CPC1394GV - Zilog - Datasheet.Support

INTEGRATED CIRCUITS DIVISION

www.ixysic.com

DS-CPC1394-R03 1

CPC1394

Single-Pole, Normally Open

4-Pin OptoMOS® Relay

Part Number Description

CPC1394G 4-Pin DIP (100/Tube)

CPC1394GV 4-Pin DIP V-Bend (100/Tube)

CPC1394GR 4-Pin Surface Mount (100/Tube)

CPC1394GRTR 4-Pin Surface Mount (1000/Reel)

Parameter Rating Units

Blocking Voltage 600 VP

Load Current 120 mArms / mADC

On-Resistance (max) 35 

Applications

Features

Description

Approvals

Ordering Information

Pin Configuration

The CPC1394 is a single-pole, normally-open

(1-Form-A) Solid State Relay with an enhanced input

to output isolation barrier of 5000Vrms.

The relay output is constructed with efficient

MOSFET switches that use IXYS Integrated Circuits

Division's patented OptoMOS architecture. The input,

a highly efficient GaAlAS infrared LED, controls the

optically coupled output.

• Instrumentation

• Multiplexers

• Data Acquisition

• Electronic Switching

• I/O Subsystems

• Meters (Watt-Hour, Water, Gas)

• Medical Equipment—Patient/Equipment Isolation

• Security

• Aerospace

• Industrial Controls

• UL Certified Component: File E76270

• CSA Certified Component: Certificate 1172007

• EN/IEC 60950-1 Certified Component:

TUV Certificate B 10 05 49410 006

• 5000Vrms Input/Output Isolation

• 600VP Blocking Voltage

• 100% Solid State

• Low Drive Power Requirements (TTL/CMOS

Compatible)

• Arc-Free With No Snubbing Circuits

• No EMI/RFI Generation

• Small 4-Pin Package

• Machine Insertable, Wave Solderable

Switching Characteristics

of Normally Open Devices

Form-A

ILOAD

10%

90%

ton toff

+ Control

– Control

Load

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CPC1394

Absolute Maximum Ratings are stress ratings. Stresses in

excess of these ratings can cause permanent damage to

the device. Functional operation of the device at conditions

beyond those indicated in the operational sections of this

data sheet is not implied.

Parameter Ratings Units

Peak Blocking Voltage 600 VP

Reverse Input Voltage 5 V

Input Control Current 50 mA

Peak (10ms) 1 A

Input Power Dissipation 1100 mW

Total Package Dissipation 2550 mW

Isolation Voltage, Input to Output 5000 Vrms

Operational Temperature -40 to +85 ºC

Storage Temperature -40 to +125 ºC

1 Derate linearly 1.33 mW / ºC

2 Derate linearly 3.00 mW / ºC

Absolute Maximum Ratings @ 25ºC

Electrical Characteristics @ 25ºC

Parameters Conditions Symbol Min Typ Max Units

Output Characteristics

Load Current

Continuous - IL- - 120 mArms / mADC

Peak t=10ms ILPK - - ±400 mAP

On-Resistance 1IL=120mA RON -2635 

Off-State Leakage Current VL=600VPILEAK -- 1 A

Switching Speeds

Turn-On IF=5mA, VL=10V ton - 0.85 5

Turn-Off toff - 0.46 3

Output Capacitance IF=0mA, VL=50V, f=1MHz COUT -50 - pF

Input Characteristics

Input Control Current to Activate 2IL=120mA IF- 0.45 2

Input Control Current to Deactivate - IF0.2 0.4 -

Input Voltage Drop IF=5mA VF0.9 1.2 1.4 V

Reverse Input Current VR=5V IR--10 A

Common Characteristics

Input to Output Capacitance - CI/O -3 - pF

1 Measurement taken within 1 second of on-time.

2 For temperatures >60ºC, a LED current of 4mA is recommended.

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PERFORMANCE DATA*

*The Performance data shown in the graphs above is typical of device performance. For guaranteed parameters not indicated in the written specifications, please contact our application

department.

Temperature (ºC)

-40 -20 0 20 40 60 80 100

LED Forward Voltage (V)

1.0

1.1

1.2

1.3

1.4

1.5

1.6

Typical LED Forward Voltage Drop

vs. Temperature

IF=50mA

IF=20mA

IF=10mA

IF=5mA

IF=2mA

LED Current (mA)

0 1020304050

Turn-On Time (ms)

Typical Turn-On

vs. LED Forward Current

(IL=70mA, TA=25ºC)

LED Current (mA)

0 1020304050

Turn-Off (ms)

0.45

0.47

0.49

0.51

0.53

0.55

Typical Turn-Off

vs. LED Forward Current

(IL=70mA, TA=25ºC)

LED Forward Voltage (V)

-40 -20 0 20 40 60 80 100

Forward Current (mA)

