* Device mounted on ceramic PCB: 7.6mm x 9.4mm x 0.87mm with
pad areas 25 mm2
THRU
BZT52C43
500 mW
Zener Diode
2.4 to 43 Volts
Features
xPlanar Die Construction
x500mW Power Dissipation on Ceramic PCB
xGeneral Purpose Medium Current
xIdeally Suited for Automated Assembly Processes
Absolute Maximum Ratings
Symbol Rating Rating Unit
PD Power dissipation 500 mW
TJ Junction Temperature -65 to +150 кTSTG Storage Temperature Range -65 to +150 кAbsolute Maximum Ratings
Symbol Rating Rating Unit
RthJA
Thermal Resistance Junction to
Ambient* 250
к/W
Electrical Characteristics
Symbol Rating Rating Unit
VF
Maximum Forward Voltage
(IF=10mAdc) 0.9 V
BZT52C2V4
Revision: A 2011/01/01
DIMENSIONS
INCHES MM
DIM
MIN MAX MIN MAX
NOTE
A .140 .152 3.55 3.85
B .100 .112 2.55 2.85
C .055 .071 1.40 1.80
D ----- .053 ----- 1.35
E .012 .031 0.30 .78
G .006 ----- 0.15 -----
H ----- .01 ----- .25
J ----- .006 ----- .15
A
B
E
C
J
D
H
G
SOD-123
0.036”
0.093"
0.048”
SUGGESTED SOLDER
PAD LAYOUT
MCC
omponents
20736 Marilla Street Chatsworth
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$%  !"#
TM
Micro Commercial Components
• Lead Free Finish/RoHS Compliant("P" Suffix
designates RoHS Compliant. See ordering information)
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• Epoxy meets UL 94 V-0 flammability rating
• Moisture Sensitivity Level 1
ELECTRICAL CHARACTERISTICS @25qC
ZENER VOLTAGE
VZ
(1)
VOLTS
Maximum Zener
Impedance (2)
ZZT(OHMS)
Maximum Zener
Impedance (2)
ZZK (OHMS)
REVERSE
CURRENT
IR(Max) @ VR
Typical
Temperature
Coefficent
@ IZTC
Type
Min. Nom Max. IZT(mA) Max. IZK(mA) Max. uA V mV/ć
Marking
BZT52C2V4 2.28 2.4 2.56 5 100 1.0 600 50 1.0 -3.5 0 WX
BZT52C2V7 2.5 2.7 2.9 5 100 1.0 600 20 1.0 -3.5 0 W1
BZT52C3V0 2.8 3.0 3.2 5 95 1.0 600 10 1.0 -3.5 0 W2
BZT52C3V3 3.1 3.3 3.5 5 95 1.0 600 5 1.0 -3.5 0 W3
BZT52C3V6 3.4 3.6 3.8 5 90 1.0 600 5 1.0 -3.5 0 W4
BZT52C3V9 3.7 3.9 4.1 5 90 1.0 600 3 1.0 -3.5 0 W5
BZT52C4V3 4.0 4.3 4.6 5 90 1.0 600 3 1.0 -3.5 0 W6
BZT52C4V7 4.4 4.7 5.0 5 80 1.0 500 3 2.0 -3.5 0.2 W7
BZT52C5V1 4.8 5.1 5.4 5 60 1.0 480 2 2.0 -2.7 1.2 W8
BZT52C5V6 5.2 5.6 6.0 5 40 1.0 400 1 2.0 -2.0 2.5 W9
BZT52C6V2 5.8 6.2 6.6 5 10 1.0 150 3 4.0 0.4 3.7 WA
BZT52C6V8 6.4 6.8 7.2 5 15 1.0 80 2 4.0 1.2 4.5 WB
BZT52C7V5 7.0 7.5 7.9 5 15 1.0 80 1 5.0 2.5 5.3 WC
BZT52C8V2 7.7 8.2 8.7 5 15 1.0 80 0.7 5.0 3.2 6.2 WD
BZT52C9V1 8.5 9.1 9.6 5 15 1.0 100 0.5 6.0 3.8 7.0 WE
BZT52C10 9.4 10 10.6 5 20 1.0 150 0.2 7.0 4.5 8.0 WF
BZT52C11 10.4 11 11.6 5 20 1.0 150 0.1 8.0 5.4 9.0 WG
BZT52C12 11.4 12 12.7 5 25 1.0 150 0.1 8.0 6.0 10.0 WH
BZT52C13 12.4 13 14.1 5 30 1.0 170 0.1 8.0 7.0 11.0 WI
BZT52C15 13.8 15 15.6 5 30 1.0 200 0.1 10.5 9.2 13.0 WJ
BZT52C16 15.3 16 17.1 5 40 1.0 200 0.1 11.2 10.4 14.0 WK
BZT52C18 16.8 18 19.1 5 45 1.0 225 0.1 12.6 12.4 16.0 WL
BZT52C20 18.8 20 21.2 5 55 1.0 225 0.1 14.0 14.4 18.0 WM
BZT52C22 20.8 22 23.3 5 55 1.0 250 0.1 15.4 16.4 20.0 WN
BZT52C24 22.8 24 25.6 5 70 1.0 250 0.1 16.8 18.4 22.0 WO
BZT52C27 25.1 27 28.9 2 80 0.5 300 0.1 18.9 21.4 25.3 WP
BZT52C30 28 30 32 2 80 0.5 300 0.1 21.0 24.4 29.4 WQ
