SPEC NO: DSAL4013 REV NO: V.2 DATE: MAY/09/2011 PAGE: 1 OF 7
APPROVED: WYNEC CHECKED: Allen Liu DRAWN: C.H.HAN ERP: 1201007421
3.5x3.5 mm SMD CHIP LED LAMP
ATTENTION
OBSERVE PRECAUTIONS
FOR HANDLING
ELECTROSTATIC
DISCHARGE
SENSITIVE
DEVICES
Part Number: AA3535QB25Z1S-AMT Blue
Features
zWhite SMD package, silicone resin.
zLow thermal resistance.
zCompatible with IR-reflow processes.
zESD protection.
zPackage: 2000pcs / reel.
zMoisture sensitivity level : level 2a.
zRoHS compliant.
Package Dimensions
Notes:
1. All dimensions are in millimeters (inches).
2. Tolerance is ±0.25(0.01") unless otherwise noted.
3. The specifications, characteristics and technical data described in the datasheet are subject to change without prior notice.
4. The device has a single mounting surface. The device must be mounted according to the specifications.
Description
The Blue source color devices are made with InGaN on
Al2O3 substrate Light Emitting Diode.
Static electricity and surge damage the LEDS.
It is recommended to use a wrist band or anti-electrostatic
glove when handling the LEDs.
All devices, equipment and machinery must be electrically
grounded.
Applications
zSignal and symbol luminaire for orientation.
zMarker lights (e.g. steps, exit ways, etc).
zDecorative and entertainment lighting.
zCommercial and residential lighting.
zAutomotive interior lighting.
SPEC NO: DSAL4013 REV NO: V.2 DATE: MAY/09/2011 PAGE: 2 OF 7
APPROVED: WYNEC CHECKED: Allen Liu DRAWN: C.H.HAN ERP: 1201007421
Handling Precautions
Compare to epoxy encapsulant that is hard and brittle, silicone is softer and flexible. Although its characteristic
significantly reduces thermal stress, it is more susceptible to damage by external mechanical force.
As a result, special handling precautions need to be observed during assembly using silicone encapsulated
LED products. Failure to comply might lead to damage and premature failure of the LED.
1. Handle the component along the side surfaces by using forceps or appropriate tools.
2. Do not directly touch or handle the silicone lens surface. It may damage the internal circuitry.
3. Do not stack together assembled PCBs containing exposed LEDs. Impact may scratch the silicone lens or
damage the internal circuitry.
4.1. The outer diameter of the SMD pickup nozzle should not exceed the size of the LED to prevent air leaks. The inner diame-
ter of the nozzle should be as large as possible.
4.2. A pliable material is suggested for the nozzle tip to avoid scratching or damaging the LED surface during pickup.
4.3. The dimensions of the component must be accurately programmed in the pick-and-place machine to insure precise pickup
and avoid damage during production.
5. As silicone encapsulation is permeable to gases, some corrosive substances such as H2S might corrode silver plating of
leadframe. Special care should be taken if an LED with silicone encapsulation is to be used near such substances.
SPEC NO: DSAL4013 REV NO: V.2 DATE: MAY/09/2011 PAGE: 3 OF 7
APPROVED: WYNEC CHECKED: Allen Liu DRAWN: C.H.HAN ERP: 1201007421
Absolute Maximum Ratings at TA=25°C
Electrical / Optical Characteristics at TA=25°C
Notes:
1.Results from mounting on PC board FR4(pad size ≥70mm2), mounted on pc board-metal core PCB is recommend
for lowest thermal Resistance.
2.1/10 Duty Cycle, 0.1ms Pulse Width.
Part No. Dice Lens Type
Iv (cd) [2]
@ 150mA
Φv (lm) [2]
@ 150mA
V
iewing
Angle [1]
Code. Min. Max. Code. Min. Max. 2θ1/2
AA3535QB25Z1S-AMT Blue (InGaN) Water Clear
T 0.7 1.0 A12 3.5 4.2
U 1.0 1.3 A13 4.2 5.0
V 1.3 1.6 A14 5.0 6.0
120 °
Selection Guide
Notes:
1.Wavelength: +/-1nm.
2. Forward Voltage: +/-0.1V.
Notes:
1. θ1/2 is the angle from optical centerline where the luminous intensity is 1/2 of the optical peak value.
2. Luminous intensity/ luminous Flux: +/-15%.
Parameter Symbol Value Unit
Power Dissipation PD 600 mW
Junction Temperature [1] TJ 110 °C
Operating Temperature Top -40 To +85 °C
Storage Temperature Ts tg -40 To +85 °C
DC Forward Current [1] IF 150 mA
Peak Forward Current [2] IFM 300 mA
Thermal Resistance [1]
(Junction/ambient) Rth j-a 180 °C/W
Thermal Resistance [1]
(Junction/solder point) Rth j-S 60 °C/W
8000 V Electrostatic Discharge Threshold (HBM)
Reverse Voltage VR 5 V
Parameter Symbol
Value
Unit
Code. Min. Typ. Max.
