MCP2120-I/SL - MICROCHIP - Datasheet.Support

MCP2120

Features

• Supports with IrDA® Physical Layer Specification

(version 1.3)

• UART to IR Encoder/Decoder

- Interfaces with IrDA Compliant Transceivers

- Used with any UART, including standard

16550 UART and microcontroller UART

• Transmit/Receive formats supported:

-1.63µs

• Hardware or Software Baud rate selection

- Up to IrDA standard 115.2 kbaud operation

- Up to 312.5 kbaud operation (at 20 MHz)

- Low power mode

• Pb-free packaging

CMOS Technology

• Low-power, high-speed CMOS technology

• Fully static design

• Low voltage operation

• Commercial and Industrial temperature ranges

• Low power consumption

- < 1 mA @ 3.3V, 8 MHz (typical)

- 3 mA typical @ 5.0V when disabled

Pin Diagrams

Block Diagram

PDIP, SOIC

MCP2120

VDD

OSC1/CLKIN

OSC2

RESET

RXIR

TXIR

MODE

VSS

BAUD0

BAUD1

BAUD2

Decode

TX TXIR

RX RXIR

MCP2120

Logic

Baud Rate

BAUD2

Generator

BAUD1

BAUD0

MODE

Encode

Infrared Encoder/Decoder

MCP2120

NOTES:

MCP2120

1.0 DEVICE OVERVIEW

This document contains device specific information for

the following device:

• MCP2120

This device is a low-cost, high-performance, fully-static

infrared encoder/decoder. This device sits between a

UART and an infrared (IR) optical transceiver.

The data received from a standard UART is encoded

(modulated), and output as electrical pulses to the IR

Transceiver. The IR Transceiver also receives data

which it outputs as electrical pulses. The MCP2120

decodes (demodulates) these electrical pulses and

then the data is transmitted by the MCP2120 UART.

This modulation and demodulation method is

performed in accordance with the IrDA standard.

Typically a microcontroller interfaces to the IR encoder/

decoder.

Infrared communication is a wireless two-way data

connection using infrared light generated by low-cost

transceiver signaling technology. This provides reliable

communication between two devices.

Infrared technology offers:

• Universal standard for connecting portable

computing devices

• Easy, effortless implementation

• Economical alternative to other connectivity

solutions

• Reliable, high speed connection

• Safe to use in any environment; can even be used

during air travel

• Eliminates the hassle of cables

• Allows PC’s and non-PC’s to communicate to

each other

• Enhances mobility by allowing users to easily

connect

1.1 Applications

The MCP2120 is a stand–alone IrDA Encoder/Decoder

product. Figure 1-1 shows a typical application block

diagram. Table 1-2 shows the pin definitions in the user

(normal) mode of operation.

TABLE 1-1: MCP2120 FEATURES

OVERVIEW

FIGURE 1-1: System Block Diagram

Features MCP2120

Serial Communications: UART, IR

Baud Rate Selection: Hardware/Software

Low Power Mode: Yes

Resets: (and Delays) Wake-up (DRT)

Packages: 14-pin DIP

14-pin SOIC

Encode

Decode

TX TXIR

RX RXIR

MCP2120

Micro–

Optical

UART

TXD

RXD

Power

Down

Baud Rate

BAUD2

Generator

BAUD1

BAUD0

MODE

I/O

Controller

Logic

(S/W Mode)

Transceiver

MCP2120

TABLE 1-2: PIN DESCRIPTION USER MODE

Pin Name Pin Number Pin

Type

Buffer

Type

PDIP SOIC Description

VDD 1 1 — P Positive supply for logic and I/O pins

OSC1/CLKIN 2 2 I CMOS Oscillator crystal input/external clock source input

OSC2 3 3 O — Oscillator crystal Output

RESET 4 4 I ST Resets the Device

RXIR 5 5 I ST Asynchronous receive from infrared transceiver

TXIR 6 6 O — Asynchronous transmit to infrared transceiver

MODE 7 7 I TTL Selects the device mode (Data/Command) for Software Baud

Rate operation. For more information see Section 2.4.1.2 “Soft-

ware Selection”.

BAUD2 8 8 I TTL BAUD2:BAUD0 specify the Baud rate of the device, or if the

device operates in Software Baud Rate mode. For more informa-

tion see Section 2.4.1 “Baud Rate”.

BAUD1 9 9 I TTL

BAUD0 10 10 I TTL

RX 11 11 O — Asynchronous transmit to controller UART

TX 12 12 I TTL Asynchronous receive from controller UART

EN 13 13 I — Device Enable.

VSS 14 14 — P Ground reference for logic and I/O pins

Legend: TTL = TTL compatible input ST = Schmitt Trigger input with CMOS levels

I = Input O = Output

P = Power CMOS = CMOS compatible input

MCP2120

2.0 DEVICE OPERATION

The MCP2120 is a low cost infrared Encoder/Decoder.

The baud rate is user selectable to standard IrDA baud

rates between 9600 baud to 115.2 kbaud. The maxi-

mum baud rate is 312.5 kbaud.

2.1 Power-up

Any time that the device is powered up, the Device

Reset Timer delay (parameter 32) must occur before

any communication with the device is initiated. This is

from both the infrared transceiver side as well as the

controller UART interface.

2.2 Device Reset

The MCP2120 is forced into the reset state when the

RESET pin is in the low state. After the RESET pin is

brought to a high state, the Device Reset Timer occurs.

Once the DRT times out, normal operation occurs.

2.3 Bit Clock

The device crystal is used to derive the communication

bit clock (BITCLK). There are 16 BITCLKs for each bit

time. The BITCLKs are used for the generation of the

Start bit and the eight data bits. The Stop bit uses the

BITCLK when the data is transmitted (not for recep-

tion).

This clock is a fixed frequency, and has minimal varia-

tion in frequency (specified by crystal manufacturer).

