Atmel-8815E-SEEPROM-AT24CS01-02-Datasheet_012015
Standard Features
Low-voltage Operation
VCC = 1.7V to 5.5V
Internally Organized as 128 x 8 (1-Kbit) or 256 x 8 (2-Kbit)
I2C-compatible (2-wire) Serial Interface
Schmitt Trigger, Filtered Inputs for Noise Suppression
Bidirectional Data Transfer Protocol
400kHz (1.7V) and 1MHz (2.5V, 5.0V) Compatibility
Write Protect Pin for Hardware Data Protection
8-byte Page Write Mode
Partial Page Writes Allowed
Self-timed Write Cycle (5ms Max)
High-reliability
Endurance: 1,000,000 Write Cycles
Data Retention: 100 Years
Green Package Options (Pb/Halide-free/RoHS-compliant)
8-lead JEDEC SOIC, 8-lead TSSOP, 8-pad UDFN, and 5-lead SOT23
Die Sale Options: Wafer Form and Tape and Reel Available
Enhanced Features in the CS Serial EEPROM Series
All Standard Features Supported
128-bit Unique Factory-programmed Serial Number
Permanently Locked, Read-only Value
Stored in a Separate Memory Area
Guaranteed Unique Across Entire CS Series of Serial EEPROMs
AT24CS01 and AT24CS02
I2C-Compatible (2-wire) Serial EEPROM with a
Unique, Factory Programmed 128-bit Serial Number
1-Kbit (128 x 8), 2-Kbit (256 x 8)
DATASHEET
AT24CS01/02 [DATASHEET]
Atmel-8815E-SEEPROM-AT24CS01-02-Datasheet_012015
2
1. Description
The Atmel® AT24CS01 and AT24CS02 provides 1024/2048 bits of Serial Electrically Erasable and
Programmable Read-only Memory (EEPROM) organized as 128/256 words of 8 bits each. The device is
optimized for use in many industrial and commercial applications where low-power and low-voltage operation
are essential. The AT24CS01/02 is available in space-saving, 8-lead JEDEC SOIC, 8-lead TSSOP, 8-pad
UDFN and 5-lead SOT23 packages and is accessed via a 2-wire serial interface. In addition, both devices fully
operate from 1.7V to 5.5V VCC.
The AT24CS01/02 provides the additional feature of a factory programmed, guaranteed unique 128-bit serial
number, while maintaining all of the traditional features available in the 1-Kbit or 2-Kbit Serial EEPROM. The
time consuming step of performing and ensuring true serialization of product on a manufacturing line can be
removed from the production flow by employing the CS Series Serial EEPROM. The 128-bit serial number is
programmed and permanently locked from future writing during the Atmel production process. Further, this
128-bit location does not consume any of the user read/write area of the 1-Kbit or 2-Kbit Serial EEPROM. The
uniqueness of the serial number is guaranteed across the entire CS Series of Serial EEPROMs, regardless of
the size of the memory array or the type of interface protocol. This means that as an application's needs for
memory size or interface protocol evolve in future generations, any previously deployed serial number from any
Atmel CS Series Serial EEPROM part will remain valid.
2. Pin Descriptions and Pinouts
Figure 2-1. Pin Configuration
Notes: 1. For use of 5-lead SOT23, the software A2, A1, and A0 bits in the device address word must be set to
zero to properly communicate with the device.
2. Drawings are not to scale.
Pin Name Function
A0 - A2Address Inputs
SDA Serial Data
SCL Serial Clock Input
WP Write Protect
GND Ground
VCC Power Supply 1
2
3
4
A0
A1
A2
GND
8
7
6
5
VCC
WP
SCL
SDA
8-pad UDFN
(Top View)
8-lead TSSOP
(Top View)
1
2
3
4
8
7
6
5
A0
A1
A2
GND
VCC
WP
SCL
SDA
1
2
3
4
A0
A1
A2
GND
8
7
6
5
VCC
WP
SCL
SDA
8-lead SOIC
(Top View)
5-lead SOT23
(Top View)
SCL
GND
SDA
WP
VCC
1
2
3
5
4
3
AT24CS01/02 [DATASHEET]
Atmel-8815E-SEEPROM-AT24CS01-02-Datasheet_012015
3. Absolute Maximum Ratings
4. Block Diagram
Figure 4-1. Block Diagram
Operating Temperature .........................-55C to +125C
Storage Temperature ............................-65C to +150C
Voltage on any pin
with respect to ground ..............................-1.0V to +7.0V
Maximum Operating Voltage................................. 6.25V
DC Output Current ............................................... 5.0mA
*Notice: Stresses beyond those listed under “Absolute
Maximum Ratings” may cause permanent
damage to the device. This is a stress rating only
and functional operation of the device at these or
any other conditions beyond those indicated in the
operational sections of this specification is not
implied. Exposure to absolute maximum rating
conditions for extended periods may affect device
reliability.
