1999 Feb 10 291
Philips Components Product specification
Power chip resistor
size 2010 PRC111
1%
FEATURES
•Reduced size of final equipment
•Low assembly costs
•Higher component and equipment
reliability.
APPLICATIONS
•Converters
•Printer equipment
•Computers
•Battery chargers
•Automotive
•Power supplies.
DESCRIPTION
The resistors are constructed on a
high grade ceramic body (aluminium
oxide). Internal metal electrodes are
added at each end and connected by
a resistive paste which is applied to
the top surface of the substrate. The
composition of the paste is adjusted
to give the approximate resistance
required and the value is trimmed to
within tolerance, by laser cutting of
this resistive layer.
The resistive layer is covered with a
protective coating and printed with the
resistance value. Finally, the two
external end terminations are added.
To guarantee optimum solderability
the outer layer consists of a lead-tin
alloy.
QUICK REFERENCE DATA
DESCRIPTION VALUE
Resistance range 1 Ωto 10 MΩ, E96 series
Resistance tolerance ±1%
Temperature coefficient:
1Ω≤R < 4.99 Ω≤±300 ×10−6/K
5.1 Ω≤R < 9.76 Ω≤±200 ×10−6/K
10 Ω≤R<1MΩ≤±100 ×10−6/K
1MΩ≤R < 10 MΩ≤±200 ×10−6/K
Absolute maximum dissipation at
Tamb =70°C0.5 W
Maximum permissible voltage 200 V (DC or RMS)
Climatic category (IEC 60068) 55/125/56
Operating temperature range −55 °C to +125 °C
Basic specification IEC 60115-8
1999 Feb 10 292
Philips Components Product specification
Power chip resistor
size 2010 PRC111
1%
ORDERING INFORMATION
Table 1 Ordering code indicating resistor type and packaging
TYPE RESISTANCE
RANGE TOL.
(%) SERIES
ORDERING CODE 2322 761 .....
BLISTER TAPE ON REEL
4000 units
PRC111 1 Ωto 10 MΩ±1 E96 6....
Ordering code (12NC)
•The resistors have a 12-digit
ordering code starting with
2322 761; see Table 1.
•The subsequent digit indicates the
resistor type and packaging.
•The remaining digits indicate the
resistance value:
– The first 3 digits indicate the
resistance value.
– The last digit indicates the
resistance decade in
accordance with Table 2.
Table 2 Last digit of 12NC
RESISTANCE
DECADE LAST DIGIT
1 to 9.76 Ω8
10 to 97.6 Ω9
100 to 976 Ω1
1 to 9.76 kΩ2
10 to 97.6 kΩ3
100 to 976 kΩ4
1 to 9.76 MΩ5
10 MΩ6
ORDERING EXAMPLE
The ordering code of a PRC111
resistor, value 4.02 kΩ with 1%
tolerance, supplied on blister tape of
4000 units per reel is:
2322 761 64022.
1999 Feb 10 293
Philips Components Product specification
Power chip resistor
size 2010 PRC111
1%
FUNCTIONAL DESCRIPTION
Product characterization
Standard values of nominal
resistance are taken from the
E96 series for resistors
with a tolerance of ±1%.
The values of the E96 series are in
accordance with
“IEC publication 60063”
.
Limiting values
Note
1. The maximum voltage that may
be continuously applied to the
resistor element, see
“IEC publication 60115-8”
.
TYPE LIMITING
VOLTAGE(1)
(V)
LIMITING
POWER
(W)
PRC111 200 0.5
DERATING
The power that the resistor can dissipate depends on the operating
temperature; see Fig.1.
Fig.1 Maximum dissipation (Pmax) in percentage of rated power
as a function of the ambient temperature (Tamb).
handbook, halfpage
MLB206
70 10055 50 Tamb( C)
o
(%P )
rated
00
50
100
125
Pmax
1999 Feb 10 294
Philips Components Product specification
Power chip resistor
size 2010 PRC111
1%
MECHANICAL DATA
Mass per 100 units
Marking
Each resistor is marked with the
nominal resistance value.
4-DIGIT MARKING
For values up to 976 Ω the R is used
as a decimal point. For values of 1 kΩ
or greater the first 3 digits apply to the
resistance value and the fourth
indicates the number of zeros to
follow.
Example
PACKAGE MARKING
The packaging is also marked and
includes resistance value, tolerance,
catalogue number, quantity,
production period, batch number and
source code.
TYPE MASS
(g)
PRC111 2.50
MARKING RESISTANCE
121R 121 Ω
4021 4.02 kΩ
1503 150 kΩ
Outlines
Table 3 Chip resistor type and relevant physical dimensions; see Fig.2
TYPE L
(mm) W
(mm) T
(mm) tt
(mm) tb
(mm)
PRC111 5.0 ±0.2 2.5 ±0.2 0.55 ±0.10 0.65 ±0.25 0.90 ±0.25
Fig.2 Outlines.
