M27C1001-12C6 - STMicroelectronics

April 2006 Rev 5 1/24

M27C1001

1 Mbit (128 Kbit x 8) UV EPROM and OTP EPROM

Features

■5v ± 10% Supply Voltage in Read Operation

■Access Time: 35ns

■Low Power Consumption:

– Active Current: 30 mA at 5 MHz

– Standby Current: 100 µA

■Programming Voltage: 12.75V ± 0.25V

■Programming Time: 100 µs/word

■Electronic Signature

– Manufacturer Code : 20h

– Device Code: 05h

■ECOPACK® packages available

32 32

FDIP32W (F) PDIP32 (B)

PLCC32 (C) TSOP32 (N)

8 x 20 mm

www.st.com

Contents M27C1001

2/24

Contents

1 Summary description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5

2 Device description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8

2.1 Read mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8

2.2 Standby mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8

2.3 Two-line output control . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8

2.4 System considerations . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9

2.5 Programming . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9

2.6 Presto II programming algorithm . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9

2.7 Program Inhibit . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10

2.8 Program Verify . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10

2.9 Electronic Signature . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10

2.10 Erasure operation (applies to UV EPROM) . . . . . . . . . . . . . . . . . . . . . . . 11

3 Maximum ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12

4 DC and AC characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13

5 Package mechanical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18

5.1 32-pin Ceramic Frit-seal DIP, with round window (FDIP32WA) . . . . . . . . 18

5.2 32-pin Plastic DIP, 600 mils width (PDIP32) . . . . . . . . . . . . . . . . . . . . . . . 19

5.3 32-lead Rectangular Plastic Leaded Chip Carrier (PLCC32) . . . . . . . . . . 20

5.4 32-lead Plastic Thin Small Outline, 8x20 mm (TSOP32) . . . . . . . . . . . . . 21

6 Part numbering . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22

7 Revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23

M27C1001 List of tables

3/24

List of tables

Table 1. Signal Descriptions. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6

Table 2. Operating Modes . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8

Table 3. Electronic Signature . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11

Table 4. Absolute Maximum Ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12

Table 5. Read Mode DC Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13

Table 6. Programming Mode DC Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13

Table 7. Capacitance . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14

Table 8. AC Measurement Conditions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14

Table 9. Read Mode AC Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15

Table 10. Read Mode AC Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16

Table 11. Programming Mode AC Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17

Table 12. FDIP32WA package mechanical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18

Table 13. PDIP32 package mechanical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19

Table 14. PLCC32 package mechanical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20

Table 15. TSOP32 package mechanical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21

Table 16. Ordering information scheme . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22

Table 17. Document revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23

List of figures M27C1001

4/24

List of figures

Figure 1. Logic Diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5

Figure 2. DIP Connections. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6

Figure 3. LCC Connections . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7

Figure 4. TSOP Connections. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7

Figure 5. Programming Flowchart . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10

Figure 6. AC Testing Input Output Waveform . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14

Figure 7. AC Testing Load Circuit . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14

Figure 8. Read Mode AC Waveforms . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16

Figure 9. Programming and Verify Modes AC Waveforms . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17

Figure 10. FDIP32WA package outline . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18

Figure 11. PDIP32 package outline . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19

Figure 12. PLCC32 package outline . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20

Figure 13. TSOP32 package outline . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21

M27C1001 Summary description

5/24

1 Summary description

The M27C1001 is a 1 Mbit EPROM offered in the two ranges: UV (ultra violet erase) and

OTP (one time programmable). It is ideally suited for microprocessor systems requiring

large programs and is organized as 131,072 words of 8 bits.

The FDIP32W (window ceramic frit-seal package) has a transparent lid th at en a bles the

user to e xpo se the chip to ultr a violet light to erase the bit pattern. A new pat tern can then be

written to the device by following the programming procedure.

For applications where the content is programmed only one time and erasure is not

required, the M27C1001 is of fered in PDIP32, PLCC32 and T SOP32 (8 x 2 0 mm) p ac kages .