Start
Stop
Logic
Data Word
ADDR/Counter
Row Decoder
Device
Address
Comparator
Data Latches
D
OUT
/ ACK
Logic
Column
Decoder
EEPROM
Array
Serial
Control
Logic
High Voltage
Pump & Timing
128-bit
Serial
Number
Serial MUX
Read
Read/Write
Enable
COMP Load
INC
V
CC
GND
WP
SCL
SDA
D
OUT
D
IN
A
2
A
1
A
0
AT24CS01/02 [DATASHEET]
Atmel-8815E-SEEPROM-AT24CS01-02-Datasheet_012015
4
5. Pin Descriptions
Serial Clock (SCL): The SCL input is used to positive edge clock data into each EEPROM device and negative
edge clock data out of each device.
Serial Data (SDA): The SDA pin is bidirectional for serial data transfer. This pin is open-drain driven and may
be wire-ORed with any number of other open-drain or open-collector devices.
Device/Page Addresses (A2, A1, A0): The A2, A1 and A0 pins are device address inputs that are hard wired for
the AT24CS01/02. As many as eight 1-Kbit or 2-Kbit devices may be addressed on a single bus system. For
more detail, see Section 8., “Device Addressing” on page 10.
Write Protect (WP): AT24CS01/02 has a Write Protect (WP) pin that provides hardware data protection. When
the Write Protect pin is connected to ground (GND), normal read/write operations to the full array are possible.
When the Write Protect pin is connected to VCC, all write operations to the memory are inhibited but read
operations are still possible. This operation is summarized in Table 5-1 below.
Table 5-1. Write Protect
WP Pin Status Part of the Array Protected
At VCC Full Array
At GND Normal Read/Write Operations
5
AT24CS01/02 [DATASHEET]
Atmel-8815E-SEEPROM-AT24CS01-02-Datasheet_012015
6. Memory Organization
AT24CS01, 1K Serial EEPROM: Internally organized with 16 pages of 8 bytes each, the 1K requires a 7-bit
data word address for random word addressing.
AT24CS02, 2K Serial EEPROM: Internally organized with 32 pages of 8 bytes each, the 2K requires an
8-bit data word address for random word addressing.
6.1 Pin Capacitance
Table 6-1. Pin Capacitance(1)
Note: 1. This parameter is characterized and is not 100% tested.
6.2 DC Characteristics
Table 6-2. DC Characteristics
Note: 1. VIL min and VIH max are reference only and are not tested.
Applicable over recommended operating range from TA = 25°C, f = 1.0MHz, VCC = 1.7V to 5.5V.
Symbol Test Condition Max Units Conditions
CI/O Input/Output Capacitance (SDA) 8 pF VI/O = 0V
CIN Input Capacitance (A0, A1, A2, SCL) 6 pF VIN = 0V
Applicable over recommended operating range from: TAI = -40C to +85C, VCC = 1.7V to 5.5V (unless otherwise noted).
Symbol Parameter Test Condition Min Typ Max Units
VCC Supply Voltage 1.7 5.5 V
ICC1 Supply Current VCC = 5.0V Read at 400kHz 0.4 1.0 mA
ICC2 Supply Current VCC = 5.0V Write at 400kHz 2.0 3.0 mA
ISB1 Standby Current VCC = 1.7V VIN = VCC or VSS 1.0 μA
ISB2 Standby Current VCC = 5.5V VIN = VCC or VSS 6.0 μA
ILI Input Leakage Current VIN = VCC or VSS 0.10 3.0 μA
ILO Output Leakage Current VOUT = VCC or VSS 0.05 3.0 μA
VIL Input Low Level(1) –0.6 VCC x 0.3 V
VIH Input High Level(1) VCC x 0.7 VCC + 0.5 V
VOL1 Output Low Level VCC = 1.7V IOL = 0.15mA 0.2 V
VOL2 Output Low Level VCC = 3.0V IOL = 2.1mA 0.4 V
AT24CS01/02 [DATASHEET]
Atmel-8815E-SEEPROM-AT24CS01-02-Datasheet_012015
6
6.3 AC Characteristics
Table 6-3. AC Characteristics
Note: 1. This parameter is ensured by characterization only.
