HCPL-2400 Functional Diagram
7
1
2
3
45
6
8
ANODE 1
CATHODE 1
CATHODE 2
ANODE 2 GND
VCC
VO1
VO2
HCPL-2430
TRUTH TABLE
(POSITIVE LOGIC)
LED
ON
OFF
VCC
GND
NC
7
1
2
3
45
6
8
HCPL-2400/11
NC
LED
ON
OFF
ON
OFF
ENABLE
L
L
H
H
OUTPUT
L
H
Z
Z
TRUTH TABLE
(POSITIVE LOGIC)
OUTPUT
L
H
Features
High speed: 40 MBd typical data rate
High common mode rejection:
HCPL-2400: 10 kV/µs at VCM = 300 V (typical)
AC performance guaranteed over temperature
High speed AlGaAs emitter
Compatible with TTL, STTL, LSTTL, and HCMOS logic
families
Totem pole and tri state output (no pull up resistor
required)
Safety approval
UL recognized – 3750 V rms for 1 minute per
UL1577
IEC/EN/DIN EN 60747-5-2 approved with
VIORM = 630 V peak (Option 060) for HCPL-2400
CSA approved
High power supply noise immunity
MIL-PRF-38534 hermetic version available
(HCPL-5400/1 and HCPL-5430/1)
Applications
Isolation of high speed logic systems
Computer-peripheral interfaces
Switching power supplies
Isolated bus driver (networking applications)
Ground loop elimination
High speed disk drive I/O
Digital isolation for A/D, D/A conversion
Pulse transformer replacement
A 0.1 µF bypass capacitor must be connected between pins 5 and 8.
HCPL-2400, HCPL-2430
20 MBd High CMR Logic Gate Optocouplers
Data Sheet
Description
The HCPL-2400 and HCPL-2430 high speed opto-cou-
plers combine an 820 nm AlGaAs light emitting diode
with a high speed photodetector. This combina-tion re-
sults in very high data rate capability and low input cur-
rent. The totem pole output (HCPL-2430) or three state
output (HCPL-2400) eliminates the need for a pull up re-
sistor and allows for direct drive of data buses.
The detector has optical receiver input stage with built-
in Schmitt trigger to provide logic compatible wave-
forms, eliminating the need for additional waveshaping.
The hysteresis provides dierential mode noise immuni-
ty and minimizes the potential for output signal chatter.
The electrical and switching characteristics of the HCPL-
2400 and HCPL-2430 are guaranteed over the tempera-
ture range of 0°C to 70°C.
Functional Diagram
CAUTION: It is advised that normal static precautions be taken in handling and assembly
of this component to prevent damage and/or degradation which may be induced by ESD.
Lead (Pb) Free
RoHS 6 fully
compliant
RoHS 6 fully compliant options available;
-xxxE denotes a lead-free product
2
These optocouplers are compatible with TTL, STTL, LSTTL, and HCMOS logic families. When Schottky type TTL devices
(STTL) are used, a data rate performance of 20 MBd over temperature is guaranteed when using the application cir-
cuit of Figure 13. Typical data rates are 40 MBd.
Selection Guide
8-Pin DIP (300 Mil) Minimum CMR
Single Dual Minimum Input Maximum
Channel Channel dV/dt V
CM On Current Propagation Delay Hermetic
Package Package (V/µs) (V) (mA) (ns) Package
HCPL-2400 1000 300 4 60
HCPL-2430 1000 50 4 60
500 50 6 60 HCPL-540X*
500 50 6 60 HCPL-543X*
500 50 6 60 HCPL-643X*
*Technical data for the Hermetic HCPL-5400/01, HCPL-5430/31, and HCPL-6430/31 are on separate Avago publications.
Ordering Information
HCPL-2400 and HCPL-2430 are UL Recognized with 3750 Vrms for 1 minute per UL1577.
