LM185-ADJ, LM285-ADJ, LM385-ADJ
www.ti.com
SNVS741F –FEBRUARY 2000–REVISED APRIL 2013
LM185/LM285/LM385 Adjustable Micropower Voltage References
Check for Samples: LM185-ADJ,LM285-ADJ,LM385-ADJ
Careful design of the LM185 has made the device
1FEATURES tolerant of capacitive loading, making it easy to use in
2• Adjustable from 1.24V to 5.30V almost any reference application. The wide dynamic
• Operating Current of 10μA to 20mA operating range allows its use with widely varying
supplies with excellent regulation.
• 1% and 2% Initial Tolerance
• 1ΩDynamic Impedance The extremely low power drain of the LM185 makes it
useful for micropower circuitry. This voltage reference
• Low Temperature Coefficient can be used to make portable meters, regulators or
general purpose analog circuitry with battery life
DESCRIPTION approaching shelf life. Further, the wide operating
The LM185/LM285/LM385 are micropower 3-terminal current allows it to replace older references with a
adjustable band-gap voltage reference diodes. tighter tolerance part.
Operating from 1.24 to 5.3V and over a 10μA to The LM185 is rated for operation over a −55°C to
20mA current range, they feature exceptionally low 125°C temperature range, while the LM285 is rated
dynamic impedance and good temperature stability. −40°C to 85°C and the LM385 0°C to 70°C. The
On-chip trimming is used to provide tight voltage LM185 is available in a hermetic TO package and a
tolerance. Since the LM185 band-gap reference uses LCCC package, while the LM285/LM385 are
only transistors and resistors, low noise and good available in a low-cost TO-92 package, as well as
long-term stability result. SOIC.
Connection Diagram
Figure 1. TO-92 Package Figure 2. TO Package
Bottom View Bottom View
Figure 3. SOIC Package Figure 4. 20-LCCC
Top View Top View
1Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
2All trademarks are the property of their respective owners.
PRODUCTION DATA information is current as of publication date. Copyright © 2000–2013, Texas Instruments Incorporated
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
LM185-ADJ, LM285-ADJ, LM385-ADJ
SNVS741F –FEBRUARY 2000–REVISED APRIL 2013
www.ti.com
Block Diagram
Typical Applications
Figure 5. 1.2V Reference
Figure 6. 5.0V Reference
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam
during storage or handling to prevent electrostatic damage to the MOS gates.
2Submit Documentation Feedback Copyright © 2000–2013, Texas Instruments Incorporated
Product Folder Links: LM185-ADJ LM285-ADJ LM385-ADJ
LM185-ADJ, LM285-ADJ, LM385-ADJ
www.ti.com
SNVS741F –FEBRUARY 2000–REVISED APRIL 2013
Absolute Maximum Ratings(1)(2)(3)
Reverse Current 30mA
Forward Current 10mA
Operating Temperature Range (4)
LM185 Series −55°C to 125°C
LM285 Series −40°C to 85°C
LM385 Series 0°C to 70°C
ESD Susceptibility (5) 2kV
Storage Temperature −55°C to 150°C
Soldering Information
TO-92 Package (10 sec.) 260°C
TO Package (10 sec.) 300°C
SOIC Package
Vapor Phase (60 sec.) 215°C
Infrared (15 sec.) 220°C
See An-450 “Surface Mounting Methods and Their Effect on Product Reliability” for other methods of soldering surface mount devices.
(1) Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for
which the device is intended to be functional. For specifications and test conditions, see the Electrical Characteristics. The specifications
apply only for the test conditions listed.
(2) Refer to RETS185H for military specifications.
(3) If Military/Aerospace specified devices are required, please contact the TI Sales Office/Distributors for availability and specifications.
(4) For elevated temperature operation, see Table 1 and Thermal Characteristics.
(5) The human body model is a 100 pF capacitor discharged through a 1.5 kΩresistor into each pin.
