74LVC541A Low-Voltage CMOS Octal Buffer Flow Through Pinout With 5 V-Tolerant Inputs and Outputs (3-State, Non-Inverting) www.onsemi.com The 74LVC541A is a high performance, non-inverting octal buffer operating from a 1.2 to 3.6 V supply. This device is similar in function to the MC74LCX244, while providing flow through architecture. High impedance TTL compatible inputs significantly reduce current loading to input drivers while TTL compatible outputs offer improved switching noise performance. A VI specification of 5.5 V allows 74LVC541A inputs to be safely driven from 5 V devices. The 74LVC541A is suitable for memory address driving and all TTL level bus oriented transceiver applications. Current drive capability is 24 mA at the outputs. The Output Enable (OE1. OE2) inputs, when HIGH, disables the output by placing them in a HIGH Z condition. SOIC-20 WB DW SUFFIX CASE 751D MARKING DIAGRAMS 20 LVC541A AWLYYWWG Features * * * * * * * * * TSSOP-20 DT SUFFIX CASE 948E Designed for 1.2 to 3.6 V VCC Operation 5 V Tolerant - Interface Capability With 5 V TTL Logic Supports Live Insertion and Withdrawal IOFF Specification Guarantees High Impedance When VCC = 0 V 24 mA Output Sink and Source Capability Near Zero Static Supply Current in All Three Logic States (10 mA) Substantially Reduces System Power Requirements Latchup Performance Exceeds 250 mA ESD Performance: Human Body Model > 2000 V Machine Model > 200 V These Devices are Pb-Free, Halogen Free/BFR Free and are RoHS Compliant 1 SOIC-20 WB 20 LVC 541A ALYW G G 1 TSSOP-20 A L, WL Y, YY W, WW G or G = Assembly Location = Wafer Lot = Year = Work Week = Pb-Free Package (Note: Microdot may be in either location) ORDERING INFORMATION See detailed ordering and shipping information in the package dimensions section on page 7 of this data sheet. (c) Semiconductor Components Industries, LLC, 2015 December, 2015 - Rev. 0 1 Publication Order Number: 74LVC541A/D 74LVC541A OE1 VCC OE2 O0 O1 O2 O3 O4 O5 O6 O7 20 19 18 17 16 15 14 13 12 11 OE2 1 19 D0 D1 D2 1 2 3 4 5 6 7 8 9 10 OE1 D0 D1 D2 D3 D4 D5 D6 D7 GND D3 D4 Figure 1. Pinout: 20-Lead (Top View) D5 PIN NAMES Pins Function OEn Output Enable Inputs Dn Data Inputs On 3-State Outputs D6 D7 18 3 17 4 16 5 15 6 14 7 13 8 12 9 11 Figure 2. Logic Diagram TRUTH TABLE Inputs 2 Outputs OE1 OE2 Dn On L L L L L L H H X H X Z H X X Z H = High Voltage Level; L = Low Voltage Level; Z = High Impedance State; X = High or Low Voltage Level and Transitions are Acceptable, for ICC reasons, DO NOT FLOAT Inputs www.onsemi.com 2 O0 O1 O2 O3 O4 O5 O6 O7 74LVC541A MAXIMUM RATINGS Symbol VCC Parameter Value DC Supply Voltage Condition Unit -0.5 to +6.5 V V VI DC Input Voltage -0.5 VI +6.5 VO DC Output Voltage -0.5 VO +6.5 Output