2.4 UART Interface

The UART interface communicates with the "control-

ler". This interface is a Half duplex interface, meaning

that the system is either transmitting or receiving, but

not both at the same time.

2.4.1 BAUD RATE

The baud rate for the MCP2120 can be configured

either by the state of three hardware pins (BAUD2,

BAUD1, and BAUD0) or through software selection.

2.4.1.1 Hardware Selection

Three device pins are used to select the baud rate that

the MCP2120 will transmit and receive data. These

pins are called BAUD2, BAUD1, and BAUD0. There is

one pin state (device mode) where the application soft-

ware can specify the baud rate. Table 2-1 shows the

baud rate configurations.

TABLE 2-1: HARDWARE BAUD RATE SELECTION VS. FREQUENCY

BAUD2:BAUD0

Frequency (MHz)

Bit Rate0.6144(1) 2.000 3.6864 4.9152 7.3728 14.7456(2) 20.000(2)

000 800 2604 4800 6400 9600 19200 26042 FOSC / 768

001 1600 5208 9600 12800 19200 38400 52083 FOSC / 384

010 3200 10417 19200 25600 38400 78600 104167 FOSC / 192

011 4800 15625 28800 38400 57600 115200 156250 FOSC / 128

100 9600 31250 57600 78600 115200 230400 312500 FOSC / 64

Note 1: An external clock is recommended for frequencies below 2 MHz.

2: For frequencies above 7.5 MHz, the TXIR pulse width (parameter IR121) will be shorter than the minimum

pulse width of 1.6 µs in the IrDA standard specification.

MCP2120

2.4.1.2 Software Selection

When the BAUD2:BAUD0 pins are configured as ’111’

the MCP2120 defaults to a baud rate of FOSC / 768.

To place the MCP2120 into Command Mode, the

MODE pin must be at a low level. When in this mode,

any data that is received by the MCP2120’s UART is

"echoed" back to the controller and no encoding/

decoding occurs. The echoed data will be skewed less

than 1 bit time (see parameter IR141). When the

MODE pin goes high, the device is returned to Data

Mode where the encoder/decoder is in operation.

Table 2-2 shows the software hex commands to config-

ure the MCP2120’s baud rate.

The MCP2120 receives data bytes at the existing baud

rate. When the change baud rate command (0x11) is

received, the last valid baud rate value received

becomes the new baud rate. The new baud rate is

effective after the stop bit of the echoed data.

Figure 2-2 shows this sequence.

2.4.2 TRANSMITTING

When the controller sends serial data to the MCP2120,

the baud rates are required to match.

There will be some jitter on the detection of the high to

low edge of the start bit. This jitter will affect the place-

ment of the encoded start bit. All subsequent bits will be

16 BITCLK times later.

2.4.3 RECEIVING

When the controller receives serial data from the

MCP2120, the baud rates are required to match.

There will be some jitter on the detection of the high to

low edge of the start bit. This jitter will affect the place-

ment of the decoded Start bit. All subsequent bits will

be 16 BITCLK times later.

FIGURE 2-1: Data/Command Mode

Flow

TABLE 2-2: SOFTWARE BAUD RATE SELECTION VS. FREQUENCY

MODE pin goes low

Data Mode Command Mode

Controller sends baud

MCP2120 echoes baud

Controller sends 0x11

MCP2120 echoes 0x11

New baud rate

MODE pin goes high

Data Mode

When echoing the Data, once the first bit is

detected, it is echoed back. This means that

the echoed data is skewed no more than 1 bit

time.

The new baud rate can occur once the echoed

stop bit completes.

Hex

Command(3, 4)

Frequency (MHz)

Bit Rate

0.6144(1) 2.000 3.6864 4.9152 7.3728 14.7456(2) 20.000(2)

0x87 800 2604 4800 6400 9600 19200 26042 FOSC / 768

0x8B 1600 5208 9600 12800 19200 38400 52083 FOSC / 384

0x85 3200 10417 19200 25600 38400 78600 104167 FOSC / 192

0x83 4800 15625 28800 38400 57600 115200 156250 FOSC / 128

0x81 9600 31250 57600 78600 115200 230400 312500 FOSC / 64

Note 1: An external clock is recommended for frequencies below 2 MHz.

2: For frequencies above 7.3728 MHz, the TXIR pulse width (parameter IR121) will be shorter than the 1.6 µs

IrDA standard specification.

3: Command 0x11 is used to change to the new baud rate.

4: All other command codes are reserved for possible future use.

MCP2120

2.5 Modulation

When the UART receives data to be transmitted, the

data needs to be modulated. This modulated signal

drives the IR transceiver module. Figure 2-2 shows the

encoding of the modulated signal.

Each bit time is comprised of 16-bit clocks. If the value

to be transmitted (as determined by the TX pin) is a

logic low, then the TXIR pin will output a low level for

7-bit clock cycles, a logic high level for 3-bit clock

cycles, and then the remaining 6-bit clock cycles will be

low. If the value to transmit is a logic high, then the

TXIR pin will output a low level for the entire 16-bit clock

cycles.

2.6 Demodulation

The modulated signal from the IR transceiver module

needs to be demodulated to form the received data. As

demodulation occurs, the bit value is placed on the RX

pin in UART format. Figure 2-3 shows the decoding of

the modulated signal.

Each bit time is comprised of 16 bit clocks. If the value

to be received is a logic low, then the RXIR pin will be

a low level for the first 3-bit clock cycles, and then the

remaining 13-bit clock cycles will be high. If the value to

be received is a logic high, then the RXIR pin will be a

high level for the entire 16-bit clock cycles. The level on

the RX pin will be in the appropriate state for the entire

16 clock cycles.

FIGURE 2-2: Encoding

FIGURE 2-3: Decoding

BITCLK

TXIR

0100 01

16 CLK

Start Bit Data bit 0 Data bit 1 Data bit 2 Data bit...

