Doc.Nr. 82 1226 00
SCR1100-D04 SINGLE AXIS GYROSCOPE WITH DIGITAL SPI INTERFACE
Features
±300 º/s angular rate measurement range
Angular rate measurement around X axis
Angular rate sensor exceptionally insensitive to
mechanical vibrations and shocks
Superior bias instability for MEMS gyroscopes
Digital SPI interfacing
Enhanced self diagnostics features
Small size 8.5 x 18.7 x 4.5 mm (w x l x h)
RoHS compliant robust packaging suitable for
lead free soldering process and SMD mounting
Proven capacitive 3D-MEMS technology
Temperature range -40 °C...+125 °C
Applications
SCR1100-D04 is targeted to applications with high
stability and tough environmental requirements. Typical
applications are:
Inertial Measurement Units (IMUs) for highly
demanding environments
Platform stabilization and control
Motion analysis and control
Roll over detection
Robotic control systems
Guidance systems
Navigation systems
General Description
SCR1100-D04 is a single axis high performance gyroscope. It is part of Murata's high performance gyro family and it has
the same gyro section as the combined gyro acceleration product SCC1300-D02. The sensor is based on Murata's
proven capacitive 3D-MEMS technology and it has highly sophisticated signal conditioning ASIC with digital SPI
interface. Small robust packaging guarantees reliable operation over product lifetime. The housing is suitable for SMD
mounting and the component is compatible with RoHS and ELV directives.
SCR1100-D04 is designed, manufactured and tested against high stability, reliability and quality requirements. The
angular rate sensor provides highly stable output over wide ranges of temperature and mechanical noise. The bias
stability is in the elite of MEMS gyros and the component has several advanced self diagnostics features.
Data Sheet
SCR1100-D04
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TABLE OF CONTENTS
SCR1100-D04 Single axis Gyroscope with digital SPI interface ...................... 1
Features............................................................................................................................................... 1
Applications ........................................................................................................................................ 1
General Description ............................................................................................................................ 1
1 General Description ........................................................................................ 4
1.1 Introduction ............................................................................................................................... 4
1.2 General Product Description .................................................................................................... 4
1.2.1 Factory Calibration ............................................................................................................. 5
1.3 Abbreviations ............................................................................................................................ 5
2 Specifications .................................................................................................. 6
2.1 Performance Specifications for Gyroscope ............................................................................ 6
2.2 Absolute Maximum Ratings ..................................................................................................... 7
2.3 Digital I/O Specification ............................................................................................................ 7
2.4 SPI AC Characteristics ............................................................................................................. 7
3 Reset and Power Up ....................................................................................... 9
3.1 Power-up Sequence .................................................................................................................. 9
3.2 Reset .......................................................................................................................................... 9
4 Component Interfacing ................................................................................... 9
4.1 SPI Interfaces ............................................................................................................................ 9
4.1.1 SPI Transfer ........................................................................................................................ 9
4.1.2 SPI Transfer Parity Mode ................................................................................................. 11
4.2 ASIC Addressing Space ......................................................................................................... 12
4.2.1 Register Definition ............................................................................................................ 12
4.2.2 Data Register Block .......................................................................................................... 12
4.2.3 Temperature Output Register .......................................................................................... 13
5 Application Information ................................................................................ 14
5.1 Pin Description ........................................................................................................................ 14
5.2 Application Circuitry and External Component Characteristics .......................................... 15
5.2.1 Separate Analog and Digital Ground Layers with Long Power Supply Lines .............. 15
SCR1100-D04
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5.3 Boost Regulator and Power Supply Decoupling in Layout .................................................. 16
5.3.1 Layout Example ................................................................................................................ 17
5.3.2 Thermal Connection ......................................................................................................... 17
5.4 Measurement Axis and Directions ......................................................................................... 18
5.5 Package Characteristics ......................................................................................................... 19
5.5.1 Package Outline Drawing ................................................................................................. 19
5.5.2 PCB Footprint ................................................................................................................... 20
5.6 Assembly instructions ............................................................................................................ 20
SCR1100-D04
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1 General Description
1.1 Introduction
This document contains essential technical information for SCR1100 sensor. Specifications, SPI
interface descriptions, user accessible register details, electrical properties and application
information etc. This document should be used as a reference when designing in SCR1100
component.
