Selection Guide Luminous Intensity Iv (mcd) @ 10 mA
Color Part Number Min. Max.
HLMP-3315 13.8 -
Red HLMP-3317 22.00 -
HLMP-3316-I00xx 22.0 -
HLMP-3316-IJ0xx 22.0 70.4
HLMP-3415 9.2 -
Yellow HLMP-3416 14.7 -
HLMP-3416-G00xx 14.7 -
HLMP-3416-IJ0xx 37.6 120.2
HLMP-3517 6.7 -
Green HLMP-3519 10.6 -
HLMP-3519-F00xx 10.6 -
HLMP-3519-IJ0xx 43.6 139.6
Description
This family of T-13/4 nondiffused
LED lamps is specially designed
for applications requiring higher
on-axis intensity than is achievable
with a standard lamp. The light
generated is focused to a narrow
beam to achieve this effect.
HLMP-331x Series, HLMP-341x Series, HLMP-351x Series
Agilent T-13/4 (5 mm) High Intensity
LED Lamps
Data Sheet
Features
High intensity
Choice of 3 bright colors
High Efficiency Red
Yellow
High Performance Green
Popular T-13/4 diameter package
Selected minimum intensities
Narrow viewing angle
General purpose leads
Reliable and rugged
Available on tape and reel
2
Package Dimensions
Part Numbering System
HLMP - 3 x 1 x - x x x xx
Mechanical Options
00: Bulk
01: Tape & Reel, Crimped Leads
02: Tape & Reel, Straight Leads
B1: Right Angle Housing, Uneven Leads
B2: Right Angle Housing, Even Leads
Color Bin Options
0: Full Color Bin Distribution
Maximum Iv Bin Options
0: Open (no max. limit)
Others: Please refer to the Iv Bin Table
Minimum Iv Bin Options
Please refer to the Iv Bin Table
Brightness Level
5, 7: Less Brightness
6, 9: Higher Brightness
Color Options
3: GaP HER
4: GaP Yellow
5: GaP Green
3
Electrical Characteristics at TA = 25°CDevice
Symbol Description HLMP- Min. Typ. Max. Units Test Conditions
IVLuminous Intensity 3315 13.8 40.0 mcd IF = 10 mA (Figure 3)
3316 22 60.0
3415 9.2 40.0 mcd IF = 10 mA (Figure 8)
3416 14.7 50.0
3517 6.7 50.0 mcd IF = 10 mA (Figure 13)
3519 10.6 70.0
2q1/2Including Angle Between Half 3315 35 Deg. IF = 10 mA
Luminous Intensity Points 3316 35 See Note 1 (Figure 6)
3415 35 Deg. IF = 10 mA
3416 35 See Note 1 (Figure 11)
3517 24 Deg. IF = 10 mA
3519 24 See Note 1 (Figure 16)
lPEAK Peak Wavelength 331X 635 nm Measurement at Peak
341X 583 (Figure 1)
351X 565
Dl1/2 Spectral Line Halfwidth 331X 40 nm
341X 36
351X 28
ldDominant Wavelength 331X 626 nm See Note 2 (Figure 1)
341X 585
351X 569
tsSpeed of Response 331X 90 ns
341X 90
351X 500
C Capacitance 331X 11 pF VF = 0; f = 1 MHz
341X 15
351X 18
RqJ-PIN Thermal Resistance 331X 260 °C/W Junction to Cathode
341X Lead
351X
VFForward Voltage 331X 1.9 2.4 V IF = 10 mA (Figure 2)
341X 2.0 2.4 IF = 10 mA (Figure 7)
351X 2.1 2.7 IF = 10 mA (Figure 12)
VRReverse Breakdown Volt. All 5.0 V IR = 100 µA
hVLuminous Efficacy 331X 145 lumens See Note 3
341X 500 Watt
351X 595
Notes:
1. q1/2 is the off-axis angle at which the luminous intensity is half the axial luminous intensity.
2. The dominant wavelength, ld, is derived from the CIE chromaticity diagram and represents the single wavelength which defines the color of the
device.
3. Radiant intensity, Ie, in watts/steradian, may be found from the equation Ie = Iv/hv, where Iv is the luminous intensity in candelas and hv is the
luminous efficacy in lumens/watt.
4
Figure 1. Relative intensity vs. wavelength.
