July 2010 Doc ID 17359 Rev 1 1/45
1
VND5E004A-E
VND5E004ASP30-E
Double 4mΩ high-side driver with analog current sense
for automotive applications
Features
■General
– Very low standby current
– 3.0 V CMOS compatible inputs
– Optimized electromagnetic emissions
– Very low electromagnetic susceptibility
– Compliant with European directive
2002/95/EC
– Very low current sense leakage
■Diagnostic functions
– Proportional load current sense
– High current sense precision for wide
currents range
– Diagnostic enable pin
– Off-state open-load detection
– Output short to VCC detection
– Overload and short to ground (power
limitation) indication
– Thermal shutdown indication
■Protection
– Undervoltage shutdown
– Overvoltage clamp
– Load current limitation
– Self limiting of fast thermal transients
– Protection against loss of ground and loss
of VCC
– Overtemperature shutdown with auto
restart (thermal shutdown)
– Inrush current active management by
power limitation
– Reverse battery protection with self switch
on of the Power MOSFET
– Electrostatic discharge protection
Applications
■All types of resistive, inductive and capacitive
loads
■Suitable for power management applications
Description
The VND5E004A-E and VND5E004ASP30-E are
double channel high-side drivers manufactured
using ST proprietary VIPower™ M0-5 technology
and housed in PQFN-12x12 power lead-less and
MultiPowerSO-30 packages. The devices are
designed to drive 12 V automotive grounded
loads, and to provide protection and diagnostics.
They also implement a 3 V and 5 V CMOS-
compatible interface for use with any
microcontroller.
The devices integrate advanced protective
functions such as load current limitation, inrush
and overload active management by power
limitation, overtemperature shut-off with auto-
restart and overvoltage active clamp. A dedicated
analog current sense pin is associated with every
output channel providing enhanced diagnostic
functions including fast detection of overload and
short-circuit to ground through power limitation
indication, overtemperature indication, short-
circuit to VCC diagnosis and on-state and off-state
open-load detection. The current sensing and
diagnostic feedback of the whole device can be
disabled by pulling the DE pin low to share the
external sense resistor with similar devices.
Max transient supply voltage VCC 41 V
Operating voltage range VCC 4.5 to 28 V
Max on-state resistance (per ch.) RON 4mΩ
Current limitation (typ) ILIMH 90 A
Off-state supply current IS2µA
(1)
1. Typical value with all loads connected
MultiPowerSO-30PQFN - 12x12 Power lead-less
www.st.com
Contents VND5E004A-E / VND5E004ASP30-E
2/45 Doc ID 17359 Rev 1
Contents
1 Block diagram and pin configurations . . . . . . . . . . . . . . . . . . . . . . . . . . 6
2 Electrical specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
2.1 Absolute maximum ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
2.2 Thermal data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
2.3 Electrical characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
2.4 Waveforms . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19
2.5 Electrical characteristics curves . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22
3 Application information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25
3.1 MCU I/Os protection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25
3.2 Load dump protection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25
3.3 Current sense and diagnostic . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 26
3.3.1 Short to VCC and off-state open-load detection . . . . . . . . . . . . . . . . . . 27
3.4 Maximum demagnetization energy (VCC = 13.5V) . . . . . . . . . . . . . . . . . 29
4 Package and PC board thermal data . . . . . . . . . . . . . . . . . . . . . . . . . . . 30
4.1 MultiPowerSO-30 thermal data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 30
4.2 PQFN - 12x12 power lead-less thermal data . . . . . . . . . . . . . . . . . . . . . . 33
5 Package and packing information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 36
5.1 ECOPACK® packages . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 36
5.2 MultiPowerSO-30 mechanical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 36
5.3 PQFN - 12x12 power lead-less mechanical data . . . . . . . . . . . . . . . . . . . 38
5.4 MultiPowerSO-30 packing information . . . . . . . . . . . . . . . . . . . . . . . . . . . 40
5.5 PQFN - 12x12 power lead-less packing information . . . . . . . . . . . . . . . . 41
6 Order codes . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 43
7 Revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 44
VND5E004A-E / VND5E004ASP30-E List of tables
Doc ID 17359 Rev 1 3/45
List of tables
Table 1. Pin functions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
Table 2. Suggested connections for unused and not connected pins . . . . . . . . . . . . . . . . . . . . . . . . 7
Table 3. Absolute maximum ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
Table 4. Thermal data. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
Table 5. Power section . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
Table 6. Switching (VCC = 13 V; Tj = 25 °C) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
Table 7. Logic inputs. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
Table 8. Protections and diagnostics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
Table 9. Current sense (8 V < VCC < 18 V) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
Table 10. Open-load detection (8V<VCC<18V, VDE= 5V) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14
Table 11. Truth table. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17
Table 12. Electrical transient requirements (part 1/3) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18
Table 13. Electrical transient requirements (part 2/3) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18
Table 14. Electrical transient requirements (part 3/3) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18
Table 15. Thermal parameters for MultiPowerSO-30 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 32
Table 16. Thermal parameters for PQFN - 12x12 power lead-less . . . . . . . . . . . . . . . . . . . . . . . . . . 35
Table 17. MultiPowerSO-30 mechanical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 37
Table 18. PQFN - 12x12 power lead-less mechanical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 39
Table 19. Device summary . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 43
Table 20. Document revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 44
List of figures VND5E004A-E / VND5E004ASP30-E
4/45 Doc ID 17359 Rev 1
List of figures
Figure 1. Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
Figure 2. Configuration diagram (not in scale) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
Figure 3. Current and voltage conventions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
Figure 4. Current sense delay characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14
Figure 5. Open-load off-state delay timing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14
Figure 6. Switching characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