1.2 General Product Description
The SCR1100 sensor consists of silicon based MEMS angular rate sensing element and
Application Specific Integrated Circuits (ASIC) used to sense and control sensing element. Figure 1
represents an upper level block diagram of the component. ASIC have digital SPI interfaces to
control and read the gyroscope.
Figure 1. SCR1100 component block diagram.
The angular rate sensing element is manufactured using Murata proprietary High Aspect Ratio
(HAR) 3D-MEMS process, which enables making robust, extremely stable and low noise capacitive
sensors.
The angular rate sensing element consists of moving masses that are purposely exited to in-plane
drive motion. Rotation in sensitive direction causes out-of-plane movement that can be measured
as capacitance change with the signal conditioning ASIC.
SCR1100-D04
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1.2.1 Factory Calibration
SCR1100 sensor is factory calibrated. No separate calibration is required in the application.
Trimmed parameters during production include sensitivities and offsets over temperature, and
frequency responses. However it should be noted that assembly can cause minor offset/bias errors
to the sensor output. If best possible offset/bias accuracy is required, system level offset/bias
calibration (zeroing) after assembly is recommended.
Calibration parameters are stored during manufacturing inside non-volatile memory. The
parameters are read automatically from the internal non-volatile memory during the start-up.
1.3 Abbreviations
ASIC Application Specific Integrated Circuit
SPI Serial Peripheral Interface
RT Room Temperature
STC Self Test Continuous (continuous self testing of accelerometer element)
STS Self Test Static (gravitational based self test of accelerometer element)
Avdd Analog supply voltage
Dvdd Digital supply voltage
SCR1100-D04
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2 Specifications
2.1 Performance Specifications for Gyroscope
Table 1. Gyroscope performance specifications (Avdd = 5 V, Dvdd = 3.3 V and ambient temperature unless
otherwise specified).
Parameter
Condition
Min PPP
A)
PPP
Typ
Units
Analog supply voltage
4.75
5
V
Analog supply current
Temperature range -40 ... +125 °C
24
26
mA
Digital supply voltage
3.0
3.3
V
Digital supply current
Temperature range -40 ... +125 °C
16
20PPP
PPP
mA
Operating range
Measurement axis X
-300
°/s
Offset errorPPP
B)
PPP
-1.5
°/s
Offset over temperature
Temperature range -40 ... +125 °C
Temperature range -10 … +60 °C
-0.9
-0.5
°/s
°/s
Offset drift velocity
Temperature gradient ≤ 2.5 K/min
-0.6
(°/s)/min
Offset short term instability PPP
C)
PPP
<2.1
°/h
Angular random walk (ARW) PPP
C)
PPP
0.86
º/ h
Sensitivity
18
LSB/(°/s)
Sensitivity over temperature
Temperature range -40 ... +125 °C
-1
%
Total sensitivity error PPP
B)
PPP
-2
%
Nonlinearity
Temperature range -40 ... +125 °C
-1
°/s
Noise (RMS)PPP
PPP
0.14
°/s
Noise Density
0.02
(º/s)/ Hz
Cross-axis sensitivity
%
G-sensitivity
-0.1
(°/s)/g
Shock sensitivity
50g, 6ms
°/s
Shock recovery time
ms
Amplitude response
-3dB frequency
50
Hz
Power on setup time
s
Output data rate
2
kHz
Output load
pF
SPI clock rate
0.1
MHz
PPPPPP
A)
PPPPPP MIN/MAX values are ±3 sigma variation limits from validation test population.
PPPPPP
B)
PPPPPP Including calibration error and drift over lifetime.
PPPPPP
C)
PPPPPP Typical, constant temperature, Allan Variance curve Figure 2 b).
D) Cross-axis sensitivity is the maximum sensitivity in the plane perpendicular to the measuring direction relative to the
sensitivity in the measuring direction. The specified limit must not be exceeded by either axis.
