S32K1XX
S32K1xx Data Sheet
Notes
• Technical information for the S32K116 and S32K118
device families is preliminary until these devices
achieve qualification.
• Following two are the available attachments with
Datasheet:
– S32K1xx_Orderable_Part_Number_ List.xlsx
– S32K1xx_Power_Modes_Configuration.xlsx
Key Features
• Operating characteristics
– Voltage range: 2.7 V to 5.5 V
– Ambient temperature range: -40 °C to 105 °C for
HSRUN mode, -40 °C to 125 °C for RUN mode
• Arm™ Cortex-M4F/M0+ core, 32-bit CPU
– Supports up to 112 MHz frequency (HSRUN mode)
with 1.25 Dhrystone MIPS per MHz
– Arm Core based on the Armv7 Architecture and
Thumb®-2 ISA
– Integrated Digital Signal Processor (DSP)
– Configurable Nested Vectored Interrupt Controller
(NVIC)
– Single Precision Floating Point Unit (FPU)
• Clock interfaces
– 4 - 40 MHz fast external oscillator (SOSC)
– 48 MHz Fast Internal RC oscillator (FIRC)
– 8 MHz Slow Internal RC oscillator (SIRC)
– 128 kHz Low Power Oscillator (LPO)
– Up to 112 MHz (HSRUN) System Phased Lock
Loop (SPLL)
– Up to 50 MHz DC external square wave input clock
– Real Time Counter (RTC)
• Power management
– Low-power Arm Cortex-M4F/M0+ core with
excellent energy efficiency
– Power Management Controller (PMC) with multiple
power modes: HSRUN, RUN, STOP, VLPR, and
VLPS. Note: CSEc (Security) or EEPROM writes/
erase will trigger error flags in HSRUN mode (112
MHz) because this use case is not allowed to
execute simultaneously. The device will need to
switch to RUN mode (80 Mhz) to execute CSEc
(Security) or EEPROM writes/erase.
– Clock gating and low power operation supported on
specific peripherals.
• Memory and memory interfaces
– Up to 2 MB program flash memory with ECC
– 64 KB FlexNVM for data flash memory with ECC
and EEPROM emulation. Note: CSEc (Security) or
EEPROM writes/erase will trigger error flags in
HSRUN mode (112 MHz) because this use case is
not allowed to execute simultaneously. The device
will need to switch to RUN mode (80 MHz) to
execute CSEc (Security) or EEPROM writes/erase.
– Up to 256 KB SRAM with ECC
– Up to 4 KB of FlexRAM for use as SRAM or
EEPROM emulation
– Up to 4 KB Code cache to minimize performance
impact of memory access latencies
– QuadSPI with HyperBus™ support
• Mixed-signal analog
– Up to two 12-bit Analog-to-Digital Converter
(ADC) with up to 32 channel analog inputs per
module
– One Analog Comparator (CMP) with internal 8-bit
Digital to Analog Converter (DAC)
• Debug functionality
– Serial Wire JTAG Debug Port (SWJ-DP) combines
– Debug Watchpoint and Trace (DWT)
– Instrumentation Trace Macrocell (ITM)
– Test Port Interface Unit (TPIU)
– Flash Patch and Breakpoint (FPB) Unit
• Human-machine interface (HMI)
– Up to 156 GPIO pins with interrupt functionality
– Non-Maskable Interrupt (NMI)
NXP Semiconductors Document Number S32K1XX
Data Sheet: Advance Information Rev. 7, 04/2018
This document contains information on a pre-production product. Specifications
and pre-production information herein are subject to change without notice.
• Communications interfaces
– Up to three Low Power Universal Asynchronous Receiver/Transmitter (LPUART/LIN) modules with DMA support
and low power availability
– Up to three Low Power Serial Peripheral Interface (LPSPI) modules with DMA support and low power availability
– Up to two Low Power Inter-Integrated Circuit (LPI2C) modules with DMA support and low power availability
– Up to three FlexCAN modules (with optional CAN-FD support)
– FlexIO module for emulation of communication protocols and peripherals (UART, I2C, SPI, I2S, LIN, PWM, etc).
– Up to one 10/100Mbps Ethernet with IEEE1588 support and two Synchronous Audio Interface (SAI) modules.
• Safety and Security
– Cryptographic Services Engine (CSEc) implements a comprehensive set of cryptographic functions as described in the
SHE (Secure Hardware Extension) Functional Specification. Note: CSEc (Security) or EEPROM writes/erase will
trigger error flags in HSRUN mode (112 MHz) because this use case is not allowed to execute simultaneously. The
device will need to switch to RUN mode (80 MHz) to execute CSEc (Security) or EEPROM writes/erase.
– 128-bit Unique Identification (ID) number
– Error-Correcting Code (ECC) on flash and SRAM memories
– System Memory Protection Unit (System MPU)
– Cyclic Redundancy Check (CRC) module
– Internal watchdog (WDOG)
– External Watchdog monitor (EWM) module
• Timing and control
– Up to eight independent 16-bit FlexTimers (FTM) modules, offering up to 64 standard channels (IC/OC/PWM)
– One 16-bit Low Power Timer (LPTMR) with flexible wake up control
– Two Programmable Delay Blocks (PDB) with flexible trigger system
– One 32-bit Low Power Interrupt Timer (LPIT) with 4 channels
– 32-bit Real Time Counter (RTC)
• Package
– 32-pin QFN, 48-pin LQFP, 64-pin LQFP, 100-pin LQFP, 100-pin MAPBGA, 144-pin LQFP, 176-pin LQFP package
options
• 16 channel DMA with up to 63 request sources using DMAMUX
S32K1xx Data Sheet, Rev. 7, 04/2018
2 NXP Semiconductors
Table of Contents
1 Block diagram.................................................................................... 4
2 Feature comparison............................................................................ 5
3 Ordering information......................................................................... 7
3.1 Selecting orderable part number ...............................................7
3.2 Ordering information ................................................................8
4 General............................................................................................... 9
4.1 Absolute maximum ratings........................................................9
4.2 Voltage and current operating requirements..............................10
4.3 Thermal operating characteristics..............................................11
4.4 Power and ground pins.............................................................. 12
4.5 LVR, LVD and POR operating requirements............................14
4.6 Power mode transition operating behaviors.............................. 15
4.7 Power consumption................................................................... 16
4.8 ESD handling ratings.................................................................20
4.9 EMC radiated emissions operating behaviors........................... 20
5 I/O parameters....................................................................................21
5.1 AC electrical characteristics...................................................... 21
5.2 General AC specifications......................................................... 21
5.3 DC electrical specifications at 3.3 V Range.............................. 22
5.4 DC electrical specifications at 5.0 V Range.............................. 23
5.5 AC electrical specifications at 3.3 V range .............................. 24
5.6 AC electrical specifications at 5 V range ................................. 24
5.7 Standard input pin capacitance.................................................. 25
5.8 Device clock specifications....................................................... 25
6 Peripheral operating requirements and behaviors..............................26
6.1 System modules.........................................................................26
6.2 Clock interface modules............................................................ 26
6.2.1 External System Oscillator electrical specifications....26
6.2.2 External System Oscillator frequency specifications . 28
6.2.3 System Clock Generation (SCG) specifications..........30
6.2.3.1 Fast internal RC Oscillator (FIRC)
electrical specifications............................ 30
6.2.3.2 Slow internal RC oscillator (SIRC)
electrical specifications ........................... 30
6.2.4 Low Power Oscillator (LPO) electrical specifications
......................................................................................31
6.2.5 SPLL electrical specifications .....................................31
6.3 Memory and memory interfaces................................................31
6.3.1 Flash memory module (FTFC) electrical
specifications................................................................31
6.3.1.1 Flash timing specifications —
commands................................................ 31
6.3.1.2 Reliability specifications..........................36
6.3.2 QuadSPI AC specifications..........................................37
6.4 Analog modules.........................................................................41
6.4.1 ADC electrical specifications...................................... 41
6.4.1.1 12-bit ADC operating conditions.............41
6.4.1.2 12-bit ADC electrical characteristics....... 43
6.4.2 CMP with 8-bit DAC electrical specifications............ 45
6.5 Communication modules...........................................................49
6.5.1 LPUART electrical specifications............................... 49
6.5.2 LPSPI electrical specifications.................................... 49
6.5.3 LPI2C electrical specifications.................................... 55
6.5.4 FlexCAN electical specifications.................................56
6.5.5 SAI electrical specifications........................................ 56
6.5.6 Ethernet AC specifications.......................................... 58
6.5.7 Clockout frequency......................................................61
6.6 Debug modules.......................................................................... 61
6.6.1 SWD electrical specofications .................................... 61
6.6.2 Trace electrical specifications......................................63
6.6.3 JTAG electrical specifications..................................... 64
7 Thermal attributes.............................................................................. 67
7.1 Description.................................................................................67
7.2 Thermal characteristics..............................................................67
7.3 General notes for specifications at maximum junction
temperature................................................................................ 72
8 Dimensions.........................................................................................73
8.1 Obtaining package dimensions .................................................73
9 Pinouts................................................................................................74
9.1 Package pinouts and signal descriptions....................................74
10 Revision History.................................................................................74
S32K1xx Data Sheet, Rev. 7, 04/2018
NXP Semiconductors 3
1 Block diagram
Following figures show superset high level architecture block diagrams of S32K14x
series and S32K11x series respectively. Other devices within the family have a subset of
the features. See Feature comparison for chip specific values.
Mux
Trace
port
Crossbar switch (AXBS-Lite)
eDMA
DMA
MUX
Core
Peripheral bus controller
CRC
WDOG
S1
M0 M1
DSP
NVIC
ITM
FPB
DWT
AWIC
SWJ-DP
TPIU
JTAG &
Serial Wire
Arm Cortex M4F
ICODE
DCODE
AHB-AP
PPB
System
M2
S2
GPIO
Mux
FPU Clock
SPLL
LPO
128 kHz
Async
512B
TCD
LPIT
LPI2C FlexIO
Flash memory
controller
Code flash
S0
Data flash
Low Power
Timer
12-bit ADC
TRGMUX
LPUART
LPSPI
FlexCAN FlexTimer
PDB
generation
LPIT
Peripherals present
on all S32K devices
Peripherals present
on selected S32K devices
Key:
Device architectural IP
on all S32K devices
S3
FIRC
48 MHz
M3
ENET
SAI
SOSC
8-40 MHz
(see the "Feature Comparison"
memory memory
4-40 MHz
QuadSPI
RTC
CMP
8-bit DAC
SIRC
8 MHz
FlexRAM/
SRAM
1: On this device, NXP’s system MPU implements the safety mechanisms to prevent masters from
accessing restricted memory regions. This system MPU provides memory protection at the
level of the Crossbar Switch. Each Crossbar master (Core, DMA, Ethernet) can be assigned
different access rights to each protected memory region. The Arm M4 core version in this family
does not integrate the Arm Core MPU, which would concurrently monitor only core-initiated memory
accesses. In this document, the term MPU refers to NXP’s system MPU.
2: For the device-specific sizes, see the "On-chip SRAM sizes" table in the "Memories and Memory Interfaces"
chapter of the S32K1xx Series Reference Manual.
section)
ERM
EWM
MCM
Lower region
Upper region
Main SRAM2
Code Cache
System MPU1
EIM
LMEM
controller
LMEM
QSPI
CSEc3
System MPU1System MPU1System MPU1
3: CSEc (Security) or EEPROM writes/erase will trigger error flags in HSRUN mode (112 MHz) because this
use case is not allowed to execute simultaneously. The device need to switch to RUN mode (80 MHz) to
execute CSEc (Security) or EEPROM writes/erase.
Figure 1. High-level architecture diagram for the S32K14x family
Block diagram
S32K1xx Data Sheet, Rev. 7, 04/2018
4 NXP Semiconductors
Crossbar switch (AXBS-Lite)
eDMA
DMA
MUX
SW-DP
Unified Bus
Serial Wire
AHBLite
AHBLite
AWIC
S0 S1
Clock
LPO
128 kHz
generation
FIRC
48 MHz
SOSC
4-40 MHz
SIRC
8 MHz
Peripheral bus controller
CRC
WDOG
LPIT
LPI2C FlexIO Low Power
Timer
12-bit ADC
TRGMUX
LPUART
LPSPI
FlexCAN FlexTimer
PDB
LPIT
RTC
CMP
8-bit DAC
ERM
CMU GPIO
M0 M2
Flash memory
controller
Data flash
memory
FlexRAM/
SRAM2
Code flash
memory
EIM
SRAM2
IO PORT
NVIC
PPB
MTB+DWT
BPU
AHB-AP
Arm Cortex M0+
Peripherals present
on all S32K devices
Peripherals present
on selected S32K devices
Key:
Device architectural IP
on all S32K devices
(see the "Feature Comparison"
1: On this device, NXP’s system MPU implements the safety mechanisms to prevent masters from
accessing restricted memory regions. This system MPU provides memory protection at the
level of the Crossbar Switch. Crossbar master (Core, DMA) can be assigned
different access rights to each protected memory region. The Arm M0+ core version in this family
does not integrate the Arm Core MPU, which would concurrently monitor only core-initiated memory
accesses. In this document, the term MPU refers to NXP’s system MPU.
2: For the device-specific sizes, see the "On-chip SRAM sizes" table in the "Memories and Memory Interfaces"
chapter of the S32K1xx Series Reference Manual.
section)
S2
IO PORT
CSEc
System MPU1System MPU1
Figure 2. High-level architecture diagram for the S32K11x family
2Feature comparison
The following figure summarizes the memory, peripherals and packaging options for the
S32K1xx devices. All devices which share a common package are pin-to-pin compatible.
Feature comparison
S32K1xx Data Sheet, Rev. 7, 04/2018
NXP Semiconductors 5
2 KB (up to 32 KB D-Flash)
EEPROM emulated by FlexRAM1
2 KB
FlexRAM (also available as system RAM)
Cache
25 KB
System RAM (including FlexRAM and MTB) 17 KB
Flash 128 KB 256 KB
2.7 - 5.5 V
Single supply voltage
HSRUN mode1
Watchdog 1x
Number of I/Os up to 43 up to 58
Memory Protection Unit (MPU)
K116 K118
Parameter
Peripheral speed
CRC module
IEEE-754 FPU
Arm® Cortex™-M0+
Core
1x
External Watchdog Monitor (EWM)
DMA
Crossbar
capable up to ASIL-B
ISO 26262
Cryptographic Services Engine (CSEc)1
48 MHz
Frequency
up to 48 MHz
Error Correcting Code (ECC)
1x
Low Power Timer (LPTMR)
1x
Low Power Interrupt Timer (LPIT)
LEGEND:
Not implemented
Available on the device
1 No write or erase access to Flash module, including Security (CSEc) and EEPROM commands, are allowed when
device is running at HSRUN mode (112MHz) or VLPR mode.
2 Available when EEEPROM, CSEc and Data Flash are not used. Else only up to 1,984 KB is available for Program Flash.
3 4 KB (up to 512 KB D-Flash as a part of 2 MB Flash). Up to 64 KB of flash is used as EEPROM backup and the remaining 448 KB
of the last 512 KB block can be used as Data flash or Program flash. See chapter FTFC for details.
4 Only for Boundary Scan Register
5 See Dimensions section for package drawings
Trigger mux (TRGMUX)
1x
Real Time Counter (RTC)
FlexTimer (16-bit counter) 8 channels 2x (16)
External memory interface
1x (16)
2x
1x
10/100 Mbps IEEE-1588 Ethernet MAC
12-bit SAR ADC (1 Msps each)
1x
FlexIO (8 pins configurable as UART, SPI, I2C, I2S)
Low Power I2C (LPI2C)
Low Power UART/LIN (LPUART)
(Supports LIN protocol versions 1.3, 2.0, 2.1, 2.2A, and SAE J2602)
SWD, MTB (1 KB), JTAG4
Debug & trace
NXP S32 Design Studio (GCC) + SDK,
IAR, GHS, Arm®, Lauterbach, iSystems
48-pin LQFP
64-pin LQFP
Packages5
Ecosystem
(IDE, compiler, debugger)
32-pin QFN
48-pin LQFP
FlexCAN
(CAN-FD ISO/CD 11898-1) 1x
(1x with FD)
1x 2x
Low Power SPI (LPSPI)
Serial Audio Interface (AC97, TDM, I2S)
Comparator with 8-bit DAC 1x
Programmable Delay Block (PDB) 1x
S32K11x S32K14x
K142 K144 K146 K148
1x
SWD, JTAG (ITM, SWV, SWO)
NXP S32 Design Studio (GCC) + SDK,
IAR, GHS, Arm®, Lauterbach, iSystems
64-pin LQFP
100-pin LQFP
64-pin LQFP
100-pin LQFP
100-pin MAPBGA
64-pin LQFP
100-pin MAPBGA
100-pin LQFP
144-pin LQFP
100-pin MAPBGA
144-pin LQFP
176-pin LQFP
SWD, JTAG
(ITM, SWV,
SWO), ETM
1x (64)
2x (16) 2x (24) 2x (32)
1x
2x 3x
1x 2x
2x
(1x with FD) 3x
(2x with FD) 3x
(3x with FD)
3x
(1x with FD)
2x 3x
2x
1x
1x (73) 1x (81)
80 MHz (RUN mode) or 112 MHz (HSRUN mode)1
1x
Arm® Cortex™-M4F
1x
capable up to ASIL-B
up to 112 MHz (HSRUN)
4 KB (up to 64 KB D-Flash)
4 KB
4 KB
32 KB 48/64 KB 96/128 KB 192/256 KB
-40oC to +85oC / +105oC / +125oC
256 KB 512 KB 1 MB 2 MB2
2.7 - 5.5 V
up to 89 up to 128 up to 156
1x
1x
1x
4x (32) 6x (48) 8x (64)
QuadSPI incl.
HyperBus™
2x
See footnote 3
MemoryAnalog Timer
Communication
IDEs
Other System
-40oC to +85oC / +105oC / +125oC
Ambient Operation Temperature (Ta)
1x (43) 1x (45)
1x (13)
FIRC CMU
Low power modes
Figure 3. S32K1xx product series comparison
Feature comparison
S32K1xx Data Sheet, Rev. 7, 04/2018
6 NXP Semiconductors
Ordering information
3.1 Selecting orderable part number
Not all part number combinations are available. See the attachment
S32K1xx_Orderable_Part_Number_ List.xlsx attached with the Datasheet for a list of
standard orderable part numbers.
