3.5x3.5 mm SMD CHIP LED LAMP Part Number: AA3535QB25Z1S-AMT Blue ATTENTION OBSERVE PRECAUTIONS FOR HANDLING ELECTROSTATIC DISCHARGE SENSITIVE DEVICES Description The Blue source color devices are made with InGaN on Features Al2O3 substrate Light Emitting Diode. z White SMD package, silicone resin. Static electricity and surge damage the LEDS. z Low thermal resistance. It is recommended to use a wrist band or anti-electrostatic z Compatible with IR-reflow processes. glove when handling the LEDs. z ESD protection. All devices, equipment and machinery must be electrically z Package: 2000pcs / reel. grounded. z Moisture sensitivity level : level 2a. Applications z RoHS compliant. z Signal and symbol luminaire for orientation. z Marker lights (e.g. steps, exit ways, etc). z Decorative and entertainment lighting. z Commercial and residential lighting. z Automotive interior lighting. Package Dimensions Notes: 1. All dimensions are in millimeters (inches). 2. Tolerance is 0.25(0.01") unless otherwise noted. 3. The specifications, characteristics and technical data described in the datasheet are subject to change without prior notice. 4. The device has a single mounting surface. The device must be mounted according to the specifications. SPEC NO: DSAL4013 REV NO: V.2 DATE: MAY/09/2011 PAGE: 1 OF 7 APPROVED: WYNEC CHECKED: Allen Liu DRAWN: C.H.HAN ERP: 1201007421 Handling Precautions Compare to epoxy encapsulant that is hard and brittle, silicone is softer and flexible. Although its characteristic significantly reduces thermal stress, it is more susceptible to damage by external mechanical force. As a result, special handling precautions need to be observed during assembly using silicone encapsulated LED products. Failure to comply might lead to damage and premature failure of the LED. 1. Handle the component along the side surfaces by using forceps or appropriate tools. 2. Do not directly touch or handle the silicone lens surface. It may damage the internal circuitry. 3. Do not stack together assembled PCBs containing exposed LEDs. Impact may scratch the silicone lens or damage the internal circuitry. 4.1. The outer diameter of the SMD pickup nozzle should not exceed the size of the LED to prevent air leaks. The inner diameter of the nozzle should be as large as possible. 4.2. A pliable material is suggested for the nozzle tip to avoid scratching or damaging the LED surface during pickup. 4.3. The dimensions of the component must be accurately programmed in the pick-and-place machine to insure precise pickup and avoid damage during production. 5. As silicone encapsulation is permeable to gases, some corrosive substances such as H2S might corrode silver plating of leadframe. Special care should be taken if an LED with silicone encapsulation is to be used near such substances. SPEC NO: DSAL4013 REV NO: V.2 DATE: MAY/09/2011 PAGE: 2 OF 7 APPROVED: WYNEC CHECKED: Allen Liu DRAWN: C.H.HAN ERP: 1201007421 Selection Guide Dice Part No. Iv (cd) [2] @ 150mA Lens Type AA3535QB25Z1S-AMT Blue (InGaN) v (lm) [2] @ 150mA Viewing Angle [1] Code. Min. Max. Code. Min. Max. T 0.7 1.0 A12 3.5 4.2 U 1.0 1.3 A13 4.2 5.0 V 1.3 1.6 A14 5.0 6.0 Water Clear 2 1/2 120 Notes: 1. 1/2 is the angle from optical centerline where the luminous intensity is 1/2 of the optical peak value. 2. Luminous intensity/ luminous Flux: +/-15%. Absolute Maximum Ratings at TA=25C Parameter Symbol Value Unit Power Dissipation PD 600 mW Junction Temperature [1] TJ 110 C Operating Temperature Top -40 To +85 C Storage Temperature Tstg -40 To +85 C IF 150 mA Peak Forward Current [2] IFM 300 mA Reverse Voltage VR 5 V Thermal Resistance [1] (Junction/ambient) Rth j-a 180 C/W Thermal Resistance [1] (Junction/solder point) Rth j-S 60 C/W 8000 V DC Forward Current [1] Electrostatic Discharge Threshold (HBM) Notes: 1.Results from mounting on PC board FR4(pad size 70mm 2 ), mounted on pc board-metal core PCB is recommend for lowest thermal Resistance. 