Figure 7. Delay response time between rising edge of output current and rising edge of current sense
(CS enabled) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
Figure 8. Output voltage drop limitation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16
Figure 9. IOUT/ISENSE vs IOUT . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16
Figure 10. Maximum current sense ratio drift vs load current(1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17
Figure 11. Normal operation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19
Figure 12. Overload or short to GND . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19
Figure 13. Intermittent overload . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20
Figure 14. Off-state open-load with external circuitry . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20
Figure 15. Short to VCC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21
Figure 16. TJ evolution in overload or short to GND . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21
Figure 17. Off-state output current. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22
Figure 18. High level input current . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22
Figure 19. Input clamp voltage. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22
Figure 20. Input low level voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22
Figure 21. Input high level voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22
Figure 22. Input hysteresis voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22
Figure 23. On-state resistance vs Tcase. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23
Figure 24. On-state resistance vs VCC. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23
Figure 25. Undervoltage shutdown . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23
Figure 26. Turn-on voltage slope . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23
Figure 27. ILIMH vs Tcase . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23
Figure 28. Turn-off voltage slope . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23
Figure 29. DE high level voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24
Figure 30. DE clamp voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24
Figure 31. DE low level voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24
Figure 32. Application schematic . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25
Figure 33. Current sense and diagnostics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 27
Figure 34. Maximum turn-off current versus inductance (1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 29
Figure 35. MultiPowerSO-30 PC board(1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 30
Figure 36. Rthj-amb vs PCB copper area in open box free air condition (one channel ON) . . . . . . . . 30
Figure 37. MultiPowerSO-30 thermal impedance junction ambient single pulse (one channel ON) . . 31
Figure 38. Thermal fitting model of a double channel HSD in MultiPowerSO-30(1) . . . . . . . . . . . . . . 31
Figure 39. 12x12 Power lead-less package PC board(1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 33
Figure 40. Rthj-amb vs PCB copper area in open box free air condition (one channel ON) . . . . . . . . 33
Figure 41. PQFN - 12x12 power lead-less package thermal impedance junction ambient single pulse
(one channel ON) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 34
Figure 42. Thermal fitting model of a double channel HSD in PQFN - 12x12 power lead-less(1) . . . . 34
Figure 43. MultiPowerSO-30 outline . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 36
Figure 44. PQFN - 12x12 power lead-less outline . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 38
Figure 45. MultiPowerSO-30 tube shipment (no suffix) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 40
Figure 46. MultiPowerSO-30 tape and reel shipment (suffix “TR”) . . . . . . . . . . . . . . . . . . . . . . . . . . . 40
VND5E004A-E / VND5E004ASP30-E List of figures
Doc ID 17359 Rev 1 5/45
Figure 47. PQFN - 12x12 power lead-less tray shipment (no suffix) . . . . . . . . . . . . . . . . . . . . . . . . . . 41
Figure 48. PQFN - 12x12 power lead-less tape and reel shipment (suffix “TR”) . . . . . . . . . . . . . . . . . 42
Block diagram and pin configurations VND5E004A-E / VND5E004ASP30-E
6/45 Doc ID 17359 Rev 1
1 Block diagram and pin configurations
Figure 1. Block diagram
Table 1. Pin functions
Name Function
VCC Battery connection
OUT1,2 Power output
GND Ground connection
IN1,2 Voltage controlled input pin with hysteresis, CMOS compatible, controls
output switch state
CS1,2 Analog current sense pin; delivers a current proportional to the load current
DE Active high diagnostic enable pin
Control & Diagnostic 2
VCC
CH 1
Control & Diagnostic 1
LOGIC
DRIVER
VON
Limitation
Current
Limitation
Power
Clamp
OFF State
Open load
Over
temp.
Undervoltage
VSENSEH
Current
Sense CH 2
OVERLOAD PROTECTION
(ACTIVE POWER LIMITATION)
IN1
IN2
CS1
CS2
CS_
DIS
GND
OUT2
OUT1
Signal Clamp Reverse
Battery
Protection
CE Device
Enable
VND5E004A-E / VND5E004ASP30-E Block diagram and pin configurations
Doc ID 17359 Rev 1 7/45
Figure 2. Configuration diagram (not in scale)
Table 2. Suggested connections for unused and not connected pins
Connection /
pin
Current
sense NC(1)
1. Not connected
Output Input DE For test only
Floating Not allowed X X X X X
To ground Through 1kΩ
resistor XNot
allowed
Through 10kΩ
resistor
Through
10kΩ resistor Not allowed
12
11
10
9
8
7
6
5
4
3
2
1
13
1 NC
2 NC
3 NC
4 GND
5 DE
6 CS 1
7 CS 2
8 IN 1
9 IN 2
10 NC
11 NC
12 NC
13 FOR TEST ONLY
14 VCC
15 OUT 2
16 OUT 1
V
CC
OUT 1
V
CC
OUT 2
OUT 1
OUT 2
OUT 1
OUT 1
OUT 1
OUT 1
NC
OUT 2
OUT 2
OUT 2
OUT 2
1
15 16
30
MultiPowerSO-30
V
CC
GND
V
CC
IN 1
NC
NC
FOR TEST ONLY
NC
NC
DE
CS 1
CS 2
IN 2
NC
FOR TEST ONLY
V
CC
Heat Slug1
(top view)
PQFN -12x12 Power
(bottom view)
lead-less
14
15
16
Electrical specifications VND5E004A-E / VND5E004ASP30-E
8/45 Doc ID 17359 Rev 1
2 Electrical specifications
Figure 3. Current and voltage conventions
2.1 Absolute maximum ratings
Applying stress which exceeds above the ratings listed in Table 3: Absolute maximum
ratings may cause permanent damage to the device. These are stress ratings only and
operation of the device at these or any other conditions above those indicated in the
Operating sections of this specification is not implied. Exposure to the conditions in this
section for extended periods may affect device reliability. Refer also to the
STMicroelectronics SURE Program and other relevant quality documents.
VCC
OUTPUT1,2
CURRENT
SENSE1,2
DE
INPUT1,2
GND
IDE
IIN1,2
VDE
VIN1,2
VSENSE1,2
VOUT1,2
VCC
IS
IOUT1,2
ISENSE1,2
IGND
VCC
OUTPUT1,2
CURRENT
SENSE1,2
DE
INPUT1,2
GND
IDE
IIN1,2
VDE
VIN1,2
VSENSE1,2
VOUT1,2
VCC
IS
IOUT1,2
ISENSE1,2
IGND
Table 3. Absolute maximum ratings
Symbol Parameter Value Unit
VCC DC supply voltage 28 V
VCCPK Transient supply voltage (T < 400 ms, Rload >0.5Ω) 41 V
-VCC Reverse DC supply voltage 16 V
IOUT DC output current Internally limited A
- IOUT Reverse DC output current 70 A
IIN DC input current -1 to 10 mA
IDE DC diagnostic enable input current -1 to 10 mA
VCSENSE Current sense maximum voltage (VCC >0V) VCC-41
+VCC
V
V
EMAX
Maximum switching energy (single pulse)
(L = 0.3 mH; RL=0Ω; Vbat =13.5V; T
jstart = 150 °C;
IOUT =I
limL(Typ.))
