JG82870P2 S L8AM - INTEL - Datasheet.Support

The Communications

and Embedded Products

Source Book 2004

Covering the spectrum

of Intel communications

products

The Communications and Embedded Products Source Book May 2004

Intel Corporation

United States and Canada

Intel Corporation

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Printed in USA/2004/10K/MD/HP

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PLEASE ADJUST SPINE TO PROPER WIDTH

Welcome to The Intel Communications and Embedded Products Sourcebook—2004, your

complete reference guide for Intel’s Communications and Embedded products.

As you look through this sourcebook, you will note that all of the sections have been updated to include

the latest released products.

As this sourcebook will only be updated once a year,. we recommend you look on

www.developer.intel.com website to get the very latest product information.

Communications and

Embedded Products Source Book

Table of Contents

PROCESSORS AND CHIPSETS

Embedded Intel®Architecture Overview . . . . . . . . . . . . . . . . . . . . . . . . . 1

Intel®Personal Internet Client Architecture . . . . . . . . . . . . . . . . . . . . . .20

Embedded PXA Processor Overview . . . . . . . . . . . . . . . . . . . . . . . . . . .35

Intel XScale®Microarchitecture . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .38

INTEL®FLASH MEMORY FOR WIRELESS APPLICATIONS

Intel®Stacked Chip Scale Packaging Products . . . . . . . . . . . . . . . . . . . .41

1.8 Volt Intel StrataFlash®Wireless Memory (L18/L30) . . . . . . . . . . . .44

1.8 Volt Intel®Wireless Flash Memory (W18/W30) . . . . . . . . . . . . . . .44

Intel®Flash Memory Software . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .46

INTEL®FLASH MEMORY FOR EMBEDDED APPLICATIONS

3 Volt Intel StrataFlash®Memory (J3 Family) . . . . . . . . . . . . . . . . . . . .49

Intel®Advanced+ Boot Block Flash Memory (C3/B3 Family) . . . . . . .50

3 Volt Synchronous Intel StrataFlash®Memory (K3/K18 Family) . . . .50

Intel®Flash Memory Development Tools . . . . . . . . . . . . . . . . . . . . . . . .51

I/O PRODUCTS

Intel’s I/O Processors (IOP) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .55

NETWORK PROCESSORS

Intel®IXP2xxx Network Processor Product Line . . . . . . . . . . . . . . . . . .61

Intel®IXP4xx Network Processor Product Line . . . . . . . . . . . . . . . . . . .67

NETWORKING PRODUCTS

Workgroup and Enterprise Solutions . . . . . . . . . . . . . . . . . . . . . . . . . . . .73

ADVANCED ETHERNET CONTROLLERS—PCI BASED

Intel’s 10/100/1000 Ethernet Controllers (MAC/Phy) . . . . . . . . . . . . . .81

Intel’s 10/100 Ethernet Controllers (MAC/Phy) . . . . . . . . . . . . . . . . . . .83

OPTICAL PRODUCTS

Optical Products . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .85

TELECOM PRODUCTS

Silicon Transmission Products . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .111

Telecom Boards and Platforms . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .117

Telecom Boards . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .121

Telecom Platforms . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .146

Telecom Software . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .152

BRIDGE PRODUCTS

Transparent PCI-to-PCI Bridges . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .163

Transparent PCI-X Bridge . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .164

Non-transparent PCI-to-PCI Bridges . . . . . . . . . . . . . . . . . . . . . . . . . . .165

PCI-X Serial ATA Host Disk Controller . . . . . . . . . . . . . . . . . . . . . . . .166

MICROCONTROLLERS

MCS®96 Microcontrollers . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .167

MCS®251 Microcontrollers . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .174

MCS®51 Microcontrollers . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .177

Interconnect Devices . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .179

SOFTWARE

Software for EID Products . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .181

Intel®Embedded Chipset Device Driver support matrix . . . . . . . . . . .186

COMMUNICATIONS AND EMBEDDED DEVELOPER’S NETWORKS

Intel®Communications Alliance . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .193

Intel™Personal Client Architecture Developer Network . . . . . . . . . . .194

DEVELOPMENT TOOLS AND SUPPORT

Comprehensive Support for Embedded Products . . . . . . . . . . . . . . . . .195

DISTRIBUTOR AND MANUFACTURING REPRESENTATIVES

Distributor and Manufacturing Representatives . . . . . . . . . . . . . . . . . . 203

developer.intel.com/design/intarch Processors and Chipsets

Embedded Intel®Architecture (IA) enables embedded system designers to choose from multiple levels of integration,

ranging from Intel®processors and chipsets to validated reference designs and highly integrated modular platforms.

Whatever level of integration you choose, Intel and its world-class ecosystem provide the building blocks and tools you need

to make your embedded solutions run better, faster and further.

■Based on emerging industry standards, IA processors are compatible with leading operating systems and supported

by a broad third-party ecosystem. Modularity, scalability and standards-based design help customers accelerate

time-to-market and reduce cost.

■Embedded Intel®Architecture chipsets provide a reliable platform for high-performance connected embedded applications

with the performance, stability, and reliability customers require for embedded computing applications. Intel®chipsets

and drivers can help reduce support costs, validation costs, and offer a variety of sell-up opportunities while still

providing ﬂexibility and performance at value pricing.

■Embedded IA reference designs and conﬁgurations support developers in a variety of market segments including

communications, digital security surveillance, interactive clients, storage, learning solutions and print imaging. They

may be used off-the-shelf as a market-ready design, or further customized to support additional value-added features.

■Intel provides a wide selection of development kits designed to minimize customers’ development efforts and

facilitate quick time-to-market. Kits include supporting documents and evaluation software from independent software

vendors.

■Intel provides developers with software resources and tools to accelerate the successful development and delivery of

IA-based solutions. Intel®Embedded Graphics Drivers speciﬁcally target the needs of embedded platform developers,

offering an alternative to drivers designed for the desktop and mobile market segments.

■Implementation-ready boards and systems from Intel and third-party vendors are also available to meet your most

stringent time-to-market requirements: www.intel.com/info/eia.

Intel®Xeon™Processor

The Intel®Xeon™processor with 512 KB L2 cache and the Low Voltage Intel®Xeon™processor are the solutions for

applications that demand the highest levels of performance in the communications market segment. The Low Voltage

Intel Xeon processor has the additional beneﬁt of lower thermal design power, making it ideal for thermally-sensitive, space-

constrained environments. Based on the Intel NetBurst®microarchitecture, they feature a 400 MHz and 533MHz system bus,

512KB L2 cache, dual-processor capability, and Hyper-Threading Technology which allows a single physical processor to

process two threads of data simultaneously. Support for the Intel Xeon processor with 512 KB L2 cache includes 2.0, 2.4

and 2.8 GHz and 1.6, 2.0 and 2.4 GHz for the Low Voltage Intel Xeon processor.

The Intel Xeon processor with 512 KB L2 cache and the Low Voltage Intel Xeon processor are validated with the Intel®

E7500 and the Intel®E7501 chipsets. These chipset designs deliver maximized system bus, memory, and I/O bandwidth to

enhance performance, scalability, and end-user productivity.

INTEL®XEON™PROCESSOR WITH 512KB L2 CACHE

CORE SPEED EXTERNAL L2 THERMAL DESIGN

PRODUCT NUMBER (GHz) BUS SPEED (MHz) CACHE POWER VOLTAGE TCAS PACKAGE

RK80532KE072512 2.8 533 512K 74.0W 1.5V 75°C 604-pin FC-mPGA-2p

RK80532KE056512 2.4 533 512K 65.0W 1.5V 74°C 604-pin FC-mPGA-2p

RN80532KC041512 2.0 400 512K 58.0W 1.5V 70°C 603-pinINT3

LOW VOLTAGE INTEL®XEON™PROCESSOR

CORE SPEED EXTERNAL L2 THERMAL DESIGN

PRODUCT NUMBER (GHz) BUS SPEED (MHz) CACHE POWER VOLTAGE TCASE PACKAGE

RK80532EE056512 2.4 533 512K 40.0W 1.3V 81°C 604-pin FC-mPGA-2p

RK80532EC041512 2.0 400 512K 35.0W 1.3V 83°C 604-pin FC-mPGA-2p

RK80532EC025512 1.6 400 512K 30.0W 1.3V 81°C 604-pin FC-mPGA-2p

Embedded Intel

Architecture

Processors and Chipsets developer.intel.com/design/intarch

Intel®Pentium®4 Processor, Intel®Pentium®4 Processor with Hyper-Threading (HT)

Technology, and Intel®Pentium®4 processor - M

The Intel®Pentium®4 processor family, with Intel NetBurst®microarchitecture, delivers performance to meet the growing

demands of a new generation of leading-edge products, with scalability that helps minimize your total cost-of-ownership.

These embedded processors provide the performance headroom needed to meet the heavy application demands of

networking, communications and storage appliances, sophisticated interactive clients, industrial automation solutions, digital

security surveillance platforms, and imaging devices.

For reliable embedded platform designs, the Intel Pentium 4 processor is validated with the Intel®845 chipset, the Intel®

845E chipset, the Intel®845GV chipset, the Intel®852GME chipset, and the Intel®875P chipset. The Intel Pentium 4

processor - M is validated with the Intel 845E chipset. The Intel®Pentium®4 Processor with HT Technology is validated with

the Intel 875P chipset. Intel Pentium 4 processor-based platforms include integrated graphics, and support the high-

bandwidth I/O performance of USB 2.0 and Gigabit Ethernet networking. Rapid platform development is supported by the

latest operating systems, applications and Intel®Architecture development tools, as well as a variety of validated reference

designs from Intel. While incorporating Intel’s most advanced embedded processor technologies, these processors are

software-compatible with previous Intel®Architecture processors.

INTEL®PENTIUM®4 PROCESSOR WITH HYPER-THREADING TECHNOLOGY

CORE SPEED EXTERNAL L2 THERMAL DESIGN

PRODUCT NUMBER (GHz) BUS SPEED (MHz) CACHE POWER VOLTAGE TCASE PACKAGE

RK80546PG0801M 3.0 800 1 MB 103W 1.25–1.4V* 5°C–73.5°C FC-HPGA4 478

*Variable VID voltage. The Intel Pentium 4 processor with HT Technology ships with different voltage settings. For more detailed information, please refer to our Web site at

http://developer.intel.com/design/intarch/pentium4/pentium4.htm

INTEL®PENTIUM®4 PROCESSOR

CORE SPEED EXTERNAL L2 THERMAL DESIGN

PRODUCT NUMBER (GHz) BUS SPEED (MHz) CACHE POWER VOLTAGE TCASE PACKAGE

RK80532PCE072512 2.8 533 512K 68.4W 1.525V* 5°C–75°C 478 FC-PGA2

RK80532PC064512 2.6 400 512K 62.6W 1.525V* 5°C–72°C 478 FC-PGA2

RK80532PE056512 2.4 533 512K 59.8W 1.525V* 5°C–71°C 478 FC-PGA2

RK80532PC041512 2A 400 512K 54.3W 1.525V* 5°C–69°C 478 FC-PGA2

*Variable VID maximum voltage

INTEL®PENTIUM®4 PROCESSOR-M

CORE SPEED EXTERNAL L2 THERMAL DESIGN

PRODUCT NUMBER (GHz) BUS SPEED (MHz) CACHE POWER VOLTAGE TJUNCTION (MAX) PACKAGE

RH80532GC049512 2.2 400 512K 35.0W 1.3V 100°C µFC-PGA 478

RH80532GC029512 1.7 400 512K 30.0W 1.3V 100°C µFC-PGA 478

Intel®Pentium®M Processor

The Intel®Pentium®M processor is ideal for high-performance, low-power embedded computing, and is designed

speciﬁcally for communications, transaction terminal, interactive clients, and industrial automation applications. An

advanced microarchitecture enables the Pentium M processor to meet embedded computing demands today and in the future.

While incorporating new features and improvements, the Intel Pentium M processor remains software-compatible with

previous members of the Intel®microprocessor family. It supports uniprocessor designs, and delivers 3.2 GB of data per

second into and out of the processor. The Intel Pentium M processor is validated with the Intel E7501 chipset, expanding the

processor’s platform with a great balance of performance and I/O bandwidth capability for embedded computing segments.

This chipset provides up to 4 GB single- or dual-channel DDR200 memory, and features conﬁgurable optional Error

Correcting Code (ECC) operation.

CORE SPEED EXTERNAL L2 THERMAL DESIGN

PRODUCT NUMBER (GHz) BUS SPEED (MHz) CACHE POWER VOLTAGE TJUNCTION PACKAGE

RH80535GC0251M 1.6 400 1 MB 24.5W 1.484V 100°C µFC-PGA 478

RJ80535GC0251M 1.6 400 1 MB 24.5W 1.484V 100°C µFC-PGA 478

RJ80535LC0051M 1.1 400 1 MB 12W 1.180V 100°C µFC-PGA 478

developer.intel.com/design/intarch Processors and Chipsets

Intel®Pentium®III Processor

The Intel®Pentium®III processor is ideal for scalable high-performance applied computing applications. It is validated

with multiple chipsets for maximum ﬂexibility and scalability. Combined with the Intel®840 chipset, the Intel Pentium III

processor provides high performance and bandwidth including dual processing support and a second PCI bus. The Intel®815,

Intel®815E, Intel®810 and Intel®810E2 chipsets utilize Intel®Graphics Technology, an integrated graphics platform which

provides more stability, higher quality graphics and a reduced OEM bill of materials cost. The Intel®440BX AGPset supports

ECC for the highest data integrity and ISA for legacy I/O. The Intel Pentium III processor with 512K cache is validated with

the Intel 815E chipset in uniprocessor mode as well as in dual-processing mode with chipsets from third-party manufacturers.

CORE SPEED EXTERNAL L2 THERMAL DESIGN

PRODUCT NUMBER (MHz) BUS SPEED (MHz) CACHE POWER (MAX) VOLTAGE TJUNCTION PACKAGE

RB80526PY600256 600 100 256K 19.6W 1.75V 82°C 370 FC-PGA

RB80526PY700256 700 100 256K 21.9W 1.75V 80°C 370 FC-PGA

RB80526PZ733256 733 133 256K 22.8W 1.75V 80°C 370 FC-PGA

RB80526PY850256 850 100 256K 25.7W 1.75V 80°C 370 FC-PGA

RB80526PZ866256 866 133 256K 26.1W 1.75V 80°C 370 FC-PGA

RB80526PY001256+ 1.0GHz 100 256K 29.0W 1.75V 75°C 370 FC-PGA

RB80526PZ001256 1.0GHz 133 256K 29.0W 1.75V 75°C 370 FC-PGA

RK80530KZ012512 1.26GHz 133 512K 29.5W 1.45V 69°C* 370 FC-PGA2

+ For existing embedded applications using the Intel®440BX chipset only. Drop ship only.

* Tcase,not Tjunction

Intel®Pentium®III Processor—Low Power

The Intel®Pentium®III processor—Low Power brings the performance of the Pentium III processor to thermally sensitive

and space-constrained embedded computing applications. It incorporates Intel’s 0.18-micron manufacturing process,

Dual Independent Bus (DIB) architecture and Advanced Transfer Cache, making it ideal for many performance-hungry,

thermally sensitive, and space-constrained embedded computing applications such as data communications,

telecommunications, industrial automation and transaction terminals.

The Pentium III processor—Low Power also supports MMX™technology and Internet Streaming SIMD extensions,

enabling a more visual experience for the end user and allowing for new applications such as real-time video encoding and

speech recognition. Dynamic execution of software instructions within the core processing unit optimizes the workload on

the processor, increasing performance. This processor is validated with the Intel®440BX AGPset and Intel®440MX PCIset.

CORE SPEED EXTERNAL L2 THERMAL DESIGN

PRODUCT NUMBER (MHz) BUS SPEED (MHz) CACHE POWER (MAX) VOLTAGE TCASE PACKAGE

RJ80530KZ933512+ 933 133 512K 12.2W 1.15V 0°C–100°C 479 µFC-BGA

RJ80530KZ800512+ 800 133 512K 11.2W 1.15V 0°C–100°C 479 UFC-BGA

KC80526GY850256‡ 700‡ 100 256k 16.1W 1.35V 0°C–100°C 495 BGA

KC80526LY500256 500 100 256K 12.2W 1.35V 0°C–100°C 495 BGA

KC80526NY400256 400 100 256K 10.1W 1.35V 0°C–100°C 495 BGA

+ Supports dual processing when paired with third-party chipsets.

‡ Intel®Pentium®III processor at 850/700 MHz featuring Intel®SpeedStep™technology (1.6V/1.35V respectively).

Intel®Pentium®III Processor—Low Power Module

The Intel®Pentium®III processor—Low Power module at 500 MHz provides a scalable solution for existing Intel®

Pentium®II processor—Low Power module designs at 266 and 333 MHz, and is the ﬁrst low-power module to support

a 100 MHz system bus. The module includes the Intel Pentium III processor and northbridge of the 440BX AGPset.

Processors and Chipsets developer.intel.com/design/intarch

Intel®Pentium®II Processor—Low Power

The Intel®Pentium®II processor—Low Power provides a superior, low-proﬁle, surface-mount solution for applications

combining high performance with low power.

CORE SPEED EXTERNAL L2 THERMAL DESIGN

PRODUCT NUMBER (MHz) BUS SPEED (MHz) CACHE POWER (MAX) VOLTAGE TJUNCTION PACKAGE

KC80524KX333256 333 66 256K 11.8W 1.6V 0°C–100°C 615 BGA

KC80524KX266256 266 66 256K 9.8W 1.6V 0°C–100°C 615 BGA

Intel®Celeron®M Processor

The Intel®Celeron®M processor is the next generation of value processors, providing exceptional performance combined

with low power. Built on the Intel®0.13-micron process, it is available at 1.3 GHz, in either µFC-PGA or µFC-BGA

packages, with 512 KB of on-die L2 cache. These processors are ideal solutions for communications appliances such as

media center appliances, network attached storage, Web pads and other applications with lower power envelopes and BOM

requirements. It features a high-performance, low-power core, Advanced Transfer Cache architecture, dynamic execution,

and is supported with the Intel®855GME chipset

CORE SPEED EXTERNAL L2 THERMAL DESIGN

PRODUCT NUMBER (GHz) BUS SPEED (MHz) CACHE POWER (MAX) VOLTAGE TJUNCTION PACKAGE

RJ80535NC013512 1.3 400 512 KB 24.5W 1.356V 0–100ºC 479 µFC-BGA

RH80535NC013512 1.3 400 512 KB 24.5W 1.356V 0–100ºC 478 µFC-PGA

Intel®Celeron®Processor

The Intel®Celeron®processor family provides an excellent solution for cost-sensitive applications requiring great per-

formance. It is compatible with Intel®815E, 815, 810E2 and 810 chipsets; Intel®82801E C-ICH; Intel 440BX AGPset

and 440MX chipset; Intel 815E and 810E2 (1.2 GHz), 845, 845E; 845GV, 852GME, and 875P chipsets (2.0 and 2.5 GHz).

CORE SPEED EXTERNAL L2 THERMAL DESIGN

PRODUCT NUMBER (MHz) BUS SPEED (MHz) CACHE POWER (MAX) VOLTAGE+ TCASE PACKAGE

RK80532RC060128 2.5 GHz 400 128K 61.0W (TDP) 1.525V 72°C FC-PGA2 478-pin

RK80532RC041128 2.0 GHz 400 128K 52.8W (TDP) 1.525V 5°C–68°C FC-PGA2 478-pin

RK80530RY009256 1.2 GHz 100 256K 32.1W 1.5V 70°C 370 FC-PGA2

RB80526PX850128 850 100 128K 26.7W 1.75V 80°C* 370 FC-PGA

RB80526RX733128 733 66 128K 23.6W 1.75V 80°C* 370 FC-PGA

RB80526RX566128 566 66 128K 19.2W 1.75V 90°C* 370 FC-PGA

FV80524RX433128 433 66 128K 24.1W 2.0V 5°C–85°C 370 PPGA

FV80524RX366128 366 66 128K 21.7W 2.0V 5°C–85°C 370 PPGA

FV80524RX300128 300A 66 128K 17.8W 2.0V 5°C–85°C 370 PPGA

* Max Tjunction

+ Variable VID maximum voltage. The Intel Celeron processor ships with different voltage settings. For detailed product speciﬁcations, please refer to http://developer.intel.com/design/celeron/datashts/251748.htm

Intel®Celeron®Processor—Low Power and Ultra Low Voltage

The Intel®Celeron®processor—Low Power and Ultra Low Voltage Intel®Celeron processor provide an exceptional value

for thermally sensitive and space-constrained embedded computing applications by combining the optimal balance of

cost, performance, and low power. The 400 MHz versions are validated with the Intel 440BX AGPset and Intel 440MX

PCIset. The Low Power processor at 300 MHz is validated with the Intel 440MX PCIset. The Ultra Low Voltage processor

at 650 MHz is validated with the Intel 440MX PCIset and Intel 815E chipsets.

INTEL®CELERON®PROCESSOR—LOW POWER

CORE SPEED EXTERNAL L2 THERMAL DESIGN

PRODUCT NUMBER (MHz) BUS SPEED (MHz) CACHE POWER (MAX) VOLTAGE TCASE PACKAGE

KC80526LY400A128 400A 100 128K 10.1W 1.35V 0°C–100°C 495 BGA

KC80526LL300128 300 100 128K 5.7W 1.10V 0°C–100°C 495 BGA

developer.intel.com/design/intarch Processors and Chipsets

ULTRA LOW VOLTAGE INTEL®CELERON®PROCESSOR

CORE SPEED EXTERNAL L2 THERMAL DESIGN

PRODUCT NUMBER (MHz) BUS SPEED (MHz) CACHE POWER (MAX) VOLTAGE TCASE PACKAGE

RJ80530VY650256 650 100 256K 8.3W 1.10V 0°C–100°C 479 µFC-BGA

RJ80530VY400256 400 100 256K 4.2W 0.95V 0°C–100°C 479 µFC-BGA

Intel®Pentium®Processor

The Intel®Pentium®processor is a valuable solution for embedded applications, featuring superscalar architecture, branch

prediction, separate code and data caches, a high-performance ﬂoating-point unit, enhanced 64-bit data bus, data

integrity features, performance monitoring, and execution tracing. Voltage Reduction Technology (VRT) is available with the

133 MHz version resulting in lower power consumption.

CORE SPEED EXTERNAL THERMAL DESIGN

PRODUCT NUMBER (MHz) BUS SPEED (MHz) POWER (MAX) VOLTAGE TCASE PACKAGE

A8050266166 166 66 14.5W 3.3V 0°C–70°C 296 SPGA

A8050266133 133 66 11.2W 3.3V 0°C–70°C 296 SPGA

A80502CSLM66133 133* 66 7.9W 3.1V 0°C–85°C 296 SPGA

A8050266100 100 66 10.1W 3.3V 0°C–70°C 296 SPGA

* With Voltage Reduction Technology (VRT)

Intel®Pentium®Processor with MMX™Technology and Low-Power Intel®Pentium®Processor

with MMX™Technology

From point-of-sale (POS) terminals and retail kiosks to advanced networking equipment, Pentium®processors with

MMX™technology enable developers of embedded systems to step up to new levels of performance. To make these

designs even easier and more ﬂexible, Intel is making the performance advantages of MMX technology available at a choice

of integration levels:

■Longer life cycle support for the 200 MHz and 233 MHz versions

■Low-power Pentium processors with MMX technology at 166 MHz and 266 MHz

■Synchronous DRAM [SDRAM] support with the Intel®430TX PCIset

INTEL®PENTIUM®PROCESSOR WITH MMX™TECHNOLOGY

CORE SPEED EXTERNAL THERMAL DESIGN

PRODUCT NUMBER (MHz) BUS SPEED (MHz) POWER (MAX) VOLTAGE TCASE PACKAGE

FV8050366233 233 66 17.0W 2.8V 0°C–70°C 296 PPGA

FV8050366200 200 66 15.7W 2.8V 0°C–70°C 296 PPGA

LOW-POWER INTEL®PENTIUM®PROCESSOR WITH MMX™TECHNOLOGY

CORE SPEED EXTERNAL THERMAL DESIGN

PRODUCT NUMBER (MHz) BUS SPEED (MHz) POWER (MAX) VOLTAGE TCASE PACKAGE

FV80503CSM66166 166 66 4.5W 1.9V 0°C–85°C 296 PPGA

FV80503CSM66266 266 66 7.6W 1.9V 0°C–85°C 296 PPGA

GC80503CSM66166 166 66 4.1W 1.8V 0°C–95°C 352 HL-PBGA

GC80503CSM66266 266 66 7.6W 2.0V 0°C–95°C 352 HL-PBGA

GC80503CS166EXT 166 66 4.1W 1.8V -40°C–+115°C 352 HL-PBGA

Processors and Chipsets developer.intel.com/design/intarch

SL Enhanced Intel486™Processor Overview

The Intel486™microprocessors provide 32-bit high performance in increasingly complex application environments.

Current customers of the embedded Intel386™processor can take advantage of the Intel486 processor architecture to

extend the performance of their embedded designs.

The Intel®SL Technology featured in the Intel486 processors, allow designers to build intelligent power management

capabilities into hardware, making these capabilities independent of application software. Power management becomes an

integral part of the system, regardless of what operating system or application is used. Power management is improved

because Intel SL Technology protects the power management features from conﬂicting with other software.

FEATURES BENEFITS

32-bit address Memory Management Unit (MMU) High performance and compatibility. The Intel486™MMU is

compatible with the Intel386™processor MMU

Intel®SL Technology for intelligent power management capabilities Capabilities. Application-independent power management Energy

■Static design efﬁciency. Intel SL Technology enables embedded system designs that

■Automatic on-chip clock control exceed the Environmental Protection Agency’s (EPA) Energy Star

■Stop Clock, Stop Grant, Auto Halt Power Down, I/O Restart program guidelines without compromising performance

■System Management Mode (SMM)

Single-cycle instruction execution Speed and efﬁciency. Faster execution

On-chip uniﬁed code and data cache Increased performance and efﬁciency. Reduces external memory

fetches and decreases bus trafﬁc

Burst data bus mode Speed. Supports demanding data-intense applications by enabling fast

cache ﬁlls

JTAG boundary scan Diagnostics. Allows for in-system processor diagnostics

Intel486™SX Embedded Processor Overview

The embedded Intel486™SX processor provides high performance to 32-bit, embedded applications that do not require

a ﬂoating-point unit. The embedded Intel486 SX processor is binary-compatible with the Intel386 and earlier Intel

processors. Compared with the Intel386 processor, it provides faster execution of many commonly used instructions.

It also provides the beneﬁts of an integrated, 8-Kbyte, write-through cache for code and data. Its data bus can operate in

burst mode, which provides up to 106 Mbps transfers for cache-line ﬁlls and instruction prefetches. Two component packages

are available: a 196-lead Plastic Quad Flat Pack (PQFP), and a 168-Pin Grid Array (PGA), both available for 5 volt designs.

Both products operate at CLK frequencies up to 33 MHz.

Ultra-Low-Power Intel486™SX/GX Embedded Processor Overview

The Ultra-Low-Power Intel486™SX/GX embedded processors were developed speciﬁcally for the embedded market.

They bring strong performance to low-cost, entry-level, embedded applications, where maximum energy efﬁciency is a

high concern. These low-power technology improvements allow for new packaging options for the Intel486 processor. The

Ultra-Low-Power Intel486 SX/GX processors come in the 176 lead Thin Quad Flat Pack (TQFP) package. This is the

smallest, lowest proﬁle Intel486 processor in the world. At 25.4 mm x 25.4 mm x 1.5 mm, the 176 lead TQFP package is the

same size and thickness as a United States quarter (25¢ coin)!

developer.intel.com/design/intarch Processors and Chipsets

FEATURES BENEFITS

Dual Vcc design for standard 3.3V I/O VccP and lower core Vcc Efﬁciency. Ideal for battery-powered, portable applications

Digital phase lock loop or DDL for minimum clock start-up time Maximizes power savings. The DDL takes a maximum of 8 input clock

periods (240ns at 33 MHz) to synchronize, approximately 4,000 times

faster than a standard Intel486™processor with PLL design

32-bit external data path in the Ultra-Low-Power Intel486™SX Performance and ﬂexibility. Multiple system design options with true

16-bit external data path in the Ultra-Low-Power Intel486™GX 32-bit architecture

On-chip 8K uniﬁed code and data cache Increased performance and efﬁciency. Reduces access cycles to

external memory

Burst data bus capable of: Cost reduction. Maintains system throughput with inexpensive DRAMs

■59 MB/sec transfer at 33 MHz, or DRAMs

176-lead TQFP and product packaging Compact. Ideal for the most compact designs. This is the smallest, lowest

proﬁle Intel486 processor in the world!

IntelDX2™and IntelDX4™Processor Overview

The IntelDX2™and IntelDX4™processors bring the highest level of performance in the Intel486 processor family, created

by such combined features as speed-multiplying technology, on-chip integration of Level I uniﬁed code and data cache,

memory management unit with paging, and ﬂoating-point unit. The clock-multiplier allows the processor to operate at

frequencies higher than the external memory bus. The integer unit uses RISC design techniques to provide single-clock-cycle

execution of common instructions and general-purpose registers for manipulating 32-bit addresses and data. The 8K on-chip

Write-Through uniﬁed cache on the speed-doubled IntelDX2 processor, and the 16K on-chip Write-Back Enhanced uniﬁed

cache on the speed-tripled IntelDX4 processor maintains the one-clock-per-instruction execution rate. Intel486 processors

provide support for multiprocessing systems. Support for multi-level caches reduces bus utilization, allowing multiple

Intel486 processors to share a single memory bus. For the highest levels of performance, choose the IntelDX2 and IntelDX4

processors.

FEATURES BENEFITS

Complete 32-bit RISC-technology integer core and Performance. For the most data-intense applications

32-bit external data bus

On-chip ﬂoating-point unit Performance. Highest Intel®x86 integration reduces inter-chip

communication

IntelDX2™processor speed doubling: Performance and ﬂexibility. Multiple frequency choices provide greater

■66 MHz core speed using 33 MHz bus clock at 5V ﬂexibility in system designs

■50 MHz core speed using 25 MHz bus clock at 3.3V The IntelDX4 processor supports both speed-doubling and speed-tripling

IntelDX4™processor speed tripling: technology

■100 MHz core speed using 33 MHz bus clock at 3.3V

Burst data bus: Performance. For instruction prefetch and for ﬁlling the internal cache

■80Mbps max. burst bus cycle at 25 MHz

■106Mbps max. burst bus cycle at 33 MHz

INTEL486™PROCESSOR (not all speeds are available in all packages)

SYS CORE BURST

SPEED I/O SERIAL TIMERS/ STATIC MGT A20 DMA CHIP INTERRUPT DRAM SPEED DTAT INPUT

PRODUCT (MHz) PINS PORTS CTRS DESIGN MODE GATE CHAN WDT SELECT CLR REFRESH MULTI CACHE BUS LEVELS VOLTAGE PACKAGE TEMP

INTEL486™PROCESSOR FAMILY

80486DX4 100 0 NO 0 YES YES NO 0 NO 0 NO NO 3X CLK 16Kb, YES CMOS 3.3V A168, C

32-bit bus WB FC208

80486DX2 50, 66 0 NO 0 YES YES NO 0 NO 0 NO NO 2X CLK 8Kb, WT YES CMOS 5.0V–3.3V A168, C

32-bit bus SB208

80486SX 33 0 NO 0 YES YES NO 0 NO 0 NO NO N/A 8Kb, WT YES CMOS 5.0V A168, C

32-bit bus KU196

80486SXSF 33 0 NO 0 YES YES NO 0 NO 0 NO NO N/A 8Kb, WT YES CMOS 3.3V FA176 C

32-bit bus

80486GXSF 33 0 NO 0 YES YES NO 0 NO 0 NO NO N/A 8Kb, WT YES CMOS 3.3V FA176 C

16-bit bus

Processors and Chipsets developer.intel.com/design/intarch

Intel386™Processor Overview

For over 10 years, Intel386 processors have provided the computer industry with reliability and high performance. Initially

built as the host CPU for PCs, these processors are still readily available and continue to provide 32-bit processing power

for embedded applications. Thanks to the Intel386 processor core design, the new pin-for-pin compatible family enables

higher performance, extended temperatures and lower power and voltage capabilities for embedded systems than was

previously possible.

FEATURES BENEFITS

32-bit CPU Performance. Performance processing at 5 to 10 MIPS

80386 instruction set Compatibility. Compatibility with all PC applications, development

and operating system software

16 MB–4 GB addressability Expandable. Head room for software growth for future system product

enhancements

Protected mode Security. Ability to develop large, OS-based embedded system;

provides restricted access privileges

SL enhanced SMM support Capabilities. Application-independent power management

Intel386™EX Integrated Processor Overview

The Intel386™EX processor provides high integration and PC compatibility for embedded applications. Intel based the EX

on the same static Intel386 processor 32-bit core, and incorporated PC-compatible and traditional embedded peripherals to

provide a high-performance, extended temperature, low power, low voltage and an integrated embedded solution.

FEATURES BENEFITS

PC-compatible peripherals (8254, 8259A, enhanced 8237A) Portability. Easy portability of application software developed on a PC

16450-compatible serial ports Compatibility. Standard protocol familiar and well supported within

the industry

DMA-supported serial transfers Efﬁcient. Reduces CPU load

Dynamic bus sizing enables interface to 8- or 16-bit peripherals Reduces costs. Lowers total system cost

Synchronous serial I/O Boosts rates. Provides higher data transfer rates (baud rate generator

on-chip vs. standard Intel386™processors)

JTAG boundary scan Diagnostics. Allows for in-system processor diagnostics

INTEL386™PROCESSOR (not all speeds are available in all packages)

SYS

SPEED I/O SERIAL TIMERS/ STATIC MGT A20 ADD DMA CLK PWR CHIP INTERRUPT DRAM INPUT

PRODUCT (MHz) PINS PORTS CTRS DESIGN MODE GATE SPACE CHAN WDT GEN OPTIONS SELECT CTLR REFRESH LEVELS VOLTAGE PACKAGE TEMP

INTEL386™PROCESSOR FAMILY

80386SX 20, 25, 0 NO 0 NO NO NO 16M 0 NO NO NO 0 NO NO TTL 5.0V NG100 C

80386DX 20, 25, 0 NO 0 NO NO NO 4G 0 NO NO NO 0 NO NO TTL 5.0V A132, C

33 NG132

80386SXTA 25, 33, 0 NO 0 YES NO NO 16M 0 NO NO NO 0 NO NO TTL 5.0V KU100 C, E

INTEL386™INTEGRATED PROCESSOR FAMILY

80386EXTB 25 24 3 3 YES YES YES 64M 2 YES NO PD, I 8 YES YES TTL 3.3V KU132, E

(8259A) FA144

80386EXTC 25 24 3 3 YES YES YES 64M 2 YES NO PD, I 8 YES YES TTL 5.0V KU132, E

(8259A) FA144

80386EXTC 33 24 3 3 YES YES YES 64M 2 YES NO PD, I 8 YES YES TTL 5.0V KU132, E

(8259A) FA144

developer.intel.com/design/intarch Processors and Chipsets

Intel386™Processor Development Tools

Because the Intel386 processor is a member of the Intel architecture family, the leading architecture used in PCs, a broad

range of familiar, low-cost development tools are readily available.

Growth and competition in the PC industry have produced tools that are time-proven and run on the PC, which eliminates

the need for expensive workstation-based development tools. For example, the Microsoft* and Borland* development tools,

used to create more than 50,000 PC applications, can now be used in an embedded environment. For more information about

development tools support, refer to the Tools section in this catalog or contact your Intel sales representative or visit our Web

site at http://appzone.intel.com/toolcatalog/.

Intel®186 Processor Overview

For the Intel®186 standard processor family, the numbers tell the story: more than 10,000 design wins and 100 million

units have shipped in its 16 years of production. With the Intel 186 family of products, you can determine the cost and

performance requirements for your embedded design and then choose from a wide variety of options: CHMOS, 8- and 16-bit

external bus versions and available in commercial/extended temperatures.

The 80C186/188XL family is pin-for-pin compatible with the 80186/188 family and adds an enhanced feature set. The

high-performance CHMOS process allows the 80C186/188XL to run at twice the clock rate of the HMOS 80186/188 while

consuming less than one-fourth the power.

FEATURES BENEFITS

16-bit static CPU (XL operating at 25 MHz) Performance. Performance >1 MIP

8086 instruction set Development. Use PC for easier software development and debugging

1-MB addressing Memory. Large address space (for programs and data). Can also use bank

switching for > 1 MB

On-chip peripherals Integration. High x86 integration enables low-cost and low-chip-count

designs

8-bit external bus available Flexibility. Lower memory and system cost

Multiple packaging options 68L (LCC, PLCC, PGA) Packaging. Supports varied system requirements

and 80L (QFP, SQFP)

CMOS inputs and outputs Noise. Improved noise margins

Intel®186 Enhanced Processor Overview

In 1990, Intel designed these processors to meet performance, integration and power consumption needs. Intel created a

modular core architecture in order to easily proliferate the family. The 80C18xEX (EA/EB/EC) family features an

improved 1.0-micron static core design, and all of the enhanced products run at 25 MHz. In addition, the Ex family products

incorporate new features (serial channels, DRAM refresh control and power management) to provide more functionality.

The Ex core has also been enhanced to run at 3 volts.

FEATURES BENEFITS

3-stage power management unit Power management. Efﬁcient power consumption

3V versions Low power. Enables portable, battery-powered designs

Watchdog timer (EC only) High integration. Ensures system integrity in hostile environments

Serial channels (EB/EC only) Avoid interrupt latency. Facilitates interprocessor communication

and modem interface

I/O ports (EB/EC only) Communication. Ability to communicate externally via standard protocols

Processors and Chipsets developer.intel.com/design/intarch

INTEL®186 PROCESSOR (not all speeds are available in all packages)

SYS

SPEED I/O SERIAL TIMERS/ STATIC MGT A20 ADD DMA CLK PWR CHIP INTERRUPT DRAM INPUT

PRODUCT (MHz) PINS PORTS CTRS DESIGN MODE GATE SPACE CHAN WDT GEN OPTIONS SELECT CTLR REFRESH LEVELS VOLTAGE PACKAGE TEMP

INTEL®STANDARD PRODUCT FAMILY

80C186XL/188XL 12, 20 0 NO 3 YES NO NO 1M 2 NO YES PS 13 YES YES TTL 5.0V A68, N68, C, E,

R68, S80,

SB80

80C186XL/188XL 25 0 NO 3 YES NO NO 1M 2 NO YES PS 13 YES YES TTL 5.OV A68, N68, C

R68, S80,

SB80

INTEL®ENHANCED PRODUCT FAMILY

80C186EA/188EA 25 0 NO 3 YES NO NO 1M 2 NO YES PS, PD, I 13 YES YES CMOS 5 0V N68 C

80C186EA/188EA 13, 20 0 NO 3 YES NO NO 1M 2 NO YES PS, PD, I 13 YES YES CMOS 5.0V N68 E

80L186EA/188EA 13 0 NO 3 YES NO NO 1M 2 NO YES PS, PD, I 13 YES YES CMOS 3.0V N68 E

80C186EB/188EB1 25 16 2 3 YES NO NO 1M O NO YES PD, I 10 YES YES CMOS 5.0V N84, S80, C

SB80

80C186EB/188EB 13, 20 16 2 3 YES NO NO 1M O NO YES PD, I 10 YES YES CMOS 5.0V N84, S80, E

SB80

80L186EB/188EB 16 16 2 3 YES NO NO 1M O NO YES PD, I 10 YES YES CMOS 3.3V N84, S80, C

SB80

80L186EB/188EB 13 16 2 3 YES NO N0 1M O NO YES PD, I 10 YES YES CMOS 3.0V N84, S80, E

SB80

80C186EC/188E 25 22 2 3 YES NO NO 1M 4 YES YES PS, PD, I 10 YES YES CMOS 5.0V KU100, C

(8259A) CS100,

SB100

80C186EC/188EC 13, 20 22 2 3 YES NO NO 1M 4 YES YES PS, PD, I 10 YES YES CMOS 5.0V KU100, E

(8259A) S100,

SB100

80L186EC/188EC 16 22 2 3 YES NO NO 1M 4 YES YES PS, PD, I 10 YES YES CMOS 3.3V KU100, C

(8259A) S100,

SB100

80L186EC/188EC 13 22 2 3 YES NO NO 1M 4 YES YES PS, PD, I 10 YES YES CMOS 3.0V KU100, E

(82SgA) S100,

SB100

PACKAGING:

A= Ceramic Pin Grid Array (PGA), KU = Plastic Quad Flat Pack (PQFP), R= Ceramic Leadless Chip Carrier (LCC), N= Plastic Leaded Chip Carrier (PLCC), NG = Plastic Quad Flat Pack (PQFP),

S= Quad Flat Pack (QFP-EIAJ), SB = Shrink Quad Flat Pack (SQFP-EIAJ), FA = Thin Quad Flat Pack (TQFP), FC = Shrink Quad Flat Pack with heat spreader (PQ2 PowerQuad), X= SmartDie product

A KU R N NG S SB FA FC

Intel486™Processor 168ld 196ld 176ld 208ld

Intel386™Processor 132ld 132ld 100ld, 144ld

132ld (DX)

Intel186®Processor 68ld 100ld 68ld 68ld, 80ld, 80ld,

84ld (EB) 100ld (EC) 100ld (EC)

POWER OPTIONS

PD = Power Down, PS = Power Save, I= Idle

TEMPERATURE RANGES: (Degrees Centigrade)

C= Commercial (0°C to +70°C), E = Extended (-40°C to +85°C).

Additional product information is always available via the World Wide Web

Intel®186 Processor Development Tools

There are many tools available for developing embedded systems with the Intel 186 product family. In fact, Intel 186

processors are compatible with Intel386 processor development tools and the PC architecture. This compatibility

provides access to a wide array of familiar, low-cost development tools.

Growth and competition in the PC industry have produced tools that are time-proven and run on your PC, which eliminates

the need for expensive workstation-based development tools. For example, the Microsoft and Borland development tools,

used to create more than 50,000 PC applications, can now be used in an embedded environment. For more information about

development tools support, refer to the Tools section in this catalog or contact your Intel sales representative or visit our Web

site at http://appzone.intel.com/toolcatalog/.

developer.intel.com/design/intarch Processors and Chipsets

EMBEDDED INTEL®ARCHITECTURE CHIPSETS

Intel®875P Chipset

The Intel®875P chipset-based platform delivers performance and high scalability for today’s cutting-edge e-Business and

e-Home applications while maintaining a balance of price and performance for embedded computing solutions. It is

designed, validated and optimized for Intel Pentium 4 processors with Intel NetBurst®microarchitecture, including the Intel®

Pentium®4 Processor with Hyper-Threading (HT) Technology. The Intel 875P chipset consists of the Intel®82875P Memory

Controller Hub (MCH) and the Intel®6300ESB I/O Controller Hub (ICH) to provide exceptional graphics bandwidth and

support the latest graphics controllers needed to meet the demands of today’s communications and embedded computing

market segments. Communication Streaming Architecture (CSA), featuring a Dedicated Network Bus (DNB), enables real

Gigabit Ethernet performance by eliminating the PCI bottleneck and providing a direct path to system memory. An optional

Intel®82547 Gigabit Ethernet Controller readily connects to CSA. Advanced packaging technology and industry-leading

electrical design innovations deliver long-term system reliability over wide operating conditions.

PRODUCT PRODUCT CODE PACKAGE FEATURE

Intel®82875P Memory 82875P 1005 FC-BGA 400/533/800 MHz system bus

Controller Hub DDR266/333/400 SDRAM with ECC

AGP 8X graphics interface

CSA network interface

Intel®6300ESB I/O FW80001ESB 689 µBGA PCI 32/33 and PCI-X 64/66

Controller Hub Serial and parallel ATA interfaces

USB 2.0 and serial ports

AC’97 support

Watchdog timer, 37 GPIOs

Intel®852GME Chipset

The Intel®852GME Chipset for Embedded Computing is an optimized integrated graphics solution featuring low-power

design. The 400/533 MHz system bus and integrated 32-bit 3D core at 133 MHz (at 533 MHz system bus) deliver a

high-bandwidth connection between the processor and the platform. It supports the Intel®Pentium®4 and the Intel®Celeron®

processors with Intel NetBurst®microarchitecture, and supports up to 2 GB of DDR266/333 system memory, providing the

performance and high scalability required for today’s cutting-edge e-Business and e-Home applications. The Intel 852GME

chipset is part of Intel’s comprehensive validation process that enables fast deployment of next-generation platforms to

maximize competitive advantage while minimizing development risks. It features integrated graphics utilizing Intel®Extreme

Graphics 2 technology, enhanced sound quality and AGP 4X support, along with advanced packaging technology and

industry-leading electrical design innovations to deliver long-term system reliability over wide operating conditions. Three

USB host controllers provide high-performance peripherals with 480 Mbps of bandwidth, while enabling support for up to

six USB 2.0 ports. This results in a signiﬁcant increase over previous integrated 1-4 port hubs at 12 Mbps.

PRODUCT NAME PRODUCT CODE PACKAGING FEATURES

852GME Memory RG82852GME 732 micro-FC-BGA DDR266/333 Memory

Controller Hub (GMCH) Integrated graphics support

400 MHz or 533 MHz System Bus

I/O Controller Hub 4 FW82801DB 421 micro-BGA Direct connection to MCH with Intel®Accelerated Hub Architecture

Supports 32-bit PCI

IDE controllers with ATA/100

Six USB ports with USB 2.0 support

AC’97 controller with 20-bit audio support

Integrated LAN connect interface

Processors and Chipsets developer.intel.com/design/intarch

Intel®855GME Chipset

The Intel®855GME Chipset for Embedded Computing is an optimized integrated graphics solution featuring low-power

design. A 400 MHz system bus and integrated 32-bit 3D core at 133 MHz, support the Intel®Pentium®M processor and

associated microarchitecture and up to 2 GB of DDR333 system memory, providing the performance and high scalability

required for today’s cutting-edge embedded computing applications. The Intel 855GME chipset is part of Intel’s

comprehensive validation process that enables fast deployment of next-generation platforms to maximize competitive

advantage while minimizing development risks. It features integrated graphics utilizing Intel®Extreme Graphics 2 technology

and AGP 4X support, along with advanced packaging technology and industry-leading electrical design innovations to deliver

long-term system reliability over wide operating conditions. Three USB host controllers provide high-performance

peripherals with 480 Mbps of bandwidth, while enabling support for up to six USB 2.0 ports. Intel®Application Accelerator

software provides additional performance over native ATA drivers by improving I/O transfer rates and enabling faster O/S

load time, resulting in accelerated boot times. Communication and Network Riser (CNR) offers ﬂexibility in system

conﬁguration with a baseline feature set that can be upgraded with an audio card, modem card, or network card. Error

Correcting Code (ECC) support is available in integrated graphics mode only.

PRODUCT PRODUCT CODE PACKAGE FEATURES

855GME Memory RG82855GME 732 micro-FC-BGA 400 MHz system bus

Controller Hub (GMCH) DDR333 Memory

Integrated graphics support

I/O Controller Hub 4 FW82801DB 421 micro-BGA Direct connection to MCH with Intel®Accelerated Hub Architecture

Supports 32-bit PCI

IDE controllers with ATA/100

Six USB ports with USB 2.0 support

AC’97 controller with 20-bit audio support

Integrated LAN connect interface

Intel®6300ESB I/O Controller Hub

The Intel®6300ESB I/O Controller Hub (ICH) supports development of next-generation solutions for the communications

and general embedded market segments. It is designed for use with the Intel®875P Memory Controller Hub (MCH) and

the Intel®855GME Graphics Memory Controller Hub (GMCH), providing board designers with a variety of platform options

to address price, performance and packaging needs. The Intel 6300ESB ICH can be designed into platforms with processors

ranging from the Intel®Pentium®M processor to Intel®Celeron®and Intel®Pentium®4 processors, in socket 478 packaging.

PSB conﬁgurations are available at 400 MHz, 533 MHz and 800 MHz. The 6300ESB ICH is a derivative of the Intel®

82801EB (ICH5) and builds upon the ICH5 design by improving bandwidth via PCI-X 64/66 and PCI 32/33 support. It also

provides port 60/64 emulation, dual 16500-compatible UARTs for overall BOM cost savings, a two-stage watchdog timer,

and 37 GPIOs including four High Drive GPIOs. The Intel 6300ESB ICH and associated drivers help reduce support and

validation costs, and offer a variety of sell-up opportunities while still providing ﬂexibility and performance at value pricing.

Flexible memory support allows for 200, 266, 333 or 400 MHz DDR SDRAM to be designed in, enabling cost-effective,

high-volume memory.

PRODUCT PRODUCT CODE PACKAGE FEATURES

Intel®6300ESB FWE6300ESB 689 µBGA Direct connection to the GMCH via Hublink 1.5

I/O Controller Hub Designed for use with the Intel®875P MCH and Intel®855GME GMCH

PCI-X 64/66 and PCI 32/33 support

Dual integrated UARTS

PATA/100 and SATA/150 support

Four USB 2.0 ports

developer.intel.com/design/intarch Processors and Chipsets

Intel®E7500 and E7501 Chipsets

The Intel®E7500 chipset and E7501 chipset are validated with the Intel Xeon processor with 512 KB L2 Cache and the

Low Voltage Intel Xeon processor. This chipset design delivers maximized system bus, memory, and I/O bandwidth to

enhance performance, scalability, and end-user productivity. ECC protection, coupled with high data transfer rates, supports

I/O segments with greater reliability and faster access to high-speed networks. Four DIMMs per channel (eight DIMMs total)

allow a maximum memory conﬁguration of 16 GB. Single or dual DDR200 or DDR266 memory channels are supported for

up to 4.3 GB/s of memory bandwidth. Up to three 64-bit PCI/PCI-X Controller Hub 2.0 (P64H2) devices can connect to the

MCH, each providing a maximum bandwidth greater than 1 GB/s. Each P64H2 contains two independent 64-bit, 133 MHz

PCI-X interfaces and two PCI hot-plug controllers.

INTEL®E7500 CHIPSET

PRODUCT PRODUCT CODE PACKAGE FEATURES

Intel®E7500 Memory Controller Hub (MCH) RGEE7500PL 1005 FC-BGA 400 MHz System Bus

Advanced Platform RASUM, ECC

Integrated Controller Hub (ICH3-S) FW82801CA 421 BGA 64-bit PCI/PCI-X Controller Hub-2 allows up to 6 PCI-X buses per system

64-bit PCI/PCI-X Controller (P64H2) RG82870P2 567 FC-BGA Dual-channel DDR200 memory interface for up to 3.2 GB/s memory bandwidth

Uni or dual-processor capable

ECC, parity for application critical environments

INTEL®E7501 CHIPSET

PRODUCT PRODUCT CODE PACKAGE FEATURES

Intel®E7501 Memory Controller Hub (MCH) RGE7501MC 1005 FC-BGA 400/533 MHz System Bus

Advanced Platform RASUM

Integrated Controller Hub (ICH3-S) FW82801CA 421 BGA 64-bit PCI/PCI-X Controller Hub-2 allows up to 6 PCI-X buses per system

64-bit PCI/PCI-X Controller (P64H2) RG82870P2 567 FC-BGA Dual-channel DDR266 memory interface for up to 4.3 GB/s memory bandwidth

Uni or dual-processor capable

ECC, parity for application critical environments

Intel®845, Intel®845E and Intel®845GV Chipsets

The Intel®845 chipset family is designed, validated, and optimized for the Intel Pentium 4 processor with Intel NetBurst

microarchitecture, using proven and established building blocks. Intel 845 chipset-based platforms extend the capabilities

of the Intel Pentium 4 processor with an excellent balance of price and performance for embedded computing segments.

PRODUCT PRODUCT CODE PACKAGE FEATURES

Intel®82845 Memory Controller Hub (MCH) RG82845 593 FC-BGA 400 MHz System Bus

SDR PC133, 3GB max

DDR1600/2100 Memory, 2GB max

AGP4X interface enables over 1 GB/s of graphics bandwidth

ECC, parity for application critical environments

PCI 2.2

Intel®82845E Memory Controller Hub (MCH) RG82845E 593 FC-BGA 400/533 MHz System Bus

DDR200/266 Memory, 2GB max

AGP4X interface enables over 1GB/s of graphics bandwidth

ECC, parity for application critical environments

PCI 2.2

Intel®82845GV Memory Controller Hub (GMCH) RG82845GV 760 FC-BGA 400/533 MHz System Bus

SDR PC133, 2GB max

DDR200/266/333 Memory, 2GB max; 2 DIMM, No ECC

Integrated Intel®Extreme Graphics

I/O Controller Hub 2 (ICH-2) FW82801BA 360 EGBA Direct connection to Intel 82845 MCH with Intel®Accelerated Hub Architecture

for 845 MCH only Supports 32-bit PCI

IDE controllers with ATA/100

Four USB ports, USB 1.1 compliant

AC’97 controller with 6-channel sound

Integrated LAN connect interface

I/O Controller Hub 4 (ICH-4) FW82801DB 421 BGA Direct connection to Intel 82845E and Intel 82845GV MCH with Intel®Accelerated Hub Architecture

for 845E and 845GV only Supports 32-bit PCI

IDE controllers with ATA/100

Six USB ports with USB 2.0 support

AC’97 controller with 6-channel sound

Integrated LAN connect interface

Processors and Chipsets developer.intel.com/design/intarch

Intel®82801E C-ICH

The Intel®82801E C-I/O Controller Hub (ICH) is speciﬁcally suited for use within the communications and network

appliance market segments. It is designed for use with a variety of Graphics Memory Controller Hubs (GMCHs)

providing board designers with outstanding scalability in a single board design. The Intel 82801E C-ICH can be designed

into embedded computing platforms with processors that range from the Intel Pentium III to Intel Celeron processors.

PRODUCT PRODUCT CODE PACKAGE FEATURES

Intel®82801E Communications FW82801E 421 BGA Direct connection to the GMCH with Intel®Accelerated Hub Architecture

I/O Controller Hub (C-ICH) Designed for use with the Intel®810, Intel®815E, and Intel®815 GMCHs

Dual Integrated MACs and Dual Integrated UARTs for overall system cost savings

Supports 32-bit PCI

IDE Controllers with ATA/100

Two USB ports

Intel®840 Chipset

The Intel 840 chipset is validated with the Intel Pentium III processor and features support for 100 or 133 MHz system bus

speeds, single- or dual-processor conﬁguration, ECC on memory, high memory bandwidth, large memory capacity, AGP

4X, and a second PCI bus (64-bit/66 MHz) for high-performance I/O.

PRODUCT PRODUCT CODE PACKAGE FEATURES

Memory Control Hub (MCH) FW82840 544 BGA Dual processing capability

Dual memory channels for up to 3.2Gbps memory bandwidth

16-bit wide implementation of accelerated hub architecture for high-performance concurrent

PCI I/O with the P64H

AGP 4X port

I/O Control Hub (ICH) FW82801AA 241 BGA Direct connection to the MCH with Intel®Accelerated Hub Architecture

Supports 32-bit PCI

IDE controllers

Dual USB ports

4 MB Firmware Hub* N82802AB PLCC System BIOS and video BIOS

Contact your local Intel ﬁeld sales Intel Random Number Generator (RNG) for stronger encryption, digital signing, and security

representative for product availability protocols

8 MB Firmware Hub* E82802AC TSOP System BIOS and video BIOS

N82802AC PLCC Intel®Random Number Generator (RNG) for stronger encryption, digital signing, and security

protocols

*Must be purchased as separate component

Optional components of the Intel®840 chipset:

64-bit PCI Controller Hub (P64H) FW82806AA 241 BGA Supports 64-bit PCI slots at speeds of either 33 or 66 MHz

Connects directly to MCH using Intel Accelerated Hub Architecture

Dedicated path for high-performance I/O

RDRAM Memory Repeater Hub (MRH-R) FW82803AA 324 BGA Converts each memory channel into two for expanded memory capacity

developer.intel.com/design/intarch Processors and Chipsets

Intel®815 and Intel®815E Chipsets

The Intel 815 and Intel 815E chipsets provide the highest degree of processor scalability supporting the Intel Celeron

processor at 566 MHz to the Intel Pentium III processor with 512K cache at 1.26 GHz. The chipsets support processor

side bus speeds of 66, 100 and 133 MHz. The Intel 815 and Intel 815E chipsets also provide graphics scalability through the

use of Intel®graphics, an add-in Graphics Performance Accelerator (GPA) card, or an add-in AGP 4X card.

PRODUCT PRODUCT CODE PACKAGE FEATURES

Graphics and AGP Memory FW82815 544 BGA Intel®Accelerated Hub Architecture

Controller Hub (GMCH) 133/100/66 MHz PSB

PC133/100 SDRAM, No ECC

Integrated scalable graphics

Intel®3D graphics with direct AGP

Overall BOM cost savings

External AGP port with the option for up to 4 MB of dedicated display cache video memory

I/O Control Hub (ICH) FW82801AA 241 BGA Direct connection to the GMCH with Intel Accelerated Hub Architecture

for Intel®815 Supports 32-bit PCI

IDE Controllers with ATA66

Dual USB ports

AC’97 controller with 4 Channel Sound

I/O Control Hub 2 (ICH2) FW82801BA 360 EBGA Direct connection to the GMCH with Intel Accelerated Hub Architecture

for Intel®815E Supports 32-bit PCI

IDE Controllers with ATA100

Four USB ports

AC’97 controller with 6-Channel Sound

Integrated MAC

4 MB Firmware Hub* N82802AB PLCC System BIOS and video BIOS

Contact your local Intel ﬁeld sales Intel®Random Number Generator (RNG) for stronger encryption, digital signing, and security protocols

representative for product availability

8 MB Firmware Hub* E82802AC TSOP System BIOS and video BIOS

N82802AC PLCC Intel Random Number Generator (RNG) for stronger encryption, digital signing, and security protocols

*Must be purchased as separate component

Intel®810 and Intel®810E2 Chipsets

The Intel 810 chipset provides processor scalability supporting the Intel Celeron processor at 300 MHz to the Intel

Pentium III processor at 800 MHz and above, with processor side bus speeds of 66 and 100 MHz. The Intel 810E2

chipset adds support for 133 MHz processor side bus speed. These chipsets optimize system memory arbitration, similar to

AGP technology, resulting in a more responsive and cost-effective system. They help reduce overall system cost by

integrating graphics into the memory controller.

PRODUCT PRODUCT CODE PACKAGE FEATURES

Intel®810 Graphics and AGP Memory FW82810 421 BGA Intel®Accelerated Hub Architecture

Controller Hub (GMCH) 66/100 MHz PSB, PC66/100 SDRAM, No ECC

Intel®3D graphics with Direct AGP

Overall BOM cost savings

Intel®810E2 Graphics and AGP FW82810E 421 BGA Intel Accelerated Hub Architecture

Memory Controller Hub (GMCH) 66/100 MHz PSB, PC66/100 SDRAM, No ECC

Intel 3D graphics with Direct AGP

Overall BOM cost savings

Optional 4MB of dedicated display cache video memory (100 or 133 MHz)

I/O Control Hub (ICH) FW82801AA 241 BGA Direct connection to the GMCH with Intel Accelerated Hub Architecture

for Intel®810 Supports 32-bit PCI

IDE Controllers with ATA66

Dual USB ports

AC’97 controller with 4-channel sound

I/O Control Hub 2 (ICH2) FW82801BA 360 EBGA Direct connection to the GMCH with Intel Accelerated Hub Architecture

for Intel®810E2 Supports 32-bit PCI

IDE Controllers with ATA100

Four USB ports

AC’97 controller with 6-channel sound

Integrated MAC

4 MB Firmware Hub* N82802AB PLCC System BIOS and video BIOS

Contact your local Intel ﬁeld sales Intel®Random Number Generator (RNG) for stronger encryption, digital signing, and security protocols

representative for product availability

8 MB Firmware Hub* E82802AC TSOP System BIOS and video BIOS

N82802AC PLCC Intel Random Number Generator (RNG) for stronger encryption, digital signing, and security protocols

*Must be purchased as separate component

Processors and Chipsets developer.intel.com/design/intarch

Intel®440BX AGPset

The Intel Pentium III processor, Intel Pentium III processor—Low Power, Intel Pentium II processor—Low Power, Intel

Celeron processor and Intel Celeron processor—Low Power families are supported by the Intel 440BX AGPset. The

system controller provides support for SDRAM, the interface to the PCI bus, and the interface to the AGP port. The PIIX4E

provides the PCI to ISA interface, USB support, and many other features necessary to maintain PC compatibility. The Intel

440BX AGPset operates at both 66 and 100 MHz, providing plenty of headroom for future generations of Intel Pentium III

and Intel Celeron processors. Both chips in the Intel 440BX AGPset use a BGA package providing improved layout and

signal integrity.

PRODUCT PRODUCT CODE PACKAGE FEATURES

Intel®440BX Northbridge FW82443BX 1 x 492 BGA AGPset support, 66/100 MHz SDRAM, 66/100 MHz PSB

Intel®PIIX4E Southbridge FW82371EB 1 x PIIX4E 324 BGA USB Support

ACPI-compliant power management

ECC, parity for application critical environments

Concurrent PCI

Intel®440MX PCIset

The Intel 440MX is a low-power, single-component chipset speciﬁcally designed to reduce system cost, space and power.

The Intel 440MX chipset supports low-power Intel Celeron and Intel Pentium III designs. The Intel 440MX is offered in

the small form factor, 492 Ball Grid Array (BGA) package with a typical power dissipation of 2.1W making it an effective

solution for fanless applications.

PRODUCT PRODUCT CODE PACKAGE FEATURES

Intel®440MX FW82443MX100 492 BGA Combines the Intel®440BX AGPset core architecture and PIIX4 southbridge into a single chip

Advanced power management features

AC’97 link interface based on Intel®AC’97 Speciﬁcation v 2.1

PC100 SDRAM and ECC

100 MHz PSB

Intel®PCIsets

The Intel®430TX PCIset is a high integration two-chip solution with BGA packaging, which minimizes board real estate

requirements while reducing failure points. It closes the power consumption gap and enables new applications by

delivering mobile-style power management with the highest performance. The Intel 430TX PCIset is available in extended

temperature range (-40° to +115°C), which enables a complete solution when joined with the 166 MHz lower-power Intel

Pentium processor extended temperature version.

The Intel®430HX PCIset is a two-chip solution featuring uncompromised EDO memory timings, optimized CPU to PCI

performance, additional buffering and arbitration and writeback enhancements. The Intel 430HX PCIset also supports USB,

ECC and parity.

PRODUCT PRODUCT CODE PACKAGE FEATURES

Intel®430HX Northbridge FW824391HX 1 X TXC 324 BGA PCI 2.1, 64 Mbit DRAM, 66 MHz PSB, No ECC

Intel®PIIX3 Southbridge SB82371SB 1 X PIIX3 208 QFP L2 cache controller

Concurrent PCI

USB support

ECC, parity for application critical environments

Intel®430TX Northbridge FW82439TX 1 X MTXC PCI 2.1, 66 MHz PSB, SDRAM, No ECC

324 BGA

Intel®PIIX4E Southbridge FW82371EB 1 X PIIX4E L2 cache controller

324 BGA Optimized for Pentium®processor with MMX™technology

Dynamic Power Management Architecture

SDRAM Support

USB Support

Concurrent PCI

Ultra DMA hard drive protocol

developer.intel.com/design/intarch Processors and Chipsets

EMBEDDED INTEL®REFERENCE DESIGNS AND CONFIGURATIONS

Embedded Intel Architecture reference designs support developers in a variety of market segments, including

communications, storage, interactive clients, learning solutions, and print imaging. These reference designs may be used

off-the-shelf as a market-ready design, or further customized to support additional value-added features. This allows

developers to focus technical resources on strategic product innovation and customized applications in order to accelerate

time-to-market while reducing the risk of hardware development.

Schematics are available for download at no cost from Intel’s Developer Web site. In addition, Intel’s growing family of

reference designs provides these key beneﬁts:

■Accelerated and economical implementation of leading-edge technologies

■Shortened platform selection and design cycle

■Simpliﬁed customization with scalable and ﬂexible platforms

■Extended component life cycles and broad software application support

Reference Designs for Communications

http://developer.intel.com/platforms/applied/eiacomm/reference_conﬁgs.htm

Intel provides building blocks that work together in speciﬁc conﬁgurations to accelerate development of networked storage

and other communications applications, including load balancing, network attached storage and storage area networking

equipment, network security, Virtual Private Networks, Voice over IP (VoIP), and Web caching. With these proof-of-concept

designs, including downloadable schematics, developers can quickly develop boards that scale in processor and I/O

performance.

COMMUNICATIONS APPLIANCE REFERENCE DESIGNS

PRODUCT PROCESSOR SPEED CHIPSET ETHERNET CATEGORY

Performance Intel®Pentium®M processor 1.6 GHz Intel E7501 82546, 82551 Performance

Communications Appliance

Intel®E7501 Dual Intel®Xeon™processors or Low Voltage 1.6–2.4 GHz Intel E7501 82559, 82554GC Performance

Intel Xeon processors

Intel®845E Intel®Pentium®4 processor or Mobile 1.7–2.4 GHz Intel 845E 82551QM, 82540EM Value

Intel®Pentium®4 processor-M

Intel®Communications Intel®Celeron®or Intel®Pentium®III processors 566 MHz–1.26 GHz Intel®815E GMCH 82559, 82562ET Value

ICH +82801E C-ICH

Intel®815E Intel Celeron or Intel Pentium III processor 566–733 MHz Intel 815E 82559ER, 82562ET Value

Intel®810 Intel Celeron or Intel Pentium III processor 300–700 MHz Intel 810 82559ER Value

Intel®815E Entry Ultra Low Voltage Intel Celeron processor 400–650 MHz Intel 815E 82551ER Entry

Intel®440MX Entry-Level Intel Celeron processor—Low Power 400 MHz Intel 440MX 82559ER Entry

Intel®440BX Entry-Level Intel Celeron processor 300A 300 MHz Intel 440BX/PIIX4E 82559ER Entry

INTEL®NETSTRUCTURE™BOARD REFERENCE DESIGNS

PRODUCT PROCESSOR SPEED CHIPSET ETHERNET ETHERNET PORTS

ZT 5524 High Performance Dual Intel®Pentium®III Processors 933 MHz ServerWorks* LE 82546, 82550 Dual Gigabit

with 512K L2 Cache

ZT 5515 Value Intel®Pentium®4 processor-M 1.2 GHz Intel®845E 82546 Dual Gigabit

BLADE REFERENCE CONFIGURATION

PRODUCT PROCESSOR SPEED CHIPSET ETHERNET CATEGORY

Intel®440MX Entry PrPMC Ultra Low Voltage Intel®Celeron®processor 300–700 MHz Intel®440MX NA Entry

or Intel®Pentium®III processor—Low Power

Processors and Chipsets developer.intel.com/design/intarch

Interactive Client Reference Conﬁgurations

http://developer.intel.com/design/intarch/platforms/iaclient/reference_conﬁgs.htm

Interactive Clients are widely used in a variety of market segments including retail, hospitality and other environments

where ﬁnancial, information, or other transactions take place. Applications for interactive clients are evolving from the

simple act of processing ﬁnancial transactions, such as at a cash register or ATM, to becoming an integral part of the business

environment. Interactive Clients are now being used to interface to other enterprise resources for business-critical applications

such as targeted marketing, Customer Relationship Marketing (CRM), labor management, and employee training. Kiosks and

other self-service terminals are being rapidly deployed to provide more customer access points on-premises, or to provide

access to goods or services that are not immediately available on-site. Interactive Client development also includes the

integration of numerous peripherals a system might use, including network interfaces, audio, LCD touch screens, pole

displays, cash drawers, scanners, printers, and other peripherals.

PRODUCT PROCESSOR SPEED CHIPSET ETHERNET CATEGORY

Intel®852 with Intel Pentium 4 processor 2.0 to 2.6 GHz Intel®852GME chipset 82551QM, 82540EM, Performance Scalability

Intel®Pentium®4 processor with ICH4 82562EZ

Intel®845E Intel Pentium 4 processor and Up to 2.53 GHz Intel 845E 82551 Performance

Intel®Pentium®4 Processor-M

Intel®815E Ultra Low Voltage Intel®Celeron®processor 400–650 MHz Intel 815E 82551ER Low-Power

Intel®815 Intel Pentium III or Intel Celeron processor 566–866 MHz Intel 815 82562ET Value

Intel®810 Intel Pentium III or Intel Celeron processor 300–850 MHz Intel 810 82559ER Value

Embedded Client

Intel 810 Intel Pentium III or Intel Celeron processor 566–866 MHz Intel 810 82562ET Value

Intel®Print Imaging Reference Conﬁgurations

http://developer.intel.com/design/intarch/platforms/printimg/reference_conﬁgs.htm

Increasing pages per minute and transition to color are driving the need for increased CPU performance and Intel®Print

Imaging solutions continue to bring increasing beneﬁt to the enterprise. These high-performance, scalable, and low-power

Print Imaging reference conﬁgurations offer:

■High performance, high I/O bandwidth and maximum CPU performance, ideal for high I/O bandwidth applications such

as high-speed color commercial print solutions.

■Scalability, performance and value, designed for applications such as midrange multi-function units and digital copiers.

■Low power and value, intended for low-power and fanless applications such as entry-level color laser and fast

monochrome printers.

PRODUCT PROCESSOR SPEED CHIPSET ETHERNET CATEGORY

Intel®E7501 Intel®Xeon™processor 2.0 GHz Intel E7501 82551, 82559 High Performance

Intel®845GV Intel®Pentium®4 or Intel®Celeron®processor 2.0 GHz Intel 845GV 82551, 82559 Scalable

Intel®845E Intel Pentium 4 or Intel Celeron processor 1.7–2.2 GHz Intel 845E 82551, 82559 Scalable

Intel®815E Intel®Pentium®III or Intel Celeron processor 1.26 GHz Intel 815E 82551, 82559 Low Power

developer.intel.com/design/intarch Processors and Chipsets

Reference Conﬁguration for Student Learning Station

http://developer.intel.com/platforms/applied/studentstation/reference_conﬁg.htm

Intel Architecture-based processors, chipsets and other components can be used in designs for student learning

terminals.

PRODUCT PROCESSOR SPEED CHIPSET ETHERNET CATEGORY

Student Computing Station Intel®Celeron®processor 300A, 366, 433 MHz Intel®810 GD 82559 Entry

Development Kits

Intel provides a wide selection of development kits to support the products on its roadmap. These kits are offered with

supporting documents and evaluation software from independent software vendors. Intel’s development kits are designed

to minimize the customers’ development efforts and facilitate quick time-to-market.

PRODUCT NUMBER PRODUCT NAME PROCESSOR SUPPORT CHIPSET PACKAGING MEMORY

EID875PDEVKIT Intel®875P MCH with Intel®6300ESB ICH Chipset Intel®Pentium®4 processor, Intel 875P MCH and 478 µFC-PGA Up to 4GB DDR SDRAM

Intel®Pentium®4 Processor Intel 6300ESB ICH at 400/333/266 MHz

with Hyper-Threading

Technology or Intel®Celeron®

processor

EIDPM855FBDVKT Intel®Pentium®M Processor with Intel Pentium M processor Intel 855GME GMCH 478 µFC-PGA 200/266/300 MHz

Intel®855GME MCH and Intel at 1.6 GHz and Intel 6300ESB ICH DDR SDRAM

6300ESB ICH Chipset

EIDPM855HDDVKT Intel Pentium M Processor with Intel Pentium M processor Intel 855GME GMCH 478 µFC-PGA 2GB or 266

Intel 855GME and Intel®FW82801DB at 1.6 GHz DDR SDRAM

EIDPME7501DEVKIT Intel Pentium M processor with Intel Pentium M processor Intel E7501 chipset 478 µFC-PGA 2 GB or 266 MHz

Intel®E7501 at 1.6 GHz DDR SDRAM

EIDXE7501DEVKIT Intel E7501 Scalable Performance Board Dual Low Voltage Intel®Xeon™Intel®E7501 Socket 604 256 MB DDR, expandable

processors (1.6 GHz) or Dual to 8 GB DDR

Intel Xeon processor (2.4 GHz)

EIAP3840DEVKIT Intel®Pentium®III Processor/Intel®840 Dual Intel Pentium III processors Intel 840 w/MCH, FC-PGA Dual 64 MB RDRAM

(866 MHz) ICH, P64H and FWH RIMMS

EIDP3815BDEVKIT Intel®815E Scalable Performance Board Intel®Celeron®processor Intel 815/815E FC-PGA or PC-PGA2 128 MB SDRAM, expandable

(566 MHz) through Intel to 512 MB SDRAM

Pentium III processor (1.26 GHz)

EIAP3FMBDEVKIT Intel®440BX Scalable Performance Board Intel Pentium III processor Intel 440BX AGPset PC-PGA 32 MB SDRAM

(850 MHz)

EIACEL18FMBDVKT Intel 440BX Scalable Performance Board Intel Pentium III processor Intel 440BX AGPset PC-PGA 32 MB SDRAM

(850 MHz) or Intel Celeron

processor (850 MHz)

EIACEL25FMBDVKT Intel 440BX Scalable Performance Board Intel Pentium III processor Intel 440BX AGPset PC-PGA 32 MB SDRAM

(850 MHz) or Intel Celeron

processor (433MHz)

EIDPLPMXDEVKIT Intel®440MX Scalable Low Power Board Intel Celeron processor— Intel 440MX AGPset µPGA 128 MB SDRAM, expandable

Ultra Low Power (700 MHz) to 256 MB SDRAM

or Intel Pentium III processor—

Low Power (500 or 700 MHz)

EID845GVDEVKIT Intel®845GV Scalable Performance Board Intel Celeron processor (2.0 GHz) Intel 845GV Socket 478 256 MB DDR, expandable

to 2 GB DDR

Processors and Chipsets developer.intel.com/design

Intel

Personal Internet Client Architecture

Accelerating Wireless Application Development

The convergence of wireless phones and handheld digital devices is advancing daily. To keep pace with this wave of

next-generation wireless devices, development of hardware and software must be able to occur along separate paths.

The open architectural framework of the Intel®Personal Internet Client Architecture (Intel®PCA) allows separate

development of applications and communication subsystems and speeds development and deployment of wireless Internet

devices, applications, and services. It helps enable you to innovate new wireless Internet devices, applications, and services

faster than ever before.

Design Independence

Intel PCA decouples the applications subsystem from the communication subsystem through an open physical and logical

bus interface, while providing a link to memory subsystem.

The beneﬁt: you can now drive application development to improve functionality and reduce time-to-market, with

independence from communication standards.

Outstanding Flexibility

Intel PCA framework enables you to design a single platform to support a broad range of products, from cell phones and

smart phones to PDAs and automotive clients. Intel PCA supports application compatibility across multiple levels of

hardware integration to protect your platform design and software investments.

The beneﬁt: Intel PCA provides consumer and corporate users greater availability of applications, broader deployment of

services and networks, and more capable wireless platforms. Applications developers will beneﬁt from shorter development

cycles and an open architecture that allows for rapid adaptation of applications across platforms and devices, resulting in

faster time-to-market.

It’s these beneﬁts that make it easy to understand why Intel PCA has such wide industry support.

INTEL®PCA PRODUCTS

Intel PCA Application Processors: Intel PCA processors, based on the Intel XScale®microarchitecture, deliver advanced

integration, leadership multimedia performance and superior power savings for full-featured wireless cell phones,

communicators and PDAs.

INTEL®PXA27X PROCESSOR FAMILY

The Intel®PXA27x processors are the ﬁrst Intel XScale technology-based processors to include Intel®Wireless MMX™

technology to enable high-performance multimedia acceleration with an industry proven instruction set.

Building Tomorrow’s Handheld Today

Designed from the ground up for wireless clients and incorporating the latest Intel advances in mobile technology, the

Intel PXA27x processor family redeﬁnes what a wireless handheld can do by incorporating innovative new features

while borrowing and enhancing others from the world of the PC. The Intel PXA27x processors are the ﬁrst Intel XScale

technology-based processors to include Intel Wireless MMX technology to enable high-performance multimedia acceleration

developer.intel.com/design Processors and Chipsets

with an industry proven instruction set. Another innovative feature is the Intel®Quick Capture Technology which provides

one of the industry’s most ﬂexible and powerful camera interfaces for capturing digital images and video. And while

performance abounds in the Intel PXA27x processor, power consumption is also a critical component. The new

capabilities of Wireless Intel SpeedStep®Technology provide a quantum leap forward in low-power operation. Finally, the

Intel PXA27x family stacks Intel StrataFlash®memory and low-power SDRAM with the processor for more functionality

in a smaller footprint.

Advanced Multimedia Capability

Instead of using additional processors or accelerators that can reduce battery life, Intel Wireless MMX technology provides

an advanced set of multimedia instructions that will help bring desktop-like multimedia performance to Intel PXA27x

processor-based clients while minimizing the power needed to run rich applications. Intel Wireless MMX technology builds

on the Intel®MMX™technology originally introduced in the Pentium®processor family, enabling the large number of

software developers already familiar with these instructions to quickly make their applications such as 2-D and 3-D gaming,

streaming MPEG4 video, wireless encryption/decryption, Digital TV reception and voice recognition available for

Intel®-based cell phones and PDAs.

High-Quality Pictures and Video on a Cell Phone, PDA

The ability to send and receive digital pictures or video clips has been one of the fastest-growing developments in the cell

phone and PDA segments worldwide. Intel Quick Capture Technology, an interface that allows imaging capabilities to be

incorporated into phones and PDAs, improves image quality and reduces the overall cost of adding digital image capabilities

to mobile devices.

Intel Quick Capture Technology is designed to provide the ability to capture live video and high-quality still images from

a wide range of camera sensors in current and future camera-enabled mobile handsets and PDAs. Performing the image

processing on the Intel PXA27x processor reduces the need for an external preprocessor, helping save both on cost and

power. Intel Quick Capture Technology consists of three primary modes of operation: Quick View mode (providing low-

power, real-time previews), Quick Shot mode (providing high-resolution image capture up to 4+ megapixels) and Quick

Video mode (providing full-motion, high-quality video capture).

Steps to Lowering Power

First available in the Intel PXA27x processor family, Wireless Intel SpeedStep Technology provides the ability to

dynamically adjust the power and performance of the processor based on CPU demand. This can result in a signiﬁcant

decrease in power consumption for wireless handheld devices to increase standby and talk-time.

Wireless Intel SpeedStep Technology advances the capabilities of functions already built into the Intel XScale

microarchitecture by incorporating three new low-power states and using advanced Wireless Intel SpeedStep Power

Manager Software to intelligently manage the power and performance needs for the end user. The technology is able to

change both voltage and frequency on-the-ﬂy, saving additional power while still providing the necessary performance

to run rich applications.

Processors and Chipsets developer.intel.com/design

Using Wireless Data Faster

Hooking up application processors to communications products today is a non-standard, high-power, and slow

performing prospect. Enter Intel®Mobile Scalable Link (Intel®MSL) a next-generation, scalable, and low-power

communications link between application processors and communication processors. This dedicated link was created by

Intel to help meet industry requirements for a high-speed interface to supply next-generation clients with data from next-

generation networks. Intel MSL supports multiplexed interfaces for data and voice, while supporting up to 14 simultaneous

transfers at speeds of up to 416Mbps. The result is quicker development times for faster time-to-market, longer battery life,

and improved real-time video telephony and multimedia streaming for clients. Intel MSL will be incorporated into all future

Intel®processor products designed for wireless, handheld devices.

Getting More from Less

In the wireless handheld market segment, space is everything. Customers are demanding thinner, lighter and more ﬂexible

handhelds that do not sacriﬁce features. The challenge is to integrate the features that customers want while simultaneously

reducing the size and weight of wireless handheld devices packaging. The Intel PXA27x processor family paves the way

toward thinner, lighter designs by stacking variations of Intel®Flash and low-power SDRAM in a space-saving 14x14-mm

package. The PXA27x processor family supports the tight space requirements for today’s 3G wireless handheld applications

while providing scalable solutions for tomorrow’s generation of platforms.