7 CLK

12 Tosc

BITCLK

RXIR

0100 01

≥ 1.6 µs

13 CLK (or ≤ 50.5 µs typical)

16 CLK

16 CLK 16 CLK 16 CLK 16 CLK 16 CLK 16 CLK

8 CLK

Start Bit Data bit 0 Data bit 1 Data bit 2 Data bit ...

(CLK)

MCP2120

2.7 Encoding/Decoding Jitter and

Offset

Figure 2-4 shows the jitter and offset that is possible on

the RX pin and the TXIR pin.

Jitter is the possible variation of the desired edge.

Offset is the propagation delay of the input signal (RXIR

or TX) to the output signal (RX or TXIR).

The first bit on the output pin (on RX or TXIR) will show

jitter compared to the input pin (RXIR or TX), but all

remaining bits will be a constant distance.

2.8 Minimizing Power

The device can be placed in a low power mode by

disabling the device (holding the EN pin at the low

state). The internal state machine is monitoring this pin

for a low level, and once this is detected the device is

disabled and enters into a low power state.

2.8.1 RETURNING TO OPERATION

When the device is disabled, the device is in a low

power state. When the EN pin is brought to a high level,

the device will return to the operating mode. The device

requires a delay of 1000 TOSC before data may be

transmitted or received.

FIGURE 2-4: Effects of Jitter and Offset

TX Jitter

3 CLK

BITCLK

RXIR

TXIR

16 CLK 16 CLK

3 CLK

16 CLK

RX Jitter

TX Offset

RX Offset 16 CLK

MCP2120

3.0 DEVELOPMENT TOOLS

The MCP212X Developer’s Daughter Board is used to

evaluate and demonstrate the MCP2122 or the

MCP2120 IrDA® Standard Encoder/Decoder devices.

A header allows the MCP212X Developer’s Daughter

Board to be jumpered easily into systems for

development purposes.

The MCP212X Developer’s Daughter Board is

designed to interface to several of the “new” low cost

PIC® Demo Boards. These include the PICDEM HPC

Explorer Demo board, the PICDEM FS USB Demo

board, and the PICDEM LCD Demo board.

When the MCP212X Developer’s Daughter Board is

used in conjunction with the PICDEM HPC Explorer

Demo board, the MCP212x can be connected to either

of the PIC18F8772's two UARTs or the RX and TX sig-

nals can be "crossed" so the MCP212x device can

communicate directly out the PICDEM HPC Explorer

Demo Board's UART (DB-9).

Features:

• 8-pin socket for installation of MCP2122

(installed) and 14-pin socket for installation of

MCP2120

• Three Optical Transceiver circuits (1 installed)

• Headers to interface to low cost PICDEM Demo

Boards, including:

- • PICDEM™ HPC Explorer Demo Board

- • PICDEM™ LCD Demo Board

- • PICDEM™ FS USB Demo Board

- • PICDEM™ 2 Plus Demo Board

• Headers to easily connect to the user’s

embedded system

• Jumpers to select routing of MCP212X signals to

the PICDEM™ Demo Board Headers

• Jumpers to configure the operating mode of the

board

The MCP2120/MCP2150 Developer’s Kit has been

obsoleted but if you have access to one of these kits, it

can be used to demonstrate the operation of the

MCP2120.

MCP2120

NOTES:

MCP2120

4.0 ELECTRICAL CHARACTERISTICS

Absolute Maximum Ratings†

Ambient Temperature under bias........................................................................................................... –40°C to +125°C

Storage Temperature ............................................................................................................................. –65°C to +150°C

Voltage on VDD with respect to VSS .....................................................................................................................0 to +7V

Voltage on RESET with respect to VSS .............................................................................................................0 to +14V

Voltage on all other pins with respect to VSS ................................................................................. –0.6V to (VDD + 0.6V)

Total Power Dissipation (1) ...................................................................................................................................700 mW

Max. Current out of VSS pin ..................................................................................................................................150 mA

Max. Current into VDD pin .....................................................................................................................................125 mA

Input Clamp Current, IIK (VI < 0 or VI > VDD)................................................................................................................... ±20 mA

Output Clamp Current, IOK (V0 < 0 or V0 > VDD)............................................................................................................. ±20 mA

Max. Output Current sunk by any Output pin..........................................................................................................25 mA

Max. Output Current sourced by any Output pin.....................................................................................................25 mA

Note 1: Power Dissipation is calculated as follows:

PDIS = VDD x {IDD - ∑ IOH} + ∑ {(VDD-VOH) x IOH} + ∑(VOL x IOL)

†NOTICE: Stresses above those listed under "Maximum Ratings" may cause permanent damage to the device. This

is a stress rating only and functional operation of the device at those or any other conditions above those indicated in

the operation listings of this specification is not implied. Exposure to maximum rating conditions for extended periods

may affect device reliability.

MCP2120

FIGURE 4-1: Voltage-Frequency Graph, -40°C ≤ TA ≤ +85°C

6.0

2.5

4.0

3.0

3.5

4.5

5.0

5.5

410

Frequency (MHz)

VDD

(Volts)

2.0

81216

FMAX = (8.0 MHz/V) (VDDAPPMIN -2.5V) + 4 MHz

Note: VDDAPPMIN is the minimum voltage of the MCP2120 in the application.

MCP2120

4.1 DC Characteristics

DC Characteristics Standard Operating Conditions (unless otherwise specified)

Operating Temperature –40°C ≤ TA ≤ +85°C (industrial)

Param.

