MTCH810-I/MF - Microchip Technology

 2012 Microchip Technology Inc. DS41672A-page 1

MTCH810

Description:

The MTCH810 provides an easy way to add Haptic

feedback to any button/sliders capacitive touch inter-

face. The device integrates a single-channel Haptic

driver output with an industry standard I2C™ slave

interface to create a simple Haptic feedback peripheral.

Features:

• Internal Library of Effects:

- 14 Haptic effect commands

- Firmware revision query command

- Abort Playback command

•I

2C Control Interface:

- 7-bit Addressing mode (address = 0x10)

- Supports 100 kHz and 400 kHz transfer rate

• Wide Operating Voltage: 2.3V-5.5V

• Minimal Number of External Components

• Low-Power Consumption when Idle

• Operating Temperature: -40˚C to +85˚C

Package Type:

The device is only offered in an 8-pin 3x3 DFN package

(see Figure 1).

FIGURE 1: 8-PIN DFN DIAGRAM

FOR MTCH810

Pin Description:

DR1

This is the non-inverting PWM Haptics drive output. It

should be connected to the non-inverting input of a

Haptic driver circuit designed for Eccentric Rotating

Mass Actuators (ERMs).

DR2

It should be connected to the inverting input of a Haptic

driver circuit designed for ERM Actuators.

SDA

This pin is the serial data connection of the I2C

interface. It should be connected to the I2C master SDA

signal with a pull-up resistor to VDD.

SCL

This pin is the serial clock connection of the I2C

interface. It should be connected to the I2C master SCL

signal with a pull-up resistor to VDD.

DR1

VDD

DR2 NC

SDA

SCL

4 5

3x3 DFN

MTCH810

VSS

TABLE 1: 8-PIN DFN PINOUT

DESCRIPTION

Name 8-Pin DFN Description

VDD 1 Power supply input

DR2 2 Drive output 2

DR1 3 Drive output 1

NC 4 No connection

SDA 5 I2C™ Data

SCL 6 I2C™ Clock

NC 7 No connection

VSS 8 Ground

Haptics Controller

MTCH810

DS41672A-page 2  2012 Microchip Technology Inc.

Table of Contents

1.0 Device Overview ........................................................................................................................................................................ 3

2.0 I2C™ Serial Interface................................................................................................................................................................. 7

3.0 Electrical Characteristics.......................................................................................................................................................... 13

4.0 Packaging Information ............................................................................................................................................................. 20

Index ............................................................................................................ ........................................................................................25

The Microchip Web Site ....................................................................................................................................................................... 26

Customer Change Notification Service ................................................................................................................................................ 26

Customer Support ................................................................................................................................................................................ 26

Reader Response ................................................................................................................................................................................ 27

Product Identification System .............................................................................................................................................................. 28

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Customer Notification System

 2012 Microchip Technology Inc. DS41672A-page 3

MTCH810

1.0 DEVICE OVERVIEW

The Microchip mTouch™ MTCH810 Haptics feedback

controller provides an easy way to add tactile feedback

to any application. The device implements all the digital

functions for a Haptics feedback system. The Haptic

effects are designed to provide feedback for a “Button

and Slider” type capacitive touch interface. When

combined with an analog power driver and an Eccentric

Rotating Mass (ERM) style actuator, the resulting

circuit comprises a complete tactile feedback Haptic

system.

The device is controlled through an I2C slave interface.

In response to a two-byte command, the MTCH810 (in

combination with the driver and ERM) generates one of

13 different Haptic vibration effects. The effects are

180-220 Hz vibrations with different amplitude

envelopes and durations. The effects create a variety

of different ‘feels’ to provide feedback for different

capacitive touch commands, status and error

conditions. Several effects are similar with different

power levels in order to allow the users to compensate

for the variations in the coupling of the vibrations to the

user’s finger tip.

Two additional commands allow the termination of an

effect early and the ability to read the effects table

revision.

1.1 Communications

•I

2C, Slave mode

1.2 Drive Outputs

• DR1 is a dedicated PWM output

• DR2 is a dedicated inverted PWM output

1.3 PWM Resolution

• 10 bits

1.4 Pin Description

1.4.1 DR1

This is the enable/non-inverting digital PWM Haptics

drive output. It should be connected to the

non-inverting input of a Haptic power driver circuit

design for ERM actuators. The PWM output should

only be active when an effect is in progress.

1.4.2 DR2

This is the inverting digital PWM Haptics driver output.

It should be connected to the inverting input of a Haptic

power driver circuit designed for ERM actuators. The

PWM output should only be active when an effect is in

progress.

1.4.3 I2C – SERIAL DATA PIN (SDA)

The SDA pin is the serial data pin of the I2C interface.

The SDA pin is used to write or read the registers and

Configuration bits. The SDA pin is an open-drain N-

channel driver. Therefore, it needs an external pull-up

resistor from the VDD line to the SDA pin. Except for the

Start and Stop conditions, the data on the SDA pin must

be stable during the high period of the clock. The high

or low state of the SDA pin can only change when the

clock signal on the SCL pin is low. Refer to

Section 2.1.2 “I2C Operation” for more details on the

I2C serial interface communication.