A Trusted Hardware Solution

The Intel PXA27x processor family incorporates the Intel®Wireless Trusted Platform that is designed to provide platform

trust and robust security services required for today’s wireless devices. Built around the concepts developed by the

Trusted Computing Group* (TCG) industry forum, Intel Wireless Trusted Platform is comprised of hardware and software

components that are designed to provide services such as secure boot, secure storage of private information and keys,

cryptographic acceleration, and key management support for common security protocols such as Virtual Private Networks

(VPN), Secure Sockets Layer (SSL), and Open Mobile Alliance Digital Rights Management (OMA-DRM). The Intel

Wireless Trusted Platform also provides the tools to enable OEMs to prevent the reprogramming of International Mobile

Equipment Identiﬁers (IMEI) thus helping reduce handset theft and fraud.

Development Ecosystem

Intel is a leader in creating comprehensive developer ecosystems for processors. The Intel PXA27x processor family

products are code compatible with all ARM* and Intel XScale technology-based solutions providing an opportunity for

developers and manufacturers to maintain their code investments. In addition, the Intel PXA27x family will be supported

by the ecosystem of reference platforms compilers, debuggers, code analyzers, codecs, and integrated primitives for

performance, graphics and security. In addition, Intel will make available OS board support packages that include drivers and

power management software for Linux, Palm* OS, Symbian*, Microsoft (CE.Net*, Smartphone* and Pocket PC*) as well as

Nucleus* and SavaJe*. A number of third-party applications developers are optimizing for Intel Wireless MMX technology

today, through Intel’s Wireless Competency Center’s worldwide. All this provides the manufacturer with one of the most

exhaustive choices of software and development hardware in the industry.

developer.intel.com/design Processors and Chipsets

The Intel®PXA27x Applications Processor Advantage

FEATURES BENEFITS

Intel XScale®Technology Highly scalable core up to 624 MHz

Secure Solution The Intel®Wireless Trusted Platform: Security trusted services such as

trusted boot, secure storage of private information, and support for security

protocols such as VPN, SSL, OMA, IMEI and OMA-DRM

Incredible Multimedia Familiar Intel®Wireless MMX™technology instructions designed for

high-performance multimedia, 3-D games and advanced video

Advanced Camera Interface Intel®Quick Capture technology supports 4+ Megapixel cameras for

capturing digital images, video and low-power, real-time previews

Enhanced LCD Controller Dual-Panel LCD up to 24-bit color. Hardware color space conversion with

256 Kbytes of on-chip SRAM for faster video. Two overlays to reduce

LCD bandwidth. Integrated with Intel Quick Capture technology to enable

fast video preview.

Reduced Power Consumption Wireless Intel SpeedStep®technology with ﬁve low-power modes can

change frequency and voltage dynamically. Wireless Intel SpeedStep

Power Manager software enables built-in, intelligent power management

Fast Access to Wireless Data Intel®Mobile Scalable Link provides up to 416 Mbps link between

communications and applications processors

Large Peripheral Set USB Host/Client

USB OTG

4-bit SD I/O

MMC/SDCard

Memory Stick

USIM card interface

Keypad controller

PCMCIA/CF

ICP

Memory Interface 100 MHz memory bus supports a variety of 1.8V, 2.5V, 3.0V and 3.3V

memory

Less Space For greater memory density and ﬂexibility

Up to 64 Mbytes Intel StrataFlash®Memory

32 Mbytes Intel StrataFlash and 32 Mbytes Low-Power SDRAM

Processors and Chipsets developer.intel.com/design

INTEL®PXA255 PROCESSORS

Wireless Internet Content at Intel Speed

Mobile and wireless devices simplify our lives, keep us entertained and increase productivity. Each day businesses

and individuals rely on them more and more. But, to continue satisfying ever-increasing customer demands to

communicate and access information anytime, anywhere, manufacturers need technologies that deliver high performance,

ﬂexibility and robust functionality—all in the small-size, low-power framework of portable, battery-powered products. The

Intel Personal Internet Client Architecture (Intel PCA) applications processors with Intel XScale technology push handheld

device functionality to new heights. With a seven-stage pipeline and faster processing speeds, these microprocessors enable

wireless devices to meet the performance demands of Enterprise-class wireless computing and feature-hungry technology

consumers. All while Intel’s power management capabilities deliver unparalleled operating efﬁciency. By reducing

component count and board space, lowering power consumption, minimizing system costs and shortening time-to-market,

Intel PCA applications processors deliver solid competitive advantage and superior handheld devices.

Intel®PXA255 High-Performance Applications Processor

Packing feature-rich devices with multimedia performance.

For advanced devices that run the most impactful mobile applications, the Intel®PXA255 Applications Processor is the

answer. This highly integrated, 32-bit RISC processor combines the efﬁciency of Intel design with the industry-standard

ARM* v.5TE instruction set architecture and the processing power of built-in multimedia capabilities for superior

performance and unmatched handheld functionality. This enables increased end-user functionality, the longest battery life and

a richer handheld Internet experience. Based on the Intel XScale technology, the Intel PXA255 cost-effectively boosts

processing speed and power management for one of the industry’s best MIPS/mW ratio. Larger memory caches and gated

clocks ensure faster functions with lower power dissipation. And the processing capabilities of the Intel PXA255 enable

portable devices to respond faster to optimized operating systems and performance-intensive applications like MP3 audio

decode, MPEG4 video decode, speech and handwriting recognition, and Java* interpretation. From surﬁng animated Web

sites to streaming video to mixing MP3s, the Intel PXA255 delivers processing power for superior performance.

The Development Framework for Wireless Advancement

Outstanding performance and low power consumption are only the beginning when you develop with the Intel PXA255

applications processor. Our robust software and hardware development environment offers a large library of ARM-

compliant applications and tools, as well as an array of wireless operating systems and tool chains to ease application

development and system prototyping. The Intel®Integrated Performance Primitives (Intel®IPP) library promises easy access

to an array of low-level, cross-platform software algorithms for high-demand communications, signal processing,

mathematics and media functions. The Intel IPP’s highly optimized implementation helps reduce battery consumption

through more efﬁcient CPU execution, enables developers to focus on value-add features, and speeds time-to-market.

With the Intel PCA development ecosystem, you have the resources you need to deliver the features your consumers want—

efﬁciently and effectively.

Intel®Personal Internet Client Architecture

The blueprint for next-generation wireless development

With Intel Personal Internet Client Architecture (Intel PCA), the next generation of wireless Internet devices,

applications and services are at hand. This open, standards-based architecture separates communication and

computing subsystems for parallel development of related wireless devices hardware and software. The scalability of the

Intel PCA platform ensures compatibility with leading operating systems and global wireless standards to make porting

applications or services across devices and platforms easy and efﬁcient. And with the superior performance of optimized

Intel®wireless hardware and software building blocks, Intel makes the promise of a dynamic, multimedia wireless

Internet a reality.

developer.intel.com/design Processors and Chipsets

The Intel PCA Developer Network offers device manufacturers, service providers and application developers easy access to

the applications, tools and services that speed market penetration and encourage consumer adoption of Intel PCA-based

products. This Web-based community offers platform and software development kits; programming tools; software building

blocks; technical information; marketing program opportunities; community networking; and market exposure to help

developers build value in their Intel PCA products, applications and services.

Intel®PXA255 At-A-Glance:

High Performance:

■ Low-power, high-performance 32-bit Intel XScale core-based CPU—200, 300, and 400MHz

■ ARM Architecture v.5TE compliant and application code compatible with Intel®SA1110 processor for rapid upgrade

■ Intel®Super pipelined RISC technology utilizing advanced Intel®0.18µ process for high core spees at low power

■ Intel®Media Processing Technology including 40-bit accumulator and 16-bit SIMD to enhance audio/video decode

performance

■ High-performance glue-less burst and page mode interfaces with Synchronous Intel StrataFlash®Memory

Low Power:

■ Low power and Turbo modes for optimal battery life

■ 32 KB data and 32 KB instruction caches

■ 2 KB Mini data cache for streaming data

■ Support for 2.5 and 3.3V memories

I/O Expansion:

■ Integrated Memory and PCMCIA/Compact Flash Controller with 100 MHz Memory Bus, 16-bit or 32-bit ROM/Flash/

SRAM (six banks), 16-bit or 32-bit SDRAM, SMROM (four banks), as well as PCMCIA and Compact Flash for added

functionality and expandability

■ System Control Module includes 17 dedicated general-purpose interruptible I/O ports, real-time clock, watchdog and

interval timers, power management controller, interrupt controller, reset controller, and two on-chip oscillators

Wireless:

■ Peripheral Control Module offers 16-channel conﬁgurable DMA controller, integrated LCD controller with unique DMA

for fast color screen support, Bluetooth* I/F, serial ports (IrDA, I2C*, I2S*, AC’97, three UARTs, SPI and SSP), USB

end point interface, and MMC/SD Card Support for expandable memory and I/O functionality

■ 17x17 mm 256-pin PBGA

The Intel®PXA255 Applications Processor Advantage

FEATURES BENEFITS

High-performance, low-power Intel XScale®core at 200, 300 Ideal for high-performance personal digital assistants and wireless

and 400 MHz. Micro-power management including low-power communicators

modes and Turbo mode application acceleration

Intel®Media Processing Technology Optimized audio and video multimedia functionality

Enhanced Memory Controller Supports lower power 2.5V and 3.3V 32-bit and 16-bit memories as well

as glue-less burst and page mode interfaces with Synchronous Intel

StrataFlash®Memory

MMC/SD and PCMCIA/CF Card support Expandable storage and I/O device support

USB Client Fast host synchronization

1.84 MHz cellular baseband interface Efﬁcient communications integration

920 Kbs Bluetooth* interface Broad inter-device communication

Variable latency I/O Add-on functionality capabilities

Processors and Chipsets developer.intel.com/design

INTEL®PXA26X PROCESSOR FAMILY

An ideal solution for the low-power, space-sensitive cellular phone market segment, the Intel®PXA26x processor family

takes portable multimedia processing and integrated memory to breakthrough application performance levels and

physical space savings. The Intel PXA26x processor family continues the promise of delivering leadership building blocks

based on the Intel Personal Internet Client Architecture (Intel PCA) for the wireless, handheld market segment.

The Intel®PXA261 and Intel®PXA262 processors are the ﬁrst Intel PCA processors based on Intel’s Multiple-Chip

Product (MCP) packaging technology. This innovative technology utilizes an Intel XScale technology-based processor with

integrated peripherals which are “stacked” in a single package with either 128 Mb (Intel PXA261) or 256 Mb (Intel PXA262)

of Intel StrataFlash memory utilizing an internal 16-bit wide memory data bus. This enables higher levels of integration and

space savings than previous generations of standalone products.

Based on Intel XScale technology, the Intel PXA26x processor family delivers high performance and low power, while

providing processing capabilities that allow wireless handsets to respond quickly to performance-intensive applications like

MPEG4 video decode, speech and handwriting recognition, and Java interpretation. Featuring integrated peripherals, the Intel

PXA261 and Intel PXA262 processors offer wireless designers expanded functionality, such as an integrated LCD controller

with its own Direct Memory Access (DMA) as well as Multi-Media, Secure Digital and CompactFlash (MMC/SD/CF) card

support for expandable memory and greater versatility.

A variety of communication ports, including Universal Serial Bus (USB), Infrared (IrDA), I2S and AC’97 audio codec

interfaces, high-speed Bluetooth* and Baseband interfaces, Universal Asynchronous Receive and Transmit (UART), and

Synchronous Serial Port (SSP) enable fast synchronization and communication with other devices.

Manufactured using Intel’s 0.18-micron process technology, the integrated Intel StrataFlash memory offers unprecedented

value, performance and reliability, and remains the industry’s lowest cost-per-bit NOR Flash memory solution featuring

2-bit-per-cell technology.

The Intel PXA26x processor family uses a small 13x13x1.4 mm package, reducing board space and placement costs by

using one integrated component instead of multiple discrete Flash and processor components. The Intel PXA26x processor

family also provides enhanced scalability within the same envelope, as all derivative conﬁgurations utilize the same package

and same ball footprint, eliminating the need to redesign a device’s main Printed Circuit Board (PCB).

Complementing the Intel PXA26x processor family is a robust software and hardware development environment.

Developers have access to a large library of ARM-compliant applications and tools plus an abundant set of key wireless

operating systems and tool chains, including real-time and interactive development systems. Developers can use these

resources to build libraries of new feature-rich, industry-leading applications for Intel XScale technology-based products and

reduce overall time-to-market.

Finally, Intel delivers Intel Integrated Performance Primitives (Intel IPP) for Intel XScale technology-based processors that

helps enable designers to develop applications that can be ported to run on any Intel®processor and the Intel®Flash Data

Integrator (Intel®FDI) for Intel StrataFlash Memory which helps designers enable handheld devices to handle the complex

features and demands of Internet storage data. This combination allows highly optimized platforms for wireless handheld

devices that incorporate all the beneﬁts of Intel PCA.

Key Applications

■ Data-enabled Cellular phones

■ Smartphones

■ Wireless Communicators

developer.intel.com/design Processors and Chipsets

The Intel®PXA26x Applications Processor Advantage

FEATURES BENEFITS

Multi-Chip Product Packaging Technology Helps reduce board size and placement costs by using one component

instead of three discrete components

Small package Features 13x13x1.4 mm package, 0.65 ball pitch, 294 balls

Scalability within same footprint Reduces design cycles by allowing derivative conﬁgurations (from high

end to entry level) in the same package and same ball footprint, helping

eliminate the need to redesign PCB and allows pin-for-pin drop-in

of alternate conﬁgurations

High-performance, low-power Intel XScale®core Ideal for wireless devices that require low power and advanced application

at 200 and 300 MHz performance. ARM* v.5TE ISA compliant

Micro-power management Offers low-power modes and “Turbo mode” application to improve

processing acceleration with efﬁcient power consumption

Intel®Media Processing Technology Helps optimize audio and video multimedia functionality through an

integrated 40-bit accumulator

Enhanced Memory Controller Supports lower power 2.5V to 3.3V 32- and 16-bit memories as well as

glue-less burst and page mode interfaces with Synchronous Intel

StrataFlash®memory

Storage Card support Supports industry-standard expandable storage and I/O devices, including

Multi-Media, Secure Digital and CompactFlash cards

USB Client Fast host synchronization with USB host

1.84 MHz cellular baseband interface Efﬁcient communications integration with celluar baseband

920 Kbs Bluetooth* interface Broad inter-device communication through industry-standard wireless link

Intel StrataFlash Memory 128 Mb or 256 Mb K3/L30 Utilizes reliable and proven two-bit-per-cell technology. High-performance

and high-density Intel®Flash memory. Synchronous burst mode

maximizes MIPS

Intel®PCA Cellular Processors: Intel PCA Cellular Processors are fully integrated cellular and application processors

that are at the heart of an advanced total system solution for today’s GSM/GPRS mobile phones. Intel PCA Cellular

Processors deliver leading-class performance, with industry-leading application headroom for voice and computation-

intensive data applications.

Intel®PXA800F Cellular processor: The Intel PXA800F Cellular Processor is designed for mainstream GSM/GPRS

handsets. This high-performance, power-efﬁcient processor integrates Intel XScale technology with Intel®On-Chip Flash

memory and Intel®Micro Signal Architecture, jointly developed with Analog Devices, Inc.*, delivers class-leading

performance, with industry-leading headroom to support computation-intensive voice and data applications for mainstream

mobile phones.

Product Highlights

■Full GSM/GPRS Class 12 solution

■High-performance/Low-power Intel XScale technology core, providing class-leading headroom for rich

data applications

■Intel Micro Signal Architecture

■Intel On-Chip Flash Memory

Processors and Chipsets developer.intel.com/design

Intel®PXA800F Cellular Processor Features Intel XScale®Technology

■High-performance, power-efﬁcient processor supports data-intensive applications

■Processor core operates at an adjustable clock frequency up to 312 MHz

■Instruction cache and Data cache memories

■4 MB integrated Intel On-Chip Flash memory

■512 KB integrated SRAM

■Memory controller supports synchronous Flash mode, page mode Flash, SRAM, SDRAM, and variable latency

■DMA controller

■Clock units—GSM slow clocking, GSM frame timing, watchdog, RTC

■Supports a wide range of standard interfaces—SIM, UART, USB, I2C, SPI, SSP, Digital Audio Interface,

MultiMediaCard, Secure Digital Card, Sony Memory Stick, Dallas* 1-Wire* Interface, keypad, PWM D/A, JTAG

■Interfaces for Bluetooth, IrDA, GPS and digital camera peripherals

■LCD Controller for up to 120 x 240 display 16-bit color or gray scale

Intel®Micro Signal Architecture

■Performs GSM/GPRS baseband signal processing

■Modiﬁed Harvard architecture, dual-MAC, deep pipeline, 104 MHz execution clock

■Instruction cache and 64 KB dual-banked data SRAM

■512 KB integrated Intel On-Chip Flash for ﬁeld-upgradable signal processing ﬁrmware

■Includes microprocessor instructions such as bit manipulation

■Includes cipher and Viterbi accelerators

■Multiple sleep modes and integrated power management minimize power consumption

■Interface support—digital I/Q, voice codec, auxiliary serial port for mixed-signal analog baseband, I2S audio codec

interface, RF synthesizer serial control interface, JTAG

Intel®On-Chip Flash Memory

■Single bit-per-cell NOR Flash stores data and allows code to be executed in place (XIP)

■All the on-chip memory required to run the GSM/GPRS protocol stack

■The entire RTOS and JVM could ﬁt in the on-chip Flash, accelerating performance and reducing power

■Potential to reduce memory latency issues with time-critical applications

Companion Chips: Companion chips are highly integrated and power-efﬁcient components that complement the

leadership performance of the Intel SA-1110 processor by providing I/O capabilities designed for emerging wireless

multimedia applications.

developer.intel.com/design Processors and Chipsets

INTEL®2700G MULTIMEDIA ACCELERATOR

The Intel®2700G multimedia accelerator is a companion chip that, when paired with the Intel PXA27x processor family,

delivers hardware-accelerated video and graphics for handheld devices.

Product Highlights

Next-generation communicators and PDAs enable a host of new entertainment-focused usage models such as capturing

and sharing pictures or video clips, video playback and interactive gaming. The introduction of VGA color LCDs has

improved the user’s visual experience for multimedia applications. The Intel 2700G multimedia accelerator is a companion

chip that, when paired with the Intel PXA27x processor family, delivers hardware-accelerated video and graphics for

handheld devices. The Intel 2700G enables rich 2D and 3D graphics, high-quality video playback and enterprise-worthy dual

display without sacriﬁcing battery life.

Intel’s multimedia accelerator line features two products that differ in their on-die memory conﬁgurations for low power

display refresh. The Intel®2700G3 has 384 KB on-die memory and the Intel®2700G5 has 704 KB on-die memory and is

optimized for VGA resolution display devices.

DVD-Quality Video Playback

User demands for quality video playback are driving development of color LCDs, cameras, and high-bandwidth

connectivity in handhelds. The Intel 2700G is designed to accelerate the leading handheld video formats, including

MPEG-2, MPEG-4 and Windows Media Video*. By working closely with leading ISVs, Intel optimizes top video players so

they deliver DVD-quality video playback on the Intel®platform.

Performance 2D/3D Graphics

Handsets and PDAs have traditionally not offered a gaming experience comparable to the PC user’s experience. The Intel

2700G, together with the Intel PXA27x processor family, is designed to enable a new level of 2D graphics and 3D

gaming capabilities. Coupled with support for standard 3D APIs such as OpenGL* ES and JSR-184, software developers will

be able to quickly port or create brand-new, near PC-quality games for handheld platforms. In addition, traditional 2D

applications such as a graphical user interface will enjoy faster response times, quicker screen refreshes and crisper icons.

Low Power

Battery life is one of the most important considerations in designing a handheld device. As multimedia capabilities

increase, battery life typically decreases. The Intel 2700G multimedia accelerator has been designed from the ground up

to work with the Intel PXA27x processor family to provide a balanced approach to performance and power.

Using an advanced low power manufacturing process, the chip is designed for low power in all operating modes, extending

battery life for entertainment-oriented applications. The Intel 2700G’s highly optimized multimedia capabilities are designed

to operate efﬁciently at extremely low-power. By ofﬂoading graphics and video trafﬁc, the Intel 2700G helps to enable the

Intel PXA27x processor to handle other types of trafﬁc, such as wireless connectivity and audio content.

Low power display refresh is another power-saving feature in the Intel 2700G. Because handheld devices are typically in

display refresh mode frequently during use, it is imperative that the platform provides a very low power display refresh

solution. The Intel 2700G3 and Intel 2700G5 have 384 KB and 704 KB on-die memory conﬁgurations respectively. These

chips are designed to refresh HVGA and VGA resolution displays using signiﬁcantly less power than solutions refreshing

from higher power external memory.

Processors and Chipsets developer.intel.com/design

Performance Dual Display

The Intel 2700G multimedia accelerator helps bring exciting new dual display capabilities to handheld devices. With

support for two displays and high resolution images, the Intel 2700G helps to allow business users to connect their

handheld devices to a projector and deliver presentations while away from the ofﬁce. The dual display capabilities also

support independent content on separate displays. For the ﬁrst time, enterprise users will have the unique ability to view

presentation notes on their PDA screen while their audience views the presentation on the projector.

Broad Market Support

The Intel 2700G multimedia accelerator meets the needs of broad market segment applications like telematics, portable

media players and industrial tablets. The LCD controller supports displays with resolutions up to 1280x1024 at 16-bit

color and advanced display features like partial display refresh.

FEATURES BENEFITS

■Robust hardware video decode support for MPEG-2, MPEG-4 ■DVD-quality video playback

and Windows Media Video*

■Optimized video players

■Graphics acceleration hardware ■Designed to deliver unprecedented handheld gaming experience

■3D API support

■Optimized 3D games

■On-die memory conﬁguration* ■Balanced system performance and power, extended battery life

■Optimization for Intel®PXA27x processor

■Performance dual display architecture ■Enterprise-worthy dual display

■Optimized dual display application

STRONGARM* INTEL®SA-1111

The Intel®SA-1111 companion chip provides integrated technology for full-featured, versatile designs.

Product Highlights

■Complements the Intel SA-1110 and Intel PXA25x processor’s leadership performance/power attributes with advanced

I/O capabilities

■Provides a highly integrated solution for emerging wireless multimedia applications

■Provides design ﬂexibility through a wide range of full-function interfaces

■Supported by a rich suite of Intel®and third-party hardware and software development tools

The Intel SA-1111 companion chip, a highly integrated and power-efﬁcient component, complements the leadership

performance of the Intel SA-1110 processor by providing key I/O capabilities designed for emerging wireless multimedia

applications. The Intel SA-1111 brings a new level of integration to portable wireless devices and enables key attributes such

as reduced component count, low power dissipation and high performance. The Intel SA-1111 provides a USB host controller,

direct connection to AC-link and I2S audio codecs, buffering for one PCMCIA slot and one CF slot, and multiple additional

I/O interfaces. A dedicated memory controller can reduce bandwidth demands, to maximize overall system performance.

This rich suite of features, combined with a robust development environment, enables manufacturers to bring competitive

portable wireless devices to market quickly.

Support for USB Devices

Featuring a Universal Serial Bus (USB) host controller, the Intel SA-1111 companion chip enables integration with

USB-compatible devices and ofﬂoads the Intel SA-1110 processor through DMA data transfers. The Intel SA-1111

is compatible with the Open Host Controller Interface (OHCI), Windows* 95 USBD, and USB Rev 1.1. USB-compliant

devices can “plug and play” with portable wireless products that incorporate the Intel SA-1110 processor and Intel SA-1111

companion chip.

developer.intel.com/design Processors and Chipsets

Integrated I/O Interfaces Provide Scalable, Flexible Handheld Designs

To provide maximum design ﬂexibility, reduce design time and lower cost, the Intel SA-1111 companion chip

integrates a broad spectrum of I/O interfaces. It incorporates two PS/2 ports, an AC-link, I2S and L3 serial ports

for audio, an SSP serial data port, two PWM outputs, one PCMCIA interface, one CompactFlash Interface, and

general-purpose I/O (GPIO) pins.

The Intel SA-1111 companion chip’s SSP serial data port supports National Microwire*, TI* Synchronous Serial Protocol

(SSP), and Motorola* Serial Peripheral Interface (SPI) serial protocols, enabling designs incorporating a wide selection of

components that require serial communication. PCMCIA and CompactFlash control logic and buffers are integrated within

the Intel SA-1111. This eliminates up to 12 external devices, providing a highly integrated, cost-effective and low-power

solution for PC companions and vertical handheld applications. Both the USB controller and the serial audio controller make

use of DMA to ofﬂoad the Intel SA-1110 microprocessor, freeing compute resources and bandwidth.

The advanced interfaces and features of the Intel SA-1111 companion chip offer broad ﬂexibility to support multiple

cost-effective handheld conﬁgurations while minimizing time-to-market constraints. The Intel SA-1111 is packaged in

a 256-pin mBGA.

Low Power Consumption Minimizes Power Requirement

The selective clock-gating feature and three power-down modes (idle, doze and sleep) of the Intel SA-1111 minimize

system power requirements. The Intel SA-1111 can power down individual functional blocks that are not in use and

power them up quickly when they are needed.

Development Tools

Intel Integrated Performance Primitives: The Intel Integrated Performance Primitives (IPP) provide a rich and powerful set

of general and multimedia signal processing kernels optimized for maximum performance on Intel Personal Internet Client

Architecture (PCA) Applications Processors.

Intel®Integrated Performance Primitives for the Intel®PXA25x and Intel®PXA26x family

of Processors, Version 3.0 Beta

The Intel Integrated Performance Primitives (Intel IPP) provides a cross-platform, low-level software interface that abstracts

multimedia and signal processing from the Intel Personal Internet Client Architecture (Intel PCA) Processors. Intel IPP

includes a broad range of functions for basic software functionality including general signal, image, speech and audio

processing, vector manipulation and matrix math, as well as more sophisticated primitives for construction of audio, video

and speech codecs such as MP3 (MPEG-1 Audio, Layer 3), MPEG-4, H263, JPEG, GSM-AMR, G723.1 and cryptography

(DES, TDES, SHA1, and RSA).

The Intel IPP release 3.0 Beta introduces additional primitives to support the following codecs/applications:

■MPEG4—Encoder (simple Proﬁle)

■AAC—Decoder (Low Complex)

■MP3—Encoder

■JPEG 2000—Encoder/Decoder

■General audio processing—Echo cancellation, VAD

■Rijndael/TDES cryptography application, and more.

With each function highly optimized for the underlying Intel PCA Processors, Intel IPP provides developers with

a powerfully simple way to maximize Intel®processor performance without writing assembly code.

Intel®IPP 3.0 Beta Documentation:

Learn more about the powerful capabilities of Intel IPP.

■Intel Integrated Performance Primitives for the Intel PXA26x and Intel PXA25x family of Processors

■Intel IPP Product Brief

■Intel IPP Case Studies

Processors and Chipsets developer.intel.com/design

To download Intel®IPP, three easy steps are required:

1. Register for Intel IPP Version 3.0 Beta

2. Check your e-mail. After registering, you will be sent an e-mail with download instructions. If you are a new customer

or haven’t previously used Intel®Premier Support, you will also receive a second e-mail with your login ID and password

information.

3. Follow the instructions to download Intel IPP from our Intel Premier Support Web site.

Intel®IPP Release Notes:

Intel®IPP for Microsoft Pocket PC* 2002 Release Notes

Intel®IPP for Linux* Release Notes

Intel®Graphics Performance Primitives (Intel®GPP) for the Intel®PXA2xx Family

of Processors, Version 1.1 Beta

The Intel®Graphics Performance Primitives (Intel®GPP) provide a rich and powerful set of 3D graphics functions

optimized for the Intel Personal Internet Client Architecture (Intel PCA) Applications Processors. Intel GPP include a

broad range of 3D graphics functions including date-type conversion, arithmetic, trigonometric, vector, matrix, and raster

primitives.

With each function highly optimized for the underlying Intel PCA Applications Processors, the Intel GPP provide

developers a powerfully simple way to maximize Intel processor performance without writing assembly code.

Intel®GPP V1.1 Beta Documentation:

Learn more about the powerful capabilities of Intel GPP.

■Intel Graphics Performance Primitives for the Intel®PXA2xx Family of Processors Reference Manual

Intel®GPP V1.1 Beta Library Download:

The Intel GPP V1.1 Beta release supports the Microsoft Pocket PC* 2002 and Microsoft Smartphone* 2002 operating

systems.

■Intel Graphics Performance Primitives: Installation Package and Release Notes

INTEL®PCA TECHNOLOGY

Intel XScale®Technology with Intel®Wireless MMX™Technology

The trend toward rich multimedia and communications capabilities on mobile devices is growing. End users in the

handheld wireless market segment demand multimedia and communication experiences similar to those they enjoy on

their desktop—but in a mobile setting. To meet that need, software developers require easy-to-use, general-purpose processor

capabilities that provide the performance necessary for rich multimedia. Device manufacturers require that this be

accomplished without sacriﬁcing battery power.

Intel®Wireless MMX™technology is the latest high-performance, low-power, seamless extension to Intel XScale

microarchitecture. Intel Wireless MMX technology offers developers a powerful set of new instructions for future Intel

Personal Internet Client Architecture (Intel PCA)-based processors that will help enhance the multimedia experience of Intel

PCA-based mobile devices. Developed from a solid foundation of Intel®Architecture (IA) technologies, Intel Wireless MMX

technology combines the Intel MMX technology instruction set, the integer instructions from Intel®Streaming SIMD

Extensions (Intel®SSE) plus several brand-new multimedia acceleration instructions unique to Intel XScale microarchitecture.

This powerful 64-bit Single Instruction Multiple Data (SIMD) architecture gives a performance boost to many applications

including motion video, graphics combined with video, image processing, audio synthesis, speech synthesis and

compression, telephony, conferencing, 2D graphics, and 3D graphics. Intel Wireless MMX technology brings 43 new

instructions to Intel XScale microarchitecture and is enabled by four primary capabilities: Intel®64-bit Data Pipeline, Intel®

Parallel Media Processing, Intel®Media Power On-Demand, and Intel®Multi-Sample Technology. The Intel 64-bit Data

developer.intel.com/design Processors and Chipsets

Pipeline is tightly coupled to the Intel XScale microarchitecture pipeline resulting in more efﬁcient and fast data transfers.

Intel Parallel Media Processing allows Intel Wireless MMX technology to accelerate many applications, that perform

calculations on integer data in a repetitive and sequential manner due to its ability to process 8-bit, 16-bit, and 32-bit data

elements in parallel. Intel Wireless MMX instructions can be interleaved with Intel XScale microarchitecture instructions and

thanks to Intel Media Power On-Demand Technology, the Intel Wireless MMX technology is only activated when required to

execute instructions. Finally, Intel Multi-Sample Technology helps improve multimedia algorithm performance by utilizing

the large register ﬁle of Intel Wireless MMX to store the many intermediate results required when calculating multiple output

values concurrently. This allows Intel Wireless MMX instructions to maximize the use of data fetched from memory to help

accelerate audio/video performance and help reduce power consumption.

Intel Wireless MMX technology was deﬁned to be simple. PC software developers who have already utilized Intel MMX

technology and Intel SSE will ﬁnd a familiar programming environment in Intel Wireless MMX technology that will help

speed the porting of existing code bases from the Intel Architecture to Intel PCA-based mobile devices. And Intel Wireless

MMX technology is general enough to address the needs of a large domain of mobile software applications built from current

and future algorithms. Finally, Intel Wireless MMX instructions can be used in applications, codecs, algorithms, and drivers.

Intel®Micro Signal Technology:

Product Information

■In order to address the rapidly expanding market segment for communications and portable computing devices, Analog

Devices (ADI) and Intel jointly developed Micro Signal Architecture that incorporates both Digital Signal Processing

(DSP) and microcontroller functionality in a single core. The Intel/ADI* core delivers vast improvements in performance,

programmability and power consumption over traditional DSP design.

■Both ADI and Intel will take the Micro Signal Architecture core and separately develop products based on it.

■Intel®Micro Signal Architecture (Intel®MSA) incorporates Digital Signal Processor (DSP) and microcontroller features

in a single platform. It combines a highly efﬁcient computational architecture with features more normally seen on

microcontrollers, such as optimizations for high-level language programming, memory protection and byte addressing.

This results in the ability to execute highly complex DSP tasks and simple control tasks in a single core architecture. Intel

MSA is ideal for a variety of battery-powered communications and consumer applications that require high-intensity

signal processing on a strict power budget.

High Performance, Low Power

Intel MSA is the ﬁrst DSP architecture to incorporate Dynamic Power Management (DPM) capabilities, delivering 10 times

the normal battery life at one-third peak performance. DPM supports continuous monitoring of the software running on the

architecture and enables dynamic adjustments of both the voltage delivered to the core and the frequency at which the core

runs (MHz). This results in optimized power consumption and performance for real-time applications.

Extended Computing with Intel XScale®Microarchitecture:

Utilizing Intel XScale®Technology

Smart Displays* are wireless ﬂat-panel displays that are used as monitors when docked to a base desktop PC, but when

detached, become a mobile monitor using 802.11b wireless LAN technology to access information and applications from

the desktop PC from anywhere in the home. Smart Displays utilizes the industry-leading performance of Intel XScale

technology-based processors and Intel StrataFlash memory.

Some of the top makers of wireless Smart Displays such as AboCom*, Fujitsu, Lite-On, MSI, Philips*, Tatung*, TriGem

and ViewSonic*—have selected Intel XScale technology-based processors to power new products that help enable wireless

PC access throughout the home. Smart Displays running on Intel XScale technology are available today in retail from

ViewSonic and Philips, with products currently targeted to be released later this year from Fujitsu and TriGem.

Processors and Chipsets developer.intel.com/design

Intel®Telematics Solutions for Emerging Digital Car Products and Services

■Telematics Design Center

The Intel®Telematics Design Center provides Web-based development and technical support for designing navigation,

multimedia, hands-free phone, and other in-car Internet products and applications using Intel XScale technology-

based processors.

■Intel®Wireless Building Blocks for Telematics Product

Intel is supplying new multimedia-capable components for current and next-generation cellular technology, including

high-performance, low-power processors, ﬂash memory, chipsets, and software.

Intel®Portable Media Player

The Portable Media Player (PMP) is a new type of mobile entertainment product pioneered by Intel. PMPs will be small

enough to ﬁt in a coat pocket and will allow people to take video, still pictures and music with them anywhere they go—

on the plane, train, or bus, to the gym, or hand it to the kids sitting in the back seat of the car during a long drive. Intel®-based

PMPs will feature high-quality video playback using an Intel XScale technology-based processor. The different types of

media can be transferred to a PMP from a PC or a Personal Video Recorder using a fast Hi-Speed USB 2.0 connection.

Intel®PCA Developer’s Network: You have an idea for an innovative wireless product. Or you have a development

solution that can save other developers time and make you money. You just need the right marketing opportunities and

industry connections to make it a success and reduce time-to-market. In today’s competitive wireless environment, it’s not

only a matter of what you know, but whom you know.

Membership in the Intel PCA Developer Network gives you fast access to the resources you need.

The enhanced Intel®PCA Developer Network Solutions Catalog is an extensive database of third-party tools and solutions

that help developers identify and connect with the right silicon, hardware designs, board support platforms, independent

software vendors, development tools, and manufacturing resources. The new Intel®PCA Developer Network Smart-Match

Reference Conﬁguration Tool makes recommendations based on speciﬁc application and platform requirements.

As a member of the Intel PCA Developer Network, you are just a click away from a community of fellow developers who

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developer.intel.com/go/PXA255 Processors and Chipsets

Embedded PXA Processor Overview

INTEL®PXA255 PROCESSOR

Designed for a Wide Range of Embedded Devices

Numerous embedded and portable consumer electronics devices simplify our lives, keep us entertained and increase

productivity. Each day businesses and individuals rely on them more and more. But, to continue satisfying ever-

increasing customer demands to communicate and access information, manufacturers need technologies that deliver high

performance, ﬂexibility and robust functionality—all in the small-size, low-power framework of portable, battery-powered

products. The PXA255 application processor with Intel XScale®technology pushes device functionality to new heights. With

a seven-stage pipeline and faster processing speeds, these microprocessors enable devices to meet the performance demands

of their customers. Coupled with Intel’s power management capabilities, the PXA255 delivers unparalleled operating

efﬁciency. By reducing component count and board space, lowering power consumption, minimizing system costs and

reducing time-to-market, these applications processors deliver solid competitive advantage and superior devices.

INTEL®PXA255 HIGH-PERFORMANCE APPLICATIONS PROCESSOR

Packing feature-rich devices with multimedia performance

For advanced devices that run the most demanding applications, the Intel®PXA255 Applications Processor is the answer.

This highly integrated, 32-bit RISC processor combines the efﬁciency of Intel design with the industry-standard ARM*

v.5TE instruction set architecture and the processing power of built-in multimedia capabilities for superior performance and

unmatched handheld functionality. This enables increased end-user functionality, the longest battery life and a richer

experience. Based on Intel XScale technology, the Intel PXA255 cost-effectively boosts processing speed and power

management for one of the industry’s best MIPS/mW ratio. Larger memory caches and gated clocks ensure faster functions

with lower power dissipation. The processing capabilities of the Intel PXA255 enable portable devices to respond faster to

optimized operating systems and performance-intensive applications like MP3 audio decode, MPEG4 video decode, speech

and handwriting recognition, and Java* interpretation. From surﬁng animated Web sites to streaming video to mixing MP3s,

the Intel PXA255 delivers processing power for superior performance.

The Development Ecosystem

Outstanding performance and low power consumption are only the beginning when you develop with the Intel PXA255

applications processor. Our robust software and hardware development environment offers a large library of ARM-

compliant applications and tools, as well as an array of operating systems and tool chains to ease application development

and system prototyping. The Intel®Integrated Performance Primitives (Intel®IPP) library promises easy access to an array of

low-level, cross-platform software algorithms for high-demand communications, signal processing, mathematics and media

functions. The Intel IPP’s highly optimized implementation helps reduce battery consumption through more efﬁcient CPU

execution, enables developers to focus on value-add features, and speeds time-to-market. With the Intel®development

ecosystem, you have the resources you need to deliver the features your consumers want—efﬁciently and effectively.

Processors and Chipsets developer.intel.com/go/PXA255

Intel®PXA255 At-A-Glance:

High Performance:

■ Low-power, high-performance 32-bit Intel XScale®core-based CPU—200, 300, and 400MHz

■ ARM Architecture v.5TE compliant and application code compatible with Intel®SA1110 processor for rapid upgrade

■ Intel®Superpipelined RISC Technology utilizing advanced Intel®0.18µ process for high core speeds at low power

■ Intel®Media Processing Technology including 40-bit accumulator and 16-bit SIMD to enhance audio/video

decode performance

■ High-performance glue-less burst and page mode interfaces with Synchronous Intel StrataFlash®Memory

Low Power:

■ Low power and Turbo modes for optimal battery life

■ 32 KB data and 32 KB instruction caches

■ 2 KB Mini data cache for streaming data

■ Support for 2.5 and 3.3V memories

I/O Expansion:

■ Integrated Memory and PCMCIA/Compact Flash Controller with 100 MHz Memory Bus, 16-bit or 32-bit ROM/Flash/

SRAM (six banks), 16-bit or 32-bit SDRAM, SMROM (four banks), as well as PCMCIA and Compact Flash for added

functionality and expandability

■ System Control Module includes 17 dedicated general-purpose interruptible I/O ports, real-time clock, watchdog and

interval timers, power management controller, interrupt controller, reset controller, and two on-chip oscillators

Portable & User Interface:

■ Peripheral Control Module offers 16-channel conﬁgurable DMA controller, integrated LCD controller with unique

DMA for fast color screen support, Bluetooth* I/F, serial ports (IrDA, I2C*, I2S*, AC’97, three UARTs, SPI and SSP),

USB end point interface, and MMC/SD Card Support for expandable memory and I/O functionality

■ 17x17 mm 256-pin PBGA

The Intel®PXA255 Applications Processor Advantage

FEATURES BENEFITS

High-performance, low-power Intel XScale®core at 200, 300 Ideal for a wide range of embedded applications

and 400 MHz. Micro-power management including low-power

modes and Turbo mode application acceleration

Intel®Media Processing Technology Optimized audio and video multimedia functionality

Enhanced Memory Controller Supports lower power 2.5V and 3.3V 32-bit and 16-bit memories as

well as glue-less burst and page mode interfaces with Synchronous

Intel StrataFlash®Memory

MMC/SD and PCMCIA/CF Card support Expandable storage and I/O device support

USB Client Fast host synchronization

1.84 MHz cellular baseband interface Efﬁcient communications integration

920 Kbs Bluetooth* interface Broad inter-device communication

Variable latency I/O Add-on functionality capabilities

developer.intel.com/go/PXA255 Processors and Chipsets

EXTENDED COMPUTING WITH INTEL XSCALE®MICROARCHITECTURE:

Intel®Telematics Solutions for Emerging Digital Car Products and Services

■Telematics Design Center

The Intel®Telematics Design Center provides Web-based development and technical support for designing navigation,

multimedia, hands-free phone, and other in-car Internet products and applications using Intel XScale®technology-based

processors.

■Intel®Building Blocks for Telematics Product

Intel is supplying new multimedia-capable components including high-performance, low-power processors, ﬂash

memory, chipsets, and software.

Intel®Portable Media Player

The Portable Media Player (PMP) is a new type of mobile entertainment product pioneered by Intel. PMPs powered by

an Intel XScale®Technology-based PXA255 processor allow users to enjoy their favorite media anywhere, anytime.

Intel®-based PMPs:

■Create an exciting, feature rich and high-quality user experience

■Enable users to enjoy video, still images and music in a device small enough to ﬁt in a coat pocket

■Accommodate the quick transfer of different types of media from a PC or Personal Video Recorder using USB2.0

■Deliver high video performance with low battery consumption

Delivering on its vision for Portable Media Players, Intel is continuously working with numerous consumer electronics

industry leaders to further develop the portable media player ecosystem.

Processors and Chipsets developer.intel.com/design/intelxscale

Intel XScale

Microarchitecture

INTEL XSCALE®MICROARCHITECTURE PRODUCT OVERVIEW

With Intel XScale®microarchitecture, a wide range of Internet applications can be optimized from ultra-low power

consumption to high-performance processing. Everything from handheld Internet devices to enterprise Internet

infrastructure products can now process rich content at all stages of the Internet.

This new high-performance, ultra-low-power microarchitecture is compliant with the ARM Version 5TE ISA instruction

set (excluding the ﬂoating-point instruction set). The microarchitecture surrounds the ARM-compliant execution core with

the following:

■ Instruction and data memory management units

■ Instruction, data and mini-data caches

■ Write, ﬁll, pend and branch target buffers

■ Power management, performance monitoring, debug and JTAG units

■ Coprocessor interface

■ MAC coprocessor

■ Core memory bus

The Intel XScale microarchitecture, when combined with peripherals, provides Applications Speciﬁc Standard Products

(ASSP) targeted at selected market segments. For example, the microprocessor core can be integrated with an LCD

controller, multimedia controllers and an external memory interface. This gives OEMs the ability to develop smaller, more

cost-effective handheld devices with long battery life and the performance to run rich multimedia applications. Or the

microprocessor core could be surrounded by high-bandwidth PCI interfaces, memory controllers and networking

microengines to provide a highly integrated, high-performance I/O or network processor.

Designed with Intel’s state-of-the-art 0.18-micron production semiconductor process technology, Intel XScale

microarchitecture enables operation of the microprocessor core over a wide range of speed and power, producing industry-

leading mW/MIPS performance.

developer.intel.com/design/intelxscale Processors and Chipsets

FEATURES BENEFITS

Intel®Superpipelined RISC Technology 7-stage integer/8-stage memory superpipelined core achieves high speed

and ultra-low power

Intel®Dynamic Voltage Management Dynamic voltage and frequency scaling on-the-ﬂy allows applications

to utilize the right blend of performance and power

Intel®Media Processing Technology Multiply-Accumulate Coprocessor performs two simultaneous 16-bit SIMD

multiplies with 40-bit accumulation for efﬁcient media processing

Power Management Unit Gives power savings via idle, sleep, and quick wake-up modes

128-entry Branch Target Buffer Keeps pipeline ﬁlled with statistically correct branch choices

32 KB Instruction Cache Keeps local copy of important instructions to enable high performance

and low power

32 KB Data Cache Keeps local copy of important data to enable high performance and

low power

2 KB Mini-Data Cache Avoids “thrashing” of the D-Cache for frequently changing data streams

32-entry Instruction Memory Management Unit Enables logical-to-physical address translation, access permissions,

I-Cache attributes

32-entry Data Memory Management Unit Enables logical-to-physical address translation, access permissions,

D-Cache attributes

4-entry Fill and Pend Buffers Promotes Core efﬁciency by allowing non-blocking and “hit-under-miss”

operation with Data Caches

Performance Monitoring Unit Furnishes two 32-bit event counters and one 32-bit cycle counter for

analysis of hit rates, etc.

Debug Unit Uses Hardware Breakpoints and 256-entry Trace History Buffer

(for ﬂow change messages) to debug programs

32-bit Coprocessor Interface Provides high-performance interface between core and coprocessors

64-bit Core Memory Bus with simultaneous 32-bit input path Gives up to 4.8 Gbps @ 600 MHz bandwidth for internal accesses

8-entry Write Buffer Allows the Core to continue execution while data is written to memory

Third-Party Vendor Program

Intel will provide a complete development environment for fast Time-To-Market designs based on the Intel XScale

microarchitecture. A number of Third-Party Vendors (TPVs) are enthusiastically supporting this new microarchitecture and

will be participating in Intel’s tools support programs for this microprocessor core. The Intel XScale microarchitecture

development platforms will include a full set of software development tools and related documentation, including both GNU

and ARM-based toolchains.

Cygnus/Red Hat* and ARM, CAD-UL*, and Green Hills will be providing compiler, assembler, linker, debugger, and

monitor software support for the Intel XScale microarchitecture. There will be a variety of operating system development

solutions available for designers, because this next-generation RISC microarchitecture’s balanced power to performance

attributes make it applicable across a broad spectrum of application environments.

The Intel XScale microarchitecture will be supported by many operating systems, including those from Accelerated

Technology*, Microsoft, MontaVista*, Symbian*, and Wind River*. Additionally, full hardware debug support will be

available from vendors such as ARM, Macraigor Systems*, and Wind River.

Processors and Chipsets developer.intel.com/design/intelxscale

Intel XScale®Microarchitecture

■ Introduced at Intel Developers Forum, August 2000

■ Provides industry-leading MIPS/mW performance in an ARM v.5TE-compliant core

■ Provides scalability for high performance and low power within a speciﬁc application

FEATURES BENEFITS

ARM* v.5TE-Compliant Core Compatibility with the broadest range of applications/OSs written

for wireless devices

Industry-leading MIPS/mW High-performance and low-power capabilities

Intel®Dynamic Voltage Management On-the-ﬂy voltage and frequency scaling

Intel®Media Processing Technology Core enhancements that enable efﬁcient multimedia processing

Advanced cache architecture Cache architecture optimized for high performance and low power

INTEL®XSCALE™CORE POWER PERFORMANCE

MIPS 50 150 400 600 733 800 1GHz

POWER CONSUMPTION 10mW 40mW 180mW 450mW 640mW 900mW 1.6W

Intel XScale®Microarchitecture Enhancements

over Intel®StrongARM* Architecture

■ ARM v.5TE compliance

■ Lower power at the same frequency

–Intel XScale core = 80mW @ 200 MHz (1.0V)

–Intel®SA1 core = 400mW @ 206 MHz (1.75V)

■ Advanced RISC architecture

–Intel®Superpipelined Technology

–Larger caches, advanced cache architecture

–Dynamic branch prediction

■ Enhanced multimedia capabilities

■ Extensive debug support/hardware JTAG support

■ Intel®0.18µ leading-edge process

–Higher performance, lower power

–More scalable power performance

Future Intel XScale®Microarchitecture Solutions

for many applications

■ Internet backbone devices, i.e., Routers, Switches, etc.

■ DSLAM Line Cards and Voice access equipment

■ Internet Storage RAID/SAN

■ PDAs

■ Smart phones

developer.intel.com/design/ﬂash Intel®Flash Memory for Wireless Applications

Today’s wireless developers are faced with the challenge of managing the explosion of emerging data types and designing

smaller form factors, all while trying to manage costs. Intel’s innovative ﬂash memory components, high-volume stacked

packaging and sophisticated software provide some of the most advanced, cost-effective, single-chip solutions for code

execution and data storage. It’s no wonder Intel is the world’s leading supplier of ﬂash memory for wireless cell phones and

consumer targeted handheld devices. Discover Intel®Flash memory, the solution of choice for wireless designs.

INTEL®STACKED-CHIP SCALE PACKAGING (SCSP) PRODUCTS—

NEW LEVELS OF SPACE SAVINGS FOR WIRELESS

Intel®Stacked-Chip Scale Packaging (Intel®Stacked-CSP) products deliver wireless customers a new generation of memory

subsystems by combining high-density Intel StrataFlash®Memory with ﬂexible RAM options for higher levels of

integration and space savings.

Intel has developed an extensive portfolio of Standard Stacked-CSP products designed to provide the widest range of

Flash and RAM product combinations, fast time-to-market, and ﬂexibility to meet your application design requirements.

Standard Intel Stacked-CSP products feature x16 and x32 bus widths as well as SRAM, PSRAM, and LP-SDRAM options

all in common footprints to allow easy migration for your design.

Key Messages:

■World-Class Silicon

■Packaging Technology Leadership

■Extensive RAM supplier network

■Manufacturing Excellence

FEATURES BENEFITS

Standard Stacked-CSP Products ■Provide widest range of Flash + RAM combinations

■Fast time-to-market

■Application Flexibility

Intel®Multi-Level Cell (MLC) Technology ■Great value and 4th generation of proven reliability

Low-proﬁle height and small X & Y dimensions from ■Small Intel®Stacked Chip Scale Package/CSP form factor for space-

8 mm x 10 mm and height-constrained applications

Standard x16 and x32 Ballouts ■Enables easy upgrades across Flash and RAM product densities

and technologies

Intel®Ultra-Thin Stacked Chip Scale Package Technology ■Allows up to 5 die stack

■Provides low package proﬁle from 0.8 mm to 1.2 mm

Intel

Flash Memory

for Wireless Applications

SCSP COMPONENTS AT A GLANCE: DESIGN-IN PRODUCTS

PRODUCT NAME PRODUCT COMBINATION ACCESS TIME (NS) TEMP RANGE PACKAGE BALL COUNT VCC/VCCQ VPP/VPEN LEAD/LEAD-FREE

INTEL STRATAFLASH®WIRELESS MEMORY SYSTEM (L18/L30 SCSP)

LQ 18/30 Code Flash, SRAM, PSRAM (QUAD+ballout)

48F2000L0 64L18+0 85[25]b[14]c P RD 88 1.8V/1.8V 0.9–2.0V or 9V L

48F2000L0 64L30+0 85[25]b[17]c P RD 88 1.8V/3.0V 0.9–2.0V or 9V L

48F3000L0 128L18+0 85[25]b[14]c P RD 88 1.8V/1.8V 0.9–2.0V or 9V L, LF

48F3000L0 128L30+0 85[25]b[17]c P RD 88 1.8V/3.0V 0.9–2.0V or 9V L, LF

48F3300L0 128L18+128L18 85[25]b[14]c P RD 88 1.8V/1.8V 0.9–2.0V or 9V LF

48F3300L0 128L30+128L30 85[25]b[17]c P RD 88 1.8V/3.0V 0.9–2.0V or 9V L

48F4000L0 256L18+0 85[25]b[14]c P RD 88 1.8V/1.8V 0.9–2.0V or 9V L, LF

48F4000L0 256L30+0 85[25]b[17]c P RD 88 1.8V/3.0V 0.9–2.0V or 9V L, LF

48F4400L0 256L18+256L18 85[25]b[14]c P RD 88 1.8V/1.8V 0.9–2.0V or 9V L, LF

48F4400L0 256L30+256L30 85[25]b[17]c P RD 88 1.8V/3.0V 0.9–2.0V or 9V L

38F3040L0 128L18+32P 85[25]b[14]c P RD 88 1.8V/1.8V 0.9–2.0V or 9V L, LF

38F3040L0 128L30+32P 85[25]b[17]c P RD 88 1.8V/3.0V 0.9–2.0V or 9V L, LF

38F3050L0 128L18+64P (Burst) 85[25]b[14]c P RD 88 1.8V/1.8V 0.9–2.0V or 9V L

38F3050L0 128L30+64P 85[25]b[17]c P RD 88 1.8V/3.0V 0.9–2.0V or 9V L

38F3340LL 128L18+128L18+32P 85[25]b[14]c P RD 88 1.8V/1.8V 0.9–2.0V or 9V L

38F4050L0 256L18+64P (Burst) 85[25]b[14]c P RD 88 1.8V/1.8V 0.9–2.0V or 9V L, LF

38F3350LL 128L30+128L30+64P 85[25]b[17]c P RD 88 1.8V/3.0V 0.9–2.0V or 9V L

38F3352LL 128L30+128L30+64P+8S 85[25]b[17]c P RD 88 1.8V/3.0V 0.9–2.0V or 9V L, LF

38F4055L0 256L30+64P+64P 85[25]b[14]c P RD 88 1.8V/1.8V 0.9–2.0V or 9V L

38F4055L0 256L18+64P+64P (Burst) 85[25]b[14]c P RD 88 1.8V/1.8V 0.9–2.0V or 9V L

38F4350LL 256L18+128L18+64P (Burst) 85[25]b[14]c P RD 88 1.8V/1.8V 0.9–2.0V or 9V L

38F4455LL 256L30+256L30+64P+64P 85[25]b[14]c P RD 88 1.8V/1.8V 0.9–2.0V or 9V L

38F4455LL 256L18+256L18+64P+64P (Burst) 85[25]b[14]c P RD 88 1.8V/1.8V 0.9–2.0V or 9V L

LX 18/30 Code Flash, SRAM, SDRAM (Performance ballouts)

38F4060L0 256L18+128SD (x16) 85[25]b[14]c P LZ 103 1.8V/1.8V 0.9–2.0V or 9V L

38F4070L0 256L18+256SD (x16) 85[25]b[14]c P LZ 137 1.8V/1.8V 0.9–2.0V or 9V L, LF

38F4462LL 256L18+256L18+128SD +8S 85[25]b[14]c P RD 103 1.8V/1.8V 0.9–2.0V or 9V LF

48F3300L0 128L30+128L 30(x32) 85[25]b[17]c P RD 137 1.8V/3.0V 0.9–2.0V or 9V L

48F3300L0 128L18+128L18 (x32) 85[25]b[14]c P LZ 137 1.8V/1.8V 0.9–2.0V or 9V L, LF

48F3300L0 128L30 +128L30 (x32) 85[25]b[17]c P LZ 137 1.8V/3.0V 0.9–2.0V or 9V L

48F4400L0 256L18+256L18 (x32) 85[25]b[14]c P LZ 137 1.8V/1.8V 0.9–2.0V or 9V L, LF

48F4400L0 256L30+256L30 (x32) 85[25]b[17]c P LZ 137 1.8V/3.0V 0.9–2.0V or 9V L

38F4360LL 256L18+128L18+128SD (Split Bus) 85[25]b[14]c P RD 137 1.8V/1.8V 0.9–2.0V or 9V L

38F4470LL 256L18+256L18+256SD (Split Bus) 85[25]b[14]c P RD 137 1.8V/1.8V 0.9–2.0V or 9V L

38F3030L0 128L18+16P 85[25]b[14]c P RD 44 1.8V/1.8V 0.9–2.0V or 9V LF

38F2030L0 64L18+16P 85[25]b[14]c P RD 44 1.8V/1.8V 0.9–2.0V or 9V LF

INTEL STRATAFLASH®WIRELESS MEMORY SYSTEM (LV18/LV30 SCSP)

LVQ 18/30 Code and DataFlash, SRAM, PSRAM (QUAD+ ballout)

48F4040LV 256L18+256V18 85[25]b[14]c P RD 88 1.8V/1.8V 0.9–2.0V or 9V L, LF

48F4040LV 256L30+256V30 85[25]b[14]c P RD 88 1.8V/3.0V 0.9–2.0V or 9V L

LVX 18/30 Code and DataFlash, SRAM, SDRAM (Performance ballouts)

38F4460LV 256L18+256V18+128SD 85[25]b[14]c P RD 103 1.8V/1.8V 0.9–2.0V or 9V LF

48F4444LV 256L18+256L18+256V18+256V18 85[25]b[14]c P RD 103 1.8V/1.8V 0.9–2.0V or 9V L

58F0012LV 256L18+256L18+256V18+128SD 85[25]b[14]c P RD 103 1.8V/1.8V 0.9–2.0V or 9V L

Wireless Products Legend

Access Time Footnotes: Product Combinations Footnotes: Temperature Range Footnotes: Package Footnotes:

bPage Mode Access P= PSRAM E= Extended Temperature (-40°C to +85°C) GE = 0.75mm VF BGA

cSynchronous Burst Mode S= SRAM P= Expanded Temperature (-25°C to +85°C) RD = Intel®Stacked Chip Scale Package

D= SDRAM LZ = Intel®UT-Stacked Chip Scale Package

† Access time refers to data component.

SCSP ORDERING INFORMATION

Intel®Flash Memory for Wireless Applications developer.intel.com/design/ﬂash

Expanded Temperature (-25°C to +85°C)

RD = SCSP

SCSP Product Line Designator

38F = Flash + Ram

48F = Flash Only

(See Table 1 for details)

Ballout Identifier

Q = Quad

(See Table 3 for details)

Custom

Flash Product Decoder

C = 3-Volt Intel® Advanced+ Boot Block Flash Memory

J = 3-Volt Intel StrataFlash® Memory

K = 3-Volt Synchronous Intel StrataFlash® Memory

L = 1.8-Volt Intel StrataFlash® Memory

W = 1.8-Volt Intel® Wireless Flash Memory

0 = No Die

(See Table 3 for details)

Voltage Options

Z = 3 Volt

Y = 1.8 Volt

M = Mixed Core Voltages

(See Table 3 for details)

Flash and Ram

Density Configuration

(See Table 2 for details)

Flash Boot Configuration

(See Table 4 for details)

RD 38F 2240 WW Y T Q Ø

Intel®Stacked-SCSP Table References

Density Decoder Table 1

CODE FLASH DENSITY RAM DENSITY

0 No Die No Die

1 32 Mbit 4 Mbit

2 64 Mbit 8 Mbit

3 128 Mbit 16 Mbit

4 256 Mbit 32 Mbit

5 512 Mbit 64 Mbit

6 1 Gbit 128 Mbit

7 2 Gbit 256 Mbit

8 4 Gbit 512 Mbit

9 8 Gbit 1 Gbit

A 16 Gbit 2 Gbit

Flash Family Decoder Table 2

CODE FLASH DENSITY CORE VOLTAGE

C Intel®Advanced+ 3.0 Volt

Boot Block Flash Memory

J Intel StrataFlash®Memory 3.0 Volt

K Intel StrataFlash®3.0 Volt

Synchronous Memory

L Intel StrataFlash®Wireless 1.8 Volt

Memory

LV Intel StrataFlash®Wireless 1.8 Volt

Memory System

W Intel®Wireless Flash 1.8 Volt

Memory

0 No Die Not Applicable

I/O Voltage Decoder Table 3

CODE FLASH I/O VOLTAGE

Z Flash Family A = 3.0 Volt I/O

Flash Family B = 3.0 Volt I/O

Y Flash Family A = 1.8 Volt I/O

Flash Family B = 1.8 Volt I/O

M Flash Family A = 3.0 Volt I/O

Flash Family B = 1.8 Volt I/O

L Flash Family A = 1.8 Volt I/O

Flash Family B = 3.0 Volt I/O

Parameter Conﬁguration Decoder Table 4

DESIGNATOR PARAMETER (BOOT) EXPLANATION

CONFIGURATION

B Bottom For stacked products

comprising two or more Flash

die, the F1 die will be the

parameter conﬁguration as

designated in the product’s

part number.

T Top

Note: Refer to the speciﬁc product datasheet for parameter onﬁguration

details of the other ﬂash die in the stack (i.e., F2, F3, and so forth).

D Dual For stacked products

comprising two Flash die,

the F1 and F2 Flash dies are

conﬁgured as Bottom–Top.

Note: Products using the “D” parameter designator are limited to

W18/W30 and K18/K30 SCSP envelope line items, and the following

individual parts: RD/PF38F4462LLYDB0, RD48F4400L0ZDQ0,

RD48F3300L0ZDQ0, RD48F4400L0YDQ0, PF48F4400L0YDN0,

PF48F4400L0ZDN0 and RD48F3300L0YDQ0.

Ballout Decoder Table 5

CODE BALLOUT DEFINITION

B x16D Performance with DRAM

L “I” ballout

P Performance x32 ballout

Q QUAD/+ ballout

S Sync ballout, original 96-ball version

H x16 Split Bus

X Custom ballout; use in conjunction with

last character

58Fxxxx Product Density Decoder Table 6

SEQUENCE FLASH+RAM DIES EXPLANATION

CODE NO.

0012 256L (Bottom)/256L Bottom parameter

(Bottom)/256V conﬁguration

(Top)/128D

0012 256L (Top)/256L Top parameter

(Top)/256V conﬁguration

(Bottom)/128D

9999 TBD TBD

Notes: Flash and RAM die densities are referenced in Mbit, unless

noted otherwise. L = Flash Code Segment; V = Flash Data Segment;

D = DRAM; P = PSRAM; S = SRAM

developer.intel.com/design/ﬂash Intel®Flash Memory for Wireless Applications

Intel®Flash Memory for Wireless Applications developer.intel.com/design/ﬂash

1.8 VOLT INTEL STRATAFLASH®WIRELESS MEMORY (L18/L30)—

OUR FOURTH-GENERATION INTEL STRATAFLASH®MEMORY

1.8 Volt Intel StrataFlash®Wireless Memory (L18/L30) delivers the combination of wireless performance and Intel

StrataFlash memory value that today’s wireless handset developers require. L18/L30 is the world’s ﬁrst 1.8V Multi-Level

Cell (MLC) device offering wireless designers memory features needed for today’s rich wireless applications—high-

performance, high-density, and low-power operation. Delivered on Intel’s fourth-generation of MLC technology and 0.13 µm

process lithography, the L18/L30 enables highly reliable, high-performance, yet cost-effective wireless solutions. L18/L30

gives wireless products the capacity to do more while consuming less power in the process.

Key Messages

■1.8 Volt Intel StrataFlash Wireless Memory is the world’s ﬁrst low-power, high-density, multi-level cell ﬂash memory

based on 0.13-micron process technology

■1.8 Volt Intel StrataFlash Wireless Memory is a single chip solution offering high density and performance that today’s

wireless industry requires for increased data and new graphic-rich applications on today’s wireless handhelds

■1.8 Volt Intel StrataFlash Wireless Memory utilizes Intel’s industry-leading stacking technology to obtain densities

of up to 1Gb resulting in the industry’s lowest-power 1Gb code and data memory solution offered in a single package

Key Beneﬁts

■First 1.8 Volt MLC device on 0.13 µm process lithography

■Intel’s forth-generation MLC architecture offers highly reliable operation

■64-Mb, 128-Mb, and 256-Mb high-density devices

■Flexible 8 Mb and partitioning allows optimized memory usage

■Dual-mode RWW/E operation for high data throughput

■Burst and page mode support for 54 MHz bus speed allows fast code execution

1.8 Volt Intel StrataFlash Wireless Memory is Levels Above and Generations Ahead

1.8 VOLT INTEL®WIRELESS FLASH MEMORY (W18/W30)—

OUR HIGHEST PERFORMANCE FLASH DEVICE

Intel®1.8 Volt Wireless Flash memory (W18/W30) is the highest performance memory solution for wireless applications

and embedded designs requiring performance or low power.. W18/W30 integrates ﬂexible partition RWW/E architecture

with synchronous burst and asynchronous page mode read operations, state-of-the-art security-enabling features and low

1.8V operation. Additionally, the W18/W30 is fully supported by the Intel®Flash Data Integrator (Intel®FDI) software, which

enables effective management of code, data, and ﬁles in a ﬂash memory device. Intel 1.8 Volt Wireless Flash is Intel’s next-

generation RWW/E device offering innovative features and revolutionary performance.

Key Messages

W18/W30 combines four major innovations into one product:

■Flexible partition Read-While-Write/Erase (RWW/E) operation

■Synchronous burst and asynchronous page mode read operations

■1.8V operations (3.0V I/O option available)

■Enhanced Factory Programming (EFP)

These features make this the ideal RWW/E ﬂash memory solution for next-generation “voice plus data” cellular and

wireless applications.

developer.intel.com/design/ﬂash Intel®Flash Memory for Wireless Applications

COMPONENTS AT A GLANCE: DESIGN-IN PRODUCTS

DENSITY PRODUCT ORGANIZATION ACCESS TIME (ns) TEMP RANGE PACKAGE BALL COUNT VCC VPP/VPEN I/O

WIRELESS MEMORY PRODUCTS—LEADING-EDGE FEATURES FOR WIRELESS CODE EXECUTION AND DATA STORAGE APPLICATIONS

Intel StrataFlash®Wireless Memory (L18/L30)

256 Mb 28F256L18a 16M x 16 85[25]b[14]c, 115[30]b[18]c P GE 63 1.7–2.0V 0.9–2.0V or 9V 1.7–2.0V

28F256L30a 16M x 16 85[25]b[17]c, 115[30]b[25]c P GE 63 1.7–2.0V 0.9–2.0V or 9V 2.2–3.3V

128 Mb 28F128L18a 8M x 16 85[25]b[14]c, 105[25]b[17]c P GE 56 1.7–2.0V 0.9–2.0V or 9V 1.7–2.0V

28F128L30a 8M x 16 85[25]b[17]c, 110[25]b[20]c P GE 56 1.7–2.0V 0.9–2.0V or 9V 2.2–3.3V

64 Mb 28F640L18a 4M x 16 85[25]b[14]c, 105[25]b[17]c P GE 56 1.7–2.0V 0.9–2.0V or 9V 1.7–2.0V

28F640L30a 4M x 16 85[25]b[17]c, 110[25]b[20]c P GE 56 1.7–2.0V 0.9–2.0V or 9V 2.2–3.3V

Intel®Wireless Flash Memory (W18/W30)

128 Mb 28F128W18 8M x 16 65[20]b[11]c, 80[25]b[14]c E GE 56 1.7–1.95V 0.9–1.95V or 12V 1.7–2.24V

28F128W30 8M x 16 70[25]b[20]c, 85[25]b[22]c E GE 56 1.7–1.95V 0.9–1.95V or 12V 2.2–3.3V

64 Mb 28F640W18 4M x 16 60[20]b[11]c, 80[25]b[14]c E GE 56 1.7–1.95V 0.9–1.95V or 12V 1.7–2.24V

28F640W30 4M x 16 70[25]b[20]c, 85[25]b[22]c E GE 56 1.7–1.95V 0.9–1.95V or 12V 2.2–3.3V

32 Mb 28F320W18 2M x 16 60[20]b[11]c, 80[25]b[18]c E GE 56 1.7–1.95V 0.9–1.95V or 12V 1.7–2.24V

28F320W30 2M x 16 70[25]b[20]c, 85[30]b[20]c E GE 56 1.7–1.95V 0.9–1.95V or 12V 2.2–3.3V

Wireless Products Legend

Access Time Footnotes: Product Combinations Footnotes: Temperature Range Footnotes: Package Footnotes:

bPage Mode Access P= PSRAM E= Extended Temperature (-40°C to +85°C) GE = 0.75mm VF BGA

cSynchronous Burst Mode S= SRAM P= Expanded Temperature (-25°C to +85°C) RD = Intel®Stacked Chip Scale Package

LZ = Intel®UT-Stacked Chip Scale Package

ORDERING INFORMATION

T 28F 640 W 18GC70

Density/Organization

00X = x8

X00 = x16

Product Line Designator

for all Discrete Intel®

Flash products

Product Identifier

B = Advanced Boot Block

C = Advanced+ Boot Block

J = Intel StrataFlash® memory

K = Synchronous Intel StrataFlash®

memory

L = Intel StrataFlash® Wireless memory

S = FlashFile™ memory

W = Wireless

Access Speed (ns)

Process Identifier

A = 0.25 µm

C = 0.18 µm

D = 0.13 µm

Boot Position for

Boot Block products only

T = Top Boot

B = Bottom Boot

Voltage Options (VCC)

18 = 1.7–1.95V

3 = 2.7–3.6V

30 = 1.7–1.95V; 2.7–3.6 VCCQ

5 = 4.5–5.5V

Commercial Temperature: (0°C to +70°C)

SSOP

TSOP

PSOP

Easy BGA

SSOP

0.75mm VF BGA

0.75mm µBGA*

Easy BGA

PSOP

TSOP

Extended Temperature: (–40°C to +85°C)

Intel®Flash Memory for Wireless Applications developer.intel.com/design/ﬂash

INTEL®FLASH MEMORY SOFTWARE—FLASH FILE MANAGEMENT FOR YOUR

WIRELESS MEMORY SUBSYSTEM

Intel offers a comprehensive line of software solutions, each designed to meet speciﬁc system application needs. Intel offers

solutions for dynamic XIP code management, data storage, and code+data combined, which make the details of interfacing

to ﬂash memory ﬂexible and easy for the system software.

Intel®Flash Data Integrator (Intel®FDI)—Wireless Advantage

Intel Flash Data Integrator (Intel FDI) is the leading wireless real-time code+data solution that delivers a true XIP advantage

to get the most out of Intel Flash memory. Intel FDI manages code, data, and ﬁles in ﬂash memory within an open

architecture, including support for downloaded Java* applets, Bluetooth* ﬁle transfers, and voice recognition tags. The Intel

FDI architecture allows easy integration into most real-time operating systems.

Software Product Highlights:

■Combined with Intel StrataFlash memory, creates a low-cost and compelling package for cellular handset designs

■Built-in support for both software-based and hardware-based read-while-write for data-centric real-time systems

■Simple data storage Application Program Interface (API)

■File Manager provides data storage in the form of ANSI-style ﬁles, to simplify software design

■Code Manager provides storage and direct execution (XIP) of Java applets and native code

■Tested, debugged, documented, and easily ported C-source code reduces the time-to-market for OEMs

■Code size is only 60 to 200 Kbytes (depending on feature set)

E28F320J5

120

U91600597

Continuation of Part Number

Part Number

Logo

Finish Process Order (FPO)

TSOP

DT28F800

F3B95

Q487 ES

Continuation of Part Number

Part Number

Spec Number

Logo

Engineering Sample

SSOP

9U1600597

Plant Code

Last Digit Year

Work Week

FPO Number Information — TSOP/SSOP

Serial Number

Assembly Site Code

Change Indicator (optional)

Finish Process Order (FPO)

Part Number

Logo

Assembly Mark

Easy BGA

F128J3A

A028123S

120304

M© ’99

FPO Number Information — Easy BGA

Finish Process Order (FPO)

Part Number

Logo

Assembly Mark

VF BGA

F320C3BC

A1030510

3301ATBA

M© ’99

1A030510

Plant Code

Last Digit Year

Work Week

FPO Number Information — VF BGA

Serial Number

Manufacturing Code

Assembly Site Code

Part Number

Logo

Assembly Mark

µBGA*

F128W30T

120304

M© ’99

210304

Last Digit Year

Assembly Site Code

Work Week

Serial Number

Assembly Mark

Information — µBGA*

0A28123S

Plant Code

Last Digit Year

Work Week

Serial Number

Manufacturing Code

Assembly Site Code

developer.intel.com/design/ﬂash Intel®Flash Memory for Wireless Applications

FEATURES BENEFITS

File Manager ■ANSI-style ﬁle storage

■Meta-data support for ﬁle name, size, date/time stamp, owner,

and permissions

■Multiple open items for high-performance access

■Enables easier coordination between software development teams

by providing an alternative to numeric data identiﬁers

Code Manager ■Store, update, and delete code segments

■XIP of code for high performance

■Enables downloaded software such as Java applets

Read-While-Write ■Takes advantage of hardware-based RWW on dual- and multi-partition

ﬂash memory devices

■Software-based RWW enables real-time data management on single-

partition ﬂash memory

Robust power-loss recovery and wear-leveling ■Recovers most current data when power is lost during writes

■Ensures better cycling endurance for ﬂash memory

Royalty-free license when using Intel®Flash devices ■No incremental product costs

Comprehensive support for Intel®Flash memory features ■Compatible with the newest ﬂash memory technology

Intel®Persistent Storage Manager (Intel®PSM)—The Ideal Windows* CE Solution

Intel®Persistent Storage Manager (Intel®PSM) is the reliable executable storage solution that offers code+data+registry

backup in one Intel Flash memory for enterprise Windows* CE systems. Intel PSM software works in conjunction with

the ﬁle system in the Microsoft Windows CE (PocketPC and SmartPhone) OS to provide simultaneous access to separate

code and ﬁle partitions in the same chip. Unlike other data-only storage solutions, the code can be direct executed (XIP),

demand-paged, or memory-mapped.

Software Product Highlights:

■Enables one of the most efﬁcient memory system architectures in the marketplace for Windows CE

■Combines key memory functions into a single ﬂash memory or bank

■Code Execution manages simultaneous read and write/erase operations

■Data Storage provides Microsoft Windows CE OS-compliant installable ﬁle system with power loss protection

and wear-leveling

■Registry Backup and Restore enables pre-OS registry restore functions

■Maximizes beneﬁts of Intel StrataFlash memory

■Cost-effective storage

■Reliable system backup

■Less board space, lower component count

■Easily integrated installable ﬁle system and device driver

■Pre-OS library ﬁle plus ﬁle system DLL

■Fully compliant with Microsoft Windows CE .NET operating system, PocketPC, and SmartPhone

FEATURES BENEFITS

Executable code and data storage in the same chip ■Efﬁcient use of all memory space in the design

■Greater design ﬂexibility

■Reduces power consumption, component count, and required board space

■Maximizes value of ﬂash memory

File system with robust power-off recovery ■Media will not corrupt if power is lost during a ﬁle modiﬁcation

■Allows Intel StrataFlash®memory to be used as ﬁle storage

■Extends effective erase cycle endurance

Pre-OS registry recovery and save ■More reliable and efﬁcient recovery from registry corruption events

Intel®Flash Memory for Wireless Applications developer.intel.com/design/ﬂash

Intel®Virtual Small Block File Manager (Intel®VFM)—Easy to Integrate

Intel®Virtual Small Block File Manager (Intel®VFM) is the proven, ﬂexible, easy-to-integrate ﬂash ﬁle manager for

embedded systems. Intel VFM is Intel’s Flash software reference code which provides for disk-like sector and ﬁle access

to Intel Flash. In addition to data storage capability, VFM also accommodates handling code in the same component.

Software Product Highlights

■Broadbase solution for embedded ﬂash components

■Intel-developed code creates virtual small-block (VSB) sectors in the larger ﬂash erase blocks

■File system sector calls are translated to Intel Flash standard commands

■VSB Flash Media Manager handles ﬂash read/erase/write, wear-leveling, and sector management

■Intel VFM can work as the ﬁle manager or with an existing one

■Reserved Blocks allows for integration of code, or other capabilities, with the data storage features of Intel VFM

■Virtual Component support allows for optimal ﬂash array utilization

■Small code size (14–20KB of code and 2–8KB RAM)

■High-performance edit capability

■Robust power-off recovery and media cleanup

FEATURES BENEFITS

C source code ■Easy porting to a wide variety of applications

■Enhancements or changes can be handled by the OEM

CFI enabled ﬂash routines ■Supports a wide range of current and future Intel®Flash components

Complete documentation ■Porting Guide, User’s Guide, Overview, etc., provides quick access to

information to understand the code

Reserved ﬂash region ■Facilitates code handling in same component with data

Royalty-free and derivative right license ■Lower cost

■Own your own solution

Intel®Flash Memory Software

SUPPORTED COMPONENTS S/W SOLUTIONS

Intel®FDI Intel®VFM Intel®PSM

Wireless

L18/L30 ■❑■

LV18/LV30 ■❑■

W18/W30 ■❑

Mainstream

J3 ■■■

K3, K18 ■■■

Basic

C3, B3 ■❑

■Fully supported and validated

❑Code modiﬁcations required

If you wish to get Intel®Flash Software, please order a physical copy of the software product’s user’s guide. Instructions on

how to download the software from our Web site will be shipped with the manuals.

Intel®Flash Memory Documentation

For a complete list and to download available literature, visit our ﬂash memory Web site at:

http://developer.intel.com/design/ﬂash

developer.intel.com/design/ﬂash Intel®Flash Memory for Embedded Applications

Embedded applications increasingly require rugged, versatile memory solutions. Designers need to accommodate features

and functionality, while protecting the end-user’s hardware investment. As the world’s leading supplier of ﬂash memory,

Intel’s combination of supply availability, innovative product offerings, high-quality standards, and superior customer support

result in embedded memory subsystem solutions unrivaled in the industry. When it comes to embedded memory solutions,

reliable high-density, low-cost ﬂash memory from Intel is the answer.

3 VOLT INTEL STRATAFLASH®MEMORY (J3 FAMILY)—

SECOND-GENERATION INTEL STRATAFLASH®MEMORY ARCHITECTURE

Intel StrataFlash®memory components utilize reliable and proven two-bit-per-cell technology to deliver 2x the memory

in 1x the space, offering high-density ﬂash at low cost. Intel StrataFlash memory offers exceptional value and reliability

with over four generations of products and 100 million units shipped. Intel StrataFlash Memory (J3) is the best value for

mainstream applications requiring both performance and large space for code and data storage. Available in densities up to

256 Mbit (32 Mbyte), J3 is the highest density NOR-based ﬂash component available in high-volume manufacturing today.

On Intel’s 0.18-micron technology, J3 sets a new benchmark for fast read speeds by adding both a four and eight word page

mode feature. Page mode reads are up to three times faster than asynchronous reads on standard ﬂash memory devices. J3

also offers a high-performance glueless interface to a myriad of processors for various applications (see CPU to Flash

Solution Matrix at http://developer.intel.com for details).

This success of Intel’s StrataFlash memory over the past six years has resulted in other ﬂash memory manufacturers

producing compatible parts to Intel’s J3 product family.

FEATURES BENEFITS

Intel®MLC Technology Over six years of leading-edge reliability, performance, and value

32-, 64-, 128-, 256-Mb densities Lowest cost-per-bit NOR devices

56-lead TSOP package Over 100 million TSOP packages shipped

64-ball Easy BGA package Long-term size and footprint capability; 50 percent smaller than

56-lead TSOP

Common Flash Interface (CFI) Compatibility with future products today

One-Time-Programmable protection registers 64 bits programmed at the factory with a unique ID, and 64 bits can

be programmed by the OEM; traceability, license control, and system

authentication

Page Mode Interface Page access mode improves read performance up to 3x

Complete selection of Intel®Flash Management Software Dramatically reduces the time-to-market for OEMs and is easily ported

to OEM's environment.

Intel

Flash Memory

for Embedded Applications

INTEL®ADVANCED+ BOOT BLOCK FLASH MEMORY (C3/B3 FAMILY)

The Intel®3 Volt Advanced+ (C3) and Advanced Boot Block (B3) Flash memory family is the world’s ﬁrst ﬂash memory

on the 0.13 µm process lithography—Intel’s ﬁfth generation of its successful boot block memory products. Intel’s C3 and

B3 products are the industry’s most widely used ﬂash memory. Designed for a diverse range of applications, the Advanced+

and Advanced Boot Block devices are available in 16- to 64-Mbit densities, with access times up to 70 ns. Packaged offerings

include 48-lead TSOP, 48-ball VF BGA, 64-ball Easy BGA, and 8 x 9 matrix Stacked Chip Scale Package. By using the

same package conﬁguration, designers can easily migrate from one density to another across ﬁve generations of boot block

products.

