®
Figure 1. Typical Flyback Application.
®
PRODUCT3Adapter1Open
Frame2Open
Frame2
OUTPUT POWER TABLE
Table 1. Notes: 1. Typical continuous power in a non-ventilated
enclosed adaptor measured at 50 ˚C ambient. 2. Maximum practical
continuous power in an open frame design at 50 ˚C ambient. See
key applications section for detailed conditions. 3. Packages: P: DIP-
8B, G: SMD-8B, Y: TO-220-7C. Please see pg. 44 for part ordering
information. 4. 230 VAC or 100/115 VAC with doubler.
PI-2632-060200
AC
IN DC
OUT
D
S
C
TOPSwitch-GX
CONTROL
L
+
-
FX
230 VAC ±15%4
Adapter1
85-265 VAC
9 W 15 W 6.5 W 10 W
10 W 22 W 7 W 14 W
13 W 25 W 9 W 15 W
20 W 45 W 15 W 30 W
16 W 30 W 11 W 20 W
30 W 65 W 20 W 45 W
40 W 85 W 26 W 60 W
60 W 125 W 40 W 90 W
85 W 165 W 55 W 125 W
105 W 205 W 70 W 155 W
120 W 250 W 80 W 180 W
Product Highlights
Lower System Cost, High Design Flexibility
Extended power range to 250 W
Features eliminate or reduce cost of external components
Fully integrated soft-start for minimum stress/overshoot
Externally programmable accurate current limit for high
efficiency low cost designs and power limiting
Wider duty cycle for more power, smaller input capacitor
Separate line sense and current limit pins on Y package
Line under-voltage (UV) detection: no turn off glitches
Line over-voltage (OV) shutdown extends line surge limit
Line feed forward with maximum duty cycle (DCMAX)
reduction rejects line ripple and limits DCMAX at high line
Frequency jittering reduces EMI and EMI filtering costs
Regulates to zero load without dummy loading
132 kHz frequency reduces transformer/power supply size
Half frequency option in Y package for video applications
Hysteretic thermal shutdown for automatic fault recovery
Large thermal hysteresis prevents PC board overheating
Standard packages with omitted pins for large creepage
EcoSmart
- Energy Efficient
Extremely low consumption in remote off mode
(80 mW @ 110 VAC, 160 mW @ 230 VAC)
Frequency lowered with load for high standby efficiency
Allows shutdown/wake-up via LAN/input port
Description
TOPSwitch-GX uses the same proven topology as TOPSwitch,
cost effectively integrating the high voltage power MOSFET,
PWM control, fault protection and other control circuitry onto
a single CMOS chip. TOPSwitch-GX extends beyond the power
ranges of existing TOPSwitch families while integrating many
new functions that are designed to reduce system cost and
improve design flexibility, performance and energy efficiency.
Depending on package type, the TOPSwitch-GX family has
either 1 or 3 additional pins over the standard DRAIN, SOURCE
and CONTROL terminals. These can be configured to allow the
following functions: line sensing (OV/UV, line feedforward/
DC max reduction), accurate externally set current limit, remote
on/off, and synchronization to an external lower frequency and
frequency selection (132 kHz/66 kHz).
All package types provide the following transparent features:
Soft-start, 132 kHz switching frequency (automatically reduced
TOP242P or G
TOP242Y
TOP243P or G
TOP243Y
TOP244P or G
TOP244Y
TOP245Y
TOP246Y
TOP247Y
TOP248Y
TOP249Y
TOP242-249
TOPSwitch -GX
Family
Extended Power, Design Flexible,
EcoSmart®
, Integrated Off-line Switcher
November 2000
at light load), frequency jittering for lower EMI, wider DCMAX,
hysteretic thermal shutdown and larger creepage packages. In
addition, all critical parameters (i.e. current limit, frequency,
PWM gain) have tighter temperature and absolute tolerance, to
simplify design and optimize system cost.
TOP242-249
2D
11/00 August 8, 2000
Section List
Functional Block Diagram......................................................................................................................................... 3
Pin Functional Description........................................................................................................................................ 4
TOPSwitch-GX Family Functional Description ........................................................................................................5
Control Pin Operation .............................................................................................................................................6
Oscillator and Switching Frequency .......................................................................................................................6
Pulse Width Modulator and Maximum Duty Cycle .................................................................................................7
Light Load Frequency Reduction............................................................................................................................7
Error Amplifier .........................................................................................................................................................7
On-chip Current Limit with External Programmability.............................................................................................7
Line Under-Voltage Detection (UV) ........................................................................................................................8
Line Over-Voltage Shutdown (OV) ......................................................................................................................... 8
Line Feed Forward with DCMAX Reduction ..............................................................................................................8
Remote ON/OFF and Synchronization...................................................................................................................9
Soft-Start ................................................................................................................................................................9
Shutdown/Auto-Restart ..........................................................................................................................................9
Hysteretic Over-Temperature Protection ................................................................................................................9
Bandgap Reference................................................................................................................................................9
High-Voltage Bias Current Source........................................................................................................................10
Using Feature Pins.................................................................................................................................................... 11
FREQUENCY (F) Pin Operation........................................................................................................................... 11
LINE-SENSE (L) Pin Operation............................................................................................................................ 11
EXTERNAL CURRENT LIMIT (X) Pin Operation ................................................................................................. 11
MULTI-FUNCTION (M) Pin Operation.................................................................................................................. 12
Typical Uses of FREQUENCY (F) Pin ......................................................................................................................15
Typical Uses of LINE-SENSE (L) and EXTERNAL CURRENT LIMIT (X) Pins....................................................... 16
Typical Uses of MULTI-FUNCTION (M) Pin .............................................................................................................19
Application Examples...............................................................................................................................................21
A High Efficiency, 30 W, Universal Input Power Supply........................................................................................ 21
A High Efficiency, Enclosed, 70 W, Universal Adapter Supply..............................................................................22
A High Efficiency, 250 W, 250 - 380 VDC Input Power Supply............................................................................. 23
Multiple Output, 60 W, 185 - 265 VAC Input Power Supply..................................................................................24
Processor Controlled Supply Turn On/Off ............................................................................................................25
Key Application Considerations.............................................................................................................................. 27
TOPSwitch-II vs. TOPSwitch-GX..........................................................................................................................27
TOPSwitch-FX vs. TOPSwitch-GX .......................................................................................................................28
TOPSwitch-GX Design Considerations ................................................................................................................29
TOPSwitch-GX Layout Considerations.................................................................................................................32
Quick Design Checklist.........................................................................................................................................32
Design Tools ......................................................................................................................................................... 32
Product Specifications and Test Conditions .......................................................................................................... 33
Typical Performance Characteristics ...................................................................................................................... 40
Part Ordering Information ........................................................................................................................................44
Package Outlines ......................................................................................................................................................44
TOP242-249
3
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11/00
August 8, 2000
Figure 2a. Functional Block Diagram (Y Package).
PI-2641-061200
PI-2639-060600
Figure 2b. Functional Block Diagram (P or G Package).
PI-2631-061200
SHUTDOWN/
AUTO-RESTART
PWM
COMPARATOR
CLOCK
SAW
CONTROLLED
TURN-ON
GATE DRIVER
CURRENT LIMIT
COMPARATOR
INTERNAL UV
COMPARATOR
INTERNAL
SUPPLY
5.8 V
4.8 V
SOURCE (S)
S
R
Q
DMAX
STOP SOFT-
START
-
+
CONTROL (C)
MULTI-
FUNCTION (M)
-
+
5.8 V
IFB
RE
ZC
VC
+
-
LEADING
EDGE
BLANKING
÷ 8
1
HYSTERETIC
THERMAL
SHUTDOWN
SHUNT REGULATOR/
ERROR AMPLIFIER
+
-
DRAIN (D)
ON/OFF
SOFT
START
DCMAX
VBG
DCMAX
VBG + VT
0
OV/UV
VI (LIMIT)
CURRENT
LIMIT
ADJUST
LINE
SENSE
SOFT START
LIGHT LOAD
FREQUENCY
REDUCTION
STOP LOGIC
OSCILLATOR WITH JITTER
PI-2639-060600
SHUTDOWN/
AUTO-RESTART
PWM
COMPARATOR
CLOCK
SAW
HALF
FREQ.
CONTROLLED
TURN-ON
GATE DRIVER
CURRENT LIMIT
COMPARATOR
INTERNAL UV
COMPARATOR
INTERNAL
SUPPLY
5.8 V
4.8 V
SOURCE (S)
S
R
Q
DMAX
STOP SOFT-
START
-
+
CONTROL (C)
LINE-SENSE (L)
EXTERNAL
CURRENT LIMIT (X)
FREQUENCY (F)
-
+
5.8 V
1 V
IFB
RE
ZC
VC
+
-
LEADING
EDGE
BLANKING
÷ 8
1
HYSTERETIC
THERMAL
SHUTDOWN
SHUNT REGULATOR/
ERROR AMPLIFIER +
-
DRAIN (D)
ON/OFF
SOFT
START
DCMAX
VBG
DCMAX
VBG + VT
0
OV/UV
VI (LIMIT)
CURRENT
LIMIT
ADJUST
LINE
SENSE
SOFT START
LIGHT LOAD
FREQUENCY
REDUCTION
STOP LOGIC
OSCILLATOR WITH JITTER
TOP242-249
4D
11/00 August 8, 2000
PI-2638-060600
Tab Internally
Connected to
Source Pin
Y Package (TO-220-7C)
CD
S
S
S
S
1 C
3 X
2 L
5 F
4 S
7 D
M
P Package (DIP-8B)
G Package (SMD-8B)
8
5
7
1
4
2
3
Pin Functional Description
DRAIN (D) Pin:
High voltage power MOSFET drain output. The internal start-
up bias current is drawn from this pin through a switched high-
voltage current source. Internal current limit sense point for
drain current.
CONTROL (C) Pin:
Error amplifier and feedback current input pin for duty cycle
control. Internal shunt regulator connection to provide internal
bias current during normal operation. It is also used as the
connection point for the supply bypass and auto-restart/
compensation capacitor.
LINE-SENSE (L) Pin: (Y package only)
Input pin for OV, UV, line feed forward with DCMAX reduction,
remote ON/OFF and synchronization. A connection to SOURCE
pin disables all functions on this pin.
EXTERNAL CURRENT LIMIT (X) Pin: (Y package only)
Input pin for external current limit adjustment, remote ON/
OFF, and synchronization. A connection to SOURCE pin
disables all functions on this pin.
MULTI-FUNCTION (M) Pin: (P or G package only)
This pin combines the functions of the LINE-SENSE (L) and
EXTERNAL CURRENT LIMIT (X) pins of the Y package into
one pin. Input pin for OV, UV, line feed forward with DCMAX
reduction, external current limit adjustment, remote ON/OFF
and synchronization. A connection to SOURCE pin disables all
functions on this pin and makes TOPSwitch-GX operate in
simple three terminal mode (like TOPSwitch-II).
FREQUENCY (F) Pin: (Y package only)
Input pin for selecting switching frequency: 132 kHz if connected
Figure 3. Pin Configuration (top view).
PI-2509-081199
DC
Input
Voltage
+
-
DM
S
C
VUV = IUV x RLS
VOV = IOV x RLS
For RLS = 2M
VUV = 100 VDC
VOV = 450 VDC
DCMAX@100 VDC = 78%
DCMAX@375 VDC = 38%
CONTROL
R
LS
2M
PI-2517-081199
DC
Input
Voltage
+
-
DM
S
C
For RIL = 12 K
ILIMIT = 69%
CONTROL
RIL
See fig. 54 for other
resistor values (RIL)
For RIL = 25 K
ILIMIT = 43%
to select different
ILIMIT values
X
PI-2629-050400
DC
Input
Voltage
+
-
D
S
C
CONTROL
L
R
IL
R
LS
12K
2M
VUV = IUV x RLS
VOV = IOV x RLS
For RLS = 2 M
DCMAX@100 VDC = 78%
DCMAX@375 VDC = 38%
For RIL = 12 K
ILIMIT = 69%
See fig. 54 for other
resistor values (RIL)
to select different ILIMIT
values
VUV = 100 VDC
VOV = 450 VDC
Figure 4. Y Package Line Sense and Externally Set Current Limit.
Figure 5. P/G Package Line Sense.
Figure 6. P/G Package Externally Set Current Limit.
to SOURCE pin and 66 kHz if connected to CONTROL pin.
The switching frequency is internally set for fixed 132 kHz
operation in P and G packages.
SOURCE (S) Pin:
Output MOSFET source connection for high voltage power
return. Primary side control circuit common and reference point.
TOP242-249
5
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11/00
August 8, 2000
TOPSwitch-GX
Family Functional Description
Like TOPSwitch, TOPSwitch-GX is an integrated switched
mode power supply chip that converts a current at the control
input to a duty cycle at the open drain output of a high voltage
power MOSFET. During normal operation the duty cycle of the
power MOSFET decreases linearly with increasing CONTROL
pin current as shown in Figure 7.
In addition to the three terminal TOPSwitch features, such as the
high voltage start-up, the cycle-by-cycle current limiting, loop
compensation circuitry, auto-restart, thermal shutdown, the
TOPSwitch-GX incorporates many additional functions that
reduce system cost, increase power supply performance and
design flexibility. A patented high voltage CMOS technology
allows both the high voltage power MOSFET and all the low
voltage control circuitry to be cost effectively integrated onto a
single monolithic chip.
Three terminals, FREQUENCY, LINE-SENSE, and
EXTERNAL CURRENT LIMIT (available in Y package) or
one terminal MULTI-FUNCTION (available in P or G Package)
have been added to implement some of the new functions.
These terminals can be connected to the SOURCE pin to
operate the TOPSwitch-GX in a TOPSwitch-like three terminal
mode. However, even in this three terminal mode, the
TOPSwitch-GX offers many new transparent features that do
not require any external components:
1. A fully integrated 10 ms soft-start limits peak currents and
voltages during start-up and dramatically reduces or
eliminates output overshoot in most applications.
2. DCMAX of 78% allows smaller input storage capacitor, lower
input voltage requirement and/or higher power capability.
3. Frequency reduction at light loads lowers the switching
losses and maintains good cross regulation in multiple
output supplies.
4. Higher switching frequency of 132 kHz reduces the
transformer size with no noticeable impact on EMI.
5. Frequency jittering reduces EMI.
6. Hysteretic over-temperature shutdown ensures automatic
recovery from thermal fault. Large hysteresis prevents circuit
board overheating.
7. Packages with omitted pins and lead forming provide large
drain creepage distance.
8. Tighter absolute tolerances and smaller temperature vari-
ations on switching frequency, current limit and PWM gain.
The LINE-SENSE (L) pin is usually used for line sensing by
connecting a resistor from this pin to the rectified DC high
voltage bus to implement line over-voltage (OV), under-voltage
(UV) and line feed forward with DCMAX reduction. In this
mode, the value of the resistor determines the OV/UV thresholds
and the DCMAX is reduced linearly starting from a line voltage
above the under-voltage threshold. See Table 2 and Figure 11.
The pin can also be used as a remote ON/OFF and a
synchronization input.
The EXTERNAL CURRENT LIMIT (X) pin is usually used to
reduce the current limit externally to a value close to the operating
peak current, by connecting the pin to SOURCE through a
resistor. This pin can also be used as a remote ON/OFF and a
synchronization input in both modes. See Table 2 and Figure 11.