Applicable over recommended operating range from TAI = -40C to +85C, VCC = 1.7V to 5.5V, CL = 1TTL Gate and 100pF
(unless otherwise noted).
Symbol Parameter
1.7V 2.5V, 5.0V
UnitsMin Max Min Max
fSCL Clock Frequency, SCL 400 1000 kHz
tLOW Clock Pulse Width Low 1.2 0.4 μs
tHIGH Clock Pulse Width High 0.6 0.4 μs
tINoise Suppression Time 100 50 ns
tAA Clock Low to Data Out Valid 0.1 0.9 0.05 0.55 μs
tBUF
Time the bus must be free before a new
transmission can start 1.3 0.5 μs
tHD.STA Start Hold Time 0.6 0.25 μs
tSU.STA Start Setup Time 0.6 0.25 μs
tHD.DAT Data In Hold Time 0 0 μs
tSU.DAT Data In Setup Time 100 100 ns
tRInputs Rise Time(1) 0.3 0.3 μs
tFInputs Fall Time(1) 300 100 ns
tSU.STO Stop Setup Time 0.6 0.25 μs
tDH Data Out Hold Time 50 50 ns
tWR Write Cycle Time 5 5 ms
Endurance(1) 3.3V, +25C, Page Mode 1,000,000 Write Cycles
7
AT24CS01/02 [DATASHEET]
Atmel-8815E-SEEPROM-AT24CS01-02-Datasheet_012015
7. Device Operation
Clock and Data Transitions: The SDA pin is normally pulled high with an external device. Data on the SDA pin
may change only during SCL low time periods. Data changes during SCL high periods will indicate a Start or
Stop condition as defined below.
Figure 7-1. Data Validity
Start Condition: A high-to-low transition of SDA with SCL high is a Start condition which must precede any
other command.
Stop Condition: A low-to-high transition of SDA with SCL high is a Stop condition. After a read sequence, the
Stop command will place the EEPROM in a standby power mode.
Figure 7-2. Start and Stop Definition
SDA
SCL
Data Stable Data Stable
Data
Change
SDA
SCL
Start Stop
AT24CS01/02 [DATASHEET]
Atmel-8815E-SEEPROM-AT24CS01-02-Datasheet_012015
8
Acknowledge: All addresses and data words are serially transmitted to and from the EEPROM in 8-bit words.
The EEPROM sends a zero to acknowledge that it has received each word. This happens during the ninth clock
cycle.
Figure 7-3. Output Acknowledge
Standby Mode: The AT24CS01/02 features a low-power standby mode which is enabled upon power-up as
well as after the receipt of the Stop condition and the completion of any internal operations.
2-wire Software Reset: After an interruption in protocol, power loss, or system reset, any 2-wire part can be
reset by following these steps:
1. Create a Start condition (if possible).
2. Clock nine cycles.
3. Create another Start condition followed by Stop condition as shown in Figure 7-4.
The device should be ready for the next communication after above steps have been completed. In the event
that the device is still non-responsive or remains active on the SDA bus, a power cycle must be used to reset
the device.
Figure 7-4. Software reset
SCL
DATA IN
DATA OUT
Start Acknowledge
9
8
1
SCL 9
Start
Condition Start
Condition
Stop
Condition
8321
SDA
Dummy Clock Cycles
9
AT24CS01/02 [DATASHEET]
Atmel-8815E-SEEPROM-AT24CS01-02-Datasheet_012015
Figure 7-5. Bus Timing
SCL: Serial Clock, SDA: Serial Data I/O
Figure 7-6. Write Cycle Timing
SCL: Serial Clock, SDA: Serial Data I/O
Note: 1. The write cycle time tWR is the time from a valid Stop condition of a write sequence to the end of the internal
clear/write cycle.
SCL
SDA IN
SDA OUT
tF
tHIGH
tLOW tLOW
tR
tAA tDH tBUF
tSU.STO
tSU.DAT
tHD.DAT
tHD.STA
tSU.STA
tWR
(1)
Stop
Condition
Start
Condition
WORD
N
SCL
SDA 8
th
Bit ACK
AT24CS01/02 [DATASHEET]
Atmel-8815E-SEEPROM-AT24CS01-02-Datasheet_012015
10
8. Device Addressing
Standard EEPROM Access: The 1K and 2K EEPROM device requires an 8-bit device address word following
a Start condition to enable the chip for a read or write operation.