3
Ordering information
S32K1xx Data Sheet, Rev. 7, 04/2018
NXP Semiconductors 7
3.2 Ordering information
F/P S32 K 1 0 0 X Y T0 M LH R
Product status
Product type/brand
Product line
Series/Family
(including generation)
Core platform/
Performance
Memory size
Ordering option 1: Letter
Ordering option 2: Letter
Wafer Fab and
revision
Temperature
Package
Tape and Reel
Product status
P: Prototype
F: Qualified
Product type/brand
S32: Automotive 32-bit MCU
Product line
K: Arm Cortex MCUs
Series/Family
1: 1st product series
2: 2nd product series
Core platform/Performance
1: Arm Cortex M0+
4: Arm Cortex M4F
Memory size
S32K11x
2468
S32K14x 256K 512K
128K
1M
256K
2M
Ordering option
X: Speed
B: 48 MHz without DMA (S32K11x only)
L: 48 MHz with DMA (S32K11x only)
H: 80 MHz
U1: 112 MHz (Not valid with M temperature/125C)
Y: Optional feature
R: Max. RAM
F: CAN FD, FlexIO, max. RAM
A1: CAN FD, FlexIO, Security, max. RAM
E: Ethernet, Audio, max. RAM (S32K148 only)
J1: CAN FD, FlexIO, Security, Ethernet,
Audio, max. RAM (S32K148 only)
Wafer, Fab and revision
Fx: ATMC2
Tx: GF
XX: Flex #2
x0: 1st revision
Temperature
V: -40C to 105C
M: -40C to 125C
W: -40C to 150C2
Tape and Reel
T: Trays/Tubes
R: Tape and Reel
Package
LQFP
32 FM
Pins QFN BGA
48
64
100
144
176
LL
LF
LH
LQ
LU
MH
-
-
-
-
-
-
-
-
-
-
-
1. CSEc (Security) or EEPROM writes/erase will trigger error flags in HSRUN mode (112 MHz) because this use case is not allowed to
execute simultaneously. The device will need to switch to RUN mode (80 MHz) to execute CSEc (Security) or EEPROM writes/erase.
2. Not supported yet
3. Part numbers no longer offered as standard include:
Ordering Option X (M:64MHz); Ordering Option Y (N: no optional features; S: Security, max. RAM); Temperature (C: -40C to 85C)
NOTE
Not all part number combinations are available. See S32K1xx_Orderable_Part_Number_List.xlsx
attached with the Datasheet for list of standard orderable parts.
Figure 4. Ordering information
Ordering information
S32K1xx Data Sheet, Rev. 7, 04/2018
8 NXP Semiconductors
General
4.1 Absolute maximum ratings
NOTE
• Functional operating conditions appear in the DC electrical
characteristics. Absolute maximum ratings are stress
ratings only, and functional operation at the maximum
values is not guaranteed. See footnotes in the following
table for specific conditions.
• Stress beyond the listed maximum values may affect device
reliability or cause permanent damage to the device.
• All the limits defined in the datasheet specification must be
honored together and any violation to any one or more will
not guarantee desired operation.
• Unless otherwise specified, all maximum and minimum
values in the datasheet are across process, voltage, and
temperature.
Table 1. Absolute maximum ratings
Symbol Parameter Conditions1Min Max Unit
VDD22.7 V - 5. 5V input supply voltage — -0.3 5.8 3V
VREFH 3.3 V / 5.0 V ADC high reference voltage — -0.3 5.8 3V
IINJPAD_DC_ABS4Continuous DC input current (positive /
negative) that can be injected into an I/O
pin
— -3 +3 mA
VIN_DC Continuous DC Voltage on any I/O pin
with respect to VSS
— -0.8 5.85V
IINJSUM_DC_ABS Sum of absolute value of injected currents
on all the pins (Continuous DC limit)
— — 30 mA
Tramp6ECU supply ramp rate — 0.5 V/min 500 V/ms —
Tramp_MCU7MCU supply ramp rate — 0.5 V/min 100 V/ms —
TA8Ambient temperature — -40 125 °C
TSTG Storage temperature — -55 165 °C
VIN_TRANSIENT Transient overshoot voltage allowed on
I/O pin beyond VIN_DC limit
— — 6.8 9V
1. All voltages are referred to VSS unless otherwise specified.
2. As VDD varies between the minimum value and the absolute maximum value the analog characteristics of the I/O and the
ADC will both change. See section I/O parameters and ADC electrical specifications respectively for details.
3. 60 s lifetime – No restrictions i.e. The part can switch.
10 hours lifetime – Device in reset i.e. The part cannot switch.
4
General
S32K1xx Data Sheet, Rev. 7, 04/2018
NXP Semiconductors 9
4. When input pad voltage levels are close to VDD or VSS, practically no current injection is possible.
5. While respecting the maximum current injection limit
6. This is the Electronic Control Unit (ECU) supply ramp rate and not directly the MCU ramp rate. Limit applies to both
maximum absolute maximum ramp rate and typical operating conditions.
7. This is the MCU supply ramp rate and the ramp rate assumes that the S32K1xx HW design guidelines in AN5426 are
followed. Limit applies to both maximum absolute maximum ramp rate and typical operating conditions.
8. TJ (Junction temperature)=135 °C. Assumes TA=125 °C for RUN mode
TJ (Junction temperature)=125 °C. Assumes TA=105 °C for HSRUN mode
• Assumes maximum θJA for 2s2p board. See Thermal characteristics
9. 60 seconds lifetime; device in reset (no outputs enabled/toggling)
4.2 Voltage and current operating requirements
NOTE
Device functionality is guaranteed up to the LVR assert level,
however electrical performance of 12-bit ADC, CMP with 8-bit
DAC, IO electrical characteristics, and communication modules
electrical characteristics would be degraded when voltage drops
below 2.7 V
Table 2. Voltage and current operating requirements 1
Symbol Description Min. Max. Unit Notes
VDD2Supply voltage 2.735.5 V 4
VDD_OFF Voltage allowed to be developed on VDD
pin when it is not powered from any
external power supply source.
0 0.1 V
VDDA Analog supply voltage 2.7 5.5 V 4
VDD – VDDA VDD-to-VDDA differential voltage – 0.1 0.1 V 4
VREFH ADC reference voltage high 2.7 VDDA + 0.1 V 5
VREFL ADC reference voltage low -0.1 0.1 V
VODPU Open drain pullup voltage level VDD VDD V6
IINJPAD_DC_OP7Continuous DC input current (positive /
negative) that can be injected into an I/O
pin
-3 +3 mA
IINJSUM_DC_OP Continuous total DC input current that can
be injected across all I/O pins such that
there's no degradation in accuracy of
analog modules: ADC and ACMP (See
section Analog Modules)
— 30 mA
1. Typical conditions assumes VDD = VDDA = VREFH = 5 V, temperature = 25 °C and typical silicon process unless otherwise
stated.
2. As VDD varies between the minimum value and the absolute maximum value the analog characteristics of the I/O and the
ADC will both change. See section I/O parameters and ADC electrical specifications respectively for details.
3. S32K148 will operate from 2.7 V when executing from internal FIRC. When the PLL is engaged S32K148 is guaranteed to
operate from 2.97 V. All other S32K family devices operate from 2.7 V in all modes.
4. VDD and VDDA must be shorted to a common source on PCB. The differential voltage between VDD and VDDA is for RF-AC
only. Appropriate decoupling capacitors to be used to filter noise on the supplies. See application note AN5032 for
reference supply design for SAR ADC.
General
S32K1xx Data Sheet, Rev. 7, 04/2018
10 NXP Semiconductors
5. VREFH should always be equal to or less than VDDA + 0.1 V and VDD + 0.1 V
6. Open drain outputs must be pulled to VDD.
7. When input pad voltage levels are close to VDD or VSS, practically no current injection is possible.
4.3 Thermal operating characteristics
Table 3. Thermal operating characteristics for 64 LQFP, 100 LQFP, and 100 MAP-BGA
packages.
Symbol Parameter Value Unit
Min. Typ. Max.
TA C-Grade Part Ambient temperature under bias −40 — 851℃
TJ C-Grade Part Junction temperature under bias −40 — 1051℃
TA V-Grade Part Ambient temperature under bias −40 — 1051℃
TJ V-Grade Part Junction temperature under bias −40 — 1251℃
TA M-Grade Part Ambient temperature under bias −40 — 1252℃
TJ M-Grade Part Junction temperature under bias −40 — 1352℃
1. Values mentioned are measured at ≤ 112 MHz in HSRUN mode.
2. Values mentioned are measured at ≤ 80 MHz in RUN mode.
General
S32K1xx Data Sheet, Rev. 7, 04/2018
NXP Semiconductors 11
4.4 Power and ground pins
VDD
VDDA
VREFH
VREFL
VSSA/VSS
VDD
VSS
VDD
VSS
100 LQFP
Package
VDD
VSS
VREFH/VDDA/VDD
VREFL/VSSA/VSS
32 QFN
Package
CDEC
CREF
CREF
CDEC
CDEC
VSS
VDD
CDEC
CDEC
CDEC
VSS
VDD
144 LQFP
Package
VDD
VSS
CDEC
CDEC
VDD
VSS
VDD
VSS
VSS
VDD
176 LQFP
Package
CDEC
CDEC
CDEC
VDD
VSS
CDEC
VSS
VDD
CDEC
VDD
VSS
CDEC
VDD
VSS
CDEC
VSS
VDD
CDEC
VDD
VDDA
VREFH
VREFL
VSS
CDEC
CREF
CDEC
VDD
VSS
CDEC
VSSA/VSS
VDD
VDDA
VREFH
VREFL
VSS
CDEC
CREF
CDEC
VDD
VSS
CDEC
VSSA/VSS
VDD
VSS
VDDA
VREFH
VREFL/VSSA/VSS
64 LQFP
Package
CREF
CDEC
CDEC
VDD
CDEC
VDD
VSS
VREFH/VDDA
VREFL/VSSA/VSS
48 LQFP
Package
CREF
CDEC
VDD
CDEC
NOTE: VDD and VDDA must be shorted to a common source on PCB
Figure 5. Pinout decoupling
General
S32K1xx Data Sheet, Rev. 7, 04/2018
12 NXP Semiconductors
Table 4. Supplies decoupling capacitors 1, 2
Symbol Description Min. 3Typ. Max. Unit
CREF, 4, 5ADC reference high decoupling capacitance 70 100 — nF
CDEC5, 6, 7Recommended decoupling capacitance 70 100 — nF
1. VDD and VDDA must be shorted to a common source on PCB. The differential voltage between VDD and VDDA is for RF-AC
only. Appropriate decoupling capacitors to be used to filter noise on the supplies. See application note AN5032 for
reference supply design for SAR ADC. All VSS pins should be connected to common ground at the PCB level.
2. All decoupling capacitors must be low ESR ceramic capacitors (for example X7R type).
3. Minimum recommendation is after considering component aging and tolerance.
4. For improved performance, it is recommended to use 10 μF, 0.1 μF and 1 nF capacitors in parallel.
5. All decoupling capacitors should be placed as close as possible to the corresponding supply and ground pins.
6. Contact your local Field Applications Engineer for details on best analog routing practices.
7. The filtering used for decoupling the device supplies must comply with the following best practices rules:
• The protection/decoupling capacitors must be on the path of the trace connected to that component.
• No trace exceeding 1 mm from the protection to the trace or to the ground.
• The protection/decoupling capacitors must be as close as possible to the input pin of the device (maximum 2 mm).
• The ground of the protection is connected as short as possible to the ground plane under the integrated circuit.
General
S32K1xx Data Sheet, Rev. 7, 04/2018
NXP Semiconductors 13
PMC
VDD
VFlash = 3.6 V nominal
VCORE = 1.2 V/1.4 V nominal
System RAM
TCD RAM
I/D Cache
EEE RAM
LV SOG
FIRC
SIRC
SPLL
VSS
SOSC
GPIO
Flash
Pads
ADC CMP
VDDA
VSSA
VREFH
VREFL
*Note: VSSA and VSS are shorted at package level
VOSC = 3.3 V nominal
Figure 6. Power diagram
4.5 LVR, LVD and POR operating requirements
Table 5. VDD supply LVR, LVD and POR operating requirements
Symbol Description Min. Typ. Max. Unit Notes
VPOR Rising and falling VDD POR detect voltage 1.1 1.6 2.0 V
VLVR LVR falling threshold (RUN, HSRUN, and
STOP modes)
2.50 2.58 2.7 V
VLVR_HYST LVR hysteresis — 45 — mV 1
VLVR_LP LVR falling threshold (VLPS/VLPR modes) 1.97 2.22 2.44 V
VLVD Falling low-voltage detect threshold 2.8 2.875 3 V
VLVD_HYST LVD hysteresis — 50 — mV 1
Table continues on the next page...
General
S32K1xx Data Sheet, Rev. 7, 04/2018
14 NXP Semiconductors
Table 5. VDD supply LVR, LVD and POR operating requirements (continued)
Symbol Description Min. Typ. Max. Unit Notes
VLVW Falling low-voltage warning threshold 4.19 4.305 4.5 V
VLVW_HYST LVW hysteresis — 75 — mV 1
VBG Bandgap voltage reference 0.97 1.00 1.03 V
1. Rising threshold is the sum of falling threshold and hysteresis voltage.
4.6 Power mode transition operating behaviors
All specifications in the following table assume this clock configuration:
• RUN Mode:
• Clock source: FIRC
• SYS_CLK/CORE_CLK = 48 MHz
• BUS_CLK = 48 MHz
• FLASH_CLK = 24 MHz
• HSRUN Mode:
• Clock source: SPLL
• SYS_CLK/CORE_CLK = 112 MHz
• BUS_CLK = 56 MHz
• FLASH_CLK = 28 MHz
• VLPR Mode:
• Clock source: SIRC
• SYS_CLK/CORE_CLK = 4 MHz
• BUS_CLK = 4 MHz
• FLASH_CLK = 1 MHz
• STOP1/STOP2 Mode:
• Clock source: FIRC
• SYS_CLK/CORE_CLK = 48 MHz
• BUS_CLK = 48 MHz
• FLASH_CLK = 24 MHz
• VLPS Mode: All clock sources disabled 1
Table 6. Power mode transition operating behaviors
Symbol Description Min. Typ. Max. Unit
tPOR After a POR event, amount of time from the point VDD
reaches 2.7 V to execution of the first instruction
across the operating temperature range of the chip.
— 325 — μs
Table continues on the next page...
1. • For S32K11x – FIRC/SOSC/FIRC/LPO
• For S32K14x – FIRC/SOSC/FIRC/LPO/SPLL
General
S32K1xx Data Sheet, Rev. 7, 04/2018
NXP Semiconductors 15
Table 6. Power mode transition operating behaviors (continued)
Symbol Description Min. Typ. Max. Unit
VLPS → RUN 8 — 17 μs
STOP1 → RUN 0.07 0.075 0.08 μs
STOP2 → RUN 0.07 0.075 0.08 μs
VLPR → RUN 19 — 26 μs
VLPR → VLPS 5.1 5.7 6.5 μs
VLPS → VLPR 18.8 23 27.75 μs
RUN → Compute operation 0.72 0.75 0.77 μs
HSRUN → Compute operation 0.3 0.31 0.35 μs
RUN → STOP1 0.35 0.38 0.4 μs
RUN → STOP2 0.2 0.23 0.25 μs
RUN → VLPS 0.3 0.35 0.4 μs
RUN → VLPR 3.5 3.8 5 μs
VLPS → Asynchronous DMA Wakeup 105 110 125 μs
STOP1 → Asynchronous DMA Wakeup 1 1.1 1.3 μs
STOP2 → Asynchronous DMA Wakeup 1 1.1 1.3 μs
Pin reset → Code execution — 214 — μs
NOTE
HSRUN should only be used when frequencies in excess of 80
MHz are required. When using 80 MHz and below, RUN mode
is the recommended operating mode.
4.7 Power consumption
The following table shows the power consumption targets for the device in various mode
of operations. Attached S32K1xx_Power_Modes _Configuration.xlsx details the modes
used in gathering the power consumption data stated in the following table Table 7. For
full functionality refer to table: Module operation in available low power modes of the
Reference Manual.
General
S32K1xx Data Sheet, Rev. 7, 04/2018
16 NXP Semiconductors
Table 7. Power consumption (Typicals unless stated otherwise) 1
Chip/Device
Ambient Temperature (°C)
VLPS (μA)2, 3VLPR (mA) STOP1
(mA)
STOP2
(mA)
RUN@48
MHz (mA)
RUN@64 MHz
(mA)
RUN@80 MHz
(mA)
HSRUN@112
MHz (mA) 4
IDD/MHz (μA/MHz)5
Peripherals disabled 6
Peripherals enabled
Peripherals disabled
Peripherals enabled
Peripherals disabled
Peripherals enabled
Peripherals disabled
Peripherals enabled
Peripherals disabled
Peripherals enabled
Peripherals disabled
Peripherals enabled
S32K116 25 Typ 26 38 1.9 2.5 7 12 TBD TBD NA TBD
105 Typ TBD TBD TBD TBD TBD TBD TBD TBD TBD
Max TBD TBD TBD TBD TBD TBD TBD TBD TBD
125 Max TBD TBD TBD TBD TBD TBD TBD 40 TBD
S32K118 25 Typ 26 38 1.9 2.5 7 12 TBD TBD NA TBD
105 Typ TBD TBD TBD TBD TBD TBD TBD TBD TBD
Max TBD TBD TBD TBD TBD TBD TBD TBD TBD
125 Max TBD TBD TBD TBD TBD TBD TBD 42 TBD
S32K142 25 Typ 29 35 1.17 1.21 6.4 7.4 17.3 24.6 24.5 31.3 28.8 37.5 40.5 52.2 360
85 Typ 128 137 1.48 1.51 7 8 17.6 24.9 25 31.6 29.1 37.7 41.1 52.5 364
Max 335 360 1.87 1.89 8.6 9.4 22 28.2 26.9 33.5 32 40 44 55.6 400
105 Typ 240 257 1.58 1.61 7.6 8.3 18.3 25.7 25.5 31.9 29.8 38 41.5 53.1 373
Max 740 791 2.32 2.34 9.9 10.9 23.1 30.2 27.8 35.3 33.8 40.7 44.9 57.4 423
125 Max 1637 1694 3.1 3.21 12.7 13.7 25 32.9 30.7 38.8 36 43.8 NA 450
S32K144 25 Typ 29.8 39.1 1.48 1.50 7 7.7 19.7 26.9 25.1 33.3 30.2 39.6 43.3 55.6 378
85 Typ 150 159 1.72 1.85 7.2 8.1 20.4 27.1 26.1 33.5 30.5 40 43.9 56.1 381
Max 359 384 2.60 2.65 9.2 9.9 23.2 29.6 29.3 36.2 34.8 42.1 46.3 59.7 435
Table continues on the next page...