600 mJ
VESD
Electrostatic discharge
(Human Body Model: R = 1.5 kΩ; C=100pF) 2000 V
VND5E004A-E / VND5E004ASP30-E Electrical specifications
Doc ID 17359 Rev 1 9/45
2.2 Thermal data
VESD Charge device model (CDM-AEC-Q100-011) 750 V
TjJunction operating temperature -40 to 150 °C
TSTG Storage temperature -55 to 150 °C
Table 3. Absolute maximum ratings (continued)
Symbol Parameter Value Unit
Table 4. Thermal data
Symbol Parameter
Maximum value
Unit
MultiPowerSO-30 12x12 PLLP
Rthj-case
Thermal resistance junction-case (with one
channel ON) 0.35 0.35 °C/W
Rthj-amb Thermal resistance junction-ambient 58(1)
1. PCB FR4 area 58 mm x 58 mm, PCB thickness 2 mm, Cu thickness 35 µm, minimum pad layout
39(2)
2. PCB FR4 area 78 mm x 78 mm, PCB thickness 2 mm, Cu thickness 35 µm, minimum pad layout
°C/W
Electrical specifications VND5E004A-E / VND5E004ASP30-E
10/45 Doc ID 17359 Rev 1
2.3 Electrical characteristics
Values specified in this section are for 8 V < VCC <24V, -40°C <T
j<150°C, unless
otherwise stated.
Table 5. Power section
Symbol Parameter Test conditions Min. Typ. Max. Unit
VCC Operating supply voltage 4.5 13 28 V
VUSD Undervoltage shutdown 3.5 4.5 V
VUSDhyst
Undervoltage shutdown
hysteresis 0.5 V
RON On-state resistance(1)
1. For each channel
IOUT =15A; T
j=25°C 3 mΩ
IOUT =15A; T
j= 150 °C 6 mΩ
IOUT =15A; V
CC =5V; T
j=25°C 6 mΩ
RON REV
RDSon in reverse battery
condition
VCC =-13V; I
OUT =-15A;
Tj=25°C 3mΩ
Vclamp VCC clamp voltage ICC =20mA; I
OUT1,2 =0A 41 46 52 V
ISSupply current
Standby VDE =0V; V
CC =13V;
Tj=25°C; V
IN =0;
VOUT =V
SENSE =0V
25µA
Off-state; VCC =13V;
VDE =5V; T
j=25°C;
VIN =V
OUT =V
SENSE =0V
10 15 µA
On-state; VCC =13V; V
DE =5V;
VIN =5V; I
OUT =0A 3.5 6 mA
IL(off) Off-state output current (1)
VIN =0V or V
DE =0V; V
OUT =0V;
VCC =13V; T
j= 25 °C 0 0.01 3 µA
VIN =0V or V
DE =0V; V
OUT =0V;
VCC =13V; T
j=125°C 05µA
VND5E004A-E / VND5E004ASP30-E Electrical specifications
Doc ID 17359 Rev 1 11/45
Table 6. Switching (VCC =13V; T
j=25°C)
Symbol Parameter Test conditions Min. Typ. Max. Unit
td(on) Turn-on delay time RL= 0.87 Ω (see Ta bl e 6 )— 25 — µs
td(off) Turn-off delay time RL= 0.87 Ω (see Ta b l e 6 )— 35 — µs
(dVOUT/dt)on Turn-on voltage slope RL= 0.87 Ω—See
Figure 26 —V/µs
(dVOUT/dt)off Turn-off voltage slope RL= 0.87 Ω—See
Figure 28 —V/µs
WON
Switching energy
losses during twon
RL= 0.87 Ω (see Ta b l e 6 )— 5.4 —mJ
WOFF
Switching energy
losses during twoff
RL= 0.87 Ω (see Ta b l e 6 )— 2.3 —mJ
Table 7. Logic inputs
Symbol Parameter Test conditions Min. Typ. Max. Unit
VIL1,2 Input low level voltage 0.9 V
IIL1,2 Low level input current VIN =0.9V 1 µA
VIH1,2 Input high level voltage 2.1 V
IIH1,2 High level input current VIN =2.1V 10 µA
VI(hyst)1,2 Input hysteresis voltage 0.25 V
VICL1,2 Input clamp voltage IIN =1mA 5.5 7 V
IIN =-1mA -0.7 V
VDEL DE low level voltage 0.9 V
IDEL DE low level current VIN =0.9V 1 µA
VDEH DE high level voltage 2.1 V
IDEH DE high level current VIN =2.1V 10 µA
VDE(hyst) DE hysteresis voltage 0.25 V
VDECL DE clamp voltage IDE =1mA 5.5 7 V
IDE =-1mA -0.7 V
Electrical specifications VND5E004A-E / VND5E004ASP30-E
12/45 Doc ID 17359 Rev 1
Table 8. Protections and diagnostics (1)
1. To ensure long term reliability under heavy overload or short circuit conditions, protection and related
diagnostic signals must be used together with a proper software strategy. If the device is subjected to
abnormal conditions, this software must limit the duration and number of activation cycles.
