M27C1001 1 Mbit (128 Kbit x 8) UV EPROM and OTP EPROM Features 5v 10% Supply Voltage in Read Operation Access Time: 35ns Low Power Consumption: - Active Current: 30 mA at 5 MHz - Standby Current: 100 A 32 32 Programming Voltage: 12.75V 0.25V Programming Time: 100 s/word Electronic Signature - Manufacturer Code: 20h - Device Code: 05h ECOPACK(R) packages available April 2006 1 1 FDIP32W (F) PLCC32 (C) Rev 5 PDIP32 (B) TSOP32 (N) 8 x 20 mm 1/24 www.st.com 1 Contents M27C1001 Contents 1 Summary description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5 2 Device description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8 2.1 Read mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8 2.2 Standby mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8 2.3 Two-line output control . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8 2.4 System considerations . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9 2.5 Programming . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9 2.6 Presto II programming algorithm . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9 2.7 Program Inhibit . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 2.8 Program Verify . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 2.9 Electronic Signature . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 2.10 Erasure operation (applies to UV EPROM) . . . . . . . . . . . . . . . . . . . . . . . 11 3 Maximum ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12 4 DC and AC characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13 5 Package mechanical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18 5.1 32-pin Ceramic Frit-seal DIP, with round window (FDIP32WA) . . . . . . . . 18 5.2 32-pin Plastic DIP, 600 mils width (PDIP32) . . . . . . . . . . . . . . . . . . . . . . . 19 5.3 32-lead Rectangular Plastic Leaded Chip Carrier (PLCC32) . . . . . . . . . . 20 5.4 32-lead Plastic Thin Small Outline, 8x20 mm (TSOP32) . . . . . . . . . . . . . 21 6 Part numbering . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22 7 Revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23 2/24 M27C1001 List of tables List of tables Table 1. Table 2. Table 3. Table 4. Table 5. Table 6. Table 7. Table 8. Table 9. Table 10. Table 11. Table 12. Table 13. Table 14. Table 15. Table 16. Table 17. Signal Descriptions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6 Operating Modes . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8 Electronic Signature . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11 Absolute Maximum Ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12 Read Mode DC Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13 Programming Mode DC Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13 Capacitance . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14 AC Measurement Conditions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14 Read Mode AC Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15 Read Mode AC Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16 Programming Mode AC Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17 FDIP32WA package mechanical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18 PDIP32 package mechanical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19 PLCC32 package mechanical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20 TSOP32 package mechanical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21 Ordering information scheme . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22 Document revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23 3/24 List of figures M27C1001 List of figures Figure 1. Figure 2. Figure 3. Figure 4. Figure 5. Figure 6. Figure 7. Figure 8. Figure 9. Figure 10. Figure 11. Figure 12. Figure 13. 4/24 Logic Diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5 DIP Connections . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6 LCC Connections . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 TSOP Connections . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 Programming Flowchart . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 AC Testing Input Output Waveform . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14 AC Testing Load Circuit . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14 Read Mode AC Waveforms . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16 Programming and Verify Modes AC Waveforms . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17 FDIP32WA package outline . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18 PDIP32 package outline . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19 PLCC32 package outline . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20 TSOP32 package outline . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21 M27C1001 1 Summary description Summary description The M27C1001 is a 1 Mbit EPROM offered in the two ranges: UV (ultra violet erase) and OTP (one time programmable). It is ideally suited for microprocessor systems requiring large programs and is organized as 131,072 words of 8 bits. The FDIP32W (window ceramic frit-seal package) has a transparent lid that enables the user to expose the chip to ultraviolet light to erase the bit pattern. A new pattern can then be written to the device by following the programming procedure. For applications where the content is programmed only one time and erasure is not required, the M27C1001 is offered in PDIP32, PLCC32 and TSOP32 (8 x 20 mm) packages. In order to meet environmental requirements, ST offers the M27C1001 in ECOPACK(R) packages. ECOPACK packages are Lead-free. The category of second Level Interconnect is marked on the package and on the inner box label, in compliance with JEDEC Standard JESD97. The maximum ratings related to soldering conditions are also marked on the inner box label. ECOPACK is an ST trademark. ECOPACK(R) specifications are available at: www.st.com. See Figure 1: Logic Diagram and Table 1: Signal Descriptions for a brief overview of the signals connected to this device. Figure 1. Logic Diagram VCC VPP 17 8 A0-A16 P Q0-Q7 M27C1001 E G VSS AI00710B 5/24 Summary description Table 1. M27C1001 Signal Descriptions Signal Description A0-A16 Address Inputs Q0-Q7 Data Outputs E Chip Enable G Output Enable P Program VPP Program Supply VCC Supply Voltage VSS Ground NC Not Connected Internally Figure 2. DIP Connections VPP A16 A15 A12 A7 A6 A5 A4 A3 A2 A1 A0 Q0 Q1 Q2 VSS 1 32 2 31 3 30 4 29 5 28 6 27 7 26 8 25 M27C1001 9 24 10 23 11 22 12 21 13 20 14 19 15 18 16 17 AI00711 6/24 VCC P NC A14 A13 A8 A9 A11 G A10 E Q7 Q6 Q5 Q4 Q3 M27C1001 Summary description LCC Connections A12 A15 A16 VPP VCC P NC Figure 3. 1 32 A7 A6 A5 A4 A3 A2 A1 A0 Q0 M27C1001 9 25 A14 A13 A8 A9 A11 G A10 E Q7 VSS Q3 Q4 Q5 Q6 Q1 Q2 17 AI00712 Figure 4. TSOP Connections A11 A9 A8 A13 A14 NC P VCC VPP A16 A15 A12 A7 A6 A5 A4 1 8 9 16 32 M27C1001 (Normal) 25 24 17 G A10 E Q7 Q6 Q5 Q4 Q3 VSS Q2 Q1 Q0 A0 A1 A2 A3 AI01151B 7/24 Device description 2 M27C1001 Device description Table 2 lists the operating modes of the M27C1001. A single power supply is required in Read mode. All inputs are TTL levels except for VPP and 12V on A9 for Electronic Signature. Table 2. Operating Modes Mode E G P A9 VPP Q7-Q0 Read VIL VIL X X VCC or VSS Data Out Output Disable VIL VIH X X VCC or VSS Hi-Z Program VIL VIH VIL Pulse X VPP Data In Verify VIL VIL VIH X VPP Data Out Program Inhibit VIH X X X VPP Hi-Z Standby VIH X X X VCC or VSS Hi-Z Electronic Signature VIL VIL VIH VID VCC Codes Note: X = VIH or VIL, VID = 12V 0.5V. 2.1 Read mode The M27C1001 has two control functions, both of which must be logically active in order to obtain data at the outputs. Chip Enable (E) is the power control and should be used for device selection. Output Enable (G) is the output control and should be used to gate data to the output pins, independent of device selection. Assuming that the addresses are stable, the address access time (tAVQV) is equal to the delay from E to output (tELQV). Data is available at the output after a delay of tGLQV from the falling edge of G, assuming that E has been low and the addresses have been stable for at least tAVQV-tGLQV. 2.2 Standby mode The M27C1001 has a standby mode which reduces the supply current from 30mA to 100A. The M27C1001 is placed in the standby mode by applying a CMOS high signal to the E input. When in the standby mode, the outputs are in a high impedance state, independent of the G input. 