0.2

0.4

0.6

0.8

1.0

1.2

1.4

Typical IF for Switch Operation

vs. Temperature

(IL=70mA)

Temperature (ºC)

-40 -20 0 20 40 60 80 100

Turn-On Time (ms)

0.5

1.0

1.5

2.0

2.5

3.0

Typical Turn-On vs. Temperature

(IL=70mA)

IF=2mA

IF=5mA

Temperature (ºC)

-40 -20 0 20 40 60 80 100

Turn-Off Time (Ps)

200

300

400

500

600

700

800

900

Typical Turn-Off vs. Temperature

(IL=70mA)

IF=2mA

IF=5mA

LED Forward Voltage (V)

1.230 1.235 1.240 1.245 1.250 1.255

Device Count (N)

Typical LED Forward Voltage Drop

(N=50, IF=5mA, TA=25ºC)

Turn-On Time (ms)

0.65 0.70 0.75 0.80 0.85 0.90 0.95 1.00

Device Count (N)

Typical Turn-On Time

(N=50, IF=5mA, IL=120mA, TA=25ºC)

Turn-Off Time (ms)

0.34 0.37 0.40 0.43 0.46 0.49 0.52 0.55

Device Count (N)

Typical Turn-Off Time

(N=50, IF=5mA, IL=120mA, TA=25ºC)

LED Current (mA)

0.30 0.35 0.40 0.45 0.50 0.55 0.60

Device Count (N)

Typical IF for Switch Operation

(N=50, IL=120mA, TA=25ºC)

On-Resistance (:)

25.50 25.75 26.00 26.25 26.50 26.75 27.00

Device Count (N)

Typical On-Resistance Distribution

(N=50, IF=2mA, IL=120mA, TA=25ºC)

Blocking Voltage (VP)

680 685 690 695 700 705 710 715

Device Count (N)

Typical Blocking Voltage Distribution

(N=50, TA=25ºC)

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CPC1394

PERFORMANCE DATA*

*The Performance data shown in the graphs above is typical of device performance. For guaranteed parameters not indicated in the written specifications, please contact our application

department.

Temperature (ºC)

-40 -20 0 20 40 60 80 100

On-Resistance (:)

Typical On-Resistance

vs. Temperature

(IF=2mA, IL=70mA)

Load Voltage (V)

-4 -3 -2 -1 0 1 2 3 4

Load Current (A)

-0.15

-0.10

-0.05

0.00

0.05

0.10

0.15

Typical Load Current

vs. Load Voltage

(IF=2mA)

Temperature (ºC)

-40 -20 0 20 40 60 80 100

Load Current (mA)

100

110

120

130

Maximum Load Current

vs. Temperature

(IF=2mA)

Temperature (ºC)

-40 -20 0 20 40 60 80 100

Blocking Voltage (VP)

Typical Blocking Voltage

vs. Temperature

600

625

650

675

700

725

750

Temperature (ºC)

-40 -20 0 20 40 60 80 100

Leakage Current (nA)

100

Typical Leakage vs. Temperature

(VL=600V)

Time

10Ps 100Ps 1ms 10ms 100ms 1s 10s 100s

Load Current (A)

0.0

0.2

0.4

0.6

0.8

1.0

Energy Rating Curve

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Manufacturing Information

Moisture Sensitivity

All plastic encapsulated semiconductor packages are susceptible to moisture ingression. IXYS Integrated

Circuits Division classified all of its plastic encapsulated devices for moisture sensitivity according to

the latest version of the joint industry standard, IPC/JEDEC J-STD-020, in force at the time of product

evaluation. We test all of our products to the maximum conditions set forth in the standard, and guarantee proper

operation of our devices when handled according to the limitations and information in that standard as well as to any

limitations set forth in the information or standards referenced below.

Failure to adhere to the warnings or limitations as established by the listed specifications could result in reduced

product performance, reduction of operable life, and/or reduction of overall reliability.

This product carries a Moisture Sensitivity Level (MSL) rating as shown below, and should be handled according

to the requirements of the latest version of the joint industry standard IPC/JEDEC J-STD-033.

Device Moisture Sensitivity Level (MSL) Rating

CPC1394G / CPC1394GV / CPC1394GR MSL 1

ESD Sensitivity

This product is ESD Sensitive, and should be handled according to the industry standard JESD-625.

Reflow Profile

This product has a maximum body temperature and time rating as shown below. All other guidelines of J-STD-020

must be observed.

Device Maximum Temperature x Time

CPC1394G / CPC1394GV / CPC1394GR 250ºC for 30 seconds

Board Wash

IXYS Integrated Circuits Division recommends the use of no-clean flux formulations. However, board washing to

remove flux residue is acceptable. Since IXYS Integrated Circuits Division employs the use of silicone coating as

an optical waveguide in many of its optically isolated products, the use of a short drying bake could be necessary

if a wash is used after solder reflow processes. Chlorine- or Fluorine-based solvents or fluxes should not be used.