Symbol Parameter Test conditions Min. Typ. Max. Unit
IlimH Short circuit current VCC =13V
5V<V
CC <24V 65 90 130
130
A
A
IlimL
Short circuit current
during thermal
cycling
VCC =13V; T
R<T
j<T
TSD 40 A
TTSD
Shutdown
temperature 150 175 200 °C
TRReset temperature TRS+1 TRS+5 °C
TRS
Thermal reset of
STATUS 135 °C
THYST
Thermal hysteresis
(TTSD-TR)7°C
VDEMAG
Turn-off output
voltage clamp IOUT =2A; V
IN =0; L=6mH V
CC-28 VCC-32 VCC-35 V
VON
Output voltage drop
limitation
IOUT =1 A;
Tj= -40 °C to 150 °C
(see Figure 8)
25 mV
Table 9. Current sense (8 V < VCC <18V)
Symbol Parameter Test conditions Min. Typ. Max. Unit
K0IOUT/ISENSE
IOUT =5 A; V
SENSE =4V; V
DE = 5 V;
Tj= -40 °C...150 °C
Tj= 25 °C...150 °C
11420
12130
17580
17580
23740
23030
—
K1IOUT/ISENSE
IOUT =10A; V
SENSE =4V; V
DE =
5V;
Tj= -40 °C...150 °C
Tj= 25 °C...150 °C
11830
12680
16910
16910
21990
21140
—
dK1/K1(1) Current sense ratio
drift
IOUT =10 A; VSENSE =4V;
VDE = 5 V;
Tj= -40 °C to 150 °C
-14 +14 %
K2IOUT/ISENSE
IOUT =15A; V
SENSE =4V; V
DE= 5 V;
Tj= -40 °C...150 °C
Tj= 25 °C...150 °C
11760
13040
16110
16110
20460
19180
—
dK2/K2(1) Current sense ratio
drift
IOUT =15 A; V
SENSE =4V; V
DE =
5V;
Tj= -40 °C to 150 °C
-10 +10 %
VND5E004A-E / VND5E004ASP30-E Electrical specifications
Doc ID 17359 Rev 1 13/45
K3IOUT/ISENSE
IOUT =30A; V
SENSE =4V; V
DE =
5V;
Tj= -40 °C...150 °C
Tj= 25 °C...150 °C
13040
13810
15520
15520
18000
17230
—
dK3/K3(1) Current sense ratio
drift
IOUT =30 A; V
SENSE =4V; V
DE =
5V;
Tj= -40 °C to 150 °C
-5 +5 %
ISENSE0
Analog sense
leakage current
IOUT =0A; V
SENSE =0V;
VDE = 0 V; VIN =0V;
Tj= -40 °C...150 °C
01µA
IOUT =0A; V
SENSE =0V;
VDE = 5 V; VIN =5V;
Tj= -40 °C...150 °C
02µA
IOUT =15 A; V
SENSE =0V;
VDE =0V; V
IN =5V; 01µA
IOL
Open-load on-
state current
detection threshold
VIN = 5V; 8V<V
CC <18V
ISENSE = 5 µA 10 150 mA
VSENSE
Max analog sense
output voltage
IOUT =45A; V
CSD =0V;
RSENSE =3.9kΩ 5V
VSENSEH
Analog sense
output voltage in
fault condition(2)
VCC =13 V; RSENSE =3.9kΩ8V
ISENSEH
Analog sense
output current in
fault condition(2)
VCC =13 V; VSENSE =5V 9 mA
tDSENSE1H
Delay response
time from rising
edge of DE pin
VSENSE <4V, 5A<I
out <30A
ISENSE =90% of I
SENSE max
(see Figure 4)
50 100 µs
tDSENSE1L
Delay response
time from falling
edge of DE pin
VSENSE <4V, 5A<I
out <30A
ISENSE =10% of I
SENSE max
(see Figure 4)
520µs
tDSENSE2H
Delay response
time from rising
edge of INPUT pin
VSENSE <4V, 5A<I
out <30A
ISENSE =90% of I
SENSE max
VDE = 5 V (see Figure 4)
200 600 µs
tDSENSE2L
Delay response
time from falling
edge of INPUT pin
VSENSE <4V, 5A<I
out <30A
ISENSE =10% of I
SENSE max
VDE = 5 V (see Figure 4)
100 250 µs
1. Parameter guaranteed by design; it is not tested.
2. Fault condition includes: power limitation, overtemperature and open-load off-state detection.
Table 9. Current sense (8 V < VCC < 18 V) (continued)
Symbol Parameter Test conditions Min. Typ. Max. Unit
Electrical specifications VND5E004A-E / VND5E004ASP30-E
14/45 Doc ID 17359 Rev 1
Figure 4. Current sense delay characteristics
Figure 5. Open-load off-state delay timing
Table 10. Open-load detection (8V<VCC<18V, VDE= 5V)
Symbol Parameter Test conditions Min. Typ. Max. Unit
VOL
Open-load off-state voltage
detection threshold
VIN = 0 V, VDE = 5 V;
See Figure 5 2—4V
tDSTKON
Output short circuit to VCC
detection delay at turn off VDE = 5 V; See Figure 5 180 — 1200 µs
IL(off2)r
Off-state output current at
VOUT = 4 V
VIN =0V; V
SENSE =0V;
VDE = 5 V;
VOUT rising from 0 V to 4 V
-120 — 90 µA
IL(off2)f
Off-state output current at
VOUT = 2 V
VIN =0V; V
SENSE =V
SENSEH
VDE = 5 V;
VOUT falling from VCC to 2 V
-50 — 90 µA
td_vol
Delay response from output
rising edge to VSENSE rising
edge in open-load
VOUT = 4 V; VIN = 0 V;
VDE = 5 V;
VSENSE = 90% of V
SENSEH
—20µs
td_voh
Delay response from output
falling edge to VSENSE falling
edge in open-load
VOUT = 2 V; VIN = 0V;
VDE = 5 V;
VSENSE = 10% of V
SENSEH
—20µs
SENSE CURRENT
INPUT
LOAD CURRENT
DE
tDSENSE2H tDSENSE2L
tDSENSE1L tDSENSE1H
VIN
VCS
tDSTKON
OUTPUT STUCK AT VCC
VOUT > VOL
VSENSEH
VND5E004A-E / VND5E004ASP30-E Electrical specifications
Doc ID 17359 Rev 1 15/45
Figure 6. Switching characteristics
Figure 7. Delay response time between rising edge of output current and rising
edge of current sense (CS enabled)
V
OUT
dV
OUT
/dt
(on)
t
r
80%
10% t
f
dV
OUT
/dt
(off)
t
d(off)
t
d(on)
INPUT
t
t
90%
t
Won
t
Woff
V
IN
I
OUT
I
SENSE
I
OUTMAX
I
SENSEMAX
90% I
SENSEMAX
90% I
OUTMAX
Δ
t
DSENSE2H
t
t
t
Electrical specifications VND5E004A-E / VND5E004ASP30-E
16/45 Doc ID 17359 Rev 1
Figure 8. Output voltage drop limitation
Figure 9. IOUT/ISENSE vs IOUT
V
on
I
OUT
V
CC
-V
OUT
T
j
= 150 °C T
j
=25°C
T
j
=-40°C
V
on
/R
on(T)
IOUT/ISENSE
10500
12500
14500
16500
18500
20500
22500
24500
2 6 10 14 18 22 26 30
IOUT (A)
A
B
C
D
E
Legend:
A: Max, Tj = -40 °C to 150 °C
B: Max, Tj = 25 °C to 150 °C
C: Typical, Tj = -40°C to 150°C
D: Min, Tj = 25 °C to 150 °C
E: Min, Tj = -40 °C to 150 °C
VND5E004A-E / VND5E004ASP30-E Electrical specifications
Doc ID 17359 Rev 1 17/45
Figure 10. Maximum current sense ratio drift vs load current(1)