2.3 Two-line output control Because EPROMs are usually used in larger memory arrays, this product features a 2-line control function which accommodates the use of multiple memory connection. The two line control function allows: the lowest possible memory power dissipation, complete assurance that output bus contention will not occur. For the most efficient use of these two control lines, E should be decoded and used as the primary device selecting function, while G should be made a common connection to all devices in the array and connected to the READ line from the system control bus. This 8/24 M27C1001 Device description ensures that all deselected memory devices are in their low power standby mode and that the output pins are only active when data is required from a particular memory device. 2.4 System considerations The power switching characteristics of Advanced CMOS EPROMs require careful decoupling of the devices. The supply current, ICC, has three segments that are of interest to the system designer: the standby current level, the active current level, and transient current peaks that are produced by the falling and rising edges of E. The magnitude of the transient current peaks is dependent on the capacitive and inductive loading of the device at the output. The associated transient voltage peaks can be suppressed by complying with the two line output control and by properly selected decoupling capacitors. It is recommended that a 0.1F ceramic capacitor be used on every device between VCC and VSS. This should be a high frequency capacitor of low inherent inductance and should be placed as close to the device as possible. In addition, a 4.7F bulk electrolytic capacitor should be used between VCC and VSS for every eight devices. The bulk capacitor should be located near the power supply connection point. The purpose of the bulk capacitor is to overcome the voltage drop caused by the inductive effects of PCB traces. 2.5 Programming When delivered (and after each erasure for UV EPROM), all bits of the M27C1001 are in the '1' state. Data is introduced by selectively programming '0's into the desired bit locations. Although only '0's will be programmed, both '1's and '0's can be present in the data word. The only way to change a '0' to a '1' is by die exposition to ultraviolet light (UV EPROM). The M27C1001 is in the programming mode when VPP input is at 12.75V, E is at VIL and P is pulsed to VIL. The data to be programmed is applied to 8 bits in parallel to the data output pins. The levels required for the address and data inputs are TTL. VCC is specified to be 6.25V 0.25V. 2.6 Presto II programming algorithm Presto II Programming Algorithm allows the whole array to be programmed, with a guaranteed margin, in a typical time of 13 seconds. Programming with Presto II involves in applying a sequence of 100s program pulses to each byte until a correct verify occurs (see Figure 5). During programming and verify operation, a Margin mode circuit is automatically activated in order to guarantee that each cell is programmed with enough margin. No overprogram pulse is applied since the verify in Margin mode provides necessary margin to each programmed cell. 9/24 Device description Figure 5. M27C1001 Programming Flowchart VCC = 6.25V, VPP = 12.75V n=0 P = 100s Pulse NO ++n = 25 YES FAIL NO ++ Addr VERIFY YES Last Addr NO YES CHECK ALL BYTES 1st: VCC = 6V 2nd: VCC = 4.2V AI00715C 2.7 Program Inhibit Programming of multiple M27C1001s in parallel with different data is also easily accomplished. Except for E, all like inputs including G of the parallel M27C1001 may be common. A TTL low level pulse applied to a M27C1001's P input, with E low and VPP at 12.75V, will program that M27C1001. A high level E input inhibits the other M27C1001s from being programmed. 