No. Sym Characteristic Min Typ(1) Max Units Conditions

D001 VDD Supply Voltage 2.5 — 5.5 V See Figure 4-1

D002 VDR RAM Data Retention

Voltage (2) 2.5 — — V Device Oscillator/Clock stopped

D003 VPOR VDD Start Voltage to

ensure Power-on

Reset

—VSS —V

D004 SVDD VDD Rise Rate to

ensure Power-on

Reset

0.05 — — V/ms

D010 IDD Supply Current (3) —

—

0.8

0.6

0.4

4.5

1.4

1.0

0.8

FOSC = 4 MHz, VDD = 5.5V

FOSC = 4 MHz, VDD = 3.0V

FOSC = 4 MHz, VDD = 2.5V

FOSC = 10 MHz, VDD = 3.0V

FOSC = 20 MHz, VDD = 4.5V

FOSC = 20 MHz, VDD = 5.5V

D020 IPD Device Disabled

Current (3, 4) —

—

0.25

0.4

5.5

µA

VDD = 3.0V, 0°C ≤ TA ≤ +70°C

VDD = 2.5V, 0°C ≤ TA ≤ +70°C

VDD = 4.5V, 0°C ≤ TA ≤ +70°C

VDD = 5.5V, –40°C ≤ TA ≤ +85°C

Note 1: Data in the Typical (“Typ”) column is based on characterization results at +25°C. This data is for design

guidance only and is not tested.

2: This is the limit to which VDD can be lowered without losing RAM data.

3: The supply current is mainly a function of the operating voltage and frequency. Pin loading, pin rate, and

temperature have an impact on the current consumption.

a) The test conditions for all IDD measurements are made when device is enabled (EN pin is high):

OSC1 = external square wave, from rail-to-rail; all input pins pulled to VSS, RXIR = VDD,

RESET =VDD;

b) When device is disabled (EN pin is low), the conditions for current measurements are the same.

4: When the device is disabled (EN pin is low), current is measured with all input pins tied to VDD or VSS and

the output pins driving a high or low level into infinite impedance.

MCP2120

DC Characteristics (Continued)

DC CHARACTERISTICS

Standard Operating Conditions (unless otherwise specified)

Operating temperature –40°C ≤ TA ≤ +85°C (industrial)

Operating voltage VDD range as described in DC spec Section 4.1 “DC

Characteristics”.

Param

No. Sym Characteristic Min Typ Max Units Conditions

Input Low Voltage

VIL Input pins

D030 with TTL buffer Vss — 0.8V V For all 4.5 ≤ VDD ≤ 5.5V

D030A Vss — 0.15VDD Votherwise

D031 with Schmitt Trigger

buffer

VSS —0.2VDD V

D032 RESET, RXIR VSS —0.2VDD V

D033 OSC1 VSS —0.3VDD V

Input High Voltage

VIH Input pins —

D040 with TTL buffer 2.0 — VDD V4.5 ≤ VDD ≤ 5.5V

D040A 0.25VDD

+ 0.8VDD

—VDD V

otherwise

D041 with Schmitt Trigger

buffer

0.8VDD —VDD V For entire VDD range

D042 RESET, RXIR 0.8VDD —VDD V

D043 OSC1 0.7VDD —VDD V

Input Leakage

Current (1, 2)

D060 IIL Input pins — — ±1 µA VSS ≤ VPIN ≤ VDD, Pin at

hi-impedance

D061 RESET ——±30µAVSS ≤ VPIN ≤ VDD

D063 OSC1 — — ±5 µA VSS ≤ VPIN ≤ VDD, XT, HS and LP

osc configuration

D070 Ipur weak pull-up current 50 250 400 µA VDD = 5V, VPIN = VSS

Note 1: The leakage current on the RESET pin is strongly dependent on the applied voltage level. The specified

levels represent normal operating conditions. Higher leakage current may be measured at different input

voltages.

2: Negative current is defined as coming out of the pin.

MCP2120

DC Characteristics (Continued)

DC CHARACTERISTICS

Standard Operating Conditions (unless otherwise specified)

Operating temperature –40°C ≤ TA ≤ +85°C (industrial)

Operating voltage VDD range as described in DC spec Section 4.1

“DC Characteristics”

Param

No. Sym Characteristic Min Typ Max Units Conditions

Output Low Voltage

D080 VOL TXIR, RX — — 0.6 V IOL = 8.5 mA, VDD = 4.5V,

–40°C to +85°C

D083 OSC2 — — 0.6 V IOL = 1.6 mA, VDD = 4.5V,

–40°C to +85°C

Output High Voltage

D090 VOH TXIR, RX (1) VDD - 0.7 — — V IOH = -3.0 mA, VDD = 4.5V,

–40°C to +85°C

D092 OSC2 VDD - 0.7 — — V IOH = -1.3 mA, VDD = 4.5V,

–40°C to +85°C

Capacitive Loading Specs

on Output Pins

D100 COSC2 OSC2 pin — — 15 pF when external clock is used

to drive OSC1.

D101 CIO All Input or Output pins — — 50 pF

Note 1: Negative current is defined as coming out of the pin.

MCP2120

4.2 Timing Parameter Symbology and Load Conditions

The timing parameter symbols have been created following one of the following formats:

4.2.1 TIMING CONDITIONS

The temperature and voltages specified in Table 4-2 apply to all timing specifications unless otherwise noted. Figure 4-

2 specifies the load conditions for the timing specifications.

TABLE 4-1: SYMBOLOGY

TABLE 4-2: AC TEMPERATURE AND VOLTAGE SPECIFICATIONS

FIGURE 4-2: Load Conditions for Device Timing Specifications

1. TppS2ppS 2. TppS

F Frequency T Time

E Error

Lowercase letters (pp) and their meanings:

io Input or Output pin osc Oscillator

rx Receive tx Transmit

bitclk RX/TX BITCLK RST Reset

drt Device Reset Timer

Uppercase letters and their meanings:

F Fall P Period

H High R Rise

I Invalid (Hi-impedance) V Valid

L Low Z Hi-impedance

AC CHARACTERISTICS

Standard Operating Conditions (unless otherwise stated)

Operating temperature –40°C ≤ TA ≤ +85°C (industrial)

Operating voltage VDD range as described in DC spec Section 4.1 “DC Character-

istics”.