1.4.4 I2C – SERIAL CLOCK PIN (SCL)

The SCL pin is the serial clock pin of the I2C interface.

The I2C interface only acts as a slave and the SCL pin

accepts only external serial clocks. The input data from

the master device is shifted into the SDA pin on the

rising edges of the SCL clock, and the output from the

device occurs at the falling edges of the SCL clock. The

SCL pin is an open-drain N-channel driver. Therefore, it

needs an external pull-up resistor from the VDD line to

the SCL pin. Refer to Section Section 2.1.2 “I2C Oper-

ation” for more details on I2C serial interface communi-

cation. For more details, see Figure 1-1 and Table 1-1.

MTCH810

DS41672A-page 4  2012 Microchip Technology Inc.

1.4.4.1 Clock Stretching

A feature of the SCL pin is clock stretching. This allows

the I2C slave to hold communications at the end of

each byte from the master. Its purpose is to allow the

slave sufficient time to process the data before the next

byte is sent. It accomplishes the clock hold by turning

on the open-drain output, holding the clock line low.

This prevents the master from starting the transmission

of the next byte in the packet. For proper operation, the

I2C master must be capable of recognizing a clock

stretch condition, and suspending transmission until

the MTCH810 releases the SCL pin.

1.5 Haptic Commands

The commands are transmitted via the I2C serial

interface as a Start condition, address plus write bit,

two successive bytes and a Stop condition. For the

effect table revision number, the Write command is

followed by an I2C read of two bytes. Table 2 -2 and

Table 2-3 list all the commands supported by the

MTCH810.

1.6 Hardware

To build a complete Haptic system, the two digital PWM

outputs must be filtered to produce a DC drive signal,

and amplified to produce a minimum of 300 mA of drive

at 3V. This output is then used to drive an ERM actua-

tor. Figure 1-1 below shows a typical controller, driver

and actuator combination for a Haptic system.

The MTCH810 is the controller in the system,

accepting I2C commands and generating the

appropriate PWM signals to create the Haptic effect.

The outputs from the MTCH810 are then filtered and

amplified by the DRV8601. The amplifier stage is

essentially an audio frequency amplifier configured for

differential inputs and outputs. The output of the

amplifier then drives the ERM.

The RC network in the feedback path provides a pole

in the transfer function at 160 Hz to roll off the high

frequency gain and attenuate the ripple at the PWM

frequency. The connection between the DR1 output

and the enable of the amplifier allows the controller to

generate an output for the ERM with a drive/coast

format, rather than a drive/brake control. Using a

differential output eliminates the need for a large

capacitor on the output to AC couple the drive signal to

the ERM.

Table 1-1 lists the qualified ERM actuators and their

manufacturers.

Note: The MTCH810 includes a time-out

function on the clock stretching function

that will reset the I2C interface in the event

that the I2C interface hangs in a clock

stretch condition.

Note: Any audio frequency drive circuits will

work in the application, provided it can

supply 300 mA at 3V and turn on in less

than 1 mS. Amplifiers with built-in “click

and pop” elimination have soft-start

enables which have a turn on time of >10

mS and are not suitable for a Haptic driver.

TABLE 1-1: APPROVED ACTUATORS AND SPECIFICATIONS

Actuator Dimensions (mm) Rated Voltage Haptic Transient

Overdrive Voltage Impedance

Nidec NRS-3388i 4.6 ± 0.2D

15.6 ± 0.9L

1.3V ± 0.2V 3.3V 10.6 ± 20%

Johnson Electric

1999-1MB0037EP

6.0H x 8.0W

21.5L

4.5V 5.0V 10- typical

 2012 Microchip Technology Inc. DS41672A-page 5

MTCH810

FIGURE 1-1: TYPICAL SCHEMATIC

VDD

1.5K

SDA

SCL

VDD

SCL

SDA

.1 uF

VDD

VSS

DR1

DR2

VDD

.01 uF

100K

49.9K

100K

ERM1

MTCH810

DRV8601

EN REF

IN1

IN2

OUT+ OUT-

VDD

VSS C6

4.7 uF

.1 uF

MTCH810

DS41672A-page 6  2012 Microchip Technology Inc.

NOTES:

 2012 Microchip Technology Inc. DS41672A-page 7

MTCH810

2.0 I2C™ SERIAL INTERFACE

This device supports the I2C serial protocol. The I2C

module operates in Slave mode, so it does not

generate the serial clock.

2.1 Overview

This I2C interface is a two-wire interface. Figure 2-1

shows a typical I2C Interface connection.

The I2C interface specifies different communication bit

rates. These are referred to as Standard, Fast or High

Speed modes. The MTCH810 device supports these

three modes. The bit rates of these modes are:

• Standard mode: Bit Rates up to 100 kbit/s

• Fast mode: Bit Rates up to 400 kbit/s

A device that sends data onto the bus is defined as a

transmitter, and a device receiving data is defined as a

receiver. The bus has to be controlled by a master

device which generates the serial clock (SCL), controls

the bus access and generates the Start and Stop

conditions. The MTCH810 device works as slave. Both

master and slave can operate as transmitter or

receiver, but the master device determines which mode

is activated. Communication is initiated by the master

(microcontroller) which sends the Start bit, followed by

the slave address byte. The first byte transmitted is

always the slave address byte, which contains the

device code, the address bits and the R/W bit.

