Semiconductor Components Industries, LLC, 2000
October, 2000 – Rev. 2 1Publication Order Number:
MBRS140LT3/D
MBRS140LT3
Surface Mount
Schottky Power Rectifier
SMB Power Surface Mount Package
. . . employing the Schottky Barrier principle in a metal–to–silicon
power rectifier. Features epitaxial construction with oxide passivation
and metal overlay contact. Ideally suited for low voltage, high
frequency switching power supplies; free wheeling diodes and
polarity protection diodes.
•Compact Package with J–Bend Leads Ideal for Automated Handling
•Highly Stable Oxide Passivated Junction
•Guardring for Over–Voltage Protection
•Low Forward Voltage Drop
Mechanical Characteristics:
•Case: Molded Epoxy
•Epoxy Meets UL94, VO at 1/8″
•Weight: 95 mg (approximately)
•Cathode Polarity Band
•Lead and Mounting Surface Temperature for Soldering Purposes:
260°C Max. for 10 Seconds
•Available in 12 mm Tape, 2500 Units per 13″ Reel, Add “T3” Suffix
to Part Number
•Finish: All External Surfaces Corrosion Resistant and Terminal
Leads are Readily Solderable
•Marking: B14L
MAXIMUM RATINGS
Rating Symbol Value Unit
Peak Repetitive Reverse Voltage
Working Peak Reverse Voltage
DC Blocking Voltage
VRRM
VRWM
VR
40 V
Average Rectified Forward Current
(At Rated VR, TC = 110°C) IO1.0 A
Peak Repetitive Forward Current
(At Rated VR, Square Wave,
100 kHz, TC = 110°C)
IFRM 2.0 A
Non–Repetitive Peak Surge Current
(Surge Applied at Rated Load
Conditions Halfwave, Single
Phase, 60 Hz)
IFSM 40 A
Storage/Operating Case
Temperature Tstg, TC–55 to +150 °C
Operating Junction Temperature TJ–55 to +125 °C
Voltage Rate of Change
(Rated VR, TJ = 25°C) dv/dt 10,000 V/s
Device Package Shipping
ORDERING INFORMATION
SMB
CASE 403A
PLASTIC
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MBRS140LT3 SMB 2500/Tape & Reel
SCHOTTKY BARRIER
RECTIFIER
1.0 AMPERE
40 VOLTS
MARKING DIAGRAM
B14L
B14L = Device Code
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THERMAL CHARACTERISTICS
Characteristic Symbol Max Unit
Thermal Resistance — Junction–to–Lead (Note 1.)
Thermal Resistance — Junction–to–Ambient (Note 2.) RθJL
RθJA 24
80 °C/W
ELECTRICAL CHARACTERISTICS
Maximum Instantaneous Forward Voltage (Note 3 )
vFTJ = 25°C TJ = 125°CVolts
M
ax
i
mum
I
ns
t
an
t
aneous
F
orwar
d
V
o
lt
age
(N
o
t
e
3
.
)
(iF = 1.0 A)
see Figure 2 (iF = 2.0 A) 0.5
0.6 0.425
0.58
Maximum Instantaneous Reverse Current (Note 3 )
IRTJ = 25°C TJ = 100°CmA
M
ax
i
mum
I
ns
t
an
t
aneous
R
everse
C
urren
t
(N
o
t
e
3
.
)
(VR = 40 V)
see Figure 4 (VR = 20 V) 0.4
0.02 10
5.0
1. Mounted with minimum recommended pad size, PC Board FR4.
2. 1 inch square pad size (1 x 0.5 inch for each lead) on FR4 board.