VSS

CLCL = 50 pF for all pins except OSC2

15 pF for OSC2 when external clock is used to drive OSC1

MCP2120

4.3 Timing Diagrams and Specifications

FIGURE 4-3: External Clock Timing

TABLE 4-3: EXTERNAL CLOCK TIMING REQUIREMENTS

AC Characteristics

Standard Operating Conditions (unless otherwise specified)

Operating Temperature –40°C ≤ TA ≤ +85°C (industrial)

Operating Voltage VDD range is described in Section 4.1 “DC

Characteristics”

Param.

No. Sym Characteristic Min Typ(1) Max Units Conditions

1TOSC External CLKIN Period (2,3) 50 — — ns

Oscillator Period (2) 50 — 500 ns

1A FOSC External CLKIN

Frequency (2,3) DC — 20 MHz

Oscillator Frequency (2) 2—20MHz

1C ECLK Clock Error — — 0.01 %

3TosL,

TosH

Clock in (OSC1)

Low or High Time

10 — — ns

4TosR,

TosF

Clock in (OSC1)

Rise or Fall Time

— — 15 ns

Note 1: Data in the Typical (“Typ”) column is at 5V, +25°C unless otherwise stated. These parameters are for

design guidance only and are not tested.

2: All specified values are based on characterization data for that particular oscillator type under standard

operating conditions with the device executing code. Exceeding these specified limits may result in an

unstable oscillator operation and/or higher than expected current consumption.

When an external clock input is used, the “max” cycle time limit is “DC” (no clock) for all devices.

3: A duty cycle of no more than 60/40 (High Time / Low Time or Low Time / High Time) is recommended for

external clock inputs.

OSC1

Q4 Q1 Q2 Q3 Q4 Q1

133

MCP2120

FIGURE 4-4: I/O Waveform

TABLE 4-4: I/O TIMING REQUIREMENTS

AC Characteristics

Standard Operating Conditions (unless otherwise specified)

Operating Temperature –40°C ≤ TA ≤ +85°C (industrial)

Operating Voltage VDD range is described in Section 4.1 “DC

Characteristics”

Param.

No. Sym Characteristic Min Typ(1) Max Units Conditions

17 TosH2ioV OSC1↑ (Q1 cycle) to Output

valid (2) ——100ns

18 TosH2ioI OSC1↑ (Q2 cycle) to Input

invalid (I/O in hold time)

200 — — ns

19 TioV2osH Input valid to OSC1↑

(I/O in setup time)

0——ns

20 ToR RX and TXIR pin rise time (2) —1025ns

21 ToF RX and TXIR pin fall time (2) —1025ns

Note 1: Data in the Typical (“Typ”) column is at 5V, +25°C unless otherwise stated.

2: See Figure 4-2 for loading conditions.

OSC1

Input Pin

Output Pin

Q4 Q1 Q2 Q3

20, 21

Old Value New Value

Note: Refer to Figure 4-2 for load conditions.

MCP2120

FIGURE 4-5: Reset and Device Reset Timer Timing

TABLE 4-5: RESET AND DEVICE RESET TIMER REQUIREMENTS

AC Characteristics

Standard Operating Conditions (unless otherwise specified)

Operating Temperature –40°C ≤ TA ≤ +85°C (industrial)

Operating Voltage VDD range is described in Section 4.1 “DC

Characteristics”

Param.

No. Sym Characteristic Min Typ(1) Max Units Conditions

30 TRSTL RESET Pulse Width (low) 2000 — — ns VDD = 5.0 V

31 TLPT Low Power Time-out Period 9 18 30 ms VDD = 5.0 V

32 TDRT Device Reset Timer Period 9 18 30 ms VDD = 5.0 V

34 TioZ Output Hi-impedance from

RESET Low or device Reset

— — 2 µs

Note 1: Data in the Typical (“Typ”) column is at 5V, 25°C unless otherwise stated.

VDD

RESET

DRT

Time-out

Internal

RESET

Low Power

Timer

Reset

Output pin

32 32

MCP2120

FIGURE 4-6: USART ASynchronous Transmission Waveform

TABLE 4-6: USART ASYNCHRONOUS TRANSMISSION REQUIREMENTS

AC Characteristics

Standard Operating Conditions (unless otherwise specified)

Operating Temperature –40°C ≤ TA ≤ +85°C (industrial)

Operating Voltage VDD range is described in Section 4.1 “DC

Characteristics”

Param.

No. Sym Characteristic Min Typ Max Units Conditions

IR100 TTXBIT Transmit Baud rate Hardware Selection

768 — 768 TOSC BAUD2:BAUD0 = 000

384 — 384 TOSC BAUD2:BAUD0 = 001

192 — 192 TOSC BAUD2:BAUD0 = 010

128 — 128 TOSC BAUD2:BAUD0 = 011

64 — 64 TOSC BAUD2:BAUD0 = 100

Software Selection

BAUD2:BAUD0 = 111

768 — 768 TOSC Hex Command = 0x87

384 — 384 TOSC Hex Command = 0x8B

192 — 192 TOSC Hex Command = 0x85

128 — 128 TOSC Hex Command = 0x83

64 — 64 TOSC Hex Command = 0x81

IR101 ETXBIT Transmit (TX pin) Baud rate

Error (into MCP2120)

——1%

IR102 ETXIRBIT Transmit (TXIR pin) Baud rate

Error (out of MCP2120)(1) ——1%

IR103 TTXRF TX pin rise time and fall time — — 25 ns

Note 1: This error is not additive to IR101 parameter.

Note: Refer to Figure 4-2 for load conditions.