For the P or G packages the LINE-SENSE and EXTERNAL
CURRENT LIMIT pin functions are combined on one MULTI-
FUNCTION (M) pin. However, some of the functions become
mutually exclusive as shown in Table 3.
The FREQUENCY (F) pin in the TO-220 package sets the
switching frequency to the default value of 132 kHz when
connected to SOURCE pin. A half frequency option of 66 kHz
can be chosen by connecting this pin to CONTROL pin instead.
Leaving this pin open is not recommended.
PI-2633-060500
Duty Cycle (%)
I
C
(mA)
TOP242/5 1.6 2.0
TOP246/9 2.2 2.6 5.2 6.0
5.8 6.6
I
CD1
I
B
Auto-restart
IL = 125 µA
IL < IL(DC)
IL = 190 µA
78
10
38
Frequency (kHz)
I
C
(mA)
30
I
CD1
I
B
Auto-restart
132
Note: For P and G packages I
L
is replaced with I
M
.
IL < IL(DC)
IL = 125 µA
Slope = PWM Gain
IL = 190 µA
Figure 7. Relationship of Duty Cycle and Frequency to CONTROL
Pin Current.
TOP242-249
6D
11/00 August 8, 2000
PI-2545-082299
S1 S2 S6 S7 S1 S2 S6 S7S0 S1 S7
S0 S0 5.8 V
4.8 V
S7
0 V
0 V
0 V
VLINE
VC
VDRAIN
VOUT
Note: S0 through S7 are the output states of the auto-restart counter
2
1234
0 V
~
~
~
~
~
~~
~~
~
S6 S7
~
~~
~
~
~
~
~
VUV
~
~
~
~
~
~
~
~
S2
~
~
Control Pin Operation
The CONTROL pin is a low impedance node that is capable of
receiving a combined supply and feedback current. During
normal operation, a shunt regulator is used to separate the
feedback signal from the supply current. CONTROL pin
voltage VC is the supply voltage for the control circuitry
including the MOSFET gate driver. An external bypass capacitor
closely connected between the CONTROL and SOURCE pins
is required to supply the instantaneous gate drive current. The
total amount of capacitance connected to this pin also sets the
auto-restart timing as well as control loop compensation.
When rectified DC high voltage is applied to the DRAIN pin
during start-up, the MOSFET is initially off, and the CONTROL
pin capacitor is charged through a switched high voltage current
source connected internally between the DRAIN and CONTROL
pins. When the CONTROL pin voltage VC reaches
approximately 5.8 V, the control circuitry is activated and the
soft-start begins. The soft-start circuit gradually increases the
duty cycle of the MOSFET from zero to the maximum value
over approximately 10 ms. If no external feedback/supply
current is fed into the CONTROL pin by the end of the soft-start,
the high voltage current source is turned off and the CONTROL
pin will start discharging in response to the supply current
drawn by the control circuitry. If the power supply is designed
properly, and no fault condition such as open loop or shorted
output exists, the feedback loop will close, providing external
CONTROL pin current, before the CONTROL pin voltage has
had a chance to discharge to the lower threshold voltage of
approximately 4.8 V (internal supply under-voltage lockout
threshold). When the externally fed current charges the
CONTROL pin to the shunt regulator voltage of 5.8 V, current
in excess of the consumption of the chip is shunted to SOURCE
through resistor RE as shown in Figure 2. This current flowing
through RE controls the duty cycle of the power MOSFET to
provide closed loop regulation. The shunt regulator has a finite
low output impedance ZC that sets the gain of the error amplifier
when used in a primary feedback configuration. The dynamic
impedance ZC of the CONTROL pin together with the external
CONTROL pin capacitance sets the dominant pole for the
control loop.
When a fault condition such as an open loop or shorted output
prevents the flow of an external current into the CONTROL pin,
the capacitor on the CONTROL pin discharges towards 4.8 V.
At 4.8 V, auto-restart is activated which turns the output
MOSFET off and puts the control circuitry in a low current
standby mode. The high-voltage current source turns on and
charges the external capacitance again. A hysteretic internal
supply under-voltage comparator keeps VC within a window of
typically 4.8 to 5.8 V by turning the high-voltage current source
on and off as shown in Figure 8. The auto-restart circuit has a
divide-by-8 counter which prevents the output MOSFET from
turning on again until eight discharge/charge cycles have elapsed.
This is accomplished by enabling the output MOSFET only
when the divide-by-8 counter reaches full count (S7). The
counter effectively limits TOPSwitch-GX power dissipation by
reducing the auto-restart duty cycle to typically 4%. Auto-
restart mode continues until output voltage regulation is again
achieved through closure of the feedback loop.
Oscillator and Switching Frequency
The internal oscillator linearly charges and discharges an internal
capacitance between two voltage levels to create a sawtooth
Figure 8. Typical Waveforms for (1) Power Up (2) Normal Operation (3) Auto-restart (4) Power Down .
TOP242-249
7
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11/00
August 8, 2000
Figure 9. Switching Frequency Jitter. (Idealized VDRAIN waveform)
waveform for the pulse width modulator. This oscillator sets
the pulse width modulator/current limit latch at the beginning
of each cycle.
The nominal switching frequency of 132 kHz was chosen to
minimize transformer size while keeping the fundamental EMI
frequency below 150 kHz. The FREQUENCY pin (available
only in TO-220 package), when shorted to the CONTROL pin,
lowers the switching frequency to 66 kHz (half frequency)
which may be preferable in some cases such as noise sensitive
video applications or a high efficiency standby mode. Otherwise,
the FREQUENCY pin should be connected to the SOURCE pin
for the default 132 kHz.
To further reduce the EMI level, the switching frequency is
jittered (frequency modulated) by approximately ±4 kHz at
250 Hz (typical) rate as shown in Figure 9. Figure 46 shows the
typical improvement of EMI measurements with frequency
jitter.
Pulse Width Modulator and Maximum Duty Cycle
The pulse width modulator implements voltage mode control
by driving the output MOSFET with a duty cycle inversely
proportional to the current into the CONTROL pin that is in
excess of the internal supply current of the chip (see Figure 7).
The excess current is the feedback error signal that appears
across RE (see Figure 2). This signal is filtered by an RC
network with a typical corner frequency of 7 kHz to reduce the
effect of switching noise in the chip supply current generated by
the MOSFET gate driver. The filtered error signal is compared
with the internal oscillator sawtooth waveform to generate the
duty cycle waveform. As the control current increases, the duty
cycle decreases. A clock signal from the oscillator sets a latch
which turns on the output MOSFET. The pulse width modulator
resets the latch, turning off the output MOSFET. Note that a
minimum current must be driven into the CONTROL pin
before the duty cycle begins to change.
The maximum duty cycle, DCMAX, is set at a default maximum
value of 78% (typical). However, by connecting the LINE-
SENSE or MULTI-FUNCTION pin (depending on the package)
to the rectified DC high voltage bus through a resistor with
appropriate value, the maximum duty cycle can be made to
decrease from 78% to 38% (typical) as shown in Figure 11 when
input line voltage increases (see line feed forward with DCMAX
reduction).
Light Load Frequency Reduction
The pulse width modulator duty cycle reduces as the load at the
power supply output decreases. This reduction in duty cycle is
proportional to the current flowing into the CONTROL pin. As
the CONTROL pin current increases, the duty cycle decreases
linearly towards a duty cycle of 10%. Below 10% duty cycle, to
maintain high efficiency at light loads, the frequency is also
reduced linearly until a minimum frequency is reached at a duty
cycle of 0% (refer to Figure 7). The minimum frequency is
typically 30 kHz and 15 kHz for 132 kHz and 66 kHz operation,
respectively.
This feature allows a power supply to operate at lower frequency
at light loads thus lowering the switching losses while
maintaining good cross regulation performance and low output
ripple.
Error Amplifier
The shunt regulator can also perform the function of an error
amplifier in primary side feedback applications. The shunt
regulator voltage is accurately derived from a temperature-
compensated bandgap reference. The gain of the error amplifier
is set by the CONTROL pin dynamic impedance. The
CONTROL pin clamps external circuit signals to the VC
voltage level. The CONTROL pin current in excess of the
supply current is separated by the shunt regulator and flows
through RE as a voltage error signal.
On-chip Current Limit with External Programmability
The cycle-by-cycle peak drain current limit circuit uses the
output MOSFET ON-resistance as a sense resistor. A current
limit comparator compares the output MOSFET on-state drain
to source voltage, VDS(ON) with a threshold voltage. High drain
current causes VDS(ON) to exceed the threshold voltage and turns
the output MOSFET off until the start of the next clock cycle.
The current limit comparator threshold voltage is temperature
compensated to minimize the variation of the current limit due
to temperature related changes in RDS(ON) of the output MOSFET.
The default current limit of TOPSwitch-GX is preset internally.
However, with a resistor connected between EXTERNAL
CURRENT LIMIT (X) pin (Y package) or MULTI-FUNCTION
(M) pin (P or G package) and SOURCE pin, current limit can
be programmed externally to a lower level between 30% and
100% of the default current limit. Please refer to the graphs in
the typical performance characteristics section for the selection
of the resistor value. By setting current limit low, a larger
TOPSwitch-GX than necessary for the power required can be
used to take advantage of the lower RDS(ON) for higher efficiency/
smaller heatsinking requirements. With a second resistor
PI-2550-092499
128 kHz
4 ms
Time
Switching
Frequency
VDRAIN
136 kHz
TOP242-249
8D
11/00 August 8, 2000
Figure 10. Synchronization Timing Diagram.
PI-2637-060600
Oscillator
(SAW)
DMAX
Enable from
X, L or M Pin (STOP) Time
connected between the EXTERNAL CURRENT LIMIT (X)
pin (Y package) or MULTI-FUNCTION (M) pin (P or G
package) and the rectified DC high voltage bus, the current limit
is reduced with increasing line voltage, allowing a true power
limiting operation against line variation to be implemented.
When using an RCD clamp, this power limiting technique
reduces maximum clamp voltage at high line. This allows for
higher reflected voltage designs as well as reducing clamp
dissipation.
The leading edge blanking circuit inhibits the current limit
comparator for a short time after the output MOSFET is turned
on. The leading edge blanking time has been set so that, if a
power supply is designed properly, current spikes caused by
primary-side capacitances and secondary-side rectifier reverse
recovery time should not cause premature termination of the
switching pulse.
The current limit is lower for a short period after the leading
edge blanking time as shown in Figure 51. This is due to
dynamic characteristics of the MOSFET. To avoid triggering
the current limit in normal operation, the drain current waveform
should stay within the envelope shown.
Line Under Voltage Detection (UV)
At power up, UV keeps TOPSwitch-GX off until the input line
voltage reaches the under voltage threshold. At power down,
UV prevents auto-restart attempts after the output goes out of
regulation. This eliminates power down glitches caused by the
slow discharge of large input storage capacitor present in
applications such as standby supplies. A single resistor connected
from the LINE-SENSE pin (Y package) or MULTI-FUNCTION
pin (P or G package) to the rectified DC high voltage bus sets
UV threshold during power up. Once the power supply is
successfully turned on, the UV threshold is lowered to 40% of
the initial UV threshold to allow extended input voltage operating
range (UV low threshold). If the UV low threshold is reached
during operation without the power supply losing regulation the
device will turn off and stay off until UV (high threshold) has
been reached again. If the power supply loses regulation before
reaching the UV low threshold, the device will enter auto-
restart. At the end of each auto-restart cycle (S7), the UV
comparator is enabled. If the UV high threshold is not exceeded
the MOSFET will be disabled during the next cycle (see figure 8).
The UV feature can be disabled independent of OV feature as
shown in Figure 19 and 23.
Line Over Voltage Shutdown (OV)
The same resistor used for UV also sets an over voltage
threshold which, once exceeded, will force TOPSwitch-GX
output into off-state. The ratio of OV and UV thresholds is
preset at 4.5 as can be seen in Figure 11. When the MOSFET
is off, the rectified DC high voltage surge capability is increased
to the voltage rating of the MOSFET (700 V), due to the absence
of the reflected voltage and leakage spikes on the drain. A small
amount of hysteresis is provided on the OV threshold to prevent
noise triggering. The OV feature can be disabled independent
of the UV feature as shown in Figure 18 and 32.
Line Feed Forward with DCMAX Reduction
The same resistor used for UV and OV also implements line
voltage feed forward which minimizes output line ripple and
reduces power supply output sensitivity to line transients. This
feed forward operation is illustrated in Figure 7 by the different
values of IL (Y package) or IM (P or G Package). Note that for
the same CONTROL pin current, higher line voltage results in
smaller operating duty cycle. As an added feature, the maximum
duty cycle DCMAX is also reduced from 78% (typical) at a
voltage slightly higher than the UV threshold to 38% (typical)
at the OV threshold (see Figures 7, 11). Limiting DCMAX at
TOP242-249
9
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11/00
August 8, 2000
higher line voltages helps prevent transformer saturation due to
large load transients in forward converter applications. DCMAX
of 38% at the OV threshold was chosen to ensure that the power
capability of the TOPSwitch-GX is not restricted by this feature
under normal operation.
Remote ON/OFF and Synchronization
TOPSwitch-GX can be turned on or off by controlling the
current into the LINE-SENSE pin or out from the EXTERNAL
CURRENT LIMIT pin (Y package) and into or out from the
MULTI-FUNCTION pin (P or G package) (see Figure 11). In
addition, the LINE-SENSE pin has a 1 V threshold comparator
connected at its input. This voltage threshold can also be used
to perform remote ON/OFF control. This allows easy
implementation of remote ON/OFF control of TOPSwitch-GX
in several different ways. A transistor or an optocoupler output
connected between the EXTERNAL CURRENT LIMIT or
LINE-SENSE pins (Y package) or the MULTI-FUNCTION
pin (P or G package) and the SOURCE pin implements this
function with “active-on” (Figure 22, 29 and 36) while a
transistor or an optocoupler output connected between the
LINE-SENSE pin (Y package) or the MULTI-FUNCTION
(P or G package) pin and the CONTROL pin implements the
function with “active-off” (Figure 23 and 37).
When a signal is received at the LINE-SENSE pin or the
EXTERNAL CURRENT LIMIT pin (Y package) or the MULTI-
FUNCTION pin (P or G package) to disable the output through
any of the pin functions such as OV, UV and remote ON/OFF,
TOPSwitch-GX always completes its current switching cycle,
as illustrated in Figure 10, before the output is forced off. The
internal oscillator is stopped slightly before the end of the
current cycle and stays there as long as the disable signal exists.
When the signal at the above pins changes state from disable to
enable, the internal oscillator starts the next switching cycle.
This approach allows the use of this pin to synchronize
TOPSwitch-GX to any external signal with a frequency lower
than its internal switching frequency.
As seen above, the remote ON/OFF feature allows the
TOPSwitch-GX to be turned on and off instantly, on a cycle-by-
cycle basis, with very little delay. However, remote ON/OFF
can also be used as a standby or power switch to turn off the
TOPSwitch-GX and keep it in a very low power consumption
state for indefinitely long periods. If the TOPSwitch-GX is held
in remote off state for long enough time to allow the CONTROL
pin to dishcharge to the internal supply under-voltage threshold
of 4.8 V (approximately 32 mS for a 47 µF CONTROL pin
capacitance), the CONTROL pin goes into the hysteretic mode
of regulation. In this mode, the CONTROL pin goes through
alternate charge and discharge cycles between 4.8 V and 5.8 V
(see CONTROL pin operation section above) and runs entirely
off the high voltage DC input, but with very low power
consumption (160 mW typical at 230 VAC with M or X pins
open). When the TOPSwitch-GX is remotely turned on after
entering this mode, it will initiate a normal start-up sequence
with soft-start the next time the CONTROL pin reaches 5.8 V.
