MCC TM Micro Commercial Components BZT52C2V4S THRU BZT52C39S omponents 20736 Marilla Street Chatsworth !"# $ % !"# Features x x x x * * * 200 mW Zener Diode 2.4 to 39 Volts Planar Die Construction 200mW Power Dissipation on Ceramic PCB General Purpose Medium Current Ideally Suited for Automated Assembly Processes Epoxy meets UL 94 V-0 flammability rating Moisture Sensitivity Level 1 Lead Free Finish/RoHS Compliant("P" Suffix designates RoHS Compliant. See ordering information) SOD-323 A Absolute Maximum Ratings Symbol Parameter B Rating Unit 200 mW PD Power dissipation TJ Junction Temperature -65 to +150 Storage Temperature Range -65 to +150 TSTG C E H D Absolute Maximum Ratings Symbol RthJA Parameter Thermal Resistance Junction to Ambient* Rating Unit DIM 625 /W * Device mounted on ceramic PCB: 7.6mm x 9.4mm x 0.87mm with pad areas 25 mm2 Electrical Characteristics Symbol Parameter J G Rating A B C D E G H J DIMENSIONS INCHES MM MIN MAX MIN MAX .090 .107 2.30 2.70 .063 .071 1.60 1.80 .045 .053 1.15 1.35 .031 .045 0.80 1.15 .010 .016 0.25 0.40 .004 .018 0.10 0.45 .004 .010 0.10 0.25 ----.006 ----0.15 NOTE Unit SUGGESTED SOLDER PAD LAYOUT VF Maximum Forward Voltage (IF=10mAdc) 0.9 0.074" V 0.027" 0.022" Revision: A www.mccsemi.com 1 of 3 2011/01/01 MCC BZT52C2V4S THRU BZT52C39S TM Micro Commercial Components ELECTRICAL CHARACTERISTICS @25qC ZENER VOLTAGE Maximum Zener Maximum Zener VZ (1) Impedance (2) Impedance (2) Type VOLTS ZZT(OHMS) ZZK (OHMS) Max. Max. IZK(mA) Min. Nom Max. IZT(mA) BZT52C2V4S 2.28 2.4 2.56 5 100 1.0 600 BZT52C2V7S 2.5 2.7 2.9 5 100 1.0 600 BZT52C3V0S 2.8 3.0 3.2 5 95 1.0 600 BZT52C3V3S 3.1 3.3 3.5 5 95 1.0 600 BZT52C3V6S 3.4 3.6 3.8 5 90 1.0 600 BZT52C3V9S 3.7 3.9 4.1 5 90 1.0 600 BZT52C4V3S 4.0 4.3 4.6 5 90 1.0 600 BZT52C4V7S 4.4 4.7 5.0 5 80 1.0 500 BZT52C5V1S 4.8 5.1 5.4 5 60 1.0 480 BZT52C5V6S 5.2 5.6 6.0 5 40 1.0 400 BZT52C6V2S 5.8 6.2 6.6 5 10 1.0 150 BZT52C6V8S 6.4 6.8 7.2 5 15 1.0 80 BZT52C7V5S 7.0 7.5 7.9 5 15 1.0 80 BZT52C8V2S 7.7 8.2 8.7 5 15 1.0 80 BZT52C9V1S 8.5 9.1 9.6 5 15 1.0 100 BZT52C10S 9.4 10 10.6 5 20 1.0 150 BZT52C11S 10.4 11 11.6 5 20 1.0 150 BZT52C12S 11.4 12 12.7 5 25 1.0 150 BZT52C13S 12.4 13 14.1 5 30 1.0 170 BZT52C15S 13.8 15 15.6 5 30 1.0 200 BZT52C16S 15.3 16 17.1 5 40 1.0 200 BZT52C18S 16.8 18 19.1 5 45 1.0 225 BZT52C20S 18.8 20 21.2 5 55 1.0 225 BZT52C22S 20.8 22 23.3 5 55 1.0 250 BZT52C24S 22.8 24 25.6 5 70 1.0 250 BZT52C27S 25.1 27 28.9 2 80 0.5 300 BZT52C30S 28 30 32 2 80 0.5 300 BZT52C33S 31 33 35 2 80 0.5 325 BZT52C36S 34 36 38 2 90 0.5 350 BZT52C39S 37 39 41 2 130 0.5 350 (1) Device mounted on ceramic PCB: 7.6mm x 9.4mm x 0.87mm with pad areas 25 mm2 (2) f=1KHz REVERSE CURRENT IR (Max) @ VR uA V 50 1.0 20 1.0 10 1.0 5 1.0 5 1.0 3 1.0 3 1.0 3 2.0 2 2.0 1 2.0 3 4.0 2 4.0 1 5.0 0.7 5.0 0.5 6.0 0.2 7.0 0.1 8.0 0.1 8.0 0.1 8.0 0.1 10.5 0.1 11.2 0.1 12.6 0.1 14.0 0.1 15.4 0.1 16.8 0.1 18.9 0.1 21.0 0.1 23.1 0.1 25.2 0.1 27.3 Typical Temperature Coefficent @ IZTC mV/ -3.5 0 -3.5 0 -3.5 0 -3.5 0 -3.5 0 -3.5 0 -3.5 0 -3.5 0.2 -2.7 