DATA SHEET CURRENT SENSOR - LOW TCR PR/PF-Power enhancement series (Pb Free) 5%, 1% Product specification - Aug 11, 2005 V.0 sizes 1206/2010/2512 Product specification Chip Resistor Surface Mount PR/PF-Power enhancement SERIES 1206/2010/2512 (Pb Free) 2 9 SCOPE This specification describes PR/PF-Power enhancement series current sensor - low TCR with lead-free terminations. ORDERING INFORMATION Part number is identified by the series, size, tolerance, packing type, temperature coefficient, taping reel and resistance value. PHYCOMP ORDERING CODE 12NC CODE 2350 / 2322 XXX XXXXX L (1) SIZE TYPE (2) (3) (4) NOTE EMBOSSED (2) PAPER (units) (2) TAPE ON REEL TAPE ON REEL START TOL. RESISTANCE IN (1) (%) RANGE 4,000 4,000 PR series 2010 PR2010 2322 5% 0.002 to 0.006 760 65xxx - PR2010 2322 1% 0.002 to 0.006 761 13xxx - 2512 MPRC221 2322 5% 0.001 to 0.005 762 10xxx - MPRC221 2322 1% 0.001 to 0.005 763 10xxx - PF series 1206 PF1206 2350 5% 0.006 to 1 - 510 27xxx PF1206 2350 1% 0.006 to 1 - 510 28xxx 2010 PF2010 2322 5% 0.007 to 1 760 66xxx - PF2010 2322 1% 0.007 to 1 760 14xxx - 2512 PF2512 2322 5% 0.006 to 1 764 10xxx - PF2512 2322 1% 0.006 to 1 764 30xxx - (1) The resistors have a 12-digit ordering code starting with 2350/2322. (2) The subsequent 5 digits indicate the resistor tolerance and packaging. (3) The remaining 3 digits represent the resistance value with the last digit indicating the multiplier as shown in the table of "Last digit of 12NC". (4) "L" means lead-free terminations (a) . a. The "L" at the end of the code is only for ordering. On the reel label, the standard CTC will be mentioned an additional stamp "LFP"= lead free production. b. Products with lead in terminations fulfil the same requirements as mentioned in this datasheet. c. Products with lead in terminations will be phased out in the coming months (before July 1st, 2006). Last digit of 12NC Resistance decade (3) Last digit 0.001 to 0.0976 X 0 0.1 to 0.976 X 7 1 to 9.76 X Example: 8 0.02 X = 200 0.3 X = 307 1X = 108 ORDERING EXAMPLE The ordering code of a MPRC221 resistor with 2W power rating, value 0.005 X with 1% tolerance, supplied in tape of 4,000 units per reel is: 232276210050L. www.yageo.com Aug 11, 2005 V.0 Product specification Chip Resistor Surface Mount CTC PR/PF-Power enhancement SERIES 1206/2010/2512 (Pb Free) 3 9 CODE PR/PF XXXX X X X XX XXXX L (1) (2) (3) (4) (5)(6) (7) (8) (1) SIZE 1206 ORDERING EXAMPLE The ordering code of a PR2512 chip resistor with 2W power rating, value 0.005 X with 1% tolerance, supplied in 7-inch tape reel is: PR2512FKF7W0R005L. 2010 2512 (2) TOLERANCE F = 1% J = 5% (3) PACKAGING TYPE R = Paper taping reel K = Embossed taping reel NOTE a. The "L" at the end of the code is only for ordering. On the reel label, the standard CTC will be mentioned an additional stamp "LFP"= lead free production. b. Products with lead in terminations fulfil the same requirements as mentioned in this datasheet. c. Products with lead in terminations will be phased out in the coming months (before July 1st, 2006). d. Standard power for size 1206 is 1/4 Watt, size 2010 is 1/2 Watt, and size 2512 is 1 Watt. (4) TEMPERATURE COEFFICIENT OF RESISTANCE F = 100 ppm/C G = 200 ppm/C (5) TAPING REEL 7 = 7 inch dia. Reel (6) POWER RATING W = 2 x standard power (d) (7) RESISTANCE VALUE PR series: 0R001, 0R002, 0R003, 0R004, 0R005. (0R0015 also available on request) PF series: 0R006, 0R056, 0R56, 1R (8) RESISTOR TERMINATIONS L = Lead free terminations (matte tin) (a) www.yageo.com Aug 11, 2005 V.0 Product specification Chip Resistor Surface Mount PR/PF-Power enhancement SERIES 1206/2010/2512 (Pb Free) 4 9 MARKING 1 m R < 20 m 4 digits: 10 mX R, E-24 series; and R = 1/2/3/4/5/6/7/8/9 m The "R" is used as a decimal point; the other 3 