MBR0530 Schottky Rectifier Features * 0.5 A, Low Forward Voltage less than 430 mV * Compact Surface Mount Package with The Same Footprint as Mini-melf www.onsemi.com Applications * * * * * Solid-State Relays Industrial Controls Lighting Controls Static Power Switches AC Motor Starters SOD-123 CASE 425-04 ABSOLUTE MAXIMUM RATINGS (TA = 25C unless otherwise noted) Symbol Description Value Unit VRRM Maximum Repetitive Reverse Voltage 30 V IF(AV) Average Rectified Forward Current 500 mA IFSM Non Repetitive Peak Forward Current (Surge Applied at Rated Load Conditions Half-Wave, Single-Phase, 60 Hz) 5.5 A TSTG Storage Temperature Range -65 to +150 _C TJmax Operating Junction Temperature -65 to +125 _C MARKING DIAGRAM 1 &Y Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality should not be assumed, damage may occur and reliability may be affected. &Z * &G &Y &Z*&G = Binary Calendar Year Coding Scheme = Assembly Plant Code = Specific Device Code B3 = Single Digit Weekly Datecode Table 1. ORDERING INFORMATION Part Number Top Mark Package Packing Method MBR0530 B3 SOD-123 2L Tape and Reel Table 2. THERMAL CHARACTERISTICS (Values are at TA = 25C unless otherwise noted) Symbol Parameter Value Unit RJA Thermal Resistance, Junction-to-Ambient (Note 1) 206 _C/W RJL Thermal Resistance, Junction-to-Lead 173 _C/W 1. 1 inch square pad size on FR-4 board. (c) Semiconductor Components Industries, LLC, 2017 March, 2019 - Rev.2 1 Publication Order Number: MBR0530/D MBR0530 Table 3. ELECTRICAL CHARACTERISTICS (Values are at TA = 25C unless otherwise noted) Symbol Parameter VF Conditions Forward Voltage IR Reverse Current Min. Max. Unit IF = 100 mA 375 IF = 100 mA, TA = 100_C 340 IF = 500 mA 430 IF = 500 mA, TA = 100_C 420 VR = 15 V 20 mA VR = 30 V 130 mA 5 mA VR = 30 V, TA = 100_C mV TYPICAL PERFORMANCE CHARACTERISTICS 1000 o Reverse Current, I R [mA] Forward Current, I F [mA] TA = 125 C 100 o 75 C o 100 C o 25 C 10 o -40 C 1 o -65 C 0.1 0.0 0.1 T A = 125 C 10000 o 0.2 0.3 0.4 o 100 C o 75 C 100 o 25 C 1 o -40 C 0.01 o -65 C 1E-4 0.5 1E-6 0.6 0 10 Forward Voltage, V F [V] Figure 1. Forward Current vs. Forward Voltage 40 50 120 100 40 Total Capacitance, C T [pF] Breakdown Voltage, BV R [V] 30 Figure 2. Reverse Current vs. Reverse Voltage 50 30 20 10 o T A = 25 C 0 20 Reverse Voltage, V R [V] 0 2 4 6 8 80 60 40 20 0 10 Reverse Current, I R [mA] 0 5 10 15 20 25 Reverse Voltage, V R [V] Figure 3. Breakdown Voltage vs. Reverse Current www.onsemi.com 2 Figure 4. Total Capacitance 30 MBR0530 SOD*123 CASE 425*04 ISSUE G D A NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. A1 1 DIM A A1 b c D E HE L E HE 2 MILLIMETERS MIN NOM MAX 0.94 1.17 1.35 0.00 0.05 0.10 0.51 0.61 0.71 ----0.15 1.40 1.60 1.80 2.54 2.69 2.84 3.56 3.68 3.86 ----0.25 --10 0 MIN 0.037 0.000 0.020 --0.055 0.100 0.140 0.010 0 INCHES NOM 0.046 0.002 0.024 --0.063 0.106 0.145 ----- MAX 0.053 0.004 0.028 0.006 0.071 0.112 0.152 --10 L b C SOLDERING FOOTPRINT* 0.91 0.036 1.22 0.048 2.36 0.093 4.19 0.165 SCALE 10:1 mm inches *For additional information on our Pb *Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. ON Semiconductor and are trademarks of Semiconductor Components Industries, LLC dba ON Semiconductor or its subsidiaries in the United States and/or other countries. ON Semiconductor owns the rights to a number of patents, trademarks, copyrights, trade secrets, and other intellectual property. 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