1. Parameter guaranteed by design; it is not tested.
Table 11. Truth table
Conditions Enable Input Output Sense
(VDE=5V)(1)
1. If the VDE is low, the SENSE output is at a high impedance; its potential depends on leakage currents and
external circuit.
Normal operation H
H
L
H
L
H
0
Nominal
Overtemperature H
H
L
H
L
L
0
VSENSEH
Undervoltage H
H
L
H
L
L
0
0
Overload H
H
H
H
X (no power limitation)
Cycling (power limitation)
Nominal
VSENSEH
Short circuit to GND
(Power limitation)
H
H
L
H
L
L
0
VSENSEH
Open-load off-state
(with external pull up) HL H V
SENSEH
Short circuit to VCC
(external pull up
disconnected)
H
H
L
H
H
H
VSENSEH
< Nominal
Negative output voltage
clamp HL L 0
dK/K (%)
-20
-15
-10
-5
0
5
10
15
20
5 101520253035
IOUT (A)
A
B
Legend:
A: Max, Tj = -40 °C to 150 °C
B: Max, Tj = 25 °C to 150 °C
Electrical specifications VND5E004A-E / VND5E004ASP30-E
18/45 Doc ID 17359 Rev 1
Table 12. Electrical transient requirements (part 1/3)
ISO 7637-2:
2004(E)
Test pulse
Test levels(1) Number of
pulses or
test times
Burst cycle/pulse
repetition time
Delays and
impedance
III IV
1 -75 V -100 V 5000
pulses 0.5 s 5 s 2 ms, 10 Ω
2a +37 V +50 V 5000
pulses 0.2 s 5 s 50 µs, 2 Ω
3a -100 V -150 V 1h 90 ms 100 ms 0.1 µs, 50 Ω
3b +75 V +100 V 1h 90 ms 100 ms 0.1 µs, 50 Ω
4 -6 V -7 V 1 pulse 100 ms, 0.01 Ω
5b(2) +65 V +87 V 1 pulse 400 ms, 2 Ω
Table 13. Electrical transient requirements (part 2/3)
ISO 7637-2:
2004(E)
Test pulse
Test level results(1)
1. The above test levels must be considered referred to VCC = 13.5V except for pulse 5b
III IV
1C C
2a C C
3a C C
3b C C
4C C
5b(2) (3)
2. Valid in case of external load dump clamp: 40V maximum referred to ground.
3. Suppressed load dump (pulse 5b) is withstood with a minimum load connected as specified in Table 3.
CC
Table 14. Electrical transient requirements (part 3/3)
Class Contents
C All functions of the device are performed as designed after exposure to disturbance.
EOne or more functions of the device are not performed as designed after exposure to
disturbance and cannot be returned to proper operation without replacing the device.
VND5E004A-E / VND5E004ASP30-E Electrical specifications
Doc ID 17359 Rev 1 19/45
2.4 Waveforms
Figure 11. Normal operation
Figure 12. Overload or short to GND
IOUT
VSENSE
VDE
INPUT
Nominal load Nominal load
IOUT
VSENSE
VDE
INPUT
Nominal load Nominal load
Power Limitation
ILimH >
ILimL >
IOUT
VSENSE
VDE
INPUT
Thermal cycling
Power Limitation
ILimH >
ILimL >
IOUT
VSENSE
VDE
INPUT
Thermal cycling
Electrical specifications VND5E004A-E / VND5E004ASP30-E
20/45 Doc ID 17359 Rev 1
Figure 13. Intermittent overload
Figure 14. Off-state open-load with external circuitry
IOUT
VSENSE
VDE
INPUT
ILimH >Nominal load
ILimL >
Overload
VSENSEH >
IOUT
VSENSE
VDE
INPUT
ILimH >Nominal load
ILimL >
Overload
VSENSEH >
INPUT
VOL
IOUT
VSENSE
VDE
VOUT
VOUT > VOL
tDSTK (on)
VSENSEH >
INPUT
VOL
IOUT
VSENSE
VDE
VOUT
VOUT > VOL
tDSTK (on)
VSENSEH >
VND5E004A-E / VND5E004ASP30-E Electrical specifications
Doc ID 17359 Rev 1 21/45
Figure 15. Short to VCC
Figure 16. TJ evolution in overload or short to GND
tDSTK (on)
VOUT > VOL
Resistive
Short to V
CC
Hard
Short to V
CC
IOUT
VDE
VOUT
VOL
tDSTK (on)
INPUT
tDSTK (on)
VOUT > VOL
Resistive
Short to V
CC
Hard
Short to V
CC
IOUT
VDE
VOUT
VOL
tDSTK (on)
INPUT
TTSD
TR
ILimH >
< ILimL
TJ_START
THYST
Power Limitation
Self-limitation of fast thermal transients
INPUT
IOUT
TJ
TTSD
TR
ILimH >
< ILimL
TJ_START
THYST
Power Limitation
Self-limitation of fast thermal transients
INPUT
IOUT
TJ
Electrical specifications VND5E004A-E / VND5E004ASP30-E
22/45 Doc ID 17359 Rev 1
2.5 Electrical characteristics curves
Figure 17. Off-state output current Figure 18. High level input current
Figure 19. Input clamp voltage Figure 20. Input low level voltage
Figure 21. Input high level voltage Figure 22. Input hysteresis voltage
Iloff [nA]
0
1000
2000
3000
4000
5000
6000
7000
-50 -25 0 25 50 75 100 125 150 175
Tc [°C]
Iih [uA]
0
0.5
1
1.5
2
2.5
3
3.5
4
4.5
5
-50 -25 0 25 50 75 100 125 150 175
Tc [°C]
Vin= 2.1V
Vicl [V]
5
5.2
5.4
5.6
5.8
6
6.2
6.4
6.6
6.8
7
-50 -25 0 25 50 75 100 125 150 175
Tc [°C]
Iin= 1m A
Vil [V]
0
0.2
0.4
0.6
0.8
1
1.2
1.4
1.6
1.8
2
-50 -25 0 25 50 75 100 125 150 175
Tc [°C]
Vih [V]
0
0.5
1
1.5
2
2.5
3
3.5
4
-50 -25 0 25 50 75 100 125 150 175
Tc [°C]
Vihyst [V]
0
0.1
0.2
0.3
0.4
0.5
0.6
0.7
0.8
0.9
1
-50 -25 0 25 50 75 100 125 150 175
Tc [°C]
VND5E004A-E / VND5E004ASP30-E Electrical specifications