digits are significant. ynsc016 Fig. 1 Value = 5 m 20 m R 1,000 m E-24 series: 4 digits 820 The "R" is used as a decimal point; the other 3 digits are significant. YNSC051 Fig. 2 R820 = 820 m For marking codes, please see EIA-marking code rules in data sheet "Chip resistors marking". CONSTRUCTION The resistors are constructed using outstanding TCR level material, which makes Yageo PR/PF resistors excellent for current sensing application in battery charger circuit & DC-DC converter. The composition of the resistive material is adjusted to give the approximate required resistance and is covered with a protective coating, which printed with the resistance value. Finally, the two external terminations (matte Tin) are added. See fig. 3. OUTLINES For dimension see Table 1 & 2 overcoat metal substrate H resistive layer end termination protective coat I1 inner electrode H termination ceramic substrate I2 protective coat overcoat I2 I1 marking end termination W R005 W SCR020 L PR series YNSC056 L PF series Note: construction will be adjusted to resistance value (only for PF series). Fig. 3 Chip resistor outlines www.yageo.com Aug 11, 2005 V.0 Product specification Chip Resistor Surface Mount PR/PF-Power enhancement SERIES 1206/2010/2512 (Pb Free) 5 9 DIMENSION Table 1 Chip resistor type and relevant physical dimensions for "PR-Power enhancement series"; see fig. 3 TYPE RESISTANCE RANGE L (mm) W (mm) H (mm) I1 (mm) PR2010 0.001 to 0.006 5.10 0.25 2.54 0.25 0.60 0.25 0.50 0.25 0.50 0.25 0.001 to 0.002 6.40 0.20 3.20 0.20 0.75 0.15 1.20 0.20 1.20 0.20 0.003 to 0.005 6.40 0.20 3.20 0.20 0.55 0.15 0.60 0.20 0.60 0.20 PR2512 I2 (mm) Table 2 Chip resistor type and relevant physical dimensions for "PF-Power enhancement series" see fig. 3 TYPE PF1206 PF2010 PF2512 RESISTANCE RANGE L (mm) W (mm) H (mm) I1 (mm) I2 (mm) 0.006 to 0.014 3.20 0.25 1.60 0.25 0.60 0.25 0.55 0.25 0.35 0.25 0.015 to 1 3.20 0.25 1.60 0.25 0.60 0.25 0.55 0.25 0.75 0.25 0.007 to 0.014 5.10 0.25 2.54 0.25 0.60 0.25 1.00 0.25 0.45 0.25 0.015 to 1 5.10 0.25 2.54 0.25 0.60 0.25 1.00 0.25 1.55 0.25 0.006 to 0.014 6.50 0.25 3.15 0.25 0.60 0.25 1.00 0.25 1.75 0.25 0.015 to 1 6.50 0.25 3.15 0.25 0.60 0.25 1.00 0.25 0.60 0.25 ELECTRICAL CHARACTERISTICS Table 3 TYPE / RESISTANCE RANGE PR2010 2 m R < 7 m PR series PR2512 1 m R < 6 m PF series TEMPERATURE COEFFICIENT OF RESISTANCE 2 mX 2 mX < R < 7 mX 200 ppm/C 100 ppm/C 1 mX R 2 mX 2 mX < R < 6 mX 200 ppm/C 100 ppm/C PF1206 6 m R 1,000 m 100 ppm/C PF2010 7 m R 1,000 m 100 ppm/C PF2512 6 m R 1,000 m 100 ppm/C www.yageo.com Aug 11, 2005 V.0 Product specification Chip Resistor Surface Mount PR/PF-Power enhancement SERIES 1206/2010/2512 (Pb Free) 6 9 FOOTPRINT AND SOLDERING PROFILES ENVIRONMENTAL DATA For recommended footprint and soldering profiles, please see the special data sheet "Chip resistors mounting". For material declaration information (IMDS-data) of the products, please see the separated info "Environmental data" conformed to EU RoHS. PACKING STYLE AND PACKAGING QUANTITY Table 4 Packing style and packaging quantity PACKING STYLE REEL DIMENSION PF 1206 Paper taping reel (R) PR/PF 2010 PR/PF 2512 7" (178 mm) 4,000 --- --- Embossed taping reel (K) 7" (178 mm) --- 4,000 4,000 NOTE 1. For Paper/PE/Embossed tape and reel specification/dimensions, please see the special data sheet "Packing" document. FUNCTIONAL DESCRIPTION OPERATINGTEMPERATURE RANGE Range: -55C to +155C POWER RATING 100 Each type rated power at 70C: PF1206=1/2 W; PR/PF2010=1 W; PR/PF2512=2 W. 50 RATED VOLTAGE The DC or AC (rms) continuous working voltage corresponding to the rated power is determined by the following formula: V = (P X R) MRA632 Pmax (%Prated) 0 -55 0 50 70 155 100 Tamb (C) Fig. 4 Maximum dissipation (Pmax) in percentage of