PACKAGING INFORMATION
Orderable Device Status (1) Package
Type Package
Drawing Pins Package
Qty Eco Plan (2) Lead/Ball Finish MSL Peak Temp (3)
5962-86812012A ACTIVE LCCC FK 20 1 TBD Call TI Level-NC-NC-NC
5962-8681201EA ACTIVE CDIP J 16 1 TBD Call TI Level-NC-NC-NC
5962-8681201EA ACTIVE CDIP J 16 1 TBD Call TI Level-NC-NC-NC
5962-86828012A OBSOLETE LCCC FK 20 TBD Call TI Call TI
5962-86828012A OBSOLETE LCCC FK 20 TBD Call TI Call TI
5962-8682801EA ACTIVE CDIP J 16 1 TBD Call TI Level-NC-NC-NC
5962-8682801EA ACTIVE CDIP J 16 1 TBD Call TI Level-NC-NC-NC
85001012A ACTIVE LCCC FK 20 1 TBD Call TI Level-NC-NC-NC
85001012A ACTIVE LCCC FK 20 1 TBD Call TI Level-NC-NC-NC
8500101EA ACTIVE CDIP J 16 1 TBD Call TI Level-NC-NC-NC
8500101EA ACTIVE CDIP J 16 1 TBD Call TI Level-NC-NC-NC
85002012A ACTIVE LCCC FK 20 1 TBD Call TI Level-NC-NC-NC
85002012A ACTIVE LCCC FK 20 1 TBD Call TI Level-NC-NC-NC
8500201EA ACTIVE CDIP J 16 1 TBD Call TI Level-NC-NC-NC
8500201EA ACTIVE CDIP J 16 1 TBD Call TI Level-NC-NC-NC
JM38510/65706BEA ACTIVE CDIP J 16 1 TBD Call TI Level-NC-NC-NC
JM38510/65706BEA ACTIVE CDIP J 16 1 TBD Call TI Level-NC-NC-NC
JM38510/65708BEA ACTIVE CDIP J 16 1 TBD Call TI Level-NC-NC-NC
JM38510/65708BEA ACTIVE CDIP J 16 1 TBD Call TI Level-NC-NC-NC
JM38510/65708BFA ACTIVE CFP W 16 1 TBD Call TI Level-NC-NC-NC
JM38510/65708BFA ACTIVE CFP W 16 1 TBD Call TI Level-NC-NC-NC
JM38510/65709BEA ACTIVE CDIP J 16 1 TBD Call TI Level-NC-NC-NC
JM38510/65709BEA ACTIVE CDIP J 16 1 TBD Call TI Level-NC-NC-NC
SN54HC365J ACTIVE CDIP J 16 1 TBD Call TI Level-NC-NC-NC
SN54HC365J ACTIVE CDIP J 16 1 TBD Call TI Level-NC-NC-NC
SN54HC366J ACTIVE CDIP J 16 1 TBD Call TI Level-NC-NC-NC
SN54HC366J ACTIVE CDIP J 16 1 TBD Call TI Level-NC-NC-NC
SN54HC367J ACTIVE CDIP J 16 1 TBD Call TI Level-NC-NC-NC
SN54HC367J ACTIVE CDIP J 16 1 TBD Call TI Level-NC-NC-NC
SN54HC368J ACTIVE CDIP J 16 1 TBD Call TI Level-NC-NC-NC
SN54HC368J ACTIVE CDIP J 16 1 TBD Call TI Level-NC-NC-NC
SN74HC365D ACTIVE SOIC D 16 40 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74HC365D ACTIVE SOIC D 16 40 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74HC365DE4 ACTIVE SOIC D 16 40 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74HC365DE4 ACTIVE SOIC D 16 40 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74HC365DR ACTIVE SOIC D 16 2500 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74HC365DR ACTIVE SOIC D 16 2500 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74HC365DRE4 ACTIVE SOIC D 16 2500 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
PACKAGE OPTION ADDENDUM
www.ti.com 26-Sep-2005
Addendum-Page 1
Orderable Device Status (1) Package
Type Package
Drawing Pins Package
Qty Eco Plan (2) Lead/Ball Finish MSL Peak Temp (3)
no Sb/Br)
SN74HC365DRE4 ACTIVE SOIC D 16 2500 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74HC365DT ACTIVE SOIC D 16 250 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74HC365DT ACTIVE SOIC D 16 250 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74HC365DTE4 ACTIVE SOIC D 16 250 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74HC365DTE4 ACTIVE SOIC D 16 250 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74HC365N ACTIVE PDIP N 16 25 Pb-Free
(RoHS) CU NIPDAU Level-NC-NC-NC
SN74HC365N ACTIVE PDIP N 16 25 Pb-Free
(RoHS) CU NIPDAU Level-NC-NC-NC
SN74HC365NSR ACTIVE SO NS 16 2000 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74HC365NSR ACTIVE SO NS 16 2000 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74HC365NSRE4 ACTIVE SO NS 16 2000 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74HC365NSRE4 ACTIVE SO NS 16 2000 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74HC365PW ACTIVE TSSOP PW 16 90 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74HC365PW ACTIVE TSSOP PW 16 90 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74HC365PWE4 ACTIVE TSSOP PW 16 90 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74HC365PWE4 ACTIVE TSSOP PW 16 90 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74HC365PWR ACTIVE TSSOP PW 16 2000 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74HC365PWR ACTIVE TSSOP PW 16 2000 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74HC365PWRE4 ACTIVE TSSOP PW 16 2000 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74HC365PWRE4 ACTIVE TSSOP PW 16 2000 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74HC365PWT ACTIVE TSSOP PW 16 250 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74HC365PWT ACTIVE TSSOP PW 16 250 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74HC365PWTE4 ACTIVE TSSOP PW 16 250 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74HC365PWTE4 ACTIVE TSSOP PW 16 250 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74HC367D ACTIVE SOIC D 16 40 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74HC367D ACTIVE SOIC D 16 40 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