in 3-State V -0.5 VO VCC + 0.5 Output in HIGH or LOW State (Note 1) V IIK DC Input Diode Current -50 VI < GND mA IOK DC Output Diode Current -50 VO < GND mA +50 VO > VCC mA IO DC Output Source/Sink Current 50 mA ICC DC Supply Current Per Supply Pin 100 mA IGND DC Ground Current Per Ground Pin 100 mA TSTG Storage Temperature Range -65 to +150 C TL Lead Temperature, 1 mm from Case for 10 Seconds TL = 260 C TJ Junction Temperature Under Bias TJ = 135 C qJA Thermal Resistance (Note 2) SOIC = 65.8 TSSOP = 110.7 C/W MSL ILATCHUP Moisture Sensitivity Level 1 250 Latch-up Performance at VCC = 3.6 V and 125C (Note 3) mA Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality should not be assumed, damage may occur and reliability may be affected. 1. IO absolute maximum rating must be observed. 2. Measured with minimum pad spacing on an FR4 board, using 10 mm-by-1 inch, 2 ounce copper trace no air flow. 3. Tested to EIA/JES078. RECOMMENDED OPERATING CONDITIONS Symbol VCC Parameter Min Supply Voltage Operating Functional Typ Max V 1.65 1.2 3.6 3.6 VI Input Voltage 0 5.5 VO Output Voltage HIGH or LOW State 3-State 0 0 VCC 5.5 IOH IOL TA Dt/DV Units V V HIGH Level Output Current VCC = 3.0 V - 3.6 V VCC = 2.7 V - 3.0 V -24 -12 mA LOW Level Output Current VCC = 3.0 V - 3.6 V VCC = 2.7 V - 3.0 V 24 12 mA Operating Free-Air Temperature Input Transition Rise or Fall Rate, VIN from 0.8 V to 2.0 V, VCC = 3.0 V -40 +125 C 0 10 ns/V Functional operation above the stresses listed in the Recommended Operating Ranges is not implied. Extended exposure to stresses beyond the Recommended Operating Ranges limits may affect device reliability. www.onsemi.com 3 74LVC541A DC ELECTRICAL CHARACTERISTICS -405C to +855C Symbol VIH VIL VOH VOL -405C to +1255C Parameter Conditions Min Typ (Note 4) Max Min Typ (Note 4) Max Unit HIGH-level input voltage VCC = 1.2 V 1.08 - - 1.08 - - V VCC = 1.65 V to 1.95 V 0.65 x VCC - - 0.65 x VCC - - VCC = 2.3 V to 2.7 V 1.7 - - 1.7 - - VCC = 2.7 V to 3.6 V 2.0 - - 2.0 - - VCC = 1.2 V - - 0.12 - - 0.12 VCC = 1.65 V to 1.95 V - - 0.35 x VCC - - 0.35 x VCC VCC = 2.3 V to 2.7 V - - 0.7 - - 0.7 VCC = 2.7 V to 3.6 V - - 0.8 - - 0.8 LOW-level input voltage HIGH-level output voltage LOW-level output voltage V V VI = VIH or VIL IO = -100 mA; VCC = 1.65 V to 3.6 V VCC - 0.2 - - VCC - 0.3 - - IO = -4 mA; VCC = 1.65 V 1.2 - - 1.05 - - IO = -8 mA; VCC = 2.3 V 1.8 - - 1.65 - - IO = -12 mA; VCC = 2.7 V 2.2 - - 2.05 - - IO = -18 mA; VCC = 3.0 V 2.4 - - 2.25 - - IO = -24 mA; VCC = 3.0 V 2.2 - - 2.0 - - V VI = VIH or VIL IO = 100 mA; VCC = 1.65 V to 3.6 V - - 0.2 - - 0.3 IO = 4 mA; VCC = 1.65 V - - 0.45 - - 0.65 IO = 8 mA; VCC = 2.3 V - - 0.6 - - 0.8 IO = 12 mA; VCC = 2.7 V - - 0.4 - - 0.6 IO = -24 mA; VCC = 3.0 V - - 0.55 - - 0.8 VI = 5.5V or GND VCC = 3.6 V - 0.1 5 - 0.1 20 mA IOZ OFF-state output current VI = VIH or VIL; VO = 5.5 V or GND; VCC = 3.6 V - 0.1 5 - 0.1 20 mA IOFF Power-off leakage current VI or VO = 5.5 V; VCC = 0.0 V - 0.1 10 - 0.1 20 mA ICC Supply current VI = VCC or GND; IO = 0 A; VCC = 3.6 V - 0.1 10 - 0.1 40 mA Additional supply current per input pin; VI = VCC - 0.6 V; IO = 0 A; VCC = 2.7 V to 3.6 V - 5 500 - 5 5000 mA II DICC Input leakage current Product parametric performance is indicated in the Electrical Characteristics for the listed test conditions, unless otherwise noted. Product performance may not be indicated by the Electrical Characteristics if operated under different conditions. 4. All typical values are measured at TA = 25C and VCC = 3.3 V, unless stated otherwise. www.onsemi.com 4 74LVC541A AC ELECTRICAL CHARACTERISTICS (tR = tF = 2.5 ns) -405C to +855C Symbol tpd ten tdis tsk(0) Parameter Propagation Delay (Note 6) nAn to nYn Enable Time (Note 7) nOE to nYn Disable Time (Note 8) nOE to nYn -405C to +1255C Conditions Min Typ1 Max Unit VCC = 1.2 V - 14.0 - - - - ns VCC = 1.65 V to 1.95 V 1.5 6.5 13.8 1.5 - 16.0 VCC = 2.3 V to 2.7 V 1.0 3.5 6.8 1.0 - 7.9 VCC = 2.7 V 1.5 3.5 5.6 1.5 - 7.0 VCC = 3.0 V to 3.6 V 1.0 2.9 5.1 1.0 - 6.5 VCC = 1.2 V - 20.0 - - - - VCC = 1.65 V to 1.95 V 1.8 7.7 16.0 1.8 - 18.5 VCC = 2.3 V to 2.7 V 1.5 4.3 8.8 1.5 - 10.2 VCC = 2.7 V 1.5 4.4 7.5 1.5 - 9.5 VCC = 3.0 V to 3.6 V 1.0 3.5 7.0 1.0 - 9.0 VCC = 1.2 V - 11.0 - - - - VCC = 1.65 V to 1.95 V 3.0 4.9 10.3 3.0 - 11.9 VCC = 2.3 V to 2.7 V 1.0 2.7 5.9 1.0 - 6.8 VCC = 2.7 V 1.5 3.7 7.0 1.5 - 9.0 VCC = 3.0 V to 3.6 V 1.0 3.3 6.0 1.0 - 7.5 - - 1 - - 1.5 Output Skew Time (Note 9) Max Min Typ1 ns ns ns Product parametric performance is indicated in the Electrical Characteristics for the listed test conditions, unless otherwise noted. Product performance may not be indicated by the Electrical Characteristics if operated under different conditions. 5. Typical values are measured at TA = 25C and VCC = 3.3 V, unless stated otherwise. 6. tpd is the same as tPLH and tPHL. 7. ten is the same as tPZL and tPZH. 8. tdis is the same as tPLZ and tPHZ. 9. Skew between any two outputs of the same package switching in the same direction. This parameter is guaranteed by design. DYNAMIC SWITCHING CHARACTERISTICS TA = +25C Min Typ Max Symbol Characteristic Condition Unit VOLP Dynamic LOW Peak Voltage (Note 10) VCC = 3.3 V, CL = 50 pF, VIH = 3.3 V, VIL = 0 V VCC = 2.5 V, CL = 30 pF, VIH = 2.5 V, VIL = 0 V 0.8 0.6 V VOLV Dynamic LOW Valley Voltage (Note 10) VCC = 3.3 V, CL = 50 pF, VIH = 3.3 V, VIL = 0 V VCC = 2.5 V, CL = 30 pF, VIH = 2.5 V, VIL = 0 V -0.8 -0.6 V 10. Number of outputs defined as "n". Measured