14
RF Device Data
Freescale Semiconductor, Inc.
MMA20312BT1
PRODUCT DOCUMENTATION, SOFTWARE AND TOOLS
Refer to the following resources to aid your design process.
Application Notes
AN1955: Thermal Measurement Methodology of RF Power Amplifiers
Software
.s2p File
Development Tools
Printed Circuit Boards
For Software and Tools, do a Part Number search at http://www.freescale.com, and select the “Part Number” link. Go to
Software & Tools on the part’s Product Summary page to download the respective tool.
FAILURE ANALYSIS
At this time, because of the physical characteristics of the part, failure analysis is limited to electrical signature analysis. In
cases where Freescale is contractually obligated to perform failure analysis (FA) services, full FA may be performed by third
party vendors with moderate success. For updates contact your local Freescale Sales Office.
REVISION HISTORY
The following table summarizes revisions to this document.
Revision Date Description
0Oct. 2010 Initial Release of Data Sheet
1Mar. 2011 Added “OIP3: 44.5 dBm @ 2140 MHz (W--CDMA Application Circuit)” to Features list, p. 1
Typical CW Performance table: removed OIP3, p. 1
Figs. 4 and 12, Test Circuit Component Layout, updated component part layout identifier to reflect package
type. Changed from MMA20312B to QFN 3x3--12B, pp. 4, 8
1.1 Mar. 2011 Updated device descriptor box to reflect W--CDMA application circuit small--signal gain value, p. 1
1.2 Feb. 2012 All references to “VCTRL” in the data sheet tables, test circuit schematics and component layouts are
replaced with “VBIAS”. VBIAS is the supply voltage which sets the internal bias conditions via pins 1, 2, and
12, p. 1--3, 5--7, 9. Footnote “(1) VBIAS [Board] supplies VBA1,V
BA2 and VBIAS [Device]” added to test
circuit component layouts, pp. 4, 8.
Fig. 3, Test Circuit Schematic -- TD--SCDMA, Table 7, Test Circuit Component Designations and Values --
TD--SCDMA, Fig. 4, Test Circuit Component Layout -- TD--SCDMA, Fig. 11, Test Circuit Schematic --
W--CDMA, Table 8, Test Circuit Component Designations and Values -- W--CDMA and Fig. 12, Test Circuit
Component Layout -- W--CDMA: clarified components not placed and components intentionally omitted,
pp. 3, 4, 7, 8
2Sept. 2014 Table 2, Maximum Ratings: updated Junction Temperature from 150C to 175C to reflect recent test
results of the device, p. 1
Added Failure Analysis information, p. 14