DATA SHEE
T
CURRENT SENSOR - LOW TCR
PR/PF-Power enhancement series (Pb Free)
5%, 1%
sizes 1206/2010/2512
Product specification – Aug 11, 2005 V.0
Chip Resistor Surface Mount PR/PF-Power enhancement
Product specification
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SERIES
1206/2010/2512 (Pb Free)
SCOPE
This specification describes PR/PF-Power enhancement series current sensor - low TCR with lead-free terminations.
ORDERING INFORMATION
Part number is identified by the series, size, tolerance, packing type, temperature coefficient, taping reel and
resistance value.
P
PH
HY
YC
CO
OM
MP
P
O
OR
RD
DE
ER
RI
IN
NG
G
C
CO
OD
DE
E
12NC CODE
2350 / 2322 XXX XXXXX L
(1) (2) (3) (4)
EMBOSSED (2)
TAPE ON REEL
PAPER (units) (2)
TAPE ON REEL
SIZE TYPE START
IN (1)
TOL.
(%)
RESISTANCE
RANGE
4,000 4,000
PR series
2010 PR2010
2322 ±5% 0.002 to 0.006 Ω 760 65xxx -
PR2010
2322 ±1% 0.002 to 0.006 Ω 761 13xxx -
2512 MPRC221
2322 ±5% 0.001 to 0.005 Ω 762 10xxx -
MPRC221
2322 ±1% 0.001 to 0.005 Ω 763 10xxx -
PF series
1206 PF1206
2350 ±5% 0.006 to 1 Ω - 510 27xxx
PF1206
2350 ±1% 0.006 to 1 Ω - 510 28xxx
2010 PF2010
2322 ±5% 0.007 to 1 Ω 760 66xxx -
PF2010
2322 ±1% 0.007 to 1 Ω 760 14xxx -
2512 PF2512
2322 ±5% 0.006 to 1 Ω 764 10xxx -
PF2512
2322 ±1% 0.006 to 1 Ω 764 30xxx -
Resistance decade (3) Last digit
0.001 to 0.0976 X 0
0.1 to 0.976 X 7
1 to 9.76 X 8
Example: 0.02
X = 200
0.3 X = 307
1
X = 108
Last digit of 12NC
ORDERING EXAMPLE
The ordering code of a MPRC221
resistor with 2W power rating,
value 0.005 X with ±1%
tolerance, supplied in tape of
4,000 units per reel is:
232276210050L.
NOTE
a. The “L” at the end of the code is only
for ordering. On the reel label, the
standard CTC will be mentioned an
additional stamp “LFP”= lead free
production.
b. Products with lead in terminations fulfil
t
he same requirements as mentioned in
this datasheet.
c. Products with lead in terminations will
be phased out in the coming months
(before July 1st, 2006).
(1) The resistors have a 12-digit
ordering code starting with
2350/2322.
(2) The subsequent 5 digits
indicate the resistor
tolerance and packaging.
(3) The remaining 3 digits
represent the resistance
value with the last digit
indicating the multiplier as
shown in the table of “Last
digit of 12NC”.
(4) “L” means lead-free
terminations (a).
Chip Resistor Surface Mount PR/PF-Power enhancement
Product specification
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SERIES
1206/2010/2512 (Pb Free)
CTC CODE
PR/PF XXXX X X X XX XXXX L
(1) (2) (3) (4) (5)(6) (7) (8)
(1) SIZE
1206
2010
2512
(2) TOLERANCE
F = ±1%
J = ±5%
(3) PACKAGING TYPE
R = Paper taping reel
K = Embossed taping reel
(4) TEMPERATURE COEFFICIENT OF RESISTANCE
F = ±100 ppm/°C
G = ±200 ppm/°C
(5) TAPING REEL
7 = 7 inch dia. Reel
(6) POWER RATING
W = 2 x standard power (d)
(7) RESISTANCE VALUE
PR series: 0R001, 0R002, 0R003, 0R004, 0R005.