General
S32K1xx Data Sheet, Rev. 7, 04/2018
NXP Semiconductors 17
Table 7. Power consumption (Typicals unless stated otherwise) 1 (continued)
Chip/Device
Ambient Temperature (°C)
VLPS (μA)2, 3VLPR (mA) STOP1
(mA)
STOP2
(mA)
RUN@48
MHz (mA)
RUN@64 MHz
(mA)
RUN@80 MHz
(mA)
HSRUN@112
MHz (mA) 4
IDD/MHz (μA/MHz)5
Peripherals disabled 6
Peripherals enabled
Peripherals disabled
Peripherals enabled
Peripherals disabled
Peripherals enabled
Peripherals disabled
Peripherals enabled
Peripherals disabled
Peripherals enabled
Peripherals disabled
Peripherals enabled
105 Typ 256 273 1.80 2.10 7.8 8.5 20.6 27.4 26.6 33.8 31.2 40.5 44.8 57.1 390
Max 850 900 2.65 2.70 10.3 11.1 23.9 30.6 30.3 37.3 35.6 43.5 47.9 61.3 445
125 Max 1960 1998 3.18 3.25 12.9 13.8 26.9 33.6 35 40.3 38.7 46.8 NA 484
S32K146 25 Typ 37 47 1.57 1.61 8 9.2 23.4 31.4 30.5 40.2 36.2 47.6 52 68.3 452
85 Typ 207 209 1.79 1.83 8.9 10.1 24.4 32.4 31.5 41.3 37.2 48.7 53.3 69.8 465
Max 974 981 3.32 3.38 12.7 13.9 29.3 37.9 36.7 47 42.4 54.4 60.3 78 530
105 Typ 419 422 1.99 2.04 9.8 11 25.3 33.4 32.5 42.2 38.1 49.6 54.4 70.8 477
Max 2004 2017 4.06 4.13 17.1 18.3 34.1 42.6 41.3 51.4 46.9 58.8 65.7 82.8 587
125 Max 3358 3380 5.28 5.38 22.6 23.7 40.2 48.8 47.3 57.4 52.8 64.8 NA 660
S32K148725 Typ 38 54 2.17 2.20 8.5 9.6 27.6 34.9 35.5 45.3 42.1 57.7 60.3 83.3 526
85 Typ 336 357 2.30 2.35 10.1 11.1 29.1 37.0 36.8 46.6 43.4 59.9 62.9 88.7 543
Max 1660 1736 3.48 3.55 14.5 15.6 34.8 43.6 41.9 53.9 48.7 65.1 70.4 96.1 609
105 Typ 560 577 2.49 2.54 10.9 11.9 29.8 37.8 37.6 47.5 45.2 61.5 63.8 89.1 565
Max 2945 2970 4.40 4.47 18.0 19.0 38.4 46.8 44.9 55.3 51.6 66.8 73.6 97.4 645
125 Max 3990 4166 6.00 6.08 23.4 24.5 44.3 52.5 50.9 61.3 57.5 71.6 NA 719
1. Typical current numbers are indicative for typical silicon process and may vary based on the silicon distribution and user configuration. Typical conditions assumes
VDD = VDDA = VREFH = 5 V, temperature = 25 °C and typical silicon process unless otherwise stated. All output pins are floating and On-chip pulldown is enabled for
all unused input pins.
General
S32K1xx Data Sheet, Rev. 7, 04/2018
18 NXP Semiconductors
2. This is an average based on the use case described in the Comparator section, whereby the analog sampling is taking place periodically, with a mechanism to only
enable the DAC as required. The numbers quoted assumes that only a single ANLCMP is active and the others are disabled
3. Current numbers are for reduced configuration and may vary based on user configuration and silicon process variation.
4. HSRUN mode must not be used at 125°C. Max ambient temperature for HSRUN mode is 105°C.
5. Values mentioned are measured at RUN@80 MHz with peripherals disabled.
6. With PMC_REGSC[CLKBIASDIS] set to 1. See Reference Manual for details.
7. The S32K148 data points assume that ENET/QuadSPI/SAI etc. are inactive.
General
S32K1xx Data Sheet, Rev. 7, 04/2018
NXP Semiconductors 19
The following table shows the power consumption targets for S32K148 in various mode
of operations measure at 3.3 V.
Table 8. Power consumption at 3.3 V
Chip/Device Ambient
Temperature
(°C)
RUN@80 MHz (mA) HSRUN@112 MHz (mA)1
Peripherals
enabled +
QSPI
Peripherals
enabled +
ENET + SAI
Peripherals
enabled +
QSPI
Peripherals
enabled +
ENET + SAI
S32K148 25 Typ 67.3 79.1 89.8 105.5
85 Typ 67.4 79.2 95.6 105.9
Max 82.5 88.2 109.7 117.4
105 Typ 68.0 79.8 96.6 106.7
Max 80.3 89.1 109.0 119.0
125 Max 83.5 94.7 NA
1. HSRUN mode must not be used at 125°C. Max ambient temperature for HSRUN mode is 105°C.
4.8 ESD handling ratings
Symbol Description Min. Max. Unit Notes
VHBM Electrostatic discharge voltage, human body model − 4000 4000 V 1
VCDM Electrostatic discharge voltage, charged-device model 2
All pins except the corner pins − 500 500 V
Corner pins only − 750 750 V
ILAT Latch-up current at ambient temperature of 125 °C − 100 100 mA 3
1. Determined according to JEDEC Standard JESD22-A114, Electrostatic Discharge (ESD) Sensitivity Testing Human Body
Model (HBM).
2. Determined according to JEDEC Standard JESD22-C101, Field-Induced Charged-Device Model Test Method for
Electrostatic-Discharge-Withstand Thresholds of Microelectronic Components.
3. Determined according to JEDEC Standard JESD78, IC Latch-Up Test.
4.9 EMC radiated emissions operating behaviors
EMC measurements to IC-level IEC standards are available from NXP on request.
General
S32K1xx Data Sheet, Rev. 7, 04/2018
20 NXP Semiconductors
I/O parameters
5.1 AC electrical characteristics
Unless otherwise specified, propagation delays are measured from the 50% to the 50%
point, and rise and fall times are measured at the 20% and 80% points, as shown in the
following figure.
Figure 7. Input signal measurement reference
5.2 General AC specifications
These general purpose specifications apply to all signals configured for GPIO, UART,
and timers.
Table 9. General switching specifications
Symbol Description Min. Max. Unit Notes
GPIO pin interrupt pulse width (digital glitch filter
disabled) — Synchronous path
1.5 — Bus clock
cycles
1, 2
GPIO pin interrupt pulse width (digital glitch filter
disabled, passive filter disabled) — Asynchronous path
50 — ns 3
WFRST RESET input filtered pulse — 10 ns 4
WNFRST RESET input not filtered pulse Maximum of
(100 ns, bus
clock period)
— ns 5
1. This is the minimum pulse width that is guaranteed to pass through the pin synchronization circuitry. Shorter pulses may or
may not be recognized. In Stop and VLPS modes, the synchronizer is bypassed so shorter pulses can be recognized in
that case.
2. The greater of synchronous and asynchronous timing must be met.
3. These pins do not have a passive filter on the inputs. This is the shortest pulse width that is guaranteed to be recognized.
4. Maximum length of RESET pulse which will be filtered by internal filter.
5. Minimum length of RESET pulse, guaranteed not to be filtered by the internal filter. This number depends on bus clock
period also. For example, in VLPR mode bus clock is 4 MHz, which make clock period of 250 ns. In this case, minimum
pulse width which will cause reset is 250 ns. For faster bus clock frequencies which have clock period less than 100 ns,
the minimum pulse width not filtered will be 100 ns.
5
I/O parameters
S32K1xx Data Sheet, Rev. 7, 04/2018
NXP Semiconductors 21
5.3 DC electrical specifications at 3.3 V Range
NOTE
For details on the pad types defined in Table 10 and Table 11,
see Reference Manual section IO Signal Table and IO Signal
Description Input Multiplexing sheet(s) attached with
Reference Manual.
Table 10. DC electrical specifications at 3.3 V Range
Symbol Parameter Value Unit Notes
Min. Typ. Max.
VDD I/O Supply Voltage 2.7 3.3 4 V 1
Vih Input Buffer High Voltage 0.7 × VDD — VDD + 0.3 V 2
Vil Input Buffer Low Voltage VSS − 0.3 — 0.3 × VDD V3
Vhys Input Buffer Hysteresis 0.06 × VDD — — V
Ioh_Standard I/O current source capability measured
when pad Voh = (VDD − 0.8 V)
3.5 — — mA
Iol_Standard I/O current sink capability measured when
pad Vol = 0.8 V
3 — — mA
Ioh_Strong I/O current source capability measured
when pad Voh = (VDD − 0.8 V)
14 — — mA 4
Iol_Strong I/O current sink capability measured when
pad Vol = 0.8 V
12 — — mA 5
IOHT Output high current total for all ports — — 100 mA
IIN Input leakage current (per pin) for full temperature range at VDD = 3.3 V 6
All pins other than high drive port pins 0.005 0.5 μA
High drive port pins 70.010 0.5 μA
RPU Internal pullup resistors 20 60 kΩ 8
RPD Internal pulldown resistors 20 60 kΩ 9
1. S32K148 will operate from 2.7 V when executing from internal FIRC. When the PLL is engaged S32K148 is guaranteed to
operate from 2.97 V. All other S32K family devices operate from 2.7 V in all modes.
2. For reset pads, same Vih levels are applicable
3. For reset pads, same Vil levels are applicable
4. The value given is measured at high drive strength mode. For value at low drive strength mode see the Ioh_Standard
value given above.
5. The value given is measured at high drive strength mode. For value at low drive strength mode see the Iol_Standard value
given above.
6. Several I/O have both high drive and normal drive capability selected by the associated Portx_PCRn[DSE] control bit. All
other GPIOs are normal drive only. For details see IO Signal Description Input Multiplexing sheet(s) attached with the
Reference Manual.
7. When using ENET and SAI on S32K148, the overall device limits associated with high drive pin configurations must be
respected i.e. On 144-pin LQFP the general purpose pins: PTA10, PTD0, and PTE4 must be set to low drive.
8. Measured at input V = VSS
9. Measured at input V = VDD
I/O parameters
S32K1xx Data Sheet, Rev. 7, 04/2018
22 NXP Semiconductors
5.4 DC electrical specifications at 5.0 V Range
Table 11. DC electrical specifications at 5.0 V Range
Symbol Parameter Value Unit Notes
Min. Typ. Max.
VDD I/O Supply Voltage 4 — 5.5 V
Vih Input Buffer High Voltage 0.65 x VDD — VDD + 0.3 V 1
Vil Input Buffer Low Voltage VSS − 0.3 — 0.35 x VDD V2
Vhys Input Buffer Hysteresis 0.06 x VDD — — V
Ioh_Standard I/O current source capability
measured when pad Voh= (VDD - 0.8
V)
5 — — mA
Iol_Standard I/O current sink capability measured
when pad Vol= 0.8 V
5 — — mA
Ioh_Strong I/O current source capability
measured when pad Voh = VDD - 0.8
V
20 — — mA 3, 4
Iol_Strong I/O current sink capability measured
when pad Vol = 0.8 V
20 — — mA 4, 5
IOHT Output high current total for all ports — — 100 mA
IIN Input leakage current (per pin) for full temperature range at VDD = 5.5 V 6
All pins other than high drive port
pins
0.005 0.5 μA
High drive port pins 0.010 0.5 μA
RPU Internal pullup resistors 20 50 kΩ 7
RPD Internal pulldown resistors 20 50 kΩ 8
1. For reset pads, same Vih levels are applicable
2. For reset pads, same Vil levels are applicable
3. The value given is measured at high drive strength mode. For value at low drive strength mode see the Ioh_Standard
value given above.
4. The strong pad I/O pin is capable of switching a 50 pF load at up to 40 MHz.
5. The value given is measured at high drive strength mode. For value at low drive strength mode see the Iol_Standard value
given above.
6. Several I/O have both high drive and normal drive capability selected by the associated Portx_PCRn[DSE] control bit. All
other GPIOs are normal drive only. For details refer to SK3K144_IO_Signal_Description_Input_Multiplexing.xlsx attached
with the Reference Manual.
7. Measured at input V = VSS
8. Measured at input V = VDD
I/O parameters
S32K1xx Data Sheet, Rev. 7, 04/2018
NXP Semiconductors 23
5.5 AC electrical specifications at 3.3 V range
Table 12. AC electrical specifications at 3.3 V Range
Symbol DSE Rise time (nS) 1Fall time (nS) 1Capacitance (pF) 2
Min. Max. Min. Max.
Standard NA 3.2 14.5 3.4 15.7 25
5.7 23.7 6.0 26.2 50
20.0 80.0 20.8 88.4 200
Strong 0 3.2 14.5 3.4 15.7 25
5.7 23.7 6.0 26.2 50
20.0 80.0 20.8 88.4 200
1 1.5 5.8 1.7 6.1 25
2.4 8.0 2.6 8.3 50
6.3 22.0 6.0 23.8 200
1. For reference only. Run simulations with the IBIS model and your custom board for accurate results.
2. Maximum capacitances supported on Standard IOs. However interface or protocol specific specifications might be
different, for example for ENET, QSPI etc. . For protocol specific AC specifications, see respective sections.
5.6 AC electrical specifications at 5 V range
Table 13. AC electrical specifications at 5 V Range
Symbol DSE Rise time (nS)1Fall time (nS) 1Capacitance (pF) 2
Min. Max . Min. Max.
Standard NA 2.8 9.4 2.9 10.7 25
5.0 15.7 5.1 17.4 50
17.3 54.8 17.6 59.7 200
Strong 0 2.8 9.4 2.9 10.7 25
5.0 15.7 5.1 17.4 50
17.3 54.8 17.6 59.7 200
1 1.1 4.6 1.1 5.0 25
2.0 5.7 2.0 5.8 50
5.4 16.0 5.0 16.0 200
1. For reference only. Run simulations with the IBIS model and your custom board for accurate results.
2. Maximum capacitances supported on Standard IOs. However interface or protocol specific specifications might be
different, for example for ENET, QSPI etc. . For protocol specific AC specifications, see respective sections.
I/O parameters
S32K1xx Data Sheet, Rev. 7, 04/2018
24 NXP Semiconductors
5.7 Standard input pin capacitance
Table 14. Standard input pin capacitance
Symbol Description Min. Max. Unit
CIN_D Input capacitance: digital pins — 7 pF
NOTE
Please refer to External System Oscillator electrical
specifications for EXTAL/XTAL pins.
5.8 Device clock specifications
Table 15. Device clock specifications 1
Symbol Description Min. Max. Unit
High Speed run mode2
fSYS System and core clock — 112 MHz
fBUS Bus clock — 56 MHz
fFLASH Flash clock — 28 MHz
Normal run mode (S32K11x series)
fSYS System and core clock — 48 MHz
fBUS Bus clock — 48 MHz
fFLASH Flash clock — 24 MHz
Normal run mode (S32K14x series) 3
fSYS System and core clock — 80 MHz
fBUS Bus clock — 404MHz
fFLASH Flash clock — 26.67 MHz
VLPR mode5
fSYS System and core clock — 4 MHz
fBUS Bus clock — 4 MHz
fFLASH Flash clock — 1 MHz
fERCLK External reference clock — 16 MHz
1. Refer to the section Feature comparison for the availability of modes and other specifications.
2. Only available on some devices. See section Feature comparison.
3. With SPLL as system clock source.
4. 48 MHz when fSYS is 48 MHz
5. The frequency limitations in VLPR mode here override any frequency specification listed in the timing specification for any
other module.
I/O parameters
S32K1xx Data Sheet, Rev. 7, 04/2018
NXP Semiconductors 25
Peripheral operating requirements and behaviors
6.1 System modules
There are no electrical specifications necessary for the device's system modules.
Clock interface modules
6.2.1 External System Oscillator electrical specifications
6
6.2
Peripheral operating requirements and behaviors
S32K1xx Data Sheet, Rev. 7, 04/2018
26 NXP Semiconductors
Single input comparator
(EXTAL WAVE) Mux ref_clk
Differential input comparator
(HG/LP mode)
Peak detector
LP mode
Driver
(HG/LP mode)
Pull down resistor (OFF)
ESD PAD
280 ohms
ESD PAD
40 ohms
EXTAL pin XTAL pin
Series resistor for current
limitation
Crystal or resonator
C1 C2
1M ohms Feedback Resistor
Figure 8. Oscillator connections scheme
Table 16. External System Oscillator electrical specifications
Symbol Description Min. Typ. Max. Unit Notes
gmXOSC Crystal oscillator transconductance
4-8 MHz 2.2 — 13.7 mA/V
8-40 MHz 16 — 47 mA/V
VIL Input low voltage — EXTAL pin in external clock mode VSS — 0.35 * VDD V
VIH Input high voltage — EXTAL pin in external clock
mode
0.7 * VDD — VDD V
C1EXTAL load capacitance — — — 1
C2XTAL load capacitance — — — 1
RFFeedback resistor 2
Low-gain mode (HGO=0) — — — MΩ
Table continues on the next page...
Clock interface modules
S32K1xx Data Sheet, Rev. 7, 04/2018
NXP Semiconductors 27
Table 16. External System Oscillator electrical specifications
(continued)
Symbol Description Min. Typ. Max. Unit Notes
High-gain mode (HGO=1) — 1 — MΩ
RSSeries resistor
Low-gain mode (HGO=0) — 0 — kΩ
High-gain mode (HGO=1) — 0 — kΩ
Vpp Peak-to-peak amplitude of oscillation (oscillator mode) 3
Low-gain mode (HGO=0) — 1.0 — V
High-gain mode (HGO=1) — 3.3 — V
1. Crystal oscillator circuit provides stable oscillations when gmXOSC > 5 * gm_crit. The gm_crit is defined as:
gm_crit = 4 * ESR * (2πF)2 * (C0 + CL)2
where:
• gmXOSC is the transconductance of the internal oscillator circuit
• ESR is the equivalent series resistance of the external crystal
• F is the external crystal oscillation frequency
• C0 is the shunt capacitance of the external crystal
• CL is the external crystal total load capacitance. CL = Cs+ [C1*C2/(C1+C2)]
• Cs is stray or parasitic capacitance on the pin due to any PCB traces
• C1, C2 external load capacitances on EXTAL and XTAL pins
See manufacture datasheet for external crystal component values
2. • When low-gain is selected, internal RF will be selected and external RF should not be attached.