2.1/10 Duty Cycle, 0.1ms Pulse Width. Electrical / Optical Characteristics at TA=25C Parameter Symbol Wavelength at peak emission Dominant Wavelength IF=150mA IF=150mA Value Code. Min. peak dom [1] Typ. Max. 445 Unit nm 1 443 452 2 448 457 3 453 462 nm Spectral Line Half-width IF=150mA Forward Voltage IF=150mA VF [2] Allowable Reverse Current IR Temperature coefficient of peak IF=150mA, -10 C T100 C TC peak 0.12 nm/ C Temperature coefficient of dom IF=150mA, -10 C T100 C TC dom 0.1 nm/ C Temperature coefficient of VF IF=150mA, -10 C T100 C TCV -2.3 mV/ C 20 2.7 3.5 nm 4.0 V 85 mA Notes: 1.Wavelength: +/-1nm. 2. Forward Voltage: +/-0.1V. SPEC NO: DSAL4013 REV NO: V.2 DATE: MAY/09/2011 PAGE: 3 OF 7 APPROVED: WYNEC CHECKED: Allen Liu DRAWN: C.H.HAN ERP: 1201007421 Blue AA3535QB25Z1S-AMT SPEC NO: DSAL4013 REV NO: V.2 DATE: MAY/09/2011 PAGE: 4 OF 7 APPROVED: WYNEC CHECKED: Allen Liu DRAWN: C.H.HAN ERP: 1201007421 AA3535QB25Z1S-AMT Reflow soldering is recommended and the soldering profile is shown below. Other soldering methods are not recommended as they might cause damage to the product. Reel Dimension Recommended Soldering Pattern (Units : mm; Tolerance: 0.1) Tape Specifications (Units : mm) SPEC NO: DSAL4013 REV NO: V.2 DATE: MAY/09/2011 PAGE: 5 OF 7 APPROVED: WYNEC CHECKED: Allen Liu DRAWN: C.H.HAN ERP: 1201007421 PACKING & LABEL SPECIFICATIONS AA3535QB25Z1S-AMT SPEC NO: DSAL4013 REV NO: V.2 DATE: MAY/09/2011 PAGE: 6 OF 7 APPROVED: WYNEC CHECKED: Allen Liu DRAWN: C.H.HAN ERP: 1201007421 Reliability Test Items And Conditions The reliability of products shall be satisfied with items listed below Lot Tolerance Percent Defective (LTPD) : 10% No. Test Item Standards Test Times / Number of Cycles Damaged Test Condition 1 Continuous operating test - Ta =25C ,IF = maximum rated current* 1,000 h 0 / 22 2 High Temp. operating test EIAJED4701/100(101) Ta = 100C IF = maximum rated current* 1,000 h 0 / 22 3 Low Temp. operating test - Ta = -40C, IF = maximum rated current* 1,000 h 0 / 22 4 High temp. storage test EIAJEDTa = maximum rated storage temperature 4701/100(201) 1,000 h 0 / 22 5 Low temp. storage test EIAJED4701/100(202) Ta = -40C 1,000 h 0 / 22 6 High temp. & humidity storage test EIAJED4701/100(103) Ta = 60C, RH = 90% 1,000 h 0 / 22 7 High temp. & humidity operating test EIAJED4701/100(102) Ta = 60C, RH = 90% IF = maximum rated current* 1,000 h 0 / 22 8 Soldering reliability test EIAJED4701/100(301) Moisture soak : 30C,70% RH, 72h Preheat : 150~180C(120s max.) Soldering temp : 260C(10s) 3 times 0 / 18 9 Thermal shock operating test - Ta = -40C(15min) ~ 100C(15min) IF = derated current at 100C 1,000 cycles 0 / 22 10 Thermal shock test - Ta = -40C(15min) ~ maximum rated storage temperature(15min) 1,000 cycles 0 / 22 11 Electric Static Discharge (ESD) EIAJED4701/100(304) C = 100pF , R2 = 1.5K V = 8000V Once each Polarity 0 / 22 12 Vibration test - a = 196m/s , f = 100~2KHz , t = 48min for all xyz axes 4 times 0 / 22 * : Refer to forward current vs. derating curve diagram Failure Criteria Items Symbols Conditions Failure Criteria luminous Intensity lv IF = 150mA Testing Min. Value <Spec.Min.Value x 0.5 Forward Voltage VF IF = 150mA Testing Max. Value Spec.Max.Value x 1.2 Reverse Current IR VR = Maximum Rated Reverse Voltage Testing Max. Value Spec.Max.Value x 2.5 High temp. storage test - - Occurrence of notable decoloration, deformation and cracking SPEC NO: DSAL4013 REV NO: V.2 DATE: MAY/09/2011 PAGE: 7 OF 7 APPROVED: WYNEC CHECKED: Allen Liu DRAWN: C.H.HAN ERP: 1201007421