Table 1. TJ(max) for Elevated Temperature Operation
DEVICE TJ(max) (°C)
LM185 150
LM285 125
LM385 100
Thermal Characteristics
Over operating free-air temperature range (unless otherwise noted)
Thermal Resistance TO-92 TO-46 SOIC
180°C/W (0.4″leads)
θJA (Junction to Ambient) 440°C/W 165°C/W
170°C/W (0.125″leads)
θJC (Junction to Case) N/A 80°C/W N/A
Copyright © 2000–2013, Texas Instruments Incorporated Submit Documentation Feedback 3
Product Folder Links: LM185-ADJ LM285-ADJ LM385-ADJ
LM185-ADJ, LM285-ADJ, LM385-ADJ
SNVS741F –FEBRUARY 2000–REVISED APRIL 2013
www.ti.com
Electrical Characteristics(1)
LM185, LM285 LM385
LM185BX, LM285 LM385
LM185BY LM385BX,
LM185B, LM385BY Units
Parameter Conditions LM285BX, (Limit)
Typ Typ
LM285BY
Tested Design Tested Design Tested Design Tested Design
Limit Limit Limit Limit Limit Limit Limit Limit
(2) (3) (2) (3) (2) (3) (2) (3)
Reference IR= 100μA 1.240 1.252 1.265 1.270 1.240 1.252 1.255 1.265 1.270 V (max)
Voltage 1.255
1.228 1.215 1.205 1.228 1.215 1.215 1.205 V (min)
1.215
Reference IMIN< IR< 1mA 0.2 1 1.5 11.5 0.2 1 1.5 11.5 mV
Voltage (max)
1mA < IR< 20mA 4 10 20 10 20 5 15 25 15 25
Change with
Current
Dynamic IR= 100μA, f =
Output 100Hz
Impedance IAC = 0.1 IRVOUT = 0.3 0.4 Ω
VREF
VOUT = 0.7 1
5.3V
Reference IR= 100μA
Voltage mV
Change with 1 3 6362 5 10 510 (max)
Output
Voltage
Feedback 13 20 25 20 25 16 30 35 30 35 nA (max)
Current
Minimum VOUT = VREF 6 9 10 910 7 11 13 11 13 μA
Operating (max)
VOUT = 5.3V 30 45 50 45 50 35 55 60 55 60
Current (see
curve)
Output IR= 100μA, 10Hz < f μVrms
Wideband < 10kHz
Noise VOUT = VREF 50 50
VOUT = 5.3V 170 170
Average IR= 100μA X Suffix 30 30
Temperature Y Suffix 50 50 ppm/°c
Coefficient (max)
All 150 150 150 150
(4) Others
Long Term IR= 100μA, T = 1000 20 20 ppm
Stability Hr,
TA= 25°C ± 0.1°C
(1) Parameters identified with boldface type apply at temperature extremes. All other numbers apply at TA= TJ= 25°C. Unless otherwise
specified, all parameters apply for VREF < VOUT < 5.3V.
(2) Production tested.
(3) Not production tested. These limits are not to be used to calculate average outgoing quality levels.
(4) The average temperature coefficient is defined as the maximum deviation of reference voltage at all measured temperatures from TMIN
to TMAX, divided by TMAX −TMIN. The measured temperatures are −55, −40, 0, 25, 70, 85, 125°C.
4Submit Documentation Feedback Copyright © 2000–2013, Texas Instruments Incorporated
Product Folder Links: LM185-ADJ LM285-ADJ LM385-ADJ
LM185-ADJ, LM285-ADJ, LM385-ADJ
www.ti.com
SNVS741F –FEBRUARY 2000–REVISED APRIL 2013
Typical Performance Characteristics
Temperature Drift of 3
Representative Units Feedback Current
Figure 7. Figure 8.
Minimum Operating Current Reverse Characteristics
Figure 9. Figure 10.
Reverse Characteristics Forward Characteristics
Figure 11. Figure 12.
Copyright © 2000–2013, Texas Instruments Incorporated Submit Documentation Feedback 5
Product Folder Links: LM185-ADJ LM285-ADJ LM385-ADJ
LM185-ADJ, LM285-ADJ, LM385-ADJ
SNVS741F –FEBRUARY 2000–REVISED APRIL 2013
www.ti.com
Typical Performance Characteristics (continued)
Output Noise Voltage Dynamic Output Impedance
Figure 13. Figure 14.
