Doc.Nr. 82 1226 00 Data Sheet SCR1100-D04 SINGLE AXIS GYROSCOPE WITH DIGITAL SPI INTERFACE Features 300 /s angular rate measurement range Angular rate measurement around X axis Angular rate sensor exceptionally insensitive to mechanical vibrations and shocks Superior bias instability for MEMS gyroscopes Digital SPI interfacing Enhanced self diagnostics features Small size 8.5 x 18.7 x 4.5 mm (w x l x h) RoHS compliant robust packaging suitable for lead free soldering process and SMD mounting Proven capacitive 3D-MEMS technology Temperature range -40 C...+125 C Applications SCR1100-D04 is targeted to applications with high stability and tough environmental requirements. Typical applications are: Inertial Measurement Units (IMUs) for highly demanding environments Platform stabilization and control Motion analysis and control Roll over detection Robotic control systems Guidance systems Navigation systems General Description SCR1100-D04 is a single axis high performance gyroscope. It is part of Murata's high performance gyro family and it has the same gyro section as the combined gyro acceleration product SCC1300-D02. The sensor is based on Murata's proven capacitive 3D-MEMS technology and it has highly sophisticated signal conditioning ASIC with digital SPI interface. Small robust packaging guarantees reliable operation over product lifetime. The housing is suitable for SMD mounting and the component is compatible with RoHS and ELV directives. SCR1100-D04 is designed, manufactured and tested against high stability, reliability and quality requirements. The angular rate sensor provides highly stable output over wide ranges of temperature and mechanical noise. The bias stability is in the elite of MEMS gyros and the component has several advanced self diagnostics features. SCR1100-D04 TABLE OF CONTENTS SCR1100-D04 Single axis Gyroscope with digital SPI interface ......................1 Features............................................................................................................................................... 1 Applications ........................................................................................................................................ 1 General Description ............................................................................................................................ 1 1 General Description ........................................................................................4 1.1 Introduction ............................................................................................................................... 4 1.2 General Product Description .................................................................................................... 4 1.2.1 Factory Calibration ............................................................................................................. 5 1.3 Abbreviations ............................................................................................................................ 5 2 Specifications..................................................................................................6 2.1 Performance Specifications for Gyroscope ............................................................................ 6 2.2 Absolute Maximum Ratings ..................................................................................................... 7 2.3 Digital I/O Specification ............................................................................................................ 7 2.4 SPI AC Characteristics ............................................................................................................. 7 3 Reset and Power Up .......................................................................................9 3.1 Power-up Sequence .................................................................................................................. 