SCDS038I − DECEMBER 1997 − REVISED OCT OBER 2003
1
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
DStandard ’126-Type Pinout
D5-Ω Switch Connection Between Two Ports
DRail-to-Rail Switching on Data I/O Ports
DIoff Supports Partial-Power-Down Mode
Operation
DLatch-up Performance Exceeds 100 mA per
JESD 78, Class II
1
2
3
4
5
6
7
14
13
12
11
10
9
8
1OE
1A
1B
2OE
2A
2B
GND
VCC
4OE
4A
4B
3OE
3A
3B
D, DGV, OR PW PACKAGE
(TOP VIEW)
1
2
3
4
5
6
7
8
16
15
14
13
12
11
10
9
NC
1OE
1A
1B
2OE
2A
2B
GND
VCC
4OE
4A
4B
3OE
3A
3B
NC
DBQ PACKAGE
(TOP VIEW)
NC − No internal connection
RGY PACKAGE
(TOP VIEW)
114
78
2
3
4
5
6
13
12
11
10
9
4OE
4A
4B
3OE
3A
1A
1B
2OE
2A
2B
1OE
3B V
GND
CC
description/ordering information
The SN74CBTLV3126 quadruple FET bus switch features independent line switches. Each switch is disabled
when the associated output-enable (OE) input is low.
This device is fully specified for partial-power-down applications using Ioff. The Ioff feature ensures that
damaging current will not backflow through the device when it is powered down. The device has isolation during
power off.
To ensure the high-impedance state during power up or power down, OE should be tied to GND through a
pulldown resistor; the minimum value of the resistor is determined by the current-sinking capability of the driver.
ORDERING INFORMATION
TAPACKAGE†ORDERABLE
PART NUMBER TOP-SIDE
MARKING
QFN − RGY Tape and reel SN74CBTLV3126RGYR CL126
SOIC − D
Tube SN74CBTLV3126D
CBTLV3126
−40°C to 85°C
SOIC − D Tape and reel SN74CBTLV3126DR CBTLV3126
−40
°
C to 85
°
C
SSOP (QSOP) − DBQ Tape and reel SN74CBTLV3126DBQR CL126
TSSOP − PW Tape and reel SN74CBTLV3126PWR CL126
TVSOP − DGV Tape and reel SN74CBTLV3126DGVR CL126
†Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines
are available at www.ti.com/sc/package.
FUNCTION TABLE
(each bus switch)
INPUT
OE FUNCTION
L Disconnect
HA port = B port
Copyright 2003, Texas Instruments Incorporated
!"#$ % &'!!($ #% )'*+&#$ ,#$(-
!,'&$% &!" $ %)(&&#$% )(! $.( $(!"% (/#% %$!'"($%
%$#,#!, 0#!!#$1- !,'&$ )!&(%%2 ,(% $ (&(%%#!+1 &+',(
$(%$2 #++ )#!#"($(!%-
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
SCDS038I − DECEMBER 1997 − REVISED OCT OBER 2003
2POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
logic diagram (positive logic)
1A
1OE
SW 1B
2A
2OE
SW 2B
3A
3OE
SW 3B
4A
4OE
SW 4B
2
1
5
4
9
10
12
13
3
6
8
11
Pin numbers shown are for the D, DGV, PW, and RGY packages.
simplified schematic, each FET switch
A
(OE)
B
SCDS038I − DECEMBER 1997 − REVISED OCT OBER 2003
3
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
absolute maximum ratings over operating free-air temperature range (unless otherwise noted)†
Supply voltage range, VCC −0.5 V to 4.6 V. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Input voltage range, VI (see Note 1) −0.5 V to 4.6 V. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Continuous channel current 128 mA. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Input clamp current, IIK (VI/O < 0) −50 mA. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Package thermal impedance, θJA(see Note 2): D package 86°C/W. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
(see Note 2): DBQ package 90°C/W. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
(see Note 2): DGV package 127°C/W. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
(see Note 2): PW package 113°C/W. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
(see Note 3): RGY package 47°C/W. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Storage temperature range, Tstg −65°C to 150°C. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
†Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and
functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not
implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
NOTES: 1. The input and output negative-voltage ratings may be exceeded if the input and output clamp-current ratings are observed.