• When high-gain is selected, external RF (1 M Ohm) needs to be connected for proper operation of the crystal. For
external resistor, up to 5% tolerance is allowed.
3. The EXTAL and XTAL pins should only be connected to required oscillator components and must not be connected to any
other devices.
6.2.2 External System Oscillator frequency specifications
Clock interface modules
S32K1xx Data Sheet, Rev. 7, 04/2018
28 NXP Semiconductors
Table 17. External System Oscillator frequency specifications
Symbol Description Min. Typ. Max. Unit Notes
S32K14x S32K11x S32K14x S32K11x S32K14x S32K11x
fosc_hi Oscillator crystal or resonator
frequency
4 — 40 MHz
fec_extal Input clock frequency (external clock
mode)
— — 50 48 MHz 1
tdc_extal Input clock duty cycle (external clock
mode)
48 50 52 % 1
tcst Crystal Start-up Time
8 MHz low-gain mode (HGO=0) — 1.5 — ms 2
8 MHz high-gain mode (HGO=1) — 2.5 —
40 MHz low-gain mode (HGO=0) — 2 —
40 MHz high-gain mode (HGO=1) — 2 —
1. Frequencies below 40 MHz can be used for degraded duty cycle upto 40-60%
2. Proper PC board layout procedures must be followed to achieve specifications.
Clock interface modules
S32K1xx Data Sheet, Rev. 7, 04/2018
NXP Semiconductors 29
System Clock Generation (SCG) specifications
6.2.3.1 Fast internal RC Oscillator (FIRC) electrical specifications
Table 18. Fast internal RC Oscillator electrical specifications
Symbol Parameter1Value Unit
Min. Typ. Max.
FFIRC FIRC target frequency — 48 — MHz
ΔF Frequency deviation across process, voltage, and
temperature < 105°C
— ±0.5 ±1 %FFIRC
ΔF125 Frequency deviation across process, voltage, and
temperature < 125°C
— ±0.5 ±1.1 %FFIRC
TStartup Startup time 3.4 5 µs2
TJIT, 3Cycle-to-Cycle jitter — 250 500 ps
TJIT3Long term jitter over 1000 cycles — 0.04 0.1 %FFIRC
1. With FIRC regulator enable
2. Startup time is defined as the time between clock enablement and clock availability for system use.
3. FIRC as system clock
NOTE
Fast internal RC Oscillator is compliant with CAN and LIN
standards.
6.2.3.2 Slow internal RC oscillator (SIRC) electrical specifications
Table 19. Slow internal RC oscillator (SIRC) electrical specifications
Symbol Parameter Value Unit
Min. Typ. Max.
FSIRC SIRC target frequency — 8 — MHz
ΔF Frequency deviation across process, voltage, and
temperature < 105°C
— — ±3 %FSIRC
ΔF125 Frequency deviation across process, voltage, and
temperature < 125°C
— — ±3.3 %FSIRC
TStartup Startup time — 9 12.5 µs1
1. Startup time is defined as the time between clock enablement and clock availability for system use.
6.2.3
System Clock Generation (SCG) specifications
S32K1xx Data Sheet, Rev. 7, 04/2018
30 NXP Semiconductors
6.2.4 Low Power Oscillator (LPO) electrical specifications
Table 20. Low Power Oscillator (LPO) electrical specifications
Symbol Parameter Min. Typ. Max. Unit
FLPO Internal low power oscillator frequency 113 128 139 kHz
Tstartup Startup Time — — 20 µs
6.2.5 SPLL electrical specifications
Table 21. SPLL electrical specifications
Symbol Parameter Min. Typ. Max. Unit
FSPLL_REF1PLL Reference Frequency Range 8 — 16 MHz
FSPLL_Input2PLL Input Frequency 8 — 40 MHz
FVCO_CLK VCO output frequency 180 — 320 MHz
FSPLL_CLK PLL output frequency 90 — 160 MHz
JCYC_SPLL PLL Period Jitter (RMS)3
at FVCO_CLK 180 MHz — 120 — ps
at FVCO_CLK 320 MHz — 75 — ps
JACC_SPLL PLL accumulated jitter over 1µs (RMS)3
at FVCO_CLK 180 MHz — 1350 — ps
at FVCO_CLK 320 MHz — 600 — ps
DUNL Lock exit frequency tolerance ± 4.47 — ± 5.97 %
TSPLL_LOCK Lock detector detection time4— — 150 × 10-6 +
1075(1/FSPLL_REF)
s
1. FSPLL_REF is PLL reference frequency range after the PREDIV. For PREDIV and MULT settings refer SCG_SPLLCFG
register of Reference Manual.
2. FSPLL_Input is PLL input frequency range before the PREDIV must be limited to the range 8 MHz to 40 MHz. This input
source could be derived from a crystal oscillator or some other external square wave clock source using OSC bypass
mode. For external clock source settings refer SCG_SOSCCFG register of Reference Manual.
3. This specification was obtained using a NXP developed PCB. PLL jitter is dependent on the noise characteristics of each
PCB and results will vary
4. Lock detector detection time is defined as the time between PLL enablement and clock availability for system use.
Memory and memory interfaces
6.3.1 Flash memory module (FTFC) electrical specifications
This section describes the electrical characteristics of the flash memory module.
6.3
Memory and memory interfaces
S32K1xx Data Sheet, Rev. 7, 04/2018
NXP Semiconductors 31
6.3.1.1 Flash timing specifications — commands
Table 22. Flash command timing specifications for S32K14x
Symbol Description1S32K142 S32K144 S32K146 S32K148
Typ Max Typ Max Typ Max Typ Max Unit Notes
trd1blk Read 1 Block
execution time
32 KB flash — — — — — — — — ms
64 KB flash — 0.5 — 0.5 — 0.5 — —
128 KB flash — — — — — — — —
256 KB flash — 2 — — — — — —
512 KB flash — — — 1.8 — 2 — 2
trd1sec Read 1 Section
execution time
2 KB flash — 75 — 75 — 75 — 75 µs
4 KB flash — 100 — 100 — 100 — 100
tpgmchk Program Check
execution time
— — 95 — 95 — 95 — 100 µs
tpgm8 Program Phrase
execution time
— 90 225 90 225 90 225 90 225 µs
tersblk Erase Flash
Block execution
time
32 KB flash — — — — — — — — ms 2
64 KB flash 30 550 30 550 30 550 — —
128 KB flash — — — — — — — —
256 KB flash 250 2125 — — — — — —
512 KB flash — — 250 4250 250 4250 250 4250
tersscr Erase Flash
Sector execution
time
— 12 130 12 130 12 130 12 130 ms 2
tpgmsec1k Program Section
execution time
(1KB flash)
— 5 — 5 — 5 — 5 — ms
trd1all Read 1s All
Block execution
time
— — 2.8 — 2.3 — 5.2 — 8.2 ms
trdonce Read Once
execution time
— — 30 — 30 — 30 — 30 µs
tpgmonce Program Once
execution time
— 90 — 90 — 90 — 90 — µs
tersall Erase All Blocks
execution time
— 250 2800 400 4900 700 10000 1400 17000 ms 2
tvfykey Verify Backdoor
Access Key
execution time
— — 35 — 35 — 35 — 35 µs
tersallu Erase All Blocks
Unsecure
execution time
— 250 2800 400 4900 700 10000 1400 17000 ms 2
tpgmpart Program
Partition for
EEPROM
execution time
32 KB
EEPROM
backup
70 — 70 — 70 — — — ms 3
64 KB
EEPROM
backup
71 — 71 — 71 — 150 —
Table continues on the next page...
Memory and memory interfaces
S32K1xx Data Sheet, Rev. 7, 04/2018
32 NXP Semiconductors
Table 22. Flash command timing specifications for S32K14x (continued)
Symbol Description1S32K142 S32K144 S32K146 S32K148
Typ Max Typ Max Typ Max Typ Max Unit Notes
tsetram Set FlexRAM
Function
execution time
Control
Code 0xFF
0.08 — 0.08 — 0.08 — 0.08 — ms 3
32 KB
EEPROM
backup
0.8 1.2 0.8 1.2 0.8 1.2 — —
48 KB
EEPROM
backup
1 1.5 1 1.5 1 1.5 — —
64 KB
EEPROM
backup
1.3 1.9 1.3 1.9 1.3 1.9 1.3 1.9
teewr8b Byte write to
FlexRAM
execution time
32 KB
EEPROM
backup
385 1700 385 1700 385 1700 — — µs 3,4
48 KB
EEPROM
backup
430 1850 430 1850 430 1850 — —
64 KB
EEPROM
backup
475 2000 475 2000 475 2000 475 4000
teewr16b 16-bit write to
FlexRAM
execution time
32 KB
EEPROM
backup
385 1700 385 1700 385 1700 — — µs 3,4
48 KB
EEPROM
backup
430 1850 430 1850 430 1850 — —
64 KB
EEPROM
backup
475 2000 475 2000 475 2000 475 4000
teewr32bers 32-bit write to
erased FlexRAM
location
execution time
— 360 2000 360 2000 360 2000 360 2000 µs
teewr32b 32-bit write to
FlexRAM
execution time
32 KB
EEPROM
backup
630 2000 630 2000 630 2000 — — µs 3,4
48 KB
EEPROM
backup
720 2125 720 2125 720 2125 — —
64 KB
EEPROM
backup
810 2250 810 2250 810 2250 810 4500
tquickwr 32-bit Quick
Write execution
time: Time from
CCIF clearing
(start the write)
until CCIF
1st 32-bit
write
200 550 200 550 200 550 200 1100 µs 4,5,6
2nd through
Next to Last
(Nth-1) 32-
bit write
150 550 150 550 150 550 150 550
Table continues on the next page...
Memory and memory interfaces
S32K1xx Data Sheet, Rev. 7, 04/2018
NXP Semiconductors 33
Table 22. Flash command timing specifications for S32K14x (continued)
Symbol Description1S32K142 S32K144 S32K146 S32K148
Typ Max Typ Max Typ Max Typ Max Unit Notes
setting (32-bit
write complete,
ready for next
32-bit write)
Last (Nth)
32-bit write
(time for
write only,
not cleanup)
200 550 200 550 200 550 200 550
tquickwrClnup Quick Write
Cleanup
execution time
— — (# of
Quick
Writes
) * 2.0
— (# of
Quick
Writes )
* 2.0
— (# of
Quick
Writes
) * 2.0
— (# of
Quick
Writes
) * 2.0
ms 7
1. All command times assumes 25 MHz or greater flash clock frequency (for synchronization time between internal/external
clocks).
2. Maximum times for erase parameters based on expectations at cycling end-of-life.
3. For all EEPROM Emulation terms, the specified timing shown assumes previous record cleanup has occurred. This may
be verified by executing FCCOB Command 0x77, and checking FCCOB number 5 contents show 0x00 - No EEPROM
issues detected.
4. 1st time EERAM writes after a Reset or SETRAM may incur additional overhead for EEE cleanup, resulting in up to 2× the
times shown.
5. Only after the Nth write completes will any data be valid. Emulated EEPROM record scheme cleanup overhead may occur
after this point even after a brownout or reset. If power on reset occurs before the Nth write completes, the last valid record
set will still be valid and the new records will be discarded.
6. Quick Write times may take up to 550 µs, as additional cleanup may occur when crossing sector boundaries.
7. Time for emulated EEPROM record scheme overhead cleanup. Automatically done after last (Nth) write completes,
assuming still powered. Or via SETRAM cleanup execution command is requested at a later point.
Table 23. Flash command timing specifications for S32K11x
Symbol Description1S32K116 S32K118
Typ Max Typ Max Unit Notes
trd1blk Read 1 Block execution
time
32 KB flash — 0.36 — 0.36 ms
64 KB flash — — — —
128 KB flash — 1.2 — —
256 KB flash — — — 2
512 KB flash — — — —
trd1sec Read 1 Section
execution time
2 KB flash — 75 — 75 µs
4 KB flash — 100 — 100
tpgmchk Program Check
execution time
— — 100 — 100 µs
tpgm8 Program Phrase
execution time
— 90 225 90 225 µs
tersblk Erase Flash Block
execution time
32 KB flash 15 300 15 300 ms 2
64 KB flash — — — —
128 KB flash 120 1100 — —
256 KB flash — — 250 2125
512 KB flash — — — —
Table continues on the next page...
Memory and memory interfaces
S32K1xx Data Sheet, Rev. 7, 04/2018
34 NXP Semiconductors
Table 23. Flash command timing specifications for S32K11x (continued)
Symbol Description1S32K116 S32K118
Typ Max Typ Max Unit Notes
tersscr Erase Flash Sector
execution time
— 12 130 12 130 ms 2
tpgmsec1k Program Section
execution time (1 KB
flash)
— 5 — 5 — ms
trd1all Read 1s All Block
execution time
— — 1.7 — 2.8 ms
trdonce Read Once execution
time
— — 30 — 30 µs
tpgmonce Program Once execution
time
— 90 — 90 — µs
tersall Erase All Blocks
execution time
— 150 1500 230 2500 ms 2
tvfykey Verify Backdoor Access
Key execution time
— — 35 — 35 µs
tersallu Erase All Blocks
Unsecure execution time
— 150 1500 230 2500 ms 2
tpgmpart Program Partition for
EEPROM execution time
32 KB EEPROM
backup
71 — 71 — ms 3
64 KB EEPROM
backup
— — — —
tsetram Set FlexRAM Function
execution time
Control Code
0xFF
0.08 — 0.08 — ms 3
32 KB EEPROM
backup
0.8 1.2 0.8 1.2
48 KB EEPROM
backup
— — — —
64 KB EEPROM
backup
— — — —
teewr8b Byte write to FlexRAM
execution time
32 KB EEPROM
backup
385 1700 385 1700 µs 3,4
48 KB EEPROM
backup
— — — —
64 KB EEPROM
backup
— — — —
teewr16b 16-bit write to FlexRAM
execution time
32 KB EEPROM
backup
385 1700 385 1700 µs 3,4
48 KB EEPROM
backup
— — — —
64 KB EEPROM
backup
— — — —
teewr32bers 32-bit write to erased
FlexRAM location
execution time
— 360 2000 360 2000 µs
Table continues on the next page...
Memory and memory interfaces
S32K1xx Data Sheet, Rev. 7, 04/2018
NXP Semiconductors 35
Table 23. Flash command timing specifications for S32K11x (continued)
Symbol Description1S32K116 S32K118
Typ Max Typ Max Unit Notes
teewr32b 32-bit write to FlexRAM
execution time
32 KB EEPROM
backup
630 2000 630 2000 µs 3,4
48 KB EEPROM
backup
— — — —
64 KB EEPROM
backup
— — — —
tquickwr 32-bit Quick Write
execution time: Time
from CCIF clearing (start
the write) until CCIF
setting (32-bit write
complete, ready for next
32-bit write)
1st 32-bit write 200 550 200 550 µs 4,5,6
2nd through Next
to Last (Nth-1)
32-bit write
150 550 150 550
Last (Nth) 32-bit
write (time for
write only, not
cleanup)
200 550 200 550
tquickwrClnup Quick Write Cleanup
execution time
— — (# of
Quick
Writes ) *
2.0
— (# of Quick
Writes ) * 2.0
ms 7
1. All command times assume 25 MHz or greater flash clock frequency (for synchronization time between internal/external
clocks).
2. Maximum times for erase parameters based on expectations at cycling end-of-life.
3. For all EEPROM Emulation terms, the specified timing shown assumes previous record cleanup has occurred. This may
be verified by executing FCCOB Command 0x77, and checking FCCOB number 5 contents show 0x00 - No EEPROM
issues detected.
4. 1st time EERAM writes after a Reset or SETRAM may incur additional overhead for EEE cleanup, resulting in up to 2x the
times shown.
5. Only after the Nth write completes will any data be valid. Emulated EEPROM record scheme cleanup overhead may occur
after this point even after a brownout or reset. If power on reset occurs before the Nth write completes, the last valid record
set will still be valid and the new records will be discarded.
6. Quick Write times may take up to 550 µs, as additional cleanup may occur when crossing sector boundaries.
7. Time for emulated EEPROM record scheme overhead cleanup. Automatically done after last (Nth) write completes,
assuming still powered. Or via SETRAM cleanup execution command is requested at a later point.
NOTE
Under certain circumstances FlexMEM maximum times may be
exceeded. In this case the user or application may wait, or assert
reset to the FTFC macro to stop the operation.
6.3.1.2 Reliability specifications
Table 24. NVM reliability specifications
Symbol Description Min. Typ. Max. Unit Notes
When using as Program and Data Flash
tnvmretp1k Data retention after up to 1 K cycles 20 — — years 1
nnvmcycp Cycling endurance 1 K — — cycles 2, 3
Table continues on the next page...
Memory and memory interfaces
S32K1xx Data Sheet, Rev. 7, 04/2018
36 NXP Semiconductors
Table 24. NVM reliability specifications (continued)
Symbol Description Min. Typ. Max. Unit Notes
When using FlexMemory feature : FlexRAM as Emulated EEPROM
tnvmretee Data retention 5 — — years 4
nnvmwree16
nnvmwree256
Write endurance
• EEPROM backup to FlexRAM ratio = 16
• EEPROM backup to FlexRAM ratio = 256
100 K
1.6 M
—
—
—
—
writes
writes
5, 6, 7
1. Data retention period per block begins upon initial user factory programming or after each subsequent erase.
2. Program and Erase for PFlash and DFlash are supported across product temperature specification in Normal Mode (not
supported in HSRUN mode).
3. Cycling endurance is per DFlash or PFlash Sector.
4. Data retention period per block begins upon initial user factory programming or after each subsequent erase. Background
maintenance operations during normal FlexRAM usage extend effective data retention life beyond 5 years.
5. FlexMemory write endurance specified for 16-bit and/or 32-bit writes to FlexRAM and is supported across product
temperature specification in Normal Mode (not supported in HSRUN mode). Greater write endurance may be achieved
with larger ratios of EEPROM backup to FlexRAM.
6. For usage of any EEE driver other than the FlexMemory feature, the endurance spec will fall back to the specified
endurance value of the D-Flash specification (1K).
7. FlexMemory calculator tool is available at NXP web site for help in estimation of the maximum write endurance achievable
at specific EEPROM/FlexRAM ratios. The “In Spec” portions of the online calculator refer to the NVM reliability
specifications section of data sheet. This calculator is only applies to the FlexMemory feature.