(0R0015 also available on request)
PF series: 0R006, 0R056, 0R56, 1R
(8) RESISTOR TERMINATIONS
L = Lead free terminations (matte tin) (a)
ORDERING EXAMPLE
The ordering code of a PR2512 chip resistor with
2W power rating, value 0.005 X with ±1% tolerance,
supplied in 7-inch tape reel is:
PR2512FKF7W0R005L.
NOTE
a. The “L” at the end of the code is only for ordering. On the reel
label, the standard CTC will be mentioned an additional stamp
“LFP”= lead free production.
b. Products with lead in terminations fulfil the same requirements
as mentioned in this datasheet.
c. Products with lead in terminations will be phased out in the
coming months (before July 1st, 2006).
d. Standard power for size 1206 is 1/4 Watt, size 2010 is 1/2 Watt,
and size 2512 is 1 Watt.
Chip Resistor Surface Mount PR/PF-Power enhancement
Product specification
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CONSTRUCTION
The resistors are constructed using outstanding TCR level material, which makes Yageo PR/PF resistors
excellent for current sensing application in battery charger circuit & DC-DC converter.
The composition of the resistive material is adjusted to give the approximate required resistance and is
covered with a protective coating, which printed with the resistance value.
Finally, the two external terminations (matte Tin) are added. See fig. 3.
MARKING
1 mΩ ≤ R < 20 mΩ
4 digits: 10 mX ≤ R, E-24 series; and R = 1/2/3/4/5/6/7/8/9 mΩ
The “R” is used as a decimal point; the other 3 digits are significant.
20 mΩ ≤ R ≤ 1,000 mΩ
E-24 series: 4 digits
The “R” is used as a decimal point; the other 3 digits are significant.
For marking codes, please see EIA-marking code rules in data sheet “Chip resistors marking”.
Fig. 1 Value = 5 mΩ
ynsc016
Fig. 2 R820 = 820 mΩ
YNSC051
820
O
OU
UT
TL
LI
IN
NE
ES
S
overcoat
resistive layer
inner electrode
termination
ceramic substrate
H
I2
YNSC056
overcoat
W
L
I1
R005
I
1
I
2
Hend termination
protective coat
marking
W
metal substrate
end termination
protective coat
L
SCR020
Fig. 3 Chip resistor outlines
For dimension see Table 1 & 2
PR series PF series Note: construction will be
adjusted to resistance value
(only for PF series).
Chip Resistor Surface Mount PR/PF-Power enhancement
Product specification
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SERIES
1206/2010/2512 (Pb Free)
TYPE RESISTANCE RANGE L (mm) W (mm) H (mm) I1 (mm) I2 (mm)
PR2010 0.001 to 0.006 Ω 5.10 ±0.25 2.54 ±0.25 0.60 ±0.25 0.50 ±0.25 0.50 ±0.25
0.001 to 0.002 Ω 6.40 ±0.20 3.20 ±0.20 0.75 ±0.15 1.20 ±0.20 1.20 ±0.20
PR2512
0.003 to 0.005 Ω 6.40 ±0.20 3.20 ±0.20 0.55 ±0.15 0.60 ±0.20 0.60 ±0.20
Table 1 Chip resistor type and relevant physical dimensions for “PR-Power enhancement series”; see fig. 3