9 3.2 Reset .......................................................................................................................................... 9 4 Component Interfacing ...................................................................................9 4.1 SPI Interfaces ............................................................................................................................ 9 4.1.1 SPI Transfer ........................................................................................................................ 9 4.1.2 SPI Transfer Parity Mode ................................................................................................. 11 4.2 ASIC Addressing Space ......................................................................................................... 12 4.2.1 Register Definition ............................................................................................................ 12 4.2.2 Data Register Block .......................................................................................................... 12 4.2.3 Temperature Output Register .......................................................................................... 13 5 Application Information ................................................................................14 5.1 Pin Description ........................................................................................................................ 14 5.2 Application Circuitry and External Component Characteristics .......................................... 15 5.2.1 Separate Analog and Digital Ground Layers with Long Power Supply Lines .............. 15 Murata Electronics Oy www.muratamems.fi Subject to changes Doc.Nr. 82 1226 00 2/20 Rev. 2.0 SCR1100-D04 5.3 Boost Regulator and Power Supply Decoupling in Layout .................................................. 16 5.3.1 Layout Example ................................................................................................................ 17 5.3.2 Thermal Connection ......................................................................................................... 17 5.4 Measurement Axis and Directions ......................................................................................... 18 5.5 Package Characteristics ......................................................................................................... 19 5.5.1 Package Outline Drawing ................................................................................................. 19 5.5.2 PCB Footprint ................................................................................................................... 20 5.6 Assembly instructions ............................................................................................................ 20 Murata Electronics Oy www.muratamems.fi Subject to changes Doc.Nr. 82 1226 00 3/20 Rev. 2.0 SCR1100-D04 1 1.1 General Description Introduction This document contains essential technical information for SCR1100 sensor. Specifications, SPI interface descriptions, user accessible register details, electrical properties and application information etc. This document should be used as a reference when designing in SCR1100 component. 1.2 General Product Description The SCR1100 sensor consists of silicon based MEMS angular rate sensing element and Application Specific Integrated Circuits (ASIC) used to sense and control sensing element. Figure 1 represents an upper level block diagram of the component. ASIC have digital SPI interfaces to control and read the gyroscope. Figure 1. SCR1100 component block diagram. The angular rate sensing element is manufactured using Murata proprietary High Aspect Ratio (HAR) 3D-MEMS process, which enables making robust, extremely stable and low noise capacitive sensors. The angular rate sensing element consists of moving masses that are purposely exited to in-plane drive motion. Rotation in sensitive direction causes out-of-plane movement that can be measured as capacitance change with the signal conditioning