FEATURES BENEFITS

Intel’s 0.13 µm process lithography ■Ideal solution for next-generation applications

High performance ■70 ns access times @ 2.7–3.6V Vcc operation

■Full Extended Operating Temperature: -40 °C to +85 °C

■12V Vpp fast programming option improves throughput time for lower

manufacturing costs

Full range of easy-to-upgrade, pin-compatible densities ■16 Mb, 32-Mb and 64-Mb densities for diverse application needs

TSOP, VF BGA, Easy BGA and Stacked Chip Scale Packaging ■Wireless and broad market package offerings

■Industry-standard JEDEC packaging

■Proven package reliability

■VF BGA and Stacked-CSP ﬂash for space-constrained applications

■Consistent package footprint across densities makes migrations easier

Instant individual block locking (C3 only) ■Ensures immediate data protection for individual blocks

128-bit fraud protection register (C3 only) ■Unique ID and OTP enables fraud protection capabilities

3 VOLT SYNCHRONOUS INTEL STRATAFLASH®MEMORY (K3/K18 FAMILY)

The Synchronous Intel StrataFlash memory product provides a high-performance burst-mode interface and other

additional features to the Intel StrataFlash memory family of products. Looking forward, the K3/K18 family of products

is expected to only be supported through 2007. For designs requiring support beyond the K3/K18 life cycle, there are

currently two choices. For designs that require the performance of a Synchronous interface, focus on the W18/30 products.

Information on these products can be found in the “Intel®Flash Memory for Wireless Applications” chapter. For designs

requiring higher densities up to 256Mb, refer to the J3 family of products earlier in this chapter.

Intel®Flash Memory for Embedded Applications developer.intel.com/design/ﬂash

developer.intel.com/design/ﬂash Intel®Flash Memory for Embedded Applications

FEATURES BENEFITS

Intel®MLC Technology Over ﬁve years of proven reliability, performance, and value

256-Mb, 128-Mb, 64-Mb densities Industry leading, highest density NOR ﬂash

Page and Burst Mode Interfaces Page and burst modes improve read performance up to 5x

Complete selection of Intel®Flash management software Dramatically reduces the time-to-market for OEMs and is easily ported

to OEMs’ environment

Buffered Enhanced Factory Programming (BEFP) BEFP speeds up MLC ﬂash programming up to 80 percent for today’s

beat-rate sensitive manufacturing environments

One-Time-Programmable protection registers 64 bits programmed at the factory with a unique ID, and 2K bits can be

programmed by the OEM; traceability, license control, and system

authentication

Common Flash Interface (CFI) Compatibility with future products today

64-ball Easy BGA package Long-term size and footprint capability; 50 percent smaller than 56-lead

TSOP

VF BGA package and Intel®Stacked-CSP Small packaging for wireless applications

INTEL®FLASH MEMORY DEVELOPMENT TOOLS

Intel®Flash memory tools reduce product development time and save money by getting your product to the market faster.

Intel and third-party vendors worldwide provide a wide range of tools for all stages of the product development cycle.

Information and vendor URL links pertaining to these tools are located on the World Wide Web at the Intel®Flash Memory

Tools and Software site and in the Electronic Tools Catalog. The Electronic Tools Catalog contains thousands of tools from

more than 200 companies. These tools provide solutions for the deﬁnition, design, prototype, and production stages of the

product development cycle.

Examples of Intel Flash memory tools range from pre-silicon software models, PCB layout ﬁles, Intel®software,

programming products, information and services, test accessories, PCB design guidelines, SMT manufacturing tips, and

rework equipment. Many other items are available on Intel’s Web site, including Chip Scale Package (CSP) information,

product information, application notes, datasheets, and online ordering of hard-copy manuals, such as the Intel®Flash

Memory Tools Guide.

TOOL HIGHLIGHTS

Deﬁnition and Design Tools Prototype and Production Tools

• IBIS, VHDL, and Verilog software models • PCB contract manufacturers

• PCB ﬂexible layout and escape routing gerber ﬁles • Programming Tools Web page,

• Schematic symbol ﬁles (developer.intel.com/design/ﬂash/swtools/tools.htm), onboard

• Media/ﬁle managers, templates, and utility software (JTAG/ATE), off-board, application notes, etc.

• Intel®Flash memory SOFTWAREBuilder • Programmers: engineering, concurrent, gang, and automated

• Intel®Flash memory packaging technology • Programming, prototype, and production sockets and adapters

• Programming and shipping media services

• Tape and reel equipment and services

• SIMM/DIMM manufacturers

• Test accessories

• Rework equipment

Intel®Flash Memory for Embedded Applications developer.intel.com/design/ﬂash

FEATURES BENEFITS

Programming tools, sockets and support Variety of programming solutions that improve your ﬂash memory

programming process by decreasing development times, lowering costs,

and improving production capabilities.

Intel also works proactively with many programming companies and socket

manufacturers to ensure reliable programming hardware and software

support is available for Intel®Flash memory products.

Pre-silicon software models (IBIS, VHDL, and Verilog) Assists the designer in evaluating design functionality and/or electrical

characteristics of Intel Flash memory components through software

simulation.

PCB ﬂexible layout and escape routing ﬁles Software-based ﬁles that allow for multiple Intel Flash memory packages

to be designed into a single PCB land pad area or escape routing designs

for Intel Flash memory CSPs. Files can be downloaded directly for PCB

design.

Media/ﬁle managers, templates, and utility software Software-based ﬁles that provide standard schematic symbols, software

management functions, low-level ﬂash access routines to help simplify

your product development.

Test accessories Test accessories include a variety of test debug tools usually used in the

prototype and production stage of product development. These tools range

from vacuum wands and handling procedures to test clip and access

ﬁxtures for all Intel Flash Memory packages.

Rework equipment Reviews rework systems that encompass multiple process steps such as

component removal, site redress, solder paste application, split-vision part

placement, and reﬂow oven on the same system.

developer.intel.com/design/ﬂash Intel®Flash Memory for Embedded Applications

COMPONENTS AT A GLANCE: DESIGN-IN PRODUCTS

DENSITY PRODUCT ORGANIZATION ACCESS TIME (ns) TEMP RANGE PACKAGE NUMBER PINS VCC VPP/VPEN I/O

MAINSTREAM MEMORY PRODUCTS—COST-EFFECTIVE FLASH MEMORY FOR MAINSTREAM CODE EXECUTION AND DATA STORAGE APPLICATIONS

Intel StrataFlash®Memory (J3)

256 Mb 28F256J3 32M x 8 or 16M x 16 125[30]b E TE/RC 56/64 2.7–3.6V 3V 2.7–3.6V

128 Mb 28F128J3 16M x 8 or 8M x 16 120[25]b E TE/RC 56/64 2.7–3.6V 3V 2.7–3.6V

64 Mb 28F640J3 8M x 8 or 4M x 16 115[25]b E GE/TE/RC 48/56/64 2.7–3.6V 3V 2.7–3.6V

32 Mb 28F320J3 4M x 8 or 2M x 16 110[25]b E GE/TE/RC 48/56/64 2.7–3.6V 3V 2.7–3.6V

Synchronous Intel StrataFlash®Memory (K3/K18)

256 Mb 28F256K3 16M x 16 120[25]b[13]c E GE/RC 63/64 2.7–3.6V 3V 2.375–3.6V

28F256K18 16M x 16 120[30]b[15]c E GE/RC 63/64 2.7–3.6V 3V 1.65–1.95V

128 Mb 28F128K3 8M x 16 115[25]b[13]c E GE/RC 56/64 2.7–3.6V 3V 2.375–3.6V

28F128K18 8M x 16 115[30]b[15]c E GE/RC 56/64 2.7–3.6V 3V 1.65–1.95V

64 Mb 28F640K3 4M x 16 110[25]b[13]c E GE/RC 56/64 2.7–3.6V 3V 2.375–3.6V

28F640K18 4M x 16 110[30]b[15]c E GE/RC 56/64 2.7–3.6V 3V 1.65–1.95V

BASIC MEMORY PRODUCTS—DEPENDABLE AND MOST WIDELY USED FLASH MEMORY

Intel®Boot Block Flash Memory (C3, B3)

64 Mb 28F640C3 4M x 16 80 E TE, GE/RC 48/64 2.7–3.6V 1.65–3.6V or 12V 1.65–2.5V or 2.7–3.6V

32 Mb 28F320C3 2M x 16 70, 90 E TE, GE/RC 48/64 2.7–3.6V 1.65–3.6V or 12V 1.65–2.5V or 2.7–3.6V

28F320B3 2M x 16 70, 90 E TE, GE 48 2.7–3.6V 2.7–3.6V or 12V 1.65–2.5V or 2.7–3.6V

16 Mb 28F160C3 1M x 16 70, 90 E TE, GE/RC 48/64 2.7–3.6V 1.65–3.6V or 12V 1.65–2.5V or 2.7–3.6V

28F160B3 1M x 16 70, 90 E TE, GE 48 2.7–3.6V 2.7–3.6V or 12V 1.65–2.5V or 2.7–3.6V

* Speed @ 3.0-3.6V. 3 Volt Boot Block parts are marked with 2.7–3.6V Vcc speeds.

Embedded Products Legend

Access Time Footnotes: Temperature Range Footnotes: Package Footnotes:

b Page Mode Access C= Commercial Temperature (0°C to +70°C) Commercial Temperature: (0˚C to +70˚C)

c Synchronous Burst Mode E= Extended Temperature (-40°C to +85°C) DA = SSOP PA = PSOP

P= Expanded Temperature (-25°C to +85°C) E= TSOP RC = Easy BGA

Extended Temperature: (-40˚C to +85˚C)

DT = SSOP TB = PSOP

GE = 0.75mm VF BGA TE = TSOP

RC = Easy BGA

† Temperature range on Intel®Stacked Chip Scale Package/CSP (-25°C to +85°C)

Intel®Flash Memory for Embedded Applications developer.intel.com/design/ﬂash

ORDERING INFORMATION

Intel®Flash Memory Documentation

For a complete list and to download available literature, visit our ﬂash memory Web site at:

http://developer.intel.com/design/ﬂash

T 28F 640 W 18GC70

Density/Organization

00X = x8

X00 = x16

Product Line Designator

for all Discrete Intel®

Flash products

Product Identifier

B = Advanced Boot Block

C = Advanced+ Boot Block

J = Intel StrataFlash® memory

K = Synchronous Intel StrataFlash®

memory

L = Intel StrataFlash® Wireless memory

S = FlashFile™ memory

W = Wireless

Access Speed (ns)

Process Identifier

A = 0.25 µm

C = 0.18 µm

D = 0.13 µm

Boot Position for

Boot Block products only

T = Top Boot

B = Bottom Boot

Voltage Options (VCC)

18 = 1.7–1.95V

3 = 2.7–3.6V

30 = 1.7–1.95V; 2.7–3.6 VCCQ

5 = 4.5–5.5V

Commercial Temperature: (0°C to +70°C)

SSOP

TSOP

PSOP

Easy BGA

SSOP

0.75mm VF BGA

0.75mm µBGA*

Easy BGA

PSOP

TSOP

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developer.intel.com/design/storage I/O Products

INTEL’S I/O PROCESSORS (IOP)

Intel’s I/O processor family offers 32-bit microprocessor products that are designed to enable high-performance I/O

solutions. These I/O processors have been designed from the ground up optimizing and balancing dataﬂow in order to

deliver the highest I/O throughput possible. Intel’s I/O processors range from high-frequency discrete products to fully

integrated devices offering all of the required components of a complete I/O solution such as a PCI-X interface or bridge,

memory controller, high-performance core, and an XOR engine (for RAID 5 parity generation).

Intel’s I/O processor family is speciﬁcally designed to increase system-level performance by off-loading many of the

I/O tasks traditionally handled by the host processor. From a system-level standpoint, an I/O processor can reduce the

utilization of the host CPU by servicing I/O requests and interrupts without host intervention, resulting in a signiﬁcant

increase in overall performance of servers. Intel’s I/O processors provide high I/O performance and better system balance,

improving scalability and performance. Applications that can best utilize these features include networked storage

applications, servers, SAN, NAS, RAID adapter cards, LAN adapter cards, computer telephony devices, networking devices

and other I/O-intensive systems. Intel’s I/O processors have also found usage in VoIP, iSCSI, Video processing, set-top boxes,

control plane processing, medical and others.

Intel®IOP331 I/O Processor with Intel XScale®Microarchitecture

The Intel®IOP331 is a highly integrated I/O system on a chip for I/O-intensive storage, networking, communications, and

embedded applications. The IOP331 features an 800 MHz CPU, high-performance internal bus, dual-ported memory

controller, a high-bandwidth PCI-X to PCI-X Bridge, and an improved interrupt controller to provide a high-performance,

highly integrated processor solution. Target applications include PCI/PCI-X host-based adapters (RAID cards, iSCSI cards,

FC cards, Security/SSL NICs, etc.), control plane and system controller applications utilizing PCI/PCI-X as a system

interconnect and/or backplane Virtual Private Network devices, video servers, Network gateways, Network Attached Storage,

External Storage Arrays), PCI/PCI-X-based line cards (VoIP, Routers, etc.), and a host of other applications that require a

highly integrated, high-performance system on a chip processor.

As Intel’s sixth-generation I/O processor, the IOP331 continues to build on Intel’s strength in delivering high-performance,

low-power Intel XScale®technology processors. The IOP331 is code compatible with the Intel®IOP321 I/O Processor, other

Intel XScale core processors, and ARM*-based devices, simplifying code porting from existing designs. The IOP331

provides ultra-fast memory transactions due to its Double Data Rate (DDR) SDRAM dual-ported memory controller that

supports up to 2 GB of DDR 333 MHz memory or 1 GB of DDRII 400 MHz memory. The memory controller supports

32-bit or 64-bit memory subsystems with or without ECC. The IOP331 features a new dual-ported memory controller that

provides both a direct port from the CPU to memory (core port) and a port from the ATU/internal bus to memory (internal

bus port).

The Intel IOP331 also has made signiﬁcant improvements to the interrupt controller in order to reduce interrupt latency.

The interrupt controller includes an advanced vector generator for both FIQ and IRQ interrupts, delivering the vector directly

to the interrupt service routine, saving software overhead. Also included is an interrupt prioritizer that uses a two-bit ﬁeld for

each interrupt source to provide four levels of interrupt priority.

Intel

I/O Processors

I/O Products developer.intel.com/design/storage

FEATURES BENEFITS

■500/667/800 MHz Intel XScale®core High performance with low power

■Integrated, System on a chip design

Dual PCI/PCI-X Interfaces PCI-X to PCI-X Bridge integration lowers BOM cost and helps reduce

■Integrated PCI-X Bridge board space

■Up to 133 MHz operation

■2 DMA units with chaining support

■Support to conﬁgure the device from remote PCI host

Optimized Memory Controller Intel XScale core has direct memory access resulting in much improved

■DDR 333 and DDRII 400 with ECC performance

■64-, 72-bit memory, and 32-bit mode also supported

Communications Integration helps reduce board space and lower BOM cost

■I2C*

■UARTs

■16-bit local bus with two chip selects

■8 GPIO pins

Application Accelerator Units in DMA Application-speciﬁc integration in hardware improves RAID5 and iSCSI

■RAID5 XOR performance and helps reduce CPU overhead

■iSCSI CRC32C

Intel XScale®80219 General-Purpose PCI Processor

The Intel XScale®80219 general-purpose PCI processor is a single-chip solution that opens the door to cost sensitive,

high-performance embedded application use. The 64-bit PCI-X interface is one of several enticing features. The 80219

processor’s 64-bit PCI-X interface is fully backward compatible to PCI 2.2 standards enabling easy interface to cheaper PCI

components today, and the PCI-X 1.0a compatibility makes it simple to upgrade to PCI-X in the future. The 133 MHz 64-bit

PCI-X interface achieves up to 1 GB per second throughput. The internal bus operates at 200 MHz delivering internal

bandwidth of up to 1.6 GB/second. The 80219 also features a 200 MHz DDR SDRAM controller with ECC that supports up

to 1 GB of 64-bit DDR SDRAM. The 32-bit local bus is programmable at 33, 66 and 100 MHz making it simpler to develop

embedded applications requiring a connection to non-PCI peripheral components such as ASICs, Flash memory, or DSPs.

The 80219 is a highly integrated chip with the high performance and bandwidth necessary to serve a wide range of

embedded applications such as industrial controllers, low-end networking, set-top boxes, compact PCI, digital surveillance

security, vision inspection equipment, personal storage appliances, control plane processing, Voice over Internet Protocol

(VoIP) blades and devices, print imaging devices and a host of other applications requiring high performance and low power

in a tightly integrated environment.

The 80219 general-purpose PCI processor introduces a powerful combination of integrated features. The 133 MHz PCI-X

interface achieves up to 1 Gbyte per second throughput, a two-fold increase over 66 MHz PCI. The internal bus operates at

200 MHz and offers internal bandwidth of up to 1.6 Gbytes/second. The 80219 also features a 200 MHz DDR SDRAM

controller with ECC that supports up to 1 Gbyte of 64-bit DDR SDRAM. It also supports 32-bit memory for applications that

are more space and cost sensitive. It contains a programmable (33, 66, 100 MHz), 32-bit local bus that is excellent for

embedded applications requiring connections to non-PCI peripheral components such as ASICs, ﬂash memory, or DSPs.

developer.intel.com/design/storage I/O Products

FEATURES BENEFITS

400, 600 MHz Intel XScale®Core High-performance with low power

Integrated, System-On-A-Chip Design Smaller packaging for board space cost savings

64-bit PCI 2.2 Interface Industry Standard I/O Bus allowing ﬂexible inexpensive interconnect

133 MHz PCI-X 1.0a Interface Easy upgrade to higher speed I/O interconnect

200 MHz DDR SDRAM Bus Higher memory performance for higher system performance

Up to 1GB memory support Supports large memory subsystems when necessary

1.6 GB/s Internal Bus Increases overall design performance

32-bit Local Bus Excellent for embedded applications requiring non-PCI peripherals

such as ASICs, DSPs, or ﬂash

8 GPIOs

4 SDRAM Output Clocks Reduces chip count Saves board space

2 Programmable Timers

Intel®IOP315 I/O Processor Chipset with Intel XScale®Technology

The Intel®IOP315 chipset—Intel®80200 processor and Intel®80314 companion chip—dramatically improves upon the

performance of the ﬁrst-generation I/O processor chipset (Intel®IOP310).

The IOP315 2-chip combo touts a 60 percent performance increase over the previous pair. The performance is scalable

with either single or dual core options. Thanks to the Intel XScale microarchitecture, developers of a variety of applications

can optimize the needs from ultra-low power of high-performance processing. This new microarchitecture is compliant with

the ARM* Version 5TE instruction set (excludes the ﬂoating-point instruction set).

I/O Products developer.intel.com/design/storage

High-performance companion chip for the Intel®80200 processor

The Intel®80314 companion chip for the Intel®80200 processor provides a rich peripheral set designed for storage and

network applications. The Intel 80314 can support either one or two Intel 80200 processors. The Intel 80314 uses an

internal switch fabric and supports concurrent transactions from any interface to any other interface. For fast memory

transactions, the Intel 80200 processor interface has a dedicated bus to the DDR SDRAM memory controller that allows

multiple concurrent outstanding transactions.

The Intel 80314 is especially well suited for high-performance storage applications such as network storage target devices

(SAN, iSCSI, NAS) and intelligent network adapter cards (iSCSI, IPv4, IPv6, IPSec). The integrated PCI-X bridge, dual-

ported ECC memory, low-latency 1 MB SRAM, high-bandwidth switch fabric and CRC32C and XOR engines make it an

ideal choice for these applications. In addition, the Intel 80314 is an excellent solution for embedded and networking

applications with its integrated dual-10/100/1000 Mbps MACs and ﬂexible endian support.

FEATURES BENEFITS

Intel®80200 Interface High-performance Intel XScale®technology that scales

■100 MHz Request Bus

■4-Entry Request Buffer

■2.5V I/O generation, 3.3V tolerant (from Intel 80200)

■Support for single or dual Intel 80200 processors

■ECC-based bus integrity protection

Dual PCI/PCI-X Interfaces PCI-X to PCI-X bridge integration lowers Bill of Material (BOM) cost

■Integrated PCI-X bridge and helps reduce board space

■25–133 MHz operation Provides for increased system concurrency

■4 DMA units with chaining support

■Support to conﬁgure the device from remote PCI host

■CPCI hot-swap support

■5V tolerant/3.3V I/O

■4 concurrent split transactions

■Conﬁgurable arbitration logic

Optimized Memory Controller Dramatically increases core to memory performance

■Dual-ported MCU

■64- and 72-bit memory

■12 GB support, 3 DIMMs

Optional 1 MB of Low-Latency SRAM Low-latency memory option helps reduce bottlenecks and improve

performance

Communications Integration reduces board space, lowers BOM, and improves performance

■2 GbE MACs

■133 MHz, 32-bit local bus with 4-chip selects

■I2C*

■UARTs

■8 GPIO pins

Application Accelerator Units in DMA Storage-speciﬁc integration in hardware improves performance

■RAID5 XOR and helps reduce CPU overhead

■iSCSI CRC32C

developer.intel.com/design/storage I/O Products

Intel®IOP321 I/O Processor

The Intel®IOP321 I/O processor is Intel’s ﬁfth-generation I/O processor. It is the ﬁrst I/O processor to integrate an Intel

XScale core and a PCI-X interface. Many storage, networking, and embedded applications require fast I/O throughput

for optimal performance. The Intel IOP321 is a highly integrated, cost-effective I/O system on a chip that delivers a two-fold

performance boost over its predecessor, the Intel®IOP310 I/O processor chipset, in I/O-intensive applications.

The Intel IOP321 is especially well suited to storage applications including RAID (Redundant Array of Independent

Disks), HBAs (Host Bus Adapters), and ROMB (RAID on motherboard). Its small package size, high data throughput, and

integrated AAU/XOR provide an optimized solution for ROMB applications. In addition, the Intel IOP321 processor is an

ideal choice for applications requiring a high-performance I/O subsystem in a tightly-integrated environment.

The Intel IOP321 offers the ﬂexibility to interface with a wide variety of different interconnect technologies, including

SCSI, Fibre Channel, SATA, IB, and GBit Ethernet. Utilization of the Intel IOP321 across multiple applications can

contribute to cost savings, ease of development, and more effective inventory management.

FEATURES BENEFITS

400, 600 MHz Intel XScale®Core High-performance with low power

Integrated, System-On-A-Chip Design Smaller packaging, board space cost savings

133 MHz PCI-X Interface Industry-Standard I/O Bus

200 MHz DDR SDRAM Bus Higher memory performance

Up to 1GB memory support Two-fold increase in total memory addressability

32 bit Local Bus Excellent for embedded applications requiring non-PCI-X peripherals

such as ASICs, DSPs, or glueless FLASH

8 GPIOs Reduces chip count

4 SDRAM Output Clocks Saves board space

2 Programmable Timers Simpliﬁes design

AAU/XOR Integrated data protection for RAID; cuts board cost/space

I/O Products developer.intel.com/design/storage

Intel®IOP303 I/O Processor

The Intel®IOP303 I/O processor, Intel’s third-generation I/O processor, provides developers with a fully validated, single-

chip solution that can deliver a 25 percent increase over the Intel®i960®RN processor in I/O performance in RAID 0

applications.

While the Intel IOP303 I/O processor is based on the Intel i960 processor core, the chip inaugurates a new naming

convention for Intel®I/O processors. The new “Intel®IOP300” series name provides an easier reference for continuing

performance increases on Intel’s I/O processor roadmap.

The Intel IOP303 I/O processor continues Intel’s commitment to strong I/O performance, delivered with high-integration.

In addition to its integrated 66 MHz PCI-to-PCI bridge, other enhanced integrated features include a 100 MHz internal bus

and 100 MHz SDRAM controller, XOR engine, SDRAM clocks, secondary PCI clocks and eight general-purpose I/O

registers, all on a single chip. Compared to the Intel i960 RN I/O processor, maximum accessible memory has been increased

from 128 Mbytes to 512 Mbytes of SDRAM. The chip supports both the 5V and 3.3V PCI 2.2 speciﬁcations.

FEATURES BENEFITS

Single chip, integrated I/O processor Integration. Pre-validated, fast time-to-market solution

66 MHz, 64-bit PCI-to-PCI bridge Standards. High data bandwidth and PCI compliant

64-bit, 100 MHz internal bus Data throughput. 800Mbps peak bandwidth for optimum data ﬂow

Two address translation units ATU. Maps PCI memory space onto the internal bus for high-performance,

direct processor access

Three channel DMA controller DMA. Transfers blocks of data between the PCI bus and the local

■Two channels between primary PCI bus and local memory processor memory at a maximum throughput of 528Mbps

■One channel between secondary PCI bus and local memory

Application accelerator unit (integrated hardware XOR engine) XOR. Supports fast parity generation for applications such as RAID

levels 3 and 5

Performance Monitoring Unit (PMU) Performance tuning. Providing monitoring capabilities of 98 discrete

events to assist in ﬁne-tuning applications for maximum performance

Integrated memory controller Memory. Supports 100 MHz SDRAM, also ﬂash memory

I2C* bus interface unit System management. Supports server management features

(temperature control, LCD display)

I/O PROCESSORS LINE CARD

CORE PCI BUS

PRODUCT SPEED (MHz) SPEED (MHz) PCI CACHE AAU PMU LOCAL BUS PACKAGE

Intel®80331M500 500 133(PCI-X) 64-bit PCI-X bridge 32K I cache, 32K D cache Yes Yes 16 bit 829L FCBGA

Intel®80331M667 667 133(PCI-X) 64-bit PCI-X bridge 32K I cache, 32K D cache Yes Yes 16 bit 829L FCBGA

Intel®80331M800 800 133(PCI-X) 64-bit PCI-X bridge 32K I cache, 32K D cache Yes Yes 16 bit 829L FCBGA

Intel®80219M400 400 133(PCI-X) 64-bit PCI-X Interface 32K I cache, 32K D cache No Yes 32 bit 544L PBGA

Intel®80219M600 600 133(PCI-X) 64-bit PCI-X Interface 32K I cache, 32K D cache No Yes 32 bit 544L PBGA

Intel®80314GN N/A 133(PCI-X) 2 x 64-bit N/A Yes Yes 32 bit 1027L HSBGA

PCI-X Interfaces

Intel®80314GS N/A 133(PCI-X) 2 x 64-bit 1MB SRAM Yes Yes 32 bit 1027L HSBGA

PCI-X Interfaces

Intel®80321M400 400 133(PCI-X) 64-bit PCI-X Interface 32K I cache, 32K D cache Yes Yes 32 bit 544L PBGA

Intel®80321M600 600 133(PCI-X) 64-bit PCI-X Interface 32K I cache, 32K D cache Yes Yes 32 bit 544L PBGA

Intel®80200M200 200 N/A N/A 32K I cache, 32K D cache N/A N/A No 241L PBGA

Intel®80200M200T 200 N/A N/A 32K I cache, 32K D cache N/A N/A No 241L PBGA

Intel®80200M400* 400 N/A N/A 32K I cache, 32K D cache N/A N/A No 241L PBGA

Intel®80200M400T* 400 N/A N/A 32K I cache, 32K D cache N/A N/A No 241L PBGA

Intel®80200M600* 600 N/A N/A 32K I cache, 32K D cache N/A N/A No 241L PBGA

Intel®80200M600T* 600 N/A N/A 32K I cache, 32K D cache N/A N/A No 241L PBGA

Intel®80200M733* 733 N/A N/A 32K I cache, 32K D cache N/A N/A No 241L PBGA

Intel®80200M733T* 733 N/A N/A 32K I cache, 32K D cache N/A N/A No 241L PBGA

Intel®80303 100 66 64-bit PCI-to-PCI bridge 16K I cache, 4K D cache Yes Yes No 540L PBGA

* The Intel®80200Mxxx and Intel®80312 constitute the “Intel®IOP310 chipset.”

developer.intel.com/go/networkprocessors Network Processors

Intel®network processors combine the high performance and low power consumption of Intel XScale®technology with an

easy-to-use programming framework that enables ﬂexible implementation of rich networking services at line rates up to

OC-192/10 Gbps. They are designed to meet the specialized packet handling requirements of market segments ranging from

customer premises equipment, to access, edge and the core of the network, and up through platforms that support secure

content processing.

Network Processors covered in this section are:

■Intel®IXP2850: Network edge security and storage area network applications to OC-192/10 Gbps

■Intel®IXP2800: Network edge and core applications to OC-192/10 Gbps

■Intel®IXP2400: Network access and edge applications to OC-48/2.5 Gbps

■Intel®IXP425: A broad range of home, SME, and embedded networking applications requiring high performance

■Intel®IXP422: Home, SME, and embedded networking applications requiring security

■Intel®IXP421: Home, SME and embedded networking applications requiring voice

■Intel®IXP420: Cost-sensitive home, SME and embedded networking applications

INTEL®IXP2XXX NETWORK PROCESSOR PRODUCT LINE

Family Overview

Equipment designed for network edge and core applications requires high levels of processing performance to support

value-added network services at line rates up to and including OC-192/10 Gbps. While rapidly adding these new

services, network equipment vendors must continue to minimize development time and cost. To support these services and

to extend time-in-market network processors must combine performance with highly ﬂexible control of processing resources.

In addition, implementation of standards-based interfaces for easy component integration and the ability to leverage software

investments by reusing code can dramatically speed time-to-market and lower development costs.

Intel’s second-generation network processors, the Intel IXP2400, Intel IXP2800, and Intel IXP2850, use fast and ﬂexible

sharing of data and event signals among threads and microengines to manage data-dependent operations among multiple

parallel processing stages with low latency. Through this combination of ﬂexible packet processing and fast inter-process

communication, Intel delivers rich processing capability at line rates up to and including OC-192/10 Gbps.

The Intel®IXP2XXX network processors deliver this enhanced performance with the programmability designed to speed

the deployment of intelligent network services. A centerpiece of Intel®Internet Exchange Architecture (Intel®IXA), Intel’s

second-generation network processor architecture scales to successive generations of networking products and is supported

by a common set of development tools, libraries, and example designs. In combination, the Intel IXP2400, Intel IXP2800,

and Intel IXP2850 provide the foundation for a comprehensive development environment that can dramatically accelerate

time-to-market, while enabling customers to reuse their investments in software.

Development Environment

Intel provides a comprehensive development environment that enables customers to rapidly develop applications for the

Intel IXP2400, Intel IXP2800, and Intel IXP2850 network processors and migrate existing applications from the Intel®

IXP1200 network processor family. The development environment includes the Intel®Internet Exchange Architecture

Software Development Kit (Intel®IXA SDK) 3.x, complemented by a choice of hardware development platforms, supporting

software and tools, example designs and professional services.

Network Processors

Network Processors developer.intel.com/go/networkprocessors

Intel provides developers designing with the Intel®IXP2XXX network processors a choice of advanced development

platforms based on their application needs:

■The Intel®IXDP2400 and the Intel®IXDP2800/IXDP2850 Advanced Development Platforms are dual-chip

implementations ideal for developing access, edge and metro/core applications up to OC-192/10 GbE line rates.

■The Intel®IXDP2401 and the Intel®IXDP2801/IXDP2851 Advanced Development Platforms are standards-based,

PICMG 3.0 Advanced Telecom Computing Architecture* (AdvancedTCA) compliant single-chip implementations ideal

for designing access and edge applications up to OC-48/4 GbE line rates.

These development platforms further enhance the value of the network processors by providing a robust development

environment that can dramatically accelerate the development and validation of new products designed for OC-3 to OC-192

line rates. These development platforms can be used in several ways:

■Developers can write code and run simulations in a Windows*-based PC environment using the graphical workbench

and the cycle-accurate simulator, and then use the development platform to verify system functionality before the

customer hardware is available.

■Hardware design engineers can reuse schematic source ﬁles included in their board design to jump-start their board

development effort.

■Developers can validate a design using the base card and mezzanine cards available from Intel, or design and test a

custom I/O subsystem using the development platform prior to committing to a full board design.

■With the IXDP2401, IXDP2801 and IXDP2851, developers can add additional AdvancedTCA boards from Intel as

well as third parties to prototype more complete systems.

■Developers can design a proprietary switch fabric card, and use an interface on the base card to implement a fabric

backplane.

The Intel IXA SDK 3.x enables hardware and software engineering to proceed in parallel. The SDK provides the software

team with an easy-to-use graphical simulation environment for developing, debugging, and optimizing a network application

at the same time that the hardware team is working on design and prototyping the device. By using the development tools,

network building blocks and the Intel®IXA Portability Framework in the SDK, the design team can achieve an unparalleled

time-to-market advantage.

Intel IXA SDK 3.x preserves investments in software for the Intel IXP1200 network processor by maintaining the familiar

best-in-class Developer’s Workbench programming environment and extending it to support the Intel IXP2400, Intel

IXP2800, and Intel IXP2850 network processors. Developers who use the Intel®IXA SDK dataplane library, Intel®

Microengine C Compiler and the programming framework with the Intel IXP1200 will be able to retarget their code for the

Intel IXP2400, Intel IXP2800, and Intel IXP2850 by using the same or similar facilities in SDK 3.x.

Intel IXA SDK 3.x consists of two parts separately packaged and released: Intel IXA SDK Tools 3.x and Intel IXA SDK

Software Framework 3.x. Intel IXA SDK Tools 3.x includes microengine (MEv2) development environment and tools used

by customers to develop, debug and tune application code that runs on microengines of IXP2XXX network processors. Intel

IXA SDK Software Framework 3.x includes software building blocks, framework for combining these building blocks and

software pipelines based on these blocks for jump-starting customer application development.

Intel also provides all the tools needed to build challenging products while meeting aggressive development schedules,

including example designs and professional software services to enable developers to take advantage of the ﬂexibility offered

by Intel®network processors. As a result, developers can reduce the time, effort, and resources required for lower-level,

standards-based platform software, and focus on developing new value-adding services and features that differentiate

products at the application level.

developer.intel.com/go/networkprocessors Network Processors

INTEL®IXP2850 NETWORK PROCESSOR FOR HIGH-SPEED, SECURE

CONTENT PROCESSING IN A SINGLE CHIP

Product Overview

The newest member of the Intel®second-generation network processor product family, the Intel IXP2850 network

processor, delivers high-performance packet and content processing with robust security features in a single platform. By

integrating capabilities that have typically required multiple specialized processors, the Intel IXP2850 provides a secure and

cost-effective platform that enables a broad range of emerging applications..

Target Applications

Several current application trends are driving the need for high-performance secure content processing. Global enterprise

networks are moving from dedicated connections to virtual private networks. Applications for e-Commerce must support

secure Web browsing. Wireless LAN applications have multiple new security standards to support. Distributed storage

applications use secure mechanisms for protocol integration and data exchange. In addition, cost efﬁciencies and performance

requirements are fostering a migration of these applications from computing platforms to communications products. These

development opportunities include:

■Converged security gateway applications including IPSec and SSL VPN, Stateful Firewall, TCP Ofﬂoad, IDS/IPS

and Virus detection

■Service blades for bulk cryptography and TCP ofﬂoad in infrastructure switches, routers and appliances

■IPsec/TCP termination and ofﬂoad functionality in networked storage applications

■Content-aware load balancing in network appliances, such as Web switches, located in front of server farms

FEATURES BENEFITS

Sixteen integrated programmable 1.4 GHz microengines Multithreaded dataplane processing elements provide headroom for

high-speed packet, content, and secure processing

Two integrated cryptography blocks Provide hardware acceleration for DES, 3DES, AES, and SHA-1

algorithms. Enables bulk encryption/decryption for IPsec data streams at

speeds up to 10 Gbps

Flow-through cryptography architecture processes packets “on the ﬂy” Minimizes packet reassembly in memory and increases performance

Supports ECB and CBC cipher modes Provides ﬂexibility to address multiple application environments

Integrated Intel XScale®Core Embedded 32-bit RISC core for IKE, route table maintenance and system-

■32 Kbyte—Instruction cache level management functions lowers system cost and saves board space

■32 Kbyte—Data cache

■2 Kbyte—Mini-data cache

Support for more than 2 GB of memory Supports large numbers of security associations for robust performance

PCI 2.2 I/O Interface Supports industry-standard connection to additional processors to

accelerate security functions such as public key exchange

Modular software building blocks for IPsec and TCP Simpliﬁes product development and speeds time-to-market

Comprehensive development environment: Software SDK Improves time-to-market via robust hardware and software development

and Hardware Development Platform tools

Professional design services Reduces development risk and time

~2 watts of incremental power for cryptography blocks Low power consumption reduces system costs

Power Dissipation ~27.5 Watts typical, ~32 Maximum @ 1.4 GHz operation

~19.5 Watts typical, ~25 Maximum @ 1.0 GHz operation

~16.5 Watts typical, ~21 Maximum @ 650 MHz

Software- and pin-compatible with IXP2800 Enables reuse of board designs, reduces development cost, and saves

board space

Network Processors developer.intel.com/go/networkprocessors

INTEL®IXP2800 NETWORK PROCESSOR FOR OC-192/10 GBPS NETWORK

EDGE AND CORE APPLICATIONS

Product Overview

The Intel IXP2800 network processor is a member of Intel’s second-generation network processor family. Based on

the ﬁrst-generation Intel IXP1200, the Intel IXP2800 is a programmable network processor that integrates a high-

performance parallel processing design on a single chip for processing complex algorithms, deep packet inspection,

trafﬁc management, and forwarding at wire speed. Its store-and-forward architecture combines a high-performance

Intel XScale core with sixteen 32-bit independent multithreaded microengines that cumulatively provide more than

23.1 giga-operations per second. The microengines provide the processing power to perform tasks that traditionally

required expensive high-speed ASICs.

Application Flexibility

The ability of the Intel IXP2800 network processor to support OC-192/10 Gbps line rates makes it the optimal solution for

a wide variety of high-performance applications such as Metropolitan Area Network (MAN) switches and routers,

Internet edge and core switches and routers, multi-service switches, 10 Gbps enterprise switches and routers designed to meet

the requirements of advanced data centers, storage area networks (SAN), and content-aware server off-load/Web switches.

The network processor’s programmability also makes it the right choice for IPSec and Virtual Private Network (VPN)

solutions, and wireless infrastructure equipment. Functionality includes:

■Ethernet/POS/ATM Layer 4 forwarding in core, MAN and edge applications

■Protocol conversion, forwarding and aggregation for multi-service switches, cable headends and DSLAM aggregation

■ATM SARing and forwarding with advanced trafﬁc shaping

■Content-aware load balancing, forwarding, and policing

■Encryption for VPNs and IPSec applications

■GPPS Tunneling Protocol and IPv6 in wireless infrastructure applications

■TCP/IP termination for enterprise data center and SANs

■SSL/TLS acceleration

developer.intel.com/go/networkprocessors Network Processors

FEATURES BENEFITS

16 integrated programmable microengines with 8K instruction Enhanced second-generation ﬂexible multithreaded RISC processors that

program stores can be programmed to deliver intelligent transmit and receive processing,

with robust software development environment for rapid product

development

Integrated Intel XScale®Core Embedded 32-bit RISC core for high-performance processing of complex

■32 Kbyte—Instruction cache algorithms, route table maintenance and system-level management

■32 Kbyte—Data cache functions. Lowers system cost and saves board space

■32 Kbyte—Mini-data cache

Two unidirectional 16-bit Low Voltage Differential Signaling Supports industry-standard interfaces to media and fabric devices,

(LVDS) data interfaces programmable to be SPI-4 Phase 2 or CSIX delivering OC-192 and 10Gbps Ethernet performance rates; simpliﬁes

design and interface to custom ASIC

Three industry-standard RDRAM interfaces Memory subsystem to support the network processor store-and-forward

processing model

Four industry-standard 32-bit QDR SRAM interfaces Memory subsystem for look-up tables and access lists

PCI 2.2 I/O Interface Supports industry-standard connection to system host processors

8-bit asynchronous control interface Provides control interface for connecting to maintenance port of PHY

devices and ﬂash memory

Hardware support for memory access queuing Simpliﬁes product development and reduces system cost

JTAG support Improve hardware debug ability

Comprehensive Development Environment: Software SDK Improves time-to-market via robust hardware and software development

and Hardware Development Platform tools

Power Dissipation ~25.5 Watts typical, ~ 30 Maximum @ 1.4 GHz operation

~17.5 Watts typical, ~ 23 Maximum @ 1.0 GHz operation

~16 Watts typical, ~20 Maximum @ 650 MHz

Additional integrated hardware features: Simpliﬁes development, reduces development cost and saves board space

■Hardware Hash Unit (48, 64, and 128 bit)

■16-Kbyte Scratchpad Memory

■Serial UART port for debug

■Four general-purpose I/O pins

■Four 32-bit timers

INTEL®IXP2400 NETWORK PROCESSOR FOR OC-48/2.5 GBPS NETWORK

ACCESS AND EDGE APPLICATIONS

Product Overview

The Intel IXP2400 network processor is a member of Intel’s second-generation network processor family. It is designed

for a wide range of access and edge applications including multi-service switches, routers, broadband access devices, and

wireless infrastructure systems. Based on the ﬁrst-generation Intel IXP1200 network processor, the Intel IXP2400 is a fully

programmable network processor that implements a high-performance parallel processing architecture on a single chip for

processing complex algorithms, deep packet inspection, trafﬁc management, and forwarding at wire speed. Its store-and-

forward architecture combines a high-performance Intel XScale core with eight 32-bit independent multithreaded

microengines that cumulatively provide more than 5.4 giga-operations per second. The microengines provide the processing

power to perform tasks that traditionally required expensive high-speed ASICs.

Network Processors developer.intel.com/go/networkprocessors

Application Flexibility

The ability of the Intel IXP2400 network processor to support OC-48/2.5 Gbps line rates makes it ideal for a wide variety

of high-performance applications such as Wide Area Networking (WAN) multi-service switches, DSLAMs (DSL access

multiplexers), CMTS (cable modem termination system) equipment, 2.5G and 3G wireless infrastructure base station

controllers and gateways, and Layer 4–7 switches including content-based load balancers, and ﬁrewalls. The programmability

of the Intel IXP2400 also makes it well suited for VoIP gateways, multi-service access platforms, high-end routers, remote

access concentrators, and Virtual Private Network (VPN) gateways. Usage models for the Intel IXP2400 in the target market

segments listed above are as follows:

■Aggregation, ATM SARing, trafﬁc shaping, policing, forwarding, and protocol conversion in DSLAM equipment

■Aggregation, forwarding, and protocol conversion in CMTS equipment

■ATM SARing, encryption, and forwarding in base station controllers/radio network controllers

■GTP Tunneling and IPv6 forwarding in wireless infrastructure

■ATM SARing, trafﬁc shaping, policing, protocol conversion, and aggregation for multi-service switches

■Content-aware load balancing, forwarding, and policing

FEATURES BENEFITS

Eight integrated programmable microengines with Enhanced second-generation ﬂexible multithreaded RISC processors that

4K instruction program stores can be programmed to deliver intelligent transmit and receive processing,

with robust software development environment for rapid product

development

Integrated Intel XScale®Core Embedded 32-bit RISC core for high-performance processing of complex

■32 Kbyte—Instruction cache algorithms, route table maintenance, and system-level management

■32 Kbyte—Data cache functions. Lowers system cost and saves board space

■2 Kbyte—Mini-data cache

Two unidirectional 32-bit media interfaces (Rx and Tx) Supports industry-standard cell and packet interfaces to media and fabric

programmable to be SPI-3, UTOPIA 1/2/3 or CSIX-L1. devices delivering 4 Gbps performance rates that can support OC-48 plus

Each path is conﬁgured for 4x8 bit, 2x16 bit, 1x32 bit or fabric encapsulation overhead or 4 x GbE; simpliﬁes design and interface to

combinations of 8 and 16 bit data paths custom ASIC devices

One industry-standard DDR DRAM interface Memory subsystem supports the network processor store-and-forward

processing model

Two industry-standard QDR SRAM interfaces Memory subsystem for look-up tables and access lists, or coprocessors

(such as CAM/TCAM, IPsec devices). NPF standardized interface for

coprocessors

PCI 2.2 64 bit/66 MHz I/O Interface Supports industry-standard connection to system host processors

Asynchronous control interface supports 8-, 16-, 32-bit Provides control interface for connecting to maintenance port of PHY

slow port devices devices and ﬂash memory

Hardware support for memory access queuing Simpliﬁes application development and reduces system cost

JTAG support Improves hardware debug ability

■Software SDK Improves time-to-market via robust hardware and software development

■Hardware Development Platform tools

Power Dissipation ~13 Watts typical, ~ 16 Maximum @ 600 MHz operation

~9 Watts typical, ~ 12 Maximum @ 400 MHz operation

Additional integrated hardware features: Simpliﬁes development, reduces development cost, and saves board space

■Hardware Hash Unit (48, 64, and 128 bit)

■16 Kbyte Scratchpad Memory

■Serial UART port for debug

■Eight general-purpose I/O pins

■Four 32-bit timers

developer.intel.com/go/networkprocessors Network Processors

INTEL®IXP4XX NETWORK PROCESSOR PRODUCT LINE

Family Overview

The Intel®IXP4XX product line is designed to meet the needs of a variety of applications such as high-end residential

gateways; small-to-medium enterprise (SME) routers, switches, security devices; wireless access points; industrial

control systems, networked printers, and other embedded networked applications. The IXP4XX product line delivers wire-

speed performance and sufﬁcient “processing headroom” for manufacturers to add a variety of rich software services to

support their applications. These are highly integrated processors that support a variety of WAN and LAN technologies

giving customers a common architecture for multiple applications.

The IXP4XX product line meets the requirements of networking applications with a unique distributed architecture that

features the performance of the Intel XScale®core and up to three Network Processor Engines (NPEs). The combination

of the four high-performance processing elements provides tremendous processing power and enables wire-speed

performance at both the LAN and WAN ports. The NPEs are designed to ofﬂoad many computationally intensive data

plane operations from the core. This provides ample processing headroom on the Intel XScale core for developers to add

differentiating product features.

The four network processors in the IXP4XX product line are the Intel®IXP425, the Intel®IXP422, the Intel®IXP421, and

the Intel®IXP420. The Intel®IXP425 network processor is the most feature rich of these processors, supporting the widest

variety of processor speed and connectivity options. The other three network processors offer a subset of the features found

on the Intel®IXP425 network processor. For an easy reference of features, see the table following the product descriptions.

Tools, Applications, and Operating Systems Support Rapid Development

Intel XScale technology includes a broad range of development tools and applications, together with support for multiple

operating systems making software development easier. The Intel IXP4XX product line currently supports Wind River*

VxWorks*, Microsoft* Windows CE, and the standard Linux* kernel. Third-party products are available for the Intel

IXP4XX product line including Wind River Tornado* for VxWorks, and the MontaVista* Linux Professional Edition.

Multiple third-party vendors provide application stacks and advanced development environment support.

To help speed time-to-market and reduce development costs, developers have a wide choice of Intel XScale technology-

based tools. The Intel IXP4XX network processor may be controlled during debug through a JTAG interface to the processor.

The Macraigor* Raven*, Wind River Systems visionPROBE*/visionICE* and EPI* MAJIC*, and other JTAG ICE systems

will plug into the JTAG interface through a 20-pin connector.

Development Platform for Faster Time-to-Market

The Intel®IXDP425 Development Platform is a powerful tool for development and veriﬁcation of hardware and

software for the Intel IXP4XX product line. Using a common development platform across the product line helps

reduce costs and speeds development by providing a consistent tools/development environment. Developers can use

this ﬂexible and extendable platform to conduct rapid initial chip evaluation, chip performance evaluation, product

development and prototyping. Pin compatibility among members of the Intel IXP4XX product line further reduces

hardware design complexity.

Network Processors developer.intel.com/go/networkprocessors

INTEL®IXP425 NETWORK PROCESSOR FOR A BROAD RANGE OF HOME,

SME, AND EMBEDDED NETWORKING APPLICATIONS

Product Overview

The Intel IXP425 network processor is a highly integrated, versatile single-chip processor that can be used in a variety

of products that need network connectivity and high performance to run their unique software applications. The Intel

IXP425 combines integration with support for multiple WAN and LAN technologies in a common architecture designed

to meet requirements for high-end gateways, Voice over IP (VoIP) applications, wireless access points, small-to-medium

enterprise (SME) routers, switches, security devices, industrial control systems, networked imaging, and other networked

embedded applications.

The IXP425 network processor offers the choice of multiple clock speeds at 266, 400, and 533 MHz, with both commercial

and extended temperature options. The Intel IXP425 network processor feature set includes a UTOPIA 2 interface, two high-

speed serial (HSS) interfaces, high-performance PCI interface, USB controller, two 10/100 Ethernet MACs and an IPsec-

enabled network processor engine (NPE) to accelerate cryptography and authentication algorithms.

Product Highlights

■Member of the Intel IXP4XX network processor product line

■Intel XScale®core at up to 533 MHz provides headroom for customer-deﬁned applications

■Integrated hardware acceleration of popular cryptography algorithms (SHA-1, MD5, DES, 3DES, AES) for secure

applications

■DSP software library on the Intel XScale core supports 2–4 voice channels and reduces system cost

■Two high-speed serial (HSS) ports for VoIP SLIC/CODEC or T1/E1

■Two integrated 10/100 Base-T Ethernet MACs with Media Independent Interface (MII) for design ﬂexibility

and cost-effective wire-speed performance

■UTOPIA 2 interface with multiple ADSL/G.SHDSL or VDSL support

■33/66 MHz PCI v2.2 host and option interface for glueless connection of up to four devices

■SDRAM controller supports from 8 to 256 Mbytes of SDRAM memory

■Low system power consumption (1.0–1.5 Watt typical)

■USB version 1.1 device controller

■Two high-speed UARTS support up to 921 Kbaud each

■Sixteen GPIO pins

■16-bit conﬁgurable expansion bus

■Commercial temperature (0° to +70° C) and extended temperature (-40° to +85° C) versions

developer.intel.com/go/networkprocessors Network Processors

INTEL®IXP422 NETWORK PROCESSOR FOR HOME/SME APPLICATIONS

REQUIRING SECURITY FEATURES

Product Overview

The Intel IXP422 network processor is a versatile, single-chip processor that integrates robust security features with the

necessary interfaces, wire-speed performance and processing headroom to meet demanding applications including

wireless access points, residential gateways, VPN ﬁrewall appliances, SME routers and switches, industrial control,

networked imaging, and other embedded networked applications.

The Intel IXP422 network processor feature set includes a 266 MHz Intel XScale RISC core, high-performance PCI

interface, USB controller, two 10/100 Ethernet MACs and an IPsec-enabled Network Processor Engine (NPE) to accelerate

cryptography and authentication algorithms.

Product Highlights

■Member of the Intel IXP4XX network processor product line

■Intel XScale®core at 266 MHz provides headroom for customer-deﬁned applications

■Integrated hardware acceleration of popular cryptography algorithms (SHA-1, MD5, DES, 3DES, AES) for secure

applications

■Two integrated 10/100 Base-T Ethernet MACs with Media Independent Interface (MII) for design ﬂexibility

and cost-effective wire-speed performance

■33/66 MHz PCI v2.2 host and option interface for glueless connection of up to four devices

■SDRAM controller supports from 8 to 256 Mbytes of SDRAM memory

■Low system power consumption (1.0–1.5 Watt typical)

■USB version 1.1 device controller

■Two high-speed UARTS support up to 921 Kbaud each

■Sixteen GPIO pins

■16-bit conﬁgurable expansion bus

■Commercial temperature (0° to +70° C)

INTEL®IXP421 NETWORK PROCESSOR FOR HOME/SME APPLICATIONS

SUPPORTING VOICE OVER IP

Product Overview

The Intel IXP421 network processor is a versatile single-chip processor that meets the needs of high-performance and

cost-sensitive data and Voice over IP (VoIP) applications ranging from residential gateways, Integrated Access Devices

(IADs) and small ofﬁce IP/PBX systems to industrial control, networked imaging, and other embedded networked

applications. The Intel IXP421 network processor provides cost-effective implementations that extend the rich performance

and features on the Intel IXP425 network processor into targeted market segments.

The Intel IXP421 network processor feature set integrates a 266 MHz Intel XScale RISC core, high-performance PCI

interface, USB controller, UTOPIA 2 interface, two high-speed serial HSS and one 10/100 Ethernet MAC. These features

provide developers with the processing power, low power consumption, cost-effectiveness and ﬂexibility to address the needs

of data plus VoIP applications.

Network Processors developer.intel.com/go/networkprocessors

Product Highlights

■Member of the Intel IXP4XX network processor product line

■Intel XScale®core at 266 MHz provides headroom for customer-deﬁned applications

■DSP software library on Intel XScale core supports 2–4 voice channels and reduces system cost

■Two high-speed serial (HSS) ports for VoIP SLIC/CODEC or T1/E1

■One integrated 10/100 Base-T Ethernet MACs with MII/RMII interface for design ﬂexibility and cost-effective

wire-speed performance

■UTOPIA 2 interface supports up to four xDSL PHYs (ADSL, G.SHDSL or VDSL)

■33/66 MHz PCI v2.2 host and option interface for glueless connection of up to four devices

■SDRAM controller supports from 8 to 256 Mbytes of SDRAM memory

■Low system power consumption (1.0–1.5 Watt typical)

■USB version 1.1 device controller

■Two high-speed UARTS: can support up to 921 Kbaud each, or one UART at 921 Kbaud and one Console UART

(230 Kbaud)

■Sixteen GPIO pins

■16-bit conﬁgurable expansion bus

■Commercial temperature (0° to +70° C)

INTEL®IXP420 NETWORK PROCESSOR FOR HIGHLY COST-SENSITIVE

HOME/SME APPLICATIONS

Product Overview

The Intel IXP420 network processor is a single-chip integrated processor that meets the needs of high-performance and

cost-sensitive applications ranging from home gateways, small ofﬁce/home ofﬁce (SOHO) routers and wireless access

points to industrial control, networked imaging, and other networked embedded applications.

The Intel IXP420 network processor feature set integrates an Intel XScale®core, high-performance PCI interface, USB

controller, and two 10/100 Ethernet MACs. This network processor enables cost-effective implementations that extend the

processing power, low power consumption and ﬂexibility of the Intel IXP425 network processor into targeted market

segments.

Product Highlights

■Member of the Intel IXP4XX network processor product line

■Intel XScale®core provides headroom for customer-deﬁned applications

■Two integrated 10/100 Base-T Ethernet MACs with MII/RMII interface for design ﬂexibility and cost-effective

wire-speed performance

■33/66 MHz PCI v2.2 host and option interface for glueless connection of up to four devices

■SDRAM controller supports from 8 to 256 Mbytes of SDRAM memory

■Low system power consumption (1.0–1.5 Watt typical)

■USB version 1.1 device controller

■Two high-speed UARTS support up to 921 Kbaud each

■Sixteen GPIO pins

■16-bit conﬁgurable expansion bus

■266, 400 and 533 MHz Commercial temperature (0° to +70° C)

■266 MHz extended temperature (-40° to + 85° C)

developer.intel.com/go/networkprocessors Network Processors

SUMMARY OF INTEL®IXP4XX PRODUCT LINE FEATURES

INTEL®INTEL®INTEL®INTEL®

IXP425 IXP422 IXP421 IXP420

Intel XScale®Core Speed 266/400/533 MHz 266 MHz 266 MHz 266/400/533 MHz

UTOPIA 2 • •

GPIO••••

UART 0/1 ••••

HSS 0 • •

HSS 1 • •

MII 0 ••••

MII 1 • • •

USB••••

PCI••••

Expansion Bus ••••

SDRAM Supports 8–256 MB Supports 8–256 MB Supports 8–256 MB Supports 8–256 MB

AES/DES/DES3 • •

SHA-1/MD-5 • •

Multi-Channel HDLC • •

VoIP support 2–4 channels 2–4 channels

Commercial Temperature ••••

Extended Temperature • •

Intel®IXP4XX Product Line Ordering Information

PRODUCT ORDER NUMBER

Intel®IXP425 Network Processor, 266 MHz CT FWIXP425BB

Intel®IXP425 Network Processor, 266 MHz ET GWIXP425BBT

Intel®IXP425 Network Processor, 400 MHz CT FWIXP425BC

Intel®IXP425 Network Processor, 400 MHz ET GWIXP425BCT

Intel®IXP425 Network Processor, 533 MHz CT FWIXP425BD

Intel®IXP425 Network Processor, 533 MHz ET GWIXP425BDT

Intel®IXP425 Network Processor, 533 MHz CT PRIXP425BD

(Lead Free Eng Samples)

Intel®IXP422 Network Processor, 266 MHz CT FWIXP422BB

Intel®IXP421 Network Processor, 266 MHz CT FWIXP421BB

Intel®IXP421 Network Processor, 266 MHz CT PRIXP421BB

(Lead Free Eng Samples)

Intel®IXP420 Network Processor, 266 MHz CT FWIXP420BB

Intel®IXDP425 Network Processor Development Platform KIXDP425BD2

Intel®IXDP425 Network Processor Development Platform KIXDP425VMU

Voice Module Upgrade Kit

Intel®IXDP425 Network Processor Development Platform KIXDP425CEU

WinCE Upgrade Kit

Network Processors developer.intel.com/go/networkprocessors

developer.intel.com/design/network Networking Products

WORKGROUP AND ENTERPRISE SOLUTIONS

Ethernet Transceivers

Ethernet transceivers are 10BASE-T Physical Layer (PHY) devices that provide low-cost solutions for desktop and node

applications. These industry-standard single-port transceivers implement all required functions of the physical coding

sublayer (PCS) and physical media attachment (PMA) sublayers as deﬁned in IEEE 802.3. They provide all the active

circuitry to interface 802.3-compliant media access controllers (MACs) and either twisted-pair or coax transmission media.

Fast Ethernet Transceivers

Fast Ethernet transceivers are 10/100 PHY devices that provide high-performance interface solutions for networks that use

equipment running at either 10Mbps or 100Mbps. They support standard CSMA/CD operation or full-duplex operation

at 10Mbps or 100Mbps. Available as a single- or multi-port option, they are suited for uses ranging from embedded

applications to high-density enterprise switches. Fast Ethernet transceivers provide the active circuitry to interface

802.3-compliant 10/100Mbps MACs and twisted-pair or ﬁber network media. Line operating conditions are determined

using auto-negotiation or parallel detection for legacy systems. The devices implement all required functions of the PCS,

PMA, and physical media dependent (PMD) sublayers, with a media independent interface (MII) as deﬁned in IEEE 802.3.

Gigabit Ethernet Transceivers

1000BASE-T Gigabit Ethernet transceivers are 10/100/1000 PHY devices that provide high-performance interface

solutions for 10/100/1000Mbps network equipment. They support standard CSMA/CD operation or full-duplex operation

at 10, 100, or 1000Mbps. The single-port device is ideally suited for embedded applications or uplinks on high-performance

Ethernet switches. Gigabit Ethernet PHY transceivers provide the active circuitry to interface 802.3-compliant

10/100/1000Mbps MACs and twisted-pair network media. Line operating conditions are determined using auto-negotiation

or parallel detection for legacy systems. The 10/100/1000Mbps Ethernet transceiver implements all the required functions of

the PCS, PMA, and PMD sublayers, with a Gigabit media independent interface (GMII) as deﬁned in IEEE 802.3.

Ethernet and Fast Ethernet Repeaters

An Ethernet repeater is a device that repeats a signal received from any port onto all other ports and is, therefore, a shared

technology. It is the “hub” that links physically distinct network segments into one logical network. It can also be used

to “fan-out” one Ethernet connection to many connections. The family of workgroup and enterprise repeater products

includes a variety of cost-effective repeater silicon solutions for managed and unmanaged applications. 10BASE-T solutions

are available as four-port devices. 10/100Mbps solutions are available in ﬁve-, six-, or eight-port devices. Port density and

management options enable these devices to be used in a variety of applications such as small ofﬁce hubs or home

gateways/modems.

Media Access Controllers

Media Access Controllers (MACs) in a local area network control access to the shared medium by LAN-attached

devices. Within a MAC are deﬁned data link layer options which specify the basis on which devices access the

shared medium, and the basis on which congestion control is exercised. The ﬁrst members of the new MAC family, the

Intel®IXF1110 Gigabit and Intel®IXF1010 100/1000 Megabit MACs, are the ﬁrst to use a more robust SPI4-2 interface

implementation called “dynamic phase alignment.” Dynamic phase alignment improves data integrity to help ensure

10-Gbps wire-speed performance. These MACs are ideal for solutions in high-end, modular switching applications such

as routers and multi-service switches that support LAN and WAN technologies.

Networking Products

Networking Products developer.intel.com/design/network

Ethernet Switching Devices

An Ethernet switch is a multi-port device used to relay frames or packets among a set of networks. Multi-layer

switch/routers combine the functions of a Layer 2 switch and a router. The Intel®Media Switch Family, including

silicon, software, and system building blocks, supports the needs of media-aware networks with advanced quality of service

(QoS) capabilities, programmability, and performance at competitive pricing. The Intel Media Switch Software Architecture

is a comprehensive package of licensed software tools including APIs and device drivers. Intel partners with other vendors to

provide protocol support. A ﬂexible, scalable architecture makes these devices ideal for designs across the entire networking

equipment spectrum including: 10/100/1000Mbps standalone switches to the desktop, stackable switches for workgroup

aggregation, chassis-based switches for connecting to the enterprise backbone, and routing switches within the data center

and network core.

Intel®Carrier Class Ethernet

Many networking and telecom applications require high-performance Ethernet components capable of operating under

harsh environmental conditions. Intel®Carrier Class Ethernet products support operation over the entire extended

temperature range while providing features that increase reliability. Each device has an operation lifetime of at least 10 years

with less than 100 failures per billion hours. All Intel Carrier Class Ethernet devices will be available a minimum of ﬁve years

from product introduction.

The Intel Carrier Class Ethernet product portfolio includes solutions for Ethernet physical layer, switching and repeater

technologies at a variety of speeds. Intel Carrier Class Ethernet products are ideal for applications where equipment must

function reliably in uncontrolled environmental conditions such as base stations, telecom/network switches, factory ﬂoor

equipment, and industrial computers. Products include the IXE2424EE, LXT9880AGE, LXT914, LXT973, LXT9785,

LXT905, and LXT971A/972A.

NETWORKING PRODUCT LINE SUMMARY

The following table summarizes the networking product application features. For full information refer to the product datasheets.

APPLICATIONS PART NUMBER FEATURES

Ethernet Transceivers

Ethernet Interface Adapter (Universal) LXT907A/LXT908

■10BASE-T hub and switching products

■10BASE-T LAN adapter boards for

computers/workstations

■Printer network attachments

■PCMCIA LAN cards

■Workstation/graphic terminals

■PC-PC servers (adapter/motherboard)

■10BASE-T interconnects (MAU)

■Bridges/routers

■Terminal servers

■Point-of-sale interfaces

Ethernet Interface Adapter (10BASE-T) LXT905

■Portable computers

■PDAs switching hubs

■Printer adapter cards

■PCMCIA cards

■Diagnostic port in telecom

■Integrated AUI transceivers ■Integrated 10BASE-T transceivers

■Improved ﬁlters to simplify FCC compliance ■Integrated Manchester

encoder/decoders ■Automatic/manual AUI/RJ-45 selection

■Automatic polarity correction ■Standard and full-duplex Ethernet

■Power-down mode with tri-stated outputs ■Four loopback modes

■Four LED drivers ■Selectable termination impedance for use with

shielded or unshielded twisted-pair (LXT901A only) ■Signal Quality

Error (SQE) disable function for hub and switch applications

(LXT907A & LXT908 only)

■3.3V or 5V operation, power-down mode for battery operation

■Provides all active circuitry for interfacing 802.3 controllers to a

10BASE-T media ■Includes Manchester encoder/decoder, reversed

polarity detection/correction, integrated ﬁlters ■LED driver, full duplex

capability ■Signal Quality Error (SQE) disable function for hub and

switch applications ■Intel®Carrier Class Ethernet support

developer.intel.com/design/network Networking Products

APPLICATIONS PART NUMBER FEATURES

Fast Ethernet Transceivers

Fast Ethernet Transceiver LXT970A

■10/100 NICs

■10/100 switches

■100BASE-FX NICs and switches

Fast Ethernet Transceiver LXT971A

■Combination 10BASE-T/100BASE-TX or

100BASE-FX NICs

■10/100 PCMCIA cards

■Cable modems and set-top boxes

Fast Ethernet Transceiver LXT972A

■Combination 10BASE-T/100BASE-TX NICs

■10/100 PCMCIA cards

■Cable modems and set-top boxes

Fast Ethernet Transceiver LXT973

■Building block for telecom backplane systems

■Internet protocol telephones

■Twisted pair to ﬁber converter modules

■Customer premise equipment

Fast Ethernet Transceiver LXT9785

■Enterprise switches

■Workgroup switches

■Storage area networks

■Multi-port NICs

■IP telephony switches (LXT9785E)

LXT9785E

■The single RJ-45 port for 10BASE-T and 100BASE-TX simpliﬁes

designs, reduces board space and minimizes system cost ■Baseline

Wander Correction delivers consistent, error-free performance

■Devices perform error free over distances greater than 130 meters of

Category 5 cable—far exceeding the IEEE speciﬁcation of 100 meters

■Auto-negotiation for 10Mbps or 100Mbps, with full- or half-duplex

and parallel detection, provides ﬂexible application support and

interoperability with legacy equipment ■MII operates with either a

3.3V or 5V power supply, allowing the use of low-power MACs

■100BASE-FX port provides ﬁber-optic media support ■Multiple

operating modes for NICs and switches help reduce costs and simplify

design cycles ■Dual operating modes for standard MII and symbol

mode MII provide ﬂexible MAC support

■3.3V operation, low power consumption (350 mW typical), low-

power “sleep” mode ■10BASE-T and 100BASE-TX using a single

RJ-45 connection ■Supports auto-negotiation and parallel detection

■MII interface with extended register capability ■Robust baseline

wander correction performance ■100BASE-FX ﬁber-optic capable

■Standard CSMA/CD or full-duplex operation ■Conﬁgurable via

MDIO serial port or hardware control pins ■Integrated, programmable

LED drivers ■64-pin PBGA, 64-pin LQFP ■Intel Carrier Class

Ethernet support

■3.3V operation, low power consumption (350 mW typical)

■10BASE-T and 100BASE-TX using a single RJ-45 connection

■Supports auto-negotiation and parallel detection ■MII interface

with extended register capability ■Robust baseline wander correction

performance ■Standard CSMA/CD or full-duplex operation

■Conﬁgurable via MDIO serial port or hardware control pins

■Integrated, programmable LED drivers ■64-pin LQFP

■Two-port Fast Ethernet PHY ■2.5V operation ■3.5V operation I/O

compatibility ■Low power consumption (250 mW per port typical)

■Full two-port MII interface with extended registers ■Auto

MDI/MDIX switch-over capability ■Status bits for LED generation

■ 100BASE-FX ﬁber-optic capability on both ports ■Support for Next

Page ■Integrated termination resistors ■100-pin PQFP at commercial

and extended temperature

■Eight independent IEEE 802.3-compliant 10BASE-T or 100BASE-TX

ports ■Very low power consumption (250 mW per port, typical)

■2.5V operation ■Multiple interfaces: RMII, SMII, SS-SMII

■Auto MDI/MDI-X ■Robust baseline wander correction ■Auto-

negotiation, parallel detection ■10/100Mbps full-duplex operation

■Sectionalization into 1x8 or 2x4 conﬁgurations ■Register

compatibility with LXT9781, LXT9782

■Conﬁgurable via MDIO port or external control pins ■JTAG

boundary scan ■Compatible with 2.5V I/O and 3.3V I/O ■Integration

of input termination resistors Intel®Carrier Class Ethernet support

■Added DTE discovery, enhanced IP Telephony features

Networking Products developer.intel.com/design/network

APPLICATIONS PART NUMBER FEATURES

Ethernet Repeaters

Managed Repeaters LXT914

■Stackable and stand alone workgroup hubs

■Embedded applications for print servers

and multi-port routers

■Remote access SOHO applications

LED Managed Or Unmanaged Repeaters LXT915

■“Personal” hubs

■Stackable and stand alone workgroup hubs

■Embedded applications for multi-port routers

and print servers

Dual Speed 10/100 Repeaters LXT9860/LXT9880

■Stackable and stand alone workgroup hubs

■Remote access SOHO applications

■“Personal” hubs

■Embedded applications for multi-port routers

and print servers

■Backplane interconnect for central ofﬁce

equipment (LXT9880AGE)

LXT9880AGE

LXT9863/LXT9883

Media Access Controllers

■High-end switches IXF1110/IXF1010

■Multi-service switches

■High-end routers

■Multi-service switches, router and aggregation IXF1104

platforms at the service provider and

enterprise edge targeting 4 GbE

■WAN Access and Edge Aggregation systems.

DSLAM, CMTS, NG-DLC

■Wireless Infrastructure such as BTS, BSC,

RNC, xGSN, PDSN

■VPNs; ﬁrewall and intrusion detection systems

■VoIP gateways and web switch appliances

■OC-48 Layer 4–7 switches and routers

■Four 10BASE-T ports ■Reversible AUI port ■Conﬁguration/status

interface ■Four LED modes ■Cascadable backplane (no glue logic

required) ■Integrated ﬁlters ■Programmable squelch ■Intel Carrier

Class Ethernet support

■Four 10BASE-T ports ■Simple AUI port ■Four LED modes

■Cascadable backplane (no glue logic required) ■Integrated ﬁlters

■Programmable squelch

■Six- or eight-port 10/100 managed repeater with integrated twisted-

pair PHYs including integrated ﬁlters ■Two 10/100 MIIs for bridging

■Independent segments for 10Mbps and 100Mbps operation ■Less

than 3.4W peak power, 3.3V operation ■Cascadable inter-repeater

backplanes (IRBs), with option for 5V stacking compatibility

■Hardware assist for RMON and the repeater MIB ■High-speed SMI

■Two address-tracking registers per port ■Source Address matching

function ■Integrated LED drivers with user-selectable modes

■Available in 208-pin QFP package ■Commercial temperature range:

0°C–+70°C, ambient

■Added Intel Carrier Class Ethernet support

■Six- or eight-port 10/100 unmanaged repeater with integrated

twisted-pair PHYs including integrated ﬁlters ■Two 10/100 MIIs for

bridging ■Independent segments for 10Mbps and 100Mbps operation

■Less than 3.4W peak power, 3.3V operation ■Cascadable inter-

repeater backplanes (IRBs), with option for 5V stacking compatibility

■Integrated LED drivers with user-selectable modes ■Available in

208-pin QFP package ■Commercial temperature range: 0°C–+70°C,

ambient

■Ten-port 100/1000Mbps or 1000Mbps for copper or ﬁber

connectivity ■SPI4-2 with dynamic phase alignment ■SPI4-2 supports

400MHz clock ■32-bit microprocessor interface ■Internal 17.0 KB

receive FIFO and 4.5 KB transmit FIFO per channel ■Less than 6W

peak power ■552 CBGA package ■Commercial temperature range:

0°C–+70°C, ambient

■Quad Gigabit Ethernet MAC with SPI3 system interface and

interfaces for connectivity to Copper PHYs and Optic modules. •

Ability to power down individual channels ■SerDes physical interface

for ﬁber ■Extended Temp operation for Copper connectivity (-40°C to

+85ºC) ■32-bit MPHY mode ■4x8-bit SPHY mode • Flexible system

interfaces ■SPI-3 System Interface ■Allows for dedicated channel per

GbE port at 125 MHz ■GBIC/I2C* Controller Interface for optics

modules ■10Kbyte transmit, 32Kbyte receive FIFOs

developer.intel.com/design/network Networking Products

APPLICATIONS PART NUMBER FEATURES

Ethernet Switching

Switching Engine IXE5416

■16–24 port Gigabit Layer 2 workgroup switches

■16–24 port Gigabit Layer 2/3/4 workgroup

switches

■Daisy chain or Star stackable 10/100/1000

Layer 2/3/4 switches

■High-port-count Layer 2/3/4 switch/router

solution suitable for stackable and chassis

switches (Can be incorporated into stacking

solutions with the Intel®Media Switch

IXE2424)

■Cellular switching systems

■Voice and data integration gateways

■Edge routers

■Packet-based video distribution systems

Switching Engine IXE5216

■16–24 port Gigabit Layer 2 workgroup switches

■Daisy chain or Star stackable 10/100/1000

Layer 2 switches

■High-port-count Layer 2 switch solution suitable

for stackable and chassis switches (Can be

incorporated into stacking solutions with the

Intel Media Switch IXE2424)

■Cellular switching systems

■Voice and data integration gateways

■Edge routers

■Packet-based video distribution systems

Switching Engine IXE2424

■24+4 Layer 2/3/4 workgroup and

enterprise switches

■Cascadable high-port-count Layer 2/3/4

switch/router when using one or all Gigabit

ports for cascading

■Layer 2/3/4 switch/router with Gigabit uplinks

and advanced bandwidth management

■24+4 MPLS label edge/switch routers

■Cellular switching systems

■Voice and data integration gateways

■Edge routers

■Packet-based video distribution systems

IXE2424EE

Switching Engine IXE2426

■24+4 Layer 2 workgroup and enterprise

switches with advanced bandwidth management

■Cascadable high-port-count Layer 2 switches

when using one or all Gigabit ports for cascading

■Cellular switching systems

■Voice and data integration gateways

■Packet-based video distribution systems

■Single chip, 16-port Gigabit switch/router with Layer 2/3/4 support

■Wire-speed performance across all ports in switching or IP routing

modes ■Advanced trafﬁc prioritization, QoS and bandwidth

management ■Link aggregation ■Supports VLANs based on IEEE

802.1Q, ports, and protocol ■Advanced multicast, broadcast, and

ﬁltering capabilities ■Integrated 10/100/1000 Ethernet MACs, packet

buffer memory and address look-up table

■Single chip, 16-port Gigabit switch/router with Layer 2 support

■Wire-speed performance across all ports ■Advanced trafﬁc

prioritization and QoS ■Link aggregation ■Supports VLANs based

on IEEE 802.1Q, ports, and protocol ■Advanced multicast, broadcast,

and ﬁltering capabilities ■Integrated 10/100/1000 Ethernet MACs,

packet buffer memory and address look-up table

■Single chip, 24-port 10/100 and four-port Gigabit Ethernet Layer

2/3/4 switch/router ■Wire-speed performance across all ports in

switching or IP/MPLS routing modes ■Advanced trafﬁc prioritization,

QoS, Diffserv, WRED, and bandwidth management ■Link

aggregation in any combination of up to eight ports per group

■Hardware assistance for several L2 and L2/3/4 protocols ■Supports

VLANs based on IEEE 802.1Q, ports, and addresses ■Advanced

multicast, broadcast, and ﬁltering capabilities ■Support for multiple

IP networks on a single port, and multiple ports on the same network

■Connects to other devices using standard interfaces such as

SERDES/GMII, SMII, PCI, I2C and SSRAM

■Same as IXE2424 ■Support for industrial temperature range

of -40°C to +85°C ■Intel Carrier Class Ethernet support

■Single chip, 24-port 10/100 and four-port Gigabit Layer 2 Ethernet

switch ■Wire-speed performance across all ports in switching modes

■Advanced trafﬁc prioritization, QoS and bandwidth management

■Link aggregation in any combination of up to eight ports per group

■Hardware assistance for several L2 protocols ■Supports VLANs

based on IEEE 802.1Q, ports, tags, and addresses ■Low-cost mode

of operation ■Connects to other devices using standard interfaces such

as SERDES/GMII, SMII, PCI, I2C and SSRAM

Networking Products developer.intel.com/design/network

NETWORKING PRODUCTS LINE CARD

10MBPS

TRANSCEIVERS1

Product Ports Interface Power Package Special Features

LXT905 TP 7-pin MAC interface, 3.3V or 5V 28 PLCC 4 LED drivers, Intel®Carrier Class Ethernet support2

auto AUI/RJ-45 selection 32 LQFP

LXT907 TP & AUI 7-pin MAC interface, 5V 44 PLCC 4 LED drivers, SQE disable

auto AUI/RJ-45 selection

LXT907A TP & AUI 7-pin MAC interface, 3.3V 44 PLCC 4 LED drivers, SQE disable

auto AUI/RJ-45 selection 64 LQFP

LXT908 TP & AUI 7-pin MAC interface, 3.3V 44 PLCC 4 LED drivers, extended temperature, SQE disable

auto AUI/RJ-45 selection 64 LQFP

10/100MBPS

TRANSCEIVERS1

Product Ports Interface Power Package Special Features

LXT970A TP or ﬁber MII, MDIO/MDINT, 5V, 3.3V 64 TQFP 5 LED drivers, baseline wander correction

hardware control 64 PQFP

LXT971A TP or ﬁber MII, MDIO/MDINT 3.3V, 2.5V 64 PBGA 3 LED drivers, programmable LEDs, CDE protection, JTAG

boundary scan, baseline wander correction, Intel®Carrier Class

Ethernet support2

LXT972A TP MII, MDIO/MDINT, 3.3V, 2.5V 64 LQFP 3 LED drivers, programmable LEDs, CDE protection, JTAG

hardware control boundary scan, baseline wander correction, low power

consumption

LXT973 2 TP or ﬁber Independent MII for 2.5V 100 PQFP Auto MDI/MDIX, CDE tolerance, Intel Carrier Class Ethernet

each port support2

LXT9785 8 TP or ﬁber RMII/SMII/SS-SMII (2.5V/3.3V) 2.5V 241 PBGA Low power, auto MDI/MDIX, MDIO sectionalization,

208 PQFP Intel Carrier Class Ethernet support2

LXT9785E 8 TP or ﬁber RMII/SMII/SS-SMII (2.5V/3.3V) 2.5V 241 PBGA Enhanced IP telephony features, auto MDI/MDIX,

208 PQFP DTE discovery

NOTES

1All products offer Energy Saving Mode and support commercial temperature range (0ºC to 70ºC).