Doc ID 17359 Rev 1 23/45
Figure 23. On-state resistance vs Tcase Figure 24. On-state resistance vs VCC
Figure 25. Undervoltage shutdown Figure 26. Turn-on voltage slope
Figure 27. ILIMH vs Tcase Figure 28. Turn-off voltage slope
Ron [ m Oh m ]
0
5
10
15
20
25
30
35
40
45
50
-50 -25 0 25 50 75 100 125 150 175
Tc [°C]
Iout= 15A
Vcc= 13V
Ron [m Ohm ]
0
2
4
6
8
0 5 10 15 20 25 30 35 40
Vcc [V]
Tc= -40°C
Tc= 25°C
Tc= 125°C
Tc= 150°C
Vusd [V]
0
2
4
6
8
10
12
14
16
-50 -25 0 25 50 75 100 125 150 175
Tc [°C]
(dVout/dt)On [V/ms]
0
100
200
300
400
500
600
700
800
900
1000
-50 -25 0 25 50 75 100 125 150 175
Tc [°C]
Vcc= 13V
Rl= 0.87Ω
Ilim h [A]
40
50
60
70
80
90
100
-50 -25 0 25 50 75 100 125 150 175
Tc [°C]
V
cc= 13V
(dVout/dt)Off [V/ms]
0
100
200
300
400
500
600
700
800
900
1000
-50 -25 0 25 50 75 100 125 150 175
Tc [°C]
Vcc= 13V
Rl= 0.87Ω
Electrical specifications VND5E004A-E / VND5E004ASP30-E
24/45 Doc ID 17359 Rev 1
Figure 29. DE high level voltage Figure 30. DE clamp voltage
Figure 31. DE low level voltage
Vdeh [V]
0
0.5
1
1.5
2
2.5
3
3.5
4
-50 -25 0 25 50 75 100 125 150 175
Tc [°C]
Vdecl [V]
0
1
2
3
4
5
6
7
8
9
10
-50 -25 0 25 50 75 100 125 150 175
Tc [°C]
Iin= 1m A
Vdel [V]
0
0.5
1
1.5
2
2.5
3
3.5
4
-50 -25 0 25 50 75 100 125 150 175
Tc [°C]
VND5E004A-E / VND5E004ASP30-E Application information
Doc ID 17359 Rev 1 25/45
3 Application information
Figure 32. Application schematic
3.1 MCU I/Os protection
When negative transients are present on the VCC line, the control pins are pulled negative to
approximately -1.5V.
ST suggests the insertion of resistors (Rprot) in the lines to prevent the microcontroller I/O
pins from latching up.
The values of these resistors provide a compromise between the leakage current of the
microcontroller, the current required by the HSD I/Os (input levels compatibility) and the
latch-up limit of the microcontroller I/Os.
-VCCpeak/Ilatchup ≤ Rprot ≤ (VOHµC-VIH) / IIHmax
Calculation example:
For VCCpeak= - 1.5V and Ilatchup ≥ 20mA; VOHµC ≥ 4.5V
75Ω ≤ Rprot ≤ 240kΩ.
Recommended values: Rprot =10kΩ, CEXT=10nF
3.2 Load dump protection
Dld is necessary (Voltage Transient Suppressor) if the load dump peak voltage exceeds the
VCCPK maximum rating. The same applies if the device is subject to transients on the VCC
line that are greater than the ones shown in the ISO 7637-2: 2004(E) table.
VCC
GND
OUTPUT
Dld
ΜCU
+5V
DE
IINPUT
Rprot
Rprot
CURRENT SENSE
Rprot
RSENSE
Cext
Application information VND5E004A-E / VND5E004ASP30-E
26/45 Doc ID 17359 Rev 1
3.3 Current sense and diagnostic
The current sense pin performs a double function (see Figure 33: Current sense and
diagnostics):
●Current mirror of the load current in normal operation, delivering a current
proportional to the load current according to a known ratio KX.
The current ISENSE can be easily converted to a voltage VSENSE by means of an
external resistor RSENSE. Linearity between IOUT and VSENSE is ensured up to 5V
minimum (see parameter VSENSE in Table 9: Current sense (8 V < VCC <18V)). The
current sense accuracy depends on the output current (refer to current sense electrical
characteristics Table 9: Current sense (8 V < VCC <18V)).
●Diagnostic flag in fault conditions, delivering a fixed voltage VSENSEH up to a
maximum current ISENSEH in case of the following fault conditions (refer to
Table 11: Truth table):
– Power limitation activation
–Overtemperature
–Short to V
CC in off-state
– Open-load in off-state with additional external components.
A logic level low on the DE pin simultaneously sets all the current sense pins of the device in
a high impedance state, thus disabling the current monitoring and diagnostic detection. This
feature allows multiplexing of the microcontroller analog inputs by sharing the sense
resistance and ADC line among different devices.
VND5E004A-E / VND5E004ASP30-E Application information
Doc ID 17359 Rev 1 27/45
Figure 33. Current sense and diagnostics
3.3.1 Short to VCC and off-state open-load detection
Short to VCC
A short circuit between VCC and output is indicated by the relevant current sense pin set to
VSENSEH during the device off-state. Little or no current is delivered by the current sense
during the on-state depending on the nature of the short circuit.
Off-state open-load with external circuitry
Detection of an open-load in off mode requires an external pull-up resistor (RPU) connecting
the output to a positive supply voltage (VPU).