FIGURE 2-1: TYPICAL I2C™

INTERFACE

The I2C serial protocol only defines the field types, field

lengths, timings, etc. of a frame. The frame content

defines the behavior of the device. For details on the

frame content (commands/data) refer to Section 2.3

“I2C Commands”.

Refer to the NXP User Manual (UM10204_3) for more

details on the I2C specifications.

2.1.1 SIGNAL DESCRIPTIONS

The I2C interface uses up to two pins (signals). These

are:

• SDA (Serial Data) (see Section 1.4.3 “I2C –

Serial Data Pin (SDA)”)

• SCL (Serial Clock) (see Section 1.4.4 “I2C –

Serial Clock Pin (SCL)”)

2.1.2 I2C OPERATION

The MTCH810 device I2C module is compatible with

the NXP I2C specification. The following lists some of

the module’s features:

• 7-bit Slave Addressing

• Supports Three Clock Rate modes:

- Standard mode, clock rates up to 100 kHz

- Fast mode, clock rates up to 400 kHz

• Support Multi-Master Applications

The I2C 10-bit addressing mode is not supported.

The NXP I2C specification only defines the field types,

field lengths, timings, etc. of a frame. The frame

content defines the behavior of the device. The frame

content for this device is defined in Section 2.3 “I2C

Commands”.

2.1.3 I2C BIT STATES AND SEQUENCE

Figure 2-8 shows an I2C 8-bit transfer sequence, while

Figure 2-7 shows the bit definitions. The serial clock is

generated by the master. The following definitions are

used for the bit states:

• Start bit (S)

• Data bit

• Acknowledge (A) bit (driven low)/

No Acknowledge (A) bit (not driven low)

• Repeated Start bit (Sr)

• Stop bit (P)

2.1.4 START BIT

The Start bit (see Figure 2-2) indicates the beginning of

a data transfer sequence. The Start bit is defined as the

SDA signal falling when the SCL signal is high.

FIGURE 2-2: START BIT

SCL

MTCH810

SDA

Host

Controller

Typical I2C™ Interface Connections

SDA

SCL

1st Bit 2nd Bit

MTCH810

DS41672A-page 8  2012 Microchip Technology Inc.

2.1.5 DATA BIT

The SDA signal may change state while the SCL signal

is low. While the SCL signal is high, the SDA signal

MUST be stable (see Figure 2-3).

FIGURE 2-3: DATA BIT

2.1.6 ACKNOWLEDGE (A) BIT

The A bit (see Figure 2-4) is typically a response from

the receiving device to the transmitting device.

Depending on the context of the transfer sequence, the

A bit may indicate different things. Typically, the slave

device will supply an A response after the Start bit and

eight data bits have been received. An A bit has the

SDA signal low.

FIGURE 2-4: ACKNOWLEDGE

WAVEFORM

2.1.7 NOT A (A) RESPONSE

The A bit has the SDA signal high. Tab le 2- 1 shows the

conditions where the slave device will issue a Not A

(A).

SDA

SCL

Data Bit

1st Bit 2nd Bit

SDA

SCL

TABLE 2-1: MTCH810 A / A RESPONSES

Event

Acknowledge

Bit

Response

Comment

General Call A

Slave Address valid A

Slave Address not valid A

Bus Collision N/A Treated as “Don’t Care” if the collision occurs on the Start

bit. Otherwise, I2C™ resets.

 2012 Microchip Technology Inc. DS41672A-page 9

MTCH810

2.1.8 REPEATED START BIT

The Repeated Start bit (see Figure 2-5) indicates that

the current master device wishes to continue

communicating with the current slave device without

releasing the I2C bus. The Repeated Start condition is

the same as the Start condition, except that the

Repeated Start bit follows a Start bit (with the Data bits

+ A bit) and not a Stop bit.

The Start bit is the beginning of a data transfer

sequence and is defined as the SDA signal falling when

the SCL signal is high.

FIGURE 2-5: REPEAT START

CONDITION WAVEFORM

2.1.9 STOP BIT

The Stop bit (see Figure 2-6) indicates the end of the

I2C data transfer sequence. The Stop bit is defined as

the SDA signal rising when the SCL signal is high.

A Stop bit resets the I2C interface of the MTCH810

device.

FIGURE 2-6: STOP CONDITION

RECEIVE OR TRANSMIT

MODE

2.1.9.1 Aborting a Transmission

If any part of the I2C transmission does not meet the

command format, it is aborted. This can be intentionally

accomplished with a Start or Stop condition. This is

done so that noisy transmissions (usually an extra Start

or Stop condition) are aborted before they corrupt the

device.

FIGURE 2-7: TYPICAL 8-BIT I2C™ WAVEFORM FORMAT

FIGURE 2-8: I2C™ DATA STATES AND BIT SEQUENCE

Note 1: A bus collision during the Repeated Start

condition occurs if:

• SDA is sampled low when SCL goes

from low-to-high.

• SCL goes low before SDA is

asserted low. This may indicate that

another master is attempting to

transmit a data ‘1’.