2. The package thermal impedance is calculated in accordance with JESD 51-7.
3. The package thermal impedance is calculated in accordance with JESD 51-5.
recommended operating conditions (see Note 4)
MIN MAX UNIT
VCC Supply voltage 2.3 3.6 V
VIH
High-level control input voltage
VCC = 2.3 V to 2.7 V 1.7
V
VIH High-level control input voltage VCC = 2.7 V to 3.6 V 2V
VIL
Low-level control input voltage
VCC = 2.3 V to 2.7 V 0.7
V
VIL Low-level control input voltage VCC = 2.7 V to 3.6 V 0.8 V
TAOperating free-air temperature −40 85 °C
NOTE 4: All unused control inputs of the device must be held at VCC or GND to ensure proper device operation. Refer to the TI application report,
Implications of Slow or Floating CMOS Inputs, literature number SCBA004.
electrical characteristics over recommended operating free-air temperature range (unless
otherwise noted)
PARAMETER TEST CONDITIONS MIN TYP‡MAX UNIT
VIK VCC = 3 V, II = −18 mA −1.2 V
IIVCC = 3.6 V, VI = VCC or GND ±1µA
Ioff VCC = 0, VI or VO = 0 to 3.6 V 10 µA
ICC VCC = 3.6 V, IO = 0, VI = VCC or GND 10 µA
∆ICC§Control inputs VCC = 3.6 V, One input at 3 V, Other inputs at VCC or GND 300 µA
CiControl inputs VI = 3 V or 0 2.5 pF
Cio(OFF) VO = 3 V or 0, OE = GND 7 pF
VCC = 2.3 V,
VI = 0
II = 64 mA 5 8
VCC = 2.3 V,
TYP at VCC = 2.5 V
VI = 0 II = 24 mA 5 8
ron¶
TYP at VCC = 2.5 V
VI = 1.7 V, II = 15 mA 27 40
Ω
r
on
¶
VI = 0
II = 64 mA 5 7 Ω
V
CC
= 3 V VI = 0 II = 24 mA 5 7
VCC = 3 V
VI = 2.4 V, II = 15 mA 10 15
‡All typical values are at VCC = 3.3 V (unless otherwise noted), TA = 25°C.
§This is the increase in supply current for each input that is at the specified voltage level, rather than VCC or GND.
¶Measured by the voltage drop between the A and B terminals at the indicated current through the switch. On-state resistance is determined by
the lower of the voltages of the two (A or B) terminals.
SCDS038I − DECEMBER 1997 − REVISED OCT OBER 2003
4POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
switching characteristics over recommended operating free-air temperature range (unless
otherwise noted) (see Figure 1)
PARAMETER
FROM
(INPUT)
TO
(OUTPUT)
VCC = 2.5 V
± 0.2 V VCC = 3.3 V
±0.3 V
UNIT
PARAMETER
(INPUT)
(OUTPUT)
MIN MAX MIN MAX
UNIT
tpd†A or B B or A 0.15 0.25 ns
ten OE A or B 1.6 4.5 1.9 4.2 ns
tdis OE A or B 1.3 4.7 1 4.8 ns
†The propagation delay is the calculated RC time constant of the typical on-state resistance of the switch and the specified load capacitance, when
driven by an ideal voltage source (zero output impedance).
