2009-12-01
Rev. 3.1 Page 1
SPP20N65C3, SPA20N65C3
SPI20N65C3
Cool MOS™ Power Transistor VDS 650 V
RDS(on) 0.19
ID20.7 A
Feature
New revolutionary high voltage technology
Worldwide best RDS(on) in TO 220
Ultra low gate charge
Periodic avalanche rated
Extreme dv/dtrated
High peak current capability
Improved transconductance
PG-TO262 PG-TO220FP PG-TO220
P-TO220-3-31
123
Marking
20N65C3
20N65C3
20N65C3
Type Package Ordering Code
SPP20N65C3 PG-TO220 Q67040-S4556
SPA20N65C3 PG-TO220FP SP000216362
SPI20N65C3 PG-TO262 Q67040-S4560
Maximum Ratings
Parameter Symbol Value Unit
SPA
Continuous drain current
T
C
= 25 °C
T
C
= 100 °C
I
D
20.7
13.1
20.7
1)
13.1
1)
A
Pulsed drain current, t
p
limited by T
jmax
I
Dpuls
62.1 62.1 A
Avalanche energy, single pulse
I
D
=3.5A, V
DD
=50V
E
AS
690 690 mJ
Avalanche energy, repetitive t
AR
limited by T
jmax2)
I
D
=7A, V
DD
=50V
E
AR
11
Avalanche current, repetitive t
AR
limited by T
jmax
I
AR
77A
Gate source voltage V
GS
±20 ±20 V
Gate source voltage AC (f >1Hz) V
GS
±30 ±30
Power dissipation,
T
C
= 25°C
P
tot
208 34.5 W
SPP_I
Operating and storage temperature T
j,
T
stg
-55...+150 °C
2009-12-01
Rev. 3.1 Page 2
SPP20N65C3, SPA20N65C3
SPI20N65C3
Maximum Ratings
Parameter Symbol Value Unit
Drain Source voltage slope
VDS = 480 V, ID = 20.7 A, Tj = 125 °C
dv/dt50 V/ns
Thermal Characteristics
Parameter Symbol Values Unit
min. typ. max.
Thermal resistance, junction - case RthJC - - 0.6 K/W
Thermal resistance, junction - case, FullPAK RthJC_FP - - 3.6
Thermal resistance, junction - ambient, leaded RthJA - - 62
Thermal resistance, junction - ambient, FullPAK RthJA_FP - - 80
SMD version, device on PCB:
@ min. footprint
@ 6 cm2 cooling area 3)
RthJA
-
-
-
35
62
-
Soldering temperature, wavesoldering
1.6 mm (0.063 in.) from case for 10s
Tsold - - 260 °C
Electrical Characteristics, at Tj=25°C unless otherwise specified
Parameter Symbol Conditions Values Unit
min. typ. max.
Drain-source breakdown voltage V(BR)DSS VGS=0V, ID=0.25mA 650 - - V
Drain-Source avalanche
breakdown voltage
V(BR)DS VGS=0V, ID=7A - 730 -
Gate threshold voltage VGS(th) ID=1000µA, VGS=VDS2.1 3 3.9
Zero gate voltage drain current IDSS VDS=600V, VGS=0V,
Tj=25°C
Tj=150°C
-
-
0.1
-
1
100
µA
Gate-source leakage current IGSS VGS=20V, VDS=0V - - 100 nA
Drain-source on-state resistance RDS(on) VGS=10V, ID=13.1A
Tj=25°C
Tj=150°C
-
-
0.16
0.43
0.19
-
Gate input resistance RGf=1MHz, open drain - 0.54 -
2009-12-01
Rev. 3.1 Page 3
SPP20N65C3, SPA20N65C3
SPI20N65C3
Electrical Characteristics
Parameter Symbol Conditions Values Unit
min. typ. max.