In order to meet environmental requirements, ST offers the M27C1001 in ECOPACK®

packages. ECOPACK packages are Lead-free. The category of second Level Interconnect

is marked on the package and on the inner box label, in compliance with JEDEC Standa rd

JESD97. The maximum r atings related t o soldering conditions are also marked on the inner

box label.

ECOPACK is an ST trademark. ECOPA CK® spe cif ications are available at: www.st.com.

See Figure 1: Logic Diagram and Table 1: Signal Descriptions for a brief overview of the

signals connected to this device.

Figure 1. Logic Diagram

AI00710B

A0-A16

Q0-Q7

VPP

VCC

M27C1001

VSS

Summary description M27C1001

6/24

Figure 2. DIP Connections

Table 1. Signal Descriptions

Signal Description

A0-A16 Address Inputs

Q0-Q7 Data Outpu ts

EChip Enable

GOutput Enable

PProgram

VPP Program Supply

VCC Supply Voltage

VSS Ground

NC Not Connected Internally

A13

A10

A14

A11

Q5Q1

Q2 Q3VSS Q4

PA16

A12

VPP VCC

A15

AI00711

M27C1001

M27C1001 Summary description

7/24

Figure 3. LCC Connections

Figure 4. TSOP Connections

AI00712

A10

A16

A11

A13

A12

VPP

VCC

M27C1001

A15

A14

VSS

A4 A3

A13

A10

A14

A11 G

A16

A12

VPP

VCC

A15

AI01151B

M27C1001

(Normal)

16 17

VSS

Device description M27C1001

8/24

2 Device description

Table 2 lists the operating modes of the M27C1001. A single power supply is required in

Read mode. All inputs are TTL le v els except f or VPP and 12V on A9 f or Electronic Signature .

Note: X = VIH or VIL, VID = 12V ± 0.5V.

2.1 Read mode

The M27C1001 has two control functions, both of which m ust be logically active in order to

obtain data at the outputs. Chip Enable (E) is the power control and should be used for

de vice selectio n. Out put Enable (G) is the output control and should be used to gate data to

the output pins, independent of device selection. Assuming that the addresses are stable,

the address access time (tAVQV) is equal to the delay from E to output (tELQV). Data is

available at th e out put af ter a delay of tGLQV from the falling edge of G, assuming that E has

been low and the addresses have been stable for at least tAVQV-tGLQV.

2.2 Standby mode

The M27C1001 has a standb y mode which reduces th e supply current from 30mA to 100µA.

The M27C1001 is placed in the standby mode by applying a CMOS high signal to the E

input. When in the standb y mode, the outputs are in a high impedance state, independent of

the G input.

2.3 Two-line output control

Because EPROMs are usually used in larger memory arrays, this product features a 2-line

control function which accommodates the use of multiple memory connection. The two line

control function allows:

●the lowest possible memory power dissipation,

●complete assurance that output bus contention will not occur.

For the most efficient use of these two control lines, E should be decode d and used as the

primary device selecting function, while G should be made a common connection to all

devices in the array and connected to the READ line from the system control bus. This

Table 2. Operating Modes

Mode E G P A9 VPP Q7-Q0

Read VIL VIL XXV

CC or VSS Data Out

Output Disable VIL VIH XXV

CC or VSS Hi-Z

Program VIL VIH VIL Pulse X VPP Data In

Verify VIL VIL VIH XV

PP Data Out

Program Inhibit VIH XXXV

PP Hi-Z

Standby VIH XXXV

CC or VSS Hi-Z

Electronic Signature VIL VIL VIH VID VCC Codes

M27C1001 Device description

9/24

ensures that all deselected memory devices are in their low power standby mode and that

the output pins are only active when data is required from a particular memory device.