SCR1100-D04 Gyro Bias vs. Temperature
-1.2
-1
-0.8
-0.6
-0.4
-0.2
0
0.2
0.4
0.6
0.8
1
-40 -20 0 20 40 60 80 100 120
Temperature [ºC]
Angular Rate Offset [º/s]
+3sigma
AVG
-3sigma
SCR1100-D04 Allan Variance Curve
1
10
100
1000
0.1 1 10 100 1000 10000 100000
tau [s]
Allan deviation [º/h]
+3 sigma
Average
Figure 2 a) SCR1100-D04 Gyroscope offset over full temperature range, b) Allan variance curve
SCR1100-D04
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2.2 Absolute Maximum Ratings
Table 2. Absolute maximum ratings of the SCR1100 sensor.
Parameter
Condition
Min
Typ
Max
Units
Analog supply voltage, AVDD_G
-0.5
7
V
Digital supply voltage, DVDD_G
-0.3
3.6
V
Maximum voltage at analog input/output pins
-0.3
AVDD_G + 0.3V
Maximum voltage at digital input/output pins
-0.3
DVDD_G + 0.3
V
Operating temperature
-40
125
°C
Storage temperature
-40
125
°C
Max 96h
-40
150
°C
Maximum junction temperature during
lifetime. Note: device has to be functional,
but not in full spec.
155
°C
Mechanical Shock
3000
g
ESD
HBM
2
kV
CDM
500
V
Ultrasonic Cleaning
Prohibited
2.3 Digital I/O Specification
Table 3 below describe the DC characteristics of SCR1100 sensor digital I/O pins. Supply voltage
is 3.3 V unless otherwise noted. Current flowing into the circuit has positive values.
Table 3. Absolute maximum ratings of the SCR1100 gyroscope SPI interface.
Parameter
Conditions
Symbol
Min
Typ
Max
Unit
Input terminal CSN_G
Pull up current
VBBBBBBINBBBBBB = 0 V
IBBBBBBPUBBBBBB
10
50
A
Input high voltage
DVDD_G = 3.3 V
VBBBBBBIHBBBBBB
2
DVDD_G
V
Input low voltage
DVDD_G = 3.3 V
VBBBBBBBBBILBBBBBB
0.8
V
Hysteresis
DVDD_G = 3.3 V
VBBBBBBBBBHYSTBBBBBB
0.3
V
VBBBBBBIN BBBBBB
Open circuit
VBBBBBBINBBBBBB
2
V
Input terminal SCK_G
Input high voltage
DVDD_G = 3.3 V
VBBBBBBIHBBBBBB
2
DVDD_G
V
Input low voltage
DVDD_G = 3.3 V
VBBBBBBBBBILBBBBBB
0.8
V
Hysteresis
DVDD_G = 3.3 V
VBBBBBBBBBHYSTBBBBBB
0.3
V
Input leakage current
0 < VBBBBBBBBBMISOBBBBBB < 3.3 V
IBBBBBBBBBLEAKBBBBBB
-1
1
uA
Output terminal MOSI_G
Input high voltage
DVDD_G = 3.3 V
VBBBBBBBBBIHBBBBBB
2
DVDD_G
V
Input low voltage
DVDD_G = 3.3 V
VBBBBBBBBBILBBBBBB
0.8
V
Hysteresis
DVDD_G = 3.3 V
VBBBBBBBBBHYSTBBBBBB
0.3
V
Input current source (pull-down)
VBBBBBBIN BBBBBB= VBBBBBBDVDD_GBBBBBB
IBBBBBBBBBLEAKBBBBBB
10
50
uA
VBBBBBBBBBIN BBBBBB
Open circuit
VBBBBBBBBBINBBBBBB
0.3
V
Output terminal MISO_G (Tri-state)
Output high voltage
IBBBBBBOUTBBBBBB = -1mA
VBBBBBBBBBOHBBBBBB
DVDD_G -0.5V
V
IBBBBBBOUTBBBBBB = -50µA
DVDD_G -0.2V
V
Output low voltage
0 ≤ VBBBBBBBBBMISOBBBBBB ≤ 3.3 V
VBBBBBBBBBOLBBBBBB
0.5
V
Capacitive load
200
pF
2.4 SPI AC Characteristics
The AC characteristics of SCR1100 are defined in Figure 3 and Table 4.