2Intel®Carrier Class Ethernet support includes: extended temperature range (-40ºC to 85ºC), extended lifetime (>10 years of operation), reliability (<100 failures per billion hours over operating life),

and extended availability (minimum of ﬁve years from product introduction)

10MBPS

REPEATERS

Product Ports Interface Power Package Special Features

LXT914 4 TP & 1 reversible AUI IRB, SMI, AUI 5V 68 PLCC 7 LED drivers, 4 LED modes, stackable, status and control,

100 PQFP Intel®Carrier Class Ethernet support2

LXT915 4 TP & 1 AUI IRB, AUI 5V 64 PQFP 7 LED drivers, 4 LED indication modes, stackable, unmanaged

10/100MBPS

REPEATERS

Product Ports Interface Power Package Special Features

LXT9860 6 TP 2 IRB (5V tolerant), SMI, 2 MII 3.3V 208 PQFP SNMP and RMON, stackable, 30 status LEDs, 3 direct drive LEDs

(4 selectable modes), 4 segment LEDs, 2 activity graph LEDs

LXT9863 6 TP 2 IRB (5V tolerant), 2 MII 3.3V 208 PQFP Unmanaged, stackable, 30 status LEDs, 3 direct drive LEDs

(4 selectable modes), 4 segment LEDs, 2 activity graph LEDs

LXT9880 8 TP 2 IRB (5V tolerant), SMI, 2 MII 3.3V 208 PQFP SNMP and RMON, stackable, 30 status LEDs, 3 direct drive LEDs

(4 selectable modes), 4 segment LEDs, 2 activity graph LEDs

LXT9880AGE 8 TP 2 IRB (5V tolerant), SMI, 2 MII 3.3V 208 PQFP SNMP and RMON, stackable, 30 status LEDs, 3 direct drive LEDs

(4 selectable modes), 4 segment LEDs, 2 activity graph LEDs,

Intel®Carrier Class Ethernet support2

LXT9883 8 TP 2 IRB (5V tolerant), 2 MII 3.3V 208 PQFP Unmanaged, stackable, 30 status LEDs, 3 direct drive LEDs

(4 selectable modes), 4 segment LEDs, 2 activity graph LEDs

developer.intel.com/design/network Networking Products

100MBPS & 10000MBPS

MEDIA ACCESS CONTROLLERS

Product Ports Interface Power Package Special Features

IXF1110 10 ﬁber SPI4-2, GBIC/SerDes 1.8V, 2.5V 552 CBGA SPI4-2 with dynamic phase alignment, double data clock,

receive FIFO, cost-effective memory architecture

IXF1010 10 TP SPI4-2, RGMII 1.8V, 2.5V 552 CBGA SPI4-2 with dynamic phase alignment, double data clock,

receive FIFO, cost-effective memory architecture

INTEL®

MEDIA SWITCH

Product Ports Interface Power Package Special Features

IXE5416 16 TP or ﬁber GMII, TBI, MII 2.5V 836 EBGA 16-port Gigabit switching/routing, trafﬁc

3.3V classiﬁcation, QoS, ﬁltering, prioritization

IXE5216 16 TP or ﬁber GMII, TBI, MII 2.5V 836 EBGA 16-port Gigabit switching, trafﬁc classiﬁcation, QoS,

3.3V ﬁltering, prioritization

IXE2424 24/4 TP SERDES/GMII, SMII 1.8V 792 TBGA 24-port 10/100, four-port Gigabit, Layer 2/3/4

IXE2424EE or ﬁber PCI, I2C, SSRAM 3.3V switching/routing, integrated 10/100 and Gigabit

MACs, MPLS, Diffserv, WRED, QoS, VLAN compliance,

Intel®Carrier Class Ethernet support2(IXE2424EE)

IXE2426 24/4 TP SERDES/GMII, SMII, 1.8V 792 TBGA 24-port 10/100, four-port Gigabit, Layer 2 switching,

or ﬁber PCI, I2C, SSRAM 3.3V integrated 10/100 and Gigabit MACs, VLAN compliance, QoS

NOTES

1All products offer Energy Saving Mode and support commercial temperature range (0ºC to 70ºC).

availability (minimum of ﬁve years from product introduction)

KEY TERMS

AUI Attached Unit Interface RMII Reduced Media Independent Interface

CDE Cable Discharge Event RMON Remote Monitoring

FX Fiber Media SMI Serial Management Interface

GMII Gigabit Media Independent Interface SMII Serial Media Independent Interface

IRB Inter-Repeater Backplane SNMP Simple Network Management Protocol

MAC Media Access Controller TBI Ten-Bit Interface

MII Media Independent Interface TDR Time Domain Reﬂectometry

PCI Peripheral Components Interconnect TP Twisted Pair

PHY OSI Physical Layer device

Networking Products developer.intel.com/design/network

developer.intel.com Advanced Ethernet Controllers

INTEL’S 10/100/1000 ETHERNET CONTROLLERS (MAC/PHY)

Intel®82541PI Gigabit Ethernet Controller

The Intel®82541PI Gigabit Ethernet Controller provides optimized Gigabit networking for PCI designs. This highly

efﬁcient controller, with enhanced power management, consumes less than 1.0W of power at Gigabit speeds. When no

signal is detected on the wire, the controller reduces power consumption by switching to 100 or 10 and powering down the

physical-layer circuitry (PHY). When a signal is detected, the controller automatically negotiates the connection to Gigabit,

if available.

The Intel 82541PI Gigabit Ethernet Controller enhances secure manageability and system health monitoring over the LAN

with support for IPMI 1.5. For IPMI designs, the onboard SMBus port can pass management trafﬁc through the controller to

a management device, such as a Baseboard Management Controller (BMC).

The Intel 82541PI combines Intel’s ﬁfth-generation Gigabit MAC design with fully integrated PHY to provide a

standard IEEE 802.3 Ethernet interface for 1000BASE-T, 100BASE-TX and 10BASE-T applications. In addition, the

controller provides a direct Peripheral Component (PCI) Interconnect designed to be compliant with the PCI 2.3 bus up

to 66MHz. Packaged in a 15x15 mm PBGA, the Intel 82541PI Gigabit Ethernet Controller is footprint-compatible with

the Intel®82551QM and Intel®82551ER Fast Ethernet Controller and Intel®82562EZ device. Footprint-compatibility,

plus Intel®SingleDriver™technology allow for a ﬂexible Gigabit Ethernet or Fast Ethernet implementation on the same

motherboard layout.

Intel®82541ER Gigabit Ethernet Controller

The Intel®82541ER Gigabit Ethernet Controller provides optimized Gigabit networking for PCI designs. This highly

efﬁcient controller, with enhanced power management, consumes less than 1.0W of power at Gigabit speeds. When no

signal is detected on the wire, the controller reduces power consumption by switching to 100 or 10 and powering down the

physical-layer circuitry (PHY). When a signal is detected, the controller automatically negotiates the connection to Gigabit,

if available.

The Intel 82541ER combines Intel’s ﬁfth-generation Gigabit MAC design with fully integrated PHY to provide a standard

IEEE 802.3 Ethernet interface for 1000BASE-T, 100BASE-TX and 10BASE-T applications. In addition, the controller

provides a direct Peripheral Component (PCI) Interconnect designed to be compliant with the PCI 2.3 bus up to 66MHz.

Packaged in a 15x15 mm PBGA, the Intel 82541ER Gigabit Ethernet Controller is footprint-compatible with the Intel

82551ER and Intel 82562EZ device. Footprint-compatibility allows for a ﬂexible Gigabit Ethernet or Fast Ethernet

implementation on the same motherboard layout.

Intel®82545GM Gigabit Ethernet Controller

The Intel®82545GM Gigabit Ethernet Controllers are single, compact components with integrated Gigabit Ethernet MAC

and PHY layer functions. Packaged in a 21x21 mm TFBGA, the 82545GM Gigabit Ethernet controller is footprint-

compatible with the Intel®82546GB Dual Port Gigabit Ethernet Controller (same package size, same number and pattern

of pins and similar signal layout), allowing for a ﬂexible, single port or dual port, multipurpose design.

The Intel 82545GM integrates Intel’s fourth-generation Gigabit MAC design with fully integrated, physical-layer circuitry

to provide a standard IEEE 802.3 Ethernet interface for 1000Base-T, 100Base-TX, and 10Base-T applications (802.3, 802.3u,

802.3ab). The controller is capable of transmitting and receiving data at 1000 Mb/s, 100 Mb/s, or 10 Mb/s data rates. For

ﬁber-optic applications, the Intel 82545GM’s integrated SERDES supports 1000Base-SX and 1000Base-LX (802.3z). In

addition, the controller provides a direct Peripheral Component Interconnect (PCI) 2.2 and PCI-X 1.0a-compliant bus at

clock frequencies up to 133 MHz.

Advanced Ethernet Controllers—PCI Based

Advanced Ethernet Controllers developer.intel.com

The Intel 82545GM Gigabit Ethernet Controller architecture is optimized to deliver both high performance and PCI/PCI-X

bus efﬁciency. Using state logic design with a pipelined DMA Unit and 128 bit wide buses for the fastest performance, the

Intel 82545GM controller handles Gigabit Ethernet trafﬁc with low network latency and minimal internal processing

overhead. The controller’s architecture includes independent transmit and receive queues to limit PCI bus trafﬁc, and a PCI

interface that maximizes the use of bursts for efﬁcient bus usage. The Intel 82545GM Gigabit Ethernet Controller prefetches

up to 64 packet descriptors in a single burst for efﬁcient PCI bandwidth usage. A 64 KB on-chip packet buffer maintains

superior performance as available PCI bandwidth changes. Advanced interrupt moderation hardware manages interrupts

generated by the Intel 82545GM controller to further improve system efﬁciency. In addition, using hardware acceleration, the

controller also ofﬂoads tasks from the host processor, such as TCP/UDP/IP checksum calculations and TCP segmentation.

The Intel 82545GM Gigabit Ethernet Controller is designed for use in the following applications:

■LAN on Motherboard (LOM) in dense, space-constrained systems such as rack-mounted servers and high-density

blade servers

■Communications platform using dual Gigabit Ethernet on the backplane (PICMG 3.1 compliant or 1000BASE-X)

■Internet infrastructure devices with high-speed requirements and limited board real estate, such as switches, routers

and load balancers

Intel®82546GB Dual Port Gigabit Ethernet Controller

The Intel 82546GB Dual Port Gigabit Ethernet Controller incorporates two full Gigabit Ethernet MAC and PHY layer

functions and Serializer/ Deserializer (SerDes) on a single, compact component. Packaged in a 21x21 mm PBGA, the

82546GB Dual Port Gigabit Ethernet Controller provides dual port functionality without requiring additional board space

for the component.

The Intel 82546GB integrates Intel’s fourth-generation Gigabit MAC design, with fully integrated, physical-layer

circuitry, to provide two standard IEEE 802.3 Ethernet interfaces for 1000BASE-T, 100BASE-TX, and 10BASE-T

applications (802.3, 802.3u, 802.3ab). For Ethernet on the backplane and ﬁber-optic applications, the Intel 82546GB’s

two integrated SerDes support 1000BASE-X (802.3z). In addition, the controller provides a single, direct Peripheral

Component Interconnect (PCI) 2.3 and PCI-X 1.0a-compliant bus that operates as a single multi-function device on the

bus at clock frequencies up to 133MHz.

The Intel 82546GB Gigabit Ethernet Controller architecture is optimized to deliver both high-performance networking and

PCI/PCI-X bus efﬁciency. Using state logic design with a pipelined DMA Unit and 128-bit-wide buses for the fastest

performance, the 82546GB controller handles Gigabit Ethernet trafﬁc with low network latency and minimal internal

processing overhead. The controller’s architecture includes independent transmit and receive queues to limit PCI bus trafﬁc,

and a PCI interface that maximizes the use of bursts for efﬁcient bus usage. The Intel 82546GB Gigabit Ethernet Controller

prefetches up to 64 packet descriptors in a single burst for efﬁcient PCI bandwidth usage. Two 64KB on-chip packet buffers

maintain superior performance as available PCI bandwidth changes. Advanced interrupt moderation hardware manages

interrupts generated by the 82546GB controller to further improve system efﬁciency. In addition, using hardware

acceleration, the controller also ofﬂoads tasks from the host processor, such as TCP/UDP/IP checksum calculations and TCP

segmentation.

The Intel 82546GB Gigabit Ethernet Controller is designed for use in the following applications:

■LAN on Motherboard (LOM) in dense, space-constrained systems such as rack-mounted servers and high-density

blade servers

■Communications platform using dual Gigabit Ethernet on the backplane (PICMG 3.1 compliant or 1000BASE-X)

■Internet infrastructure devices with high-speed requirements and limited board real estate, such as switches, routers

and load balancers

developer.intel.com Advanced Ethernet Controllers

Intel®82547GI Gigabit Ethernet Controller

The Intel®82547GI Gigabit Ethernet Controller enables full-duplex Gigabit Ethernet performance using the

Communication Streaming Architecture (CSA). The Intel 82547GI Gigabit Ethernet Controller bypasses the PCI bus,

freeing its bandwidth for other I/O operations, and connects to the dedicated CSA bus on the Memory Control Hubs (MCH)

of Intel®865 and Intel®875 chipsets for the Intel®Pentium®4 processor. The CSA port architecture is invisible to both system

software and the operating system, allowing conventional “PCI-like” conﬁguration. CSA offers lower memory latency and

higher performance than PCI-based controllers, giving the end user a true Gigabit networking experience.

The Intel 82547GI Gigabit Ethernet Controller enhances secure manageability and system health monitoring over the LAN

with support for IPMI 1.5. For IPMI designs, the onboard SMBus port can pass management trafﬁc through the controller to

a management device, such as a Baseboard Management Controller (BMC) responsible for management functions.

The Intel 82547GI combines Intel’s ﬁfth-generation Gigabit MAC design with fully integrated physical-layer circuitry

(PHY) to provide a standard IEEE 802.3 Ethernet interface for 1000BASE-T, 100BASE-TX and 10BASE-T applications.

Packaged in a 15x15 mm PBGA, the Intel 82547GI Gigabit Ethernet Controller is footprint-compatible with the Intel

82562EZ device. Footprint-compatibility and Intel SingleDriver technology allow for a ﬂexible Gigabit Ethernet or Fast

Ethernet implementation on the same motherboard layout.

INTEL’S 10/100 ETHERNET CONTROLLERS (MAC/PHY)

Intel®82551QM Integrated Fast Ethernet Controller

The Intel®82551QM Fast Ethernet Multi-function PCI/Cardbus Controller is an evolutionary addition to Intel’s family of

Intel®8255X controllers. It provides excellent performance by ofﬂoading TCP, UDP and IP checksums and supports

TCP segmentation off-load for operations such as Large Send. It combines a low-power and small package design, which is

ideal for power and space-constrained environments. Intel 82551QM enhancements over the Intel®82559 include improved

Bit Error Rate performance, Deep Power-down state power reductions. The Intel 82551QM is pin-compatible with the Intel®

82550 and Intel 82559 Fast Ethernet controllers, and layout-compatible with 82541 Gigabit Ethernet controllers.

Intel®82551ER/IT Integrated 10Base-T/100BASE-TX Ethernet Controllers

The Intel®82551ER integrated 10Base-T/100Base-TX Ethernet Controller is an evolutionary addition to Intel’s family of

8255X controllers. As part of Intel’s fourth generation of fully integrated Fast Ethernet MAC/PHY solutions, the Intel

82551ER is optimized for low-cost, embedded applications. An extended temperature version of the 82551ER product is also

available, the Intel®82551IT which supports an identical feature set and footprint as the 82551ER.

The Intel 82551ER provides excellent performance by ofﬂoading TCP, UDP and IP checksums. Its optimized 32-bit

interface and efﬁcient scatter-gather bus mastering capabilities enable the Intel 82551ER to perform high-speed data transfers

over the PCI bus. This capability accelerates the processing of high-level commands and operations, which lowers CPU

utilization. Its architecture enables data to ﬂow efﬁciently from the bus interface unit to the 3 Kbyte transmit and receive

FIFOs, providing the perfect balance between the wire and system bus. In addition, multiple priority queues are provided to

augment Quality of Service performance.

The Intel 82551ER is pin-compatible with the Intel®82559ER Fast Ethernet controller, and layout-compatible with the

Intel®82540 and 82541 Gigabit Ethernet controllers. Intel supported Intel 82551ER drivers run on the standard Intel

82551QM, providing OEMs an upgrade path to the Intel 82551QM for additional features and increased functionality.

Advanced Ethernet Controllers developer.intel.com

Intel®82562ET and Intel®82562EZ 10Base-T/100Base-TX Platform LAN Connect Solution

The Intel®82562ET and Intel®82562EZ are highly integrated Platform LAN Connect (PLC) devices combining 10Base-T

and 100Base-TX physical layer capabilities, and providing a core ingredient of the enabling solution for the integrated

networking connectivity in Intel®I/O Controller Hub (ICH2/3/4/5) based platforms. The Intel 82562ET and Intel 82562EZ

support a single interface fully compliant with the IEEE 802.3/802.3u standard. The IEEE 802.3u standard for 100Base-TX

deﬁnes networking over two pairs of Category 5 unshielded twisted pair cable. The Intel®82562ET/EZ complies with the

IEEE 802.3u Auto-Negotiation (and 100Base-TX) standard and the IEEE 802.3x Full-Duplex Flow Control standard.

The ICH2/3/4/5/6 LAN solution that the Intel 82562ET/EZ enables is a 32-bit PCI device that features enhanced scatter-

gather bus mastering capabilities which allows the LAN solution to perform high-speed data transfers over the PCI bus.

The bus mastering capabilities enable the LAN solution to process high-level commands and perform multiple operations,

thereby ofﬂoading communications tasks from the system CPU. Two large transmit and receive FIFOs are also included in

the architecture to enhance performance while minimizing the use of system resources. Target applications include but are

not limited to LAN on motherboard (LOM) and embedded designs targeted at the value segment and requiring reliable

10/100 LAN capabilities.

INTEL®ETHERNET CONTROLLER LINE CARD

MAT’L. MASTER BUS INTERFACE OPERATING POWER STANDBY PACKAGE-

PRODUCT FUNCTION PART NUMBER BUS SPEED PCI BUS TEMP. VOLTAGE DISSIPATION POWER MODE PINS

10/100/1000 ETHERNET CONTROLLERS

82547GI Single port integrated 855106 CSA n/a n/a 0°C–+70°C 1.2, 1.8, 3.3V ~1.0W 105mA @ 3.3V 196 PBGA

MAC/PHY

82541PI Single port integrated 857520 PCI 33/66 MHz 32 bit 0°C–+70°C 1.2, 1.8, 3.3V ~1.0W 45mA @ 3.3V 196 PBGA

MAC/PHY

82541ER Single port integrated 858265 PCI 33/66 MHz 32 bit 0°C–+70°C 1.2, 1.8, 3.3V ~1.0W 45mA @ 3.3V 196 PBGA

MAC/PHY

82546EB Dual port integrated 845635 PCI-X/PCI 33/66/133 MHz 32/64 bit 0°C–+55°C 1.5, 2.5, 3.3V ~2.6W 220mA @ 3.3V 364 PBGA

MAC/PHY/SerDes

82546GB Dual port integrated 855352 PCI-X/PCI 33/66/133 MHz 32/64 bit 0°C–+55°C 1.5, 2.5, 3.3V ~2.6W 220mA @ 3.3V 364 PBGA

MAC/PHY/SerDes

82545EM Single port integrated 845633 PCI-X/PCI 33/66/133 MHz 32/64 bit 0°C–+70°C 1.5, 2.5, 3.3V ~1.8W 170mA @ 3.3V 364 TFBGA

MAC/PHY/SerDes

82545GM Single port integrated 855561 PCI-X/PCI 33/66/133 MHz 32/64 bit 0°C–+70°C 1.5, 2.5, 3.3V ~1.5W 125mA @ 3.3V 364 TFBGA

MAC/PHY/SerDes

82540EM Integrated MAC/PHY 845194 PCI 33/66 MHz 32 bit 0°C–+70°C 1.5, 2.5, 3.3V ~1.4W 120mA @ 3.3V 196 TFBGA

10/100 ETHERNET CONTROLLERS

82551QM Integrated MAC/PHY 844662 PCI 33 MHz 32 bit 0°C–+85°C 3.3V ~0.5W n/a 196 PBGA

82551ER Integrated MAC/PHY 844687 PCI 33 MHz 32 bit 0°C–+85°C 3.3V ~0.5W n/a 196 PBGA

82551IT Integrated MAC/PHY 855622 PCI 33 MHz 32 bit -40°C–+85°C 3.3V ~0.5W n/a 196 PBGA

82559 Integrated MAC/PHY 822772 PCI 33 MHz 32 bit 0°C–+70°C 3.3V ~0.6W n/a 196 PBGA

82559ER Integrated MAC/PHY 825111 PCI 33 MHz 32 bit 0°C–+70°C 3.3V ~0.6W n/a 196 PBGA

82559ER* Integrated MAC/PHY 826238 PCI 33 MHz 32 bit -25°C–+85°C 3.3V ~0.6W n/a 196 PBGA

10/100 ETHERNET PLATFORM LAN CONNECT (PLC) DEVICES

82562ET PLC for ICH2/3/4/5 829706 PLC n/a n/a 0°C–+70°C 3.3V ~0.5W n/a 48 SSOP

82562EZ PLC for ICH2/3/4/5 PLC n/a n/a 0°C–+70°C 3.3V ~0.5W n/a 196 PBGA

* expanded temperature version (-25°C–+85°C)

developer.intel.com/design/network Optical Products

PRODUCT OVERVIEW

Intel enables development of a wide range of Optical solutions that help meet demands of carrier equipment manufacturers

to accelerate services deployment, reduce cost and ease migration to higher bandwidth. Intel incorporates leading-edge

technologies and delivers them through a well-demonstrated, high-volume, low-cost manufacturing.

Electrical to Optical Conversion (E/O)

The optical transmission system converts the electrical signal into an optical signal. The quality of the transmitted optical

signal (i.e., the maximum transmission distance) is highly dependent on the jitter of the serial bit stream. The jitter is the

phase noise most commonly caused by the uncertainty or variations in the bit periods. To resolve this, Intel has directed

signiﬁcant effort toward the system and component design, focused at maintaining precise, constant duration of the bit

periods in the outgoing data stream.

Framer/Media Access Controller (MAC)

ASONET/SDH Framer allows for SONET/SDH frame transport by encapsulating electrical data streams into packets or

frames, and adding a header with section, line and path overhead bytes. The device can map different kinds of payloads

such as ATM, IP, Voice, and Ethernet into the synchronous SONET/SDH frame.

Forward Error Correction (FEC)/Digital Wrapping

AForward Error Correction (FEC) transponder device provides coding and decoding functionality for 10Gbps ﬁber

optical transmission, based on the out-of-band FEC scheme recommended by ITU-T G.975. At each receiver, instead

of passing on incorrect data, an FEC module recovers the original data and corrects the error. A clean generation of client data

travels to the next receiver and the process is repeated. FEC helps to ensure data accuracy across the network and improve

network reliability at the highest possible transfer speed over longer distances.

An Optical Digital Wrapper device covers additional functions deﬁned in ITU-T G.709 recommendation, it enables Optical

Transport Network (OTN) functionalities and supports synchronous as well as asynchronous mapping schemes.

Clock and Data Recovery (CDR)

AClock and Data Recovery (CDR) device converts the analog input signal to a digital bit stream with an associated clock.

The clock output from the CDR is used to clock the data on the parallel interface into the next device. The key function

block in the CDR is the Phase Locked Loop (PLL), which locks onto the incoming data stream. The phase detector is

equipped with a discriminator that evaluates the incoming data signal in the middle of the bit period (the “eye”) and

determines whether a 1 or a 0 is received. A separate lock detector determines whether the incoming data rate deviates too

much from a given frequency. If data input is absent or deviates too much, the external reference clock ensures that the

Voltage Controlled Oscillator (VCO) remains in a selectable ±500 to ±2,000 ppm capture range.

Optical Products

FEC

WRAP

CDR

SerDes

Framer

MAC

Laser

Photodiode

Driver

LIA TIA

OpticsTransport Physical Layer (PHY)

Electrical

(to “client”)

Optical

(to “system”)

Optical Transceiver

Optical Products developer.intel.com/design/network

Serializer/Deserializer (SerDes)

The Deserializer or Demultiplexer (DeMUX) has the purpose of transforming the serial data signal into four parallel data

signals at a corresponding lower data rate. If, for example, a 2.488Gbps signal (OC-48) is fed into a 1:4 DeMUX, it will

produce four parallel data outputs at 622.08Mbps. This signal then interfaces to the digital processing system. Notice that

most of Intel’s DeMUX have an integrated Clock and Data Recovery (CDR) device meeting the market segments

requirement of small form factor solutions.

In the optical transmission system, the Serializer or Multiplexer (MUX) has the opposite function of the DeMUX. The

MUX converts the parallel signal from the processing system into one serial bit stream at a corresponding higher data rate.

If, for example, 16 parallel data inputs at 622.08Mbps are led into a 16:1 MUX, the output data will be at 9.95328Gbps

(OC-192). The serial signal is ampliﬁed before it is passed on to the next building block.

Optical to Electrical Conversion (O/E)

An optical reception system receives an optical signal and converts it into an electrical signal. The optical receiver can be

either a photodiode or an Avalanche Photo Detector (APD) and it converts the optical input to a small electrical current.

Transimpedance Ampliﬁer (TIA)

ATransimpedance Ampliﬁer (TIA) is placed right after the O/E transducer. It receives the output current from the

photodiode and converts it into an electrical voltage. The TIA signal, which varies from a few mV up to 50 mVpp or

more, can then be passed to an Automatic Gain Controlled (AGC) ampliﬁer or a Limiting Ampliﬁer (LIA).

Limiting Ampliﬁer (LIA)

ALimiting Ampliﬁer (LIA) or an Automatic Gain Control ampliﬁer (AGC) follows the TIA. The LIA and AGC have the

function of obtaining a signal of sufﬁcient amplitude/power to drive the next building block.

Laser Diode Driver (LDD)

The Laser Diode Driver (LDD) provides the opposite function of the Transimpedance Ampliﬁer (TIA). The LDD converts

the electrical voltage serial signal received from the Multiplexer (MUX) into an electrical current with strictly controlled

amplitude.

Optical Transceiver

Intel®Optical transceivers are subsystems comprised of high-speed optical to electrical conversion, which offers networking

OEMs Multi-Source Agreement (MSA)-compliant turnkey solutions for OC-192 and 10GbE interfaces. Potential

applications include: Optical switches and routers, add/drop multiplexers, digital cross-connects, Dense Wavelength Division

Multiplexing (DWDM) terminals, other WDM and non-WDM metro system equipment, and optical test equipment.

10Gbps Framer/MAC/Digital Wrapper

WB4500 SONET/SDH Virtual Concatenation Multi-Protocol OC-48/STM-16,

OC-12/STM-4, and OC-3/STM-1 Data Framer

With up to 48 separate logical channels, the Intel®WB4500 SONET/SDH virtual concatenation framer is designed for

use in highly channelized telecom and datacom applications in metropolitan area networks and wide area networks.

Typical applications include Ethernet over SONET/SDH, RPR, ATM, POS, LAPS, and TDM. This includes systems such as

MSPPs, routers, switches, access concentrators, ADMs, and dense wave division multiplexing (DWDM) systems.

There are two system interfaces shown in the Intel WB4500 high-level block diagram: the SPI-3 bus and Telecom

Add/Drop bus—combined with a time slot interchange the device can support concurrent TDM and data services in one

component.

developer.intel.com/design/network Optical Products

The line side auxiliary telecom bus can be used to connect low-cost external framers for up 16 OC-3/STM-1 ports. It can

also be used as a mate interface to connect to another Intel WB4500 device enabling a variety of options to solve APS design

problems: 1+1, 1:N, BLSR/MS_SPRing, and UPSR/SNCP.

An example of a complete SONET/SDH system solution based on the Intel WB4500 is shown in the Complete

SONET/SDH Solution diagram. The telecom bus add/drop interface is used to connect to a T1/E1 module. The SPI-3

interface connects to an Ethernet services module. On the line side, the auxiliary telecom bus connects to an external framer

for a cost effective 1+1 APS solution.

IXF19301/19303/19325 Bandwidth Aggregation and Channelizer Devices with Virtual Concatenation

Intel®IXF19301/19303/19325 Bandwidth Aggregation and Channelizer Devices with Virtual Concatenation family of

service framer products are highly integrated interface solutions for the transport of multi-service trafﬁc. The various

devices are tailored for 10G, 5G and 2.5G applications with or without line and path protection applications.

Intel IXF19301/19303/19325 supports Packet Over SONET (POS), Generic Framing Procedure (GFP), X.85, X.86, Link

Access Procedure-SDH (LAPS) and Asynchronous Transfer Mode (ATM) data mapping for up to 64 SONET/SDH virtually

or contiguously concatenated containers. The devices support the SPI4 Phase 2 System Interface for easy connection to

multi-port MACs, Field Programmable Gate Arrays (FPGAs), or Network Processors.

Intel IXF19301/19303/19325 devices perform section/line overhead termination by implementing a cross-connect allowing

the non-blocking transfer of non-concatenated and concatenated payloads between the data and line interfaces. The devices

manage both VC-3 to AU-3 and VC-3 to TU-3 container mapping options for ﬂexible SDH conﬁgurations.

IXF19301: STS-192/STM-64, 10GbE LAN/WAN, x4 STS-48/STM-16, x16 STS-12/STM-4 and STS-3/STM-1 working

interface and STS-192/STM-64, x4 STS-48/STM-16 protection interface

IXF19303: STS-192/STM-64, x4 STS-48/STM-16, 10GbE LAN/WAN, x16 STS-12/STM-4 and STS-3/STM-1

unprotected, or x2 STS-48/STM-16, x8 STS-12/STM-4 and STS-3/STM-1 protected (1+1; 1:1)

IXF19325: x2 STS-48/STM-16, x8 STS-12/STM-4 and STS-3/STM-1 unprotected, or x1 STS-48/STM-16,

x4 STS-12/STM-4 and STS-3/STM-1 protected (1+1; 1:1)

IXF19302 10Gbps Bandwidth Aggregation and Channelizer Device

The Intel®IXF19302 10-Gbps Bandwidth Aggregation and Channelizer Device service framer is a highly integrated

interface solution for the transport of multi-service trafﬁc. The device supports a single STS-192/STM-64, 4 STS-48/

STM-16, 16 STS-12/STM-4, 16 STS-3/STM-1 or combination of these via four distinct ports per interface. Intel IXF19302

also provides an aggregation/protection interface for single STS-192/STM-64 or quad STS-48/STM-16. The integrated

10 Gigabit Ethernet Media Access Controller (MAC) allows Wide Area Network (WAN) and Local Area Network (LAN)

operations. It supports concatenated and non-concatenated payloads STS-1, STS-Xc (where X = 3, 6, 9, …, 48) and

STS-192c.

Intel IXF19302 supports the mapping/demapping of POS, GFP, X.85, X.86, LAPS and ATM data for up to

64 SONET/SDH virtually or contiguously concatenated payloads/containers. The packets and cells that are mapped/demapped

to/from these containers are transferred to/from the next packet device using an SPI-4 Phase 2 system interface. Intel

IXF19302 performs section/line OH termination on both interfaces. It also supports higher order VC-4/STS-3 and lower

order VC-3/STS-1 path termination on the mapped/demapped SPE/container.

The Intel IXF19302 implements a cross-connect allowing the non-blocking transfer of non-concatenated and concatenated

payloads between the Data and Line interfaces. Work and Protect Framers supports Multicast, Add/Drop or conﬁgurable for

any port to any port protection.

Optical Products developer.intel.com/design/network

IXF18101 10Gbps Physical Layer Device for STS-192c/STM 64c POS/GFP and 10 Gigabit Ethernet LAN or WAN PHY

The Intel®IXF18101 is the ﬂagship device in the footprint and register set-compatible IXF1810x family of 10 Gigabit

Physical Layer devices.

The IXF18101 is a highly integrated solution for STS-192c/STM 64c and 10 Gigabit Ethernet LAN/WAN port

applications, as speciﬁed in IEEE 802.3ae. The IXF18101 supports various modes of operation for transport of 10 Gigabit

Ethernet, High Level Data Link Control (HDLC) frames, Packet over SONET (POS), or Generic Framing Procedure (GFP)

packet formatting. Internal mapping engines provide the required formatting and maintenance of packet data into the

STS-192c/STM 64c SONET/SDH frame payload. The device also supports Automatic Protection Switching (APS) in OC192

and 10GbE WAN Modes. A data-over-ﬁber packet mapping mode is supported for complete ﬂexibility that can be used for

test equipment, test functionality veriﬁcation within a system, or direct data to line mapping.

The GFP mappings are per G. 7041 and can be used for transport of multiplexed data ﬂows of Gigabit Ethernet, FICON,

ESCON, Fiber Channel and other protocols.

The 10 Gigabit MAC handles frame encapsulation, veriﬁcation, ﬂow control, and Remote Monitoring/Simple Network

Management Protocol (RMON/SNMP) statistics management, per IEEE 802.3ae standards. The IXF18101 also handles the

Physical Coding Sublayer (PCS) and WAN Interface Sublayer (WIS) functions of the 802.3ae 10 Gigabit Ethernet standard.

The PCS hardware handles the 64B/66B encoding/decoding to provide the transition density and balance the 10.3125Gbps

stream. The WAN interface sublayer provides the rate matching mechanism for 9.953Gbps rate transport, as well as the

STS-192c/STM 64c framing structure used in WAN PHY applications. The GFP mapping engine can be connected directly

to Forward Error Correction (FEC) or Optical Transport Networks (OTN) digital wrapper devices for GFP client mapping

directly per G.709.

On the System side, it supports the System Parallel Interface-level 4 (SPI-4) Phase 2. On the line side, the IXF18101

supports both the OIF SFI-4 and IEEE 802.3ae XSBI interfaces. An integrated Pseudo Random Bit Sequence (PRBS) packet

generator/analyzer for the PCS and WIS blocks (per IEEE 802.3ae clause 49 and 50) is also supported. Various loopback

modes for line, system and debug features are provided in the device.

The Intel IXF18101 offers a powerful solution for a variety of 10Gbps line card applications for Core and Metro

Routers, Enterprise Routers and Switches, MSPPs, Storage Area Applications, Metro Transport and Dense Wavelength

Division Multiplexing (DWDM). The ﬂexibility built into the Intel IXF18101 gives customers the ability to design a

software-reconﬁgurable line card that will support any of the protocols above. Intel provides an Evaluation and

Development platform to assist customers with the development of their line cards. And for their Software development,

we offer a complete Development platform that includes an Application Program Interface (API) management software,

Drivers and Documentation.

IXF18102 10Gbps Physical Layer Device for STS-192c/STM 64c POS/GFP

The Intel®IXF18102 offers a feature, power and cost optimized solution for STS-192c/STM 64c line card applications for

Core and Metro Routers, Enterprise Routers and Switches, MSPPs, Storage Area Applications, Metro Transport and

Dense Wavelength Division Multiplexer (DWDM). The Intel IXF18102 is a highly integrated framer solution for STS-192c/

STM 64c port applications. The IXF18102 supports various modes of operation for transport of High Level Data Link

Control (HDLC) frames, Packet over SONET (POS), or Generic Framing Procedure (GFP) packet formatting. Internal

mapping engines provide the required formatting and packet data maintenance into the STS-192c/STM 64c SONET/SDH

frame payload. A data-over-ﬁber packet mapping mode is supported for test equipment and test functionality veriﬁcation

within a system or direct data over ﬁber applications.

The GFP mapping engine can be connected directly to Forward Error Correction (FEC) or Optical Transport Networks

(OTN) digital wrapper devices for GFP client mapping over G.709 OTN Networks. The system interface is 16 bits wide,

features 622Mbps–800Mbps Double Data Rate (DDR) clocking and supports the industry-standard System Parallel Interface

Level 4 (SPI-4) Phase 2. The SPI-4 Phase 2 interface is Low Voltage Differential Signaling (LVDS), which produces fewer

connection concerns than previous 64-bit High-Speed Transport Layer (HSTL) interfaces.

developer.intel.com/design/network Optical Products

On the line side, the IXF18102 supports the OIF SerDes Framer Interface Level 4 (SFI-4) interface, which is 16 bits wide

with 622Mbps data rate. The IXF18102 supports Automatic Protection Switching (APS) for SONET/SDH. Various types of

loopbacks such as line remote, line local, system remote as well as system local and Synchronous Payload Envelope (SPE)

payload test are supported for general development functionality test and debug.

It is footprint and register set compatible with the IXF18101 device, and therefore offers a feature, cost and power

optimized migration path for customers line cards. Since the devices are footprint and register set compatible, customers IP

in terms of Software, drivers, and more are protected and can be reused.

For Design development assistance, we offer Hardware Evaluation and Software Development platforms.

IXF18103 10-Gigabit Ethernet LAN or WAN PHY

The Intel®IXF18103 is the third device in the IXF1810x family of 10Gbps Physical Layer Devices.

The IXF18103 is a highly integrated solution for 10GbE Local Area Network (LAN) and Wide Area Network (WAN)

port applications compliant as per IEEE802.3ae speciﬁcations. The IXF18103 supports 10GbE LAN (10.3125Gbps) and

WAN (9.953Gbps) applications.

The 10 Gigabit MAC (per IEEE 802.3ae) handles frame encapsulation, veriﬁcation, 10GbE ﬂow control, and Remote

Monitoring/Simple Network Management Protocol (RMON/SNMP) statistics management. The IXF18103 also handles the

Physical Coding Sublayer (PCS) and WAN Interface Sublayer (WIS) functions of the IEEE 802.3ae 10 Gigabit Ethernet

standard. The PCS hardware handles the 64B/66B encoding/decoding to provide the transition density and balance of the

10.3125Gbps stream. The WIS provides the rate matching mechanism for 9.953Gbps rate transport, as well as the STS-

192c/STM 64c framing structure used in WAN PHY applications.

The system interface supports the industry-standard System Parallel Interface Level 4 (SPI-4) Phase 2. This interface is

16 bits wide with 622Mbps–800Mbps Double Data Rate (DDR) clocking. The SPI-4 Phase 2 interface is Low Voltage

Differential Signaling (LVDS), which produces fewer connection concerns than previous 64-bit High-Speed Transport Layer

(HSTL) interfaces.

On the line side, the IXF18103 supports the IEEE 802.3ae XSBI interfaces. The 16-bit LVDS interface can operate at

622Mbps to support the 10GbE WAN rate of 9.953Gbps, and at 644Mbps to support the 10GbE LAN rate of 10.3125Gbps.

The IXF18103 also supports an integrated Pseudo Random Bit Sequence (PRBS) packet generator/analyzer for the PCS

and WIS blocks per IEEE 802.3ae clause 49 and 50. Line remote, line local, system remote, and system local loopbacks

are also supported, as well as Synchronous Payload Envelope (SPE) payload test loopbacks for general development

functionality test and debug.

The IXF18103 comes with Evaluation and Software Development platforms to assist customers in the development of

their line card solutions. Since it is optimized for 10GbE applications, it gives customers the advantage of being able to build

cost-optimized, feature rich line cards for these applications without having to pay for features that they may not want.

IXF18103 may be used in combination with Intel®10Gb LXT16726/27 MUX and CDR DeMUX chips and Intel’s

TXN18107 XFP optical transceiver for efﬁcient 10GbE LAN/WAN support in enterprise and real estate-sensitive applications.

IXF18104 10 Gigabit LAN PHY

The Intel®IXF18104 is a highly integrated solution for 10GbE Local Area Network (LAN) port applications compliant as

per IEEE802.3ae speciﬁcations. The IXF18104 supports the 10GbE LAN mode of operation for transport of Ethernet

frames in LAN (10.3125Gbps) applications.

The 10 Gigabit MAC (per IEEE 802.3ae) handles frame encapsulation, veriﬁcation, 10GbE ﬂow control, and Remote

Monitoring/Simple Network Management Protocol (RMON/SNMP) statistics management. The IXF18104 also handles the

Physical Coding Sublayer (PCS) functions of the IEEE 802.3ae 10 Gigabit Ethernet standard. The PCS hardware handles the

64B/66B encoding/decoding to provide the transition density and balance of the 10.3125Gbps stream.

Optical Products developer.intel.com/design/network

The system interface supports the industry-standard System Parallel Interface Level 4 (SPI-4) Phase 2. This interface is

16 bits wide with 622Mbps–800Mbps Double Data Rate (DDR) clocking. The SPI-4 Phase 2 interface is Low Voltage

Differential Signaling (LVDS), which provides the customer with less connection concerns than previous 64-bit High-Speed

Transport Layer (HSTL) interfaces. On the line side, the IXF18104 supports the LAN version of the IEEE 802.3ae XSBI

interface. The 16-bit LVDS interface operates at 644Mbps to support the 10GbE LAN rate of 10.3125Gbps.

The IXF18104 also supports an integrated Pseudo Random Bit Sequence (PRBS) packet generator/analyzer for the PCS.

Line remote, line local, system remote, and system local loopbacks are supported for general development functionality test

and debug. The IXF18103 is offered with Evaluation and Software development platforms to assist customers in the

development of their line card solutions.

IXF18104 may be used in combination with Intel 10Gb LXT16726/27 MUX and CDR DeMUX chips and Intel’s

TXN18107 XFP optical transceiver for efﬁcient 10GbE LAN support in enterprise and real estate-sensitive applications.

10Gbps Forward Error Correction (FEC/EFEC)

IXF30001 Forward Error Correction Device

IXF30003 Forward Error Correction Device with SONET/SDH Performance Monitor

The Intel®IXF30001 and Intel®IXF30003 are Forward Error Correction (FEC) transponder devices. They provide coding

and decoding functionality for use in a 2.5Gbps and 10Gbps ﬁber optical transmission and systems. Based on the out-of-

band FEC scheme recommended by ITU-T G.975, IXF30001 and IXF30003 provide a signiﬁcant gain in transmission

quality. Both devices are intended for use in optical networks running at 2.5Gbps and 10Gbps, especially Dense Wavelength

Division Multiplexing (DWDM) systems. Due to the out-of-band nature they do not impose any restrictions to the payload

data type. IXF30001 and IXF30003 may be operated as:

■FEC transmitter wrapping and encoding the payload data stream

■FEC receiver unwrapping, decoding and error correcting the received data

■FEC transceiver, or

■Error correcting regenerator

■SONET/performance monitor (IXF30003 only)

With its power consumption below 3.5W the IXF30001 and IXF30003 have excellent power to performance ratio, and

small space requirement. The devices open the door to wrapper-based transparent OAM&P of optical networks. Integrated

error statistics circuitry and serial Optical Overhead Channels (OCOH) allow complete remote management of an optical

network. Both devices can be controlled via an 8-bit processor interface allowing a highly event-driven communication for

reducing processor load.

Forward Error Correction (FEC)/Digital Wrapping

IXF30005 Digital Wrapper 10Gbps OTN

The Intel®IXF30005 is a fully compliant G.709 digital wrapper device that covers most Optical Transport Network (OTN)

applications on a single chip. Based on the digital signal wrapping technique deﬁned by ITU-T G.709, the IXF30005

provides all functions required for an OTN system, including transmission protection based on Forward Error Correction

(FEC). With integrated FEC error statistics and overhead processing facilities, the Intel IXF30005 is a key component in

wrapper-based transparent operation, administration, maintenance and provisioning of optical networks.

The Intel IXF30005 is built on technology developed for the Intel IXF30001, which was the world’s ﬁrst commercially

available 10Gbps FEC device in the optical marketplace. Supporting both asynchronous and synchronous mapping schemes,

the Intel IXF30005 provides rich OTN framing, mapping and overhead functions on chips, compliant with the ITU-T G.709

standard.

Acting as a direct pin- and software-compatible drop-in replacement for the Intel IXF30001 and IXF30003, the IXF30005

supports G.975 framing, as well as ITU-T G.709. The IXF30005 may be operated as a gateway between existing IXF30001-

or IXF30003-based systems and ITU-T G.709-compliant equipment.

developer.intel.com/design/network Optical Products

With its power consumption of 3.5W the IXF30005 has excellent power to performance ratio, and small space requirements.

The device opens the door to digital wrapper OTN applications. Integrated error statistics circuitry and serial Optical

Overhead Channels (OCOH) allow complete remote management of an optical network. The devices can be controlled

via an 8-bit processor interface allowing a highly event-driven communication for reducing processor load.

IXF30007 10–13Gbps Digital Wrapper with Enhanced Forward Error Correction (FEC) and Variable Overhead Rate

The Intel®IXF30007 is a fully compliant G.709 digital wrapper device that covers most Optical Transport Network (OTN)

applications on a single chip. Built on the technology developed for the Intel IXF30001 (FEC100), the ﬁrst commercially

available 10Gbps FEC device in the market, the IXF30007 is designed for optical transmission applications where the coding

gain reached with standard FEC algorithms (ITU-T G.975, ITU-T G.709) is not sufﬁcient. The Intel IXF30007 supports

enhanced Forward Error Correction (FEC) using two concatenated RS decoders that provide unparalleled performance and

ﬂexibility. The variable FEC overhead allows the adoption of various line rates from 10 to 13Gbps and outperforms any

standard FEC already at 10.7Gbps with a net coding gain of 7db. At a line rate of 12.5Gbps it offers approximately 9 dB of

net electrical coding gain. It also wraps a 10.3Gbps Ethernet client signal into a 10.7Gbps or higher line rate.

The core FEC technology concatenates two Reed-Solomon codes that are conﬁgurable in both error correction capability

and block length, delivering a coding gain conﬁguration between zero and 30 percent overhead.

The IXF30007 consists of two completely separated signal paths referred to as north and south paths. While the north path

is primarily designed to operate as a line receiver, the south path may be used as a line transmitter. The IXF30007 forms the

basis of a single chip transponder application and, using integrated bridges between both paths, may be conﬁgured as a

regenerator and provide APS support. The Intel IXF30007 provides all basic functions required for an OTN system, and

appropriate conﬁguration of the outer code ensures compliance with the digital signal wrapping technique deﬁned by ITU-T

G.709. With integrated overhead processing circuitry and different types of payload mapping, the IXF30007 is a key

component in wrapper-based transparent operations, administration, maintenance and provisioning of optical networks.

With its low power consumption (less than 3W in a G.709 application and approximately 4W at 12.5Gbps line rate) the

IXF30007 has excellent power to performance ratio, and even smaller space requirements than IXF30005. The device opens

the door to digital wrapper OTN applications with increased FEC coding gain requirements. Integrated error statistics

circuitry and serial Optical Overhead Channels (OCOH) allow remote management of an optical network.

The devices can be controlled via an 8-bit processor interface allowing a highly event-driven communication for reducing

processor load.

IXF30009 Optical Transport Processor

The Intel®IXF30009 Optical Transport Processor is a highly integrated device. As a successor to the Intel IXF30001/

IXF30003/ IXF30005/ IXF30007 devices, the Intel IXF30009 builds on this expertise and is designed to handle most

OTN applications on a single chip. It provides strong Forward Error Correction (FEC) performance and support for

networking standards such as OTN (G.709v2), SONET/SDH and 10Gigabit Ethernet (10GigE). The IXF30009 features

SFI-4-compliant interfaces that can be conﬁgured to support either a single 10Gbps signal or four 2.5Gbps tributary signals.

It can perform fully transparent asynchronous aggregation of 2.5Gbps tributaries into a 10.7Gbps (OTU2) signal. The device

is full duplex and both directions can be conﬁgured independently.

The chip can be used as a SONET/SDH framer providing complete section and line termination for one OC-192/STM-64

or four OC-48/STM-16 signals. It can also be operated as a bridge device, transparently transporting any payload over a

G.709-compliant network, a network node operating with OTN signals on all interfaces, and as a gateway between

asynchronous OTNs interfacing between different carrier networks.

The single-chip integration support for multiple standards makes the Intel IXF30009 the ideal high-integration solution for

a wide range of applications including OTN networks, FEC regenerators, multi-service platforms, SONET/SDH Add/Drop

multiplexers, submarine and ULH FEC applications, low-cost 10Gbps/2.5Gbps metro and core networks, high-density line

cards for 2.5Gbps networks (with four bidirectional ports and 10GigE LAN transport and monitoring).

Optical Products developer.intel.com/design/network

The variable FEC overhead allows the adoption of various line rates from 10 to 12.5Gbps and outperforms any standard

FEC already at 10.7Gbps with a net coding gain of 8.5db. At a line rate of 12.5Gbps it offers over 10dB of net electrical

coding gain. It also wraps a 10.3Gbps Ethernet client signal into a 10.7Gbps or higher line rate.

WB1400 1 x STM-4/OC-12 or 4 x STM-1/OC-3 Channelized SONET/SDH Framer

The Intel®WB1400 1 x STM-4/OC-12 or 4 x STM-1/OC-3 Channelized SONET/SDH Framer is targeted at high-density

telecommunications and data communications equipment built for the metropolitan area network (MAN) and access

networks, including SONET/SDH ADMs, Switches, Multi-Service Provisioning Platforms (MSPPs) and Access

Concentrators used to aggregate end-user trafﬁc transmitted over T1/E1/J1/DS3, wireless, DSL and other transmission pipes.

The Intel WB1400 enables equipment makers to design for either OC-12/STM-4 or 4xOC-3/STM-1 with the same chip. In

the OC-3/STM-1 mode, the Intel WB1400 incorporates on-chip Clock and Data Recovery (CDR) which enables connection

to small form factor pluggable (SFP) Optics. On the system side, the device offers a triple redundant 4 x 8-bit telecom bus

interface at 77.76MHz for backplane connectivity, protection applications, or connection to an add/drop tributary device.

Software compatibility with the Intel®WB15xx/WB1400 product family enables reuse of design for multiple applications.

In addition, system designers can develop a single board with different stufﬁng options applicable for a range of line interface

connections. This compatibility enhances equipment manufacturer productivity and reduces design time required for

SONET/SDH systems.

WB1500 1 x OC-48/STM-16 or 4 x OC-12/STM-4 Channelized SONET/SDH Framer

The Intel®WB1500 1 x OC-48/STM-16 or 4 x OC-12/STM-4 Channelized SONET/SDH Framer is targeted at high-

density telecommunications and data communications equipment built for the wide area network (WAN) and

metropolitan edges of the network, including SONET/SDH ADMs, multi-service routers, switches, access concentrators and

dense wavelength division multiplexing (DWDM) systems, used to aggregate large amounts of end user trafﬁc transmitted

over T1/E1/J1/DS3, wireless, DSL and other transmission pipes.

The Intel WB1500 is a highly integrated channelized framer and overhead processor that comprehensively addresses both

SONET and SDH standards requirements. Compared to competitive devices targeting similar applications, the Intel WB1500

incorporates several unique features such as advanced support for tandem connections, and Intel ALERT™. In the 622 Mbps

mode, the Intel WB1500 connects directly to the CDRs eliminating the need for four external MUX/DeMUX devices.

Software compatibility with the Intel WB15xx/WB1400 product family enables reuse of design for multiple applications.

In addition, system designers can develop a single board with different stufﬁng options applicable for a range of line interface

connections. This compatibility enhances equipment manufacturer productivity and reduces design time required for

SONET/SDH systems.

WB1501 16 x OC-3 Channelized SONET/SDH Framer with Clock and Data Recovery

The integrated Intel®WB1501 16 x OC-3 Channelized Framer with Clock and Data Recovery (CDR) replaces 4 x OC-3

Framer enabling the design of signiﬁcantly smaller, more functional optical interfaces. The Intel WB1501 supports

sixteen 155Mbps optical ports, channelized down to the STS-1/VC-3 level.

The Intel WB1501 is designed for high-channelization, high density equipment located at the Access and Metropolitan

edges of the network, including SONET/SDH ADMs, multi-service routers, switches, access concentrators and DWDM

equipment used to aggregate large amounts of end-user trafﬁc transmitted over T1/E1/J1/DS3, wireless, DSL and other

transmission pipes. Additionally, with the advent of new high-density optics, the Intel WB1501 eliminates a major barrier to

designing higher density optical interface boards.

The Intel WB1501 achieves the industry’s highest density at the lowest power dissipation rate and enables equipment

makers to build very high-density optical interfaces with drastically reduced power dissipation, a critical advantage in

building today’s state-of-the-art systems.

developer.intel.com/design/network Optical Products

Software compatibility with the Intel WB15xx/WB1400 product family enables reuse of design for multiple applications.

In addition, system designers can develop a single board with different stufﬁng options applicable for a range of line interface

connections. This compatibility enhances equipment manufacturer productivity and reduces design time required for

SONET/SDH systems.

WB1510 2 x STM-4/OC-12 or 2 x STM-1/OC-3 Channelized SONET/SDH Framer

The Intel®WB1510 is the industry’s ﬁrst single-chip 2 x STM-4/OC-12 or 2 x STM-1/OC-3 Channelized SONET/SDH

Framer. The device offers equipment makers the ﬂexibility to design 2-ﬁber line interfaces for ring applications, using

a single chip. The 2 x OC-3/STM-1 mode enables systems engineers to design a single line interface card for both OC-12/

STM-4 and OC-3/STM-1 rates. The Intel WB1510 is targeted at high density telecommunications and data communications

equipment built for the metropolitan area network (MAN) and access networks, including SONET/SDH ADMs, Switches

and Multi-Service Provisioning Platforms (MSPPs), and Access Concentrator equipment used to aggregate end-user trafﬁc

transmitted over T1/E1/J1/DS3, wireless, DSL and other transmission pipes.

The Intel WB1510 offers a telecom bus interface and full bandwidth cross-connect that enables connections to multiple

devices or cards, such as tributary interfaces at the DS1/E1/DS3/E3 or OC-3/STM-1 rates. In the OC-3/STM-1 mode, the

WB1510 incorporates on-chip CDR.

Software compatibility with the Intel WB15xx/WB1400 product family enables reuse of design for multiple applications.

In addition, system designers can develop a single board with different stufﬁng options applicable for a range of line interface

connections. This compatibility enhances equipment manufacturer productivity and reduces design time required for

SONET/SDH systems.

10 Gigabit XAUI Transceiver

LXT12102 XAUI to 10G Serial Transceiver

Intel®LXT12102 is a follow-on next-generation product to LXT12101. The device is intended for use in the same

applications as LXT12101. With strong integrated features that includes, 8051 microcontroller, multiple ADC and DAC

channels, VCSEL driver, Limiting Ampliﬁer, and JTAG, it is an ideal device for optical transceiver modules. LXT12102 uses

internal 90nm process technology which enables more than 25 percent power reduction in the B0 version. Similar to

LXT12101, it can also be used in the system gasket applications and comes with reference designs.

10Gbps Transmitters

GD16585 10Gbps 16:1 Multiplexer (MUX) with Retiming

GD16589 10.66Gbps 16:1 Multiplexer (MUX) with Retiming

Intel’s highly integrated 10Gbps and 10.66Gbps transmitter chips for use in STM 64, OC-192 and out-of-band Forward

Error Correction (FEC) applications all incorporate a 16:1 MUX with fully integrated retiming Phase Locked Loop (PLL).

The 10Gbps MUX GD16585 and GD16589 include a dynamic phase alignment circuit that provides forward timing for OIF

applications or jitter clean up of the reference clock. All the devices exceed the ITU-T and Telcordia jitter requirements.

LXT16707 9.95–10.71Gbps Low-Power 16:1 Multiplexer (MUX)

The Intel®LXT16707 is a highly integrated, high-performance and low-power serializer for SDH STM 64, SONET

OC-192, Optical Transport Networking (OTN), Forward Error Correction (FEC/EFEC) applications and 10GbE

systems. Manufactured using a SiGe BiCMOS process for an optimal power/performance ratio, the Intel LXT16707

serializer chip helps ensure stable and reliable operation in Telco-class networking equipment.

The Intel LXT16707 transmitter includes a 16:1 MUX and Phase Locked Loop (PLL) circuits. In order to ensure critical

timing between clock and data signals going from the framer to the MUX, a 2-bit FIFO has been integrated as support for the

Optical Products developer.intel.com/design/network

Dynamic Phase Alignment (DPA). The device exceeds ITU-T and Telcordia jitter requirements. The LXT16707 is operated

from a single 3.3V power supply and has a power dissipation of 0.75W. It is packaged in a 13x13 mm 132-ball PBGA.

LXT16727 9.95–11.1Gbps Low-Power 16:1 Multiplexer (MUX)

The Intel®LXT16727 is a highly integrated, high-performance and low-power serializer for SDH STM 64, SONET OC-192,

Optical Transport Networking (OTN), Forward Error Correction (FEC/EFEC) applications and 10GbE systems.

Manufactured using a SiGe BiCMOS process for optimal power/performance ratio, the Intel LXT16727 serializer chip

helps ensure stable and reliable operation in Telco-class networking equipment.

The Intel LXT16727 transmitter includes a 16:1 MUX and Phase Locked Loop (PLL) circuits. In order to ensure critical

timing between clock and data signals going from the framer to the MUX, a 9-bit FIFO has been integrated as support for

Dynamic Phase Alignment (DPA). Furthermore, the device has three reference clock inputs to ﬁt a wide range of applications

(SONET, GbE and OTN) as well as a third integrated PLL for jitter clean-up. The device exceeds the ITU-T and Telcordia

jitter requirements. The LXT16727 is operated from a single 3.3V power supply and has a power dissipation of 1.1W. It is

packaged in a 13x13 mm or 10x10 mm 132-ball PBGA.

10Gbps Receivers

GD16584 10Gbps Clock and Data Recovery (CDR) device with 1:16 Demultiplexer (DeMUX)

GD16588 10.66Gbps Clock and Data Recovery (CDR) device with 1:16 Demultiplexer (DeMUX)

Intel’s highly integrated 10Gbps and 10.66Gbps receivers for use in STM 64, OC-192 and out-of-band Forward Error

Correction (FEC) applications all feature a fully integrated Phase Locked Loop (PLL)-based Clock and Data Recovery

(CDR) device, along with a 1:16 Demultiplexer (DeMUX). The devices exceed the ITU-T and Telcordia jitter

recommendations. Interconnection to 78Mbps framers can be made with the digital support circuits.

LXT16706 9.95–10.71Gbps Low-Power 1:16 Demultiplexer (DeMUX)

The Intel®LXT16706 is a highly integrated, high-performance and low-power deserializer for SDH STM 64, SONET

OC-192, Optical Transport Networking (OTN), Forward Error Correction (FEC/EFEC) applications and 10GbE systems.

Manufactured using a SiGe BiCMOS process for an optimal power/performance ratio, the Intel LXT16706 deserializer

chip helps ensure stable and reliable operation in Telco-class networking equipment.

The Intel LXT16706 is a DeMUX with an integrated Clock and Data Recovery (CDR) device and a high-quality Limiting

Gain Ampliﬁer and is fully compliant with the Optical Interface Forum’s SFI-4 recommendation on common electrical

interface between framers and Serializer/Deserializer (SerDes) for OC-192/STM 64. The LXT16706 is operated from a dual

1.8V/3.3V power supply and has a power dissipation of 0.75W. It is packaged in a 13 x 13 mm 132-ball PBGA.

LXT16713XC 9.95–11.1Gbps Clock and Data Recovery (CDR)

The Intel®LXT16713XC features an integrated Limiting Ampliﬁer (LIA) with state-of-the-art input sensitivity (better than

2x2.5mVpp @ BER 10-10), a Clock and Data Recovery (CDR) unit and a loss of signal/loss of lock circuitry. The device

provides a high-performance protocol-agnostic 10Gbps Clock and Data Recovery and Re-timer solution for use in optical

line cards and XFP MSA modules for SDH STM 64, SONET OC-192, Optical Transport Networking (OTN) systems with

Forward Error Correction (FEC) applications; and submarine systems, 10GbE networks, and 10Gbps Fiber Channel (GFC)

and ﬁber-optic test equipment.

The CDR recovers clock and data, sampling the incoming signal to determine the optimum bit period and coping with

dispersions in the ﬁber that can cause the eye to shrink or deteriorate. The CDR automatically detects the optimum sampling

point. The LXT16713 is operated from a single 3.3V power supply and has a power dissipation of 0.5W. It is manufactured

using BiCMOS technology and packaged in a 5x6 mm 42-ball PBGA.

developer.intel.com/design/network Optical Products

LXT16713A 9.95–11.1Gbps Clock and Data Recovery (CDR)

The Intel®LXT16713A features an integrated Limiting Ampliﬁer (LIA) with state-of-the-art input sensitivity (better than

2x5mVpp @ BER 10-10), a Clock and Data Recovery (CDR) unit and a loss of signal/loss of lock circuitry. The device

can be used in XFP modules as a signal conditioner in both Receive and Transmit paths or as an eye opener in optical line

cards for SDH STM 64, SONET OC-192, Optical Transport Networking (OTN) systems with Forward Error Correction

(FEC) applications; and submarine systems, 10GbE networks, and 10Gbps Fiber Channel (GFC) and ﬁber-optic test equipment.

The LXT16713A is operated from a single 3.3V power supply and has a power dissipation of 0.5W. It is manufactured

using BiCMOS technology and packaged in a 4x4 mm 24-lead QFN.

LXT16723 9.95–11.1Gbps XFP Clock and Data Recovery (CDR)

The Intel®LXT16723 features an integrated Limiting Ampliﬁer (LIA) with state-of-the-art input sensitivity (better than

2x5mVpp @ BER 10-10), a Clock and Data Recovery (CDR) unit and a loss of signal/loss of lock circuitry. The CDR

acts as signal conditioner for either XFP Receive and Transmit paths and conforms to XFI electrical interface as deﬁned in

XFP MSA. The device also supports Rx alarms such as LOS and LOCK, and can be used in combination with a micro

controller for XFP modules. Furthermore the device can be used as an eye opener in optical line cards for SDH STM 64,

SONET OC-192, Optical Transport Networking (OTN) systems with Forward Error Correction (FEC) applications; and

submarine systems, 10GbE networks, and 10Gbps Fiber Channel (GFC) and ﬁber-optic test equipment.

The LXT16723 is operated from a dual 1.8/3.3V power supply and has a power dissipation of 250–350mW. It is

manufactured using BiCMOS technology and packaged in a 4x4 mm 24-lead QFN.

LXT16726 9.95–11.1Gbps Low-Power 1:16 Demultiplexer (DeMUX)

The Intel®LXT16726 is a highly integrated, high-performance and low-power deserializer for SDH STM 64, SONET

OC-192, Optical Transport Networking (OTN), Forward Error Correction (FEC/EFEC) applications and 10GbE systems.

Manufactured using a SiGe BiCMOS process for an optimal power/performance ratio, the Intel LXT16726 deserializer

chip helps ensure stable and reliable operation in Telco-class networking equipment.

The Intel LXT16726 is a DeMUX with an integrated Clock and Data Recovery (CDR) device and a high-quality Limiting

Gain Ampliﬁer and is fully compliant with the Optical Interface Forum’s SFI-4 recommendation on common electrical

interface between framers and Serializer/Deserializer (SerDes) for OC-192/STM 64. The LXT16726 is operated from a dual

1.8V/3.3V power supply and has a power dissipation of 0.75W. It is packaged in a 13x13 mm or 10x10 mm 132-ball PBGA.

10Gbps Transceiver

LXT16715 9.95–11.1Gbps XFP Transceiver

The Intel®LXT16715 features a bidirectional Clock and Data Recovery Device including integrated Limiting Ampliﬁers

(LIA) with state-of-the-art input sensitivity (better than 2x5mVpp @ BER 10-10). The CDRs acts as signal conditioner for

XFP Receive and Transmit paths, supports system and line side loop back and conforms to XFI electrical interface as deﬁned

in XFP MSA. The device also supports Rx/Tx alarms such as LOS and LOCK, and can be used in combination with a micro

controller for XFP modules. Also the device can be used as an eye opener in optical line cards for SDH STM 64, SONET

OC-192, Optical Transport Networking (OTN) systems with Forward Error Correction (FEC) applications; and submarine

systems, 10GbE networks, and 10Gbps Fiber Channel (GFC) and ﬁber-optic test equipment.

The LXT16715 is operated from a dual 1.8/3.3V power supply and has a power dissipation of 500–700mW. It is

manufactured using BiCMOS technology and packaged in a 6x6 mm 49-ball BGA.

Optical Products developer.intel.com/design/network

10Gbps Ampliﬁers

LXT13002 Limiting Ampliﬁer (LIA) with Loss of Signal (LoS)

The Intel®LXT13002 Limiting Ampliﬁer (LIA), has up to 10.7Gbps operation, input sensitivity of less than 5mV

differential, on-chip DC offset compensation, and a single 1.8V power supply. The device can be used in 10Gbps

Ethernet serial LAN, MAN and WAN systems, SONET OC-192, Fibre Channel FC-10, and InﬁniBand 1X. The LXT13002

has a programmable loss of signal indicator. The 1.8V supply voltage allows compatibility with 10GbE XFP and XENPAK

module speciﬁcations, and the low power consumption < 342mW reduces heat generation, enabling implementations within

small form factor modules. The low total Root Mean Square (RMS) jitter, typically < 3ps, results in low system jitter at

10Gbps data rates, and the 0.500mV output voltage swing is able to interface with Current Mode Logic (CML). The

LXT13002 is available in die form and in 24 MLF package.

LXT16865 Transimpedance Ampliﬁer (TIA)

The Intel®LXT16865 is a high gain Transimpedance Ampliﬁer (TIA) providing a differential output swing up to

2x200mVpp and a small signal, single-ended transimpedance gain of 6000Ω. It requires a single power supply of +3.3V

and consumes less than 130mW of power. A high optical sensitivity of -20dBm makes LXT16865 the TIA of choice for

Metro and Long-Haul applications while LXT14012 is suitable for the Metro/Access and Enterprise market segments. It can

support over 2mA input current before overload.

The LXT16865 is tolerant to a photodiode capacitance of 0.2pF, allowing broadband operations with commercial grade

photodiodes. They are designed in proven SiGe process and are available in die.

10Gbps Drivers

LXT17001 Laser Driver

The Intel®LXT17001 is one of three distinct components of the Intel®10Gbps Physical Medium Dependent (PMD)

Chipset. With the expanding demand for data communications, the result is the drive for advancement of high-speed

optical networks. The LXT17001 is a low-cost, high-performance laser diode driver IC intended for ﬁber-optic transmitters

operating up to 10.7Gbps. Use of CMOS technology offers an economic solution with considerable power savings compared

to traditional 5V bipolar or GaAs parts. The low power consumption reduces heat generation, enabling implementations

within small form factor modules, and the low signal overshoot and undershoot <10 percent, creates low jitter and open eye

patterns at 10Gbps data rates. The current drive capability is 25mA modulation current into a 50Ωload and is sufﬁcient for

biasing and driving most commercial grade Vertical Cavity Surface Emitting Laser (VCSELs). The supply voltages are

compatible with preliminary 10GbE XFP and XENPAK module speciﬁcations. The LXT17001 is available in die form

and 24 MLF package.

LXT17011 Laser Driver

The Intel®LXT17011 is a low-cost, high-performance laser diode driver IC intended for ﬁber-optic transmitters operating

over 10 Gbps. Similar in performance to the LXT17001 except that the output of the Intel LXT17011 is an unterminated

open drain, allowing the part to drive low impedance lasers with modulation currents up to 50mA. Use of CMOS technology

offers an economic solution with considerable power savings compared to traditional 5V bipolar or GaAs parts. The

LXT17011 is available in die.

developer.intel.com/design/network Optical Products

LXT17031 10Gbps Electro-Absorption Modulator (EAM Driver)

The LXT17031 is an Electro-Absorption Modulator (EAM) driver that provides an adjustable swing up to 2.5Vpp into a

50Ωimpedance load for data rates up to 10.7Gbps. The LXT17031 requires a single power supply (-5.2V) and features

a very low power dissipation rate (0.8W). The LXT17031 EAM driver incorporates a three-stage ampliﬁer: the input

ampliﬁer is designed for a wide-dynamic range input signal and provides a duty-cycle control function; the second ampliﬁer

prepares the data signal for the output stage; and the output stage enables a DC connection to the modulator and provides

high-drive capability and output-voltage swing control. The LXT17031 is used in telecommunication transmission systems,

DWDM applications, 10.7Gbps Forward Error Correction and Optical Transport Network transmission and metro and long-

haul transmitters. The LXT17031 is available in die and QFN32 package.

10Gbps Optical Transceivers

TXN132201/5/7 Small Form Factor 10Gbps Optical Transceivers

The Intel®TXN132201/5/7 Small Form Factor 10Gbps Optical Transceivers are designed to provide an interface between

the photonic physical layer and the electrical layer in 10Gbps network applications. The TXN13320 transceiver family

provides an optical transmitter and receiver pair integrated with an electrical Multiplexer (MUX) and Demultiplexer

(DeMUX). The module multiplexes/demultiplexes 16 channels from a differential Low-Voltage Differential Signal (LVDS)

parallel data bus into a serial optical signal running at line rates from 9.953 to 10.709Gbps. An integrated micro-controller

provides robust control and monitoring of the module through an I2C interface on the 300-pin Berg* MEG-Array connector.

The transmitter contains a cooled 1310nm Distributed Feedback (DFB) laser or a cooled 1550nm Electro-absorption

Modulated Laser (EML) with integrated laser-driver, launched into a single-mode optical ﬁber pigtail. The receiver includes

a PIN photodiode and transimpedance ampliﬁer, which operate over both the 1.3µm and 1.5µm bands.

The TXN13220 transceiver family can be conﬁgured to supply a single- or dual-rate SONET/SDH, SONET+ Forward

Error Correction (FEC) or 10Gb Ethernet interface, with optional clock jitter ﬁltering. The module satisﬁes link distances

from 0 to 40km with future variants extending to 80km in reach. The transceiver is assembled in a Multi-Source Agreement

(MSA)-compatible package that is a maximum size of 3.0" Lx2.2" Wx0.63" H.

The Intel TXN13220 family of transceivers is designed to be compliant with Telcordia GR-253 requirements for OC-192

SONET interfaces and draft 5.0 of IEEE 802.3ae, 10GBASE-L and 10GBASE-E 10Gb Ethernet speciﬁcations. The

TXN13220 family is also fully compliant to the 300-pin MSA for 10 Gigabit transponders and I2C reference document for

300-pin MSA transponders.

TXN13600 10Gbps C-Band Tunable Optical Transceiver for DWDM Networks

The Intel®TXN13600 Tunable Optical Transceiver is a full C-band tunable10Gbps transceiver for DWDM network

applications. By allowing customers to tune the transceiver to any one of the ITU grid channels, the Intel TXN13600

transceiver makes it possible to cover the 80-channel C-band with a single transceiver, eliminating the requirement to carry

80 different transceivers for each of the required wavelengths.

The Intel TXN13600 Tunable Optical Transceiver provides a compliant interface between the photonic physical layer and

the electrical section layer. The module includes an optical transmitter and receiver pair integrated with electrical MUX/

DeMUX functions. When matched with Intel’s other transceiver, Framer and FEC products, Intel provides the complete

solution for many line card designs.

Designed to meet the link budget and distance requirements of metro and long-haul networks, the highly integrated Intel

TXN13600 module includes a Lithium Niobate Mach-Zehnder modulator, microcontroller, MUX (9bit FIFO)/DeMUX,

Clock and Data Recovery (CDR) unit, jitter ﬁlter, APD and PIN receiver options, and a temperature-tuned external cavity

laser into a 4.1" Lx3.5" Wx0.53" H form factor device with only 11W of maximum power dissipation. Additional product

features include SBS suppression (“dithering”), multi-rate capability (SONET/SDH, Ethernet, and Forward Error

Correction), zero chirped (+/-1200ps/nm dispersion) and negative chirped (+1600ps/nm dispersion) modulator options,

and a transmit output power of up to +5.5dBm.

Optical Products developer.intel.com/design/network

TXN17201/9 10Gbps Optical Transceiver, compliant with XPAK MSA

The Intel®TXN17201/9 10Gbps optical transceiver is XPAK PCI form factor compatible, hot-pluggable module designed

for use in data-center applications in Local Area and Storage Area Networks.

The device is a 10GBASE-SR multi-mode transceiver operating at 10.3Gbps for Ethernet applications, and includes

Physical Coding Sublayer (PCS), Physical Medium Attachment (PMA), and Physical Medium Dependent (PMD) functions.

The transmitter section decodes four 8B/10B-encoded channels at 3.125Mbps from an XAUI parallel data bus, performs

64B/66B scrambling, and multiplexes the result into a 10.3Gbps Ethernet rate optical signal.

The receiver section demultiplexes a single 10 Gbps optical signal and converts it to four channels of XAUI. The receiver

includes a photodiode, transimpedance ampliﬁer, clock recovery decision circuit and demultiplexer, and operates over the

850nm band.

The TXN17201 transceiver is assembled in an XPAK Multi-Source Agreement (MSA)-compatible 2.74" Lx1.557"

Wx0.465" H module. The heat sink is designed for 45°C ambient temperature with 100 linear feet per minute airﬂow. The

electrical interface is through an XPAK MSA-compliant 70-pin board edge connector, with optical connections made using

standard LC optical connectors. The transceiver is intended for link spans up to 300 m, and uses an 850 nm Vertical Cavity

Surface Emitting Laser (VCSEL). An IEEE802.3ae and XPAK MSA-compliant Management Data Interface (MDIO) are

also included.

The Intel®TXN17209 10Gbps XPAK optical transceiver operating at 10.5Gbps for Fibre Channel applications is also

available.

TXN174XX 10Gbps Optical Transceiver, compliant with XENPAK MSA

The Intel®TXN174XX 10Gbps Optical Transceiver is XENPAK compliant and designed to provide a IEEE802.3ae

10.3Gbps interface between the photonic physical layer and the electrical section layer. The module comprises an optical

transmitter and receiver pair integrated with XAUI to Serial conversion. PCS, PMA and PMD functions are included. The

transmitter section decodes four 8B/10B encoded channels at 3.125Mbps from a XAUI parallel data bus, performs 64B/66B

scrambling and multiplexes the result into a 10.3125Gbps optical signal launched into a single-mode optical ﬁber pigtail.

The receiver section demultiplexes a single 10.3125Gbps optical signal and performs opposite decoding before it converts

back to 4 channels of 3.125Mbps XAUI. The receiver includes a photodiode, Transimpedance Ampliﬁer (TIA), Clock and

Data Recovery (CDR) device, decision circuit, and DeMUX. An IEEE802.3ae and XENPAK MSA-compliant Management

Data Interface (MDIO) is included.

The optical transceiver is assembled in a Multi-Source Agreement (MSA)-compatible 4.5" Lx1.4" Wx0.7" H package. The

heat sinking was designed for 55°C ambient temperature/200 linear feet per minute airﬂow. Alternative heat sinking options

are also available. The XAUI interface connection is made using a XENPAK MSA-compliant 70-pin board edge connector.

Optical connections are made with standard SC-UPC optical connectors.

The 10GBASE-SR transceiver is intended for link spans up to 300m, and uses a 850nm vertical cavity surface emitting

laser (VCSEL) source.

The 10GBASE-LR transceiver is intended for link spans up to 10km, and uses a 1.3µm distributed feedback (DFB) laser

source. The 10GBASE-ER transceiver is intended for link spans up to 40km, and uses a 1.5µm externally modulated (EML)

laser source.

TXN17431 CX4 Electrical Transceiver, compliant with XENPAK MSA

The Intel®TXN17431 CX4 Electrical Transceiver is a XENPAK compliant form factor module designed for link distances

of 15m over 24 American Wire Guide (AWG) InﬁniBand* cable. It complies with the latest IEEE CX4 speciﬁcation, as

drafted in 802.3ak_D5. Intel TXN17431 has an adjustable transmit de-emphasis that enables a transmit function that ﬁts

within the template deﬁned in 802.3ak. In addition, the built-in receive equalization provides a robust link for 15 m. In case of

proprietary links, an additional transmit pre-emphasis can be chosen in order to either drive longer distances of 24 AWG

cable or utilize an inferior but more ﬂexible 28 AWG cable.

developer.intel.com/design/network Optical Products

Intel TXN17431 interfaces with standard InﬁniBand cables using a 4X (8-signal pair) electrical connector. The connector is

a shielded structure for low cross-talk. This electrical mating interface is compliant to the standards—InﬁniBand, 10GFC,

Serial ATA 2, and SAS. With the XENPAK-compliant 70-pin connector, the Intel TXN17431 can be readily plugged into the

existing optical slots in a line card application with no further changes required to the existing system board designs. This

ready-to-use function provides a way to quickly evaluate the CX4 modules in a real system environment.

TXN18107 10Gbps Optical Transceiver, compliant with XFP MSA

The Intel®TXN18107 10Gbps Optical Transceiver is XFP compliant and provides an interface between the photonic

physical layer and the electrical section layer in high-density data-center applications, local area networks (LANs) and

storage area networks (SANs). This small form factor, hot-pluggable transceiver provides excellent optical performance in the

challenging thermal environment of multi-port switch line cards and other high port-density applications including server

network interface cards, storage host bus adapters, LAN switches, SAN switches and storage array interfaces.

The Intel TXN18107 transceiver will operate at any bit rate from 9.95 to 10.51875Gbps. It is compliant with IEEE 802.3ae

draft 5.0 10GBASE-LR, operating at 10.312Gbps for Ethernet applications and 10GFC draft 3.0 1200-SM-LL-L, operating

at 10.51875Gbps for Fibre Channel applications.

The transceiver includes an optical transmitter and receiver pair integrated with clock and data recovery (CDR) integrated

circuits. The transceiver also includes an XFP MSA-compliant, 2-wire digital management and diagnostic interface.

Assembled in a compact MSA-compliant form factor, the transceiver is 0.722"x0.453"x3.071" and is designed to be

compliant with draft 5.0 of IEEE 802.3ae and 10GFC draft 3.0 speciﬁcations.

TXN3101 4/2/1Gbps Small Form Factor (SFF) Optical Transceivers

The Intel®TXN3101 4/2/1Gbps Small Form Factor (SFF) Optical Transceivers provide high performance integrated

duplex data links for bidirectional communication over multimode optical ﬁber. This module is designed for high-speed

Fibre Channel data links at 4.25Gbps (4X Fibre Channel rate). With the rate select pin, the module is also rate agile and can

work at the 1X and 2X Fibre Channel rates (1.0625Gbps and 2.125Gbps) and the Gigabit Ethernet rate (1.25Gbps).

The Intel TXN3101 optical transceiver is provided with a LC receptacle compatible with the industry standard LC optical

connector. The SFF 850nm transceivers use a single 3.3V supply and are assembled in a compact MSA-compliant form

factor package, 0.53"x0.386"x1.92". This optoelectronic transceiver module is a class 1 laser product compliant with FDA

Radiation Performance Standards, 21 CFR Subchapter J. This component is also class 1 laser compliant according to

International Safety Standard IEC-825-1.

TXN3111 4/2/1Gbps Small Form Factor Pluggable (SFP) Optical Transceivers

The Intel®TXN3111 4/2/1Gbps Small Form Factor Pluggable (SFP) Optical Transceivers provide high performance

integrated duplex data links for bi-directional communication over multimode optical ﬁber. This module is designed for

high-speed Fibre Channel data links at 4.25Gbps (4X Fibre Channel rate). With the rate select pin, the module is also rate

agile and can work at the 1X and 2X Fibre Channel rates (1.0625Gbps and 2.125Gbps) and the Gigabit Ethernet rate

(1.25Gbps).

The TXN3111 optical transceiver is provided with a LC receptacle compatible with the industry standard LC optical

connector. The SFF 850nm transceivers use a single 3.3V supply and are assembled in a compact MSA-compliant form

factor package, 0.58"x0.445"x2.22". This optoelectronic transceiver module is a class 1 laser product compliant with FDA

Radiation Performance Standards, 21 CFR Subchapter J. This component is also class 1 laser compliant according to

International Safety Standard IEC-825-1.

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TTX11500 Full C-Band Tunable Laser

The Intel®TTX11500 Full C-Band Tunable Laser is the ideal solution for DWDM optical transceivers and DWDM

discrete linecard designs. Full C-band tunable lasers alleviate inventory and sparing costs in high channel-count DWDM

systems by allowing a single device to replace multiple single-channel lasers tuned to individual wavelengths on the ITU

grid. Full C-band tunable lasers also enable new system functionality such as hot backup and dynamic provisioning in

addition to next-generation applications of optical regeneration and wavelength conversion.

The Intel®C-band tunable laser design consists of a cooled external cavity diode laser (ECDL) within a 30-pin butterﬂy

package. The ECDL uses an etalon-based, thermally actuated, widely tunable ﬁlter to achieve single mode operation at

selectable wavelengths. The tunable laser contains no moving parts and shares many design elements of standard distributed

feedback lasers (DFBs).

The laser has excellent optical performance, including low RIN, high SMSR, narrow line width and superior wavelength

accuracy over operating conditions and lifetime allowing the product to meet all the stringent requirements of today’s

high-channel-count long-haul and metro DWDM systems.

The Intel TTX11500 is designed to be implemented in modules and line card solutions with the Intel TTX11500

electronics reference design. This allows full control and monitoring of the laser via a LVTTL RS-232 serial interface

including the ability to tune to any channel within the C-band (off-grid tuning optional). The laser reference design also

accommodates features such as frequency dithering for SBS suppression and TxTRACE tone signaling, as implemented in

the Intel TXN11500 electronics reference design.

2.5Gbps Framer/Digital Wrapper/Bandwidth Management

IXF6048 Cell Packet Framer

The Intel®IXF6048 and IXF6012 multi-speed SONET/SDH cell packet framers are distinguished by a unique architecture

that enables OEMs to design high-performance IP/ATM transport equipment. The IXF6048 and IXF6012 can store

entire packets of different lengths, ATM cells or a combination of IP packets and ATM cells on the same payload, while

enabling optimal equipment processing. This capability is the result of a large on-chip FIFO (up to 16Kbytes), and allows

carriers to provide a much greater level of Quality of Service (QoS).

The IXF6048 supports various channel types such as one OC-48, or four OC-12s and the IXF6012 supports various

channel types such as one OC-12 or four OC-3s. The IXF6012 is pin-to-pin compatible with the IXF6048, enabling OEMs

to build highly ﬂexible equipment that can be easily upgraded as the network grows. This ﬂexibility also helps extend the life

and versatility of equipment, and helps reduce replacement costs. Intel’s software support, including device drivers and a

Graphical User Interface (GUI), enables OEMs to quickly implement both the IXF6048 and IXF6012. In addition, equipment

becomes easily adaptable for different speeds via software that changes the conﬁguration. With an extremely conﬁgurable

design that carries both ATM and IP, the IXF6048 and IXF6012 cell/packet framers simplify and accelerate the transporting

of data through today’s multi-protocol network, and help speed time-to-market.

