
6
Absolute Maximum Ratings
HER Yellow Green
AlGaAs Red HLMP-2300/ HLMP-2400/ HLMP-2500/
Parameter HLCP-X100 2600/29XX 2700/2950 2800/2965
Series Series Series Series
Average Power Dissipated per LED Chip 37 mW[1] 135 mW[2] 85 mW[3] 135 mW[2]
Peak Forward Current per LED Chip 45 mA[4] 90 mA[5] 60 mA[5] 90 mA[5]
Average Forward Current per LED Chip 15 mA 25 mA 20 mA 25 mA
DC Forward Current per LED Chip 15 mA[1] 30 mA[2] 25 mA[3] 30 mA[2]
Reverse Voltage per LED Chip 5 V 6 V[6]
Operating Temperature Range –20°C to +100°C[7] –40°C to +85°C –20°C to +85°C
Storage Temperature Range –40°C to +85°C
Wave Soldering Temperature 250°C for 3 seconds
1.6 mm (1/16 inch) below Body
Notes:
1. Derate above 87°C at 1.7 mW/°C per LED chip. For DC operation, derate above 91°C at 0.8 mA/°C.
2. Derate above 25°C at 1.8 mW/°C per LED chip. For DC operation, derate above 50°C at 0.5 mA/°C.
3. Derate above 50°C at 1.8 mW/°C per LED chip. For DC operation, derate above 60°C at 0.5 mA/°C.
4. See Figure 1 to establish pulsed operation. Maximum pulse width is 1.5 mS.
5. See Figure 6 to establish pulsed operation. Maximum pulse width is 2 mS.
6. Does not apply to bicolor parts.
7. For operation below –20°C, contact your local Avago sales representative.
Electrical/Optical Characteristics at TA = 25°C
AlGaAs Red HLCP-X100 Series
Parameter HLCP- Symbol Min. Typ. Max. Units Test Conditions
A100/D100/E100 IV37.5 mcd IF = 3 mA
Luminous Intensity
per Lighting Emitting B100/C100/F100/G100 6 15 mcd
Area[1] H100 12 30 mcd
Peak Wavelength λPEAK 645 nm
Dominant Wavelength[2] λd637 nm
Forward Voltage per LED VF1.8 2.2 V IF = 20 mA
Reverse Breakdown Voltage per LED VR515 V I
R = 100 µA
Thermal Resistance LED Junction-to-Pin RθJ-PIN 250 °C/W/
LED