In the worst case, the delay from remote on to start-up can be
equal to the full discharge/charge cycle time of the CONTROL
pin, which is approximately 125 mS for a 47 µF CONTROL pin
capacitor. This reduced consumption remote off mode can
eliminate expensive and unreliable in-line mechanical switches.
It also allows for microprocessor controlled turn-on and turn-
off sequences that may be required in certain applications such
as inkjet and laser printers.
Soft-Start
Two on-chip soft-start functions are activated at start-up with a
duration of 10 ms (typical). Maximum duty cycle starts from
0% and linearly increases to the default maximum of 78% at the
end of the 10 ms duration and the current limit starts from about
85% and linearly increases to 100% at the end of the 10ms
duration. In addition to start-up, soft-start is also activated at
each restart attempt during auto-restart and when restarting
after being in hysteretic regulation of CONTROL pin voltage
(VC), due to remote off or thermal shutdown conditions. This
effectively minimizes current and voltage stresses on the output
MOSFET, the clamp circuit and the output rectifier during start-
up. This feature also helps minimize output overshoot and
prevents saturation of the transformer during start-up.
Shutdown/Auto-Restart
To minimize TOPSwitch-GX power dissipation under fault
conditions, the shutdown/auto-restart circuit turns the power
supply on and off at an auto-restart duty cycle of typically 4%
if an out of regulation condition persists. Loss of regulation
interrupts the external current into the CONTROL pin. VC
regulation changes from shunt mode to the hysteretic auto-
restart mode as described in CONTROL pin operation section.
When the fault condition is removed, the power supply output
becomes regulated, VC regulation returns to shunt mode, and
normal operation of the power supply resumes.
Hysteretic Over-Temperature Protection
Temperature protection is provided by a precision analog
circuit that turns the output MOSFET off when the junction
temperature exceeds the thermal shutdown temperature (140 ˚C
typical). When the junction temperature cools to below the
hysteretic temperature, normal operation resumes providing
automatic recovery. A large hysteresis of 70 ˚C (typical) is
provided to prevent overheating of the PC board due to a
continuous fault condition. VC is regulated in hysteretic mode
and a 4.8 V to 5.8 V (typical) sawtooth waveform is present on
the CONTROL pin while in thermal shutdown.
Bandgap Reference
All critical TOPSwitch-GX internal voltages are derived from a
temperature-compensated bandgap reference. This reference is
TOP242-249
10 D
11/00 August 8, 2000
also used to generate a temperature-compensated current
reference which is trimmed to accurately set the switching
frequency, MOSFET gate drive current, current limit, and the
line OV/UV thresholds. TOPSwitch-GX has improved circuitry
to maintain all of the above critical parameters within very tight
absolute and temperature tolerances.
High-Voltage Bias Current Source
This current source biases TOPSwitch-GX from the DRAIN pin
and charges the CONTROL pin external capacitance during
start-up or hysteretic operation. Hysteretic operation occurs
during auto-restart, remote off and over-temperature shutdown.
In this mode of operation, the current source is switched on and
off with an effective duty cycle of approximately 35%. This
duty cycle is determined by the ratio of CONTROL pin charge
(IC) and discharge currents (ICD1 and ICD2). This current source
is turned off during normal operation when the output MOSFET
is switching. The effect of the current source switching will be
seen on the DRAIN voltage waveform as small disturbances
and is normal.
TOP242-249
11
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Refer to Table 2 for possible combinations of the functions with
example circuits shown in Figure 16 through Figure 40. A
description of specific functions in terms of the LINE-SENSE
pin I/V characteristic is shown in Figure 11 (right hand side).
The horizontal axis represents LINE-SENSE pin current with
positive polarity indicating currents flowing into the pin. The
meaning of the vertical axes varies with functions. For those
that control the on/off states of the output such as UV, OV and
remote ON/OFF, the vertical axis represents the enable/disable
states of the output. UV triggers at IUV (+50 µA typical with
30 µA hysteresis) and OV triggers at IOV (+225 µA typical with
8 µA hysteresis). Between the UV and OV thresholds, the
output is enabled. For line feed forward with DCMAX reduction,
the vertical axis represents the magnitude of the DCMAX. Line
feed forward with DC MAX reduction lowers maximum duty cycle
from 78% at IL(DC) (+60 µA typical) to 38% at IOV (+225 µA).
EXTERNAL CURRENT LIMIT (X) Pin Operation
(Y Package)
When current is drawn out of the EXTERNAL CURRENT
LIMIT pin, it works as a voltage source of approximately 1.3
V up to a maximum current of –240 µA (typical). At –240 µA,
it turns into a constant current source (refer to Figure 12a).
There are two functions available through the use of the
EXTERNAL CURRENT LIMIT pin: external current limit
and remote ON/OFF. Connecting the EXTERNAL CURRENT
LIMIT pin and SOURCE pin disables the two functions. In
high efficiency applications this pin can be used to reduce the
current limit externally to a value close to the operating peak
current, by connecting the pin to the SOURCE pin through a
resistor. The pin can also be used as a remote on/off. Table 2
shows several possible combinations using this pin. See Figure
FREQUENCY (F) Pin Operation
The FREQUENCY pin is a digital input pin available in the
TO-220 package only. Shorting the FREQUENCY pin to
SOURCE pin selects the nominal switching frequency of
132 kHz (Figure 13) which is suited for most applications. For
other cases that may benefit from lower switching frequency
such as noise sensitive video applications, a 66 kHz switching
frequency (half frequency) can be selected by shorting the
FREQUENCY pin to the CONTROL pin (Figure 14). In
addition, an example circuit shown in Figure 15 may be used to
lower the switching frequency from 132 kHz in normal
operation to 66 kHz in standby mode for very low standby
power consumption.
LINE-SENSE (L) Pin Operation (Y Package)
When current is fed into the LINE-SENSE pin, it works as a
voltage source of approximately 2.6 V up to a maximum
current of +400 µA (typical). At +400 µA, this pin turns into
a constant current sink. Refer to Figure 12a. In addition, a
comparator with a threshold of 1 V is connected at the pin and
is used to detect when the pin is shorted to the SOURCE pin.
There are a total of four functions available through the use of
the LINE-SENSE pin: OV, UV, line feed forward with DCMAX
reduction, and remote ON/OFF. Connecting the LINE-SENSE
pin to the SOURCE pin disables all four functions. The LINE-
SENSE pin is typically used for line sensing by connecting a
resistor from this pin to the rectified DC high voltage bus to
implement OV, UV and DCMAX reduction with line voltage. In
this mode, the value of the resistor determines the line OV/UV
thresholds, and the DCMAX is reduced linearly with rectified DC
high voltage starting from just above the UV threshold. The pin
can also be used as a remote on/off and a synchronization input.
Using Feature Pins
✔✔✔
✔✔✔
✔✔✔
✔✔ ✔✔ ✔✔
✔✔✔✔✔
16 17 18 19 20 21 22 23 24 25 26 27 28 29
Table 2. Typical LINE-SENSE and EXTERNAL CURRENT LIMIT Pin Configurations.
LINE-SENSE AND EXTERNAL CURRENT LIMIT PIN TABLE*
*This table is only a partial list of many LINE-SENSE and EXTERNAL CURRENT LIMIT pin configurations that are possible.
Figure Number
Three Terminal Operation
Under-Voltage
Over-Voltage
Line Feed Forward (DCMAX)
Overload Power Limiting
External Current Limit
Remote ON/OFF
TOP242-249
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11/00 August 8, 2000
✔✔
✔✔
✔✔
✔✔ ✔✔
✔✔✔✔
Table 3. Typical MULTI-FUNCTION Pin Configurations.
MULTI-FUNCTION PIN TABLE*
30 31 32 33 34 35 36 37 38 39 40
*This table is only a partial list of many MULTI-FUNCTION pin configurations that are possible.
Figure Number
Three Terminal Operation
Under-Voltage
Over-Voltage
Line Feed Forward (DCMAX)
Overload Power Limiting
External Current Limit
Remote ON/OFF
11 for a description of the functions where the horizontal axis
(left hand side) represents the EXTERNAL CURRENT LIMIT
pin current. The meaning of the vertical axes varies with
function. For those that control the on/off states of the output
such as remote ON/OFF, the vertical axis represents the enable/
disable states of the output. For external current limit, the
vertical axis represents the magnitude of the ILIMIT. Please see
graphs in the typical performance characteristics section for the
current limit programming range and the selection of appropriate
resistor value.
MULTI-FUNCTION (M) Pin Operation (P and G Packages)
The LINE-SENSE and EXTERNAL CURRENT LIMIT pin
functions are combined to a single MULTI-FUNCTION pin for
P and G packages. The comparator with a 1 V threshold at the
LINE-SENSE pin is removed in this case as shown in Figure 2b.
All of the other functions are kept intact. However, since some
of the functions require opposite polarity of input current
(MULTI-FUNCTION pin), they are mutually exclusive. For
example, line sensing features cannot be used simultaneously
with external current limit setting. When current is fed into the
MULTI-FUNCTION pin, it works as a voltage source of
approximately 2.6 V up to a maximum current of +400 µA
(typical). At +400 µA, this pin turns into a constant current sink.
When current is drawn out of the MULTI-FUNCTION pin, it
works as a voltage source of approximately 1.3 V up to a
maximum current of –240 µA (typical). At –240 µA, it turns
into a constant current source. Refer to Figure 12b.
There are a total of five functions available through the use of
the MULTI-FUNCTION pin: OV, UV, line feed forward with
DCMAX reduction, external current limit and remote ON/OFF. A
short circuit between the MULTI-FUNCTION pin and
SOURCE pin disables all five functions and forces
TOPSwitch-GX to operate in a simple three terminal mode like
TOPSwitch-II. The MULTI-FUNCTION pin is typically used
for line sensing by connecting a resistor from this pin to the
rectified DC high voltage bus to implement OV, UV and DCMAX
reduction with line voltage. In this mode, the value of the
resistor determines the line OV/UV thresholds, and the DCMAX
is reduced linearly with rectified DC high voltage starting from
just above the UV threshold. In high efficiency applications
this pin can be used in the external current limit mode instead,
to reduce the current limit externally to a value close to the
operating peak current, by connecting the pin to the SOURCE
pin through a resistor. The same pin can also be used as a remote
on/off and a synchronization input in both modes. Please refer
to Table 3 for possible combinations of the functions with
example circuits shown in Figure 30 through Figure 40. A
description of specific functions in terms of the MULTI-
FUNCTION pin I/V characteristic is shown in Figure 11. The
horizontal axis represents MULTI-FUNCTION pin current
with positive polarity indicating currents flowing into the pin.
The meaning of the vertical axes varies with functions. For
those that control the on/off states of the output such as UV, OV
and remote ON/OFF, the vertical axis represents the enable/
disable states of the output. UV triggers at IUV (+50 µA typical)
and OV triggers at IOV (+225 µA typical with 30µA hysteresis).
Between the UV and OV thresholds, the output is enabled. For
external current limit and line feed forward with DCMAX
reduction, the vertical axis represents the magnitude of the ILIMIT
and DCMAX. Line feed forward with DCMAX reduction lowers
maximum duty cycle from 78% at IM(DC) (+60 µA typical) to 38%
at IOV (+225 µA). External current limit is available only with
negative MULTI-FUNCTION pin current. Please see graphs in
the typical performance characteristics section for the current
limit programming range and the selection of appropriate resistor
value.
TOP242-249
13
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Figure 11. MULTI-FUNCTION (P or G package), LINE-SENSE, and EXTERNAL CURRENT LIMIT (Y package) Pin Characteristics.
-250 -200 -150 -100 -50 0 50 100 150 200 250 300 350 400
PI-2636-060600
Output
MOSFET
Switching
(Enabled)
(Disabled)
I
LIMIT
(Default)
DC
MAX
(78.5%)
Current
Limit
M Pin
L PinX Pin
Maximum
Duty Cycle
V
BG
-22µA
-27µAV
BG
+ V
TP
I
I
I
I
I
UV
I
REM(N)
I
OV
Pin Voltage
Note: This figure provides idealized functional characteristics with typical performance values. Please refer to the parametric
table and typical performance characteristics sections of the data sheet for measured data.
X and L Pins (Y Package) and M Pin (P or G Package) Current (µA)
Disabled when supply
output goes out of
regulation
TOP242-249
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11/00 August 8, 2000
Figure 12a. LINE-SENSE (L), and EXTERNAL CURRENT LIMIT (X) Pin Input Simplified Schematic.
Figure 12b. MULTI-FUNCTION (M) Pin Input Simplified Schematic.
V
BG
+ V
T
1 V
V
BG
240 µA
400 µA
CONTROL Pin Y Package
(Voltage Sense)
(Positive Current Sense - Under-Voltage,
Over-Voltage, ON/OFF Maximum Duty
Cycle Reduction)
(Negative Current Sense - ON/OFF,
Current Limit Adjustment)
PI-2634-060500
TOPSwitch-GX
LINE-SENSE (L)
EXTERNAL CURRENT LIMIT (X)
V
BG
+ V
T
V
BG
240 µA
400 µA
CONTROL Pin
MULTI-FUNCTION (M)
(Positive Current Sense - Under-Voltage,
Over-Voltage, Maximum Duty
Cycle Reduction)
(Negative Current Sense - ON/OFF,
Current Limit Adjustment)
PI-2548-092399
TOPSwitch-GX
P and G Package
TOP242-249
15
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August 8, 2000
Figure 15. Half Frequency Standby Mode (For High
Standby Efficiency).
Figure 13. Full Frequency Operation (132 kHz). Figure 14. Half Frequency Operation (66 kHz).
Typical Uses of FREQUENCY (F) Pin
PI-2654-071700
DC
Input
Voltage
+
-
D
S
C
CONTROL
F
PI-2655-071700
DC
Input
Voltage
+
-
D
S
C
CONTROL
F
PI-2656-071700
DC
Input
Voltage
+
-
D
S
C
STANDBY
QS can be an optocoupler output.
CONTROL
F
20K
RHF 1nF
QS47K
TOP242-249
16 D
11/00 August 8, 2000
Typical Uses of LINE-SENSE (L) and EXTERNAL CURRENT LIMIT (X) Pins
XF
PI-2617-050100
DC
Input
Voltage
+
-
DCS D
S
C
CONTROL
L
CLXSF D
PI-2618-050100
DC
Input
Voltage
+
-
D
S
C
CONTROL
L
2MR
LS
VUV = IUV x RLS
VOV = IOV x RLS
For RLS = 2M
VUV = 100 VDC
VOV = 450 VDC
DCMAX@100 VDC = 78%
DCMAX@375 VDC = 38%
PI-2510-103000
DC
Input
Voltage
+
-
DL
S
C
VUV = RLS x IUV
For Value Shown
VUV = 100 VDC
RLS
6.2 V
2M
22K
CONTROL
PI-2620-050100
DC
Input
Voltage
+
-
D
S
C
CONTROL
L
2M
30K
R
LS
1N4148
V
OV
= I
OV
x
R
LS
For Values Shown
V
OV
= 450 VDC
X
PI-2623-102700
DC
Input
Voltage
+
-
D
S
C
R
IL
For R
IL
= 12 K
I
LIMIT
= 69%
See fig. 54 for other
resistor values (R
IL
)
For R
IL
= 25 K
I
LIMIT
= 43%
CONTROL
X
PI-2624-102700
DC
Input
Voltage
+
-
D
S
C
2.5MR
LS
6K
R
IL
90% @ 100 VDC
55% @ 300 VDC
ILIMIT =
ILIMIT =
CONTROL
Figure 16. Three Terminal Operation (LINE-SENSE and
EXTERNAL CURRENT LIMIT Features Disabled.