2.4 System considerations

The power switching char acteristics of Advanced CMOS EPROMs require careful

decoupling of the devices. The supply current, ICC, has three segments that are of interest to

the system designer: the standb y current le v el, th e activ e current level, a nd tr ansient current

peaks that are produce d by the f a lling and rising edges of E. The ma gnitude of t he tr a nsient

current peaks is dependent on the capacitive and inductive loading of the device at the

output. The associated transient voltage peaks can be suppressed by complying with the

two line output control and by properly selected decoupling capacitors. It is recommended

that a 0.1µF ce r am i c cap acitor b e used on every de vice between VCC and VSS. This should

be a high frequency capacitor of low inherent inductance and should be placed as close to

the device as possible. In addition, a 4.7µF bulk electrolyt ic cap a cito r shou l d be use d

betwee n VCC and VSS f or ev ery eight devices . The bulk capacito r should be located near the

pow er supply connection point . The purpose of the b ulk capacitor is to o v ercome the v oltage

drop caused by the inductive effects of PCB traces.

2.5 Programming

When deliv ered (and after each er asure f or UV EPR OM), all bits of the M27C1001 are in the

'1' state. Data is introduced by selectively programm ing '0's into the desired bit locations.

Although only '0's will be programmed, both '1's and '0's can be present in the data word.

The only w a y to change a '0' to a '1' is b y die e xpo sition to ultr a violet light (UV EPR OM). T he

M27C1001 is in the programming mode when VPP input is at 12.75V, E is at VIL and P is

pulsed to VIL. The data to be programmed is applied to 8 bits in parallel to the data output

pins. The levels required for the address an d da ta inpu ts ar e TTL . V CC is specified to be

6.25V ± 0.25V.

2.6 Presto II programming algorithm

Presto II Programming Algorithm allows the whole array to be programmed, with a

guarant eed margin, in a typical time of 13 seconds. Programming with Presto II involves in

applying a sequence of 100µs progr am pulses to each b yte until a corr ect v erify occurs (see

Figure 5). During progr amming and verify operation, a Margin mode circuit is automatically

activated in order to guarantee that each cell is programmed with enough margin. No

overprogram pulse is a ppli ed sin ce the verify in Margin m ode provides necessary margin to

each programmed cell.

Device description M27C1001

10/24

Figure 5. Pr ogramming Flowchart

2.7 Program Inhibit

Programming of multip le M27C1001s in parallel with different data is also easily

accomplished. Except for E, all like inputs including G of the parallel M27C1001 may be

common. A TTL low level pulse applied to a M27C1001's P input, with E low and VPP at

12.75V, will program that M2 7C1001. A high lev el E input inhibi ts the other M27C1001s f rom

being programmed.

2.8 Program Verify

A verify (read) should be performed on the programmed bits to determine that they were

correctly programmed. The verify is accomplished with E and G at VIL, P at VIH, VPP at

12.75V and VCC at 6.25V.

2.9 Electronic Signature

The Electronic Signature (ES) mode enables the reading out of a binary code from an

EPROM that will identify its manufacturer and type. This mode is intended for use by

programming equipment to automatically match the device to be programmed with its

corresponding programming algorithm. The ES mode is functional in the 25°C ± 5°C

ambient temperature range that is required when programming the M27C1001. To activate

the ES mode , th e p rog ramming equipme nt must force 11.5V to 12.5V on a dd ress line A9 o f

the M27C1001, with VPP = VCC = 5V. Two identifier bytes may then be sequenced from the

device outputs by toggling address line A0 from VIL to VIH. All other address lines must be

held at VIL during Electronic Signature mode.

AI00715C

n = 0

Last

Addr

VERIFY

P = 100µs Pulse

++n

= 25 ++ Addr

VCC = 6.25V, VPP = 12.75V

FAIL

CHECK ALL BYTES

1st: VCC = 6V

2nd: VCC = 4.2V

YES

M27C1001 Device description

11/24

Byte 0 (A0 = VIL) represent s the manufacturer code and byte 1 (A0 = VIH) the device

identifier code. For the STMicroelectr onics M27C1001, these two identifier bytes are given

in Table 3 and can be read-out on outputs Q7 to Q0.