Part
number
Option
Package
Surface
Mount
Gull
Wing
Tape
& Reel
UL 5000 Vrms/1
Minute rating
IEC/EN/DIN EN
60747-5-2 Quantity
RoHS
Compliant
Non RoHS
Compliant
HCPL-2400
-000E No option
300mil
DIP-8
50 per tube
-300E #300 X X 50 per tube
-500E #500 X X X 1000 per reel
-060E #060 X 50 per tube
-360E -360 X X X 50 per reel
HCPL-2430
-000E No option
300mil
DIP-8
50 per tube
-300E #300 X X 50 per tube
-500E #500 X X X 1000 per reel
-020E - X 50 per tube
-060E - X 50 per tube
To order, choose a part number from the part number column and combine with the desired option from the option
column to form an order entry.
Example 1:
HCPL-2430-500E to order product of Gull Wing Surface Mount package in Tape in RoHS compliant.
Example 2:
HCPl-2400 to order product of 8-Pin DIP package in tube packaging and non RoHS compliant.
Option datasheets are available. Contact your Avago sales representative or authorized distributor for information.
Remarks: The notation ‘#XXX’ is used for existing products, while (new) products launched since 15th July 2001 and
RoHS compliant option will use ‘-XXXE‘.
3
Schematic
HCPL-2400 Schematic
IF
VF
VCC
VO
GND
ICC
IO
+
2
3
8
5
IF1
VF1
VCC
VO1
ICC
IO
+
1
2
8
6
SHIELD
VF2
VO2
GND
IO
+
3
45
IF2
7
ANODE
CATHODE
IEVE
7
6
TRUTH TABLE
(POSITIVE LOGIC)
LED
ON
OFF
LED
ON
OFF
ON
OFF
ENABLE
L
L
H
H
OUTPUT
L
H
Z
Z
TRUTH TABLE
(POSITIVE LOGIC)
OUTPUT
L
H
4
Package Outline Drawings
8-Pin DIP Package (HCPL-2400, HCPL-2430)
8-Pin DIP Package with Gull Wing Surface Mount Option 300
(HCPL-2400, HCPL-2430)
1.080 ± 0.320
(0.043 ± 0.013) 2.54 ± 0.25
(0.100 ± 0.010)
0.51 (0.020) MIN.
0.65 (0.025) MAX.
4.70 (0.185) MAX.
2.92 (0.115) MIN. DIMENSIONS IN MILLIMETERS AND (INCHES).
*MARKING CODE LETTER FOR OPTION NUMBERS.
"V" = OPTION 060
OPTION NUMBERS 300 AND 500 NOT MARKED.
NOTE: FLOATING LEAD PROTRUSION IS 0.25 mm (10 mils) MAX.
5° TYP. 0.254 + 0.076
- 0.051
(0.010+ 0.003)
- 0.002)
7.62 ± 0.25
(0.300 ± 0.010)
6.35 ± 0.25
(0.250 ± 0.010)
9.65 ± 0.25
(0.380 ± 0.010)
1.78 (0.070) MAX.
1.19 (0.047) MAX.
A XXXXZ
YYWW
DATE CODE
5678
4321
OPTION CODE*
UL
RECOGNITION
UR
TYPE NUMBER
3.56 ± 0.13
(0.140 ± 0.005)
0.635 ± 0.25
(0.025 ± 0.010) 12° NOM.
9.65 ± 0.25
(0.380 ± 0.010)
0.635 ± 0.130
(0.025 ± 0.005)
7.62 ± 0.25
(0.300 ± 0.010)
5
6
7
8
4
3
2
1
9.65 ± 0.25
(0.380 ± 0.010)
6.350 ± 0.25
(0.250 ± 0.010)
1.016 (0.040)
1.27 (0.050)
10.9 (0.430)
2.0 (0.080)
LAND PATTERN RECOMMENDATION
1.080 ± 0.320
(0.043 ± 0.013)
3.56 ± 0.13
(0.140 ± 0.005)
1.780
(0.070)
MAX.
1.19
(0.047)
MAX.
2.54
(0.100)
BSC
DIMENSIONS IN MILLIMETERS (INCHES).
LEAD COPLANARITY = 0.10 mm (0.004 INCHES).
NOTE: FLOATING LEAD PROTRUSION IS 0.25 mm (10 mils) MAX.
0.254 + 0.076
- 0.051
(0.010+ 0.003)
- 0.002)
5
Regulatory Information
The HCPL-24XX has been approved by the following organizations:
Solder Reow Thermal Prole
0
TIME (SECONDS)
TEMPERATURE (°C)
200
100
50 150100 200 250
300
0
30
SEC.