FREQUENCY Pin can be tied to SOURCE or
CONTROL Pin).
Figure 17. Line-Sensing for Under-Voltage, Over-Voltage and
Line Feed Forward.
Figure 18. Line-Sensing for Under-Voltage Only (Over-
Voltage Disabled). Figure 19. Line-Sensing for Over-Voltage Only (Under-
Voltage Disabled). Maximum Duty Cycle will be
reduced at Low Line.
Figure 20. Externally Set Current Limit. Figure 21. Current Limit Reduction with Line Voltage.
TOP242-249
17
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August 8, 2000
Typical Uses of LINE-SENSE (L) and EXTERNAL CURRENT LIMIT (X) Pins (cont.)
Figure 22. Active-on (Fail Safe) Remote ON/OFF.
X
PI-2625-103000
DC
Input
Voltage
+
-
D
S
C
ON/OFF
47K
Q
R
can be an optocoupler
output or can be replaced by
a manual switch.
Q
R
CONTROL
X
ON/OFF
47K
PI-2626-050400
DC
Input
Voltage
+
-
D
S
C
R
IL
Q
R
12 K
For RIL =
ILIMIT = 69 %
25 K
For RIL =
ILIMIT = 43 %
QR can be an optocoupler
output or can be replaced
by a manual switch.
CONTROL
PI-2627-103000
DC
Input
Voltage
+
-
D
S
C
CONTROL
L
47K
Q
R
RMC
45K
QR can be an
optocoupler output
or can be replaced
by a manual switch.
ON/OFF
PI-2622-103000
DC
Input
Voltage
+
-
D
S
C
CONTROL
L
47K
2M
Q
R
R
LS
ON/OFF
For RLS = 2
M
VUV = 100 VDC
VOV = 450 VDC
QR can be an optocoupler
output or can be replaced
by a manual switch.
X
ON/OFF
47K
PI-2628-050400
DC
Input
Voltage
+
-
D
S
C
CONTROL
L
R
IL
R
LS
Q
R
2M
V
UV
= I
UV
x R
LS
V
OV
=
I
OV
x
R
LS
DC
MAX
@100 VDC = 78%
DC
MAX
@375 VDC = 38%
12 K
For R
IL
=
I
LIMIT
= 69 %
Q
R
can be an optocoupler
output or can be replaced
by a manual switch.
Figure 23. Active-off Remote ON/OFF. Maximum Duty Cycle will
be reduced.
Figure 24. Active-on Remote ON/OFF with Externally Set
Current Limit. Figure 25. Active-off Remote ON/OFF. Maximum Duty Cycle will
be reduced.
Figure 26. Active-off Remote ON/OFF with LINE-SENSE. Figure 27. Active-on Remote ON/OFF with LINE-SENSE and
EXTERNAL CURRENT LIMIT.
PI-2621-103000
DC
Input
Voltage
+
-
D
S
C
CONTROL
L
47K
Q
R
R
MC
45K
QR can be an
optocoupler output or
can be replaced
by a manual switch.
ON/OFF
TOP242-249
18 D
11/00 August 8, 2000
Typical Uses of LINE-SENSE (L) and EXTERNAL CURRENT LIMIT (X) Pins (cont.)
Figure 28. Line-Sensing and Externally Set Current Limit.
PI-2640-103000
DC
Input
Voltage
+
-
D
S
C
CONTROL
L
ON/OFF
47K
QR can be an optocoupler
output or can be replaced by
a manual switch.
300K
Q
R
Figure 29. Active-on Remote ON/OFF.
X
PI-2629-050400
DC
Input
Voltage
+
-
D
S
C
CONTROL
L
R
IL
R
LS
12K
2M
V
UV
= I
UV
x R
LS
V
OV
=
I
OV
x
R
LS
For R
LS
= 2 M
DC
MAX
@100 VDC = 78%
DC
MAX
@375 VDC = 38%
For R
IL
= 12 K
I
LIMIT
= 69%
See fig. 54 for other
resistor values (R
IL
)
to select different I
LIMIT
values
V
UV
= 100 VDC
V
OV
= 450 VDC
TOP242-249
19
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August 8, 2000
Figure 32. Line Sensing for Under-Voltage Only (Over-
Voltage Disabled).
PI-2510-081199
DC
Input
Voltage
+
-
DM
S
C
VUV = RLS x IUV
For Value Shown
VUV = 100 VDC
R
LS
6.2 V
2M
22K
CONTROL
Figure 33. Line Sensing for Over-Voltage Only (Under-
Voltage Disabled). Maximum Duty Cycle Will Be
Reduced at Low Line.
Figure 34. Externally Set Current Limit.
PI-2517-081199
DC
Input
Voltage
+
-
DM
S
C
For RIL = 12 K
ILIMIT = 69%
CONTROL
R
IL
See fig. 54 for other
resistor values (RIL)
For RIL = 25 K
ILIMIT = 43%
to select different
ILIMIT values
PI-2516-081199
DC
Input
Voltage
+
-
DM
S
C
VOV = IOV x RLS
For Values Shown
VOV = 450 VDC
CONTROL
RLS
1N4148
2M
30K
Figure 30. Three Terminal Operation (MULTI-FUNCTION
Features Disabled). Figure 31. Line Sensing for Under-Voltage, Over-Voltage
and Line Feed Forward.
PI-2508-081199
DC
Input
Voltage
+
-
D
S
C
CONTROL
M
C
DS
CD S
S
SS
M
PI-2509-081199
DC
Input
Voltage
+
-
DM
S
C
VUV = IUV x RLS
VOV = IOV x RLS
For RLS = 2M
VUV = 100 VDC
VOV = 450 VDC
DCMAX@100 VDC = 78%
DCMAX@375 VDC = 38%
CONTROL
R
LS
2M
Typical Uses of MULTI-FUNCTION (M) Pin
Figure 35. Current Limit Reduction with Line Voltage.
PI-2518-081199
DC
Input
Voltage
+
-
DM
S
C
CONTROL
RIL
RLS 2.5M
6K
90% @ 100 VDC
55% @ 300 VDC
ILIMIT =
ILIMIT =
TOP242-249
20 D
11/00 August 8, 2000
PI-2522-081199
DC
Input
Voltage
+
-
D
S
C
R
MC
45K
M
CONTROL
Q
R
QR can be an optocoupler
output or can be replaced
by a manual switch.
ON/OFF 47K
Figure 37. Active-off Remote ON/OFF. Maximum Duty Cycle will
be Reduced.
Figure 36. Active-on (Fail Safe) Remote ON/OFF.
PI-2519-081199
DC
Input
Voltage
+
-
D
S
C
Q
R
ON/OFF
M
CONTROL
QR can be an optocoupler
output or can be replaced by
a manual switch.
47K
PI-2523-081199
DC
Input
Voltage
+
-
D
S
C
R
LS
M For RLS = 2M
VUV = 100 VDC
VOV = 450 VDC
CONTROL
Q
R
2M
QR can be an optocoupler
output or can be replaced
by a manual switch.
ON/OFF 47K
Figure 40. Active-off Remote ON/OFF with LINE-SENSE.
Figure 39. Active-off Remote ON/OFF with Externally Set
Current Limit.
PI-2521-081199
DC
Input
Voltage
+
-
D
S
C
R
IL
R
MC
24K
12K
M
CONTROL
Q
R
2RIL
RMC =
QR can be an optocoupler
output or can be replaced
by a manual switch.
ON/OFF 47K
Figure 38. Active-on Remote ON/OFF with Externally Set
Current Limit.
PI-2520-081199
DC
Input
Voltage
+
-
D
S
C
Q
R
R
IL
M
CONTROL
12 K
For RIL =
ILIMIT = 69 %
QR can be an optocoupler
output or can be replaced
by a manual switch.
ON/OFF 47K
25 K
For RIL =
ILIMIT = 43 %
Typical Uses of MULTI-FUNCTION (M) Pin (cont.)
TOP242-249
21
D
11/00
August 8, 2000
Figure 41. 30 W Power Supply using External Current Limit Programming and Line Sensing for UV and OV.
Application Examples
A High Efficiency, 30 W, Universal Input Power Supply
The circuit shown in Figure 41 takes advantage of several of the
TOPSwitch-GX features to reduce system cost and power
supply size and to improve efficiency. This design delivers
30 W at 12 V, from an 85 to 265 VAC input, at an ambient of
50 ˚C, in an open frame configuration. A nominal efficiency of
80% at full load is achieved using TOP244Y.
The current limit is externally set by resistors R1 and R2 to a
value just above the low line operating peak DRAIN current of
approximately 70% of the default current limit. This allows use
of a smaller transformer core size and/or higher transformer
primary inductance for a given output power, reducing
TOPSwitch-GX power dissipation, while at the same time
avoiding transformer core saturation during startup and output
transient conditions. The resistors R1 & R2 provide a signal
that reduces the current limit with increasing line voltage,
which in turn limits the maximum overload power at high input
line voltage. This function in combination with the built-in
soft-start feature of TOPSwitch-GX, allows the use of a low cost
RCD clamp (R3, C3 and D1) with a higher reflected voltage, by
safely limiting the TOPSwitch-GX drain voltage, with adequate
margin under worst case conditions. Resistor R4 provides line
sensing, setting UV at 100 VDC and OV at 450 VDC. The
extended maximum duty cycle feature of TOPSwitch-GX
(guaranteed minimum value of 75% vs. 64% for TOPSwitch-II)
allows the use of a smaller input capacitor (C1). The extended
maximum duty cycle and the higher reflected voltage possible
with the RCD clamp also permit the use of a higher primary to
secondary turns ratio for T1 which reduces the peak reverse
voltage experienced by the secondary rectifier D8. As a result
a 60 V Schottky rectifier can be used for up to 15 V outputs,
which greatly improves power supply efficiency. The frequency
reduction feature of the TOPSwitch-GX eliminates the need for
any dummy loading for regulation at no load and reduces the no
load/standby consumption of the power supply. Frequency
jitter provides improved margin for conducted EMI meeting the
CISPR 22 (FCC B) specification.
Output regulation is achieved by using a simple Zener sense
circuit for low cost. The output voltage is determined by the
Zener diode (VR2) voltage and the voltage drops across the
optocoupler (U2) LED and resistor R6. Resistor R8 provides
bias current to Zener VR2 for typical regulation of ±5% at the
12 V output level, over line and load and component variations.
12 V
@ 2.5A
D2
1N4148
T1
C5
47 µF
10 V
U2
LTV817A
VR2
1N5240C
10 V, 2%
R6
150
R15
150
C14
1 nF
D1
UF4005
R3
68 K
2W
C3
4.7 nF
1KV
CY1
2.2 nF
U1
TOP244Y
DL
SXF
C
R8
150
C1
68 µF
400V
C6
0.1 µF
D8
MBR1060 C10
560 µF
35 V
C12
220 µF
35 V
C11
560 µF
35 V RTN
R5
6.8
R1
4.7 M
1/2 W
R4
2 M
1/2 W
R2
9.09 K
PI-2657-071900
L3
3.3 µH
BR1
600 V
2A
F1
3.15 A
J1
L1
20 mH
L
N
CX1
100 nF
250 VAC
CONTROL
CONTROL
TOPSwitch-GX
PERFORMANCE SUMMARY
Output Power: 30 W
Regulation: ± 4%
Efficiency: 79%
Ripple: 50 mV pk-pk
TOP242-249
22 D
11/00 August 8, 2000
A High Efficiency, Enclosed, 70 W, Universal Adapter Supply
The circuit shown in figure 42 takes advantage of several of the
TOPSwitch-GX features to reduce cost, power supply size and
increase efficiency. This design delivers 70 W at 19 V, from an
85 to 265 VAC input, at an ambient of 40 °C, in a small sealed
adapter case (4” x 2.15” x 1”). Full load efficiency is 85% at 85
VAC rising to 90% at 230 VAC input.
Due to the thermal environment of a sealed adapter a TOP249Y
is used to minimize device dissipation. Resistors R9 and R10
externally program the current limit level to just above the
operating peak DRAIN current at full load and low line. This
allows the use of a smaller transformer core size without saturation
during startup or output load transients. Resistors R9 and R10 also
reduce the current limit with increasing line voltage, limiting the
maximum overload power at high input line voltage, removing the
need for any protection circuitry on the secondary. Resistor R11
implements an under voltage and over voltage sense as well as
providing line feed forward for reduced output line frequency
ripple. With resistor R11 set at 2 M the power supply does not
start operating until the DC rail voltage reaches 100 VDC. On
removal of the AC input the UV sense prevents the output
glitching as C1 discharges, turning off the TOPSwitch-GX when
the output regulation is lost or when the input voltage falls to below
40 V, whichever occurs first. This same value of R11 sets the OV
threshold to 450 V. If exceeded, for example during a line surge,
TOPSwitch-GX stops switching for the duration of the surge
extending the high voltage withstand to 700 V without device
damage.
Capacitor C11 has been added in parallel with VR1 to reduce
zener clamp dissipation. With a switching frequency of
132 kHz a PQ26/20 core can be used to provide 70 W. To
maximize efficiency, by reducing winding losses, two output
windings are used each with there own dual 100 V Schottky
rectifier (D2 and D3). The frequency reduction feature of the
TOPSwitch-GX eliminates any dummy loading to maintain
regulation at no-load and reduces the no-load consumption of
the power supply to only 520 mW at 230 VAC input. Frequency
jittering provides conducted EMI meeting the CISPR 22 (FCC
B) / EN55022B specification, using simple filter components
(C7, L2, L3 and C6) even with the output earth grounded.
To regulate the output an opto coupler (U2) is used with a
secondary reference sensing the output voltage via a resistor
divider (U3, R4, R5, R6). Diode D4 and C15 filter and smooth
the output of the bias winding. Capacitor C15 (1uF) prevents
the bias voltage from falling during zero to full load transients.
Resistor R8 provides filtering of leakage inductance spikes
keeping the bias voltage constant even at high output loads.
Resistor R7, C9 and C10 together with C5 and R3 provide loop
compensation.
Due to the large primary currents, all the small signal control
components are connected to a separate source node that is
Kelvin connected to the source pin of the TOPSwitch-GX. For
improved common mode surge immunity the bias winding
common returns directly to the DC bulk capacitor (C1).
Figure 42. 70 W Power Supply using Current Limit Reduction with Line and Line Sensing for UV and OV.
19 V
@ 3.6A
TOP249Y
U1
U3
TL431
U2
PC817A
DL
SXF
C
RTN
L2
820 µH
2A
C6
0.1 µF
X2
F1
3.15 A
85-265 VAC
BR1
RS805
8A 600 V
L3
75 µH
2A
t°
T1
C13
0.33 µF
400 V
C12
0.022 µF
400 V
C11
0.01 µF
400 V
RT1
10
1.7 A
PI-2691-102500
All resistor 1/8 W 5% unless otherwise stated.