SCR1100-D04
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CSN_G, CSB_A
SCK_G, SCK
MOSI_G, MOSI_A
MISO_G, MISO_A
TLS1
TCH
THOL
TSET
TVAL1
TVAL2
TLZ
TLS2
TLH
MSB in
MSB out
LSB in
LSB out
DATA out
DATA in
TCL
Figure 3. Timing diagram of SPI communication
Table 4. Timing Characteristics of SPI Communication.
Parameter
Condition
Min
Typ
Max
Units
FBBBBBBBBSPIBBBBBB
8
MHz
TBBBBBBSPIBBBBBB
1/ FBBBBBBBBSPIBBBBBB
TBBBBBBCHBBBBBB
SCK_G high time
TBBBBBBSPIBBBBBB /2
ns
TBBBBBBCLBBBBBB
SCK_G low time
TBBBBBBSPIBBBBBB /2
ns
TBBBBBBLS1BBBBBB
CSN_G setup time
TBBBBBBSPIBBBBBB /2
ns
TBBBBBBVAL1BBBBBB
Delay CSN_G -> MISO_G
TBBBBBBBBBSPIBBBBBB /4
ns
TBBBBBBSETBBBBBB
MOSI_G setup time
TBBBBBBSPIBBBBBB /4
ns
TBBBBBBHOLBBBBBB
MOSI_G data hold time
TBBBBBBSPIBBBBBB /4
ns
TBBBBBBVAL2BBBBBB
Delay SCK_G -> MISO_G
1.3 * TBBBBBBBBBSPIBBBBBB /4
ns
TBBBBBBLS2BBBBBB
CSN_G hold time
TBBBBBBSPIBBBBBB /2
ns
TBBBBBBLZBBBBBB
Tri-state delay time
TBBBBBBBBBSPIBBBBBB /4
ns
TBBBBBBRISEBBBBBB
Rise time of the SCK_G
10
ns
TBBBBBBFALLBBBBBB
Fall time of the SCK_G
10
ns
TBBBBBBLHBBBBBB
Time between SPI cycles
TBBBBBBSPIBBBBBB
ns
SCR1100-D04
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3 Reset and Power Up
After the start-up the angular rate and acceleration data is immediately available through SPI
registers. There is no need to initialize the gyroscope or accelerometer before starting to use it. If
the application requires monitoring operation correctness there are several options available to
monitor the status.
3.1 Power-up Sequence
To ensure correct ASIC start up please connect the digital supply voltage VBBBBBBBBBDVDD_GBBBBBBB (3.3V) before the
analog supply voltage VBBBBBBBBBAVDD_G BBBBBB(5.0V) to the gyro ASIC. After power up please read Status register
twice to clear error flags. Angular rate data is available immediately so no start up command
sequence is required if error flags are not used.
Table 5. SCR1100 gyroscope power-up sequence.
Procedure
Functions
Check
Set VBBBBBBDVDD_GBBBBBB V=3.0...3.6V
Wait 10ms
Set VBBBBBBAVDD_GBBBBBB V=4.75...5.25V
Wait 800 ms
Read Status register (08h) two times
Acknowledge error flags after start up
3.2 Reset
SCR1100 can be reset by writing 0x04 in to IC Identification register (address 07h) or with external
active low reset pin (EXTRESN_G). Power supplies should be within the specified range before the
reset pin can be released.
4 Component Interfacing
4.1 SPI Interfaces
SCR1100 sensor SPI interface is a digital 4 wire interface where SCR1100 always operate as
slave devices in the master-slave operation mode.
SCR1100 Angular rate sensor ASIC SPI interface:
MOSI_G master out slave in µP ASIC
MISO_G master in slave out ASIC µP
SCK_G serial clock µP ASIC
CSN_G chip select (low active) µP ASIC
4.1.1 SPI Transfer
The SPI transfer is based on a 16-bit protocol. Figure 4 shows an example of a single 16-bit data
transmission. Each output data/status-bits are shifted out on the falling edge of SCK (MISO line).
Each bit is sampled on the rising edge of SCK (MOSI line).
Figure 4. SCR1100 angular rate sensor 16-bit data transmission.