50 SEC.
30
SEC.
160°C
140°C
150°C
PEAK
TEMP.
245°C
PEAK
TEMP.
240°C
PEAK
TEMP.
230°C
SOLDERING
TIME
200°C
PREHEATING TIME
150°C, 90 + 30 SEC.
2.5°C ± 0.5°C/SEC.
3°C + 1°C/–0.5°C
TIGHT
TYPICAL
LOOSE
ROOM
TEMPERATURE
PREHEATING RATE 3°C + 1°C/–0.5°C/SEC.
REFLOW HEATING RATE 2.5°C ± 0.5°C/SEC.
Recommended Pb-Free IR Prole
217 °C
RAMP-DOWN
6 °C/SEC. MAX.
RAMP-UP
3 °C/SEC. MAX.
150 - 200 °C
260 +0/-5 °C
t 25 °C to PEAK
60 to 150 SEC.
20-40 SEC.
TIME WITHIN 5 °C of ACTUAL
PEAK TEMPERATURE
t
p
t
s
PREHEAT
60 to 180 SEC.
t
L
T
L
T
smax
T
smin
25
T
p
TIME
TEMPERATURE
NOTES:
THE TIME FROM 25 °C to PEAK TEMPERATURE = 8 MINUTES MAX.
T
smax
= 200 °C, T
smin
= 150 °C
Note: Non-halide ux should be used.
Note: Non-halide ux should be used.
VDE
Approved according to VDE 0884/06.92 (Option 060
only).
UL
Recognized under UL 1577, Component Recognition
Program, File E55361.
IEC/EN/DIN EN 60747-5-2
Approved under:
IEC 60747-5-2:1997 + A1:2002
EN 60747-5-2:2001 + A1:2002
DIN EN 60747-5-2 (VDE 0884
Teil 2):2003-01.
(Option 060 only)
6
IEC/EN/DIN EN 60747-5-2 Insulation Related Characteristics
(HCPL-2400 OPTION 060 ONLY)
Description Symbol Characteristic Units
Installation classication per DIN VDE 0110/1.89, Table 1
for rated mains voltage ≤300 V rms I-IV
for rated mains voltage ≤450 V rms I-III
Climatic Classication 55/85/21
Pollution Degree (DIN VDE 0110/1.89) 2
Maximum Working Insulation Voltage VIORM 630 V peak
Input to Output Test Voltage, Method b*
VIORM x 1.875 = VPR, 100% Production Test with tm = 1 sec, VPR 1181 V peak
Partial Discharge < 5 pC
Input to Output Test Voltage, Method a*
VIORM x 1.5 = VPR, Type and sample test, VPR 945 V peak
tm = 60 sec, Partial Discharge < 5 pC
Highest Allowable Overvoltage*
(Transient Overvoltage, tini = 10 sec) VIOTM 6000 V peak
Safety Limiting Values
(Maximum values allowed in the event of a failure,
also see Figure 12, Thermal Derating curve.)
Case Temperature TS 175 °C
Input Current IS,INPUT 230 mA
Output Power PS,OUTPUT 600 mW
Insulation Resistance at TS, VIO = 500 V RS ≥109 Ω
*Refer to the front of the optocoupler section of the current catalog, under Product Safety Regulations section IEC/EN/DIN EN 60747-5-2 for a
detailed description.
Note: Isolation characteristics are guaranteed only within the safety maximum ratings which must ben ensured by protective circuits in applica-
tion.
Insulation and Safety Related Specications
Parameter Symbol Value Units Conditions
Minimum External L(101) 7.1 mm Measured from input terminals to output
Air Gap (External terminals, shortest distance through air.
Clearance)
Minimum External L(102) 7.4 mm Measured from input terminals to output
Tracking (External terminals, shortest distance path along body.
Creepage)
Minimum Internal 0.08 mm Through insulation distance, conductor to
Plastic Gap conductor, usually the direct distance between the
(Internal Clearance) photoemitter and photodetector inside the
optocoupler cavity.