PACKAGE OPTION ADDENDUM
www.ti.com 26-Sep-2005
Addendum-Page 2
Orderable Device Status (1) Package
Type Package
Drawing Pins Package
Qty Eco Plan (2) Lead/Ball Finish MSL Peak Temp (3)
SN74HC367DE4 ACTIVE SOIC D 16 40 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74HC367DE4 ACTIVE SOIC D 16 40 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74HC367DR ACTIVE SOIC D 16 2500 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74HC367DR ACTIVE SOIC D 16 2500 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74HC367DRE4 ACTIVE SOIC D 16 2500 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74HC367DRE4 ACTIVE SOIC D 16 2500 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74HC367DT ACTIVE SOIC D 16 250 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74HC367DT ACTIVE SOIC D 16 250 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74HC367DTE4 ACTIVE SOIC D 16 250 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74HC367DTE4 ACTIVE SOIC D 16 250 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74HC367N ACTIVE PDIP N 16 25 Pb-Free
(RoHS) CU NIPDAU Level-NC-NC-NC
SN74HC367N ACTIVE PDIP N 16 25 Pb-Free
(RoHS) CU NIPDAU Level-NC-NC-NC
SN74HC367NE4 ACTIVE PDIP N 16 25 Pb-Free
(RoHS) CU NIPDAU Level-NC-NC-NC
SN74HC367NE4 ACTIVE PDIP N 16 25 Pb-Free
(RoHS) CU NIPDAU Level-NC-NC-NC
SN74HC367NSR ACTIVE SO NS 16 2000 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74HC367NSR ACTIVE SO NS 16 2000 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74HC367NSRE4 ACTIVE SO NS 16 2000 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74HC367NSRE4 ACTIVE SO NS 16 2000 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74HC367PW ACTIVE TSSOP PW 16 90 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74HC367PW ACTIVE TSSOP PW 16 90 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74HC367PWE4 ACTIVE TSSOP PW 16 90 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74HC367PWE4 ACTIVE TSSOP PW 16 90 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74HC367PWR ACTIVE TSSOP PW 16 2000 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74HC367PWR ACTIVE TSSOP PW 16 2000 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74HC367PWRE4 ACTIVE TSSOP PW 16 2000 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74HC367PWRE4 ACTIVE TSSOP PW 16 2000 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
PACKAGE OPTION ADDENDUM
www.ti.com 26-Sep-2005
Addendum-Page 3
Orderable Device Status (1) Package
Type Package
Drawing Pins Package
Qty Eco Plan (2) Lead/Ball Finish MSL Peak Temp (3)
SN74HC367PWT ACTIVE TSSOP PW 16 250 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74HC367PWT ACTIVE TSSOP PW 16 250 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74HC367PWTE4 ACTIVE TSSOP PW 16 250 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74HC367PWTE4 ACTIVE TSSOP PW 16 250 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74HC368D ACTIVE SOIC D 16 40 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74HC368D ACTIVE SOIC D 16 40 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74HC368DBR ACTIVE SSOP DB 16 2000 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74HC368DBR ACTIVE SSOP DB 16 2000 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74HC368DBRE4 ACTIVE SSOP DB 16 2000 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74HC368DBRE4 ACTIVE SSOP DB 16 2000 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74HC368DE4 ACTIVE SOIC D 16 40 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74HC368DE4 ACTIVE SOIC D 16 40 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74HC368DR ACTIVE