IXF30025 Digital Wrapper 2.5Gbps Optical Transport Network (OTN)

The Intel®IXF30025 is a fully compliant G.709 digital wrapper device that covers most Optical Transport Network (OTN)

applications on a single chip. The device is targeted for 2.5Gbps OTN applications. Based on the digital signal wrapping

technique deﬁned by ITU-T G.709, the IXF30025 provides all functions required for a 2.5Gbps OTN system, including

transmission protection based on Forward Error Correction (FEC). With integrated FEC error statistics and overhead

processing facilities, the Intel IXF30025 is a key component in wrapper-based transparent operation, administration,

maintenance and provisioning of optical networks.

The Intel IXF30025 is built on technology developed for the Intel®IXF30005 Digital Wrapper for 10Gbps. Acting as a

direct pin- and software-compatible drop-in replacement for the Intel®IXF30001 the Intel IXF30025 supports G.975 framing,

as well as ITU-T G.709 OTU-1 framing. The IXF30025 may be operated as a gateway between existing IXF30001-based

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systems and ITU-T G.709-compliant equipment. With its power consumption of 2W the IXF30025 has excellent power to

performance ratio, and small space requirements. The device opens the door to digital wrapper OTN applications. Integrated

error statistics circuitry and serial Optical Overhead Channels (OCOH) allow complete remote management of an optical

network. The devices can be controlled via an 8-bit processor interface allowing a highly event driven communication for

reducing processor load.

IXF25300 2.5G SONET/SDH Framer with STS-1 and VT/TU Pointer Processor and AU/TU Cross Connect,

Stackable to 10Gbps

The Intel®IXF25300 2.5G SONET/SDH Framer with STS-1 and VT/TU Pointer Processor and AU/TU Cross Connect,

Stackable to 10Gbps provides a complete high and low order bandwidth management solution in Metro and Access

networks for Multi-Service Provisioning Platforms (MSPPs), Add/Drop Multiplexers (ADMs), Edge Boxes, Core Switches,

and Cross Connects using modular stackable fabric that allows multiple product platforms, sizes, and architectures within a

single chip. The Intel IXF25300 is compliant with Bellcore GR-253, ANSI T1.105, ETSI ETS 300 417, ITU-T G.707, G.783,

G.784, G.806 and G.826 requirements.

The Intel IXF25300 supports up to STM-16/OC-48 worth of bandwidth with any valid combination of STM-16/OC-48,

STM-4/OC-12 and STM-1/OC-3 interfaces. The device integrates all common ADM functions into a single chip to allow

single card ADM/MSPP development with linear scalability from 2.5Gbps to 10Gbps. It combines framing, high order and

low order processing into the same package. It also contains a single stage non-blocking AU/TU cross connect and provides

separate controls for AU and TU switch conﬁgurations. The Intel IXF25300 supports SD/SF on VC-4 to VT-1.5 VC-12 to

allow for faster UPSR/SNCP ring closure. Low power dissipation of 7W and a compact 31mmx31mm package enable

ﬂexible design and improved time-to-market.

2.5Gbps Multi-rate Serializer/Deserializer (SerDes) Chipsets

GD16556 Multi-rate Clock and Data Recovery (CDR) device with 1:16 Demultiplexer (DeMUX) and Digital Wrapping

GD16557 Multi-rate 16:1 Multiplexer (MUX) with Digital Wrapping

LXT16596 Multi-rate Clock and Data Recovery (CDR) device with 1:4 Demultiplexer (DeMUX) and Digital Wrapping

LXT16597 Multi-rate 4:1 Multiplexer (MUX) with Digital Wrapping

The Intel®LXT16596/LXT16597 and GD16556/GD16557 are high-performance multi-rate transponder chipsets designed

for interconnecting a 2.5Gbps line interface to a custom CMOS ASIC or FPGA. The fully integrated on-chip Phase

Locked Loops (PLLs) on LXT16597 eliminate critical clock/data timing relations and feature the unique dynamic phase-

alignment between ASIC and Multiplexer (MUX). The chipsets are compatible with multiple line rates up to OC-48/STM 16.

Switching between the bit rates is possible on the ﬂy through select pins. The receivers have an input Limiting Ampliﬁer

(LIA), Clock and Data Recovery (CDR) device, Loss of Signal (LOS), and DeMUX and support digital wrapping. The

transmitters are equipped with a MUX and jitter attenuator. All devices support up to 7 percent increased line rate. They

comprise integrated programmable clock dividers for digital wrapping for Forward Error Correction (FEC) applications.

Fractions available are 32/31, 16/15, and 15/14.

2.5Gbps Transmitters

GD16553 4:1 Multiplexer (MUX) with Bypass Capability and Laser Driver

The Intel®GD16553 is a high-performance 2.5Gbps 4:1 Multiplexer (MUX) with on-chip Phase Locked Loop (PLL) and

high current laser driver designed for use in SDH STM 16 or SONET OC-48 ﬁber-optic communication systems. The

optional bypass capability allows direct 2.5Gbps input to the laser driver. The on-chip PLL synthesizer ensures the 2.5GHz

clock for retiming of the high-speed serial output. The PLL is locked to the external reference clock. The on-chip LC type

VCO ensures low jitter generation of less than 5 mUIRMS. For 78Mbps interface, see our digital support circuits. The

GD16553 has a 4-bit ECL system interface and a supply voltage of –5.2V.

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LXT16653 4:1 Multiplexer (MUX)

The Intel®LXT16653 is a high-performance monolithic integrated Multiplexer (MUX) and clock generator device

applicable for optical communication systems including SONET OC-48 and OC-12. It uses an external reference clock

for accurate clock generation. The Phase Locked Loop (PLL) ﬁlter is external for ﬂexible design, giving an excellent low

jitter clock source. The device features VCO, PLL, Clock Divider, MUX, and Phase Nulling Clocking Scheme.

GD16523 Multi-rate 16:1 Multiplexer (MUX)

The Intel®GD16523 are high-performance 2.5Gbps 16:1 multiplexers with on-chip VCO and Phase Locked Loop (PLL)

system, designed for SDH STM 16 and SONET OC-48 transmission systems. The GD16523 is a low-power multi-rate

transmitter with double PLL featuring forward clocking, FIFO and loopback functionality. The GD16523 can also be

conﬁgured for dynamic phase alignment. All the transmitters are manufactured in a Silicon Bipolar process and exceed the

ITU-T and Telcordia jitter recommendations.

2.5Gbps Receivers

GD16543 Clock and Data Recovery (CDR) device with 1:4 Demultiplexer (DeMUX)

The Intel®GD16543 receiver features a 1:4 Demultiplexer (DeMUX) with input Limiting Ampliﬁer (LIA) and Clock Data

and Recovery (CDR). It is designed for SDH STM 16 and SONET OC-48 transmission systems. The 622MHz output

clock is maintained within 500ppm tolerance even in absence of data. The device meets the ITU-T and Telcordia jitter

recommendations. For 78Mbps interface, see our digital support circuits.

LXT16642 Clock and Data Recovery (CDR) device with 1:4 Demultiplexer (DeMUX)

The Intel®LXT16642 is a high-performance monolithic integrated Clock and Data Recovery (CDR) device with onboard

1:4 4 Demultiplexer (DeMUX), applicable for optical communication systems including SONET OC-48 and OC-12.

It uses an external reference clock for fast acquisition. The Phase Locked Loop (PLL) ﬁlter is external for ﬂexible design,

giving an excellent low jitter clock source. The low power, small physical form factor and the high integration, makes the

device ideal for module, Dense Wavelength Division Multiplexing (DWDM) and backplane applications, as well as solutions

with aggregation points for OC-48 (quad) to OC-192.

GD16524 Multi-rate Clock and Data Recovery (CDR) device with 1:16 Demultiplexer (DeMUX) with

Limiting Ampliﬁer (LIA)

The Intel®GD16524 are high-performance 2.5Gbps receiver devices applicable for SDH STM 16 and SONET OC-48

applications. The devices all comprise a Phase Locked Loop (PLL)-based Clock and Data Recovery (CDR) device with

all circuits needed for fast acquisition and lock to the incoming data. The integrated 1:16 Demultiplexer (DeMUX) ensures

a simple and universal interface to the next device. All three devices have a wide tuning range conforming to standard

SONET/SDH speed and Forward Error Correction (FEC) requirements.

GD16524 is a 3.3V multi-rate transmitter designed for standard SONET/SDH rate and Gigabit Ethernet. GD16524 features

high-speed serial loopback input, peak detection for signal level monitoring and AGC control as well as consecutive identical

bit sequence and BER detection. All the devices conform to ITU-T and Telcordia jitter requirements over supply and

temperature ranges.

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GD16522 Multi-rate 1:1 Clock and Data Recovery (CDR) device with Limiting Ampliﬁer (LIA)

and Loss of Signal (LOS)

GD16546B 1:1 Clock and Data Recovery (CDR) device with Limiting Ampliﬁer (LIA)

GD16547 1:1 Clock and Data Recovery (CDR) device with Limiting Ampliﬁer (LIA)

The Intel®GD16522, Intel®GD16546B and Intel®GD16547 are complete 2.5Gbps Clock and Data Recovery (CDR)

receivers with on-chip Limiting Ampliﬁer (LIA). Device speciﬁcations for both jitter transfer, jitter tolerance and jitter

generation exceed the ITU-T and Telcordia recommendations simultaneously over supply and temperature, allowing the

CDR to be used as a regenerator in SONET/SDH systems. All the 1:1 CDRs have a wide tuning range enabling both standard

SONET/SDH speed and Forward Error Correction (FEC) application. The GD16522 is multi-rate STM 1/4/16 and SONET

OC-3/12/48 ideal for high-density applications. It features a consecutive identical bit sequence and BER detection.

2.5Gbps Drivers

GD16578 Laser Modulator Driver with Retiming

The Intel®GD16578 is a 2.5Gbps Retiming Laser Modulator Driver designed to provide a controllable drive current for

optical modulators. Even at the maximum modulation current of 200 mA the device still provides an excellent eye

diagram up to 4Gbps, making it a good price-performance solution for 2.5Gbps transmission. The GD16578 can drive

external loads with a characteristic impedance of 25Ω.

GD16521 Any Rate Laser Driver with Retiming (25Ω)

GD16561 Any Rate Laser Driver with Retiming (50Ω)

GD16571 Any Rate Laser Driver with Retiming (25Ω)

Together with our 16:1 multiplexers, the Retiming Laser Drivers form a low jitter, low-power and cost optimized 2.5Gbps

solution for your SDH or SONET system. The retiming laser drivers have the best eye diagrams in the industry across

the full modulation current range. This allows for a large variety of laser diodes.

GD16573A Any Rate Laser Driver (25Ω)

GD16575A Any Rate Laser Driver (50Ω)

The Intel®GD16573A and Intel®GD16575A Laser Drivers are a cost optimized, low-power solution for your 2.5Gbps

SDH or SONET transmission system. Both are suitable for Electro-Absorption, Direct Modulated and WDM lasers,

the GD16573A being designed to drive a 25W load and the GD16575A a 50W load.

2.5Gbps Ampliﬁers

GD16511 General-Purpose Limiting Ampliﬁer (LIA)

The Intel®GD16511 is a wide bandwidth Limiting Ampliﬁer (LIA) designed for SDH STM 16 and SONET OC-48

optical communication systems as well as instrumentation and datacom applications up to 3.125Gbps. The GD16511 has

been measured together with a 2.5Gbps Clock and Data Recovery (CDR) circuit, and error-free operation has been measured

down to below 3mVpp input signal (10–9 BER). The ampliﬁer accepts input signals to above 1Vpp. The GD16511 has ECL

system interface and a supply voltage of -5V.

622 or Quad 155Mbps Framer

IXF6012 POS/ATM Framer

See IXF6048.

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155Mbps Receivers/Transmitters

GD16591A Multi-rate 8:1/4:1/2:1 Multiplexer (MUX)

GD16592A Multi-rate Clock and Data Recovery (CDR) device with 1:8/1:4/1:2 Demultiplexer (MUX)

The Intel®GD16591A/GD16592A is a low-power transmitter/receiver chipset designed for multi-rate line interfaces such

as STM 4/OC-12, STM 1/OC-3 and PDH E4. The GD16591A comprises an 8:1/4:/2:1 Multiplexer (MUX) and an

optional forward/counter clocking scheme. The GD16592A comprises an input Limiting Ampliﬁer (LIA), Clock and Data

Recovery (CDR) device and 1:8/1:4/1:2 Demultiplexer (DeMUX). Both devices offer loopback for local and remote

loopback test modes. The devices exceed the ITU-T/Belcore jitter recommendations.

GD16360 Dual Transceiver with Cable Equalizer

The Intel®GD16360 is a fully dual transmit/receive IC for E4/STM 1/OC-3 operation designed for low cost and volume

production. It provides conversion between LVPECL signals and the G.703 line interface featuring two channels, each

with a cable equalizer and Loss of Signal (LOS) detection on the receive side and a cable driver on the transmit side.

LXT6155 SDH SONET/ATM Transceiver

The Intel®LXT6155 is a 155Mbps (OC-3/STM 1/STS-3/3c) high-speed, fully integrated transceiver that supports ﬁber

and coax transmission on the same chip. Implemented using Intel’s proven mixed-signal design expertise in 3.3V CMOS

technology, it has a small footprint, enabling consumption of 650mW of power (typical) and allowing the integration of

multiple OC-3s on the same board.

155Mbps Mapper

IXF6151 28 T1/E1 Mapper

The Intel®IXF6151 28 T1/E1 Mapper is a universal voice and data communication solution for high-bandwidth access

that maps both T1 and E1 signals over SONET/SDH networks. The ﬂexible, universal design of the IXF6151 enables

OEMs to build one solution that meets the requirements of both SONET and SDH networks and provides interoperability

between the two infrastructures. The IXF6151 allows T1 signals to be carried in an SDH network, further enhancing

ﬂexibility.

155Mbps Receivers

GD16362A Clock Date and Recovery (CDR) CMI Decoder with Equalizer and LOS

GD16368B CMI Decoder with 1:8/1:4/1:2 Demultiplexer (DeMUX)

The Intel®GD16362A and Intel®GD16368B receivers are Clock and Data Recovery devices with CMI to NRZ decoders

designed for reception of PDH, SDH, and SONET signals at 140 and 155Mbps. The 78/70 or 17/19MHz reference clock

enable programmable selection between PDH (E4) and STM 1/OC-3 board conﬁgurations for maximum ﬂexibility. The

GD16362A additionally features on-chip true LOS detection (G.775) and an equalizer capable of recovering signals after

more than 25dB (78MHz) cable attenuation. Both devices meet G.751, G.823, and G.825 requirements for jitter tolerance

and jitter transfer. The devices are designed for low cost and volume production using BiCMOS technology.

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155Mbps Transmitters

GD16361A CMI Encoder with Cable Driver

GD16367B 8:1/4:1/2:1 Multiplexer (MUX) with CMI Encoder

The Intel®GD16361A and Intel®GD16367B transmitters are retiming CMI encoders designed for cable transmission

of PDH, SDH, and SONET signals at 140 and 155Mbps. Both devices meet ITU-T G.751, G.823, and G.825

recommendations for jitter tolerance and jitter generation and G.703 for 140 and 155Mbps CMI interface (return loss and

transmit power). The devices are designed for low cost and volume production using BiCMOS technology.

Digital Support Circuits

GD16590 General-Purpose Multi-frequency Clock Synthesizer

The Intel®GD16590 is a 3.3V high-speed multi-rate clock synthesizer, with three selectable reference clock inputs and six

output clocks at ﬁxed rates from 38.88 to 1.244MHz, intended for clock distribution in SONET/SDH applications by

using the internal Voltage Control Oscillator (VCO). The device can also be used with an external VCXO. The GD16590

features an integrated Phase Locked Loop (PLL) with on-chip low noise VCO. Selectable subdivided output clocks without

phase skew. It exceeds the ITU-T and Telcordia jitter requirements and is available in a 48-pin TQFP package (7x7 mm).

GD16590 is a general-purpose PLL intended for jitter clean-up, phase compensation and frequency synthesis application in

high-speed digital systems.

LXT16598 Multi-frequency Clock Synthesizer

The Intel®LXT16598 is a 3.3V generic high-speed multi-rate clock synthesizer consisting of a Phase Frequency

Comparator and a wide-tune range Voltage Control Oscillator (VCO). The device supports up to three external

VCSOs/VCXOs (Voltage Control Saw/Crystal Oscillator). The LXT16598 features an integrated Phase Locked Loop (PLL)

with on-chip low noise VCO. Four selectable subdivided output clocks without phase skew at programmable rates from

9.00 to 809MHz, suitable for Forward Error Correction (FEC) operations in 2.5Gbps and 10Gbps applications. It exceeds

the ITU-T and Telcordia jitter requirements and is available in a 48-pin QFN package (7x7 mm). The LXT16598 is a general-

purpose PLL intended for FEC gear-box as a one chip solution for synchronous clocking designs in FEC applications, jitter

clean-up, phase compensation and frequency synthesis application in high-speed digital systems.

GD16333 4:32 Demultiplexer (DeMUX)

GD16334 32:4 Multiplexer (MUX)

Our digital support circuits are cascadable quad multiplexers and demultiplexers designed to interface high-speed primary

Multiplexer/Demultiplexer (MUX/DeMUX) devices at 622Mbps and low-speed CMOS framers at 78Mbps. Each

device contains circuitry for control and synchronization of an array of slave devices. The devices are composed of four

identical MUX/DeMUX blocks with a common clock and synchronization block. Combined with our 10Gbps transmitter

and receiver chipsets, these interface devices provide a simple and complete solution for SDH and SONET system designs.

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OPTICAL PRODUCTS OVERVIEW

SYSTEM PART NUMBER FUNCTION APPLICATION

OC-192/10GbE IXF18101 10Gbps Physical Layer Device for STS-192c/STM 64c POS/GFP Core and Metro Routers, Enterprise Routers and Switches, MSPPs, Storage

and 10GbE LAN and WAN Area Applications, Metro Transport and DWDM

OC-192 IXF18102 10Gbps Physical Layer Device for STS-192c/STM 64c POS/GFP Core and Metro Routers, Enterprise Routers and Switches, MSPPs, Storage

Area Applications, Metro Transport and DWDM

10GbE IXF18103 10Gigabit Ethernet LAN or WAN PHY Core and Metro Routers, Enterprise Routers and Switches, MSPPs, Storage

Area Applications, Metro Transport and DWDM

10GbE IXF18104 10Gigabit Ethernet LAN PHY Core and Metro Routers, Enterprise Routers and Switches, MSPPs, Storage

Area Applications, Metro Transport and DWDM

OC-192 IXF30001 G.975 10.7Gbps Forward Error Correction Device ~6dB gain DWDM equipment, FEC regenerators, long-haul networks, Cross Connects

OC-192 IXF30003 G.975 10.7Gbps Forward Error Correction Device with Performance DWDM equipment, FEC regenerators, long-haul networks, SONET/SDH

Monitoring ~6dB gain performance monitoring

OTN IXF30005 G.709 10.7Gbps Digital Wrapper and Forward Error Correction Device DWDM equipment, OTN Optical Transport Networks, FEC regenerators,

submarine/ULH network SONET/SDH performance monitoring

OTN IXF30007 G.709 10–13Gbps Digital Wrapper with Enhanced FEC DWDM equipment, OTN Optical Transport Networks, FEC regenerators,

up to 9dB net electrical coding gain submarine/ULH network SONET/SDH performance monitoring, ultra long

haul and submarine networks

OTN/10GbE IXF30009 G.709 10.7Gbps Optical Transport Processor and Ultra Forward Error Correction OTN Optical Transport Network, FEC regenerators, SONET/SDH add/drop

10dB net electrical coding gain multiplexers, submarine and ULH FEC applications, metro and core networks,

10GE LAN transport and monitoring, multi-services switches, Cross Connects

OTN IXF30025 G.709 2.66 Gbps Digital Wrapper and Forward Error Correction Device DWDM equipment, OTN Optical Transport Network, IP transport equipment,

gigabit and terabit routers, ATM Switches, Layer 3 switches, multi-services

switches, Cross Connects ~6dB gain

OC-3 to OC-48 IXF25300 SONET/SDH Framer, STS-1, VT/TU Pointer Processing MSPP, ADM, Edge Box, Core Switch, Cross Connects

OC-12/OC-3 WB1400 SONET/SDH Framer ADM, Switches, MSPP, Access Concentrators, STM-1, STM-4

OC-12/OC-3 WB1500 SONET/SDH Framer ADM, Switches, MSPP, Access Concentrators, STM-1, STM-4

OC-12/OC-3 WB1501 SONET/SDH Framer ADM, Switches, MSPP, Access Concentrators, STM-1, STM-4

OC-12/OC-3 WB1510 SONET/SDH Framer w/CDR ADM, Switches, MSPP, Access Concentrators, STM-1, STM-4

OC-48/OC-12 WB4500 SONET/SDH Framer Ethernet over SONET, RPR, ATM, POS, LAPS, TDM

0C-3 to OC-192 IXF193XX Bandwidth aggregation and channelizer, virtual concatenation POS, GFP, X.86, X.85, ATM, LAPS

0C-3 to OC-192 IXF19302 Bandwidth aggregation and channelizer POS, GFP, X.86, X.85, ATM, LAPS

OC-192 LXT12102 XAUI to 10G Serial Transceiver XENPAK/XPAK/X2 MSA, XAUI-to-10G serial line card (XFP)

OC-192 LXT13002 10G L/A W/LOS OC-192, 10G Transceivers, FC-10, 10 Gbps Ethernet Serial LAN, MAN,

WAN Systems

OC-192 LXT16588 10.66Gbps CDR with 1:16 DeMUX STM 64, OC-192 and out-of-band FEC applications

OC-192 LXT16589 10.66Gbps 16:1 MUX with Retiming STM 64, OC-192 and out-of-band FEC applications

OC-192 LXT16706 9.95Gbps–10.7G CDR with 1:16 DeMUX STM 64, OC-192 and out-of-band FEC applications

OC-192 LXT16707 9.95Gbps–10.7G 16:1 MUX with Retiming and 2-bit FIFO STM 64, OC-192 and out-of-band FEC applications

OC-192 LXT16713 9.95Gbps–11.1Gbps Clock and Data Recovery STM 64, OC-192 and out-of-band FEC applications

OC-192 LXT16713A 9.95Gbps–11.1Gbps Clock and Data Recovery STM 64, OC-192 and out-of-band FEC applications

OC-192 LXT16726 9.95Gbps–11.1Gbps CDR with 1:16 DeMUX STM 64, OC-192 and out-of-band FEC applications

OC-192 LXT16727 9.95Gbps–10.7G 16:1 MUX with Retiming and 9-bit FIFO STM 64, OC-192 and out-of-band FEC applications

OC-192 LXT16715 10G XFP Transceiver, CDR OC-192, STM64, OTN, FEC, Submarine Sysems, GFC, ﬁber-optical test

equipment, 10GbE

OC-192 LXT16723 10 Gbps 1:1 CDR OC-192, STM64, OTN, FEC, Submarine Sysems, GFC, ﬁber-optical test

equipment, 10GbE

OC-192 LXT16865 10G High Gain T/A STM64, OC-192, DWDM, FEC, OTN

OC-192 LXT17001 Low Current Laser Driver VSCEL Driver for 10GbE and OC-192

OC-192 LXT17011 High Current Laser Driver Laser Driver for 10GbE and OC-192

OC-192 LXT17031 10Gbps Electro-Absorption Modulator (EAM) Driver STM 64, OC-192, DWDM, FEC, OTN

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OPERATING POWER SUPPLY OPERATING SYSTEM INTERFACE POWER CONSUMPTION PACKAGE

SPEED TEMPERATURES (TCASE)

10/10.3Gbps 1.2/1.8/2.5V; -40°C to +85°C LVDS 5.2W 672 UBGA

3.3V I/O tolerant

10Gbps 1.2/1.8/2.5V; -40°C to +85°C LVDS 4.7W 672 UBGA

3.3V I/O tolerant

10.3Gbps 1.2/1.8/2.5V; -40°C to +85°C LVDS 5.2W 672 UBGA

3.3V I/O tolerant

10.3Gbps 1.2/1.8/2.5V; -40°C to +85°C LVDS 4.7W 672 UBGA

3.3V I/O tolerant

10.7Gbps 1.8V, 2.5V, 3.3V -40°C to +85°C 622, 666 LVDS 3.5W max 576 TBGA

10.7Gbps 1.8V, 2.5V, 3.3V -40°C to +85°C 622, 669 Mbps LVDS 3.1W typical 576 TBGA

up to 12.5 Gbps 1.5V, 2.5V, 3.3V -40°C to +85°C 622, 669 Mbps LVDS 4W 420 TBGA 35x35 mm

up to 12.5 Gbps 1.5V, 2.5V, 3.3V -40°C to +85°C 622, 669 Mbps LVDS TBD 868 TBGA

2.7Gbps 2.5V; 3V I/O tolerant -40°C to +85°C 155, 166 LVDS 2W 576 TBGA

2.5Gbpt to 10Gbps -40°C to +85°C 155 LVDS, 622 LVDS 3.4W

2.5Gbps 1.5V, 2.5V, 3.3V -40°C to +85°C .25µ CMOS 3.4V 648-Pin PBGA

2.5Gbps 1.5V -40°C to +85°C .14µ CMOS 3.5V 850-Pin PBGA

10Gbps, 5Gbps, 2.5Gbps 1150-Pin UBGA

10Gbps 1150-Pin UBGA

10.3Gbps 1.2V Core Supply 0°C to +70°C XAUI 1.9–2.2W 192-pin BGA

10.7Gbps 1.8V/3.3V -40°C to +85°C NA -342mW Die/MLF32

10.7Gbps +3.3V 0°C to +70°C LVDS 3.4W 132-pin BGA

10–10.7Gbps 1.8/3.3V -40°C to +85°C LVDS 0.75W 132-pin BGA

10–10.7Gbps 3.3V -40°C to +85°C LVDS 0.75W 132-pin BGA

10–10.7Gbps 3.3V 0°C to +85°C CML 0.4–0.5W 42-ball PBGA

10–10.7Gbps 3.3V 0°C to +85°C CML 0.4–0.5W 24-pin QFN

10–10.7Gbps 1.8/3.3V -40°C to +85°C LVDS 0.75W 132-pin BGA

10–10.7Gbps 3.3V -40°C to +85°C LVDS 1.1W 132-pin BGA

9.95–11.1Gbps 1.8V/3.3V O°C to +85°C CML 650–700mW 49-ball BGA

9.96–11.1Gbps 1.8V/3.3V O°C to +85°C CML 325-350mW 24-pin QFN

10.7Gbps +3.3V O°C to +85°C Serial -130mW Die

10Gbps -1.8V Core Supply -40°C to +85°C NA 500mW Die

10.7Gbps -5.2V -40°C to +85°C CML 0.8W Die/QFN32

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OPTICAL PRODUCTS OVERVIEW

SYSTEM PART NUMBER FUNCTION APPLICATION

OC-48 GD16511 General-purpose Limiting Ampliﬁer STM 16/OC-48, 4x3.125Gbps for 10Gb Ethernet WDM PHY modules

OC-48 GD16521 Any Rate Laser Driver with Retiming (25Ω) SDH STM 16, SONET OC-48

OC-48 GD16522 Multi-rate 1:1 CDR with Limiting Ampliﬁer and LOS SDH STM 16, SONET OC-48

OC-48 GD16523 Multi-rate 16:1 MUX SDH STM 16, SONET OC-48

OC-48 GD16524 Multi-rate CDR with 1:16 DeMUX with Limiting Ampliﬁer SDH STM 16, SONET OC-48

OC-48 GD16543 CDR with 1:4 DeMUX SDH STM 16, SONET OC-48

OC-48 GD16546B 1:1 CDR with Limiting Ampliﬁer SDH STM 16, SONET OC-48

OC-48 GD16547 1:1 CDR with Limiting Ampliﬁer SDH STM 16, SONET OC-48

OC-12 IXF6012 Multi-speed OC-12, x4 OC-3/1 SONET/SDH ATM/POS Overhead Terminator ATM Switches, Layer 3 switches, multi-services switches, gigabit and terabit

routers, DWDM equipment, IP transport equipment, LAN/WAN interfaces,

DSLAMs, Central Ofﬁce, Cross Connect, Digital Loop Carrier

OC-12 GD16591A Multi-rate 8:1/4:1/2:1 MUX STM 4/OC-12, STM 1/OC-3, PDH E4

OC-12 GD16592A Multi-rate CDR with 1:8/1:4/1:2 DeMUX SDH STM 16, SONET OC-48

OC-3 LXT6155 155Mbps SONET/SDH/ATM Transceiver drives Fiber or Coax Multi-services switches, DSLAMs, Gateways, Central Ofﬁce Switch, Cross

Connects, Digital Loop Carrier, 3G Mobile Switch Centers

OC-3 GD16361A CMI Encoder with Cable Driver PDH, SDH and SONET at 140 and 155Mbps

OC-3 GD16362A CDR CMI Decoder with Equalizer and LOS PDH, SDH and SONET at 140 and 155Mbps

OC-3 GD16367B 8:1/4:1/2:1 MUX with CMI Encoder PDH, SDH and SONET at 140 and 155Mbps

OC-3 GD16368B CMI Decoder with 1:8/1:4/1:2 DeMUX PDH, SDH and SONET at 140 and 155Mbps

OC-3 LXT6151 28T1/21E1 VT/TU SONET/SDH Mapper PDH, SDH and SONET at 140 and 155Mbps

Various GD16333 4:32 DeMUX SONET/SDH

Various GD16334 32:4 MUX SONET/SDH

Various GD16360 Dual Transceiver with cable Equalizer, LOS detection and Cable Driver Multi-services switches, ADMs, Central Ofﬁce Switch, Cross Connects, Digital

Loop Carrier, 3G Mobile Switch Centers

Various GD16590 General-Purpose Multi-frequency Clock Synthesizer E4/STM 1/OC-3

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OPERATING POWER SUPPLY OPERATING SYSTEM INTERFACE POWER CONSUMPTION PACKAGE

SPEED TEMPERATURES (TCASE)

3.5Gbps +3.3V -40°C to +85°C CML 0.13W 32-pin TQFP

2.7GHz +3.3V -40°C to +95°C CML/LVPECL 0.6W+bias+mod 48-pin TQFP

2.7GHz +3.3V -40°C to +85°C 0.6W 48-pin TQFP

2.7GHz +3.3V -40°C to +85°C LVPECL 0.8W 100-pin TQFP

2.7GHz -5.2V 0°C to +85°C LVPECL 1.1W 48-pin TQFP

2.7GHz -5.2V -5°C to +95°C 1.0W 48-pin TQFP

2.7GHz -5.2V -40°C to +85°C Utopia 1,2,3/POS Utopia 1,2,3 0.8W max 600 PBGA

622MHz +3.3V -25°C to +85°C 0.40W 48-pin TQFP

622Mbps, 155Mbps, 3.3V; 5V tolerant I/O -25°C to +85°C 0.45W 48-pin TQFP

55Mbps

622Mbps 3.3V, 5V tolerant I/O 0°C to +75°C 155 Serial PECL or CMI, 760mW typical 64 LQFP

8-bit parallel

155Mbps +3.3V, +5.0V -40°C to +85°C LVPECL 0.5W 28-pin SSOP

155Mbps +3.3V, +5.0V -40°C to +85°C CMOS 0.4W 52-pin PQFP

155Mbps 3.3V 0°C to +75°C CMOS 0.6W 52-pin PQFP

155Mbps +3.3V, +5.0V T1/E1 NRZ serial Data. Telecom 256 PBGA

Bus for STS 3/STM 1 Multiplexing

622MHz 5.0V -5°C to +85°C TTL 1.0W 100-pin QFP

800MHz 0°C to +70°C TTL 1.3W 100-pin QFP

55Mbps 3.3V, 5V tolerant I/O 5°C to +85°C LVPECL 0.50W 48-pin TQFP

1244MHz +3.3V 0°C to +70°C TTL 1.0W 100-pin QFP

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developer.intel.com/design/network Silicon Transmission Products

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INTEL®TELECOM PRODUCTS INTRODUCTION

Intel, the world’s largest chipmaker, is also a leading manufacturer of computer, networking and communications products.

Intel®communications systems products offer developers, service providers, resellers and communications system owners

what they need to succeed in the new world of converged voice and data communications. This includes a broad family of

building blocks, a global network of solutions providers, and comprehensive support and consulting services.

Ranging from silicon to server software, Intel®building blocks meet the converged communications needs of environments

as diverse as enterprise organizations and service providers. These building blocks include voice, fax, conferencing and

speech technologies; telephone and IP network interfaces; PBX integration products; carrier-class, board systems-level

products, platforms, transmission products; and more. Intel®communications building blocks enable new, converged Web

services including Internet voice browsing, Web-enabled contact centers and true uniﬁed messaging.

For more information on these products, visit http://www.intel.com/products/index.

SILICON TRANSMISSION PRODUCTS

T1/E1/J1 Transmission Solutions

T1/E1/J1 technology is the standard in the telecommunications industry, providing the foundation from which DSL, PDH,

SDH, and ATM technologies deliver narrowband and broadband applications using the existing infrastructure. For an

industry facing a wide variety of WAN access choices in the coming years, T1/E1/J1 will remain the transport channel of

choice because of its availability, backward compatibility, and cost-effectiveness. The T1/E1/J1 product group consists of the

following families: (1) Analog Front Ends (AFE), (2) Short Haul T1/E1/J1 Line Interface Units (LIU), (3) Long Haul

T1/E1/J1 Line Interface Units and (4) T1/E1/J1 framers.

Digital Subscriber Line (DSL) Solutions

DSL technologies are transport mechanisms for delivering high-bandwidth digital data services over twisted-pair

copper wires—the cabling now in place between telephone companies’ central ofﬁces and subscribers. HDSL2 is the

latest advancement in symmetric DSL technology delivering 1.544Mbps (DS-1/T1) data rates up to 12,000 feet on a single

twisted pair.

Intel

Telecom Products

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SILICON TRANSMISSION PRODUCT LINE SUMMARY

The following table summarizes the networking product application features. For full information refer to the product datasheets.

APPLICATIONS PART NUMBER FEATURES

Integrated T1/E1/J1 Short Haul Line Interface Units

■ E1 Digital Cross Connects LXT380 ■Octal E1 Short Haul transceiver per ITU G.703 ■Single rail supply

■ SDH E1 Tributary Interfaces voltage of 3.3V with 5V I/O capability ■Hitless Protection Switching

■ Public Switching Trunk Line Interfaces (HPS) for 1 to 1 protection without relays ■Low power consumption

■ Microwave Transmission Systems of <100 mW per channel (typical) ■75Ω/120ΩTX operation without

■ Access Systems component changes ■Driver short circuit current limiter (<50 mA

■ Add Drop Multiplexers (ADM) RMS) ■Transmit return loss exceeds ETSI ETS 300166 ■Selectable

optional transmit pulse shape PLL ■Optional per channel clock

recovery ■Optional HDB3 line encoder/decoder ■On-chip secondary

driver short circuit monitoring circuit ■Provides protected monitoring

points per ITU G.772 ■Analog/digital and remote loopback testing

function ■LOS per ITU G.775 and ETS 300 233 (selectable)

■Optional 8-bit parallel or 4 wire serial control interface ■JTAG

Boundary Scan test port per IEEE 1149.4 ■Small footprint 144-pin

LQFP and 160-pin BGA ■Host mode (parallel or serial) and

Hardware mode

■ SDH E1 tributary interfaces LXT381 ■Single rail 3.3V supply with 5V tolerant inputs ■Hitless Protection

■ Public switching trunk line interfaces Switching (HPS) for 1 to 1 protection without relays ■Low power

■ Digital Access Cross Connects (DAC) consumption of <100 mW per channel (typical) ■75Ω/120ΩTX

■ Channel banks operation without component changes ■Fast output driver tri-

■ Microwave transmission systems statability ■Transmit return loss exceeds ETSI ETS 300166 ■LOS per

ITU G.775 ■JTAG Boundary Scan test port per IEEE 1149.1 ■144-pin

Tools = LXT380, LXT384 Design Assistant LQFP and 160-pin BGA Packages ■Hardware mode only

■ SONET/SDH Tributary Interfaces LXT384 ■Single rail 3.3V supply with 5V tolerant inputs ■Low power

■ Digital Cross Connects consumption of 150 mW per channel (typical) ■Hitless Protection

■ Public/Private Switching Trunk Line Interfaces Switching (HPS) for 1 to 1 protection without relays ■Superior crystal-

■ Microwave Transmission Systems less jitter attenuator ■Meets ETSI CTR12/13, ITU G.736, G.742,

■ T1-T3, E1-E3 MUX G.823 and AT&T Pub 62411 speciﬁcations ■Optimized for

■ Access Systems SONET/SDH applications, meets ITU G.783 mapping jitter

speciﬁcation ■Constant throughput delay jitter attenuator ■HDB3,

B8ZS, or AMI line encoder/decoder ■Provides protected monitoring

points per ITU G.772 ■Analog/digital and remote loopback testing

functions ■LOS per ITU G.775, ETS 300 233 and T1.231 ■8-bit

parallel or 4 wire serial control interface ■Hardware and Software

control modes ■JTAG Boundary Scan test port per IEEE 1149.1

■160-pin PBGA and 144-pin LQFP

LXT386 ■4 Channel Version of LXT384

LXT388 ■2 Channel Version of LXT384 ■Driver Performance Monitor (DPM)

■Tx and Rx Jitter Attenuator ■100-pin LQFP

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APPLICATIONS PART NUMBER FEATURES

Switched 56/DDS

Frame Relay DDS and SW/56 DSUs LXT400 ■Fully integrated all-rate extended range transceiver ■Receive

■ Leased-line DDS equalizer ﬁlter can handle up to 40 dB at rates below 56 Kbps, and

■ Internet Service Provider (ISP) Equipment up to 49 dB at 56 Kbps and 72 Kbps

■ Frame Relay Access Devices (FRAD)

T1/E1/J1 Long Haul Line Interface Units

Access Systems LXT360/LXT361 ■Fully integrated transceivers for Long or Short Haul T1 or E1

■ ISDN Primary Rate Interface (ISDN PRI) interfaces ■Crystal-less digital jitter attenuation: Select either transmit

■ CSU/NTU interface to T1 Service or receive path, no crystal or high-speed external clock required

■ Wireless Base Station interface ■Meet or exceed speciﬁcations in ANSI T1.403 and T1.408; ITU

■ T1 LAN/WAN bridge/routers I.431, G.703, G.736, G.775 and G.823; ETSI300-166 and 300-233;

■ T1 Mux; Channel Banks and AT&T Pub 62411 ■Support 75Ω(E1 coax), 100Ω(T1 twisted-

■ Digital Loop Carrier—Subscriber Carrier pair) and 120Ω(E1 twisted-pair) applications ■Selectable receiver

Systems sensitivity—Fully restores the received signal after transmission

through a cable with attenuation of either 0 to 26 dB, or 0 to 36 dB

@772 kHz and 0 to 43 dB @ 1024 kHz ■Five Pulse Equalization

Settings for T1 Short Haul applications ■Four Line Build-Outs for T1

Long Haul applications from 0 dB to -22.5 dB ■Transmit/receive

performance monitors with Driver Fail Monitor Open and Loss of

Signal outputs ■Selectable unipolar or bipolar data I/O and

B8ZS/HDB3 encoding/decoding ■Line attenuation indication output

in 2.9 dB steps ■QRSS generator/detector for testing or monitoring

■Output short circuit current limit protection ■Local, remote and

analog loopback, plus in-band network loopback generation and

detection ■Multiple-register serial interface for microprocessor control

■Available in 28-pin PLCC, and 44-pin PQFP packages

OC3/STM-1 Line Card

155 Mbps Transceiver LXT6155 ■155Mbps (OC-3/STM 1/STS-3/3c) high-speed, fully integrated

transceiver that supports ﬁber and coax transmission on the same chip.

Implemented using Intel’s proven mixed-signal design expertise in

3.3V CMOS technology, it has a small footprint, enabling consumption

of 650mW of power (typical) and allowing the integration of multiple

OC-3s on the same board.

155Mbps Mapper IXF6151 ■Universal voice and data communication solution for high-bandwidth

access that maps both T1 and E1 signals over SONET/SDH networks.

The ﬂexible, universal design of the IXF6151 enables OEMs to build

one solution that meets the requirements of both SONET and SDH

networks and provides interoperability between the two

infrastructures. The IXF6151 allows T1 signals to be carried in an

SDH network, further enhancing ﬂexibility.

T1/E1/J1 Framers

■Voice and ATM Gateways IXF3204 ■Quad and Octal T1/E1/J1 Framer with Intel®On-Chip Performance

■T1/E1/J1 Access IXF3208 Report Messaging (Intel®PRM). IXF3204/08 has independent channel

■IMAPs control and 24 HDLCs (V5.1 and 5.2, GR-303 support for DLCs).

■Integrated Access Devices (IAD) Extensive BERTs, and counters for Intel PRM. T1/E1/J1 framer with

■Inverse Multiplexing over ATM (IMA) cards Intel PRM and API and GUI speeds design and or saves license

■Wireless Base Stations fees. Single BOM for world markets. Available in 256 PBGA

■Frame Relay Access Devices (17x17 mm).

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T1/E1/J1 TRANSMISSION LINE CARD—SHORT HAUL LINE INTERFACE UNITS

NETWORK LINE POWER JITTER JA µP

DEVICE TYPE PORTS RATE SUPPLY ATTENUATOR ARCHITECTURE HPS JTAG INTERFACE PACKAGE

LXT350 SH LIU 1 T1/E1/J1 5V Tx or Rx Crystal-less Serial 28 PLCC/44 QFP

LXT351 SH LIU 1 T1/E1/J1 5V Tx or Rx Crystal-less Parallel 28 PLCC/44 QFP

LXT380 SH LIU 8 E1 3.3V Yes Yes Serial/Parallel 144 LQFP/160 BGA

LXT381 SH AFE 8 E1 3.3V Yes Yes Serial/Parallel 144 LQFP/160 BGA

LXT384 SH LIU 8 T1/E1/J1 3.3V Tx or Rx Crystal-less Yes Yes Serial/Parallel 144 LQFP/160 BGA

LXT386 SH LIU 4 T1/E1/J1 3.3V Tx or Rx Crystal-less Yes Yes Serial/Parallel 100 LQFP/160 BGA

LXT388 SH LIU 2 T1/E1/J1 3.3V Tx and Rx Crystal-less Yes Yes Serial/Parallel 100 LQFP

T1/E1/J1 TRANSMISSION LINE CARD—LONG HAUL LINE INTERFACE UNITS

NETWORK LINE POWER JITTER JA µP

DEVICE TYPE PORTS RATE SUPPLY ATTENUATOR ARCHITECTURE HPS JTAG INTERFACE PACKAGE

LXT360 LH/SH LIU 1 T1/E1 5V Tx or Rx Crystal-less Serial 28 PLCC/44 QFP

LXT361 LH/SH LIU 1 T1/E1 5V Tx or Rx Crystal-less Parallel 28 PLCC/44 QFP

T1/E1/J1 TRANSMISSION LINE CARD—FRAMERS

NETWORK LINE POWER SPECIAL µP

DEVICE TYPE PORTS RATE SUPPLY FEATURES JTAG INTERFACE PACKAGE

IXF3204 framer 4 T1/E1/J1 3.3V PRM Yes Serial 256 PBGA

IXF3208 framer 8 T1/E1/J1 3.3V nPRM Yes Serial 256 PBGA

OC3/STN-1 LINE CARD

SYSTEM PART NUMBER FUNCTION APPLICATION

OC-3 LXT6155 155Mbps SONET/SDH/ATM Transceiver drives Fiber or Coax Multi-services switches, DSLAMs, Gateways, Central Ofﬁce Switch, Cross

Connects, Digital Loop Carrier, 3G Mobile Switch Centers

OC-3 LXT6151 28T1/21E1 VT/TU SONET/SDH Mapper PDH, SDH and SONET at 140 and 155Mbps

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APPLICATIONS PART NUMBER FEATURES

Digital Subscriber Line Products

HDSL SK70704/SK70706 ■HDSL chipset for 784 Kbps data transmission ■Fully-integrated

■ T1 or E1 (2-pair) and fractional T1 analog core chip ■Integrated activation/start-up ■Optimized for

or E1 transport one-pair operation

■ Digital pair-gain

■ Wireless base stations to switch interfaces

■ Campus and private networking

■ High-speed digital modems

SK70704/SK70707 ■HDSL chipset for 1168 Kbps data transmission ■Fully-integrated

or SK70708 analog core chip ■Integrated activation/start-up ■Optimized for

one-pair operation

Multi-Rate DSL SK70720/SK70721 ■Chipset conﬁgurable to 272, 400, 528, and 784 Kbps data

■ High-speed residential Internet access transmission ■Fully integrated analog core chip ■Supports transparent

■ Extended range fractional T1/E1 transport repeater applications without an external processor or glue-logic

■ 4-, 6-, 8- or 12-channel digital pair-gain ■Supports processor directed rate selection driven by receive signal

■ Wireless base station to switch access level and noise margin ■Continuously adaptive echo canceller and

■ WAN access for LAN routers equalizers perform to changing noise and line characteristics

SK70721/SK70725 ■Fully integrated, 2-chip transceiver ■Supports 272–1,168 Kbps data

or SK70725A transmission ■Integrated line drivers, ﬁlters and analog echo canceller

reduce the number of external components ■Multiple framing modes:

Transparent, T1 standard, E1 standard ■Independent transmit and

receive clocks for minimum delay ■Tolerance for extended signal

interruptions ■Single +5V supply ■Typical power dissipation less than

500 mW ■Supports processor directed rate selection driven by receive

signal level and noise margin ■Continuously adaptive echo canceller

and equalizers maintain excellent transmission performance with

changing noise and line characteristics

LXP730 ■Complements the SK70725/25A/21 ■Synchronization of external

data streams to the DSL ■Multiplexing and demultiplexing of

independent data streams ■Loopback of data at DSL interface in both

directions ■Creation, insertion, and recovery of the MDSL Overhead

(MOH) ■Supports two input/output data streams simultaneously

■Supports systems with point-to-point architectures

HDSL2 SK7074x

■ Single pair T1 transport systems

■ Multichannel digital pair-gain systems

■ WAN access for LAN routers and switches

■ Integrated access devices (IAD)

■ Wireless access systems

SK70740/41/42

SK70740/44

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DIGITAL SUBSCRIBER LINE (DSL) PRODUCTS LINE CARD

HDSL CHIPSET MULTI-RATE DSL (MDSL) CHIPSET HDSL2 CHIPSET

ACC SK70704 SK70704 SK70704 SK70720 SK70725 SK70725A SK70740

HDX SK70706 SK70707 SK70708 SK70721 SK70721 SK70721 SK70741

Framer LXP730 LXP730 SK70742

SK70744

Description T1 HDSL Chipset E1 HDSL Chipset E1 HDSL Chipset Multi-Rate DSL Enhanced Multi-Rate Enhanced Multi-Rate HDSL2 Chipset

DSL Data Pump Chipset DSL Data Pump Chipset DSL Data Pump Chipset

(w/Microinterruption)

Speed (Kbps) 784 Kbps 1168 Kbps 1168 Kbps 272 Kbps–784 Kbps 272 Kbps–1168 Kbps 272 Kbps–1168 Kbps 1552 Kbps

Reference Clock (MHz) 12.544 MHz 18.688 MHz 18.688 MHz Variable Variable Variable 21.5 MHz

Power Supply (Volts) 5V 5V 5V 5V 5V 5V 2.5V, 3.3V, 5V

Power Consumption/port <1.0W <1.2W <1.2W <1.2W <1.2W <1.2W <1.8W

(Watts)

Integrated Line Driver • •••••

Microprocessor Interface • ••••••

Ext. Temp -40°C to +85°C • ••••••

SUPPORTED STANDARDS

ETSI •• • •

ANSI • ••••

ITU • •••••

SUPPORTED LINE CODING

2B1Q • •••••

TCPAM •

APPLICATIONS

T1 (2 Pair) • •••

T1 (1 Pair) •

Fractional T1 ••••

E1 (2 Pair) ••

Fractional E1 ••

N Channel Digital Pair-Gain ••••••

Wireless Base Station • ••••••

to Switch Interface

Campus and Private • ••••••

Networking

High-Speed Digital • ••••••

Modems

WAN Access for LAN • ••••••

Routers and Switches

PACKAGES

ACC 28 PLCC 28 PLCC 28 PLCC 44 PLCC 44 PLCC 44 PLCC 64 QFP

HDX 44 PLCC 68 PLCC 44 PLCC 28 PLCC 28 PLCC 28 PLCC 64 QFP, 100 QFP

Framer 64 LQFP 64 LQFP 64 QFP

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Telecom Boards and Platforms

INTEL®NETSTRUCTURE™COMPUTE BOARDS AND PLATFORMS

developer.intel.com/design/network/products/cbp/index.htm

Intel provides modular building blocks for the telecommunications market segment. Based on industry standards, including

AdvancedTCA* and CompactPCI*, Intel boards and platforms offer carrier-grade, high-density computing solutions

featuring high availability, hot-swappable components and computer telephony capabilities. Components are designed to be

NEBS-3/ETSI-compliant and feature IPMI v1.5-based management.

Intel®NetStructure™solutions empower development of differentiated, reliable, Intelligent Network (IN) services for the

converged IP network. The Intel®embedded processor roadmap is built on performance scalability to ensure an extended

product life cycle, while standards-based hardware and software building blocks support efﬁcient and cost-effective time-to-

market.

Complete Development Solutions

Intel provides technical and sales support for customers designing with Intel®NetStructure boards, platforms, and

components. This support includes value-add operating system support with device drivers for Redundant System Slot

(RSS) applications, system management features and functionality, hot swap, and BIOS innovations.

In addition, when faced with complex design issues in a tight timeframe, look to the Intel®Communications Alliance

members for complete, standards-based development solutions to help you move products to market on YOUR schedule.

Discover ready-to-buy boards and platforms based on embedded Intel®Architecture that can save you development time and

money, allowing you to focus resources on value-add functionality. You’ll realize the beneﬁts of price, ﬂexibility and

scalability for a variety of embedded, communications, and networking applications.

www.intel.com/info/eia

Intel®NetStructure™Boards and Platforms: Designed for AdvancedTCA* Speciﬁcations

Intel is meeting the diverse design challenges of system developers in the areas of availabilty, density, price, performance

and support for service applications with AdvancedTCA-compliant boards and platforms. Based on the PICMG* 3.x

speciﬁcation, this open, board-based, carrier-grade architecture can achieve levels of backplane interconnect bandwidth,

peformance and ﬂexibility not previously possible in standards-based products.

ADVANCEDTCA*-COMPLIANT PROCESSOR BOARDS

PRODUCT NUMBER PRODUCT NAME PROCESSOR SPEED CHIPSET MEMORY CHASSIS COMPATIBILITY ETHERNET SUPPORT

MPCBL0001FO3/FO4 High-Performance Low Voltage Intel®Xeon™2.0 GHz with Intel®E7501 Up to 4 GB DDR 266 MPCHC0001 ATCA 2x 1000/100/10

Single Board Computer processor Fibre Channel chipset ECC SDRAM 14U Chassis to the backplane

MPCBL0001NO3/NO4 High-Performance Low Voltage Intel®Xeon™2.0 GHz without Intel®E7501 Up to 4 GB DDR 266 MPCHC0001 ATCA 2x 1000/100/10

Single Board Computer processor Fibre Channel chipset ECC SDRAM 14U Chassis to the backplane

ADVANCEDTCA*-COMPLIANT PLATFORMS

PRODUCT NUMBER PRODUCT NAME TOTAL SLOTS POWER FANS HEIGHT DEDICATED CHASSIS MANAGEMENT SLOTS

MPCHC0001 14U Shelf 14 200W/slot 6 24.4" (621mm) 2

ADVANCEDTCA*-COMPLIANT PLATFORM COMPONENTS

PRODUCT NUMBER PRODUCT NAME COMPATIBILITY SIZE FEATURES

MPCMM0001 Chassis Management MPCBL0001FO3/FO4 SBC 177mm x 300mm x 4 HP Monitors chassis resources and environmental conditions; provides instrumentation

Module MPCBL0001NO3/NO4 SBC for health metrics and alerting. Deﬁnes interface between platform hardware and

MPCH0001 14U Shelf system software.

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Intel®NetStructure™Boards and Platforms: Designed for CompactPCI* Speciﬁcations

The PICMG 2.16 speciﬁcation-compliant family of products provides OEM equipment designers with CompactPCI

standards-based, building-block solutions for carrier-grade telecom and Internet applications, with support for switched

Ethernet communications across the system backplane. Solutions include hot-swap, high availability and multicomputing

capabilities ranging from low-cost processor boards to fully integrated systems for mission-critical applications. Modular,

scalable, off-the-shelf platforms and components, and support for major operating systems and real-time software, speed

application development. A generous set of onboard embedded features address the system integration and reliability

requirements of OEM system builders. These building blocks are designed to interoperate within the entire Intel®

NetStructure™family of packet switched backplane products, and with third-party building blocks meeting the PICMG 2.16

speciﬁcation.

FEATURES BENEFITS

Standards-based, open architecture • Interoperable between multiple vendors’ systems, giving customers more

ﬂexibility

• Efﬁcient and economical integration to support faster time-to-market

• Custom conﬁgurable

• Allows customers to focus on core competencies

Embedded lifecycle support • Continuous Intel Architecture (IA) roadmap provides future security

High density • Reduces overall cost of equipment space and minimizes system volume

Low power/thermals • Provides superior thermal characteristics

Modular boards are active FRUs to enhance serviceability • Can easily be replaced in the ﬁeld in under ﬁve minutes without

disrupting other system components

RSS capabilities, provided by redundant power supplies, CPUs, • High availability with 99.999 percent uptime

hard drives, etc., support hot-swappable boards

IPMI Management enables full management of all IPMI-based • Allows operators to remotely monitor system health, individual sensor

SBCs and peripherals in a platform data, FRU data, and exert power-up/down control

COMPACTPCI*-COMPLIANT 6U PROCESSOR BOARDS

Intel®NetStructure™MPCBL5525 High Performance Processor Board

Designed for carrier-grade telecom and Internet applications requiring exceptional processing power from a single slot,

this board offers conﬁgurable high availability, I/O expansion, 66 MHz CompactPCI bridging features and utilizes a

split-transaction, deferred reply protocol. The 400 MHz processor side bus uses Source Synchronous Transfer (SST) of

address and data to improve performance by transferring data four times per bus clock (4X data transfer rate, as in AGP 4X).

Intel®NetStructure™ZT 5524 High Performance System Master Processor Board

This high-performance processor board is designed for telecom and Internet applications requiring exceptional computing

bandwidth, speed, and processing power. A 64-bit PCI bridge and high-speed CompactPCI bus drive up-to-seven

peripheral boards at 33 MHz, or four at 66 MHz. The ZT 5524 board supports 2 GB ECC SDRAM, 4 MB onboard ﬂash and

onboard video.

Intel®NetStructure™ZT 5504 System Master Processor Board

This high-value Intel Pentium III processor-based board is designed for telecommunications and Internet applications

requiring completely integrated processing solutions for increased performance and system reliability. It can also operate

in a CompactPCI peripheral slot as a standalone single board computer (SBC). The board features a 100 MHz FSB with 64-

bit/33 MHz CompactPCI bus interface, 512 MB or 1 GB ECC SDRAM, 4 MB onboard Flash and onboard video..

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Intel®NetStructure™ZT 5515 Compute Processor Board

This Intel®Pentium®4 processor-based board inherits the high reliability and robust physical characteristics of

CompactPCI without a CompactPCI bus. Use of Intel's Gigabit ethernet technology for both dataplane and control-plane

communication provides excellent price performance. The board features 1 GB ECC SDRAM, 16 MB onboard Flash, and

onboard video.

COMPACTPCI*-COMPLIANT PROCESSOR BOARDS

PRODUCT PRODUCT COMPACTPCI* CHASSIS EXTENDED OS REFERENCE DESIGN

NUMBER NAME PROCESSOR CHIPSET BUS INTERFACE MEMORY MANAGEMENT COMPATIBILITY SUPPORT AVAILABLE

MPCBL5525 High Performance Intel®Pentium®M Intel®E7501 64-bit, 33 MHz DDR 200 SDRAM IPMI-based BMC ZT 5091, ZT 5088, Windows* XP, Windows* 2000, No

Processor Board processor, 1.6 GHz chipset with ECC ZT 5085, Windows NT* 4.0, Red Hat*

MPCHC5089D Linux* 8.0, VxWorks*,

MontaVista CGL*

ZT 5524 High Performance Single or Dual Intel®ServerWorks* 64-bit, 33/66 MHz 512 MB and 1 GB IPMI-based BMC ZT 5090, ZT 5085, Red Hat Linux, VxWorks, Yes

System Master Pentium®III LE chipset PC133 SDRAM ZT 5088 Windows 2000

Processor Board processors, 933 MHz

ZT 5515 Compute Intel®Pentium®4 Intel®845E No cPCI Bus 256 MB, 512 MB, IPMI-based BMC ZT 5090, ZT 5085, Red Hat Linux, VxWorks, Yes

Processor Board Processor – M, chipset Interface 1 GB and 1 GB+ ZT 5088 Windows* 2000

1.2 GHz ECC DDR SDRAM

ZT 5504 System Master Intel Pentium III Intel®440GX 64-bit/33 MHz 512 MB and 1 GB IPMI-based BMC ZT 5090, ZT 5085, Red Hat Linux, VxWorks, No

Processor Board processor— ECC SDRAM ZT 5088 Windows* 2000

Low Power, 1.0 GHz

(BGA2)

COMPACTPCI*-COMPLIANT PLATFORMS

These telecom building blocks from Intel provide OEM equipment designers with standards-based development solutions

built on the PICMG 2.16 speciﬁcation. In addition to high availability features, Intel®NetStructure™platforms are highly

modular, scalable, and extremely serviceable. Ethernet signals are routed across the midplane without the use of cables,

saving time in set-up, maintenance and repair, and minimizing the thermal challenges of traditional cabling methods. Chassis

management modules enable customers to manage multiple SBCs and conduct chassis diagnostics remotely for enhanced

system reliability. Hot-swappable system components provide built-in redundancy to simplify replacement and minimize

service time. Platforms include AC/DC power and are designed to the NEBS/ETSI and IPMI v1.5 standards.

The Intel®NetStructure™ZT 5085 12U Redundant Host Packet Switched Platform

This platform features a PICMG 2.16-compatible midplane to support redundant-host architecture for I/O-intensive

applications, providing OEM equipment designers with a carrier-grade, standards based, high availability computing

platform. It supports ﬁve-nines (99.999%) availability with built-in redundancy for active system components including

Ethernet switches, chassis management modules, power supplies and fan trays.

Intel®NetStructure™ZT 5088 12U General Purpose Packet Switched Platform

This extremely ﬂexible, high-availability platform is conﬁgurable for both compute-intensive and I/O-intensive

applications, providing OEM equipment designers with carrier-grade, standards-based solutions. This high-capacity

CompactPCI platform features innovative power and cooling. The ZT 5088 supports ﬁve-nines (99.999%) availability with

built-in redundancy for active system components including Ethernet switches, chassis management modules, power supplies

and fan trays.

Intel®NetStructure™ZT 5090 4U General Purpose Packet Switched Platform

This high-density CompactPCI platform features seven node slots and one integrated layer 2/3 Ethernet switch slot,

transversely mounted in a 4U enclosure, making it ideal for carrier-grade telecom and Internet applications. Backplane

interconnect speeds are user-deﬁnable and scalable from 10 Mbps to 2000 Mbps per node slot, allowing customers to start

with a lower-cost, lower-speed set of components and upgrade as needed.

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Intel®NetStructure MPCHC5091 4U General Purpose Packet Switched Platform

This high density CompactPCI platform features seven node slots and one integrated layer 2/3 Ethernet switch slot,

transversely mounted in a 4U enclosure, making it ideal for carrier-grade telecom and Internet applications.

Intel®NetStructure™MPCHC5089DC 12U General Purpose Packet Switched Platform

This extremely ﬂexible platform is well-suited for the exacting requirements of modular communications infrastructure

applications. It is designed for customers who demand high availability and low maintenance, but at the same time want

to maximize processing density while minimizing hardware footprint and cost. It features built-in redundancy for active

system components including Ethernet switches, chassis management modules, power supplies and fan trays.

COMPACTPCI*-COMPLIANT PLATFORMS

PRODUCT SBC SLOTS CHASSIS

NUMBER PRODUCT NAME TOTAL SLOTS (POWER/SLOT) BUS SEGMENTATION H.110 SUPPORT TOTAL POWER MANAGEMENT

ZT 5085 12U Redundant Host Packet 21* 2 (50W) Two 64-bit, 33 MHz PCI segments 12 slots 250W 2 modules included

Switched Platform (8,8) or (16) (N+N, N=4 redundancy)

ZT 5088 12U General Purpose Packet 21* 4 (50W) Four 64-bit/66 MHz PCI segments None 250W 2 modules included

Switched Platform (5,4,5,4) or (9,9) (N+N, N=4 redundancy)

ZT 5090 4U General Purpose Packet 8** 2 (45W) Two 32-bit/33 MHz or Peripheral slots on 250W (N+N, N=2) 1 module included

Switched Platform 64-bit/66 MHz PCI segments (4,3) each segment; 5 total

MPCHC5091 4U General Purpose Packet 8 7 (45W) One 32/64-bit 33 MHz PCI segment One segment, Two 250W power supplies, 1 dedicated chassis

Switched Platform 6 total peripheral slots AC or DC (N+1 support with management slot

optional third power supply) (Optional CMM)

MPCHC5089DC 12U General Purpose Packet 21 6U slots†Up to 50W per No CompactPCI bus None 350W 2 modules included

Switched Platform node slot (N+N, N+4 redundancy)

* Includes two dedicated Ethernet slots

** Includes one dedicated Ethernet slot

† Includes 18 node slots, two fabric slots and two 3U chassis management slots

COMPACTPCI*-COMPLIANT PLATFORM COMPONENTS

PRODUCT NUMBER PRODUCT NAME COMPATIBILITY SIZE FEATURES

ZT 4807 Rear-Panel Transition ZT 5090 platform, 6U x 4HP Routes all cabling out the back of a system; provides access to a secondary IDE channel,

Board ZT 5504 SBC Com1 and 2 serial ports and a ﬂoppy disk drive

ZT 4901 I/O Mezzanine ZT 5524 SBC, 6U x 4HP Provides two PMC sites, a dual optical Fibre Channel interface, and CompactPCI bridging at 33 or 66 MHz

Expansion Card ZT 5090 platform

ZT 6303 250W Hot Swap ZT 5090 platform 3U x 8HP x 160 mm Extra high current density allows unit to deliver up to 40 amperes on either the +5 or +3.3 volt outputs

AC Power Supply at 50°C. This highly dense, hot swap, redundant supply is ideally suited for telecommunications, industrial

automation and a variety of embedded computer applications

ZT 7102 Chassis Management ZT 5090, ZT 5085 and 3U x 4HP Reliable, comprehensive, standards-based management, utilizing the IPMI standard within a unique star

Module ZT 5088 platforms topology to support very high-level management applications

ZT 8101 10/100 Ethernet Switch ZT 5090 platform, 6U x 4HP Easy-to-use browser/Web-based management console; routes and switches at full wire speed utilizing

ZT 5504 SBC non-blocking architecture with sophisticated multicast protocols to limit unnecessary trafﬁc; provides

in-chassis switch fabric to operate in a redundant conﬁguration

ZT 8102 Ethernet Switch ZT 5515 SBC, ZT 5085 6U x 4HP Available in either a basic Layer 3 version (ZT 8102) or enhanced Layer 3 version (ZT 8102HA) with

ZT 8102HA and ZT 5088 platforms high-availability software stack and additional routing capabilities; 16 Gigabit Ethernet ports and Layer 3

routing capabilities; hardware-based wire speed L2 switching and L3 routing

ZT 96080 IDE CompactFlash* ZT 5504, ZT 5515 and N/A Drop-in storage alternative to a 2.5" IDE hard disk drive; allows customer to select preferred amount

Carrier ZT 5524 SBCs of CompactFlash

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121

Telecom Boards

Intel offers a range of media processing b7

The Intel®Dialogic®System Release 5.1.1 Feature Pack 1 for Windows* (SR 5.1.1 FP1), available from Intel, supports

these new telecom products: Intel®Dialogic®DMV160LP Combined Media Board, Intel®Dialogic®CPI/400BRI PCI

Fax Board, and the Intel®Dialogic®DISI16R2 and Intel®Dialogic®DISI24R2 switching boards. SR 5.1.1 FP1 also provides

support for the following board enhancements: Intel®Dialogic®DI0408LSAR2, Intel®Dialogic®DI0408LSAR2EU, and

Intel®Dialogic®DISI32R2 switching boards; Intel®NetStructure™DM/IP IP boards; Intel®NetStructure™DM/V combined

media boards; and all products and features supported in the previous SR 5.1.1 release.

Combined Media Processing Boards

LOW-DENSITY COMBINED MEDIA PRODUCTS

DM3 Voice Processing and Analog Interface

Part of the next-generation of analog PCI boards, the Intel®Dialogic®DMV160LP Combined Media Board is a 16-port,

PCI-based voice processing and analog interface board offering the enhanced capabilities a competitive communications

market segment demands. Ideal for advanced computer telephony (CT)-based communications applications requiring

multimedia resources, this high-performance, scalable board offers a rich set of advanced features and support for digital

signal processing (DSP) technology and signal processing algorithms.

Resource with Analog Interface (JCT Boards)

The Intel®Dialogic®JCT boards are low-density products that provide a robust media feature set including voice

processing, speech recognition, and fax capabilities. These boards with Spring Ware technology are available for the PCI

form factor and are for developers seeking to rapidly build and globally deploy small to midrange enterprise solutions. The

boards can be scaled from one to eight boards in a PC chassis for building systems up to 96 ports and provide a CT Bus

connector, allowing for interoperability with other CT Bus/SCbus-compatible boards. Intel Dialogic JCT boards provide the

ideal platform for today’s uniﬁed messaging, voice mail, IVR, and contact center applications.

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122

Low-Density Analog Product Line Summary

The following table summarizes the low-density analog product features. For additional information, refer to the product datasheet index at

http://www.intel.com/design/network/products/telecom/boards/mediaprocessing.htm.

DM3 VOICE PROCESSING AND ANALOG INTERFACE BOARD

PRODUCT AND APPLICATIONS ITEM MARKET NAME KEY FEATURES

Intel®Dialogic®DMV160LP DMV160LP ■16 channels of voice processing

■Uniﬁed messaging ■16 analog loop start network interfaces

■Voice mail/voice messaging ■DM3 architecture

■IVR ■R4 API for media control

■Contact center ■Supports simultaneous voice, fax, and Intel®Dialogic®Continuous

■Dictation Speech Processing Technology

■Full-size, universal PCI form factor

■Worldwide approvals in progress

■DTMF detection

■Call progress analysis

■Advanced low bit rate coders, including TrueSpeech*

■Up to eight boards per chassis

■Support for Windows NT*, Windows* 2000, and Windows* XP

operating systems

■Four ports onboard DSP-based fax

■H.100 connector (H.100 TDM Bus support)

■CT Bus compatible (with SCbus support)

■Global Call* support

■Transaction record

RESOURCE WITH ANALOG INTERFACE (JCT BOARDS)

PRODUCT AND APPLICATIONS ITEM MARKET NAME KEY FEATURES

Intel®Dialogic®D/41JCT-LS D41JCTLS ■Four channels of enhanced voice (voice and speech recognition)

■Uniﬁed messaging ■Four channels of fax

■Voice/fax mail ■Four channels of analog loop start network interfaces

■Voice portal ■PCI form factor, universal connectivity (support for 3.3V and 5V

■IVR signaling environments)

■Contact center and e-Business ■R4 API for media control

■Dictation ■Up to eight boards per system

■Speech-enabled auto-attendant ■Tone signaling

■Call progress analysis ensures reliability

■A-law or µ-law voice coding at dynamically selectable data rates

■GSM and G.726 coding algorithms for support of Voice Proﬁle for

Internet Mail (VPIM) standard

■Software development kits for Windows NT*, Windows* 2000,

and Linux* operating systems yield faster time-to-market

■Worldwide approvals for cost-effective expansion to serve global

market segments

Intel®Dialogic®VFX/41JCT-LS VFX41JCTLS ■Four channels of enhanced voice (voice and speech recognition)

■Uniﬁed messaging ■Four channels of analog loop start network interfaces

■Voice/fax mail ■Same features and beneﬁts as D/41JCT-LS plus four channels of

■Voice portal enhanced fax capabilities

■IVR ■ITU-T T.4 Group III fax (T.4 and T.30) and ETSI NET/30 for send

■Contact center and e-Business and receive operations

■Fax-on-demand ■V.17 transmission (14.4 Kbps) for sending and receiving faxes

■Software development kits for Windows NT, Windows 2000,

and Linux operating systems yield faster time-to-market

Intel®Dialogic®D/120JCT-LS D120JCTLS ■12 channels of enhanced voice (voice, speech recognition)

■4 channels of fax

■12 channels of analog loop start network interfaces

■PCI form factor, universal connectivity

(support for 3.3V and 5V signaling environments)

■Same features and beneﬁts as D/41JCT-LS

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Voice Boards

VOICE BOARDS

Voice with Analog Interface

Low-density voice resource boards offer from four to 16 resources of voice processing and four to 16 channels of loop-

start network interfaces on a single board. The four-channel products are half-size boards with no SCbus or CT Bus

support and are available for the ISA and PCI form factors. The 16-channel product is an ISA board with SCbus support. All

of these boards with Spring Ware technology are for small to midrange enterprise developers who require high-end features

such as automatic gain control (AGC), caller ID, global dial pulse detection (GDPD), and international approvals. The boards

can be scaled from one to 16 boards in a PC chassis for building systems up to 256 ports (depending on speciﬁc product and

application limitations) and provide the ideal platform for today’s uniﬁed messaging, voice mail, interactive voice response

(IVR), and contact center applications.

Low-Density Single Media Product Line Summary

The following table summarizes the low-density analog product features. For additional information, refer to the product datasheet index at

http://www.intel.com/design/network/products/telecom/boards/mediaprocessing.htm

VOICE AND ANALOG LOOP-START INTERFACE BOARDS

PRODUCT AND APPLICATIONS ITEM MARKET NAME KEY FEATURES

Intel®Dialogic®DIALOG/4 DIALOG4 ■Up to four channels of voice

■Uniﬁed messaging ■Four analog loop start network interfaces

■Voice mail ■Half-size, ISA form factor

■Interactive voice response (IVR) ■R4 API for media control

■Contact center ■Voice coding at dynamically selectable data rates

■DTMF detection and cut-through

■AGC support

■Up to 16 boards per chassis = 64 channels

■Internationally approved

■Software development kits for Windows NT*, Windows* 2000,

and Linux* operating systems yield faster time-to-market

Intel®Dialogic®D/4PCI D4PCI ■Four channels of voice

■Uniﬁed messaging ■Four analog loop start network interfaces

■Voice mail ■Half-size, PCI form factor

■IVR ■R4 API for media control

■Contact center ■Supports caller ID for intelligent call handling

■Supports global dial pulse detection

■Internationally approved

■Tone signaling

■Call progress analysis ensures reliability

■TAPI/WAVE support

■Up to 16 boards per chassis = 64 channels

■Software development kits for Windows NT, Windows 2000,

and Linux operating systems yield faster time-to-market

Intel®Dialogic®D/4PCIU D4PCIU ■Same features and beneﬁts as D/4PCI with universal connectivity

(support for 3.3V and 5V signaling environments) with Intel®

Dialogic®System Release V5.1 SP1 or higher

■G.726 and GSM coders

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VOICE AND ANALOG LOOP-START INTERFACE BOARDS (continued)

PRODUCT AND APPLICATIONS ITEM MARKET NAME KEY FEATURES

Intel®Dialogic®D/4PCIUF D4PCIUF ■Same features and beneﬁts as D/4PCIU AND up to four channels

of basic, DSP-based fax

Intel®Dialogic®D/160SC-LS D160SCLSREV3 ■Up to 16 channels of voice

■Uniﬁed messaging ■16 loop-start telephone line interfaces

■Voice mail ■ISA form factor

■IVR ■R4 API for media control

■Contact center ■Voice coding at dynamically selectable data rates

■DTMF detection and cut-through

■AGC support

■Caller ID capability

■Up to 16 boards per chassis = 256 channels (may be limited by

application)

■Software development kits for Windows NT*, Windows* 2000,

Linux, and MS-DOS operating systems yield faster time-to-market

VOICE WITH DIGITAL PRI INTERFACE

DM/V Voice Series

Intel®NetStructure™DM/V voice boards are media platforms for developers looking to rapidly build and globally deploy

high-density media server solutions for the enterprise and public networks. The boards are available with four digital PRI

interfaces in addition to voice processing in either PCI or CompactPCI* form factors.

High-Density Single Media Product Line Summary

The following table summarizes the high-density single media product features. For more information, refer to the product datasheet index at

http://www.intel.com/design/network/products/telecom/boards/mediaprocessing.htm

DM/V VOICE BOARDS

PRODUCTS AND APPLICATIONS ITEM MARKET NAME KEY FEATURES

Intel®NetStructure™DM/V480-4T1-PCI DMV4804T1PCIU ■48–120 channels of basic voice

Intel®NetStructure™DM/V480-4T1-CPCI DMV4804T1CPCI ■Four digital network interfaces

Intel®NetStructure™DM/V600-4E1-PCI DMV6004E1PCIU ■PCI or CompactPCI* form factor

Intel®NetStructure™DM/V600-4E1-CPCI DMV6004E1CPCI ■H.100 and H.110 compliant

Intel®NetStructure™DM/V960-4T1-PCI DMV9604T1PCIU ■Universal connectivity (support for 3.3V and 5V signaling

Intel®NetStructure™DM/V960-4T1-CPCI DMV9604T1CPCI environments)

Intel®NetStructure™DM/V1200-4E1-PCI DMV12004E1PCIU ■Tone signaling

Intel®NetStructure™DM/V1200-4E1-CPCI DMV12004E1CPCI ■Call progress analysis

■Messaging and enhanced services ■1200+ ports per chassis

■Contact center and e-Business ■Software development kits for Windows NT*, Windows* 2000,

■PC-PBX and Linux* operating systems yield faster time-to-market

■Switching and call completion ■R4 API for media control

■Prepaid/debit card ■Uniﬁed call control access through Global Call* interface provides

■Gateway switch worldwide application portability and shortens development time

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125

HIGH-DENSITY COMBINED MEDIA PRODUCTS

Resource Only (DM/V-B and DM/V-A Multifunction Resource Series)

When combined with a board containing digital network interfaces—such as the Intel®NetStructure™DM/N or DM/T

Digital Telephony Interface Board—Intel®NetStructure™DM/V-B and DM/V-A combined media boards provide a

powerful media platform for developers looking to rapidly build and globally deploy high-density media server solutions for

the enterprise and public network market segments. The DM/V-A boards provide a rich solution with a robust media feature

set and between 120 and 240 channels of media—including voice processing, speech recognition and conferencing, or fax

capabilities—in either universal PCI or CompactPCI form factors. The DM/V-B boards build upon the features of the DM/V-

A boards by adding universal media loads that offer simultaneous voice processing, speech recognition, fax, and

conferencing; improved media densities (120 to 576 channels); and the ability to select three different types of conferencing

media. Currently available in a universal PCI form factor, DM/V-B boards are supported by Intel®Dialogic®System Release

Software 6.0 PCI for Windows* (SR 6.0 PCI for Windows).

Resource Only (JCT Shared Resource Series)

When combined with a board containing digital network interfaces—such as the Intel NetStructure DM/N or DM/T

Digital Telephony Interface Board—the Intel®Dialogic®JCT combined media boards enable media platforms for

developers looking to rapidly build high-density media server solutions for enterprise and service provider networks. The JCT

boards support up to 32 channels of media including voice processing, fax capabilities, or—with SR6.0 PCI for Windows—

speech recognition, in a universal PCI form factor.

Resource with Onboard PRI Interface(s) (DM/V-B and DM/V-A Combined Media Boards)

Intel NetStructure DM/V-B and DM/V-A combined media boards are powerful media platforms for developers looking to

rapidly build and globally deploy high-density media server solutions for the enterprise and public networks. The DM/V-A

boards are available with either two or four digital PRI interfaces in either universal PCI or CompactPCI form factors and

offer a rich solution with a robust media feature set that includes voice processing, speech recognition, and with the dual span

boards, conferencing capabilities. The DM/V-B boards build upon the features of the DM/V-A boards by adding software-

selectable T-1/E-1 interfaces; a universal media load that offers simultaneous voice processing, speech recognition, fax, and

conferencing; improved media densities; the ability to mix select protocols; and the ability to select three different types of

conferencing media. Currently available in a universal PCI form factor, DM/V-B boards are supported by SR6.0 PCI for

Windows.

Resource with Onboard PRI Interface(s) (JCT Single- and Dual-Span Boards)

Intel®Dialogic®JCT single- and dual-span combined media boards enable media platforms for developers looking to

rapidly build high-density media server solutions for enterprise and service provider networks. Available with either one or

two digital PRI interface(s) in a universal PCI form factor, the boards provide a media-rich environment that supports

multiple media such as voice processing and in select instances, speech recognition or fax.

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126

High-Density Combined Media Product Line Summary

The following table summarizes the high-density combined media product features. For additional information, refer to the product datasheet index at

http://www.intel.com/design/network/products/telecom/boards/mediaprocessing.htm.

