LTST-C170GKTBINJ - Lite-On Electronics, Inc.

LITE-ON TECHNOLOGY CORPORATION

Property of Lite-On Only

Features

* Meet ROHS, Green Product.

* Package In 8mm Tape On 7" Diameter Reels.

* Compatible With Automatic Placement Equipment.

* Compatible With Infrared And Vapor Phase Reflow Solder Process.

* EIA STD package.

* I.C. compatible.

Package Dimensions

Part No. Lens Source Color

LTST-C170GKT Water Clear GaP on GaP Green

Notes:

1. All dimensions are in millimeters (inches).

2. Tolerance is ± 0.10 mm (.004") unless otherwise noted.

Part No. : LTST-C170GKT Page : 1 of 10

BNS-OD-C131/A4

LITE-ON TECHNOLOGY CORPORATION

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Absolute Maximum Ratings At Ta=25℃

Parameter LTST-C170GKT Unit

Pow er D is si p a ti o n 100 mW

Peak Forward Current

(1/10 Duty Cycle, 0.1ms Pulse Width) 120 mA

DC Forward Current 30 mA

Derating Linear From 50°C 0.6 mA/°C

Reverse Voltage 5 V

Operating Temperature Range -55°C to + 8 5 °C

Storage Temperature Range -55°C to + 8 5 °C

Wave Soldering Condition 260°C For 5 Seconds

Infrared Soldering Condition 260°C For 5 Seconds

Vapor Phase Soldering Condition 215°C For 3 Minutes

Part No. : LTST-C170GKT Page : 2 of 10

BNS-OD-C131/A4

LITE-ON TECHNOLOGY CORPORATION

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Suggestion Profile:

(1) Suggestion IR Reflow Profile For Normal Process

(2) Suggestion IR Reflow Profile For Pb Free Process

Recom m ended Profile Between Assem ble And H eat-Resistance Line

T h e P ro file is av a ila b le th a t mu s t to u s e S n A g C u s o ld er p a ste

Part No. : LTST-C170GKT Page : 3 of 10

BNS-OD-C131/A4

LITE-ON TECHNOLOGY CORPORATION

Property of Lite-On Only

Electrical Optical Characteristics At Ta=25℃

Parameter Symbol

Part No.

LTST- Min. Typ. Max. Unit Test Condition

Luminous Intensity IV C170GKT 1.8 6.0 mcd IF = 10mA

Note 1

Viewing Angle 2θ1/2 C170GKT 130 deg Note 2 (Fig.6)

Peak Emission Wavelength λP C170GKT 565 nm

Measurement

@Peak (Fig.1)

Dominant Wavelength λd C170GKT 569 nm Note 3

Spectral Line Half-Width Δλ C170GKT 30 nm

Fo rward Voltage VF C170GKT 2.1 2.6 V IF = 20mA

Reverse Current IR C170GKT 10 μA VR = 5V

Capacitance C C170GKT 35 PF

VF = 0

f = 1MHZ

Notes: 1. Luminous intensity is measured with a light sensor and filter combination that approximates the

CIE eye-response curve.

2. θ1/2 is the off-axis angle at which the luminous intensity is half the axial luminous intensity.

3. The dominant wavelength, λd is derived from the CIE chromaticity diagram and represents the

single wavelength which defines the color of the device.

Part No. : LTST-C170GKT Page : 4 of 10

BNS-OD-C131/A4

LITE-ON TECHNOLOGY CORPORATION

Property of Lite-On Only

Bin Code List

Part No. : LTST-C170GKT Page : 5 of 10

BNS-OD-C131/A4

Luminous Intensity Unit : mcd @10mA

Bin Code Min. Max.

G 1.80 2.80

H 2.80 4.50

J 4.50 7.10

K 7.10 11.2

L 11.2 18.0

Tolerance on each Intensity bin is +/-15%

LITE-ON TECHNOLOGY CORPORATION

Property of Lite-On Only

Typical Electrical / Optical Characteristics Curves

(25 °C Ambient Temperature Unless Otherwise Noted)

Part No. : LTST-C170GKT Page : 6 of 10

BNS-OD-C131/A4

LITE-ON TECHNOLOGY CORPORATION

Property of Lite-On Only

Cleaning

Do not use unspecified chemical liquid to clean LED they could harm the package.

If clean is necessary, immerse the LED in ethyl alcohol or in isopropyl alcohol at normal temperature

for less one minute.

Suggest Soldering Pad Dimensions

Package Dimensions Of Tape And Reel

Notes:

1. All dimensions are in millimeters (inches).

Part No. : LTST-C170GKT Page : 7 of 10

BNS-OD-C131/A4

LITE-ON TECHNOLOGY CORPORATION

Property of Lite-On Only

Notes:

1. Empty component pockets sealed with top cover tape.

2. 7 inch reel-3000 pieces per reel.

3. Minimum packing quantity is 500 pcs for remainders.

4. The maximum number of consecutive missing lamps is two.

5. In accordance with ANSI/EIA 481-1-A-1994 specifications.

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BNS-OD-C131/A4

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Part No. : LTST-C170GKT Page : 9 of 10

BNS-OD-C131/A4

CAUTIONS

1. Application

The LEDs described here are intended to be used for ordinary electronic equipment (such as office

equipment, communication equipment and household applications).Consult Liteon’s Sales in advance

for information on applications in which exceptional reliability is required, particularly when the failure

or malfunction of the LEDs may directly jeopardize life or health (such as in aviation, transportation,

traffic control equipment, medical and life support systems and safety devices).

2. Storage

The storage ambient for the LEDs should not exceed 30°C temperature or 70% relative humidity.