Response Time
Figure 15.
Temperature Coefficient Typical
LM185 (left), LM285 (center), LM385 (right)
Figure 16.
6Submit Documentation Feedback Copyright © 2000–2013, Texas Instruments Incorporated
Product Folder Links: LM185-ADJ LM285-ADJ LM385-ADJ
LM185-ADJ, LM285-ADJ, LM385-ADJ
www.ti.com
SNVS741F –FEBRUARY 2000–REVISED APRIL 2013
TYPICAL APPLICATIONS
Figure 17. Precision 10V Reference Figure 18. Low AC Noise Reference
Figure 19. 25V Low Current Shunt Regulator Figure 20. 200 mA Shunt Regulator
Copyright © 2000–2013, Texas Instruments Incorporated Submit Documentation Feedback 7
Product Folder Links: LM185-ADJ LM285-ADJ LM385-ADJ
LM185-ADJ, LM285-ADJ, LM385-ADJ
SNVS741F –FEBRUARY 2000–REVISED APRIL 2013
www.ti.com
Figure 21. Series-Shunt 20 mA Regulator Figure 22. High Efficiency Low Power Regulator
Figure 23. Voltage Level Detector Figure 24. Voltage Level Detector
Figure 25. Fast Positive Clamp Figure 26. Bidirectional Clamp
2.4V + ΔVD1 ±2.4V
8Submit Documentation Feedback Copyright © 2000–2013, Texas Instruments Incorporated
Product Folder Links: LM185-ADJ LM285-ADJ LM385-ADJ
LM185-ADJ, LM285-ADJ, LM385-ADJ
www.ti.com
SNVS741F –FEBRUARY 2000–REVISED APRIL 2013
Figure 27. Bidirectional Adjustable Clamp Figure 28. Bidirectional Adjustable Clamp
±1.8V to ±2.4V ±2.4V to ±6V
Figure 29. Simple Floating Current Detector
Figure 30. Current Source
Copyright © 2000–2013, Texas Instruments Incorporated Submit Documentation Feedback 9
Product Folder Links: LM185-ADJ LM285-ADJ LM385-ADJ
LM185-ADJ, LM285-ADJ, LM385-ADJ
SNVS741F –FEBRUARY 2000–REVISED APRIL 2013
www.ti.com
*D1 can be any LED, VF=1.5V to 2.2V at 3 mA. D1 may act as an indicator. D1 will be on if ITHRESHOLD falls below the
threshold current, except with I=O.
Figure 31. Precision Floating Current Detector
Figure 32. Centigrade Thermometer, 10mV/°C
Figure 33. Freezer Alarm
10 Submit Documentation Feedback Copyright © 2000–2013, Texas Instruments Incorporated
Product Folder Links: LM185-ADJ LM285-ADJ LM385-ADJ
LM185-ADJ, LM285-ADJ, LM385-ADJ
SNVS741F –FEBRUARY 2000–REVISED APRIL 2013
www.ti.com
REVISION HISTORY
Changes from Revision E (April 2013) to Revision F Page
• Changed layout of National Data Sheet to TI format .......................................................................................................... 11
12 Submit Documentation Feedback Copyright © 2000–2013, Texas Instruments Incorporated
Product Folder Links: LM185-ADJ LM285-ADJ LM385-ADJ
PACKAGE OPTION ADDENDUM
www.ti.com 14-Oct-2017
Addendum-Page 1
PACKAGING INFORMATION
Orderable Device Status
(1)
Package Type Package
Drawing Pins Package
Qty Eco Plan
(2)
Lead/Ball Finish
(6)
MSL Peak Temp
(3)
Op Temp (°C) Device Marking
(4/5)
Samples