DIMENSION
TYPE RESISTANCE RANGE L (mm) W (mm) H (mm) I1 (mm) I2 (mm)
0.006 to 0.014 Ω 3.20 ±0.25 1.60 ±0.25 0.60 ±0.25 0.55 ±0.25 0.35 ±0.25
PF1206
0.015 to 1 Ω 3.20 ±0.25 1.60 ±0.25 0.60 ±0.25 0.55 ±0.25 0.75 ±0.25
0.007 to 0.014 Ω 5.10 ±0.25 2.54 ±0.25 0.60 ±0.25 1.00 ±0.25 0.45 ±0.25
PF2010
0.015 to 1 Ω 5.10 ±0.25 2.54 ±0.25 0.60 ±0.25 1.00 ±0.25 1.55 ±0.25
0.006 to 0.014 Ω 6.50 ±0.25 3.15 ±0.25 0.60 ±0.25 1.00 ±0.25 1.75 ±0.25
PF2512
0.015 to 1 Ω 6.50 ±0.25 3.15 ±0.25 0.60 ±0.25 1.00 ±0.25 0.60 ±0.25
Table 2 Chip resistor type and relevant physical dimensions for “PF-Power enhancement series” see fig. 3
ELECTRICAL CHARACTERISTICS
Table 3
TYPE / RESISTANCE RANGE TEMPERATURE COEFFICIENT OF RESISTANCE
2 mX 2 mX
<
R
<
7 mX
PR2010 2 mΩ ≤ R < 7 mΩ ±200 ppm/°C ±100 ppm/°C
1 mX
≤
R
≤
2 mX 2 mX
<
R
<
6 mX
PR series
PR2512 1 mΩ ≤ R < 6 mΩ ±200 ppm/°C ±100 ppm/°C
PF1206 6 mΩ ≤ R ≤ 1,000 mΩ ±100 ppm/°C
PF2010 7 mΩ ≤ R ≤ 1,000 mΩ ±100 ppm/°C
PF series
PF2512 6 mΩ ≤ R ≤ 1,000 mΩ ±100 ppm/°C
Chip Resistor Surface Mount PR/PF-Power enhancement
Product specification
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FOOTPRINT AND SOLDERING PROFILES
For recommended footprint and soldering profiles,
please see the special data sheet “Chip resistors
mounting”.
ENVIRONMENTAL DAT
A
For material declaration information (IMDS-data) of
the products, please see the separated info
“Environmental data” conformed to EU RoHS.
PACKING STYLE REEL DIMENSION PF 1206 PR/PF 2010 PR/PF 2512
Paper taping reel (R) 7" (178 mm) 4,000 --- ---
Embossed taping reel (K) 7" (178 mm) --- 4,000 4,000
NOTE
1. For Paper/PE/Embossed tape and reel specification/dimensions, please see the special data sheet “Packing” document.
PACKING STYLE AND P
A
CKAGING QUANTITY
Table 4 Packing style and packaging quantity
MRA632
70 100
−55 50
Tamb (°C)
(%Prated)
0
0
50
100
155
Pmax
Fig. 4 Maximum dissipation (Pmax) in percentage of rated power
as a function of the operating ambient temperature (Tamb)
FUNCTIONAL DESCRIPTION
O
OP
PE
ER
RA
AT
TI
IN
NG
GT
TE
EM
MP
PE
ER
RA
AT
TU
UR
RE
E
R
RA
AN
NG
GE
E
Range: –55°C to +155°C
P
PO
OW
WE
ER
R
R
RA
AT
TI
IN
NG
G
Each type rated power at 70°C:
PF1206=1/2 W; PR/PF2010=1 W;
PR/PF2512=2 W.
RATED VOLTAGE
The DC or AC (rms) continuous working voltage
corresponding to the rated power is determined by
the following formula:
V = √(P X R)
Where
V = Continuous rated DC or AC (rms) working voltage (V)
P = Rated power (W)
R = Resistance value (X)
Chip Resistor Surface Mount PR/PF-Power enhancement
Product specification
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TESTS AND REQUIREMENTS
TEST TEST METHOD PROCEDURE REQUIREMENTS
At +25/–55 °C and +25/+125 °C Temperature
Coefficient o
f
Resistance
(T.C.R.)