J1
L
N
CONTROL
CONTROL
TOPSwitch-GX
C1
150 µF
400 V
PERFORMANCE SUMMARY
Output Power: 70 W
Regulation: ± 4%
Efficiency: 84%
Ripple: 120 mV pk-pk
No Load Consumption: < 0.52 W @ 230 VAC
C5
47 µF
16 V
C3
820 µF
25 V L1
200 µH
C2
820 µF
25 V
C14
0.1 µF
50 V
C4
820 µF
25 V
C10
0.1 µF
50 V
C9
4.7 nF 50 V
C8
0.1 µF
50 V
VR1
P6KE-
200
D2
MBR20100
C7 2.2 nF
Y1 Safety
D3
MBR20100
D4
1N4148
R11
2 M
1/2 W
R9
13 M
R8
4.7
R1
270
R2
1 kR5
562
1%
R4
31.6 k
1%
R7
56 k
R10
20.5 k
R3
6.8
R6
4.75 k
1%
C15
1 µF
50 V
D1
UF4006
TOP242-249
23
D
11/00
August 8, 2000
A High Efficiency, 250 W, 250 380 VDC Input Power Supply
The circuit shown in figure 43 delivers 250 W (48 V @ 5.2 A)
at 84% efficiency using a TOP249 from a 250 to 380 VDC
input. DC input is shown as typically at this power level a p.f.c.
boost stage would preceed this supply, providing the DC input
(C1 is included to provide local decoupling). Flyback topology
is still useable at this power level due to the high output voltage,
in turn the secondary peak currents are low enough that the
output diode and capacitors are reasonably sized.
In this example the TOP249 at the upper limit of its power
capability and the current limit is set to the internal maximum
by connecting the X pin to SOURCE. However line sensing is
implemented by connecting a 2 M resistor from the L pin to
the DC rail. If the DC input rail rises above 450 VDC then
TOPSwitch-GX will stop switching, preventing device damage,
until the voltage returns to normal.
Due to high primary currents a low leakage inductance
transformer is essential. Therefore a sandwich winding with a
copper foil secondary was used. Even with this technique the
leakage inductance energy is beyond the power capability of a
simple zener clamp. Therefore R2, R3 and C6 are added in
parallel to VR1. These have been sized such that during normal
operation very little power is dissipated by VR1, the leakage
energy instead being dissipated by R2 and R3. However VR1
is essential to limit the peak drain voltage during start-up and/
or overload conditions to below the 700 V rating of the
TOPSwitch-GX MOSFET.
The secondary is rectifed and smoothed by D2 and C9, C10 and
C11. Three capacitors are used to meet the secondary ripple
current requirement. Inductor L2 and C12 provide switching
noise filtering.
A simple Zener sensing chain regulates the output voltage. The
sum of the voltage drop of VR2, VR3 and VR4 plus the LED
drop of U2 gives the desired output voltage. Resistor R6 limits
LED current and sets overall control loop DC gain. Diode D4,
C14 provide a secondary soft-finish, feeding current into the
CONTROL pin prior to output regulation and thus ensuring that
the output voltage reaches regulation at start-up under low line,
full load conditions. Resistor R9 provides a discharge path for
C14. Capacitor C13 and R8 provide control loop compensation
and are required due to the gain associated with such a high
output voltage.
Sufficient heatsinking is required to keep the TOPSwitch-GX
device below 110 °C when operating under full load, low line
and maximum ambient temperature. Airflow may also be
required if a large heatsink area is not acceptable.
Figure 43. 250 W, 48 V Power Supply using TOP249.
48 V @ 5.2 A
+250 - 380 VDC
0V
LD
SXF
C
RTN
PI-2692-102700
All resistor 1/8 W 5% unless otherwise stated.
CONTROL
TOPSwitch-GX
C1
22 µF
400 V
C3
0.1 µF
50 V
R4
6.8
R6
100
R8
56
R9
10 k
C3
47 µF
10 V
C6
4.7 nF
1 kV
C13
150 nF
63 V
C4
1 µF
50 V
C14
22 µF
63 V
C9
560 µF
63 V
C10
560 µF
63 V
C11
560 µF
63 V
C12
68 µF
63 V
C7
2.2 nF Y1
L2
3 µH 8A
D2
MUR1640CT
D2
1N4148 U2
LTV817A
D1
BYV26C
T1
R1
2 M
1/2 W
R3
68 k
2 W
R2
68 k
2 W
VR1
P6KE200
VR2 22 V
BZX79B22
VR3 12 V
BZX79B12
VR4 12 V
BZX79B12
CONTROL D4
1N4148
PERFORMANCE SUMMARY
Output Power: 250 W
Line Regulation: ± 1%
Load Regulation: ± 5%
Efficiency: 85%
Ripple: < 100 mV pk-pk
No Load Consumption: 1.4 W (300 VDC)
TOP249Y
U1
TOP242-249
24 D
11/00 August 8, 2000
Multiple Output, 60 W, 185-265 VAC Input Power Supply
Figure 44 shows a multiple output supply typical for high end
set-top boxes or cable decoders containing high capacity hard
disks for recording. The supply delivers an output power of
45 W cont./60 W peak (thermally limited) from an input voltage
of 185 to 265 VAC. Efficiency at 45 W, 185 VAC is 75%.
The 3.3 V and 5 V outputs are regulated to ±5% without the need
for secondary linear regulators. DC stacking (the secondary
winding reference for the other output voltages is connected to
the cathode of D10 rather than the anode) is used to minimize
the voltage error for the higher voltage outputs.
Due to the high ambient operating temperature requirement
typical of a set-top box (60 °C) the TOP246Y is used to reduce
conduction losses and minimize heatsink size. Resistor R2 sets
the device current limit to 80% of typical to limit overload
power. The line sense resistor (R1) protects the TOPSwitch-GX
from line surges and transients by sensing when the DC rail
voltage rises to above 450 V. In this condition the TOPSwitch-
GX stops switching, extending the input voltage withstand to
496 VAC ideal for countries with poor power quality. A
thermistor (RT1) is used to prevent premature failure of the fuse
by limiting the inrush current (due to the relatively large size of
C2). An optional MOV (RV1) extends the differential surge
protection to 6 kV from 4 kV.
Leakage inductance clamping is provided by VR1, R5 and C5,
keeping the DRAIN voltage below 700 V under all conditions.
Resistor R5 and capacitor C5 are selected such that VR1
dissipates very little power except during overload conditions.
The frequency jittering feature of TOPSwitch-GX allows the
circuit shown to meet CISPR22B with simple EMI filtering
(C1, L1 and C6) and the output grounded.
The secondaries are rectified and smoothed by D7 to D11, C7,
C9, C11, C13, C14, C16 and C17. Diode D11 for the 3.3 V
output is a Schottky diode to maximize efficiency. Diode D10
for the 5 V output is a PN type to center the 5 V output at 5 V.
The 3.3 V and 5 V output require two capacitors in parallel to
meet the ripple current requirement. Switching noise filtering
is provided by L2 to L5 and C8, C10, C12, C15 and C18.
Resistor R6 prevents peak charging of the lightly loaded 30 V
output. The outputs are regulated using a secondary reference
(U3). Both the 3.3 V and 5 V outputs are sensed via R11 and
R10. Resistor R8 provides bias for U3 and R7 sets the overall
DC gain. Resistor R9, C19, R3 and C4 provide Loop
compensation. A soft-finish capacitor (C20) ensures the output
rise montonically, without any output overshoot.
Figure 44. 60 W Multiple Output Power Supply using TOP246.
D6
1N4148
D7
UF4003
D8
UF5402
D9
UF5402
D11
MBR1045
D10
BYV32-200
T1 U2
LTV817
U3
TL431ACLP
C20
22 µF
10 V
R7
150
R12
10 k
C19
0.1 µF
R11
15 k
R10
9.53 k
R9
33 k
R8
330
C6
2.2 nF
Y1
C7
47 µF
50 V
C9
330 µF
25 V
C11
390 µF
35 V
C14
1000 µF
25 V
30 V @
0.03 A
18 V @
0.5 A
12 V @
0.6 A
5 V @
3.2 A
3.3 V @
3 A
RTN
D1-D4
1N4007 V
F1
3.15 A
RV1
275 V
14 mm
J1
L1
20 mH
0.8A
t°
L
N
R3
6.8
C5
47 µF
10 V
TOP246Y
U1
DL
S
C
TOPSwitch-GX
R1
2 M
1/2 W
R5
68 k
2 W
R6
10
RT1
10
1.7 A
C2
68 µF
400 V
C5
1 nF
400 V
C3
0.1 µF
50 V
C1
0.1 µF
X1
PI-2693-103000
CONTROL
CONTROL
C3
0.1 µF
50 V
XF
D6
UF4005
VR1
P6KE170
C16
1000 µF
25 V
C13
1000 µF
25 V
C17
1000 µF
25 V
C15
220 µF
165 V
C18
220 µF
16 V
C12
100 µF
25 V
C10
100 µF
25 V
C8
10 µF
50 V
L2
3.3 uH
3A
L3
3.3 uH
3A
L4
3.3 uH
5A
L5
3.3 uH
5A
PERFORMANCE SUMMARY
Output Power: 45 W Cont./60 W Peak
Regulation:
3.3 V: ± 5%
5 V: ± 5%
12 V: ± 7%
18 V: ± 7%
30 V: ± 8%
Efficiency: 75%
No Load Consumption: 0.6 W
185-265 VAC
R2
9 k
TOP242-249
25
D
11/00
August 8, 2000
Processor Controlled Supply Turn On/Off
A low cost momentary contact switch can be used to turn the
TOPSwitch-GX power on and off under microprocessor control
that may be required in some applications such as printers. The
low power remote off feature allows an elegant implementation
of this function with very few external components as shown in
Figure 45. Whenever the push button momentary contact
switch P1 is closed by the user, the optocoupler U3 is activated
to inform the microprocessor of this action. Initially, when the
power supply is off (M pin is floating), closing of P1 turns the
power supply on by shorting the M pin of the TOPSwitch-GX
to SOURCE through a diode (remote on). When the secondary
output voltage VCC is established, the microprocessor comes
alive and recognizes that the switch P1 is closed through the
switch status input that is driven by the optocoupler U3 output.
The microprocessor then sends a power supply control signal to
hold the power supply in the on-state through the optocoupler
U4. If the user presses the switch P1 again to command a turn
off, the microprocessor detects this through the optocoupler U3
and initiates a shutdown procedure that is product specific. For
example, in the case of the inkjet printer, the shutdown procedure
may include safely parking the print heads in the storage
position. In the case of products with a disk drive, the shutdown
procedure may include saving data or settings to the disk. After
the shutdown procedure is complete, when it is safe to turn off
the power supply, the microprocessor releases the M pin by
turning the optocoupler U4 off. If the manual switch and the
optocouplers U3 and U4 are not located close to the M pin, a
capacitor CM may be needed to prevent noise coupling to the pin
when it is open.
The power supply could also be turned on remotely through a
local area network or a parallel or serial port by driving the
optocoupler U4 input LED with a logic signal. Sometimes it is
easier to send a train of logic pulses through a cable (due to AC
coupling of cable, for example) instead of a DC logic level as
a wake up signal. In this case, a simple RC filter can be used to
generate a DC level to drive U4 (not shown in Figure 45). This
remote on feature can be used to wake up peripherals such as
printers, scanners, external modems, disk drives, etc., as needed
from a computer. Peripherals are usually designed to turn off
automatically if they are not being used for a period of time, to
save power.
U1
U2
U4
U3
C
M
P1
P1 Switch
Status
Power
Supply
ON/OFF
Control
External
Wake-up
Signal
PI-2561-101399
V
CC
(+5V)
RETURN
CONTROL
MICRO
PROCESSOR/
CONTROLLER
LOGIC
INPUT LOGIC
OUTPUT
High Voltage
DC Input
+
-
TOPSwitch-GX
DM
SF
C
1N4148
U4
LTV817A
6.8 K
1 nF
100 K
6.8 K
U3
LTV817A
27 K
1N4148
47 µF
Figure 45. Remote ON/OFF using Microcontroller.
TOP242-249
26 D
11/00 August 8, 2000
In addition to using a minimum number of components,
TOPSwitch-GX provides many technical advantages in this
type of application:
1. Extremely low power consumption in the off mode: 80 mW
typical at 110 VAC and 160 mW typical at 230 VAC. This
is because in the remote/off mode the TOPSwitch-GX
consumes very little power, and the external circuitry does
not consume any current (either M, L or X pin is open) from
the high voltage DC input.
2. A very low cost, low voltage/current, momentary contact
switch can be used.
3. No debouncing circuitry for the momentary switch is required.
During turn-on, the start-up time of the power supply
(typically 10 to 20 mS) plus the microprocessor initiation
time act as a debouncing filter, allowing a turn-on only if the
switch is depressed firmly for at least the above delay time.
During turn-off, the microprocessor initiates the shutdown
sequence when it detects the first closure of the switch, and
subsequent bouncing of the switch has no effect. If necessary,
the microprocessor could implement the switch debouncing
in software during turn-off, or a filter capacitor can be used
at the switch status input.
4. No external current limiting circuitry is needed for the
operation of the U4 optocoupler output due to internal
limiting of M pin current.
5. No high voltage resistors to the input DC voltage rail are
required to power the external circuitry in the primary. Even
the LED current for U3 can be derived from the CONTROL
pin. This not only saves components and simplifies layout,
but also eliminates the power loss associated with the high
voltage resistors in both on and off states.
6. Robust design: There is no on/off latch that can be accidentally
triggered by transients. Instead, the power supply is held in
the on-state through the secondary side microprocessor.
TOP242-249
27
D
11/00
August 8, 2000
Key Application Considerations
TOPSwitch-II
vs.
TOPSwitch-GX
Table 3 compares the features and performance differences
between TOPSwitch-GX and TOPSwitch-II. Many of the new
features eliminate the need for additional discrete components.
Other features increase the robustness of design allowing cost
savings in the transformer and other power components.