LM185BH ACTIVE TO NDV 3 1000 TBD Call TI Call TI -55 to 125 ( LM185BH, LM185BH
)
LM185BH/NOPB ACTIVE TO NDV 3 1000 Green (RoHS
& no Sb/Br) Call TI Level-1-NA-UNLIM -55 to 125 ( LM185BH, LM185BH
)
LM185H-2.5/NOPB ACTIVE TO NDU 2 1000 Green (RoHS
& no Sb/Br) Call TI | POST-PLATE Level-1-NA-UNLIM -55 to 125 ( LM185H2.5, LM185
H2.5)
LM285BXZ/NOPB ACTIVE TO-92 LP 3 1800 Green (RoHS
& no Sb/Br) CU SN N / A for Pkg Type -40 to 85 LM285
BXZ
LM285BYM/NOPB ACTIVE SOIC D 8 95 Green (RoHS
& no Sb/Br) CU SN Level-1-260C-UNLIM -40 to 85 LM285
BYM
LM285BYMX/NOPB ACTIVE SOIC D 8 2500 Green (RoHS
& no Sb/Br) CU SN Level-1-260C-UNLIM -40 to 85 LM285
BYM
LM285BYZ/NOPB ACTIVE TO-92 LP 3 1800 Green (RoHS
& no Sb/Br) CU SN N / A for Pkg Type -40 to 85 LM285
BYZ
LM285M/NOPB ACTIVE SOIC D 8 95 Green (RoHS
& no Sb/Br) CU SN Level-1-260C-UNLIM -40 to 85 LM285
M
LM285MX/NOPB ACTIVE SOIC D 8 2500 Green (RoHS
& no Sb/Br) CU SN Level-1-260C-UNLIM -40 to 85 LM285
M
LM285Z/NOPB ACTIVE TO-92 LP 3 1800 Green (RoHS
& no Sb/Br) CU SN N / A for Pkg Type -40 to 85 LM285
Z
LM385BM/NOPB ACTIVE SOIC D 8 95 Green (RoHS
& no Sb/Br) CU SN Level-1-260C-UNLIM 0 to 70 LM385
BM
LM385BMX/NOPB ACTIVE SOIC D 8 2500 Green (RoHS
& no Sb/Br) CU SN Level-1-260C-UNLIM 0 to 70 LM385
BM
LM385BXZ/NOPB ACTIVE TO-92 LP 3 1800 Green (RoHS
& no Sb/Br) CU SN N / A for Pkg Type 0 to 70 LM385
BXZ
LM385BYZ/NOPB ACTIVE TO-92 LP 3 1800 Green (RoHS
& no Sb/Br) CU SN N / A for Pkg Type 0 to 70 LM385
BYZ
LM385BZ/NOPB ACTIVE TO-92 LP 3 1800 Green (RoHS
& no Sb/Br) CU SN N / A for Pkg Type 0 to 70 LM385
BZ
LM385M NRND SOIC D 8 95 TBD Call TI Call TI 0 to 70 LM385
M
LM385M/NOPB ACTIVE SOIC D 8 95 Green (RoHS
& no Sb/Br) CU SN Level-1-260C-UNLIM 0 to 70 LM385
M
PACKAGE OPTION ADDENDUM
www.ti.com 14-Oct-2017
Addendum-Page 2
Orderable Device Status
(1)
Package Type Package
Drawing Pins Package
Qty Eco Plan
(2)
Lead/Ball Finish
(6)
MSL Peak Temp
(3)
Op Temp (°C) Device Marking
(4/5)
Samples
LM385MX NRND SOIC D 8 2500 TBD Call TI Call TI 0 to 70 LM385
M
LM385MX/NOPB ACTIVE SOIC D 8 2500 Green (RoHS
& no Sb/Br) CU SN Level-1-260C-UNLIM 0 to 70 LM385
M
LM385Z/NOPB ACTIVE TO-92 LP 3 1800 Green (RoHS
& no Sb/Br) CU SN N / A for Pkg Type 0 to 70 LM385
Z
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2) RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance
do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may
reference these types of products as "Pb-Free".
RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption.
Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of <=1000ppm threshold. Antimony trioxide based
flame retardants must also meet the <=1000ppm threshold requirement.
(3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
(5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.