SOIC D 16 2500 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74HC368DR ACTIVE SOIC D 16 2500 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74HC368DRE4 ACTIVE SOIC D 16 2500 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74HC368DRE4 ACTIVE SOIC D 16 2500 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74HC368DT ACTIVE SOIC D 16 250 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74HC368DT ACTIVE SOIC D 16 250 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74HC368DTE4 ACTIVE SOIC D 16 250 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74HC368DTE4 ACTIVE SOIC D 16 250 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74HC368N ACTIVE PDIP N 16 25 Pb-Free
(RoHS) CU NIPDAU Level-NC-NC-NC
SN74HC368N ACTIVE PDIP N 16 25 Pb-Free
(RoHS) CU NIPDAU Level-NC-NC-NC
SN74HC368NE4 ACTIVE PDIP N 16 25 Pb-Free
(RoHS) CU NIPDAU Level-NC-NC-NC
SN74HC368NE4 ACTIVE PDIP N 16 25 Pb-Free
(RoHS) CU NIPDAU Level-NC-NC-NC
SN74HC368NSR ACTIVE SO NS 16 2000 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74HC368NSR ACTIVE SO NS 16 2000 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
PACKAGE OPTION ADDENDUM
www.ti.com 26-Sep-2005
Addendum-Page 4
Orderable Device Status (1) Package
Type Package
Drawing Pins Package
Qty Eco Plan (2) Lead/Ball Finish MSL Peak Temp (3)
SN74HC368NSRE4 ACTIVE SO NS 16 2000 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74HC368NSRE4 ACTIVE SO NS 16 2000 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74HC368PW ACTIVE TSSOP PW 16 90 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74HC368PW ACTIVE TSSOP PW 16 90 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74HC368PWE4 ACTIVE TSSOP PW 16 90 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74HC368PWE4 ACTIVE TSSOP PW 16 90 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74HC368PWR ACTIVE TSSOP PW 16 2000 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74HC368PWR ACTIVE TSSOP PW 16 2000 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74HC368PWRE4 ACTIVE TSSOP PW 16 2000 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74HC368PWRE4 ACTIVE TSSOP PW 16 2000 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74HC368PWT ACTIVE TSSOP PW 16 250 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74HC368PWT ACTIVE TSSOP PW 16 250 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74HC368PWTE4 ACTIVE TSSOP PW 16 250 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74HC368PWTE4 ACTIVE TSSOP PW 16 250 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SNJ54HC365FK ACTIVE LCCC FK 20 1 TBD Call TI Level-NC-NC-NC
SNJ54HC365FK ACTIVE LCCC FK 20 1 TBD Call TI Level-NC-NC-NC
SNJ54HC365J ACTIVE CDIP J 16 1 TBD Call TI Level-NC-NC-NC
SNJ54HC365J ACTIVE CDIP J 16 1 TBD Call TI Level-NC-NC-NC
SNJ54HC366FK OBSOLETE 20 TBD Call TI Call TI
SNJ54HC366FK OBSOLETE 20 TBD Call TI Call TI
SNJ54HC366J ACTIVE CDIP J 16 1 TBD Call TI Level-NC-NC-NC
SNJ54HC366J ACTIVE CDIP J 16 1 TBD Call TI Level-NC-NC-NC
SNJ54HC367FK ACTIVE LCCC FK 20 1 TBD Call TI Level-NC-NC-NC
SNJ54HC367FK ACTIVE LCCC FK 20 1 TBD Call TI Level-NC-NC-NC
SNJ54HC367J ACTIVE CDIP J 16 1 TBD Call TI Level-NC-NC-NC
SNJ54HC367J ACTIVE CDIP J 16 1 TBD Call TI Level-NC-NC-NC
SNJ54HC368FK ACTIVE LCCC FK 20 1 TBD Call TI Level-NC-NC-NC
SNJ54HC368FK ACTIVE LCCC FK 20 1 TBD Call TI Level-NC-NC-NC
SNJ54HC368J ACTIVE CDIP J 16 1 TBD Call TI Level-NC-NC-NC
SNJ54HC368J ACTIVE CDIP J 16 1 TBD Call TI Level-NC-NC-NC
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
PACKAGE OPTION ADDENDUM
www.ti.com 26-Sep-2005
Addendum-Page 5
a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS) or Green (RoHS & no Sb/Br) - please check
http://www.ti.com/productcontent for the latest availability information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)
(3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder
temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is
provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the
accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take
reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on
incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited
information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI
to Customer on an annual basis.