2.10 Erasure operation (applies to UV EPROM)

The era sure char acteristics of the M27C1001 is such that er asure b egins when the cells ar e

exposed to light with wavelengths shorter than approximately 4000 Å. It should be noted

that sunlight and some type of fluorescent lamps have wavelengths in the 3000-4000 Å

range. Research shows that constant exposure to room level fluorescent lighting could

erase a typical M27C1001 in about 3 years, while it would take approximately 1 week to

cause erasure when exposed to direct sunlight. If the M27C1001 is to be exposed to these

types of lighting conditions for extended periods of time, it is suggested that opaque labels

be put over the M27C1001 window to prevent unintentional erasure. The recommende d

erasure procedure for the M27C1001 is exposure to short wave ultraviolet light which has a

wavelength of 2537 Å. The integrated dose (i.e. UV intensity x exposure time) for erasure

should be a minimum of 15 W-sec/cm2. The erasure time with this dosage is approximately

15 to 20 minutes using an ult ra violet lamp with 12000 µW/cm 2 pow er rat ing. The M2 7C1001

should be placed within 2.5 cm (1 inch) of the lamp tubes during the erasure. Some lamps

have a filter on their tubes which should be removed before erasure.

Table 3. Electronic Sig n ature

Identifier A0 Q7 Q6 Q5 Q4 Q3 Q2 Q1 Q0 Hex Data

Manufacturer’s Code VIL 00100000 20h

Device Code VIH 00000101 05h

Maximum ratings M27C1001

12/24

3 Maximum ratings

Table 4. Absolute Maximum Ratings(1)

1. Except for the rating "Operating Temperature Range", stresses above those listed in the Table "Absolute

Maximum Ratings" may cause permanent damage to the device. These are stress ratings only and

operation of the device at these or any other conditions above those indicated in the Operating sections of

this specification is not implied. Exposure to Absolute Maximu m Rating conditions for extended periods

may affect device reliability. Refer also to the STMicroelectronics SURE Program and other relevant quality

documents.

Symbol Parameter Value Unit

TAAmbient Operating Temperature (2)

2. Depends on range.

–40 to 125 °C

TBIAS Temperature Under Bias –50 to 125 °C

TSTG Storage Temperature –65 to 150 °C

VIO (3)

3. Minimum DC voltage on Input or Output is –0.5V with possible undershoot to –2.0V for a period less than

20ns.

Maximum DC voltage on Output is VCC +0.5V with possible overshoot to VCC +2V for a period less than

20ns.

Input or Output Voltage (except A9) –2 to 7 V

VCC Supply Voltage –2 to 7 V

VA9 (3) A9 Voltage –2 to 13.5 V

VPP Program Supply Voltage –2 to 14 V

M27C1001 DC and AC characteristi cs

13/24

4 DC and AC characteristics

TA = 0 to 70°C, –40 to 85°C or –40 to 125°C; VCC = 5V ± 5% or 5V ± 10%; VPP = VCC

TA = 25 °C; VCC = 6.25V ± 0.25V ; VPP = 12.75V ± 0.25V

Table 5. Read Mode DC Characteristics (1)

1. VCC must be applied simultaneously with or before VPP and removed simultaneously or after VPP.

Symbol Parameter Test Condition Min. Max. Unit

ILI Input Leakage Current 0V ≤ VIN ≤ VCC ±10 µA

ILO Output Leakage Current 0V ≤ VOUT ≤ VCC ±10 µA

ICC Supply Current E = VIL, G = VIL,

IOUT = 0mA, f = 5MHz 30 mA

ICC1 Supply Current (Standby) TTL E = VIH 1mA

ICC2 Supply Current (Standby) CMOS E > VCC – 0.2V 100 µA

IPP Program Current VPP = VCC 10 µA

VIL Input Low Voltage –0.3 0.8 V

VIH (2)