SDA

SCL

Sr = Repeated Start

1st Bit

SCL

SDA A / A

1st Bit

SDA

SCL

S2nd Bit 3rd Bit 4th Bit 5th Bit 6th Bit 7th Bit 8th Bit PA / A

SCL

SDA

Start

Condition Stop

Condition

Data allowed

to change

Data or

A valid

MTCH810

DS41672A-page 10  2012 Microchip Technology Inc.

2.1.9.2 Device Addressing

The address byte is the first byte received following the

Start condition from the master device. The full seven

bits of the I2C slave address is “0010000”.

Figure 2-9 shows the I2C slave address byte format,

which contains the seven address bits and a Read/

Write (R/W) bit.

FIGURE 2-9: SLAVE ADDRESS BITS IN

THE I2C™ CONTROL

BYTE

2.2 Device Commands

This section documents the commands that the device

supports.

The commands can be grouped into the following

categories:

• Effect Commands

• Revision and Control Commands

Start bit Read/Write bit

Address Byte

R/W ACK

Acknowledge bit

Slave Address

A6 A5 A4 A3

Slave Address (7 bits)

A2 A1 A0

Note 1: Address Bits (A6:A0) can be reprogrammed

by the customer.

0010000A0 Address

Note 1

TABLE 2-2: EFFECT COMMANDS

Index I2C™ Message Haptic Effect

Description

0 0x00 0x00 Strong click

1 0x01 0xFF Med. strong click 60%

2 0x02 0xFE Low strong click 30%

3 0x03 0xFD Sharp click

4 0x04 0xFC Sharp click 60%

5 0x05 0xFB Sharp click 30%

6 0x06 0xFA Soft bump

7 0x07 0xF9 Med. soft bump 60%

8 0x08 0xF8 Soft bump 30%

9 0x09 0xF7 Double click

10 0x0A 0xF6 Double click 60%

11 0x0B 0xF5 Triple click

12 0x0C 0xF4 Soft buzz

13 0x0D 0xF3 Strong buzz

TABLE 2-3: REVISION AND CONTROL

COMMANDS

Index I2C™ Message Haptic Effect

Description

14 0x0E 0xF2 Read effect library version

number

15 0x0F 0xF1 Abort effect playback

 2012 Microchip Technology Inc. DS41672A-page 11

MTCH810

2.3 I2C COMMANDS

The I2C protocol does not specify how commands are

formatted, so this section specifies the MTCH810

device I2C command formats and operation.

The commands can be grouped into the following

categories:

• Effect Commands

• Revision and Control Commands

The supported commands are shown in Ta b l e 2 - 2 and

Table 2-3.

2.3.1 EFFECT COMMANDS

Effect commands are used to initiate a specific Haptic

effect. The command consists of two bytes which are

the XOR of one another. The effect begins with the

completion of the I2C Stop condition.

2.3.2 REVISION AND CONTROL

COMMANDS

Revision and Control commands are used to either

retrieve the current revision of the effects table within

the controller, or to terminate early a Haptic effect. Just

like the Effect commands, the command codes are

two’s compliments of one another. The Terminate-early

command is executed at the completion of the I2C Stop

condition. When the Revision command is sent, the

controller then formats the revision data and waits for

an I2C read from the master.

2.3.3 ABORTING A COMMAND

TRANSMISSION

A Restart or Stop condition in an expected data bit

position will abort the current command sequence and

data will not be written to the MTCH810. Write

commands are automatically aborted if the binary XOR

checksum is not valid.

2.3.4 WRITE COMMAND

(NORMAL AND HIGH VOLTAGE)

The format of the command is shown in Figure 2-10.

The MTCH810 generates the A / A bits.

A Write command will only start a write cycle after a

properly formatted Write command has been received

and the Stop condition has occurred.

FIGURE 2-10: WRITE RANDOM ADDRESS COMMAND

I2C Slave Address

Write bit

0010000 00001001

11110111

Command Message

MTCH810

DS41672A-page 12  2012 Microchip Technology Inc.

2.3.5 REVISION COMMAND

The format of the Revision command (see Figure 2-11)

includes the Start condition, I2C control byte (with R/W

bit set to 0), A bit, the first command byte, A bit, fol-

lowed by the two’s compliment of the command byte, a

Repeated Start bit, I2C control byte (with R/W bit set to

1) and the MTCH810 device transmitting the requested

data bytes one at a time, until the master sends a Stop

condition.

The I2C control byte requires the R/W bit to be equal to

a logic one (R/W = 1) in order to generate a read

sequence. The data read will start with the Most Signif-

icant Byte (MSB) of the revision date and automatically

increment to the next byte after each byte request. The

sequence is ended with the master generating a Stop

or Restart condition. Figure 2-11 shows the waveforms

for a single read.

2.3.5.1 Ignoring an I2C Transmission and

“Falling Off” the Bus

The MTCH810 device expects to receive complete,

valid I2C commands and will assume that any

command not defined as a valid command is due to a

bus corruption and will enter a passive high condition

on the SDA signal. All signals will be ignored until the

next valid Start condition and control byte are received.

FIGURE 2-11: READ REVISION COMMAND

Stop bit

I2C™ Slave Address Revision Command

DDDD D D DD

A1DDDDD DDDN1

Read bit Revision LSB

Note 1: Master device is responsible for A / A signal. If a A signal occurs, the MTCH810 will abort this

transfer and release the bus.

