Semiconductor Components Industries, LLC, 2004
April, 2004 − Rev. 2 1Publication Order Number:
MBRS3200T3/D
MBRS3200T3
Surface Mount
Schottky Power Rectifier
. . . employing the Schottky Barrier principle in a large area
metal−to−silicon power diode. State−of−the−art geometry features
epitaxial construction with oxide passivation and metal overlay
contact. Ideally suited for low voltage, high frequency rectification, or
as free wheeling and polarity protection diodes in surface mount
applications where compact size and weight are critical to the system.
Small Compact Surface Mountable Package with J−Bend Leads
Rectangular Package for Automated Handling
Highly Stable Oxide Passivated Junction
Very High Blocking Voltage − 200 V
150°C Operating Junction Temperature
Guardring for Stress Protection
Mechanical Characteristics
Case: Epoxy, Molded, Epoxy Meets UL94, VO
Weight: 95 mg (approximately)
Finish: All External Surfaces Corrosion Resistant and Terminal
Leads are Readily Solderable
Lead and Mounting Surface Temperature for Soldering Purposes:
260°C Max. for 10 Seconds
Shipped in 12 mm Tape and Reel, 2500 units per reel
Cathode Polarity Band
Device Meets MSL 1 Requirements
ESD Ratings: Machine Model = A
ESD Ratings: Human Body Model = 1C
Marking: B320
Pb−Free Package is Available
MAXIMUM RATINGS
Rating Symbol Value Unit
Peak Repetitive Reverse Voltage
Working Peak Reverse Voltage
DC Blocking Voltage
VRRM
VRWM
VR
200 V
Average Rectified Forward Current
(TL = 120 °C) IF(AV) 3.0 A
Non−Repetitive Peak Surge Current
(Surge Applied at Rated Load Condi-
tions Halfwave, Single Phase, 60 Hz)
IFSM 100 A
Operating Junction Temperature TJ−65 to +150 °C
Maximum ratings are those values beyond which device damage can occur.
Maximum ratings applied to the device are individual stress limit values (not
normal operating conditions) and are not valid simultaneously. If these limits
are exceeded, device functional operation is not implied, damage may occur
and reliability may be affected.
Device Package Shipping
ORDERING INFORMATION
SMB
CASE 403A
PLASTIC
MBRS3200T3 SMB 2500/Tape & Reel
SCHOTTKY BARRIER
RECTIFIER
3.0 AMPERE
200 VOLTS
MARKING DIAGRAM
B320
B320 = Device Code
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For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specification
Brochure, BRD8011/D.
MBRS3200T3G SMB
(Pb−Free) 2500/Tape & Reel
MBRS3200T3
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2
THERMAL CHARACTERISTICS
Characteristic Symbol Value Unit
Thermal Resistance − Junction−to−Lead (Note 1)
Thermal Resistance − Junction−to−Ambient (Note 2) RJL
RJA 13
62 °C/W
ELECTRICAL CHARACTERISTICS
Maximum Instantaneous Forward Voltage (Note 3)
(IF = 3.0 A, TJ = 25°C)
(IF = 4.0 A, TJ = 25°C)
(IF = 3.0 A, TJ = 150°C)
VF0.84
0.86
0.59
V
Maximum Instantaneous Reverse Current (Note 3)
(Rated dc Voltage, TJ = 25°C)
(Rated dc Voltage, TJ = 150°C)
IR5.0
5.0 A
mA
1. Minimum pad size (0.108 × 0.085 inch) for each lead on FR4 board
2. 1 inch square pad size (1 × 0.5 inch) for each lead on FR4 board
3. Pulse Test: Pulse Width = 300 s, Duty Cycle 2.0%.
MBRS3200T3
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3
100
1
0.1 10.2 0.3 0.4 0.5 0.6 0.7
VF, INSTANTANEOUS VOLTAGE (VOLTS)
Figure 1. Typical Forward Voltage Figure 2. Maximum Forward Voltage
10
0.8 0.9 1.1 1.2
IF, FORWARD CURRENT (AMPS)
TC = 25°C
TC = 150°C
TC = 100°C100
1
0.1 10.2 0.3 0.4 0.5 0.6 0.7
VF, INSTANTANEOUS VOLTAGE (VOLTS)
10
0.8 0.9 1.1 1.2
IF, FORWARD CURRENT (AMPS)
TC = 25°C
TC = 150°C
TC = 100°C
1.0E−09 1600 20 40 60 80 100
VR, REVERSE VOLTAGE (VOLTS)
Figure 3. Typical Reverse Current Figure 4. Typical Capacitance
120 140 180 200
IR, REVERSE CURRENT (AMPS)
TC = 25°C
TC = 150°C
TC = 100°C
1000
10 1600 20 40 60 80 100
VR, REVERSE VOLTAGE (VOLTS)
100
120 140 180 200
C, CAPACITANCE (pF)
TC = 25°C
f = 1 MHz
1.0E−08
1.0E−07
1.0E−06
1.0E−05
1.0E−04
1.0E−03
Typical Capacitance
at 0 V = 209 V
015080 90 100 110 120
TL, LEAD TEMPERATURE (°C)
Figure 5. Current Derating − Lead Figure 6. Forward Power Dissipation
130 140 160
IF, AVERAGE FORWARD CURRENT (AMPS)
5
040123
IO, AVERAGE FORWARD CURRENT (AMPS)
2.5
56
Pfo, AVERAGE POWER DISSIPATION (W)
1
2
3
4
6
7
5SQUARE WAVE
dc
0.5
1
1.5
2
4.5
3
3.5
4SQUARE WAVE
dc
MBRS3200T3
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4
PACKAGE DIMENSIONS
SMB
PLASTIC PACKAGE
CASE 403A−03
ISSUE D
A
S
DB
J
P
K
C
H
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. D DIMENSION SHALL BE MEASURED WITHIN
DIMENSION P.
DIM MIN MAX MIN MAX
MILLIMETERSINCHES
A0.160 0.180 4.06 4.57
B0.130 0.150 3.30 3.81
C0.075 0.095 1.90 2.41
D0.077 0.083 1.96 2.11
H0.0020 0.0060 0.051 0.152
J0.006 0.012 0.15 0.30
K0.030 0.050 0.76 1.27
P0.020 REF 0.51 REF
S0.205 0.220 5.21 5.59
mm
inches
SCALE 8:1
2.743
0.108
2.159
0.085
2.261
0.089
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
SOLDERING FOOTPRINT*
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to any products herein. SCILLC makes no warranty , representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability
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MBRS3200T3/D
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