ASIC. Murata Electronics Oy www.muratamems.fi Subject to changes Doc.Nr. 82 1226 00 4/20 Rev. 2.0 SCR1100-D04 1.2.1 Factory Calibration SCR1100 sensor is factory calibrated. No separate calibration is required in the application. Trimmed parameters during production include sensitivities and offsets over temperature, and frequency responses. However it should be noted that assembly can cause minor offset/bias errors to the sensor output. If best possible offset/bias accuracy is required, system level offset/bias calibration (zeroing) after assembly is recommended. Calibration parameters are stored during manufacturing inside non-volatile memory. The parameters are read automatically from the internal non-volatile memory during the start-up. 1.3 Abbreviations ASIC SPI RT STC STS Avdd Dvdd Murata Electronics Oy www.muratamems.fi Application Specific Integrated Circuit Serial Peripheral Interface Room Temperature Self Test Continuous (continuous self testing of accelerometer element) Self Test Static (gravitational based self test of accelerometer element) Analog supply voltage Digital supply voltage Subject to changes Doc.Nr. 82 1226 00 5/20 Rev. 2.0 SCR1100-D04 2 2.1 Specifications Performance Specifications for Gyroscope Table 1. Gyroscope performance specifications (Avdd = 5 V, Dvdd = 3.3 V and ambient temperature unless otherwise specified). Parameter Analog supply voltage Analog supply current Digital supply voltage Digital supply current Operating range B) Offset error Offset over temperature Temperature range -40 ... +125 C Measurement axis X P P P Temperature range -40 ... +125 C Temperature range -10 ... +60 C Temperature gradient 2.5 K/min P Max 5.25 29.5 3.6 24 300 1.5 0.9 0.5 0.6 P P <2.1 0.86 18 P Temperature range -40 ... +125 C Temperature range -40 ... +125 C Units V mA V mA /s /s /s /s (/s)/min /h P / h -1 -2 -1 P 1 2 1 0.23 0.14 0.02 P A) A) Typ 5 26 3.3 20 P P P LSB/(/s) % % /s /s (/s)/ Hz 1.7 0.1 2.0 50.0 -0.1 50g, 6ms -3dB frequency % (/s)/g /s ms Hz s kHz pF MHz 50 0.8 2 200 8 0.1 MIN/MAX values are 3 sigma variation limits from validation test population. Including calibration error and drift over lifetime. Typical, constant temperature, Allan Variance curve Figure 2 b). Cross-axis sensitivity is the maximum sensitivity in the plane perpendicular to the measuring direction relative to the sensitivity in the measuring direction. The specified limit must not be exceeded by either axis. P B) P C) P P Temperature range -40 ... +125 C Offset drift velocity C) Offset short term instability C) Angular random walk (ARW) Sensitivity Sensitivity over temperature B) Total sensitivity error Nonlinearity Noise (RMS) Noise Density Cross-axis sensitivity G-sensitivity Shock sensitivity Shock recovery time Amplitude response Power on setup time Output data rate Output load SPI clock rate P Min 4.75 24 3.0 16 -300 -1.5 -0.9 -0.5 -0.6 P P P A) Condition P D) SCR1100-D04 Allan Variance Curve SCR1100-D04 Gyro Bias vs. Temperature 1 1000 0.8 0.4 0.2 +3sigma 0 -0.2 AVG -40 -20 0 20 40 60 80 100 120 -3sigma -0.4 Allan deviation [/h] Angular Rate Offset [/s] 0.6 100 +3 sigma Average 10 -0.6 -0.8 1 -1 0.1 -1.2 1 10 100 1000 10000 100000 tau [s] Temperature [C] Figure 2 a) SCR1100-D04 Gyroscope offset over full temperature range, b) Allan variance curve Murata Electronics Oy www.muratamems.fi Subject to changes Doc.Nr. 82 1226 00 6/20 Rev. 2.0 SCR1100-D04 2.2 Absolute Maximum Ratings Table 2. Absolute maximum ratings of the SCR1100 sensor. Parameter Analog supply voltage, AVDD_G Digital supply voltage, DVDD_G Maximum voltage at analog input/output pins Maximum voltage at digital input/output pins Operating temperature Storage temperature Condition Min -0.5 -0.3 -0.3 -0.3 -40 -40 -40 Max 96h Maximum junction temperature during lifetime. Note: device has to be functional, but not in full spec. Mechanical Shock ESD Max 7 3.6 AVDD_G + 0.3V DVDD_G + 0.3 125 125 150 155 Units V V V C C C C 3000 HBM CDM Prohibited Ultrasonic Cleaning 2.3 Typ g kV V 2 500 