D3V3F4U10LP 4 CHANNEL LOW CAPACITANCE TVS DIODE ARRAY ADVANCED INFORMATION Product Summary Features VBR (MIN) IPP (MAX) CT (TYP) Clamping Voltage: 5V at 16A IEC6100-4-2 5.5V 5 0.5pF IEC61000-4-2 (ESD): Air -- 12kV, Contact -- 12kV IEC61000-4-5 (Lightning): 5A (8/20s) 4 Channels of ESD Protection Ultra-Low Channel Input Capacitance of 0.5pF Typical TLP Dynamic Resistance: 0.25 Totally Lead-Free & Fully RoHS Compliant (Notes 1 & 2) Halogen and Antimony Free. "Green" Device (Note 3) Description The D3V3F4U10LP is a high-performance device suitable for protecting four high speed I/Os. These devices are assembled in UDFN2510-10 packages and have high ESD surge capability, low ESD clamping voltage and Ultra-low capacitance. Mechanical Data Applications Typically used at high-speed ports such as USB 3.0, USB 3.1, Serial ATA, Display port. Case: U-DFN2510-10 Case Material: Molded Plastic, Green Molding Compound. UL Flammability Classification Rating 94V-0 Moisture Sensitivity: Level 1 per J-STD-020 Terminals: NiPdAu over Copper Leadframe (Lead Free Plating). Solderable per MIL-STD-202, Method 208 e4 Weight: 0.038 grams (Approximate) U-DFN2510-10 Pin1 Pin # 1, 2, 4, 5 6, 7, 9, 10 3, 8 Description I/O No Connection Vss 10 9 8 7 6 1 2 3 4 5 Pin2 Pin5 Pin4 3,8 Pin Description (Top View) Device Schematic Ordering Information (Note 4) Product D3V3F4U10LP-7 Notes: Compliance Standard Marking QD6 Reel Size (inches) 7 Tape Width (mm) 8 Quantity per Reel 3,000/Tape & Reel 1. No purposely added lead. Fully EU Directive 2002/95/EC (RoHS) & 2011/65/EU (RoHS 2) compliant. 2. See http://www.diodes.com/quality/lead_free.html for more information about Diodes Incorporated's definitions of Halogen- and Antimony-free, "Green" and Lead-free. 3. Halogen- and Antimony-free "Green products are defined as those which contain <900ppm bromine, <900ppm chlorine (<1500ppm total Br + Cl) and <1000ppm antimony compounds. 4. For packaging details, go to our website at http://www.diodes.com/products/packages.html. Marking Information U-DFN2510-10 QD6 = Product Type Marking Code YM = Date Code Marking Y = Year (ex: E = 2017) M = Month (ex: 9 = September) TF2 QD6 YM Date Code Key Year Code Month Code 2015 C Jan 1 2016 D Feb 2 D3V3F4U10LP Document number: DS38563 Rev. 1 - 2 Mar 3 2017 E Apr 4 May 5 2018 F Jun 6 1 of 5 www.diodes.com Jul 7 2019 G Aug 8 Sep 9 2020 H Oct O Nov N Dec D March 2017 (c) Diodes Incorporated D3V3F4U10LP Maximum Ratings (@TA = +25C, unless otherwise specified.) Characteristic Peak Pulse Current, per IEC61000-4-5 Peak Pulse Power, per IEC61000-4-5 ESD Protection - Contact Discharge, per IEC61000-4-2 ADVANCED INFORMATION ESD Protection - Air Discharge, per IEC61000-4-2 Symbol Value Unit IPP A W I/O to VSS, 8/20s PPP 5 30 Condition VESD_CONTACT 12 kV I/O to VSS VESD_AIR 12 kV I/O to VSS I/O to VSS, 8/20s Thermal Characteristics Characteristic Symbol Value Power Dissipation Typical (Note 5) PD 350 mW RJA 360 C/W TJ,TSTG -55 to +150 C Thermal Resistance, Junction to Ambient Typical (Note 5) Operating and Storage Temperature Range Electrical Characteristics Characteristic Reverse Working Voltage Reverse Current Reverse Breakdown Voltage Forward Clamping Voltage Holding Reverse Voltage Reverse Clamping Voltage (Note 6) Clamping Voltage (Note 7) Clamping Voltage (Note 7) Dynamic Reverse Resistance Dynamic Forward Resistance Channel Input Capacitance Notes: Unit (@TA = +25C, unless otherwise specified.) Symbol VRWM IR VBR VF VHOLD VC VC VC RDIF-R RDIF-F CI/O Min -- -- 5.5 -1.0 -- -- -- -- -- -- -- Typ -- -- 6.2 -0.85 1.3 3.5 5 5 Max 3.3 1.0 -- -- -- -- -- -- Unit V A V V V V V V 0.25 0.2 0.5 55 -- -- -- pF Test Condition -- VR = 3.3V, I/O to VSS IR = 1mA, I/O to VSS IF = -15mA, I/O to VSS I/O to VSS IPP = 5A, I/O to VSS, 8/20s TLP, 16A, tP = 100ns, I/O to VSS TLP, -16A, tP = 100ns, I/O to VSS TLP, 10A, tP = 100ns, I/O to VSS TLP, 10A, tP = 100ns, VSS to I/O VI/O = 0V, VSS = 0V, f = 1MHz 5. Device mounted on FR-4 PCB pad layout (2oz copper) as shown on Diodes Incorporated's suggested pad layout, which can be found on our website at http://www.diodes.com/package-outlines.html. 6. Clamping voltage value is based on an 8x20s peak pulse current (IPP) waveform. 