The device address word consists of a mandatory ‘1010’ (Ah) sequence for the first four most significant bits
as shown in Figure 8-1. This is common to all Serial EEPROM devices.
The next three bits are the A2, A1, and A0 device address bits for the 1K and 2K EEPROM. These three bits
must compare to their corresponding hard-wired input pins A2, A1, and A0 in order for the part to acknowledge.
The eighth bit of the device address is the read/write operation select bit. A read operation is initiated if this bit is
high and a write operation is initiated if this bit is low.
Upon a valid compare of the device address with hard-wired input pins A2, A1, and A0, the EEPROM will output
a zero. If a compare is not successfully made, the chip will return to a standby state.
Serial Number Access: The AT24CS01 and AT24CS02 utilizes a separate memory block containing a factory
programmed 128-bit serial number. Access to this memory location is obtained by beginning the device address
word with a ‘1011’ (Bh) sequence.
The behavior of the next three bits (A2, A1, and A0) remain the same as during a standard EEPROM
addressing sequence. These three bits must compare to their corresponding hard-wired input pins A2, A1, and
A0 in order for the part to acknowledge.
The eighth bit of the device address needs be set to a one to read the Serial Number. A zero in this bit position,
other than during a dummy write sequence to set the address pointer, will result in a unknown data read from
the part. Writing or altering the 128-bit serial number is not possible.
Further specific protocol is needed to read the serial number from of the device. See Section 10., “Read
Operations” on page 12 for more details on accessing the special feature.
Figure 8-1. Device Address
Density Access Area Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0
1K EEPROM 1 0 1 0 A2A1A0R/W
Serial Number 1 0 1 1 A2A1A01
2K EEPROM 1 0 1 0 A2A1A0R/W
Serial Number 1 0 1 1 A2A1A01
MSB LSB
11
AT24CS01/02 [DATASHEET]
Atmel-8815E-SEEPROM-AT24CS01-02-Datasheet_012015
9. Write Operations
Byte Write: A Byte Write operation requires an 8-bit data word address following the device address word and
acknowledgment. Upon receipt of this address, the EEPROM will again respond with a zero and then clock in
the first 8-bit data word. Following receipt of the 8-bit data word, the EEPROM will output a zero and the
addressing device, such as a microcontroller, must terminate the write sequence with a Stop condition. At this
time the EEPROM enters an internally timed write cycle, tWR, to the nonvolatile memory. All inputs are disabled
during this write cycle and the EEPROM will not respond until the Write is complete.
Figure 9-1. Byte Write
Page Write: The 1K and 2K EEPROM are capable of an 8-byte Page Write. A Page Write is initiated in the
same way as a Byte Write, but the microcontroller does not send a Stop condition after the first data word is
clocked in. Instead, after the EEPROM acknowledges receipt of the first data word, the microcontroller can
transmit up to seven data words. The EEPROM will respond with a zero after each data word received. The
microcontroller must terminate the Page Write sequence with a Stop condition.
Figure 9-2. Page Write
The data word address lower three bits are internally incremented following the receipt of each data word. The
higher data word address bits are not incremented, retaining the memory page row location. When the internally
generated word address reaches the page boundary, the subsequent byte loaded will be placed at the
beginning of the same page. If more than eight data words are transmitted to the EEPROM, the data word
address will roll-over and previously loaded data will be overwritten.
Acknowledge Polling: Once the internally timed write cycle has started and the EEPROM inputs are disabled,
acknowledge polling can be initiated. This involves sending a Start condition followed by the device address
word. The Read/Write bit is representative of the operation desired. Only if the internal write cycle has
completed will the EEPROM respond with a zero allowing the next read or write sequence to begin.