6.3.2 QuadSPI AC specifications
The following table describes the QuadSPI electrical characteristics.
• Measurements are with maximum output load of 25 pF, input transition of 1 ns and
pad configured with fastest slew settings (DSE = 1'b1).
• I/O operating voltage ranges from 2.97 V to 3.6 V
• While doing the mode transition (RUN -> HSRUN or HSRUN -> RUN ), the
interface should be OFF.
• Add 50 ohm series termination on board in QuadSPI SCK for Flash A to avoid loop
back reflection when using in Internal DQS (PAD Loopback) mode.
• QuadSPI trace length should be 3 inches.
• For non-Quad mode of operation if external device doesn’t have pull-up feature,
external pull-up needs to be added at board level for non-used pads.
• With external pull-up, performance of the interface may degrade based on load
associated with external pull-up.
Memory and memory interfaces
S32K1xx Data Sheet, Rev. 7, 04/2018
NXP Semiconductors 37
Table 25. QuadSPI electrical specifications
FLASH PORT Sym Unit FLASH A FLASH B
RUN1HSRUN1RUN/HSRUN2
QuadSPI Mode SDR SDR SDR DDR3
Internal
Sampling
Internal DQS Internal
Sampling
Internal DQS Internal
Sampling
External DQS
N1 PAD
Loopback
Internal
Loopback
N1 PAD
Loopback
Internal
Loopback
N1 External DQS
Min Max Min Max Min Max Min Max Min Max Min Max Min Max Min Max
Register Settings
MCR[DDR_EN] - 0 0 0 0 0 0 0 1
MCR[DQS_EN] - 0 1 1 0 1 1 0 1
MCR[SCLKCFG[0]] - - 1 0 - 1 0 - -
MCR[SCLKCFG[1]] - - 1 0 - 1 0 - -
MCR[SCLKCFG[2]] - - - - - - - - 0
MCR[SCLKCFG[3]] - - - - - - - - 0
MCR[SCLKCFG[5]] - 0 0 0 0 0 0 0 1
SMPR[FSPHS] - 0 1 0 0 1 0 0 0
SMPR[FSDLY] - 0 0 0 0 0 0 0 0
SOCCR
[SOCCFG[7:0]]
- 0 23 - 0 30 - -
SOCCR[SOCCFG[15:8]] - - - - - - - - 30
FLSHCR[TDH] - 0x00 0x00 0x00 0x00 0x00 0x00 0x00 0x01
Timing Parameters
SCK Clock Frequency fSCK MHz - 38 - 64 - 48 - 40 - 80 - 50 - 20 - 204
SCK Clock Period tSCK ns
1/fSCK
-
1/fSCK
-
1/fSCK
-
1/fSCK
-
1/fSCK
-
1/fSCK
- 50.0 - 50.04-
Table continues on the next page...
Memory and memory interfaces
S32K1xx Data Sheet, Rev. 7, 04/2018
38 NXP Semiconductors
Table 25. QuadSPI electrical specifications (continued)
FLASH PORT Sym Unit FLASH A FLASH B
RUN1HSRUN1RUN/HSRUN2
QuadSPI Mode SDR SDR SDR DDR3
Internal
Sampling
Internal DQS Internal
Sampling
Internal DQS Internal
Sampling
External DQS
N1 PAD
Loopback
Internal
Loopback
N1 PAD
Loopback
Internal
Loopback
N1 External DQS
Min Max Min Max Min Max Min Max Min Max Min Max Min Max Min Max
SCK Duty Cycle tSDC ns
tSCK/2 - 1.5
tSCK/2 + 1.5
tSCK/2 - 1.5
tSCK/2 + 1.5
tSCK/2 - 1.5
tSCK/2 + 1.5
tSCK/2 - 1.5
tSCK/2 + 1.5
tSCK/2 - 0.750
tSCK/2 - 0.750
tSCK/2 - 1.5
tSCK/2 + 1.5
tSCK/2 - 2.5
tSCK/2 + 2.5
tSCK/2 - 2.5
tSCK/2 + 2.5
Data Input Setup Time tIS ns 15 - 2.5 - 10 - 14 - 1.6 - 9 - 25 - 2 -
Data Input Hold Time tIH ns 0 - 1 - 1 - 0 - 1 - 1 - 0 - 20 -
Data Output Valid Time tOV ns - 4.5 - 4.5 - 4.5 - 4 - 4 - 4 - 10 - 10
Data Output In-Valid
Time
tIV ns 5 - 5 - 5 - 5 - 35- 5 - 5 - 5 -
CS to SCK Time 6tCSSCK ns 5 - 5 - 5 - 5 - 5 - 5 - 10 - 10 -
SCK to CS Time 7tSCKCS ns 5 - 5 - 5 - 5 - 5 - 5 - 5 - 5 -
Output Load pf 25 25 25 25 25 25 25 25
1. See Reference Manual for details on mode settings
2. See Reference Manual for details on mode settings
3. Valid for HyperRAM only
4. RWDS(External DQS CLK) frequency
5. For operating frequency ≤ 64 Mhz,Output invalid time is 5 ns.
6. Program register value QuadSPI_FLSHCR[TCSS] = 4`h2
7. Program register value QuadSPI_FLSHCR[TCSH] = 4`h1
Memory and memory interfaces
S32K1xx Data Sheet, Rev. 7, 04/2018
NXP Semiconductors 39
1 2 3
tSCK
tIS
tIH
Clock
SCK
CS
Data in
tSDC
tSDC
Figure 9. QuadSPI input timing (SDR mode) diagram
123
tIV
tOV
tSCK
tCSSCK tSCKCS
Clock
SCK
CS
Data out
tSDC tSDC
tSDC
Figure 10. QuadSPI output timing (SDR mode) diagram
invalid invalid
D2 invalid invalid
D4
D3
D1 D5
TIS TIS
TIH
TIH
TIS– Setup Time
TIH– Hold Time
Figure 11. QuadSPI input timing (HyperRAM mode) diagram
Memory and memory interfaces
S32K1xx Data Sheet, Rev. 7, 04/2018
40 NXP Semiconductors
SCK
tOV
Output Invalid Data
tIV
Figure 12. QuadSPI output timing (HyperRAM mode) diagram
Analog modules
ADC electrical specifications
6.4.1.1 12-bit ADC operating conditions
Table 26. 12-bit ADC operating conditions
Symbol Description Conditions Min. Typ.1Max. Unit Notes
VREFH ADC reference voltage high See Voltage
and current
operating
requirements
for values
VDDA See Voltage
and current
operating
requirements
for values
V2
VREFL ADC reference voltage low See Voltage
and current
operating
requirements
for values
0 See Voltage
and current
operating
requirements
for values
mV 2
VADIN Input voltage VREFL — VREFH V
RSSource impedendance fADCK < 4 MHz — — 5 kΩ
RSW1 Channel Selection Switch
Impedance
— 0.75 1.2 kΩ
RAD Sampling Switch Impedance — 2 5 kΩ
CP1 Pin Capacitance — 10 — pF
CP2 Analog Bus Capacitance — — 4 pF
CSSampling capacitance — 4 5 pF
Table continues on the next page...
6.4
6.4.1
Analog modules
S32K1xx Data Sheet, Rev. 7, 04/2018
NXP Semiconductors 41
Table 26. 12-bit ADC operating conditions (continued)
Symbol Description Conditions Min. Typ.1Max. Unit Notes
fADCK ADC conversion clock
frequency
Normal usage 2 40 50 MHz 3, 4
fCONV ADC conversion frequency No ADC hardware
averaging.5 Continuous
conversions enabled,
subsequent conversion
time
46.4 928 1160 Ksps 6, 7
ADC hardware averaging
set to 32. 5 Continuous
conversions enabled,
subsequent conversion
time
1.45 29 36.25 Ksps 6, 7
1. Typical values assume VDDA = 5 V, Temp = 25 °C, fADCK = 40 MHz, RAS=20 Ω, and CAS=10 nF unless otherwise stated.
Typical values are for reference only, and are not tested in production.
2. For packages without dedicated VREFH and VREFL pins, VREFH is internally tied to VDDA, and VREFL is internally tied to VSS.
To get maximum performance, reference supply quality should be better than SAR ADC. See application note AN5032 for
details.
3. Clock and compare cycle need to be set according to the guidelines mentioned in the Reference Manual .
4. ADC conversion will become less reliable above maximum frequency.
5. When using ADC hardware averaging, see the Reference Manual to determine the most appropriate setting for AVGS.
6. Numbers based on the minimum sampling time of 275 ns.
7. For guidelines and examples of conversion rate calculation, see the Reference Manual or download the ADC calculator
tool.
Figure 13. ADC input impedance equivalency diagram
ADC electrical specifications
S32K1xx Data Sheet, Rev. 7, 04/2018
42 NXP Semiconductors
6.4.1.2 12-bit ADC electrical characteristics
NOTE
• ADC performance specifications are documented using a
single ADC. For parallel/simultaneous operation of both
ADCs, either for sampling the same channel by both ADCs
or for sampling different channels by each ADC, some
amount of decrease in performance can be expected. Care
must be taken to stagger the two ADC conversions, in
particular the sample phase, to minimize the impact of
simultaneous conversions.
• On reduced pin packages where ADC reference pins are
shared with supply pins, ADC analog performance
characteristics may be impacted. The amount of variation
will be directly impacted by the external PCB layout and
hence care must be taken with PCB routing. See AN5426
for details
Table 27. 12-bit ADC characteristics (2.7 V to 3 V) (VREFH = VDDA, VREFL = VSS)
Symbol Description Conditions 1Min. Typ.2Max. Unit Notes
VDDA Supply voltage 2.7 — 3 V
IDDA_ADC Supply current per ADC — 0.6 — mA 3
SMPLTS Sample Time 275 — Refer to
the
Reference
Manual
ns
TUE4Total unadjusted error — ±4 ±8 LSB56, 7, 8, 9
DNL Differential non-linearity — ±1.0 — LSB56, 7, 8, 9
INL Integral non-linearity — ±2.0 — LSB56, 7, 8, 9
1. All accuracy numbers assume the ADC is calibrated with VREFH=VDDA=VDD, with the calibration frequency set to half the
ADC clock frequency.
2. Typical values assume VDDA = 3 V, Temp = 25 °C, fADCK = 40 MHz, RAS=20 Ω, and CAS=10 nF.
3. The ADC supply current depends on the ADC conversion rate.
4. Represents total static error, which includes offset and full scale error.
5. 1 LSB = (VREFH - VREFL)/2N
6. The specifications are with averaging and in standalone mode only. Performance may degrade depending upon device
use case scenario. When using ADC averaging, refer to the Reference Manual to determine the most appropriate settings
for AVGS.
7. For ADC signals adjacent to VDD/VSS or XTAL/EXTAL or high frequency switching pins, some degradation in the ADC
performance may be observed.
8. All values guarantee the performance of the ADC for multiple ADC input channel pins. When using ADC to monitor the
internal analog parameters, assume minor degradation.
9. All the parameters in the table are given assuming system clock as the clocking source for ADC.
ADC electrical specifications
S32K1xx Data Sheet, Rev. 7, 04/2018
NXP Semiconductors 43
Table 28. 12-bit ADC characteristics (3 V to 5.5 V)(VREFH = VDDA, VREFL = VSS)
Symbol Description Conditions 1Min. Typ.2Max. Unit Notes
VDDA Supply voltage 3 — 5.5 V
IDDA_ADC Supply current per ADC — 1 — mA 3
SMPLTS Sample Time 275 — Refer to
the
Reference
Manual
ns
TUE4Total unadjusted error — ±4 ±8 LSB56, 7, 8, 9
DNL Differential non-linearity — ±0.7 — LSB56, 7, 8, 9
INL Integral non-linearity — ±1.0 — LSB56, 7, 8, 9
1. All accuracy numbers assume the ADC is calibrated with VREFH=VDDA=VDD, with the calibration frequency set to half the
ADC clock frequency.
2. Typical values assume VDDA = 5.0 V, Temp = 25 °C, fADCK = 40 MHz, RAS=20 Ω, and CAS=10 nF unless otherwise stated.
3. The ADC supply current depends on the ADC conversion rate.
4. Represents total static error, which includes offset and full scale error.
5. 1 LSB = (VREFH - VREFL)/2N
6. The specifications are with averaging and in standalone mode only. Performance may degrade depending upon device
use case scenario. When using ADC averaging, refer to the Reference Manual to determine the most appropriate settings
for AVGS.
7. For ADC signals adjacent to VDD/VSS or XTAL/EXTAL or high frequency switching pins, some degradation in the ADC
performance may be observed.
8. All values guarantee the performance of the ADC for multiple ADC input channel pins. When using ADC to monitor the
internal analog parameters, assume minor degradation.
9. All the parameters in the table are given assuming system clock as the clocking source for ADC.
NOTE
• Due to triple bonding in lower pin packages like 32-QFN,
48-LQFP, and 64-LQFP degradation might be seen in ADC
parameters.
• When using high speed interfaces such as the QuadSPI,
SAI0, SAI1 or ENET there may be some ADC degradation
on the adjacent analog input paths. See following table for
details.
Pin name TGATE purpose
PTE8 CMP0_IN3
PTC3 ADC0_SE11/CMP0_IN4
PTC2 ADC0_SE10/CMP0_IN5
PTD7 CMP0_IN6
PTD6 CMP0_IN7
PTD28 ADC1_SE22
PTD27 ADC1_SE21
ADC electrical specifications
S32K1xx Data Sheet, Rev. 7, 04/2018
44 NXP Semiconductors
6.4.2 CMP with 8-bit DAC electrical specifications
Table 30. Comparator with 8-bit DAC electrical specifications
Symbol Description Min. Typ. Max. Unit
IDDHS Supply current, High-speed mode1μA
-40 - 125 ℃— 230 300
IDDLS Supply current, Low-speed mode1μA
-40 - 105 ℃— 6 11
-40 - 125 ℃6 13
VAIN Analog input voltage 0 0 - VDDA VDDA V
VAIO Analog input offset voltage, High-speed mode mV
-40 - 125 ℃-25 ±1 25
VAIO Analog input offset voltage, Low-speed mode mV
-40 - 125 ℃-40 ±4 40
tDHSB Propagation delay, High-speed mode2ns
-40 - 105 ℃— 35 200
-40 - 125 ℃35 300
tDLSB Propagation delay, Low-speed mode2µs
-40 - 105 ℃— 0.5 2
-40 - 125 ℃— 0.5 3
tDHSS Propagation delay, High-speed mode3ns
-40 - 105 ℃— 70 400
-40 - 125 ℃— 70 500
tDLSS Propagation delay, Low-speed mode3µs
-40 - 105 ℃— 1 5
-40 - 125 ℃— 1 5
tIDHS Initialization delay, High-speed mode4μs
-40 - 125 ℃— 1.5 3
tIDLS Initialization delay, Low-speed mode4μs
-40 - 125 ℃— 10 30
VHYST0 Analog comparator hysteresis, Hyst0 (VAIO) mV
-40 - 125 ℃—0—
VHYST1 Analog comparator hysteresis, Hyst1, High-speed
mode
mV
-40 - 125 ℃— 19 66
Analog comparator hysteresis, Hyst1, Low-speed
mode
-40 - 125 ℃— 15 40
VHYST2 Analog comparator hysteresis, Hyst2, High-speed
mode
mV
-40 - 125 ℃— 34 133
Table continues on the next page...
ADC electrical specifications
S32K1xx Data Sheet, Rev. 7, 04/2018
NXP Semiconductors 45
Table 30. Comparator with 8-bit DAC electrical specifications (continued)
Symbol Description Min. Typ. Max. Unit
Analog comparator hysteresis, Hyst2, Low-speed
mode
-40 - 125 ℃— 23 80
VHYST3 Analog comparator hysteresis, Hyst3, High-speed
mode
mV
-40 - 125 ℃— 46 200
Analog comparator hysteresis, Hyst3, Low-speed
mode
-40 - 125 ℃— 32 120
IDAC8b 8-bit DAC current adder (enabled)
3.3V Reference Voltage — 6 9 μA
5V Reference Voltage — 10 16 μA
INL58-bit DAC integral non-linearity –0.75 — 0.75 LSB6
DNL 8-bit DAC differential non-linearity –0.5 — 0.5 LSB6
tDDAC Initialization and switching settling time — — 30 μs
1. Difference at input > 200mV
2. Applied ± (100 mV + VHYST0/1/2/3+ max. of VAIO) around switch point.
3. Applied ± (30 mV + 2 × VHYST0/1/2/3+ max. of VAIO) around switch point.
4. Applied ± (100 mV + VHYST0/1/2/3).
5. Calculation method used: Linear Regression Least Square Method
6. 1 LSB = Vreference/256
NOTE
For comparator IN signals adjacent to VDD/VSS or XTAL/
EXTAL or switching pins cross coupling may happen and
hence hysteresis settings can be used to obtain the desired
comparator performance. Additionally, an external capacitor
(1nF) should be used to filter noise on input signal. Also, source
drive should not be weak (Signal with < 50 K pull up/down is
recommended).
ADC electrical specifications
S32K1xx Data Sheet, Rev. 7, 04/2018
46 NXP Semiconductors
Figure 14. Typical hysteresis vs. Vin level (VDDA = 3.3 V, PMODE = 0)
Figure 15. Typical hysteresis vs. Vin level (VDDA = 3.3 V, PMODE = 1)
ADC electrical specifications
S32K1xx Data Sheet, Rev. 7, 04/2018
NXP Semiconductors 47
Figure 16. Typical hysteresis vs. Vin level (VDDA = 5 V, PMODE = 0)
Figure 17. Typical hysteresis vs. Vin level (VDDA = 5 V, PMODE = 1)
ADC electrical specifications
S32K1xx Data Sheet, Rev. 7, 04/2018
48 NXP Semiconductors
Communication modules
6.5.1 LPUART electrical specifications
Refer to General AC specifications for LPUART specifications.
6.5.1.1 Supported baud rate
Baud rate = Baud clock / ((OSR+1) * SBR).
For details, see section: 'Baud rate generation' of the Reference Manual.
6.5.2 LPSPI electrical specifications
The Low Power Serial Peripheral Interface (LPSPI) provides a synchronous serial bus
with master and slave operations. Many of the transfer attributes are programmable. The
following tables provide timing characteristics for classic LPSPI timing modes.
• All timing is shown with respect to 20% VDD and 80% VDD thresholds.
• All measurements are with maximum output load of 50 pF, input transition of 1 ns
and pad configured with fastest slew setting ( DSE = 1 ).
