www.yageo.com
Feb 10, 2012 V.12
General Purpose & High Cap.
4 V to 50 V
Surface Mount Multilayer Ceramic Capacitors
15
18
Product specification
X5R
TEST TEST METHOD
PROCEDURE REQUIREMENTS
Mounting in accordance with IEC 60384-22 paragraph 4.3
No visible damage
Bond
Strength of
Plating on
End Face
IEC 60384-
21/22
4.8
Conditions: bending 1 mm at a rate of 1 mm/s, radius jig
340 mm
<General purpose series>
∆C/C
Class2:
X5R: ±10%
<High Capacitance series>
∆C/C
Class2:
X5R: ±10%
Dissolution of the end face plating shall
not exceed 25% of the length of the
edge concerned
<General purpose series>
∆C/C
Class2:
X5R: ±10%
<High Capacitance series>
∆C/C
Class2:
X5R: ±10%
Resistance to
Soldering
Heat
4.9
Precondition: 150 +0/–10 °C for 1 hour, then keep for 24
±1 hours at room temperature
Preheating: for size ≤ 1206: 120 °C to 150 °C for 1 minute
Preheating: for size >1206: 100 °C to 120 °C for 1 minute
and 170 °C to 200 °C for 1 minute
Solder bath temperature: 260 ±5 °C
Dipping time: 10 ±0.5 seconds
Recovery time: 24 ±2 hours
D.F. within initial specified value
R
ins
within initial specified value
Solderability
4.10
Preheated the temperature of 80 °C to 140 °C and
maintained for 30 seconds to 60 seconds.
Test conditions for lead-free containing solder alloy
Temperature: 235 ±5 °C
Dipping time: 2 ±0.2 seconds
Depth of immersion: 10 mm
Alloy Composition: 60/40 Sn/Pb
Number of immersions: 1
Test conditions for lead-free containing solder alloy
Temperature: 245 ±5 °C
Dipping time: 3 ±0.3 seconds
Depth of immersion: 10 mm
Alloy Composition: SAC305
Number of immersions: 1
The solder should cover over 95% of
the critical area of each termination