S
T
A
R
T
S
T
O
P
W
R
I
T
EDevice Address Word Address Data
SDA LINE
M
S
B
R
/
W
A
C
K
A
C
K
A
C
K
S
T
A
R
T
S
T
O
P
W
R
I
T
E
Device Address
SDA LINE
Word Address (n) Data (n) Data (n + 1) Data (n + x)
M
S
B
R
/
W
A
C
K
A
C
K
A
C
K
A
C
K
A
C
K
AT24CS01/02 [DATASHEET]
Atmel-8815E-SEEPROM-AT24CS01-02-Datasheet_012015
12
10. Read Operations
Read operations are initiated in the same way as Write operations with the exception that the Read/Write select
bit in the device address word is set to one. There are four read operations:
Current Address Read
Random Address Read
Sequential Read
Serial Number Read
Current Address Read: The internal data word address counter maintains the last address accessed during
the last Read or Write operation, incremented by one. This address stays valid between operations as long as
the chip power is maintained. The address roll-over during read is from the last byte of the last memory page to
the first byte of the first page. The address roll-over during write is from the last byte of the current page to the
first byte of the same page.
Once the device address with the read/write select bit set to one is clocked in and acknowledged by the
EEPROM, the current address data word is serially clocked out. The microcontroller does not respond with an
zero but does generate a following Stop condition.
Figure 10-1. Current Address Read
Random Read: A Random Read requires a dummy byte write sequence to load in the data word address. Once
the device address word and data word address are clocked in and acknowledged by the EEPROM, the
microcontroller must generate another Start condition. The microcontroller now initiates a Current Address
Read by sending a device address with the read/write select bit high. The EEPROM acknowledges the device
address and serially clocks out the data word. The microcontroller does not respond with a zero but does
generate a following Stop condition.
Figure 10-2. Random Read
Device Address Data
S
T
A
R
T
R
E
A
D
S
T
O
P
SDA LINE
M
S
B
R
/
W
A
C
K
N
O
A
C
K
SDA LINE
S
T
A
R
T
W
R
I
T
E
S
T
A
R
T
R
E
A
D
S
T
O
PDevice Address Word Address (n) Device Address Data (n)
Dummy Write
M
S
B
R
/
W
A
C
K
N
O
A
C
K
A
C
K
A
C
K
13
AT24CS01/02 [DATASHEET]
Atmel-8815E-SEEPROM-AT24CS01-02-Datasheet_012015
Sequential Read: Sequential Reads are initiated by either a current address read or a random address read.
After the microcontroller receives a data word, it responds with an acknowledge. As long as the EEPROM
receives an acknowledge, it will continue to increment the data word address and serially clock out sequential
data words. When the memory address limit is reached, the data word address will roll-over and the Sequential
Read will continue. The Sequential Read operation is terminated when the microcontroller does not respond
with a zero but does generate a following Stop condition.
Figure 10-3. Sequential Read
Serial Number Read: Reading the serial number is similar to the sequential read sequence but requires use of
the device address seen in Figure 8-1 on page 10, a dummy write, and the use of specific word address.
Note: The entire 128-bit value must be read from the starting address of the serial number block to guarantee
a unique number.
Since the address pointer of the device is shared between the regular EEPROM array and the serial number
block, a dummy write sequence, as part of a Random Read or Sequential Read protocol, should be performed
to ensure the address pointer is set to zero. A Current Address Read of the serial number block is supported but
if the previous operation was to the EEPROM array, the address pointer will retain the last location accessed,
incremented by one. Reading the serial number from a location other than the first address of the block will not
result in a unique serial number.
Additionally, the word address must begin with a ‘10’ sequence regardless of the intended address. If a word
address other than ‘10’ is used, then the device will output undefined data.
Example: If the application desires to read the first byte of the serial number, the word address input would
need to be 80h.
When the end of the 128-bit serial number is reached (16 bytes of data), the data word address will roll-over
back to the beginning of the 128-bit serial number. The Serial Number Read operation is terminated when the
microcontroller does not respond with an zero (ACK) and instead issues a Stop condition (see Figure 10-4 on
page 14.)
R
/
W
A
C
K
A
C
K
A
C
K
A
C
K
N
O
A
C
K
SDA LINE
R
E
A
D
S
T
O
P
Device
Address Data (n + x) Data (n + 2) Data (n + 1) Data (n)
AT24CS01/02 [DATASHEET]
Atmel-8815E-SEEPROM-AT24CS01-02-Datasheet_012015
14
Figure 10-4. Serial Number Read
SDA LINE
Device
Address
Word
Address n
Device
Address
S
T
A
R
T
W
R
I
T
E
S
T
A
R
T
R
E
A
D
A
C
K
A
C
K
A
C
K
A
C
K
R
/
W
1 0 1 1 1 0 0 0 0 0 0 0 1 0 1 1
M
S
B
Dummy Write
Serial Number
Data Byte 0x0
Serial Number
Data Byte 0x1
Serial Number
Data Byte 0x2
Serial Number
Data Byte 0x3
Serial Number
Data Byte 0xF
N
O
A
C
K
S
T
O
P
15
AT24CS01/02 [DATASHEET]
Atmel-8815E-SEEPROM-AT24CS01-02-Datasheet_012015
11. Part Markings
DRAWING NO. REV.