6.5
Communication modules
S32K1xx Data Sheet, Rev. 7, 04/2018
NXP Semiconductors 49
Table 31. LPSPI electrical specifications1
Num Symbol Description Conditions Run Mode2HSRUN Mode2VLPR Mode Unit
5.0 V IO 3.3 V IO 5.0 V IO 3.3 V IO 5.0 V IO 3.3 V IO
Min. Max. Min. Max. Min. Max. Min. Max. Min. Max. Min. Max.
fperiph, 3, 4Peripheral
Frequency
Slave - 40 - 40 - 56 - 56 - 4 - 4 MHz
Master - 40 - 40 - 56 - 56 - 4 - 4
Master
Loopback5- 40 - 48 - 48 - 48 - 4 - 4
Master
Loopback(slow)6- 48 - 48 - 48 - 48 - 4 - 4
1 fop Frequency of
operation
Slave - 10 - 10 - 14 - 14 7- 2 - 2 MHz
Master - 10 - 10 - 14 - 14 7- 2 - 2
Master
Loopback5- 20 - 12 - 24 - 12 - 2 - 2
Master
Loopback(slow)6- 12 - 12 - 12 - 12 - 2 - 2
2 tSPSCK SPSCK
period
Slave 100 - 100 - 72 - 72 - 500 - 500 - ns
Master 100 - 100 - 72 - 72 - 500 - 500 -
Master
Loopback550 - 83 - 42 - 83 - 500 - 500 -
Master
Loopback(slow)683 - 83 - 83 - 83 - 500 - 500 -
3 tLead8Enable lead
time (PCS to
SPSCK delay)
Slave - - - - - - - - - - - - ns
Master
(PCSSCK+1)*tperiph-25
-
(PCSSCK+1)*tperiph-25
-
(PCSSCK+1)*tperiph-25
-
(PCSSCK+1)*tperiph-25
-
(PCSSCK+1)*tperiph-50
-
(PCSSCK+1)*tperiph-50
-
Master
Loopback5
Master
Loopback(slow)6
Table continues on the next page...
Communication modules
S32K1xx Data Sheet, Rev. 7, 04/2018
50 NXP Semiconductors
Table 31. LPSPI electrical specifications1 (continued)
Num Symbol Description Conditions Run Mode2HSRUN Mode2VLPR Mode Unit
5.0 V IO 3.3 V IO 5.0 V IO 3.3 V IO 5.0 V IO 3.3 V IO
Min. Max. Min. Max. Min. Max. Min. Max. Min. Max. Min. Max.
4 tLag9Enable lag
time (After
SPSCK delay)
Slave - - - - - - - - - - - - ns
Master
(SCKPCS+1)*tperiph- 25
-
(SCKPCS+1)*tperiph- 25
-
(SCKPCS+1)*tperiph- 25
-
(SCKPCS+1)*tperiph- 25
-
(SCKPCS+1)*tperiph- 50
-
(SCKPCS+1)*tperiph- 50
-
Master
Loopback5
Master
Loopback(slow)6
5 tWSPSCK10 Clock(SPSCK
) high or low
time (SPSCK
duty cycle)
Slave
tSPSCK/2-3
tSPSCK/2+3
tSPSCK/2-3
tSPSCK/2+3
tSPSCK/2-3
tSPSCK/2+3
tSPSCK/2-3
tSPSCK/2+3
tSPSCK/2-5
tSPSCK/2+5
tSPSCK/2-5
tSPSCK/2+5
ns
Master
Master
Loopback5
Master
Loopback(slow)6
6 tSU Data setup
time(inputs)
Slave 3 - 5 - 3 - 5 - 18 - 18 - ns
Master 29 - 38 - 26 - 3711
32 12
- 72 - 78 -
Master
Loopback57 - 8 - 5 - 7 - 20 - 20 -
Master
Loopback(slow)68 - 10 - 7 - 9 - 20 - 20 -
7 tHI Data hold
time(inputs)
Slave 3 - 3 - 3 - 3 - 14 - 14 - ns
Master 0 - 0 - 0 - 0 - 0 - 0 -
Master
Loopback53 - 3 - 2 - 3 - 11 - 11 -
Master
Loopback(slow)63 - 3 - 3 - 3 - 12 - 12 -
Table continues on the next page...
Communication modules
S32K1xx Data Sheet, Rev. 7, 04/2018
NXP Semiconductors 51
Table 31. LPSPI electrical specifications1 (continued)
Num Symbol Description Conditions Run Mode2HSRUN Mode2VLPR Mode Unit
5.0 V IO 3.3 V IO 5.0 V IO 3.3 V IO 5.0 V IO 3.3 V IO
Min. Max. Min. Max. Min. Max. Min. Max. Min. Max. Min. Max.
8 taSlave access
time
Slave - 50 - 50 - 50 - 50 - 100 - 100 ns
9 tdis Slave MISO
(SOUT)
disable time
Slave - 50 - 50 - 50 - 50 - 100 - 100 ns
10 tvData valid
(after SPSCK
edge)
Slave - 30 - 39 - 26 - 36 11
31 12
- 92 - 96 ns
Master - 12 - 16 - 11 - 15 - 47 - 48
Master
Loopback5- 12 - 16 - 11 - 15 - 47 - 48
Master
Loopback(slow)6- 8 - 10 - 7 - 9 - 44 - 44
11 tHO Data hold
time(outputs)
Slave 4 - 4 - 4 - 4 - 4 - 4 - ns
Master -15 - -22 - -15 - -23 - -22 - -29 -
Master
Loopback5-10 - -14 - -10 - -14 - -14 - -19 -
Master
Loopback(slow)6-15 - -22 - -15 - -22 - -21 - -27 -
12 tRI/FI Rise/Fall time
input
Slave - 1 - 1 - 1 - 1 - 1 - 1 ns
Master - - - - - -
Master
Loopback5- - - - - -
Master
Loopback(slow)6- - - - - -
13 tRO/FO Rise/Fall time
output
Slave - 25 - 25 - 25 - 25 - 25 - 25 ns
Master - - - - - -
Master
Loopback 5- - - - - -
Table continues on the next page...
Communication modules
S32K1xx Data Sheet, Rev. 7, 04/2018
52 NXP Semiconductors
Table 31. LPSPI electrical specifications1 (continued)
Num Symbol Description Conditions Run Mode2HSRUN Mode2VLPR Mode Unit
5.0 V IO 3.3 V IO 5.0 V IO 3.3 V IO 5.0 V IO 3.3 V IO
Min. Max. Min. Max. Min. Max. Min. Max. Min. Max. Min. Max.
Master
Loopback(slow)
6
- - - - - -
1. Trace length should not exceed 11 inches for SCK pad when used in Master loopback mode.
2. While transitioning from HSRUN mode to RUN mode, LPSPI output clock should not be more than 14 MHz.
3. fperiph = LPSPI peripheral clock
4. tperiph = 1/fperiph
5. Master Loopback mode - In this mode LPSPI_SCK clock is delayed for sampling the input data which is enabled by setting LPSPI_CFGR1[SAMPLE] bit as 1.
Clock pads used are PTD15 and PTE0. Applicable only for LPSPI0.
6. Master Loopback (slow) - In this mode LPSPI_SCK clock is delayed for sampling the input data which is enabled by setting LPSPI_CFGR1[SAMPLE] bit as 1.
Clock pad used is PTB2. Applicable only for LPSPI0.
7. This is the maximum operating frequency (fop) for LPSPI0 with medium PAD type only. Otherwise, the maximum operating frequency (fop) is 12 Mhz.
8. Set the PCSSCK configuration bit as 0, for a minimum of 1 delay cycle of LPSPI baud rate clock, where PCSSCK ranges from 0 to 255.
9. Set the SCKPCS configuration bit as 0, for a minimum of 1 delay cycle of LPSPI baud rate clock, where SCKPCS ranges from 0 to 255.
10. While selecting odd dividers, ensure Duty Cycle is meeting this parameter.
11. Maximum operating frequency (fop ) is 12 MHz irrespective of PAD type and LPSPI instance.
12. Applicable for LPSPI0 only with medium PAD type, with maximum operating frequency (fop) as 14 MHz.
Communication modules
S32K1xx Data Sheet, Rev. 7, 04/2018
NXP Semiconductors 53
(OUTPUT)
2
10
6 7
MSB IN2
LSB IN
MSB OUT2 LSB OUT
11
5
5
3
(CPOL=0)
4
13
13
12
12
SPSCK
SPSCK
(CPOL=1)
2. LSBF = 0. For LSBF = 1, bit order is LSB, bit 1, ..., bit 6, MSB.
1. If configured as an output.
SS1
(OUTPUT)
(OUTPUT)
MOSI
(OUTPUT)
MISO
(INPUT) BIT 6 . . . 1
BIT 6 . . . 1
Figure 18. LPSPI master mode timing (CPHA = 0)
<<CLASSIFICATION>>
<<NDA MESSAGE>>
38
2
6 7
MSB IN2
BIT 6 . . . 1
MASTER MSB OUT2 MASTER LSB OUT
5
5
10
12 13
PORT DATA PORT DATA
312 13 4
1.If configured as output
2. LSBF = 0. For LSBF = 1, bit order is LSB, bit 1, ..., bit 6, MSB.
11
(OUTPUT)
(CPOL=0)
SPSCK
SPSCK
(CPOL=1)
SS1
(OUTPUT)
(OUTPUT)
MOSI
(OUTPUT)
MISO
(INPUT) LSB IN
BIT 6 . . . 1
Figure 19. LPSPI master mode timing (CPHA = 1)
Communication modules
S32K1xx Data Sheet, Rev. 7, 04/2018
54 NXP Semiconductors
2
10
6 7
MSB IN
BIT 6 . . . 1
SLAVE MSB SLAVE LSB OUT
11
5
5
3
8
4
13
12
12
11
See
note 1
13
9
See
note1
(INPUT)
(CPOL=0)
SPSCK
SPSCK
(CPOL=1)
SS
(INPUT)
(INPUT)
MOSI
(INPUT)
MISO
(OUTPUT)
LSB IN
BIT 6 . . . 1
Notes:
1. Undefined
Figure 20. LPSPI slave mode timing (CPHA = 0)
2
6 7
MSB IN
BIT 6 . . . 1
MSB OUT SLAVE LSB OUT
5
5
10
12 13
312 13
4
SLAVE
8
9
See
note 1
(INPUT)
(CPOL=0)
SPSCK
SPSCK
(CPOL=1)
SS
(INPUT)
(INPUT)
MOSI
(INPUT)
MISO
(OUTPUT)
11
LSB IN
BIT 6 . . . 1
Notes:
1. Undefined
Figure 21. LPSPI slave mode timing (CPHA = 1)
6.5.3 LPI2C electrical specifications
See General AC specifications for LPI2C specifications.
For supported baud rate see section 'Chip-specific LPI2C information' of the Reference
Manual.
Communication modules
S32K1xx Data Sheet, Rev. 7, 04/2018
NXP Semiconductors 55
6.5.4 FlexCAN electical specifications
For supported baud rate, see section 'Protocol timing' of the Reference Manual.
6.5.5 SAI electrical specifications
The following table describes the SAI electrical characteristics.
• Measurements are with maximum output load of 50 pF, input transition of 1 ns and
pad configured with fastest slew settings (DSE = 1'b1).
• I/O operating voltage ranges from 2.97 V to 3.6 V
• While doing the mode transition (RUN -> HSRUN or HSRUN -> RUN ), the
interface should be OFF.
Table 32. Master mode timing specifications
Symbol Description Min. Max. Unit
— Operating voltage 2.97 3.6 V
S1 SAI_MCLK cycle time 40 — ns
S2 SAI_MCLK pulse width high/low 45% 55% MCLK period
S3 SAI_BCLK cycle time 80 — ns
S4 SAI_BCLK pulse width high/low 45% 55% BCLK period
S5 SAI_RXD input setup before
SAI_BCLK
28 — ns
S6 SAI_RXD input hold after
SAI_BCLK
0 — ns
S7 SAI_BCLK to SAI_TXD output
valid
— 8 ns
S8 SAI_BCLK to SAI_TXD output
invalid
-2 — ns
S9 SAI_FS input setup before
SAI_BCLK
28 — ns
S10 SAI_FS input hold after
SAI_BCLK
0 — ns
S11 SAI_BCLK to SAI_FS output
valid
— 8 ns
S12 SAI_BCLK to SAI_FS output
invalid
-2 — ns
Communication modules
S32K1xx Data Sheet, Rev. 7, 04/2018
56 NXP Semiconductors
S1 S2 S2
S3
S4
S4
S11
S9
S7
S5 S6
S7
S8
S12
S10
S8
SAI_MCLK (output)
SAI_BCLK (output)
SAI_FS (output)
SAI_FS (input)
SAI_TXD
SAI_RXD
Figure 22. SAI Timing — Master modes
Table 33. Slave mode timing specifications
Symbol Description Min. Max. Unit
— Operating voltage 2.97 3.6 V
S13 SAI_BCLK cycle time (input) 80 — ns
S141SAI_BCLK pulse width high/low
(input)
45% 55% BCLK period
S15 SAI_RXD input setup before
SAI_BCLK
8 — ns
S16 SAI_RXD input hold after
SAI_BCLK
2 — ns
S17 SAI_BCLK to SAI_TXD output
valid
— 28 ns
S18 SAI_BCLK to SAI_TXD output
invalid
0 — ns
S19 SAI_FS input setup before
SAI_BCLK
8 — ns
S20 SAI_FS input hold after SAI_BCLK 2 — ns
S21 SAI_BCLK to SAI_FS output valid — 28 ns
S22 SAI_BCLK to SAI_FS output
invalid
0 — ns
1. The slave mode parameters (S15 - S22) assume 50% duty cycle on SAI_BCLK input. Any change in SAI_BCLK duty cycle
input must be taken care during the board design or by the master timing.
Communication modules
S32K1xx Data Sheet, Rev. 7, 04/2018
NXP Semiconductors 57
S21
S19
S17
S15 S16
S17
S18
S22
S20
S18
S13
S14
S14
SAI_BCLK (input)
SAI_FS (output)
SAI_FS (input)
SAI_TXD
SAI_RXD
Figure 23. SAI Timing — Slave modes
6.5.6 Ethernet AC specifications
The following timing specs are defined at the chip I/O pin and must be translated
appropriately to arrive at timing specs/constraints for the physical interface.
The following table describes the MII electrical characteristics.
• Measurements are with maximum output load of 25 pF, input transition of 1 ns and
pad configured with fastest slew settings (DSE = 1'b1).
• I/O operating voltage ranges from 2.97 V to 3.6 V
• While doing the mode transition (RUN -> HSRUN or HSRUN -> RUN ), the
interface should be OFF.
Table 34. MII signal switching specifications
Symbol Description Min. Max. Unit
— RXCLK frequency — 25 MHz
MII1 RXCLK pulse width high 35% 65% RXCLK period
MII2 RXCLK pulse width low 35% 65% RXCLK period
MII3 RXD[3:0], RXDV, RXER to RXCLK setup 5 — ns
MII4 RXCLK to RXD[3:0], RXDV, RXER hold 5 — ns
— TXCLK frequency — 25 MHz
MII5 TXCLK pulse width high 35% 65% TXCLK period
MII6 TXCLK pulse width low 35% 65% TXCLK period
MII7 TXCLK to TXD[3:0], TXEN, TXER invalid 2 — ns
MII8 TXCLK to TXD[3:0], TXEN, TXER valid — 25 ns
Communication modules
S32K1xx Data Sheet, Rev. 7, 04/2018
58 NXP Semiconductors
MII2 MII1
MII4MII3
Valid data
Valid data
Valid data
RXCLK (input)
RXD[n:0]
RXDV
RXER
Figure 24. MII receive diagram
MII7MII8
Valid data
Valid data
Valid data
MII6 MII5
TXCLK (input)
TXD[n:0]
TXEN
TXER
Figure 25. MII transmit signal diagram
The following table describes the RMII electrical characteristics.
• Measurements are with maximum output load of 25 pF, input transition of 1 ns and
pad configured with fastest slew settings (DSE = 1'b1).
• I/O operating voltage ranges from 2.97 V to 3.6 V
• While doing the mode transition (RUN -> HSRUN or HSRUN -> RUN ), the
interface should be OFF.
Table 35. RMII signal switching specifications
Symbol Description Min. Max. Unit
— RMII input clock RMII_CLK Frequency — 50 MHz
RMII1, RMII5 RMII_CLK pulse width high 35% 65% RMII_CLK
period
RMII2, RMII6 RMII_CLK pulse width low 35% 65% RMII_CLK
period
RMII3 RXD[1:0], CRS_DV, RXER to RMII_CLK setup 4 — ns
RMII4 RMII_CLK to RXD[1:0], CRS_DV, RXER hold 2 — ns
Table continues on the next page...
Communication modules
S32K1xx Data Sheet, Rev. 7, 04/2018
NXP Semiconductors 59
Table 35. RMII signal switching specifications
(continued)
Symbol Description Min. Max. Unit
RMII7 RMII_CLK to TXD[1:0], TXEN invalid 2 — ns
RMII8 RMII_CLK to TXD[1:0], TXEN valid — 15 ns
RMII2 RMII1
RMII4
RMII3
Valid data
Valid data
Valid data
RMII_CLK(input)
RXD[n:0]
CRS_DV
RXER
Figure 26. RMII receive diagram
RMII7RMII8
Valid data
Valid data
RMII6 RMII5
RMII_CLK (input)
TXD[n:0]
TXEN
Figure 27. RMII transmit diagram
The following table describes the MDIO electrical characteristics.
• Measurements are with maximum output load of 25 pF, input transition of 1 ns and
pad configured with fastest slew settings (DSE = 1'b1).
• I/O operating voltage ranges from 2.97 V to 3.6 V
• While doing the mode transition (RUN -> HSRUN or HSRUN -> RUN ), the
interface should be OFF.
• MDIO pin must have external Pull-up.
Table 36. MDIO timing specifications
Symbol Description Min. Max. Unit
— MDC Clock Frequency — 2.5 MHz
Table continues on the next page...
