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Is Now Part of
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of patents, trademarks, copyrights, trade secrets, and other intellectual property. A listing of ON Semiconductor’s product/patent coverage may be accessed at www.onsemi.com/site/pdf/Patent-Marking.pdf. ON Semiconductor reserves the right
to make changes without further notice to any products herein. ON Semiconductor makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does ON Semiconductor assume any liability
arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. Buyer is responsible for its products and applications using ON
Semiconductor products, including compliance with all laws, regulations and safety requirements or standards, regardless of any support or applications information provided by ON Semiconductor. “Typical” parameters which may be provided in ON
Semiconductor data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer application by customer’s
technical experts. ON Semiconductor does not convey any license under its patent rights nor the rights of others. ON Semiconductor products are not designed, intended, or authorized for use as a critical component in life support systems or any FDA
Class 3 medical devices or medical devices with a same or similar classification in a foreign jurisdiction or any devices intended for implantation in the human body. Should Buyer purchase or use ON Semiconductor products for any such unintended
or unauthorized application, Buyer shall indemnify and hold ON Semiconductor and its officers, employees, subsidiaries, afliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out
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is an Equal Opportunity/Afrmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner.
GBU4A - GBU4M — Bridge Rectifiers
© 2009 Fairchild Semiconductor Corporation www.fairchildsemi.com
GBU4A - GBU4M Rev. 1.2.1 1
October 2013
GBU4A - GBU4M
Bridge Rectifiers
Features
Glass-Passi vated Junction
Surge Overload Rating: 150 A Peak
Reliable Low-Cost Construction Utilizing Molded
Plastic Technique
Ideal for Printed Circuit Board
UL Certified: UL #E258596
Ordering Informations
Absolute Maximum Ratings(1)
Stresses exceeding the absolute maximum ratings may damage the device. The device may not function or be opera-
ble above the re co mmen ded operating conditions and s tres si ng the parts to these level s i s not recommended. In addi-
tion, extended exposure to stresses above the recommended operating conditions may affect device reliability. The
absolute maximum ratings are stress ratings only. Values are at TA = 25°C unless otherwise noted.
Note:
1. These ratings are limiting values above which the serviceability of any semiconductor device may be impaired.
Part Number Marking Package Packing Method
GBU4A GBU4A GBU 4L Rail
GBU4B GBU4B GBU 4L Rail
GBU4D GBU4D GBU 4L Rail
GBU4G GBU4G GBU 4L Rail
GBU4J GBU4J GBU 4L Rail
GBU4K GBU4K GBU 4L Rail
GBU4M GBU4M GBU 4L Rail
Symbol Parameter Value Units
4A 4B 4D 4G 4J 4K 4M
VRRM Maximum Repetitive Reverse Voltage 50 100 200 400 600 800 1000 V
VRMS Maximum RMS Bridge Input Voltage 35 70 140 280 420 560 700 V
VRDC Reverse Voltage (Rated VR) 50 100 200 400 600 800 1000 V
IF(AV) Average Recitified Forward
Current TA = 100°C4.0 A
TA = 40°C3.0 A
IFSM Non-Repetitive Peak Forward Surge Current
8.3 ms Single Half-Sine-Wave 150 A
TSTG Storage Temperature Range -55 to +150 °C
TJOperating Junction Temperature -55 to +150 °C
+~~-
GBU
GBU4A - GBU4M — Bridge Rectifiers
© 2009 Fairchild Semiconductor Corporation www.fairchildsemi.com
GBU4A - GBU4M Rev. 1.2.1 2
Thermal Characteristics
Values are at TA = 25°C unless otherwise noted.
Note:
2. Device mounted on PCB with 0.5 × 0.5 inch (12 × 12 mm).
Electrical Characteristics
Values are at TA = 25°C unless otherwise noted.