TITLE
Catalog Number Truncation
AT24CS01 Truncation Code ##: N1
AT24CS02 Truncation Code ##: N2
AAAAAAAA
## M @
ATMLHYWW
8-lead SOIC 8-lead TSSOP
AAAAAAA
## M @
ATHYWW
8-lead UDFN
##
HM@
YXX
2.0 x 3.0 mm Body
5-lead SOT-23
## MU
YMXX Bottom Mark
Top Mark
Note 2: Package drawings are not to scale
Note 1: designates pin 1
24CS01-02SM A
4/3/12
24CS01-02SM, AT24CS01, and AT24CS02
Package Marking Information
Date Codes Voltages
Y = Year M = Month WW = Work Week of Assembly M: 1.7V min
2: 2012 6: 2016 A: January 02: Week 2
3: 2013 7: 2017 B: February 04: Week 4
4: 2014 8: 2018 ... ...
5: 2015 9: 2019 L: December 52: Week 52
Country of Assembly Lot Number Grade/Lead Finish Material
@ = Country of Assembly AAA...A = Atmel Wafer Lot Number H: Industrial/NiPdAu
U: Industrial/Matte Tin
Trace Code Atmel Truncation
XX = Trace Code (Atmel Lot Numbers Correspond to Code) AT: Atmel
Example: AA, AB.... YZ, ZZ ATM: Atmel
ATML: Atmel
AT24CS01 and AT24CS02: Package Marking Information
Package Mark Contact:
DL-CSO-Assy_eng@atmel.com
AT24CS01/02 [DATASHEET]
Atmel-8815E-SEEPROM-AT24CS01-02-Datasheet_012015
16
12. Ordering Code Detail
Atmel Designator
Product Family
Device Density
Shipping Carrier Option
Operating Voltage
01 = 1K
02 = 2K
24CS = Serial EEPROM, Plus
128-bit Serial Number Feature
B = Bulk (Tubes)
T = Tape and Reel, Standard Quantity Option
E = Tape and Reel, Expanded Quantity Option
M = 1.7V to 5.5V
Package Device Grade or
Wafer/Die Thickness
H = Green, NiPdAu Lead Finish,
Industrial Temperature Range
(-40˚C to +85°C)
U = Green, Matte Sn Lead Finish,
Industrial Temperature Range
(-40˚C to +85°C)
11 = 11mil Wafer Thickness
Package Option
SS = JEDEC SOIC
X = TSSOP
MA = UDFN
ST = SOT23
WWU = Wafer Unsawn
AT24CS01-SSHM-B
17
AT24CS01/02 [DATASHEET]
Atmel-8815E-SEEPROM-AT24CS01-02-Datasheet_012015
13. Ordering Information
Additional package types that are not listed may be available. Please contact Atmel for more details.
Note: 1. For Wafer sales, please contact Atmel Sales.