rated power as a function of the operating ambient temperature (Tamb ) Where V = Continuous rated DC or AC (rms) working voltage (V) P = Rated power (W) R = Resistance value (X) www.yageo.com Aug 11, 2005 V.0 Product specification Chip Resistor Surface Mount PR/PF-Power enhancement SERIES 1206/2010/2512 (Pb Free) 7 9 TESTS AND REQUIREMENTS Table 5 Test condition, procedure and requirements TEST Temperature Coefficient of Resistance (T.C.R.) TEST METHOD PROCEDURE REQUIREMENTS MIL-STD-202F-method 304; At +25/-55 C and +25/+125 C Refer to table 3 JIS C 5202-4.8 Formula: R2-R1 T.C.R= ------------------------- x106 (ppm/C) R1(t2-t1) Where t1=+25 C or specified room temperature t2=-55 C or +125 C test temperature R1=resistance at reference temperature in ohms R2=resistance at test temperature in ohms Thermal Shock MIL-STD-202F-method 107G; At -65 (+0/-10) C for 2 minutes and at +125 (+10/-0) C for 2 minutes; 25 cycles (0.5%+0.0005 ) At -65 (+0/-5) C for 1 hour; RCWV applied for 45 (+5/-0) minutes (0.5%+0.0005 ) 2.5 x RCWV applied for 5 seconds at room temperature (0.5%+0.0005 ) Unmounted chips; 260 5 C for 10 1 seconds (0.5%+0.0005 ) At 702 C for 1,000 hours; RCWV applied for 1.5 hours on and 0.5 hour off (1.0%+0.0005 ) IEC 60115-1 4.25.1 MIL-STD-202F-method 208A; Solder bath at 2453 C Well tinned (95% covered) IEC 60115-1 4.17 Dipping time: 20.5 seconds No visible damage JIS C 5202 7.5; 1,000 hours; 402 C; 93(+2/-3)% RH (0.5%+0.0005 ) IEC 60115-8 4.24.8 RCWV applied for 1.5 hours on and 0.5 hour off IEC 60115-1 4.19 Low Temperature Operation MIL-R-55342D-Para 4.7.4 Short Time Overload MIL-R-55342D-Para 4.7.5; IEC 60115-1 4.13 Resistance to Soldering Heat MIL-STD-202F-method 210C; Life MIL-STD-202F-method 108A; Solderability Humidity (steady state) IEC 60115-1 4.18 No visible damage No visible damage No visible damage www.yageo.com Aug 11, 2005 V.0 Product specification Chip Resistor Surface Mount PR/PF-Power enhancement SERIES 1206/2010/2512 (Pb Free) 8 9 Table 5 Test condition, procedure and requirements (continued) TEST TEST METHOD Leaching Moisture Resistance Heat High Temperature Exposure PROCEDURE REQUIREMENTS EIA/IS 4.13B; Solder bath at 2605 C No visible damage IEC 60115-8 4.18 Dipping time: 301 seconds MIL-STD-202F-method 106F; 42 cycles; total 1,000 hours (0.5%+0.0005 ) IEC 60115-1 4.24.2 Shown as fig. 5 No visible damage MIL-STD-202 Method 108 Unpowered chips at =150 C for 1,000 hours (1%+0.0005 ) 75 80 - 98% RH 90 - 98% RH temperature [C] 90 - 98% RH 80 - 98% RH 90 - 98% RH initial drying 24 hours rate of change of temperature is unspecified, however, specimens shall not be subjected to radiant heating from chamber conditioning processes 50 end of final cycle; measurements as specified in 2.7 +10 C (+18 F) -2 C (-3.6 F) 25 initial measurements as specified in 2.2 0 temperature tolerance 2 C (3.6 F) unless otherwise specified voltage applied as specified in 2.4 STEP1 STEP2 prior to first cycle only HBK073 optional sub-cycle if specified (2.3); sub-cycle performed during any 5 of the first 9 cycles; humidity uncontrolled during sub-cycle circulation of conditioning air shall be at a minimum cubic rate per minute equivalent to 10 times the volume of the chamber STEP3 STEP4 STEP5 STEP6 STEP7 one cycle 24 hours; repeat as specified in 2.5 0 5 10 15 20 25 time [h] Fig. 5 Moisture resistance test requirements www.yageo.com Aug 11, 2005 V.0 Product specification Chip Resistor Surface Mount PR/PF-Power enhancement SERIES 1206/2010/2512 (Pb Free) 9 9 REVISION HISTORY REVISION DATE Version 0 CHANGE NOTIFICATION Aug 11, 2005 - DESCRIPTION - New datasheet for current sensor - low TCR PR/PF-Power enhancement series, sizes of 1206/2010/2512, 1% and 5% with lead-free terminations www.yageo.com Aug 11, 2005 V.0