Digital I/O Specification Table 3 below describe the DC characteristics of SCR1100 sensor digital I/O pins. Supply voltage is 3.3 V unless otherwise noted. Current flowing into the circuit has positive values. Table 3. Absolute maximum ratings of the SCR1100 gyroscope SPI interface. Parameter Input terminal CSN_G Pull up current Input high voltage Input low voltage Hysteresis VIN Input terminal SCK_G Input high voltage Input low voltage Hysteresis Input leakage current Output terminal MOSI_G Input high voltage Input low voltage Hysteresis Input current source (pull-down) VBBIN Output terminal MISO_G (Tri-state) Output high voltage B B B B Conditions Symbol Min VIN = 0 V DVDD_G = 3.3 V DVDD_G = 3.3 V DVDD_G = 3.3 V Open circuit IPU VIH VBBIL VBBHYST VIN 10 2 DVDD_G = 3.3 V DVDD_G = 3.3 V DVDD_G = 3.3 V 0 < VBMISO B < 3.3 V VIH VBBIL VBBHYST IBBLEAK DVDD_G = 3.3 V DVDD_G = 3.3 V DVDD_G = 3.3 V VIN = VDVDD_G Open circuit VBBIH VBBIL VBBHYST IBBLEAK VBBIN B B B B 2.4 B B B B B B B B B B B B B B B B B 0.3 10 B VBBOL B 2 B B B B Unit 50 DVDD_G 0.8 A V V V V DVDD_G 0.8 V V V uA 1 DVDD_G 0.8 50 0.3 DVDD_G -0.5V B B V V V uA V V DVDD_G -0.2V B B B 0.3 -1 B B IOUT = -50A 0 VBBMISO 3.3 V B 2 B B VBBOH B B B B Max 0.3 2 B IOUT = -1mA B Output low voltage Capacitive load B B B Typ 0.5 200 V V pF SPI AC Characteristics The AC characteristics of SCR1100 are defined in Figure 3 and Table 4. Murata Electronics Oy www.muratamems.fi Subject to changes Doc.Nr. 82 1226 00 7/20 Rev. 2.0 SCR1100-D04 TLS1 TCH TCL TLS2 TLH CSN_G, CSB_A SCK_G, SCK THOL MOSI_G, MOSI_A MSB in TVAL1 MISO_G, MISO_A TSET DATA in LSB in TVAL2 MSB out TLZ DATA out LSB out Figure 3. Timing diagram of SPI communication Table 4. Timing Characteristics of SPI Communication. Parameter FBBSPI TSPI TCH TCL TLS1 TVAL1 TSET THOL Condition TVAL2 TLS2 Delay SCK_G -> MISO_G CSN_G hold time TLZ TRISE TFALL TLH Tri-state delay time Rise time of the SCK_G Fall time of the SCK_G Time between SPI cycles B Min Typ Max 8 B B 1/ FBBSPI B B B B B B B B B B B B B B B B B B B B B B B B B Murata Electronics Oy www.muratamems.fi Units MHz B SCK_G high time SCK_G low time CSN_G setup time Delay CSN_G -> MISO_G MOSI_G setup time MOSI_G data hold time Subject to changes Doc.Nr. 82 1226 00 B TSPI /2 TSPI /2 TSPI /2 B B B B B B ns ns ns ns ns ns TBBSPI /4 B B TSPI /4 TSPI /4 B B B B 1.3 * TBBSPI /4 ns ns TBBSPI /4 10 10 ns ns ns ns B TSPI /2 B B B TSPI B B B B 8/20 Rev. 2.0 SCR1100-D04 3 Reset and Power Up After the start-up the angular rate and acceleration data is immediately available through SPI registers. There is no need to initialize the gyroscope or accelerometer before starting to use it. If the application requires monitoring operation correctness there are several options available to monitor the status. 3.1 Power-up Sequence To ensure correct ASIC start up please connect the digital supply voltage V DVDD_G (3.3V) before the analog supply voltage VAVDD_G (5.0V) to the gyro ASIC. After power up please read Status register twice to clear error flags. Angular rate data is available immediately so no start up command sequence is required if error flags are not used. B B B B Table 5. SCR1100 gyroscope power-up sequence. Procedure Set VDVDD_G V=3.0...3.6V Wait 10ms Set VAVDD_G V=4.75...5.25V Wait 800 ms Read Status register (08h) two times B B 3.2 Functions Check B B Acknowledge error flags after start up Reset SCR1100 can be reset by writing 0x04 in to IC Identification register (address 07h) or with external active low reset pin (EXTRESN_G). Power supplies should be within the specified range before the reset pin can be released. 