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After the falling edge of CSN_G the device interprets the first 16-bit word is an address transfer
having a bit coding scheme below.
Address Transfer:
D15
D14
D13
D12
D11
D10
D9
D8
D7
D6
D5
D4
D3
D2
D1
D0
0
0
0
0
0
0
ADR6
ADR5
ADR4
ADR3
ADR2
ADR1
ADR0
RW
0
Par
odd
ADR[6:0] : Register address
RW : RW=1 : Write access
RW=0 : Read access
par odd : odd parity bit.
par odd = 0 : the number of ones in the data word (D15:D1) is odd.
par odd = 1 : the number of ones in the data word (D15:D1) is even.
The address selects an internal register of the device; the RW bit selects the access mode.
RW = ‘0' The master performs a read access on the selected register. During the
transmission of the next word, the slave sends the requested register value to MISO_G. The slave
interprets the next word at MOSI_G as an address transfer.
RW = ‘1' The master performs a write access on the selected register. The slave stores the
next transmitted word in the selected device register of MOSI_G and sends the actual register
value in response to MOSI_G. The transmission goes on with an address transfer to MOSI_G and
the address mode flags to MISO_G.
If the device is addressed by a nonexistent address it will respond with ´0´.
The next table shows the encoding scheme of a data value for a write access.
Data Transfer:
D15
D14
D13
D12
D11
D10
D9
D8
D7
D6
D5
D4
D3
D2
D1
D0
Dat14
Dat13
Dat12
Dat11
Dat10
Dat9
Dat8
Dat7
Dat6
Dat5
Dat4
Dat3
Dat2
Dat1
Dat0
Par
odd
dat[14:0] : data value for write access (15 Bit)
par odd : see Address Transfer
It is possible to combine the two access modes (write and read access) during one communication.
The communication can be finished after last transmitted word of mixed access communication
frame with CSN_G='1'. CSN_G must be '0' during mixed access communication frame.
SPI result values on MISO_G
Within SPI communication SCR1100 gyro ASIC sends Status Flags (Status/Config register value)
and register result values on MISO_G. The following two tables show the encoding scheme:
Status Flags:
D15
D14
D13
D12
D11
D10
D9
D8
D7
D6
D5
D4
D3
D2
D1
D0
s_ok
par odd
S_OK is generated out of the monitoring flags in the status register (08h).
SCR1100-D04
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Register Result:
D15
D14
D13
D12
D11
D10
D9
D8
D7
D6
D5
D4
D3
D2
D1
D0
reg 14
reg 13
reg 12
reg11
reg 10
reg9
reg8
reg7
reg6
reg5
reg4
reg3
reg2
reg1
reg0
par
odd
reg[14:0] : value of the internal register. All bits, which are not used, are set to zero.
par odd : see Address Transfer
Figure 5 shows an example of communication sequence:
Figure 5. Communication example.
Each communication frame in the figure 6 contain 16 SCK cycles. After communication start
(CSN_G falling edge) the master sends ADR1 and performs a read access. In parallel the slave
sends Status Flags. During the transmission of the next data word (ADR2) the slave sends the
register value of ADR1 (Result_1). On ADR2 the master performs a write access (RW='1'). The
slave stores Data_2 in the register of ADR2 and sends the current register value of ADR2 to
MISO_G. After the transmission of data value during a write access the slave always sends Status
Flags. To receive Result_5 of the last read access the Master has to send an additional word ('Zero
Vector').
Example of how to read out Rate output
The MCU begins by sending the address frame followed by a zero vector (with correct parity). The
zero vector is necessary for the sensor to be able to reply to the MCU during the last 16-bit frame.
The sensor replies by sending first the status bits followed by the rate data.
MOSI: 0x0001 0x0001
MISO: 0x3FFE 0x0008
4.1.2 SPI Transfer Parity Mode
SCR1100 gyro ASIC is able to support parity check during SPI Transfer. This functionality is
controlled by the IC Identification Register. The internal parity status is reported in Status/Config
Register.
With parity enable bit set the SCR1100 gyro ASIC is expecting an additional parity bit after the
transmission of each 16 bit data word. This additional parity bit requires an additional SCK cycle,
i.e. the SPI frame consists of 17 SCK cycles instead of the normal 16 SCK cycles. Detecting a
wrong parity bit has the following consequences:
During read access:
The Parity Error Flag in the Status/Config Register is set. The SCR1100 reports the contents of the
received register address.