IR103

TX pin

IR100

IR103

IR100 IR100 IR100

Start Bit Data Bit Data Bit Data Bit

MCP2120

FIGURE 4-7: USART ASynchronous Receive Timing

TABLE 4-7: USART ASYNCHRONOUS RECEIVE REQUIREMENTS

AC Characteristics

Standard Operating Conditions (unless otherwise specified)

Operating Temperature –40°C ≤ TA ≤ +85°C (industrial)

Operating Voltage VDD range is described in Section 4.1 “DC

Characteristics”

Param.

No. Sym Characteristic Min Typ Max Units Conditions

IR110 TRXBIT Receive Baud Rate Hardware Selection

768 — 768 TOSC BAUD2:BAUD0 = 000

384 — 384 TOSC BAUD2:BAUD0 = 001

192 — 192 TOSC BAUD2:BAUD0 = 010

128 — 128 TOSC BAUD2:BAUD0 = 011

64 — 64 TOSC BAUD2:BAUD0 = 100

Software Selection

BAUD2:BAUD0 = 111

768 — 768 TOSC Hex Command = 0x87

384 — 384 TOSC Hex Command = 0x8B

192 — 192 TOSC Hex Command = 0x85

128 — 128 TOSC Hex Command = 0x83

64 — 64 TOSC Hex Command = 0x81

IR111 ERXBIT Receive (RXIR pin) Baud rate

Error (into MCP2120)

——1%

IR112 ERXBIT Receive (RX pin) Baud rate

Error (out of MCP2120)(1) ——1%

IR113 TTXRF RX pin rise time and fall time — — 25 ns

Note 1: This error is not additive to IR111 parameter.

Note: Refer to Figure 4-2 for load conditions.

IR112

RX pin

IR112

IR110 IR110 IR110

Start Bit Data Bit Data Bit Data Bit

IR110

MCP2120

FIGURE 4-8: TX and TXIR Waveforms

TABLE 4-8: TX AND TXIR REQUIREMENTS

AC Characteristics

Standard Operating Conditions (unless otherwise specified)

Operating Temperature –40°C ≤ TA ≤ +85°C (industrial)

Operating Voltage VDD range is described in Section 4.1 “DC

Characteristics”

Param.

No. Sym Characteristic Min Typ Max Units Conditions

IR100 TTXBIT Transmit Baud Rate Hardware Selection

768 — 768 TOSC BAUD2:BAUD0 = 000

384 — 384 TOSC BAUD2:BAUD0 = 001

192 — 192 TOSC BAUD2:BAUD0 = 010

128 — 128 TOSC BAUD2:BAUD0 = 011

64 — 64 TOSC BAUD2:BAUD0 = 100

8 Software Selection

BAUD2:BAUD0 = 111

768 — 768 TOSC Hex Command = 0x87

384 — 384 TOSC Hex Command = 0x8B

192 — 192 TOSC Hex Command = 0x85

128 — 128 TOSC Hex Command = 0x83

64 — 64 TOSC Hex Command = 0x81

IR120 TTXL2TXIRH TX falling edge (↓) to

TXIR rising edge (↑) (1) 7TBITCLK

- 8.34 µs

77T

BITCLK

+ 8.34 µs

TBITCLK

IR121 TTXIRPW TXIR pulse width 12 — 12 TOSC

IR122 TTXIRP TXIR bit period (1) —16—TBITCLK

Note 1: TBITCLK = TTXBIT/16

BITCLK

TXIR

0100 01

IR100

IR121

IR120

Start Bit Data bit 7 Data bit 6 Data bit 5 Data bit ...

IR122 IR122 IR122 IR122 IR122 IR122

MCP2120

FIGURE 4-9: RXIR and RX Waveforms

TABLE 4-9: RXIR REQUIREMENTS

AC Characteristics

Standard Operating Conditions (unless otherwise specified)

Operating Temperature –40°C ≤ TA ≤ +85°C (industrial)

Operating Voltage VDD range is described in Section 4.1 “DC

Characteristics”

Param.

No. Sym Characteristic Min Typ Max Units Conditions

IR110 TRXBIT Receive Baud Rate Hardware Selection

768 — 768 TOSC BAUD2:BAUD0 = 000

384 — 384 TOSC BAUD2:BAUD0 = 001

192 — 192 TOSC BAUD2:BAUD0 = 010

128 — 128 TOSC BAUD2:BAUD0 = 011

64 — 64 TOSC BAUD2:BAUD0 = 100

Software Selection

BAUD2:BAUD0 = 111

768 — 768 TOSC Hex Command = 0x87

384 — 384 TOSC Hex Command = 0x8B

192 — 192 TOSC Hex Command = 0x85

128 — 128 TOSC Hex Command = 0x83

64 — 64 TOSC Hex Command = 0x81

IR130 TRXIRL2RXH RXIR falling edge (↓) to RX

falling edge (↓) (1) 8TBITCLK

- 8.34 µs

88T

BITCLK

+ 8.34 µs

TBITCLK

IR131A TRXIRPW RXIR pulse width 3 — 3 TOSC

IR132 TRXIRP RXIR bit period (1) —16—TBITCLK

Note 1: TBITCLK = TRXBIT/16

BITCLK

RXIR

01 00 01

IR131A

IR110

IR131B IR131B IR131B IR131B IR131B IR131B

IR130

Start Bit Data bit 7 Data bit 6 Data bit 5 Data bit ...

MCP2120

FIGURE 4-10: Command Mode: TX and RX Waveforms

TABLE 4-10: TX AND TXIR REQUIREMENTS

AC Characteristics

Standard Operating Conditions (unless otherwise specified)

Operating Temperature –40°C ≤ TA ≤ +85°C (industrial)

Operating Voltage VDD range is described in Section 4.1

“DC Characteristics”

Param.