0123456701234567

0010000

I2C™ Slave Address

Write bit

Repeated Start bit

00 0

Revision MSB

11110010A

 2012 Microchip Technology Inc. DS41672A-page 13

MTCH810

3.0 ELECTRICAL SPECIFICATIONS

Absolute Maximum Ratings(†)

Ambient temperature under bias....................................................................................................... -40°C to +125°C

Storage temperature ........................................................................................................................ -65°C to +150°C

Voltage on VDD with respect to VSS .................................................................................................... -0.3V to +4.0V

Voltage on all other pins with respect to VSS ........................................................................... -0.3V to (VDD + 0.3V)

Total power dissipation(1) ............................................................................................................................... 800 mW

Maximum current out of VSS pin, -40°C  TA  +85°C for industrial................................................................. 85 mA

Maximum current into VDD pin, -40°C  TA  +85°C for industrial.................................................................... 80 mA

Clamp current, IK (VPIN < 0 or VPIN > VDD)20 mA

Maximum output current sunk by any DR pin ................................................................................................... 25 mA

Maximum output current sourced by any DR pin.............................................................................................. 25 mA

Note 1: Power dissipation is calculated as follows: PDIS = VDD x {IDD –  IOH} +  {(VDD – VOH) x IOH} + (VOl x IOL).

† NOTICE: Stresses above those listed under “Absolute Maximum Ratings” may cause permanent damage to the

device. This is a stress rating only and functional operation of the device at those or any other conditions above those

indicated in the operation listings of this specification is not implied. Exposure to maximum rating conditions for

extended periods may affect device reliability.

MTCH810

DS41672A-page 14  2012 Microchip Technology Inc.

FIGURE 3-1: POR AND POR REARM WITH SLOW RISING VDD

3.1 DC Characteristics: MTCH810

MTCH810 Standard Operating Conditions (unless otherwise stated)

Operating temperature -40°C  T

A  +85°C for industrial

Param.

No.

Sym. Characteristic Min. Typ† Max. Units Conditions

D001 VDD Supply Voltage 1.8 — 3.6 V

D002

D003

VPOR*Power-on Reset Release Voltage —1.6— V

VPORR*Power-on Reset Rearm Voltage — 0.8 — V Device in Sleep mode

D004* SVDD VDD Rise Rate to ensure internal

Power-on Reset signal

0.05 — — V/ms

* These parameters are characterized but not tested.

† Data in “Typ” column is at 3.0V, 25°C unless otherwise stated. These parameters are for design guidance only and

are not tested.

Note 1: This is the limit to which VDD can be lowered in Sleep mode without losing RAM data.

VDD

VPOR

VPORR

VSS

NPOR(1)

TPOR(3)

POR REARM

Note 1: When NPOR is low, the device is held in Reset.

2: TPOR 1 s typical.

3: TVLOW 2.7 s typical.

TVLOW(2)

 2012 Microchip Technology Inc. DS41672A-page 15

MTCH810

3.2 DC Characteristics: MTCH810-I/E

DC CHARACTERISTICS Standard Operating Conditions (unless otherwise stated)

Operating temperature-40°C  T

A  +85°C for industrial

Param.

No. Sym. Characteristic Min. Typ† Max. Units Conditions

VIL Input Low Voltage

DR PORT:

D030A with TTL buffer — — 0.15 VD

V1.8V  VDD  3.6V

D031 with I2C™ levels — — 0.3 VDD V

VIH Input High Voltage

DR Ports:

D040A with TTL buffer 0.25 VDD

+ 0.8

——V1.8V  VDD  3.6V

D041 with I2C™ levels 0.7 VDD ——V

IIL Input Leakage Current(1)

D060 DR Ports —

—

± 5

± 125

± 1000

VSS  VPIN  VDD,

Pin at high-impedance at 85°C

125°C

VOL Output Low Voltage(3)

D080 DR Ports ——0.6V

IOL = 6 mA, VDD = 3.3V

IOL = 1.8 mA, VDD = 1.8V

VOH Output High Voltage(3)

D090 DR Ports VDD - 0.7 — — V IOH = 3 mA, VDD = 3.3V

IOH = 1 mA, VDD = 1.8V

Capacitive Loading Specs on Output Pins

D101A* CIO All DR pins — — 50 pF

* These parameters are characterized but not tested.

† Data in “Typ” column is at 3.0V, 25°C unless otherwise stated. These parameters are for design guidance

only and are not tested.

Note 1: Negative current is defined as current sourced by the pin.

2: The leakage current on the MCLR pin is strongly dependent on the applied voltage level. The specified

levels represent normal operating conditions. Higher leakage current may be measured at different input

voltages.

3: Including OSC2 in CLKOUT mode.

MTCH810

DS41672A-page 16  2012 Microchip Technology Inc.

FIGURE 3-2: LOAD CONDITIONS

TABLE 3-1: DR TIMING PARAMETERS

Legend: CL = 50 pF for all pins

Load Condition

Standard Operating Conditions (unless otherwise stated)

Operating Temperature -40°C T

A +125°C

Param.

