DF005M thru DF10M
Features
- Plastic package used has Underwriters
Laboratory Flammability Classification 94V-0
- Glass passivated chip junction
- High surge overload rating of 50 Amperes peak
- High temperature soldering guaranteed:
260°C/10 seconds, at 5 lbs. (2.3kg) tension
Mechanical Data
- Case: Molded plastic body over passivated
junctions
- Terminals: Plated leads solderable per MIL-
STD-750, Method 2026
- Mounting Position: Any
- Weight: 0.014 oz., 0.4 g
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MDS0312008A Page 1
Reverse Voltage: 50 to 1000V
Forward Current: 1.0A
0.315 (8.00)
0.285 (7.24)
0.013 (3.3)
0.0086 (0.22)
0.350 (8.9)
0.300 (7.6)
0.255 (6.5)
0.245 (6.2)
0.335 (8.51)
0.320 (8.12)
0.080 (2.03)
0.050 (1.27)
0.023 (0.58)
0.018 (0.46)
0.185 (4.69)
0.150 (3.81)
0.130 (3.3)
0.120 (3.05)
0.075 (1.90)
0.055 (1.39)
0.205 (5.2)
0.195 (5.0)
Dimensions in inches and (millimeters)
DF-M
0.045 (1.14)
0.035 (0.89)
Maximum Ratings & Thermal Characteristics Ratings at 25°C ambient temperature unless otherwise specified.
DF DF DF DF DF DF DF
Parameter
Symbol
005M 01M 02M 04M 06M 08M 10M Unit
Device Mar king Code DF005 DF01 DF02 DF04 DF06 DF08 DF10
Maximum repetitive peak reverse voltage VRRM 50 100 200 400 600 800 1000 V
Maximum RMS voltage VRMS 35 70 140 280 420 560 700 V
Maximum DC blocking voltage VDC 50 100 200 400 600 800 1000 V
Max. average forward output rectified current at TA=40°C IF(AV) 1.0 A
Peak forward surge current single sine-wave
superimposed on rated load (JEDEC Method) IFSM 50 A
Rating for fusing (t < 8.3ms) I2t10A
2sec
Typical thermal resistance per leg (NOTE 1) RθJA 40
RθJL 15 °C/W
Operating junction and storage temperature range
TJ, TSTG
–55 to +150 °C
Electrical Characteristics Ratings at 25°C ambient temperature unless otherwise specified.
DF DF DF DF DF DF DF
Parameter
Symbol
005M 01M 02M 04M 06M 08M 10M Unit
Maximum instantaneous forward voltage drop
per leg at 1.0A VF1.1 V
Maximum reverse current TA = 25°C 5.0
at rated DC blocking voltage per leg TA = 125°C IR500 µA
Typical junction capacitance per leg at 4.0V, 1MHz CJ25 pF
Note: (1) Thermal resistance from junction to ambient and from junction to lead mounted on P.C.B. with 0.5 x 0.5" (13 x 13mm) copper pads
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MDS0312008A Page 2
0.4 0.6 0.8 1.0 1.2 1.4
0.01
0.1
1
10
110 100
1
10
100
20 40 60 80 100 120 140 150
0
0.5
1.0
110 100
0
10
20
30
40
50
60
020 40 60 80 100
0.01
0.1
1
10
100
0.01 0.1 110 100
0.1
1
10
100
Fig. 1 - Derating Curve Output
Rectified Current Fig. 2 - Maximum Non-Repetitive Peak
Forward Surge Current Per Leg
Fig. 4 - Typical Reverse Leakage
Characteristics Per Leg
Fig. 6 - Typical Transient Thermal
Impedance
Fig. 3 - Typical Forward Characteristics
Per Leg
Fig. 5 - Typical Junction Capacitance
Per Leg
Average Forward Output Current (A)
Average Forward Output Current (A)
Instantaneous Reverse Current (µA)Transient Thermal Impedance (°C/W)
Instantaneous Forward Current (A)Junction Capacitance (pF)
Ambient Temperature (°C) Number of Cycles at 60 Hz
Percent of Rated Peak Reverse Voltage (V)
t, Heating Time (sec.)
Instantaneous Forward Voltage (V)
Reverse Voltage (V)
60 HZ
Resistive or
Inductive Load
P.C.B mounted on
0.51 x 0.51" (13 x 13mm)
Copper pads with 0.06"
(1.5mm) lead length
TJ = 25°C
Pulse width = 300µs
1% Duty Cycle
TJ = 150°C
Single Sine-Wave
(JEDEC Method)
TJ = 25° C
f = 1.0MHz
Vsig = 50mVp-p
1.0 Cycle
TJ = 125°C
TJ = 25°C
Ratings and Characteristic Curves
(T
A
= 25°C unless otherwise noted)