Symbol Parameter Value Units
PDPower Dissipation 8 W
RθJA Thermal Resistance per Leg, Junction to Ambient(2) 19 °C/W
Symbol Parameter Value Units
VFForward Voltage, per Element at 4.0 A 1.0 V
IRReverse Current, per Element at Rated VRTA = 25°C5.0μA
TA = 125°C500μA
I2tI
2t Rating for Fusing t < 8.35 ms 93 A2s
GBU4A - GBU4M — Bridge Rectifiers
© 2009 Fairchild Semiconductor Corporation www.fairchildsemi.com
GBU4A - GBU4M Rev. 1.2.1 3
Typical Performance Characteristics
Figure 1. Forward Current Derating Curve Figure 2. Forward Voltage Characteristic s
Figure 3. Reverse Current vs. Reverse Voltage Figure 4. Non-Repetitive Surge Current
Figure 5. Total Capacitance
0 50 100 150
0
1
2
3
4
5
Ambient Temperature [ºC]
Average Rectified Forward Current, IF [A]
MOUNTED ON PC BOARD,
TA 0.5" (12.7mm) LEAD LENGTH
60Hz RESISTIVE OR INDUCTIVE LOAD
HEAT-SINK
MOUNTING, TC
4x4x0.15"
COPPER PLATE
0.7 0.8 0.9 1 1.1 1.2 1.3 1.4
0.1
1
10
100
Forward Voltage, V
F
[V]
Forward Current, I
F
[A]
T = 25 C
º
J
Pulse Width = 300μ
μμ
μs
1% Duty Cycle
0 20406080100120140
0.01
0.1
1
10
Percent of Rated Peak Reverse Voltage [%]
Reverse Current, IR [mA]
T = 100 C
º
C
T = 25 C
º
J
12 51020 50100
0
30
60
90
120
150
Number of Cycles at 60Hz
Peak Forward Surge Current, IFSM [A]
T = 105 C
º
J
1 5 10 50 100
10
50
100
200
Reverse Voltage, V
R
[V]
Total Capacitance, C
T
[pF]
T = 25 C
º
J
f = 1.0 MHz
Visg = 50m Vp-p
GBU4A- GBU4J
GBU4K
K-GBU4M
GBU4A - GBU4M — Bridge Rectifiers
© 2009 Fairchild Semiconductor Corporation www.fairchildsemi.com
GBU4A - GBU4M Rev. 1.2.1 4
Physical Dimension
Figure 6. 4-LEAD, GBU, THROUGH-HOLE, MOLDED PACKAGE (ACTIVE)
Package drawings are provided as a service to customers considering Fairchild components. Drawings may change in any manner
without notic e. Please note the revision and/or date on the drawing and contact a Fairchild Semiconductor represe ntative to verify or
obtain the most recent revision. Package specifica tions do not expand the terms of Fairchild’s worldwide terms and conditions, specifically the
warranty therein, which covers Fairchild produ cts.
Always visit Fairchild Semiconduct or’s online packaging are a for the most recent package drawings :
http://www.fairchildsemi.com/dwg/GB/GBU04A.pdf.
22.30
21.80
7.90
7.40 2.16
1.65
1.27
1.02
(4X)
2.54
2.16
(2X)
3.91
2.03
1.65
(2X)
2.03
1.52
3.20
45°
X
5.33
4.83
(3X)
R
1.90 TYP
-
~ ~
+
3.56
3.30
TYP
TYP
2.16
1.79
0.75
0.46
18.00
17.50
18.80
18.30
NOTES:
A. THIS PACKAGE DOES NOT CONFORM TO
ANY STANDARDS.
B. ALL DIMENSIONS ARE IN MILLIMETERS.
C. DIMENSIONS ARE EXCLUSIVE OF BURRS,
MOLD FLASH AND TIE BAR PROTRUSIONS.
E. DIMENSION AND TOLERANCE AS PER ASME
Y14.5-1994.
F. DRAWING FILE NAME: GBU04AREV1
GBU-4L
© Fairchild Semiconductor Corporation www.fairchildsemi.com
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Rev. I66
®
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