Absolute Maximum Ratings at TA = 25°C
Parameter 331X Series 341X Series 351X Series Units
Peak Forward Current 90 60 90 mA
Average Forward Current[1] 25 20 25 mA
DC Current[2] 30 20 30 mA
Power Dissipation[3] 135 85 135 mW
Reverse Voltage (IR = 100 µA) 5 5 5 V
Transient Forward Current[4] 500 500 500 mA
(10 µsec Pulse)
LED Junction Temperature 110 110 110 °C
Operating Temperature Range -55 to +100 -55 to +100 -20 to +100 °C
Storage Temperature Range -55 to +100
Notes:
1. See Figure 5 (Red), 10 (Yellow), or 15 (Green) to establish pulsed operating conditions.
2. For Red and Green series derate linearly from 50°C at 0.5 mA/°C. For Yellow series derate linearly from 50°C at 0.2 mA/°C.
3. For Red and Green series derate power linearly from 25°C at 1.8 mW/°C. For Yellow series derate power linearly from 50°C at 1.6 mW/°C.
4. The transient peak current is the maximum non-recurring peak current that can be applied to the device without damaging the LED die and wirebond.
It is not recommended that the device be operated at peak currents beyond the peak forward current listed in the Absolute Maximum Ratings.
5
High Efficiency Red HLMP-331X Series
Figure 3. Relative luminous intensity vs. DC
forward current.
Figure 2. Forward current vs. forward voltage
characteristics. Figure 4. Relative efficiency (luminous
intensity per unit current) vs. peak LED
current.
Figure 5. Maximum tolerable peak current vs.
pulse duration (IDC MAX as per MAX
ratings).
Figure 6. Relative luminous intensity vs. angular displacement.
6
Yellow HLMP-341X Series
Figure 8. Relative luminous intensity vs. DC
forward current.
Figure 7. Forward current vs. forward voltage
characteristics. Figure 9. Relative efficiency (luminous
intensity per unit current) vs. peak current.
Figure 10. Maximum tolerable peak current
vs. pulse duration (IDC MAX as per MAX
ratings).
Figure 11. Relative luminous intensity vs. angular displacement.
7
Green HLMP-351X Series
Figure 13. Relative luminous intensity vs. DC
forward current.
Figure 12. Forward current vs. forward
voltage characteristics. Figure 14. Relative efficiency (luminous
intensity per unit current) vs. peak LED
current.
Figure 15. Maximum tolerable peak current
vs. pulse duration (IDC MAX as per MAX
ratings).
Figure 16. Relative luminous intensity vs. angular displacement. T-13/4 lamp.
8
Table 2. Intensity Bin Limit
Intensity Range
(mcd)
Color Bin Min. Max.
H 15.5 24.8
I 24.8 39.6
J 39.6 63.4
K 63.4 101.5
L 101.5 162.4
M 162.4 234.6
N 234.6 340.0
O 340.0 540.0
Red P 540.0 850.0
Q 850.0 1200.0
R 1200.0 1700.0
S 1700.0 2400.0
T 2400.0 3400.0
U 3400.0 4900.0
V 4900.0 7100.0
W 7100.0 10200.0
X 10200.0 14800.0
Y 14800.0 21400.0
Z 21400.0 30900.0
Table 2. (Cont'd) Table 2. (Cont'd)
Maximum tolerance for each bin limit is ±18%.
Intensity Range
(mcd)
Color Bin Min. Max.
G 16.6 26.5
H 26.5 42.3
I 42.3 67.7
J 67.7 108.2
K 108.2 173.2
L 173.2 250.0
M 250.0 360.0
Yellow N 360.0 510.0
O 510.0 800.0
P 800.0 1250.0
Q 1250.0 1800.0
R 1800.0 2900.0
S 2900.0 4700.0
T 4700.0 7200.0
U 7200.0 11700.0
V 11700.0 18000.0
W 18000.0 27000.0
Intensity Range
(mcd)
Color Bin Min. Max.
E 7.6 12.0
F 12.0 19.1
G 19.1 30.7
H 30.7 49.1
I 49.1 78.5
J 78.5 125.7
K 125.7 201.1
L 201.1 289.0
Green M 289.0 417.0
N 417.0 680.0
O 680.0 1100.0
P 1100.0 1800.0
Q 1800.0 2700.0
R 2700.0 4300.0
S 4300.0 6800.0
T 6800.0 10800.0
U 10800.0 16000.0
V 16000.0 25000.0
W 25000.0 40000.0
9
Color Categories Lambda (nm)
Color Cat # Min. Max.