During write access:
The Parity Error Flag in the Status/Config Register is set. The SPI Write Access is cancelled.
These actions are performed either if the parity failure is detected in the address word or the data
word.
Due to the additional parity bit a single SPI Transfer is using now 17 Bit as shown in the Figure 6.
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Figure 6. Communication in parity mode.
At the end of the data word the SPI master and the SPI slave have to add an additional parity bit.
Both devices have to check the received parity according to the selected parity mode odd or even.
4.2 ASIC Addressing Space
4.2.1 Register Definition
The ASIC has multiple register and EEPROM blocks. The EEPROM blocks holding the calibration
data will be programmed via SPI during manufacturing process. User only needs to access the
Data Register Block at addresses 00h and 07h - 0Ah (addresses 01h-06h are reserved). The
content of this register block is described below.
4.2.2 Data Register Block
Table 6. Register map of data register block.
Address
Dec (hex)
Register Name
[bit definition]
Number of
Bits
Read/
Write/
Factory
Data Format
Description
00(00)
Rate_X[0]
1
R
-
odd Parity bit of Rate_X[14,1]
00(00)
Rate_X[1]
(S_OK Flag)
1
R
-
S_OK =0 Rate_X failed
S_OK =1 Rate_X valid (ok)
S_OK is generated out of the monitoring flags in the
status register (08h).
If either one of the flags in register 08h [15:2] is 0,
S_OK will be 0. Only if all flags in register 08h[15:2]
are 1 S_OK is set to 1
00(00)
Rate_X[15:2]
14
R
S
Sensor output data format two's complement
07(07)
IC Identification
[14, 11:4, 2, 1]
13
F
-
Reserved
07(07)
IC Identification []
1
r
Soft Reset bit
Writing '1' to this register bit will reset the device
07(07)
IC Identification[12]
HWParEn
1
W
Setting this bit to ‘1’ is enabling the Parity functionality
07(07)
IC Identification[13]
HWParSel
1
W
This bit is selecting an even or an odd parity mode.
Bit = 0: Even Parity mode means that the number of
ones in the data word including the parity bit is even.
Bit = 1: Odd Parity mode means that the number of
ones in the data word including the parity bit is odd.
08(08)
Status/Config
[14:10, 8:1]
14
F
-
Reserved
08(08)
Status/Config[9]
(Parity_OK)
1
R
-
This bit is set as soon as the SPI logic is detecting a
wrong parity bit received from the µC. This bit is
automatically cleared during read access to this
register.
Bit = 0 : Parity error
Bit = 1 : Parity check ok.
09(09)
Reserved
14
F
-
Reserved
10(0A)
Temp[0]
1
R
-
odd Parity bit of TEMP[14,1]
10(0A)
Temp[1] (S_OK Flag)
1
R
-
S_OK =0 Rate_X failed
S_OK =1 Rate_X valid
10(0A)
Temp[15,2]
14
R
S
Temperature sensor output
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The offset of temperature data is factory calibrated but sensitivity of the temperature data varies
from part to part. Note: Registers marked with F are reserved for factory use only and not to be
written to.
4.2.3 Temperature Output Register
The offset of temperature sensor is factory calibrated but sensitivity of the temperature data varies
from part to part. The temperature doesn't reflect absolute ambient temperature.
Temperature data is in 2's complement format in 14 bits (15:2) of Temp register. To use the
temperature sensor as an absolute temperature sensor or for additional system level
compensations, the offset and sensitivity of the sensor should be measured and calibrated on
system level
Temperature registers’ typical output at +23 °C is -1755 counts and 1 °C change in temperature
typically corresponds to 65 count change in temperature sensor output. Temperature information
can be converted from decimals to [°C] as follows
[ ] [ ]
65/)3250+(=º LSBTempCTemp
,
where Temp[°C] is temperature in Celsius and Temp[LSB] is temperature from TEMP registers in
decimal format,
Temperature sensor offset calibration error at 25°C: ≤ ±15 °C
Temperature sensor sensitivity calibration error : ≤ 5%
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5 Application Information
5.1 Pin Description
The pin out for SCR1100 is presented in Figure 7 (pin descriptions can be found from Table 7).