No. Sym Characteristic Min Typ Max Units Conditions

IR140A BTX Transmit Baud Rate 16 — 16 TBITCLK

IR140B BRX Receive Baud Rate 16 — 16 TBITCLK

IR141 TTXE2RXE TX edge to RX edge (delay) 5.5 8 10.5 TBITCLK

IR142 TRXP2TXS Delay from RX Stop bit complete

to TX Start bit (new baud rate)

——0TOSC

BITCLK

Start Bit Data bit 7 Data bit 6 Data bit ... Stop bit

IR140B IR140B IR140B IR140B IR140B IR140B

IR140A IR140A IR140A

IR141

IR140A IR140A IR140A

Start Bit Data bit 7

IR142

(new Baud rate)

MCP2120

5.0 DC AND AC CHARACTERISTICS GRAPHS AND TABLES

The graphs and tables provided in this section are for design guidance and are not tested. In some graphs or tables the

data presented is outside specified operating range (e.g., outside specified VDD range). This is for information only and

devices will operate properly only within the specified range.

The data presented in this section is a statistical summary of data collected on units from different lots over a period of

time. “Typical” represents the mean of the distribution while “max” or “min” represents (mean + 3s) and (mean – 3s)

respectively, where s is standard deviation.

FIGURE 5-1: Short DRT Period Vs. VDD

950

850

750

650

550

450

350

250

150

00 2.5 3.5 4.5 5.5 6.5

VDD (Volts)

DRT period (µs)

Max +85°C

Typ +25°C

MIn –40°C

MCP2120

FIGURE 5-2: IOH vs. VOH, VDD = 2.5V

FIGURE 5-3: IOH vs. VOH, VDD = 5.5V

FIGURE 5-4: IOL vs. VOL, VDD = 2.5V

FIGURE 5-1: IOL vs. VOL, VDD = 5.5V

500m 1.0 1.5

VOH (Volts)

IOH (mA)

2.0 2.5

-1

-2

-3

-4

-5

-6

-7

Max –40°C

Typ +25°C

Min +85°C

3.5 4.0 4.5

VOH (Volts)

IOH (mA)

5.0 5.5

-5

-10

-15

-20

-25

-30

Typ +25°C

Min +85°C

Max –40°C

250.0m 500.0m 1.0

VOL (Volts)

IOL (mA)

Min +85°C

Max –40°C

Typ +25°C

500.0m 750.0m 1.0

VOL (Volts)

IOL (mA)

250.0m

Min +85°C

Max –40°C

Typ +25°C

MCP2120

6.0 PACKAGING INFORMATION

6.1 Package Marking Information

14-Lead PDIP (300 mil) Example:

14-Lead SOIC (150 mil) Example:

XXXXXXXX

XXXXXNNN

YYWW

XXXXXXX

YYWWNNN

MCP2120

PSAZNNN

YYWW

MCP2120

/SL

YYWWNNN

Legend: XX...X Customer-specific information

Y Year code (last digit of calendar year)

YY Year code (last 2 digits of calendar year)

WW Week code (week of January 1 is week ‘01’)

NNN Alphanumeric traceability code

Pb-free JEDEC designator for Matte Tin (Sn)

*This package is Pb-free. The Pb-free JEDEC designator ( )

can be found on the outer packaging for this package.

Note: In the event the full Microchip part number cannot be marked on one line, it will

be carried over to the next line, thus limiting the number of available

characters for customer-specific information.

MCP2120

14-Lead Plastic Dual In-Line (P) – 300 mil Body [PDIP]

Notes:

1. Pin 1 visual index feature may vary, but must be located with the hatched area.

2. § Significant Characteristic.

3. Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed .010" per side.

4. Dimensioning and tolerancing per ASME Y14.5M.

BSC: Basic Dimension. Theoretically exact value shown without tolerances.

Note: For the most current package drawings, please see the Microchip Packaging Specification located at

http://www.microchip.com/packaging

Units INCHES

Dimension Limits MIN NOM MAX

Number of Pins N 14

Pitch e .100 BSC

Top to Seating Plane A – – .210

Molded Package Thickness A2 .115 .130 .195

Base to Seating Plane A1 .015 – –

Shoulder to Shoulder Width E .290 .310 .325

Molded Package Width E1 .240 .250 .280

Overall Length D .735 .750 .775

Tip to Seating Plane L .115 .130 .150

Lead Thickness c .008 .010 . 015

Upper Lead Width b1 .045 .060 .070

Lower Lead Width b .014 .018 .022

Overall Row Spacing § eB – – . 430

NOTE 1

123

A1 b1

Microchip Technology Drawing C04-005B

MCP2120

14-Lead Plastic Small Outli ne (SL) – Narrow, 3.90 mm Body [SOIC]

Notes:

1. Pin 1 visual index feature may vary, but must be located within the hatched area.

2. § Significant Characteristic.

3. Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed 0.15 mm per side.

4. Dimensioning and tolerancing per ASME Y14.5M.

BSC: Basic Dimension. Theoretically exact value shown without tolerances.

REF: Reference Dimension, usually without tolerance, for information purposes only.

Note: For the most current package drawings, please see the Microchip Packaging Specification located at

http://www.microchip.com/packaging

Units MILLMETERS

Dimension Limits MIN NOM MAX

Number of Pins N 14

Pitch e 1.27 BSC

Overall Height A – – 1.75

Molded Package Thickness A2 1.25 – –

Standoff § A1 0.10 – 0. 25

Overall Width E 6.00 BSC

Molded Package Width E 1 3.90 BSC

Overall Length D 8.65 BSC

Chamfer (optional) h 0.25 – 0.50

Foot Length L 0.40 – 1. 27

Footprint L1 1.04 REF

Foot Angle φ0° – 8°

Lead Thickness c 0.17 – 0.25

Lead Width b 0.31 – 0. 51

Mold Draft Angle Top α5° – 15°

Mold Draft Angle Bottom β5° – 15°

NOTE 1

123

hα

Microchip Technology Drawing C04-065B

MCP2120

FIGURE 6-1: EMBOSSED CARRIER DIMENSIONS (16 MM TAPE)