(6) Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish
value exceeds the maximum column width.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
PACKAGE OPTION ADDENDUM
www.ti.com 14-Oct-2017
Addendum-Page 3
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device Package
Type Package
Drawing Pins SPQ Reel
Diameter
(mm)
Reel
Width
W1 (mm)
A0
(mm) B0
(mm) K0
(mm) P1
(mm) W
(mm) Pin1
Quadrant
LM285BYMX/NOPB SOIC D 8 2500 330.0 12.4 6.5 5.4 2.0 8.0 12.0 Q1
LM285MX/NOPB SOIC D 8 2500 330.0 12.4 6.5 5.4 2.0 8.0 12.0 Q1
LM385BMX/NOPB SOIC D 8 2500 330.0 12.4 6.5 5.4 2.0 8.0 12.0 Q1
LM385MX SOIC D 8 2500 330.0 12.4 6.5 5.4 2.0 8.0 12.0 Q1
LM385MX/NOPB SOIC D 8 2500 330.0 12.4 6.5 5.4 2.0 8.0 12.0 Q1
PACKAGE MATERIALS INFORMATION
www.ti.com 8-Apr-2013
Pack Materials-Page 1
*All dimensions are nominal
Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm)
LM285BYMX/NOPB SOIC D 8 2500 367.0 367.0 35.0
LM285MX/NOPB SOIC D 8 2500 367.0 367.0 35.0
LM385BMX/NOPB SOIC D 8 2500 367.0 367.0 35.0
LM385MX SOIC D 8 2500 367.0 367.0 35.0
LM385MX/NOPB SOIC D 8 2500 367.0 367.0 35.0
PACKAGE MATERIALS INFORMATION
www.ti.com 8-Apr-2013
Pack Materials-Page 2
MECHANICAL DATA
NDU0002A
www.ti.com
H02A (Rev F)
www.ti.com
PACKAGE OUTLINE
( 2.54)
1.16
0.92
4.95
4.55
0.76 MAX 2.67 MAX
0.64 MAX
UNCONTROLLED
LEAD DIA
3X
12.7 MIN
3X 0.483
0.407
-5.565.32
1.22
0.72
45
TO-CAN - 2.67 mm max heightNDV0003H
TO-46
4219876/A 01/2017
NOTES:
1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing
per ASME Y14.5M.
2. This drawing is subject to change without notice.
3. Reference JEDEC registration TO-46.
1
2
3
SCALE 1.250
www.ti.com
EXAMPLE BOARD LAYOUT
0.07 MAX
ALL AROUND
0.07 MAX
TYP
( 1.2)
METAL
2X ( 1.2)
METAL
3X ( 0.7) VIA
(R0.05) TYP
(2.54)
(1.27)
TO-CAN - 2.67 mm max heightNDV0003H
TO-46
4219876/A 01/2017
LAND PATTERN EXAMPLE
NON-SOLDER MASK DEFINED
SCALE:12X
2X
SOLDER MASK
OPENING
SOLDER MASK
OPENING
1
2
3
www.ti.com
PACKAGE OUTLINE
3X 2.67
2.03
5.21
4.44
5.34
4.32
3X
12.7 MIN
2X 1.27 0.13
3X 0.55
0.38
4.19
3.17
3.43 MIN
3X 0.43
0.35
(2.54)
NOTE 3
2X
2.6 0.2
2X
4 MAX
SEATING
PLANE
6X
0.076 MAX
(0.51) TYP
(1.5) TYP
TO-92 - 5.34 mm max heightLP0003A
TO-92
4215214/B 04/2017
NOTES:
1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing
per ASME Y14.5M.
2. This drawing is subject to change without notice.
3. Lead dimensions are not controlled within this area.
4. Reference JEDEC TO-226, variation AA.
5. Shipping method:
a. Straight lead option available in bulk pack only.
b. Formed lead option available in tape and reel or ammo pack.
c. Specific products can be offered in limited combinations of shipping medium and lead options.
d. Consult product folder for more information on available options.