No. Sym. Characteristic Min. Typ† Max. Units Conditions

OS18* TioR DR output rise time —

—

140

ns VDD = 1.8V

VDD = 3.0-3.6V

OS19* TioF DR output fall time —

—

ns VDD = 1.8V

VDD = 3.0-3.6V

* These parameters are characterized but not tested.

† Data in “Typ” column is at 3.0V, 25C unless otherwise stated.

 2012 Microchip Technology Inc. DS41672A-page 17

MTCH810

FIGURE 3-3: BROWN-OUT RESET TIMING AND CHARACTERISTICS

TABLE 3-2: RESET, WATCHDOG TIMER, OSCILLATOR START-UP TIMER, POWER-UP TIMER

AND BROWN-OUT RESET PARAMETERS

Standard Operating Conditions (unless otherwise stated)

Operating Temperature -40°C TA +125°C

Param.

No. Sym. Characteristic Min. Typ† Max. Units Conditions

31 TWDTLP Watchdog Timer Time-out Period 205 256 305 ms VDD = 1.8V-3.6V,

1:1 Prescaler used

33* TPWRT Power-up Timer Period 40 65 140 ms

* These parameters are characterized but not tested.

† Data in “Typ” column is at 3.0V, 25°C unless otherwise stated. These parameters are for design guidance

only and are not tested.

VBOR

VDD

(Device in Brown-out Reset) (Device not in Brown-out Reset)

Reset

(due to BOR)

VBOR and VHYST

MTCH810

DS41672A-page 18  2012 Microchip Technology Inc.

FIGURE 3-4: I2C™ BUS START/STOP BITS TIMING

FIGURE 3-5: I2C™ BUS DATA TIMING

Note: Refer to Figure 3-2 for load conditions.

SP91

SP92

SP93

SCLx

SDAx

Start

Condition

Stop

Condition

SP90

Note: Refer to Figure 3-2 for load conditions.

SP90

SP91 SP92

SP100

SP101

SP103

SP106 SP107

SP109 SP109

SP110

SP102

SCLx

SDAx

Out

 2012 Microchip Technology Inc. DS41672A-page 19

MTCH810

TABLE 3-3: I2C™ BUS DATA REQUIREMENTS

Param.

No. Symbol Characteristic Min. Max. Units Conditions

SP100* THIGH Clock high time 400 kHz mode 0.6 — s

SP101* TLOW Clock low time 400 kHz mode 1.3 — s

SP102* TRSDAx and SCLx

rise time

400 kHz mode 20 + 0.1CB300 ns CB is specified to be from

10-400 pF

SP103* TFSDAx and SCLx

fall time

400 kHz mode 20 + 0.1CB250 ns CB is specified to be from

10-400 pF

SP106* THD:DAT Data input hold

time

400 kHz mode 0 0.9 s

SP107* T

SU:DAT Data input setup

time

400 kHz mode 100 — ns

SP109* T

AA Output valid from

clock

400 kHz mode — — ns

SP110* TBUF Bus free time 400 kHz mode 1.3 — s Time the bus must be free

before a new transmission

can start

SP111* CBBus capacitive loading — 400 pF

SP112* TTIMEOUT Maximum message

time

400 kHz mode 29.5 36.0 ms

* These parameters are characterized but not tested.

MTCH810

DS41672A-page 20  2012 Microchip Technology Inc.

4.0 PACKAGING INFORMATION

4.1 Package Marking Information

8-Lead DFN (3x3x0.9 mm) Example

XXXX

NNN

YYWW

PIN 1 PIN 1

MFT0

1243

017

TABLE 4-1: 8-LEAD 3x3x0.9 DFN (MF) TOP MARKING

Part Number Marking

MTCH810-I/MF MFTO

*Standard PIC® device marking consists of Microchip part number, year code, week code, and traceability

code. For PIC device marking beyond this, certain price adders apply. Please check with your Microchip

Sales Office. For QTP devices, any special marking adders are included in QTP price.

Legend: XX...X Customer-specific information

Y Year code (last digit of calendar year)

YY Year code (last 2 digits of calendar year)

WW Week code (week of January 1 is week ‘01’)

NNN Alphanumeric traceability code

Pb-free JEDEC designator for Matte Tin (Sn)

*This package is Pb-free. The Pb-free JEDEC designator ( )

can be found on the outer packaging for this package.

Note: In the event the full Microchip part number cannot be marked on one line, it will

be carried over to the next line, thus limiting the number of available

characters for customer-specific information.

 2012 Microchip Technology Inc. DS41672A-page 21

MTCH810

4.2 Package Details

The following sections give the technical details of the packages.

Note: For the most current package drawings, please see the Microchip Packaging Specification located at

http://www.microchip.com/packaging

MTCH810

DS41672A-page 22  2012 Microchip Technology Inc.

Note: For the most current package drawings, please see the Microchip Packaging Specification located at

http://www.microchip.com/packaging

 2012 Microchip Technology Inc. DS41672A-page 23

MTCH810

Note: For the most current package drawings, please see the Microchip Packaging Specification located at

http://www.microchip.com/packaging

MTCH810

DS41672A-page 24  2012 Microchip Technology Inc.

APPENDIX A: DATA SHEET

REVISION HISTORY

Revision A (12/2012)

Initial release.