7. Clamping voltage value is based on a TLP model. TLP conditions: ZO=50, tP = 100ns, tP = 1ns, averageing window; t1=70ns to t2=90ns. D3V3F4U10LP Document number: DS38563 Rev. 1 - 2 2 of 5 www.diodes.com March 2017 (c) Diodes Incorporated D3V3F4U10LP 0.8 CI/O,INPUT CAPACITANCE (pF) PEAK PULSE DERATING IN % OF PEAK POWER OR CURRENT 75 50 25 I/O to VSS, f=1MHz 0.6 0.4 0.2 0.0 0 0 25 50 75 100 125 150 175 200 0.0 0.5 1.0 1.5 2.0 2.5 3.0 VI/O, INPUT VOLTAGE (V) Figure 2. Input Capacitance vs. Input Voltage TA, AMBIENT TEMPERATURE (C) Figure 1. Pulse Derating Curve 20 CURRENT FROM I/O TO VSS (A) ADVANCED INFORMATION 100 18 16 14 12 10 8 6 4 2 0 0 1 2 3 4 5 6 7 8 9 10 VOLTAGE FROM I/O TO VSS (V) Figure 3. Current vs. Voltage D3V3F4U10LP Document number: DS38563 Rev. 1 - 2 3 of 5 www.diodes.com March 2017 (c) Diodes Incorporated D3V3F4U10LP Package Outline Dimensions Please see http://www.diodes.com/package-outlines.html for the latest version. A3 A1 A Seating Plane D b1 R0.075 E L Z R 0 .1 e 25 ADVANCED INFORMATION U-DFN2510-10 U-DFN2510-10 Dim Min Max Typ A 0.545 0.605 0.575 A1 0.00 0.05 0.03 A3 0.13 b 0.15 0.25 0.20 b1 035 0.45 0.40 D 2.450 2.575 2.500 e 0.50 E 0.950 1.075 1.000 L 0.325 0.425 0.375 Z 0.150 All Dimensions in mm b Suggested Pad Layout Please see http://www.diodes.com/package-outlines.html for the latest version. U-DFN2510-10 X2 X1 Dimensions X Y1 Y Y3 Y2 C X X1 X2 Y Y1 Y2 Y3 Value (in mm) 0.500 0.250 0.450 2.250 0.625 0.575 0.700 1.400 C D3V3F4U10LP Document number: DS38563 Rev. 1 - 2 4 of 5 www.diodes.com March 2017 (c) Diodes Incorporated D3V3F4U10LP IMPORTANT NOTICE ADVANCED INFORMATION DIODES INCORPORATED MAKES NO WARRANTY OF ANY KIND, EXPRESS OR IMPLIED, WITH REGARDS TO THIS DOCUMENT, INCLUDING, BUT NOT LIMITED TO, THE IMPLIED WARRANTIES OF MERCHANTABILITY AND FITNESS FOR A PARTICULAR PURPOSE (AND THEIR EQUIVALENTS UNDER THE LAWS OF ANY JURISDICTION). Diodes Incorporated and its subsidiaries reserve the right to make modifications, enhancements, improvements, corrections or other changes without further notice to this document and any product described herein. Diodes Incorporated does not assume any liability arising out of the application or use of this document or any product described herein; neither does Diodes Incorporated convey any license under its patent or trademark rights, nor the rights of others. Any Customer or user of this document or products described herein in such applications shall assume all risks of such use and will agree to hold Diodes Incorporated and all the companies whose products are represented on Diodes Incorporated website, harmless against all damages. Diodes Incorporated does not warrant or accept any liability whatsoever in respect of any products purchased through unauthorized sales channel. Should Customers purchase or use Diodes Incorporated products for any unintended or unauthorized application, Customers shall indemnify and hold Diodes Incorporated and its representatives harmless against all claims, damages, expenses, and attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized application. Products described herein may be covered by one or more United States, international or foreign patents pending. Product names and markings noted herein may also be covered by one or more United States, international or foreign trademarks. This document is written in English but may be translated into multiple languages for reference. Only the English version of this document is the final and determinative format released by Diodes Incorporated. LIFE SUPPORT Diodes Incorporated products are specifically not authorized for use as critical components in life support devices or systems without the express written approval of the Chief Executive Officer of Diodes Incorporated. As used herein: A. Life support devices or systems are devices or systems which: 1. are intended to implant into the body, or 2. support or sustain life and whose failure to perform when properly used in accordance with instructions for use provided in the labeling can be reasonably expected to result in significant injury to the user. B. A critical component is any component in a life support device or system whose failure to perform can be reasonably expected to cause the failure of the life support device or to affect its safety or effectiveness. Customers represent that they have all necessary expertise in the safety and regulatory ramifications of their life support devices or systems, and acknowledge and agree that they are solely responsible for all legal, regulatory and safety-related requirements concerning their products and any use of Diodes Incorporated products in such safety-critical, life support devices or systems, notwithstanding any devices- or systems-related information or support that may be provided by Diodes Incorporated. Further, Customers must fully indemnify Diodes Incorporated and its representatives against any damages arising out of the use of Diodes Incorporated products in such safety-critical, life support devices or systems. Copyright (c) 2017, Diodes Incorporated www.diodes.com D3V3F4U10LP Document number: DS38563 Rev. 1 - 2 5 of 5 www.diodes.com March 2017 (c) Diodes Incorporated