EJECTOR PIN
OPTIONAL
PLANE
SEATING
STRAIGHT LEAD OPTION
321
SCALE 1.200
FORMED LEAD OPTION
OTHER DIMENSIONS IDENTICAL
TO STRAIGHT LEAD OPTION
SCALE 1.200
www.ti.com
EXAMPLE BOARD LAYOUT
0.05 MAX
ALL AROUND
TYP
(1.07)
(1.5) 2X (1.5)
2X (1.07)
(1.27)
(2.54)
FULL R
TYP
( 1.4)0.05 MAX
ALL AROUND
TYP
(2.6)
(5.2)
(R0.05) TYP
3X ( 0.9) HOLE
2X ( 1.4)
METAL
3X ( 0.85) HOLE
(R0.05) TYP
4215214/B 04/2017
TO-92 - 5.34 mm max heightLP0003A
TO-92
LAND PATTERN EXAMPLE
FORMED LEAD OPTION
NON-SOLDER MASK DEFINED
SCALE:15X
SOLDER MASK
OPENING
METAL
2X
SOLDER MASK
OPENING
123
LAND PATTERN EXAMPLE
STRAIGHT LEAD OPTION
NON-SOLDER MASK DEFINED
SCALE:15X
METAL
TYP
SOLDER MASK
OPENING
2X
SOLDER MASK
OPENING
2X
METAL
12 3
www.ti.com
TAPE SPECIFICATIONS
19.0
17.5
13.7
11.7
11.0
8.5
0.5 MIN
TYP-4.33.7
9.75
8.50
TYP
2.9
2.4 6.75
5.95
13.0
12.4
(2.5) TYP
16.5
15.5
32
23
4215214/B 04/2017
TO-92 - 5.34 mm max heightLP0003A
TO-92
FOR FORMED LEAD OPTION PACKAGE
IMPORTANT NOTICE
Texas Instruments Incorporated (TI) reserves the right to make corrections, enhancements, improvements and other changes to its
semiconductor products and services per JESD46, latest issue, and to discontinue any product or service per JESD48, latest issue. Buyers
should obtain the latest relevant information before placing orders and should verify that such information is current and complete.
TI’s published terms of sale for semiconductor products (http://www.ti.com/sc/docs/stdterms.htm) apply to the sale of packaged integrated
circuit products that TI has qualified and released to market. Additional terms may apply to the use or sale of other types of TI products and
services.
Reproduction of significant portions of TI information in TI data sheets is permissible only if reproduction is without alteration and is
accompanied by all associated warranties, conditions, limitations, and notices. TI is not responsible or liable for such reproduced
documentation. Information of third parties may be subject to additional restrictions. Resale of TI products or services with statements
different from or beyond the parameters stated by TI for that product or service voids all express and any implied warranties for the
associated TI product or service and is an unfair and deceptive business practice. TI is not responsible or liable for any such statements.
Buyers and others who are developing systems that incorporate TI products (collectively, “Designers”) understand and agree that Designers
remain responsible for using their independent analysis, evaluation and judgment in designing their applications and that Designers have
full and exclusive responsibility to assure the safety of Designers' applications and compliance of their applications (and of all TI products
used in or for Designers’ applications) with all applicable regulations, laws and other applicable requirements. Designer represents that, with
respect to their applications, Designer has all the necessary expertise to create and implement safeguards that (1) anticipate dangerous
consequences of failures, (2) monitor failures and their consequences, and (3) lessen the likelihood of failures that might cause harm and
take appropriate actions. Designer agrees that prior to using or distributing any applications that include TI products, Designer will
thoroughly test such applications and the functionality of such TI products as used in such applications.
TI’s provision of technical, application or other design advice, quality characterization, reliability data or other services or information,
including, but not limited to, reference designs and materials relating to evaluation modules, (collectively, “TI Resources”) are intended to
assist designers who are developing applications that incorporate TI products; by downloading, accessing or using TI Resources in any
way, Designer (individually or, if Designer is acting on behalf of a company, Designer’s company) agrees to use any particular TI Resource
solely for this purpose and subject to the terms of this Notice.
TI’s provision of TI Resources does not expand or otherwise alter TI’s applicable published warranties or warranty disclaimers for TI
products, and no additional obligations or liabilities arise from TI providing such TI Resources. TI reserves the right to make corrections,
enhancements, improvements and other changes to its TI Resources. TI has not conducted any testing other than that specifically
described in the published documentation for a particular TI Resource.