4 Component Interfacing 4.1 SPI Interfaces SCR1100 sensor SPI interface is a digital 4 wire interface where SCR1100 always operate as slave devices in the master-slave operation mode. SCR1100 Angular rate sensor ASIC SPI interface: MOSI_G MISO_G SCK_G CSN_G 4.1.1 master out slave in master in slave out serial clock chip select (low active) P ASIC ASIC P P ASIC P ASIC SPI Transfer The SPI transfer is based on a 16-bit protocol. Figure 4 shows an example of a single 16-bit data transmission. Each output data/status-bits are shifted out on the falling edge of SCK (MISO line). Each bit is sampled on the rising edge of SCK (MOSI line). Figure 4. SCR1100 angular rate sensor 16-bit data transmission. Murata Electronics Oy www.muratamems.fi Subject to changes Doc.Nr. 82 1226 00 9/20 Rev. 2.0 SCR1100-D04 After the falling edge of CSN_G the device interprets the first 16-bit word is an address transfer having a bit coding scheme below. Address Transfer: D15 D14 D13 D12 D11 D10 D9 D8 D7 D6 D5 D4 D3 D2 D1 D0 0 0 0 0 0 0 ADR6 ADR5 ADR4 ADR3 ADR2 ADR1 ADR0 RW 0 Par odd ADR[6:0] : RW : par odd : Register address RW=1 : Write access RW=0 : Read access odd parity bit. par odd = 0 : the number of ones in the data word (D15:D1) is odd. par odd = 1 : the number of ones in the data word (D15:D1) is even. The address selects an internal register of the device; the RW bit selects the access mode. RW = `0' The master performs a read access on the selected register. During the transmission of the next word, the slave sends the requested register value to MISO_G. The slave interprets the next word at MOSI_G as an address transfer. RW = `1' The master performs a write access on the selected register. The slave stores the next transmitted word in the selected device register of MOSI_G and sends the actual register value in response to MOSI_G. The transmission goes on with an address transfer to MOSI_G and the address mode flags to MISO_G. If the device is addressed by a nonexistent address it will respond with 0. The next table shows the encoding scheme of a data value for a write access. Data Transfer: D15 Dat14 D14 Dat13 D13 Dat12 dat[14:0] : par odd : D12 Dat11 D11 Dat10 D10 Dat9 D9 Dat8 D8 Dat7 D7 Dat6 D6 Dat5 D5 Dat4 D4 Dat3 D3 Dat2 D2 Dat1 D1 Dat0 D0 Par odd data value for write access (15 Bit) see Address Transfer It is possible to combine the two access modes (write and read access) during one communication. The communication can be finished after last transmitted word of mixed access communication frame with CSN_G='1'. CSN_G must be '0' during mixed access communication frame. SPI result values on MISO_G Within SPI communication SCR1100 gyro ASIC sends Status Flags (Status/Config register value) and register result values on MISO_G. The following two tables show the encoding scheme: Status Flags: D15 D14 D13 D12 D11 D10 D9 D8 D7 D6 D5 D4 D3 D2 D1 s_ok D0 par odd S_OK is generated out of the monitoring flags in the status register (08h). Murata Electronics Oy www.muratamems.fi Subject to changes Doc.Nr. 82 1226 00 10/20 Rev. 2.0 SCR1100-D04 Register Result: D15 reg 14 D14 reg 13 D13 reg 12 reg[14:0] : par odd : D12 reg11 D11 reg 10 D10 reg9 D9 reg8 D8 reg7 D7 reg6 D6 reg5 D5 reg4 D4 reg3 D3 reg2 D2 reg1 D1 reg0 D0 par odd value of the internal register. All bits, which are not used, are set to zero. see Address Transfer Figure 5 shows an example of communication sequence: Figure 5. Communication example. Each communication frame in the figure 6 contain 16 SCK cycles. After communication start (CSN_G falling edge) the master sends ADR1 and performs a read access. In parallel the slave sends Status Flags. During the transmission of the next data word (ADR2) the slave sends the register value of ADR1 (Result_1). On ADR2 the master performs a write access (RW='1'). The slave stores Data_2 in the register of ADR2 and sends the current register value of ADR2 to MISO_G. After the transmission of data value during a write access the slave always sends Status Flags. To receive Result_5 of the last read access the Master has to send an additional word ('Zero Vector'). Example of how to read out Rate output The MCU begins by sending the address frame followed by a zero vector (with correct parity). The zero vector is necessary for the sensor to be able to reply to the MCU during the last 16-bit frame. The sensor replies by sending first the status bits followed