It is preferable that VPU be switched off during the module standby mode to avoid an
increase in the overall standby current consumption in normal conditions, that is, when the
load is connected.
An external pull down resistor (RPD) connected between output and GND is mandatory to
avoid misdetection in case of floating outputs in off-state (see Figure 33: Current sense and
diagnostics).
RPD must be selected in order to ensure VOUT < VOLmin unless pulled up by the external
circuitry:
Main MOSn
41V
OUTn
ILoff2r
RSENSE
RPROT
To uC ADC
RPD
RPU
VPU
Pwr_Lim
VSENSE
PU_CMD
Overtemperature
OL OFF
+
-
VOL
CURRENT
SENSEn
IOUT/KX
ISENSEH
VBAT
ILoff2f
VSENSEH
Load
INPUTn
VCC
GND
DE
VVIRV OLfoffLPD
OFFupPull
OUT 2
min)2(
_=<⋅=
−
Application information VND5E004A-E / VND5E004ASP30-E
28/45 Doc ID 17359 Rev 1
RPD ≤ 22 KΩ is recommended.
For proper open-load detection in off-state, the external pull-up resistor must be selected
according to the following formula:
For the values of VOLmin,VOLmax, IL(off2)r and IL(off2)f see Table 10: Open-load detection
(8V<VCC<18V, VDE= 5V).
VV
RR
IRRVR
VOL
PDPU
roffLPDPUPUPD
ONupPull
OUT 4
max
)2(
_=>
+
⋅⋅−⋅
=
−
VND5E004A-E / VND5E004ASP30-E Application information
Doc ID 17359 Rev 1 29/45
3.4 Maximum demagnetization energy (VCC = 13.5V)
Figure 34. Maximum turn-off current versus inductance (1)
1. Values are generated with RL = 0 Ω.
In case of repetitive pulses, Tjstart (at beginning of each demagnetization) of every pulse must not exceed
the temperature specified above for curves A and B.
1
10
100
1 10 100L (mH)
I (A)
Demagnetization Demagnetization Demagnetization
t
VIN, IL
C: Tjstart = 125 °C repetitive pulse
A: Tjstart = 150 °C single pulse
B: Tjstart = 100 °C repetitive pulse
A
B
C
Package and PC board thermal data VND5E004A-E / VND5E004ASP30-E
30/45 Doc ID 17359 Rev 1
4 Package and PC board thermal data
4.1 MultiPowerSO-30 thermal data
Figure 35. MultiPowerSO-30 PC board(1)
1. Layout condition of Rth and Zth measurements (PCB: double layer, thermal vias, FR4
area = 58 mm x 58 mm, PCB thickness = 2 mm, Cu thickness = 70 µm (front and back side), copper
areas: from minimum pad lay-out to 16 cm2).
Figure 36.
R
thj-amb
vs PCB copper area in open box free air condition (one channel ON)
35
40
45
50
55
60
012345
RTHj_amb(°C/W)
PCB Cu heatsink area (cm^2)
VND5E004A-E / VND5E004ASP30-E Package and PC board thermal data
Doc ID 17359 Rev 1 31/45
Figure 37. MultiPowerSO-30 thermal impedance junction ambient single pulse (one
channel ON)
Figure 38. Thermal fitting model of a double channel HSD in MultiPowerSO-30(1)
1. The fitting model is a simplified thermal tool and is valid for transient evolutions where the embedded
protection functions (power limitation or thermal cycling during thermal shutdown) are not triggered.
0.01
0.1
1
10
100
1000
0.0001 0.001 0.01 0.1 1 10 100 1000
Time (s)
ZT H (°C/W)
Footprint
4 cm
2
Package and PC board thermal data VND5E004A-E / VND5E004ASP30-E
32/45 Doc ID 17359 Rev 1
Equation 1: Pulse calculation formula
Table 15. Thermal parameters for MultiPowerSO-30
Area/island (cm2)Footprint4
R1 (°C/W) 0.05
R2 (°C/W) 0.3
R3 (°C/W) 0.5
R4 (°C/W) 1.3
R5 (°C/W) 14
R6 (°C/W) 44.7 23.7
R7 (°C/W) 0.05
R8 (°C/W) 0.3
C1 (W.s/°C) 0.005
C2 (W.s/°C) 0.008
C3 (W.s/°C) 0.01
C4 (W.s/°C) 0.3
C5 (W.s/°C) 0.6
C6 (W.s/°C) 5 11
C7 (W.s/°C) 0.005
C8 (W.s/°C) 0.008
ZTHδRTH δZTHtp 1δ–()+⋅=
where δtpT⁄=
VND5E004A-E / VND5E004ASP30-E Package and PC board thermal data
Doc ID 17359 Rev 1 33/45
4.2 PQFN - 12x12 power lead-less thermal data
Figure 39. 12x12 Power lead-less package PC board(1)
1. Layout condition of Rth and Zth measurements (PCB: double layer, thermal vias, FR4
area = 77 mm x 86 mm, PCB thickness = 1.6 mm, Cu thickness = 70 µm (front and back side), copper
areas: minimum pad lay-out).
Figure 40. Rthj-amb vs PCB copper area in open box free air condition (one channel
ON)
20
25
30
35
40
45
50
0 5 10 15 20
PCB Cu heatsink area (cm^ 2)
Package and PC board thermal data VND5E004A-E / VND5E004ASP30-E
34/45 Doc ID 17359 Rev 1
Figure 41. PQFN - 12x12 power lead-less package thermal impedance junction
ambient single pulse (one channel ON)
Figure 42.
Thermal fitting model of a double channel HSD in PQFN - 12x12 power lead-less
(1)
1. The fitting model is a simplified thermal tool and is valid for transient evolutions where the embedded
protection functions (power limitation or thermal cycling during thermal shutdown) are not triggered.