FIGURE 6-2: SOIC DEVICE

Top

Cover

Tape

TABLE 6-1: CARRIER TAPE/CAVITY DIMENSIONS

Case

Outline

Package

Type

Carrier

Dimensions

Cavity

Dimensions Output

Quantity

Units

Reel

Diameter in

SL SOIC .150” 14L 16 8 6.5 9.5 2.1 2600 330

User Direction of Feed

P, Pitch

Pin 1

Reverse Reel Component Orientation

W, Width

of Carrier

Tape

Standard Reel Component Orientation

MCP2120

APPENDIX A: REVISION HISTORY

Revision B (February 2007)

• Updated Development Tools section

• Update packaging outline drawings

• Updates Product Identification System section.

Revision A (March 2001)

• Initial release of this document

NOTES:

MCP2120

PRODUCT IDENTIFICATION SYSTEM

To order or obtain information, e.g., on pricing or delivery, refer to the factory or the listed sales office.

Device MCP2120: Infrared Encoder/Decoder

MCP2120T: Infrared Encoder/Decoder, Tape and Reel

Temperature Range I = -40×C to+85×C

Package P = Plastic DIP (300 mil, Body), 14-lead

SL = Plastic SOIC (150 mil, Body), 14-lead

PART NO. X/XX

PackageTemperature

Range

Device

Examples:

a) MCP2120-I/P: Industrial Temperature,

PDIP packaging

b) MCP2120-I/SL: Industrial Temperature,

SOIC package

c) MCP2120T-I/SL: Tape and Reel,

Industrial Temperature,

SOIC package

MCP2120

NOTES:

Information contained in this publication regarding device

applications and the like is provided only for your convenience

and may be superseded by updates. It is your responsibility to

ensure that your application meets with your specifications.

MICROCHIP MAKES NO REPRESENTATIONS OR

WARRANTIES OF ANY KIND WHETHER EXPRESS OR

IMPLIED, WRITTEN OR ORAL, STATUTORY OR

OTHERWISE, RELATED TO THE INFORMATION,

INCLUDING BUT NOT LIMITED TO ITS CONDITION,

QUALITY, PERFORMANCE, MERCHANTABILITY OR

FITNESS FOR PURPOSE. Microchip disclaims all liability

arising from this information and its use. Use of Microchip

devices in life support and/or safety applications is entirely at

the buyer’s risk, and the buyer agrees to defend, indemnify and

hold harmless Microchip from any and all damages, claims,

suits, or expenses resulting from such use. No licenses are

conveyed, implicitly or otherwise, under any Microchip

intellectual property rights.

Trademarks

The Microchip name and logo, the Microchip logo, Accuron,

dsPIC, KEELOQ, KEELOQ logo, microID, MPLAB, PIC,

PICmicro, PICSTART, PRO MATE, PowerSmart, rfPIC, and

SmartShunt are registered trademarks of Microchip

Technology Incorporated in the U.S.A. and other countries.

AmpLab, FilterLab, Linear Active Thermistor, Migratable

Memory, MXDEV, MXLAB, PS logo, SEEVAL, SmartSensor

and The Embedded Control Solutions Company are

registered trademarks of Microchip Technology Incorporated

in the U.S.A.

Analog-for-the-Digital Age, Application Maestro, CodeGuard,

dsPICDEM, dsPICDEM.net, dsPICworks, ECAN,

ECONOMONITOR, FanSense, FlexROM, fuzzyLAB,

In-Circuit Serial Programming, ICSP, ICEPIC, Mindi, MiWi,

MPASM, MPLAB Certified logo, MPLIB, MPLINK, PICkit,

PICDEM, PICDEM.net, PICLAB, PICtail, PowerCal,

PowerInfo, PowerMate, PowerTool, REAL ICE, rfLAB,

rfPICDEM, Select Mode, Smart Serial, SmartTel, Total

Endurance, UNI/O, WiperLock and ZENA are trademarks of

Microchip Technology Incorporated in the U.S.A. and other

countries.

SQTP is a service mark of Microchip Technology Incorporated

in the U.S.A.

All other trademarks mentioned herein are property of their

respective companies.

Printed on recycled paper.

Note the following details of the code protection feature on Microchip devices:

• Microchip products meet the specification contained in their particular Microchip Data Sheet.

• Microchip believes that its family of products is one of the most secure families of its kind on the market today, when used in the

intended manner and under normal conditions.

• There are dishonest and possibly illegal methods used to breach the code protection feature. All of these methods, to our

knowledge, require using the Microchip products in a manner outside the operating specifications contained in Microchip’s Data

Sheets. Most likely, the person doing so is engaged in theft of intellectual property.

• Microchip is willing to work with the customer who is concerned about the integrity of their code.

• Neither Microchip nor any other semiconductor manufacturer can guarantee the security of their code. Code protection does not

mean that we are guaranteeing the product as “unbreakable.”

Code protection is constantly evolving. We at Microchip are committed to continuously improving the code protection features of our

products. Attempts to break Microchip’s code protection feature may be a violation of the Digital Millennium Copyright Act. If such acts

allow unauthorized access to your software or other copyrighted work, you may have a right to sue for relief under that Act.

Microchip received ISO/TS-16949:2002 certification for its worldwide

headquarters, design and wafer fabrication facilities in Chandler and

Tempe, Arizona, Gresham, Oregon and Mountain View, California. The

Company’s quality system processes and procedures are for its PIC®

MCUs and dsPIC® DSCs, KEELOQ® code hopping devices, Serial

EEPROMs, microperipherals, nonvolatile memory and analog

products. In addition, Microchip’s quality system for the design and

manufacture of development systems is ISO 9001:2000 certified.

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12/08/06