For dimensions see Table 3.
tb
tt
T
inner electrode
end termination
protective coat
CCB436
4022
marking
W
L
protective coat
resistor layer
ceramic substrate
1999 Feb 10 295
Philips Components Product specification
Power chip resistor
size 2010 PRC111
1%
TESTS AND REQUIREMENTS
Essentially all tests are carried out in accordance with the
schedule of
“IEC publication 60115-8”
, category
55/125/56 (rated temperature range −55 to +125 °C;
damp heat, long term, 56 days). The testing also covers
the requirements specified by EIA and EIAJ.
The tests are carried out in accordance with
IEC publication 60068,
“Recommended basic climatic and
mechanical robustness testing procedure for electronic
components”
and under standard atmospheric conditions
in accordance with
“IEC 60068-1”
, subclause 5.3.
Unless otherwise specified the following values apply:
Temperature: 15 °Cto35°C
Relative humidity: 45% to 75%
Air pressure: 86 kPa to 106 kPa
(860 mbar to 1060 mbar).
In Table 4 the tests and requirements are listed with
reference to the relevant clauses of
“IEC publications 60115-8 and 60068”
; a short
description of the test procedure is also given. In some
instances deviations from the IEC recommendations were
necessary for our method of specifying.
All soldering tests are performed with mildly activated flux.
Table 4 Test procedures and requirements
IEC
60115-8
CLAUSE
IEC
60068-2
TEST
METHOD
TEST PROCEDURE REQUIREMENTS
Tests in accordance with the schedule of IEC publication 60115-8
4.4.1 visual
examination no holes; clean surface;
no visible damage
4.17 20 (Ta) solderability unmounted chips completely immersed
for 2 ±0.5 s in a solder bath at 235 ±2°Cgood tinning (≥95% covered);
no visible damage
4.18 20 (Tb) resistance to
soldering heat unmounted chips; 10 ±1s;260±5°C no visible damage
∆R/R max.: ±(0.5% +0.05 Ω)
4.13 short time
overload room temperature;
dissipation 6.25 ×0.5 W;
5 s (voltage not more than 2 ×Vmax)
∆R/R max.: ±(1% +0.05 Ω)
4.33 bending resistors mounted on a 90 mm glass
epoxy resin PCB (FR4), bending: 2 mm no visible damage
∆R/R max.: ±(0.5% +0.05 Ω)
4.19 14 (Na) rapid change of
temperature 30 minutes at LCT and
30 minutes at UCT; 5 cycles no visible damage
∆R/R max.: ±(0.5% +0.05 Ω)
4.6.1.1 insulation
resistance 200 V (DC) after 1 minute Rins min.: 10000 MΩ
4.24.2 3 (Ca) damp heat
(steady state) 56 days; 40 ±2°C; 93 +2/−3% RH;
loaded with 0.01 Pn
no visible damage
∆R/R max.: ±(1.5% +0.05 Ω)
4.25.1 endurance 1000 +48/−0 hours; nominal dissipation;
1.5 hours on, 0.5 hour off no visible damage
∆R/R max.: ±(1.5% +0.05 Ω)
4.8.4.2 temperature
coefficient at 20/LCT/20 °C and 20/UCT/20 °C:
1Ω≤R<4.99 Ω∆R/R max.: ±300 ×10−6/K
5.1 Ω≤R<9.76 Ω∆R/R max.: ±200 ×10−6/K
10 Ω≤R<1MΩ∆R/R max.: ±100 ×10−6/K
1MΩ≤R<10 MΩ∆R/R max.: ±200 ×10−6/K
1999 Feb 10 296
Philips Components Product specification
Power chip resistor
size 2010 PRC111
1%
Other tests in accordance with IEC 60115 clauses and IEC 60068 test method
4.17 20 (Ta) solderability
(after ageing) 8 hours steam or 16 hours at 155 °C;
unmounted chips completely immersed
for 2 ±0.5 s in a solder bath at 235 ±2°C
good tinning (≥95% covered);
no visible damage
Other applicable tests
leaching unmounted chips 60 ±1 s; 260 ±5°C good tinning; no leaching
(JIS) C
5202 7.5 resistance to
damp heat
(steady state)
1000 +48/−0 hours; 40 ±2°C;
93 +2/−3% RH;
loaded with 1 W or Vmax;
1.5 hours on, 0.5 hour off
no visible damage
∆R/R max.: ±(1% +0.05 Ω)
IEC
60115-8
CLAUSE
IEC
60068-2
TEST
METHOD
TEST PROCEDURE REQUIREMENTS