Wavelength at peak emission IF=150mA λpeak 445 nm
Dominant Wavelength IF=150mA λ dom [1]
1 443 452
nm 2 448 457
3 453 462
Spectral Line Half-width IF=150mA Δλ 20 nm
Forward Voltage IF=150mA VF [2] 2.7 3.5 4.0 V
Allowable Reverse Current IR 85 mA
Temperature coefficient of λpeak
IF=150mA, -10 °C≤ T≤100 °C TC λpeak 0.12 nm/°C
Temperature coefficient of λdom
IF=150mA, -10 °C≤ T≤100 °C TC λdom 0.1 nm/°C
Temperature coefficient of VF
IF=150mA, -10 °C≤ T≤100 °C TCV -2.3 mV/°C
SPEC NO: DSAL4013 REV NO: V.2 DATE: MAY/09/2011 PAGE: 4 OF 7
APPROVED: WYNEC CHECKED: Allen Liu DRAWN: C.H.HAN ERP: 1201007421
Blue AA3535QB25Z1S-AMT
SPEC NO: DSAL4013 REV NO: V.2 DATE: MAY/09/2011 PAGE: 5 OF 7
APPROVED: WYNEC CHECKED: Allen Liu DRAWN: C.H.HAN ERP: 1201007421
AA3535QB25Z1S-AMT
Reflow soldering is recommended and the soldering profile is shown below.
Other soldering methods are not recommended as they might cause damage to the product.
Recommended Soldering Pattern
(Units : mm; Tolerance: ±0.1)
Tape Specifications
(Units : mm)
Reel Dimension
SPEC NO: DSAL4013 REV NO: V.2 DATE: MAY/09/2011 PAGE: 6 OF 7
APPROVED: WYNEC CHECKED: Allen Liu DRAWN: C.H.HAN ERP: 1201007421
PACKING & LABEL SPECIFICATIONS AA3535QB25Z1S-AMT
SPEC NO: DSAL4013 REV NO: V.2 DATE: MAY/09/2011 PAGE: 7 OF 7
APPROVED: WYNEC CHECKED: Allen Liu DRAWN: C.H.HAN ERP: 1201007421
Failure Criteria
Items Symbols Conditions Failure Criteria
luminous Intensity lv IF = 150mA Testing Min. Value <Spec.Min.Value x 0.5
Forward Voltage VF IF = 150mA Testing Max. Value ≥Spec.Max.Value x 1.2
Reverse Current IR VR = Maximum Rated Reverse Voltage Testing Max. Value ≥Spec.Max.Value x 2.5
High temp. storage test - - Occurrence of notable decoloration, deformation
and cracking
Reliability Test Items And Conditions
The reliability of products shall be satisfied with items listed below
Lot Tolerance Percent Defective (LTPD) : 10%
No. Test Item Standards Test Condition Test Times /
Cycles
Number of
Damaged
1 Continuous operating test - Ta =25°C ,IF = maximum rated current* 1,000 h 0 / 22
2 High Temp. operating test EIAJED-
4701/100(101) Ta = 100°C IF = maximum rated current* 1,000 h 0 / 22
3 Low Temp. operating test - Ta = -40°C, IF = maximum rated current* 1,000 h 0 / 22
4 High temp. storage test EIAJED-
4701/100(201) Ta = maximum rated storage temperature 1,000 h 0 / 22
5 Low temp. storage test EIAJED-
4701/100(202) Ta = -40°C 1,000 h 0 / 22
6 High temp. & humidity storage test EIAJED-
4701/100(103) Ta = 60°C, RH = 90% 1,000 h 0 / 22
7 High temp. & humidity operating test EIAJED-
4701/100(102)
Ta = 60°C, RH = 90%
IF = maximum rated current* 1,000 h 0 / 22
8 Soldering reliability test EIAJED-
4701/100(301)
Moisture soak : 30°C,70% RH, 72h
Preheat : 150~180°C(120s max.)
Soldering temp : 260°C(10s)
3 times 0 / 18
9 Thermal shock operating test - Ta = -40°C(15min) ~ 100°C(15min)
IF = derated current at 100°C 1,000 cycles 0 / 22
10 Thermal shock test - Ta = -40°C(15min) ~ maximum rated
storage temperature(15min) 1,000 cycles 0 / 22
11 Electric Static Discharge (ESD) EIAJED-
4701/100(304) C = 100pF , R2 = 1.5KΩ V = 8000V Once each
Polarity 0 / 22
12 Vibration test - a = 196m/s² , f = 100~2KHz ,
t = 48min for all xyz axes 4 times 0 / 22
* : Refer to forward current vs. derating curve diagram