MIL-STD-202F-method 304;
JIS C 5202-4.8
Formula:
T.C.R= ------------------------- × 106 (ppm/°C)
Where
t1=+25 °C or specified room temperature
t2=–55 °C or +125 °C test temperature
R1=resistance at reference temperature in ohms
R2=resistance at test temperature in ohms
Refer to table 3
Thermal Shoc
k
MIL-STD-202F-method 107G;
IEC 60115-1 4.19
At –65 (+0/–10) °C for 2 minutes and at +125
(+10/–0) °C for 2 minutes; 25 cycles
±(0.5%+0.0005 Ω)
Low
Temperature
Operation
MIL-R-55342D-Para 4.7.4 At –65 (+0/–5) °C for 1 hour; RCWV applied
for 45 (+5/–0) minutes
±(0.5%+0.0005 Ω)
No visible damage
Short Time
Overload
MIL-R-55342D-Para 4.7.5;
IEC 60115-1 4.13
2.5 × RCWV applied for 5 seconds at room
temperature
±(0.5%+0.0005 Ω)
No visible damage
Resistance to
Soldering
Heat
MIL-STD-202F-method 210C;
IEC 60115-1 4.18
Unmounted chips; 260 ±5 °C for 10 ±1
seconds
±(0.5%+0.0005 Ω)
No visible damage
Life MIL-STD-202F-method 108A;
IEC 60115-1 4.25.1
At 70±2 °C for 1,000 hours; RCWV applied for
1.5 hours on and 0.5 hour off
±(1.0%+0.0005 Ω)
Solderabilit
y
MIL-STD-202F-method 208A;
IEC 60115-1 4.17
Solder bath at 245±3 °C
Dipping time: 2±0.5 seconds
Well tinned (≥95% covered)
No visible damage
Humidit
y
(steady state)
JIS C 5202 7.5;
IEC 60115-8 4.24.8
1,000 hours; 40±2 °C; 93(+2/–3)% RH
RCWV applied for 1.5 hours on and 0.5 hour of
f
±(0.5%+0.0005 Ω)
R2–R1
R1(t2–t1)
Table 5 Test condition, procedure and requirements
Chip Resistor Surface Mount PR/PF-Power enhancement
Product specification
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TEST TEST METHOD PROCEDURE REQUIREMENTS
Leaching EIA/IS 4.13B;
IEC 60115-8 4.18
Solder bath at 260±5 °C
Dipping time: 30±1 seconds
No visible damage
Moisture
Resistance
Heat
MIL-STD-202F-method 106F;
IEC 60115-1 4.24.2
42 cycles; total 1,000 hours
Shown as fig. 5
±(0.5%+0.0005 Ω)
No visible damage
High
Temperature
Exposure
MIL-STD-202 Method 108 Unpowered chips at =150 °C for 1,000 hours ±(1%+0.0005 Ω)
Table 5 Test condition, procedure and requirements (continued)
75
initial drying
24 hours
90 − 98% RH
80 − 98%
RH
temperature
tolerance
±2 °C (±3.6 °F)
unless otherwise
specified
initial measurements
as specified in 2.2
0
STEP1 STEP3STEP2
prior to first
cycle only
STEP4
one cycle 24 hours; repeat as specified in 2.5
voltage applied as specified in 2.4
circulation of conditioning air shall be at a
minimum cubic rate per minute equivalent to
10 times the volume of the chamber
STEP6 STEP7
HBK073
STEP5
51015
end of final cycle;
measurements
as specified in 2.7
optional sub-cycle if specified
(2.3); sub-cycle performed during
any 5 of the first 9 cycles; humidity
uncontrolled during sub-cycle
20
time [h]
temperature
[°C]
25
50
25
0
90 − 98% RH 90 − 98% RH
+10 °C (+18 °F)
−2 °C (−3.6 °F)
80 − 98%
RH
rate of change of temperature is unspecified,
however, specimens shall not be subjected to
radiant heating from chamber conditioning processes
Fig. 5 Moisture resistance test requirements
Chip Resistor Surface Mount PR/PF-Power enhancement
Product specification
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REVISION HISTORY
REVISION DATE CHANGE NOTIFICATION DESCRIPTION
Version 0 Aug 11, 2005 - - New datasheet for current sensor - low TCR PR/PF-Power enhancement
series, sizes of 1206/2010/2512, 1% and 5% with lead-free terminations