with "n-1" outputs switching from HIGH-to-LOW or LOW-to-HIGH. The remaining output is measured in the LOW state. CAPACITIVE CHARACTERISTICS Symbol CIN COUT CPD Parameter Condition Typical Unit Input Capacitance VCC = 3.3 V, VI = 0 V or VCC 4.0 pF Output Capacitance VCC = 3.3 V, VI = 0 V or VCC 5.0 pF Power Dissipation Capacitance (Note 11) pF Per input; VI = GND or VCC VCC = 1.65 V to 1.95 V 7.7 VCC = 2.3 V to 2.7 V 11.3 VCC = 3.0 V to 3.6 V 14.4 11. CPD is used to determine the dynamic power dissipation (PD in mW). PD = CPD * VCC2 x fi * N + S (CL x VCC2 x fo) where: fi = input frequency in MHz; fo = output frequency in MHz CL = output load capacitance in pF VCC = supply voltage in Volts N = number of outputs switching S(CL * VCC2 x fo) = sum of the outputs. www.onsemi.com 5 74LVC541A 2.7 V Dn 1.5 V 1.5 V 0V tPLH tPHL VOH 1.5 V On 1.5 V VOL WAVEFORM 1 - PROPAGATION DELAYS tR = tF = 2.5 ns, 10% to 90%; f = 1 MHz; tW = 500 ns 2.7 V 1.5 V OEn 0V tPZH tPHZ VCC VOH - 0.3 V 1.5 V On 0V tPZL tPLZ 3.0 V 1.5 V On VOL + 0.3 V GND WAVEFORM 2 - OUTPUT ENABLE AND DISABLE TIMES tR = tF = 2.5 ns, 10% to 90%; f = 1 MHz; tW = 500 ns Figure 3. AC Waveforms VCC Symbol 3.3 V 0.3 V 2.7 V Vmi 1.5 V 1.5 V VCC < 2.7 V VCC/2 Vmo 1.5 V 1.5 V VCC/2 VHZ VOL + 0.3 V VOL + 0.3 V VOL + 0.15 V VLZ VOH - 0.3 V VOH - 0.3 V VOH - 015 V www.onsemi.com 6 74LVC541A VCC VI VO PULSE GENERATOR R1 DUT RT CL VEXT OPEN GND RL CL includes jig and probe capacitance RT = ZOUT of pulse generator (typically 50 W) R1 = RL Supply Voltage Input Load VEXT VCC (V) VI tr, tf CL RL tPLH, tPHL tPLZ, tPZL tPHZ, tPZH 1.2 VCC 2 ns 30 pF 1 kW Open 2 x VCC GND 1.65 - 1.95 VCC 2 ns 30 pF 1 kW Open 2 x VCC GND 2.3 - 2.7 VCC 2 ns 30 pF 500 W Open 2 x VCC GND 2.7 2.7 V 2.5 ns 50 pF 500 W Open 2 x VCC GND 3 - 3.6 2.7 V 2.5 ns 50 pF 500 W Open 2 x VCC GND Figure 4. Test Circuit ORDERING INFORMATION Package Shipping 74LVC541ADWR2G SOIC-20 (Pb-Free) 1000 / Tape & Reel 74LVC541ADTR2G TSSOP-20 (Pb-Free) 2500 / Tape & Reel Device For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D. www.onsemi.com 7 74LVC541A PACKAGE DIMENSIONS TSSOP-20 CASE 948E-02 ISSUE C 20X 0.15 (0.006) T U 2X K REF 0.10 (0.004) S L/2 20 M T U S V K K1 IIII IIII IIII S J J1 11 B L SECTION N-N -U- PIN 1 IDENT 0.25 (0.010) N 1 10 M 0.15 (0.006) T U S A -V- NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: MILLIMETER. 3. DIMENSION A DOES NOT INCLUDE MOLD FLASH, PROTRUSIONS OR GATE BURRS. MOLD FLASH OR GATE BURRS SHALL NOT EXCEED 0.15 (0.006) PER SIDE. 4. DIMENSION B DOES NOT INCLUDE INTERLEAD FLASH OR PROTRUSION. INTERLEAD FLASH OR PROTRUSION SHALL NOT EXCEED 0.25 (0.010) PER SIDE. 5. DIMENSION K DOES NOT INCLUDE DAMBAR PROTRUSION. ALLOWABLE DAMBAR PROTRUSION SHALL BE 0.08 (0.003) TOTAL IN EXCESS OF THE K DIMENSION AT MAXIMUM MATERIAL CONDITION. 