3. Pulse Test: Pulse Width ≤ 250 µs, Duty Cycle ≤2.0%.
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Figure 1. Typical Forward Voltage Figure 2. Maximum Forward Voltage
Figure 3. Typical Reverse Current Figure 4. Maximum Reverse Current
Figure 5. Current Derating Figure 6. Forward Power Dissipation
0.70.1
vF, INSTANTANEOUS FORWARD VOLTAGE (VOLTS)
10
1.0
400
VR, REVERSE VOLTAGE (VOLTS)
100E-3
10E-3
1.0E-3
100E-6
10E-6
1.0E-6
45 8525
TL, LEAD TEMPERATURE (°C)
1.6
0.8
0.4
0
IO, AVERAGE FORWARD CURRENT (AMPS)
0.2 0.80
0.9
0.8
0.6
0.5
0.2
0
65
iF, INSTANTANEOUS FORWARD CURRENT (AMPS)I
0.1
0.3 0.5 0.9
10 20 30
, AVERAGE FORWARD CURRENT (AMPS)IO
125105 0.4 1.60.6
0.3
PFO, AVERAGE POWER DISSIPATION (WATTS)
100
TJ = 125°C
100°C
25°C
-40°C
0.70.1
VF, MAXIMUM INSTANTANEOUS FORWARD VOLTAGE (VOLTS)
10
1.0
IF, INSTANTANEOUS FORWARD CURRENT (AMPS)
0.1
0.3 0.5 0.9
100
TJ = 125°C
100°C
25°C
, REVERSE CURRENT (AMPS)
R
400
VR, REVERSE VOLTAGE (VOLTS)
100E-3
10E-3
1.0E-3
100E-6
10E-6
1.0E-6
I
10 20 30
, MAXIMUM REVERSE CURRENT (AMPS)
R
1.2
FREQ = 20 kHz
TJ = 125°C
100°C
25°C
TJ = 125°C
100°C
25°C
dc
SQUARE WAVE
Ipk/Io =
Ipk/Io = 5.0
Ipk/Io = 10
Ipk/Io = 20
dc
SQUARE WAVE
Ipk/Io =
Ipk/Io = 5.0
Ipk/Io = 10
Ipk/Io = 20
1.4
0.6
0.2
1.0
1.41.0 1.2
0.1
0.4
0.7
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Figure 7. Capacitance Figure 8. Typical Operating Temperature Derating*
Figure 9. Thermal Response — Junction to Lead
Fi
g
ure 10. Thermal Res
p
onse — Junction to Ambient
300
VR, REVERSE VOLTAGE (VOLTS)
1000
100
10
VR, DC REVERSE VOLTAGE (VOLTS)
25 400
105
85
75
65
C, CAPACITANCE (pF)
T
155.0 10 20 25 35 40 30 355.0 10 2015
95
115
125
, DERATED OPERATING TEMPERATURE ( C)
J°
* Reverse power dissipation and the possibility of thermal runaway must be considered when operating this device under any re-
verse voltage conditions. Calculations of TJ therefore must include forward and reverse power effects. The allowable operating
TJ may be calculated from the equation: TJ = TJmax – r(t)(Pf + Pr) where
r(t) = thermal impedance under given conditions,
Pf = forward power dissipation, and
Pr = reverse power dissipation
This graph displays the derated allowable TJ due to reverse bias under DC conditions only and is calculated as T J = TJmax – r(t)Pr,
where r(t) = Rthja. For other power applications further calculations must be performed.
Rtja = 94°C/W
44°C/W 63°C/W
80°C/W
24°C/W
TJ = 25°C
0.10.00001
t, TIME (s)
1.0E+00
1.0E-01
1.0E-02
1.0E-03
1.0E-04
R
0.0001 0.001 0.01
, TRANSIENT THERMAL RESISTANCE (NORMALIZED)
T
1.0 10 100 1000
50%
20%
10%
5.0%
2.0%
1.0%
Rtjl(t) = Rtjl*r(t)
0.10.00001
t, TIME (s)
1.0E+00
1.0E-01
1.0E-02
1.0E-03
1.0E-04
0.0001 0.001 0.01 1.0 10 100 1000
50%
20%
10%
5.0%
2.0%
1.0%
Rtjl(t) = Rtjl*r(t)
R , TRANSIENT THERMAL RESISTANCE (NORMALIZED)
T
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MINIMUM SOLDER PAD SIZES
mm
inches
0.085
2.159
0.108
2.743
0.089
2.261
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PACKAGE DIMENSIONS
SMB
PLASTIC PACKAGE
CASE 403A–03
ISSUE D
A
S
DB
J
P
K
C
H
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. D DIMENSION SHALL BE MEASURED WITHIN
DIMENSION P.
DIM MIN MAX MIN MAX
MILLIMETERSINCHES
A0.160 0.180 4.06 4.57
B0.130 0.150 3.30 3.81
C0.075 0.095 1.90 2.41
D0.077 0.083 1.96 2.11
H0.0020 0.0060 0.051 0.152
J0.006 0.012 0.15 0.30
K0.030 0.050 0.76 1.27
P0.020 REF 0.51 REF
S0.205 0.220 5.21 5.59
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Notes
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MBRS140LT3/D
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