PACKAGE OPTION ADDENDUM
www.ti.com 26-Sep-2005
Addendum-Page 6
MECHANICAL DATA
MLCC006B – OCTOBER 1996
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
FK (S-CQCC-N**) LEADLESS CERAMIC CHIP CARRIER
4040140/D 10/96
28 TERMINAL SHOWN
B
0.358
(9,09)
MAX
(11,63)
0.560
(14,22)
0.560
0.458
0.858
(21,8)
1.063
(27,0)
(14,22)
A
NO. OF
MINMAX
0.358
0.660
0.761
0.458
0.342
(8,69)
MIN
(11,23)
(16,26)
0.640
0.739
0.442
(9,09)
(11,63)
(16,76)
0.962
1.165
(23,83)
0.938
(28,99)
1.141
(24,43)
(29,59)
(19,32)(18,78)
**
20
28
52
44
68
84
0.020 (0,51)
TERMINALS
0.080 (2,03)
0.064 (1,63)
(7,80)
0.307
(10,31)
0.406
(12,58)
0.495
(12,58)
0.495
(21,6)
0.850
(26,6)
1.047
0.045 (1,14)
0.045 (1,14)
0.035 (0,89)
0.035 (0,89)
0.010 (0,25)
12
1314151618 17
11
10
8
9
7
5
432
0.020 (0,51)
0.010 (0,25)
6
12826 27
19
21
B SQ
A SQ 22
23
24
25
20
0.055 (1,40)
0.045 (1,14)
0.028 (0,71)
0.022 (0,54)
0.050 (1,27)
NOTES: A. All linear dimensions are in inches (millimeters).
B. This drawing is subject to change without notice.
C. This package can be hermetically sealed with a metal lid.
D. The terminals are gold plated.
E. Falls within JEDEC MS-004
MECHANICAL DATA
MSSO002E – JANUARY 1995 – REVISED DECEMBER 2001
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
DB (R-PDSO-G**) PLASTIC SMALL-OUTLINE
4040065 /E 12/01
28 PINS SHOWN
Gage Plane
8,20
7,40
0,55
0,95
0,25
38
12,90
12,30
28
10,50
24
8,50
Seating Plane
9,907,90
30
10,50
9,90
0,38
5,60
5,00
15
0,22
14
A
28
1
2016
6,50
6,50
14
0,05 MIN
5,905,90
DIM
A MAX
A MIN
PINS **
2,00 MAX
6,90
7,50
0,65 M
0,15
0°–ā8°
0,10
0,09
0,25
NOTES: A. All linear dimensions are in millimeters.
B. This drawing is subject to change without notice.
C. Body dimensions do not include mold flash or protrusion not to exceed 0,15.
D. Falls within JEDEC MO-150
MECHANICAL DATA
MTSS001C – JANUARY 1995 – REVISED FEBRUARY 1999
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
PW (R-PDSO-G**) PLASTIC SMALL-OUTLINE PACKAGE
14 PINS SHOWN
0,65 M
0,10
0,10
0,25
0,50
0,75
0,15 NOM
Gage Plane
28
9,80
9,60
24
7,90
7,70
2016
6,60
6,40
4040064/F 01/97
0,30
6,60
6,20
80,19
4,30
4,50
7
0,15
14
A
1
1,20 MAX
14
5,10
4,90
8
3,10
2,90
A MAX
A MIN
DIM PINS **
0,05
4,90
5,10
Seating Plane
0°–8°
NOTES: A. All linear dimensions are in millimeters.
B. This drawing is subject to change without notice.
C. Body dimensions do not include mold flash or protrusion not to exceed 0,15.
D. Falls within JEDEC MO-153
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solutions:
Products Applications
Amplifiers amplifier.ti.com Audio www.ti.com/audio
Data Converters dataconverter.ti.com Automotive www.ti.com/automotive
DSP dsp.ti.com Broadband www.ti.com/broadband
Interface interface.ti.com Digital Control www.ti.com/digitalcontrol
Logic logic.ti.com Military www.ti.com/military
Power Mgmt power.ti.com Optical Networking www.ti.com/opticalnetwork
Microcontrollers microcontroller.ti.com Security www.ti.com/security
Telephony www.ti.com/telephony
Video & Imaging www.ti.com/video
Wireless www.ti.com/wireless
Mailing Address: Texas Instruments
Post Office Box 655303 Dallas, Texas 75265
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