DM/V-B COMBINED MEDIA BOARDS

PRODUCTS AND APPLICATIONS ITEM MARKET NAME KEY FEATURES

Intel®NetStructure™DMV3600BP DMV3600BP ■360 channels of basic voice, or

(Currently supported only on SR6.0 PCI for Windows) ■160–576 channels of conferencing, or

■Messaging and enhanced services ■120+ channels of simultaneous voice, speech recognition,

■Wireless and ﬁxed-line short message service (SMS) conferencing, and fax (universal media load)

■Color ring-back ■Three different levels and densities of conferencing to choose from

■Voice portal ■Select media loads with enhanced EC (up to 64ms echo tail length)

■Contact center and e-Business ■PCI form factor

■PC-PBX ■H.100 compliant

■Audio conferencing server ■Universal connectivity (support for 3.3V and 5V signaling

■Web conferecing environments)

■Fax server ■Tone signaling

■Fax broadcast ■Call progress analysis

■1200+ ports per chassis

■Software development kits for Windows* 2000, Windows* 2003,

Windows* XP and Linux* operating systems yield faster

time-to-market

■R4 API for media control

DM/V-A COMBINED MEDIA BOARDS

PRODUCTS AND APPLICATIONS ITEM MARKET NAME KEY FEATURES

Intel®NetStructure™DM/V2400A-PCI DMV2400APCIU ■240 channels of basic voice, or

Intel®NetStructure™DM/V2400A-CPCI DMV2400ACPCI ■120-240 channels of conferencing, or

■Messaging and enhanced services ■120 channels of simultaneous voice and speech recognition, and

■Wireless and ﬁxed-line short message 60–120 channels of conferencing, or

service (SMS) ■120 channels of voice and speech recognition and 12–15 channels

■Color ring-back of fax

■Voice portal ■PCI or CompactPCI* form factor

■Contact center and e-Business ■H.100 and H.110 compliant

■PC-PBX ■Universal connectivity (support for 3.3V and 5V signaling

■Audio conferencing server environments)

■Web conferencing ■Tone signaling

■Fax server ■Call progress analysis

■Fax broadcast ■1200+ ports per chassis

■Software development kits that can include Windows NT*,

Windows* 2000, Windows* 2003, Windows* XP and Linux*

(depending on the speciﬁc system release) operating systems

yield faster time-to-market

■R4 API for media control

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127

JCT COMBINED MEDIA BOARDS

PRODUCTS AND APPLICATIONS ITEM MARKET NAME KEY FEATURES

Intel®Dialogic®D/160JCT D160JCT ■16 and 32 channels of voice, speech recognition or fax

Intel®Dialogic®D/320JCT D320JCT (speech recognition currently only on SR6.0 PCI for Windows)

■Messaging and enhanced services ■PCI form factor

■Wireless and ﬁxed-line short message ■H.100 compliant

service (SMS) ■Universal connectivity (support for 3.3V and 5V signaling

■Voice Portal environments)

■Contact center and e-Business ■Tone signaling

■PC-PBX ■Call progress analysis

■Fax server ■Up to six boards per chassis

■Fax broadcast ■Software development kits that can include Windows NT*,

Windows* 2000, Windows* 2003, Windows* XP and Linux*

(depending on the speciﬁc system release) operating systems yield

faster time-to-market

■R4 API for media control

DM/V-B COMBINED MEDIA BOARDS

PRODUCTS AND APPLICATIONS ITEM MARKET NAME KEY FEATURES

Intel®NetStructure™DMV600BTEP DMV600BTEP ■60+ channels of simultaneous voice, speech recognition,

(Currently supported only on SR6.0 PCI for Windows) conferencing, and fax (universal media load)

■Messaging and enhanced services ■Two software-selectable digital network interfaces

■Wireless and ﬁxed-line short message ■Select media loads with enhanced EC (up to 64ms echo tail length)

service (SMS) ■PCI form factor

■Color ring-back ■H.100 compliant

■Voice portal ■Universal connectivity (support for 3.3V and 5V signaling

■Contact center and e-Business l environments)

■PC-PBX ■Tone signaling

■Audio conferencing server ■Call progress analysis

■Web conferencing ■1200+ ports per chassis

■Switching and call completion ■Software development kits for Windows* 2000, Windows* 2003,

■Prepaid/debit card Windows* XP and Linux* operating systems yield faster

■Gateway switch time-to-market

■Fax server ■R4 API for media control

■Fax broadcast ■Uniﬁed call control access through Global Call* interface provides

worldwide application portability and shortens development time

■Ability to mix select protocols for each span

Intel®NetStructure™DMV1200BTEP DMV1200BTEP ■120+ channels of simultaneous voice, speech recognition,

(Currently supported only on SR6.0 PCI for Windows) conferencing, and fax (universal media load)

■Messaging and enhanced services ■Four software-selectable digital network interfaces

■Wireless and ﬁxed-line short message ■Select media loads with enhanced EC (up to 64ms echo tail length)

service (SMS) ■PCI form factor

■Color ring-back ■H.100 compliant

■Voice portal ■Universal connectivity (support for 3.3V and 5V signaling

■Contact center and e-Business environments)

■PC-PBX ■Tone signaling

■Audio conferencing server ■Call progress analysis

■Web conferencing ■1200+ ports per chassis

■Switching and call completion ■Software development kits for Windows 2000, Windows 2003,

■Prepaid/debit card Windows XP and Linux operating systems yield faster

■Gateway swtich time-to-market

■Fax server ■R4 API for media control

■Fax broadcast ■Uniﬁed call control access through Global Call interface provides

worldwide application portability and shortens development time

■Ability to mix select protocols for each span

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DM/V-A COMBINED MEDIA BOARDS

PRODUCTS AND APPLICATIONS ITEM MARKET NAME KEY FEATURES

Intel®NetStructure™DM/V480A-2T1-PCI DMV480A2T1PCI • 48 and 60 channels of simultaneous voice and speech recognition,

Intel®NetStructure™DM/V480A-2T1-CPCI DMV480A2T1CPCI and 60 channels of conferencing

Intel®NetStructure™DM/V600A-2E1-PCI DMV600A2E1PCI • Two digital network interfaces

Intel®NetStructure™DM/V600A-2E1-CPCI DMV600A2E1CPCI • PCI or CompactPCI* form factor

■Messaging and enhanced services ■H.100 and H.110 compliant

■Wireless and ﬁxed-line short message ■Universal connectivity (support for 3.3V and 5V signaling

service (SMS) environments)

■Color ring-back ■Tone signaling

■Voice portal ■Call progress analysis

■Contact center and e-Business ■1200+ ports per chassis

■PC-PBX ■Software development kits that can include Windows NT*,

■Audio conferencing server Windows* 2000, Windows* 2003, Windows* XP and Linux*

■Web conferencing (depending on the speciﬁc system release) operating systems yield

■Switching and call completion faster time-to-market

■Prepaid/debit card ■R4 API for media control

■Gateway switch ■Uniﬁed call control access through Global Call interface provides

worldwide application portability and shortens development time

Intel®NetStructure™DM/V960A-4T1-PCI DMV960A4T1PCI ■96 and 120 channels of voice and speech recognition

Intel®NetStructure™DM/V960A-4T1-CPCI DMV960A4T1CPCI ■Four digital network interfaces

Intel®NetStructure™DM/V1200A-4E1-PCI DMV1200A4E1PCI ■PCI or CompactPCI form factor

Intel®NetStructure™DM/V1200A-4E1-CPCI DMV1200A4E1CPCI ■H.100 and H.110 compliant

■Messaging and enhanced services ■Universal connectivity (support for 3.3V and 5V signaling

■Wireless and ﬁxed-line short message environments)

service (SMS) ■Tone signaling

■Color ring-back ■Call progress analysis

■Voice portal ■1200+ ports per chassis

■Contact center and e-Business ■Software development kits that can include Windows NT,

■PC-PBX Windows 2000, Windows 2003, Windows XP and Linux

■Switching and call completion (depending on the speciﬁc system release) operating systems yield

■Prepaid/debit card faster time-to-market

■Gateway switch ■R4 API for media control

■Uniﬁed call control access through Global Call interface provides

worldwide application portability and shortens development time

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JCT SINGLE- AND DUAL-SPAN BOARDS

PRODUCTS AND APPLICATIONS ITEM MARKET NAME KEY FEATURES

Intel®Dialogic®D/240JCT-T1 D240JCTT1R2U ■24 and 30 channels of voice, speech recognition or fax

Intel®Dialogic®D/480JCT-1T1 D480JCT1T1U ■One digital network interface

Intel®Dialogic®D/300JCT-E1-75 D300JCTE175R2U ■PCI form factor

Intel®Dialogic®D/300JCT-E1-120 D300JCTE1120R2U ■H.100 compliant

Intel®Dialogic®D/600JCT-1E1-75 D600JCT1E175U ■Universal connectivity (support for 3.3V and 5V signaling

Intel®Dialogic®D/600JCT-1E1-120 D600JCT1E1120U environments)

■Messaging and enhanced services ■Tone signaling

■Wireless and ﬁxed-line short message ■Call progress analysis

service (SMS) ■Up to 16 boards per chassis

■Voice portal ■Software development kits that can include Windows NT*,

■Contact center and e-Business Windows* 2000, Windows* 2003, Windows* XP and Linux*

■PC-PBX (depending on the speciﬁc system release) operating systems yield

■Switching and call completion faster time-to-market

■Prepaid/debit card ■R4 API for media control

■Gateway switch ■Uniﬁed call control access through Global Call* interface provides

■Fax server worldwide application portability and shortens development time

■Fax broadcast

Intel®Dialogic®D/480JCT-2T1 D480JCT2T1R2U ■48 and 60 channels of voice, speech recognition or fax

Intel®Dialogic®D/600JCT-2E1-75 D600JCT2E175R2U ■Two digital network interfaces

Intel®Dialogic®D/600JCT-2E1-120 D600JC2E1120R2U ■PCI form factor

■Messaging and enhanced services ■H.100 compliant

■Wireless and ﬁxed-line short message ■Universal connectivity (support for 3.3V and 5V signaling

service (SMS) environments)

■Contact center and e-Business ■Tone signaling

■PC-PBX ■Call progress analysis

■Switching and call completion ■Up to 10 boards per chassis

■Prepaid/debit card ■Software development kits that can include Windows NT,

■Gateway switch Windows 2000, Windows 2003, Windows XP and Linux

(depending on the speciﬁc system release) operating systems yield

faster time-to-market

■R4 API for media control

■Uniﬁed call control access through Global Call interface provides

worldwide application portability and shortens development time

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Fax Boards

LOW-DENSITY FAX PRODUCTS

Intel®Dialogic®CPi/200-B2 and CPi/400-B2 Fax Boards

The Intel®Dialogic®CPi/200-B2 and CPi/400-B2 fax boards are ideal solutions for computer-based fax installations

requiring PCI compatibility and V.34 fast transmission mode. Designed to optimize network-based fax servers and

customized applications, they have two (CPi/200-B2 PCI board) or four (CPi/400-B2 PCI board) telephone line interface

circuits approved for direct connection to analog loop-start lines. An onboard switch can be set to a unique board number for

each board within a multi-board conﬁguration. Install multiple CPi/200-B2 or CPi/400-B2 PCI boards in a single PC chassis

to create cost-effective systems scalable up to 16 ports.

Intel®Dialogic®CPi/400BRI PCI Fax Board

The Intel®Dialogic®CPi/400BRI PCI fax board is a single-slot, medium-density fax board that supports four ports of

feature-rich fax capabilities plus two integrated, onboard, digital BRI network interfaces.

The CPi/400BRI PCI four-port ISDN BRI fax board was developed to meet the fax needs of countries widely using ISDN

BRI as the preferred communications network such as European countries and Australia, Japan, New Zealand, and South

Africa. This ﬂexible, scalable solution incorporates computer-based fax into the ISDN environment, with a universal PCI

form factor for maximum compatibility with the latest servers.

Low-Density Fax Product Line Summary

The following table summarizes the low-density fax product features. For additional information, refer to the product datasheet index at

http://www.intel.com/design/network/products/telecom/boards/mediaprocessing.htm#fb.

CPI/200-B2 AND CPI/400-B2 FAX BOARDS

PRODUCT AND APPLICATIONS ITEM MARKET NAME KEY FEATURES

Intel®Dialogic®CPi/200-B2 CPI200B2 ■Two fax resources

■Uniﬁed messaging ■PCI form factor

■Fax server ■Onboard, on-the-ﬂy MH, MR, MMR compressions

■Fax-on-demand ■API support for the GDK/GRT

■Fax broadcast ■Simultaneous V.34 transmission (33.6 Kbps), both transmit

and receive

■Up to four boards per chassis = up to eight channels

Intel®Dialogic®CPi/400-B2 CPI400B2 ■Four fax resources

■Uniﬁed messaging ■PCI form factor

■Fax server ■Onboard, on-the-ﬂy MH, MR, and MMR compression

■Fax-on-demand ■API support for the GDK/GRT

■Fax broadcast ■Simultaneous V.34 transmission (33.6 Kbps), both transmit

and receive

■Up to four boards per chassis = up to 16 channels

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INTEL®DIALOGIC®CPI/400BRI PCI FAX BOARDS

PRODUCT AND APPLICATIONS ITEM MARKET NAME KEY FEATURES

Intel®Dialogic®CPi/400BRI PCI CPI400BRIPCI ■Four fax resources

■Uniﬁed messaging ■PCI form factor, universal connectivity (support for 3.3V and 5V

■Fax server signaling environments)

■Fax-on-demand ■ISDN BRI network interface

■Fax broadcast ■API support for the GDK/GRT

■V.17 transmission (14.4 Kbps)

■Onboard, on-the-ﬂy MH, MR, and MMR compression

■TBR3 compliant

■ITU T.30, T.4, T.6 compliance

HIGH-DENSITY FAX PRODUCTS

Fax Resource Only (DM/F Fax Boards)

These fax resource products offer 24 or 30 resources of full-featured fax on a single board. This includes the Intel®

NetStructure™DM/F240-PCIU, Intel®NetStructure™DM/F240-CPCI, Intel®NetStructure™DM/F300-PCIU, and Intel®

NetStructure™DM/F300-CPCI fax boards. The products are available for the PCI or CompactPCI* form factor. These boards

give fax-intensive applications robust processing power and messaging ﬂexibility. Users can make the most of a span of either

24 or 30 ports of feature-rich fax capabilities on a single board, deploying fewer boards per chassis and, ultimately, fewer and

smaller chassis overall. This lowers the cost of ownership and enables more end users to deploy CT applications. Up to eight

DM/F fax boards (up to 196 or 240 ports of fax) can be combined in a single chassis.

As an alternative, developers can choose the Intel®Dialogic®CPi/2400-PCIU and Intel®Dialogic®CPi/3000-PCIU fax

resource only boards, which are programmed through the legacy Gamma Link API only.

Fax Resource with Onboard PRI Interface (High-Density Fax Boards)

The high-density, single-slot hardware Intel®NetStructure™DM/F240-1T1-PCIU and Intel®NetStructure™

DM/F300-1E1-PCIU fax boards are high-capacity fax boards that are useful for large-scale deployments of fax-enabled

applications. The boards let users make the best use of a span of either 24 or 30 ports of feature-rich fax capabilities, plus

an integrated network interface, on a single board. The increased resource density on the DM/F240-1T1-PCIU and

DM/F300-1E1-PCIU fax boards lowers per-port costs, since customers can deploy fewer boards per chassis, and, ultimately,

fewer and smaller chassis overall. Up to eight DM/F fax boards (up to 196 or 240 ports of fax) can be combined in a single

chassis.

As an alternative, developers can choose the Intel®Dialogic®CPi/2400-1T1-PCIU and Intel®Dialogic®

CPi/3000-1E1-PCIU fax boards, which are programmed through the legacy Gamma Link API only.

Fax and Voice Resource with Onboard PRI Interface (DM3 VFN Boards)

The Intel®NetStructure™DMVF240-1T1-PCIU and Intel®NetStructure™DMVF300-1E1-PCIU fax boards provide a

highly integrated platform with 24 or 30 universal ports of voice, fax, and digital network interface. Offering a universal

set of voice, fax, tone resources, and network interface in a 1:1:1:1 ratio, available on any call at any time, these boards are

ideal for developers looking to provide cost-effective, highly scalable, high-density communications applications that require

multimedia in a single PCI slot. Create high-density, multimedia solutions that support from 24 to 192 T-1 or 30 to 240 E-1

channels per chassis.

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High-Density Fax Product Line Summary

The following table summarizes the high-density fax product features. For additional information, refer to the product datasheet index at

http://www.intel.com/design/network/products/telecom/boards/mediaprocessing.htm#fb

FAX RESOURCE ONLY BOARDS

PRODUCT AND APPLICATIONS ITEM MARKET NAME KEY FEATURES

Intel®NetStructure™DM/F240-PCIU DMF240PCIU ■24 fax resources

■Uniﬁed messaging ■PCI form factor, universal connectivity (support for 3.3V and 5V

■Fax servers signaling environments)

■Fax-on-demand ■R4 API

■Fax broadcast ■Onboard, on-the-ﬂy MH, MR, and MMR compression

■Error Correction Mechanism (ECM)

■V.17 transmission (14.4 Kbps)

■Up to eight boards per chassis = 196 channels

■Windows* and Linux* operating system support

■All features available on all channels, regardless of load

■ITU T.30, T.4 compliance

Intel®NetStructure™DM/F300-PCIU DMF300PCIU ■30 fax resources

■Uniﬁed messaging ■PCI form factor, universal connectivity (support for 3.3V and 5V

■Fax servers signaling environments)

■Fax-on-demand ■R4 API

■Fax broadcast ■Onboard, on-the-ﬂy MH, MR, and MMR compression

■Error Correction Mechanism (ECM)

■V.17 transmission (14.4 Kbps)

■Up to eight boards per chassis = 240 channels

■Windows and Linux operating system support

■All features available on all channels, regardless of load

■ITU T.30, T.4 compliance

Intel®NetStructure™DM/F240-CPCI DMF240CPCI ■24 fax resources

■Uniﬁed messaging ■CompactPCI* form factor

■Fax servers ■R4 API

■Fax-on-demand ■Onboard, on-the-ﬂy MH, MR, and MMR compression

■Fax broadcast ■Error Correction Mechanism (ECM)

■V.17 transmission (14.4 Kbps)

■Up to eight boards per chassis = 196 channels

■Windows and Linux operating system support

■All features available on all channels, regardless of load

■ITU T.30, T.4 compliance

Intel®NetStructure™DM/F300-CPCI DMF300CPCI ■30 fax resources

■Uniﬁed messaging ■CompactPCI form factor

■Fax servers ■R4 API

■Fax-on-demand ■Onboard, on-the-ﬂy MH, MR, and MMR compression

■Fax broadcast ■Error Correction Mechanism (ECM)

■V.17 transmission (14.4 Kbps)

■Up to eight boards per chassis = 240 channels

■Windows and Linux operating system support

■All features available on all channels, regardless of load

■ITU T.30, T.4 compliance

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FAX RESOURCE WITH ONBOARD PRI INTERFACE BOARDS

PRODUCT AND APPLICATIONS ITEM MARKET NAME KEY FEATURES

Intel®NetStructure™DM/F240-1T1-PCIU DMF2401T1PCIU ■24 fax resources

■Uniﬁed messaging ■Onboard T-1 network interface (ISDN, T-1 CAS)

■Fax servers ■PCI form factor, universal connectivity (support for 3.3V and 5V

■Fax-on-demand signaling environments)

■Fax broadcast ■R4 API for fax, Global Call* for call control

■Fully exportable fax resources

■Onboard on-the-ﬂy MH, MR, and MMR compression

■Error Correction Mechanism (ECM)

■V.17 transmission (14.4 Kbps)

■Up to eight boards per chassis = 196 channels

■Windows* and Linux* operating system support

■All features available on all channels, regardless of load

■ITU T.30, T.4 compliance

Intel®NetStructure™DM/F300-1E1-PCIU DMF3001E1PCIU ■30 fax resources

■Uniﬁed messaging ■Onboard E-1 network interface (ISDN, R2 MF)

■Fax servers ■PCI form factor, universal connectivity (support for 3.3V and 5V

■Fax-on-demand signaling environments)

■Fax broadcast ■R4 API for fax, Global Call for call control

■Fully exportable fax resources

■Onboard on-the-ﬂy MH, MR, and MMR compression

■Error Correction Mechanism (ECM)

■V.17 transmission (14.4 Kbps)

■Up to eight boards per chassis = 240 channels

■Windows and Linux operating system support

■All features available on all channels, regardless of load

■ITU T.30, T.4 compliance

FAX AND VOICE RESOURCE WITH ONBOARD PRI INTERFACE BOARDS

PRODUCT AND APPLICATIONS ITEM MARKET NAME KEY FEATURES

Intel®NetStructure™DMVF240-1T1-PCIU DMVF2401T1PCIU ■24 fax resources and 24 voice resources

■Uniﬁed messaging ■Play voice, record voice prompts

■Fax servers ■Onboard T-1 network interface (ISDN, T-1 CAS)

■Voice response servers ■PCI form factor, universal connectivity (support for 3.3V and 5V

■Fax-on-demand signaling environments)

■Fax broadcast ■R4 API for fax and voice, Global Call* for call control

■Fully exportable fax and voice resources

■Onboard, on-the-ﬂy MH, MR, and MMR compression

■Error Correction Mechanism (ECM)

■V.17 transmission (14.4 Kbps)

■Up to eight boards per chassis = 196 channels

■Windows and Linux operating system support

■All features available on all channels, regardless of load

■ITU T.30, T.4 compliance

Intel®NetStructure™DMVF300-1E1-PCIU DMVF3001E1PCIU ■30 fax resources and 30 voice resources

■Uniﬁed messaging ■Play voice, record voice prompts

■Fax servers ■Onboard E-1 network interface (ISDN, R2 MF)

■Voice response servers ■PCI form factor, universal connectivity (support for 3.3V and 5V

■Fax-on-demand signaling environments)

■Fax broadcast ■R4 API for fax and voice, Global Call for call control

■Fully exportable fax and voice resources

■Onboard, on-the-ﬂy MH, MR, and MMR compression

■Error Correction Mechanism (ECM)

■V.17 transmission (14.4 Kbps)

■Up to eight boards per chassis = 240 channels

■Windows* and Linux* operating system support

■All features available on all channels, regardless of load

■ITU T.30, T.4 compliance

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Digital Telephony Interface Boards

INTEL®NETSTRUCTURE™DMN160TEC DIGITAL TELEPHONY

INTERFACE BOARD

The Intel®NetStructure™DMN160TEC Digital Telephony Interface Board is a high-density, digital telephone interface on

a CompactPCI* form factor. Supporting up to 480 ports and 16 spans, the board is programmable as T-1, E-1, or a mix of

both (in units of four) and fully compatible with other CompactPCI media processing and IP resource boards available from

Intel.

The DMN160TEC board offers developers a single, ﬂexible product that supports worldwide network interfaces.

Programmable on the ﬂy, it effectively lets solutions scale as system requirements grow. The DMN160TEC board is H.110

compliant and supports the switching of voice paths over CT Bus time slots to use resources on other boards. High density

and multiple features mean fewer boards and a smaller chassis, which helps developers keep up with the growing demands

placed on next-generation platforms.

Digital Telephony Interface Product Line Summary

The following table summarizes the digital telephony interface product features. For additional information, refer to the product datasheet index at

http://www.intel.com/design/network/products/telecom/boards/signaling.htm#dtib.

DMN AND DMT DIGITAL TELEPHONY INTERFACE BOARDS

PRODUCTS AND APPLICATIONS ITEM MARKET NAME KEY FEATURES

Intel®NetStructure™DMN160TEC DMN160TEC ■16 software-selectable T-1 or E-1 digital network interfaces

■Switching/call completion (groups of four)

■Network contact center ■CompactPCI* form factor

■Prepaid/debit card ■H.110 compliant

■Gateway switch ■Onboard law conversion

■Ability to simultaneously run multiple ISDN protocols

■Software development kits for Windows* 2000 and Linux*

operating systems yield faster time-to-market

■Uniﬁed call control access through Global Call* interface provides

worldwide application portability and shortens development time

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135

IP Boards

DM/IP BOARDS

Intel®NetStructure™DM/IP boards offer a standards-based software and hardware development platform for building

IP-based communications servers for the next-generation enterprise and service provider Ethernet network. Intel®DM/IP

boards feature 24 to 60 ports per slot of both public network and Internet connectivity, plus onboard voice and fax

processing. The DM/IP boards readily scale to support 480-port call completion applications such as access gateways and

IP-PBXs and media server applications such as uniﬁed messaging, interactive voice response (IVR), customer relationship

management (CRM).

DM/IP boards offers many optimized, low-bandwidth vocoder algorithms for transmitting high-quality audio over an IP

network including ITU-T G.711, G.723.1, G.729a, ITU GSM, and real-time fax over IP (ITU T.38). These algorithms use a

variety of coding techniques, bit rates, and frame sizes to compress audio for managing data network bandwidth. The wide

algorithm support of the boards provides the ability to deploy IP-based applications globally, tailoring them to speciﬁc

network bandwidth and voice quality requirements.

DM/IP boards offer improved quality of service (QoS) performance over IP networks. Threshold alarms alert an

application when network QoS parameters (jitter, latency, and packet loss) deteriorate below user-administered levels. These

alarms help to improve trafﬁc engineering, allowing more efﬁcient use of IP networks. They also enable dynamic decision-

making, which lets IP calls be rerouted onto the PSTN in the event of network congestion. IP packets carrying real-time voice

and fax can be routed with higher priority by setting IP Precedence bits.

The boards feature a ﬂexible approach to IP call control, letting a developer choose from any of the call control stacks

supported by H.323, MGCP, and SIP, or providing the ability to develop or port another by offering call control management

that resides on the server host instead of being embedded on the board. Support for standard signaling protocols enables the

DM/IP boards to interoperate with a wide range of popular IP phones including Microsoft NetMeeting* and the PingTel*

Phone. DM/IP boards also work seamlessly with terminals that are compliant with H.323, MGCP, H.248, and SIP. With the

introduction of a SIP-based phone client on Windows XP desktop software, DM/IP boards enables fast, cost-effective

deployment of IP phone service in the enterprise.

In addition to these leading IP voice networking features, DM/IP boards also provide a true universal port solution with

a robust media feature set including voice processing and fax capabilities. These boards also support an extensive suite of

PSTN digital network interfaces and globally approved signaling protocols all in a single PCI or CompactPCI* slot. All of

these features combined make Intel NetStructure DM/IP boards among the most powerful media processing platforms

bridging legacy networks and communications solutions to the next-generation Internet.

DM/IP IP Board Product Line Summary

The following table summarizes the DM/IP board product features. For additional information, refer to the product datasheet index at

http://www.intel.com/design/network/products/telecom/boards/signaling.htm#ipb

DM/IP IP BOARDS

PRODUCT AND APPLICATIONS ITEM MARKET NAME KEY FEATURES

Intel®NetStructure™DMIP241T1P100 ■Up to 24 voice resources

DM/IP241-1T1-PCI-100BT ■Full-size, PCI form factor

■IP-based uniﬁed messaging ■Vocoders: G.723.1, G.729a, G.711, GSM

■Interactive voice response (IVR) services ■T.38 real-time FoIP

■Web CRM centers and help desks ■Host-based call control

■Debit/calling card applications ■R4 and Global Call* control APIs

■Voice portals ■QoS: IP Precedence/Type of Service (TOS)

■Fax over Internet Protocol (FoIP)

■Access gateway

■IP PBX

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Intel®NetStructure™DMIP301E1P100 ■Up to 30 voice resources

DM/IP301-1E1-PCI-100BT ■Full-size, PCI form factor

■IP-based uniﬁed messaging ■Vocoders: G.723.1, G.729a, G.711, GSMs

■IVR services ■T.38 real-time FOIP

■Web CRM centers and help desks ■Host-based call control

■Debit/calling card applications ■R4 and Global Call control APIs

■Voice portals ■QoS: IP Precedence/TOS

■Fax over Internet Protocol (FoIP)

■Access gateway

■IP PBX

Intel®NetStructure™DMIP4812T1P100 ■Up to 48 voice resources

DM/IP481-2T1-PCI-100BT DMIP4812T1C100 ■Full-size, PCI and CompactPCI* form factors

Intel®NetStructure™■Vocoders: G.723.1, G.729a, G.711, GSM

DM/IP481-2T1-CPCI-100BT ■T.38 real-time FOIP

■IP-based uniﬁed messaging ■IVR services

■Web CRM centers and help desks ■R4 and Global Call control APIs

■Debit/calling card applications ■Host-based call control

■Voice portals ■QoS: IP Precedence/TOS

■FoIP ■CompactPCI high availability

■Access gateway

■IP PBX

Intel®NetStructure™DMIP6012E1P100 ■Up to 60 voice resources

DM/IP601-2E1-PCI-100BT DMIP6012E1C100 ■Full-size, PCI and CompactPCI form factors

Intel®NetStructure™■Vocoders: G.723.1, G.729a, G.711, GSM

DM/IP601-2E1-CPCI-100BT ■T.38 real-time FOIP

■IP-based uniﬁed messaging ■Host-based call control

■IVR services ■R4 API

■Web CRM centers and help desks ■QoS: IP Precedence/TOS

■Debit/calling card applications

■Voice portals

■FoIP

■Internet gateways for toll bypass

(Voice and Fax over IP)

■Access gateway

■IP PBX

Intel®NetStructure™DMIP601C100BT ■Up to 60 voice resources

DM/IP601-CPCI-100BT ■Full-size, CompactPCI form factor

■IP-based uniﬁed messaging ■Vocoders: G.723.1, G.729a, G.711, GSM

■IVR services ■T.38 real-time FOIP

■Web CRM centers and help desks ■Host-based call control

■Debit/calling card applications ■R4 API

■Voice portals ■G.711 multicast

■FoIP ■QoS: IP Precedence/TOS

■Internet gateways for toll bypass ■CompactPCI high availability

(Voice and Fax over IP) ■Conferencing

■Access gateway

■IP PBX

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137

IPT PRODUCTS

Intel®NetStructure™IPT Boards

Intel®NetStructure™IPT boards are among the industry’s highest-density standards-based VoIP interface boards for

developing scalable, carrier-grade IP telephony gateways and media servers. There are four IPT models, differentiated by

the number and type of IP channels per PC slot.

■IPT1200C—120 channels of any coder

■IPT4800C—480 channels of any coder

■IPT6720C—672 channels of any coder

■IPT2400C—240 channels of any coder

IPT boards are optimized to deliver the most popular IP-based solutions for the public network and the enterprise. They

easily scale to support thousands of channels in media gateway, media server, IP-PBX, and IP contact center solutions.

Offering the choice of between 120 and 672 channels per slot, IPT boards interoperate in a broad suite of PSTN signaling and

media processing boards for developing open systems solutions.

Intel NetStructure IPT boards offer many optimized, low-bandwidth vocoder algorithms for transmitting audio over an IP

network, including ITU-T G.711, G.723.1+a, and G.729a+b. These algorithms use a variety of coding techniques, bit rates,

and frame sizes to compress audio for managing data network bandwidth. Frame sizes as small as 5 ms are supported for

some of the highest voice-quality IP telephony available on the market today. The wide algorithm support lets developers

deploy IP-based applications for the diverse requirements of the modular network.

Besides powerful transcoding capabilities, other standard features include high-performance echo cancellation up to 64 ms,

RFC-2833 support for tone detection and pass-through capabilities, and T.38 fax relay support for developing high-

performance solutions. In addition, the boards support high quality of service through quality monitoring (QM) features

including IP precedence for setting trafﬁc priority, voice activity detection (VAD) and silence suppression for reducing the

number of packets in a link and lower bandwidth utilization, packet loss recovery, and jitter buffer management compensating

for latency (resulting in high voice quality). Intel NetStructure IPT boards let developers deploy competitive, feature rich,

carrier-grade IP telephony solutions.

IPT Boards Product Line Summary

The following table summarizes the IPT board product features. For additional information, refer to the product datasheet index at

http://www.intel.com/design/network/products/telecom/boards/signaling.htm#ipb

IPT BOARDS

PRODUCTS AND APPLICATIONS ITEM MARKET NAME KEY FEATURES

Intel®NetStructure™IPT1200C IPT1200C ■Choice of 120-, 240-, 480-, and 672-port low-bit-rate vocoder

Intel®NetStructure™IPT2400C IPT2400C port conﬁgurations

Intel®NetStructure™IPT4800C IPT4800C ■Broad choice of vocoders (G.711, G.723.1+a, G.729a+b)

Intel®NetStructure™IPT6720C IPT6720C ■SIP, H.323, MGCP, MEGACO signaling

■IP media gateway and media servers ■H.110-compliant 8 MHz CT Bus

■IP-enabled contact centers ■Dual 1000BaseT, 100BaseTX network interface

■Enhanced service platforms ■Windows NT*/Windows* 2000 operating system compatible

■IP-enabled voice portals ■Global Call* API for call control

■CompactPCI* form factor

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Call Logging Boards

Intel offers a wide breadth of products in the call logging and contact center market segments. The Intel®Dialogic®line-

tapping boards are for digital- and analog-based enterprises in the call recording industry. By providing a high-impedance

line tap of stations and/or trunks, these PCI- and ISA-compatible boards provide transparent access to speciﬁc call

information. They provide for voice recording in environments where logging is required by law or is desired to reduce

liability and resolve disputes. Developers can create medium to large quality assurance (QA) and call logging systems with a

powerful set of features and functionalities including low-bit-rate coders. Quality and stability help to make Intel a vendor of

choice for call logging and QA hardware.

Analog HiZ Line-Tapping Board

The Intel®Dialogic®DMV160LPHiZ Line-Tapping Board contains a rich set of advanced features, including digital signal

processing (DSP) technology and signal processing algorithms for building the core of any computer telephony (CT) call

logging system. The DMV160LPHiZ board provides 16 channels of call processing interfaces in a single PC slot. A unique

dual-processor architecture comprised of DSPs and a general-purpose microprocessor handles all telephony signaling and

performs all DTMF (touchtone) and audio/voice signal-processing tasks. The DMV160LPHiZ board connects to 16 analog

telephone channels, detects touchtones, and digitizes, compresses, and records voice signals.

Use the DMV160LPHiZ board to develop sophisticated, multifunction CT systems incorporating capabilities such as voice

processing, speech recognition, and text-to-speech (TTS).

Digital Station Set HiZ Line-Tapping Board

Intel®Dialogic®DSLT/162CT-U-HiZ Line-Tapping Board is a 16-port high-impedance line-tap PCI board for digital station

sets that records up to 128 simultaneous conversations via separate DSPs and provides voice and digital telephone display

data. Highly scalable, this board can access and record all digital agent lines regardless of the contact center's size.

This digital set line-tapping (DSLT) board provides quality assurance for the call recording industry by providing constant

line access to proprietary PBX digital agent telephones and capturing information essential to the effective management of

large contact centers. The DSLT board is an internal, PC-based solution that provides a physical tap of an agent's telephone,

capturing the required information and providing access to the necessary call information. While the link is transparent to the

parties involved in the connection, it permits extraction of signaling/protocol information from the network interface. The

DSLT board is strictly a passive device monitoring existing connections between the PBX and the digital telephone set. The

board uses a transparent, electrical coupling to the link that connects the telephone to the PBX. No PBX conference bridge

resources are required.

Compatible with Avaya* (formerly Lucent*), NEC*, Nortel*, and Siemens* PBXs, the DSLT board provides 16 ports,

with a maximum of 128 ports per chassis. The DSLT Software Development Kit (SDK), available for Windows NT* and

Windows* 2000 operating systems, includes advanced diagnostic and ﬁeld troubleshooting capabilities.

Digital T-1 HiZ Line-Tapping Board

The Intel®Dialogic®DM/V480-2T1-PCI-HiZ Line-Tapping Board provides a powerful set of features that developers can

use to create quality assurance and call logging systems. Offered in a single-slot PCI format, this digital HiZ board

provides 48 ports of call recording capability for two T-1 (1.544 Mb/s) digital interfaces.

Powerful DSPs provide a rich set of voice processing features, including various rates of voice compression, recording,

telephony tone signaling, and reliable DTMF detection. The digital T-1 HiZ board is based on the DM3 architecture, which

provides an environment that accelerates application development and provides a path for future growth. Software

development kits (SDK) are available for Windows NT and Windows 2000 operating systems. This digital T-1 HiZ board is

accompanied by software that monitors trunk signaling to determine the moment a call is setup, connected, and disconnected.

This information is then used to determine when to start recording the call, as well as collect Automatic Number

Identiﬁcation (ANI) and Dialed Number Identiﬁcation Service (DNIS). ISDN signaling is supported.

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Voice processing features, downloaded to the onboard DSPs at power up, let the digital T-1 HiZ board record voice

messages from the calling and called parties. Messages can be stored using G.711µ-law or A-law PCM, at a rate of 64 Kb/s,

as is used by the public telephone network. To reduce storage requirements, voice-coding algorithms can compress

recordings to 24 Kb/s or 32 Kb/s, using adaptive differential pulse code modulation (ADPCM). Other standards-based low-

bit-rate coders like G.276 for VPIM-compliant applications and GSM for uniﬁed messaging applications are also available.

Digital E-1 HiZ Line-Tapping Board

The Intel®Dialogic®DM/V600-2E1-PCI-HiZ Line-Tapping Board provides a powerful set of features that developers can

use to create quality assurance and call logging systems. Offered in a single-slot PCI format, this digital HiZ board

provides 60 ports of call recording capability for two E-1 (2.048 Mb/s) digital interfaces.

Powerful DSPs provide a rich set of voice processing features, including various rates of voice compression, recording,

telephony tone signaling, and reliable DTMF detection. The digital E-1 HiZ board is based on the DM3 architecture, which

provides an environment that accelerates application development and provides a path for future growth. SDKs are available

for Windows NT and Windows 2000 operating systems.

Voice processing features, downloaded to the onboard DSPs at power up, let the digital E-1 HiZ board record voice

messages from the calling and called parties. Messages can be stored using G.711µ-law or A-law PCM, at a rate of 64 Kb/s,

as is used by the public telephone network. To reduce storage requirements, voice-coding algorithms can compress

recordings to 24 Kb/s or 32 Kb/s, using ADPCM. Other standards-based low-bit-rate coders like G.276 for VPIM-compliant

applications and GSM for uniﬁed messaging applications are also available.

Call Logging Product Line Summary

The following table summarizes the call logging product application features. For additional information, refer to the product datasheet index at

http://www.intel.com/design/network/products/telecom/boards/signaling.htm#ltb

CALL LOGGING BOARDS

PRODUCT AND APPLICATIONS ITEM MARKET NAME KEY FEATURES

Intel®Dialogic®DSLT/162CT-U-HIZ DSLT162CTUHIZ DSLT key features

Digital Station Set HiZ line tap ■Taps proprietary digital PBX station sets

■Contact center/quality assurance ■16 ports

■Call logging/recording environments ■PCI form factor

■128 ports per chassis

■Records up to 128 simultaneous conversations

■H.100 compatible

■Windows NT*/Windows* 2000 operating system compatible

■Drivers available in the Intel®Dialogic®System Release Software

Intel®Dialogic®DM/V480-2E1-PCI-HIZ DMV4802T1PCIHIZ T-1/E-1 key features

Intel®Dialogic®DM/V600-2E1-PCI-HIZ DMV6002E1PCIHIZ ■48 T-1 or 60 E1 ports per board

Digital T-1 HiZ line tap board ■Universal PCI form factor

Digital E-1 HiZ line tap board ■Built on DM3 media stream architecture

■Contact center/quality assurance ■Signal monitoring

■Call logging/recording environments ■Dual interface—two digital network interfaces for each digital

trunk tapped

■Audio interface detects call progress and DTMF tones for host

application

■H.100 compatible

■Global tone detection

■R4 API

■Call logging API with GUI

Intel®Dialogic®DMV160LPHIZ DMV160LPHIZ ■16 ports of voice processing and 16 ports analog high-impedance

Analog HiZ line tap board interface

■Contact center/quality assurance ■PCI form factor

■Call logging/recording environments ■Downloadable signal and call processing ﬁrmware

■Onboard DSP

■H.100 compatible

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PBX Integration Boards

Private branch exchange (PBX) integration boards let developers of voice mail, uniﬁed messaging, auto-attendant, and

interactive voice response (IVR) solutions build sophisticated enterprise applications that maximize the advanced digital

features of the PBX such as calling party identiﬁcation; called party identiﬁcation; message waiting lamp control; and fast,

reliable transfers.

PBX integration boards are considered premium integration products and used when an application requires more

sophisticated call control and call information than normally available through an analog connection. These advanced

features are sometimes collectively referred to as “digital features.” The term “integration” describes any method for

connecting an application to a PBX or key telephone system (KTS), but is most often used when referring speciﬁcally

to a product that offers advanced digital features.

These digital features are available without expensive upgrades to existing PBX equipment, since PBX integration boards

use the same interface to the PBX as a digital telephone—a concept known as “emulation.” PBX integration boards emulate,

or behave like, a digital telephone, thereby letting the boards provide advanced call control capabilities to an application

through an application programming interface (API).

Intel®Dialogic®DSE PBX Integration Boards

Intel®Dialogic®DSE PBX Integration boards offer advanced digital connectivity for popular PBXs in 8-, 12-, and 16-port

conﬁgurations for uniﬁed and Internet-ready call, voice, and fax processing applications in medium to large enterprises and

contact centers. The boards provide up to 16 ports of digital access to the PBX by emulating the powerful digital display

telephones used by attendants and ACD/contact center supervisors and agents.

The DSE board provides application developers with a high-level interface to digital PBXs through digital telephone

emulation, as well as the ability for media processing using H.100-compatible voice processing hardware. The Intel Dialogic

DSE PBX integration board runs on Windows NT* and Windows* 2000 operating systems and offers support for Microsoft

Telephony API* (TAPI), the industry standard for computer-telephony integration (CTI) interfaces. TAPI support means the

Intel Dialogic DSE PBX integration board works readily with a large number of existing applications, signiﬁcantly reducing

development time.

Intel®Dialogic®D/82JCT-U-PCI-UNIV PBX Integration Board

The Intel®Dialogic®D/82JCT-U-PCI-UNIV PBX integration board offers advanced digital connectivity to many popular

PBXs for uniﬁed and Internet-ready call, voice, and fax processing applications in small to medium-sized enterprises.

Featuring programmable soft-ports capable of supporting voice, fax, call handling, and host-based speech technologies, this

board reduces the cost of ownership for systems requiring multimedia functionality. By choosing the D/82JCT-U-PCI-UNIV

board for enterprise applications, developers eliminate the complexities associated with analog or T-1 integration, as well as

costly investments in proprietary CTI links.

Intel®Dialogic®D/42JCT-U PBX Integration Board

The Intel®Dialogic®D/42JCT-U PBX integration board offers advanced digital connectivity to many popular PBXs for

uniﬁed and Internet-ready call, voice, and fax processing applications in small to medium-sized enterprises. Featuring

programmable soft-ports capable of supporting voice, fax, call handling, and host-based speech technologies, this board

reduces the cost of ownership for systems requiring multimedia functionality. By choosing the D/42JCT-U board for

enterprise applications, developers eliminate the complexities associated with analog or T-1 integration, as well as costly

investments in proprietary CTI links.

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PBX Integration Board Product Line Summary

The following table summarizes the PBX integration board product features. For additional information, refer to the product datasheet index at

http://www.intel.com/design/network/products/telecom/boards/signaling.htm#pbxib.

DSE PBX INTEGRATION BOARDS

PRODUCTS AND APPLICATIONS ITEM MARKET NAME KEY FEATURES

Intel®Dialogic®DL300908 DL300908 ■8, 12, and 16 digital interface ports

Intel®Dialogic®DL300912 DL300912 ■Supports Avaya* (Deﬁnity), NEC* (NEAX*), Nortel* (Meridian-1),

Intel®Dialogic®DL300916 DL300916 and Siemens* (Hicom*) PBXs

■Voice mail/voice messaging ■PCI long form factor

■Uniﬁed messaging ■Field expandable (DL300908 and DL300912)

■Auto attendant

■Interactive voice response (IVR)

■Interactive media response (IMR)

Intel®Dialogic®DL300708 DL300708 ■8, 12, and 16 digital interface ports

Intel®Dialogic®DL300712 DL300712 ■Supports Mitel* (SX200, SX2000) PBXs

Intel®Dialogic®DL300716 DL300716 ■PCI long form factor

■Voice mail/voice messaging ■H.100 compatible

■Uniﬁed messaging ■Field expandable (DL300708 and DL300712)

■Auto attendant

■Interactive voice response (IVR)

■Interactive media response (IMR)

Intel®Dialogic®DL300208 DL300208 ■8, 12, and 16 digital interface ports

Intel®Dialogic®DL300212 DL300212 ■Supports Siemens (ROLM) PBXs

Intel®Dialogic®DL300216 DL300216 ■PCI long form factor

■Voice mail/voice messaging ■H.100 compatible

■Uniﬁed messaging ■Field expandable (DL300208 and DL300212)

■Auto attendant

■Interactive voice response (IVR)

■Interactive media response (IMR)

JCT PBX INTEGRATION BOARDS

PRODUCT AND APPLICATIONS ITEM MARKET NAME KEY FEATURES

Intel®Dialogic®D/82JCT-U D82JCTUPCIUNIV ■Eight digital interfaces plus eight media processing channels

■Voice mail/voice messaging ■Four digital interfaces plus four media processing channels

■Uniﬁed messaging ■Supports Avaya* (Deﬁnity), Mitel* (SX200, SX2000, SX50), Nortel*

■Auto attendant (Meridian-1 and NorStar), Siemens* (Hicom* 150/300, ROLM*

■Interactive voice response (IVR) CBX 9005, 9006, 9751), and NEC (NEAX* 2400/2000, Electra

■Interactive media response (IMR) Professional*, Electra Elite*) PBXs

■Supports G.711, OKI linear, GSM, and G.726 voice coders

■Two channels of fax per card, sharable across CT Bus

■DTMF tone generation and detection

■Support for continuous speech processing

■Pitch corrected speed control on playback

■Universal PCI support—with System Release 5.1 or higher

■H.100 compatible

Intel®Dialogic®D/42JCT-U D42JCTU ■Four digital interfaces plus four media processing channels

■Supports Avaya (Deﬁnity), Mitel (SX200, SX2000, SX50), Nortel

(Meridian-1 and NorStar), Siemens (Hicom 150/300, ROLM

CBX 9005, 9006, 9751), and NEC (NEAX* 2400/2000, Electra

Professional, Electra Elite) PBXs

■Supports G.711, OKI linear, GSM, and G.726 voice coders

■One channel of fax per card, sharable across CT Bus

■DTMF tone generation and detection

■Support for Intel®Dialogic®Continuous Speech Processing

Technology

■Pitch-corrected speed control on playback

■PCI long form factor

■H.100 compatible

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SS7 Boards

Signaling System 7 (SS7) is the signaling system that forms the backbone of the international telecommunications

network. Intel offers a complete family of SS7 products ranging from boards to gateways, scalable from 64 to more than

16,000 ports. These products are used for call control/call routing, wireless/wireline messaging, and intelligent network

applications.

For more information on SS7 gateway products, refer to the Signaling Gateway section.

Intel®NetStructure™SS7 Boards

These E-1/T-1/V.35 SS7 intelligent interface boards, along with SS7 protocol software, give direct, high-performance

access to the worldwide telecommunications network. SS7 boards from Intel provide the platform for call control,

wireless applications, and Intelligent Networking (IN) in CompactPCI*, PCI, and ISA form factors. The onboard processor

runs a full range of protocols, from MTP up to ISUP, SCCP, TCAP, GSM-MAP, IS41-MAP, INAP, and CAP, independent

from the host. The boards also include H.100/H.110/SCbus interfaces for interworking with other standards-based boards in a

system. The boards include runtime support for many local variants, as well as the major ANSI and ITU versions. The latest

addition to the product family, the Intel®NetStructure™SS7HDP Board, is a high-density, high-performance board that lets

developers create cost-effective, high-density, carrier-grade communications solutions requiring advanced SS7 performance.

SS7 Board Summary

The following table summarizes the SS7 board application features. For additional information, refer to the product datasheet index at

http://www.intel.com/design/network/products/telecom/boards/signaling.htm#ss7b

Applications that can be enabled using Intel®SS7 Products include:

■Color ring-back tone (CRBT)

■Location-based services (LBS)

■Short Message Services (SMS)

■Prepaid calling

■Voice portals

■Interactive voice response (IVR) and voice mail systems

■Intelligent networking/IP long-haul

SS7 BOARDS

PRODUCTS AND APPLICATIONS FORM FACTOR ITEM MARKET NAME KEY FEATURES

Intel®NetStructure™SS7HDP PCI SS7HDPD4TE ■16 or 64 links per board

■Onboard process runs protocols independent

of host

■Common API between boards

Intel®NetStructure™SPC12S PCI SS7SPC12S ■Two, four, or eight E-1/T-1 digital network

Intel®NetStructure™SPC14 PCI SS7SPC14 interfaces per board

■Onboard processor runs protocols

Intel®NetStructure™SCPM8 CompactPCI* SS7CPM8 independent of host

Intel®NetStructure™SCPR8RJ CompactPCI SS7CPR8RJ ■Support for MTP, ISUP, TUP, BT-IUP, SCCP,

TCAP, GSM-MAP, IS41-MAP,

Intel®NetStructure™PCCS62E ISA SS7PCCS62E INAP, CAP, and many local variants

Intel®NetStructure™PCCS62EU ISA SS7PCCS62EU including ANSI and ITU/ETSI

Intel®NetStructure™PCCS62T ISA SS7PCCS62T ■Three or four SS7 links per board

Intel®NetStructure™PCCS62TH ISA SS7PCCS62TH ■Common API between boards

Intel®NetStructure™PCCS62EUH ISA SS7PCCS62EUH

Intel®NetStructure™PCCS62EBH ISA SS7PCCS62EBH

Intel®NetStructure™PCCS62SEB ISA SS7PCCS62SEB

Intel®NetStructure™PCCS62ST ISA SS7PCCS62ST

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143

Station Interface Boards

These integrated, multifunction telephony boards are designed speciﬁcally for small to medium-sized enterprise

applications including server-based private branch exchanges (PBXs) and contact centers. Equipped with a rich mix of

telephone station interfaces and media processing resources, the DI boards help developers and resellers create more efﬁcient

and complete system solutions that offer increased functionality at a lower cost to end users. These are some of the overall

beneﬁts of this product line.

■Optimized for converged communications switching applications

■Lower system cost through higher densities

■Wide range of resources integrated onboard

■Easy to add system features and enhancements

■Built-in service reliability and availability

STATION INTERFACE PRODUCTS

Intel®Dialogic®DI0408LSAR2 Switching Board

The Intel®Dialogic®DI0408LSAR2 board is a single-slot, richly-conﬁgured trunk and station interface board designed for

small to mid-sized server-based PBX or contact centers starting at four loop-start analog interfaces and eight station

interfaces on a single board. Reliable and cost-effective, the DI0408LSAR2 board offers an optimized combination of

interfaces and resources for enterprise switching applications. Build a 4-trunk, 8-station converged communications system in

a single PCI slot with one DI0408LSAR2 board. Add up to eight integrated boards from Intel or other Intel®boards to

support virtually any small to medium-sized enterprise switching application.

Intel®Dialogic®DISI16R2, DISI24R2, and DISI32R2 Switching Boards

The Intel®Dialogic®DISI16R2, DISI24R2, and DISI32R2 switching boards connect analog telephone devices directly to

converged communications platforms to create affordable, small to mid-sized, server-based PBX telemarketing systems

and contact centers. Highly reliable and cost-effective, these integrated station interface products offer an optimized mix of

analog station interfaces and resources for building highly scalable systems.

The DISI16R2, DISI24R2, and DISI32R2 boards are full-size, single-slot PCI boards based on DM3 architecture that

provide 16, 24, or 32 station interfaces, respectively. They include conferencing, voice play/record, tone detection and

generation, and caller ID capabilities. The DM3 architecture provides access to independent, high-performance, ﬁrmware-

based network protocol and media processing resources that can be operated and integrated on compatible hardware

platforms.

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144

Station Interface Product Line Summary

The following table summarizes the station interface board application features. For additional information, refer to the product datasheet index at

http://www.intel.com/design/network/products/telecom/boards/switching.htm#cssivb

STATION INTERFACE BOARDS

PRODUCTS AND APPLICATIONS ITEM MARKET NAME KEY FEATURES

Intel®Dialogic®DI0408LSAR2 DI0408LSAR2 ■Four loop-start trunk connections with call control

Intel®Dialogic®DI0408LSAR2EU DI0408LSAR2EU ■Eight analog station interfaces with call control

Intel®Dialogic®DI0408LSAR2I DI0408LSAR2I ■Full-size, PCI form factor

Intel®Dialogic®DI0408LSAR2EUI DI0408LSAR2EUI ■Fail-over of four trunks to four stations

■Server-based PBX ■Eight voice play and record

■Customer contact center ■Full complement of tone detection and generation

■Nine-party conference resources

■Two fax resources per board

■Four CSP resources

■On-hook and off-hook caller ID generation (FSK)

■Message Waiting Indicator Control (FSK)

■Music on-hold audio port

■Support for Windows NT* , Windows* 2000, and Windows* XP

operating systems

■Uses Global Call*, MSI, and R4 APIs

■CT Bus H.100 compliant

■Phone support, 2500 sets; caller ID phones; international complex

impedance phones

■International approvals

■DI0408LSAR2, DI0408LSAR2EU require external telephony

power supply (MSISCGLOBALPWR)

■DI0408LSAR2I, DI0408LSAR2EUI require internal telephony

power supply (DIINTPPS)

Intel®Dialogic®DISI16R2 DISI16R2 ■Full-size, PCI form factor

Intel®Dialogic®DISI24R2 DISI24R2 ■16, 24, or 32 analog station interfaces with call control, caller

Intel®Dialogic®DISI32R2 DISI32R2 ID generation

■Automatic call distributor (ACD) ■Full complement of dedicated voice play and record

■Server-based PBX ■Full complement of dedicated tone detections and generation

■Customer service ■16 parties of conferencing with echo cancellation

■Teleconferencing/conferencing bridge ■On-hook and off-hook caller ID generation (FSK)

■Inbound and outbound telemarketing ■Message Waiting Indicator Control (FSK)

■Music on-hold audio port

■Support for Windows NT, Windows 2000, and Windows XP

operating systems

■Uses Global Call, MSI, and R4 APIs

■CT Bus H.100 compliant

■International approvals

■Requires external power supply (MSISCGLOBALPWR)

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HIGH-DENSITY STATION INTERFACE PRODUCTS

The high-density station interface (HDSI) solution from Intel provides an open-architecture platform for converged

communication systems that integrates large-scale switching and voice processing resources under a single hardware and

software architecture. The HDSI solution is offered in both PCI and CompactPCI* conﬁgurations, which provide some of the

industry’s highest densities plus analog station connectivity in a single computer chassis slot.

High-Density Station Interface

The HDSI solution offered by Intel is an assembly consisting of either an Intel®NetStructure™HDSI-PCIU board with

H.100-compliant CT Bus connectivity or an HDSI-CompactPCI* board assembly (including a CompactPCI baseboard

and a rear I/O module) with H.110-compliant CT Bus connectivity, connected to an external station interface box (SIB). The

CT Bus provides switching between trunks and stations and also allows expansion for additional network and resource

boards from Intel. Using just one computer chassis slot, this solution can support up to 120 stations with tone detection and

generation, and frequency shift key (FSK) caller ID transmission.

High-Density Station Interface Product Line Summary

The following table summarizes the HDSI product features. For additional information, refer to the product datasheet index at

http://www.intel.com/design/network/products/telecom/boards/switching.htm#sib.

HIGH-DENSITY STATION INTERFACE BOARDS

PRODUCTS AND APPLICATIONS ITEM MARKET NAME KEY FEATURES

Intel®NetStructure™HDSI/480PCIU HDSI480PCIU ■Connectivity to 48, 72, 96, or 120 analog stations

Intel®NetStructure™HDSI/480PCIJP HDSI480PCIJP ■Programmable ringing with automatic ring trip requires no additional

Intel®NetStructure™HDSI/720PCIU HDSI720PCIU external circuitry

Intel®NetStructure™HDSI/720PCIJP HDSI720PCIJP ■Station status event detection allows collection of call trafﬁc statistics

Intel®NetStructure™HDSI/960PCIU HDSI960PCIU via the application for cost-effective management of call setup and

Intel®NetStructure™HDSI/960PCIJP HDSI960PCIJP call termination

Intel®NetStructure™HDSI/1200PCIU HDSI1200PCIU ■Programmable gain provides station volume control from the

Intel®NetStructure™HDSI/1200PCIJP HDSI1200PCIJP application and enables matching line levels from different devices

Intel®NetStructure™HDSI/480CPCI HDSI480CPCI ■Supports programmable notiﬁcation tones for metering time expired

Intel®NetStructure™HDSI/720CPCI HDSI720CPCI ■Full complement of dedicated voice resources (not on HDSI 1200)

Intel®NetStructure™HDSI/960CPCI HDSI960CPCI ■Provides unobtrusive monitoring of connections

Intel®NetStructure™HDSI/1200CPCI HDSI1200CPCI ■Provides battery feed to phone (termination) sets

■Inbound and outbound telemarketing ■C language application program interfaces (APIs) for Windows NT*,

■PBX/key systems Windows* 2000, and Windows* XP operating systems

■Operator services, such as billing automation, ■Onboard DTMF detection recognizes tones generated by phones

directory assistance, and intercept treatments connected to the stations

■Automatic call distribution (ACD) ■Onboard tone generation provides for generating PBX-like tones

■Local information services to the stations such as dial tone, ring back, and busy

■Programmable cadence allows selection of ring cadence options

■Onboard FSK generation allows the transmission of Caller ID

to Class, type caller ID phones, as well as the ability to turn on

and off message waiting indicators

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Telecom Platforms

Intel offers open, modular product platforms that can provide a solid foundation on which communications OEMs can build

large- or small-scale converged communications systems for both the enterprise and the public network market segments.

Gateway products from Intel include the Intel®NetStructure™PBX-IP Media Gateway, offering enterprises a phased

migration to IP networking, and the Elite Gateway* which lets enterprises eliminate toll calls between ofﬁces by adding voice

to existing wide area networks (WANs). In general, use the PBX-IP Media Gateway to connect to digital PBXs or drive

digital phones and the Elite Gateway to connect to analog trunk interfaces or drive analog phones.

Media Gateways

INTEL®NETSTRUCTURE™PBX-IP MEDIA GATEWAY

The Intel NetStructure PBX-IP Media Gateway allows a well-planned, phased migration to an IP network, making it

a smart solution for enterprises not yet ready (or willing) to completely abandon their investment in legacy PBX

equipment. This building block from Intel provides a simple, cost-effective transition to voice and data convergence for

enterprises with PBXs. Connected externally, it offers an IP solution that works with current legacy equipment. It supports

H.323 or SIP-based applications running on network servers, remote terminals, or other devices.

Connected between a PBX or a digital handset and a LAN, WAN, or managed packet network, the Intel NetStructure

PBX-IP Media Gateway converts proprietary digital PBX messages into a format suitable for transmission over standard IP

networks. With a PBX, the gateway is used for emulation; with a digital handset, the gateway is used for phone driving. Each

gateway unit contains eight digital PBX (emulating) or digital station interfaces (phone driving) and a 10/100 BaseT Ethernet

connection for connecting to a LAN.

PBX-IP Media Gateway Product Line Summary

The following table summarizes the PBX-IP media gateway product features. For more information, refer to the product datasheet index at

http://www.intel.com/design/network/products/telecom/gsp/index.htm#gateways

PBX-IP MEDIA GATEWAY PRODUCT LINE

PRODUCT AND APPLICATIONS ITEM MARKET NAME KEY FEATURES

Intel®NetStructure™PIMG80PBXDNI PIMG80PBXDNI Emulating

Intel®NetStructure™PIMG80PBXMTLDNI PIMG80PBXMTLDNI ■Eight ports per unit. Stack multiple units for higher densities.

Intel®NetStructure™PIMG80LS PMIG80LS ■PBX compatibility: Mitel* (PIMG80PBXMTLDNI), Avaya*, NEC*,

■IP-enabled PBX network Nortel*, Siemens* (PMIG80PBXDNI) various analog (PIMG80LS)

■Voice over Internet Protocol ■10/100 BaseT Ethernet LAN port

(VoIP) extension to branch ofﬁces ■Supports H.323 or Session Initiated Protocol (SIP) VoIP standards

■Centralized VoIP applications servers including ■Administration through Web, telenet, or local serial port

IP-based voice mail and uniﬁed messaging ■Appliance packaging (approximately 10 in x 10 in x 2 in [25 cm x

■Teleworking/telecommunting 25 cm x 5 cm])

Intel®NetStructure™PIMG80PBXDSI PIMG80PBXDSI Phone driving

■Eight ports per unit. Stack multiple units for higher system densities.

■Handset compatibility: Avaya, NEC, Siemens (PIMG80PBXDSI)

■10/100 BaseT Ethernet LAN port

■Support H.323 or SIP VoIP standards

■Administration through Web, telenet, or local serial port

■Appliance packaging (approximately 10 in x 10 in x 2 in

[25 cm x 25 cm x 5 cm])

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ELITE GATEWAY*

The Elite Gateway is a cost-effective and reliable way to place voice and fax calls over an IP network. Service providers

and enterprises can both use the gateway to cut costs. The gateway is equipped with remote management capabilities.

Modules are provided for analog trunks or analog telephones.

Elite Gateway* Product Line Summary

The following table summarizes the Elite Gateway product features. For more information, refer to the product datasheet index at

http://www.intel.com/design/network/products/telecom/gsp/index.htm#gateways

ELITE GATEWAY* PRODUCT LINE

PRODUCT AND APPLICATIONS ITEM MARKET NAME KEY FEATURES

Elite Gateway* E8044PORTFXO ■1U rack-mountable with four ports per module (up to two modules

■xSP service provision for enterprises E804S4PORTFXS per chassis) or desktop appliance with two or four ports

■E-Business data center E8088PORTFXO ■10/100 BaseT Ethernet LAN port

■Enterprise voice intranet E808S8PORTFXS ■Analog loop-start trunk or analog telephone station interfaces

■Web-enabled contact center E808X4PTFXOFXS (FXS, FXO and E&M)

■Click-to-connect business FXS4PORTBLADE ■Supports H.323 VoIP standard

■Web-enabled auto-attendant FXO4PORTBLADE ■Supports T.38 fax transmission

■IP-based PBX ELITE4PORTENM ■Built-in dial plan

E4PORT2FXS2FXO ■Web browser, Telnet, or RS-232 for administration

EDESKTOP4FXO

EDESKTOP4FXS

EDESKTOP2FXS

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Signaling Gateways

Signaling System 7 (SS7) is the signaling system that forms the backbone of the international telecommunications

network. Intel offers a complete family of SS7 products ranging from boards to servers that scale from 64 to more than

16,000 ports. These products are used for call control, signaling, wireless messaging, and intelligent network applications.

For more information on SS7 server products, refer to the SS7 Boards section.

SS7 SERVER PRODUCTS

Intel®NetStructure™SIU131 and SIU231 SS7 Signaling Gateways

The Intel®NetStructure™SIU131 and SIU231 signaling gateways are cost-effective and highly reliable SS7 servers that

provide straightforward ways to build intelligent network entities such as Service Control Points (SCP) and Intelligent

Peripherals (IP) using standard computing platforms.

Intel®NetStructure™SIU520 Signaling Gateway

The Intel®NetStructure™SIU520 Signaling Gateway provides SS7 connectivity for multi-chassis call control, wireless,

or Intelligent Networking (IN) applications. A message-based protocol application programming interface (API),

compatible with other SIU systems and with Intel®NetStructure™SS7 boards, is presented over IP to application hosts.

SIU520 unit can run a wide range of SS7 protocols and local variants, enabling worldwide deployment in a variety of

applications.

Intel®NetStructure™Digital Signaling Converter

This multifunction, multi-protocol intelligent “black-box” device accepts SS7 or ISDN signal inputs and outputs

another SS7 or ISDN signal. With a simple conﬁguration and capable of ﬁtting into your existing network, Intel

NetStructure Digital Signaling Converters let ISDN or previously incompatible SS7 equipment to be interconnected with

public network systems.

Intel®NetStructure™SG430 SS7 Signaling Gateway

Interfacing to both SS7 and IP networks, the Intel®NetStructure™SG430 SS7 Signaling Gateway lets SS7 information be

carried to and from IP-based applications such as softswitches and mobile network elements. This signaling gateway

bridges IP networks, ISDN equipment, and SS7 equipment. It is a key enabler for building IP-based telecommunications

service nodes such as VAD platforms or wireless location/messaging services. It is also used to SS7-enable voice systems,

giving access to the power and ﬂexibility of the core telecommunications network.

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149

SS7 Server Product Line Summary

The following table summarizes the SS7 server product features. For more information, refer to the product datasheet index at

http://www.intel.com/design/network/products/telecom/gsp/index.htm#sg.

SS7 SERVERS

PRODUCTS AND APPLICATIONS ITEM MARKET NAME KEY FEATURES

Intel®NetStructure™SIU131 SIU131 ■Support for MTP, ISUP, TUP, BT-IUP, SCCP, TCAP, GSM-MAP,

Intel®NetStructure™SIU231 SIU231 IS41-MAP, INAP, CAP, and many local variants including

■Mobile short messaging/location-based services ANSI and ITU/ETSI

■IP telephony gateways ■Multiple interface formats—E-1/T-1/V.35

■Intelligent Networking SCP ■Fault-resilient load-sharing conﬁgurations

■IP-based application service provider ■Common API with boards for applications scalability

■Multi-chassis service platforms ■API over TCP/IP interface to up to 32 applications hosts

■VAD/IVR and voice mail systems

Intel®NetStructure™SIU520 SIU520 ■Trafﬁc rates up to 800 TCAP transactions per second, or 450 ISUP

■SS7 service node creation, including or TUP calls per second

■Wireless nodes—short message service ■Up to 12 SS7 signaling links in 12 link sets

center (SMSC), home register (HLR), ■Intel®2U carrier-grade NEBS-3/ETSI carrier-grade server location

roaming gateways ■Dual fault-resilient conﬁgurations

■Wireless short messaging service (SMS)

platforms/gateways

■Intelligent Networking (IN) service control

point (SCP), Internet protocol (IP)

■Voice-activated dialing (VAD), voice portal,

interactive voice response (IVR), or voice

mail systems

Intel®NetStructure™DSC110 DSC110 ■Support for ANSI/ITU ISP, TUP, BT-IUP and other local variants

Intel®NetStructure™DSC210 DSC210 ■Conversion to/from all supported SS7 variants

Intel®NetStructure™DSC310 DSC310 ■Conversion to/from ISDN and DPNSS

■Rapid deployment of ISDN equipment ■Parameter manipulation to bridge incompatible networks

■Interconnection of incompatible SS7

equipment

■Advanced network inter-working

Intel®NetStructure™SG430 Signaling SG430 ■SS7-to-IP inter-working using open standards

Gateway ■Simultaneous support for multiple SS7 variants—

■Mobile short messaging/location-based ANSI/ITU/ETSI/JAPAN

services ■Multiple interface formats—E-1/T-1/V.35

■Distributed switch ■Supports connectivity to SIGTRAN-compatible application servers

■SS7 long haul and ofﬂoad ■Enables multi-host distributed application server systems

■GPRS integration ■STP-like operation

■2G-to-3G inter-working ■Fault-resilient conﬁgurations

■IP telephony gateways ■High-performance in 2U form factor

■Intelligent Networking SCP ■SS7/SIGTRAN application server software also available

■IP-based application service provider

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150

Media Servers

MEDIA SERVER PRODUCTS

Voice Portal Reference Assemblies from Intel

Voice portal reference assemblies from Intel are packaged, integrated hardware platforms application developers can use to

build hardened solutions for rapidly-expanding e-Business and speech-enabled voice portal solutions. It brings together

the power of Intel®server technology with Intel®Dialogic®telephony interface boards in an integrated server platform.

The voice portal reference assemblies are comprised of three major, logical components: the Intel®Server Board

SE7500WV2, a hardened chassis that provides a rugged platform for building ﬂexible voice portal solutions; Intel®Dialogic®

telephony interface boards; and Intel®Dialogic®Continuous Speech Processing Technology, software that consists of a new

library of functions, device drivers, ﬁrmware, and technical documentation to help create leading-edge ASR applications.

Voice Portal Reference Assemblies Product Line Summary

The following table summarizes the voice portal reference assemblies’ product features. For more information, refer to the product datasheet index at

http://www.intel.com/design/network/products/telecom/gsp/index.htm#servers

VOICE PORTAL REFERENCE ASSEMBLIES

PRODUCTS AND APPLICATIONS KEY FEATURES

Voice Portal Reference System

■Voice-assisted dialing ■Supports one or two Intel®Xeon™processors—up to 2.2 GHz

■Speech-enabled interactive voice response (IVR) (512 KB L2 cache)

■Uniﬁed messaging ■Two integrated Intel®PRO/100+ Server Adapters

■Voice mail server (Intel®82550PM controller)

■Customer care/contact center ■Triple Peer PCI buses

■Operator services (collect, calling card, and prepaid) ■Integrated ATI* Rage* XL video controller with 8 MB of video memory

■And many others ■Supports up to 6 GB of PC133 ECC SDRAM memory with six

DIMM sockets

■Validated on Windows* and Linux* operating systems

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151

The following are the descriptions and Item Market Names for the latest releases.

ITEM MARKET NAME DESCRIPTION

VPWIN2KE1S75 Windows* 2000 Professional, 1 Gig, 30 ports

VP12WIN2KT1S Windows 2000 Professional, 1 Gig, 48 ports

VP12WIN2KT1D Windows 2000 Professional, 1 Gig, 96 ports

VP12WIN2KE1D Windows 2000 Professional, 1 Gig, 120 ports

VP22WIN2KT1 Windows 2000 Professional, 2 Gig, 192 ports

VP22WIN2KE1 Windows 2000 Professional, 2 Gig, 240 ports

PFSR22003960 Windows 2000 Professional, 4 Gig, 288 ports

PFMULWIN196 Windows 2000 Professional, 2 Gig, 96 ports, NEBS compliant

PFMULWIN11200 Windows 2000 Professional, 2 Gig, 120 ports, NEBS compliant

PFLANWIN296 Windows 2000 Professional, 4 Gig, 192 ports, NEBS compliant

PFLANWIN211200 Windows 2000 Professional, 4 Gig, 240 ports, NEBS compliant

PF13W41T1 Windows 2000 Server, 1 Gig, 4 ports

PF13W41EURO Windows 2000 Server, 1 Gig, 4 ports

PF13W4802T1 Windows 2000 Server, 2 Gig, 48 ports

PF13W964T1 Windows 2000 Server, 1 Gig, 96 ports

PF13W964T12G Windows 2000 Server, 2 Gig, 96 ports

PF13W12E1 Windows 2000 Server, 1 Gig, 120 ports

PF13W12004E1 Windows 2000 Server, 2 Gig, 120 ports

PF23W1GB Windows 2000 Server, 1 Gig, 28 ports

PF23W1GBE1 Windows 2000 Server, 1 Gig, 34 ports

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152

Telecom Software

Telecom software from Intel helps developers rapidly build robust, feature-rich, custom converged communications and

modular network solutions by managing the applications and the low-level hardware and software development tasks.

Intel®Dialogic®System Release software and software development kits (SDKs) include device drivers, application

programming interfaces (APIs), and utilities for Intel®telecom boards and related products. A variety of development tools—

including the Intel®NetMerge™CT Application Development Environment—help developers shorten development cycles

and deliver products to market faster.

Intel®NetMerge™Call Processing Software

Intel®NetMerge™Call Processing Software V6.0 is computer telephony (CT) call control server software capable of

connecting a wide range of telephone switches to a variety of data processing environments. The software’s client/server

technology supports industry-standard hardware, operating systems, network services, and call control programming

interfaces such as C, C++, Java*, TAPI, and ActiveX*, letting application developers easily integrate more intelligent call

control features into their existing business applications.

For original equipment manufacturers (OEMs), independent software vendors (ISVs), application developers, and

integrators looking to expand their reach into the contact center market segment, Intel NetMerge Call Processing Software

provides the ability to:

■Add telephony features to their customers' existing business applications

■Expand their businesses by providing current—and new—customers with ways to enhance their existing contact centers

■Integrate new features and functionality into legacy systems while maintaining their customer's investment in existing

equipment and infrastructure

■Support new communication environments such as IP with minimal changes to the application.

Intel®NetMerge™Call Processing Software Components

In addition to Intel NetMerge Call Processing Software, Intel offers several software components that can assist you in

developing or CTI-enabling business applications. Each of the following Intel NetMerge Call Processing Software

components provides complex functions from which computer-telephone integration (CTI) applications can be built. In

many cases, these components can be used to provide CTI capabilities in an existing business application without having

to CTI-enable the application.

■Intel®NetMerge™Enhanced SDK provides an intuitive higher-level telephony programming interface that shields

developers from many of the variations of different telephone switches.

■Intel®NetMerge™Call Information Manager manages call-related data as the call is routed through the enterprise.

■Intel®NetMerge™Call Monitoring Manager brings real-time call monitoring functionality to your applications.

The call monitoring manager simpliﬁes call monitoring for large numbers of telephony devices, easily integrating with

business applications.

■Intel®NetMerge™Call Routing Manager handles the technical aspects of call routing applications. Just add the business

logic.

■CSTA Switch Simulator emulate a CSTA-compliant switch environment, including devices such as telephones, trunks

and ACD queues.

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153

Call Processing Software Product Line Summary

The following table summarizes the Intel NetMerge Call Processing Software product features. For more information, refer to the product datasheet index at

http://www.intel.com/network/csp/products/ctconnect/family.htm

CALL PROCESSING SOFTWARE PRODUCT LINE

PRODUCT AND APPLICATIONS KEY FEATURES

Intel®NetMerge™Call Processing Software

■Customer relationship management (CRM)/e-CRM ■Runs under Windows NT*, Windows* 2000, and Windows* XP

■Call recording and quality management operating systems

■Contact center workforce management ■Includes client APIs for Microsoft Windows* 95, Windows* 98,

■Contact center Windows 2000, Windows NT*, Windows XP, Hewlett-Packard HP-UX*,

■Help desk and Compaq Tru64 UNIX*, and OpenVMS* operating systems

■Interactive voice response (IVR) ■Supports call control programming interfaces such as C, C++, Java*,

■Screen pop TAPI, and ActiveX*

■Support for Computer Supported Telecommunications Application

(CSTA) Phase III protocol

The following are the descriptions and Item Market Names for the latest releases.

ITEM MARKET NAME DESCRIPTION

CPSV6ENTWINPPK CPS V6.0 Enterprise License for Windows* PP key

CPSV6ENTWINUSB CPS V6.0 Enterprise License for Windows USB key

CPSV6FULLWINPPK CPS V6.0 Full License for Windows PP key

CPSV6FULLWINUSB CPS V6.0 Full License for Windows USB key

CPSV6LOWWINPPK CPS V6.0 Low License for Windows PP key

CPSV6LOWWINUSB CPS V6.0 Low License for Windows USB key

CPSV6MIDWINPPK CPS V6.0 Mid License for Windows PP key

CPSV6MIDWINUSB CPS V6.0 Mid License for Windows USB key

CPSV6MONWINPPK CPS V6.0 Monitor License for Windows PP key

CPSV6MONWINUSB CPS V6.0 Monitor License for Windows USB key

CPSV6PROUPG CPS V6.0 Product Upgrade License for Windows

CTCESDKSUBSRV Enhanced Software Development Kit

CTCCMPCALFKIT Version 3 for COMPUCALL, Full Sys Prod. for Windows NT*

CTCFULLSUNKIT CT Connect V5.0 Full Sys. for SOLARIS

CTCCIMUNLDVKIT Call Information MGR V3.5 Single Site, Unlimited Devices

CTCCIM25KIT Call Information MGR V3.5, Single Site, 25 devices

CTCCIM30MS25DEV Call Information MGR V3.5, Multisite, 25 devices

CTCCIMUPDKIT Call Information MGR V3.5 Update kit

CTCCIMUDMSITEKT Call Information MGR V3.5 Multisite, Unlimited Devices

CTCOMPLV30MONNT Version 3 for COMPUCALL, monitor for Windows NT

CTCCRMGR Call Routing Manager

CSTAASSIMFORNT CSTA Switch Simulator V1.0 Prod. for Windows NT

NCCSV1.1WINPPK Network Call Control Software V1.1 for Windows PP key

NCCSV1.1WINUSB Network Call Control Software V1.1 for Windows USB key

NECGATEWAYV20NT NEC Gateway* V2.0 Product for Windows NT

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154

Intel®NetMerge™Call Manager

Intel®NetMerge™Call Manager is software that works in conjunction with the Microsoft Speech Server*, providing

management and control over Intel®Dialogic®telephony resources. Through a set of application programming interface

(API) functions, the call manager enables applications built using Microsoft speech tools to control and monitor calls and

apply speech resources. The call manager sets up and maintains connections with voice browsers, making it possible to

monitor a device in order to make or receive calls, control events, distribute incoming calls across available ("ready")

browsers, and place outbound calls on available device resources. The call manager:

■Maps outbound call requests from a Speech Application Language Tag (SALT) interpreter to available channels on the

Intel Dialogic telephony board. The number of channels available depends on the type of telephony board you install.

■Maps call control signaling events from the switch into CSTA XML messages that can be understood by the

SALT interpreter.

■Maps CSTA XML messages from the SALT interpreter into telephony requests that can be sent to the switch.

■Handles media processing, such as recording audio.

Each Intel NetMerge Call Manager package includes a single CD containing:

■Intel NetMerge Call Manager Software

■Intel Dialogic System Release Software

■Global Call Software

■Runtime license for Intel®NetMerge™Call Manager and Intel®Dialogic®System Release software

Note: Customers do not have to purchase the Intel Dialogic System Release Software.

Also available is an entry-level, single-span bundle that includes one Intel®NetStructure™DMV480A-2T1-PCI Combined

Media Board and a 24-port Intel NetMerge Call Manager licensed software package. Packaging standard, off-the-shelf

DM3 telephony hardware with 24 ports of call manager software provides developers with a single span of telephony at

a reduced price.

Call Manager Software

The following table summarizes the Intel NetMerge Call Manager Software product features. For additional information, refer to the product datasheet index at

http://www.intel.com/network/csp/products/8661web.htm

CALL PROCESSING SOFTWARE PRODUCT LINE

PRODUCT AND APPLICATIONS KEY FEATURES

Intel®NetMerge™Call Manager is the enabling media and telephony ■Runs under Windows* 2003 Server

control component of these application areas: ■Supports Microsoft Speech Server* (SALT)

■Speech-enabling existing IVR and contact center applications ■Modular design

■Self-help Web services for customer service ■Manages low-level telephony events, messages, and media

■Customer relationship management ■Support a variety of telephony boards and protocols

The following are the descriptions and Item Market Names for the latest releases.

ITEM MARKET NAME DESCRIPTION

NMCALMGR4PTPKG Intel®Call Manager 4 port licensed software kit and other associated

Intel®software components

NMCALMGR16PTPKG Intel Call Manager 16 port licensed software kit and other associated

Intel software components

NMCALMGR24PTPKG Intel Call Manager 24 port licensed software kit and other associated

Intel software components

NMCALMGR48PTPKG Intel Call Manager 48 port licensed software kit and other associated

Intel software components

NMCALMGR96PTPKG Intel Call Manager 96 port licensed software kit and other associated

Intel software components

KDMVACM24PT Single-Span Bundle: Intel®DMV480A-2T1 board, Intel Call Manager

24 port license, and other associated Intel software components

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155

Development Tools

INTEL®NETMERGE™CT APPLICATION DEVELOPMENT ENVIRONMENT

The Intel®NetMerge™CT Application Development Environment is a set of development tools and runtime environments

that help shorten time-to-market and to revenue by helping developers build robust, portable computer telephony (CT)

applications quickly and easily.

This product reduces the need to write directly to a telephony device’s API in C or C++. Because of its underlying

architecture, Intel NetMerge CT Application Development Environment eliminates the need for developers to learn new

telephony hardware, APIs, and protocols. The Intel NetMerge CT Application Development Environment architecture

provides an abstraction layer that sits on top of telephony device APIs and performs low-level CT tasks, saving time that

developers can better use to focus on building innovative applications.

Intel NetMerge CT Application Development Environment offers the ﬂexibility of programming in different environments:

either a CT-speciﬁc environment or a Windows environment. Both interfaces provide access to the many beneﬁts of the

underlying architecture. The Intel NetMerge CT Application Development Environment’s application development (AD)

language is a CT-speciﬁc scripting language that includes a ﬂowcharter and a debugger. Also available are AD ActiveX*

objects, which incorporate directly into a Windows visual programming environment such as Visual Basic* and provide

CT-speciﬁc development functions. Intel®NetStructure™Host Media Processing software is now supported under Intel

NetMerge CT Application Development Environment Version 8.2 SP2.

CT Application Development Environment Product Line Summary

The following table summarizes the CT Application Development Environment product features. For more information, refer to the product datasheet index at

http://www.intel.com/network/csp/products/indx_aet.htm#tools. A complimentary evaluation version is available for download at

http://www.intel.com/network/csp/products/ctade/evalsw.htm.

CT APPLICATION DEVELOPMENT ENVIRONMENT PRODUCT LINE

APPLICATIONS KEY FEATURES

CT Application Development Environment ■Provides native support for speech recognition engines including

■Voice portal Microsoft* SAPI, Nuance*, Phillips* SpeechPearl*, and SpeechWorks*

■Voice messaging and uniﬁed messaging ■Designed/tested for Windows NT* and Windows* 2000 operating systems

■Voice-activated dialing (VAD) ■Transparent support for R4 and Global Call* APIs

■Text-to-speech e-mail ■Available for System Release 5.1

■Speech-enabled interactive voice response (IVR) ■Supports 15 languages including Cantonese, Dutch, English, French,

■Contact center Mandarin, and Spanish

■Customer relationship management (CRM) ■Supports regional language differences such as British and

■Fax-on-demand American English, and Latin American and Castilian Spanish

■Debit card

■Host Media Processing (supported under V8.2 SP2)

■Voice over IP—DM/IP boards

■ISDN—Basic Rate Interface (BRI)

CT Application Development Environment

The following are the descriptions and Item Market Names for the latest releases.