BZT52C33 31 33 35 2 80 0.5 325 0.1 23.1 27.4 33.4 WR
BZT52C36 34 36 38 2 90 0.5 350 0.1 25.2 30.4 37.4 WS
BZT52C39 37 39 41 2 130 0.5 350 0.1 27.3 33.4 41.2 WT
Revision: A 2011/01/01
MCC
TM
Micro Commercial Components
WU
BZT52C43 40 43 46 5 100 1.0 700 0.1 32.0 10.0 12.0WU
BZT52C43 40 43 46 5 100 1.0 700 0.1 32.0 10.0 12.0
(1) Device mounted on ceramic PCB: 7.6mm x 9.4mm x 0.87mm with pad areas 25 mm2
(2) f=1KHz
C , TOTAL CAPACITANCE (pF)
T
10
100
1000
10 100
1
V , NOMINAL ZENER VOLTAGE (V)
Fig. 1 Total Capacitance vs Nominal Zener Voltage
Z
T = 25 °C
f = 1MHz
j
V=1V
R
V=2V
R
V=1V
R
V=2V
R
BZT52C2V4 THRU BZT52C43
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0
0.1
0.2
0.3
0.4
0.5
25050
75 100 125 150
P,P
O
WER DISSIPATI
O
N (W)
D
T , AMBIENT TEMPERATURE ( C)
Fig. 2 Power Dissipation vs Ambient Temperature
A°
0.6
0
10
20
30
40
50
01 2 3 4 5 6 78910
I , ZENER
URRENT
mA
Z
V , ZENER VOLTAGE (V)
Fig. 3 Zener Breakdown Characteristics
Z
T = 25°C
jC2V7
C3V3
C3V9
C4V7
C5V6
C6V8
C8V2
C6V2
Test Current I
5.0mA
Z
0
10
20
0
I , ZENER CURRENT (mA)
Z
V , ZENER VOLTAGE (V)
Fi
. 4 Zener Breakdown Characteristics
Z
10 20 30 40
T = 25°C
j
Test current I
5mA
Z
Test current I
2mA
Z
C10
C12
C18
C22
C27
C33 C36
C15
0
2
4
6
8
10 20 30 40 50 60 70 80 90 100
I , ZENER CURRENT (mA)
Z
V , ZENER VOLTAGE (V)
Fi
. 5 Zener Breakdown Characteristics
Z
Test Current I
2mA
Z
C39
T = 25°C
j
MCC
TM
Micro Commercial Components
Revision: A 2011/01/01
BZT52C2V4 THRU BZT52C43
www.mccsemi.com
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MCC
TM
Micro Commercial Components
Revision: A 2011/01/01
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Device Packing
Part Number-TP Tape&Reel: 3Kpcs/Reel
Ordering Information :
***IMPORTANT NOTICE***
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make corrections, modifications , enhancements , improvements , or other changes . Micro Commercial Components
Corp . does not assume any liability arising out of the application or use of any product described herein; neither does it
convey any license under its patent rights ,nor the rights of others . The user of products in such applications shall assume all
risks of such use and will agree to hold Micro Commercial Components Corp . and all the companies whose products are
represented on our website, harmless against all damages.
***LIFE SUPPORT***
MCC's products are not authorized for use as critical components in life support devices or systems without the express written
approval of Micro Commercial Components Corporation.
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strong measures to protect ourselves and our customers from the proliferation of counterfeit parts. MCC strongly encourages
customers to purchase MCC parts either directly from MCC or from Authorized MCC Distributors who are listed by country on
our web page cited below. Products customers buy either from MCC directly or from Authorized MCC Distributors are genuine
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