Atmel Ordering Code Finish Package
Delivery Information Operation
Range
Form Quantity
AT24CS01-SSHM-B
NiPdAu
(Lead-free/Halogen-free)
8S1
Bulk (Tubes) 100 per Tube
Industrial
Temperature
(-40C to +85C)
AT24CS01-SSHM-T Tape and Reel 4,000 per Reel
AT24CS01-XHM-B
8X
Bulk (Tubes) 100 per Tube
AT24CS01-XHM-T Tape and Reel 5,000 per Reel
AT24CS01-MAHM-T
8MA2
Tape and Reel 5,000 per Reel
AT24CS01-MAHM-E Tape and Reel 15,000 per Reel
AT24CS01-STUM-T 5TS1 Tape and Reel 5,000 per Reel
AT24CS01-WWU11M(1) N/A Wafer Sale Note 1
AT24CS02-SSHM-B
NiPdAu
(Lead-free/Halogen-free)
8S1
Bulk (Tubes) 100 per Tube
Industrial
Temperature
(-40C to +85C)
AT24CS02-SSHM-T Tape and Reel 4,000 per Reel
AT24CS02-XHM-B
8X
Bulk (Tubes) 100 per Tube
AT24CS02-XHM-T Tape and Reel 5,000 per Reel
AT24CS02-MAHM-T
8MA2
Tape and Reel 5,000 per Reel
AT24CS02-MAHM-E Tape and Reel 15,000 per Reel
AT24CS02-STUM-T 5TS1 Tape and Reel 5,000 per Reel
AT24CS02-WWU11M(1) N/A Wafer Sale Note 1
Package Type
8S1 8-lead, 0.150” wide, Plastic Gull Wing Small Outline (JEDEC SOIC)
8X 8-lead, 4.4mm body, Plastic Thin Shrink Small Outline Package (TSSOP)
8MA2 8-pad, 2.00mm x 3.00mm body, 0.50mm pitch, Dual No Lead (UDFN)
5TS1 5-lead, 2.90mm x 1.60mm body, Plastic Thin Shrink Small Outline (SOT23)
AT24CS01/02 [DATASHEET]
Atmel-8815E-SEEPROM-AT24CS01-02-Datasheet_012015
18
14. Packaging Information
14.1 8S1 — 8-lead JEDEC SOIC
DRAWING NO. REV. TITLE GPC
COMMON DIMENSIONS
(Unit of Measure = mm)
SYMBOL MIN NOM MAX NOTE
A1 0.10 – 0.25
A 1.35 – 1.75
b 0.31 – 0.51
C 0.17 – 0.25
D 4.80 – 5.05
E1 3.81 – 3.99
E 5.79 – 6.20
e 1.27 BSC
L 0.40 – 1.27
Ø
Ø
0° – 8°
Ø
E
1
N
TOP VIEW
C
E1
END VIEW
A
b
L
A1
e
D
SIDE VIEW
Package Drawing Contact:
packagedrawings@atmel.com
8S1 G
6/22/11
Notes: This drawing is for general information only.
Refer to JEDEC Drawing MS-012, Variation AA
for proper dimensions, tolerances, datums, etc.
8S1, 8-lead (0.150” Wide Body), Plastic Gull Wing
Small Outline (JEDEC SOIC) SWB
19
AT24CS01/02 [DATASHEET]
Atmel-8815E-SEEPROM-AT24CS01-02-Datasheet_012015
14.2 8X — 8-lead TSSOP
DRAWING NO. REV. TITLE GPC
COMMON DIMENSIONS
(Unit of Measure = mm)
SYMBOL MIN NOM MAX NOTE
A - - 1.20
A1 0.05 - 0.15
A2 0.80 1.00 1.05
D 2.90 3.00 3.10 2, 5
E 6.40 BSC
E1 4.30 4.40 4.50 3, 5
b 0.19 0.25 0.30 4
e 0.65 BSC
L 0.45 0.60 0.75
L1 1.00 REF
C 0.09 - 0.20
Side View
End View
Top View
A2
A
L
L1
D
1
E1
N
b
Pin 1 indicator
this corner
E
e
Notes: 1. This drawing is for general information only.
Refer to JEDEC Drawing MO-153, Variation AA, for proper
dimensions, tolerances, datums, etc.
2. Dimension D does not include mold Flash, protrusions or gate
burrs. Mold Flash, protrusions and gate burrs shall not exceed
0.15mm (0.006in) per side.
3. Dimension E1 does not include inter-lead Flash or protrusions.
Inter-lead Flash and protrusions shall not exceed 0.25mm
(0.010in) per side.
4. Dimension b does not include Dambar protrusion.
Allowable Dambar protrusion shall be 0.08mm total in excess
of the b dimension at maximum material condition. Dambar
cannot be located on the lower radius of the foot. Minimum
space between protrusion and adjacent lead is 0.07mm.