Transconductance gfs VDS2*ID*RDS(on)max,
ID=13.1A
- 17.5 - S
Input capacitance Ciss VGS=0V, VDS=25V,
f=1MHz
- 2400 - pF
Output capacitance Coss - 780 -
Reverse transfer capacitance Crss - 50 -
Effective output capacitance,4)
energy related
Co(er) VGS=0V,
VDS=0V to 480V
- 83 -
Effective output capacitance,5)
time related
Co(tr) - 160 -
Turn-on delay time td(on) VDD=380V, VGS=0/13V,
ID=20.7A,
RG=3.6,Tj=125
- 10 - ns
Rise time trVDD=380V, VGS=0/13V,
ID=20.7A,
RG=3.6
- 5 -
Turn-off delay time td(off) - 67 100
Fall time tf- 4.5 12
Gate Charge Characteristics
Gate to source charge Qgs VDD=480V, ID=20.7A - 11 - nC
Gate to drain charge Qgd - 33 -
Gate charge total QgVDD=480V, ID=20.7A,
VGS=0 to 10V
- 87 114
Gate plateau voltage V(plateau) VDD=480V, ID=20.7A - 5.5 - V
1Limited only by maximum temperature
2Repetitve avalanche causes additional power losses that can be calculated as PAV=EAR*f.
3Device on 40mm*40mm*1.5mm epoxy PCB FR4 with 6cm² (one layer, 70 µm thick) copper area for drain
connection. PCB is vertical without blown air.
4Co(er) is a fixed capacitance that gives the same stored energy as Coss while VDS is rising from 0 to 80% VDSS.
5Co(tr) is a fixed capacitance that gives the same charging time as Coss while VDS is rising from 0 to 80% VDSS.
2009-12-01
Rev. 3.1 Page 4
SPP20N65C3, SPA20N65C3
SPI20N65C3
Electrical Characteristics
Parameter Symbol Conditions Values Unit
min. typ. max.
Inverse diode continuous
forward current
ISTC=25°C - - 20.7 A
Inverse diode direct current,
pulsed ISM - - 62.1
Inverse diode forward voltage VSD VGS=0V, IF=IS- 1 1.2 V
Reverse recovery time trr VR=480V, IF=IS ,
diF/dt=100A/µs
- 500 800 ns
Reverse recovery charge Qrr - 11 - µC
Peak reverse recovery current Irrm - 70 - A
Peak rate of fall of reverse
recovery current
dirr/dt Tj=25°C - 1400 - A/µs
Typical Transient Thermal Characteristics
Symbol Value Unit Symbol Value Unit
SPA SPA
Rth1 0.00769 0.00769 K/W Cth1 0.0003763 0.0003763 Ws/K
Rth2 0.015 0.015 Cth2 0.001411 0.001411
Rth3 0.029 0.029 Cth3 0.001931 0.001931
Rth4 0.114 0.163 Cth4 0.005297 0.005297
Rth5 0.136 0.323 Cth5 0.012 0.008453
Rth6 0.059 2.526 Cth6 0.091 0.412
SPP_ISPP_I
External Heatsink
TjTcase
Tamb
Cth1 Cth2
Rth1 Rth,n
Cth,n
Ptot (t)
2009-12-01
Rev. 3.1 Page 5
SPP20N65C3, SPA20N65C3
SPI20N65C3
1 Power dissipation
Ptot = f(TC)
0 20 40 60 80 100 120 °C 160
TC
0
20
40
60
80
100
120
140
160
180
200
W
240 SPP20N65C3
Ptot