by the rate data. MOSI: 0x0001 0x0001 MISO: 0x3FFE 0x0008 4.1.2 SPI Transfer Parity Mode SCR1100 gyro ASIC is able to support parity check during SPI Transfer. This functionality is controlled by the IC Identification Register. The internal parity status is reported in Status/Config Register. With parity enable bit set the SCR1100 gyro ASIC is expecting an additional parity bit after the transmission of each 16 bit data word. This additional parity bit requires an additional SCK cycle, i.e. the SPI frame consists of 17 SCK cycles instead of the normal 16 SCK cycles. Detecting a wrong parity bit has the following consequences: During read access: The Parity Error Flag in the Status/Config Register is set. The SCR1100 reports the contents of the received register address. During write access: The Parity Error Flag in the Status/Config Register is set. The SPI Write Access is cancelled. These actions are performed either if the parity failure is detected in the address word or the data word. Due to the additional parity bit a single SPI Transfer is using now 17 Bit as shown in the Figure 6. Murata Electronics Oy www.muratamems.fi Subject to changes Doc.Nr. 82 1226 00 11/20 Rev. 2.0 SCR1100-D04 Figure 6. Communication in parity mode. At the end of the data word the SPI master and the SPI slave have to add an additional parity bit. Both devices have to check the received parity according to the selected parity mode odd or even. 4.2 4.2.1 ASIC Addressing Space Register Definition The ASIC has multiple register and EEPROM blocks. The EEPROM blocks holding the calibration data will be programmed via SPI during manufacturing process. User only needs to access the Data Register Block at addresses 00h and 07h - 0Ah (addresses 01h-06h are reserved). The content of this register block is described below. 4.2.2 Data Register Block Table 6. Register map of data register block. Address Dec (hex) Register Name [bit definition] Number of Bits Read/ Write/ Factory Data Format Description 00(00) Rate_X[0] 1 R - 00(00) Rate_X[1] (S_OK Flag) 1 R - odd Parity bit of Rate_X[14,1] S_OK =0 Rate_X failed S_OK =1 Rate_X valid (ok) S_OK is generated out of the monitoring flags in the status register (08h). If either one of the flags in register 08h [15:2] is 0, S_OK will be 0. Only if all flags in register 08h[15:2] are 1 S_OK is set to 1 Rate_X[15:2] IC Identification [14, 11:4, 2, 1] IC Identification [] 14 13 R F S - Sensor output data format two's complement Reserved 1 r IC Identification[12] HWParEn IC Identification[13] HWParSel 1 W 1 W Status/Config [14:10, 8:1] Status/Config[9] (Parity_OK) 14 F - 1 R - 09(09) Reserved 14 F - 10(0A) Temp[0] 1 R - 10(0A) Temp[1] (S_OK Flag) 1 R - odd Parity bit of TEMP[14,1] S_OK =0 Rate_X failed S_OK =1 Rate_X valid 10(0A) Temp[15,2] 14 R S Temperature sensor output 00(00) 07(07) 07(07) 07(07) 07(07) 08(08) 08(08) Murata Electronics Oy www.muratamems.fi Subject to changes Doc.Nr. 82 1226 00 Soft Reset bit Writing '1' to this register bit will reset the device Setting this bit to `1' is enabling the Parity functionality This bit is selecting an even or an odd parity mode. Bit = 0: Even Parity mode means that the number of ones in the data word including the parity bit is even. Bit = 1: Odd Parity mode means that the number of ones in the data word including the parity bit is odd. Reserved This bit is set as soon as the SPI logic is detecting a wrong parity bit received from the C. This bit is automatically cleared during read access to this register. Bit = 0 : Parity error Bit = 1 : Parity check ok. Reserved 12/20 Rev. 2.0 SCR1100-D04 The offset of temperature data is factory calibrated but sensitivity of the temperature data varies from part to part. Note: Registers marked with F are reserved for factory use only and not to be written to. 4.2.3 Temperature Output Register The offset of temperature sensor is factory calibrated but sensitivity of the temperature data varies from part to part. The temperature doesn't reflect absolute