Designer is authorized to use, copy and modify any individual TI Resource only in connection with the development of applications that
include the TI product(s) identified in such TI Resource. NO OTHER LICENSE, EXPRESS OR IMPLIED, BY ESTOPPEL OR OTHERWISE
TO ANY OTHER TI INTELLECTUAL PROPERTY RIGHT, AND NO LICENSE TO ANY TECHNOLOGY OR INTELLECTUAL PROPERTY
RIGHT OF TI OR ANY THIRD PARTY IS GRANTED HEREIN, including but not limited to any patent right, copyright, mask work right, or
other intellectual property right relating to any combination, machine, or process in which TI products or services are used. Information
regarding or referencing third-party products or services does not constitute a license to use such products or services, or a warranty or
endorsement thereof. Use of TI Resources may require a license from a third party under the patents or other intellectual property of the
third party, or a license from TI under the patents or other intellectual property of TI.
TI RESOURCES ARE PROVIDED “AS IS” AND WITH ALL FAULTS. TI DISCLAIMS ALL OTHER WARRANTIES OR
REPRESENTATIONS, EXPRESS OR IMPLIED, REGARDING RESOURCES OR USE THEREOF, INCLUDING BUT NOT LIMITED TO
ACCURACY OR COMPLETENESS, TITLE, ANY EPIDEMIC FAILURE WARRANTY AND ANY IMPLIED WARRANTIES OF
MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE, AND NON-INFRINGEMENT OF ANY THIRD PARTY INTELLECTUAL
PROPERTY RIGHTS. TI SHALL NOT BE LIABLE FOR AND SHALL NOT DEFEND OR INDEMNIFY DESIGNER AGAINST ANY CLAIM,
INCLUDING BUT NOT LIMITED TO ANY INFRINGEMENT CLAIM THAT RELATES TO OR IS BASED ON ANY COMBINATION OF
PRODUCTS EVEN IF DESCRIBED IN TI RESOURCES OR OTHERWISE. IN NO EVENT SHALL TI BE LIABLE FOR ANY ACTUAL,
DIRECT, SPECIAL, COLLATERAL, INDIRECT, PUNITIVE, INCIDENTAL, CONSEQUENTIAL OR EXEMPLARY DAMAGES IN
CONNECTION WITH OR ARISING OUT OF TI RESOURCES OR USE THEREOF, AND REGARDLESS OF WHETHER TI HAS BEEN
ADVISED OF THE POSSIBILITY OF SUCH DAMAGES.
Unless TI has explicitly designated an individual product as meeting the requirements of a particular industry standard (e.g., ISO/TS 16949
and ISO 26262), TI is not responsible for any failure to meet such industry standard requirements.
Where TI specifically promotes products as facilitating functional safety or as compliant with industry functional safety standards, such
products are intended to help enable customers to design and create their own applications that meet applicable functional safety standards
and requirements. Using products in an application does not by itself establish any safety features in the application. Designers must
ensure compliance with safety-related requirements and standards applicable to their applications. Designer may not use any TI products in
life-critical medical equipment unless authorized officers of the parties have executed a special contract specifically governing such use.
Life-critical medical equipment is medical equipment where failure of such equipment would cause serious bodily injury or death (e.g., life
support, pacemakers, defibrillators, heart pumps, neurostimulators, and implantables). Such equipment includes, without limitation, all
medical devices identified by the U.S. Food and Drug Administration as Class III devices and equivalent classifications outside the U.S.
TI may expressly designate certain products as completing a particular qualification (e.g., Q100, Military Grade, or Enhanced Product).
Designers agree that it has the necessary expertise to select the product with the appropriate qualification designation for their applications
and that proper product selection is at Designers’ own risk. Designers are solely responsible for compliance with all legal and regulatory
requirements in connection with such selection.
Designer will fully indemnify TI and its representatives against any damages, costs, losses, and/or liabilities arising out of Designer’s non-
compliance with the terms and provisions of this Notice.
Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265
Copyright © 2017, Texas Instruments Incorporated