2. Maximum DC voltage on Output is VCC +0.5V.

Input High Voltage 2 VCC + 1 V

VOL Output Low Voltage IOL = 2.1mA 0.4 V

VOH Output High Voltage TTL IOH = –400µA 2.4 V

Output High Voltage CMOS IOH = –100µA VCC – 0.7V V

Table 6. Programming Mode DC Characteristics (1)

1. VCC must be applied simultaneously with or before VPP and removed simultaneously or after VPP.

Symbol Parameter Test Condition Min. Max. Unit

ILI Input Leakage Current VIL ≤ VIN ≤ VIH ±10 µA

ICC Supply Current 50 mA

IPP Program Current E = VIL 50 mA

VIL Input Low Voltage –0.3 0.8 V

VIH Input High Voltage 2 VCC + 0.5 V

VOL Output Low Voltage IOL = 2.1mA 0.4 V

VOH Output High Voltage TTL IOH = –400µA 2.4 V

VID A9 Voltage 11.5 12.5 V

DC and AC characteristics M27C1001

14/24

TA = 25 °C, f = 1 MHz

Figure 6. AC Testing Input Output Waveform

Figure 7. AC Testing Load Circuit

Table 7. Capacitance (1)

1. Sampled only, not 100% tested.

Symbol Parameter Test Condition Min Max Unit

CIN Input Capacitance VIN = 0V 6 pF

COUT Output Capacitance VOUT = 0V 12 pF

Table 8. AC Measurement Conditions

Pa rameter High Speed Standard

Input Rise and Fall Times ≤ 10ns ≤ 20ns

Input Pulse Voltages 0 to 3V 0.4V to 2.4V

Input and Output Timing Ref. Voltages 1.5V 0.8V and 2V

AI01822

High Speed

1.5V

2.4V

Standard

0.4V

2.0V

0.8V

AI01823B

1.3V

OUT

CL = 30pF for High Speed

CL = 100pF for Standard

CL includes JIG capacitance

3.3kΩ

1N914

DEVICE

UNDER

TEST

M27C1001 DC and AC characteristi cs

15/24

TA = 0 to 70°C, –40 to 85°C or –40 to 125°C; VCC = 5V ± 5% or 5V ± 10%; VPP = VCC

Table 9. Read Mode AC Characteristics (1)

1. VCC must be applied simultaneously with or before VPP and removed simultaneously or after VPP.

Symbol Alt Parameter Test

Condition

M27C1001

Unit -35 (2)

2. Speed obtained with High Speed AC measurement conditions.

-45 -60 -70

Min. Max. Min. Max. Min. Max. Min. Max.

tAVQV tACC Address Valid to

Output Valid E = VIL,

G = VIL 35 45 60 70 ns

tELQV tCE Chip Enable Low

to Output Va lid G = VIL 35 45 60 70 ns

tGLQV tOE

Output Enable

Low to Output

Valid E = VIL 25 25 30 35 ns

tEHQZ (3)

3. Sampled only, not 100% tested.

tDF Chip Enable High

to Output Hi-Z G = VIL 025025030030ns

tGHQZ

(3) tDF

Output Enable

High to Output Hi-

ZE = VIL 025025030030ns

tAXQX tOH

Address Transition

to Output

Transition

E = VIL,

G = VIL 0000ns

DC and AC characteristics M27C1001

16/24

TA = 0 to 70°C, –40 to 85°C or –40 to 125°C; VCC = 5V ± 5% or 5V ± 10%; VPP = VCC

Figure 8. Read Mode AC Waveforms

Table 10. R ead Mode AC Characteristics (1)

1. VCC must be applied simultaneously with or before VPP and removed simultaneously or after VPP.

Symbol Alt Parameter Test

Condition

M27C1001

Unit-80 -90 -10 -12/-15/

-20/-25

Min Max Min Max Min Max Min Max

tAVQV tACC Address Valid to

Output Valid E = VIL, G =

VIL 80 90 100 120 ns

tELQV tCE Chip Enable Low

to Output Valid G = VIL 80 90 100 120 ns

tGLQV tOE

Output Enable

Low to Output

Valid E = VIL 40 45 50 60 ns

tEHQZ (2)