 2012 Microchip Technology Inc. DS41672A-page 25

MTCH810

INDEX

Symbols

I2C Hardware Interface......................................................... 7

Absolute Maximum Ratings ................................................ 13

Brown-out Reset (BOR)

Specifications.............................................................. 17

Timing and Characteristics ......................................... 17

Communications ................................................................... 3

Customer Change Notification Service ............................... 26

Customer Notification Service............................................. 26

Customer Support ............................................................... 26

DC Characteristics

MTCH810.................................................................... 14

Description ............................................................................ 1

Device Overview ................................................................... 3

DR1....................................................................................... 3

DR2....................................................................................... 3

Drive Outputs ........................................................................ 3

Electrical Specifications ...................................................... 13

Errata .................................................................................... 2

Features................................................................................ 1

I2C™ Communications and Protocol.................................... 7

Internet Address.................................................................. 26

Microchip Internet Web Site................................................ 26

Oscillator Start-up Timer (OST)

Specifications.............................................................. 17

Package Type ....................................................................... 1

Packaging

DFN............................................................................. 21

Packaging Information ........................................................ 20

Pin Description.................................................................. 1, 3

Power-up Timer (PWRT)

Specifications.............................................................. 17

PWM Resolution ................................................................... 3

Reader Response ............................................................... 27

Revision History .................................................................. 24

Timing Diagrams

Brown-out Reset (BOR) .............................................. 17

I2C Bus Data............................................................... 18

WWW Address ................................................................... 26

WWW, On-Line Support ....................................................... 2

MTCH810

DS41672A-page 26  2012 Microchip Technology Inc.

THE MICROCHIP WEB SITE

Microchip provides online support via our WWW site at

www.microchip.com. This web site is used as a means

to make files and information easily available to

customers. Accessible by using your favorite Internet

browser, the web site contains the following

information:

•Product Support – Data sheets and errata,

application notes and sample programs, design

resources, user’s guides and hardware support

documents, latest software releases and archived

software

•General Technical Support – Frequently Asked

Questions (FAQ), technical support requests,

online discussion groups, Microchip consultant

program member listing

•Business of Microchip – Product selector and

ordering guides, latest Microchip press releases,

listing of seminars and events, listings of

Microchip sales offices, distributors and factory

representatives

CUSTOMER CHANGE NOTIFICATION

SERVICE

Microchip’s customer notification service helps keep

customers current on Microchip products. Subscribers

will receive e-mail notification whenever there are

changes, updates, revisions or errata related to a

specified product family or development tool of interest.

To register, access the Microchip web site at

www.microchip.com. Under “Support”, click on

“Customer Change Notification” and follow the

registration instructions.

CUSTOMER SUPPORT

Users of Microchip products can receive assistance

through several channels:

• Distributor or Representative

• Local Sales Office

• Field Application Engineer (FAE)

• Technical Support

• Development Systems Information Line

Customers should contact their distributor,

representative or field application engineer (FAE) for

support. Local sales offices are also available to help

customers. A listing of sales offices and locations is

included in the back of this document.

Technical support is available through the web site

at: http://microchip.com/support

 2012 Microchip Technology Inc. DS41672A-page 27

MTCH810

READER RESPONSE

It is our intention to provide you with the best documentation possible to ensure successful use of your Microchip

product. If you wish to provide your comments on organization, clarity, subject matter, and ways in which our

documentation can better serve you, please FAX your comments to the Technical Publications Manager at

(480) 792-4150.

Please list the following information, and use this outline to provide us with your comments about this document.

TO: Technical Publications Manager

RE: Reader Response

Total Pages Sent ________

From: Name

Company

Address

City / State / ZIP / Country

Telephone: (_______) _________ - _________

Application (optional):

Would you like a reply? Y N

Device: Literature Number:

Questions:

FAX: (______) _________ - _________

DS41672AMTCH810

1. What are the best features of this document?

2. How does this document meet your hardware and software development needs?

3. Do you find the organization of this document easy to follow? If not, why?

4. What additions to the document do you think would enhance the structure and subject?

5. What deletions from the document could be made without affecting the overall usefulness?

6. Is there any incorrect or misleading information (what and where)?

7. How would you improve this document?

MTCH810

DS41672A-page 28  2012 Microchip Technology Inc.

PRODUCT IDENTIFICATION SYSTEM

To order or obtain information, e.g., on pricing or delivery, refer to the factory or the listed sales office.

PART NO. X/XX XXX

PatternPackageTemperature

Range

Device

Device: MTCH810

Tape and Reel

Option:

Blank = Standard packaging (tube or tray)

T = Tape and Reel(1)

Temperature

Range:

I= -40C to +85C (Industrial)

Package:(2) MF = DFN

Pattern: QTP, SQTP, Code or Special Requirements

(blank otherwise)

Examples:

a) MTCH810 - I/MF

Industrial temperature,

DFN package

Note 1: Tape and Reel identifier only appears in the

catalog part number description. This

identifier is used for ordering purposes and is

not printed on the device package. Check

with your Microchip Sales Office for package

availability with the Tape and Reel option.

2: For other small form-factor package

availability and marking information, please

visit www.microchip.com/packaging or

contact your local sales office.