Tracking Resistance CTI 200 Volts DIN IEC 112/VDE 0303 Part 1
(Comparative
Tracking Index)
Isolation Group IIIa Material Group (DIN VDE 0110, 1/89, Table 1)
Option 300 - surface mount classication is Class A in accordance with CECC 00802.
7
Absolute Maximum Ratings
(No derating required up to 70°C)
Parameter Symbol Minimum Maximum Units Note
Storage Temperature TS -55 125 °C
Operating Temperature TA -40 85 °C
Average Forward Input Current IF(AVG) 10 mA
Peak Forward Input Current IFPK 20 mA 12
Reverse Input Voltage VR 2 V
Three State Enable Voltage VE -0.5 10 V
(HCPL-2400 Only)
Supply Voltage V
CC 0 7 V
Average Output Collector Current IO -25 25 mA
Output Collector Voltage V
O -0.5 10 V
Output Voltage V
O -0.5 18 V
Output Collector Power Dissipation PO 40 mW
(Each Channel)
Total Package Power Dissipation PT 350 mW
(Each Channel)
Lead Solder Temperature 260°C for 10 sec., 1.6 mm below seating plane
(for Through Hole Devices)
Reow Temperature Prole See Package Outline Drawings section
(Option #300)
Recommended Operating Conditions
Parameter Symbol Minimum Maximum Units
Power Supply Voltage VCC 4.75 5.25 V
Forward Input Current (ON) IF(ON) 4 8 mA
Forward Input Voltage (OFF) VF(OFF) 0.8 V
Fan Out N 5 TTL Loads
Enable Voltage (Low) V
EL 0 0.8 V
HCPL-2400 Only)
Enable Voltage (High) VEH 2 VCC V
HCPL-2400 Only)
Operating Temperature TA 0 70 °C
8
Electrical Specications
0°C ≤TA ≤70°C, 4.75 V ≤VCC ≤5.25 V, 4 mA ≤IF(ON) ≤8 mA, 0 V ≤VF(OFF) ≤0.8 V. All typicals at TA = 25°C, VCC = 5 V, IF(ON) = 6.0
mA, VF(OFF) = 0 V, except where noted. See Note 11.
Device
Parameter Symbol HCPL- Min. Typ.* Max. Units Test Conditions Fig. Note
Logic Low Output Voltage VOL 0.5 V IOL = 8.0 mA (5 TTL Loads) 1
Logic High Output VOH 2.4 V IOH = -4.0 mA 2
Voltage 2.7 IOH = -0.4 mA
Output Leakage Current IOHH 100 µA VO = 5.25 V, VF = 0.8 V
Logic High Enable Current VEH 2400 2.0 V
Logic Low Enable Voltage VEL 2400 0.8 V
Logic High Enable IEH 2400 20 µA VE = 2.4 V
100 VE = 5.25 V
Logic Low Enable Current IEL 2400 -0.28 -0.4 mA VE = 0.4 V
Logic Low Supply Current ICCL 2400 19 26 mA VCC = 5.25 V, VE = 0 V,
IO = Open
2430 34 46 VCC = 5.25 V, IO = Open
Logic High Supply ICCH 2400 17 26 mA VCC = 5.25 V, VE = 0 V,
Current IO = Open
2430 32 42 VCC = 5.25 V, IO = Open
High Impedance State ICCZ 2400 22 28 mA VCC = 5.25 V, VE = 5.25 V
Supply Current
High Impedance State IOZL 2400 20 µA VO = 0.4 V VE = 2 V
IOZH 20 µA VO = 2.4 V
IOZH 100 µA VO = 5.25 V
Logic Low Short Circuit IOSL 52 mA VO = VCC = 5.25 V, 2
Output Current IF = 8 mA
Logic High Short Circuit IOSH -45 mA VCC = 5.25 V, IF = 0 mA, 2
Output Current VO = GND
Input Current Hysteresis IHYS 0.25 mA VCC = 5 V 3
Input Forward Voltage VF 1.1 1.3 1.5 TA = 25°C IF = 8 mA
1.0 1.55 4
Input Reverse Breakdown BVR 3.0 5.0 V TA = 25°C IR = 10 µA
2.0
Temperature ∆VF -1.44 mV/°C IF = 6 mA 4
Coecient of
Forward Voltage
Input Capacitance CIN 20 pF f = 1 MHz, VF = 0 V
*All typical values at TA = 25°C and VCC = 5 V, unless otherwise noted.