2.8 Program Verify A verify (read) should be performed on the programmed bits to determine that they were correctly programmed. The verify is accomplished with E and G at VIL, P at VIH, VPP at 12.75V and VCC at 6.25V. 2.9 Electronic Signature The Electronic Signature (ES) mode enables the reading out of a binary code from an EPROM that will identify its manufacturer and type. This mode is intended for use by programming equipment to automatically match the device to be programmed with its corresponding programming algorithm. The ES mode is functional in the 25C 5C ambient temperature range that is required when programming the M27C1001. To activate the ES mode, the programming equipment must force 11.5V to 12.5V on address line A9 of the M27C1001, with VPP = VCC = 5V. Two identifier bytes may then be sequenced from the device outputs by toggling address line A0 from VIL to VIH. All other address lines must be held at VIL during Electronic Signature mode. 10/24 M27C1001 Device description Byte 0 (A0 = VIL) represents the manufacturer code and byte 1 (A0 = VIH) the device identifier code. For the STMicroelectronics M27C1001, these two identifier bytes are given in Table 3 and can be read-out on outputs Q7 to Q0. Table 3. 2.10 Electronic Signature Identifier A0 Q7 Q6 Q5 Q4 Q3 Q2 Q1 Q0 Hex Data Manufacturer's Code VIL 0 0 1 0 0 0 0 0 20h Device Code VIH 0 0 0 0 0 1 0 1 05h Erasure operation (applies to UV EPROM) The erasure characteristics of the M27C1001 is such that erasure begins when the cells are exposed to light with wavelengths shorter than approximately 4000 A. It should be noted that sunlight and some type of fluorescent lamps have wavelengths in the 3000-4000 A range. Research shows that constant exposure to room level fluorescent lighting could erase a typical M27C1001 in about 3 years, while it would take approximately 1 week to cause erasure when exposed to direct sunlight. If the M27C1001 is to be exposed to these types of lighting conditions for extended periods of time, it is suggested that opaque labels be put over the M27C1001 window to prevent unintentional erasure. The recommended erasure procedure for the M27C1001 is exposure to short wave ultraviolet light which has a wavelength of 2537 A. The integrated dose (i.e. UV intensity x exposure time) for erasure should be a minimum of 15 W-sec/cm2. The erasure time with this dosage is approximately 15 to 20 minutes using an ultraviolet lamp with 12000 W/cm2 power rating. The M27C1001 should be placed within 2.5 cm (1 inch) of the lamp tubes during the erasure. Some lamps have a filter on their tubes which should be removed before erasure. 11/24 Maximum ratings 3 M27C1001 Maximum ratings Table 4. Absolute Maximum Ratings(1) Symbol Value Unit Ambient Operating Temperature (2) -40 to 125 C TBIAS Temperature Under Bias -50 to 125 C TSTG Storage Temperature -65 to 150 C VIO (3) Input or Output Voltage (except A9) -2 to 7 V Supply Voltage -2 to 7 V -2 to 13.5 V -2 to 14 V TA VCC VA9 (3) VPP Parameter A9 Voltage Program Supply Voltage 1. Except for the rating "Operating Temperature Range", stresses above those listed in the Table "Absolute Maximum Ratings" may cause permanent damage to the device. These are stress ratings only and operation of the device at these or any other conditions above those indicated in the Operating sections of this specification is not implied. Exposure to Absolute Maximum Rating conditions for extended periods may affect device reliability. Refer also to the STMicroelectronics SURE Program and other relevant quality documents. 2. Depends on range. 3. Minimum DC voltage on Input or Output is -0.5V with possible undershoot to -2.0V for a period less than 20ns. Maximum DC voltage on Output is VCC +0.5V with possible overshoot to VCC +2V for a period less than 20ns. 12/24 M27C1001 4 DC and AC characteristics DC and AC characteristics TA = 0 to 70C, -40 to 85C or -40 to 125C; VCC = 5V 5% or 5V 10%; VPP = VCC Table 5. Symbol Read Mode DC Characteristics (1) Parameter Test Condition Min. Max. Unit ILI Input Leakage Current 0V VIN VCC 10 A ILO Output Leakage Current 0V VOUT VCC 10 A ICC Supply Current E = VIL, G = VIL, IOUT = 0mA, f = 5MHz 30 mA ICC1 Supply Current (Standby) TTL E = VIH 1 mA ICC2 Supply Current (Standby) CMOS E > VCC - 0.2V 100 A IPP Program Current 10 A VIL Input Low Voltage -0.3 0.8 V Input High Voltage 2 VCC + 1 V 0.4 V VIH (2) VOL VOH VPP = VCC Output Low Voltage IOL = 2.1mA Output High Voltage TTL IOH = -400A 2.4 V Output High Voltage CMOS IOH = -100A VCC - 0.7V V 1. VCC must be applied simultaneously with or before VPP and removed simultaneously or after VPP. 2. Maximum DC voltage on Output is VCC +0.5V. TA = 25 C; VCC = 6.25V 0.25V; VPP = 12.75V 0.25V Table 6. Symbol Programming Mode DC Characteristics (1) Parameter Test Condition Min. VIL VIN VIH Max. Unit 10 A 50 mA 50 mA ILI Input Leakage Current ICC Supply Current IPP Program Current VIL Input Low Voltage -0.3 0.8 V VIH Input High Voltage 2 VCC + 0.5 V VOL Output Low Voltage IOL = 2.1mA 0.4 V VOH Output High Voltage TTL IOH = -400A VID A9 Voltage E = VIL 2.4 11.5 V 12.5 V 1. VCC must be applied simultaneously with or before VPP and removed simultaneously or after VPP. 13/24 DC and AC characteristics M27C1001 TA = 25 C, f = 1 MHz Table 7. Capacitance (1) Symbol CIN COUT Parameter Test Condition Max Unit VIN = 0V 6 pF VOUT = 0V 12 pF Input Capacitance Output Capacitance Min 1. Sampled only, not 100% tested. Table 8. AC Measurement Conditions Parameter High Speed Standard Input Rise and Fall Times 10ns 20ns Input Pulse Voltages 0 to 3V 0.4V to 2.4V 1.5V 0.8V and 2V Input and Output Timing Ref. Voltages Figure 6. AC Testing Input Output Waveform High Speed 3V 1.5V 0V Standard 2.4V 2.0V 0.8V 0.4V AI01822 Figure 7. AC Testing Load Circuit 1.3V 1N914 3.3k DEVICE UNDER TEST OUT CL CL = 30pF for High Speed CL = 100pF for Standard CL includes JIG capacitance 14/24 AI01823B M27C1001 DC and AC characteristics TA = 0 to 70C, -40 to 85C or -40 to 125C; VCC = 5V 5% or 5V 10%; VPP = VCC Read Mode AC Characteristics (1) Table 9. M27C1001 Symbol Alt Parameter Test Condition -35 (2) -45 -60 -70 Unit Min. Max. Min. Max. Min. Max. Min. Max. tAVQV tACC Address Valid to Output Valid E = VIL, G = VIL 35 45 60 70 ns tELQV tCE Chip Enable Low to Output Valid G = VIL 35 45 60 70 ns tGLQV Output Enable tOE Low to Output Valid E = VIL 25 25 30 35 ns Chip Enable High G = VIL to Output Hi-Z 0 25 0 25 0 30 0 30 ns (3) Output Enable tDF High to Output Hi- E = VIL Z 0 25 0 25 0 30 0 30 ns tAXQX Address Transition E = VIL, tOH to Output G = VIL Transition 0 tEHQZ (3) tDF tGHQZ 0 0 0 ns 1. VCC must be applied simultaneously with or before VPP and removed simultaneously or after VPP. 2. Speed obtained with High Speed AC measurement conditions. 3. Sampled only, not 100% tested. 15/24 DC and AC characteristics M27C1001 TA = 0 to 70C, -40 to 85C or -40 to 125C; VCC = 5V 5% or 5V 10%; VPP = VCC Table 10. Read Mode AC Characteristics (1) M27C1001 Symbol Alt Test Condition Parameter -80 -90 -10 -12/-15/ -20/-25 Unit Min Max Min Max Min Max Min Max tAVQV tACC Address Valid to Output Valid tELQV tCE tGLQV tEHQZ (2) E = VIL, G = VIL 80 90 100 120 ns Chip Enable Low G = VIL to Output Valid 80 90 100 120 ns tOE Output Enable Low to Output Valid 40 45 50 60 ns tDF Chip Enable High G = VIL to Output Hi-Z 0 30 0 30 0 30 0 40 ns (2) tDF Output Enable High to Output Hi-Z 0 30 0 30 0 30 0 40 ns tAXQX tOH Address E = VIL, G = Transition to V Output Transition IL tGHQZ E = VIL E = VIL 0 0 0 0 ns 1. VCC must be applied simultaneously with or before VPP and removed simultaneously or after VPP. 2. Sampled only, not 100% tested. Figure 8. A0-A16 Read Mode AC Waveforms VALID tAVQV VALID tAXQX E tGLQV tEHQZ G tELQV Q0-Q7 tGHQZ Hi-Z AI00713B 16/24 M27C1001 DC and AC characteristics TA = 25 C; VCC = 6.25V 0.25V; VPP = 12.75V 0.25V Table 11. Programming Mode AC Characteristics (1) Symbol Alt Parameter Test Condition Min. Max. tAVPL tAS Address Valid to Program Low 2 s tQVPL tDS Input Valid to Program Low 2 s tVPHPL tVPS VPP High to Program Low 2 s tVCHPL tVCS VCC High to Program Low 2 s tELPL tCES Chip Enable Low to Program Low 2 s tPLPH tPW Program Pulse Width 95 tPHQX tDH Program High to Input Transition 2 s tQXGL tOES Input Transition to Output Enable Low 2 s tGLQV tOE Output Enable Low to Output Valid tGHQZ (2) tDFP Output Enable High to Output Hi-Z 0 tGHAX tAH Output Enable High to Address Transition 0 105 Unit s 100 ns 130 ns ns 1. VCC must be applied simultaneously with or before VPP and removed simultaneously or after VPP. 