0,1
1
10
100
0,001 0,01 0,1 1 10 100 1000time (s)
°C/W
Footprint
4 cm
2
8 cm
2
16 cm
2
VND5E004A-E / VND5E004ASP30-E Package and PC board thermal data
Doc ID 17359 Rev 1 35/45
Equation 2: pulse calculation formula
Table 16. Thermal parameters for PQFN - 12x12 power lead-less
Area/island (cm2)Footprint 4 8 16
R1 (°C/W) 0.35
R2 (°C/W) 0.15
R3 (°C/W) 4.2
R4 (°C/W) 9.6 9.4 9.2 9
R5 (°C/W) 15.1 10.5 8.5 5.5
R6 (°C/W) 16.7 12 9 6
R7 (°C/W) 0.35
R8 (°C/W) 0.15
C1 (W.s/°C) 0.018
C2 (W.s/°C) 0.015
C3 (W.s/°C) 0.2
C4 (W.s/°C) 1.9 2.2 2.32 2.45
C5 (W.s/°C) 2.45 7.3 13.7 20
C6 (W.s/°C) 11.85 22 25 30
C7 (W.s/°C) 0.018
C8 (W.s/°C) 0.015
ZTHδRTH δZTHtp 1δ–()+⋅=
where δtpT⁄=
Package and packing information VND5E004A-E / VND5E004ASP30-E
36/45 Doc ID 17359 Rev 1
5 Package and packing information
5.1 ECOPACK® packages
In order to meet environmental requirements, ST offers these devices in different grades of
ECOPACK® packages, depending on their level of environmental compliance. ECOPACK®
specifications, grade definitions and product status are available at: www.st.com.
ECOPACK® is an ST trademark.
5.2 MultiPowerSO-30 mechanical data
Figure 43. MultiPowerSO-30 outline
VND5E004A-E / VND5E004ASP30-E Package and packing information
Doc ID 17359 Rev 1 37/45
Table 17. MultiPowerSO-30 mechanical data
Symbol
Millimeters
Min. Typ. Max.
A2.35
A2 1.85 2.25
A3 0 0.1
B 0.42 0.58
C 0.23 0.32
D 17.1 17.2 17.3
E 18.85 19.15
E1 15.9 16 16.1
“e” 1
F6 14.3
F7 5.45
F8 0.73
L 0.8 1.15
N10 Deg
S 0 Deg 7 Deg
Package and packing information VND5E004A-E / VND5E004ASP30-E
38/45 Doc ID 17359 Rev 1
5.3 PQFN - 12x12 power lead-less mechanical data
Figure 44. PQFN - 12x12 power lead-less outline
VND5E004A-E / VND5E004ASP30-E Package and packing information
Doc ID 17359 Rev 1 39/45
Table 18. PQFN - 12x12 power lead-less mechanical data
Symbol
Millimeters
Min. Typ. Max.
A2 2.2
A1 0 0.05
b 0.35 0.47
C0.50
D 11.90 12.10
Dh1 4.65 4.95
Dh2 10.45 10.65
Dh3 4.80 5
Dh4 4.80 5
E 11.90 12.10
Eh1 2.15 2.45
Eh2 5.15 5.45
Eh3 1.70 2
e1 0.90
e2 3.45
e3 1.10
f0.50
f1 0.60
L 0.75 0.95
L1 1.65 1.90
L2 0.76 0.78
M 11.10 11.30
N 11.10 11.30
v0.1
w0.05
y0.05
y1 0.1
Package and packing information VND5E004A-E / VND5E004ASP30-E
40/45 Doc ID 17359 Rev 1
5.4 MultiPowerSO-30 packing information
The devices can be packed in tube or tape and reel shipments (see Table 19: Device
summary).
Figure 45. MultiPowerSO-30 tube shipment (no suffix)
Figure 46. MultiPowerSO-30 tape and reel shipment (suffix “TR”)
A
B
C
Tube dimension
Dimension mm
Base Q.ty 29
Bulk Q.ty 435
Tube length (± 0.5) 532
A3.82
B23.6
C (± 0.13) 0.8
Reel dimension
Dimension mm
Base Q.ty 1000
Bulk Q.ty 1000
A (max) 330
B (min) 1.5
C (± 0.2) 13
D (min) 20.2
G (+ 2 / -0) 32
N (min) 100
T (max) 38.4
Top
cover
tape
Start
No componentsNo components Components
500 mm min
500 mm min
Empty components pockets
User direction of feed
Tape dimensions
According to Electronic Industries Association
(EIA) Standard 481 rev. A, Feb 1986
Description Dimension mm
Tape width W 32
Tape Hole Spacing P0 (± 0.1) 4
Component Spacing P 24
Hole Diameter D (± 0.1/-0) 1.5
Hole Diameter D1 (min) 2
Hole Position F (± 0.1) 14.2
Compartment Depth K (max) 2.2
End
VND5E004A-E / VND5E004ASP30-E Package and packing information
Doc ID 17359 Rev 1 41/45
5.5 PQFN - 12x12 power lead-less packing information
The devices can be packed in tray or tape and reel shipments (see Table 19: Device
summary).
Figure 47. PQFN - 12x12 power lead-less tray shipment (no suffix)
Tray information
Parameter
Base Q.ty 189
Bulk Q.ty 945
Package and packing information VND5E004A-E / VND5E004ASP30-E
42/45 Doc ID 17359 Rev 1
Figure 48. PQFN - 12x12 power lead-less tape and reel shipment (suffix “TR”)
Tape dimensions
Dimension mm
A0 ± 0.1 12.30
B0 ± 0.1 12.30
K0 ± 0.1 2.15
F ± 0.1 11.50
E ± 0.1 1.75
W ± 0.3 24
P2 ± 0.1 2
P0 ± 0.1 4
P1 ± 0.1 16
T ± 0.05 0.30
D1.50
D1 (min) 1.50
Reel dimensions
Dimension mm
Base Q.ty 1500
Bulk Q.ty 1500
A (max) 330
B (min) 1.5
C (± 0.2) 13
D (min) 20.2
G (+ 2 / -0) 32
N (min) 100
T (max) 38.4
VND5E004A-E / VND5E004ASP30-E Order codes
Doc ID 17359 Rev 1 43/45
6 Order codes
Table 19. Device summary
Package
Order codes
Tube Tape and reel Tray
PQFN-12x12 power lead-less — VND5E004ATR-E VND5E004A-E
MultiPowerSO-30 VND5E004A30-E VND5E004A30TR-E —
Revision history VND5E004A-E / VND5E004ASP30-E
44/45 Doc ID 17359 Rev 1
7 Revision history
Table 20. Document revision history
Date Revision Changes
20-Jul-2010 1 Initial release.
VND5E004A-E / VND5E004ASP30-E
Doc ID 17359 Rev 1 45/45
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