Current
Voltage
∆TA
Output Current
9
Switching Specications
0°C ≤ TA ≤ 70°C, 4.75 V ≤ VCC ≤ 5.25 V, 4 mA ≤ IF(ON) ≤ 8 mA, 0 V ≤ VF(OFF) ≤ 0.8 V. All typicals at TA = 25°C, VCC = 5 V,
IF(ON) = 6.0 mA, VF(OFF) = 0 V, except where noted. See Note 11.
Device
Parameter Symbol HCPL- Min. Typ.* Max. Units Test Conditions Figure Note
Propagation Delay tPHL 55 ns IF(ON) = 7 mA 5, 6, 7 1, 4,
Time to Logic Low 5, 6
Output Level 15 33 60
Propagation Delay tPLH 55 ns IF(ON) = 7 mA 5, 6, 7 1, 4,
Time to Logic High 5, 6
Output Level 15 30 60
Pulse Width |tPHL-tPLH| 2 15 ns IF(ON) = 7 mA 5, 8 6
Distortion
5 25
Propagation Delay tPSK 35 ns Per Notes & Text 15, 16 7
Skew
Output Rise Time tr 20 ns 5
Output Fall Time tf 10 ns 5
Output Enable Time tPZH 2400 15 ns 9, 10
to Logic High
Output Enable Time tPZL 2400 30 ns 9, 10
to Logic Low
Output Disable Time tPHZ 2400 20 ns 9, 10
from Logic High
Output Disable Time tPLZ 2400 15 ns 9, 10
from Logic Low
Logic High Common |CMH| 1000 10,000 V/µs VCM = 300 V, T
A = 25°C, 11 9
Mode Transient IF = 0 mA
Immunity
Logic Low Common |CML| 1000 10,000 V/µs VCM = 300 V, T
A = 25°C, 11 9
Mode Transient IF = 4 mA
Immunity
Power Supply Noise PSNI 0.5 Vp-p VCC = 5.0 V, 10
Immunity 48 Hz ≤ = FAC ≤50 MHz
*All typical values at TA = 25°C and VCC = 5 V, unless otherwise noted.
10
Package Characteristics
Parameter Sym. Device Min. Typ.* Max. Units Test Conditions Fig. Note
Input-Output VISO 3750 V rms RH ≤50%, 3, 13
Momentary t = 1 min.,
Withstand Voltage** TA = 25°C
Input-Output RI-O 1012 Ω VI-O = 500 Vdc 3
Resistance
Input-Output CI-O 0.6 pF f = 1 MHz
Capacitance VI-O = 0 Vdc
Input-Input II-I 2430 0.005 µA RH ≤45% 8
Insulation Leakage t = 5 s,
Current VI-I = 500 Vdc
Resistance RI-I 2430 1011 Ω VI-I = 500 Vdc 8
(Input-Input)
Capacitance CI-I 2430 0.25 pF f = 1 MHz 8
(Input-Input)
*All typical values are at TA = 25°C.
**The Input-Output Momentary Withstand Voltage is a dielectric voltage rating that should not be interpreted as an input-output continuous
voltage rating. For the continuous voltage rating refer to the VDE 0884 Insulation Related Characteristics Table (if applicable), your equipment lev-
el safety specication or Avago Application Note 1074 entitled “Optocoupler Input-Output Endurance Voltage, publication number 5963-2203E.
Notes:
1. Each channel.
2. Duration of output short circuit time not to exceed 10 ms.
3. Device considered a two terminal device: pins 1, 2, 3, and 4 shorted together, and pins 5, 6, 7, and 8 shorted together.
4. tPHL propagation delay is measured from the 50% level on the rising edge of the input current pulse to the 1.5 V level on the falling edge of the
output pulse. The tPLH propagation delay is measured from the 50% level on the falling edge of the input current pulse to the 1.5 V level on the
rising edge of the output pulse.
5. The typical data shown is indicative of what can be expected using the application circuit in Figure 13.
6. This specication simulates the worst case operating conditions of the HCPL-2400 over the recommended operating temperature and VCC range
with the suggested application circuit of Figure 13.