1.2 -2.0 2.5 0.4 3.7 1.2 4.5 2.5 5.3 3.2 6.2 3.8 7.0 4.5 8.0 5.4 9.0 6.0 10.0 7.0 11.0 9.2 13.0 10.4 14.0 12.4 16.0 14.4 18.0 16.4 20.0 18.4 22.0 21.4 25.3 24.4 29.4 27.4 33.4 30.4 37.4 33.4 41.2 Marking WX W1 W2 W3 W4 W5 W6 W7 W8 W9 WA WB WC WD WE WF WG WH WI WJ WK WL WM WN WO WP WQ WR WS WT www.mccsemi.com Revision: A 2 of 3 2011/01/01 MCC BZT52C2V4S-BZT52C39S Typical characteristics 300 50 Tj = 25C C2V7 C3V9 C3V3 C5V6 C4V7 C6V8 40 IZ, ZENER CURRENT (mA) PD, POWER DISSIPATION (mW) TM Micro Commercial Components 200 100 C8V2 30 20 Test Current IZ 5.0mA 10 0 100 0 200 0 0 1 3 4 5 6 8 9 7 VZ, ZENER VOLTAGE (V) Fig. 2 Zener Breakdown Characteristics TA, AMBIENT TEMPERATURE, C Fig. 1. Power Derating Curve 30 Tj = 25C 2 10 1000 C10 Tj = 25 C CT, TOTAL CAPACITANCE (pF) IZ, ZENER CURRENT (mA) C12 C15 20 C18 Test current IZ 2mA C22 10 Test current IZ 5mA C27 C33 C39 C36 VR = 1V VR = 2V 100 VR = 1V VR = 2V 10 1 0 0 10 20 30 VZ, ZENER VOLTAGE (V) Fig. 3. Zener Breakdown Characteristics 10 100 VZ, NOMINAL ZENER VOLTAGE (V) Fig. 4 Total Capacitance vs Nominal Zener Voltage 40 www.mccsemi.com Revision: A 2 of 3 2011/01/01 MCC TM Micro Commercial Components Ordering Information : Device Packing Part Number-TP Tape&Reel: 3Kpcs/Reel ***IMPORTANT NOTICE*** Micro Commercial Components Corp. reserves the right to make changes without further notice to any product herein to make corrections, modifications , enhancements , improvements , or other changes . Micro Commercial Components Corp . does not assume any liability arising out of the application or use of any product described herein; neither does it convey any license under its patent rights ,nor the rights of others . The user of products in such applications shall assume all risks of such use and will agree to hold Micro Commercial Components Corp . and all the companies whose products are represented on our website, harmless against all damages. ***LIFE SUPPORT*** MCC's products are not authorized for use as critical components in life support devices or systems without the express written approval of Micro Commercial Components Corporation. ***CUSTOMER AWARENESS*** Counterfeiting of semiconductor parts is a growing problem in the industry. Micro Commercial Components (MCC) is taking strong measures to protect ourselves and our customers from the proliferation of counterfeit parts. MCC strongly encourages customers to purchase MCC parts either directly from MCC or from Authorized MCC Distributors who are listed by country on our web page cited below. Products customers buy either from MCC directly or from Authorized MCC Distributors are genuine parts, have full traceability, meet MCC's quality standards for handling and storage. MCC will not provide any warranty coverage or other assistance for parts bought from Unauthorized Sources. MCC is committed to combat this global problem and encourage our customers to do their part in stopping this practice by buying direct or from authorized distributors. www.mccsemi.com Revision: A 3 of 3 2011/01/01 3