2. Sampled only, not 100% tested. Figure 9. Programming and Verify Modes AC Waveforms VALID A0-A16 tAVPL Q0-Q7 DATA IN tQVPL DATA OUT tPHQX VPP tVPHPL tGLQV tGHQZ VCC tVCHPL tGHAX E tELPL P tPLPH tQXGL G PROGRAM VERIFY AI00714 17/24 Package mechanical data M27C1001 5 Package mechanical data 5.1 32-pin Ceramic Frit-seal DIP, with round window (FDIP32WA) Figure 10. FDIP32WA package outline A2 A3 A1 B1 B A L e eA D2 C eB D S N E1 E 1 FDIPW-a Table 12. FDIP32WA package mechanical data millimeters inches Symbol Min Typ A Min Typ 5.72 Max 0.225 A1 0.51 1.40 0.020 0.055 A2 3.91 4.57 0.154 0.180 A3 3.89 4.50 0.153 0.177 B 0.41 0.56 0.016 0.022 B1 1.45 0.057 C 0.23 0.30 0.009 0.012 D 41.73 42.04 1.643 1.655 D2 38.10 1.500 e 2.54 0.100 E 15.24 0.600 E1 13.06 eA 13.36 0.514 14.99 0.526 0.590 eB 16.18 18.03 0.637 0.710 L 3.18 4.10 0.125 0.161 N S 32 1.52 O 18/24 Max 32 2.49 0.060 7.11 4 0.098 0.280 11 4 11 M27C1001 5.2 Package mechanical data 32-pin Plastic DIP, 600 mils width (PDIP32) Figure 11. PDIP32 package outline A2 A1 b1 b A L e eA c D2 D S N E1 E 1 PDIP-C Table 13. PDIP32 package mechanical data millimeters inches Symbol Min Typ A A1 Max Min Typ 4.83 0.38 A2 Max 0.190 0.015 3.81 0.150 b 0.41 0.53 0.016 0.021 b1 1.14 1.65 0.045 0.065 c 0.23 0.38 0.009 0.015 D 41.78 42.29 1.645 1.665 D2 38.10 1.500 eA 15.24 0.600 e 2.54 0.100 E 15.24 15.88 0.600 0.625 E1 13.46 13.97 0.530 0.550 S 1.65 2.21 0.065 0.087 L 3.05 3.56 0.120 0.140 0 15 0 15 N 32 32 19/24 Package mechanical data 5.3 M27C1001 32-lead Rectangular Plastic Leaded Chip Carrier (PLCC32) Figure 12. PLCC32 package outline D D1 A1 A2 1 N B1 E2 e E1 E E3 F B 0.51 (.020) E2 1.14 (.045) A D3 R D2 CP D2 PLCC-A Table 14. PLCC32 package mechanical data millimeters inches Symbol Min Typ Min Typ Max A 3.18 3.56 0.125 0.140 A1 1.53 2.41 0.060 0.095 A2 0.38 B 0.33 0.53 0.013 0.021 B1 0.66 0.81 0.026 0.032 0.015 CP 0.10 0.004 D 12.32 12.57 0.485 0.495 D1 11.35 11.51 0.447 0.453 D2 4.78 5.66 0.188 0.223 D3 7.62 0.300 E 14.86 15.11 0.585 0.595 E1 13.89 14.05 0.547 0.553 E2 6.05 6.93 0.238 0.273 E3 10.16 0.400 e 1.27 0.050 F 20/24 Max 0.00 0.13 0.000 0.005 R 0.89 0.035 N 32 32 M27C1001 5.4 Package mechanical data 32-lead Plastic Thin Small Outline, 8x20 mm (TSOP32) Figure 13. TSOP32 package outline A2 N 1 e E B N/2 A D1 CP D DIE C A1 TSOP-a Table 15. L TSOP32 package mechanical data millimeters inches Symbol Min Typ A Max Min Typ 1.200 Max 0.0472 A1 0.050 0.150 0.0020 0.0059 A2 0.950 1.050 0.0374 0.0413 B 0.170 0.250 0.0067 0.0098 C 0.100 0.210 0.0039 0.0083 CP 0.100 0.0039 D 19.800 20.200 0.7795 0.7953 D1 18.300 18.500 0.7205 0.7283 e 0.500 0.0197 E 7.900 8.100 0.3110 0.3189 L 0.500 0.700 0.0197 0.0276 N 32 0 32 5 0 5 21/24 Part numbering 6 M27C1001 Part numbering Table 16. Ordering information scheme Example: M27C1001 -35 X C 1 TR Device Type M27 Supply Voltage C = 5V Device Function 1001 = 1 Mbit (128Kb x 8) Speed -35 (1) = 35 ns -10 = 100 ns -45 = 45 ns -12 = 120 ns -60 = 60 ns -15 = 150 ns -70 = 70 ns -20 = 200 ns -80 = 80 ns -25 = 250 ns -90 = 90 ns VCC Tolerance blank = 10% X = 5% Package F = FDIP32W C = PLCC32 B = PDIP32 N = TSOP32: 8 x 20 mm Temperature Range 1 = 0 to 70 C 3 = -40 to 125 C 6 = -40 to 85 C Options TR = ECOPACK(R) package, Tape & Reel Packing 1. High Speed, see AC Characteristics section for further information. For a list of available options (Speed, Package, etc...) or for further information on any aspect of this device, please contact the STMicroelectronics Sales Office nearest to you. 22/24 M27C1001 7 Revision history Revision history Table 17. Document revision history Date Revision Changes September 1998 1 First Issue 24-Jan-2000 2 35ns speed class addes (Table 8A, Table 16) 20-Sep-2000 3 AN620 Reference removed 04-Jun-2002 4 PLCC32 Package mechanical data and drawing clarified (Table 14 and Figure 12) TSOP32 Package mechanical data clarified (Table 15) 12-Apr-2006 5 Removed LCC32W package and Additional Burn-in option. Converted to new template. Added ECOPACK(R) information. 23/24 M27C1001 Please Read Carefully: Information in this document is provided solely in connection with ST products. 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