ambient temperature. Temperature data is in 2's complement format in 14 bits (15:2) of Temp register. To use the temperature sensor as an absolute temperature sensor or for additional system level compensations, the offset and sensitivity of the sensor should be measured and calibrated on system level Temperature registers' typical output at +23 C is -1755 counts and 1 C change in temperature typically corresponds to 65 count change in temperature sensor output. Temperature information can be converted from decimals to [C] as follows Temp[ C] = (Temp[LSB ] + 3250 ) / 65 , where Temp[C] is temperature in Celsius and Temp[LSB] is temperature from TEMP registers in decimal format, Temperature sensor offset calibration error at 25C: 15 C Temperature sensor sensitivity calibration error : 5% Murata Electronics Oy www.muratamems.fi Subject to changes Doc.Nr. 82 1226 00 13/20 Rev. 2.0 SCR1100-D04 5 Application Information 5.1 Pin Description The pin out for SCR1100 is presented in Figure 7 (pin descriptions can be found from Table 7). Figure 7. SCR1100 pinout diagram. Table 7. SCR1100 pin descriptions. pin # 1 2 Name HEAT REFGND_G Type 1) A1 AI PD/PU/HV 3) 3 VREFP_G AO 4 EXTRESN_G DI 5 6 7 8 9 10 11 12 13 14 14 15 16 17 18 19 19 20 21 22 23 RESERVED AHVVDDS_G LHV DVDD_G DVSS_G MISO_G NC NC NC NC NC NC HEAT HEAT NC NC NC NC NC NC MOSI_G R AO AI AI AI DOZ NC NC NC NC NC NC A1 A1 NC NC NC NC NC NC DI 24 SCK_G DI PD 25 CSN_G DI PU 26 27 28 RESERVED RESERVED AVDD_G R R AI Murata Electronics Oy www.muratamems.fi PU HV (~30V) PD Description Heatsink connection, externally connected to AVSS_G. Analog reference ground should be connected external to AVSS_G External C for positive reference voltage and output pin for use as supply for external load. Max load is 5mA. Note this voltage can only be used as supply for analog circuits. Circuits that produce high current spikes due to switching circuit can not be driven by this node. External Reset, 3.3V level Schmitt-trigger input with internal pull-up, High low transition cause system restart Factory used only, leave floating External C for high voltage analog supply, high voltage pad 30V Connection for inductor for high voltage generation, high voltage pad 30V Digital Supply Voltage Digital Supply Return, external connected to AVSS_G Data Out of SPI Interface, 3.3V level, Level definition see SPI-section Not connected, connect to GND or leave floating. Not connected, connect to GND or leave floating. Not connected, connect to GND or leave floating. Not connected, connect to GND or leave floating. Not connected, connect to GND or leave floating. Not connected, connect to GND or leave floating. Heatsink connection, externally connected to AVSS_G. Heatsink connection, externally connected to AVSS_G. Not connected, connect to GND or leave floating. Not connected, connect to GND or leave floating. Not connected, connect to GND or leave floating. Not connected, connect to GND or leave floating. Not connected, connect to GND or leave floating. Not connected, connect to GND or leave floating. Data In of SPI Interface, 3.3V level Schmitt-trigger input Clk Signal of SPI Interface, 3.3V level Schmitt-trigger input, Input Clock range 2 to 8MHz. Level definition see SPI-section Chip Select of SPI Interface, 3.3V level Schmitt-trigger input, Input Clock range 2 to 8MHz. Level definition see SPI-section Factory used only, leave floating Factory used only, leave floating Analog Supply voltage Subject to changes Doc.Nr. 82 1226 00 14/20 Rev. 2.0 SCR1100-D04 pin # 29 30 31 32 Name SUB RESERVED RESERVED HEAT Type 1) AI R R A1 PD/PU/HV 3) Description Connected external to AVSS_G Factory used only, leave floating Factory used only, leave floating Heat sink connection, externally connected to AVSS_G. Notes: 1) A=Analog, D=Digital, I=Input, O=Output, Z=Tristate Output, R = Reserved 3) PU=internal pullup, PD=internal pulldown, HV = high voltage 5.2 Application Circuitry and External Component Characteristics See recommended schematics in Figure 8. Component characteristics are presented in Table 8. Figure 8. SCR1100 recommended circuit diagram. Optional filtering recommendations for better PSRR (Power Supply Rejection Ratio) is presented in Figure 9. Please note that PSSR filtering is optional and not required if the 3.3V power supply is already stabile enough. RC filtering (R1 & C7 without L2) could also be sufficient for most cases. Figure 9. Optional filtering recommendation to improve PSRR if required. 