7. Propagation delay skew is discussed later in this data sheet.
8. Measured between pins 1 and 2 shorted together, and pins 3 and 4 shorted together.
9. Common mode transient immunity in a Logic High level is the maximum tolerable (positive) dVCM/dt of the common mode pulse, VCM, to assure
that the output will remain in a Logic High state (i.e., VO > 2.0 V). Common mode transient immunity in a Logic Low level is the maximum toler-
able (negative) dVCM/dt of the common mode pulse, VCM, to assure that the output will remain in a Logic Low state (i.e., VO < 0.8 V).
10. Power Supply Noise Immunity is the peak to peak amplitude of the ac ripple voltage on the VCC line that the device will withstand and still remain
in the desired logic state. For desired logic high state, VOH(MIN) > 2.0 V, and for desired logic low state, VOL(MAX) < 0.8 V.
11. Use of a 0.1 µF bypass capacitor connected between pins 8 and 5 adjacent to the device is required.
12. Peak Forward Input Current pulse width < 50 µs at 1 KHz maximum repetition rate.
13. In accordance with UL 1577, each optocoupler is proof tested by applying an insulation test voltage ≥ 4500 V rms for one second (leakage detec-
tion current limit, II-O ≤ 5 µA). This test is performed before the 100% Production test shown in the IEC/EN/DIN EN 60747-5-2 Insulation Related
Characteristics Table, if applicable.
11
Figure 4. Typical diode input forward current charac-
teristic.
Figure 6. Typical propagation delay vs. ambient
temperature.
Figure 7. Typical propagation delay vs. input forward
current.
Figure 8. Typical pulse width distortion vs. ambient
temperature.
Figure 5. Test circuit for tPLH, tPHL, tr, and tf.
Figure 1. Typical logic low output voltage vs. logic low
output current.
Figure 2. Typical logic high output voltage vs. logic
high output current.
Figure 3. Typical output voltage vs. input forward
current.
12
Figure 9. Test circuit for tPHZ, tPZH, tPLZ and tPZL. Figure 10. Typical enable propagation delay vs. ambi-
ent temperature.
Figure 11. Test diagram for common mode transient immunity and typical waveforms. Figure 12. Thermal derating curve, dependence of
safety limiting value with case temperature per
IEC/EN/DIN EN 60747-5-2.
HCPL-2400 fig 12
OUTPUT POWER – P
S
, INPUT CURRENT – I
S
0
0
T
S
– CASE TEMPERATURE – °C
20050
400
12525 75 100 150
600
800
200
100
300
500
700
P
S
(mW)
I
S
(mA)
175
0.1 µF *
V
FF
+
F
I
CC
V
GND
NC
NC
CM
V
+
7
5
6
8
2
3
4
1
C = 15 pF
A
B
PULSE GENERATOR
L
CC
V
OUTPUT V
MONITORING NODE
O
HCPL-2400/11
HCPL-2400 fig 11a
13
Figure 15. Illustration of propagation delay skew – tPSK.
Figure 13. Recommended 20 MBd HCPL-2400/30 interface circuit.
Applications
Figure 14. Alternative HCPL-2400/30 interface circuit.
Figure 16. Parallel data transmission example.
Figure 17. Modulation code selections. Figure 18. Typical HCPL-2400/30 output schematic.
HCPL-2400 fig 16
DATA
t
PSK
INPUTS
CLOCK
DATA
OUTPUTS
CLOCK
t
PSK
Propagation Delay, Pulse-Width Distortion and Propa-
gation Delay Skew
Propagation delay is a gure of merit which describes
how quickly a logic signal propagates through a sys-
tem. The propagation delay from low to high (tPLH) is the
amount of time required for an input signal to propa-
gate to the output, causing the output to change from
low to high. Similarly, the propagation delay from high
to low (tPHL) is the amount of time required for the input
signal to propagate to the output, causing the output to
change from high to low (see Figure 5).