Cleaning methods that employ ultrasonic energy should not be used.

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CPC1394

MECHANICAL DIMENSIONS

PC Board Pattern (Top View)

Dimensions

(inches)

PIN 1

6.350 ± 0.127

(0.250 ± 0.005)

4.572 ± 0.127

(0.180 ± 0.005)

0.991

(0.039)

9º (ALL)

3.30 ± 0.050

(0.130 ± 0.002)

0.254

(0.010)

9.144 ± 0.508

(0.360 ± 0.020)

7.620 ± 0.250

(0.300 ± 0.010)

7.620 ± 0.127

(0.300 ± 0.005)

2.540 ± 0.127

(0.100 ± 0.005)

6 - 0.800 DIA.

(6 - 0.031 DIA.)

6.350 ± 0.127

(0.250 ± 0.005)

9º (ALL)

0.457 ± 0.076

(0.018 ± 0.003)

2.540 ± 0.127

(0.100 ± 0.005) 3.175

(0.125)

0.508

(0.020)

2.159

(0.085)

Dimensions

(inches)

PC Board Pattern (Top View)

10.160 ± 0.127

(0.400 ± 0.005)

2.540 ± 0.127

(0.100 ± 0.005)

6 - 0.800 DIA.

(6 - 0.031 DIA.)

6.350 ± 0.127

(0.250 ± 0.005)

9º (ALL)

3.30 ± 0.050

(0.130 ± 0.002)

0.254

(0.010) 10.160 ± 0.508

(0.400 ± 0.020)

7.620 ± 0.254

(0.300 ± 0.010)

6.350 ± 0.050

(0.250 ± 0.002)

4.572 ± 0.050

(0.180 ± 0.002)

0.991

(0.039)

9º (ALL)

0.457 ± 0.076

(0.018 ± 0.003)

2.540 ± 0.050

(0.100 ± 0.002) 2.92

(0.115)

0.127

(0.005)

1.778

(0.070)

Pin 1

CPC1394G

CPC1394GV

INTEGRATED CIRCUITS DIVISION

IXYS Integrated Circuits Division makes no representations or warranties with respect to the accuracy or completeness of the contents of this publication and reserves the right to make

changes to specifications and product descriptions at any time without notice. Neither circuit patent licenses nor indemnity are expressed or implied. Except as set forth in IXYS Integrated

Circuits Division’s Standard Terms and Conditions of Sale, IXYS Integrated Circuits Division assumes no liability whatsoever, and disclaims any express or implied warranty, relating to

its products including, but not limited to, the implied warranty of merchantability, fitness for a particular purpose, or infringement of any intellectual property right.

The products described in this document are not designed, intended, authorized or warranted for use as components in systems intended for surgical implant into the body, or in other

applications intended to support or sustain life, or where malfunction of IXYS Integrated Circuits Division’s product may result in direct physical harm, injury, or death to a person or severe

property or environmental damage. IXYS Integrated Circuits Division reserves the right to discontinue or make changes to its products at any time without notice.

Specification: DS-CPC1394-R03

12/16/2012

For additional information please visit our website at: www.ixysic.com

CPC1394

Dimensions

(inches)

PCB Land Pattern

PIN #1

6.350 ± 0.127

(0.250 ± 0.005)

0.991

(0.039)

9.525

(0.375)

2.540 ± 0.127

(0.100 ± 0.005)

7.620 ± 0.254

(0.300 ± 0.010)

0.635 ± 0.254

(0.025 ± 0.010)

0.254

(0.010)

3.300 ± 0.050

(0.130 ± 0.002)

3.480 ± 0.076

(0.137 ± 0.003)

2.287

(0.09)

8.80

(0.346)

1.60

(0.063)

0.95

(0.037)

9º ± 1º

(ALL)

0.102 min / 0.254 max

(0.004 min / 0.010 max)

4.572 ± 0.127

(0.180 ± 0.005)

2.540 ± 0.127

(0.100 ± 0.005)

2.287 ± 0.127

(0.090 ± 0.005)

Dimensions

(inches)

NOTES:

1. All dimensions meet EIA-481-C requirements

2. Unless otherwise noted, tolerances = ±0.10 (0.004)

Embossment

Embossed

Carrier

330.2 Dia

(13.00 Dia)

Top Cover

Tape Thickness

0.102 Max

(0.004 Max) K0=4.20

(0.165)

K1=3.70

(0.146)

W=16.00±0.30

(0.630±0.012)

A0=10.01

(0.394)

P=12.00

(0.472)

B0=5.00

(0.197)

CPC1394GR

CPC1394GRTR Tape & Reel