum W3 50 (1.969) 8.4 +1.5/-0.0 (0.331 +0.059/-0.0) 12.4 +2.0/-0.0 (0.488 +0.078/-0.0) 16.4 +2.0/-0.0 (0.646 +0.078/-0.0) 14.4 (0.567) 18.4 (0.724) 22.4 (0.882) Shall accommodate tape width without interference 8 mm 12 mm 16 mm (c) KEMET Electronics Corporation * P.O. Box 5928 * Greenville, SC 29606 (864) 963-6300 * www.kemet.com C1018_X7R_SnPb_SMD * 6/11/2012 13 Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) Commercial "L" Series, SnPb Termination, X7R Dielectric, 6.3 - 250 VDC (Commercial Grade) Figure 7 - Tape Leader & Trailer Dimensions Embossed Carrier Carrier Tape Punched Carrier 8 mm & 12 mm only END Round Sprocket Holes START Top Cover Tape Elongated Sprocket Holes (32 mm tape and wider) Trailer 160 mm Minimum Components 100 mm Minimum Leader 400 mm Minimum Top Cover Tape Figure 8 - Maximum Camber Elongated sprocket holes (32 mm & wider tapes) Carrier Tape Round Sprocket Holes 1 mm Maximum, either direction Straight Edge 250 mm (c) KEMET Electronics Corporation * P.O. Box 5928 * Greenville, SC 29606 (864) 963-6300 * www.kemet.com C1018_X7R_SnPb_SMD * 6/11/2012 14 Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) Commercial "L" Series, SnPb Termination, X7R Dielectric, 6.3 - 250 VDC (Commercial Grade) Figure 9 - Bulk Cassette Packaging (Ceramic Chips Only) Meets Dimensional Requirements IEC-286 and EIAJ 7201 6 8 0.1 8 8 0.1 12.0 0.1 Unit mm *Reference 19.0* 36 00.2 31.5 0.2 0 53 3* 10* 1.5 2.0 3.0 0.1 0 0 0.1 0.2 0 5 0* 110 0.7 Table 9 - Capacitor Dimensions for Bulk Cassette Cassette Packaging - Millimeters EIA Size Code Metric Size Code L Length W Width B Bandwidth S Separation Minimum T Thickness Number of Pieces/Cassette 0402 1005 1.0 0.05 0.5 0.05 0.2 to 0.4 0.3 0.5 0.05 50,000 0603 1608 1.6 0.07 0.8 0.07 0.2 to 0.5 0.7 0.8 0.07 15,000 Table 10 - Capacitor Marking Numeral Alpha Character A B C D E F G H J K L M N P Q R S T U V W X Y Z a b d e f m n t y Capacitance (pF) For Various Numeral Identifiers 9 0.1 0.11 0.12 0.13 0.15 0.16 0.18 0.2 0.22 0.24 0.27 0.3 0.33 0.36 0.39 0.43 0.47 0.51 0.56 0.62 0.68 0.75 0.82 0.91 0.25 0.35 0.4 0.45 0.5 0.6 0.7 0.8 0.9 0 1 1.1 1.2 1.3 1.5 1.6 1.8 2 2.2 2.4 2.7 3 3.3 3.6 3.9 4.3 4.7 5.1 5.6 6.2 6.8 7.5 8.2 9.1 2.5 3.5 4 4.5 5 6 7 8 9 1 10 11 12 13 15 16 18 20 22 24 27 30 33 36 39 43 47 51 56 62 68 75 82 91 25 35 40 45 50 60 70 80 90 2 100 110 120 130 150 160 180 200 220 240 270 300 330 360 390 430 470 510 560 620 680 750 820 910 250 350 400 450 500 600 700 800 900 3 1000 1100 1200 1300 1500 1600 1800 2000 2200 2400 2700 3000 3300 3600 3900 4300 4700 5100 5600 6200 6800 7500 8200 9100 2500 3500 4000 4500 5000 6000 7000 8000 9000 4 10000 11000 12000 13000 15000 16000 18000 20000 22000 24000 27000 30000 33000 36000 39000 43000 47000 51000 56000 62000 68000 75000 82000 91000 25000 35000 40000 45000 50000 60000 70000 80000 90000 5 100000 110000 120000 130000 150000 160000 180000 200000 220000 240000 270000 300000 330000 360000 390000 430000 470000 510000 560000 620000 680000 750000 820000 910000 250000 350000 400000 450000 500000 600000 700000 800000 900000 6 1000000 1100000 1200000 1300000 1500000 1600000 1800000 2000000 2200000 2400000 2700000 3000000 3300000 3600000 3900000 4300000 4700000 5100000 5600000 6200000 6800000 7500000 8200000 9100000 2500000 3500000 4000000 4500000 5000000 6000000 7000000 8000000 9000000 7 10000000 11000000 12000000 13000000 15000000 16000000 18000000 20000000 22000000 24000000 27000000 30000000 33000000 36000000 39000000 43000000 47000000 51000000 56000000 62000000 68000000 75000000 82000000 91000000 25000000 35000000 40000000 45000000 50000000 60000000 70000000 80000000 90000000 (c) KEMET Electronics Corporation * P.O. Box 5928 * Greenville, SC 29606 (864) 963-6300 * www.kemet.com Laser marking is available as an extracost option for most KEMET ceramic chips. Such marking is two sided and includes a K to identify KEMET, followed by two characters (per EIA-198) to identify the capacitance value. Note that marking is not available for any Y5V chip. ln addition, the 0603 marking option is limited to the K only. (Marking Optional - Not Available for 0402 Size) Example shown is 1,000 pF capacitor C1018_X7R_SnPb_SMD * 6/11/2012 15