Figure 7. SCR1100 pinout diagram.
Table 7. SCR1100 pin descriptions.
pin #
Name
Type 1)
PD/PU/HV 3)
Description
1
HEAT
A1
Heatsink connection, externally connected to AVSS_G.
2
REFGND_G
AI
Analog reference ground should be connected external to AVSS_G
3
VREFP_G
AO
External C for positive reference voltage and output pin for use as supply
for external load. Max load is 5mA. Note this voltage can only be used as
supply for analog circuits. Circuits that produce high current spikes due to
switching circuit can not be driven by this node.
4
EXTRESN_G
DI
PU
External Reset, 3.3V level Schmitt-trigger input with internal pull-up, High
low transition cause system restart
5
RESERVED
R
Factory used only, leave floating
6
AHVVDDS_G
AO
HV (~30V)
External C for high voltage analog supply, high voltage pad ≈30V
7
LHV
AI
Connection for inductor for high voltage generation, high voltage pad ≈30V
8
DVDD_G
AI
Digital Supply Voltage
9
DVSS_G
AI
Digital Supply Return, external connected to AVSS_G
10
MISO_G
DOZ
Data Out of SPI Interface, 3.3V level, Level definition see SPI-section
11
NC
NC
Not connected, connect to GND or leave floating.
12
NC
NC
Not connected, connect to GND or leave floating.
13
NC
NC
Not connected, connect to GND or leave floating.
14
NC
NC
Not connected, connect to GND or leave floating.
14
NC
NC
Not connected, connect to GND or leave floating.
15
NC
NC
Not connected, connect to GND or leave floating.
16
HEAT
A1
Heatsink connection, externally connected to AVSS_G.
17
HEAT
A1
Heatsink connection, externally connected to AVSS_G.
18
NC
NC
Not connected, connect to GND or leave floating.
19
NC
NC
Not connected, connect to GND or leave floating.
19
NC
NC
Not connected, connect to GND or leave floating.
20
NC
NC
Not connected, connect to GND or leave floating.
21
NC
NC
Not connected, connect to GND or leave floating.
22
NC
NC
Not connected, connect to GND or leave floating.
23
MOSI_G
DI
PD
Data In of SPI Interface, 3.3V level Schmitt-trigger input
24
SCK_G
DI
PD
Clk Signal of SPI Interface, 3.3V level Schmitt-trigger input, Input Clock
range 2 to 8MHz. Level definition see SPI-section
25
CSN_G
DI
PU
Chip Select of SPI Interface, 3.3V level Schmitt-trigger input, Input Clock
range 2 to 8MHz. Level definition see SPI-section
26
RESERVED
R
Factory used only, leave floating
27
RESERVED
R
Factory used only, leave floating
28
AVDD_G
AI
Analog Supply voltage
SCR1100-D04
Murata Electronics Oy Subject to changes 15/20
www.muratamems.fi Doc.Nr. 82 1226 00 Rev. 2.0
pin #
Name
Type 1)
PD/PU/HV 3)
Description
29
SUB
AI
Connected external to AVSS_G
30
RESERVED
R
Factory used only, leave floating
31
RESERVED
R
Factory used only, leave floating
32
HEAT
A1
Heat sink connection, externally connected to AVSS_G.
Notes:
1) A=Analog, D=Digital, I=Input, O=Output, Z=Tristate Output, R = Reserved
3) PU=internal pullup, PD=internal pulldown, HV = high voltage
5.2 Application Circuitry and External Component Characteristics
See recommended schematics in Figure 8. Component characteristics are presented in Table 8.
Figure 8. SCR1100 recommended circuit diagram.
Optional filtering recommendations for better PSRR (Power Supply Rejection Ratio) is presented in
Figure 9. Please note that PSSR filtering is optional and not required if the 3.3V power supply is
already stabile enough. RC filtering (R1 & C7 without L2) could also be sufficient for most cases.
Figure 9. Optional filtering recommendation to improve PSRR if required.
