MCP25055-I/P - Microchip Technology

MCP250XX

The Device# parts you have received conform function-

ally to the Device Data Sheet (DS21664D), except for

the anomalies described below.

These Errata are associated with the following Micro-

chip devices:

- MCP25020

- MCP25025

- MCP25050

- MCP25055

All of the issues li sted here wi ll be addressed in future

revisions of the MCP250XX silicon.

1. Module: CAN

The CAN module may send a passive error flag

earlier than expected. This will occur at the transi-

tion point of error active to error passive, TEC

(Transmit Error Count), or REC (Receive Error

Count) ≥ 128.

Work around

None

Date Codes that pertain to this issue:

All engineering and production devices.

2. Module: CAN

The CAN module may not synch ronize correctly if

there is a phase error between nodes that is equal

to the Synchronization Jump Width (SJW). As a

result, the module may request retransmission of

messages from the transmitting node (via an Error

Frame).

Work around

Use the longest SJW possible that will work with

the application.

Date Codes that pertain to this issue:

All engineering and production devices.

3. Module: Control Logic

The device may exceed the maximum standby

current specification (IDDS) when it is initially

placed into SLEEP mode (OPTREG2.SLPEN bit is

set).

This condition ma y peak at ≥ 2 mA for a duration

of ≤ 10 seconds, up to 5 seconds after the SLEEP

mode command is received, with the magnitude

and length of time being dependent on external

conditions, including de vice voltage and tempera-

ture range.

Work arou nd

None

Date Codes that pertain to this issue:

All engineering and production devices.

4. Module: CAN TX Module

If an error frame occurs on the CAN bus during

message transmission by the MCP250XX, the

internal flags are cleared, however, the internal

byte counter does not clear. This causes the

retransmitted message to become corrupted.

Work arou nd

The CAN node(s) interested in MCP250XX mes-

sages should discard the subse quent MCP250XX

message after an error frame is detected on the

bus.

Date Codes that pertain to this issue:

All engineering and production devices.

CLARIFICATIONS/CORRECTIONS TO

THE DATA SHEET:

In the Device Data Sheet (DS21664D), the following

clarifications and corrections should be noted.

•None

MCP250XX Rev. A2 Silicon Errata

MCP250XX

APPENDIX A: REVISION HISTORY

Revision B Document (9/2008)

1. Added CAN TX Module.

Revision A Document (10/2001)

Initial release of this document..

APPENDIX B: SILICON REVISION

HISTORY

The following table and package marking information

indicates how to determine the revision of the

MCP250XX devices. The revision information can be

determined by the Year and Week Code of the

manufacturer printed on the device.

TABLE B-1: SILICON REVISION/DEVICE

MARKING

Silicon

Revision

YYWWNNN Comments

Start Date End Date

Rev A2 All All In Production

Rev A1 — —

Legend: “N” is any alphanumeric character.

Information contained in this publication regarding device

applications and the like is provided only for your convenience

and may be superseded by updates. It is your responsibility to

ensure that your application meets with your specifications.

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OTHERWISE, RELATED TO THE INFORMATION,

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arising from this information and its use. Use of Microchip

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conveyed, implicitly or otherwise, under any Microchip

intellectual property rights.

Trademarks

The Microchip name and logo, the Microchip logo, Accuron,

dsPIC, KEELOQ, KEELOQ logo, MPLAB, PIC, PICmicro,

PICSTART, rfPIC, SmartShunt and UNI/O are registered

trademarks of Microchip Technology Incorporated in the

U.S.A. and other countries.

FilterLab, Linear Active Thermistor, MXDEV, MXLAB,

SEEV AL, SmartSensor and The Embedded Control Solutions

Company are registered trademarks of Microchip Technology

Incorporated in the U.S.A.

Analog-for-the-Digital Age, Application Maestro, CodeGuard,

dsPICDEM, dsPICDEM.net, dsPICworks, dsSPEAK, ECAN,

ECONOMONITOR, FanSense, In-Circuit Serial

Programming, ICSP, ICEPIC, Mindi, MiWi, MPASM, MPLAB

Certified logo, MPLIB, MPLINK, mTouch, PICkit, PICDEM,

PICDEM.net, PICtail, PIC32 logo, PowerCal, PowerInfo,

PowerMate, PowerTool, REAL ICE, rfLAB, Select Mode, T ot al

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Microchip Technology Incorporated in the U.S.A. and other

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SQTP is a service mark of Microchip T echnology Incorporated

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All other trademarks mentioned herein are property of their

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Printed on recycled paper.

Note the following details of the code protection feature on Microchip devices:

• Microchip products meet the specification contained in their particular Microchip Data Sheet.

• Microchip believes that its family of products is one of the most secure families of its kind on the market today, when used in the

intended manner and under normal conditions.

• There are dishonest and possibly illegal methods used to breach the code protection feature. All of these methods, to our

knowledge, require using the Microchip products in a manner outside the operating specifications contained in Microchip’s Dat a

Sheets. Most likely, the person doing so is engaged in theft of intellectual p roperty.

• Microchip is willing to work with the customer who is concerned about the integrity of their code.

• Neither Microchip nor any other semiconductor manufacturer can guarantee the security of their code. Code protection does not

mean that we are guaranteeing the product as “unbreakable.”

Code protection is constantly evolving. We at Microchip are committed to continuously improving the code protection featur es of our

products. Attempts to break Microchip’ s code protection feature may be a violation of the Digit al Millennium Copyright Act. If such acts

allow unauthorized access to you r software or other copyrighted work, you may have a right to sue for relief under that Act.

Microchip received ISO/TS-16949:200 2 certif ication for its worldwide

headquarters, design and wafer fabrication facilities in Chandler and

Tempe, Arizona; Gresham, Oregon and design centers in California

and India. The Company’s quality system processes and procedures

are for its PIC® MCUs and dsPIC® DSCs, KEELOQ® code hopping

devices, Serial EEPROMs, microperi pherals, nonvola tile memo ry and

analog product s. In addition, Microchip ’s quality system for the design

and manufacture of development systems is ISO 9001:2000 certified.

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