Pulse-width distortion (PWD) results when tPLH and tPHL
dier in value. PWD is dened as the dierence between
tPLH and tPHL and often determines the maximum data
rate capability of a transmission system. PWD can be ex-
pressed in percent by dividing the PWD (in ns) by the
minimum pulse width (in ns) being transmitted. Typi-
cally, PWD on the order of 20-30% of the minimum pulse
width is tolerable; the exact gure depends on the par-
ticular application (RS232, RS422, T-1, etc.).
Propagation delay skew, tPSK, is an important param-
eter to consider in parallel data applications where
synchronization of signals on parallel data lines is a con-
cern. If the parallel data is being sent through a group
of optocouplers, dierences in propagation delays will
cause the data to arrive at the outputs of the optocou-
plers at dierent times. If this dierence in propagation
delays is large enough, it will determine the maximum
rate at which parallel data can be sent through the op-
tocouplers.
Propagation delay skew is dened as the dierence be-
tween the minimum and maximum propagation delays,
either tPLH or tPHL, for any given group of optocouplers
which are operating under the same conditions (i.e., the
same drive current, supply voltage, output load, and op-
erating temperature). As illustrated in Figure 15, if the in-
puts of a group of optocouplers are switched either ON
or OFF at the same time, tPSK is the dierence between
the shortest propagation delay, either tPLH or tPHL, and the
longest pro-pagation delay, either tPLH or tPHL.
As mentioned earlier, tPSK can determine the maximum
parallel data transmission rate. Figure 16 is the timing
diagram of a typical parallel data application with both
the clock and the data lines being sent through opto-
couplers. The gure shows data and clock signals at the
inputs and outputs of the optocouplers. To obtain the
maximum data transmission rate, both edges of the
clock signals are being used to clock the data; if only one
edge were used, the clock signal would need to be twice
as fast.
Propagation delay skew represents the uncertainty of
where an edge might be after being sent through an
optocoupler. Figure 16 shows that there will be uncer-
tainty in both the data and the clock lines. It is impor-
tant that these two areas of uncertainty not overlap,
otherwise the clock signal might arrive before all of the
data outputs have settled, or some of the data outputs
may start to change before the clock signal has arrived.
From these considerations, the absolute minimum pulse
width that can be sent through optocouplers in a par-
allel application is twice tPHZ. A cautious design should
use a slightly longer pulse width to ensure that any addi-
tional uncertainty in the rest of the circuit does not cause
a problem.
The HCPL-2400/30 optocouplers oer the advantages of
guaranteed specications for propagation delays, pulse-
width distortion, and propagation delay skew over the
recommended temperature, input current, and power
supply ranges.
Application Circuit
A recommended LED drive circuit is shown in Figure 13.
This circuit utilizes several techniques to minimize the
total pulse-width distortion at the output of the opto-
coupler. By using two inverting TTL gates connected in
series, the inherent pulse-width distortion of each gate
cancels the distortion of the other gate. For best results,
the two series-connected gates should be from the same
package.
The circuit in Figure 13 also uses techniques known as
prebias and peaking to enhance the performance of the
optocoupler LED. Prebias is a small forward voltage ap-
plied to the LED when the LED is o. This small prebias
voltage partially charges the junction capacitance of the
LED, allowing the LED to turn on more quickly. The speed
of the LED is further increased by applying momentary
current peaks to the LED during the turn-on and turn-o
transitions of the drive current. These peak currents help
to charge and discharge the capacitances of the LED
more quickly, shortening the time required for the LED
to turn on and o.
Switching performance of the HCPL-2400/30 optocou-
plers is not sensitive to the TTL logic family used in the
recommended drive circuit. The typical and worst-case
switching parameters given in the data sheet can be
met using common 74LS TTL inverting gates or buers.
Use of faster TTL families will slightly reduce the overall
propagation delays from the input of the drive circuit to
the output of the optocoupler, but will not necessarily
result in lower pulse-width distortion or propagation de-
lay skew. This reduction in overall propagation delay is
due to shorter delays in the drive circuit, not to changes
in the propagation delays of the optocoupler; optocou-
pler propagation delays are not aected by the speed of
the logic used in the drive circuit.
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Data subject to change. Copyright © 2007 Avago Technologies Limited. All rights reserved. Obsoletes AV01-0563EN
AV02-0962EN - January 4, 2008