ITEM MARKET NAME DESCRIPTION

CTADE0PROGKEY 0 port, programmable key

CTADE0PRGKEYUSB 0 port, programmable key USB

CTADE2DEVKEY Version 8.2, 2-port development kit

CTADE2RT 2-port, Runtime hardware key

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156

ITEM MARKET NAME DESCRIPTION

CTADE4RT 4-port, RunTime hardware key

CTADE8RT 8-port, RunTime hardware key

CTADE12RT 12-port, RunTime hardware key

CTADE16RT 16-port, RunTime hardware key

CTADE24RT 24-port, RunTime hardware key

CTADE24DEVKEY Version 8.2, 24-port development kit

CTADE30RT 30-port, RunTime hardware key

CTADE30DEVKEY Version 8.2, 30-port development kit

CTADE48RT 48-port, RunTime hardware key

CTADE60RT 60-port, RunTime hardware key

CTADE64RT 64-port, RunTime hardware key

CTADE72RT 72-port, RunTime hardware key

CTADE96RT 96-port, RunTime hardware key

CTADE120RT 120-port, RunTime hardware key

CTADE128RT 128-port, RunTime hardware key

CTADE192RT 192-port, RunTime hardware key

CTADE240RT 240-port, RunTime hardware key

CTADE256RT 256-port, RunTime hardware key

CTADE2DEVKEYUSB Version 8.2, 2-port development kit USB

CTADE2RTUSB 2-port, RunTime hardware key USB

CTADE4RTUSB 4-port, RunTime hardware key USB

CTADE8RTUSB 8-port, RunTime hardware key USB

CTADE12RTUSB 12-port, RunTime hardware key USB

CTADE16RTUSB 16-port, RunTime hardware key USB

CTADE24RTUSB 24-port, RunTime hardware key USB

CTADE24DEVKEYUSB Version 8.2, 24-port development kit USB

CTADE30RTUSB 30-port, RunTime hardware key USB

CTADE30DEVKEYUSB Version 8.2, 30-port development kit USB

CTADE48RTUSB 48-port, RunTime hardware key USB

CTADE60RTUSB 60-port, RunTime hardware key USB

CTADE64RTUSB 64-port, RunTime hardware key USB

CTADE72RTUSB 72-port, RunTime hardware key USB

CTADE96RTUSB 96-port, RunTime hardware key USB

CTADE120RTUSB 120-port, RunTime hardware key USB

CTADE128RTUSB 128-port, RunTime hardware key USB

CTADE192RTUSB 192-port, RunTime hardware key USB

CTADE240RTUSB 240-port, RunTime hardware key USB

CTADE256RTUSB 256-port, RunTime hardware key USB

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157

Telecom System Software

INTEL®DIALOGIC®SYSTEM RELEASE SOFTWARE

Intel®Dialogic®System Release Software is a collection of software components used to build and operate solutions that

use the latest features of Intel®Dialogic®and Intel®NetStructure™board products. This includes host software,

downloadable ﬁrmware, software development tools (SDKs), and management utilities. The software has a high level of

interoperability and typically includes signiﬁcant infrastructure enhancements. It is designed for broad distribution with

a complete uninstall/install required.

Intel®Dialogic®System Release 6.0 PCI for Windows*

The Intel®Dialogic®System Release 6.0 PCI for Windows* (Intel®Dialogic®SR 6.0 PCI for Windows) enables higher-

density solutions with increased usability and ﬂexibility that use Intel®Dialogic®and Intel®NetStructure™boards. This

release supports new and enhanced telecom products from Intel, along with major enhancements to existing capabilities. This

release provides support for the new Intel®NetStructure™DMV600BTEP, DMV1200BTEP, and DMV3600BP combined

media boards and the Intel Dialogic DMV160LPHIZ high-impedance board.

Intel®Dialogic®Continuous Speech Processing Technology (which enables high-quality speech recognition), Global Call*

(which provides a uniform call control interface), and the IP Media Library (which controls media on IP devices), all have

new capabilities enabling more robust solutions. Intel®Dialogic®SR 6.0 PCI for Windows* adds support for the Windows

2003 operating system in addition to supporting the Windows XP and Windows 2000 operating systems.

Intel®Dialogic®System Release 6.0 CompactPCI* for Windows* and Linux*

The Intel®Dialogic®System Release 6.0 CompactPCI* for Windows and Linux* is a telco-ready release that includes

support for the high-density product line featuring the Intel®NetStructure™IPT boards, the Intel®NetStructure™

DMN160TEC Network Interface Board, and the Intel®NetStructure™DM/V-A combined media and high-density station

interface (HDSI) boards.

Intel Dialogic SR 6.0 CompactPCI supports high availability features such as peripheral hot swap (PHS) and warm

redundant system slot (RSS), full SNMP support, fault management (detection, diagnosis, isolation, recovery, and repair),

remote management, faster system download and initialization, and more. Intel®Dialogic®Continuous Speech Processing

(Intel®Dialogic®CSP) and conferencing software modules can be implemented and scaled to hundreds of speech—and audio

conferencing—enabled ports and still deliver high-quality speech recognition and conferencing effectively. By adding these

capabilities, Intel provides OEMs with the building blocks they need to deliver robust carrier-grade solutions that use less

hardware resources and space, resulting in decreased development, deployment, and operating costs.

Intel®Dialogic®System Release 5.1.1 FP1 for Windows*

The Intel®Dialogic®System Release 5.1.1 Feature Pack 1 for Windows (Intel®Dialogic®SR 5.1.1 FP1) adds support for

Windows XP Professional, as well as support for all products and features supported in previous Intel Dialogic SR 5.x

releases. New products supported include the new Intel®Dialogic®DMV160LP Combined Media Board, Intel®Dialogic®

CPI/400BRI PCI Fax Board, and the new Intel®Dialogic®DISI16R2, DISI24R2, and DISI32R2 switching boards. Intel

Dialogic SR 5.1.1 FP1 also includes newly-enhanced features for some current board products including the Intel®Dialogic®

DI0408LSA Switching Board and the new Intel®Dialogic®DI0408LSAR2 Switching Board.

Telecom System Software intel.com/design/network/products/telecom/index.htm

158

Intel®Dialogic®System Release 5.1.1 for Windows*

The Intel®Dialogic®System Release 5.1.1 for Windows (Intel®Dialogic®SR 5.1.1) includes supports for the “A” series

quad-pan and resource boards, dual-span boards, the high impedance (HiZ) boards from Intel, and the Intel®

NetStructure™High-Density Station Interface boards. All Intel®Dialogic®SR 5.0 and Intel®Dialogic®SR 5.01 supported

products and features are also supported in Intel®Dialogic®SR 5.1.1.

Intel®Dialogic®System Release 5.1 Feature Pack 1 for Linux*

The Intel®Dialogic®System Release 5.1 Feature Pack 1 for Linux (Intel®Dialogic®SR 5.1 FP1 for Linux) supports Red

Hat* 7.2 and 7.3 and introduces support for several new features and the new Intel®Dialogic®D/4PCIU voice boards.

Intel®Dialogic®SR 5.1 FP1 enhances the IP capabilities by adding support for host-based call control on DM/IP boards,

adding IP Media Library support of RFC 2833 and T.38 fax, and Global Call API support for H.323 and SIP protocol stacks.

In addition to supporting all previous features and products from Intel Dialogic SR 5.1 for Linux, this release includes

support for universal PCI versions of the DM/F and DM/VF boards.

Intel®Dialogic®System Release 5.1 for Linux*

The Intel®Dialogic®System Release 5.1 for Linux (Intel Dialogic SR 5.1) supports the Red Hat 7.1 and 7.2 operating

systems, the high-density DM3-based boards, and the entire portfolio of communications boards and all the features

found in the Intel Dialogic System Release 5.0 and Intel Dialogic System Release 5.01.

Highlighted in this release are the Intel®Dialogic®DM/V-A boards with enhanced voice processing features and protocols,

the DM/IP (100BaseT) boards, and the Intel®NetStructure™DM/VF integrated T-1/E-1 voice and fax processing products.

High availability and high-performance features required for carrier-grade telco, service provider, and large enterprise

solutions are also included. Intel Dialogic SR 5.1 also supports lower-density communications building blocks from Intel on

Linux platforms for building cost-effective solutions such as interactive voice response (IVR) and messaging for cost-

sensitive market segments.

Telcos and high-end service providers require highly available systems to sustain their revenue goals and to minimize their

total cost of ownership. Intel Dialogic SR 5.1 for Linux enables solutions using the CompactPCI form factor supporting

peripheral hot-swap, SNMP support, on-demand diagnostics, single-board start/stop operation, ﬁrmware tracing, faster

system download and initialization, and more. Intel Dialogic Continuous Speech Processing Technology and conferencing

software modules can be implemented and scaled to hundreds of speech- and audio-conferencing-enabled ports and still

deliver high-quality speech recognition and effective conferencing. By adding these capabilities, Intel provides OEMs with

the building blocks they need to deliver robust, carrier-grade solutions that use fewer hardware resources and less space,

resulting in decreased development, deployment, and operating costs.

intel.com/design/network/products/telecom/index.htm Telecom System Software

159

System Release Software Product Line Summary

The following table summarizes the system release software product features. For additional information, refer to the product datasheet index at

http://www.intel.com/network/csp/products/indx_aet.htm#srs

SYSTEM RELEASE SOFTWARE

PRODUCT KEY FEATURES

Intel®Dialogic®System Release 6.0 PCI ■Runs under Windows* 2003, Windows* XP, and Windows* 2000

for Windows* ■Supports the Intel®NetStructure™DMV600BTEP, DMV1200BTEP, and

DMV3600BP combined media boards

■Supports the Intel Dialogic DMV160LPHIZ high-impedance board

■Echo cancellation to 64 mSec support on Intel NetStructure combined

media boards

■Global Call* API support for Call Progress Analysis, call transfer, call

hold and retrieve on DM3 boards, and access to SIP message information

ﬁelds

■IP Media Library API support for RFC 2833 and T.38 fax

■Learn Mode and Tone Set API support on Intel NetStructure boards

■Enhancements to conﬁguration, administration, and diagnostic software

make it easier to install, conﬁgure, and manage

Intel®Dialogic®System Release 6.0 ■Runs under Windows 2000

CompactPCI* for Windows ■Supports standards-based basic peripheral hot-swap (PHS)—PICMG*

2.12 and warm redundant system slot (RSS)

■Increased fault management (FM) for detection, diagnosis, isolation,

recovery, and repair

■SNMP support that also includes standard DS1 and ISDN MIB (2495)

and MIB-II

■Clocking API and daemon provides clock management (fallback)

eliminating system failure from clock faults

■Command line interface (CLI) for the operation of all boards (start, stop,

remove, and diagnose)

■Locking CompactPCI board ejectors guards against accidental board

removal

Intel®Dialogic®System Release 6.0 ■Runs under Red Hat* 7.3 Linux operating system, offering quick

CompactPCI for Linux* out-of-the-box installation and conﬁguration

■Same features and products supported as V6.0 for Windows

Intel®Dialogic®System Release 5.1.1 FP1 ■Runs under Windows NT*, Windows 2000, and Windows XP operating

for Windows systems

■Same products and features as Intel Dialogic SR 5.1.1 for Windows,

plus additional product support and features

■New products supported—Intel Dialogic DMV160LP Combined Media

Board, Intel Dialogic CPi/400-BRI PCI Fax Board, and Rev 2 DI products

Intel®Dialogic®System Release 5.1.1 ■Runs under Windows NT and Windows 2000 operating systems

for Windows ■Same products and features as Intel Dialogic SR 5.1 for Windows,

plus additional product support and features

■Enhanced IP Link, expanded fax support, improved high availability

Intel®Dialogic®System Release 5.1 FP1 ■Runs under Red Hat 7.2 and 7.23 operating systems

for Linux ■Supports the Intel Dialogic D/4PCIU voice board

■Host-based H.323 and SIP IP call control

■Universal PCI versions of Intel NetStructure DM/F and DM/VF boards

■Global Call API support for H.323 and SIP Protocol stacks

■IP Media Library support for RFC 2833 and T.38 fax

Telecom System Software intel.com/design/network/products/telecom/index.htm

160

SYSTEM RELEASE SOFTWARE (continued)

PRODUCT KEY FEATURES

Intel®Dialogic®System Release 5.1 ■Runs under Red Hat* 7.1 and 7.2 operating systems

for Linux* ■Quad-span and resource “A” series boards can support up to 120 channels

of conferencing in a single slot

■Dual-span, quad-span, and resource “A” series boards provide up to

120 channels of continuous speech processing, conferencing, or other

media processing features

■HDSI boards provide support for up to 120 analog station devices

■DM3 voice, fax, and network interface in a single PCI slot offering

24 (T-1) or 30 (E-1) universal ports of voice, tone, fax processing, and

network interface available on any call at any time in a 1:1:1:1 ratio

■DM/IP boards let VoIP calls be connected from the platform to the SCbus

■Increased high-availability features for carrier-grade solutions, including

CompactPCI* peripheral hot-swap (like-for-like replacement)

■Interactive diagnostics for DM3 technology (POST on-demand)

■Detects and repairs ﬁrmware faults

■Improved system initialization time

System Release Software

The following are the descriptions and Item Market Names for the latest releases.

ITEM MARKET NAME DESCRIPTION

SR511WIN Intel®Dialogic®System Release 5.1.1 for Windows*

SR511WINSP1 Intel®Dialogic®System Release 5.1.1 Service Pack for Windows

SR511WINFP1 Intel®Dialogic®System Release 5.1.1 Feature Pack 1 for Windows

SR51LINUX Intel®Dialogic®System Release 5.1 for Linux*

SR51LINUXSP1 Intel®Dialogic®System Release 5.1 Service Pack for Linux

SR51LINUXFP1 Intel®Dialogic®System Release 5.1 Feature Pack 1 for Linux

SR60CPCIWIN Intel®Dialogic®System Release 6.0 for CompactPCI* for Windows

SR60CPCILINUX Intel®Dialogic®System Release 6.0 for CompactPCI for Linux

SR60PCIWIN Intel®Dialogic®System Release 6.0 PCI for Windows

intel.com/design/network/products/telecom/index.htm Host Media Processing Software

161

Host Media Processing Software

INTEL®NETSTRUCTURE™HOST MEDIA PROCESSING SOFTWARE RELEASE

1.1 FEATURE PACK 1 FOR THE WINDOWS* OPERATING SYSTEM

Intel®NetStructure™Host Media Processing (Intel®NetStructure™HMP) Software performs media processing tasks on

general-purpose servers based on Intel®architecture (IA) without the use of specialized hardware. The software provides

media services that can be used to build ﬂexible, scalable, and cost-effective next-generation IP media servers.

When installed on a system, the software looks to the customer application like an Intel®telecom board with DM3

architecture, but all media processing takes place on the host processor. To help customers accelerate their time-to-market and

migrate their existing applications to IP, the software also supports two direct APIs: R4 for media processing and Global

Call* for call control. Release 1.1 uses a built-in network interface card (NIC) to provide IP connectivity. It also supports the

industry-standard H.323 and Session Initiation Protocol (SIP) protocols for call control, and call transfers using the H.450.2

supplementary services protocol.

Host Media Processing Software Product Summary

The following table summarizes the Host Media Processing product features. For additional information, refer to the product datasheet index at

http://www.intel.com/network/csp/products/8762web.htm.

HOST MEDIA PROCESSING SOFTWARE PRODUCT LINE

PRODUCT AND APPLICATIONS KEY FEATURES

Intel®NetStructure™Host Media Processing Software ■Supports computing platforms with Intel®Celeron®, Intel®Pentium®III,

Release 1.1 & Release1.1 Feature Pack 1 Intel®Pentium®4, and Intel®Xeon™processors with ability to

■Voice mail and messaging scale up to 120 media processing channels per system

■IVR and announcements ■Compliant with the ITU H.323 speciﬁcation for call control

■Conferencing server ■Supports voice record/play with automatic gain control and volume

■Uniﬁed messaging control in a variety of ﬁle formats including OKI ADPCM, linear A-law

and µ-law PCM, and Wave

■Supports streaming media over RTP using a G.711 voice coder with

choice of packet size (10 ms, 20 ms, and 30 ms) and RFC-2833 DTMF

packets

■Uses built-in Ethernet card for network connectivity

■Compliant with the ITU H.323 and H.450.2 speciﬁcations and IETF

SIP for call control

■IP multicast support

■Provides a mechanism for integration with any third-party call control

or connection control over IP stack

■Supports streaming media over RTP using the G.711, G.723.a, G.729a,

G.729b voice coders

■Supports the Global Call* and R4 APIs

■Includes administration tools such as conﬁguration manager and

SNMP software

■Supports voice record/play with AGC control and volume control

■Detects and generates standard in-band DTMF and user-deﬁned tones

■Full conferencing features include scalability with a maximum of

120 parties per system

■Quality of service (QoS) threshold alarms and packet loss reduction

■T.38 fax termination support

■Supports Intel®Dialogic®Continuous Speech Processing Technology

■Supports Windows* 2000, XP, 2003 Server operating systems

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162

Intel®NetStructure™Host Media Processing Software Release 1.1

for the Windows* Operating System

The following are the Item Market Names and descriptions for the latest releases.

ITEM MARKET NAME DESCRIPTION

DMIPS10C11W Conferencing—Includes advanced features such as coach/pupil mode,

tone clamping, and active talker notiﬁcation (one conferencing port)

DMIPS10E11W Enhanced RTP—Adds the capability of streaming voice over RTP using

the G.723.1, G.729a, and G.729b coders to the RTP G.711 resource. Add

on top of the RTP G.711 resource (one port of transcoding)

DMIPS10F11W T.38 fax termination—T.38 fax termination (over UDP) (one port of fax)

DMIPS10I11W IP call control—Provides call control stacks for the H.323 with H.450.2

supplementary services, and SIP protocols, with Global Call* API support.

Can only be used together with the RTP G.711 resource (one port of IP

call control)

DMIPS10R11W RTP G.711—Provides the capability of streaming digitized voice over

RTP using the G.711 coder with 10 ms, 20 ms, and 30 ms frames. Required

for each RTP session (one RTP stream)

DMIPS10S11W Speech integration—Integrates host media processing with speech engines

for ASR and TTS support by using the continuous speech processing APIs.

Add on top of the voice resource (one port of speech)

DMIPS10V11W Voice—Play with volume control, record with AGC, DTMF, user-deﬁned

tone detection and generation, including RFC 2833 and H.245 UII

(one port of voice)

developer.intel.com/design/bridge Bridge Products

163

TRANSPARENT PCI-TO-PCI BRIDGES

Intel’s family of second-generation Transparent PCI-to-PCI bridge chips provides essential building blocks for extending

PCI bus capabilities and delivering higher performance for data-intensive applications. With their secondary PCI buses,

the Intel®2115x family enables designers to increase the number of supported PCI slots in x86, Intel®Pentium®processor,

PowerPC* Alpha*, and other system architectures, and to design multi-component PCI adapter cards with an independent

bus on the card.

For improved performance, Intel’s second-generation Transparent PCI-to-PCI bridges are designed for compliance with

2.3 of the PCI Local Bus Speciﬁcation. In addition, these second-generation bridge products feature support for delayed

transactions and have deeper buffers than earlier-generation bridges designed for PCI Revision 2.0. They are compliant with

the Advanced Conﬁguration Power Interface (ACPI) and PCI Bus Power Management Speciﬁcation.

FEATURES

Proven PCI technology for extending PCI bus capabilities

Compliant with ACPI (Advanced Conﬁguration Power Interface) the Power-Management Interface speciﬁcation

Compliant with PCI (Peripheral Component Interface Speciﬁcation) Rev. 2.3

Increases the number of PCI slots that can be supported in a system and multi-device and multi-function add-in card designs

Available in 33 MHz and 66 MHz and 32-bit or 64-bit bus architectures

Support for delayed transactions and an advanced buffer architecture

JTAG interface and general I/O pins for embedded device designs (see line card)

64-bit PCI bus provides the high bandwidth manufacturers need to deliver high-performance servers and workstations for data-intensive applications

TRANSPARENT PCI-TO-PCI BRIDGES

BASE MANUFACTURER MAT’L. MASTER PROCESS PRIMARY INTERFACE SECONDARY INTERFACE OTHER PRODUCT FEATURES

PART NUMBER REVISION PART NUMBER PART NUMBER TECH SPEED PCI BUS SPEED PCI BUS JTAG GPIO PACKAGE POWER MGMT

21152 BB 835912 854 33 MHz 32 bit 33 MHz 32 bit No No 160 PQFP Yes

21154 AE 821305 854 33 MHz 64 bit 33 MHz 64 bit Yes Yes 304 PQFP Yes

BE 821308 854 66 MHz 64 bit 66 MHz 64 bit Yes Yes 304 PQFP Yes

Process Technology Key: 854

Intel®0.35 micron (854.6)

Customer Technical Questions: 1-800-628-8686

support@mailbox.intel.com

Bridge Products

Bridge Products developer.intel.com/design/bridge

164

PCI-X Bridge Products

TRANSPARENT PCI-X BRIDGE

Intel’s newest member of the PCI discrete bridge chip family is a transparent bridge for the latest, eXtended version of

PCI architecture—PCI-X. PCI-X provides signiﬁcantly increased I/O throughput over standard 33MHz and 66MHz PCI

modes. Operating at a maximum 133MHz clock frequency, the 64-bit BW31154 provides throughput of up to 1GB/sec—

twice the max throughput of 64-bit, 66MHz PCI. It also runs at 66MHz and 100MHz PCI-X frequencies, and also can

be operated seamlessly in standard 33MHz or 66MHz PCI speeds for complete compatibility with legacy PCI devices and

frequency isolated systems or modules. With the 31154’s 10 secondary PCI clocks and other advanced, second-generation

PCI-X bridge features, design engineers can readily develop high slot and/or high-density device attach applications in PCI

or cPCI form factors for motherboards, add-in cards, backplanes or embedded platforms.

For improved performance, Intel’s Transparent PCI-X bridge is designed for compliance with 1.0b of the PCI-X Local Bus

Speciﬁcation. In addition, the highly capable and ﬂexible 31154 features a dynamic 8KB transaction buffer, 5V tolerance for

legacy PCI devices, an opaque memory mode (for semi-transparent operation), cPCI hot swap capability and asynchronous

clock frequency support.

FEATURES

Latest PCI-X technology for extending PCI and PCI-X bus capabilities

Compliant with ACPI (Advanced Conﬁguration Power Interface) the Power-Management Interface speciﬁcation

Compliant with the PCI SIG’s PCI-X v 1.0b speciﬁcation

Increases the number of PCI slots that can be supported in a system or backplane, as well as increasing the number of devices (multi-function and/or

multi-device) in add-in cards and HBAs

64-bit bridge supporting 33 MHz and 66 MHz PCI; and 66MHz, 100MHz and 133MHz PCI-X architectures and speeds; in any arrangement between

primary and secondary bus segments

Support for PCI-X split transaction protocol and asynchronous clock frequency (25MHz – 133MHz)

JTAG interface and general I/O pins for embedded device designs (see line card)

64-bit PCI/PCI-X bus provides the high-bandwidth hardware vendors need for high-performance enterprise-class desktops and servers, embedded

platforms, backplanes and add-in cards.

TRANSPARENT PCI-TO-PCI BRIDGES

BASE MANUFACTURER MAT’L. MASTER PROCESS PRIMARY INTERFACE SECONDARY INTERFACE OTHER PRODUCT FEATURES

PART NUMBER REVISION PART NUMBER PART NUMBER TECH SPEED PCI BUS SPEED PCI BUS JTAG GPIO PACKAGE POWER MGMT

BW31154 857381 859 133MHz 64-bit 133MHz 64-bit Yes Yes 421BGA Yes

Process Technology Key: 859

0.18 micron

developer.intel.com/design/bridge Bridge Products

165

NON-TRANSPARENT PCI-TO-PCI BRIDGES

Intel’s 21555 non-transparent PCI-to-PCI bridge chips enable add-in card vendors to deliver high-performance, intelligent

option cards and embedded products that previously were not possible. Designed speciﬁcally for applications where a

processor is used behind a PCI-to-PCI bridge, the chip provides a clean architecture for creating a product with multiple

processor domains.

The non-transparent PCI-to-PCI bridge chip provides designers of intelligent controllers and embedded systems with a

solution capable of resolving resource conﬂicts between a PCI-based host system and a PCI-based subsystem. This gives a

local processor maximum ﬂexibility in mapping and managing subsystem resources. In addition, this non-transparent bridge

product is fully compliant with Revision 2.3 of the PCI speciﬁcation including delayed transactions. It also features cPCI hot

swap capability.

FEATURES

Independent address spaces and asynchronous clocks deliver unparalleled application ﬂexibility

64-bit primary and secondary bus interfaces deliver high performance for data-intensive applications

Compliant with PCI (Peripheral Component Interface Speciﬁcation) Rev. 2.3

Secondary bus arbitration support for up to nine bus master devices

Evaluation Design Kit speeds time-to-market

Available in 33 MHz and 66 MHz bus speed

NON-TRANSPARENT PCI-TO-PCI BRIDGES

BASE MANUFACTURER MAT’L. MASTER PROCESS PRIMARY INTERFACE SECONDARY INTERFACE OTHER PRODUCT FEATURES

PART NUMBER REVISION PART NUMBER PART NUMBER TECH SPEED PCI BUS SPEED PCI BUS JTAG GPIO PACKAGE POWER MGMT

21555 A Intel 848191 854 33 MHz 64 bit 33 MHz 64 bit Yes Yes 304 PBGA Yes

BB Intel 848192 854 66 MHz 64 bit 66 MHz 64 bit Yes Yes 304 PBGA Yes

Process Technology Key: 854

Intel®0.35 micron (854.6)

Customer Technical Questions: 1-800-628-8686

support@mailbox.intel.com

Bridge Products developer.intel.com/design/bridge

166

PCI-X SERIAL ATA HOST DISK CONTROLLER

Intel’s 31244 PCI-X Serial ATA Host Disk controller is a 4-port, 1.5Gbps Host Controller backwards compatible with

Parallel ATA software and drivers. Using the 31244 host Serial ATA controller, system and storage vendors can provide

high-performance, low-cost disk controller and RAID 0, 1 and 10 capability on motherboards, storage/RAID cards or

external disk/storage subsystems for DAS, SAN or NAS solutions. Designed with features such as Direct Port Access

(independent, concurrent port control) and dedicated DMA channel for each port, the 31244 PCI-X Serial ATA host disk

controller takes the inherent advantages of PCI-X and Serial ATA 150MBs (per port) architectures even further with

sophisticated features and enterprise extensions to SATA I—such as LED, enhanced voltage, drive hot plug and powerful

Serial ATA (native) Command Queuing support. In addition, the 31244 controller is backwards compatible with PCI 33MHz

and 66MHz speeds (32-bit or 64-bit bus modes), as well as supporting PCI-X 66MHz, 100MHz and 133MHz in 64-bit mode.

FEATURES

Four Serial ATA channels/ports at 1.5Gbps (150MBs) each

PCI-X 1.0a-compliant 64-bit bus width running at 133, 100 or 66MHz speeds; backwards compatible with 32-bit or 64-bit PCI v 2.3 running

at 33 or 66MHz speeds

Direct Port Access (DPA mode or Master/Master) control over each Serial ATA port

Dedicated DMA channel for each Serial ATA port

Parallel ATA mode (Master/Slave) support

Serial ATA Command Queuing with support for up to 32 queue pairs

RAID 0, 1, 10 (including boot support and pre-O/S utility)

Supports hot-plug Serial ATA hard disk drives

Activity LED support for each driver, or one LED for the system

Enhanced voltage support for storage/HDD backplane applications

DPA Mode software drivers for Windows* 2000, Windows XP and Windows CE .NET; and Linux* Redhat 8.0

NOTE: In addition, a Host Bus Adapter (HBA) card and Customer Reference Board (CRB) are available.

developer.intel.com/design/mcs96 Microcontrollers

167

A POWERFUL FOUNDATION

The Intel®MCS®96 microcontroller family of products are popular for 16-bit embedded microcontrollers. The 8XC196

products are found in a variety of embedded applications. The high-performance register-to-register architecture is well

suited for complex real-time control applications such as industrial controllers, automation, printers, pattern recognition and

motor control. Our broad portfolio of 8XC196 microcontroller products has been designed to meet your varying peripheral,

memory size, addressability, serial communications and performance requirements.

The 8XC196 family shares a common core architecture which is register based. This register-based architecture eliminates

the accumulator bottleneck seen in most other microcontroller families and enables fast context switching. All devices have

bit, byte, word and some 32-bit operations. The table below summarizes the capture and generation of high-speed signals on

the HSIO and EPA.

OPERATION 16 MHz 20 MHz 25 MHz 50 MHz

HSI (High-speed input) 1.125 us 900 ns

HSO (High-speed output) 1 us 800 ns

EPA (Event processor array) 250 ns 200 ns 160 ns 80 ns

The 8XC196 Bus Controller features programmable wait-state generation, 8- or 16-bit bus width, and features a HOLD/

HLDA protocol for multiprocessor applications. The 8XC196NP/NU have dynamically selectable multiplexed/demultiplexed

bus and a chip select unit.

The MCS 96 microcontroller product family has three distinct product lines. The most recent products form the EPA

(Event Processor Array) family. This family of devices has the advanced peripherals which include a ﬂexible input/output

system and the EPA module itself. The HSIO family consists of devices that have the High-Speed Input/Output subsystem.

The Motor Control family is comprised of devices that support motor control applications. This last family also uses the EPA

system for I/O control.

The majority of the MCS96 microcontrollers product family is offered with on-chip EPROM (size vary) and some have

on-chip CAN 2.0. The advanced 88CO196EC microcontroller offers high level of integration with on chip Flash (256Kbyte)

and CAN 2.0.

MCS

96 Microcontrollers

Microcontrollers developer.intel.com/design/mcs96

168

FEATURES COMMON TO ALL MCS®96 PRODUCTS BENEFITS

16-bit CPU High performance. Up to 50 MHz

On-chip memory Low cost. Cost-effective solution

allows more efﬁcient use of memory (no accumulator bottleneck for

any operations/computations)

Unlimited usage. Minimum of 232 registers can be directly addressed

at any time

Three operand instructions Create efﬁcient code. Reduces data memory usage

Bus controller features programmable wait-state generation and Economical. Efﬁcient usage of wide variety of memory and 8- or 16-bit

bus widths peripheral devices

Flat addressability of large register ﬁles Fewer barriers. Avoids artiﬁcial limitation and barriers of segmented ﬁles

Three distinct product lines: Advanced. Peripherals include conﬁgurable input/output ports and

■event processor array (EPA) modular event processor array structure

■high-speed input/output (HSIO) Speed. Devices with high-speed input FIFO and output system

■motion control (MC) Waveform. Uses waveform generator and event processor array

system for input/output

MCS®96 Microcontroller Family—High-Speed Input/Output

Intel designed the HSIO family for applications that require high-speed input and output and closed-loop event control.

These devices can lock events in the high-speed output unit (CAM), which allows you to repeat events with no software

overhead. The HSIO family comprises the 8X196KB, 8XC196KC, 8XC196KD and 88CO196EC.

The CHMOS version (denoted with a “C,” i.e., 8XC196) is code- and peripheral-compatible with the obsolete NMOS

products. The HSIO allows interrupt servicing in the background with minimal CPU overhead and reduces external

components for temperature control, strain gauge and motion detection, providing an attractive solution for applications

that need accurate timing for multiple events.

FEATURES FOUND ON HSIO PRODUCTS BENEFITS

RAM and up to 32K internal OTPROM

1.4 uSec 16x16 multiply, 2.4 uSec 32/16 divide Speed. Good math performance for fast and compact calculation loops

8-channel, 8- or 10-bit A/D converter Fewer components. Reduces external components requirement by

integrating A/D functionality on chip

8- or 16-bit external bus Performance. Optimal memory interfacing

Full-duplex serial port Tracking. Versatile event tracking

Pulse-width-modulated output Less overhead. Reduces processor overhead

High-speed I/O subsystem Timing. For accurate timing of multiple events

Peripheral transition server on KC and KD Less overhead. Reduces CPU overhead during interrupt servicing

Integrated Flash and CAN on 88CO196EC Integration. Attractive solution where CAN and/or Flash memory is

required, enabling easy upgrade for current 96 users based on the same

architecture

developer.intel.com/design/mcs96 Microcontrollers

169

MCS®96 Microcontroller Family—Motor Control

Intel’s Motor Control family provides efﬁcient three-phase AC induction motors, DC brushless motors and inverter

applications. The product line features the 8XC196MC, 8XC196MD and 8XC196MH. The 8XC196MC/MD/MH have a

unique three-phase waveform generator that enables precise and efﬁcient motor control. All include standard microcontroller

peripherals so the same chip can also handle additional functions such as front-panel control. These products are ideal

single-chip solutions for reducing system cost. Motor control can also be possible through software using 88CO196EC

microcontroller.

FEATURES FOUND ON MC PRODUCTS BENEFITS

Three-phase PWM waveform generator Ease of operation. Simpliﬁes software and hardware requirements

Up to 12-channel EPA Timing. High-resolution timing of multiple events

Peripheral transaction server (PTS) Less overhead. Reduces CPU overhead required to service interrupts

Up to 14-channel A/D converter Efﬁciency. Monitors multiple analog signals

16-bit watchdog timer Reliability. Increases reliability of system

488 MC/MD and 744 MH byte register ﬁle, high-performance CPU Speed. Provides fast context switching, fast instruction execution

On-chip ROM/OTPROM 16K MC/MD and 32K MH Storage. Available for code and data storage

Frequency generator (MD only) Applications. For infrared (remote) functionality

Two serial ports (MH only) Applications. For increased communication capability

MCS®96 Microcontroller Family—Event Processor Array (EPA)

The EPA family of devices is ideal for complex, real-time control applications that require a ﬂexible input/output system

and yield a ﬁner granularity in timing measurement. EPA products include the 8XC196NT, 8XC196NP, 80C196NU and

80C196EA is the newest addition to this family, operating at 40 MHz and is integrated with a large number of peripherals and

4K of data RAM. The 80C196EA’s demultiplexed address/data bus with three chip select outputs make it easier to design

low-cost memory solutions. The 88CO196EC is the newest addition to this family, operating at 40MHz and is highly

integrated with on-chip 256K Flash and CAN 2.0.

FEATURES FOUND ON EPA PRODUCTS BENEFITS

High-speed capture/compare EPA channels Precision. Precision event capture, output compare

Peripheral transaction server Less overhead. Reduces system overhead to service interrupts

Optional ROM on chip when codes are stable; NP is ROM or Solutions. Provides single-chip solutions

CPU-only, NU is CPU-only

Up to 1,000-byte-register RAM Performance. Fast data manipulation with register space

Up to 31 prioritized interrupt sources Flexibility. Handles a variety of commands

NP/NU feature dynamic demux/mux address/data bus and chip Performance. Fast external memory access using commodity or

unit with six chip select pins; NP supports 3V operation low-cost memory

devices; allows for glueless memory interface; NU provides a clock-

doubled performance increase over all MCS®96 microcontroller devices

and approximately twice the performance of the C196NP

Integrated Flash and CAN on 88CO196EC Integration. Attractive solution where can and/or Flash memory is

required, enabling easy upgrade for current 96 users based on the same

architecture

MCS®96 Microcontroller Family—Integrated CAN 2.0 88CO196EC Microcontroller

The Intel®88CO196EC contains a highly integrated set of functions, including the CAN2.0 in-vehicle networking

protocol, plus an SDU, stack monitor, 16-channel A/D converter, and an enhanced EPA. With the SDU, designers can set

a hardware breakpoint for debugging purposes, plus read and write code RAM as well as program the Flash memory through

a high-speed, dedicated serial link. The stack monitor detects stack overﬂow and underﬂow conditions and invokes a non-

maskable interrupt if the stack pointer crosses a user deﬁned boundary. The enhanced EPA, capable of transmitting and

receiving Pulse Width Modulation (PWM) signals, handles high-speed input and output events with reduced overhead and

trigger A/D conversions. The 16-channel, 8- or 10-bit A/D converter, with an individual register for each channel, supports

an auto-scan mode and consumes no CPU overhead.

MCS®296 Microcontroller—Advanced 16-Bit Controller with DSP Capability

Intel’s MCS®296 microcontroller is the latest addition to the Intel MCS 96 microcontroller family. The 80296SA is

performance enhanced compared to the 8XC196NP and 8XC196NU controllers. The 80296SA is designed to be binary-

code compatible with the 8XC196NP/NU products, and can be directly dropped into an 8XC196NP/NU socket with an

immediate boost to system performance.

The 80296SA exhibits improved math performance over previous architectures making it suitable for embedded digital

signal processing and feedback control systems. The 80296SA can perform at 12.5 DSP MIPS and 16 general-purpose

MIPS. The 80296SA has 512 bytes of register RAM and 2 Kbytes of code/data RAM and utilizes the same peripherals as

the 8XC196NP/NU. Additionally, like the 8XC196NU, the 80296SA includes a phase-lock loop. With this peripheral, an

external clock drives the device at one-half or one-quarter the maximum internal clock frequency allowing the system to use

low-frequency external clock or oscillators while maintaining the maximum internal operating frequency. Enhancements to

the chip select unit, the interrupts, and the timers are also implemented. The MCS 96 windowing scheme was enhanced in the

80296SA to include the windowing of some external memory locations for direct addressing, thus improving the overall

efﬁciency of external memory instructions.

FEATURES BENEFITS

50 MHz Operation Speed. Higher performance

Binary-code compatible with Intel’s 8XC196NU/NP Cost. Protect existing software investment microcontrollers

Pipelined architecture/reduced execution states Faster. Up to ﬁve times faster than the 8XC196KC20

6 Mbyte of address space Memory headroom. More memory headroom for high-level language

compilation

2 Kbytes code/data RAM High-speed code memory. More space to store data

40-bit accumulator Added signal processing capability. Multiply and accumulate executes

in 80 ns using 40-bit hardware accumulator. Useful in signal processing

and feedback control system

512 bytes register RAM Fast data manipulation. Within register space

MCS®296 Microcontroller Development Tools

The Intel MCS 296 controller is complemented by an extensive set of hardware and software tools from Intel and leading

third-party development tool vendors. Software development is supported by ANSI C compiler, assembler, linker/locator,

debugger, and simulators from Tasking, IAR, and ChipTools. Hardware design and debug is supported by In-Circuit

Emulators from Nohau*.

Product evaluation is facilitated using Intel’s 296SA Eval Kit. This kit includes a board, debug monitor, and evaluation

copies of third-party software development tools to facilitate code development and execution.

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MCS®96 Microcontroller Development Tools

The Intel MCS 96 microcontroller product family is supported by a variety of development tools, and evaluation boards.

Complete sets of development tools and C compilers are available from third-party vendors. Third-party vendors also

support development tools for in-circuit emulation. For more information about development tools support, contact your Intel

sales representative or visit the Web site at: http://appzone.intel.com/toolcatalog/

MCS®96 Microcontroller family—CAN Product family

Intel has developed a complete product family that supports the Controller Area Network (CAN) protocol. Intel offers

the CAN capability as either a standalone communications controller or integrated onto high-performance 16-bit

Microcontroller. CAN is a development of Robert Bosch GmbH and was designed speciﬁcally for high-speed in-vehicle

networking. CAN is widely accepted in automotive applications and supports high-speed networking standards such as

DeviceNet* and SDS*, that are used in industrial control and factory automation. CAN utilizes a multi-master bus

conﬁguration for the transfer of communication objects between nodes of the network.

All members of the Intel®CAN product family utilize the features of the 82527-standalone communications controller

and are software compatible. They all support the standard and extended message identiﬁer CAN speciﬁcation 2.0 part B.

CAN—Standalone Communications Controller—82527

The 82527 serial communications controller, which is a joint development of Robert Bosch GmbH and the Intel

Corporation, is a highly integrated device that performs serial communication according to the CAN protocol. It features

advanced message ﬁltering, I/O port reconstruction, and storage for 15 message objects and multiple CPU interface options.

FEATURES BENEFITS

CAN speciﬁcation 2.0 Capable of transmitting, receiving, and performing message ﬁltering on

extended message frames

Programmable global mask Allows users to globally mask any identiﬁer bits of the incoming message.

Two 8-bit bidirectional I/O Ports Two 8-bit I/O ports for communication with external peripherals/CPU,

allowing two-way communications

Flexible CPU Interface Ability to directly interface with many different CPUs

Programmable message objects of 8-byte data length Message object can be conﬁgured as either transmit or receive

CAN—16-bit Microcontroller with Integrated CAN

Intel has combined the 82527 CAN protocol controller with the industry-standard MCS®96 16-bit Microcontroller

architecture on one chip. The result is a family of integrated Microcontrollers well suited for a variety or real-time event

control applications that require high-speed networking. Integrating CAN on the CPU decreases printed circuit board area,

allows faster access to CAN messages and reduces overall system cost. All members of the MCS 96 family have bit, byte,

word and some 32-bit operations. The 87C196CA and 87C196CB microcontrollers with integrated CAN provide an upgrade

path for the members of the 87C196Kx/87C196Jx families.

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16-bit Microcontroller with Integrated CAN-TN87C196CA

TN87C196CA has a similar memory and peripheral set similar to the 87C196JT including 32Kbytes of on-chip

OTPROM, 1Kbytes of on-ship register RAM and 256 bytes of code RAM. This product is suited for applications

requiring real-time event control such as anti-lock braking systems, 4-cylinder engine control and programmable logic

controllers.

FEATURES BENEFITS

Integrated CAN 2.0 Built-in CAN 2.0 capability, reducing overall application cost

6 high-speed capture/compare EPAs High-resolution timing of multiple events

Up to 38 I/O ports High interface potential with external peripherals

Full duplex synchronous serial I/O port (SSIO) Enables communication with other SSIO-equipped peripherals

Conﬁgurable 8- or 16-bit external bus Works with various external peripherals vs. just 8 or 16-bit peripherals

16-bit Microcontroller with Integrated CAN-TN87C196CB

TN87C196CB is a highly integrated superset of the 87C196CA. It contains all 87C196CA features, and additional

memory, more I/O capability, user-selectable 4X PLL clock multiplier and additional features.

The 87C196CB provides a compatible upgrade path for the 87C196CA applications, such as 4 or 6 cylinder engine control,

integrated vehicle dynamics, programmable logic controllers and motor controls.

FEATURES BENEFITS

Integrated CAN 2.0 Built-in CAN 2.0 capability, reducing overall application cost

Up to 56 I/O port Pins Extremely high interface potential with external peripherals

1 Mbytes external addressing More memory headroom for high-level language compilation

4X PLL Clock multiplier Greater ﬂexibility in choosing an external clocking source

56 Kbytes on-chip OTPROM Highest internal memory available for all Intel®16-bit controllers

1.5 Kbytes on-chip register RAM Fast data manipulation with register space

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MCS

®96 MICROCONTROLLER LINE CARD

ANALOG

SPEED ROM/ REGISTER CODE I/O I/O SERIAL INPUT ADDRESS

PRODUCT (MHz) OTPROM RAM RAM PINS TYPE PORTS CHANNELS SPACE PKG TEMP KEY FEATURES

HSIO FAMILY

8XC196KB 16 168K 232 NO 48 HSIO 1 8 64K N-68, C, E, A Low-cost entry level, suitable for replacing NMOS 8X9X

S-80

8XC196KC20 20 16K 488 NO 48 HSIO 1 8 64K N-68, C, E, A 16K OTPROM, 488-byte RAM 3-PWM, PTS

S-80,

SB-80

8XC196KD/ 16, 20 32K 1000 NO 48 HSIO 1 8 64K N-68, C, E, A 32K OTPROM, 1000-byte RAM Version of KC

S-80,

SB-80

8XC196KD20

Timer Counters = 2; Once Test Mode = Yes; Process = CMOS

MOTION CONTROL FAMILY

8XC196MC 16 16K 488 NO 53 8 EPA PTS MODE 13 64K N-84, E PTS, PWM, 3-Phase Waveform Generator

S-80,

U-64

8XC196MD 16 16K 488 NO 64 12 EPA PTS MODE 14 64K N-84, E MC Enhancement with Frequency Generator

S-80

8XC196MH 16 32K 744 NO 52 6 EPA 2 8 64K N-84, E Enhanced 3-Phase Waveform Generator with 32K

S-80, EPROM

U-64

Timer Counters = 2; Once Test Mode = Yes; Process = CMOS

EPA Family

87C196CA 20 32K 1000 256 44 6 EPA 2 6 64K N-68 E Integrated CAN 2.0 controller

87C196CB 20 56K 1.5K 512 56 10 EPA 2 8 1M N-84 E Integrated CAN 2.0, 1 MB linear address range, 2K RAM

88CO196EC 40 0 1.26Kb 275 59 15 EPA 3 16 2 MB NG-132 C,E Integrated CAN 2.0, 256 Kbytes on chip Flash

8XC196NP 25 4K 1000 NO 32 4 EPA 1 0 1 MB S-100, C 1 MB Linear Address Range, Low Power, 6 Chip select,

SB-100 3 PWMs, Demux bus

8XL196NP 14 4K 1000 NO 32 4 EPA 1 0 1 MB S-100, C 3V at 14 MHz version of 8XC196NP

SB-100

8XC196NT 20 32K 1000 512 56 10 EPA 2 4 1 MB N-68 C, E High performance and highly integrated controller with

1 MB Address Range

80C196NU 40, 50 0 1000 NO 33, 32 4 EPA 1 0 1 MB S-100, C 1 MB Linear Address Range, 6 Chip Selects, 3 PWMs,

SB-100 Demux bus

80C196EA 40 0 1K 3K 83 17 EPA 3 16 2M S-160 C Highly integrated NU-core Controller with Serial Debug

Unit

Timer Counters = 2, except 83C196EA = 4; Once Test Mode = Yes; Process = CMOS

MCS

®296 PROCESSOR LINE CARD

ANALOG

SPEED ROM/ REGISTER CODE I/O I/O SERIAL INPUT ADDRESS

PRODUCT (MHz) OTPROM RAM RAM PINS TYPE PORTS CHANNELS SPACE PKG TEMP KEY FEATURES

MCS®296 Microprocessor Line card

80296SA 40, 50 0 512 2K 32 4 EPA 1 0 6M S-100 C 6 MB Linear Address Range, 6 Chip selects, 3 PWM,

40-bit Hardware Accumulator

Timer Counters = 2; Once Test Mode = Yes; Process = CMOS

82527 CAN STANDALONE LINE CARD

CAN I/O BIT MESSAGE GLOBAL PROGRAM CPU

PRODUCT VERSION PORTS RATE OBJECTS MASK CLOCKOUT INTERFACE PACKAGE TEMPERATURE

82527 2 Two 8-bit Ports Up to 1 Mbit 14 (one with programmable mask) Yes Yes 8-bit MUX, 16-Bit MUX 44ld PLCC E

8-bit Non-MUX (sync/async)

Packages: Temperature Ranges:

C = 48L Ceramic DIP R = 68L Ceramic LCC C = Commercial (0 to 70 degrees C)

N = 68L PLCC S = 80L QFP (EIAJ) E = Extended (-40 to 85 degrees C)

N-52 = 52L PLCC S-100 = 100L QFP A = Automotive (-40 to 125 degrees C)

N-68 = 68L PLCC SB-100 = 100L SQFP To receive more information on Intel’s Automotive Products,

N-84 = 84L PLCC U = 64L Shrink DIP call (800) 548-4725 and ask for document #272452-01,

P = 68L Plastic DIP “The Winning Formula Automotive Brochure.”

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MCS

251 Microcontrollers

THE NEXT-GENERATION MICROCONTROLLERS

Using advanced modular design techniques, Intel launched the next generation of its 8-bit (80c51) architecture—

MCS®251 microcontroller. The MCS 251 microcontroller delivers signiﬁcantly higher performance of minimum ﬁve

times simply by recompiling your existing MCS®51 code, and offers a host of other enhanced features including an increase

in memory mix and addressing, low power and noise, efﬁcient high-level language support, an enhanced instruction set and

other integrated features.

Most importantly, the new architecture maintains binary code and pin compatibility with existing MCS 51 microcontrollers.

The MCS 251 microcontrollers will deliver even greater performance through its enhanced and optimized 251 instruction set

with no hardware changes to your existing MCS 51 microcontroller application.

FEATURES 8XC251SA/SB/SP/SQ 8XC251TB/TQ BENEFITS

New core architecture ■Up to 15X performance increase using new

MCS 251 microcontroller instructions

■Signiﬁcantly reduce RFI

■Increase efﬁciency and support of C language programming

Binary code and pin compatible ■Hardware investment protected

with MCS 51 microcontroller ■Reduce development time with backward-compatible MCS®51

microcontroller instruction set

8 Kbytes/16 Kbytes on-chip ■Flexibility in using different memory options in development and

ROM/OTPROM or ROMless version production

Programmable Counter Array (PCA) supports ■Flexibility and performance enhancement in real-time control applications

■High-speed output such as:

■Real-time capture and compare - Measurement of duty cycle, phase difference and frequency

■PWM - Real-time interrupt generation and output toggling

- Adjustable duty cycle generation

Hardware watchdog timer ■Increased system reliability

Page mode conﬁguration ■Increases the performance for external instruction fetch by 2X

Programmable wait-states (0–3) ■Flexibility in external memory and peripheral interface conﬁguration and

external wait-pin capability ■Allows the use of either fast or slow memory

Support seven interrupt sources, ■Increased ﬂexibility for event control applications

each with four interrupt priority levels

256 Kbytes external memory space ■Increased capability and ﬂexibility to handle large software requirements

512/1 Kbyte on-chip RAM ■Increased internal memory capacity for data manipulation and

C language support

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MCS®251 Microcontrollers

Intel®8XC251SA/SB/SP/SQ and Intel®8XC251TB/TQ microcontrollers provide the performance upgrade path to existing

MCS 51 microcontroller with the New Instruction Pipeline, 16-bit internal code fetch and page mode capability giving a

performance edge over other microcontrollers. It also has an interface provision for slower external peripherals through its

unique conﬁgurable wait-states and external wait-pin capability. This signiﬁcantly reduces RFI design consideration. It also

has the ability to execute C code efﬁciently and coupled with larger RAM size options to enable complex applications thus

shortening applications design and qualiﬁcation time.

The Intel 8XC251TB/TQ is based on the MCS 251 microcontroller architecture and has ALL of the Intel

8XC251SA/SB/SP/SQ peripheral features plus a second programmable serial I/O port (UART). In addition, the Intel

8XC251TB/TQ microcontroller can perform up to 24 MHz frequency and maintains pin and code compatibility with

MCS 51/151/251 microcontrollers. Similar with the Intel 8XC251SA/SB/SP/SQ, the Intel 8XC251TB/TQ has 512 bytes

or 1 Kbyte of on-chip data RAM options, 8 Kbytes and 16 Kbytes of on-chip ROM or ROMless options, and is available

in 44LD PLCC and 40LD PDIP package options.

The Intel 8XC251TB/TQ and Intel 8XC251SA/SB/SP/SQ microcontrollers are an ideal performance upgrade path for all

existing MCS 51 microcontroller applications. The high-performance architecture and the advanced features available in the

Intel 8XC251TB/TQ and Intel 8XC251SA/SB/SP/SQ also make them ideally suited for applications requiring complex data

manipulation functions and real-time control capability such as printers, copiers, scanners, CD-ROM drives, tape drives, POS

terminals, modems, digital phones, cellular/wireless handsets and line cards.

Development Tools and Programming Tools

Intel offers design engineers a variety of hardware and software development tools from some of the industry’s leading

tools suppliers. High performance, Windows*-based software, full featured, real-time emulators along with ﬂexible, fully

integrated device programming support is available from many of the familiar suppliers currently supporting the MCS 51

microcontroller architecture.

High-performance Windows-based development tools are also available from BSO/Tasking, Franklin/Keil and Production

Languages Corporation (PLC). These high-quality tools include ANSI C Compilers, Macro Assemblers, Source Level

Debuggers, Object Librarians, Linker/Locators and Instruction Simulators. Full-featured, real-time emulators featuring

DOS* or Windows-based user interface and a variety of host hardware interfaces are offered by Metalink Corporation*

and Nohau Corporation. Flexible, fully integrated device programming support for advanced designs is available from

BP Microsystems*, Data I/O*, Needham*, SMS Mikrocomputer-Systeme GmbH*, and System General Corporation*.

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MCS

®251 MICROCONTROLLER LINE CARD

ROM/ REGISTER ANALOG

EPROM RAM TIMER/ SERIAL INPUT I/O SPEED

PRODUCT (BYTES) (BYTES) COUNTERS PORT CHANNELS PINS (MHz) PROCESS PACKAGE SECURITY TEMP KEY FEATURES

87C251SA 8K 1K 3 1 0 32 16 CHMOS P, N, TN, TP L3 C, E High-Performance MCS®251

Architecture, PCA, H/W WDT

87C251SB 16K 1K 3 1 0 32 16 CHMOS P, N, TN, TP L3 C, E High-Performance MCS 251

Architecture, PCA, H/W WDT

87C251SP 8K 512K 3 1 0 32 16 CHMOS P, N, TN, TP L3 C, E High-Performance MCS 251

Architecture, PCA, H/W WDT

87C251SQ 16K 512K 3 1 0 32 16 CHMOS P, N, TN, TP L3 C, E High-Performance MCS 251

Architecture, PCA, H/W WDT

83C251SA 8K 1K 3 1 0 32 16 CHMOS P, N, TN, TP L3 C, E High-Performance MCS 251

Architecture, PCA, H/W WDT

87C251SA, ROM

83C251SB 16K 1K 3 1 0 32 16 CHMOS P, N, TN, TP L3 C, E High-Performance MCS 251

Architecture, PCA, H/W WDT

87C251SB, ROM

83C251SP 8K 512K 3 1 0 32 16 CHMOS P, N, TN, TP L3 C, E High-Performance MCS 251

Architecture, PCA, H/W WDT

87C251SP, ROM

83C251SQ 16K 512K 3 1 0 32 16 CHMOS P, N, TN, TP L3 C, E High-Performance MCS 251

Architecture, PCA, H/W WDT

87C251SQ, ROM

80C251SB ROMless 1K 3 1 0 32 16 CHMOS P, N, TN, TP L3 C, E High-Performance MCS 251

Architecture, PCA, H/W WDT

80C251SQ ROMless 512K 3 1 0 32 16 CHMOS P, N, TN, TP L3 C, E High-Performance MCS 251

Architecture, PCA, H/W WDT

83C251TB 16K 1K 3 2 0 32 24 CHMOS P, N, TN, TP L3 C, E High-Performance MCS 251

Architecture, PCA, H/W WDT

83C251TQ 16K 512K 3 2 0 32 24 CHMOS P, N, TN, TP L3 C, E High-Performance MCS 251

Architecture, PCA, H/W WDT

80C251TB ROMless 1K 3 2 0 32 24 CHMOS P, N, TN, TP L3 C, E High-Performance MCS 251

Architecture, PCA, H/W WDT

80C251TQ ROMless 512K 3 2 0 32 24 CHMOS P, N, TN, TP L3 C, E High-Performance MCS 251

Architecture, PCA, H/W WDT

PACKAGE OPTIONS:

D= 40LD CerDIP, Ku = 100LD QFP (Quad Flat Pack), N= 44LD PLCC, N1 = 68LD PLCC, P= 40LD PDIP, P1 = 48LD PDIP, S= 44LD QFP (Quad Flat Pack), Sb = 100LD SQFP (Shrink Quad Flat Pack),

X= SmartDie®: Product, P= 40 Lead Plastic Dual Inline Package at commercial temp, N= 44 Lead Plastic Chip Carrier at commercial temp, TN = 44 Lead Plastic Chip Carrier at express temp,

TP = 40 Lead Plastic Dual Inline Package at express temp

TEMPERATURE RANGES:

C= Commercial (0°C to +70°C), E= Extended (-40°C to +85°C), A= Automotive (-40°C to +125°C). To receive more information on Intel’s Automotive Products, call (800) 548-4725 and ask for document #272452-01,

“The Winning Formula Automotive Brochure.” Speed (MHz): * = commercial temperature range only.

Security: L1 = 1 Lock Bit, L2 = 2 Lock Bits, L3 = 3 Lock Bits, P = Protection

NOMENCLATURE:

83C51xx = Mask ROM, 80C5x = Mask ROM, 87C51xx,ROM = FPROM, 87C5x,ROM = FPROM, 87Cx51,ROM = Factory Program ROM

Where available, order Factory Programmed ROM (FPROM)

Additional product information is always available at http://developer.intel.com/design/mcs51/

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THE ORIGINAL 8-BIT MICROCONTROLLERS

Intel’s 8-bit MCS®51 microcontroller family consists of CHMOS versions of the original NMOS 8-bit microcontrollers.

The MCS 51 microcontroller architecture is optimized for control-oriented applications and provides a variety of fast

addressing modes for accessing the internal RAM facilitates byte processing and numerical operations on small data

structures. The instruction set provides an extremely useful spread of 8-bit arithmetic instructions, including multiply and

divide instructions, logical instructions as well as extensive on-chip support for 1-bit variables as a separate data type,

allowing direct bit manipulation and testing in control and logic systems that require Boolean processing.

Intel offers a wide variety of MCS 51 controllers with different levels of on-chip peripherals and memory. The MCS 51

microcontroller family includes versions with on-chip EPROM, One-Time Programmable (OTP) and ROM memory, as well

as CPU-only microcontrollers. Intel’s proven CHMOS technology provides lower power, higher integration and higher

performance for the MCS 51 product line.

FEATURES COMMON TO ALL MCS®51 PRODUCTS BENEFITS

8-bit CPU optimized for event control Efﬁcient. Event control design

Boolean processing Ease. Simple bit manipulation

Flexibility. Enables single-chip designs

On-chip peripherals (timer/counters, serial ports, I/O ports, PCA, etc.) Integration. High integration enables low-cost and low-chip-count designs

Extensive software and hardware programming support Easy to use. Simpliﬁes your design cycle

MCS®51 Microcontroller Family—Classic

Intel’s 8-bit MCS 51 Classic family is a leading choice for embedded control. Intel offers a wide variety of on-chip memory

in both EPROM and ROM options, as well as CPU-only microcontrollers. Intel’s proven CHMOS technology provides

lower power, higher integration and higher performance.

FEATURES FOUND ON MCS®51 CLASSIC PRODUCTS BENEFITS

8-bit CPU optimized for event control Efﬁcient. Event control design

Boolean processing Ease. Simple bit manipulation

On-chip memory (up to 32K) Solutions. Enables single-chip designs

On-chip peripherals (timer/counters, serial ports, PCA, etc.) High integration. Enables low-cost and I/O ports, low-chip-count designs

MCS®51 Microcontrollers—Expanded RAM

The 8XC51RA/RB/RC provides additional on-chip RAM from 256 to 512 bytes, making these products ideal if your

application requires large on-chip data storage. The Expanded RAM family is peripheral-compatible with the 8XC51FX

product line.

FEATURES FOUND ON MCS®51 EXPANDED RAM PRODUCTS BENEFITS

Expanded internal RAM (512 byte) size Synergy. More working space on chip, breaks the 256-byte limitation

Dedicated hardware watchdog timer Control. Improved system integrity control

Functionally compatible with other MCS®51 microcontrollers Compatibility. Easy migration of existing designs

On-chip peripherals (timer/counters, serial ports, I/O ports, etc.) High integration. Enables low-cost and low-chip-count designs

MCS

51 Microcontrollers

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MCS®51 Microcontroller Development Tools

Complete sets of development utilities and C compilers are available through third-party vendors. Many third-party

vendors also provide in-circuit emulator development tools. For more information about development tools support,

log on to http://developer.intel.com/design/mcs51, or contact your Intel sales representative.

MCS

®51 CLASSIC FAMILY MICROCONTROLLER LINE CARD

ROM/ REGISTER ANALOG

EPROM RAM TIMER/ SERIAL INPUT I/O SPEED

PRODUCT (BYTES) (BYTES) COUNTERS PORT CHANNELS PINS (MHz) PROCESS PACKAGE SECURITY TEMP KEY FEATURES

80C31BH ROMless 128 2 1 0 32 16, 24 CHMOS D, N, P, S N/A C, E Power Save Modes

80C51BH 4K ROM 128 2 1 0 32 12, 16, 24 CHMOS N, P, S P C, E Power Save Modes

87C51 4K EPROM/OTP 128 2 1 0 32 16, 24 CHMOS D, N, P, S L3 C, E Three-Level Memory Lock

80C32 ROMless 256 3 1 0 32 16, 24 CHMOS N, P, S N/A C, E Up-Down Timer/Counter

80C52 8K ROM 256 3 1 0 32 12, 16, 24 CHMOS N, P, S L1 C, E Up-Down Timer/Counter

87C52 8K EPROM/OTP 256 3 1 0 32 16, 24 CHMOS D, N, P, S L3 C, E Up-Down Timer/Counter

87C58, ROM 32K ROM 256 3 1 0 32 12, 16, 24, 33 CHMOS N, P, S L1 C, E Up-Down Timer/Counter

87C58 32K EPROM/OTP 256 3 1 0 32 16, 24, 33 CHMOS D, N, P, S L3 C, E Up-Down Timer/Counter

80C51FA ROMless 256 3 1 0 32 16, 24, 33 CHMOS D, N, P, S N/A C, E Programmable Counter Array (PCA),

Prog. Clock Out

83C51FA 8K ROM 256 3 1 0 32 12, 16, 24 CHMOS N, P, S L1 C, E, A Programmable Counter Array (PCA),

Prog. Clock Out

87C51FA 8K EPROM/OTP 256 3 1 0 32 16, 24, 33 CHMOS D, N, P, S L3 C, E, A Programmable Counter Array (PCA),

Prog. Clock Out

87C51FB, ROM 16K ROM 256 3 1 0 32 12, 16, 24, 33 CHMOS N, P, S L1 C, E, A Programmable Counter Array (PCA),

Prog. Clock Out

87C51FB 16K EPROM/OTP 256 3 1 0 32 16, 24, 33 CHMOS D, N, P, S L3 C, E, A Programmable Counter Array (PCA)

Prog. Clock Out

87C51FC, ROM 32K ROM 256 3 1 0 32 12,16, 24, 33 CHMOS D, N, P, S L1 C, E, A Programmable Counter Array (PCA),

Prog. Clock Out

87C51FC 32K EPROM/OTP 256 3 1 0 32 16, 24, 33 CHMOS D, N, P, S L3 C, E, A Programmable Counter Array (PCA),

Prog. Clock Out

MCS

®51 EXPANDED RAM FAMILY LINE CARD

ROM/ REGISTER ANALOG

EPROM RAM TIMER/ SERIAL INPUT I/O SPEED

PRODUCT (BYTES) (BYTES) COUNTERS PORT CHANNELS PINS (MHz) PROCESS PACKAGE SECURITY TEMP KEY FEATURES

80C51RA ROMless 512 3 1 0 32 16, 24 CHMOS N, P, S N/A C, E Expanded RAM, Prog. Clock out, H/W WDT

87C51RA, ROM

87C51RA 8K OTP 512 3 1 0 32 16, 24 CHMOS N, P, S L3 C, E Expanded RAM, Prog. Clock out, H/W WDT

87C51RB, ROM

87C51RB 16K OTP 512 3 1 0 32 16, 24 CHMOS N, P, S L3 C, E Expanded RAM, Prog. Clock out, H/W WDT

87C51RC, ROM

87C51RC 32K OTP 512 3 1 0 32 16, 24 CHMOS N, P, S L3 C, E Expanded RAM, Prog. Clock out, H/W WDT

PACKAGE OPTIONS:

D= 40LD CerDIP, Ku = 100LD QFP (Quad Flat Pack), N= 44LD PLCC, N1 = 68LD PLCC, P= 40LD PDIP, P1 = 48LD PDIP, S= 44LD QFP (Quad Flat Pack), Sb = 100LD SQFP (Shrink Quad Flat Pack),

X= SmartDie®: Product, P= 40 Lead Plastic Dual Inline Package at commercial temp, N= 44 Lead Plastic Chip Carrier at commercial temp, TN = 44 Lead Plastic Chip Carrier at express temp,

TP = 40 Lead Plastic Dual Inline Package at express temp

TEMPERATURE RANGES:

“The Winning Formula Automotive Brochure.” Speed (MHz): * = commercial temperature range only.

Security: L1 = 1 Lock Bit, L2 = 2 Lock Bits, L3 = 3 Lock Bits, P= Protection

NOMENCLATURE:

83C51xx = Mask ROM, 80C5x = Mask ROM, 87C51xx,ROM = FPROM, 87C5x,ROM = FPROM, 87Cx51,ROM = Factory Program ROM

Where available, order Factory Programmed ROM (FPROM)

Additional product information is always available at http://developer.intel.com/design/mcs51/

developer.intel.com/design/interconnect/ Microcontrollers

179

PRODUCT OVERVIEW

The Intel®Interconnect Devices provide a combination of ﬂexible integration options, functionality and reliability that

helps ensure optimum system-level performance and customer satisfaction.

■Intel®PC Card (PCMCIA) controllers provide a ﬂexible, compact, and reliable solution for software transport,

memory upgrade and peripheral connectivity in communications devices and embedded systems.

■Serial Controllers are I/O data communication devices for network applications.

■Parallel Controllers are IEEE 1284-compatible parallel I/O data communication products for peripheral applications.

■WAN Controllers enable leased line, dial-up and packet-based WAN connections for a broad range of communications

applications.

PRODUCTS CONTROLLER CATEGORY OPERATING TEMPERATURE PACKAGE EVALUATION KIT DESCRIPTION

DZPD6710VCB PC Card/PCMCIA Commercial (0°C to +70°C) LQFP 144 pin PDK6710ADM12 ISA to PC Card Single-slot

SPD6722QCCE PC Card/PCMCIA Commercial (0°C to +70°C) MQFP 208 pin PDK6722ADM16 ISA to PC Card Dual-slot

SPD6729QCE PC Card/PCMCIA Commercial (0°C to +70°C) MQFP 208 pin PDK6729ADM14 PCI to PC Card Dual-slot

SCD140010QCJ Serial Commercial (0°C to +70°C) MQFP 100 pin CDK1400JAT01A 4 async serial channels at 230.4 Kbps or 3 serial ports and 1 parallel port

SCD186510QCB Serial Commercial (0°C to +70°C) MQFP 100 pin CDK1865BAT01A 8 async serial channels at 115.2 Kbps

SCD128310QCE Parallel Commercial (0°C to +70°C) MQFP 100 pin CDK1284EAT02A IEEE 1284

SCD128410QCE Parallel Commercial (0°C to +70°C) MQFP 100 pin CDK1284EAT02A IEEE 1284, 2 serial channels at 115.2 Kbps

SCD240110QCM WAN Commercial (0°C to +70°C) MQFP 100 pin CDK2401MAT03B 4 async/sync serial channels at 134.4 Kbps

SCD248110QCD WAN Commercial (0°C to +70°C) MQFP 100 pin CDK2481DAT03B 4 async/sync serial channels at 230.4 Kbps

PC Card (PCMCIA) Applications

■Routers, bridges, network switches

■Printers

■Test equipment

■Portable handheld systems

■Remote access servers

■Terminal servers

■POS terminals

■Video conferencing using Zoom Video

■DSLAMs (digital subscriber line access multiplexers)

■Vending machines

■Integrated access devices

■PBXs

■Set-top, Internet boxes

■Navigation systems

Serial Controller Applications

■General-purpose, multi-channel serial communications

■Remote access servers

■Terminal servers

■POS terminals

■Multiport async cards

Interconnect Devices

Microcontrollers developer.intel.com/design/interconnect/

180

Parallel Controller Applications

■Printers

■Scanners

■Copiers

■Backup systems

■Industrial control systems

■Multi-function devices

■Set-top boxes with printer port

WAN Controller Applications

■Branch ofﬁce routers

■Remote access servers

■Terminal servers

■Protocol converters

developer.intel.com/platforms/applied/software/devsoft.htm Software

181

SOFTWARE FOR EID PRODUCTS

Embedded Intel®Architecture (EIA) system software support is a key platform building block. Software building blocks

from Intel such as the Intel®Embedded Computing Firmware Library eases development of EIA designs for faster time-

to-market. Enabling software such as device drivers help deliver maximum performance for the advanced features offered

on EIA silicon.

Intel®Embedded Computing Firmware Library

The high rate of technology evolution makes it critical to get to market quickly with innovative, high-performance,

connected devices. These sophisticated systems must also meet increasingly demanding application requirements and

tighter budget controls. Developers regularly face challenges that threaten their ability to meet schedule, feature, and cost

goals. One large challenge is in the area of system initialization. Many applied computing platforms don’t require the full

set of features provided in a standard PC BIOS. The problem is that developing initialization code is difﬁcult and time-

consuming. Intel Embedded Computing Firmware Library can help.

Intel Embedded Computing Firmware Library provides a set of libraries and tools that perform core level initialization

of the processor, chipset and memory. Intel Embedded Computing Firmware Library lets developers implement only the

components they need, resulting in faster boot times and a smaller memory footprint. In addition, Intel Embedded Computing

Firmware Library can signiﬁcantly reduce the time and cost associated with developing and validating system initialization

modules.

Currently, Intel Embedded Computing Firmware Library provides support for component-level initialization of the

Intel®Pentium®III, Intel®Pentium®II and Intel®Celeron®processors, SDRAM, the Intel®440BX AGPset, Intel®440MX

chipset, Intel®815 and Intel®815E chipsets and the Intel®E7500 chipset. It presents a simple, clean, 32-bit API consistent

with common embedded programming practices regardless which Intel®processor or chipset is being utilized. Figure 1

shows the Intel Embedded Computing Firmware Library version 2 architecture. The API provides an abstraction of the

processor and chipset so that if these components change, the developer is no longer required to update any of the

“additional initialization code” that may have been developed. Instead, the developer downloads only the version

of Intel Embedded Computing Firmware Library supporting the Intel processor and chipset selected for the new design.

Software

Legacy

Real Mode

PCI

ATA

GDB

Others…

C-Lib

Subset

Flash

Manager

Console

Reset and

Mode Switch

Basic

Initialization

Script

Advanced

Initialization

Script

Shell,

Application,

Loader, RTOS

BSP or other

customer FW

Processor Chipset Super I/O Flash

Library

Boot Sequence

API and

Services

Drivers

Binary Source

Figure 1: Intel®Embedded Computing Firmware Library Block Diagram

Software developer.intel.com/platforms/applied/software/devsoft.htm

182

Intel Embedded Computing Firmware Library has the following features:

■Memory and memory controller initialization

■Processor cache initialization, conﬁguration and control

■Initialization of multi-processor system including Hyper-Threading processors

■Installation of processor updates

■Querying of hardware conﬁguration (e.g., installed memory, cache size, etc.)

■PCI enumeration and resource allocation

■Support for PCI expansion ROMs enabling video initialization, PXE boot, SCSI boot, etc.

■IDE initialization and I/O

■Subset of C library

■Support for common OS boot loaders

■GNU debugger (GDB) stub with serial interface which enables early dynamic system test execution, remote debugging

of system boot & hardware

■Basic initialization of most components on selected super I/O chips

■Easily extensible subset of real-mode interrupts (i.e., BIOS services)

■System management mode support

■Interrupt handling

■Local and remote consoles with user-extensible, command line shell

■Update boot ﬂash via serial port using YMODEM

Enabling Software

Enabling software consists of software and tools used to realize maximum performance from Embedded Intel Architecture

(EIA) processors and of software, typically referred to as device drivers, used to deliver maximum performance from the

features provided by the EIA chipsets.

developer.intel.com/platforms/applied/software/devsoft.htm Software

183

Processor Enabling Software

Processor enabling software consists of software tools and utilities used to optimize the application software and operating

systems which are targeted to run on a platform with an EIA processor. The following steps may be taken in order to

fully optimize any software product for EIA processors:

1. Incorporate Intel®Performance Libraries in the software source code to take advantage of the special processor features.

See http://developer.intel.com/software/products/perﬂib/ for additional details.

2. Use Intel®Compilers (now with embedded extentions) to compile the software source code to take advantage of special

processor instruction sets, such as SSE2. See http://developer.intel.com/software/products/compilers/ for additional

details.

3. Use Intel®VTune™Performance Analyzers to optimize the software source code ﬂow such that the resultant compiled

binary performs signiﬁcantly better. See http://developer.intel.com/software/products/vtune/ for additional details.

4. Use Intel’s Threading Tools to add parallelism to software if it is targeted for a Multi-Processing system or for a

processor which supports Hyper-Threading Technology. See http://developer.intel.com/software/products/threadtool.htm

for additional details.

These steps apply to any software designated for a platform with an EIA processor, including operating systems. For

example, the Intel Compilers may be used to compile the Linux* operating system kernel in place of the standard Gnu C

Compiler for improved performance.

Table 1 identiﬁes the operating systems that have speciﬁc processor feature support available.

TABLE 1 PROCESSOR FEATURES SUPPORTED PER OPERATING SYSTEM

Chipset Enabling Software (Device Drivers)

The device drivers for the EIA chipsets and components improve performance and expose features, such as USB 2.0,

ATA/100, or Gigabit LAN. Typically each operating system vendor will provide, with the distribution of their operating

system, a set of “native” device drivers which support many of the standard features available on the EIA chipsets which were

common at the time of the OS release. For example, Microsoft Windows* 2000 provides native drivers for the integrated

graphics available on the Intel 815 Chipset, while Microsoft Windows NT* 4.0 will use the default native VGA drivers. In

addition, Intel offers the Intel®Embedded Graphics Driver for the Intel®815/815E, 845GV, 852GME, and 855GME Chipsets

which may be installed on either Microsoft Windows XP, eXP, 2000, NT 4.0, CE .NET, and Linux replacing the native

drivers and providing enhanced performance and features.

Microsoft Windows NT* 4.0

Microsoft Windows* 98SE

Microsoft Windows* 2000

Microsoft Windows* XP

Microsoft Windows NT* Embedded

Microsoft Windows* XP Embedded

Hyper-Threading Technology NNY

1Y1NY

1NNYY

(Intel® Pentium® 4 Processor feature)

Physical Address Extension NNY

3Y3NY

3NNY

4NN

(36-bit addressing)

Microsoft Windows* CE 3.0

Microsoft Windows* CE .NET

Linux* 2.4.19

Windriver* VxWorks 5.x

QNX* Neutrino v6

Major Processor Features

1See http://www.microsoft.com/windows2000/server/evaluation/performance/reports/hyperthread.asp for more information

2Hyper-Threading Technology supported as loosely coupled asynchronous multiprocessing design.

3See http://www.microsoft.com/hwdev/platform/server/PAE/default.asp for more information

4See http://www.intel.com/idf/us/fall2002/presentations/DES124PS.pdf for more information

5Neutrino v6.2.1 provides support for PAE with an explicit model – apps/drivers can access >4G but kernel does not manage

this space

Software developer.intel.com/platforms/applied/software/devsoft.htm

184

In some cases driver updates are available from the operating system vendor while in other cases updates are only available

from Intel. This section is intended to clarify what device drivers are available for the chipsets which are on EIA Division’s

roadmap and where updates may be found. In addition, some references are included for Intel®Network Adapters. Due to the

large variety of operating systems used in embedded markets, only a limited listing is provided.

The paragraphs below describe where the drivers for each operating system are typically found; after that there are tables

which describe the drivers available for each supported EIA Division chipset.

Microsoft* Operating Systems

The Microsoft operating systems typically have native device driver support for all Intel®chipsets and components up to

the time that the operating systems are released. In a few cases, Microsoft will provide Service Packs or may offer

Microsoft Windows Updates which include updated drivers that have support for newer features. For example, Windows

2000 was released before USB 2.0 products were widely available. Microsoft has since provided a Service Pack for

Windows 2000 that will include drivers for USB 2.0 support. On the other hand, Windows NT 4.0 was released prior to

USB 1.1 product availability. Microsoft does not currently, and will not ever, provide any Service Packs that provide

USB 1.1 support for Windows NT 4.0.

The embedded versions of the Microsoft operating systems, such as Microsoft Windows XP embedded and Microsoft

Windows NT embedded, will typically use the same device driver binary as the standard desktop version of the operating

system. The primary difference is the method of installation of the driver binary; with a desktop operating system, an

install method, such as Plug and Play, is normally used to ﬁnd and install on initial boot the appropriate drivers for the

hardware features that are present on the platform, while for the embedded operating systems, the OEM customer will use

a development environment to include the device driver binary as part of an operating system image built prior to initial boot

of the target platform. Because of this, different support ﬁles are required for the embedded operating system development

environment. However, out of the box, the same level of device driver support will be available from Microsoft for both the

desktop version and the embedded version of the operating system. For example, Windows NT 4.0 does not have support for

USB 1.1, and Windows NT embedded also does not have support for USB 1.1.

One distinct exception to the native Intel chipset device driver support under the Microsoft operating systems is the

Microsoft Windows CE operating system. There are very few native device drivers available for speciﬁc EIA components,

and only the most rudimentary support is available for generic services, such as IDE and USB.

TABLE 2 MICROSOFT* OPERATING SYSTEM DEVICE DRIVER RESOURCES

ITEM DESCRIPTION LOCATION APPLICABLE MICROSOFT OS*

Microsoft* Updates Microsoft supplied updates, such as Service Packs and patches, http://windowsupdate.microsoft.com Desktop Only6

to operating system which may include updated or new native device drivers

Intel®Network Updates and overwrites the Microsoft-supplied native device drivers for http://support.intel.com/support/network/index.htm All

Adapter Drivers Intel Network Adapters with newer and more advanced features.

Includes Intel®PRO/100, Intel®PRO/1000, and Intel®PRO/Wireless adapters.

Intel®Chipset Installs chipset INF ﬁle which describes to the operating system the capabilities http://support.intel.com/support/chipsets/ Desktop only7

Software Installation Utility of the chipset such that the correct native drivers are loaded.

Intel®Application Performance software package for Intel®desktop PCs which provides improved IDE http://support.intel.com/support/chipsets/ All except Windows* CE8

Accelerator hard drive support for Windows* operating systems, including 48-bit LBA (137+ GB)

drive support.

Intel®810, Intel®815, Updates and overwrites the Microsoft-supplied native device drivers, if present, http://support.intel.com/support/graphics/intel815/ Desktop only9

and Intel®845GV for the internal graphics of these chipsets. and http://support.intel.com/support/graphics/intel810/

chipsets graphics drivers and http://support.intel.com/support/graphics/intel845g/

Intel®InﬁniBand* Information and tools for developing device drivers for the Intel InﬁniBand http://www.intel.com/technology/inﬁniband/index.htm All

Architecture resource Architecture.

USB 1.1 drivers Drivers which add generic USB support for the operating system http://www.bsquare.com/products/devtools/usbwin40/ Windows NT* 4.0 and Windows* NT

Embedded

USB 2.0 drivers Drivers which add USB 2.0 support for Windows 2000 and Windows XP only http://www.microsoft.com/WindowsXP/pro/downloads/ Windows 2000, Windows XP,

servicepacks/sp1/default.asp or and Windows XP Embedded

http://www.microsoft.com/windows2000/downloads/

servicepacks/sp3/default.asp

6For the embedded operating systems, a new package must be obtained from Microsoft or a Microsoft partner.

7For the embedded operating systems, the Intel®Chipset Software Installation Utility is not used because the developer of the embedded image may choose the speciﬁc drivers the operating system will use when developing

the OS image.

8IAA may be installed normally after the Embedded XP or Embedded NT image is created; there are no Embedded components for either of these operating systems.

9For Microsoft* Windows CE 3.0 and Windows CE .NET, device drivers can be found on FDBL, under Applied Computing -> Products -> Chipsets -> [choose chipset] -> Software.

developer.intel.com/platforms/applied/software/devsoft.htm Software

185

Linux* Operating System

The Linux operating system is available in source code form free of charge from http://www.kernel.org. The current kernel

distribution includes complete support for the majority of the EIA chipsets, with additional support for newer chipsets

being added with each new release. Many of the basic device drivers are typically provided with the kernel, and necessary

modiﬁcations can be made through a source code patch; audio drivers and X server drivers are drivers which are available

separately.

Linux vendors, such as Red Hat*, Agilent*, MontaVista*, and LynuxWorks*, will adopt the standard Linux kernel

distribution, make their own modiﬁcations, and then redistribute through their own channels. Therefore, their redistribution

will have the same EIA devices supported as the Linux kernel they have adopted.