2 Power dissipation FullPAK
Ptot = f(TC)
0 20 40 60 80 100 120 °C 160
TC
0
5
10
15
20
25
W
35
Ptot
3 Safe operating area
ID= f ( VDS )
parameter : D = 0 , TC=25°C
10 010 110 210 3
V
VDS
-2
10
-1
10
0
10
1
10
2
10
A
ID
tp = 0.001 ms
tp = 0.01 ms
tp = 0.1 ms
tp = 1 ms
DC
4 Safe operating area FullPAK
ID = f (VDS)
parameter: D = 0, TC = 25°C
10 010 110 210 3
V
VDS
-2
10
-1
10
0
10
1
10
2
10
A
ID
tp = 0.001 ms
tp = 0.01 ms
tp = 0.1 ms
tp = 1 ms
tp = 10 ms
DC
2009-12-01
Rev. 3.1 Page 6
SPP20N65C3, SPA20N65C3
SPI20N65C3
5 Transient thermal impedance FullPAK
ZthJC = f(tp)
parameter: D = tp/t
10 -6 10 -5 10 -4 10 -3 10 -2 10 -1 10 1
s
tp
-3
10
-2
10
-1
10
0
10
1
10
K/W
ZthJC
D = 0.5
D = 0.2
D = 0.1
D = 0.05
D = 0.02
D = 0.01
single pulse
6 Typ. output characteristic
ID = f (VDS); Tj=25°C
parameter: tp= 10 µs, VGS
0 5 10 15 V 25
VDS
0
10
20
30
40
50
60
A
80
ID
4,5V
5V
5,5V
6V
6,5V
7V
20V
10V
8V
7 Typ. output characteristic
ID = f (VDS); Tj=150°C
parameter: tp= 10 µs, VGS
0 2 4 6 8 10 12 14 16 18 20 22 V 25
VDS
0
5
10
15
20
25
30
35
A
45
ID
4.5V
5V
5.5V
6V
20V
10V
7V
8 Typ. drain-source on resistance
RDS(on)=f(ID)
parameter: Tj=150°C, VGS
0 5 10 15 20 25 30 A 40
ID
0.3
0.4
0.5
0.6
0.7
0.8
0.9
1
1.1
1.2
1.3
1.5
RDS(on)
4V
4.5V
5V
5.5V
6V
6.5V
20V
2009-12-01
Rev. 3.1 Page 7
SPP20N65C3, SPA20N65C3
SPI20N65C3
9 Drain-source on-state resistance
RDS(on) = f(Tj)
parameter : ID = 13.1 A, VGS = 10 V
-60 -20 20 60 100 °C 180
Tj
0
0.1
0.2
0.3
0.4
0.5
0.6
0.7
0.8
0.9
1.1 SPP20N65C3
RDS(on)
typ
98%
10 Typ. transfer characteristics
ID= f ( VGS ); VDS 2 x ID x RDS(on)max
parameter: tp = 10 µs
0 1 2 3 4 5 6 7 V 9
VGS
0
10
20
30
40
50
60
A
80
ID
150°C
25°C
12 Forward characteristics of body diode
IF = f (VSD)
parameter: Tj , tp= 10 µs
0 0.4 0.8 1.2 1.6 2 2.4 V3
VSD
-1
10
0
10
1
10
2
10
A
SPP20N65C3
IF
Tj = 25 °C typ
Tj = 25 °C (98%)
Tj = 150 °C typ
Tj = 150 °C (98%)
11 Typ. gate charge
VGS =f (QGate)
parameter: ID = 20.7 A pulsed
0 20 40 60 80 100 nC 140
QGate
0
2
4
6
8
10
12
V
16 SPP20N65C3
VGS
0,8 VDS max
DS max
V
0,2
2009-12-01
Rev. 3.1 Page 8
SPP20N65C3, SPA20N65C3
SPI20N65C3
13 Typ. switching time
t = f(ID), inductive load, Tj=125°C
par.: VDS=380V, VGS=0/+13V, RG=3.6
0 4 8 12 16 A 24
ID
0
10
1
10
2
10
ns
t
tr
td(off)
td(on)
tf
14 Typ. switching time
t = f (RG), inductive load, Tj=125°C
par.: VDS=380V, VGS=0/+13V, ID=20.7 A
0 5 10 15 20 25 30 40
RG
0
10
1
10
2
10
3
10
ns
t
td(off)
td(on)
tr
tf