Function
TOPSwitch-II
TOPSwitch-GX
Figures TOPSwitch-GX Advantages
Soft-Start N/A* 10 mS Limits peak current and voltage
component stresses during start-up
Eliminates external components
used for soft-start in most
applications
Reduces or eliminates output
overshoot
External Current Limit N/A* Programmable 11,20,21, Smaller transformer
100% to 30% of 24,25,27, Higher efficiency
default current 28, 34,35, Allows power limiting (constant over-
limit 38,39 load power independent of line
voltage
Allows use of larger device for lower
losses, higher efficiency and smaller
heatsink
DCMAX 67% 78% 7 Smaller input cap (wider dynamic
range)
Higher power capability (when used
with RCD clamp for large VOR)
Allows use of Schottky secondary
rectifier diode for up to 15 V output
for high efficiency
Line Feed Forward with N/A* 78% to 38% 7,11,17, Rejects line ripple
DCMAX Reduction 26,27,28,
31,40
Line OV Shutdown N/A* Single resistor 11,17,19, Increases voltage withstand cap-
programmable 26,27,28, ability against line surge
31,33,40
Line UV Detection N/A* Single resistor 11,17,18, Prevents auto-restart glitches
programmable 26,27,28, during power down
31,32,40
Switching Frequency 100 kHz ±10% 132 kHz ±6% 13,15 Smaller transformer
Below start of conducted EMI limits
Switching Frequency N/A* 66 kHz ±7% 14,15 Lower losses when using RC and
Option (TO-220 only) RCD snubber for noise reduction in
video applications
Allows for higher efficiency in
standby mode
Lower EMI (second harmonic below
150 kHz)
Frequency Jitter N/A* ±4 kHz@132 kHz 9,46 Reduces conducted EMI
±2 kHz@66 kHz
Frequency Reduction N/A* At a Duty Cycle 7 Zero load regulation without dummy
below 10% load
Low power consumption at no load
Table 3. Comparison Between TOPSwitch-II and TOPSwitch-GX. (continued on next page) *Not available
TOP242-249
28 D
11/00 August 8, 2000
Table 3 (cont). Comparison Between TOPSwitch-II and TOPSwitch-GX. *Not available
Function
TOPSwitch-FX
TOPSwitch-GX
TOPSwitch-GX Advantages
Light Load Operation Cycle skipping Frequency and Duty Cycle Improves light load efficiency
reduction Reduces no-load consumption
Line Sensing/Externally Line sensing and Line sensing an externally Additional design flexibility allows all
Set Current Limit externally set set current limit possible features to be used simultaneously
(Y Package only) current limit simultaneously
mutually (functions split onto
exclusive (M pin) L and X pins)
Current Limit 100-40% 100-30% Minimizes transformer core size
Programming in highly continuous designs
Range
TOPSwitch-FX
vs.
TOPSwitch-GX
Table 4 compares the features and performance differences
between TOPSwitch-GX and TOPSwitch-FX. Many of the new
features eliminate the need for additional discrete components.
Other features increase the robustness of design allowing cost
savings in the transformer and other power components.
Function
TOPSwitch-II TOPSwitch-GX
Figures TOPSwitch-GX Advantages
Remote ON/OFF N/A* Single transistor 11,22, Fast on/off (cycle by cycle)
or optocoupler 23,24, Active-on or active-off control
interface or manual 25,26, Low consumption in remote off state
switch 27,29, Active-on control for fail-safe
36,37, Eliminates expensive in-line on/off
38,39, switch
40 Allows processor controlled turn
on/off
Permits shutdown/wake-up of
peripherals via LAN or parallel port
Synchronization N/A* Single transistor Synchronization to external lower
or optocoupler frequency signal
interface Starts new switching cycle on
demand
Thermal Shutdown 125 °C min. Hysteretic 130 °C Automatic recovery from thermal
Latched min. Shutdown (with fault
75 °C hysteresis) Large hysteresis prevents circuit
board overheating
Current Limit Tolerance ±10% (@25 °C) ±7% (@25 °C) 10% higher power capability due to
-8% (0 °C to100 °C) -4% (0° C to 100 °C) tighter tolerance
Drain Creepage DIP 0.037" / 0.94 mm 0.137" / 3.48 mm Greater immunity to arcing as a
at Package SMD 0.037" / 0.94 mm 0.137" / 3.48 mm result of build-up of dust, debris and
TO-220 0.046" / 1.17 mm 0.068" / 1.73 mm other contaminants
Drain Creepage at PCB 0.045" / 1.14 mm 0.113" / 2.87 mm Preformed leads accommodate
for TO-220 (preformed leads) large creepage for PCB layout
Easier to meet Safety (UL/VDE)
TOP242-249
29
D
11/00
August 8, 2000
Table 4 (cont). Comparison Between TOPSwitch-FX and TOPSwitch-GX. *Not available
TOPSwitch-GX
Design Considerations
Power Table
Datasheet power table represents the maximum practical
continuous output power based on the following conditions:
TOP242 to TOP246: 12 V output, Schottky output diode,
150 V reflected voltage (VOR) and efficiency estimates from
curves contained in application note AN-29. TOP247 to TOP249:
Higher output voltages used with a maximum output current of
6 A.
For all devices a 100 VDC minimum for 85-265 VAC and 250
VDC minimum for 230 VDC are assumed and sufficient
heatsinking to keep device temperature 100 °C. Flyback
topology used for all power levels.
TOPSwitch-GX Selection
Selecting the optimum TOPSwitch-GX depends upon required
maximum output power, efficiency, heatsinking constraints
and cost goals. With the option to externally reduce current
limit, a larger TOPSwitch-GX may be used for lower power
applications where higher efficiency is needed or minimal
heatsinking is available.
Input Capacitor
The input capacitor must be chosen to provide the minimum
DC voltage required for the TOPSwitch-GX converter to maintain
regulation at the lowest specified input voltage and maximum
output power. Since TOPSwitch-GX has a higher DCMAX than
TOPSwitch-II, it is possible to use a smaller input capacitor.
For TOPSwitch-GX, a capacitance of 2 µF per watt is possible
for universal input with an appropriately designed transformer.
Primary Clamp and Output Reflected Voltage VOR
A primary clamp is necessary to limit the peak TOPSwitch-GX
drain to source voltage. A Zener clamp requires few parts and
takes up little board space. For good efficiency, the clamp
Zener should be selected to be at least 1.5 times the output
reflected voltage VOR as this keeps the leakage spike conduction
time short. When using a Zener clamp in a universal input
application, a VOR of less than 135 V is recommended to allow
for the absolute tolerances and temperature variations of the
Zener. This will ensure efficient operation of the clamp circuit
and will also keep the maximum drain voltage below the rated
breakdown voltage of the TOPSwitch-GX MOSFET.
A high VOR is required to take full advantage of the wider DCMAX
of TOPSwitch-GX. An RCD clamp provides tighter clamp
Function
TOPSwitch-FX
TOPSwitch-GX
TOPSwitch-GX Advantages
P Package Current Identical to Y TOP243P and TOP244P Matches device current limit to
Limits packages internal current limits package dissipation capability
reduced Allows more continuous design to
lower device dissipation (lower RMS
currents)
Y Package Current 100% 90% (for equivalent RDS (ON)) Minimizes transformer core size
Limits Optimizes efficiency for most
applications
Thermal Shutdown 125 °C min. 130 °C min. 75 °C Allows higher output powers in
70 °C hysteresis hysteresis high ambient temperature
applications
Maximum Duty Cycle 90 µA 60 µA Reduces output line frequency
Reduction Threshold ripple at low line
•D
MAX reduction optimized for
forward design
Line Undervoltage N/A* 40% of positive (turn-on) Provides a well defined turn-off
Negative (turn-off) threshold threshold as the line voltage falls
Threshold
Soft-Start 10 ms (duty cycle) 10 ms (duty cycle + current Gradually increasing current limit
limit) in addition to duty cycle during soft-
start further reduces peak current
and voltage
Further reduces component
stresses during start up
TOP242-249
30 D
11/00 August 8, 2000
Figure 46a. TOPSwitch-II Full Range EMI Scan
(100 kHz, no jitter)
Figure 46b. TOPSwitch-GX Full Range EMI Scan
(132 kHz, With Jitter) With Identical
Circuitry and Conditions.
voltage tolerance than a Zener clamp and allows a VOR as high
as 150 V. RCD clamp dissipation can be minimized by
reducing the external current limit as a function of input line
voltage (see Figure 21 and 35). The RCD clamp is more cost
effective than the Zener clamp but requires more careful design
(see quick design checklist).
Output Diode
The output diode is selected for peak inverse voltage, output
current, and thermal conditions in the application (including
heatsinking, air circulation, etc.). The higher DCMAX of
TOPSwitch-GX along with an appropriate transformer turns
ratio can allow the use of a 60 V Schoktty diode for higher
efficiency on output voltages as high as 15 V (see Figure 41. A
12 V, 30 W design using a 60 V Schottky for the output diode).
Bias Winding Capacitor
Due to the low frequency operation at no-load a 1µF bias
winding capacitor is recommended.
Soft-Start
Generally a power supply experiences maximum stress at start-
up before the feedback loop achieves regulation. For a period
of 10 ms the on-chip soft-start linearly increases the duty cycle
from zero to the default DCMAX at turn on. In addition, the
primary current limit increases from 85% to 100% over the
same period. This causes the output voltage to rise in an orderly
manner allowing time for the feedback loop to take control of
the duty cycle. This reduces the stress on the TOPSwitch-GX
MOSFET, clamp circuit and output diode(s), and helps prevent
transformer saturation during start-up. Also soft-start limits the
amount of output voltage overshoot, and in many applications
eliminates the need for a soft-finish capacitor.
EMI
The frequency jitter feature modulates the switching frequency
over a narrow band as a means to reduce conducted EMI peaks
associated with the harmonics of the fundamental switching
frequency. This is particularly beneficial for average detection
mode. As can be seen in Figure 46, the benefits of jitter increase
with the order of the switching harmonic due to an increase in
frequency deviation.
The FREQUENCY pin of TOPSwitch-GX offers a switching
frequency option of 132 kHz or 66 kHz. In applications that
require heavy snubbers on the drain node for reducing high
frequency radiated noise (for example, video noise sensitive
applications such as VCR, DVD, monitor, TV, etc.), operating
at 66 kHz will reduce snubber loss resulting in better efficiency.
Also, in applications where transformer size is not a concern,
use of the 66 kHz option will provide lower EMI and higher
efficiency. Note that the second harmonic of 66 kHz is still
below 150 kHz, above which the conducted EMI specifications
get much tighter.
For 10 W or below, it is possible to use a simple inductor in
place of a more costly AC input common mode choke to meet
worldwide conducted EMI limits.
Transformer Design
It is recommended that the transformer be designed for maximum
operating flux density of 3000 Gauss and a peak flux density of
4200 Gauss at maximum current limit. The turns ratio should be
chosen for a reflected voltage (VOR) no greater than 135 V when
using a Zener clamp, 150 V (max) when using RCD clamp with
current limit reduction with line voltage (overload protection).
For designs where operating current is significantly lower than
the default current limit, it is recommended to use an externally
set current limit close to the operating peak current to reduce
peak flux density and peak power (see Figure 20 and 34). In
most applications, the tighter current limit tolerance, higher
-20
-10
0
-10
20
30
40
50
60
70
80
0.15 1 10 30
Frequency (MHz)
Amplitude (dBµV)
PI-2576-010600
EN55022B (QP)
EN55022B (AV)
TOPSwitch-II (no jitter)
EN55022B (QP)
EN55022B (AV)
-20
-10
0
-10
20
30
40
50
60
70
80
0.15 1 10 30
Frequency (MHz)
Amplitude (dBµV)
PI-2577-010600
TOPSwitch-GX (with jitter)
TOP242-249
31
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11/00
August 8, 2000
Figure 47. Layout Considerations for TOPSwitch-GX using DIP or SMD Packages.
Figure 48. Layout Considerations for TOPSwitch-GX using TO-220 Package.
+
-
Input Filter Capacitor
Heatsink
Safety Spacing
Opto-
coupler +- DC
Out
Output Filter Capacitor
T
r
a
n
s
f
o
r
m
e
r
SEC
D
L
C
Maximize hatched copper
areas ( ) for optimum
heat sinking
Y1-
Capacitor
PI-2669-091300
TOP VIEW
TOPSwitch-GX
HV
R1
X
TOP VIEW
PI-2670-091300
Y1-
Capacitor
Opto-
coupler
D
+
-
HV
R2 +- DC
Out
Input Filter Capacitor Output Filter Capacitor
Safety Spacing
T
r
a
n
s
f
o
r
m
e
r
Maximize hatched copper
areas ( ) for optimum
heat sinking
S
PRI
PRI
SEC
S
S
SC
BIAS
BIAS
M
R1
TOPSwitch-GX
TOP242-249
32 D
11/00 August 8, 2000
switching frequency and soft-start features of TOPSwitch-GX
contribute to a smaller transformer when compared to
TOPSwitch-II.
Standby Consumption
Frequency reduction can significantly reduce power loss at
light or no load, especially when a Zener clamp is used. For very
low secondary power consumption use a TL431 regulator for
feedback control. Alternately, switching losses can be
significantly reduced by changing from 132 kHz in normal
operation to 66 kHz under light load conditions.
TOPSwitch-GX
Layout Considerations
As TOPSwitch-GX has additional pins and operates at much
higher power levels compared to previous TOPSwitch
families, the following guidelines should be carefully
followed.
Primary Side Connections
Use a single point (Kelvin) connection at the negative terminal
of the input filter capacitor for TOPSwitch-GX source pin and
bias winding return. This improves surge capabilities by returning
surge currents from the bias winding directly to the input filter
capacitor.
The CONTROL pin bypass capacitor should be located as
close as possible to the SOURCE and CONTROL pins and its
SOURCE connection trace should not be shared by the main
MOSFET switching currents. All SOURCE pin referenced
components connected to the MULTI-FUNCTION, LINE-
SENSE or EXTERNAL CURRENT LIMIT pins should also be
located closely between their respective pin and SOURCE.
Once again the SOURCE connection trace of these components
should not be shared by the main MOSFET switching currents.
It is very critical that SOURCE pin switching currents are
returned to the input capacitor -ve terminal through a seperate
trace that is not shared by the components connected to
CONTROL, MULTI-FUNCTION, LINE-SENSE or
EXTERNAL CURRENT LIMIT pins. This is because the
SOURCE pin is also the controller ground reference pin.
Any traces to the M, L or X pins should be kept as short as
possible and away from the DRAIN trace to prevent noise
coupling. LINE-SENSE resistor (R1 in figures 47 and 48)
should be located close to the M or L pin to minimize the trace
length on the M or L pin side.
In addition to the 47 µF CONTROL pin capacitor, a high
frequency bypass capacitor in parallel may be used for better
noise immunity. The feedback optocoupler output should also
be located close to the CONTROL and SOURCE pins of
TOPSwitch-GX.
Y-Capacitor
The Y-capacitor should be connected close to the secondary
output return pin(s) and the positive primary DC input pin of the
transformer.
Heatsinking
The tab of the Y package (TO-220) is internally electrically
tied to the SOURCE pin. To avoid circulating currents, a
heatsink attached to the tab should not be electrically tied to any
primary ground/source nodes on the PC board.
When using a P (DIP-8) or G (SMD-8) package, a copper area
underneath the package connected to the SOURCE pins will act
as an effective heatsink.
In addition, sufficient copper area should be provided at the
anode and cathode leads of the output diode(s) for heatsinking.
Quick Design Checklist
As with any power supply design, all TOPSwitch-GX designs
should be verified on the bench to make sure that components
specifications are not exceeded under worst case conditions.
The following minimum set of tests is strongly recommended:
1. Maximum drain voltage Verify that peak VDS does not
exceed 675 V at highest input voltage and maximum overload
output power. Maximum overload output power occurs
when the output is overloaded to a level just before the
power supply goes into auto-restart (loss of regulation).
2. Maximum drain current At maximum ambient temperature,
maximum input voltage and maximum output load, verify
drain current waveforms at start-up for any signs of
transformer saturation and excessive leading edge current
spikes. TOPSwitch-GX has a leading edge blanking time of
220 ns to prevent premature termination of the on-cycle.
Verify that the leading edge current spike is below the
allowed current limit envelope (see Figure 51) for the drain
current waveform at the end of the 220 ns blanking period.
3. Thermal check At maximum output power, minimum
input voltage and maximum ambient temperature, verify
that temperature specifications are not exceeded for
TOPSwitch-GX, transformer, output diodes and output
capacitors. Enough thermal margin should be allowed for
the part-to-part variation of the RDS(ON) of TOPSwitch-GX as
specified in the data sheet. The margin required can either
be calculated from the tolerances or it can be accounted for
by connecting an external resistance in series with the
DRAIN pin and attached to the same heatsink, having a
resistance value that is equal to the difference between the
measured RDS(ON) of the device under test and the worst case
maximum specification.