The EIA Division works with the Linux kernel development team to incorporate the support for new features and

functionality of EIA chipsets into new kernel distributions when possible; if additional features and functionality is required,

Intel FAE/FSE should forward request to the EID Driver Software contact.

TABLE 3 LINUX* OPERATING SYSTEM DEVICE DRIVER RESOURCES

ITEM DESCRIPTION LOCATION

Ofﬁcial Linux* kernel distribution Complete source for the Linux operating system which supports a large number of EIA devices http://www.kernel.org/

Intel®Network Adapter Drivers Intel®-supplied network drivers for the Linux operating system. Note that the kernel distribution http://support.intel.com/support/network/index.htm

does already have Intel network driver support; these drivers are an alternative. Includes

Intel®PRO/100, Intel®PRO/1000, and Intel®PRO/Wireless adapters.

Xfree86 Most popular open-source X Window System which runs on Linux; support provided for EIA http://www.xfree86.org/

integrated graphics chipsets.

Audio driver project Project to provide extensive audio support for the Linux operating system, including support for the http://www.alsa-project.org

EIA chipsets which have integrated AC’97 controllers.

USB Project Effort to enhance USB support for the Linux kernel; USB 2.0 support has been rolled into the standard http://www.linux-usb.org/

Linux kernel distribution 2.4.19 and later

Gnu C Compiler (GCC) 3.1 Updated compiler provided with Linux kernel distribution; this version provides some Intel®http://gcc.gnu.org

Pentium®4 processor optimizations.

Intel®InﬁniBand* Architecture resource Information and tools for developing device drivers for the Intel InﬁniBand Architecture http://www.intel.com/technology/inﬁniband/index.htm

Other Real Time Operating Systems (RTOSs)

Other operating systems that are typically used in embedded applications are WindRiver* VxWorks and QNX* Neutrino.

For Intel®devices, these vendors will develop and support the device drivers on their own.

Other Embedded Operating Systems

There are a large number of other operating systems that are used in embedded applications. The EIA Division does not

typically provide driver support for any of these other operating systems. Two of the most popular operating systems

which support EIA chipsets include WindRiver VxWorks and QNX Neutrino. For Intel devices, these vendors will develop

and support the device drivers individually.

TABLE 4 OTHER EMBEDDED OPERATING SYSTEM DEVICE DRIVER RESOURCES

ITEM DESCRIPTION LOCATION

WindRiver* VxWorks v5.x Most widely adopted real-time operating system in the embedded industry, according to WindRiver. http://www.windriver.com/products/html/vxwks5x.html

QNX* Neutrino v6 The QNX RTOS provides a powerful, massively scalable, reliable foundation for embedded systems, http://www.qnx.com/products/os/rtos6.html

according to QNX.

Intel®Network Adapter Drivers Intel provided distribution of network drivers for the Intel®82559ER Ethernet component which http://developer.intel.com/design/network/products/lan/controllers/

includes WindRiver-provided VxWorks drivers. 82559er.htm

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186

INTEL®EMBEDDED CHIPSET DEVICE DRIVER SUPPORT MATRIX

The following tables describe the device driver support provided for the associated Intel®Embedded Chipsets. The tables

are presented in the following order:

■ Table 5 Intel®E7500 and Intel®E7501 Chipset—ICH3 south bridge (RGEE7500PL/RGE7501MC + FW82801CA +

RG82870P2)

■ Table 6 Intel®845GV Chipset—ICH4 south bridge (RG82845GV + FW82801DB)

■ Table 7 Intel®845E Chipset—ICH4 south bridge (RG82845E + FW82801DB)

■ Table 8 Intel®845 Chipset—ICH2 south bridge (RG82845 + FW82801BA)

■ Table 9 Intel®815E and Intel®810E2 Chipsets—ICH2 south bridge (FW82815E/FW82810E + FW82801BA)

■ Table 10 Intel®840 Chipset—ICH south bridge (FW82840 + FW82801AA)

■ Table 11 Intel®815E and Intel®810E2 Chipsets—CICH south bridge (FW82815E/FW82810E + FW82801E)

(the CICH south bridge is not natively supported by any of the Microsoft operating systems. Check FDBL for the

Microsoft OS drivers)

■ Table 12 Intel®815 and Intel®810 Chipsets—ICH south bridge (FW82815/FW82810 + FW82801AA)

■ Table 13 Intel®440BX Chipset—PIIX4E south bridge (FW82443BX + FW82371EB)

■ Table 14 Intel®440MX Chipset—Integrated south bridge, PIIX4E compatible (FW82443MX100)

■ Table 15 Intel®430TX Chipset—PIIX4 south bridge (FW82439TX + FW82371EB)

■ Table 16 Intel®430HX Chipset—PIIX3 south bridge (FW82439HX + SB82371SB)

■ Table 17 Intel®Network Adapters

Each table provides a list of highlighted features for the chipset, and the support available for each OS. For the best

performance, it may be necessary to get the most recent drivers available from the sources provided in the operating system

sections above.

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187

TABLE 5 INTEL®E7500 AND INTEL®E7501 CHIPSET—ICH3 SOUTH

BRIDGE (RGEE7500PL/RGE7501MC + FW82801CA + RG82870P2)

TABLE 6 INTEL®845GV CHIPSET—ICH4 SOUTH BRIDGE (RG82845GV +

FW82801DB)

Microsoft Windows NT* 4.0

Microsoft Windows* 98SE

Microsoft Windows* 2000

Microsoft Windows* XP

Microsoft Windows NT* Embedded

Microsoft Windows* XP Embedded

Microsoft Windows* CE 3.0

Microsoft Windows* CE .NET

Linux* 2.4.19

Windriver* VxWorks 5.x

QNX* Neutrino v6

3x USB 1.1 N10 YYYN

10 Y1x1xYYY

3x USB 2.0 N N Y11 Y11 NY

11 NNYNN

2x IDE ATA/100 Y12 Y12 YY

ATA/66

Y14 PIO PIO Y Y Y

1x Integrated LAN Y Y Y Y Y Y Y Y Y N Y

AC’97 2.2 Y Y Y Y Y Y Y Y Y N Y

Integrated Graphics:

Resolution to 1600x1200, YYY YNNNNY

15 NN

color depth to 24bpp

Accelerated 2D features Y Y Y Y NNNNYNN

Accelerated 3D features Y Y Y Y NNNNNNN

Accelerated video features Y Y Y Y NNNNYNN

DVO encoder support

(includes TV-Out, TMDS, Y Y Y Y NNNNNNN

and LVDS devices)

Major Chipset Functions

Microsoft Windows NT* 4.0

Microsoft Windows* 98SE

Microsoft Windows* 2000

Microsoft Windows* XP

Microsoft Windows NT* Embedded

Microsoft Windows* XP Embedded

3x USB 1.1 N10 YYYN

10 Y1x1xY Y Y

3x USB 2.0 N N Y11 Y11 NY

11 NNYNN

2x IDE ATA/100 Y12 Y12 YYATA/66 Y PIO PIO Y Y Y

1x Integrated LAN Y Y Y Y Y Y YYYYY

AC’97 2.2 Y Y Y Y Y Y Y Y Y N Y

Microsoft Windows* CE 3.0

Microsoft Windows* CE .NET

Linux* 2.4.19

Windriver* VxWorks 5.x

QNX* Neutrino v6

Major Chipset Functions

10 USB 1.1 support available separately from third-party vendors

11 USB 2.0 support available in a Microsoft Windows Update release

12 ATA/100 and 48-bit LBA (137+ GB) drive support provided in Intel®Application Accelerator utility

13 48-bit LBA (137+ GB) drive support provided in Intel®Application Accelerator utility; also will be enabled as part of

Service Pack 1

14 48-bit LBA (137+ GB) drive support will be enabled as part of Service Pack 1

15 Advanced graphics features supported in XFree86 4.2

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188

TABLE 7 INTEL®845E CHIPSET—ICH4 SOUTH BRIDGE (RG82845E +

FW82801DB)

TABLE 8 INTEL®845 CHIPSET—ICH2 SOUTH BRIDGE (RG82845 +

FW82801BA)

Microsoft Windows NT* 4.0

Microsoft Windows* 98SE

Microsoft Windows* 2000

Microsoft Windows* XP

Microsoft Windows NT* Embedded

Microsoft Windows* XP Embedded

3x USB 1.1 N10 YYYN

10 Y1x1xYYY

3x USB 2.0 N N Y11 Y11 NY

11 NNYNN

2x IDE ATA/100 Y12 Y12 YY

13 ATA/66 Y14 PIO PIO Y Y Y

1x Integrated LAN Y Y Y Y Y Y Y Y Y N Y

AC’97 2.2 Y Y Y Y Y Y Y Y Y N Y

Microsoft Windows* CE 3.0

Microsoft Windows* CE .NET

Linux* 2.4.19

Windriver* VxWorks 5.x

QNX* Neutrino v6

Major Chipset Functions

Microsoft Windows NT* 4.0

Microsoft Windows* 98SE

Microsoft Windows* 2000

Microsoft Windows* XP

Microsoft Windows NT* Embedded

Microsoft Windows* XP Embedded

3x USB 1.1 N10 YYYN

10 Y1x1xYYY

2x IDE ATA/100 Y12 Y12 YYATA/66 Y PIO PIO Y Y Y

1x Integrated LAN Y Y Y Y Y Y Y Y Y N Y

AC’97 2.1 Y Y Y Y Y Y Y Y Y N Y

Microsoft Windows* CE 3.0

Microsoft Windows* CE .NET

Linux* 2.4.19

Windriver* VxWorks 5.x

QNX* Neutrino v6

Major Chipset Functions

10 USB 1.1 support available separately from third-party vendors

11 USB 2.0 support available in a Microsoft Windows Update release

12 ATA/100 and 48-bit LBA (137+ GB) drive support provided in Intel®Application Accelerator utility

13 48-bit LBA (137+ GB) drive support provided in Intel®Application Accelerator utility; also will be enabled as part of

Service Pack 1

14 48-bit LBA (137+ GB) drive support will be enabled as part of Service Pack 1

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189

TABLE 9 INTEL®815E AND INTEL®810E2 CHIPSETS—ICH2 SOUTH

BRIDGE (FW82815E/FW82810E + FW82801BA)

TABLE 10 INTEL®840 CHIPSET—ICH SOUTH BRIDGE (FW82840 +

FW82801AA)

Microsoft Windows NT* 4.0

Microsoft Windows* 98SE

Microsoft Windows* 2000

Microsoft Windows* XP

Microsoft Windows NT* Embedded

Microsoft Windows* XP Embedded

2x USB 1.1 N10 YYYN

10 Y1x1xY Y Y

2x IDE ATA/66 Y Y Y Y Y Y PIO PIO Y Y Y

AC’97 2.1 Y Y Y Y Y Y Y Y Y N Y

Microsoft Windows* CE 3.0

Microsoft Windows* CE .NET

Linux* 2.4.19

Windriver* VxWorks 5.x

QNX* Neutrino v6

Major Chipset Functions

Microsoft Windows NT* 4.0

Microsoft Windows* 98SE

Microsoft Windows* 2000

Microsoft Windows* XP

Microsoft Windows NT* Embedded

Microsoft Windows* XP Embedded

Microsoft Windows* CE 3.0

Microsoft Windows* CE .NET

Linux* 2.4.19

Windriver* VxWorks 5.x

QNX* Neutrino v6

2x USB 1.1 N10 YYYN

10 Y1x1xYYY

2x IDE ATA/100 Y12 Y12 YY

ATA/66

Y PIO PIO Y Y Y

1x Integrated LAN Y Y Y Y Y Y Y Y Y Y Y

AC’97 2.1 Y Y Y Y Y Y Y Y Y N Y

Integrated Graphics:

Resolution to 1600x1200, YYYYYYYYY

15 Y16 Y17

color depth to 24bpp

Accelerated 2D features Y Y Y Y YYYYYNY

Accelerated 3D features Y Y Y Y YYYYNNN

Accelerated video features Y Y Y Y YYYYYNN

DVO encoder support

(includes TV-Out, TMDS, Y Y Y Y Y Y Y18 Y18 Y19 NN

and LVDS devices)

Major Chipset Functions

10 USB 1.1 support available separately from third-party vendors

12 ATA/100 and 48-bit LBA (137+ GB) drive support provided in Intel®Application Accelerator utility

15 Advanced graphics features supported in XFree86 4.2

16 Advanced graphics features supported in WindML

17 Advanced graphics features supported in Photon* MicroGUI

18 Limited to Chrontel* CH700x and Silicon Image* 154/164

19 Limited to Chrontel* CH7007

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190

TABLE 11 INTEL®815E AND INTEL®810E2 CHIPSETS—CICH SOUTH

BRIDGE (FW82815E/FW82810E + FW82801E)20

TABLE 12 INTEL®815 AND INTEL®810 CHIPSETS—ICH SOUTH BRIDGE

(FW82815/FW82810 + FW82801AA)

Microsoft Windows NT* 4.0

Microsoft Windows* 98SE

Microsoft Windows* 2000

Microsoft Windows* XP

Microsoft Windows NT* Embedded

Microsoft Windows* XP Embedded

Microsoft Windows* CE 3.0

Microsoft Windows* CE .NET

Linux* 2.4.19

Windriver* VxWorks 5.x

QNX* Neutrino v6

2x USB 1.1 N10 YYYN

10 Y1x1xY Y N

2x IDE ATA/100 ATA/66 ATA/66 YYATA/66 Y PIO PIO Y Y N

2x Integrated LAN Y Y Y Y Y Y YYYYN

Integrated Graphics:

Resolution to 1600x1200, YYYYYYYYY

15 Y16 Y17

color depth to 24bpp

Accelerated 2D features Y Y Y Y YYYYYNY

Accelerated 3D features Y Y Y Y YYYYNNN

Accelerated video features Y Y Y Y YYYYYNN

DVO encoder support

(includes TV-Out, TMDS, Y Y Y Y Y Y Y18 Y18 Y19 NN

and LVDS devices)

Major Chipset Functions

Microsoft Windows NT* 4.0

Microsoft Windows* 98SE

Microsoft Windows* 2000

Microsoft Windows* XP

Microsoft Windows NT* Embedded

Microsoft Windows* XP Embedded

Microsoft Windows* CE 3.0

Microsoft Windows* CE .NET

Linux* 2.4.19

Windriver* VxWorks 5.x

QNX* Neutrino v6

2x USB 1.1 N10 YYYN

10 Y1x1xYYY

2x IDE ATA/66 Y Y Y Y Y Y PIO PIO Y Y Y

AC’97 2.1 Y Y Y Y Y Y Y Y Y N Y

Integrated Graphics:

Resolution to 1600x1200, YYYYYYYYY

15 Y16 Y17

color depth to 24bpp

Accelerated 2D features Y Y Y Y YYYYYNY

Accelerated 3D features Y Y Y Y YYYYNNN

Accelerated video features Y Y Y Y YYYYYNN

DVO encoder support

(includes TV-Out, TMDS, Y Y Y Y Y Y Y18 Y18 Y19 NN

and LVDS devices)

Major Chipset Functions

10 USB 1.1 support available separately from third-party vendors

15 Advanced graphics features supported in XFree86 4.2

16 Advanced graphics features supported in WindML

17 Advanced graphics features supported in Photon* MicroGUI

18 Limited to Chrontel* CH700x and Silicon Image* 154/164

19 Limited to Chrontel* CH7007

20 For the Microsoft OS driver support, check on FDBL at Applied Computing -> Products -> Chipsets ->

Havasupai -> Software.

developer.intel.com/platforms/applied/software/devsoft.htm Software

191

TABLE 13 INTEL®440BX CHIPSET—PIIX4E SOUTH BRIDGE (FW82443BX +

FW82371EB)

TABLE 14 INTEL®440MX CHIPSET—INTEGRATED SOUTH BRIDGE, PIIX4E

COMPATIBLE (FW82443MX100)

TABLE 15 INTEL®430TX CHIPSET—PIIX4 SOUTH BRIDGE (FW82439TX +

FW82371EB)

Microsoft Windows NT* 4.0

Microsoft Windows* 98SE

Microsoft Windows* 2000

Microsoft Windows* XP

Microsoft Windows NT* Embedded

Microsoft Windows* XP Embedded

1x USB 1.0 N10 YYYN

10 YYYYYY

2x IDE ATA/33 Y Y Y Y Y Y PIO PIO Y Y Y

Microsoft Windows* CE 3.0

Microsoft Windows* CE .NET

Linux* 2.4.19

Windriver* VxWorks 5.x

QNX* Neutrino v6

Major Chipset Functions

Microsoft Windows NT* 4.0

Microsoft Windows* 98SE

Microsoft Windows* 2000

Microsoft Windows* XP

Microsoft Windows NT* Embedded

Microsoft Windows* XP Embedded

1x USB 1.0 N10 YYYN

10 YYYYYY

2x Ultra DMA/33 Y Y Y Y Y Y PIO PIO Y Y Y

Microsoft Windows* CE 3.0

Microsoft Windows* CE .NET

Linux* 2.4.19

Windriver* VxWorks 5.x

QNX* Neutrino v6

Major Chipset Functions

Microsoft Windows NT* 4.0

Microsoft Windows* 98SE

Microsoft Windows* 2000

Microsoft Windows* XP

Microsoft Windows NT* Embedded

Microsoft Windows* XP Embedded

1x USB 1.0 N10 YYYN

10 YYYYYY

1x IDE ATA/33 Y Y Y Y YY PIO PIO Y Y Y

AC’97 2.1 Y Y Y Y Y Y Y Y Y N Y

Microsoft Windows* CE 3.0

Microsoft Windows* CE .NET

Linux* 2.4.19

Windriver* VxWorks 5.x

QNX* Neutrino v6

Major Chipset Functions

10 USB 1.1 support available separately from third-party vendors

Software developer.intel.com/platforms/applied/software/devsoft.htm

192

TABLE 16 INTEL®430HX CHIPSET—PIIX3 SOUTH BRIDGE (FW82439HX +

SB82371SB)

TABLE 17 INTEL®NETWORK ADAPTERS

Microsoft Windows NT* 4.0

Microsoft Windows* 98SE

Microsoft Windows* 2000

Microsoft Windows* XP

Microsoft Windows NT* Embedded

Microsoft Windows* XP Embedded

1x USB 1.0 N10 YYYN

10 YYYYYY

2x Bus Master IDE Y Y Y Y Y Y PIO PIO Y Y Y

Microsoft Windows* CE 3.0

Microsoft Windows* CE .NET

Linux* 2.4.19

Windriver* VxWorks 5.x

QNX* Neutrino v6

Major Chipset Functions

Microsoft Windows NT* 4.0

Microsoft Windows* 98SE

Microsoft Windows* 2000

Microsoft Windows* XP

Microsoft Windows NT* Embedded

Microsoft Windows* XP Embedded

Intel® PRO/1000 (includes 82544) Y Y Y Y Y Y N N Y Y Y

Intel® PRO/100 Adapters

(includes 82557, 82558, Y Y Y Y YYYYYYY

82559, 82550)

Intel® PRO/Wireless Adapters21

(includes 802.11a and 802.11b Y Y Y Y Y N Y Y Y N N

adapters)

Microsoft Windows* CE 3.0

Microsoft Windows* CE .NET

Linux* 2.4.19

Windriver* VxWorks 5.x

QNX* Neutrino v6

Major Chipset Functions

10 USB 1.1 support available separately from third-party vendors

21 Some Wireless adapters are not supported by all operating systems; check supported operating systems at

http://support.intel.com/support/network/wireless/31485.htm.

developer.intel.com Communications and Embedded Developer’s Networks

193

Intel®Communications Alliance

The Intel®Communications Alliance is a community of communications and embedded developers and solutions

providers who share a vision of the convergence of communications and embedded computing technologies. Members

of the Intel Communications Alliance include operating systems and tools providers, software providers, hardware

providers and integrators. These companies share a commitment to accelerating the convergence of computing and

communications based on Intel®technologies, products and services. By networking, building new relationships and working

together, members of the Intel Communications Alliance have the opportunity to deliver innovative solutions, in less time

at lower cost, and pass these competitive beneﬁts on to their customers. Intel works with community members, providing

underlying communications and computing technologies and driving the industry-standard speciﬁcations needed for greater

choice, stability and opportunities for market segment growth.

The Intel Communications Alliance reﬂects Intel’s growing commitment to the success of communications and embedded

market segments in key areas:

■Communications and computing technologies and industry initiatives

■Solutions development and co-marketing assistance

■Standards leadership

Identiﬁcation with the Intel Communications Alliance positions member companies as industry leaders. Active

participation creates unique opportunities to engage with Intel and beneﬁt from opportunities only possible through

collaboration with the worldwide communications and embedded ecosystem. Engage with the Intel Communications

Alliance and share the beneﬁts of our worldwide community.

http://www.intel.com/go/ica

Communications and Embedded

Developer’s Networks

A community of communications and embedded

developers and solution providers

Intel® Communications Alliance

Communications and Embedded Developer’s Networks developer.intel.com

194

Intel®Personal Internet Client Architecture Developer Network

Membership in the Intel®PCA Developer Network provides application developers, device manufacturers, development

tools vendors, and service providers with technical data, marketing support, marketing exposure, marketing

opportunities, and industry connections they need to accelerate the innovation and marketing of wireless Internet solutions.

Joining this Web-based community today provides you with even easier access to the resources you need to design,

develop, and deploy innovative solutions based on this widely supported standards-based architecture. Here are just some

of the beneﬁts:

■Now it is easier to make the industry connections you need through the Intel PCA Developer Network Company

Directory.

■The new and enhanced Intel®PCA Developer Network Solutions Catalog provides even faster access to Intel®PCA

building blocks, third-party tools, and software.

■Intel PCA Development Support and Technical Support pages deliver the data you need.

■The Intel®PCA Developer Network Newsletter keeps you informed on the latest Intel®PCA wireless solutions.

Beneﬁts

PCA Developer Network provides access to critical product and software tool information to enable members to bring

solutions to the market. Members become part of community to share valuable information to help accelerate the

development of wireless solutions. Intel PCA Developer Network provides members the following beneﬁts:

■Advance information

■Access to development tools and platforms

■Software building blocks for applications

■Application and technical support

■Marketing assistance and cooperative marketing opportunities

■Networking and matchmaking opportunities

■Joining the community is easy. Register today at no cost and accelerate your innovation. Please see link:

http://developer.intel.com/pca/developernetwork/about.htm

http://www.intel.com/pca

Intel® PCA

Developer Networ

It's all about being first!

COMPREHENSIVE SUPPORT FOR EMBEDDED PRODUCTS

Intel is proud of the wide variety of hardware and software development tools available to support you in all phases of the

development cycle. Some of the industry’s leading tools suppliers are providing high-performance Windows*-based

software; full-featured, real-time emulators; along with ﬂexible, fully integrated device programming support for Intel’s

embedded products. We are committed to providing the tools and support needed to speed the learning curve and reduce

design time. The pages that follow list our tool vendors and contact information, including World Wide Web addresses. Feel

free to contact them directly, browse their home site, or look up their tool fact sheets on Intel’s Web-based Electronic Tools

Catalog at: http://appzone.intel.com/toolcatalog/.

MICROCONTROLLERS, NETWORK AND MICROPROCESSORS—Hardware Support

MCS®196/296 MCS®51/251 80X86 AND PENTIUM®PENTIUM®II, PENTIUM®III PENTIUM®4 AND XEON™

MICROCONTROLLERS MICROCONTROLLERS PROCESSORS AND CELERON®PROCESSORS PROCESSORS

Supports both 196 & 296

Microcontrollers

ACCESSORIES/ADAPTERS

Emulation Technology, Inc. Emulation Technology, Inc. Adapter Technologies, Inc. American Arium American Arium

Tribal Microsystems Emulation Technology, Inc. Intel Corp. Intel Corp.

Hitex Development Tools GmbH

EMULATORS

Dr. Krohn & Stiller CEIBO, Inc. American Arium Agilent American Arium

Huntsville Microsystems ChipTools, Inc. CEIBO, Inc. American Arium

Lauterbach Datentechnik Dr. Krohn & Stiller Hewlett-Packard Company Applied Microsystems Corp.

GmbH Emulation Technology, Inc. Hitex Development Tools GmbH Microtek International

Nohau Corp. Agilent Microtek International

Phyton Hi-Lo Systems Research Signum Systems

Signum Systems HiTech Equipment Corp. Softaid, Inc.

Hitex Development Tools GmbH## Sophia Systems

Huntsville Microsystems

ISystems

Lauterbach Datentechnik

GmbH

MetaLink Corp., Inc.

Nohau Corp.

Signum Systems

Tribal Microsystems

MIcetek International

EVALUATION BOARDS AND KITS

Intel Corp. HiTech Equipment Corp. Intel Corp. Intel Corp. Intel Corp.

The Dearborn Group Intel Corp.

HARDWARE ACCESSORIES—MEMORY & STORAGE

Forte Design Systems ITT Cannon Adtron Corp. Adtron Corp. Adtron Corp.

Newnex AnnaSoft AnnaSoft AnnaSoft

Forte Design Systems Datalight, Inc. Datalight, Inc. Datalight, Inc.

Intel Corp. Intel Corp. Intel Corp.

M-Systems Inc. M-Systems Inc. M-Systems Inc.

Microsoft Corp. Microsoft Corp. Microsoft Corp.

Phoenix Technologies Phoenix Technologies Phoenix Technologies

Syquest Technology Syquest Technology Syquest Technology

LOGIC/BUS ANALYZERS

Agilent Agilent DLI Digital Logic Instruments GmbH Agilent Agilent

Hewlett-Packard Company Tektronix, Inc. Tektronix, Inc.

Agilent

Tektronix, Inc.

PC/104 MODULES

Adtron Corp. Adtron Corp.

Ampro Computers, Inc. Ampro Computers, Inc.

EEPD EEPD

Imagenation Corp. Jumptec

Jumptec

Motion Engineering, Inc.

developer.intel.com/design/develop.htm Development Tools and Support

195

Development Tools and Support

Development Tools and Support developer.intel.com/design/develop.htm

196

MICROCONTROLLERS, NETWORK AND MICROPROCESSORS—Hardware Support

(continued)

MCS®196/296 MCS®51/251 80X86 AND PENTIUM®PENTIUM®II, PENTIUM®III PENTIUM®4 AND XEON™

MICROCONTROLLERS MICROCONTROLLERS PROCESSORS AND CELERON®PROCESSORS PROCESSORS

Supports both 196 & 296

Microcontrollers

SINGLE BOARD COMPUTING

Advantech Advantech Advantech

American Predator Corp. American Predator Corp. Diversiﬁed Technology

Ampro Computers, Inc. Ampro Computers, Inc. Force Computers

Carlo Gavazzi Carlo Gavazzi Kontron

Cell Computing Cell Computing Nexcom

Concurrent Technologies Concurrent Technologies Portwell

Diversiﬁed Technology Diversiﬁed Technology RadiSys Corp.

Force Computers Force Computers Trenton Technology

HiTech Equipment Corp. I-Bus

I-Bus Itox

ICS Advent Jumptec

Itox Kontron

Jumptec Micro Industries

Kontron Micro Industries Microbus

Microbus Motorola Computer Group

Motion Engineering, Inc. Pep Modular Computers

Motorola Computer Group Portwell

Pep Modular Computers RadiSys Corp.

Portwell SBS Technologies

RadiSys Corp. Trenton Technology

SBS Technologies VMIC

Trenton Technology WinSystems

VMIC

WinSystems

SUPPORT COMPONENTS

Intel Corp. Intel Corp.

National Semiconductor National Semiconductor

Vadem Vadem

MICROCONTROLLERS, NETWORK AND MICROPROCESSORS—Hardware Support

i960®STRONGARM* INTEL®XSCALE™INTEL®IXA NETWORK

PROCESSORS PROCESSORS TECHNOLOGY PROCESSORS

Supports I/O Processors 80200/80312 IXP 220/225/425

PXA210/PXA250 IXP 1200/2400/2800

ACCESSORIES/ADAPTERS

Cyclone Microsystems, Inc.

Emulation Technology, Inc.

Intel Corp.

PLX Technology, Inc.

SKY Computers, Inc.

EMULATORS

Corelis, Inc. Applied Microsystems Corp. ARM, Ltd. Applied Microsystems Corp.

Spectrum Digital, Inc. ARM, Ltd. Embedded Performance, Inc. ARM, Ltd.

Sophia Systems Lauterbach Datentechnik, GmbH Embedded Performance, Inc.

Macraigor Systems LLC Lauterbach Datentechnik, GmbH

Sophia Systems Macraigor Systems LLC

Wind River Systems, Inc. Sophia Systems

Wind River Systems, Inc.

EVALUATION BOARDS AND KITS

CompuLab Acorn Systems ADI Engineering Intel Corp.

Cyclone Microsystems, Inc. China Business Services Cyclone Microsystems, Inc. RadiSys Corp.

Intel Corp. Cogent Computer Systems, Inc. Intel Corp.

GDA Technologies Wind River Systems, Inc.

HARDWARE ACCESSORIES—MEMORY AND STORAGE

Emulation Technology, Inc.

LOGIC/BUS ANALYZERS

Agilent Tektronix, Inc. Agilent Agilent

DLI Digital Logic Corelis, Inc. New Wave PDG

Instrument GmbH Tektronix, Inc. Tektronix, Inc.

developer.intel.com/design/develop.htm Development Tools and Support

197

MICROCONTROLLERS, NETWORK AND MICROPROCESSORS—Hardware Support

(continued)

i960®STRONGARM* INTEL®XSCALE™INTEL®IXA NETWORK

PROCESSORS PROCESSORS TECHNOLOGY PROCESSORS

Supports I/O Processors 80200/80312 IXP 220/225/425

PXA210/PXA250 IXP 1200/2400/2800

PC/104 MODULES

SINGLE BOARD COMPUTING

Cyclone Microsystems, Inc. Accelent Systems, Inc. ADI Engineering Force Computers

ADS Cyclone Microsystems, Inc. Kontron

RadiSys Corp.

SUPPORT COMPONENTS

Applied Micro Circuits Corp. ADI Engineering

Galileo Technology, Inc.

Intel Corp.

V3 Semiconductor

MICROCONTROLLERS, NETWORK AND MICROPROCESSORS—Software Support

MCS®196/296 MCS®51/251 80X86 AND PENTIUM®PENTIUM®II, PENTIUM®III PENTIUM®4 AND XEON™

MICROCONTROLLERS MICROCONTROLLERS PROCESSORS AND CELERON®PROCESSORS PROCESSORS

ASSEMBLERS & COMPILERS, LINKERS/LOCATORS

IAR Systems Avocet Systems, Inc. Borland International CAD-UL, Inc. Red Hat

Phyton, Inc. IAR Systems CAD-UL, Inc. Red Hat Intel Corp.

Tasking Intel Corp. Red Hat Intel Corp. GNU

Keil Elektronik GmbH*. DDC-I, Inc. GNU Microsoft Corp.

Micro Computer Control Corp. Intel Corp. Microsoft Corp.

Tasking. GNU

MetaWare, Inc.

Metrowerks

Microsoft Corp.

Rational Software Corp.

Thomson Software Products

BIOS

American Megatrends, Inc. American Megatrends, Inc. American Megatrends, Inc.

AnnaSoft Award Software International, Inc. Award Software International, Inc.

Award Software International, Inc. General Software, Inc. General Software, Inc.

General Software, Inc. Insyde Software Insyde Software

Insyde Software Phoenix Technologies Phoenix Technologies

Phoenix Technologies

BOARD TESTERS

Antron/Psilogic Antron/Psilogic Antron/Psilogic

International Test Technologies International Test Technologies International Test Technologies

DEBUGGERS

ChipTools, Inc. ChipTools, Inc. AnnaSoft CAD-UL, Inc. Red Hat

IAR Systems CAD-UL, Inc. Red Hat GNU

Intel Corp. Concurrent Sciences, Inc. GNU Microsoft Corp.

Tasking Embedded Power Corp. Microsoft Corp.

Universal Cross-Assemblers Micro Digital, Inc.

Microsoft Corp.

Paradigm Systems

DEVELOPMENT SOFTWARE

Chip Tools, Inc. Avocet Systems Cogent Real-Time Systems, Inc. Cogent Real-Time Systems, Inc. Cogent Real-Time Systems, Inc.

IAR Systems Intel Corp. Intel Corp. Intel Corp.

Phyton, Inc. Intrinsyc Software, Inc. Intrinsyc Software, Inc. Intrinsyc Software, Inc.

Tasking Log Point Technologies, Inc.

FUZZY LOGIC SOFTWARE

Aptronix

Inform

Syndesis

Development Tools and Support developer.intel.com/design/develop.htm

198

MICROCONTROLLERS, NETWORK AND MICROPROCESSORS—Software Support

(continued)

MCS®196/296 MCS®51/251 80X86 & PENTIUM®PENTIUM®II, PENTIUM®III PENTIUM®4 AND XEON™

MICROCONTROLLERS MICROCONTROLLERS PROCESSORS AND CELERON®PROCESSORS PROCESSORS

OPERATING SYSTEMS AND REAL-TIME EXTENSIONS

CMX Company CMX Company Accelerated Technology, Inc. LynuxWorks LynuxWorks

Embedded Systems Products, Inc. Embedded Systems Products, Inc. AnnaSoft Microsoft Corp. Microsoft Corp.

IAR Systems Signum Systems Datalight, Inc. MontaVista Software MontaVista Software

Embedded Systems Products, Inc. QNX Software Systems, Ltd. QNX Software Systems, Ltd.

IBM Software Group—OEM Sales VenturCom, Inc. VenturCom, Inc.

Industrial Programming, Inc. Wind River Systems, Inc. Wind River Systems, Inc.

Integrated Systems, Inc.

JMI Software Systems, Inc.

KADAK Products Ltd.

LynuxWorks

Micro Digital, Inc.

Microsoft Corp.

Microtec

Microware Systems Corp.

On Time Marketing

Phar Lap Software, Inc.

QNX Software Systems Ltd.

RadiSys Corp.

U.S. Software

VenturCom, Inc.

Wind River Systems, Inc.

PROGRAMMERS

Advin Systems, Inc. Advin Systems, Inc.

BP Microsystems, Inc. BP Microsystems, Inc.

Data I/O Corp. CEIBO, Inc.

Needham’s Electronics Data I/O Corp.

Phyton, Inc. Needham’s Electronics

SMS Microcomputer Systeme GmbH Phyton, Inc.

Stag Programmers Ltd. SMS Microcomputer Systeme GmbH

System General Corp. (US) System General Corp. (US)

Tribal Microsystems Tribal Microsystems

Zorchip Corporation

MODELING/SIMULATION

Chip Tools, Inc. Synopsys, Inc. Synopsys, Inc. Synopsys, Inc.

Chronology Corp.

SOFTWARE MODEM

SOFTWARE TEST/VERIFICATION

Applied Microsystems Corp. Applied Microsystems Corp. Applied Microsystems Corp.

VOICE RECOGNITION

MICROCONTROLLERS, NETWORK AND MICROPROCESSORS—Software Support

i960®STRONGARM* INTEL®XSCALE™INTEL®IXA NETWORK

PROCESSORS PROCESSORS TECHNOLOGY PROCESSORS

ASSEMBLERS & COMPILERS, LINKERS/LOCATORS

Green Hills Software, Inc. ARM, Ltd. ARM, Ltd. ARM, Ltd.

Intel Corp. Red Hat GNU GNU

Irvine Compiler Corp. GNU Green Hills Software, Inc. Green Hills Software, Inc.

Green Hills Software, Inc. Intel Corp. Intel Corp.

MetaWare, Inc. LynuxWorks LynuxWorks

MontaVista MontaVista

Red Hat Red Hat

Wind River Systems, Inc. Wind River Systems, Inc.

BIOS

BOARD TESTERS

Corelis, Inc. Corelis, Inc.

International Test Technologies

developer.intel.com/design/develop.htm Development Tools and Support

199

MICROCONTROLLERS, NETWORK AND MICROPROCESSORS—Software Support

(continued)

i960®STRONGARM* INTEL®XSCALE™INTEL®IXA NETWORK

PROCESSORS PROCESSORS TECHNOLOGY PROCESSORS

DEBUGGERS

Accelerated Technology, Inc. ARM, Ltd. ARM, Ltd. ARM, Ltd.

ARM, Ltd. Red Hat Green Hills Software, Inc. Green Hills Software, Inc.

Green Hills Software, Inc. GNU Red Hat Intel Corp.

Integrated Systems, Inc. Green Hills Software, Inc. LynuxWorks LynuxWorks

Intel Corp. MetaWare, Inc. MontaVista MontaVista

Real-Time Innovations, Inc. Wind River Systems, Inc. RadiSys Corp.

Red Hat

Wind River Systems, Inc.

DEVELOPMENT SOFTWARE

Green Hills Software, Inc. ARM, Ltd. ARM, Ltd. Consystant

Intel Corp. Red Hat Accelerated Technology, Inc. Intel Corp.

Wind River Systems, Inc. GNU Green Hills Software, Inc. MontaVista

Green Hills Software, Inc. Red Hat RadiSys Corp.

MetaWare, Inc. Wind River Systems, Inc. Teja Technologies

Wind River Systems, Inc.

FUZZY LOGIC SOFTWARE

OPERATING SYSTEMS AND REAL-TIME EXTENSIONS

Accelerated Technology, Inc. Accelerated Technology, Inc. Accelerated Technology, Inc. Accelerated Technology, Inc.

JMI Software Systems, Inc. CMX Company OSE Systems LynuxWorks

KADAK Products Ltd. Embedded Systems Products, Inc. Express Logic, Inc. MontaVista

NSI Com Express Logic, Inc. LynuxWorks OSE Systems

Wind River Systems, Inc. Integrated Systems, Inc. MontaVista QNX Software

JMI Software Systems, Inc. Microware Systems, Corp. RadiSys Corp.

KADAK Products Ltd. QNX Software Wind River Systems, Inc.

Lucent Technologies, Inc. Red Hat

LynuxWorks Wind River Systems, Inc.

Mentor Graphics Corp.

Microsoft Corp.

Microware Systems Corp.

MontaVista

Net BSD

Perihelion Distributed Software Ltd.

Sun Microsystems, Inc.

Symbian

U.S. Software

Wind River Systems, Inc.

PROGRAMMERS

MODELING/SIMULATION

Integrated Systems, Inc. Applied Microsystems Corp. ARM, Ltd. Intel Corp.

Synopsys ARM, Ltd. Red Hat

Corelis Inc. VaST Systems Technology

Summit

SOFTWARE MODEM

Altacom

PC Tel

Surf

SOFTWARE TEST/VERIFICATION

Dragon Systems L & H

Development Tools and Support developer.intel.com/design/develop.htm

200

MICROCONTROLLERS, NETWORK AND MICROPROCESSORS—

Other Products and Services

MCS®196/296 MCS®51/251 80X86 AND PENTIUM®PENTIUM®II, PENTIUM®III PENTIUM®4 AND XEON™

MICROCONTROLLERS MICROCONTROLLERS PROCESSORS AND CELERON®PROCESSORS PROCESSORS

CONSULTING SERVICES

Applied Microsystems Corp. Applied Microsystems Corp.

NETWORKING

Applied Microsystems Corp. RouterWare, Inc. RouterWare, Inc.

U.S. Software U.S. Software

PCI BOARDS AND COMPONENTS

FuturePlus Systems FuturePlus Systems FuturePlus Systems

Agilent Agilent Agilent

PCI BOARDS TOOLS

PRINTERS

SYSTEM INTEGRATORS

X WINDOW SYSTEM

INTELLIGENT I/O S/W TOOLS

MICROCONTROLLERS, NETWORK AND MICROPROCESSORS—

Other Products and Services

i960®STRONGARM* INTEL®XSCALE™INTEL®IXA NETWORK

PROCESSORS PROCESSORS TECHNOLOGY PROCESSORS

CONSULTING SERVICES

CompuLab Accelent Systems, Inc. ADI Engineering RadiSys Corp.

Intel Corp. ADS Cyclone Microsystems, Inc. Silicon & Software Systems

Venture Technologies Anigma Design Interface Ltd. Wind River Systems, Inc.

China Business Services

ISI Design

NETWORKING

CompuLab

Harris & Jeffries

Integrated Systems, Inc.

PCI BOARDS AND COMPONENTS

Applied Micro Circuits Corp. Cyclone Microsystems, Inc. RadiSys Corp.

Catalyst Enterprise, Inc.

Cyclone Microsystems, Inc.

Gefen Computer Engineering, Ltd.

Intel Corp.

PLX Technology

V3 Semiconductor

developer.intel.com/design/develop.htm Development Tools and Support

201

MICROCONTROLLERS, NETWORK AND MICROPROCESSORS—

Other Products and Services (continued)

i960®STRONGARM* INTEL®XSCALE™INTEL®IXA NETWORK

PROCESSORS PROCESSORS TECHNOLOGY PROCESSORS

PCI BOARDS TOOLS

Catalyst Enterprise, Inc.

Corelis, Inc.

FuturePlus Systems

Hewlett-Packard Company

PRINTERS

Advanced Hardware Architecture

Bitstream, Inc.

Destiny Technology Corp.

Intel Corp.

Peerless Systems Corp.

Pipeline

Xionics Document Technologies, Inc.

SYSTEM INTEGRATORS

AnnaSoft Silicon & Software Systems

Bsquare Corp. Wipro

Eclipse

X WINDOW SYSTEM

AGE Logic, Inc.

INTELLIGENT I/O S/W TOOLS

Intel Corp. Wind River Systems, Inc.

Serano Systems, Corp.

Wind River Systems, Inc.

Development Tools and Support developer.intel.com/design/develop.htm

202

developer.intel.com Price Quote and Ordering

203

North American Distributors:

Arrow Electronics, Inc.

50 Marcus Drive

Melville, NY 11747

Tel: 800-777-2776

Avnet Cilicon

2211 South 47th Street

Phoenix, AZ 85034

Tel: 800-408-8353

Digi-Key

701 Brooks Ave. South

Thief River Falls, MN 56701

Tel: 800-344-4539

Rochester Electronics, Inc.

10 Malcolm Hoyt Drive

Newburyport, MA 01950

Tel: 978-462-9332

European Distributors

Austria

Silica (An Avnet Company)

Diefenbachgasse 35-2

A-1150 Wien

Tel: +43 1 866 42 0

Fax: +43 1 866 42 350

E-mail: silica.wien@avnet.com

Spoerle an Arrow Company

Landstraßer Hauptstrasse 97-101(Stiege 1 /4A)

1030 Vienna, Austria

Tel: +43 1 3 60 46 0

Fax: +43 1 3 60 46 90

www.spoerle.com

Spoerle an Arrow Company

Am Kehlerpark 1

16850 Dornbirn, Austria

Tel: +43 (0)5572 38 65 00-0

Fax: +43 (0)5572 38 65 00-90

E-mail: Vertrieb.Dornbirn@spoerle.com

Unique Memec

Diefenbachgasse 35A

1150 Wien, Austria

Tel: +43 1 892 85 60

Fax: +43 1 862 85 60 25

E-mail: info@unique.at.memec.com

Belgium

Arrow Spoerle Electronic

Keiberg II

Minervastraat 14/B2

1930 Zaventem, Belgium

Tel: +32(0)272-54660

Fax: +32(0)272 54511

Getronics Belux

Research Park Zellik

Pontbeeklaan 43

1731 Zellik, Belgium

Tel: +32(0)24671755

Fax: +32(0)24671748

www.getronics.be

Getronics Belux

Place Madouplein 1 box 8

1210 Brussels, Belgium

Tel: +32 (0)2 229 91 11

Fax: +32 (0)2 229 92 00

Unique Memec

Gen. De Wittelaan N 17, B10

2800 Mechelen, Belgium

Tel: +32 15 44 00 80

Fax: +32 15 44 00 88

E-mail: info@unique.be.memec.com

www.unique.memec.com

Silica (An Avnet Company)

Kouterveldstraat 20

1831 Diegem, Belgium

Tel: + 32 (2) 709 90 00

Fax: +32 (2) 709 98 10

E-mail: silica.belgium@avnet.com

Bulgaria

Unique Memec

no ofﬁce address

Tel: +35 92 719 103

Fax: +35 92 971 440 1

E-mail: info@bg.memec.com

Croatia

Unique Memec

no ofﬁce address

Tel: +38 51 23 245 4

Fax: +38 51 23 245 4

E-mail: info@hr.memec.com

Czech Republic

Spoerle Electronic

Charkovská 24

101 00 Praha 10, Czech Republic

Tel: +42 02 71 74 20 00

Fax: +42 02 71 74 20 01

Silica (An Avnet Company)

Argentinská 38/286

CZ - 170 00 Praha 7

Tel: +420 2 3409 1031

Fax: +420 2 3409 1030

E-mail: silica.praha@avnet.com

Unique Memec

no ofﬁce address

Tel: +420 24 1933765-26

Fax: +420 24 1933765-27

E-mail: info@cz.memec.com

Denmark

Arrow Component Denmark

Snedehoilm 13A

2730 Herlev, Denmark

Tel: +45 7010-2211

Fax: +45 44 50 82 10

Silica (An Avnet Company)

Banemarksvej 50

2605 Brondby, Denmark

43 22 80 1044 88 08 00

Fax: +45 43 22 80 11

E-mail: silica.denmark@avnet.com

Unique Memec

Tempovej 16

2750 Ballerup, Denmark

Tel: +45 4343 2020

Fax: +45 4343 2122

www.unique.memec.com

Finland

Arrow Finland

Kalkkipellontie 4

Box 280

FIN-02600 Espoo, Finland

Tel: +358 9 47 66 60

Fax: +358 9 47 66 63 19 (Administration)

Fax: +358 9 47 66 63 27 (Sales)

Silica (An Avnet Company)

Niittykatu 8

FIN-02200 Espoo

Tel: +358 (0) 9 613 182 00

Fax: +358 (0) 9 613 182 80

E-mail: silica.helsinki@avnet.com

Unique Memec

Kutojantie 7 - 02630

Espoo, Finland

Tel: +358 9 25 35 44 60

Fax: +358 9 25 35 44 77

E-mail: info@unique.ﬁ.memec.com

France

Arrow Electronique S.A:

21, rue du Jura

Silic 585

94633 RUNGIS Cedex, France

Tel: +33 (0) 1 4978 4900

Fax: +33 (0) 1 41 80 96 30

Silica (An Avnet Company)

6 / 8 rue Ambroise Croizat, ZAE les glaises

91127 Palaiseau Cedex, France

Tel: +33 (0)1 64 47 29 29

Fax: +33 (0)1 64 4700 84

E-mail: silica.paris@avnet.com

Unique Memec

8 rue de L'Esterel, Silic 583

94663 Rungis Cedex, France

Tel: +33 1 46 87 22 00

Fax: +33 1 46 87 80 49

www.unique.memec.com

Germany

Arrow Spoerle Germany

Max Planck Str. 1-3

63303 Dreieich, Germany

Tel: +49 (0) 6103 30 42 01

Fax: +49 (0) 6103 304 - 0

www.spoerle.com

Silica (An Avnet Company)

Gruber Strasse 60c

85586 Poing, Germany

Tel: +49-8121-777 02

Fax: +49-812 777 531

E-mail: silica.muenchen@avnet.com

Unique Memec

Leonhardsweg 4

82008 Unterhaching, Germany

Tel: +49 89 61 52 390

Fax: +49 89 61 52 39 97

E-mail: info@unique.de.memec.com

Greece

Arrow Electronics Hellas

Elia Eliou 31

Athens 11743, Greece

Tel.: +30-210-9020165

Fax: +30-210-9022118

Silica (an Avnet Company)

1, Anaxagora Street

GR-17778 Tavros (Athens)

Phone: +30-210-342 51 28

Fax: +10-210-341 43 04

Email: silica.greece@avnet.com

Unique Memec

no ofﬁce address

Tel.: +30 210 325 362 6

Fax: +30 210 321 606 3

E-mail: info@gr.memec.com

Hungary

SPOERLE ELECTRONIC

BUDAPEST

Váci út 45

1134 Budapest

Fax: (01) 350 6277

Tel: (01) 3506275 / 76; 329 4202

E-mail: SalesOfﬁce.Budapest@spoerle.com

Silica (An Avnet Company)

Montevideo u. 2/B

1037 Budapest, Hungary

Tel: +36 1 436 72 15

Fax: +36 1 43 672 13

E-mail: silica.budapest@avnet.com

Unique Memec

no ofﬁce address

Tel: +36 1 231 700 0

Fax: +36 1 231 70 11

E-mail: info@hu.memec.com

Ireland

Arrow Electronics Ltd

10A Second Floor

Beckett Way

Park West

Dublin 12, Ireland

Tel: +353 1 629 870 0 (Reception)

Fax: +353 1 629 870 1

Silica (An Avnet Company)

Unit 7, Swords Business Park

Swords Co., Dublin, Ireland

Tel: +353 1 890 1000

Fax: +353 1 890 101 0

E-mail: silica.dublin@avnet.com

Unique Memec

Gardner House, Bank Place

Limerick, Ireland

Tel: +353 61 31 61 16

Fax: +353 61 31 61 17

www.unique.memec.com

Israel

Arrow\Rapac Ltd.

60 Amal St.

Kiryat-Arieh

Petach-Tikva 49130

Tel: +972-3-9203456

Fax: +972-3-9203443

www.arrow-israel.co.il

Eastronics Israel

Rozanis Street 11

P.O.B. 39300

Tel Baruch 61392 Tel-Aviv, Israel

Tel: +972 3 6458746

Fax: +972 3 6458 666

E-mail: eastronics.co.il

www.eastronics.co.il

Italy

Arrow Silverstar

Viale Fulvio Testi, N 280

I-20126 Milano, Italy

Tel: +39-02-66-1251

Fax: +39-02-66101-359

Arrow Lasi Elettronica -Milano

Viale Fulvio Testi 280

20126 Milano, Italy

Tel: +39 02 661431

Fax: +39 02 66101385

Silica (An Avnet Company)

Via Valtellina 23/25

I-20092 Cinisello B., MI

Tel: +39 02 660 921

Fax: +39 02 660 165 43

E-mail: silica.milano@avnet.com

Unique Memec

Via Bernina 7

20158 Milano, Italy

Tel: +39 02 60 79 51

Fax: +39 02 68 87 143

E-mail: info@unique.it.memec.com

Netherlands

Arrow / Spoerle Electronic

Postbus 476

3990 GC Houten, Netherlands

Tel: +31(0)30 6 39 12 05

Fax: +31(0)30 6 39 12 34

E-mail: SalesOfﬁce.Utrecht@spoerle.com

Getronics

Energieweg 1

2627 AP

P.O Box 125

2600 AC Delft, Netherlands

Tel: +31(0)152609906

Fax: +31(0)152619194

www.getronics.nl

Distributor and Manufacturing Representatives

* Third-party marks and names are the property of their respective owners.

Intel Corporation makes no warranty for the use of its products and assumes no responsibility for any errors that may appear in this document. Intel retains the right to make changes to the speciﬁcations at any time, without

notice. Contact your local Intel sales ofﬁce or distributor to obtain the latest speciﬁcations before placing your order. Intel Corporation makes no warranty as to the content or reliability of the third-party tool vendor information

contained herein.

Price Quote and Ordering developer.intel.com

204

Gertronics

Donauweg 10

P.O. Box 652

1000 AR Amsterdam, Netherlands

Tel: +31 (20) 5861412

Fax: +31 (20) 5861568

Silica (An Avnet Company)

Takkebijsters 2

4802 HV Breda, Netherlands

Tel: +31 76 572 27 00

Fax: +31 76 572 270 7

E-mail: Silica.breda@avnet.com

Unique Memec

Insulindelaan 134

5613 Eindhoven, Netherlands

Tel: +31 40 26 59 399

Fax: +31 40 26 59 393

E-mail: info@unique.nl.memec.com

Norway

Arrow Components Norway AS

Trygve Nilsens Vei 8

P.O.Box 91 Furuset

N-1001 Oslo, Norway

Tel: +47 52763000

Fax: +47 21306550

Silica (An Avnet Company)

Hagaløkkveien 7

Postboks 63

NL-1371 Asker, Norway

Tel: +47 66 77 36 00

Fax: +47 66 77 36 77

E-mail: silica.norway@avnet.com

Unique Memec

Smedsvingen 4

P.O. Box 366

1379 Nesbru, Norway

Tel: +47 66 77 45 40

Fax: +47 66 77 45 49

E-mail: info@unique.no.memec.com

www.unique.memec.com/

Poland

SPOERLE ELECTRONIC Polska Sp. Zo.o

ul. Sobieskiego 110/28

00-764 Warszawa

Tel: +48 22 856 90 90

Fax: +48 22 851 61 36

Avnet EM Sp. z o.o.

ul. Domaniewska 39a

PL-02-672 Warszawa, Poland

Tel: +48 22640 2351

Fax: +48 22640 2354

E-mail: silica.warszawa@avnet.com

UNIQUE MEMEC POLSKA sp. z o.o.

ul. Sowinskiego 5

PL-44-1000 Gliwice, Poland

Polska

Tel: +48 32 238 03 41

Fax: +48 32 238 06 92

E-mail: info@pl.memec.com

Portugal

ARROW Iberia Electronica

Avda. das Larangeiras 12

2720 Amadora-Lisboa

Portugal

Tel: 351 21 471 48 06

Fax: 351 21 471 08 02

Silica (An Avnet Company)

Rua Corujeira de Baixo 452

PT-4300 -150 Porto; Portugal

Tel: +351 (0) 22 589 8070

Fax: +351 (0)22 589 8071

E-mail: silica.porto@avnet.com

www.aac.avnet.com/europe

Russia

Spoerle Electronic

Avakiana Str. 32/3 Appt. 12

220065 Minsk, Belarus

Mob: +375 29 666 7709

Tel: +375 172197625

Fax: +375 172197625

Kvazar-Micro-M

76, Butyrskaya Str.

125015 Moscow

Russia

Tel: +7 095 210 07 00

Fax: +7 095 210 07 00

E-mail: kmm@kvazar-micro.ru

www.kvazar-micro.ru

Silica (an Avnet company)

Korovinskoye Chaussee 10

Building 2, Ofﬁce 25

RUS-127484 Moscow

Tel: +386 (0)1 430 1461

Fax: +386 (0)1 430 1464

E-mail: silica.russia@avnet.com

Unique Memec

no ofﬁce address

Tel.: +7 095 234 063 6

Fax: +7 095 234 064 0

E-mail: info@ru.memec.com

Serbia and Montenegro

Unique Memec

no ofﬁce address

Tel: +381 11 316 095 7

Fax: +381 11 316 095 7

Slovakia

Unique Memec

no ofﬁce address

Tel: +421 2 482 508 50

Fax: +421 2 482 508 54

E-mail: info@sk.memec.com

Slovenia

Unique Memec

no ofﬁce address

Tel: +386 1 568 013 1

Fax: +386 1 568 012 0

South Africa

Arrow Altech Distribution (Pty) Ltd.

53-57 Yaldwyn Road

Hughes Ext, Jet Park

1600 Johannesburg, South Africa

Tel: 27119239600

Fax: 27119239887

E-mail: info@arrow.altech.co.za

www.arrow.altech.co.za

Unique Memec

101 Heritage House

20 Dreyer Street

7700 Claremont, South Africa

Tel: +27 21 674 0835

Fax: +27 21 674 0852

www.unique.memec.com

Spain

Arrow Iberia Electronica

c/ Albasanz 75

28037 Madrid, Spain

Tel: + 34 91 304 30 40

Fax: +34 91 304 24 72

www.arrowiberia.com

Silica (An Avnet Company)

C/Chile, 10-plta 2, oﬁc 229

Ediﬁcio Madrid 92

E-28290 Las Matas (Madrid), Spain

Tel: +34 91 372 71 00

Fax: +34 91 636 97 88

E-mail: silica.madrid@avnet.com

www.aac.avnet.com/europe

Unique Memec

Centro Empresarial El Plantio

Ochandiano 8-2 1

28023 Madrid, Spain

Tel: +34 91 3076 893

Fax: +34 91 37 29 453

E-mail: info@unique.es.memec.com

Sweden

Arrow Components Sweden

Box 67

Kronborgsgränd 19

SE-164 94 Kista, Sweden

Tel: +46 8 56265500

Fax: +46 8 56265770 (Arrow Nordic)

Fax: +46 8 56265550 (Arrow Sweden)

Silica (An Avnet Company)

Englundavâgen 7

Box 1830

S-171 27 Solna, Sweden

Tel: +46 08-587 461 00

Fax: +46 08-587 463 01

E-mail: silica.stockholm@avnet.com

www.aac.avnet.com/europe

Unique Memec

Sehlstedtsgatan 6

115 28 Stockholm, Sweden

Tel: +46 8 45 97 900

Fax: +46 8 45 97 999

E-mail: info@unique.se.memec.com

Switzerland

Silica (An Avnet Company)

Hardstrasse 72

CH-5430 Wettingen, Switzerland

Tel: +41 056 437 51 11

Fax: +41 056 437 55 54

E-mail: silica.wettingen@avnet.com

www.aac.avnet.com/europe

Spoerle Electronic Schweiz

Riedmatt 9

8153 Rumlang, Switzerland

Tel: +41 18 17 6262

Fax: + 41 18 17 6200

Unique Memec

Gaswerkstrasse 32

4901 Langenthal, Switzerland

Tel: +41 62 91 94 200

Fax: +41 62 91 94 209

E-mail: info@unique.ch.memec.com

Turkey

Arrow Elektronik Ticaret A.S.

Cayiryolu sok Ucgen Plaza No:7Kat 8

81120 Icerenkoy

Istanbul, Turkey

Tel: +90 216 575 18 20

Fax: +90 216 575 18 30

Silica (an Avnet Company)

Bayar Gülbahar, Sok. Nr. 17

Perdemsac Plaza D:132

TR-34742 Istanbul

Tel: +90 216 361 89 58

Fax: +90 216 361 89 27

E-mail: silica.turkey@avnet.com

Unique Memec

no ofﬁce address

Tel: +90 216 339 611 9

Fax: +90 216 339 611 3

E-mail: info@tr.memec.com

Arrow Electronics (UK) Ltd

Edinburgh Way

Harlow

Essex CM20 2DF, UK

Tel: 01279 626777 (Sales)

Tel: 01279 455155 (Customer Service)

Tel: 01279 441144 (Reception)

Fax: 01279 455777

E-mail: sales@arrowuk.com

Silica (An Avnet Company)

Avnet House

Rutherford Close, Meadway

Stevenage, Herts SG1 2EF, UK

Tel: +44 (0)1438 788 310

Fax: +44 (0)1438 788 250

E-mail: silica.stevenage@avnet.com

Unique Memec

64/65 Rabans Close

Aylesbury

Buckinhamshire HP19 8TW, UK

Tel: +44 1296 39 73 96

Fax: +44 1296 39 74 39

E-mail: info@unique.uk.memec.com

www.unique.memec.com/

Ukraine

Kvazar-Micro

1, Severo-Syretskaya Str.

04136 Kiev

Ukraine

Tel: +380 (44) 442 9459

Fax: + 380 (44) 239 9868

E-mail: dic@kvazar-micro.com

www.kvazar-micro.com/

Unique Memec

no ofﬁce address

Tel: +380 44 290 829 4

Fax: +380 44 254 425 8

E-mail: info@ua.memec.com

Japanese Distributors

Asahi Electronics Co. Ltd.

Shinjuku IS Bldg 2nd Floor, 2-13-12 Shinjuku,

Shinjuku-ku, Tokyo, 160-0022 Japan

Tel: 03-3350-5418

Macnica, Inc.

Macnica Bldg. No. 1

1-6-3, Shin-Yokohama, Kohoku-ku,

Kanagawa, 222-8561 Japan

Tel: 045-470-9821

Okaya Electronics Corp.

Dai-2 Ueno Bldg. 6F

3-7-18 Shin-Yokohama, Kohoku-ku, Yokohama,

Danagawa, 222-0033 Japan

Tel: 045-475-1502

Ryoyo Electro Corp.

Konwa Bldg, 1-12-22 Tsukiji, Chuo-ku, Tokyo,

104-8408 Japan

Tel: 03-3546-5015

Tomen Electronics Corp.

Nishin Bldg, 1-8-27 Kohnan, Minato-ku,

Tokyo 108-8510, Japan

Tel: 03-5462-9618

Unidux, Inc.

Dia Semicon Systems Div.

Tobu AK Bldg, 3-23-3 Shin-Yokohama, Kohoku-ku,

Yokohama-city, Kanagawa-ken, 222-0033 Japan

Tel: 045-476-7451

Asian/Paciﬁc Distributors

Australia

Braemac

1/59-61 Burrows Road, Alexandria

Sydney, 2015 Australia

Tel: 61-2-95506600

Fax: 61-2-95506377

MemecEBV (NSD division)

Unit 6, 17-19 Melrich Road, Bayswater

Victoria, 3153 Australia

Tel: 61-3-97604333

Fax: 61-3-97604344

China

Avnet Sunrise Limited

Rm 612, Chang Xin Bldg..

39 AnDing Rd.

Chao Yang Dist.

Beijing, 100081 China

Tel: 86-10-64413113

Fax: 86-10-64438246

Distributor and Manufacturing Representatives

developer.intel.com Price Quote and Ordering

205

Avnet Sunrise Limited

21/ Strength Plaza.

No. 3, Lane 600

Tian Shan Rd.

Shanghai, 200051 China

Tel: 86-21-52062288

Fax: 86-21-52062099

Avnet Sunrise Limited

10/F, Block A, Electronic Technology Building

11 ZhenNan Zhong Road

Shenzhen, 518031 China

Tel: 86-755-83781886

Fax: 86-755-83783139

Avnet Sunrise Limited

7/F & 16F, Spectrum Tower

53 Hung To Road

KwunTong Hong Kong

Tel: 852-21765388

Fax: 23761235

Arrow Electronics

20/F, Tower Two, Ever Gain Plaza

88 Container Port Road

Kwai Chung, Hong Kong

Tel: 852-24842484

Fax: 852-24871268

Arrow Electronics

Rm F, 9/F, Phase 2, East Ocean Centre

618 Yanan Rd East

Shanghai, 200001 China

Tel: 86-21-53061871

Fax: 86-21-53061876

Arrow Electronics (Shenzhen) Limited

No. 109-112 Building

International Commerce and Exhibition Center

No. 1001 HongHua Road

Futian Free Trade Zone

Shenzhen, 518038 China

Tel: 86-755-3592920

Fax: 86-755-3592377

Arrow Electronics China Ltd.

Rm. 1002, 10F Manhattan

CNT Building

6 Chao YengMen Bei DaJie

Beijing, 10003227 China

Tel: 86-10-85282030

Fax: 86-10-85282698

Synnex Paciﬁc Limited

3/F Block A, Overseas Decoration Building

11 Zhenhua Road

ShenZhen 518031 China

Tel: 755-83342722

Fax: 852-83237466

Honestar Technologies Co., Ltd.

Room 1301-5, Cyber times

Tower A, Cyber Park

Futian District

Shenzhen 518041, PRC

Tel: 86 83475116

Fax: 86 834769911

Dragon Technology Distribution Co., Ltd.

Rm 1823, Landmark North,

Sheung Shui, New Territories

Hong Kong

Tel: (852) 2303 0711

Fax: (852) 2317 7522

WPI International (Hong Kong) Ltd.

Unit 1201-1205

12F/ Miremar Tower

132 Nathan Road

Tsim Sha Tsui

Kowloon, Hong Kong

Tel: (852) 27654860

Fax: (852) 27641129

India

Memec (Asia Paciﬁc) Ltd. Unique Div.

1st Floor, Sandhya Deep Building, 15

Community Centre East of Kailash

New Delhi, 110065 India

Tel: +91-11-6218801, 6225223

Fax: +6215023

WPI International (I) PVT Ltd.

405, Gateway Plaza, Hiranandani Gardens, Powai

Mumbai 400076 India

Tel: +91 22 570 5093

Fax: +91 22 570 5094

Tecnomic

111-113 A-Wing. Carlton Towers

1 Airport Road

Bangalore—560008 India

Tel: 91-80-5286934,5273594

New Zealand

Insight Electronics Pty Ltd.

69 Worchester Boulevard

Christchurch, New Zealand

Singapore

Achieva Components

240 Macpherson Road

#02-02, Pines Industrial Building

Singapore 348574

Tel: 65-8403107

Ingram Micro Asia Ltd

205 Kallang Bahru Road, #04-00

Singapore 339341

Tel: (65) 298 0888

Fax: (65) 3923294

WPI International (S) Pte Ltd.

10 Upper Aljunied Link #07-01/03

York Industrial Building

Singapore 367904

Tel: (65) 282 5188

Fax: (65) 280 4988

The Republic of Korea

Intechn Co.

52-3 Wonhyoro-2Ga Yongsan-Gu,

Seoul 140-112, The Republic of Korea

Tel: +82-2-2129-7960

Fax: +82-2-2129-7802

Uniquest Korea

8th Floor Dongsung Bldg.

158-24, Samsung-Dong

Kangnam-Ku, Seoul, The Republic of Korea

Tel: +82-2-3404-9900

Fax: +82-2-3404-9900

Taiwan

World Peace Industrial Co., Ltd.

1F, 76 Cheng Kung Road, Sec. 1,

Nan Kang, Taipei, Taiwan, R.O.C.

Tel: 886-2-27885200

Fax: 886-2-26510286

Synnex Technology International Corp.

4F, 75, Sec. 3, Ming-Sheng E. Rd.,

Taipei, Taiwan, R.O.C.

Tel: 886-2-25063320

Fax: 886-2-25000606

Acer Sertek Incorporated

8F, 88, Sec 1, Hsin Tai Wu Rd., Hsichin

Taipei Hsien 221, Taiwan, R.O.C.

Tel: 886-2-26963131

Fax: 886-2-26964817

ASEC International Corporation

4F No. 223 Chung Yang Road, Nan Kang

Taipei, Taiwan, R.O.C.

Tel: 886-2-27866677

Fax: 886-2-27865257

Micromax International Corp.

3F, No. 103, Sec. 2, Jiow-Jong Rd., Nei-Hu

Taipei, Taiwan, R.O.C.

Tel: 886-2-27962789

Fax: 886-2-27963889

North American

Manufacturer’s

Representatives

Alabama

Elcom

4940 Corporate Drive, Suite C

Huntsville, AL 35805

Tel: 770-447-8200

Arizona

Addem

8700 E. via de Ventura, Suite 265

Scottsdale, AZ 85258

Tel: 770-447-8200

Arkansas

BP Sales

689 West Renner Rd., Suite 101

Richardson, TX 75080

Tel: 972-234-8438

California–Southern

Vision Technical Sales

300 Goddard, Suite 150

Irvine, CA 92618

Tel: 949-450-9050

California–Northern

T3 Technical Sales

3211 Scott Blvd., Suite 201

Santa Clara, CA 95054

Tel: 408-350-3900

Colorado

Luscombe Engineering Company Inc. of Colorado

1500 Kansas Avenue, Suite 1B

Longmont, CO 80501

Tel: 303-772-3342

Connecticut

Impact Technical Sales

294 Cutlers Farm Road

Monroe, CT 06468

Tel: 203-268-7229

Delaware

Delta Technical Sales Inc.

122 North York Road, Suite 9

Hatboro, PA 19040

Tel: 215-957-0600

Florida

Elcom

801 International Parkway, Suite 5066

Lake Mary, FL 32746

Tel: 770-447-8200

Georgia

Elcom

4400 Rivergreen Parkway, Suite 120

Duluth, GA 30096

Tel: 770-447-8200

Idaho

Luscombe Engineering Company Inc. of Utah

6901 Emerald, Suite 206

Boise, ID 83704

Tel: 208-377-1444

Illinois–Northeastern

Oasis Sales

1101 Tonne Road

Elk Grove Village, IL 60007

Tel: 847-640-1850

Illinois–Southern

Stan Clothier Sales

340 North Main Street, Suite 205A

St. Charles, MO 63301

Tel: 636-916-3777

Illinois–Rock Island County

Mel Foster Company

3047 Center Point Road NE, Suite D

Cedar Rapids, IA 52402

Tel: 319-363-6336

Indiana–Indianapolis

Millennium-Alliance Technical Sales

4000 East 96th Street, Suite 160

Indianapolis, IN 46240

Tel: 317-575-4600

Indiana–Kokomo

Millennium-Alliance Technical Sales

2715 S. Albright Rd.

Kokomo, IN 46902

Tel: 765-453-4260

Iowa

Mel Foster Company

3047 Center Point Road NE, Suite D

Cedar Rapids, IA 52402

Tel: 319-363-6336

Kansas

Stan Clothier Sales

10300 West 103rd St., Suite 205

Overland Park, KS 66214

Tel: 913-894-1675

Kentucky

Millennium-Alliance Technical Sales

7155 Post Road

Dublin, OH 43016

Tel: 614-793-9545

Louisiana–Northern

BP Sales

689 W. Renner Rd., Suite 101

Richardson, TX 75080

Tel: 972-234-8438

Louisiana–Southern

BP Sales

10700 Richmond, Suite 150

Houston, TX 77042

Tel: 713-782-4144

Maine

Impact Technical Sales

One New England Executive Park, First Floor

Burlington, MA 01803

Tel: 781-238-8888

Maryland

Third Wave Solutions, Inc.

8335H Guilford Road

Columbia, MD 21046

Tel: 410-290-5990

Massachusetts

Impact Technical Sales

One New England Executive Park

Burlington, MA 01803

Tel: 781-238-8888

Michigan–Eastern

Millennium-Alliance Technical Sales

21800 Haggerty Road, Suite 203

Northville, MI 48167

Tel: 248-305-6700

Michigan–Western

Millennium-Alliance Technical Sales

3343 Creek Ct.

Holland, Michigan 49424

Tel: 619-399-9265

Minnesota

Mel Foster Company

7611 Washington Avenue South

Edina, MN 55439

Tel: 952-941-9790

Mississippi

Elcom

4940 Corporate Dr., Suite C

Huntsville, AL 35805

Tel: 770-447-8200

Missouri–Eastern

Stan Clothier Sales

340 North Main Street, Suite 205A

St. Charles, MO 63301

Tel: 636-916-3777

Distributor and Manufacturing Representatives

Price Quote and Ordering developer.intel.com

206

Missouri–Western

Stan Clothier Sales

10300 West 103rd St., Suite 205

Overland Park, KS 66214

Tel: 913-894-1675

Montana

Luscombe Engineering Company of Utah

5097 South 900 East, Suite 200

Salt Lake City, UT 84117

Tel: 801-268-3434

Nebraska

Stan Clothier Sales

10300 West 103rd St., Suite 205

Overland Park, KS 66214

Tel: 913-894-1675

Nevada–Las Vegas

Addem

8700 E. via de Ventura, Suite 265

Scottsdale, AZ 85258

Tel: 480-421-9270

Nevada–Reno

T3 Technical Sales

3211 Scott Blvd, Suite 201

Santa Clara, CA 95054

Tel: 408-350-3900

New Hampshire

Impact Technical Sales

One New England Executive Park, First Floor

Burlington, MA 01803

Tel: 781-238-8888

New Jersey–Northern

Parallax, Inc.

140 Fell Ct

Hauppauge, NY 11788

Tel: 631-351-1000

New Jersey–Southern

Delta Technical Sales, Inc.

122 North York Road, Suite 9

Hatboro, PA 19040

Tel: 215-957-0600

New Mexico

Addem

6220 East Thomas Rd., Suite 303

Scottsdale, AZ 85251

Tel: 480-421-9270

New York–NY City/Long Island

Parallax, Inc.

140 Fell Ct

Hauppauge, NY 11788

Tel: 631-351-1000

New York–Upstate

Foster & Wager Incorporated

55 Webster Commons Blvd.

Webster, NY 14580

Tel: 585-872-1030

North Carolina

Elcom

15200 Weston Parkway, Suite 104

Cary, NC 27513

Tel: 770-447-8200

North Dakota

Mel Foster Company

7401 East Palomino Road

Sioux Falls, SD 57110

Tel: 605-332-7307

Ohio–Columbus

(Headquarters)

Millennium-Alliance Technical Sales

7155 Post Road

Dublin, OH 43016

Tel: 614-793-9545

Ohio–Cleveland

Millennium-Alliance Technical Sales

6325 Cochran Road, Suite 7

Solon, OH 44139

Tel: 440-349-6600

Oklahoma

BP Sales

689 West Renner Rd., Suite 101

Richardson, TX 75080

Tel: 972-234-8438

Oregon

SiFore Technical Sales, LLC

9115 SW Oleson Rd.

Suite 140

Portland, OR 97223

Tel: 503-977-6267

Pennsylvania–Eastern

Delta Technical Sales Inc.

122 North York Road, Suite 9

Hatboro, PA 19040

Tel: 215-957-0600

Pennsylvania–Western

Millennium Technical Sales

6325 Cochran Rd., Suite 7

Solon, OH 44139

Tel: 440-349-6600

Rhode Island

Impact Technical Sales

One New England Executive Park, First Floor

Burlington, MA 01803

Tel: 781-238-8888

South Carolina

Elcom

15200 Weston Parkway, Suite 104

Cary, NC 27513

Tel: 770-447-8200

South Dakota

Mel Foster Company

7401 East Palomino Road

Sioux Falls, SD 57110

Tel: 605-332-7307

Tennessee–Eastern

Elcom

4400 Rivergreen Parkway, Suite 120

Duluth, GA 30096

Tel: 770-447-8200

Tennessee–Western

Elcom

4940 Corporate Dr., Suite C

Huntsville, AL 35805

Tel: 770-447-8200

Texas–El Paso Only

Addem

8700 E. via de Ventura, Suite 265

Scottsdale, AZ 85258

Tel: 480-421-9270

Texas–Western

BP Sales

8200 MoPac Expressway, Suite 185

Austin, TX 78759

Tel: 512-346-9186

Texas–North

BP Sales

689 West Renner Rd., Suite 101

Richardson, TX 75080

Tel: 972-234-8438

Texas–Southern

BP Sales

10700 Richmond, Suite 150

Houston, TX 77042

Tel: 713-782-4144

Utah

Luscombe Engineering Company Inc. of Utah

5097 South 900 East, Suite 200

Salt Lake City, UT 84117

Tel: 801-268-3434

Vermont

Impact Technical Sales

One New England Executive Park, First Floor

Burlington, MA 01803

Tel: 781-238-8888

Virginia

Third Wave Solutions, Inc.

8335H Guilford Road

Columbia, MD 21046

Tel: 410-290-5990

Washington

SiFore Technical Sales, LLC

11100 NE 8th Street, Suite 600

Bellevue, WA 98004

Tel: 425-990-4701

Washington, D.C.

Third Wave Solutions, Inc.

8335H Guilford Road

Columbia, MD 21046

Tel: 410-290-5990

West Virginia–Eastern

Third Wave Solutions, Inc.

8335H Guilford Road

Columbia, MD 21046

Tel: 410-290-5990

West Virginia–Western

Millennium Technical Sales

6325 Cochran Road, Suite 7

Solon, OH 44139

Tel: 440-349-6600

Wisconsin–Eastern

Oasis Sales

N27 W23953 Paul Road

Suite 102

Pewaukee, WI 53072

Tel: 262-523-9045

Wisconsin–Northwest

Mel Foster Company

7611 Washington Avenue South

Edina, MN 55439

Tel: 952-941-9790

Wyoming

Luscombe Engineering Co. Inc. of Colorado

1500 Kansas Avenue, Suite 1B

Longmont, CO 80501

Tel: 303-772-3342

Canadian Manufacturer’s

Representative

Apera Technologies Inc.

905 Michele-Bohec

Blainville, Quebec, J7C5L6, Canada

450-971-6969

www.aperatech.com

European Manufacturer’s

Representatives

Belgium

IC-4S

Interleuvenlaan 62

3001 Leuven

Belgium

Tel: 32-16-400025

Denmark

Cedar Scandinavia AB

Fagerstagatan 15, 5tr

P.O. Box 8204

16308 Spanga

Sweden

Tel: 46-(8)-56472583

Finland

Cedar Scandinavia AB

Fagerstagatan 15, 5tr

P.O. Box 8204

16308 Spanga

Sweden

Tel: 46-(8)-56472583

France

A-Z Design Electronics

8, rue Rene Cassin

91300 Massy

France

Tel: 33-1-69534242

Germany

Prisma Sales Service GmbH

Foehrenweg 26

D-29308 Winsen/Aller

Germany

Tel: 49-5143-912540

Ireland

Cedar Technologies Ltd.

Thame House; Thame Road

Ofﬁce Suite 1

Haddenham

Buckinghamshire

United Kingdom

HP178HU

Tel: 44-1844-296800

Italy

Overtek s.r.l.

Via Ludovico di Breme, 46

20156 Milano, MI

Italy

Tel: 39-02-3088566

Luxemburg

IC-4S

Interleuvenlaan 62

3001 Leuven

Belgium

Tel: 32-16-400025

Netherlands

IC-4S

Interleuvenlaan 62

3001 Leuven

Belgium

Tel: 32-16-400025

Norway

Cedar Scandinavia AB

Fagerstagatan 15, 5tr

P.O. Box 8204

16308 Spanga

Sweden

Tel: 46-(8)-56472583

Portugal

IC-4S

PTM, Isaac Newton 2

28760 Tres Cantos (Madrid)

Spain

Tel: 34-918041495

Spain

IC-4S

PTM, Isaac Newton 2

28760 Tres Cantos (Madrid)

Spain

Tel: 34-918041495

Sweden

Cedar Scandinavia AB

Fagerstagatan 15, 5tr

P.O. Box 8204

16308 Spanga

Sweden

Tel: 46-(8)-56472583

Switzerland

Prisma Sales Service GmbH

Foehrenweg 26

D-29308 Winsen/Aller

Germany

Tel: 49-5143-912540

United Kingdom

Cedar Technologies Ltd.

Thame House; Thame Road

Ofﬁce Suite 1

Haddenham

Buckinghamshire

United Kingdom

HP178HU

Tel: 44-1844-296800

Distributor and Manufacturing Representatives

developer.intel.com Price Quote and Ordering

207

Latin American

Manufacturer’s

Representatives

Brazil

Hitech Electronica

Rua Cunha Gago, 700

9 andar

São Paulo, SP

Brazil 05421-001

Tel: 55-11-3094-3844

Japanese Manufacturer’s

Representatives

Nagano Japan Radio Co., Ltd.

Intel Consulting Group

5-33-8 Sendagaya shibuya-ku

Tokyo

Japan

151-0051

813-5360-4555

Novatec Corporation

2-19-2 Nishi-Gotanda

Shinagawa-ku

Tokyo

Japan 141-0031

813-5759-261

141-0031

813-5759-2612

Price Quote and Ordering developer.intel.com

208

The Communications

and Embedded Products

Source Book 2004

Covering the spectrum

of Intel communications

products

The Communications and Embedded Products Source Book May 2004

Intel Corporation

United States and Canada

Intel Corporation

Robert Noyce Building

2200 Mission College Boulevard

P.O. Box 58119

Santa Clara, CA 95052-8119

USA

Phone: (408) 765-8080

Europe

Intel Corporation (UK) Ltd.

Pipers Way

Swindon

Wiltshire SN3 1RJ

Phone:

England (44) 1793 403 000

France (33) 1 4694 7171

Germany (49) 89 99143 0

Italy (39) 02 575 441

Israel (972) 2 589 7111

Netherlands (31) 20 659 1800

Asia Pacific

Intel Semiconductor Ltd.

32/F Two Pacific Place

88 Queensway, Central

Hong Kong SAR

Phone: (852) 2844-4555

Japan

Intel Kabushiki Kaisha

P.O. Box 300-8603 Tsukuba-gakuen

5-6 Tokodai, Tsukuba-shi

Ibaraki-ken 300-2635

Japan

Phone: (81) 298-47-8511

South America

Intel Semicondutores do Brasil

Av. Dr Chucri Zaidan, 940- 10th floor

Market Place Tower II

04583-906

Sao Paulo-SP-Brasil

Phone: (55) 11 3365 5500

Intel, and the Intel logo are registered

trademarks of Intel Corporation.

* Other names and brands may be claimed

as the property of others.

Printed in USA/2004/10K/MD/HP

Order No. 272676-012

NOTE:

PLEASE ADJUST SPINE TO PROPER WIDTH