SCDS038I − DECEMBER 1997 − REVISED OCT OBER 2003
5
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
PARAMETER MEASUREMENT INFORMATION
VCC/2
th
tsu
From Output
Under Test
CL
(see Note A)
LOAD CIRCUIT
S1 2 × VCC
Open
GND
RL
RL
Data Input
Timing Input VCC
0 V
VCC
0 V
0 V
tw
Input
VOLTAGE WAVEFORMS
SETUP AND HOLD TIMES
VOLTAGE WAVEFORMS
PROPAGATION DELAY TIMES
INVERTING AND NONINVERTING OUTPUTS
VOLTAGE WAVEFORMS
PULSE DURATION
tPLH
tPHL
tPHL
tPLH
VOH
VOH
VOL
VOL
VCC
0 V
Input
Output
Waveform 1
S1 at 2 × VCC
(see Note B)
Output
Waveform 2
S1 at GND
(see Note B)
VOL
VOH
tPZL
tPZH
tPLZ
tPHZ
VCC
0 V
VOL + V∆
VOH − V∆
≈0 V
VCC
VOLTAGE WAVEFORMS
ENABLE AND DISABLE TIMES
LOW- AND HIGH-LEVEL ENABLING
Output
Output
tPLH/tPHL
tPLZ/tPZL
tPHZ/tPZH
Open
2 × VCC
GND
TEST S1
NOTES: A. CL includes probe and jig capacitance.
B. W aveform 1 is for an output with internal conditions such that the output is low except when disabled by the output control.
Waveform 2 is for an output with internal conditions such that the output is high except when disabled by the output control.
C. All input pulses are supplied by generators having the following characteristics: PRR ≤ 10 MHz, ZO = 50 Ω, tr ≤2 ns, tf ≤2 ns.
D. The outputs are measured one at a time with one transition per measurement.
E. tPLZ and tPHZ are the same as tdis.
F. tPZL and tPZH are the same as ten.
G. tPLH and tPHL are the same as tpd.
H. All parameters and waveforms are not applicable to all devices.
Output
Control
VCC/2 VCC/2
VCC/2 VCC/2
VCC/2 VCC/2
VCC/2
VCC/2 VCC/2
VCC/2
VCC/2
VCC/2
VCC
VCC/2
VCC/2
2.5 V ±0.2 V
3.3 V ±0.3 V 500 Ω
500 Ω
VCC RL
0.15 V
0.3 V
V∆
CL
30 pF
50 pF
Figure 1. Load Circuit and Voltage Waveforms
PACKAGING INFORMATION
Orderable Device Status (1) Package
Type Package
Drawing Pins Package
Qty Eco Plan (2) Lead/Ball Finish MSL Peak Temp (3)
74CBTLV3126DBQRE4 ACTIVE SSOP/
QSOP DBQ 16 2500 Green (RoHS &
no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR
74CBTLV3126DBQRG4 ACTIVE SSOP/
QSOP DBQ 16 2500 Green (RoHS &
no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR
74CBTLV3126DGVRE4 ACTIVE TVSOP DGV 14 2000 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
74CBTLV3126DGVRG4 ACTIVE TVSOP DGV 14 2000 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
74CBTLV3126PWRE4 ACTIVE TSSOP PW 14 2000 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
74CBTLV3126PWRG4 ACTIVE TSSOP PW 14 2000 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
74CBTLV3126RGYRG4 ACTIVE VQFN RGY 14 3000 Green (RoHS &
no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR
74CBTLV3216PWRE4 ACTIVE TSSOP PW 14 TBD Call TI Call TI
SN74CBTLV3126D ACTIVE SOIC D 14 50 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74CBTLV3126DBQR ACTIVE SSOP/
QSOP DBQ 16 2500 Green (RoHS &
no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR
SN74CBTLV3126DE4 ACTIVE SOIC D 14 50 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74CBTLV3126DG4 ACTIVE SOIC D 14 50 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74CBTLV3126DGVR ACTIVE TVSOP DGV 14 2000 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74CBTLV3126DR ACTIVE SOIC D 14 2500 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74CBTLV3126DRE4 ACTIVE SOIC D 14 2500 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74CBTLV3126DRG4 ACTIVE SOIC D 14 2500 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74CBTLV3126PW ACTIVE TSSOP PW 14 90 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74CBTLV3126PWE4 ACTIVE TSSOP PW 14 90 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74CBTLV3126PWG4 ACTIVE TSSOP PW 14 90 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74CBTLV3126PWR ACTIVE TSSOP PW 14 2000 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74CBTLV3126RGYR ACTIVE VQFN RGY 14 3000 Green (RoHS &
no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check
PACKAGE OPTION ADDENDUM
www.ti.com 21-Dec-2009
Addendum-Page 1
http://www.ti.com/productcontent for the latest availability information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and
package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS
compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)
(3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder
temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is
provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the
accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take
reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on
incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited
information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI
to Customer on an annual basis.