Design Tools
Up to date information on design tools can be found at the
Power Integrations website: www.powerint.com
TOP242-249
33
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11/00
August 8, 2000
ABSOLUTE MAXIMUM RATINGS1
DRAIN Voltage ............................................ -0.3 to 700 V
DRAIN Peak Current: TOP242 ...............................0.72 A
TOP243 ...............................1.44 A
TOP244 ...............................2.16 A
TOP245 ...............................2.88 A
TOP246 ...............................4.32 A
TOP247 ...............................5.76 A
TOP248 ...............................7.20 A
TOP249 ...............................8.64 A
CONTROL Voltage .......................................... -0.3 to 9 V
CONTROL Current ...............................................100 mA
IC = 3 mA;
TJ = 25 °C
IC = ICD1
fOSC
DC(ONSET)
fOSC (DMIN)
f
fM
DCMAX
tSOFT
CONTROL FUNCTIONS
Conditions
(Unless Otherwise Specified)
See Figure 52
SOURCE = 0 V; TJ = -40 to 125 °C
Min Typ Max
Parameter Symbol Units
THERMAL IMPEDANCE
kHz
%
kHz
kHz
Hz
%
mS
Thermal Impedance: Y Package (θJA) 1 ................ 70 °C/W
(θJC) 2 .................. 2 °C/W
P or G Package:
(θJA) ...........45 °C/W3; 35 °C/W4
(θJC) 5 ........................... 11 °C/W
Notes:
1. Free standing with no heatsink.
2. Measured at the back surface of tab.
3. Soldered to 0.36 sq. inch (232 mm2), 2oz. (610 gm/m2) copper clad.
4. Soldered to 1 sq. inch (645 mm2), 2oz. (610 gm/m2) copper clad.
5. Measured on the SOURCE pin close to plastic interface.
124 132 140
61.5 66 70.5
10
30
15
± 4
± 2
250
75 78 83
28 38 50
10 15
FREQUENCY Pin
Connected to SOURCE
FREQUENCY Pin
Connected to CONTROL
132 kHz Operation
66 kHz Operation
IL IL (DC) or IM IM(DC)
IL or IM = 190 µA
TJ = 25 °C; DCMIN to DCMAX
Switching
Frequency
(average)
Duty Cycle at
ONSET of Fre-
quency Reduction
Switching
Frequency near
0% Duty Cycle
Frequency Jitter
Deviation
Frequency Jitter
Modulation Rate
Maximum Duty
Cycle
Soft Start Time
132 kHz Operation
66 kHz Operation
LINE SENSE Pin Voltage ................................ -0.3 to 9 V
CURRENT LIMIT Pin Voltage..................... -0.3 to 4.5 V
MULTI-FUNCTION Pin Voltage .................... -0.3 to 9 V
FREQUENCY Pin Voltage............................... -0.3 to 9 V
Storage Temperature .....................................-65 to 150 °C
Operating Junction Temperature2.................-40 to 150 °C
Lead Temperature3.................................................. 260 °C
Notes:
1. All voltages referenced to SOURCE, TA = 25 °C.
2. Normally limited by internal circuitry.
3. 1/16" from case for 5 seconds.
TOP242-249
34 D
11/00 August 8, 2000
CONTROL FUNCTIONS (cont.)
Conditions
(Unless Otherwise Specified)
See Figure 52
SOURCE = 0 V; TJ = -40 to 125 °C
Min Typ Max
Parameter Symbol Units
See Note A
See Figure 7
TJ = 25 °C
IC = 4 mA; TJ = 25 °C
See Figure 50
DCreg
lB
lC(OFF)
ZC
PWM Gain
Temperature Drift
External Bias
Current
CONTROL
Current at 0%
Duty Cycle
Dynamic
Impedance
Dynamic
Impedance
Temperature Drift
Control Pin
Internal Filter Pole
%/mA/°C
mA
mA
%/°C
kHz
SHUTDOWN/AUTO-RESTART
VC = 0 V
VC = 5 V
lC (CH)
vC(AR)U
VC(AR)L
VC(AR)hyst
DC(AR)
f(AR)
Control Pin
Charging Current
Charging Current
Temperature Drift
Auto-restart Upper
Threshold Voltage
Auto-restart Lower
Threshold Voltage
Auto-restart
Hysteresis Voltage
Auto-restart Duty
Cycle
Auto-restart
Frequency
mA
%/°C
V
V
V
%
Hz
-5.0 -3.5 -2.0
-3.0 -1.8 -0.6
0.5
5.8
4.5 4.8 5.1
0.8 1.0
48
1.0
TJ = 25 °C
See Note A
PWM Gain IC = 4 mA; TJ = 25°C -28 -23 -18 %/mA
TOP242-245
TOP246-249
TOP242-245
TOP246-249
-0.01
1.2 2.0 3.0
1.6 2.6 4.0
6.0 7.0
6.6 8.0
10 15 22
0.18
7
TOP242-249
35
D
11/00
August 8, 2000
Conditions
(Unless Otherwise Specified)
See Figure 52
SOURCE = 0 V; TJ = -40 to 125 °C
Min Typ Max
Parameter Symbol Units
µA
µA
µA
µA
V
µA
µA
µA
µA
V
V
V
µA
%/µA
mA
44 50 54
30
210 225 240
8
0.5 1.0 1.6
-35 -27 -20
5
300 400 520
-300 -240 -180
-110 -90 -70
1.90 2.50 3.00
2.30 2.90 3.30
1.26 1.33 1.40
1.18 1.24 1.30
1.24 1.31 1.39
1.13 1.19 1.25
40 60 75
0.25
0.6 1.0
1.0 1.6
TJ = 25 °C
TJ = 25 °C
Threshold
Hysteresis
TJ = 25 °C
Threshold
Hysteresis
Line Under-Voltage
Threshold Current
and Hysteresis
(M or L Pin)
Line Over-Voltage
or Remote ON/
OFF Threshold
Current and Hys-
teresis (M or L Pin)
L Pin Voltage
Threshold
Remote ON/OFF
Negative Threshold
Current and Hyster-
esis (M or X Pin)
L or M Pin Short
Circuit Current
X or M Pin Short
Circuit Current
L or M Pin Voltage
(Positive Current)
X Pin Voltage
(Negative Current)
M Pin Voltage
(Negative Current)
Maximum Duty
Cycle Reduction
Onset Threshold
Current
Maximum Duty
Cycle Reduction
Slope
Remote OFF
DRAIN Supply
Current
Threshold
Hysteresis
MULTI-FUNCTION (M), LINE-SENSE (L) AND EXTERNAL CURRENT LIMIT (X) INPUTS
L or M Pin Shorted
to CONTROL
VL, VM = VC
Normal Mode
Auto-restart Mode
lL or lM = 50 µA
lL or lM = 225 µA
lX = -50 µA
lX = -150 µA
lM = -50 µA
lM = -150 µA
lUV
IOV
VL(TH)
IREM (N)
IL (SC) or
IM (SC)
IX (SC) or
IM (SC)
VL, VM
VX
VM
IL (DC) or
IM (DC)
ID(RMT)
VX, VM = 0 V
X, L or M Pin
Floating
TJ = 25 °C
IL > IL(DC) or IM > IM (DC)
See Figure 69
VDRAIN = 150 V
TJ = 25 °C
TOP242-249
36 D
11/00 August 8, 2000
ILIMIT
IINIT
tLEB
A
A
nS
Conditions
(Unless Otherwise Specified)
See Figure 52
SOURCE = 0 V; TJ = -40 to 125 °C
Min Typ Max
Parameter Symbol Units
CIRCUIT PROTECTION
FREQUENCY INPUT
FREQUENCY Pin
Threshold Voltage
FREQUENCY Pin
Input Current VF = VC
VF
IF
Self Protection
Current Limit
Initial Current Limit
Leading Edge
Blanking Time
See Note B 2.9 V
10 40 100 µA
MULTI-FUNCTION (M), LINE-SENSE (L) AND CURRENT LIMIT (I) INPUTS (cont)
Remote ON Delay
Remote OFF
Setup Time
tR(ON)
tR(OFF)
From Remote On to Drain Turn-On
See Note B
Minimum Time Before Drain Turn-On
to Disable Cycle
See Note B
2.5 µS
2.5 µS
TOP242 P/G
TOP242 Y
TJ= 25°C
TOP243 P/G
TJ= 25°C
TOP243 Y
TJ= 25°C
TOP244 P/G
TJ= 25°C
TOP244 Y
TJ= 25°C
TOP245 Y
TJ= 25°C
TOP246 Y
TJ= 25°C
TOP247 Y
TJ= 25°C
TOP248 Y
TJ= 25°C
TOP249 Y
TJ= 25°C
See Fig. 51
TJ = 25 °C
85 VAC
(Rectified Line Input)
265 VAC
(Rectified Line Input)
IC = 4 mA
Internal;di/dt=90mA/µS
See Note C
Internal;di/dt=150mA/µS
See Note C
Internal;di/dt=180mA/µS
See Note C
Internal;di/dt=200mA/µS
See Note C
Internal;di/dt=270mA/µS
See Note C
Internal;di/dt=360mA/µS
See Note C
Internal;di/dt=540mA/µS
See Note C
Internal;di/dt=720mA/µS
See Note C
Internal;di/dt=900mA/µS
See Note C
Internal;di/dt=1080mA/µS
See Note C
0.418 0.45 0.481
0.697 0.75 0.802
0.837 0.90 0.963
0.930 1.00 1.070
1.256 1.35 1.445
1.674 1.80 1.926
2.511 2.70 2.889
3.348 3.60 3.852
4.185 4.50 4.815
5.022 5.40 5.778
0.75 x
ILIMIT(MIN)
0.6 x
ILIMIT(MIN)
220
See
Note B
TOP242-249
37
D
11/00
August 8, 2000
Conditions
(Unless Otherwise Specified)
See Figure 52
SOURCE = 0 V; TJ = -40 to 125 °C
Min Typ Max
Parameter Symbol Units
OUTPUT
CIRCUIT PROTECTION (cont)
tIL(D)
VC(RESET)
100
130 140 150
75
1.75 3.0 4.25
nS
°C
°C
V
Current Limit Delay
Thermal Shutdown
Temperature
Thermal Shutdown
Hysteresis
Power-up Reset
Threshold Voltage
IC = 4 mA
Figure 52, S1 Open
RDS(ON)
ON-State
Resistance
TJ = 25 °C
TJ = 100 °C
TJ = 25 °C
TJ = 100 °C
TJ = 25 °C
TJ = 100 °C
TJ = 25 °C
TJ = 100 °C
TJ = 25 °C
TJ = 100 °C
TJ = 25 °C
TJ = 100 °C
TJ = 25 °C
TJ = 100 °C
TJ = 25 °C
TJ = 100 °C
TOP242
ID = 50 mA
TOP243
ID = 100 mA
TOP244
ID = 150 mA
TOP245
ID = 200 mA
TOP246
ID = 300 mA
TOP247
ID = 400 mA
TOP248
ID = 500 mA
TOP249
ID = 600 mA
15.6 18.0
25.7 30.0
7.80 9.00
12.9 15.0
5.20 6.00
8.60 10.0
3.90 4.50
6.45 7.50
2.60 3.00
4.30 5.00
1.95 2.25
3.22 3.75
1.56 1.80
2.58 3.00
1.30 1.50
2.15 2.50
Measured in a Typical
Flyback Converter Application
Off-State
Current
Breakdown
Voltage
Rise
Time
Fall
Time
IDSS
BVDSS
tR
tF
400 µA
700 V
100 nS
50 nS
VL, VM = Floating; IC = 4mA
VDS = 560 V; TJ = 125 °C
VL, VM = Floating; IC = 4mA
ID = 100 µA; TJ = 125 °C
TOP242-249
38 D
11/00 August 8, 2000
Conditions
(Unless Otherwise Specified)
See Figure 52
SOURCE = 0 V; TJ = -40 to 125 °C
Min Typ Max
Parameter Symbol Units
SUPPLY VOLTAGE CHARACTERISTICS
36
5.60 5.85 6.10
±50
1.0 1.6 2.5
1.2 2.2 3.2
0.3 0.6 1.3
V
V
ppm/°C
mA
VC(SHUNT)
lCD1
lCD2
See Note D
IC = 4 mA
Output
MOSFET Disabled
VL, VM = 0 V
NOTES:
A. For specifications with negative values, a negative temperature coefficient corresponds to an increase in
magnitude with increasing temperature, and a positive temperature coefficient corresponds to a decrease in
magnitude with increasing temperature.
B. Guaranteed by characterization. Not tested in production.
C.For externally adjusted current limit values, please refer to Figure 54 (Current Limit vs. External Current Limit
Resistance) in the Typical Performance Characteristics section.
D.It is possible to start up and operate TOPSwitch-GX at DRAIN voltages well below 36 V. However, the
CONTROL pin charging current is reduced, which affects start-up time, auto-restart frequency, and auto-restart
duty cycle. Refer to Figure 66, the characteristic graph on CONTROL pin charge current (IC) vs. DRAIN voltage
for low voltage operation characteristics.
DRAIN Supply
Voltage
Shunt Regulator
Voltage
Shunt Regulator
Temperature Drift
Control Supply/
Discharge Current
Output
MOSFET Enabled
VL, VM = 0 V
TOP 242-245
TOP 246-249
TOP242-249
39
D
11/00
August 8, 2000
Figure 50. CONTROL Pin I-V Characteristic.
PI-2039-043097
DRAIN
VOLTAGE
HV
0 V
90%
10%
90%
t2
t1
D = t1
t2
Figure 49. Duty Cycle Measurement.
120
100
80
40
20
60
00246810
CONTROL Pin Voltage (V)
CONTROL Pin Current (mA)
PI-1939-091996
1
Slope
Dynamic
Impedance =
Figure 51. Drain Current Operating Envelope.
Figure 52. TOPSwitch-GX General Test Circuit.
PI-2631-042800
5-50 V 5-50 V
S4
40 V
0-15 V 0.1 µF47 µF
470
5 W
Y Package (X and L Pin) P or G Package (M Pin)
470
0-100K
0-60K
0-60K
0-100K
NOTES: 1. This test circuit is not applicable for current limit or output characteristic measurements.
2. For P and G packages, short all SOURCE pins together.
D
SFX
C
L
M
C
CONTROL
TOPSwitch-GX
S2
S1
S5
S3
0.8
1.3
1.2
1.1
0.9
0.8
1.0
0012 6 83
Time (µs)
DRAIN Current (normalized)
PI-2022-040397
45 7
0.7
0.6
0.5
0.4
0.3
0.2
0.1
ILIMIT(MAX) @ 25 ˚C
ILIMIT(MIN) @ 25 ˚C
IINIT(MIN) @ 85VAC
IINIT(MIN) @ 265VAC
tLEB (Blanking Time)
TOP242-249
40 D
11/00 August 8, 2000
The following precautions should be followed when testing
TOPSwitch-GX by itself outside of a power supply. The
schematic shown in Figure 52 is suggested for laboratory
testing of TOPSwitch-GX.