[X](1)

Tape and Reel

Option

 2012 Microchip Technology Inc. DS41672A-page 29

Information contained in this publication regarding device

applications and the like is provided only for your convenience

and may be superseded by updates. It is your responsibility to

ensure that your application meets with your specifications.

MICROCHIP MAKES NO REPRESENTATIONS OR

WARRANTIES OF ANY KIND WHETHER EXPRESS OR

IMPLIED, WRITTEN OR ORAL, STATUTORY OR

OTHERWISE, RELATED TO THE INFORMATION,

INCLUDING BUT NOT LIMITED TO ITS CONDITION,

QUALITY, PERFORMANCE, MERCHANTABILITY OR

FITNESS FOR PURPOSE. Microchip disclaims all liability

arising from this information and its use. Use of Microchip

devices in life support and/or safety applications is entirely at

the buyer’s risk, and the buyer agrees to defend, indemnify and

hold harmless Microchip from any and all damages, claims,

suits, or expenses resulting from such use. No licenses are

conveyed, implicitly or otherwise, under any Microchip

intellectual property rights.

Trademarks

The Microchip name and logo, the Microchip logo, dsPIC,

FlashFlex, KEELOQ, KEELOQ logo, MPLAB, PIC, PICmicro,

PICSTART, PIC32 logo, rfPIC, SST, SST Logo, SuperFlash

and UNI/O are registered trademarks of Microchip Technology

Incorporated in the U.S.A. and other countries.

FilterLab, Hampshire, HI-TECH C, Linear Active Thermistor,

MTP, SEEVAL and The Embedded Control Solutions

Company are registered trademarks of Microchip Technology

Incorporated in the U.S.A.

Silicon Storage Technology is a registered trademark of

Microchip Technology Inc. in other countries.

Analog-for-the-Digital Age, Application Maestro, BodyCom,

chipKIT, chipKIT logo, CodeGuard, dsPICDEM,

dsPICDEM.net, dsPICworks, dsSPEAK, ECAN,

ECONOMONITOR, FanSense, HI-TIDE, In-Circuit Serial

Programming, ICSP, Mindi, MiWi, MPASM, MPF, MPLAB

Certified logo, MPLIB, MPLINK, mTouch, Omniscient Code

Generation, PICC, PICC-18, PICDEM, PICDEM.net, PICkit,

PICtail, REAL ICE, rfLAB, Select Mode, SQI, Serial Quad I/O,

Total Endurance, TSHARC, UniWinDriver, WiperLock, ZENA

and Z-Scale are trademarks of Microchip Technology

Incorporated in the U.S.A. and other countries.

SQTP is a service mark of Microchip Technology Incorporated

in the U.S.A.

GestIC and ULPP are registered trademarks of Microchip

Technology Germany II GmbH & Co. & KG, a subsidiary of

Microchip Technology Inc., in other countries.

All other trademarks mentioned herein are property of their

respective companies.

Printed on recycled paper.

ISBN: 9781620768174

Note the following details of the code protection feature on Microchip devices:

• Microchip products meet the specification contained in their particular Microchip Data Sheet.

• Microchip believes that its family of products is one of the most secure families of its kind on the market today, when used in the

intended manner and under normal conditions.

• There are dishonest and possibly illegal methods used to breach the code protection feature. All of these methods, to our

knowledge, require using the Microchip products in a manner outside the operating specifications contained in Microchip’s Data

Sheets. Most likely, the person doing so is engaged in theft of intellectual property.

• Microchip is willing to work with the customer who is concerned about the integrity of their code.

• Neither Microchip nor any other semiconductor manufacturer can guarantee the security of their code. Code protection does not

mean that we are guaranteeing the product as “unbreakable.”

Code protection is constantly evolving. We at Microchip are committed to continuously improving the code protection features of our

products. Attempts to break Microchip’s code protection feature may be a violation of the Digital Millennium Copyright Act. If such acts

allow unauthorized access to your software or other copyrighted work, you may have a right to sue for relief under that Act.

Microchip received ISO/TS-16949:2009 certification for its worldwide

headquarters, design and wafer fabrication facilities in Chandler and

Tempe, Arizona; Gresham, Oregon and design centers in California

and India. The Company’s quality system processes and procedures

are for its PIC® MCUs and dsPIC® DSCs, KEELOQ® code hopping

devices, Serial EEPROMs, microperipherals, nonvolatile memory and

analog products. In addition, Microchip’s quality system for the design

and manufacture of development systems is ISO 9001:2000 certified.

QUALITY MANAGEMENT S

YSTEM

CERTIFIED BY DNV

== ISO/TS 16949 ==

DS41672A-page 30  2012 Microchip Technology Inc.

AMERICAS

Corporate Office

2355 West Chandler Blvd.

Chandler, AZ 85224-6199

Tel: 480-792-7200

Fax: 480-792-7277

Technical Support:

http://www.microchip.com/

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Web Address:

www.microchip.com

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Tel: 61-2-9868-6733

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Tel: 86-532-8502-7355

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Tel: 86-21-5407-5533

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Worldwide Sales and Service

11/29/12

Mouser Electronics

Authorized Distributor

Click to View Pricing, Inventory, Delivery & Lifecycle Information:

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MTCH810-I/MF