It is recommended that LEDs out of their original packaging are IR-reflowed within one week.

For extended storage out of their original packaging, it is recommended that the LEDs be stored in a

sealed container with appropriate desiccant, or in a desiccators with nitrogen ambient.

LEDs stored out of their original packaging for more than a week should be baked at about 60 deg C

for at least 24 hours before solder assembly.

3. Cleaning

Use alcohol-based cleaning solvents such as isopropyl alcohol to clean the LED if necessary.

4. Soldering

Recommended soldering conditions:

Reflow soldering Wave Soldering Soldering iron

Pre-heat

Pre-heat time

Peak temperature

Soldering time

120~150°C

120 sec. Max.

240°C Max.

10 sec. Max.

Pre-heat

Pre-heat time

Solder wave

Soldering time

100°C Max.

60 sec. Max.

260°C Max.

10 sec. Max.

Temperature

Soldering time 300°C Max.

3 sec. Max.

(one time only)

5. Drive Method

An LED is a current-operated device. In order to ensure intensity uniformity on multiple LEDs

connected in parallel in an application, it is recommended that a current limiting resistor be incorporated

in the drive circuit, in series with each LED as shown in Circuit A below.

Circuit model A Circuit model B

LED

(A) Recommended circuit.

(B) The brightness of each LED might appear different due to the differences in the I-V characteristics

of those LEDs.

6. ESD (Electrostatic Discharge)

Static Electricity or power surge will damage the LED.

Suggestions to prevent ESD damage:

 Use of a conductive wrist band or anti-electrostatic glove when handling these LEDs.

 All devices, equipment, and machinery must be properly grounded.

 Work tables, storage racks, etc. should be properly grounded.

 Use ion blower to neutralize the static charge which might have built up on surface of the LED’s

plastic lens as a result of friction between LEDs during storage and handling.

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Part No. : LTST-C170GKT Page : 10 of 10

BNS-OD-C131/A4

ESD-damaged LEDs will exhibit abnormal characteristics such as high reverse leakage current, low forward

voltage, or “ no lightup ” at low currents.

To verify for ESD damage, check for “ lightup ” and Vf of the suspect LEDs at low currents.

The Vf of “ good ” LEDs should be >2.0V@0.1mA for InGaN product and >1.4V@0.1mA for AlInGaP product.

7. Reliability Test

Classification Test Item Test Condition Reference Standard

Operation Life Ta= Under Room Temperature As Per Data Sheet

Maximum Rating

*Test Time= 1000HRS (-24HRS,+72HRS)*@20mA.

MIL-STD-750D:1026 (1995)

MIL-STD-883D:1005 (1991)

JIS C 7021:B-1 (1982)

High Temperature

High Humidity

Storage

IR-Reflow In-Board, 2 Times

Ta= 65±5℃,RH= 90～95%

*Test Time= 240HRS±2HRS

MIL-STD-202F:103B(1980)

JIS C 7021:B-11(1982)

High Temperature

Storage Ta= 105±5℃

*Test Time= 1000HRS (-24HRS,+72HRS) MIL-STD-883D:1008 (1991)

JIS C 7021:B-10 (1982)

Endurance

Test

Low Temperature

Storage Ta= -55±5℃

*Test Time=1000HRS (-24HRS,+72H RS) JIS C 7021:B-12 (1982)

Temperature

Cycling

105℃ ～ 25℃ ～ -55℃ ～ 25℃

30mins 5mins 30mins 5mins

10 Cycles

MIL-STD-202F:107D (1980)

MIL-STD-750D:1051(1995)

MIL-STD-883D:1010 (1991)

JIS C 7021:A-4(1982)

Thermal

Shock

IR-Reflow In-Board, 2 Times

85 ± 5℃ ～ -40℃ ± 5℃

10mins 10mins 10 Cycles

MIL-STD-202F:107D(1980)

MIL-STD-750D:1051(1995)

MIL-STD-883D:1011 (1991)

Solder

Resistance T.sol= 260 ± 5℃

Dwell Time= 10 ± 1secs

MIL-STD-202F:210A(1980)

MIL-STD-750D:2031(1995)

JIS C 7021:A-1(1982)

IR-Reflow

Normal Process

Ramp-up rate(183℃ to Peak) +3℃/ second max

Temp. maintain at 125(±25)℃ 120 seconds max

Temp. maintain above 183℃ 60-150 seconds

Peak temperature range 235℃+5/-0℃

Time within 5°C of actual Peak Temperature (tp)

10-30 seconds

Ramp-down rate +6℃/second max

MIL-STD-750D:2031.2(1995)

J-STD-020(1999)

IR-Reflow

Pb Free Process

Ramp-up rate(217 to Peak) +3 / second max℃℃

Temp. maintain at 175(±25) 180 seconds max℃

Temp. maintain above 217 60℃-150 seconds

Peak temperature range 260 +0/℃-5℃

Time within 5°C of actual Peak Temperature (tp)

20-40 seconds

Ramp-down rate +6 /second max℃

MIL-STD-750D:2031.2(1995)

J-STD-020(1999)

Environmental

Test

Solderability

T.sol= 235 ± 5℃

Immersion time 2±0.5 sec

Immersion rate 25±2.5 mm/sec

Coverage ≧95% of the dipped surface

MIL-STD-202F:208D(1980)

MIL-STD-750D:2026(1995)

MIL-STD-883D:2003(1991)

IEC 68 Part 2-20

JIS C 7021:A-2(1982)

8. Others

The appearance and specifications of the product may be modified for improvement without prior notice.