6. TERMINAL NUMBERS ARE SHOWN FOR REFERENCE ONLY. 7. DIMENSION A AND B ARE TO BE DETERMINED AT DATUM PLANE -W-. N F DETAIL E -W- C G D H DETAIL E 0.100 (0.004) -T- SEATING DIM A B C D F G H J J1 K K1 L M PLANE SOLDERING FOOTPRINT* 7.06 1 0.65 PITCH 16X 0.36 16X 1.26 DIMENSIONS: MILLIMETERS *For additional information on our Pb-Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. www.onsemi.com 8 MILLIMETERS MIN MAX 6.40 6.60 4.30 4.50 --1.20 0.05 0.15 0.50 0.75 0.65 BSC 0.27 0.37 0.09 0.20 0.09 0.16 0.19 0.30 0.19 0.25 6.40 BSC 0_ 8_ INCHES MIN MAX 0.252 0.260 0.169 0.177 --0.047 0.002 0.006 0.020 0.030 0.026 BSC 0.011 0.015 0.004 0.008 0.004 0.006 0.007 0.012 0.007 0.010 0.252 BSC 0_ 8_ 74LVC541A PACKAGE DIMENSIONS SOIC-20 WB CASE 751D-05 ISSUE G q A 20 X 45 _ h H M E 0.25 10X NOTES: 1. DIMENSIONS ARE IN MILLIMETERS. 2. INTERPRET DIMENSIONS AND TOLERANCES PER ASME Y14.5M, 1994. 3. DIMENSIONS D AND E DO NOT INCLUDE MOLD PROTRUSION. 4. MAXIMUM MOLD PROTRUSION 0.15 PER SIDE. 5. DIMENSION B DOES NOT INCLUDE DAMBAR PROTRUSION. ALLOWABLE PROTRUSION SHALL BE 0.13 TOTAL IN EXCESS OF B DIMENSION AT MAXIMUM MATERIAL CONDITION. 11 B M D 1 10 20X B B 0.25 M T A S B S L A 18X e A1 SEATING PLANE C T DIM A A1 B C D E e H h L q MILLIMETERS MIN MAX 2.35 2.65 0.10 0.25 0.35 0.49 0.23 0.32 12.65 12.95 7.40 7.60 1.27 BSC 10.05 10.55 0.25 0.75 0.50 0.90 0_ 7_ ON Semiconductor and the are registered trademarks of Semiconductor Components Industries, LLC (SCILLC) or its subsidiaries in the United States and/or other countries. SCILLC owns the rights to a number of patents, trademarks, copyrights, trade secrets, and other intellectual property. A listing of SCILLC's product/patent coverage may be accessed at www.onsemi.com/site/pdf/Patent-Marking.pdf. SCILLC reserves the right to make changes without further notice to any products herein. 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This literature is subject to all applicable copyright laws and is not for resale in any manner. PUBLICATION ORDERING INFORMATION LITERATURE FULFILLMENT: Literature Distribution Center for ON Semiconductor P.O. Box 5163, Denver, Colorado 80217 USA Phone: 303-675-2175 or 800-344-3860 Toll Free USA/Canada Fax: 303-675-2176 or 800-344-3867 Toll Free USA/Canada Email: orderlit@onsemi.com N. American Technical Support: 800-282-9855 Toll Free USA/Canada Europe, Middle East and Africa Technical Support: Phone: 421 33 790 2910 Japan Customer Focus Center Phone: 81-3-5817-1050 www.onsemi.com 9 ON Semiconductor Website: www.onsemi.com Order Literature: http://www.onsemi.com/orderlit For additional information, please contact your local Sales Representative 74LVC541A/D