5. Dimension D and E1 to be determined at Datum Plane H.
Package Drawing Contact:
packagedrawings@atmel.com
8X E
2/27/14
8X, 8-lead 4.4mm Body, Plastic Thin
Shrink Small Outline Package (TSSOP) TNR
C
A1
AT24CS01/02 [DATASHEET]
Atmel-8815E-SEEPROM-AT24CS01-02-Datasheet_012015
20
14.3 8MA2 — 8-pad UDFN
DRAWING NO. REV. TITLE GPC
8MA2 G
11/26/14
8MA2, 8-pad 2 x 3 x 0.6mm Body, Thermally
Enhanced Plastic Ultra Thin Dual Flat No-Lead
Package (UDFN)
YNZ
COMMON DIMENSIONS
(Unit of Measure = mm)
SYMBOL MIN NOM MAX NOTE
A 0.50 0.55 0.60
A1 0.0 0.02 0.05
A2 - - 0.55
D 1.90 2.00 2.10
D2 1.40 1.50 1.60
E 2.90 3.00 3.10
E2 1.20 1.30 1.40
b 0.18 0.25 0.30 3
C 1.52 REF
L 0.30 0.35 0.40
e 0.50 BSC
K 0.20 - -
TOP VIEW
SIDE VIEW
BOTTOM VIEW
Package Drawing Contact:
packagedrawings@atmel.com
C
E
Pin 1 ID
D
8
7
6
5
1
2
3
4
A
A1
A2
D2
E2
e (6x)
L (8x)
b (8x)
Pin#1 ID
K
1
2
3
4
8
7
6
5
Notes: 1. This drawing is for general information only. Refer to
Drawing MO-229, for proper dimensions, tolerances,
datums, etc.
2. The Pin #1 ID is a laser-marked feature on Top View.
3. Dimensions b applies to metallized terminal and is
measured between 0.15 mm and 0.30 mm from the
terminal tip. If the terminal has the optional radius on
the other end of the terminal, the dimension should
not be measured in that radius area.
4. The Pin #1 ID on the Bottom View is an orientation
feature on the thermal pad.
21
AT24CS01/02 [DATASHEET]
Atmel-8815E-SEEPROM-AT24CS01-02-Datasheet_012015
14.4 5TS1 — 5-lead SOT23
DRAWING NO. REV. TITLE GPC
Package Drawing Contact:
packagedrawings@atmel.com
5TS1 D
5/31/12
5TS1, 5-lead 1.60mm Body, Plastic Thin
Shrink Small Outline Package (Shrink SOT) TSZ
COMMON DIMENSIONS
(Unit of Measure = mm)
SYMBOL MIN NOM MAX NOTE
A - - 1.00
A1 0.00 - 0.10
A2 0.70 0.90 1.00
c 0.08 - 0.20 3
D 2.90 BSC 1,2
E 2.80 BSC 1,2
E1 1.60 BSC 1,2
L1 0.60 REF
e 0.95 BSC
e1 1.90 BSC
b 0.30 - 0.50 3,4
1. Dimension D does not include mold flash, protrusions or gate burrs. Mold flash,
protrusions or gate burrs shall not exceed 0.15 mm per end. Dimension E1 does
not include interlead flash or protrusion. Interlead flash or protrusion shall not
exceed 0.15 mm per side.
2. The package top may be smaller than the package bottom. Dimensions D and E1
are determined at the outermost extremes of the plastic body exclusive of mold
flash, tie bar burrs, gate burrs and interlead flash, but including any mismatch
between the top and bottom of the plastic body.
3. These dimensions apply to the flat section of the lead between 0.08 mm and 0.15
mm from the lead tip.
4. Dimension "b" does not include dambar protrusion. Allowable dambar protrusion
shall be 0.08 mm total in excess of the "b" dimension at maximum material
condition. The dambar cannot be located on the lower radius of the foot. Minimum
space between protrusion and an adjacent lead shall not be less than 0.07 mm.
This drawing is for general information only. Refer to JEDEC
Drawing MO-193, Variation AB for additional information.
54
2
L1
L
C
END VIEW
C
A
A2
A1
b
e
PLANE
SEATING
D
SIDE VIEW
E
e1
E1
3
1
TOP VIEW
AT24CS01/02 [DATASHEET]
Atmel-8815E-SEEPROM-AT24CS01-02-Datasheet_012015
22
15. Revision History
Doc. Rev. Date Comments
8815E 01/2015 Add the UDFN Expanded Quantity Option and update the ordering information section.
Update the 8MA2 package outline drawing.
8815D 08/2014
Add bulk SOIC and TSSOP ordering codes. Update ordering code table, 8X and 8MA2
package drawings, and update the disclaimer page.
Correct pinouts from bottom to top view and reorganization figures. No changes to
functional specification.
8815C 07/2013 Update status from preliminary to complete release and footers and the disclaimer page.
8815B 09/2012 Update ordering information.
8815A 06/2012 Initial document release.
X
XXX
XX
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© 2015 Atmel Corporation. / Rev.: Atmel-8815E-SEEPROM-AT24CS01-02-Datasheet_012015.
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