PACKAGE OPTION ADDENDUM
www.ti.com 21-Dec-2009
Addendum-Page 2
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device Package
Type Package
Drawing Pins SPQ Reel
Diameter
(mm)
Reel
Width
W1 (mm)
A0
(mm) B0
(mm) K0
(mm) P1
(mm) W
(mm) Pin1
Quadrant
SN74CBTLV3126DGVR TVSOP DGV 14 2000 330.0 12.4 6.8 4.0 1.6 8.0 12.0 Q1
SN74CBTLV3126DR SOIC D 14 2500 330.0 16.4 6.5 9.0 2.1 8.0 16.0 Q1
SN74CBTLV3126PWR TSSOP PW 14 2000 330.0 12.4 7.0 5.6 1.6 8.0 12.0 Q1
SN74CBTLV3126RGYR VQFN RGY 14 3000 180.0 12.4 3.75 3.75 1.15 8.0 12.0 Q1
PACKAGE MATERIALS INFORMATION
www.ti.com 21-Dec-2009
Pack Materials-Page 1
*All dimensions are nominal
Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm)
SN74CBTLV3126DGVR TVSOP DGV 14 2000 346.0 346.0 29.0
SN74CBTLV3126DR SOIC D 14 2500 346.0 346.0 33.0
SN74CBTLV3126PWR TSSOP PW 14 2000 346.0 346.0 29.0
SN74CBTLV3126RGYR VQFN RGY 14 3000 190.5 212.7 31.8
PACKAGE MATERIALS INFORMATION
www.ti.com 21-Dec-2009
Pack Materials-Page 2
MECHANICAL DATA
MTSS001C – JANUARY 1995 – REVISED FEBRUARY 1999
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
PW (R-PDSO-G**) PLASTIC SMALL-OUTLINE PACKAGE
14 PINS SHOWN
0,65 M
0,10
0,10
0,25
0,50
0,75
0,15 NOM
Gage Plane
28
9,80
9,60
24
7,90
7,70
2016
6,60
6,40
4040064/F 01/97
0,30
6,60
6,20
80,19
4,30
4,50
7
0,15
14
A
1
1,20 MAX
14
5,10
4,90
8
3,10
2,90
A MAX
A MIN
DIM PINS **
0,05
4,90
5,10
Seating Plane
0°–8°
NOTES: A. All linear dimensions are in millimeters.
B. This drawing is subject to change without notice.
C. Body dimensions do not include mold flash or protrusion not to exceed 0,15.
D. Falls within JEDEC MO-153
MECHANICAL DATA
MPDS006C – FEBRUAR Y 1996 – REVISED AUGUST 2000
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
DGV (R-PDSO-G**) PLASTIC SMALL-OUTLINE
24 PINS SHOWN
14
3,70
3,50 4,90
5,10
20
DIM
PINS **
4073251/E 08/00
1,20 MAX
Seating Plane
0,05
0,15
0,25
0,50
0,75
0,23
0,13
112
24 13
4,30
4,50
0,16 NOM
Gage Plane
A
7,90
7,70
382416
4,90
5,103,70
3,50
A MAX
A MIN
6,60
6,20
11,20
11,40
56
9,60
9,80
48
0,08
M
0,07
0,40
0°–8°
NOTES: A. All linear dimensions are in millimeters.
B. This drawing is subject to change without notice.
C. Body dimensions do not include mold flash or protrusion, not to exceed 0,15 per side.
D. Falls within JEDEC: 24/48 Pins – MO-153
14/16/20/56 Pins – MO-194
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