15 Typ. drain current slope
di/dt = f(RG), inductive load, Tj = 125°C
par.: VDS=380V, VGS=0/+13V, ID=20.7A
0 5 10 15 20 25 30 40
RG
0
500
1000
1500
2000
2500
3000
3500
4000
A/µs
5000
di/dt
di/dt(on)
di/dt(off)
16 Typ. drain source voltage slope
dv/dt = f(RG), inductive load, Tj = 125°C
par.: VDS=380V, VGS=0/+13V, ID=20.7A
0 5 10 15 20 25 30 40
RG
0
25
50
75
100
V/ns
150
dv/dt
dv/dt(on)
dv/dt(off)
2009-12-01
Rev. 3.1 Page 9
SPP20N65C3, SPA20N65C3
SPI20N65C3
17 Typ. switching losses
E = f (ID), inductive load, Tj=125°C
par.: VDS=380V, VGS=0/+13V, RG=3.6
0 3 6 9 12 15 A 21
ID
0
0.01
0.02
0.03
0.04
0.05
0.06
mWs
0.08
E
Eon*
Eoff
*) Eon includes SPD06S60 diode
commutation losses
18 Typ. switching losses
E = f(RG), inductive load, Tj=125°C
par.: VDS=380V, VGS=0/+13V,ID=11A
0 5 10 15 20 25 30 40
RG
0
0.05
0.1
0.15
0.2
0.25
0.3
mWs
0.4
E
Eon*
Eoff
*) Eon includes SPD06S60 diode
commutation losses
19 Avalanche SOA
IAR = f (tAR)
par.: Tj 150 °C
10 -3 10 -2 10 -1 10 010 110 210 4
µs
tAR
0
0.5
1
1.5
2
2.5
3
3.5
4
4.5
5
5.5
6
A
7
IAR
Tj(Start)=25°C
Tj(Start)=125°C
20 Avalanche energy
EAS = f(Tj)
par.: ID = 3.5 A, VDD = 50 V
20 40 60 80 100 120 °C 160
Tj
0
100
200
300
400
500
mJ
700
EAS
2009-12-01
Rev. 3.1 Page 10
SPP20N65C3, SPA20N65C3
SPI20N65C3
22 Avalanche power losses
PAR = f (f )
parameter: EAR=1mJ
10 410 510 6
Hz
f
0
50
100
150
200
250
300
350
400
W
500
PAR
21 Drain-source breakdown voltage
V(BR)DSS = f(Tj)
-60 -20 20 60 100 °C 180
Tj
585
605
625
645
665
685
705
725
745
V
785 SPP20N65C3
V(BR)DSS
23 Typ. capacitances
C = f(VDS)
parameter: VGS=0V, f=1 MHz
0 100 200 300 400 V 600
VDS
0
10
1
10
2
10
3
10
4
10
5
10
pF
C
Ciss
Coss
Crss
24 Typ. Coss stored energy
Eoss=f(VDS)
0 100 200 300 400 V 600
VDS
0
1
2
3
4
5
6
7
8
9
10
11
12
µJ
14
Eoss
2009-12-01
Rev. 3.1 Page 11
SPP20N65C3, SPA20N65C3
SPI20N65C3
Definition of diodes switching characteristics
2009-12-01
Rev. 3.1 Page 12
SPP20N65C3, SPA20N65C3
SPI20N65C3
PG-TO220-3-1, PG-TO220-3-21
2009-12-01
Rev. 3.1 Page 13
SPP20N65C3, SPA20N65C3
SPI20N65C3
PG-TO220-3-31/3-111 Fully isolated package ( 2500 VAC; 1 minute )
2009-12-01
Rev. 3.1 Page 14
SPP20N65C3, SPA20N65C3
SPI20N65C3
PG-TO262-3-1, PG-TO262-3-21 (I²-PAK)
2009-12-01
Rev. 3.1 Page 15
SPP20N65C3, SPA20N65C3
SPI20N65C3
Published by
Infineon Technologies AG
81726 Munich, Germany
© 2007 Infineon Technologies AG
All Rights Reserved.
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