5.2.1 Separate Analog and Digital Ground Layers with Long Power Supply Lines If power supply routings/cablings are long separate ground cabling, routing and layers for analog and digital supply voltages should be used to avoid excessive power supply ripple. Murata Electronics Oy www.muratamems.fi Subject to changes Doc.Nr. 82 1226 00 15/20 Rev. 2.0 SCR1100-D04 In the recommended circuit diagram Figure 8 and layout Figure 11 joint ground is used as it is the simplest solution and is adequate as long as the supply voltage lines are not long (when connecting the SCR1100 directly to C on the same PCB). Table 8. SCR1100 external components. Component C1, C3, C5 Parameter Capacitance ESR @ 1 MHz Voltage rating Capacitance ESR @ 1 MHz Voltage rating Inductance ESR L=47 H Voltage rating Capacitance ESR @ 1 MHz C39 L1 C6 Optional for better PSRR: R1 C7 L2 5.3 Min 70 Typ 100 Max 130 100 7 376 470 564 100 30 37 47 57 5 30 0.7 1 1.3 100 Resistance Capacitance Impedance 10 4.7 1k Units nF m V nF m V H V F m F Boost Regulator and Power Supply Decoupling in Layout Recommended layout for DVDD_G/LHV pin decoupling is shown in Figure 10. Figure 10. Layout recommendations for DVDD_G/LHV pin decoupling. Murata Electronics Oy www.muratamems.fi Subject to changes Doc.Nr. 82 1226 00 16/20 Rev. 2.0 SCR1100-D04 5.3.1 Layout Example Figure 11. Example layout for SCR1100. 5.3.2 Thermal Connection The component includes heat sink pins to transfer the internally generated heat from the package to outside. The thermal resistance to ambient should be low enough not to self heat the device. If the internal junction temperature gets too high compared to ambient, that may lead to out of specification behaviour. Table 9. Thermal resistance. Component Thermal resistance BBJAB B Murata Electronics Oy www.muratamems.fi B Parameter Total resistance from junction to ambient Subject to changes Doc.Nr. 82 1226 00 Min Typ Max 50 Units C/W 17/20 Rev. 2.0 SCR1100-D04 5.4 Measurement Axis and Directions The SCR1100 angular rate measurement direction is shown below in Figure 12. Figure 12. SCR1100 angular rate measurement direction. Murata Electronics Oy www.muratamems.fi Subject to changes Doc.Nr. 82 1226 00 18/20 Rev. 2.0 SCR1100-D04 5.5 5.5.1 Package Characteristics Package Outline Drawing The SCR1100 package outline and dimensions are presented in Figure 13 and Table 10. Figure 13. SCR1100 package outline and dimensions. Limits for linear measures (ISO2768-f) Tollerance class f (fine) Limits in mm for nominal size in mm Above 3 to 6 Above 6 to 30 0.05 0.1 0.5 to 3 0.05 Above 30 to 120 0.15 Table 10. SCR1100 package dimensions. Component Length Width Width Height Parameter Without leads Without leads With leads With leads (including stand-off and EMC lead) Lead pitch Murata Electronics Oy www.muratamems.fi Min Typ 19.71 8.5 12.1 4.60 1.0 Subject to changes Doc.Nr. 82 1226 00 Max Units mm mm mm mm mm 19/20 Rev. 2.0 SCR1100-D04 5.5.2 PCB Footprint SCR1100 footprint dimensions are presented in Figure 14 and Table 11. Figure 14. SCR1100 footprint. Table 11. SCR1100 footprint dimensions. Component Footprint length Footprint width Footprint lead pitch Footprint lead length Footprint lead width 5.6 Parameter Without lead footprints Without lead footprints Long side leads Long side leads Min Typ 15.7 13.0 1.0 2.20 0.7 Max Units mm mm mm mm mm Assembly instructions Please refer to "Technical Note 82" document for assembly instructions. Murata Electronics Oy www.muratamems.fi Subject to changes Doc.Nr. 82 1226 00 20/20 Rev. 2.0