When the DRAIN pin supply is turned on, the part will be in the
auto-restart mode. The CONTROL pin voltage will be oscillating
at a low frequency between 4.8 and 5.8 V and the drain is turned
on every eighth cycle of the CONTROL pin oscillation. If the
CONTROL pin power supply is turned on while in this auto-
BENCH TEST PRECAUTIONS FOR EVALUATION OF ELECTRICAL CHARACTERISTICS
Typical Performance Characteristics
restart mode, there is only a 12.5% chance that the CONTROL
pin oscillation will be in the correct state (drain active state) so
that the continuous drain voltage waveform may be observed.
It is recommended that the VC power supply be turned on first
and the DRAIN pin power supply second if continuous drain
voltage waveforms are to be observed. The 12.5% chance of
being in the correct state is due to the divide-by-8 counter.
Temporarily shorting the CONTROL pin to the SOURCE pin
will reset TOPSwitch-GX, which then will come up in the
correct state.
0.2
0.3
0.4
0.5
0.6
0.7
0.8
0.9
1.0
1.1
60
40
80
100
120
140
160
180
200
-250 -200 -150 -100 -50
I
M
(µA)
Current Limit (A)
di/dt (mA/µs)
PI-2653-103000
0
Scaling Factors:
TOP242 P/G/Y: .45
TOP243 P/G: .75
TOP243 Y: .90
TOP244 P/G: 1
TOP244 Y: 1.35
TOP245 Y: 1.80
TOP246 Y: 2.70
TOP247 Y: 3.60
TOP248 Y: 4.50
TOP249 Y: 5.40
Figure 53. Current Limit vs. Multi-Function Pin Current.
Figure 54. Current Limit vs. External Current Limit Resistance.
0.2
0.3
0.4
0.5
0.6
0.7
0.8
0.9
1.0
1.1
60
40
80
100
120
140
160
180
200
0 5K 10K 15K 20K 25K 30K 35K 40K
External Current Limit Resistor R
IL
()
Current Limit (A)
di/dt (mA/µs)
PI-2652-103000
45K
Scaling Factors:
TOP242 P/G/Y: .45
TOP243 P/G: .75
TOP243 Y: .90
TOP244 P/G: 1
TOP244 Y: 1.35
TOP245 Y: 1.80
TOP246 Y: 2.70
TOP247 Y: 3.60
TOP248 Y: 4.50
TOP249 Y: 5.40
Maximum and minimum levels
are based on characterization.
Minimum
Typical
Maximum
TOP242-249
41
D
11/00
August 8, 2000
Typical Performance Characteristics (cont.)
1.1
1.0
0.9 -50 -25 0 25 50 75 100 125 150
Junction Temperature (°C)
Breakdown Voltage
(Normalized to 25°C)
PI-176B-0101599
1.2
1.0
0.8
0.6
0.4
0.2
0
-50 -25 0 25 50 75 100 125 150
Junction Temperature (°C)
PI-1123A-060794
Output Frequency
(Normalized to 25°C)
1.2
1.0
0.8
0.6
0.4
0.2
0-50 -25 0 25 50 75 100 125 150
Junction Temperature (°C)
PI-2555-092999
Current Limit
(Normalized to 25°C)
1.2
1.0
0.8
0.6
0.4
0.2
0-50 -25 0 25 50 75 100 125 150
Junction Temperature (°C)
PI-2553-092899
Over-Voltage Threshold
(Normalized to 25°C)
1.2
1.0
0.8
0.6
0.4
0.2
0-50 -25 0 25 50 75 100 125 150
Junction Temperature (°C)
PI-2552-092899
Under-Voltage Threshold
(Normalized to 25°C)
Figure 55. Breakdown vs. Temperature. Figure 56. Frequency vs. Temperature.
Figure 57. Internal Current Limit vs. Temperature. Figure 58. External Current Limit vs. Temperature
with RIL =12k
.
Figure 59. Over-Voltage Threshold vs. Temperature. Figure 60. Under-Voltage Threshold vs. Temperature.
1.2
1.0
0.8
0.6
0.4
0.2
0-50 -25 0 25 50 75 100 125 150
Junction Temperature (°C)
PI-2554-110100
Current Limit
(Normalized to 25 °C)
TOP242-249
42 D
11/00 August 8, 2000
Typical Performance Characteristics (cont.)
6
5
4
3
2
1
0-300 -200 -100 0 100 200 300 400 500
PI-2542-102700
MULTI-FUNCTION Pin Voltage (V)
MULTI-FUNCTION Pin Current (µA)
See
Expanded
Version
1.2
1.0
0.8
0.6
0.4
0.2
0-50 -25 0 25 50 75 100 125 150
Junction Temperature (°C)
PI-2562-101499
CONTROL Current
(Normalized to 25°C)
1.2
1.0
0.8
0.6
0.4
0.2
0-50 -25 0 25 50 75 100 125 150
Junction Temperature (°C)
PI-2563-101499
Onset Threshold Current
(Normalized to 25°C)
Figure 62a. Multi-Function Pin Voltage vs. Current. Figure 62b. Multi-Function Pin Voltage vs. Current
(Expanded).
Figure 63. Control Current Out at 0% Duty Cycle vs.
Temperature. Figure 64. Max. Duty Cycle Reduction Onset Threshold
Current vs. Temperature.
6.0
4.5
5.5
5.0
2.0 0100 200 300 400
LINE-SENSE Pin Current (µA)
LINE SENSE pin Voltage (V)
PI-2688-102700
3.0
2.5
3.5
4.0
1.6
1.0
1.4
1.2
0-240 -180 -60-120 0
EXTERNAL CURRENT LIMIT Pin Current (µA)
EXTERNAL CURRENT LIMIT
pin Voltage (V)
PI-2689-102300
0.4
0.2
0.6
0.8
V
X
= 1.33 - I
X
x 0.66 k
-200 µA I
X
-25 µA
Figure 61a. LINE-SENSE Pin Voltage vs. Current. Figure 61b. EXTERNAL CURRENT LIMIT Pin Voltage
vs. Current.
1.2
1.4
1.6
0.4
0.6
0.2
0.8
1.0
0-300 -200 -150 -50-250 -100 0
MULTI-FUNCTION Pin Voltage (V)
PI-2541-102700
MULTI-FUNCTION Pin Current (µA)
VM = 1.37 - IMx 1 k
-200 µA IM -25 µA
TOP242-249
43
D
11/00
August 8, 2000
Typical Performance Characteristics (cont.)
0 100 200 300 400 500 600
10
100
1000
10000
PI-2646-062000
Drain Voltage (V)
Drain Capacitance (pF)
Scaling Factors:
TOP249 1.00
TOP248 0.83
TOP247 0.67
TOP246 0.50
TOP245 0.33
TOP244 0.25
TOP243 0.17
TOP242 0.08
600
400
500
200
100
300
00 200100 400 500300 600
DRAIN Voltage (V)
Power (mW)
PI-2650-070700
Scaling Factors:
TOP249 1.00
TOP248 0.83
TOP247 0.67
TOP246 0.50
TOP245 0.33
TOP244 0.25
TOP243 0.17
TOP242 0.08
Figure 67. COSS vs. Drain Voltage. Figure 68. Drain Capacitance Power.
2
1.2
1.6
0020 40 60 80 100
DRAIN Voltage (V)
CONTROL Pin
Charging Current (mA)
PI-2564-101499
0.4
0.8
V
C
= 5 V
Figure 65. Output Characteristics. Figure 66. IC vs. Drain Voltage.
1.2
0.8
1.0
0
-50 0 50 100 150
Junction Temperature (°C)
Remote OFF DRAIN Supply Current
(Normalized to 25 °C)
PI-2690-102700
0.2
0.4
0.6
Figure 69. Remote OFF DRAIN Supply Current
vs. Temperature.
6
5
002 4 6 8 10 12 14 16 18 20
DRAIN Voltage (V)
DRAIN Current (A)
PI-2645-103000
2
1
T
CASE
= 25 °C
T
CASE
= 100 °C
4
3
Scaling Factors:
TOP249 1.00
TOP248 0.83
TOP247 0.67
TOP246 0.50
TOP245 0.33
TOP244 0.25
TOP243 0.17
TOP242 0.08
TOP242-249
44 D
11/00 August 8, 2000
PI-2644-061400
Notes:
1. Controlling dimensions are inches. Millimeter
dimensions are shown in parentheses.
2. Pin numbers start with Pin 1, and continue
from left to right when viewed from the front.
3. Dimensions do not include mold flash or
other protrusions. Mold flash or protrusions
shall not exceed .006 (.15mm) on any side.
5. Position of terminals to be measured at a
location .25 (6.35) below the package body.
Y07C
PIN 1 PIN 7
MOUNTING HOLE PATTERN
.050 (1.27)
.150 (3.81)
.050 (1.27)
.150 (3.81)
.050 (1.27)
.050 (1.27)
.100 (2.54)
.180 (4.58)
.200 (5.08)
PIN 1
+
.010 (.25) M
.467 (11.86)
.487 (12.37)
.400 (10.16)
.415 (10.54)
.146 (3.71)
.156 (3.96)
.860 (21.84)
.880 (22.35)
.026 (.66)
.032 (.81)
.050 (1.27) BSC
.150 (3.81) BSC
.108 (2.74) REF
PIN 1 & 7
7° TYP.
PIN 2 & 4
.040 (1.06)
.060 (1.52)
.190 (4.83)
.210 (5.33)
.015 (.38)
.020 (.51)
.095 (2.41)
.115 (2.92)
.236 (5.99)
.260 (6.60)
.165 (4.19)
.185 (4.70)
.040 (1.02)
.060 (1.52)
.045 (1.14)
.055 (1.40)
.670 (17.02)
REF.
.570 (14.48)
REF.
TO-220-7C
TOPSwitch Product Family
GX Series Number
Package Identifier
G Plastic Surface Mount DIP
P Plastic DIP
Y Plastic TO-220
Package/Lead Options
Blank Standard Configurations
TL Tape & Reel, 1 K pcs minimum, G Package only
PART ORDERING INFORMATION
TOP 242 G - TL
(242, 243 & 244 only)
TOP242-249
45
D
11/00
August 8, 2000
Notes:
1. Package dimensions conform to JEDEC specification
MS-001-AB (Issue B 7/85) for standard dual-in-line (DIP)
package with .300 inch row spacing.
2. Controlling dimensions are inches. Millimeter sizes are
shown in parentheses.
3. Dimensions shown do not include mold flash or other
protrusions. Mold flash or protrusions shall not exceed
.006 (.15) on any side.
4. Pin locations start with Pin 1, and continue counter-clock-
wise to Pin 8 when viewed from the top. The notch and/or
dimple are aids in locating Pin 1. Pin 6 is omitted.
5. Minimum metal to metal spacing at the package body for
the omitted lead location is .137 inch (3.48 mm).
6. Lead width measured at package body.
7. Lead spacing measured with the leads constrained to be
perpendicular to plane T.
.010 (.25)
.015 (.38)
.300 (7.62) BSC
(NOTE 7)
.300 (7.62)
.390 (9.91)
.375 (9.53)
.385 (9.78)
.245 (6.22)
.255 (6.48)
.128 (3.25)
.132 (3.35)
.057 (1.45)
.063 (1.60)
.125 (3.18)
.135 (3.43)
0.15 (.38)
MINIMUM
.048 (1.22)
.053 (1.35)
.100 (2.54) BSC
.014 (.36)
.022 (.56)
-E-
Pin 1
SEATING
PLANE
-D-
-T-
P08B
DIP-8B
PI-2551-101599
D S .004 (.10)
T E D S .010 (.25) M
(NOTE 6)
G08B
SMD-8B
PI-2546-101599
.004 (.10)
.012 (.30) .036 (0.91)
.044 (1.12)
.004 (.10) 0°
8°
.375 (9.53)
.385 (9.78)
.048 (1.22) .009 (.23)
.053 (1.35)
.032 (.81)
.037 (.94)
.128 (3.25)
.132 (3.35)
-D-
Notes:
1. Controlling dimensions are inches. Millimeter sizes are
shown in parentheses.
2. Dimensions shown do not include mold flash or other
protrusions. Mold flash or protrusions shall not exceed
.006 (.15) on any side.
3. Pin locations start with Pin 1, and continue counter-
clock wise to Pin 8 when viewed from the top. Pin 6
is omitted.
4. Minimum metal to metal spacing at the package body
for the omitted lead location is .137 inch (3.48 mm).
5. Lead width measured at package body.
6. D and E are referenced datums on the package body.
.057 (1.45)
.063 (1.60)
(NOTE 5)
E S
.100 (2.54) (BSC)
.372 (9.45)
.245 (6.22) .388 (9.86)
.255 (6.48) .010 (.25)
-E-
Pin 1
D S .004 (.10)
TOP242-249
46 D
11/00 August 8, 2000
Notes
TOP242-249
47
D
11/00
August 8, 2000
Notes
TOP242-249
48 D
11/00 August 8, 2000
KOREA
Power Integrations International
Holdings, Inc.
Rm# 402, Handuk Building,
649-4 Yeoksam-Dong, Kangnam-Gu,
Seoul, Korea
Phone: +82•2•568•7520
Fax: +82•2•568•7474
WORLD HEADQUARTERS
NORTH AMERICA - WEST
Power Integrations, Inc.
5245 Hellyer Ave.
San Jose, CA 95138 USA
Main: +1•408•414•9200
Customer Service:
Phone: +1•408•414•9665
Fax: +1•408•414•9765
For the latest updates, visit our website: www.powerint.com
Power Integrations reserves the right to make changes to its products at any time to improve reliability or manufacturability.
Power Integrations does not assume any liability arising from the use of any device or circuit described herein, nor does it
convey any license under its patent rights or the rights of others.
PI Logo,
TOPSwitch,
and
EcoSmart
are registered trademarks of Power Integrations, Inc.
©Copyright 2000, Power Integrations, Inc.
JAPAN
Power Integrations, K.K.
Keihin-Tatemono 1st Bldg.
12-20 Shin-Yokohama 2-Chome,
Kohoku-ku, Yokohama-shi,
Kanagawa 222, Japan
Phone: +81•45•471•1021
Fax: +81•45•471•3717
EUROPE & AFRICA
Power Integrations (Europe) Ltd.
Centennial Court
Easthampstead Road
Bracknell
Berkshire RG12 1YQ,
United Kingdom
Phone: +44•1344•462•300
Fax: +44•1344•311•732
NORTH AMERICA - EAST
& SOUTH AMERICA
Power Integrations, Inc.
Eastern Area Sales Office
1343 Canton Road, Suite C1
Marietta, GA 30066 USA
Phone: +1•770•424•5152
Fax: +1•770•424•6567
INDIA (Technical Support)
Innovatech
#1, 8th Main Road
Vasanthnagar
Bangalore 560052, India
Phone: +91•80•226•6023
Fax: +91•80•228•9727
APPLICATIONS HOTLINE APPLICATIONS FAX
World Wide +1•408•414•9660 World Wide +1•408•414•9760
CHINA
Power Integrations, China
Rm# 1705, Bao Hua Bldg.
1016 Hua Qiang Bei Lu
Shenzhen Guangdong, 518031
Phone: +86•755•3675•143
Fax: +86•755•3779•610
TAIWAN
Power Integrations International
Holdings, Inc.
2F, #508, Chung Hsiao E. Rd., Sec. 5,
Taipei 105, Taiwan
Phone: +886•2•2727•1221
Fax: +886•2•2727•1223