Communication modules
S32K1xx Data Sheet, Rev. 7, 04/2018
60 NXP Semiconductors
Table 36. MDIO timing specifications (continued)
Symbol Description Min. Max. Unit
MDC1 MDC pulse width high 40% 60% MDC period
MDC2 MDC pulse width low 40% 60% MDC period
MDC3 MDIO (input) to MDC rising edge setup 25 — ns
MDC4 MDIO (input) to MDC rising edge hold 0 — ns
MDC5 MDC falling edge to MDIO output valid
(maximum propagation delay)
— 25 ns
MDC6 MDC falling edge to MDIO output invalid
(minimum propagation delay)
-10 — ns
MDC (output)
MDIO (output)
MDIO (input)
MDC6
MDC5
MDC3 MDC4
MDC1 MDC2
Figure 28. MII/RMII serial management channel timing diagram
6.5.7 Clockout frequency
Maximum supported clock out frequency for this device is 20 MHz
Debug modules
6.6.1 SWD electrical specofications
6.6
Debug modules
S32K1xx Data Sheet, Rev. 7, 04/2018
NXP Semiconductors 61
Table 37. SWD electrical specifications
Symbol Description Run Mode HSRUN Mode VLPR Mode Unit
5.0 V IO 3.3 V IO 5.0 V IO 3.3 V IO 5.0 V IO 3.3 V IO
Min. Max. Min. Max. Min. Max. Min. Max. Min. Max. Min. Max.
S1 SWD_CLK frequency of
operation
- 25 - 25 - 25 - 25 - 10 - 10 MHz
S2 SWD_CLK cycle period 1/S1 - 1/S1 - 1/S1 - 1/S1 - 1/S1 - 1/S1 - ns
S3 SWD_CLK clock pulse width
S2/2 - 5
S2/2 + 5
S2/2 - 5
S2/2 + 5
S2/2 - 5
S2/2 + 5
S2/2 - 5
S2/2 + 5
S2/2 - 5
S2/2 + 5
S2/2 - 5
S2/2 + 5
ns
S4 SWD_CLK rise and fall times - 1 - 1 - 1 - 1 - 1 - 1 ns
S9 SWD_DIO input data setup time
to SWD_CLK rise
4 - 4 - 4 - 4 - 16 - 16 - ns
S10 SWD_DIO input data hold time
after SWD_CLK rise
3 - 3 - 3 - 3 - 10 - 10 - ns
S11 SWD_CLK high to SWD_DIO
data valid
- 28 - 38 - 28 - 38 - 70 - 77 ns
S12 SWD_CLK high to SWD_DIO
high-Z
- 28 - 38 - 28 - 38 - 70 - 77 ns
S13 SWD_CLK high to SWD_DIO
data invalid
0 - 0 - 0 - 0 - 0 - 0 - ns
Debug modules
S32K1xx Data Sheet, Rev. 7, 04/2018
62 NXP Semiconductors
S2
S3 S3
S4 S4
SWD_CLK (input)
Figure 29. Serial wire clock input timing
S11
S12
S9 S10
Input data valid
Output data valid
SWD_CLK
SWD_DIO
SWD_DIO
SWD_DIO
S13
Figure 30. Serial wire data timing
6.6.2 Trace electrical specifications
The following table describes the Trace electrical characteristics.
• Measurements are with maximum output load of 50 pF, input transition of 1 ns and
pad configured with fastest slew settings (DSE = 1'b1).
• While doing the mode transition (RUN -> HSRUN or HSRUN -> RUN ), the
interface should be OFF.
Table 38. Trace specifications
Symbol Description RUN Mode HSRUN Mode VLPR
Mode
Unit
— Fsys System frequency 80 48 40 112 80 4 MHz
Table continues on the next page...
Debug modules
S32K1xx Data Sheet, Rev. 7, 04/2018
NXP Semiconductors 63
Table 38. Trace specifications (continued)
Symbol Description RUN Mode HSRUN Mode VLPR
Mode
Unit
Trace on fast pads
fTRACE Max Trace frequency 80 48 40 74.667 80 4 MHz
tDVO Data Output Valid 4 4 4 4 4 20 ns
tDIV Data Output Invalid -2 -2 -2 -2 -2 -10 ns
Trace on slow pads
fTRACE Max Trace frequency 22.86 24 20 22.4 22.86 4 MHz
tDVO Data Output Valid 8 8 8 8 8 20 ns
tDIV Data Output Invalid -4 -4 -4 -4 -4 -10 ns
Figure 31. TRACE CLKOUT specifications
6.6.3 JTAG electrical specifications
Debug modules
S32K1xx Data Sheet, Rev. 7, 04/2018
64 NXP Semiconductors
Table 39. JTAG electrical specifications
Symbol Description Run Mode HSRUN Mode VLPR Mode Unit
5.0 V IO 3.3 V IO 5.0 V IO 3.3 V IO 5.0 V IO 3.3 V IO
Min. Max. Min. Max. Min. Max. Min. Max. Min. Max. Min. Max.
JI TCLK frequency of operation MHz
Boundary Scan - 20 - 20 - 20 - 20 - 10 - 10
JTAG - 20 - 20 - 20 - 20 - 10 - 10
J2 TCLK cycle period 1/JI - 1/JI - 1/JI - 1/JI - 1/JI - 1/JI - ns
J3 TCLK clock pulse width ns
Boundary Scan
J2/2 - 5
J2/2 + 5
J2/2 - 5
J2/2 + 5
J2/2 - 5
J2/2 + 5
J2/2 - 5
J2/2 + 5
J2/2 - 5
J2/2 + 5
J2/2 - 5
J2/2 + 5
JTAG
J4 TCLK rise and fall times - 1 - 1 - 1 - 1 - 1 - 1 ns
J5 Boundary scan input data
setup time to TCLK rise
5 - 5 - 5 - 5 - 15 - 15 - ns
J6 Boundary scan input data
hold time after TCLK rise
5 - 5 - 5 - 5 - 8 - 8 - ns
J7 TCLK low to boundary scan
output data valid
- 28 - 32 - 28 - 32 - 80 - 80 ns
J8 TCLK low to boundary scan
output data invalid
0 - 0 - 0 - 0 - 0 - 0 -
J9 TCLK low to boundary scan
output high-Z
- 28 - 32 - 28 - 32 - 80 - 80 ns
J10 TMS, TDI input data setup
time to TCLK rise
3 - 3 - 3 - 3 - 15 - 15 - ns
J11 TMS, TDI input data hold
time after TCLK rise
2 - 2 - 2 - 2 - 8 - 8 - ns
J12 TCLK low to TDO data valid - 28 - 32 - 28 - 32 - 80 - 80 ns
J13 TCLK low to TDO data
invalid
0 - 0 - 0 - 0 - 0 - 0 - ns
J14 TCLK low to TDO high-Z - 28 - 32 - 28 - 32 - 80 - 80 ns
Debug modules
S32K1xx Data Sheet, Rev. 7, 04/2018
NXP Semiconductors 65
J2
J3 J3
J4 J4
TCLK (input)
Figure 32. Test clock input timing
J7
J9
J5 J6
Input data valid
Output data valid
TCLK
Data inputs
Data outputs
Data outputs
J8
Figure 33. Boundary scan (JTAG) timing
Debug modules
S32K1xx Data Sheet, Rev. 7, 04/2018
66 NXP Semiconductors
J12
J10 J11
Input data valid
Output data valid
TCLK
TDI/TMS
TDO
J14
TDO
J13
Figure 34. Test Access Port timing
Thermal attributes
7.1 Description
The tables in the following sections describe the thermal characteristics of the device.
NOTE
Junction temperature is a function of die size, on-chip power
dissipation, package thermal resistance, mounting side (board)
temperature, ambient temperature, air flow, power dissipation
or other components on the board, and board thermal resistance.
7.2 Thermal characteristics
7
Thermal attributes
S32K1xx Data Sheet, Rev. 7, 04/2018
NXP Semiconductors 67
Table 40. Thermal characteristics for 32-pin QFN and 48/64/100/144/176-pin LQFP package
Rating Conditions Symbol Package Values Unit
S32K116 S32K118 S32K142 S32K144 S32K146 S32K148
Thermal resistance, Junction to Ambient
(Natural Convection)1, 2Single layer
board (1s)
RθJA 32 93 NA NA NA NA NA °C/W
48 79 71 NA NA NA NA
64 NA 62 61 61 59 NA
100 NA NA 53 52 51 NA
144 NA NA NA NA 51 44
176 NA NA NA NA NA 42
Thermal resistance, Junction to Ambient
(Natural Convection)1Two layer
board (1s1p)
RθJA 32 50 NA NA NA NA NA
48 58 50 NA NA NA NA
64 NA 46 45 45 44 NA
100 NA NA 42 42 40 NA
144 NA NA NA NA 44 37
176 NA NA NA NA NA 36
Thermal resistance, Junction to Ambient
(Natural Convection)1, 2Four layer
board (2s2p)
RθJA 32 32 NA NA NA NA NA
48 55 47 NA NA NA NA
64 NA 44 43 43 41 NA
100 NA NA 40 40 39 NA
144 NA NA NA NA 42 36
176 NA NA NA NA NA 35
Thermal resistance, Junction to Ambient
(@200 ft/min)1, 3Single layer
board (1s)
RθJMA 32 77 NA NA NA NA NA
48 66 58 NA NA NA NA
64 NA 50 49 49 48 NA
100 NA NA 43 42 41 NA
144 NA NA NA NA 42 36
176 NA NA NA NA NA 34
Thermal resistance, Junction to Ambient
(@200 ft/min)1Two layer
board (1s1p)
RθJMA 32 43 NA NA NA NA NA
48 51 43 NA NA NA NA
64 NA 39 38 38 37 NA
100 NA NA 35 35 34 NA
Table continues on the next page...
Thermal attributes
S32K1xx Data Sheet, Rev. 7, 04/2018
68 NXP Semiconductors
Table 40. Thermal characteristics for 32-pin QFN and 48/64/100/144/176-pin LQFP package
(continued)
Rating Conditions Symbol Package Values Unit
S32K116 S32K118 S32K142 S32K144 S32K146 S32K148
144 NA NA NA NA 37 31
176 NA NA NA NA NA 30
Thermal resistance, Junction to Ambient
(@200 ft/min)1, 3Four layer
board (2s2p)
RθJMA 32 26 NA NA NA NA NA
48 48 41 NA NA NA NA
64 NA 37 36 36 35 NA
100 NA NA 34 34 33 NA
144 NA NA NA NA 36 30
176 NA NA NA NA NA 29
Thermal resistance, Junction to Board4— RθJB 32 11 NA NA NA NA NA
48 33 24 NA NA NA NA
64 NA 26 25 25 23 NA
100 NA NA 25 25 24 NA
144 NA NA NA NA 30 24
176 NA NA NA NA NA 24
Thermal resistance, Junction to Case 5— RθJC 32 NA NA NA NA NA NA
48 23 19 NA NA NA NA
64 NA 14 13 12 11 NA
100 NA NA 13 12 11 NA
144 NA NA NA NA 12 9
176 NA NA NA NA NA 9
Thermal resistance, Junction to Case
(Bottom) 6— RθJCBottom 32 1 NA
48 NA
64
100
144
176
Table continues on the next page...
Thermal attributes
S32K1xx Data Sheet, Rev. 7, 04/2018
NXP Semiconductors 69
Table 40. Thermal characteristics for 32-pin QFN and 48/64/100/144/176-pin LQFP package
(continued)
Rating Conditions Symbol Package Values Unit
S32K116 S32K118 S32K142 S32K144 S32K146 S32K148
Thermal resistance, Junction to Package
Top7Natural
Convection
ψJT 32 1 NA NA NA NA NA
48 4 2 NA NA NA NA
64 NA 2 2 2 2 NA
100 NA NA 2 2 2 NA
144 NA NA NA NA 2 1
176 NA NA NA NA NA 1
1. Junction temperature is a function of die size, on-chip power dissipation, package thermal resistance, mounting site (board) temperature, ambient temperature, air
flow, power dissipation of other components on the board, and board thermal resistance.
2. Per JEDEC JESD51-2 with natural convection for horizontally oriented board. Board meets JESD51-9 specification for 1s or 2s2p board, respectively.
3. Per JEDEC JESD51-6 with forced convection for horizontally oriented board. Board meets JESD51-9 specification for 1s or 2s2p board, respectively.
4. Thermal resistance between the die and the printed circuit board per JEDEC JESD51-8. Board temperature is measured on the top surface of the board near the
package.
5. Thermal resistance between the die and the case top surface as measured by the cold plate method (MIL SPEC-883 Method 1012.1).
6. Thermal resistance between the die and the solder pad on the bottom of the package. Interface resistance is ignored.
7. Thermal characterization parameter indicating the temperature difference between package top and the junction temperature per JEDEC JESD51-2. When Greek
letters are not available, the thermal characterization parameter is written as Psi-JT.
Thermal attributes
S32K1xx Data Sheet, Rev. 7, 04/2018
70 NXP Semiconductors
Table 41. Thermal characteristics for the 100 MAPBGA package
Rating Conditions Symbol Values Unit
S32K146 S32K144 S32K148
Thermal resistance, Junction to Ambient (Natural
Convection) 1, 2Single layer board (1s) RθJA 57.2 61.0 52.5 °C/W
Thermal resistance, Junction to Ambient (Natural
Convection) 1, 2, 3Four layer board
(2s2p)
RθJA 32.1 35.6 27.5 °C/W
Thermal resistance, Junction to Ambient (@200 ft/min) 1, 2, 3Single layer board (1s) RθJMA 44.1 46.6 39.0 °C/W
Thermal resistance, Junction to Ambient (@200 ft/min)1, 3Two layer board
(2s2p)
RθJMA 27.2 30.9 22.8 °C/W
Thermal resistance, Junction to Board4— RθJB 15.3 18.9 11.2 °C/W
Thermal resistance, Junction to Case 5— RθJC 10.2 14.2 7.5 °C/W
Thermal resistance, Junction to Package Top outside
center6—ψJT 0.2 0.4 0.2 °C/W
Thermal resistance, Junction to Package Bottom outside
center7—ψJB 12.2 15.9 18.3 °C/W
1. Junction temperature is a function of die size, on-chip power dissipation, package thermal resistance, mounting site (board) temperature, ambient temperature, air
flow, power dissipation of other components on the board, and board thermal resistance.
2. Per SEMI G38-87 and JEDEC JESD51-2 with the single layer board horizontal.
3. Per JEDEC JESD51-6 with the board horizontal.
4. Thermal resistance between the die and the printed circuit board per JEDEC JESD51-8. Board temperature is measured on the top surface of the board near the
package.
5. Thermal resistance between the die and the case top surface as measured by the cold plate method (MIL SPEC-883 Method 1012.1).
6. Thermal characterization parameter indicating the temperature difference between package top and the junction temperature per JEDEC JESD51-2. When Greek
letters are not available, the thermal characterization parameter is written as Psi-JT.
7. Thermal characterization parameter indicating the temperature difference between package bottom center and the junction temperature per JEDEC JESD51-12.
When Greek letters are not available, the thermal characterization parameter is written as Psi-JB.
Thermal attributes
S32K1xx Data Sheet, Rev. 7, 04/2018
NXP Semiconductors 71
7.3 General notes for specifications at maximum junction
temperature
An estimation of the chip junction temperature, TJ, can be obtained from this equation:
where:
• TA = ambient temperature for the package (°C)
• RθJA = junction to ambient thermal resistance (°C/W)
• PD = power dissipation in the package (W)
The junction to ambient thermal resistance is an industry standard value that provides a
quick and easy estimation of thermal performance. Unfortunately, there are two values in
common usage: the value determined on a single layer board and the value obtained on a
board with two planes. For packages such as the PBGA, these values can be different by
a factor of two. Which value is closer to the application depends on the power dissipated
by other components on the board. The value obtained on a single layer board is
appropriate for the tightly packed printed circuit board. The value obtained on the board
with the internal planes is usually appropriate if the board has low power dissipation and
the components are well separated.
When a heat sink is used, the thermal resistance is expressed in the following equation as
the sum of a junction-to-case thermal resistance and a case-to-ambient thermal resistance:
where:
• RθJA = junction to ambient thermal resistance (°C/W)
• RθJC = junction to case thermal resistance (°C/W)
• RθCA = case to ambient thermal resistance (°C/W)
RθJC is device related and cannot be influenced by the user. The user controls the thermal
environment to change the case to ambient thermal resistance, RθCA. For instance, the
user can change the size of the heat sink, the air flow around the device, the interface
material, the mounting arrangement on printed circuit board, or change the thermal
dissipation on the printed circuit board surrounding the device.
Thermal attributes
S32K1xx Data Sheet, Rev. 7, 04/2018
72 NXP Semiconductors
To determine the junction temperature of the device in the application when heat sinks
are not used, the Thermal Characterization Parameter (ΨJT) can be used to determine the
junction temperature with a measurement of the temperature at the top center of the
package case using this equation:
where:
• TT = thermocouple temperature on top of the package (°C)
•ΨJT = thermal characterization parameter (°C/W)
• PD = power dissipation in the package (W)
The thermal characterization parameter is measured per JESD51-2 specification using a
40 gauge type T thermocouple epoxied to the top center of the package case. The
thermocouple should be positioned so that the thermocouple junction rests on the
package. A small amount of epoxy is placed over the thermocouple junction and over
about 1 mm of wire extending from the junction. The thermocouple wire is placed flat
against the package case to avoid measurement errors caused by cooling effects of the
thermocouple wire.
Dimensions
8.1 Obtaining package dimensions
Package dimensions are provided in the package drawings.
To find a package drawing, go to http://www.nxp.com and perform a keyword search for
the drawing’s document number:
Package option Document Number
32-pin QFN SOT617-3 1
48-pin LQFP 98ASH00962A
64-pin LQFP 98ASS23234W
100-pin LQFP 98ASS23308W
100-pin MAPBGA 98ASA00802D
144-pin LQFP 98ASS23177W
176-pin LQFP 98ASS23479W
1. 5x5 mm package
8
Dimensions
S32K1xx Data Sheet, Rev. 7, 04/2018
NXP Semiconductors 73
Pinouts
9.1 Package pinouts and signal descriptions
For package pinouts and signal descriptions, refer to the Reference Manual.
10 Revision History
The following table provides a revision history for this document.
Table 42. Revision History
Rev. No. Date Substantial Changes
1 12 Aug 2016 Initial release
2 03 March 2017 • Updated descpition of QSPI and Clock interfaces in Key Features section
• Updated figure: High-level architecture diagram for the S32K1xx family
• Updated figure: S32K1xx product series comparison
• Added note in section Selecting orderable part number
• Updated figure: Ordering information
• In table: Absolute maximum ratings :
• Added footnote to IINJPAD_DC
• Updated min and max value of IINJPAD_DC
• Updated description, max and min values for IINJSUM
• Updated VIN_TRANSIENT
• In table: Voltage and current operating requirements :
• Renamed VSUP_OFF
• Updated max value of VDD_OFF
• Removed VINA and VIN
• Added VREFH and VREFL
• Updated footnote "Typical conditions assumes VDD = VDDA = VREFH = 5
V ...