6 561.5 564.5
5 564.5 567.5
Green 4 567.5 570.5
3 570.5 573.5
2 573.5 576.5
1 582.0 584.5
3 584.5 587.0
Yellow 2 587.0 589.5
4 589.5 592.0
5 592.0 593.0
Mechanical Option Matrix
Mechanical Option Code Definition
00 Bulk Packaging, minimum increment 500 pcs/bag
01 Tape & Reel, crimped leads, minimum increment 1300 pcs/bag
02 Tape & Reel, straight leads, minimum increment 1300 pcs/bag
B1 Right Angle Housing, uneven leads, minimum increment 500 pcs/bag
B2 Right Angle Housing, even leads, minimum increment 500 pcs/bag
Note:
All Categories are established for classification of products. Products may not be available in all categories. Please contact your local Agilent
representative for further clarification/information.
Precautions
Lead Forming
The leads of an LED lamp may be preformed or cut to
length prior to insertion and soldering into PC board.
If lead forming is required before soldering, care must
be taken to avoid any excessive mechanical stress
induced to LED package. Otherwise, cut the leads of
LED to length after soldering process at room
temperature. The solder joint formed will absorb the
mechanical stress of the lead cutting from traveling to
the LED chip die attach and wirebond.
It is recommended that tooling made to precisely
form and cut the leads to length rather than rely upon
hand operation.
Soldering Conditions
Care must be taken during PCB assembly and
soldering process to prevent damage to LED
component.
The closest LED is allowed to solder on board is 1.59
mm below the body (encapsulant epoxy) for those
parts without standoff.
Recommended soldering conditions:
Wave soldering parameter must be set and
maintained according to recommended temperature
and dwell time in the solder wave. Customer is
advised to periodically check on the soldering profile
to ensure the soldering profile used is always
conforming to recommended soldering condition.
If necessary, use fixture to hold the LED component
in proper orientation with respect to the PCB during
soldering process.
Proper handling is imperative to avoid excessive
thermal stresses to LED components when heated.
Therefore, the soldered PCB must be allowed to cool
to room temperature, 25°C, before handling.
Special attention must be given to board fabrication,
solder masking, surface plating and lead holes size
and component orientation to assure solderability.
Recommended PC board plated through hole sizes for
LED component leads:
Manual Solder
W ave Soldering Dipping
Pre-heat Temperature 105 °C Max.
Pre-heat Time 30 sec Max.
Peak Temperature 250 °C Max. 260 °C Max.
Dwell Time 3 sec Max. 5 sec Max.
LED Component Plated Through
Lead Size Diagonal Hole Diameter
0.457 x 0.457 mm 0.646 mm 0.976 to 1.078 mm
(0.018 x 0.018 inch) (0.025 inch) (0.038 to 0.042 inch)
0.508 x 0.508 mm 0.718 mm 1.049 to 1.150 mm
(0.020 x 0.020 inch) (0.028 inch) (0.041 to 0.045 inch)
Note: Refer to application note AN1027 for more
information on soldering LED components.
Figure 17. Recommended wave soldering profile.
LAMINAR W A VE BOTTOM SIDE
OF PC BOARD
HOT AIR KNIFE
TURBULENT W A VE
FLUXING
PREHEAT
01020
30
50
100
150
200
250
30 40 50
TIME – SECONDS
TEMPERATURE – °C
60 70 80 90 100
TOP SIDE OF
PC BOARD
CONVEYOR SPEED = 1.83 M/MIN (6 FT/MIN)
PREHEAT SETTING = 150°C (100°C PCB)
SOLDER WAVE TEMPERATURE = 245°C
AIR KNIFE AIR TEMPERATURE = 390°C
AIR KNIFE DISTANCE = 1.91 mm (0.25 IN.)
AIR KNIFE ANGLE = 40°
SOLDER: SN63; FLUX: RMA
NOTE: ALLOW FOR BOARDS TO BE
SUFFICIENTLY COOLED BEFORE EXERTING
MECHANICAL FORCE.
10
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Copyright © 2005 Agilent Technologies, Inc.
Obsoletes 5988-2146EN
November 16, 2005
5989-4259EN