2. Sampled only, not 100% tested.

tDF Chip Enable High

to Output Hi-Z G = VIL 030030030040ns

tGHQZ

(2) tDF

Output Enable

High to Output

Hi-Z E = VIL 030030030040ns

tAXQX tOH

Address

Transition to

Output Transition

E = VIL, G =

VIL 0000ns

AI00713B

tAXQX

tEHQZ

A0-A16

Q0-Q7

tAVQV

tGHQZ

tGLQV

tELQV

VALID

Hi-Z

VALID

M27C1001 DC and AC characteristi cs

17/24

TA = 25 °C; VCC = 6.25V ± 0.25V ; VPP = 12.75V ± 0.25V

Figure 9. Programming and Verify Modes AC Waveforms

Table 11. Programming Mode AC Characteristics (1)

1. VCC must be applied simultaneously with or before VPP and removed simultaneously or after VPP.

Symbol Alt Parameter Test Condition Min. Max. Unit

tAVPL tAS Address Valid to Program Low 2 µs

tQVPL tDS Input Valid to Program Low 2 µs

tVPHPL tVPS VPP High to Program Low 2 µs

tVCHPL tVCS VCC High to Program Low 2 µs

tELPL tCES Chip Enable Low to Program Low 2 µs

tPLPH tPW Program Pulse Width 95 105 µs

tPHQX tDH Program High to Input Transition 2 µs

tQXGL tOES Input Transition to Output Enable Low 2 µs

tGLQV tOE Output Enable Low to Output Valid 100 ns

tGHQZ (2)

2. Sampled only, not 100% tested.

tDFP Output Enab le High to Output Hi-Z 0 130 ns

tGHAX tAH Output Enable High to Address

Transition 0ns

tAVPL

VALID

AI00714

A0-A16

Q0-Q7

VPP

VCC

DATA IN DATA OUT

tQVPL

tVPHPL

tVCHPL

tPHQX

tPLPH

tGLQV

tQXGL

tELPL

tGHQZ

tGHAX

PROGRAM VERIFY

Package mechanica l data M27C1001

18/24

5 Package mechanical data

5.1 32-pin Ceramic Frit-seal DIP, with round window (FDIP32WA)

Figure 10. FDIP32WA package outline

Table 12. FDIP32WA package mechanical data

Symbol millimeters inches

Min Typ Max Min Typ Max

A5.720.225

A1 0.51 1.40 0.020 0.055

A2 3.91 4.57 0.154 0.180

A3 3.89 4.50 0.153 0.177

B 0.41 0.56 0.016 0.022

B1 1.45 0.057

C 0.23 0.30 0.009 0.012

D 41.73 42.04 1.643 1.655

D2 38.10 1.500

e 2.54 0.100

E 15.24 0.600

E1 13.06 13.36 0.514 0.526

eA 14.99 0.590

eB 16.18 18.03 0.637 0.710

L 3.18 4.10 0.125 0.161

N32 32

S 1.52 2.49 0.060 0.098

Ø 7.11 0.280

α4° 11° 4° 11°

FDIPW-a

B1 B e

E1 E

∅

M27C1001 Package mech anical data

19/24

5.2 32-pin Plastic DIP, 600 mils width (PDIP32)

Figure 11. PDIP32 package outline

Table 13. PDIP32 package mechanical data

Symbol millimeters inches

Min Typ Max Min Typ Max

A4.830.190

A1 0.38 0.015

A2 3.81 0.150

b 0.41 0.53 0.016 0.021

b1 1.14 1.65 0.045 0.065

c 0.23 0.38 0.009 0.015

D 41.78 42.29 1.645 1.665

D2 38.10 1.500

eA 15.24 0.600

e 2.54 0.100

E 15.24 15.88 0.600 0.625

E1 13.46 13.97 0.530 0.550

S 1.65 2.21 0.065 0.087

L 3.05 3.56 0.120 0.140

α0° 15° 0° 15°

N32 32

PDIP-C

b1 b e

E1 E

Package mechanica l data M27C1001

20/24

5.3 32-lead Rectangular Plastic Leaded Chip Carrier (PLCC32)