• Removed INJSUM_AF
• Updated footnotes in table Table 4
• Updated section Power mode transition operating behaviors
• In table: Power consumption
• Added footnote "With PMC_REGSC[CLKBIASDIS] ... "
• Updated conditions for VLPR
• Removed Idd/MHz for S32K144
• Updated numbers for S32K142 and S32K148
• Removed use case footnotes
• In section Modes configuration :
• Replaced table "Modes configuration" with spreadsheet attachment:
'S32K1xx_Power_Modes _Master_configuration_sheet'
• In table: DC electrical specifications at 3.3 V Range :
• Added footnotes to Vih Input Buffer High Voltage and Vih Input Buffer
Low Voltage
• Added footnote to High drive port pins
• In table: DC electrical specifications at 5.0 V Range :
Table continues on the next page...
9
Pinouts
S32K1xx Data Sheet, Rev. 7, 04/2018
74 NXP Semiconductors
Table 42. Revision History
Rev. No. Date Substantial Changes
• Added footnotes Vih Input Buffer High Voltage and Vih Input Buffer Low
Voltage
• Updated table: AC electrical specifications at 3.3 V range
• Updated table: AC electrical specifications at 5 V range
• In table: Standard input pin capacitance
• Added footnote to Normal run mode (S32K14x series)
• Removed note from 1M ohms Feedback Resistor in figure Oscillator
connections scheme
• In table: External System Oscillator electrical specifications
• Updated typical of IDDOSC Supply current — low-gain mode (low-power
mode) (HGO=0) 1 for 4 and 8 MHz
• Removed rows for Ilk_ext EXTAL/XTAL impedence High-frequency, low-
gain mode (low-power mode) and high-frequency, high-gain mode and
VEXTAL
• Updated Typ. of RS low-gain mode
• Updated description of RF, RS, and VPP
• Removed footnote from RF Feedback resistor
• Updated footnote for C1 C2 and RF
• In table: Table 17
• Removed mention of high-frequency
• Added HGO 0, 1 information
• In table: Fast internal RC Oscillator electrical specifications
• Updated FFIRC
• Updated description of ΔF
• Updated typ and max values of TJIT cycle-to-cycle jitter and TJIT Long
term jitter over 1000 cycles
• Added footnotes to TJIT cycle-to-cycle jitter and TJIT Long term jitter
over 1000 cycles
• Updated naming convention of IDDFIRC Supply current
• Added footnote to IDDFIRC Supply current
• Added footnote to column Parameter
• In table: Slow internal RC oscillator (SIRC) electrical specifications
• Removed VDD Supply current in 2 MHz Mode
• Removed footnote and updated description of ΔF
• Updated footnote to FSIRC and IDDSIRC
• In table: SPLL electrical specifications
• Added row for FSPLL_REF PLL Reference
• Updated naming convention throughout the table
• Updated the max value of TSPLL_LOCK Lock detector detection time
• In table: Flash timing specifications — commands
• Added footnotes:
• All command times assumes ...
• For all EEPROM Emulation terms ...
• 'First time' EERAM writes after a POR ...
• Removed footnote 'Assumes 25 MHz or ...'
• Updated Max of teewr32bers
• Added parameters tquickwr and tquickwrClnup
• In table: Reliability specifications
• Removed Typ. values for all parameters
• Removed footnote 'Typical values represent ... '
• Added footnote 'Any other EEE driver usage ... '
• Updated QuadSPI AC specifications
• Removed topic: Reliability, Safety and Security modules
• In table: 12-bit ADC operating conditions
• Updated VDDA
Table continues on the next page...
Revision History
S32K1xx Data Sheet, Rev. 7, 04/2018
NXP Semiconductors 75
Table 42. Revision History (continued)
Rev. No. Date Substantial Changes
• Updated values for VREFH and VREFL to add refernce to the section
"voltage and current operating requirments" for Min and Max valaues
• Updated footnote to Typ.
• Removed footnote from RAS Analog source resistance
• Updated figure: ADC input impedance equivalency diagram
• In table: 12-bit ADC characteristics (2.7 V to 3 V) (VREFH = VDDA, VREFL =
VSS)
• Removed rows for VTEMP_S and VTEMP25
• Updated footnote to Typ.
• In table: 12-bit ADC characteristics (3 V to 5.5 V)(VREFH = VDDA, VREFL =
VSS)
• Removed rows for VTEMP_S and VTEMP25
• Removed number for TUE
• Updated footnote to Typ.
• In table: Comparator with 8-bit DAC electrical specifications
• Updated Typ. of IDDLS Supply current, Low-speed mode
• Updated Typ. of tDLSB Propagation delay, Low-speed mode
• Updated Typ. of tDHSS Propagation delay, High-speed mode
• Updated tDLSS Propagation delay
• Added row for tDDAC Initialization and switching settling time
• Updated footnote
• Updated section LPSPI electrical specifications
• Added section: SAI electrical specifications
• Updated section: Ethernet AC specifications
• Added section: Clockout frequency
• Added section: Trace electrical specifications
• Updated table: Table 40 : Updated numbers for S32K142 and S32K148
• Updated table: Table 41 : Updated numbers for S32K148
• Updated Document number for 32-pin QFN in topic Obtaining package
dimensions
314 March 2017 • In Table 2
• Updated min. value of VDD_OFF
• Added parameter IINJSUM_AF
• Updated Power mode transition operating behaviors
• Updated Power consumption
• Updated footnote to TSPLL_LOCK in SPLL electrical specifications
• In 12-bit ADC electrical characteristics
• Updated table: 12-bit ADC characteristics (2.7 V to 3 V) (VREFH =
VDDA, VREFL = VSS)
• Added typ. value to IDDA_ADC, TUE, DNL, and INL
• Added min. value to SMPLTS
• Removed footnote 'All the parameters in this table ... '
• Updated table: 12-bit ADC characteristics (3 V to 5.5 V) (VREFH =
VDDA, VREFL = VSS)
• Added typ. value to IDDA_ADC
• Removed footnote 'All the parameters in this table ... '
• In Flash timing specifications — commands updated Max. value of tvfykey to
33 μs
402 June 2017 • In section: Block diagram, added block diagram for S32K11x series.
• Updated figure: S32K1xx product series comparison.
• In section: Selecting orderable part number , added reference to attachement
S32K_Part_Numbers.xlsx.
• In section: Ordering information
• Updated figure: Ordering information.
• In Table 1,
Table continues on the next page...
Revision History
S32K1xx Data Sheet, Rev. 7, 04/2018
76 NXP Semiconductors
Table 42. Revision History (continued)
Rev. No. Date Substantial Changes
• Updated note 'All the limits defined ... '
• Updated parameter 'IINJPAD_DC_ABS', 'VIN_DC', IINJSUM_DC_ABS.
• In Table 2,
• Updated parameter IINJPAD_DC_OP and IINJSUM_DC_OP.
• In Table 5, updated TBDs for VLVR_HYST, VLVD_HYST, and VLVW_HYST
• In Power mode transition operating behaviors,
• Added VLPR → VLPS
• Added VLPS → VLPR
• Updated TBDs for VLPS → Asynchronous DMA Wakeup, STOP1 →
Asynchronous DMA Wakeup, and STOP2 → Asynchronous DMA
Wakeup
• In Table 7, updated the specifications for S32K144.
• Updated the attachment S32K1xx_Power_Modes _Configuration.xlsx.
• In Table 14, removed CIN_A.
• In Table 16,
• Updated specificatins for gmXOSC.
• Removed IDDOSC
• In Table 18,
• Added parameter ΔF125.
• Removed IDDFIRC
• In Table 19,
• Added parameter ΔF125.
• Removed IDDSIRC
• In Table 20, removed ILPO
• Updated section: Flash memory module (FTFC) electrical specifications
• In section: 12-bit ADC operating conditions,
• Updated TBDs for IDDA_ADC and TUE in Table 27
• Updated TBDs for IDDA_ADC and TUE in Table 28
• In section: QuadSPI AC specifications, updated figure 'QuadSPI output
timing (HyperRAM mode) diagram'.
• In section: 12-bit ADC operating conditions, updated Table 26.
• In section: CMP with 8-bit DAC electrical specifications, added note 'For
comparator IN signals adjacent ... '
• In table: Table 31, minor update in footnote 6.
• In table: Table 40, updated specifications for S32K146.
506 Dec 2017 • Removed S32K148 from 'Caution'
• Updated figure: S32K1xx product series comparison for
• 'EEPROM emulated by FlexRAM' of S32K148 (Added content to
footnote)
• Added support for LIN protocol version 2.2 A
• In Absolute maximum ratings :
• Added note 'Unless otherwise ... '
• Added parameter 'Added note 'Tramp_MCU'
• Updated footnote for 'Tramp'
• In Voltage and current operating requirements :
• Added footnote 'VDD and VDDA must be shorted ... ' against parameter
'VDD– VDDA'
• Updated footnote 'VDD and VDDA must be shorted ...'
• In Power and ground pins
• Added diagrams for 32-QFN and 48-LQFP and footnote below the
diagrams.
• Updated footnote 'VDD and VDDA must be shorted ...'
• In Power mode transition operating behaviors :
Table continues on the next page...
Revision History
S32K1xx Data Sheet, Rev. 7, 04/2018
NXP Semiconductors 77
Table 42. Revision History
Rev. No. Date Substantial Changes
• Added footnote 'For S32K11x – FIRC/SOSC/FIRC/LPO; For S32K14x
– FIRC/SOSC/FIRC/LPO/SPLL' to 'VLPS Mode: All clock sources
disabled'
• Updated numbers for:
• VLPR → VLPS
• VLPS → VLPR
• 'RUN → Compute operation'
• RUN → VLPS
• RUN → VLPR
• In Power consumption :
• Updated specs for S32K142, S32K144, and S32K148
• Updated footnote 'Typical current numbers are indicative ...'
• Updated footnote 'The S32K148 data ...'
• Removed footnote 'Above S32K148 data is preliminary targets only'
• Added new table 'Power consumption at 3.3 V'
• In General AC specifications :
• Updated max value and footnote of WFRST
• Updated symbol for not filtered pulse to 'WNFRST', updated min value,
removed max. value, and added footnote
• Fixed naming conventions to align with DS in DC electrical specifications at
3.3 V Range and DC electrical specifications at 5.0 V Range
• Updated specs for AC electrical specifications at 3.3 V range and AC
electrical specifications at 5 V range
• In Device clock specifications :
• Updated fBUS to 48 for 11x
• Added footnote to fBUS for 14x
• In External System Oscillator frequency specifications :
• Added specs for S32K11x
• Updated 'tdc_extal' for S32K14x
• Added footnote 'Frequecies below ... ' to 'fec_extal' and 'tdc_extal'
• Splitted Flash timing specifications — commands for S32K14x and S32K11x
• Updated Flash timing specifications — commands for S32K14x
• In Reliability specifications :
• Added footnote 'Data retention period ... ' for 'tnvmretp1k' and
'tnvmretee'
• Minor update in footnote for 'nnvmwree16' 'nnvmwree256'
• In QuadSPI AC specifications :
• Updated 'MCR[SCLKCFG[5]]' value to 0
• Updated 'Data Input Setup Time' HSRUN Internal DQS PAD Loopback
value to 1.6
• Updated 'Data Input Setup Time' DDR External DQS min. value to 2
• Updated 'Data Input Hold Time' DDR External DQS min. value to 20
• Upadted figure 'QuadSPI output timing (SDR mode) diagram' and
'QuadSPI input timing (HyperRAM mode) diagram'
• In 12-bit ADC electrical characteristics :
• Added note 'On reduced pin packages where ... '
• Removed max. value of 'IDDA_ADC'
• Added note 'Due to triple ... '
• In 12-bit ADC operating conditions, removed parameter 'ΔVDDA'
• In CMP with 8-bit DAC electrical specifications :
• Updated Typ. and Max. values of 'IDDLS'
• Upadted Typ. value of 'tDHSB'
• Updated Typ. value of 'VHYST1' , 'VHYST2', and 'VHYST3'
• In LPSPI electrical specifications :
• Updated 'fperiph' and 'fop', and 'tSPSCK'
Table continues on the next page...
Revision History
S32K1xx Data Sheet, Rev. 7, 04/2018
78 NXP Semiconductors
Table 42. Revision History (continued)
Rev. No. Date Substantial Changes
• Updated 3.3 V numbers and added footnote against fop, tSU, ans tV in
HSRUN Mode
• Added footnote to 'tWSPSCK'
• Updated Thermal characteristics for S32K11x
6 31 Jan 2018 • Changed the representation of ARM trademark throughout.
• Removed S32K142 from 'Caution'
• In 'Key features', added the following note under 'Power management',
'Memory and memory interfaces', and 'Reliability, safety and security':
• No write or erase access to ...
• In High-level architecture diagram for the S32K14x family, added the
following footnote:
• No write or erase access to ...
• In High-level architecture diagram for the S32K11x family :
• Minor editorial update: Fixed the placement of SRAM, under 'Flash
memory controller' block
• Updated figure: S32K1xx product series comparison :
• Updated footnote 1, and added against 'HSRUN' in addition to 'HW
security module (CSEc)' and 'EEPROM emulated by FlexRAM'.
• Updated 'System RAM (including FlexRAM and MTB)' row for
S32K144, S32K146, and S32K148.
• Updated channel count for S32K116 in row '12-bit SAR ADC (1 MSPS
each)'.
• Updated Ordering information
• Updated Flash timing specifications — commands for S32K148, S32K142,
S32K146, S32K116, and S32K118.
719 April 2018 • Changed Caution to Notes
• Updated the wordings of Notes and removed S32K146
• Added 'Following two are the available ...'
• In 'Key features' :
• Editorial updates
• Updated the note under Power management, Memory and memory
interfaces, and Safety and security.
• Updated FlexIO under Communications interfaces
• Added ENET and SAI under Communications interfaces
• Updated Cryptographic Services Engine (CSEc) under 'Safety and
security'
• In High-level architecture diagram for the S32K14x family :
• Minor editorial updates
• Updated note 3
• In High-level architecture diagram for the S32K11x family :
• Minor editorial updates
• In figure: S32K1xx product series comparison :
• Editorial updates
• Updated Frequency for S32K14x
• Updated footnote 4
• Added footnote 5
• In Ordering information :
• Renamed section, updated the starting paragraph
• Updated the figure
• In Voltage and current operating requirements, updated the note
• In Power consumption :
• Updated specs for S32K146
• Removed section 'Modes configuration', amd moved its content under
the fisrt paragraph.
• In 12-bit ADC operating conditions :
Revision History
S32K1xx Data Sheet, Rev. 7, 04/2018
NXP Semiconductors 79
Table 42. Revision History
Rev. No. Date Substantial Changes
• Fixed the typo in RSW1
• In LPSPI electrical specifications :
• Updated tLead and tLag
• Added footnote in Figure: LPSPI slave mode timing (CPHA = 0) and
Figure: LPSPI slave mode timing (CPHA = 1)
• In Thermal characteristics :
• Updated the name of table: Thermal characteristics for 32-pin QFN
and 48/64/100/144/176-pin LQFP package
• Deleted specs for RθJC for 32 QFN package
• Added 'RθJCBottom'
Revision History
S32K1xx Data Sheet, Rev. 7, 04/2018
80 NXP Semiconductors
How to Reach Us:
Home Page:
nxp.com
Web Support:
nxp.com/support
Information in this document is provided solely to enable system and software
implementers to use NXP products. There are no express or implied copyright
licenses granted hereunder to design or fabricate any integrated circuits based
on the information in this document. NXP reserves the right to make changes
without further notice to any products herein.
NXP makes no warranty, representation, or guarantee regarding the suitability of
its products for any particular purpose, nor does NXP assume any liability arising
out of the application or use of any product or circuit, and specifically disclaims
any and all liability, including without limitation consequential or incidental
damages. “Typical” parameters that may be provided in NXP data sheets and/or
specifications can and do vary in different applications, and actual performance
may vary over time. All operating parameters, including “typicals,” must be
validated for each customer application by customerʼs technical experts. NXP
does not convey any license under its patent rights nor the rights of others. NXP
sells products pursuant to standard terms and conditions of sale, which can be
found at the following address: nxp.com/SalesTermsandConditions.
NXP, the NXP logo, NXP SECURE CONNECTIONS FOR A SMARTER
WORLD, COOLFLUX, EMBRACE, GREENCHIP, HITAG, I2C BUS, ICODE,
JCOP, LIFE VIBES, MIFARE, MIFARE CLASSIC, MIFARE DESFire, MIFARE
PLUS, MIFARE FLEX, MANTIS, MIFARE ULTRALIGHT, MIFARE4MOBILE,
MIGLO, NTAG, ROADLINK, SMARTLX, SMARTMX, STARPLUG, TOPFET,
TRENCHMOS, UCODE, Freescale, the Freescale logo, AltiVec, C-5, CodeTest,
CodeWarrior, ColdFire, ColdFire+, C-Ware, the Energy Efficient Solutions logo,
Kinetis, Layerscape, MagniV, mobileGT, PEG, PowerQUICC, Processor Expert,
QorIQ, QorIQ Qonverge, Ready Play, SafeAssure, the SafeAssure logo,
StarCore, Symphony, VortiQa, Vybrid, Airfast, BeeKit, BeeStack, CoreNet,
Flexis, MXC, Platform in a Package, QUICC Engine, SMARTMOS, Tower,
TurboLink, and UMEMS are trademarks of NXP B.V. All other product or service
names are the property of their respective owners. ARM, AMBA, ARM Powered,
Artisan, Cortex, Jazelle, Keil, SecurCore, Thumb, TrustZone, and μVision are
registered trademarks of ARM Limited (or its subsidiaries) in the EU and/or
elsewhere. ARM7, ARM9, ARM11, big.LITTLE, CoreLink, CoreSight,
DesignStart, Mali, mbed, NEON, POP, Sensinode, Socrates, ULINK and
Versatile are trademarks of ARM Limited (or its subsidiaries) in the EU and/or
elsewhere. All rights reserved. Oracle and Java are registered trademarks of
Oracle and/or its affiliates. The Power Architecture and Power.org word marks
and the Power and Power.org logos and related marks are trademarks and
service marks licensed by Power.org.
© 2015–2018 NXP B.V.
Document Number S32K1XX
Revision 7, 04/2018