5.2.1 Separate Analog and Digital Ground Layers with Long Power Supply Lines
If power supply routings/cablings are long separate ground cabling, routing and layers for analog
and digital supply voltages should be used to avoid excessive power supply ripple.
SCR1100-D04
Murata Electronics Oy Subject to changes 16/20
www.muratamems.fi Doc.Nr. 82 1226 00 Rev. 2.0
In the recommended circuit diagram Figure 8 and layout Figure 11 joint ground is used as it is the
simplest solution and is adequate as long as the supply voltage lines are not long (when
connecting the SCR1100 directly to µC on the same PCB).
Table 8. SCR1100 external components.
Component
Parameter
Min
Typ
Units
C1, C3, C5
Capacitance
70
100
nF
ESR @ 1 MHz
m
Voltage rating
7
V
C39
Capacitance
376
470
nF
ESR @ 1 MHz
m
Voltage rating
30
V
L1
Inductance
37
47
µH
ESR L=47 µH
Voltage rating
30
V
C6
Capacitance
0.7
1
µF
ESR @ 1 MHz
m
Optional for better PSRR:
R1
Resistance
10
C7
Capacitance
4.7
µF
L2
Impedance
1k
5.3 Boost Regulator and Power Supply Decoupling in Layout
Recommended layout for DVDD_G/LHV pin decoupling is shown in Figure 10.
Figure 10. Layout recommendations for DVDD_G/LHV pin decoupling.
SCR1100-D04
Murata Electronics Oy Subject to changes 17/20
www.muratamems.fi Doc.Nr. 82 1226 00 Rev. 2.0
5.3.1 Layout Example
Figure 11. Example layout for SCR1100.
5.3.2 Thermal Connection
The component includes heat sink pins to transfer the internally generated heat from the package
to outside. The thermal resistance to ambient should be low enough not to self heat the device. If
the internal junction temperature gets too high compared to ambient, that may lead to out of
specification behaviour.
Table 9. Thermal resistance.
Component
Parameter
Min
Typ
Units
Thermal resistance BBBBBBBBBJABBBBBBBBBBBBBBBBBBBBBBBBBBB
Total resistance from junction to ambient
C/W
SCR1100-D04
Murata Electronics Oy Subject to changes 18/20
www.muratamems.fi Doc.Nr. 82 1226 00 Rev. 2.0
5.4 Measurement Axis and Directions
The SCR1100 angular rate measurement direction is shown below in Figure 12.
Figure 12. SCR1100 angular rate measurement direction.
SCR1100-D04
Murata Electronics Oy Subject to changes 19/20
www.muratamems.fi Doc.Nr. 82 1226 00 Rev. 2.0
5.5 Package Characteristics
5.5.1 Package Outline Drawing
The SCR1100 package outline and dimensions are presented in Figure 13 and Table 10.
Figure 13. SCR1100 package outline and dimensions.
Limits for linear measures (ISO2768-f)
Tollerance class
Limits in mm for nominal size in mm
0.5 to 3
Above 3 to 6
Above 6 to 30
Above 30 to 120
f (fine)
±0.05
±0.05
±0.1
±0.15
Table 10. SCR1100 package dimensions.
Component
Parameter
Min
Typ
Units
Length
Without leads
19.71
mm
Width
Without leads
8.5
mm
Width
With leads
12.1
mm
Height
With leads
(including stand-off and EMC lead)
4.60
mm
Lead pitch
1.0
mm
SCR1100-D04
Murata Electronics Oy Subject to changes 20/20
www.muratamems.fi Doc.Nr. 82 1226 00 Rev. 2.0
5.5.2 PCB Footprint
SCR1100 footprint dimensions are presented in Figure 14 and Table 11.
Figure 14. SCR1100 footprint.
Table 11. SCR1100 footprint dimensions.
Component
Parameter
Min
Typ
Units
Footprint length
Without lead footprints
15.7
mm
Footprint width
Without lead footprints
13.0
mm
Footprint lead pitch
Long side leads
1.0
mm
Footprint lead length
2.20
mm
Footprint lead width
Long side leads
0.7
mm
5.6 Assembly instructions
Please refer to "Technical Note 82" document for assembly instructions.