Figure 12. PLCC32 package outline

Table 14. PLCC32 package mechanical data

Symbol millimeters inches

Min Typ Max Min Typ Max

A 3.18 3.56 0.125 0.140

A1 1.53 2.41 0.060 0.095

A2 0.38 0.015

B 0.33 0.53 0.013 0.021

B1 0.66 0.81 0.026 0.032

CP 0.10 0.004

D 12.32 12.57 0.485 0.495

D1 11.35 11.51 0.447 0.453

D2 4.78 5.66 0.188 0.223

D3 7.62 0.300

E 14.86 15.11 0.585 0.595

E1 13.89 14.05 0.547 0.553

E2 6.05 6.93 0.238 0.273

E3 10.16 0.400

e 1.27 0.050

F 0.00 0.13 0.000 0.005

R 0.89 0.035

N32 32

PLCC-A

E3 E1 E

1 N

0.51 (.020)

1.14 (.045)

D2 D2

M27C1001 Package mech anical data

21/24

5.4 32-lead Plastic Thin Small Outline, 8x20 mm (TSOP32)

Figure 13. TSOP32 pac kage outline

Table 15. TSOP32 packa ge mechanical data

Symbol millimeters inches

Min Typ Max Min Typ Max

A 1.200 0.0472

A1 0.050 0.150 0.0020 0.0059

A2 0.950 1.050 0.0374 0.0413

B 0.170 0.250 0.0067 0.0098

C 0.100 0.210 0.0039 0.0083

CP 0.100 0.0039

D 19.800 20.200 0.7795 0.7953

D1 18.300 18.500 0.7205 0.7283

e 0.500 0.0197

E 7.900 8.100 0.3110 0.3189

L 0.500 0.700 0.0197 0.0276

N32 32

α0° 5° 0° 5°

TSOP-a

N/2

DIE

LA1 α

Part numbering M27C1001

22/24

6 Part numbering

Table 16. Ordering information scheme

For a list of available options (Speed, Package, etc...) or for further information on any

aspect of this device, please contact the STMicroelectronics Sales Office nearest to you.

Example: M27C1001 -35 X C 1 TR

Device Type

M27

Supply Voltage

C = 5V

Device Function

1001 = 1 Mbit (128Kb x 8)

Speed

-35 (1) = 35 ns -10 = 100 ns

1. High Speed, see AC Characteristics section for further information.

-45 = 45 ns -12 = 120 ns

-60 = 60 ns -15 = 150 ns

-70 = 70 ns -20 = 200 ns

-80 = 80 ns -25 = 250 ns

-90 = 90 ns

VCC Tolerance

blank = ± 10%

X = ± 5%

Package

F = FDIP32W C = PLCC32

B = PDIP32 N = TSOP32: 8 x 20 mm

Temperature Range

1 = 0 to 70 °C

3 = –40 to 125 °C

6 = –40 to 85 °C

Options

TR = ECOPACK® package, Tape & Reel Packing

M27C1001 Revision history

23/24

7 Revision history

Table 17. Document revision history

Date Revision Changes

September 1998 1 First Issue

24-Jan-2000 2 35ns speed class addes (Table 8A, Table 16)

20-Sep-2000 3 AN620 Reference remov ed

04-Jun-2002 4 PLCC32 Package mechanical data and drawing clarified

(Table 14 and Figure 12)

TSOP32 Package mechanical data clarified (Table 15)

12-Apr-2006 5 Removed LCC32W package and Additiona l Burn-in option.

Converted to new template. Added ECOPACK® information.

M27C1001

24/24

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